Classifications

• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
  • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
  • C09K5/08—Materials not undergoing a change of physical state when used
  • C09K5/14—Solid materials, e.g. powdery or granular
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
  • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
  • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
  • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
  • B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
  • B32B7/02—Physical, chemical or physicochemical properties
  • B32B7/027—Thermal properties
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
  • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
  • C08J5/18—Manufacture of films or sheets
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
  • C08K3/20—Oxides; Hydroxides
  • C08K3/22—Oxides; Hydroxides of metals
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/28—Nitrogen-containing compounds
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/54—Silicon-containing compounds
  • C08K5/541—Silicon-containing compounds containing oxygen
  • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
  • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K7/00—Use of ingredients characterised by shape
  • C08K7/16—Solid spheres
  • C08K7/18—Solid spheres inorganic
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
  • C08L83/04—Polysiloxanes
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W40/00—Arrangements for thermal protection or thermal control
  • H10W40/20—Arrangements for cooling
  • H10W40/25—Arrangements for cooling characterised by their materials
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W40/00—Arrangements for thermal protection or thermal control
  • H10W40/20—Arrangements for cooling
  • H10W40/25—Arrangements for cooling characterised by their materials
  • H10W40/251—Organics
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
  • B32B2264/10—Inorganic particles
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
  • B32B2264/10—Inorganic particles
  • B32B2264/102—Oxide or hydroxide
  • B32B2264/1023—Alumina
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2307/00—Properties of the layers or laminate
  • B32B2307/30—Properties of the layers or laminate having particular thermal properties
  • B32B2307/302—Conductive
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2307/00—Properties of the layers or laminate
  • B32B2307/70—Other properties
  • B32B2307/732—Dimensional properties
  • B32B2307/737—Dimensions, e.g. volume or area
  • B32B2307/7375—Linear, e.g. length, distance or width
  • B32B2307/7376—Thickness
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
  • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
  • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
  • C08J2383/04—Polysiloxanes
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
  • C08K3/20—Oxides; Hydroxides
  • C08K3/22—Oxides; Hydroxides of metals
  • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/28—Nitrogen-containing compounds
  • C08K2003/282—Binary compounds of nitrogen with aluminium
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K2201/00—Specific properties of additives
  • C08K2201/001—Conductive additives
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K2201/00—Specific properties of additives
  • C08K2201/002—Physical properties
  • C08K2201/005—Additives being defined by their particle size in general
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K2201/00—Specific properties of additives
  • C08K2201/002—Physical properties
  • C08K2201/006—Additives being defined by their surface area

Definitions

• the present invention relates to a sheet-shaped heat dissipation member and a thermally conductive composite.
• thermosoftening materials that are easy to handle in a solid form at room temperature and soften or melt when exposed to heat generated by electronic components.
• thermosoftening materials are thermally conductive components that have both the easy-to-handle properties of a low-hardness thermally conductive sheet and the low thermal resistance of a thermally conductive grease.
• Silicone is known as a material that has excellent heat resistance, weather resistance, and flame retardancy, which are required particularly for heat dissipation materials, and many silicone-based heat-softening materials have been proposed.
• Patent Document 1 proposes a composition consisting of a thermoplastic silicone resin, a wax-like modified silicone resin, and a thermally conductive filler.
• Patent Document 2 proposes a thermally conductive sheet consisting of a binder resin such as silicone gel, a wax, and a thermally conductive filler.
• Patent Document 3 proposes a heat-softening heat-dissipating sheet consisting of a polymer gel such as silicone, a compound that becomes liquid when heated, such as modified silicone or wax, and a thermally conductive filler.
• Patent Document 4 discloses a heat-softening heat dissipation material that does not contain organic substances such as wax or modified silicone wax, but contains a silicone resin as a matrix, and specifies the particle size of the heat-conductive filler.
• the heat-conductive filler uses conductive copper powder, it cannot be used for insulation purposes, and copper is easily oxidized, so there were issues with stable production management.
• examples of ceramic-based thermally conductive fillers that can ensure insulation include aluminum nitride, boron nitride, alumina, magnesia, and silicon nitride.
• aluminum nitride itself has a high thermal conductivity of 170 W/mK, and is expected to have high thermal conductivity.
• aluminum nitride has poor filling properties with silicone, and high filling reduces the fluidity of the silicone binder when it is thermally softened.
• alumina has a relatively good compatibility with silicone, and even if it is highly filled, it is easy to maintain the fluidity of the silicone binder and the contact resistance is easy to decrease.
• alumina has a poor thermal conductivity of 20 W/mK by itself, and even if it is mixed with the above-mentioned heat-softening material, it is difficult to increase the thermal conductivity. Therefore, there has been a demand for the development of a heat dissipation material that can be made highly thermally conductive by increasing the filler loading, that has both good handling properties and insulating properties, and that also has excellent reliability under high temperature and high humidity conditions.
• the object of the present invention is therefore to provide a heat dissipation member that has good adhesion to heat-generating electronic components and heat dissipation components, good thermal conductivity and insulation properties, and is highly reliable.
• the present inventors have found that the following sheet-shaped heat dissipating member and thermally conductive composite can achieve the above objects, and have completed the present invention. That is, the present invention provides the following sheet-shaped heat dissipating member and thermally conductive composite.
• A 100 parts by mass of a silicone resin which is solid at 25° C.
• the heat-softenable thermally conductive composition further comprises: (D) The sheet-like heat dissipation member according to ⁇ 1> or ⁇ 2>, which contains 1 to 30 parts by mass of a linear organopolysiloxane having a viscosity of 0.1 to 100 Pa ⁇ s at 25°C and having one or more aryl groups having 6 to 12 carbon atoms in one molecule, per 100 parts by mass of the component (A).
• the heat-softenable thermally conductive composition further comprises: (C) a compound represented by the following general formula (1): R2aR3bSi ( OR4 ) 4 - ab (1) (In formula (1), R2 is an alkyl group having 6 to 15 carbon atoms, R3 is a monovalent hydrocarbon group having 1 to 4 carbon atoms, R4 is an alkyl group having 1 to 6 carbon atoms, a is an integer of 1 to 3, and b is an integer of 0 to 2, with the proviso that a+b is an integer of 1 to 3.)
• the sheet-shaped heat dissipation member according to any one of ⁇ 1> to ⁇ 4> comprising 1 to 20 parts by mass of an alkylalkoxysilane represented by the following formula (1) relative to 100 parts by mass of the component (
• ⁇ 6> The sheet-shaped heat dissipating member according to any one of ⁇ 1> to ⁇ 5>, wherein the thermal conductivity of the cured product of the heat-softening thermally conductive composition is 4.0 W/mK or more.
• ⁇ 7> The sheet-like heat dissipating member according to any one of ⁇ 1> to ⁇ 6>, wherein the composition layer has a thickness of 50 to 300 ⁇ m.
• ⁇ 8> The sheet-like heat dissipation member according to any one of ⁇ 1> to ⁇ 7>, having a breakdown voltage of 1 kV or more as measured by the method described in JIS K6249:2003.
• thermoplastic resin is any one of an aromatic polyimide resin, a polyamide resin, a polyamideimide resin, a polyester resin, and a fluororesin.
• thermoplastic resin is any one of an aromatic polyimide resin, a polyamide resin, a polyamideimide resin, a polyester resin, and a fluororesin.
• room temperature refers to a range of 15 to 30°C
• non-fluid refers to a state in which the substance is in a state in which it is difficult to flow, specifically, a state in which the substance does not deform even when 50 g of a sample is placed in a 100 ml glass bottle and placed horizontally, and then the glass bottle is tilted at a 45° angle and held for one hour.
• the sheet-shaped heat dissipation member of the present invention has a composition layer made of a heat-softening heat-conductive composition in which a silicone resin that is solid at 25° C. is combined with specific aluminum nitride and alumina as heat-conductive fillers, and the blending ratio and filling amount are optimized.
• the sheet-shaped heat dissipation member of the present invention has good thermal conductivity and insulation properties, good adhesion to heat-generating electronic components and heat-dissipating components, and can achieve high heat dissipation. Furthermore, since it has excellent reliability, it can be applied to vehicle applications that require high durability.
• the sheet-shaped heat dissipation member of the present invention can be used, for example, for heat dissipation from general power sources, electronic devices, etc., heat dissipation from integrated circuit elements such as LSIs and CPUs used in electronic devices such as personal computers and digital video disk drives, and heat dissipation from IGBT modules, DCDC converters, LED fog lamps, etc. in automotive applications.
• Component (A) is a silicone resin that forms the matrix of the sheet-shaped heat dissipation member of the present invention, and is also a factor that causes thermal softening of the sheet-shaped heat dissipation member of the present invention, and also serves as a binder that imparts processability and workability to the thermally conductive filler, which is component (B).
• Component (A) is characterized as being a silicone resin that is solid at 25°C and contains 20 mol% or more of one or more siloxane units selected from R1SiO3 /2 units (wherein R1 is a monovalent hydrocarbon having 1 to 10 carbon atoms) and SiO4 /2 units.
• R 1 is a monovalent hydrocarbon group having 1 to 10 carbon atoms, preferably a monovalent hydrocarbon group having 1 to 6 carbon atoms.
• R 1 include alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, pentyl, neopentyl, hexyl, cyclohexyl, octyl, nonyl, and decyl; aryl groups such as phenyl, tolyl, xylyl, and naphthyl; aralkyl groups such as benzyl, phenylethyl, and phenylpropyl; and alkenyl groups such as vinyl, allyl, propenyl, isopropenyl, butenyl, hexenyl, cyclohexynyl, and octenyl.
• R 1 may be a hydrocarbon group in which some or all of the hydrogen atoms present in the hydrocarbon group have been substituted with halogen atoms such as fluorine atoms.
• halogen atoms such as fluorine atoms.
• methyl, phenyl, and vinyl groups are particularly preferred.
• silicone resin of component (A) that is solid at 25°C and contains one or more siloxane units selected from R1SiO3 /2 units (hereinafter also referred to as T units) and SiO4 /2 units (hereinafter also referred to as Q units)
• T units R1SiO3 /2 units
• Q units SiO4 /2 units
• silicone resin composed of M units and Q units a silicone resin composed of M units, T units and Q units.
• the combined proportion of T units and Q units is at least 20 mol %, preferably from 20 to 98 mol %, and more preferably from 30 to 96 mol %.
• silicone resins having T units are preferred because they can increase toughness, which improves brittleness when solid at room temperature and prevents breakage during handling.
• the (A) component may have a D unit (R 1 2 SiO 2/2 unit) as a constituent unit.
• silicone resins also having D units include silicone resins consisting of T units and D units; silicone resins consisting of M units, T units and D units; and silicone resins consisting of M units, Q units and D units.
• the substituents (R 1 ) of the T units are preferably methyl groups and phenyl groups
• the substituents of the D units are preferably methyl groups, phenyl groups and vinyl groups.
• component (A) include the following silicone resins.
• the sheet-shaped heat dissipation member of the present invention is substantially solid at 25°C, and can be thermally softened, reduced in viscosity, or melted and fluidized at a certain temperature or higher, preferably 40°C or higher, but below the maximum temperature reached by heat generation of the heat-generating electronic component, specifically in a temperature range of about 40 to 150°C, and particularly about 40 to 120°C.
• the temperature at which the silicone resin is thermally softened, viscous or melted is the temperature at which the silicone resin acts as a heat dissipating member, and the silicone resin (A) itself may have a melting point below 40°C.
• the component (A) may use one type alone, or two or more types in combination.
• the silicone resin of the component (A) only needs to cause a certain degree of viscosity reduction when heated, and also needs to be able to act as a binder for the thermally conductive filler.
• the weight average molecular weight of the component (A) is preferably 500 to 20,000, particularly preferably 1,000 to 10,000, as calculated in terms of polystyrene by GPC analysis.
• the component (A) is preferably one that imparts flexibility and tackiness to the heat dissipation member of the present invention.
• a polymer of a single molecular weight may be used, but a mixture of two or more polymers having different molecular weights may also be used.
• the thermally conductive filler, component (B), is characterized by containing alumina, component (B-1), having a specific average particle size, and aluminum nitride, component (B-2), having a specific surface area of 4.0 m2 /g or less, in a specific compounding ratio.
• the average particle size of the alumina of component (B-1) is 0.1 to 70 ⁇ m, preferably 0.5 to 60 ⁇ m, and more preferably 1.0 to 50 ⁇ m. When the average particle size is within this range, it is easy to achieve close packing when component (B) is highly packed, which is advantageous for achieving high thermal conductivity, and the handleability of the molded product is also excellent.
• the average particle size is a volume average particle size, and is a value measured using a Microtrac particle size distribution measuring device MT3300EX (Nikkiso Co., Ltd.).
• the shape of the alumina of component (B-1) may be spherical, rounded, crushed, etc., with spherical being particularly preferred.
• spherical refers to a state in which the aspect ratio of the particle shape is 1.5 or less.
• the amount of alumina in component (B-1) is 120 to 1750 parts by mass, preferably 300 to 1,600 parts by mass, and more preferably 400 to 1,500 parts by mass, per 100 parts by mass of component (A), provided that the blending ratio with component (B-2) and the total blending amount of component (B) satisfy the ranges described below.
• the average particle size of the aluminum nitride of component (B-2) is 0.1 to 70 ⁇ m, preferably 0.5 to 60 ⁇ m, and more preferably 1.0 to 50 ⁇ m. When the average particle size is within this range, close packing is easily achieved when component (B) is highly packed, which is advantageous for achieving high thermal conductivity and excellent handleability of the molded product.
• the specific surface area of the aluminum nitride of component (B-2) is 4.0 m 2 /g or less, preferably 3.5 m 2 /g or less, and more preferably 3.2 m 2 /g or less.
• the specific surface area of the aluminum nitride exceeds the upper limit, the composition will have poor extensibility, and even after being molded into a molded product (sheet-like), the thermal conductivity is likely to decrease due to the effects of hydrolysis, etc., when the molded product is placed under high temperature and high humidity for a long period of time.
• the specific surface area is a value measured by a gas adsorption method, and is measured, for example, by an automatic specific surface area measuring device manufactured by Shimadzu Corporation.
• the shape of the aluminum nitride of the component (B-2) may be spherical, crushed, rounded, or the like.
• the amount of aluminum nitride in component (B-2) is 600 to 2,880 parts by mass, preferably 800 to 2,600 parts by mass, and more preferably 1,000 to 2,400 parts by mass, per 100 parts by mass of component (A), provided that the blending ratio with component (B-1) and the total blending amount of component (B) satisfy the ranges described below.
• the amount of component (B), i.e., the total amount of components (B-1) and (B-2), must be 1,200 to 3,500 parts by mass, and is preferably 1,500 to 3,000 parts by mass, per 100 parts by mass of component (A). If the amount is less than 1,200 parts by mass, the resulting composition may have poor thermal conductivity and poor storage stability, whereas if it exceeds 3,500 parts by mass, the composition may have poor extensibility and the molded product may have low strength.
• the ratio of (B-1)/(B-2) is within this range, even when the (B) component is highly filled, the flexibility and conformability of the heat dissipation component are not impaired, and it is possible to efficiently improve the thermal conductivity of the molded product.
• the component (B) may be subjected to various known surface treatments as long as the effects of the present invention, such as thermal conductivity, are not significantly impaired. Specific examples of such treatments include treatment with a coupling agent such as a silane or titanate type, and plasma treatment.
• the present invention may further include the following components as required.
• Component (C) The component (C) is represented by the following general formula (1): R2aR3bSi ( OR4 ) 4 - ab (1) (In formula (1), R2 is an alkyl group having 6 to 15 carbon atoms, R3 is a monovalent hydrocarbon group having 1 to 4 carbon atoms, R4 is an alkyl group having 1 to 6 carbon atoms, a is an integer of 1 to 3, and b is an integer of 0 to 2, with the proviso that a+b is an integer of 1 to 3.)
• the alkylalkoxysilane represented by the formula: Component (C) is a wetter component and can be blended as an optional component in the heat-softening thermally conductive composition.
• component (C) By treating the surface of the thermally conductive filler of component (B) with component (C), the wettability between component (B) and component (A) can be improved. As a result, component (C) assists in high loading of the thermally conductive powder of component (B).
• R2 is an alkyl group having 6 to 15 carbon atoms, specific examples of which include a hexyl group, an octyl group, a nonyl group, a decyl group, a dodecyl group, a tetradecyl group, etc. If the number of carbon atoms is less than 6, the wettability with the thermally conductive filler (component (B)) is likely to be insufficient, and if it is more than 15, component (C) is likely to solidify at room temperature, making handling thereof inconvenient, and the heat resistance and flame retardancy of the resulting composition are likely to decrease.
• R 3 above is a monovalent hydrocarbon group having 1 to 4 carbon atoms, which may be a saturated monovalent hydrocarbon group or an unsaturated monovalent hydrocarbon group, and the hydrogen atoms in the hydrocarbon group may be substituted with other atomic groups such as halogen atoms.
• Specific examples thereof include alkyl groups such as methyl, ethyl, propyl, and butyl; alkenyl groups such as vinyl, allyl, and isopropenyl; and halogenated alkyl groups such as 3,3,3-trifluoropropyl, and particularly preferably methyl and ethyl groups.
• R 4 above is an alkyl group having 1 to 6 carbon atoms, specific examples of which include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, and a hexyl group, with a methyl group and an ethyl group being particularly preferred.
• the above a is an integer from 1 to 3, and is particularly preferably 1.
• the above b is an integer from 0 to 2.
• a+b is an integer from 1 to 3.
• component (C) include the following alkylalkoxysilanes, etc.
• C6H13Si ( OCH3 ) 3 C10H21Si ( OCH3 ) 3 C12H25Si ( OCH3 ) 3 C12H25Si ( OC2H5 ) 3 C10H21Si ( CH3 ) ( OCH3 ) 2 C10H21Si ( C6H5 ) ( OCH3 ) 2 C10H21Si ( CH3 ) ( OC2H5 ) 2 C10H21Si ( CH CH2 )( OCH3 ) 2 C10H21Si ( CH2CH2CF3 ) ( OCH3 ) 2
• the amount of component (C) is preferably 1 to 20 parts by mass, and more preferably 2 to 15 parts by mass, per 100 parts by mass of the silicone resin of component (A). When the amount is within this range, the incorporation of component (C) is effective, allowing the thermally conductive filler to be efficiently filled, and the sheet is easy to handle.
• the heat-softenable thermally conductive composition used in the sheet-shaped heat dissipation member of the present invention preferably contains, in addition to the components (A) to (C), a linear organopolysiloxane having a viscosity of 0.1 to 100 Pa s at 25° C. and having one or more aryl groups having 6 to 12 carbon atoms per molecule as component (D).
• the toughness of the resin can be improved by introducing D units into the (A) silicone resin. It has also been found that the same effect can be obtained by blending a linear organopolysiloxane having D units separately without introducing D units into the (A) silicone resin. Therefore, when toughness is to be imparted to the heat-softening thermally conductive composition, it is preferable to blend a linear organopolysiloxane having one or more aryl groups having 6 to 12 carbon atoms in one molecule as the (D) component.
• the (D) component is preferably oily or gum-like, and when it is oily, it is preferable that the viscosity is 0.1 to 100 Pa ⁇ s. Within this range, it is possible to increase toughness and improve brittleness.
• the blend amount of the component (D) is preferably 1 to 30 parts by mass, and more preferably 2 to 15 parts by mass, per 100 parts by mass of the component (A).
• the heat-softening heat-conductive composition used in the sheet-shaped heat dissipation member of the present invention may further contain additives or fillers that are usually used in synthetic rubber as optional components, within the scope of the present invention.
• additives or fillers that are usually used in synthetic rubber as optional components, within the scope of the present invention.
• silicone oil, fluorine-modified silicone surfactant, etc. as a mold release agent
• platinum catalyst, iron oxide, titanium oxide, cerium oxide, etc. as a flame retardant imparting agent, metal oxide or metal hydroxide
• process oil, reactive titanate catalyst, reactive aluminum catalyst, etc. as a processability improver.
• fine powder silica such as precipitated silica or calcined silica, thixotropy improver, etc. as an agent to prevent the heat-conductive filler from settling at high temperatures.
• the heat-softenable thermally conductive composition used in the sheet-shaped heat dissipation member of the present invention can be easily produced by blending and kneading the above-mentioned components using a rubber kneader such as a dough mixer (kneader), a gate mixer, or a planetary mixer.
• a rubber kneader such as a dough mixer (kneader), a gate mixer, or a planetary mixer.
• the sheet-like heat dissipation member of the present invention has a composition layer produced by forming the heat-softening thermally conductive composition into a sheet.
• the term sheet is used to include film and tape.
• Methods for forming into a sheet include, for example, forming the kneaded composition by extrusion molding, calendar molding, roll molding, press molding, etc., and coating the composition dissolved in a solvent.
• the thickness of the composition layer of the sheet-like heat dissipation member produced in this manner is preferably 50 to 300 ⁇ m, more preferably 50 to 250 ⁇ m, and particularly preferably 50 to 200 ⁇ m. If the thickness is within this range, it is easy to maintain good handling and heat dissipation performance.
• the sheet-like heat dissipating member of the present invention may further have a substrate surface-treated with a release agent as a separator film (hereinafter, sometimes referred to as a release-treated film). That is, a separator film may be laminated on both sides of the composition layer of the sheet-like heat dissipating member so that the release-treated surfaces of the substrate are in contact with each other.
• a separator film By having the sheet-like heat dissipating member have a separator film, handling such as transportation and cutting to a fixed length can be facilitated. In this case, it is also possible to adjust the peel strength of the two separator films laminated on both sides by changing the amount and type of release agent and the material of the film.
• the separator film is preferably a paper or PET film that has been subjected to a release treatment with a non-dimethyl silicone polymer.
• the non-dimethyl silicone polymer include non-reactive fluorosilicone release agents (hereinafter referred to as fluorine-modified silicone separators) in which fluorine substituents such as perfluoroalkyl groups and perfluoropolyether groups are bonded to the main chain.
• the perfluoropolyether groups can be represented by the following formulas (2) to (4). (p is a number from 1 to 5, and q is a number from 3 to 10)
• non-reactive fluorosilicone release agents include, for example, X-70-201, X-70-258, and X-41-3035 manufactured by Shin-Etsu Chemical Co., Ltd.
• Methods for applying the material onto the substrate include, but are not limited to, applying a liquid material onto the substrate using a bar coater, knife coater, comma coater, spin coater, or the like, followed by heating and curing.
• the thermal conductivity of the composition layer of the sheet-shaped heat dissipation member of the present invention i.e., the cured product of the heat-softenable thermally conductive composition
• the thermal conductivity is preferably 4.0 W/m K or more, and more preferably 6.0 to 20.0 W/m K.
• the thermal conductivity is a value calculated from the thermal resistance measured by a laser flash method and the thickness of the cured product.
• the heat-softenable thermally conductive composition used in the sheet-shaped heat dissipation member of the present invention preferably has a viscosity at 80° C. in the range of 0.5 ⁇ 10 2 to 1 ⁇ 10 5 Pa ⁇ s, and more preferably in the range of 1.5 ⁇ 10 2 to 5 ⁇ 10 4 Pa ⁇ s. If the viscosity is within this range, the heat dissipation member is less likely to flow out from between the electronic component and the heat dissipation component such as a heat sink, and the gap between the electronic component and the heat dissipation component can be easily reduced, making it easier to achieve sufficient heat dissipation performance.
• the viscosity at 80° C. is a value measured by a dynamic viscoelasticity measuring device RDA3 (manufactured by TA Instruments).
• the sheet-shaped heat dissipation member of the present invention can be laminated with any reinforcing layer (X) to form a heat conductive composite having improved handling properties and insulating properties.
• the reinforcing layer is preferably a synthetic resin film layer having excellent heat resistance and electrical insulation properties, as well as flexibility and high mechanical strength, and can be appropriately selected from known substrates.
• the synthetic resin film layer usually has a thickness of 2 to 20 ⁇ m, preferably in the range of 5 to 15 ⁇ m. If the synthetic resin film layer is too thick, the thermal conductivity of the composite of the present invention will be impaired.
• the synthetic resin film layer is preferably a film layer without holes that would reduce the withstand voltage characteristics.
• the synthetic resin include aromatic polyimide resin, polyamide resin, polyamideimide resin, polyester resin such as polyethylene naphthalate, and fluororesin such as polytetrafluoroethylene (PTFE), tetrafluoroethylene-perfluoroalkylvinyl ether copolymer, etc.
• the synthetic resin film is particularly preferably a heat-resistant film having a melting point of 200° C. or more, preferably 250° C. or more.
• Kapton registered trademark
• MT product name, manufactured by Toray DuPont Co., Ltd.
• the method for producing the thermally conductive composite of the present invention is to laminate the above-mentioned sheet-like heat dissipating member as an outer layer on both sides of the reinforcing layer (X) by room temperature compression or hot compression.
• the lamination method is not particularly limited, and may be appropriately performed according to a conventionally known method for producing a composite.
• room temperature pressure bonding for example, a sheet-like heat dissipation member formed in advance on the separator film may be transferred to both sides of the reinforcing layer (X).
• the press tool is heated to 40 to 80°C and pressure-bonded and transferred in the same manner.
• roll bonding or the like may be used for pressure bonding.
• a composite may be produced by applying a composition of the heat dissipation member diluted with a solvent to both sides of the reinforcing layer (X) and drying it.
• the sheet-like heat dissipation member or thermally conductive composite of the present invention is placed between a heat-generating electronic component that can reach a temperature higher than room temperature when in operation, and a heat dissipation component; it is non-fluid at room temperature, but becomes fluid when the electronic component generates heat while in operation, or when heat is actively applied when the electronic component is placed, allowing it to fill the boundary between the electronic component and the heat dissipation component with virtually no voids.
• D represents a dimethylsiloxane unit (i.e., ( CH3 ) 2SiO2 /2 )
• T ⁇ represents a phenylsiloxane unit (i.e., ( C6H5 )SiO3 /2 )
• (A-2) M 2 T ⁇ 50 weight average molecular weight: 3,100 in polystyrene equivalent, solid at 25°C, softening point: 40-50°C
• M represents a trimethylsiloxane unit (i.e., (CH 3 ) 3 SiO 1/2 )
• T ⁇ represents a phenylsiloxane unit (i.e., (C 6 H 5 )SiO 3/2 ).
• M represents a trimethylsiloxane unit (i.e., ( CH3 ) 3SiO1 /2 )
• D represents a dimethylsiloxane unit (i.e., ( CH3 ) 2SiO2/2 )
• Q represents SiO4/2
• B Thermally conductive filler (B-1-1) Spherical alumina with an average particle size of 2 ⁇ m (B-1-2) Spherical alumina with an average particle size of 50 ⁇ m (B-2-1) Crushed aluminum nitride with an average particle size of 2 ⁇ m (specific surface area: 3.2 m 2 /g) (B-2-2) Crushed aluminum nitride with an average particle size of 30 ⁇ m (specific surface area: 2.0 m 2 /g) (B-2-3) Aluminum nitride in a crushed form with an average particle size of 0.5 ⁇ m (specific surface area: 5.6 m 2 /g, for comparison)
• Alkylalkoxysilane (wetter component) Alkylalkoxysilane represented by the formula C10H21Si ( OCH3 ) 3
• Silicone oil Phenyl-containing linear silicone oil having a viscosity of 0.4 Pa ⁇ s at 25° C. (product name: KF-54, manufactured by Shin-Etsu Chemical Co., Ltd.)
• Handling ease was evaluated based on whether a desired degree of adhesion was obtained when the sheet or composite was attached to a heat dissipation member (aluminum heat sink).
• the separator film on one side was peeled off, and the composition layer of the sheet or composite was attached to an aluminum heat sink.
• the evaluation was made as to whether the attached sheet or composite was fixed in place without slipping or breaking from the heat sink. Those which were fixed without any shifting or tearing were marked with an ⁇ , and those which were shifted or torn were marked with an ⁇ , and these are recorded in the table.
• the molded products (sheets or composites) were easy to handle (closely attached to heat dissipating parts), and showed good thermal conductivity and breakdown voltage as heat dissipating materials. Furthermore, the thermal conductivity after high temperature and high humidity did not change significantly from the initial value, making them heat dissipating materials with excellent reliability.
• the total amount of the thermally conductive filler, which is the (B) component was less than 1,200 parts by mass relative to 100 parts by mass of the (A) component, so the molded product (sheet) could not obtain the desired thermal conductivity.
• the total amount of the thermally conductive filler, which is the (B) component was as large as more than 3,500 parts by mass relative to 100 parts by mass of the (A) component, so the molded product (sheet) became brittle and difficult to handle, and evaluation of anything other than handleability was not possible.
• Comparative Example 5 aluminum nitride having a specific surface area exceeding 4.0 m 2 /g was used, and therefore when the molded product was aged for a long period of time under high temperature and high humidity, a decrease in thermal conductivity was observed, resulting in a decrease in reliability.

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• 2023
  • 2023-11-16 EP EP23894505.9A patent/EP4625487A1/en active Pending
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