WO2024065862A1 - 晶圆搬运装置 - Google Patents
晶圆搬运装置 Download PDFInfo
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- WO2024065862A1 WO2024065862A1 PCT/CN2022/123911 CN2022123911W WO2024065862A1 WO 2024065862 A1 WO2024065862 A1 WO 2024065862A1 CN 2022123911 W CN2022123911 W CN 2022123911W WO 2024065862 A1 WO2024065862 A1 WO 2024065862A1
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- WIPO (PCT)
- Prior art keywords
- assembly
- lifting rod
- handling device
- wafer handling
- cylinder
- Prior art date
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- 230000002093 peripheral effect Effects 0.000 claims abstract description 10
- 239000013618 particulate matter Substances 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 47
- 238000010586 diagram Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 238000012545 processing Methods 0.000 description 9
- 239000002245 particle Substances 0.000 description 8
- 239000012535 impurity Substances 0.000 description 7
- 238000012423 maintenance Methods 0.000 description 5
- 238000003466 welding Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 1
- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 1
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 1
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 1
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
Definitions
- the present application relates to the field of optoelectronic technology, and in particular to a wafer transport device.
- the wafer handling device provided in the embodiment of the present application can effectively prevent the influence of impurities generated by the processing machine on the wafer during the process, thereby improving the yield of the wafer.
- a wafer handling device including: a cylinder assembly and a cover assembly.
- the cylinder assembly includes a cylinder body and a lifting rod movably connected to the cylinder body in the longitudinal direction.
- the cover assembly is sleeved on the cylinder assembly and connected to the lifting rod. In the cylinder assembly operation mode, the cover assembly moves with the lifting rod and can at least cover the peripheral side of the connection between the lifting rod and the cylinder body.
- the cover assembly includes a top cover and a plurality of side walls connected to the top cover, and the top cover is connected to an end of the lifting rod facing away from the cylinder body.
- a load assembly is also provided to be connected to a lifting rod.
- At least one side wall includes a first opening, and a portion of the load device is fixedly connected to the lifting rod through the first opening.
- the side wall further includes a second opening, and the second opening and the first opening are respectively located on opposite side walls.
- the dimension of the side wall in the longitudinal direction is less than or equal to the dimension of the cylinder assembly in the longitudinal direction.
- the first opening is located on a side of the side wall close to the top cover.
- the cylinder assembly includes a guide rod, the cylinder body includes a guide hole, the guide rod is located in the guide hole, one end of the guide rod facing away from the cylinder body is at least partially connected to the other end of the lifting rod facing away from the cylinder body, and the extension direction of the guide rod is parallel to the extension direction of the lifting rod.
- the wafer handling device further includes a fixing assembly, which is located on a side of the cylinder assembly facing away from the cover assembly.
- the fixing component includes a first through hole, the first through hole penetrates the fixing component in a longitudinal direction, and the first through hole is arranged corresponding to the guide hole.
- the fixing assembly also includes a second through hole, the second through hole is extended along the first direction, the first through hole is connected to the second through hole, and the first direction intersects with the longitudinal direction.
- a cover assembly is sleeved on the cylinder assembly, and the cover assembly can always cover the connection between the lifting rod and the cylinder body in the cylinder assembly operation mode, thereby preventing particles generated by the friction between the lifting rod and the cylinder body from scattering onto the wafer operation platform, and can effectively restrict the scattering direction of the particles.
- the cover assembly moves with the lifting rod, thereby avoiding the need to open a large opening on the cover body for the lifting rod to connect and move with other components, thereby improving the space utilization of the cover assembly, miniaturizing the cover assembly, and further improving the reliability of the wafer handling device.
- FIG1 is a schematic structural diagram of an operation mode of a wafer handling device provided in an embodiment of the present application.
- FIG2 is a schematic structural diagram of another wafer handling device operation mode provided in an embodiment of the present application.
- FIG3 is a schematic structural diagram of a cover assembly in a wafer handling device provided in an embodiment of the present application from a viewing angle;
- FIG4 is a schematic structural diagram of another viewing angle of a cover assembly in a wafer handling device provided in an embodiment of the present application.
- FIG5 is a perspective structural diagram of a fixed component in a wafer handling device provided in an embodiment of the present application.
- FIG. 6 is a side view schematic diagram of the structure of another wafer handling device provided in an embodiment of the present application.
- fixing assembly 41. bearing portion; 42. limiting portion; 43. fixing portion; 44. first through hole; 45. second through hole;
- X longitudinal direction
- Y first direction
- Fig. 1 is a schematic diagram of a wafer handling device operating mode provided in an embodiment of the present application.
- Fig. 2 is a schematic diagram of another wafer handling device operating mode provided in an embodiment of the present application.
- the embodiment of the present application provides a wafer handling device 1 including: a cylinder assembly 10 and a cover assembly 20.
- the cylinder assembly 10 includes a cylinder body 11 and a lifting rod 12 movably connected to the cylinder body 11 along the longitudinal direction X.
- the cover assembly 20 is sleeved on the cylinder assembly 10 and connected to the lifting rod 12. In the operation mode of the cylinder assembly 10, the cover assembly 20 moves with the lifting rod 12 and can at least cover the peripheral side of the connection between the lifting rod 12 and the cylinder body 11.
- the wafer handling device 1 can be used in a wafer processing machine. By shielding the cylinder on the process machine, impurities generated by the friction between the lifting rod 12 and the cylinder body 11 in the operating mode are prevented from being scattered onto the wafer working platform.
- the cylinder assembly 10 is composed of a cylinder body 11 and a movable lifting rod 12, and the lifting rod 12 moves in the cylinder body 11 along the longitudinal X direction to drive other components to operate.
- the cylinder assembly 10 can be placed perpendicular to the horizontal plane in the wafer processing machine so that the lifting rod 12 moves vertically relative to the horizontal plane.
- the cylinder assembly 10 can also be placed parallel to the horizontal plane in the wafer processing machine so that the lifting rod 12 moves horizontally relative to the horizontal plane.
- the cylinder assembly 10 can also be placed at a certain angle to the horizontal plane in the wafer processing machine so that the lifting rod 12 moves in a predetermined direction.
- a plurality of lifting rods 12 can be set in the cylinder assembly 10.
- the cylinder assembly 10 is a single-acting cylinder, a double-acting cylinder or other cylinders. It should be noted that the cylinder assembly 10 in the drawings of the present application only shows a partial structure of the cylinder assembly 10.
- the cover assembly 20 is sleeved on the cylinder assembly 10 to cover the peripheral area of the connection between the lifting rod 12 and the cylinder body 11 in the cylinder assembly 10. As some optional embodiments, the cover assembly 20 covers the peripheral side of the cylinder assembly 10. As some other optional embodiments, the cover assembly 20 reserves a certain area on the peripheral side of the cylinder assembly 10, so that the particles generated by the wear of the lifting rod 12 can escape through the reserved area, and the impurities can be effectively collected to prevent the impurities from affecting the surrounding environment of the operation.
- the cover assembly 20 is connected to the lifting rod 12 and moves with the lifting rod 12.
- the cover assembly 20 can be fixedly connected to the lifting rod 12 by bolts, welding, bonding, etc.
- the cover assembly 20 moves with the lifting rod 12.
- the components driven by the cylinder assembly 10 can be fixedly connected to the lifting rod 12.
- An opening is provided on the cover assembly 20 to allow the components driven by the cylinder assembly 10 to penetrate into the space of the cover assembly 20.
- the components driven by the cylinder are fixedly connected to the lifting rod 12 and the cover assembly 20, thereby increasing the connection strength between the components driven by the cylinder assembly 10 and the cylinder assembly 10.
- the components driven by the cylinder assembly 10 can be fixedly connected to the cover assembly 20, thereby avoiding the need to provide an avoidance opening on the cover assembly 20.
- the lifting rod 12 has a predetermined moving distance in the operating mode.
- the dimension of the cover assembly 20 in the longitudinal direction X exceeds the connection between the lifting rod 12 and the cylinder body 11, thereby effectively shielding the area.
- the outer surface of the cover assembly 20 can be electrophoretically frosted and treated with pure black to avoid light reflection to meet the light-shielding requirements of the wafer exposure unit.
- a cover assembly 20 is sleeved on the cylinder assembly 10.
- the cover assembly 20 can always cover the connection between the lifting rod 12 and the cylinder body 11 in the operation mode of the cylinder assembly 10, thereby preventing particles generated by the friction between the lifting rod 12 and the cylinder body 11 from scattering onto the wafer operation platform, and can effectively restrict the scattering direction of the particles.
- the cover assembly 20 moves with the lifting rod 12, thereby avoiding the need to open a large opening on the cover for the lifting rod 12 to connect and move with other components, further improving the reliability of the wafer handling device 1.
- FIG. 3 is a schematic structural diagram of a cover assembly in a wafer handling device provided in an embodiment of the present application from a viewing angle.
- the cover assembly 20 includes a top cover 21 and a plurality of side walls 22 connected to the top cover 21 .
- the top cover 21 is connected to an end of the lifting rod 12 that faces away from the cylinder body 11 .
- the top cover 21 is enclosed by the plurality of side walls 22 to limit the particles generated in the cylinder assembly 10 from escaping from the upper side and the surrounding side of the cylinder assembly 10 .
- the plurality of side walls 22 may be enclosed to form a rectangular frame, a square frame, a circular frame or a frame of other shapes.
- the plurality of side walls 22 may be fixed by bolts, welding, bonding, etc.
- the top cover 21 and the plurality of side walls 22 and the top cover 21 and the lifting rod 12 may also be fixed by the above-mentioned fixing methods.
- the cover assembly 20 needs to move with the lifting rod 12, and the top cover 21 is a component that moves with it.
- the top cover 21 can be arranged in contact with the end of the lifting rod 12 that faces away from the cylinder body 11.
- the top cover 21 can also be arranged at a distance from the end of the lifting rod 12 that faces away from the cylinder body 11, so that space is reserved for clamping the components driven by the cylinder assembly 10.
- the side wall 22 is used to shield the peripheral side of the cylinder assembly 10, and there is a certain gap between the side wall 22 and the peripheral side of the cylinder assembly 10 to avoid friction between the side wall 22 and the cylinder assembly 10 during the movement of the cover assembly 20, thereby reducing the possibility of damage to the cylinder assembly 10 by the side wall 22.
- the gap between the side wall 22 and the cylinder assembly 10 is 0.1 mm to 2 cm.
- a loading device 30 is connected to the lifting rod 12 .
- the lifting rod 12 is provided with an end with a larger area, and the load assembly is fixedly connected to the end of the lifting rod 12.
- a through hole or a threaded hole is provided on the load assembly, so that one end of the lifting rod 12 extends into the through hole or the threaded hole, thereby reducing the assembly space.
- the loading device 30 is used to transport or carry the wafers.
- the loading device 30 is fixedly connected to the lifting rod 12 so that the loading device 30 can move with the lifting rod 12.
- At least one side wall 22 includes a first opening 221 , and a portion of the load device 30 is fixedly connected to the lifting rod 12 through the first opening 221 .
- the first opening 221 may be provided on one side wall 22 ; the first opening 221 may be provided on a plurality of side walls 22 , and the first openings 221 on the plurality of side walls 22 may be connected.
- part of the loading device 30 enters the inner space of the cover assembly 20 through the first opening 221 and is fixedly connected to the lifting rod 12. It can be understood that the maximum profile of the loading device 30 extending into the first opening 221 is similar to the profile of the first opening 221, thereby reducing the gap between the loading device 30 and the first opening 221, and further improving the reliability of the wafer handling device 1.
- FIG. 4 is a schematic structural diagram of another viewing angle of the cover assembly in the wafer handling device provided in an embodiment of the present application.
- the side wall 22 further includes a second opening 222 .
- the second opening 222 and the first opening 221 are respectively located on opposite side walls 22 .
- the shape of the second opening 222 includes polygons such as rectangle, circle, diamond, etc.
- a transparent plate that can be opened or closed may be provided on the second opening 222 , so as to prevent particles generated by wear of the cylinder assembly 10 from escaping from the second opening 222 .
- the second opening 222 on the side wall 22 can be used as an observation window for maintenance personnel; the second opening 222 on the side wall 22 can also be used as a maintenance window for maintenance personnel.
- the first opening 221 and the second opening 222 are arranged opposite to each other so that maintenance personnel will not interfere with the wafer work platform when inspecting or observing the operation of the cylinder assembly 10.
- the second opening 222 can be set at the moving position of the lifting rod 12 to observe whether particulate matter is generated at the connection between the lifting rod 12 and the cylinder body 11.
- the dimension of the side wall 22 along the longitudinal direction X is less than or equal to the dimension of the cylinder assembly 10 in the longitudinal direction X to avoid interference between the side wall 22 and surrounding components when the cylinder assembly 10 is not in operation mode.
- the first opening 221 is located on a side of the side wall 22 close to the top cover 21. It can be understood that the closer the first opening 221 is to the top cover 21, the smaller the distance between the load device 30 and the top cover 21, and the more convenient it is to fix the top cover 21, the end of the lifting rod 12 and the load device 30 together.
- FIG. 5 is a perspective structural diagram of a fixed component in a wafer handling device provided in an embodiment of the present application. (The cover component is not shown)
- the cylinder assembly 10 includes a guide rod 13, and the cylinder body 11 includes a guide hole 111.
- the guide rod 13 is located in the guide hole 111.
- the end of the guide rod 13 facing away from the cylinder body 11 is at least partially connected to the end of the lifting rod 12 facing away from the cylinder body 11, and the extension direction of the guide rod 13 is parallel to the extension direction of the lifting rod 12.
- the cylinder assembly 10 includes a lifting rod 12 and a guide rod 13, wherein a portion of the structure of the lifting rod 12 is located in the closed hole 112 in the cylinder body 1, and the movement of the lifting rod 12 is controlled by the flowing medium, thereby realizing the regulation of the external device.
- a portion of the structure of the guide rod 13 is located in the guide hole 111 of the cylinder body 11, which guides the movement of the lifting rod 12, and there is no need for the flowing medium to control the guide rod 13. It should be noted that the guide rod 13 will generate a certain degree of air pressure in the guide hole 111 during the movement.
- the guide hole 111 is a through hole structure, and the air pressure generated by the guide rod 13 during the movement of the guide hole 111 can be discharged into the external environment through the through hole.
- a one-way valve may be provided inside the guide hole 111 to prevent foreign matter from entering the cylinder body 11 through the guide hole 111.
- the end of the guide rod 13 away from the cylinder body 11 and the end of the lifting rod 12 away from the cylinder body 11 may be connected by a connector 14.
- the connector 14 and the end of the guide rod 13 away from the cylinder body 11 and the end of the lifting rod 12 away from the cylinder body 11 are an integral structure.
- the connecting portion 14 and the end of the guide rod 13 away from the cylinder body 11 and the end of the lifting rod 12 away from the cylinder body 11 are separate structures.
- FIG. 6 is a side view schematic diagram of the structure of another wafer handling device provided in an embodiment of the present application.
- the wafer transport device 1 further includes a fixing assembly 40 .
- the fixing assembly 40 is located on a side of the cylinder assembly 10 facing away from the cover assembly 20 .
- the fixing component 40 has a bearing portion 41 and a limiting portion 42.
- the bearing portion 41 of the fixing component 40 is used to bear the cylinder component 10
- the limiting portion 42 of the fixing component 40 is used to limit the installation area of the cylinder component 10 on the fixing component 40, thereby simplifying the installation process of the cylinder component 10.
- the fixing assembly 40 and the cylinder assembly 10 may be fixedly connected by bolts, welding, bonding, etc.
- a slot may be provided in the fixing assembly 40, and the cylinder assembly 10 may be snapped into the slot.
- the fixing assembly 40 further has a fixing portion 43 , and the fixing assembly 40 can be fixedly connected to the machine through the fixing portion 43 .
- the fixing component 40 can be fixedly connected to the working surface of the machine; the fixing component 40 can be fixedly connected to the side wall surface of the working surface of the machine; the fixing component 40 can be fixedly connected to the top surface opposite to the working surface of the machine.
- the fixing assembly 40 includes a first through hole 44 , which penetrates the fixing assembly 40 along the longitudinal direction X, and the first through hole 44 is disposed corresponding to the guide hole 111 .
- the first through hole 44 on the fixing assembly 40 is arranged corresponding to the guide hole 111 on the cylinder body 11, so that the gas pressure can be dissipated after passing through the fixing assembly 40, increasing the distance between the gas dissipation position and the cover body, thereby preventing the gas from blowing external impurities into the cover body assembly 20.
- the fixing assembly 40 further includes a second through hole 45 .
- the second through hole 45 is extended along a first direction Y.
- the first through hole 44 is connected to the second through hole 45 .
- the first direction Y intersects with the longitudinal direction X.
- the second through hole 45 can discharge the gas in the first through hole 44 from the fixing component 40, reducing the possibility of the gas in the first through hole 44 forming air pressure, and the second through hole 45 can change the direction of gas leakage in the cylinder body 11 so that the gas can flow in a predetermined direction, further improving the reliability of the wafer handling device 1.
- the second through hole 45 may be located on a side of the fixing assembly 40 facing away from the cylinder assembly 10 .
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Abstract
本申请涉及一种晶圆搬运装置包括：气缸组件和盖体组件。气缸组件包括缸体和沿纵向活动连接于缸体的升降杆。盖体组件套设在气缸组件，且连接于升降杆，在气缸组件作业模式下与升降杆随动且自始至少能够盖合至升降杆和缸体的连接部位周侧设置。本申请实施例能够有效约束颗粒物的散射方向，提高盖体组件的空间利用率，使盖体组件小型化，进一步提高晶圆搬运装置的可靠性。
Description
相关申请的交叉引用
本申请要求享有于2022年09月27日提交的名称为“晶圆搬运装置”的中国专利申请202222571413.8的优先权，该申请的全部内容通过引用并入本文中。
本申请涉及光电技术领域，尤其涉及一种晶圆搬运装置。
随着光电技术的快速发展，晶圆的需求也变得越来越多。在晶圆的多项制作过程中，均需要避免外界杂质附着到晶圆中。
然而，在一些制程中的加工机器自身内部部件在经过长时间的作业后发生一定程度的磨损，这些加工机器在一定的磨损程度内仍是作为符合标准内的机器使用，但是这些加工机器在作业过程中会产生颗粒物这类细微杂质，导致晶圆受到污染，进而造成晶圆的良率下降
实用新型内容
本申请实施例提供的晶圆搬运装置，能够有效避免晶圆在制程过程中加工机器产生的杂质对晶圆的影响，从而提高晶圆的良率。
一方面，根据本申请实施例提出了一种晶圆搬运装置包括：气缸组件和盖体组件。气缸组件包括缸体和沿纵向活动连接于缸体的升降杆。盖体组件套设在气缸组件，且连接于升降杆，在气缸组件作业模式下与升降杆随动且自始至少能够盖合至升降杆和缸体的连接部位周侧设置。
根据本申请实施例的一个方面，盖体组件包括顶盖和连接于顶盖的多个侧壁，顶盖与升降杆的背向缸体的一端连接设置。
根据本申请实施例的一个方面，还包括负载组件与升降杆连接设置。
根据本申请实施例的一个方面，至少一个侧壁上包括设置有第一开口，部分负载装置通过第一开口与升降杆固定连接。
根据本申请实施例的一个方面，侧壁还包括第二开口，第二开口与第一开口分别位于相对的侧壁。
根据本申请实施例的一个方面，侧壁沿纵向的尺寸小于等于气缸组件在纵向上的尺寸。
根据本申请实施例的一个方面，第一开口位于侧壁靠近顶盖的一侧。
根据本申请实施例的一个方面，气缸组件包括导向杆，缸体包括导向孔，导向杆位于导向孔内，导向杆背向缸体的一端与升降杆背向缸体的一端至少部分连接设置，导向杆的延伸方向平行于升降杆的延伸方向。
根据本申请实施例的一个方面，晶圆搬运装置还包括固定组件，固定组件位于气缸组件背向盖体组件的一侧。
根据本申请实施例的一个方面，固定组件包括第一通孔，第一通孔沿纵向方向贯穿固定组件，第一通孔与导向孔对应设置。
根据本申请实施例的一个方面，固定组件还包括第二通孔，第二通孔沿第一方向延伸设置，第一通孔连通第二通孔，第一方向与纵向方向相交。
根据本申请提供的一种晶圆搬运装置，在气缸组件上套设盖体组件，盖体组件在气缸组件作业模式下始终能够盖合升降杆与缸体连接部，从而避免升降杆与缸体摩擦产生的颗粒物散落至晶圆作业平台上，能够有效约束颗粒物的散射方向。并且盖体组件跟随升降杆移动，从而避免在盖体上开设较大的用于升降杆与其他部件连接移动的开口，提高盖体组件的空间利用率，使盖体组件小型化，进一步提高晶圆搬运装置的可靠性。
下面将参考附图来描述本申请示例性实施例的特征、优点和技术效果。
图1是本申请实施例提供的一种晶圆搬运装置作业模式的结构示意图；
图2是本申请实施例提供的另一种晶圆搬运装置作业模式的结构示意图；
图3是本申请实施例提供的晶圆搬运装置中盖体组件的一种视角结构示意图；
图4是本申请实施例提供的晶圆搬运装置中盖体组件的又一种视角结构示意图；
图5是本申请实施例提供的晶圆搬运装置中固定组件的一种视角结构示意图；
图6是本申请实施例提供的又一种晶圆搬运装置的侧视结构示意图。
标记说明：
1、晶圆搬运装置；
10、气缸组件；11、缸体；111、导向孔；112、密闭孔；12、升降杆；13、导向杆；14、连接件；
20、盖体组件；21、顶盖；22、侧壁；221、第一开口；222、第二开口；
30、负载装置；
40、固定组件；41、承载部；42、限位部；43、固定部；44、第一通孔；45、第二通孔；
X、纵向；Y、第一方向。
在附图中，相同的部件使用相同的附图标记。附图并未按照实际的比例绘制。
下面将详细描述本申请的各个方面的特征和示例性实施例，为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及具体实施例，对本申请进行进一步详细描述。应理解，此处所描述的具体实施例仅意在解释本申请，而不是限定本申请。对于本领域技术人员来说，本申请可以在不需要这些具体细节中的一些细节的情况下实施。下面对实施例的描述仅仅是为了通过示出本申请的示例来提供对本申请更好的理解。
需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。
为了更好地理解本申请，第一方面，下面结合图1至图6根据本申请实施例进行详细描述。
图1是本申请实施例提供的一种晶圆搬运装置作业模式的结构示意图。图2是本申请实施例提供的另一种晶圆搬运装置作业模式的结构示意图。
如图1和图2所示，本申请实施例提供了一种晶圆搬运装置1包括：气缸组件10和盖体组件20。气缸组件10包括缸体11和沿纵向X活动连接于缸体11的升降杆12。盖体组件20套设在气缸组件10，且连接于升降杆12，在气缸组件10作业模式下与升降杆12随动且自始至少能够盖合至升降杆12和缸体11的连接部位周侧设置。
本申请一些可选的实施例中，晶圆搬运装置1可以应用在晶圆的制程机台中，通过对制程机台上的气缸进行遮挡，从而避免升降杆12在作业模式下与缸体11摩擦产生的杂质散射至晶圆的作业平台上。
气缸组件10由缸体11和可移动的升降杆12组成，升降杆12在缸体11中沿纵向X方向移动，以驱动其他部件进行作业。可选的，气缸组件10可以在晶圆的制程机器中垂直于水平面放置，以使升降杆12相对于水平面进行垂直移动。气缸组件10还可以在晶圆的制程机器中平行于水平面放置，以使升降杆12相对于水平面进行水平移动。气缸组件10还可以在晶圆的制程机器中与水平面呈一定夹角放置，以使升降杆12沿预定方向移动。为了提高气缸组件10的驱动力，可以在气缸组件10中设置多个升降杆12。
本申请实施例不限制气缸组件10的类型，示例性的，气缸组件10为单作用气缸、双作用气缸或其他气缸。需要说明的是，本申请附图中的气缸组件10仅展示了气缸组件10的部分结构。
盖体组件20套设在气缸组件10上，用于遮挡气缸组件10中升降杆12与缸体11的连接部的周侧区域。作为一些可选的实施例，盖体组件20将气缸组件10的周侧均覆盖。作为另一些可选的实施例，盖体组件20在气缸组件10的周侧预留出一定区域，使升降杆12磨损产生的颗粒物能够通过预留区域逸出，并且能够对杂质进行有效收集，避免杂质对作业周边环境产生影响。
盖体组件20与升降杆12连接并且跟随升降杆12进行移动，可选的，盖体组件20可以通过螺栓、焊接、粘合等方式与升降杆12进行固定连接。
盖体组件20与升降杆12进行跟随移动，在一些可选的示例中，气缸组件10所驱动的部件可以与升降杆12进行固定连接，在盖体组件20上开设能够将气缸组件10所驱动的部件深入至盖体组件20空间的开口，将气缸所驱动的部件与升降杆12和盖体组件20一并固定连接，增加气缸组件10所驱动部件与气缸组件10的连接强度。在另一些的可选的示例中，气缸组件10所驱动的部件可以与盖体组件20进行固定连接，从而避免在盖体组件20上设置避让开口。
可以理解的是，升降杆12在作业模式下具有预定的移动距离，升降杆12在上升至最大行程时，盖体组件20在纵向X上的尺寸沿超过升降杆12与缸体11连接处，从而对该区域进行有效遮挡。
作为一些可选实施例，晶圆搬运装置1运用在晶圆曝光制程的机台中时，盖体组件20的外表面上可以采用电泳磨砂工艺以及进行纯黑处理，从而避免光线反射，以适应晶圆曝光单元的避光需求。
根据本申请提供的一种晶圆搬运装置1，在气缸组件10上套设盖体组件20，盖体组件20在气缸组件10作业模式下始终能够盖合升降杆12与缸体11连接部，从而避免升降杆12与缸体11摩擦产生的颗粒物散落至晶圆作业平台上，能够有效约束颗粒物的散射方向。并且盖体组件20跟随升降杆12移动，从而避免在盖体上开设较大的用于升降杆12与其他部件 连接移动的开口，进一步提高晶圆搬运装置1的可靠性。
图3是本申请实施例提供的晶圆搬运装置中盖体组件的一种视角结构示意图。
如图1至图3所示，盖体组件20包括顶盖21和连接于顶盖21的多个侧壁22，顶盖21与升降杆12的背向缸体11的一端连接设置。
本申请一些可选的实施例中，顶盖21与多个侧壁22围合从而限制气缸组件10中产生的颗粒物由气缸组件10的上侧以及周侧散逸。
作为一些可选实施例，多个侧壁22可以围合形成矩形框体、正方形框体、圆形框体或其他形状的框体。多个侧壁22可以通过螺栓、焊接、粘接等方式固定，同样的，顶盖21与多个侧壁22之间以及顶盖21与升降杆12之间也可采用上述固定方式。
可选的，盖体组件20需要跟随升降杆12移动，顶盖21作为跟随移动的部件，顶盖21与升降杆12背向缸体11的一端之间可以抵接设置。顶盖21与升降杆12背向缸体11的一端之间也可以间隔设置，预留出空间来夹放气缸组件10所驱动的部件。
需要说明的是，侧壁22用于对气缸组件10的周侧进行遮挡，侧壁22与气缸组件10的周侧之间具有一定的空隙，以避免盖体组件20在移动过程中，侧壁22与气缸组件10产生摩擦，降低侧壁22对气缸组件10造成损坏的可能性。可选的，侧壁22与气缸组件10之间的空隙为0.1mm～2cm。
如图1所示，还包括负载装置30与升降杆12连接设置。
作为一些可选实施例，升降杆12上设置较大面积的端部，负载组件与升降杆12的端部进行固定连接。作为另一些可选实施例，在负载组件上设置通孔或螺纹孔，使升降杆12的一端伸入通孔或螺纹孔内，从而减小装配空间。
本申请一些可选的实施例中，负载装置30用于对晶圆进行搬运或者承载晶圆。将负载装置30与升降杆12进行固定连接，以使负载装置30能够跟随升降杆12进行移动。
如图1至图3所示，至少一个侧壁22上包括设置有第一开口221，部 分负载装置30通过第一开口221与升降杆12固定连接。
可选的，第一开口221可以设置在一个侧壁22上；第一开口221可以设置在多个侧壁22上，并且可以将多个侧壁22上的第一开口221进行连通。
本申请一些可选的实施例中，部分负载装置30通过第一开口221进入至盖体组件20的内部空间内与升降杆12进行固定连接。可以理解的是，负载装置30伸入第一开口221的最大轮廓与第一开口221的轮廓相仿，从而减小负载装置30与第一开口221之间的空隙，进一步提高晶圆搬运装置1的可靠性。
图4是本申请实施例提供的晶圆搬运装置中盖体组件的又一种视角结构示意图。
如图1、图2以及图4，侧壁22还包括第二开口222，第二开口222与第一开口221分别位于相对的侧壁22。
作为一些可选实施例，第二开口222的形状包括矩形、圆形、菱形等多边形。
需要说明的是，在第二开口222上可以设置可以开启或关闭的透明板材，从而避免气缸组件10磨损产生的颗粒物从第二开口222逸出。
本申请一些可选的实施例中，侧壁22上的第二开口222可以用于维修人员的观察窗口；侧壁22上的第二开口222也可以用于维修人员的维修窗口。将第一开口221和第二开口222相对设置，使维修人员在检修或者观察气缸组件10运行情况时，不会对晶圆的作业平台进行干扰。
在一些可选的实施例中，第二开口222为了便于维修人员作业，可以将第二开口222设置在升降杆12移动位置，以便观察升降杆12与缸体11连接部是否产生颗粒物。
如图1和图2所示，侧壁22沿纵向X的尺寸小于等于气缸组件10在纵向X上的尺寸，以避免在气缸组件10未作业模式下侧壁22与周围部件发生干涉。
可以理解的是，侧壁22沿纵向X的尺寸在不超过气缸组件10在纵向X上的尺寸的前提下，侧壁22沿纵向X上的尺寸越大，气缸组件10产生 的颗粒物从气缸组件10周侧散逸的可能性越小。
如图1和图2所示，第一开口221位于侧壁22靠近顶盖21的一侧。可以理解的是，第一开口221越靠近顶盖21，负载装置30与顶盖21之间的间距越小，越有便于顶盖21与升降杆12的端部以及负载装置30三者之间的固定连接。
图5是本申请实施例提供的晶圆搬运装置中固定组件的一种视角结构示意图。(未示出盖体组件)
如图1和图5所示，气缸组件10包括导向杆13，缸体11包括导向孔111，导向杆13位于导向孔111内，导向杆13背向缸体11的一端与升降杆12背向缸体11的一端至少部分连接设置，导向杆13的延伸方向平行于升降杆12的延伸方向。
在一些可选的实施例中，气缸组件10包括升降杆12与导向杆13，其中升降杆12的部分结构位于缸体1内的密闭孔112中，由流动介质来控制升降杆12的动作，从而实现对外部器件的调控。导向杆13的部分结构位于缸体11的导向孔111中，对升降杆12的动作起到导向作用，无需流动介质来对导向杆13进行控制。需要说明的是，导向杆13在移动过程中会在导向孔111内产生一定程度的气压，由于导向杆13与升降杆12是连接设置且升降杆12的移动会带动导向杆13的移动，导向孔111内的气压会阻碍升降杆12的移动，降低升降杆12的工作效率，由此，期望导向孔111为通孔结构，导向杆13在导向孔111内移动过程中产生的气压可以由通孔排入外部环境中。
作为一些可选实施例，导向孔111内部可以设置单向阀，从而避免外界的杂质通过导向孔111进入至缸体11内。在一些可选的实施例中，导向杆13背离缸体11的一端与升降杆12背离缸体11的一端可以通过连接件14连接。可选的，连接件14与导向杆13背离缸体11的一端和升降杆12背离缸体11的一端为一体结构。连接部14与导向杆13背离缸体11的一端和升降杆12背离缸体11的一端为分体结构。
图6是本申请实施例提供的又一种晶圆搬运装置的侧视结构示意图。
如图1、图2、图5以及图6所示，晶圆搬运装置1还包括固定组件40，固定组件40位于气缸组件10背向盖体组件20的一侧。
本申请一些可选的实施例中，固定组件40具有承载部41和限位部42，固定组件40的承载部41用于承载气缸组件10，固定组件40的限位部42用于限制气缸组件10在固定组件40上的安装区域，简化气缸组件10的安装流程。
作为一些可选实施例，固定组件40与气缸组件10之间可以通过螺栓、焊接、粘接等方式固定连接。作为另一些可选实施例，固定组件40中可以设置卡槽，将气缸组件10卡接至卡槽内。
需要说明的是，晶圆搬运装置1运用在晶圆的制程机台上时，固定组件40还具有固定部43，固定组件40可以通过固定部43与机台进行固定连接。
可选的，固定组件40可以与机台的工作台面上进行固定连接；固定组件40可以与机台的工作台面的侧壁面进行固定连接；固定组件40可以与机台的工作台面相对的顶面进行固定连接。
在本实施例中，通过将固定组件40设置在气缸组件10背向盖体组件20的一侧，使气缸组件10周侧具有足够的空间用于盖体组件20在纵向X方向上的移动，减小盖体组件20在纵向方向X移动的过程中与固定组件40之间发生干涉的可能性。
如图1、图5以及图6所示，固定组件40包括第一通孔44，第一通孔44沿纵向X方向贯穿固定组件40，第一通孔44与导向孔111对应设置。
固定组件40上的第一通孔44与缸体11上的导向孔111对应设置，可以使气压通过固定组件40后再进行散逸，增加气体逸散位置与盖体之间距离，从而避免气体将外界杂质吹至盖体组件20内。
如图6所示，固定组件40还包括第二通孔45，第二通孔45沿第一方向Y延伸设置，第一通孔44连通第二通孔45，第一方向Y与纵向X方向相交。
本申请一些可选的实施例中，第二通孔45可以将第一通孔44中的气体从固定组件40中导出，减小第一通孔44中的气体形成气压的可能性，并且第二通孔45可以将缸体11内气体泄出的方向进行改变，以使气体能够按照预定的方向进行流动，进一步提高晶圆搬运装置1的可靠性。
可选的，第二通孔45可以位于固定组件40背向气缸组件10的一侧。
虽然已经参考优选实施例对本申请进行了描述，但在不脱离本申请的范围的情况下，可以对其进行各种改进并且可以用等效物替换其中的部件。尤其是，只要不存在结构冲突，各个实施例中所提到的各项技术特征均可以任意方式组合起来。本申请并不局限于文中公开的特定实施例，而是包括落入权利要求的范围内的所有技术方案。
Claims (11)
- 一种晶圆搬运装置，其中，包括：气缸组件，包括缸体和沿纵向活动连接于所述缸体的升降杆；盖体组件，套设在所述气缸组件，且连接于所述升降杆，在所述气缸组件作业模式下与所述升降杆随动且自始至少能够盖合至所述升降杆和所述缸体的连接部位周侧设置。
- 根据权利要求1所述的晶圆搬运装置，其中，所述盖体组件包括顶盖和连接于所述顶盖的多个侧壁，所述顶盖与所述升降杆的背向所述缸体的一端连接设置。
- 根据权利要求2所述的晶圆搬运装置，其中，还包括负载组件与所述升降杆连接设置。
- 根据权利要求2所述的晶圆搬运装置，其中，至少一个所述侧壁上包括设置有第一开口，部分所述负载装置通过所述第一开口与所述升降杆固定连接。
- 根据权利要求4所述的晶圆搬运装置，其中，所述侧壁还包括第二开口，所述第二开口与所述第一开口分别位于相对的所述侧壁。
- 根据权利要求2所述的晶圆搬运装置，其中，所述侧壁沿所述纵向的尺寸小于等于所述气缸组件在所述纵向上的尺寸。
- 根据权利要求2所述的晶圆搬运装置，其中，所述第一开口位于所述侧壁靠近所述顶盖的一侧。
- 根据权利要求1所述的晶圆搬运装置，其中，所述气缸组件包括导向杆，所述缸体包括导向孔，所述导向杆位于所述导向孔内，所述导向杆背向所述缸体的一端与所述升降杆背向所述缸体的一端至少部分连接设 置，所述导向杆的延伸方向平行于所述升降杆的延伸方向。
- 根据权利要求8所述的晶圆搬运装置，其中，所述晶圆搬运装置还包括固定组件，所述固定组件位于所述气缸组件背向所述盖体组件的一侧。
- 根据权利要求9所述的晶圆搬运装置，其中，所述固定组件包括第一通孔，所述第一通孔沿纵向方向贯穿所述固定组件，所述第一通孔与所述导向孔对应设置。
- 根据权利要求10所述的晶圆搬运装置，其中，所述固定组件还包括第二通孔，所述第二通孔沿第一方向延伸设置，所述第一通孔连通所述第二通孔，所述第一方向与所述纵向方向相交。
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|---|---|---|---|---|
| JPH09148240A (ja) * | 1995-11-24 | 1997-06-06 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| JP2000150445A (ja) * | 1998-11-11 | 2000-05-30 | Tokyo Electron Ltd | 処理装置 |
| KR20060108317A (ko) * | 2005-04-12 | 2006-10-17 | 삼성전자주식회사 | 오염방지 커버가 부착된 에어 실린더를 구비한 반도체 장비 |
| JP2007073746A (ja) * | 2005-09-07 | 2007-03-22 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| CN216043270U (zh) * | 2021-05-14 | 2022-03-15 | 长江存储科技有限责任公司 | 开门机构及半导体处理设备 |
-
2022
- 2022-09-27 CN CN202222571413.8U patent/CN218274550U/zh active Active
- 2022-10-08 WO PCT/CN2022/123911 patent/WO2024065862A1/zh unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09148240A (ja) * | 1995-11-24 | 1997-06-06 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| JP2000150445A (ja) * | 1998-11-11 | 2000-05-30 | Tokyo Electron Ltd | 処理装置 |
| KR20060108317A (ko) * | 2005-04-12 | 2006-10-17 | 삼성전자주식회사 | 오염방지 커버가 부착된 에어 실린더를 구비한 반도체 장비 |
| JP2007073746A (ja) * | 2005-09-07 | 2007-03-22 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| CN216043270U (zh) * | 2021-05-14 | 2022-03-15 | 长江存储科技有限责任公司 | 开门机构及半导体处理设备 |
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| Publication number | Publication date |
|---|---|
| CN218274550U (zh) | 2023-01-10 |
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