Classifications

• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
  • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
  • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
  • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
  • B41J2/01—Ink jet
  • B41J2/135—Nozzles
  • B41J2/14—Structure thereof only for on-demand ink jet heads
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
  • C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
  • C08G59/22—Di-epoxy compounds
  • C08G59/24—Di-epoxy compounds carbocyclic
  • C08G59/245—Di-epoxy compounds carbocyclic aromatic
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
  • C08G59/32—Epoxy compounds containing three or more epoxy groups
  • C08G59/3227—Compounds containing acyclic nitrogen atoms
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
  • C08G59/32—Epoxy compounds containing three or more epoxy groups
  • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
  • C08G59/50—Amines
  • C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
  • C08G59/50—Amines
  • C08G59/5046—Amines heterocyclic
  • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
  • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
  • C08G59/62—Alcohols or phenols
  • C08G59/621—Phenols
  • C08G59/623—Aminophenols
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
  • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/34—Silicon-containing compounds
  • C08K3/346—Clay
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/34—Silicon-containing compounds
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/54—Silicon-containing compounds
  • C08K5/544—Silicon-containing compounds containing nitrogen

Definitions

• the present invention relates to an epoxy resin composition. More preferably, the present invention relates to an epoxy resin composition suitable for bonding parts and members used in inkjet heads in inkjet printers.
• Inkjet printing is a technology that can print characters and images directly onto a recording medium by ejecting ink in the form of minute droplets, and is a technology that is widely used in inkjet printers and other applications.
• the solvent-based ink used in inkjet printing is usually made by dispersing plastic pigments in a solvent, and this solvent is required to dissolve the plastic as a fixing agent for the plastic pigment.
• epoxy resin adhesives with high chemical resistance have traditionally been used to bond the parts and components of the inkjet head of inkjet printers (Patent Document 1).
• epoxy resin compositions with high solvent and chemical resistance are also required.
• the solvents used in inkjet printing inks are highly corrosive to adhesives, so the epoxy resin adhesives used in inkjet heads must be resistant to the inks used in inkjet printing.
• To improve the resistance of epoxy resin adhesives to ink it is common to increase the crosslink density of the epoxy resin or to highly fill the filler, but this reduces the adhesive strength and reduces the adhesive properties.
• inkjet heads are made up of parts and components that cannot be heated at high temperatures, so the adhesives used are required to have low-temperature curing properties.
• epoxy resin compositions and adhesives that have high solvent resistance, chemical resistance, and water resistance while ensuring low-temperature curing properties are also required.
• ink resistance includes solvent resistance in the sense of resistance to solvents such as organic solvents and water contained in ink, and chemical resistance in the sense of resistance to other chemicals such as alcohol, and specifically includes solvent resistance, chemical resistance, organic solvent resistance, and water resistance.
• the present invention can have the following aspects. [1] An epoxy resin composition comprising the following components (A) to (C), and containing 40 mass% or more of a glycidyl amine-type epoxy resin (A-1) relative to 100 mass% of the component (A).
• the agent B further contains a silane coupling agent as a component (E).
• a two-part mixed adhesive comprising the kit according to any one of [10] to [12] above.
• the gist of the present invention may be as follows.
• An epoxy resin composition for inkjet heads comprising the following (A) to (C), in which component (A) contains 40 mass % or more of a glycidyl amine type epoxy resin (A-1).
• A an epoxy resin
• B talc
• C a curing agent that is liquid at 25°C.
• the epoxy resin composition of the present invention is a resin composition that can be cured at low temperatures and has both excellent adhesive strength and ink resistance.
• the epoxy resin composition of the present invention When the epoxy resin composition of the present invention is used in an inkjet head, the epoxy resin composition of the present invention has excellent adhesive strength while exhibiting excellent resistance to the ink used in inkjet printers, and is extremely useful as an adhesive suitable for bonding parts and components used in inkjet heads.
• X to Y means “X or more and Y or less”, with the numerical values (X and Y) described before and after the "X” being the lower and upper limits, respectively.
• the preferred and more preferred embodiments exemplified below can be used in combination with each other as appropriate, regardless of expressions such as “preferred” and “more preferred”.
• the descriptions of numerical ranges are merely examples, and ranges obtained by appropriately combining the upper and lower limits of each range and the numerical values of the examples can also be preferably used, regardless of expressions such as “preferred” and “more preferred”.
• terms such as “contain” or “include” may be read as “essentially consisting of” or “consisting only of”, as appropriate.
• Epoxy resin composition is an epoxy resin composition comprising the following components (A) to (C), and optionally further components (D) to (F), and comprising 40 mass% or more of a glycidylamine-type epoxy resin (A-1) relative to 100 mass% of the component (A). The details are described below.
• the (A) component used in the present invention is an epoxy resin.
• Specific examples of (A) include, but are not limited to, bisphenol type epoxy resins such as bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, bisphenol AD type epoxy resins, brominated bisphenol A type epoxy resins, and hydrogenated bisphenol A type epoxy resins; naphthalene type epoxy resins; biphenyl type epoxy resins; novolac type epoxy resins such as phenol novolac type epoxy resins and orthocresol novolac type epoxy resins; glycidylamine type epoxy resins; dicyclopentadiene type epoxy resins; and alicyclic epoxy resins.
• the (A) component contains 40% by mass or more of glycidylamine type epoxy resins. From the viewpoint of improving ink resistance, it is preferable that the (A) component contains 50% by mass or more of glycidylamine type epoxy resins, and it is most preferable that only glycidylamine type epoxy resins are contained.
• the glycidylamine type epoxy resin is an epoxy resin having one or more glycidyl groups directly bonded to a nitrogen atom, and has the following structure:
• the (A) component preferably contains a trifunctional glycidylamine type epoxy resin from the viewpoint of low-temperature curing properties and improved adhesive strength. From the viewpoint of improving water resistance, it preferably contains a glycidylamine type epoxy resin and a bisphenol type epoxy resin, more preferably contains a glycidylamine type epoxy resin and a bisphenol A type diglycidyl ether and/or a bisphenol F type diglycidyl ether, and most preferably contains a glycidylamine type epoxy resin and a bisphenol A type diglycidyl ether and a bisphenol F type diglycidyl ether.
• epoxy compounds constituting the glycidylamine type epoxy resin include, but are not limited to, N,N-diglycidyl-4-glycidyloxyaniline, diaminodiphenylmethane tetraglycidyl ether, 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane, N,N,N',N'-tetraglycidyl-m-xylylenediamine, N,N,N',N'-tetraglycidyldiaminophenylmethane, etc. These may be used alone or in combination of two or more.
• glycidylamine type epoxy resins include, but are not limited to, jER630, jER604 (manufactured by Mitsubishi Chemical Corporation), TETRAD-C, TETRAD-X (manufactured by Mitsubishi Gas Chemical Company, Inc.), Araldite MY-720, Araldite MY0500, Araldite MY0510, Araldite MY0600 (manufactured by Huntsman Advanced Materials), YH-434, YH-434L (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), EP-3950S, EP-3950L, EP-3980S (ADEKA Corporation), etc. These may be used alone or in a mixture of two or more types.
• bisphenol-type epoxy resins include, for example, jER825, 827, 828, 828EL, 828US, 828XA, 834, 1009, 1010, 1003F, 1004F, 1005F, 1009F, 1004FS, 1006FS, 1007FS, 806, 806H, 807 (manufactured by Mitsubishi Chemical Corporation), EPICLON840, 840-S, 850, 850-S, EXA-850CRP, 850-LC, 830, 830-S, 835, EXA-830CRP, and EXA8.
• Such resins include 30LVP, EXA-835LV, 860, 1050, 1055, 2050, 3050, 4050, 7050, HM-091, and HM-101 (manufactured by DIC Corporation), ADEKA RESIN EP-4100, EP-4100G, EP-4100E, EP-4100TX, EP-4300E, EP-4400, EP-4520S, EP-4530, EP-4901, and EP-4901E (manufactured by ADEKA Corporation), and DER-331, 332, 383, 330, 354, and 351 (manufactured by The Dow Chemical Company). These resins may be used alone or in combination of two or more types.
• the component (B) used in the present invention is talc.
• Talc is a mineral called talc, and is a material generally called rose stone. It is preferable to use talc in the form of powder.
• the talc powder can be a powder (mainly an inorganic powder) obtained by finely grinding the talc. Chemically, talc corresponds to hydrated magnesium silicate [Mg 3 Si 4 O 10 (OH) 2 ], and is mainly composed of about 60% SiO 2 , about 30% MgO, and about 4.8% water of crystallization.
• the 50% average particle size of the component (B) is preferably 0.1 ⁇ m to 50 ⁇ m, more preferably 0.2 ⁇ m to 30 ⁇ m, and most preferably 0.5 to 20 ⁇ m.
• the average particle size in this specification including the examples and comparative examples is the particle size at a cumulative volume ratio of 50% (D50) in the particle size distribution determined by a laser diffraction scattering method.
• the content of the (B) component is preferably 10 to 300 parts by mass, more preferably 20 to 200 parts by mass, and most preferably 40 to 170 parts by mass, per 100 parts by mass of (A). If the content of (B) is 10 parts by mass or more, it is possible to improve the ink resistance, and if it is 300 parts by mass or less, there is no risk of reducing the adhesive strength.
• the component (C) used in the present invention is a curing agent that is liquid at 25°C.
• the component (C) By including the component (C), it is possible to realize low-temperature curing properties and high adhesive strength without decreasing ink resistance.
• the component (C) of the present invention does not include a curing agent that is solid at 25°C and is dispersed in an epoxy resin to make it liquid. From the viewpoint of realizing low-temperature curing properties and improving adhesive strength, it is preferable that the component (C) contains an imidazole curing agent and/or an amine curing agent.
• the amine curing agent referred to in the present invention is an amine curing agent other than an imidazole curing agent.
• an imidazole curing agent used as the component (C) include 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, and 1-cyanoethyl-2-methylimidazole.
• an amine curing agent having a primary amine in the molecule it is more preferable to include a polyetheramine.
• the polyetheramine in the present invention is an amine compound having a repeating structure of -(CR 2 -O)- in the molecule, where each R is independently hydrogen and/or a hydrocarbon group.
• Specific examples of primary polyetheramines include methoxypolyoxyethylene-2-propylamine, methoxypolyoxypropylene-2-propylamine, polyoxypropylenediamine, triethyleneglycoldiamine, trimethylolpropanepolyoxypropylenetriamine, and glycerylpolyoxypropylenetriamine.
• an amine curing agent having a tertiary amine in the molecule, and from the viewpoint of improving ink resistance and low-temperature curing properties, it is preferable to include both an amine curing agent having a primary amine and an amine curing agent having a tertiary amine.
• Specific examples of amine curing agents having a tertiary amine include diazabicycloundecene, diazabicyclononene, and trisdimethylaminomethylphenol. These may be used alone or in combination of two or more.
• the content of the (C) component is preferably 1 to 50 parts by mass, more preferably 5 to 40 parts by mass, and most preferably 10 to 30 parts by mass, per 100 parts by mass of (A). If the content is 1 part by mass or more, low-temperature curing can be achieved, and if the content of the (C) component is 50 parts by mass or less, there is no risk of reducing ink resistance or adhesive strength.
• the mass ratio total mass of imidazole curing agent:total mass of amine curing agent
• the mass ratio is 2:8 to 8:2, low-temperature curing can be achieved and there is no risk of reducing ink resistance or adhesive strength.
• the mass ratio (total mass of primary amine compounds:total mass of tertiary amine compounds) is preferably 9:1 to 1:9, more preferably 8:2 to 2:8, and most preferably 8:2 to 5:5. If the mass ratio is between 9:1 and 1:9, low-temperature curing can be achieved and there is no risk of reduced storage stability.
• the present invention preferably further comprises a dispersant as component (D).
• Component (D) of the present invention is an auxiliary for uniformly dispersing component (B) in component (A). By including component (D), it is possible to suppress settling or separation of component (B) in component (A) over time, and improve the storage stability as an adhesive suitable for bonding parts and members used in inkjet heads.
• Component (D) is not particularly limited as long as it can disperse component (B) in component (A), but a dispersant made of a carboxylate ester or a phosphate ester is preferred from the viewpoint of improving the dispersibility of component (B) and not reducing ink resistance or adhesive strength.
• the content of (D) is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 7 parts by mass, and most preferably 0.5 to 5 parts by mass, per 100 parts by mass of (A). If the content of (D) is 0.01 parts by mass or more, (B) can be uniformly dispersed in (A), and if it is 10 parts by mass or less, there is no risk of reducing ink resistance or adhesive strength.
• the present invention preferably further contains a silane coupling agent as component (E).
• a silane coupling agent as component (E).
• silane coupling agents include 3-acryloxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropylmethyldipropyloxysilane, 3-glycidoxypropyldimethylmonomethoxysilane, 3-glycidoxypropyldimethylmonoethoxysilane, 3-glycidoxypropyldimethylmonopropyloxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxy ...
• glycidyl group-containing silane coupling agents such as glycidoxypropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, and 3-glycidoxypropylmethyldiethoxysilane
• vinyl group-containing silane coupling agents such as vinyltris( ⁇ -methoxyethoxy)silane, vinyltriethoxysilane, and vinyltrimethoxysilane
• (Meth)acrylic group-containing silane coupling agents such as propyl dimethyl monoethoxysilane, 3-acryloxypropyl methyl dipropyloxysilane, 3-acryloxypropyl methyl dimethoxysilane, 3-acryloxypropyl methyl
• amino group-containing silane coupling agents are preferred, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, and N-2-(aminoethyl)-3-aminopropylmethyldiethoxysilane are more preferred, and 3-aminopropyltrimethoxysilane is the most preferred.
• the amino group silane coupling agents of the present invention are not included in component (C). These may be used alone or in combination of two or more types.
• the content of (E) is preferably 0.1 to 20 parts by mass, more preferably 0.3 to 10 parts by mass, and most preferably 0.5 to 5 parts by mass, per 100 parts by mass of (A). If the content of (E) is 0.1 part by mass or more, water resistance can be improved, and if it is 20 parts by mass or less, there is no risk of deteriorating storage stability.
• the present invention may further include fumed silica as component (F).
• Fumed silica is made of silicon dioxide usually obtained by flame hydrolysis, and generally forms spherical particles, and a plurality of particles may aggregate and fuse to form bulky aggregates.
• component (F) it is possible to adjust the application property as an adhesive suitable for bonding parts and members used in inkjet heads, and improve workability.
• surface-treated fumed silica is preferred as component (F), and fumed silica having a hydrophobic surface is more preferred.
• fumed silica having a hydrophobic surface examples include fumed silica surface-treated with dimethylsilyl, octylsilane, trimethylsilyl, dimethyl silicone oil, etc. From the viewpoint of improving the application property and not reducing the adhesive strength, it is preferable to use fumed silica surface-treated with octylsilane as component (F). These may be used alone or in combination of two or more.
• the content of (F) is preferably up to 20 parts by mass, more preferably 10 parts by mass or less, and most preferably 7 parts by mass or less, per 100 parts by mass of (A). If the content of (F) is 20 parts by mass or less, there is no risk of reducing the adhesive strength.
• additives such as organic fillers, colorants, rheology control agents, and storage stabilizers may be included in appropriate amounts within the scope of the present invention without impairing its characteristics.
• an alcohol-based solvent it is preferable not to include an alcohol-based solvent, since the storage stability decreases when combined with component (C).
• alcohol-based solvents include benzyl alcohol.
• the organic filler may be an organic material composed of rubber, elastomer, plastic, polymer (or copolymer), etc., and more preferably a powder of these organic materials.
• the organic filler may also be an organic filler having a multi-layer structure such as a core-shell type. These may be used alone or in combination of two or more types.
• the colorant examples include, but are not limited to, inorganic pigments such as carbon black, barium sulfate, alumina white, clay, and titanium oxide; organic pigments such as indanthrone blue, quinacridone red, dioxazine violet, and phthalocyanine blue; fluorescent inorganic pigments such as ZnS:Ag, ZnS:Cu, ZnS:Mn, SrAl2O4:Eu, Sr4Al14O25:Eu, Y2O2S : Eu , and Y2O3 : Eu ; fluorescent organic pigments; and dyes.
• inorganic pigments such as carbon black, barium sulfate, alumina white, clay, and titanium oxide
• organic pigments such as indanthrone blue, quinacridone red, dioxazine violet, and phthalocyanine blue
• fluorescent inorganic pigments such as ZnS:Ag, ZnS:Cu, ZnS:Mn, Sr
• the rheology control agent generally refers to an additive that has the effect of controlling rheological properties, and may be called a thixotropic agent, anti-settling agent, anti-sagging agent, thickener, etc.
• Rheology control agents include, for example, organic rheology control agents, such as fatty acid amide-based rheology control agents and ethyl cellulose-based rheology control agents, but are not limited to these.
• the storage stabilizer may be a borate ester, phosphoric acid, an alkyl phosphate ester, or p-toluenesulfonic acid.
• the borate ester include, but are not limited to, tributyl borate, trimethoxyboroxine, and ethyl borate.
• the alkyl phosphate ester include, but are not limited to, trimethyl phosphate and tributyl phosphate.
• the storage stabilizer may be used alone or in combination.
• the storage stabilizer is one or more selected from the group consisting of phosphoric acid, tributyl borate, trimethoxyboroxine, and methyl p-toluenesulfonate.
• the epoxy resin composition of the present invention has low-temperature curing properties, it is preferable to use it as a two-liquid mixed type kit in which the composition containing the (A) and (B) components is the A component, and the composition containing the (C) component is the B component, and these are mixed when used.
• the epoxy resin composition of the present invention it is preferable for the epoxy resin composition of the present invention to be a kit containing the A component and the B component separately, without mixing them.
• the epoxy resin composition contains the (D) to (F) components
• (D) may be included in the A component
• (E) may be included in the B component
• (F) may be included in the A component and/or the B component.
• the mixing ratio of agent A and agent B is preferably such that agent B contains 1 to 50 parts by mass of (C) per 100 parts by mass of (A) in agent A, more preferably 5 to 40 parts by mass of (C), and most preferably 10 to 30 parts by mass of (C).
• the term "epoxy resin composition” in this specification is appropriately interpreted as "kit” or "kit of epoxy resin compositions.”
• the method for mixing the components A and B of the epoxy resin composition kit of the present invention is not particularly limited as long as they can be mixed uniformly.
• a stirrer such as a mixer or planetary stirrer may be used, or the components may be stirred by hand using a glass rod or the like.
• the epoxy resin composition kit of the present invention has excellent low-temperature curing properties, and when the components A and B are mixed, they react quickly, so it is preferable to mix them at 40°C or less.
• the epoxy resin composition or kit of the present invention can be applied to an adherend by a known method for applying a sealant, adhesive, or coating agent, such as dispensing using an automatic coater, spraying, inkjet printing, screen printing, gravure printing, dipping, spin coating, or the like.
• the viscosity of the epoxy resin composition or the viscosity after mixing of components A and B is preferably 0.1 to 100 Pa ⁇ s, more preferably 0.5 to 70 Pa ⁇ s, and most preferably 1 to 50 Pa ⁇ s.
• the viscosity in this specification is a value measured using a cone-plate type viscometer at 25° C. and a shear rate of 20 s ⁇ 1 .
• the epoxy resin composition of the present invention can be cured under any conditions.
• the curing method includes photocuring and heat curing, but heat curing is preferred, and the curing temperature is, for example, preferably 25°C to 100°C, more preferably 30°C to 90°C, and most preferably 40°C to 80°C.
• the curing time is not particularly limited, but for example, when the temperature is 25°C to 100°C, it is preferably 30 minutes to 10 hours, and more preferably 1 hour or more and 7 hours or less.
• the epoxy resin composition of the present invention can be cured at low temperatures, has high adhesive strength, and has excellent resistance to inks used in inkjet printers, and is therefore suitable for bonding inkjet heads.
• excellent resistance to ink is also called ink resistance, and specifically means solvent resistance, chemical resistance, organic solvent resistance, and water resistance.
• the cured product of the epoxy resin composition of the present invention can exist stably without dissolving, breaking, cracking, deforming, swelling, etc., even when it comes into contact with solvents, chemicals, organic solvents, water, etc. contained in ink.
• the epoxy resin composition of the present invention has high resistance (ink resistance) to the solvents.
• the epoxy resin composition of the present invention having such high ink resistance is useful for bonding parts and members of an inkjet head.
• the inkjet head refers to a part of an inkjet printer that ejects ink onto a printing target such as paper.
• Examples of inkjet heads include thermal heads and piezoelectric heads, and the present invention is generally useful for piezoelectric inkjet heads.
• the epoxy resin composition of the present invention can be used for bonding parts and members of the inkjet head, such as the nozzle part, reservoir part, and pressure chamber part of the inkjet head.
• the parts and members of the inkjet head may be made of plastic materials, organic polymer materials, inorganic polymer materials, metal materials, and the like that are generally used in inkjet printers. More specifically, metals such as stainless steel can be mentioned as examples of these parts and members.
• the epoxy resin composition of the present invention can be used for various applications other than the above-mentioned inkjet head.
• Specific examples include, in the automotive field, adhesion, sealing, casting, coating, etc. of automotive switch parts, headlamps, engine internal parts, electrical components, drive engines, brake oil tanks, front hoods, fenders, body panels such as doors, windows, etc.; in the electronic materials field, adhesion, sealing, casting, coating, etc. of flat panel displays (liquid crystal displays, organic EL displays, light-emitting diode displays, field emission displays), video discs, CDs, DVDs, MDs, pickup lenses, hard disks, etc.; in the battery field, adhesion, sealing, casting, coating, etc. of lithium batteries, lithium-ion batteries, etc.; They can be used for bonding, sealing, coating, etc.
• the shear adhesive strength (unit: MPa) was measured at 25°C using a universal tensile tester (tensile speed: 10 mm/min.) in accordance with JIS K 6850:1999, and the evaluation was performed according to the following evaluation criteria. Pass: 10 MPa or more Fail: less than 10 MPa The upper limit is not particularly limited, but is 30 MPa or less.
• Examples 1 to 5 have excellent adhesive strength and ink resistance while having low-temperature curing properties.
• Comparative Examples 1 and 2 which do not contain glycidylamine-type epoxy resin, cracked in the cured product after immersion in the ink resistance test, making it impossible to measure.
• Comparative Example 3 which does not contain 40 mass% or more of glycidylamine-type epoxy resin relative to 100 mass% of component (A), showed poor results in both adhesive strength and ink resistance.
• Comparative Example 7 which used a different curing agent, did not cure under the curing conditions of 50°C for 6 hours, so no subsequent evaluation was performed. From the above, by combining (A) to (C), a cured product with excellent adhesive strength and ink resistance can be obtained, and the problem of the present invention can be solved.
• Water resistance was evaluated based on the mass change rate before and after immersion.
• Water resistance (mass change rate %) (mass after immersion ⁇ mass before immersion)/(mass before immersion) ⁇ 100(%)
• the water resistance value of Example 1 was +7.9%, and the water resistance value of Example 5 was +3.9%. From this, it can be seen that by including both a glycidylamine type epoxy resin and a bisphenol type epoxy resin in (A), it is possible to obtain an epoxy resin composition which has the effect of improving water resistance while maintaining ink resistance, and which is compatible with not only solvent-based inks but also water-based inks as an adhesive suitable for bonding parts and members used in inkjet heads.
• the epoxy resin composition of the present invention can be cured at low temperatures and has excellent adhesive strength.
• the cured product has excellent resistance to the inks used in inkjet printing, making it extremely useful for bonding inkjet heads in inkjet printers.

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• Polymers & Plastics (AREA)
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• 2023
  • 2023-09-27 JP JP2024555748A patent/JPWO2024075602A1/ja active Pending
  • 2023-09-27 CN CN202380070776.8A patent/CN120077081A/zh active Pending
  • 2023-09-27 EP EP23874730.7A patent/EP4600286A1/en active Pending
  • 2023-09-27 KR KR1020257010803A patent/KR20250084129A/ko active Pending
  • 2023-09-27 WO PCT/JP2023/035095 patent/WO2024075602A1/ja not_active Ceased
  • 2023-10-04 TW TW112138121A patent/TW202428682A/zh unknown

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