WO2024066827A1 - 一种接地弹片及电子设备 - Google Patents
一种接地弹片及电子设备 Download PDFInfo
- Publication number
- WO2024066827A1 WO2024066827A1 PCT/CN2023/114648 CN2023114648W WO2024066827A1 WO 2024066827 A1 WO2024066827 A1 WO 2024066827A1 CN 2023114648 W CN2023114648 W CN 2023114648W WO 2024066827 A1 WO2024066827 A1 WO 2024066827A1
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- WO
- WIPO (PCT)
- Prior art keywords
- grounding
- sub
- contact
- bending
- main body
- Prior art date
Links
- 238000005452 bending Methods 0.000 claims abstract description 158
- 230000004308 accommodation Effects 0.000 claims description 13
- 230000005489 elastic deformation Effects 0.000 claims description 4
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 5
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 5
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 2
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
Definitions
- the present application relates to the technical field of electronic products, and in particular to a grounding spring and an electronic device.
- the grounding spring is set in electronic devices such as mobile phones.
- the grounding spring is used to ground the camera component in the electronic device, that is, to connect the camera component to the grounding area on the mainboard of the electronic device to transmit the electrical signal of the camera component to the grounding area, reduce the signal interference between the camera component and other electronic components inside the electronic device, and improve the anti-interference ability of the camera component.
- the grounding spring in the related art is only applicable to electronic devices with a small distance (about less than or equal to 1.6mm) between the camera component and the grounding area along the thickness direction of the electronic device. Therefore, there is an urgent need for a grounding spring that can be applied to electronic devices with a large distance (about greater than 1.6mm) between the camera component and the grounding area.
- the purpose of the embodiments of the present application is to provide a grounding spring and an electronic device, so as to provide a grounding spring that can be applied to electronic devices where the distance between a camera component and a grounding area is large.
- the specific technical solution is as follows:
- An embodiment of the first aspect of the present application provides a grounding spring, the grounding spring is applied to an electronic device, the electronic device includes a camera assembly, a camera bracket for mounting the camera assembly, and a circuit board, the circuit board has a grounding area, and the grounding spring includes:
- a grounding portion is located at one side of the main body and is fixedly connected to the main body, the grounding portion is provided with a first contact point, and the first contact point is used to contact the grounding area;
- the side of the main body away from the grounding portion is bent toward the grounding portion to form a first bending portion, and the end of the first bending portion close to the grounding portion is bent toward the grounding portion to form a second bending portion.
- a first accommodating space is formed between the first bending portion and the second bending portion, and the first accommodating space is used to accommodate part of the structure of the camera bracket.
- the second bending portion is provided with a second contact, and the second contact is used to contact the camera assembly.
- the grounding portion includes a fixed sub-portion and an elastic sub-portion connected to the fixed sub-portion, the fixed sub-portion is connected to the main body portion, the first contact is arranged on the elastic sub-portion, and the elastic sub-portion can move in a direction close to or away from the fixed sub-portion.
- the elastic sub-portion includes:
- the first sub-part and the second sub-part are integrally connected, the first sub-part is arranged closer to the fixed sub-part than the second sub-part, the first contact is arranged on the lower surface of the second sub-part; and an elastic deformation space is formed between the first sub-part and the second sub-part.
- the main body is a sheet-like structure, and the length direction of the sheet-like structure is consistent with the thickness direction of the electronic device;
- the grounding portion is located at a first end of the main body along the thickness direction of the electronic device, and the first bending portion is located at a second end of the main body along the thickness direction of the electronic device;
- the fixing sub-portion is formed by bending the first end of the main body portion in a transverse direction, so that the fixing sub-portion is perpendicular to the main body portion.
- the camera bracket is provided with a first card slot
- the second bending portion includes: a first contact sub-portion and a second contact sub-portion;
- the second contact point is arranged on the first contact sub-portion; a first buckle is arranged on one side of the second contact sub-portion close to the first bending portion, and the first buckle is used for being engaged with the first clamping slot.
- the main body is a sheet-like structure; the grounding portion and the first bending portion and the second bending portion are respectively located on both sides of the sheet-like structure along the length direction.
- the first bending portion includes a first bending section and a second bending section connected to each other; the first bending section is formed by bending the side of the main body away from the grounding portion in a transverse direction; the second bending section is formed by bending the end of the first bending section away from the main body toward the grounding portion;
- the second bending portion comprises a third bending section and a fourth bending section connected to each other; the third bending section is formed by bending one end of the second bending section away from the first bending section in a direction away from the main body; the fourth bending section is formed by bending one end of the third bending section away from the second bending section in a direction away from the grounding portion; the second contact is arranged on the fourth bending section;
- the second bending section, the third bending section, and the fourth bending section form the first accommodating space.
- the first contact sub-portion belongs to the fourth bending segment
- the second contact point is located at an end of the fourth bending segment away from the third bending segment.
- the second contact sub-portion belongs to the fourth bending section, and the first contact sub-portion and the second contact sub-portion are separately arranged and are respectively fixedly connected to the third bending section;
- the first buckle is disposed on a side of the second contact sub-portion close to the second bending section.
- the camera bracket is provided with at least one second card slot
- At least one second buckle is disposed on a side of the main body away from the second bending section, and each second buckle is used for being engaged with one of the second buckle slots.
- the main body is provided with a first through hole, and the first through hole extends to the fixed sub-part;
- a second through hole is provided at a connection point between the main body and the first bending portion, a connection point between the first bending portion and the second bending portion, and a bending point of the second bending portion.
- the grounding spring sheet further includes a bridge piece, and the bridge piece is disposed between the grounding area and the grounding portion of the grounding spring sheet;
- the bridging piece is a conductive structure
- One side of the bridge piece is in contact with and connected to the grounding area, and the other side of the bridge piece is in contact with and connected to a first contact point of the grounding portion.
- a distance between the first contact point and the second contact point in a thickness direction of the electronic device is greater than a preset size.
- the distance between the first contact point and the second contact point is greater than 1.6 mm.
- An embodiment of a second aspect of the present application provides an electronic device, the electronic device comprising a camera assembly, a camera bracket, a circuit board and any one of the above-mentioned grounding springs, the camera bracket being used to install the camera assembly, and the circuit board having a grounding area;
- the grounding spring is connected to the camera bracket, wherein a first contact of a grounding portion of the grounding spring contacts a grounding area on the circuit board; and a second contact of a second bent portion of the grounding spring contacts the camera assembly.
- the camera bracket includes a first positioning block and a second positioning block that are fixedly connected, the first positioning block is arranged closer to the camera assembly than the second positioning block, and a second accommodating space is formed between the first positioning block and the second positioning block;
- the main body and the first bent portion of the grounding spring are placed in the second accommodating space, and the second positioning block includes a first side surface and a second side surface that are perpendicular to each other, the first side surface is arranged parallel to the main body, and the second side surface is in contact and connected with a surface of the grounding portion close to the main body.
- the first positioning block of the camera bracket is provided with a first card slot
- the second bending portion includes: a first contact sub-portion and a second contact sub-portion;
- the second contact point is arranged on the first contact sub-portion, and a first buckle is arranged on a side of the second contact sub-portion close to the first bending portion, and the first buckle is used to be engaged with the first clamping slot;
- At least one second slot is provided on the second positioning block of the camera bracket
- the first bending portion includes a first bending section and a second bending section connected to each other; at least one second buckle is provided on a side of the main body away from the second bending section, and each second buckle is used to be engaged with a second slot.
- the grounding spring clip is applied to the electronic device, and the grounding spring clip is used to connect the grounding area and the camera assembly in the electronic device to ground the camera assembly.
- the grounding spring clip includes a main body and a grounding part, one side of the main body is fixedly connected to the grounding part, and the other side is bent toward the direction close to the grounding part to form a first bending part, and the side of the first bending part close to the grounding part is bent toward the direction away from the grounding part to form a second bending part, and the first contact sub-portion of the second bending part is in contact with and connected to the camera assembly, so that the camera assembly is connected to the grounding area through the grounding spring clip.
- a first accommodating space is formed between the first bending part and the second bending part, and a partial structure of the camera bracket is placed in the first accommodating space so that the grounding spring clip can be installed on the camera bracket.
- the main body is located between the grounding portion and the first contact sub-portion.
- the distance between the grounding portion and the first contact sub-portion is the sum of the size of the first contact sub-portion, the size of the main body and the size of the grounding portion along the thickness direction of the electronic device. Therefore, the main body is provided in the grounding spring sheet so that the distance between the grounding portion and the first contact sub-portion is increased, and the increased distance is approximately the size of the main body along the thickness direction of the electronic device.
- the main body makes the grounding portion have a larger distance with the first contact sub-portion, so that the grounding spring sheet can be applied to electronic devices with a larger distance between the camera component and the grounding area.
- FIG1 is a structural diagram of a grounding spring in some embodiments of the present application.
- FIG2 is a structural diagram of a grounding spring installed in an electronic device in some embodiments of the present application.
- FIG3 is a partial structural diagram of a grounding spring in some embodiments of the present application.
- FIG4 is a side view of a grounding spring installed in an electronic device in some embodiments of the present application.
- FIG5 is a top view of a grounding spring installed in an electronic device in some embodiments of the present application.
- FIG. 6 is a partial structural diagram of a grounding spring in some embodiments of the present application.
- the term "and/or" is only a description of the association relationship of associated objects, indicating that three relationships may exist.
- a and/or B can represent: A exists alone, A and B exist at the same time, and B exists alone.
- the character "/" in this article generally indicates that the associated objects before and after are in an "or" relationship.
- multiple refers to more than two (including two).
- multiple groups refers to more than two groups (including two groups), and “multiple pieces” refers to more than two pieces (including two pieces).
- the shooting function in electronic devices such as mobile phones and tablets has become a key selling point of electronic devices, and the camera component is an important component for realizing the shooting function of electronic devices.
- the camera component is an important component for realizing the shooting function of electronic devices.
- electrical signal interference will be generated with other electronic components inside the electronic device, affecting the camera quality of the camera component.
- a grounding spring sheet is often provided in the electronic device. The grounding spring sheet is used to connect the camera component to the grounding area in the electronic device to achieve grounding of the camera component, reduce signal interference between the camera component and other electronic components, and enhance the anti-interference ability of the camera component.
- the grounding spring sheet includes a first contact and a second contact, the first contact is in contact and connection with the camera body of the camera component, and the second contact is in contact and connection with the grounding area.
- the distance between the first contact and the second contact in the direction perpendicular to the grounding area is small.
- the distance between the first contact and the second contact in the direction perpendicular to the grounding area is less than or equal to 1.6 mm.
- an embodiment of the present application provides a grounding spring and an electronic device.
- the grounding spring and the electronic device provided in the embodiment of the present application will be described in detail below in conjunction with the accompanying drawings.
- the grounding spring can be applied to electronic devices with camera components such as mobile phones, tablets, and computers.
- the electronic device includes a camera component 10, a camera bracket 20 for mounting the camera component 10, and a mainboard 30, and the mainboard 30 has a grounding area.
- the grounding area can be an area formed by a metal plate integrated in the mainboard 30, and the grounding area can also be a metal area formed by the exposed surface of the mainboard 30.
- an embodiment of the first aspect of the present application provides a grounding spring 100, which includes a main body 1 and a grounding portion 2.
- the grounding portion 2 is located on one side of the main body 1 and is fixedly connected to the main body 1, and the side of the grounding portion 2 away from the main body 1 is used to connect to the grounding area.
- the side of the main body 1 away from the grounding portion 2 is bent in a direction close to the grounding portion 2 to form a first bending portion 3, and the side of the first bending portion 3 close to the grounding portion 2 is bent in a direction away from the grounding portion 2 to form a second bending portion 4.
- a first accommodating space 5 is formed between the first bending portion 3 and the second bending portion 4, and the first accommodating space 5 is used to accommodate part of the structure of the camera bracket 20.
- the second bending portion 4 includes a first contact sub-portion 41, and the first contact sub-portion 41 is used to contact and connect with the camera assembly 10.
- the grounding spring clip 100 when the grounding spring clip 100 is installed in the electronic device, the direction toward the camera assembly 10 is upward, and the direction toward the main board 30 is downward.
- the material of the grounding spring clip 100 is a metal such as copper, aluminum, or an alloy having a metal such as copper, aluminum, etc.
- the main body 1 can be a sheet-like structure, and the main body 1 is roughly rectangular, and the first bending portion 3 and the grounding portion 2 are respectively arranged on both sides of the main body 1 along the length direction.
- the main body 1 when the grounding spring clip 100 is installed in the electronic device, the main body 1 is arranged perpendicular to the grounding area on the main board 30, so that in the direction perpendicular to the grounding area, the main body 1 makes the first bending portion 3 on both sides of itself have a certain distance from the grounding portion 2.
- the main body 1 since the second bending portion 4 is formed by bending the lower side of the first bending portion 3 upward, the main body 1 makes the first contact sub-portion 41 on the second bending portion 4 have a certain distance from the grounding portion 2.
- the camera assembly 10 includes a camera body and a device for accommodating The first contact sub-portion 41 of the camera body is in contact with the camera assembly.
- the first contact sub-portion 41 can pass through the shell to contact or abut the camera body, or the first contact sub-portion 41 can contact or abut the conductive area on the shell.
- a first accommodation space 5 is formed between the first bending portion 3 and the second bending portion 4.
- part of the structure of the camera bracket 20 is located in the first accommodation space 5, so that the grounding spring sheet 100 can be installed on the camera bracket 20.
- part of the structure of the first bending portion 3 can be arranged parallel to the main body 1.
- the first bending portion 3, the second bending portion 4, the main body 1 and the grounding portion 2 can be an integral structure
- the first bending portion 3 can be formed by stamping and bending the upper side of the main body 1
- the grounding portion 2 can be formed by stamping and bending the lower side of the main body 1
- the second bending portion 4 can be formed by stamping and bending the lower side of the first bending portion 3.
- the main body 1 is located between the grounding part 2 and the first contact sub-part 41.
- the grounding part 2 is in contact with the grounding area
- the first contact sub-part 41 is in contact with the camera assembly 10.
- the distance between the grounding part 2 and the first contact sub-part 41 is the sum of the size of the first contact sub-part 41, the size of the main body 1, and the size of the grounding part 2 in the thickness direction of the electronic device.
- the main body 1 is provided in the grounding spring 100 so that the distance between the grounding part 2 and the first contact sub-part 41 is increased, and the increased distance is approximately the size of the main body 1 in the thickness direction of the electronic device.
- the grounding portion 2 includes a fixed sub-portion 21 and an elastic sub-portion 22 connected to the fixed sub-portion 21, the fixed sub-portion 21 is connected to the main body portion 1, and a first contact 221 is provided on the elastic sub-portion 22, and the first contact 221 is used to connect to the grounding area, and the elastic sub-portion 22 can move in a direction close to or away from the fixed sub-portion 21.
- the first contact 221 is located on the lower surface of the elastic sub-portion 22, and the first contact 221 can be a protrusion protruding from the lower surface of the elastic sub-portion 22.
- Both the elastic sub-portion 22 and the fixed sub-portion 21 can be a sheet-like structure, as shown in FIG1 , an elastic deformation space is formed between the elastic sub-portion 22 and the fixed sub-portion 21.
- the elastic sub-portion 22 can be in a slightly compressed state, and then the elastic sub-portion 22 is pressed against the grounding area below by the rebound force of the elastic sub-portion 22, so that the first contact 221 is stably connected to the grounding area.
- the elastic sub-portion 22 and the fixed sub-portion 21 may also be an integral structure.
- FIG6 is a schematic diagram of the structure of the grounding portion 2, the elastic sub-portion 22 includes a first sub-portion 222 and a second sub-portion 223 connected in one piece, the first sub-portion 222 is arranged closer to the fixed sub-portion 21 than the second sub-portion 223, and the first contact 221 is arranged on the lower surface of the second sub-portion 223.
- An elastic deformation space is formed between the first sub-portion 222 and the second sub-portion 223.
- the first sub-portion 222 and the second sub-portion 223 are tilted relative to the fixed sub-portion 21.
- the first sub-portion 222 and the second sub-portion 223 are elastic and can be elastically deformed.
- the elastic sub-portion 22 is connected to the grounding area, one end of the second sub-portion 223 contacts the grounding area first and is arranged at a certain angle to the grounding area. Then, by applying pressure to the grounding spring sheet 100, the second sub-portion 223 and the second sub-portion 223 are tilted relative to the fixed sub-portion 21.
- the first sub-portion 222 is deformed under pressure, so that the angle between the second sub-portion 223 and the first sub-portion 222 and the grounding area gradually decreases, until the second sub-portion 223 and the first sub-portion 222 are roughly parallel to the grounding area, and the first contact 221 contacts the grounding area.
- the first sub-portion 222 and the second sub-portion 223 are tilted compared to the fixed sub-portion 21, so that when the grounding spring 100 is installed in an electronic device, the first sub-portion 222 and the second sub-portion 223 are elastically deformed, and the elastic sub-portion 22 is pressed against the grounding area below by the rebound force of the first sub-portion 222 and the second sub-portion 223, so that the first contact 221 is stably connected to the grounding area.
- the grounding spring 100 may further include a bridge piece 6, which is disposed between the grounding region and the grounding portion 2 of the grounding spring 100.
- the bridge piece 6 is a conductive structure, one side of the bridge piece 6 is in contact with the grounding region, and the other side is in contact with the first contact 221 of the grounding portion 2, so as to achieve grounding of the grounding portion 2.
- the bridge piece 6 is used to further increase the size of the grounding spring 100 in the thickness direction, so that the grounding spring 100 can be applied to electronic devices where the distance between the camera assembly 10 and the grounding region is relatively large.
- the fixed sub-portion 21 is arranged perpendicular to the main body 1. As shown in FIG. 1 and FIG. 2, the fixed sub-portion 21 is arranged perpendicular to the main body 1, and an unclosed third accommodation space is formed between the fixed sub-portion 21 and the main body 1.
- the camera bracket 20 includes a first positioning block 203 and a second positioning block 204. A second accommodation space is defined between the first positioning block 203 and the second positioning block 204. As shown in FIG.
- the main body 1 and the first bending portion 3 of the grounding spring sheet 100 are located in the second accommodation space, and the second positioning block 204 is located in the above-mentioned unclosed third accommodation space, and the lower surface of the second positioning block 204 is arranged opposite to or in contact with the upper surface of the fixed sub-portion 21, and the side surface of the second positioning block 204 adjacent to the lower surface and perpendicular to the lower surface is arranged correspondingly or in contact with the side surface of the main body 1.
- the fixing sub-portion 21 is arranged perpendicular to the main body 1 , so that the fixing sub-portion 21 and the main body 1 can better cooperate with the lower surface and the side surface of the second positioning block 204 , so that the grounding spring 100 can be more stably installed on the camera bracket 20 .
- the first contact sub-portion 41 includes a second contact 411 , which is in contact with the camera assembly 10 , and a distance L1 between the first contact 221 and the second contact 411 along a direction perpendicular to the grounding area is greater than 1.6 mm.
- the following distances are all distances in a direction perpendicular to the grounding area.
- the distance L1 between the first contact 221 and the second contact 411 is greater than 1.6 mm, so when the grounding spring 100 is installed in an electronic device, the distance between the camera component 10 in contact with the second contact 411 and the grounding area in contact with the first contact 221 can be greater than 1.6 mm, that is, the grounding spring 100 can be used in electronic devices where the distance between the camera component 10 and the grounding area is greater than 1.6 mm.
- the distance L1 between the first contact 221 and the second contact 411 is related to the dimension in the direction of the extended side of the main body 1, that is, the length of the main body 1. Therefore, the distance between the first contact 221 and the second contact 411 can be adjusted by changing the length of the main body 1, so that the grounding spring 100 can be applied to electronic devices of various sizes.
- the camera bracket 20 is provided with a first slot 201 .
- the second bending portion 4 further includes a second contact sub-portion 42 , and a first buckle 421 is provided on one side of the second contact sub-portion 42 close to the first bending portion 3 , and the first buckle 421 is used to engage with the first slot 201 .
- the second bending portion 4 further includes a second contact sub-portion 42, and the second contact sub-portion 42 is used to connect with the camera bracket 20 to fix the grounding spring 100.
- the second contact sub-portion 42 can be arranged parallel to the first bending portion 3 to facilitate the connection of the second contact sub-portion 42 with the camera bracket.
- the first contact sub-portion 41 and the second contact sub-portion 42 are located in different planes, and the upper end of the first contact sub-portion 41 is inclined in a direction away from the first bending portion 3, and the second contact point 411 is arranged on the first contact sub-portion 41.
- a first buckle 421 is provided on one side of the second contact sub-portion 42 close to the first bending portion 3.
- the first buckle 421 is engaged with the first slot 201 on the camera bracket 20.
- the first buckle 421 and the first slot 201 are used to limit the grounding spring piece 100, reduce the probability of the grounding spring piece 100 rotating relative to the camera bracket 20 due to the reaction force of the camera assembly 10, and enable the grounding spring piece 100 to be more stably in contact and connected with the camera assembly 10 and the grounding area.
- the first buckle 421 is a sheet-like structure, and the first buckle 421 is tilted downward relative to the second contact sub-portion 42.
- the first buckle 421 is tilted downward, so that when the first buckle 421 is engaged with the first slot 201, the first buckle 421 can apply downward pressure to the camera bracket 20 in the vertical direction, so that the first buckle 421 can fix the grounding spring sheet 100 in a direction perpendicular to the grounding area.
- the first buckle 421 can also apply pressure to the camera bracket 20 in the horizontal direction to reduce the probability of the grounding spring sheet 100 rotating relative to the camera bracket 20.
- the first buckle 421 and the second bending portion 4 may be an integral structure.
- the first buckle 421 may be obtained by stamping a partial area of the second bending portion 4 .
- the camera bracket 20 is provided with at least one second slot 202 .
- the main body 1 is provided with at least one second buckle 12 on one side close to the first bending portion 3 , and each second buckle 12 is used to be engaged with one second slot 202 .
- the second buckle 12 when the grounding spring piece 100 is installed in the electronic device, the second buckle 12 is engaged with the second slot 202 on the camera bracket 20.
- the second buckle 12 and the second slot 202 are used to limit the grounding spring piece 100, reduce the probability that the grounding spring piece 100 rotates relative to the camera bracket 20 due to the reaction force of the camera assembly 10, and further increase the connection stability between the grounding spring piece 100, the camera assembly 10 and the grounding area.
- the second buckle 12 is a sheet-like structure, and the second buckle 12 is arranged to be tilted downward relative to the main body 1.
- the second buckle 12 is arranged to be tilted downward, so that when the second buckle 12 is engaged with the second slot 202, the second buckle 12 can apply downward pressure to the camera bracket 20 along the vertical direction Y, so that the second buckle 12 can fix the grounding spring piece in a direction perpendicular to the grounding area.
- the second buckle 12 can also apply rightward pressure in FIG. 4 to the camera bracket 20 along the horizontal direction X, reducing the probability of the grounding spring piece rotating relative to the camera bracket 20.
- the number of the second buckle 12 and the second slot 202 can be set according to actual needs, and each second buckle 12 is engaged in a second slot 202.
- the second buckle 12 and the first bending portion 3 may be an integral structure.
- the second buckle 12 may be obtained by stamping a partial area of the first bending portion 3 .
- two second buckles 12 are provided on one side of the main body 1 away from the first bending portion 3.
- two second slots 202 are provided on the camera bracket 20.
- each second buckle 12 is snapped into one second slot 202.
- the two second buckles 12 jointly limit the grounding spring 100, further reducing the probability of the grounding spring rotating relative to the camera bracket 20, and further increasing the connection stability between the grounding spring 100 and the camera assembly 10 and the grounding area.
- two second buckles 12 are arranged side by side along the wide side direction of the main body 1 .
- the main body 1 is provided with a first through hole 11, and the first through hole 11 extends to the fixed sub-section 21.
- the first through hole 11 is a process hole, which is used to reduce the bending difficulty of the main body 1 when the lower side of the main body 1 is bent to form the fixed sub-section 21, and reduce the probability of fracture at the connection between the main body 1 and the fixed sub-section 21 due to stress concentration.
- the second embodiment of the present application provides an electronic device, the electronic device includes a camera assembly 10, a camera bracket 20, the main board 30 and the grounding spring piece 100 in any of the above embodiments, the camera bracket 20 is used to install the camera assembly 10, and the main board 30 has a grounding area.
- the grounding spring piece 100 is connected to the camera bracket 20, the first contact sub-portion 41 of the second bending portion 4 of the grounding spring piece 100 is in contact with the camera assembly 10, and the grounding portion 2 of the grounding spring piece 100 is connected to the grounding area.
- the electronic device includes but is not limited to mobile phones, tablets, laptop computers and other devices with camera components.
- the main body 1 in the grounding spring sheet 100 included therein, the main body 1 is located between the grounding portion 2 and the first contact sub-portion 41.
- the grounding spring sheet 100 is installed in the electronic device, the grounding portion 2 is in contact with the grounding area, and the first contact sub-portion 41 is in contact with the camera component 10.
- the distance between the grounding portion 2 and the first contact sub-portion 41 is the sum of the size of the first contact sub-portion 41, the size of the main body 1 and the size of the grounding portion 2 in the thickness direction of the electronic device. Therefore, the main body 1 is provided in the grounding spring sheet 100 so that the distance between the grounding portion 2 and the first contact sub-portion 41 increases, and the increased distance is approximately the size of the main body 1 in the thickness direction of the electronic device. As shown in Figure 1, there is a first distance L1 between the contact end of the first contact sub-portion 41 and the contact end of the grounding portion 2.
- the grounding spring clip 100 when the grounding spring clip 100 is applied to an electronic device, the grounding spring clip 100 can be applied to an electronic device in which the distance between the camera component 10 and the grounding area is approximately L1, so that the grounding spring clip 100 can be applied to an electronic device in which the distance between the camera component 10 and the grounding area is larger.
- the camera bracket 20 includes a first positioning block 203 and a second positioning block 204 that are fixedly connected.
- the first positioning block 203 is disposed closer to the camera assembly 10 than the second positioning block 204, and a second accommodation space is formed between the first positioning block 203 and the second positioning block 204.
- the main body 1 and the first bending portion 3 of the grounding spring 100 are placed in the second accommodation space, and the second positioning block 204 includes a first side surface 2041 and a second side surface 2042 that are perpendicular to each other.
- the first side surface 2041 is disposed parallel to the main body 1
- the second side surface 2042 is disposed parallel to a side surface of the grounding portion 2 close to the main body 1.
- the first side surface 2041 of the second positioning block 204 can be the lower surface of the second positioning block 204, and the second side surface 2042 is a side surface adjacent to and perpendicular to the lower surface.
- An unclosed accommodation space is formed between the fixed sub-portion 21 and the main body 1, and a second accommodation space is defined between the first positioning block 203 and the second positioning block 204.
- the main body 1 and the first bending portion 3 of the grounding spring 100 are located in the second accommodation space, and the second positioning block 204 is located in the above-mentioned unclosed accommodation space, and the lower surface of the second positioning block 204 is arranged opposite to or in contact with the upper surface of the grounding portion 2, and the side surface of the second positioning block 204 is arranged correspondingly or in contact with the side surface of the main body 1, so that the grounding spring 100 can be more stably installed on the camera bracket 20.
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
一种接地弹片（100）及电子设备，接地弹片（100）应用于电子设备，电子设备包括摄像组件（10）、用于安装摄像组件（10）的摄像支架（20），以及主板（30），主板（30）上具有接地区域，接地弹片（100）包括主体部（1）及接地部（2），接地部（2）位于主体部（1）的一侧且与主体部（1）固定连接，接地部（2）远离主体部（1）的一侧用于与接地区域连接；主体部（1）远离接地部（2）的一侧沿靠近接地部（2）的方向弯折形成第一弯折部（3），第一弯折部（3）靠近接地部（2）的一侧沿远离接地部（2）的方向弯折形成第二弯折部（4），第一弯折部（3）与第二弯折部（4）之间形成第一容纳空间（5），第一容纳空间（5）用于容纳摄像支架（20）的部分结构，第二弯折部（4）包括第一接触子部（41），第一接触子部（41）与摄像组件（10）接触连接。
Description
本申请要求于2022年09月26日提交中国专利局、申请号为202211171070.4发明名称为“一种接地弹片及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
本申请涉及电子产品技术领域，特别是涉及一种接地弹片及电子设备。
接地弹片设置于手机等电子设备内，接地弹片用于使电子设备内的摄像组件接地，即将摄像组件连接至电子设备内主板上的接地区域，以将摄像组件的电信号传导至接地区域，降低摄像组件与电子设备内部其他电子元件的信号干扰，提升摄像组件的抗干扰能力。而相关技术中的接地弹片仅适用于沿电子设备的厚度方向上，摄像组件与接地区域距离较小(约小于等于1.6mm)的电子设备，因此亟需一种能够应用于摄像组件与接地区域距离较大(约大于1.6mm)的电子设备的接地弹片。
发明内容
本申请实施例的目的在于提供一种接地弹片及电子设备，以提供一种能够应用于摄像组件与接地区域距离较大的电子设备的接地弹片。具体技术方案如下：
本申请第一方面的实施例提供了一种接地弹片，所述接地弹片应用于电子设备，所述电子设备包括摄像组件、用于安装摄像组件的摄像支架以及电路板，所述电路板上具有接地区域，所述接地弹片包括：
主体部；
接地部，所述接地部位于所述主体部的一侧且与所述主体部固定连接，所述接地部设有第一触点，所述第一触点用于与所述接地区域接触；
所述主体部远离所述接地部的一侧向靠近所述接地部的方向弯折形成第一弯折部，所述第一弯折部靠近所述接地部的一端向远离所述接地部的方向弯折形成第二弯折部，所述第一弯折部与所述第二弯折部之间形成第一容纳空间，所述第一容纳空间用于容纳所述摄像支架的部分结构，所述第二弯折部设有第二触点，所述第二触点用于与所述摄像组件接触。
一些实施例中，所述接地部包括固定子部和与所述固定子部连接的弹性子部，所述固定子部与所述主体部连接，所述第一触点设置在所述弹性子部上，所述弹性子部可沿靠近或远离所述固定子部的方向移动。
一些实施例中，所述弹性子部包括：
一体连接的第一子部分和第二子部分，相较于所述第二子部分，所述第一子部分更加靠近所述固定子部设置，所述第一触点设置于所述第二子部分的下表面；所述第一子部分与所述第二子部分之间形成弹性变形空间。
一些实施例中，所述主体部为片状结构，所述片状结构的长度方向与所述电子设备的厚度方向一致；
所述接地部位于所述主体部沿所述电子设备的厚度方向的第一端，所述第一弯折部位于所述主体部沿所述电子设备的厚度方向的第二端；
所述固定子部由所述主体部的第一端横向弯折形成，以使所述固定子部垂直于所述主体部。
一些实施例中，所述摄像支架上设有第一卡槽；
所述第二弯折部包括：第一接触子部和第二接触子部；
所述第二触点设置在所述第一接触子部上；所述第二接触子部靠近所述第一弯折部的一侧设有第一卡扣，所述第一卡扣用于与所述第一卡槽卡接。
一些实施例中，所述主体部为片状结构；所述接地部与所述第一弯折部和所述第二弯折部分别位于所述片状结构沿长度方向的两侧。
一些实施例中，所述第一弯折部包括相互连接的第一弯折段和第二弯折段；所述第一弯折段由所述主体部远离所述接地部的一侧横向弯折形成；所述第二弯折段由所述第一弯折段远离所述主体部的一端，向靠近所述接地部的方向弯折形成；
所述第二弯折部包括相互连接的第三弯折段和第四弯折段；所述第三弯折段由所述第二弯折段远离所述第一弯折段的一端，向远离所述主体部的方向横向弯折形成；所述第四弯折段由所述第三弯折段远离所述第二弯折段的一端，向远离所述接地部的方向弯折形成；所述第二触点设置在所述第四弯折段上；
所述第二弯折段、所述第三弯折段与所述第四弯折段形成所述第一容纳空间。
一些实施例中，所述第一接触子部属于所述第四弯折段，所述第二触点位于所述第四弯折段远离所述第三弯折段的一端。
一些实施例中，所述第二接触子部属于所述第四弯折段，所述第一接触子部与第二接触子部分离设置，分别与所述第三弯折段固定连接；
所述第一卡扣设置于所述第二接触子部靠近所述第二弯折段的一侧。
一些实施例中，所述摄像支架上设有至少一个第二卡槽；
所述主体部远离所述第二弯折段的一侧设有至少一个第二卡扣，每一所述第二卡扣用于与一个所述第二卡槽卡接。
一些实施例中，所述主体部上设有第一通孔，所述第一通孔延伸至所述固定子部；
所述主体部和所述第一弯折部的连接处、所述第一弯折部和所述第二弯折部的连接处以及所述第二弯折部的弯折处均设有第二通孔。
一些实施例中，所述接地弹片还包括搭接件，所述搭接件设置于所述接地区域与所述接地弹片的接地部之间；
所述搭接件为导电结构；
所述搭接件的一侧与所述接地区域接触连接，所述搭接件的另一侧与所述接地部的第一触点接触连接。
一些实施例中，所述第一接触点与所述第二接触点在所述电子设备的厚度方向上的距离大于预设尺寸。
一些实施例中，在所述电子设备的厚度方向上，所述第一接触点与所述第二接触点之间的距离大于1.6mm。
本申请第二方面的实施例提供了一种电子设备，所述电子设备包括摄像组件、摄像支架、电路板以及上述任一所述的接地弹片，所述摄像支架用于安装所述摄像组件，所述电路板上具有接地区域；
所述接地弹片与所述摄像支架连接，其中，所述接地弹片的接地部的第一触点与所述电路板上的接地区域接触；所述接地弹片的第二弯折部的第二触点与所述摄像组件接触。
一些实施例中，所述摄像支架包括固定连接的第一定位块及第二定位块，所述第一定位块相较于所述第二定位块更加靠近所述摄像组件设置，所述第一定位块与所述第二定位块之间形成有第二容纳空间；
所述接地弹片的所述主体部及所述第一弯折部置于所述第二容纳空间内，所述第二定位块包括相互垂直的第一侧面及第二侧面，所述第一侧面平行于所述主体部设置，所述第二侧面与所述接地部靠近所述主体部的一侧表面接触连接。
一些实施例中，所述摄像支架的所述第一定位块上设有第一卡槽；
所述第二弯折部包括：第一接触子部和第二接触子部；
所述第二触点设置在所述第一接触子部上，所述第二接触子部靠近所述第一弯折部的一侧设有第一卡扣，所述第一卡扣用于与所述第一卡槽卡接；
所述摄像支架的所述第二定位块上设有至少一个第二卡槽；
所述第一弯折部包括相互连接的第一弯折段和第二弯折段；所述主体部远离所述第二弯折段的一侧设有至少一个第二卡扣，每一所述第二卡扣用于与一个所述第二卡槽卡接。
本申请实施例有益效果：
本申请实施例提供的一种接地弹片及电子设备中，接地弹片应用于电子设备，接地弹片用于连接电子设备中的接地区域及摄像组件，以使摄像组件接地。接地弹片包括主体部和接地部，主体部的一侧与接地部固定连接，另一侧朝向靠近接地部的方向弯折形成第一弯折部，第一弯折部靠近接地部的一侧朝向远离接地部的方向弯折形成第二弯折部，第二弯折部的第一接触子部与摄像组件接触连接，以使摄像组件通过接地弹片与接地区域连接。第一弯折部与第二弯折部之间形成第一容纳空间，摄像支架的部分结构置于第一容纳空间内，以使接地弹片安装于摄像支架上。本申请实施例提供的接地弹片中，主体部位于接地部与第一接触子部之间，当接地弹片安装于电子设备内时，接地部与及接地区域接触连接，第一接触子部与摄像组件接触连接，沿垂直于接地区域的方向上，即沿电子设备的厚度方向上，接地部与第一接触子部之间的距离为沿电子设备的厚度方向上，第一接触子部的尺寸、主体部的尺寸及接地部的尺寸之和，因此在接地弹片中设置主体部使得接地部与第一接触子部之间的距离增加，且增加的距离约为主体部沿电子设备的厚度方向上的尺寸，主体部使得接地部与第一接触子部之间具有较大的距离，从而使得接地弹片可以应用于摄像组件与接地区域距离较大的电子设备。
当然，实施本申请的任一产品或方法并不一定需要同时达到以上所述的所有优点。上述说明仅是本申请技术方案的概述，为了能够更清楚了解本申请的技术手段，而可依照说明书的内容予以实施，并且为了让本申请的上述和其它目的、特征和优点能够更明显易懂，
以下特举本申请的具体实施方式。
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的实施例。
图1为本申请一些实施例中一种接地弹片的一种结构图；
图2为本申请一些实施例中一种接地弹片安装于电子设备时的一种结构图；
图3为本申请一些实施例中一种接地弹片的一种部分结构图；
图4为本申请一些实施例中一种接地弹片安装于电子设备时的一种侧视图；
图5为本申请一些实施例中一种接地弹片安装于电子设备时的一种俯视图；
图6为本申请一些实施例中一种接地弹片的一种局部结构图。
下面将结合附图对本申请技术方案的实施例进行详细的描述。以下实施例仅用于更加清楚地说明本申请的技术方案，因此只作为示例，而不能以此来限制本申请的保护范围。
除非另有定义，本文所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同；本文中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本申请；本申请的说明书和权利要求书及上述附图说明中的术语“包括”和“具有”以及它们的任何变形，意图在于覆盖不排他的包含。
在本申请实施例的描述中，技术术语“第一”“第二”等仅用于区别不同对象，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量、特定顺序或主次关系。在本申请实施例的描述中，“多个”的含义是两个以上，除非另有明确具体的限定。
在本文中提及“实施例”意味着，结合实施例描述的特定特征、结构或特性可以包含在本申请的至少一个实施例中。在说明书中的各个位置出现该短语并不一定均是指相同的实施例，也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是，本文所描述的实施例可以与其它实施例相结合。
在本申请实施例的描述中，术语“和/或”仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。另外，本文中字符“/”，一般表示前后关联对象是一种“或”的关系。
在本申请实施例的描述中，术语“多个”指的是两个以上(包括两个)，同理，“多组”指的是两组以上(包括两组)，“多片”指的是两片以上(包括两片)。
在本申请实施例的描述中，技术术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请实施例和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申
请实施例的限制。
在本申请实施例的描述中，除非另有明确的规定和限定，技术术语“安装”“相连”“连接”“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；也可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请实施例中的具体含义。
目前，手机、平板等电子设备中的拍摄功能已经成为电子设备的关键卖点，摄像组件为实现电子设备拍摄功能的重要组件。摄像组件工作过程中会与电子设备内部的其他电子元件产生电信号干扰，影响摄像组件的摄像质量。为解决上述问题，多在电子设备内设置接地弹片，接地弹片用于将摄像组件与电子设备内的接地区域连接，实现摄像组件接地，降低摄像组件与其他电子元件的信号干扰，提升摄像组件的抗干扰能力。相关技术中，接地弹片包括第一触点和第二触点，第一触点与摄像组件的摄像主体接触连接，第二触点与接地区域接触连接。相关技术中的接地弹片中，第一触点和第二触点沿垂直于接地区域的方向上的距离较小，例如，第一触点与第二触点沿垂直于接地区域的方向上的距离小于等于1.6mm，这使得接地弹片仅能用于摄像组件与接地区域之间电子元件较少，摄像组件与接地区域距离较小的电子设备，对于摄像组件与接地区域之间电子元件较多，摄像组件与接地区域距离较大的电子设备没有适用的接地弹片。
为提供一种能够应用于摄像组件与接地区域距离较大的电子设备的接地弹片，本申请实施例提供了一种接地弹片及电子设备，下面将结合附图对本申请实施例提供的接地弹片及电子设备进行详细说明。其中，接地弹片可以应用于手机、平板、电脑等具有摄像组件的电子设备。如图2所示，电子设备包括摄像组件10、用于安装摄像组件10的摄像支架20，以及主板30，主板30上具有接地区域。其中，接地区域可以为集成于主板30的金属板所形成的区域，接地区域也可以为主板30表面裸露形成的金属区域。
如图1所示，本申请第一方面的实施例提供了一种接地弹片100，接地弹片100包括主体部1和接地部2。接地部2位于主体部1的一侧且与主体部1固定连接，接地部2远离主体部1的一侧用于与接地区域连接。主体部1远离接地部2的一侧沿靠近接地部2的方向弯折形成第一弯折部3，第一弯折部3靠近接地部2的一侧沿远离接地部2的方向弯折形成第二弯折部4，第一弯折部3与第二弯折部4之间形成第一容纳空间5，第一容纳空间5用于容纳摄像支架20的部分结构，第二弯折部4包括第一接触子部41，第一接触子部41用于与摄像组件10接触连接。
本申请实施例中，为便于描述，定义接地弹片100安装于电子设备时，朝向摄像组件10的方向为上，朝向主板30的方向为下。接地弹片100的材料为铜、铝等金属或具有铜、铝等金属的合金。如图1所示，主体部1可以为片状结构，且主体部1大致呈矩形，第一弯折部3和接地部2分别设置于主体部1沿长度方向上的两侧。可选的，接地弹片100安装于电子设备时，主体部1垂直于主板30上的接地区域设置，因此沿垂直于接地区域的方向上，主体部1使得位于自身两侧的第一弯折部3与接地部2之间具有一定距离。又由于第二弯折部4为第一弯折部3的下侧朝向上方弯折形成，主体部1使得第二弯折部4上的第一接触子部41与接地部2之间具有一定距离。摄像组件10包括摄像主体和用于容纳
摄像主体的壳体，第一接触子部41与摄像组件接触连接，可以为第一接触子部41穿过壳体与摄像主体接触连接或抵接，也可以为第一接触子部41与壳体上的导电区域接触连接或抵接。
第一弯折部3与第二弯折部4之间形成第一容纳空间5，接地弹片100安装于电子设备内时，摄像支架20的部分结构位于第一容纳空间5内，使得接地弹片100能够安装于摄像支架20上。可选的，如图1所示，第一弯折部3部分结构可以平行于主体部1设置。可选的，第一弯折部3、第二弯折部4、主体部1及接地部2可以为一体结构，第一弯折部3可以为对主体部1的上侧冲压弯折形成，接地部2可以为对主体部1的下侧冲压弯折形成，第二弯折部4可以为对第一弯折部3的下侧冲压弯折形成。
在本申请实施例提供的接地弹片100中，主体部1位于接地部2与第一接触子部41之间，当接地弹片100安装于电子设备内时，接地部2与及接地区域接触连接，第一接触子部41与摄像组件10接触连接，沿垂直于接地区域的方向上，即沿电子设备的厚度方向上，接地部2与第一接触子部41之间的距离为沿电子设备的厚度方向上，第一接触子部41的尺寸、主体部1的尺寸及接地部2的尺寸之和，因此在接地弹片100中设置主体部1使得接地部2与第一接触子部41之间的距离增加，且增加的距离约为主体部1沿电子设备的厚度方向上的尺寸。如图1所示，第一接触子部41的接触端与接地部2的接触端之间具有第一距离L1，因此当接地弹片100应用于电子设备时，接地弹片100可以应用于摄像组件10与接地区域之间的距离约为L1的电子设备，从而使得接地弹片100可以应用于摄像组件10与接地区域距离较大的电子设备。
一些实施例中，如图1所示，接地部2包括固定子部21和与固定子部21连接的弹性子部22，固定子部21与主体部1连接，弹性子部22上设有第一触点221，第一触点221用于与接地区域连接，弹性子部22可沿靠近或远离固定子部21的方向移动。
本申请实施例中，如图1所示，第一触点221位于弹性子部22的下表面，第一触点221可以为凸出于弹性子部22下表面的凸起。弹性子部22及固定子部21均可以为片状结构，如图1所示，弹性子部22与固定子部21之间形成有弹性变形空间。当弹性子部22受到向上的力时，弹性子部22可以沿靠近固定子部21的方向移动并处于压缩状态，力撤销后弹性子部22可以通过自身的反弹力复位。通过弹性子部22的设置，可以在安装接地弹片100时，使得弹性子部22处于轻微的压缩状态，然后通过弹性子部22的反弹力使得弹性子部22压紧下方的接地区域，从而使得第一触点221与接地区域稳定连接。
可选的，弹性子部22与固定子部21也可以为一体结构。
可选的，如图6所示，图6为接地部2的结构示意图，弹性子部22包括一体连接的第一子部分222和第二子部分223，第一子部分222相较于第二子部分223更加靠近固定子部21设置，第一触点221设置于第二子部分223的下表面。第一子部分222与第二子部分223之间形成弹性变形空间。
其中，如图6所示，当接地弹片100处于自然状态下，第一子部分222及第二子部分223相较于固定子部21倾斜设置。第一子部分222及第二子部分223具有弹性且可以发生弹性形变。弹性子部22与接地区域连接时，第二子部分223的一端先于接地区域接触，并与接地区域呈一定夹角设置，然后通过对接地弹片100施加压力，第二子部分223及第
一子部分222在压力作用下发生形变，使得第二子部分223及第一子部分222与接地区域间的夹角逐渐减小，直至第二子部分223及第一子部分222大致平行于接地区域，且第一触点221与接地区域接触。接地弹片100处于自然状态下，第一子部分222及第二子部分223相较于固定子部21倾斜设置，使得接地弹片100安装于电子设备内时，第一子部分222及第二子部分223产生弹性形变，通过第一子部分222及第二子部分223的反弹力使得弹性子部22压紧下方的接地区域，从而使得第一触点221与接地区域稳定连接。
一些实施例中，如图2所示，接地弹片100还可以包括搭接件6，搭接件6设置于接地区域与接地弹片100的接地部2之间。搭接件6为导电结构，搭接件6的一侧与接地区域接触连接，另一侧与接地部2的第一触点221接触连接，实现接地部2的接地。搭接件6用于进一步增加接地弹片100沿厚度方向上的尺寸，使得接地弹片100可以应用于摄像组件10与接地区域距离较大的电子设备。
一些实施例中，固定子部21垂直于主体部1设置。如图1和图2所示，固定子部21与主体部1垂直设置，在固定子部21与主体部1之间形成不封闭的第三容纳空间。摄像支架20包括第一定位块203和第二定位块204。第一定位块203和第二定位块204之间限定出第二容纳空间，如图2所示，当接地弹片100安装于电子设备时，接地弹片100的主体部1与第一弯折部3位于第二容纳空间内，且第二定位块204位于上述不封闭的第三容纳空间内，且第二定位块204的下表面与固定子部21的上表面相对设置或接触连接，第二定位块204上与下表面相邻且垂直于下表面的侧面与主体部1的侧面对应设置或接触连接。固定子部21垂直于主体部1设置，使得固定子部21与主体部1更好的与第二定位块204的下表面与侧面配合，使得接地弹片100更加稳定的安装于摄像支架20上。
一些实施例中，如图1所示，第一接触子部41包括第二触点411，第二触点411与摄像组件10接触连接，沿垂直于接地区域的方向上，第一触点221与第二触点411之间的距离L1大于1.6mm。
本申请实施例中，为便于描述，下述距离均为沿垂直于接地区域的方向上的距离。第一触点221与第二触点411之间的距离L1大于1.6mm，因此接地弹片100安装于电子设备时，与第二触点411接触连接的摄像组件10和与第一触点221接触的接地区域之间的距离可以大于1.6mm，也就是接地弹片100可以用于摄像组件10与接地区域间的距离大于1.6mm的电子设备。其中，第一触点221与第二触点411之间的距离L1与主体部1延长边方向上的尺寸，即主体部1的长度相关，因此，可通过改变主体部1的长度调整第一触点221与第二触点411间的距离，使得接地弹片100可以应用于多种尺寸的电子设备中。
一些实施例中，如图3和图5所示，摄像支架20上设有第一卡槽201。第二弯折部4还包括第二接触子部42，第二接触子部42靠近第一弯折部3的一侧设有第一卡扣421，第一卡扣421用于与第一卡槽201卡接。
本申请实施例中，如图1和图3所示，第二弯折部4还包括第二接触子部42，第二接触子部42用于与摄像支架20连接，以固定接地弹片100。可选的，如图1和图3所示，第二接触子部42可以平行于第一弯折部3设置，以便于第二接触子部42与摄像支架连接。可选的，如图1所示，第一接触子部41和第二接触子部42位于不同平面，第一接触子部41的上端朝向远离第一弯折部3的方向倾斜设置，且第二触点411设置于第一接触子部41
的上端，以便于第二触点411与摄像组件10接触连接。其中，第二接触子部42靠近第一弯折部3的一侧设有第一卡扣421，当接地弹片100安装于电子设备时，第一卡扣421与摄像支架20上的第一卡槽201卡接。第一卡扣421及第一卡槽201用于对接地弹片100进行限位，降低接地弹片100因受摄像组件10的反作用力而相对于摄像支架20发生转动的概率，使得接地弹片100能够更加稳定地与摄像组件10及接地区域接触连接。
可选的，如图3和图4所示，第一卡扣421为片状结构，第一卡扣421相对于第二接触子部42向下倾斜设置。第一卡扣421向下倾斜设置，使得第一卡扣421与第一卡槽201卡接时，第一卡扣421可以向沿竖直方向向摄像支架20施加向下的压力，使得第一卡扣421能够沿垂直于接地区域的方向固定接地弹片100。第一卡扣421还可以沿水平方向向摄像支架20施加压力，降低接地弹片100相对于摄像支架20发生转动的概率。
可选的，第一卡扣421可以与第二弯折部4为一体结构，例如，第一卡扣421可以为对第二弯折部4的部分区域进行冲压得到。
一些实施例中，如图3和图5所示，摄像支架20上设有至少一个第二卡槽202。主体部1靠近第一弯折部3的一侧设有至少一个第二卡扣12，每一第二卡扣12用于与一个第二卡槽202卡接。
本申请实施例中，当接地弹片100安装于电子设备时，第二卡扣12与摄像支架20上的第二卡槽202卡接。第二卡扣12及第二卡槽202用于对接地弹片100进行限位，降低接地弹片100因受摄像组件10的反作用力而相对于摄像支架20发生转动的概率，进一步增加接地弹片100与摄像组件10及接地区域的连接稳定性。
可选的，如图4和图5所示，第二卡扣12为片状结构，第二卡扣12相对于主体部1向下倾斜设置。第二卡扣12向下倾斜设置，使得第二卡扣12与第二卡槽202卡接时，第二卡扣12可以向沿竖直方向Y向摄像支架20施加向下的压力，使得第二卡扣12能够沿垂直于接地区域的方向固定接地弹片。第二卡扣12还可以沿水平方向X向摄像支架20施加图4中向右的压力，降低接地弹片相对于摄像支架20发生转动的概率。其中，第二卡扣12及第二卡槽202的数量可以根据实际需求设置，每一第二卡扣12卡接于一个第二卡槽202内。
可选的，第二卡扣12可以与第一弯折部3为一体结构，例如，第二卡扣12可以为通过对第一弯折部3的部分区域冲压得到。
一些实施例中，如图3所示，主体部1远离第一弯折部3的一侧设有两个第二卡扣12。相对应的，摄像支架20上设有两个第二卡槽202，接地弹片100安装于电子设备时，每一第二卡扣12均卡接于一个第二卡槽202内。两个第二卡扣12共同对接地弹片100进行限位，进一步降低接地弹片相对于摄像支架20发生转动的概率，进一步增加接地弹片100与摄像组件10及接地区域的连接稳定性。
可选的，如图3所示，两个第二卡扣12沿主体部1的宽边方向并排设置。
一些实施例中，主体部1上设有第一通孔11，第一通孔11延伸至固定子部21。第一通孔11为工艺孔，用于在主体部1的下侧弯折形成固定子部21时，降低主体部1的弯折难度，且降低因应力集中使得主体部1与固定子部21的连接处出现断裂的概率。
本申请第二方面的实施例提供了一种电子设备，电子设备包括摄像组件10、摄像支架
20、主板30以及上述任一实施例中的接地弹片100，摄像支架20用于安装摄像组件10，主板30上具有接地区域。接地弹片100与摄像支架20连接，接地弹片100的第二弯折部4的第一接触子部41与摄像组件10接触连接，且接地弹片100的接地部2与接地区域连接。
本申请实施例中，电子设备包括但不限于手机、平板、笔记本电脑等具有摄像组件的设备。在本申请实施例提供的电子设备中，其包括的接地弹片100中，主体部1位于接地部2与第一接触子部41之间，当接地弹片100安装于电子设备内时，接地部2与及接地区域接触连接，第一接触子部41与摄像组件10接触连接，沿垂直于接地区域的方向上，即沿电子设备的厚度方向上，接地部2与第一接触子部41之间的距离为沿电子设备的厚度方向上，第一接触子部41的尺寸、主体部1的尺寸及接地部2的尺寸之和，因此在接地弹片100中设置主体部1使得接地部2与第一接触子部41之间的距离增加，且增加的距离约为主体部1沿电子设备的厚度方向上的尺寸。如图1所示，第一接触子部41的接触端与接地部2的接触端之间具有第一距离L1，因此当接地弹片100应用于电子设备时，接地弹片100可以应用于摄像组件10与接地区域之间的距离约为L1的电子设备，从而使得接地弹片100可以应用于摄像组件10与接地区域距离较大的电子设备。
一些实施例中，如图2所示，摄像支架20包括固定连接的第一定位块203及第二定位块204，第一定位块203相较于第二定位块204更加靠近摄像组件10设置，第一定位块203与第二定位块204之间形成有第二容纳空间。接地弹片100的主体部1及第一弯折部3置于第二容纳空间内，第二定位块204包括相互垂直的第一侧面2041及第二侧面2042，第一侧面2041平行于主体部1设置，第二侧面2042与接地部2靠近主体部1的一侧表面平行设置。
本申请实施例中，第二定位块204的第一侧面2041可以为第二定位块204的下表面，第二侧面2042为与下表面相邻且垂直于下表面的侧面。固定子部21与主体部1之间形成不封闭的容纳空间，第一定位块203和第二定位块204之间限定出第二容纳空间，接地弹片100的主体部1与第一弯折部3位于第二容纳空间内，且第二定位块204位于上述不封闭的容纳空间内，且第二定位块204的下表面与接地部2的上表面相对设置或接触连接，第二定位块204的侧面与主体部1的侧面对应设置或接触连接，以使接地弹片100更稳定地安装于摄像支架20上。
最后应说明的是：以上各实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述各实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的范围，其均应涵盖在本申请的权利要求和说明书的范围当中。尤其是，只要不存在结构冲突，各个实施例中所提到的各项技术特征均可以任意方式组合起来。本申请并不局限于文中公开的特定实施例，而是包括落入权利要求的范围内的所有技术方案。
Claims (17)
- 一种接地弹片，应用于电子设备，其特征在于，所述电子设备包括摄像组件、用于安装摄像组件的摄像支架以及电路板，所述电路板上具有接地区域，所述接地弹片包括：主体部；接地部，所述接地部位于所述主体部的一侧且与所述主体部固定连接，所述接地部设有第一触点，所述第一触点用于与所述接地区域接触；所述主体部远离所述接地部的一侧向靠近所述接地部的方向弯折形成第一弯折部，所述第一弯折部靠近所述接地部的一端向远离所述接地部的方向弯折形成第二弯折部，所述第一弯折部与所述第二弯折部之间形成第一容纳空间，所述第一容纳空间用于容纳所述摄像支架的部分结构，所述第二弯折部设有第二触点，所述第二触点用于与所述摄像组件接触。
- 根据权利要求1所述的接地弹片，其特征在于，所述接地部包括固定子部和与所述固定子部连接的弹性子部，所述固定子部与所述主体部连接，所述第一触点设置在所述弹性子部上，所述弹性子部可沿靠近或远离所述固定子部的方向移动。
- 根据权利要求2所述的接地弹片，其特征在于，所述弹性子部包括：一体连接的第一子部分和第二子部分，相较于所述第二子部分，所述第一子部分更加靠近所述固定子部设置，所述第一触点设置于所述第二子部分的下表面；所述第一子部分与所述第二子部分之间形成弹性变形空间。
- 根据权利要求3所述的接地弹片，其特征在于，所述主体部为片状结构，所述片状结构的长度方向与所述电子设备的厚度方向一致；所述接地部位于所述主体部沿所述电子设备的厚度方向的第一端，所述第一弯折部位于所述主体部沿所述电子设备的厚度方向的第二端；所述固定子部由所述主体部的第一端横向弯折形成，以使所述固定子部垂直于所述主体部。
- 根据权利要求1所述的接地弹片，其特征在于，所述摄像支架上设有第一卡槽；所述第二弯折部包括：第一接触子部和第二接触子部；所述第二触点设置在所述第一接触子部上；所述第二接触子部靠近所述第一弯折部的一侧设有第一卡扣，所述第一卡扣用于与所述第一卡槽卡接。
- 根据权利要求5所述的接地弹片，其特征在于，所述主体部为片状结构；所述接地部与所述第一弯折部和所述第二弯折部分别位于所述片状结构沿长度方向的两侧。
- 根据权利要求6所述的接地弹片，其特征在于，所述第一弯折部包括相互连接的第一弯折段和第二弯折段；所述第一弯折段由所述主体部远离所述接地部的一侧横向弯折形成；所述第二弯折段由所述第一弯折段远离所述主体部的一端，向靠近所述接地部的方向弯折形成；所述第二弯折部包括相互连接的第三弯折段和第四弯折段；所述第三弯折段由所述第二弯折段远离所述第一弯折段的一端，向远离所述主体部的方向横向弯折形成；所述第四 弯折段由所述第三弯折段远离所述第二弯折段的一端，向远离所述接地部的方向弯折形成；所述第二触点设置在所述第四弯折段上；所述第二弯折段、所述第三弯折段与所述第四弯折段形成所述第一容纳空间。
- 根据权利要求7所述的接地弹片，其特征在于，所述第一接触子部属于所述第四弯折段，所述第二触点位于所述第四弯折段远离所述第三弯折段的一端。
- 根据权利要求8所述的接地弹片，其特征在于，所述第二接触子部属于所述第四弯折段，所述第一接触子部与第二接触子部分离设置，分别与所述第三弯折段固定连接；所述第一卡扣设置于所述第二接触子部靠近所述第二弯折段的一侧。
- 根据权利要求1所述的接地弹片，其特征在于，所述摄像支架上设有至少一个第二卡槽；所述主体部远离所述第二弯折段的一侧设有至少一个第二卡扣，每一所述第二卡扣用于与一个所述第二卡槽卡接。
- 根据权利要求1所述的接地弹片，其特征在于，所述主体部上设有第一通孔，所述第一通孔延伸至所述固定子部；所述主体部和所述第一弯折部的连接处、所述第一弯折部和所述第二弯折部的连接处以及所述第二弯折部的弯折处均设有第二通孔。
- 根据权利要求1所述的接地弹片，其特征在于，所述接地弹片还包括搭接件，所述搭接件设置于所述接地区域与所述接地弹片的接地部之间；所述搭接件为导电结构；所述搭接件的一侧与所述接地区域接触连接，所述搭接件的另一侧与所述接地部的第一触点接触连接。
- 根据权利要求1-12任一项所述的接地弹片，其特征在于，所述第一接触点与所述第二接触点在所述电子设备的厚度方向上的距离大于预设尺寸。
- 根据权利要求1-12任一项所述的接地弹片，其特征在于，在所述电子设备的厚度方向上，所述第一接触点与所述第二接触点之间的距离大于1.6mm。
- 一种电子设备，其特征在于，包括摄像组件、摄像支架、电路板以及权利要求1-14任一项所述的接地弹片，所述摄像支架用于安装所述摄像组件，所述电路板上具有接地区域；所述接地弹片与所述摄像支架连接，其中，所述接地弹片的接地部的第一触点与所述电路板上的接地区域接触；所述接地弹片的第二弯折部的第二触点与所述摄像组件接触。
- 根据权利要求15所述的电子设备，其特征在于，所述摄像支架包括固定连接的第一定位块及第二定位块，所述第一定位块相较于所述第二定位块更加靠近所述摄像组件设置，所述第一定位块与所述第二定位块之间形成有第二容纳空间；所述接地弹片的所述主体部及所述第一弯折部置于所述第二容纳空间内，所述第二定位块包括相互垂直的第一侧面及第二侧面，所述第一侧面平行于所述主体部设置，所述第二侧面与所述接地部靠近所述主体部的一侧表面接触连接。
- 根据权利要求16所述的电子设备，其特征在于，所述摄像支架的所述第一定位块上设有第一卡槽；所述第二弯折部包括：第一接触子部和第二接触子部；所述第二触点设置在所述第一接触子部上，所述第二接触子部靠近所述第一弯折部的一侧设有第一卡扣，所述第一卡扣用于与所述第一卡槽卡接；所述摄像支架的所述第二定位块上设有至少一个第二卡槽；所述第一弯折部包括相互连接的第一弯折段和第二弯折段；所述主体部远离所述第二弯折段的一侧设有至少一个第二卡扣，每一所述第二卡扣用于与一个所述第二卡槽卡接。
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