LU502193B1 - Heat-dissipation structure for electronic product - Google Patents

Heat-dissipation structure for electronic product Download PDF

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Publication number
LU502193B1
LU502193B1 LU502193A LU502193A LU502193B1 LU 502193 B1 LU502193 B1 LU 502193B1 LU 502193 A LU502193 A LU 502193A LU 502193 A LU502193 A LU 502193A LU 502193 B1 LU502193 B1 LU 502193B1
Authority
LU
Luxembourg
Prior art keywords
heat
noise
dissipation
reduction
air
Prior art date
Application number
LU502193A
Other languages
German (de)
Inventor
Juan Kong
Original Assignee
Suzhou Ruilingke Information Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Ruilingke Information Tech Co Ltd filed Critical Suzhou Ruilingke Information Tech Co Ltd
Application granted granted Critical
Publication of LU502193B1 publication Critical patent/LU502193B1/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20181Filters; Louvers

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The heat-dissipation structure comprises a main housing, wherein a heat-dissipation opening is formed in a sidewall of the main housing, a fan mounting frame is fixedly provided in the heat- dissipation opening, a heat-dissipation fan is detachably arranged in the fan mounting frame, and a wind direction of the heat-dissipation fan is towards an inside of the main housing; a dust cover is fixed on an outer side of the heat-dissipation opening through screws, an air volume adjusting mechanism is provided at an air inlet of the dust cover, and a dust shield is detachably arranged in the dust cover; a noise-reduction cover is fixed on an inner side of the heat-dissipation opening through screws and comprises a noise-reduction cavity for air circulation, and an air outlet of the noise-reduction cover is provided with an outlet air noise-reduction structure.

Description

DESCRIPTION 0502193 HEAT-DISSIPATION STRUCTURE FOR ELECTRONIC PRODUCT
TECHNICAL FIELD The present invention relates to the technical field of electronic products, and particularly to a heat-dissipation structure for an electronic product.
BACKGROUND Along with the rapid development of industry, the operation speed of an electronic device is continuously increased and a large amount of heat is generated during operation, which results in the increase in the temperature of the electronic device and the system and thereby affects the stability of the device. In order to ensure the normal operation of the device, generally heat- dissipation holes are arranged in a housing of the device and a heat-dissipation fan is installed in the housing, so as to dissipate heat in a host. However, when the device is in operation, it is easy for the dust from the outside to enter into the device through the heat-dissipation holes, and thus effectively compatibility of heat-dissipation and dust removal is impossible for the device; accumulation of excessive dust not only affects the heat-dissipation, but also increases the internal workload of the device and affects the normal use and service life of the device. Therefore, what is provided herein is a heat-dissipation structure for an electronic product, which can realize the heat dissipation function and reduce the entering of dust as well.
SUMMARY The present invention mainly solves the technical problem of providing a heat-dissipation structure for an electronic product which can realize the heat dissipation function and reduce the entering of dust as well. In order to solve the above technical problem, the following technical scheme is adopted by the present invention: The present invention comprises a main housing, wherein a heat-dissipation opening is formed in a sidewall of the main housing, a fan mounting frame is fixedly provided in the heat-dissipation
. 2 . . . . LU502193 opening, a heat-dissipation fan is detachably arranged in the fan mounting frame, and a wind direction of the heat-dissipation fan is towards an inside of the main housing; a dust cover is fixed on an outer side of the heat-dissipation opening through screws, an air volume adjusting mechanism is provided at an air inlet of the dust cover, and a dust shield is detachably arranged in the dust cover; a noise-reduction cover is fixed on an inner side of the heat-dissipation opening through screws and comprises a noise-reduction cavity for air circulation, and an air outlet of the noise-reduction cover is provided with an outlet air noise-reduction structure.
Further, the air volume adjusting mechanism comprises a mounting frame, a plurality of air guide plates rotatably arranged along a height direction of the mounting frame at equal intervals, and an adjusting rod, and the plurality of air guide plates are rotatably adjusted through the adjusting rod.
Further, a rectangular recess is formed in one side of each of the air guide plates away from the heat-dissipation fan, and two sides of the adjusting rod are rotatably connected to two sides of the rectangular recess, respectively, through a rotating shaft.
Further, the outlet air noise-reduction structure comprises a connecting frame and a plurality of noise-reduction plates fixedly and obliquely arranged along a height direction of the connecting frame at equal intervals, and a plurality of noise-reduction holes are formed in arrays on each of the noise-reduction plates.
Further, a top of the dust cover is provided with an insertion groove for inserting of the dust shield, a top of the dust shield is provided with a mounting plate, and a fitting groove matching with the mounting plate is formed on the top of the dust cover.
Further, a top of the mounting plate is provided with a handle.
Further, the dust cover is an aluminum profile housing.
Beneficial effects of the present invention: When the heat-dissipation fan is in operation, air enters from the air inlet of the dust cover arranged, and since the air volume adjusting mechanism is provided at the air inlet, the volume
. . . Co . . . . . LU502193 of inlet air can be adjusted by adjusting the angle of the air guide plates; besides, the air guide plates can preliminarily adsorb and isolate some large particles or impurities, so that the impurities are prevented from influencing the filtering effect of the subsequent dust shield; air 1s exhausted from the air outlet of the noise-reduction cover arranged, and then passes through the outlet air noise-reduction structure; the obliquely arranged noise-reduction plates enable effective guiding and buffering of air, and the noise-reduction holes arranged in arrays on the noise-reduction plates can improve the uniformity of outlet air, and thereby the noise generated by air flow is reduced; therefore, the present invention can be very effective in preventing dust and reducing noise, and it is very easy to maintain and clean the dust cover and the noise-reduction cover since both of them are fixed by screws; furthermore, the dust shield inside the dust cover 1s detachable and can be easily taken out by the handle at the top of the dust shield, which enables periodical cleaning of the dust shield and thereby effectively improves the stability of the electronic device during operation. The above description 1s only an outline of the technical scheme of the present invention, and in order to allow the technical means of the present invention to be more clearly understood and to be implemented in accordance with the content of the specification, the following detailed description will be provided with reference to a preferred embodiment of the present invention in conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram of the overall structure according to the present invention; FIG. 2 is a schematic diagram of a position of a heat-dissipation fan according to the present invention; FIG. 3 is a schematic diagram of the overall structure according to the present invention (main housing being sectioned); FIG. 4 is a schematic diagram of the overall structure of a dust cover according to the present invention;
FIG. 5 is a schematic diagram of the overall structure of the dust cover according to the presentLU502193 invention (a dust shield excluded); FIG. 6 is a schematic diagram of the overall structure of the noise-reduction cover according to the present invention; and FIG. 7 is a schematic diagram of the overall structure of the noise-reduction cover according to the present invention (another view). The reference numerals of the components in the drawings are as follows: 1 main housing, 11 heat-dissipation opening, 12 fan mounting frame, 13 heat-dissipation fan, 2 dust cover, 22 air volume adjusting mechanism, 221 mounting frame, 222 air guide plate, 223 adjusting rod, 224 rectangular recess, 225 rotating shaft, 23 dust shield, 231 mounting plate, 232 handle, 24 insertion groove, 25 fitting groove, 3 noise-reduction cover, 31 noise-reduction cavity, 32 outlet air noise-reduction structure, 321 connecting frame, 322 noise-reduction plate, and 323 noise-reduction hole.
DETAILED DESCRIPTION A preferred embodiment of the present invention will be described in detail below with reference to the drawings, so that the advantages and features of the present invention can be easily understood by those skilled in the art, and thus the protection scope of the present invention is more clearly and explicitly defined. Embodiment: Provided is a heat-dissipation structure for an electronic product, as shown in FIGs. 1-7, which comprises a main housing 1, wherein a heat-dissipation opening 11 is formed in a sidewall of the main housing, a fan mounting frame 12 is fixedly provided in the heat-dissipation opening, a heat-dissipation fan 13 is detachably arranged in the fan mounting frame, a wind direction of the heat-dissipation fan is towards an inside of the main housing, and the main housing is a housing of the electronic product. A dust cover 2 is fixed on an outer side of the heat-dissipation opening through screws, an air volume adjusting mechanism 22 is provided at an air inlet of the dust cover, and a dust shield 23 is detachably arranged in the dust cover.
A noise-reduction cover 3 is fixed on an inner side of the heat-dissipation opening through LUs02193 screws and comprises a noise-reduction cavity 31 for air circulation, and an air outlet of the noise-reduction cover is provided with an outlet air noise-reduction structure 32. The outer side and the inner side of the heat-dissipation opening are defined with reference to the inner side and the outer side of the main housing, and the air outlet and the air inlet are set according to the air flowing direction.
The air volume adjusting mechanism comprises a mounting frame 221, a plurality of air guide plates 222 rotatably arranged along a height direction of the mounting frame at equal intervals, and an adjusting rod 223, and the plurality of air guide plates are rotatably adjusted through the adjusting rod.
A rectangular recess 224 is formed in one side of each of the air guide plates away from the heat- dissipation fan, and two sides of the adjusting rod are rotatably connected to two sides of the rectangular recess, respectively, through a rotating shaft 225. When the heat-dissipation fan is in operation, air enters from the air inlet of the dust cover, and since the air volume adjusting mechanism is provided at the air inlet, the volume of inlet air can be adjusted by adjusting the angle of the air guide plates; besides, the air guide plates can preliminarily adsorb and isolate some large particles or impurities, so that the impurities are prevented from influencing the filtering effect of the subsequent dust shield.
Further, the outlet air noise-reduction structure comprises a connecting frame 321 and a plurality of noise-reduction plates 322 fixedly and obliquely arranged along a height direction of the connecting frame at equal intervals, and a plurality of noise-reduction holes 323 are formed in arrays on each of the noise-reduction plates.
The obliquely arranged noise-reduction plates enable effective guiding and buffering of air, and the noise-reduction holes arranged in arrays on the noise-reduction plates can improve the uniformity of outlet air, and thereby the noise generated by air flow is reduced.
A top of the dust cover is provided with an insertion groove 24 for inserting of the dust shield, a top of the dust shield is provided with a mounting plate 231, a fitting groove 25 matching with the mounting plate is formed on the top of the dust cover, and a top of the mounting plate is provided with a handle 232. By using the above structure, the dust shield is detachable and LUs02193 thereby can be cleaned periodically.
The dust cover is an aluminum profile housing.
Further, the housing is provided with a plurality of heat-dissipation regions (not shown in the drawing; the heat-dissipation regions are formed by heat-dissipation holes), which is favorable for air circulation and thereby facilitates heat dissipation.
In the description of the present invention, it should be noted that directions or positional relationships indicated by terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like are those described based on the embodiments and shown based on the drawings, or those that the product in the present invention is usually placed in when it is used.
These indicated directions or positional relationships are merely intended to facilitate and simplify description rather than indicate or imply that the indicated device or element must have a specific direction and must be configured and operated according to the specific direction.
Therefore, these directions or positional relationships should not be construed as limiting the present invention.
The working principle of the present invention is as follows: When the heat-dissipation fan is in operation, air enters from the air inlet of the dust cover arranged, and since the air volume adjusting mechanism is provided at the air inlet, the volume of inlet air can be adjusted by adjusting the angle of the air guide plates; besides, the air guide plates can preliminarily adsorb and isolate some large particles or impurities, so that the impurities are prevented from influencing the filtering effect of the subsequent dust shield; air is exhausted from the air outlet of the noise-reduction cover arranged, and then passes through the outlet air noise-reduction structure; the obliquely arranged noise-reduction plates enable effective guiding and buffering of air, and the noise-reduction holes arranged in arrays on the noise-reduction plates can improve the uniformity of outlet air, and thereby the noise generated by air flow is reduced; therefore, the present invention can be very effective in preventing dust and reducing noise, and it is very easy to maintain and clean the dust cover and the noise-reduction cover since both of them are fixed by screws; furthermore, the dust shield inside the dust cover is detachable and can 2021 93 be easily taken out by the handle at the top of the dust shield, which enables periodical cleaning of the dust shield and thereby effectively improves the stability of the electronic device during operation.
The above description is only the embodiment of the present invention, and is not intended to limit the patent scope of the present invention.
Equivalent structural alterations that utilize the content of the specification and the accompanying drawings of the present invention, or the cases where the content of the specification and the accompanying drawings is directly or indirectly applied in other related relevant technical fields, shall all fall within the patent protection scope of the present invention.

Claims (7)

CLAIMS LU502193
1. À heat-dissipation structure for an electronic product, comprising a main housing (1), wherein a heat-dissipation opening (11) is formed in a sidewall of the main housing, a fan mounting frame (12) is fixedly provided in the heat-dissipation opening, a heat-dissipation fan (13) is detachably arranged in the fan mounting frame, and a wind direction of the heat-dissipation fan 1s towards an inside of the main housing, a dust cover (2) is fixed on an outer side of the heat-dissipation opening through screws, an air volume adjusting mechanism (22) is provided at an air inlet of the dust cover, and a dust shield (23) is detachably arranged in the dust cover; a noise-reduction cover (3) is fixed on an inner side of the heat-dissipation opening through screws and comprises a noise-reduction cavity (31) for air circulation, and an air outlet of the noise-reduction cover is provided with an outlet air noise-reduction structure (32).
2. The heat-dissipation structure for an electronic product according to claim 1, wherein the air volume adjusting mechanism comprises a mounting frame (221), a plurality of air guide plates (222) rotatably arranged along a height direction of the mounting frame at equal intervals, and an adjusting rod (223), and the plurality of air guide plates are rotatably adjusted through the adjusting rod.
3. The heat-dissipation structure for an electronic product according to claim 2, wherein a rectangular recess (224) is formed in one side of each of the air guide plates away from the heat- dissipation fan, and two sides of the adjusting rod are rotatably connected to two sides of the rectangular recess, respectively, through a rotating shaft (225).
4. The heat-dissipation structure for an electronic product according to claim 1, wherein the outlet air noise-reduction structure comprises a connecting frame (321) and a plurality of noise- reduction plates (322) fixedly and obliquely arranged along a height direction of the connecting frame at equal intervals, and a plurality of noise-reduction holes (323) are formed in arrays on each of the noise-reduction plates.
5. The heat-dissipation structure for an electronic product according to claim 1, wherein a top of the dust cover is provided with an insertion groove (24) for inserting of the dust shield, a top of
. . . . . . . .,, LU502193 the dust shield is provided with a mounting plate (231), and a fitting groove (25) matching with the mounting plate is formed on the top of the dust cover.
6. The heat-dissipation structure for an electronic product according to claim 5, wherein a top of the mounting plate 1s provided with a handle (232).
7. The heat-dissipation structure for an electronic product according to claim 1, wherein the dust cover is an aluminum profile housing.
LU502193A 2022-05-12 2022-05-18 Heat-dissipation structure for electronic product LU502193B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210515140 2022-05-12

Publications (1)

Publication Number Publication Date
LU502193B1 true LU502193B1 (en) 2022-12-20

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WO (1) WO2022171206A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115675042B (en) * 2022-12-01 2024-02-02 四川吉利学院 Electromechanical control type chassis heat dissipation stabilizing device of electric automobile
CN116036756A (en) * 2023-03-31 2023-05-02 深圳市昱森机电有限公司 Motor air inlet filter equipment
CN116594487B (en) * 2023-07-17 2023-11-21 松原市何悦科技有限公司 Computer motherboard heat dissipation protection device
CN116704984B (en) * 2023-08-03 2023-10-20 山东蓝诺机械制造有限公司 Noise reduction protection monitoring control system and control method for mechanical equipment
CN117154286B (en) * 2023-09-15 2024-03-01 广州太空人新能源科技有限公司 New energy battery with good heat dissipation effect

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101015433B1 (en) * 2002-10-26 2011-02-22 한라공조주식회사 Structure for fixing fan assembly
JP2005012132A (en) * 2003-06-20 2005-01-13 Sony Corp Heat sink device and heat dissipation method of electronic apparatus
US20070089862A1 (en) * 2005-10-20 2007-04-26 Cui-Jun Lu Heat dissipation device including dust mask
CN101685324B (en) * 2008-09-28 2011-11-02 联想(北京)有限公司 Noise-reducing hardware combination and computer
CN104675758A (en) * 2013-12-02 2015-06-03 鸿富锦精密工业(深圳)有限公司 Low-noise fan module
CN108879347B (en) * 2018-07-25 2020-08-21 安徽科创新能源科技有限责任公司 Protection device for electromechanical device with heat dissipation function

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WO2022171206A9 (en) 2023-03-23
WO2022171206A3 (en) 2023-02-23

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