Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
  • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
  • H05K13/0069—Holders for printed circuit boards
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
  • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
  • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
  • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
  • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
  • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
  • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
  • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
  • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
  • B29L2031/00—Other particular articles
  • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
  • B29L2031/3425—Printed circuits
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
  • B29L2031/00—Other particular articles
  • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
  • B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
  • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10227—Other objects, e.g. metallic pieces
  • H05K2201/1028—Thin metal strips as connectors or conductors
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/01—Tools for processing; Objects used during processing
  • H05K2203/0147—Carriers and holders
  • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/01—Tools for processing; Objects used during processing
  • H05K2203/0147—Carriers and holders
  • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
  • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/06—Lamination
  • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/06—Lamination
  • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
  • H05K2203/111—Preheating, e.g. before soldering
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/15—Position of the PCB during processing
  • H05K2203/1509—Horizontally held PCB
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/15—Position of the PCB during processing
  • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/16—Inspection; Monitoring; Aligning
  • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W40/00—Arrangements for thermal protection or thermal control
  • H10W40/20—Arrangements for cooling
  • H10W40/25—Arrangements for cooling characterised by their materials
  • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates

Definitions

• This disclosure relates to a transport jig, a circuit board manufacturing device, and a circuit board manufacturing method.
• JP Patent Publication 2003-48249 A discloses an apparatus for continuously bonding two or more sheets, at least one of which has an uneven surface, together under high vacuum, with pressure bonding, such as bonding a printed circuit board sheet with an uneven surface and a cover sheet to the sheet.
• pressure bonding such as bonding a printed circuit board sheet with an uneven surface and a cover sheet to the sheet.
• the present disclosure takes into consideration the above and aims to provide a transport jig, a circuit board manufacturing device, and a circuit board manufacturing method that can accommodate the specifications of multiple circuit boards.
• the first embodiment of the transport jig is a transport jig used in the manufacture of a circuit board having a substrate formed using a metal material, an insulating layer formed in a sheet shape using an insulating material and fixed onto the substrate, and a circuit portion formed using a conductive material and fixed onto the insulating layer, and is equipped with a base portion on which the substrate is supported from below, and a plurality of movement limiting portions that detachably engage with the base portion and limit horizontal displacement of the substrate supported from below by the base portion.
• the board is supported from below by the base portion. Furthermore, when the board is supported from below by the base portion, horizontal displacement of the board is restricted by multiple movement restricting parts.
• the multiple movement restricting parts are adapted to detachably engage with the base portion. Therefore, by changing the points at which the multiple movement restricting parts engage with the base portion, boards with different shapes and dimensions can be supported by the base portion. In this way, the transport jig of the first aspect can accommodate the specifications of multiple circuit boards.
• the second embodiment of the transport jig is the transport jig of the first embodiment, and further includes a gripped portion that is fixed to a portion of the base portion different from the portion where the substrate is supported from below and the portion where the plurality of movement limiting portions engage, and is gripped by a gripping member.
• the gripped portion that is gripped by the gripping member is fixed to the above-mentioned location on the base. This allows the transport jig to be transported with the gripped portion being gripped by the gripping member.
• the third aspect of the transport jig is the first or second aspect of the transport jig, in which the base portion is formed with a positioning portion with which a positioning member engages.
• the position of the base part can be fixed by engaging the positioning member with the positioning part formed on the base part. This allows work on the base part to be performed in a stable state.
• the circuit board manufacturing apparatus of the fourth aspect includes an insulating layer fixing section that fixes the insulating layer onto the board, a circuit section fixing section that fixes the circuit section onto the insulating layer, a transport jig of any one of the first to third aspects, and a transport section that transports the transport jig to the insulating layer fixing section and the circuit section fixing section, respectively.
• the circuit board manufacturing method of the fifth aspect uses the circuit board manufacturing apparatus of the fourth aspect and includes a first transport step of transporting the board with the insulating layer set to the insulating layer fixing part using the transport jig and the transport unit, a first fixing step of fixing the insulating layer to the board by pressing the insulating layer toward the board side, a second transport step of transporting the board with the circuit part set on the insulating layer to the circuit part fixing part using the transport jig and the transport unit, and a second fixing step of fixing the circuit part to the insulating layer by pressing the circuit part toward the board side.
• the circuit board manufacturing apparatus of the fourth aspect can be applied to the manufacturing method of the fifth aspect, for example.
• the manufacturing method of the fifth aspect first, the board with the insulating layer set is transported to the insulating layer fixing part using the transport jig and the transport part (first transport step).
• the insulating layer is fixed to the board by pressing the insulating layer toward the board side (first fixing step).
• the board with the circuit part set on the insulating layer is transported to the circuit part fixing part using the transport jig and the transport part (second transport step).
• the insulating layer is fixed to the insulating layer by pressing the circuit part toward the board side (second fixing step).
• the base part can support boards with different shapes and dimensions by changing the engagement points of the multiple movement limiting parts with the base part. In this way, the circuit board manufacturing apparatus of the fourth aspect and the manufacturing method of the fifth aspect can accommodate multiple circuit board specifications.
• the transport jig, circuit board manufacturing device, and circuit board manufacturing method disclosed herein have the excellent advantage of being able to accommodate multiple circuit board specifications.
• FIG. FIG. FIG. 2 is a block diagram showing a part of a manufacturing apparatus for a circuit board.
• FIG. 13 is a block diagram showing another part of the circuit board manufacturing apparatus.
• FIG. 2 is a perspective view showing an insulating layer formed on a PET film.
• FIG. 11 is a perspective view for explaining a process in an insulating layer cutting section.
• FIG. 2 is a perspective view showing a common conveying jig and a positioning jig;
• FIG. 13 is a perspective view for explaining a process in a first setting section, showing a state in which the substrate is set on a common transport jig;
• FIG. 13 is a perspective view for explaining a process in a first setting section, showing a process in which an insulating layer or the like is set on a substrate.
• FIG. 11 is a side view for explaining a process performed by the first preheating section.
• FIG. 2 is a side view showing an apparatus used in the first press section.
• FIG. 4 is a plan view showing a heating and pressurizing section transport section.
• FIG. 4 is a side cross-sectional view showing a heating and pressurizing unit and the like.
• FIG. 11 is a side cross-sectional view showing a step in which the insulating layer set on the substrate is pressed toward the substrate.
• FIG. FIG. 11 is a side view illustrating a first insulating layer fixing step.
• FIG. 11 is a side view illustrating a first insulating layer fixing step.
• FIG. 11 is a side view for explaining a second insulating layer fixing step.
• FIG. 11 is a side view for explaining a third insulating layer fixing step and a fourth insulating layer fixing step.
• FIG. 11 is a side view for explaining a third insulating layer fixing step and a fourth insulating layer fixing step.
• FIG. 11 is a side view for explaining a fifth insulating layer fixing step.
• FIG. 13 is a side view for explaining a sixth insulating layer fixing step and a seventh insulating layer fixing step.
• FIG. 13 is a side view for explaining a process performed by the first removal unit.
• FIG. 11 is a side view for explaining a process performed by the first cooling section.
• FIG. 11 is a side view for explaining a process performed by the first cooling section.
• FIG. 13 is a perspective view for explaining a process performed by a first peeling unit.
• FIG. 11 is a perspective view for explaining a process performed by a first inspection unit.
• FIG. 13 is a perspective view for explaining a process performed by a circuit attachment section.
• FIG. 13 is a perspective view for explaining a process in a second setting section, showing a process in which a circuit section and the like are set on a substrate.
• 11 is a side cross-sectional view showing a process in which the circuit unit set on the substrate is pressed toward the substrate.
• FIG. FIG. 13 is a side view for explaining the process performed by the second removal unit.
• FIG. 11 is a side view for explaining a process performed by the second cooling section.
• FIG. 11 is a side view for explaining a process performed by the second cooling section.
• FIG. 11 is a perspective view for explaining a process performed by a second peeling unit.
• FIG. 11 is a perspective view for explaining a process performed by a second inspection unit.
• 13 is a plan view showing the common transport jig in a state in which a single substrate can be set thereon.
• FIG. 34B is a cross-sectional view showing a cross section of one movement limiting portion taken along line 34B-34B in FIG. 34A.
• 34C is a cross-sectional view showing a cross section of one of the grasped portions taken along line 34C-34C in FIG. 34A.
• 13 is a plan view showing the common transport jig in a state in which two substrates can be set thereon.
• FIG. 13 is a plan view showing the common transport jig in a state in which four substrates can be set thereon.
• FIG. 34B is a cross-sectional view showing a cross section of one movement limiting portion taken along line 34B-34B in FIG
• circuit board manufacturing apparatus 10 and the circuit board manufacturing method according to an embodiment of the present disclosure will be described using Figures 1 to 33.
• the general configuration of the circuit board 12 will be described, and then the configuration of the circuit board manufacturing apparatus 10 will be described together with the circuit board manufacturing method.
• the circuit board 12 includes a substrate 12 , an insulating layer 16 fixed onto the substrate 12 , and a circuit portion 18 fixed onto the insulating layer 16 .
• the substrate 12 is formed using a metal material.
• the substrate 12 has a plate-shaped portion 14A formed in a rectangular plate shape, and multiple heat dissipation portions 14B protruding from the plate-shaped portion 14A.
• An insulating layer 16 and a circuit portion 18 are fixed in a stacked state to one surface of the plate-shaped portion 14A in the thickness direction.
• Multiple heat dissipation portions 14B protrude from the other surface of the plate-shaped portion 14A in the thickness direction toward the opposite side to the plate-shaped portion 14A.
• the multiple heat dissipation portions 14B are formed, as an example, in a cylindrical shape, and are regularly arranged at set intervals from each other.
• the circuit section 18 is formed in a rectangular plate shape using a conductive material. In this embodiment, multiple circuit sections 18 formed in a specified pattern are fixed onto the insulating layer 16.
• circuit board manufacturing apparatus 10 and circuit board manufacturing method 3 and 4 are block diagrams showing a schematic diagram of a circuit board manufacturing apparatus 10 (hereinafter simply referred to as "manufacturing apparatus 10") used in manufacturing the circuit board 12.
• the manufacturing apparatus 10 includes an insulating layer cutting section 20, a first setting section 22, a first preheating section 24, a first pressing section 26, a first removing section 28, a first cooling section 30, a first peeling section 32, and a first inspection section 34.
• Fig. 10 Circuit board manufacturing apparatus 10 and circuit board manufacturing method 3 and 4 are block diagrams showing a schematic diagram of a circuit board manufacturing apparatus 10 (hereinafter simply referred to as "manufacturing apparatus 10") used in manufacturing the circuit board 12.
• the manufacturing apparatus 10 includes an insulating layer cutting section 20, a first setting section 22, a first preheating section 24, a first pressing section 26, a first removing section 28, a first cooling section 30, a first peeling section 32, and a first inspection section 34.
• the manufacturing apparatus 10 includes a circuit part attaching section 36, a second setting section 38, a second preheating section 40, a second pressing section 42, a second removing section 44, a second cooling section 46, a second peeling section 48, and a second inspection section 50.
• the insulating layer cutting section 20 cuts the insulating layer 16 into a predetermined shape and size.
• the insulating layer 16 is formed in a sheet shape along a film 52 (hereinafter referred to as a PET film 52) formed using polyethylene terephthalate.
• the insulating layer cutting section 20 includes a cutting table 54 on which the insulating layer 16 is placed together with the PET film 52, and a cutter 56 that cuts the insulating layer 16 placed on the cutting table 54 together with the PET film 52.
• the insulating layer 16 is placed (set) on the cutting table 54 together with the PET film 52 with the insulating layer 16 facing downward relative to the PET film 52.
• the cutter 56 moves on the cutting table 54 in a predetermined trajectory, so that the insulating layer 16 is cut together with the PET film 52 into a predetermined shape and size.
• the cutting point is depicted by a two-dot chain line.
• All of the steps in the insulating layer cutting unit 20 may be performed automatically, or some or all of the steps in the insulating layer cutting unit 20 may be performed manually.
• the first set section 22 sets the insulating layer 16 cut to the shape and dimensions determined by the insulating layer cutting section 20 on the substrate 12.
• the first set section 22 uses a common transport jig 58 transported by a transport section 66 (see FIG. 10) described later, and a positioning jig 60 that engages with the common transport jig 58.
• the common transport jig 58 as a transport jig has a substrate setting section 58A in which the substrate 12 is set in a fitted state.
• the positioning jig 60 is formed of a metal material like the common transport jig 58.
• the positioning jig 60 has a rectangular positioning hole 60A formed so as to penetrate the positioning jig 60 in the vertical direction.
• the positioning jig 60 engages with the common transport jig 58 from above, thereby restricting the horizontal movement of the positioning jig 60 relative to the common transport jig 58 (direction perpendicular to the vertical direction).
• the substrate 12 is set in the substrate setting section 58A of the common conveying jig 58 in a position in which the heat dissipating sections 14B are on the lower side.
• the positioning jig 60 is engaged with the common conveying jig 58 from above.
• the positioning jig 60 When the positioning jig 60 is engaged with the common conveying jig 58, the portion of the plate-shaped section 14A of the substrate 12 to which the insulating layer 16 is fixed is exposed to the upper side through the positioning hole 60A. Next, adhesive is applied to the surface of the insulating layer 16 opposite to the PET film 52. Next, with the side of the insulating layer 16 to which the adhesive is applied facing downward, the insulating layer 16 is placed in the positioning hole 60A of the positioning jig 60, and the insulating layer 16 is set on the plate-shaped section 14A of the substrate 12 together with the PET film 52.
• a metal plate 62 and cardboard 64 whose shape and dimensions as viewed from above correspond to those of the insulating layer 16 are placed in the positioning hole 60A of the positioning jig 60, and the metal plate 62 and cardboard 64 are set on the insulating layer 16 (on the PET film 52). All of the steps in the first setting unit 22 may be performed automatically, or some or all of the steps in the first setting unit 22 may be performed manually.
• the first preheating section 24 heats the substrate 12 and insulating layer 16.
• the first preheating section 24 is equipped with a heating furnace 68 arranged to surround a transport section 66 that transports the common transport jig 58.
• the temperature inside the heating furnace 68 is maintained at a set temperature.
• the common transport jig 58 is moved within the heating furnace 68 by being transported by the transport section 66. This causes the substrate 12 set on the common transport jig 58 and the insulating layer 16 set on the substrate 12 to be heated.
• the first press section 26 which serves as an insulating layer fixing section, presses the insulating layer 16 set on the substrate 12 toward the substrate 12.
• the first press section 26 includes a press section main body section 70 having a mechanism for pressing an upper die 86 (described later) toward a lower die 84, a setup section 72 provided adjacent to the press section main body section 70, and a heating and pressurizing section transport section 73 for moving a heating and pressurizing section 74 (described later) and the like between the press section main body section 70 and the setup section 72.
• the first press section 26 includes two heating and pressurizing sections 74 on which the substrate 12 and the like are set, and an air suction section 76.
• the press section main body 70 includes a hydraulic cylinder 78 and an upper die engaging portion 80 supported by the hydraulic cylinder 78.
• An upper die 86 which will be described later, is removably engaged with the upper die engaging portion 80.
• the hydraulic cylinder 78 in this embodiment is configured such that a high-pressure cylinder 78A and a low-pressure cylinder 78B are stacked vertically.
• the setup section 72 is equipped with an upper die lifting section 82 that raises and lowers an upper die 86, which will be described later. By operating this upper die lifting section 82, it is possible to raise and lower the upper die 86 relative to the lower die 84.
• the heating and pressurizing section transport section 73 includes a rotating section 73A that can rotate with the vertical direction as the axial direction, and two lower die engagement sections 73B fixed to the upper part of the rotating section 73A.
• the two lower die engagement sections 73B are respectively engaged with two heating and pressurizing sections 74 described below.
• the heating and pressurizing section 74 on one lower die engagement section 73B moves from the press section main body section 70 to the setup section 72
• the heating and pressurizing section 74 on the other lower die engagement section 73B moves from the setup section 72 to the press section main body section 70.
• the position on the lower die engagement portion 73B arranged in the setup section 72 will be referred to as the "setup position P1," and the position on the lower die engagement portion 73B arranged in the press section main body 70 will be referred to as the "pressure position P2.”
• the two heating and pressurizing units 74 have the same configuration. Note that FIG. 13 only shows the heating and pressurizing unit 74 located on the press unit main body 70 side.
• the heating and pressurizing unit 74 includes a lower die 84, an upper die 86 that engages with the lower die 84, and a receiving jig 88 fixed to the lower die 84.
• the lower mold 84 comprises a lower plate portion 84A fixed to the lower mold engagement portion 73B, and a central convex portion 84B protruding upward from the horizontal center of the lower plate portion 84A.
• a receiving jig 88 which will be described later, is fixed to the upper surface of the central convex portion 84B.
• a heater 90 for heating the lower mold 84 is also provided on the lower plate portion 84A.
• an O-ring 92 is attached to the central convex portion 84B.
• a vacuum path 84C is formed in the lower plate portion 84A and the central convex portion 84B, with one end open to the upper surface of the central convex portion 84B and the other end connected to an air suction portion 76 such as a vacuum pump.
• the upper die 86 is disposed above the lower die 84.
• the upper die 86 has an upper plate portion 86A that detachably engages with the upper die engagement portion 80 and the upper die lifting portion 82 (see FIG. 11), and a peripheral wall portion 86B that protrudes downward from the horizontal end of the upper plate portion 86A.
• the upper die 86 moves toward the lower die 84, so that the upper die 86 engages with the lower die 84.
• the central convex portion 84B of the lower die 84 is disposed inside the peripheral wall portion 86B of the upper die 86.
• a sealed space 94 that surrounds the receiving jig 88 is formed between the upper die 86 and the lower die 84.
• the upper plate portion 86A is provided with a heater 90 for heating the upper mold 86.
• the upper mold 86 is provided with a concentrated pressure portion 86 that protrudes downward from the horizontal center of the upper plate portion 86A.
• FIG. 14 shows a plan view of the receiving jig 88 seen from above.
• This receiving jig 88 is formed in the shape of a rectangular block.
• the receiving jig 88 is also formed with a plurality of insertion holes 88A that are open on the upper side.
• These insertion holes 88A correspond to the heat dissipation sections 14B (see FIG. 1) of the substrate 12, and are regularly arranged at set intervals from each other. Then, as shown in FIG. 15, the substrate 12 is set on the receiving jig 88 with the heat dissipation sections 14B of the substrate 12 inserted into the insertion holes 88A, respectively.
• the lower surface of the plate-shaped section 14A (the surface that forms the bottom surface of the heat dissipation sections 14B of the substrate 12) and the upper surface of the receiving jig 88 are in contact.
• the substrate 12 that has been subjected to the process in the first preheat section 24 (passed through the heating furnace 68) is set in the heating and pressing section 74 arranged at the setup position P1.
• the first transport step is the process of transporting the substrate 14 with the insulating layer 16 set thereon from the first set section 22 to the first press section 26 using the common transport jig 58 and the transport section 66.
• a manipulator (not shown) is operated to move the substrate 12 together with the positioning jig 60, etc., and set the substrate 12 in the receiving jig 88 arranged at the setup position P1.
• the upper mold lifting section 82 is operated to engage the upper mold 86 with the lower mold 84 at the setup position P1 (first insulating layer fixing step).
• the upper mold 86 and the lower mold 84 are heated to a predetermined temperature by the heater 90 described above.
• the air suction unit 76 is activated and the air is sucked out of the sealed space 94 between the upper die 86 and the lower die 84. In other words, a vacuum is drawn in the sealed space 94 between the upper die 86 and the lower die 84.
• the rotating unit 73A is rotated to move the heating and pressurizing unit 74 located at the setup position P1 to the pressurizing position P2.
• the heating and pressurizing unit 74 located at the pressurizing position P2 moves to the setup position P1 (second insulating layer fixing process).
• the upper mold engagement portion 80 is engaged with the upper mold 86, and the upper mold 86 is pressed toward the lower mold 84 at the pressure position P2, thereby pressing the insulating layer 16 toward the substrate 12.
• This fixes the insulating layer 16 to the substrate 12 (third insulating layer fixing process).
• the state in which the insulating layer 16 is pressed toward the substrate 12 is maintained for a set time.
• the upper mold 86 and the lower mold 84 are heated by the heater 90, and a vacuum is drawn in the sealed space 94 between the upper mold 86 and the lower mold 84.
• the substrate 12 that has been processed by the first preheat unit 24 (that has passed through the heating furnace 68) is set in the heating and pressurizing unit 74 that is located at the setup position P1.
• the upper die lifting unit 82 is operated to engage the upper die 86 with the lower die 84 at the setup position P1 (fourth insulating layer fixing process).
• the air suction unit 76 is operated to draw a vacuum in the sealed space 94 between the upper die 86 and the lower die 84.
• the rotating portion 73A is rotated to move the heating and pressurizing portion 74, which has completed the third insulating layer fixing process, from the pressurizing position P2 to the preparation position.
• the heating and pressurizing portion 74 which has completed the fourth insulating layer fixing process, moves from the preparation position P1 to the pressurizing position P2 (fifth insulating layer fixing process).
• the upper die engagement portion 80 is engaged with the upper die 86, and the upper die 86 is pressed toward the lower die 84 at the pressure position P2, thereby pressing the insulating layer 16 toward the substrate 12. This fixes the insulating layer 16 to the substrate 12 (sixth insulating layer fixing process).
• the substrate 12 to which the insulating layer 16 is fixed is removed from the heating and pressurizing section 74 arranged at the setup position P1.
• a manipulator (not shown) is operated to move the substrate 12 together with the positioning jig 60, etc., and the substrate 12 is removed from the receiving jig 88 arranged at the setup position P1.
• the substrate 12 removed from the receiving jig 88 is returned to the common conveying jig 58 on the conveying section 66 together with the positioning jig 60, etc.
• the substrate 12 that has completed the process by the first preheating section 24 (passed through the heating furnace 68) is set in the heating and pressurizing section 74 arranged at the setup position P1 (seventh insulating layer fixing process).
• the substrates 12, etc. that have completed the process by the first preheating section 24 are fed one after another into the first pressing section 26.
• the substrates 12, etc. fed into the first pressing section 26 are sent out one after another to the next process.
• the first insulating layer fixing process to the seventh insulating layer fixing process described above are the first fixing process for fixing the insulating layer 16 to the substrate 14.
• the fourth insulating layer fixing process can be performed simultaneously with the third insulating layer fixing process.
• the seventh insulating layer fixing process can be performed simultaneously with the sixth insulating layer fixing process. This makes it possible to prevent the waiting time before the process of fixing the substrate 12 and the insulating layer 16 from becoming long.
• the substrate 12 to which the insulating layer 16 is fixed can be removed from the heating and pressing section 74 at the setup position P1.
• the substrate 12 before the insulating layer 16 is fixed can be set in the heating and pressing section 74 at the setup position P1. Furthermore, when the insulating layer 16 is pressed toward the substrate 12 at the pressurizing position P2, the substrate 12 before the insulating layer 16 is fixed can be heated by the heaters 90 provided on the upper die 86 and the lower die 84 at the preparation position P1. Also, when the insulating layer 16 is pressed toward the substrate 12 at the pressurizing position P2, the sealed space 94 formed between the upper die 86 and the lower die 84 can be evacuated at the preparation position P1. In this way, in this embodiment, the time that the substrate 12 that has completed the process by the first preheating unit 24 is left waiting without doing anything before being inserted into the first pressing unit 26 can be reduced.
• the concentrated pressing portion 86 of the upper mold 86 is inserted into the positioning hole 60A of the positioning jig 60, so that the portion of the plate-shaped portion 14A of the substrate 12 on which the insulating layer 16 is placed is pressed in a concentrated manner. This allows pinpoint pressing of the portion of the plate-shaped portion 14A of the substrate 12 on which the insulating layer 16 is placed.
• the concentrated pressing portion 86 of the upper mold 86 presses the portion of the plate-shaped portion 14A of the substrate 12 on which the insulating layer 16 is placed via the cardboard 64 and the metal plate 62. This makes it possible to uniformly press the portion of the plate-shaped portion 14A of the substrate 12 on which the insulating layer 16 is placed.
• the metal plate 62 between the cardboard 64 and the insulating layer 16 (PET film 52), it is possible to prevent the unevenness of the cardboard 64 from being transferred to the insulating layer 16.
• the air in the sealed space 94 formed between the lower die 84 and the upper die 86 can be sucked in by the air suction unit 76.
• the substrate 12 and the like are heated in the process in the first preheat section 24. This makes it possible to shorten the time required to heat the substrate 12 and the like in the process in the first press section 26.
• All of the steps in the first press section 26 described above may be performed automatically, or some of the steps in the first press section 26 may be performed manually.
• the positioning jig 60 is removed from the common transport jig 58 sent from the first press section 26.
• the metal plate 62 and the cardboard 64 set on the insulating layer 16 are removed. Note that all of the processes in the first removal section 28 may be performed automatically, or some or all of the processes in the first removal section 28 may be performed manually.
• the first cooling section 30 cools the substrate 12 and the insulating layer 16.
• the first cooling section 30 has fans 96 provided above and below the transport section 66 that transports the common transport jig 58.
• the common transport jig 58 is transported by the transport section 66 so that the common transport jig 58 passes between the upper and lower fans 96. This cools the substrate 12 set on the common transport jig 58 and the insulating layer 16 fixed on the substrate 12.
• the first peeling unit 32 removes the PET film 52 from the insulating layer 16.
• the first peeling unit 32 includes an adsorption unit 98 that adsorbs the PET film 52, and a nozzle 100 that sprays compressed air between the PET film 52 and the insulating layer 16.
• the adsorption unit 98 first adsorbs the horizontal center of the PET film 52.
• the adsorption unit 98 is moved while spraying compressed air from the nozzle 100 toward between the PET film 52 and the insulating layer 16. This causes the PET film 52 to be peeled off from the insulating layer 16.
• the PET film 52 peeled off from the insulating layer 16 is transported by the adsorption unit 98 and discarded in a designated container. All of the steps in the first peeling unit 32 may be performed automatically, or some or all of the steps in the first peeling unit 32 may be performed manually.
• the first inspection unit 34 inspects whether the insulating layer 16 is fixed at a predetermined position on the substrate 12. As shown in FIG. 26, the first inspection unit 34 is equipped with a camera 102. In the process in the first inspection unit 34, the image of the substrate 12 and the insulating layer 16 taken by the camera 102 is compared with the inspection data to inspect whether the insulating layer 16 is fixed at a predetermined position on the substrate 12. If the inspection result shows that the insulating layer 16 is fixed at a predetermined position on the substrate 12, the substrate 12 to which the insulating layer 16 is fixed is transported to the next process.
• the substrate 12 to which the insulating layer 16 is fixed is discarded without being sent to the next process.
• all of the processes in the first inspection unit 34 may be performed automatically, or some or all of the processes in the first inspection unit 34 may be performed manually.
• the circuit part 18 is attached to the urethane sheet 104.
• the shape and dimensions of the urethane sheet 104 as viewed in the thickness direction are set to correspond to the shape and dimensions of the insulating layer 16.
• An adhesive layer to which the circuit part 18 can be attached is formed on one side of the urethane sheet 104.
• the circuit part 18 is attached to a specified position on the surface of the urethane sheet 104 on which the adhesive layer is formed. This fixes the circuit part 18 to the urethane sheet 104. All of the processes in the circuit part attachment section 36 may be performed automatically, or some or all of the processes in the circuit part attachment section 36 may be performed manually.
• the circuit section 18 fixed to the urethane sheet 104 is set on the insulating layer 16 fixed to the substrate 12.
• adhesive is applied to the surface of the circuit unit 18 opposite the urethane sheet 104.
• adhesive is applied to the portion of the insulating layer 16 where the circuit unit 18 is fixed.
• the circuit unit 18 is set on the insulating layer 16 together with the urethane sheet 104 with the surface of the circuit unit 18 opposite the urethane sheet 104 facing downward.
• the cardboard 64 is set on the urethane sheet 104. All of the processes in the second setting unit 38 may be performed automatically, or some or all of the processes in the second setting unit 38 may be performed manually.
• the second preheating section 40 heats the substrate 12, insulating layer 16, and circuit section 18.
• the process in the second preheating section 40 is the same as the process in the first preheating section 24. That is, in the process in the second preheating section 40, the common transport jig 58 is moved within the heating furnace 68 by being transported by the transport section 66 (see FIG. 10). This heats up the substrate 12, insulating layer 16, circuit section 18, etc., that are set on the common transport jig 58.
• the second press section 42 which serves as the circuit section fixing section, presses the circuit section 18 set on the insulating layer 16 towards the substrate 12.
• the process in the second press section 42 uses the press section main body section 70, setup section 72, heating and pressurizing section transport section 73, two heating and pressurizing sections 74 and air suction section 76 shown in FIG. 11 to FIG. 14, as in the process in the first press section 26.
• each process in the second press section 42 is similar to each process in the first press section 26. Therefore, in explaining each process in the second press section 42, the same figures used in explaining each process in the first press section 26 will be used.
• the substrate 12 that has been subjected to the process in the second preheat section 40 (passed through the heating furnace 68) is set in the heating and pressing section 74 arranged at the setup position P1.
• the second transport process is a process in which the substrate 14 with the circuit section 18 set on the insulating layer 16 is transported from the second set section 38 to the second press section 42 using the common transport jig 58 and the transport section 66.
• a manipulator (not shown) is operated to set the substrate 12 in the receiving jig 88 arranged at the setup position P1.
• the upper mold lifting section 82 is operated to engage the upper mold 86 with the lower mold 84 at the setup position P1 (first circuit section fixing process).
• the upper mold 86 and the lower mold 84 are heated to a predetermined temperature by the heater 90 described above.
• the air suction unit 76 is activated and the air is sucked out of the sealed space 94 between the upper die 86 and the lower die 84. In other words, a vacuum is drawn in the sealed space 94 between the upper die 86 and the lower die 84.
• the rotating part 73A is rotated to move the heating and pressurizing part 74 arranged at the setup position P1 to the pressurizing position P2.
• the heating and pressurizing part 74 arranged at the pressurizing position P2 moves to the setup position P1 (second circuit part fixing process).
• the upper die engagement portion 80 is engaged with the upper die 86, and the upper die 86 is pressed toward the lower die 84 at the pressure position P2, thereby pressing the circuit portion 18 set on the insulating layer 16 toward the substrate 12.
• the third circuit portion fixing process the state in which the circuit portion 18 is pressed toward the substrate 12 is maintained for a set time.
• the circuit portion 18 is pressed toward the substrate 12 at a lower pressure than in the third insulating layer fixing process described above.
• the third circuit portion fixing process only the high-pressure cylinder 78A may be operated, and in the third circuit portion fixing process, only the low-pressure cylinder 78B may be operated.
• the upper mold 86 and the lower mold 84 are also heated by the heater 90, and a vacuum is drawn in the sealed space 94 between the upper mold 86 and the lower mold 84.
• the substrate 12 that has been processed by the second preheat unit 40 (that has passed through the heating furnace 68) is set in the heating and pressurizing unit 74 that is located at the setup position P1.
• the upper die lifting unit 82 is operated to engage the upper die 86 with the lower die 84 at the setup position P1 (fourth circuit unit fixing process).
• the air suction unit 76 is operated to draw a vacuum in the sealed space 94 between the upper die 86 and the lower die 84.
• the rotating portion 73A is rotated to move the heating and pressurizing portion 74, which has completed the third circuit portion fixing process, from the pressurizing position P2 to the preparation position.
• the heating and pressurizing portion 74 which has completed the fourth circuit portion fixing process, moves from the preparation position P1 to the pressurizing position P2 (fifth circuit portion fixing process).
• the upper die engagement portion 80 is engaged with the upper die 86, and the upper die 86 is pressed toward the lower die 84 at the pressure position P2, thereby pressing the circuit portion 18 set on the insulating layer 16 toward the substrate 12. This fixes the circuit portion 18 to the insulating layer 16 (sixth circuit portion fixing process).
• the substrate 12 with the circuit part 18 fixed on the insulating layer 16 is removed from the heating and pressurizing section 74 arranged at the setup position P1.
• the substrate 12 is removed from the receiving jig 88 arranged at the setup position P1 by operating a manipulator (not shown).
• the substrate 12 removed from the receiving jig 88 is returned to the common conveying jig 58 on the conveying section 66.
• the substrate 12 that has completed the process by the second preheating section 40 (passed through the heating furnace 68) is set in the heating and pressurizing section 74 arranged at the setup position P1 (seventh circuit part fixing process).
• the substrates 12 and the like that have completed the process by the second preheating section 40 are fed one after another into the second press section 42.
• the substrates 12 and the like fed into the second press section 42 are sent out one after another to the next process.
• the first circuit unit fixing process to the seventh circuit unit fixing process described above are the second fixing process for fixing the circuit unit 18 to the insulating layer 16.
• the fourth circuit part fixing process can be performed simultaneously with the third circuit part fixing process.
• the seventh circuit part fixing process can be performed simultaneously with the sixth circuit part fixing process. This makes it possible to prevent the waiting time before the process of fixing the circuit part 18 and the insulating layer 16 from becoming long.
• the substrate 12 with the circuit part 18 fixed on the insulating layer 16 can be removed from the heating and pressing section 74 at the setup position P1.
• the substrate 12 with the circuit part 18 set on the insulating layer 16 can be set in the heating and pressing section 74 at the setup position P1. Furthermore, when the circuit part 18 is pressed toward the substrate 12 at the pressurizing position P2, the substrate 12 with the circuit part 18 set on the insulating layer 16 can be heated by the heaters 90 provided on the upper die 86 and the lower die 84 at the preparation position P1. Also, when the circuit part 18 is pressed toward the substrate 12 at the pressurizing position P2, the sealed space 94 formed between the upper die 86 and the lower die 84 can be evacuated at the preparation position P1. In this way, in this embodiment, the time that the substrate 12, etc. that has completed the process by the second preheating unit 40 is left waiting without doing anything before being inserted into the second pressing unit 42 can be reduced.
• the substrate 12 is set on the receiving jig 88 with the heat dissipation sections 14B of the substrate 12 inserted into the insertion holes 88A of the receiving jig 88.
• the lower surface of the plate-shaped section 14A (the surface forming the bottom surface of the heat dissipation sections 14B of the substrate 12) is in contact with the upper surface of the receiving jig 88.
• This allows the bottom surfaces of the heat dissipation sections 14B of the substrate 12 to be supported by the upper surface of the receiving jig 88.
• pressure can be applied to the fixing points of the circuit section 18.
• the concentrated pressing portion 86 of the upper mold 86 is configured to concentrate pressure on the portion where the circuit portion 18 is set. This allows pinpoint pressure to be applied to the portion where the circuit portion 18 is set.
• the concentrated pressing portion 86 of the upper mold 86 presses the portion where the circuit portion 18 is set through the cardboard 64 and the urethane sheet 104.
• the urethane sheet 104 is pressed toward the substrate 12 through the cardboard 64, a portion of the urethane sheet 104 comes into contact with the insulating layer 16 and presses the insulating layer 16 downward. This makes it possible to suppress bulging of the insulating layer 16 at points where the circuit portion 18 is not fixed.
• the adhesive that protrudes from between the insulating layer 16 and the circuit portion 18 can be absorbed by the urethane sheet 104.
• the air in the sealed space 94 formed between the lower die 84 and the upper die 86 can be sucked in by the air suction unit 76.
• the substrate 12 and the like are heated in the process in the second preheat section 40. This makes it possible to shorten the time required to heat the substrate 12 and the like in the process in the second press section 42.
• All of the steps in the second press section 42 described above may be performed automatically, or some of the steps in the second press section 42 may be performed manually.
• the cardboard 64 set on the urethane sheet 104 is removed. All of the steps in the second removal section 44 may be performed automatically, or some or all of the steps in the second removal section 44 may be performed manually.
• the second cooling section 46 cools the substrate 12, the insulating layer 16, and the circuit section 18.
• the common transport jig 58 is transported by the transport section 66 so that the common transport jig 58 passes between the upper and lower fans 96. This cools the substrate 12 set on the common transport jig 58, the insulating layer 16 fixed on the substrate 12, and the circuit section 18 fixed on the insulating layer 16.
• the second peeling section 48 removes the urethane sheet 104.
• the second peeling section 48 has a gripping section 106 that grips the urethane sheet 104.
• the gripping section 106 first grips an end of the urethane sheet 104.
• the gripping section 106 gripping the end of the urethane sheet 104 is moved. This causes the urethane sheet 104 to be peeled off from the circuit section 18 and the insulating layer 16.
• the urethane sheet 104 peeled off from the circuit section 18 and the insulating layer 16 is carried by the gripping section 106 and discarded in a specified container. All of the processes in the second peeling section 48 may be performed automatically, or some or all of the processes in the second peeling section 48 may be performed manually.
• the second inspection unit 50 inspects whether the circuit unit 18 is fixed at a predetermined position on the board 12. As shown in FIG. 33, in the process in the second inspection unit 50, the images of the board 12, the insulating layer 16, and the circuit unit 18 taken by the camera 102 are compared with the inspection data to inspect whether the circuit unit 18 is fixed at a predetermined position on the board 12. If the inspection result shows that the circuit unit 18 is fixed at a predetermined position on the board 12, the board 12 (circuit board 12) with the circuit unit 18 fixed to the insulating layer 16 is shipped as a product.
• the board 12 (circuit board 12) with the circuit unit 18 fixed to the insulating layer 16 is discarded without being shipped as a product.
• all of the processes in the second inspection unit 50 may be performed automatically, or some or all of the processes in the second inspection unit 50 may be performed manually.
• circuit board 12 shown in Figures 1 and 2 is manufactured.
• the insulating layer cutting section 20, first setting section 22, first preheating section 24, first pressing section 26, first removal section 28, first cooling section 30, first peeling section 32, and first inspection section 34 shown in FIG. 3 and the circuit section attachment section 36, second setting section 38, second preheating section 40, second pressing section 42, second removal section 44, second cooling section 46, second peeling section 48, and second inspection section 50 shown in FIG. 4 may be shared equipment, or may be independently provided equipment.
• Figure 34A shows a plan view from above of the common conveying jig 58 used in the circuit board manufacturing apparatus 10 and circuit board manufacturing method described above.
• the common conveying jig 58 includes a base portion 108, a plurality of movement limiting portions 110 fixed to the base portion 108, and a plurality of gripped portions 112 fixed to the base portion 108.
• the base portion 108 is formed in a rectangular plate shape extending horizontally with the thickness direction being the up-down direction.
• the base portion 108 is formed with a plurality of screw holes 108A into which fastening members 114 for fixing the movement limiting portion 110 and the gripped portion 112 to the base portion 108, which will be described in detail later, are screwed. Note that in FIG. 34A, only some of the screw holes 108A are shown, and the other screw holes 108A are omitted from the illustration.
• the base portion 108 is also formed with a pair of positioning portions 108B. The pair of positioning portions 108B are arranged at an interval in the longitudinal direction of the base portion 108.
• the positioning portions 108B in this embodiment are in the form of a hole penetrating the base portion 108 in the thickness direction, but may be in the form of a recess with the lower side of the base portion 108 open.
• rectangular cutouts 108C are formed at both ends of the base 108 in the longitudinal direction and at the center of the lateral direction.
• Each of the multiple movement limiting sections 110 is formed in a block shape.
• eight movement limiting sections 110 are provided.
• Figure 34B shows a cross section of one movement limiting section 110 cut along line 34B-34B in Figure 34A.
• This movement limiting section 110 has a rectangular block-shaped first block section 110A that is arranged along the upper surface of the base section 108 when fixed to the base section 108.
• this movement limiting section 110 has a rectangular block-shaped second block section 110B that protrudes upward from the first block section 110A.
• This movement limiting section 110 has two fastening member insertion holes 110C that vertically penetrate the first block section 110A and the second block section 110B.
• the movement limiting portion 110 is fixed to the base portion 108 by screwing two fastening members 114, which are inserted through the two fastening member insertion holes 110C, into screw holes 108A formed in the base portion 108.
• the upper end of the fastening member 114 does not protrude upward from the upper surface of the second block portion 110B.
• the other seven movement limiting parts 110 have the same configuration as the movement limiting part 110 described above, except for their shape and the parts where the fastening member insertion holes 110C are formed. Therefore, the parts of the other seven movement limiting parts 110 that correspond to the movement limiting part 110 described above are given the same reference numerals as the parts corresponding to the movement limiting part 110 described above, and their description will be omitted.
• the eight movement limiting parts 110 are each fixed to the base part 108 while being arranged at a predetermined position on the base part 108. The area on the base part 108 surrounded by the eight movement limiting parts 110 forms the board set part 58A.
• each of the multiple grippable parts 112 is formed in a block shape.
• two grippable parts 112 are provided.
• Figure 34C shows a cross section of one of the grippable parts 112 cut along line 34C-34C in Figure 34A.
• This grippable part 112 has a rectangular block-shaped first block part 112A that is arranged along the upper surface of the base part 108 when fixed to the base part 108.
• this grippable part 112 has a rectangular block-shaped second block part 112B that protrudes horizontally from the upper end of the first block part 112A to one side.
• This grippable part 112 has two fastening member insertion holes 112C that vertically penetrate the first block part 112A.
• the two fastening members 114 which are inserted through the two fastening member insertion holes 112C, are screwed into the screw holes 108A formed in the base portion 108, thereby fixing the gripped portion 112 to the base portion 108. Note that when the gripped portion 112 is fixed to the base portion 108, the upper end of the fastening member 114 protrudes upward from the upper surface of the first block portion 112A.
• the shape and dimensions of the other gripped portion 112 are similar to those of the one gripped portion 112. Therefore, the parts of the other gripped portion 112 that correspond to the one gripped portion 112 are given the same reference numerals as the parts that correspond to the one gripped portion 112, and the description thereof is omitted.
• the one gripped portion 112 and the other gripped portion 112 are fixed at positions that avoid the substrate set portion 58A, where the substrate 14 is supported from below, and the portion where the multiple movement limiting portions 110 are fixed in the base portion 108.
• the one gripped portion 112 is fixed at a position adjacent to the one rectangular cutout portion 108C in the base portion 108.
• the other gripped portion 112 is fixed at a position adjacent to the other rectangular cutout portion 108C in the base portion 108.
• the second block portion 112B protrudes from the first block portion 112A toward the opposite side to the substrate setting portion 58A.
• the substrate 14 can be set in the substrate setting section 58A.
• each portion of the plate-shaped portion 14A of the substrate 14 is in contact with the upper surface of the first block portion 110A of the multiple movement limiting portions 110.
• the substrate 14 is supported from below by the base portion 108 via the first block portion 110A of the multiple movement limiting portions 110.
• each portion of the plate-shaped portion 14A of the substrate 14 is arranged horizontally opposite and adjacent to the second block portion 110B of the multiple movement limiting portions 110.
• the horizontal displacement of the substrate 14 relative to the base portion 108 is limited by the second block portion 110B of the multiple movement limiting portions 110.
• a single substrate 14 can be set in the substrate setting section 58A.
• the multiple movement limiting parts 110 are removably fixed to the base part 108 via fastening members 114. Therefore, by changing the engagement points of the multiple movement limiting parts 110 with the base part 108, it is possible to support boards 14 having different shapes and dimensions on the base part 108. For example, as shown in FIG. 35, by changing the relative positions of the eight movement limiting parts 110 described above on the base part 108 and adding one movement limiting part 110, it is possible to set two boards 14 having dimensions smaller than the above-mentioned board 14 (see FIG. 34A) in the board setting part 58A. It is also possible to set four boards 14 having dimensions smaller than the board 14 shown in FIG. 35 in the board setting part 58A, as shown in FIG. 35. In this way, the common conveying jig 58 described above can accommodate the specifications of multiple circuit boards 14.
• the two gripped parts 112 are fixed to the base part 108. This allows the common transport jig 58 to be transported with the two gripped parts 112 being gripped by gripping members (not shown).
• a pair of positioning portions 108B are formed on the base portion 108. This allows the position of the base portion 108 to be fixed by engaging a positioning member (not shown) with the pair of positioning portions 108B formed on the base portion 108. This allows work on the base portion 108 to be performed in a stable state.
• a pair of positioning portions 108B are formed on the base portion 108, but the present disclosure is not limited to this. Whether or not to form the positioning portions 108B on the base portion 108 can be appropriately determined taking into consideration factors such as whether or not it is necessary to fix the position of the base portion 108 in the manufacturing process of the circuit board 14.
• multiple movement limiting parts 110 formed in a rectangular block shape are fixed to the base part 108, but the present disclosure is not limited to this.
• multiple movement limiting parts 110 formed in a pin shape e.g., cylindrical shape

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• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Mechanical Engineering (AREA)
• Production Of Multi-Layered Print Wiring Board (AREA)
• Supply And Installment Of Electrical Components (AREA)
• Insulated Metal Substrates For Printed Circuits (AREA)
• Press Drives And Press Lines (AREA)
• Lining Or Joining Of Plastics Or The Like (AREA)

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• 2023
  • 2023-11-20 EP EP23916153.2A patent/EP4651640A4/en active Pending
  • 2023-11-20 CN CN202380091031.XA patent/CN120500918A/zh active Pending
  • 2023-11-20 KR KR1020257026660A patent/KR20250135820A/ko active Pending
  • 2023-11-20 JP JP2024570064A patent/JPWO2024150536A1/ja active Pending
  • 2023-11-20 WO PCT/JP2023/041667 patent/WO2024150536A1/ja not_active Ceased
  • 2023-11-29 TW TW112146204A patent/TWI903289B/zh active

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