WO2024048134A1 - センサ - Google Patents

センサ Download PDF

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Publication number
WO2024048134A1
WO2024048134A1 PCT/JP2023/027172 JP2023027172W WO2024048134A1 WO 2024048134 A1 WO2024048134 A1 WO 2024048134A1 JP 2023027172 W JP2023027172 W JP 2023027172W WO 2024048134 A1 WO2024048134 A1 WO 2024048134A1
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WO
WIPO (PCT)
Prior art keywords
sensor
flow path
fluid
liquid level
sensor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/027172
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English (en)
French (fr)
Japanese (ja)
Inventor
章 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Ltd
Original Assignee
Proterial Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Proterial Ltd filed Critical Proterial Ltd
Priority to US19/107,635 priority Critical patent/US20260071905A1/en
Priority to CN202380059748.6A priority patent/CN119731515A/zh
Priority to JP2024544025A priority patent/JPWO2024048134A1/ja
Priority to KR1020257005765A priority patent/KR20250056909A/ko
Publication of WO2024048134A1 publication Critical patent/WO2024048134A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6842—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow with means for influencing the fluid flow
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/30—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by floats
    • G01F23/56—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by floats using elements rigidly fixed to, and rectilinearly moving with, the floats as transmission elements
    • G01F23/62—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by floats using elements rigidly fixed to, and rectilinearly moving with, the floats as transmission elements using magnetically actuated indicating means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F15/00—Details of, or accessories for, apparatus of groups G01F1/00 - G01F13/00 insofar as such details or appliances are not adapted to particular types of such apparatus
    • G01F15/14—Casings, e.g. of special material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/30—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by floats
    • G01F23/32—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by floats using rotatable arms or other pivotable transmission elements
    • G01F23/38—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by floats using rotatable arms or other pivotable transmission elements using magnetically actuated indicating means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/30—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by floats
    • G01F23/56—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by floats using elements rigidly fixed to, and rectilinearly moving with, the floats as transmission elements
    • G01F23/60—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by floats using elements rigidly fixed to, and rectilinearly moving with, the floats as transmission elements using electrically actuated indicating means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/30—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by floats
    • G01F23/64—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by floats of the free float type without mechanical transmission elements
    • G01F23/72—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by floats of the free float type without mechanical transmission elements using magnetically actuated indicating means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/30—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by floats
    • G01F23/64—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by floats of the free float type without mechanical transmission elements
    • G01F23/72—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by floats of the free float type without mechanical transmission elements using magnetically actuated indicating means
    • G01F23/74—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by floats of the free float type without mechanical transmission elements using magnetically actuated indicating means for sensing changes in level only at discrete points

Definitions

  • the present invention relates to a sensor used at high temperatures.
  • material gases for example, in the manufacturing process of semiconductor devices such as integrated circuits, various types of semiconductor material gases (hereinafter referred to as "material gases") are used depending on the purpose of the process.
  • material gases in which the precursor is stored in a liquid or solid state the precursor is converted to a gaseous material gas using a vaporizer, and then transferred to the semiconductor manufacturing equipment via piping.
  • means for generating material gas from a precursor in a vaporizer include a method of heating a precursor stored in a tank to generate steam.
  • the temperature of the precursor and/or material gas in the vaporizer has tended to increase more and more.
  • a vaporizer generally includes a valve for starting or stopping the supply of the generated material gas, a flow rate control device for controlling the flow rate of the material gas, and the amount of precursor and the properties of the material gas (e.g. temperature Various sensors are incorporated for detecting pressure (and pressure, etc.). For example, in a liquid level sensor for detecting the amount of a precursor in a liquid state, a sensor element such as a Hall IC or a reed switch is used to detect the liquid level of the precursor. . Not only Hall ICs and reed switches, but many sensor elements have a maximum operating temperature that is the upper limit of the operating temperature at which they can be used for a long period of time while maintaining normal operation.
  • a semiconductor element having a pn junction in which a p-type semiconductor and an n-type semiconductor are joined is widely used as a sensor because its electrical conductivity changes greatly depending on the surrounding environment.
  • a sensor using a semiconductor element is called a semiconductor sensor.
  • semiconductor sensors including, but not limited to, temperature sensors, optical sensors, magnetic field sensors, pressure sensors, and acceleration sensors.
  • Patent Document 2 filed by the present applicant discloses an invention of a liquid level sensor that detects the level of liquid.
  • This liquid level sensor is composed of a sleeve installed vertically, a float configured to move along the sleeve as the liquid level fluctuates, a resistor array, and a Hall IC that is a type of semiconductor sensor. and a plurality of grounding means.
  • the Hall IC functions as a magnetic field sensor, detects the magnetic field generated by the magnet included in the float, and grounds the resistor array at the position where the float is present.
  • the electrical signal generated in the resistor string changes in accordance with fluctuations in the liquid level, so the liquid level can be detected by extracting the electrical signal.
  • junction temperature The temperature at the pn junction of a semiconductor element.
  • junction temperature When the junction temperature exceeds a certain limit temperature, a large number of electron-hole pairs are generated, making it impossible for the semiconductor device to operate normally. This limit temperature is called “maximum junction temperature.”
  • the maximum junction temperature of a typical semiconductor device is approximately 170° C. in the case of temporary heating.
  • a predetermined temperature for example, 100°C
  • the plurality of grounding means included in the liquid level sensor may be composed of reed switches instead of being composed of Hall ICs, which are a type of semiconductor sensor, as described above.
  • a reed switch is comprised of two magnetic leads, each free end of which is held at a predetermined distance within a glass tube or the like. When a magnetic field is applied from the outside, the leads are magnetized and their free ends attract each other and come into contact, closing the circuit. When the magnetic field disappears, the elasticity of the leads separates the free ends and opens the circuit. has been done.
  • the magnetism of the reed may change and the reed switch may not be able to operate normally. Further, depending on the temperature, the elastic modulus of the material forming the reed changes, and there is a possibility that the reed switch may not be able to operate normally.
  • a liquid level sensor including the above-mentioned Hall IC or reed switch may be provided in the tank of the vaporizer.
  • a vaporizer is a device used for the purpose of supplying material gas to semiconductor manufacturing equipment and the like. A liquid material as a precursor that becomes the source of the material gas is stored in the tank of the vaporizer, and the liquid level is measured by a liquid level sensor.
  • the liquid level sensor that is in contact with the liquid material in the tank is usually also heated to the same temperature as the liquid material.
  • Some liquid materials cannot obtain the vapor pressure necessary to supply the material gas unless they are heated to a temperature exceeding the maximum operating temperature of the sensor element.
  • the temperature exceeds a predetermined temperature (for example, 100°C) that is sufficiently lower than the maximum junction temperature.
  • a predetermined temperature for example, 100°C
  • the present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a sensor that can be used continuously for a long period of time at a temperature exceeding the maximum operating temperature of the sensor elements constituting the sensor. purpose.
  • the sensor according to the present invention is a sensor used in a vaporizer, and includes one or more sensor elements, a first flow path that is a flow path that delivers fluid from the outside of the sensor to the position of the sensor element, and The second flow path is a flow path that returns the fluid delivered to the sensor element position by the first flow path to the outside of the sensor.
  • the above fluid is not a gas obtained by vaporizing a precursor using a vaporizer.
  • the sensor element is cooled by the fluid flowing around the first flow path and the second flow path. Therefore, even if the temperature outside the sensor rises to a temperature exceeding the maximum operating temperature of the sensor element, the temperature of the sensor element can be maintained at a temperature lower than the temperature outside the sensor.
  • the senor according to the present invention further includes a protective tube that is closed at one end and open at the other end, and the sensor element is arranged in the protective tube.
  • at least one of the members constituting the first flow path and the members constituting the second flow path may be made of a material having a lower thermal conductivity than the member constituting the protection tube. In this configuration, it becomes difficult for heat to be transmitted from the outside to the inside of the protective tube, so that a rise in temperature of the sensor element can be suppressed more reliably.
  • the sensor according to the present invention can be configured as a liquid level sensor used in a vaporizer.
  • the sensor element is cooled by the fluid flowing around the first flow path and the second flow path. Therefore, even if the temperature outside the sensor rises to a temperature exceeding the maximum operating temperature of the sensor element, the temperature of the sensor element can be maintained at a temperature lower than the temperature outside the sensor. Therefore, the temperature at which the sensor including the sensor element is used continuously over a long period of time can be set to a higher temperature than before. Thereby, the operating temperature of a vaporizer that uses a liquid level sensor including a sensor element can be set to a higher temperature than the maximum operating temperature of the sensor element.
  • FIG. 1 is a schematic diagram showing an example of the configuration of a sensor according to the present invention in a first embodiment of the present invention.
  • FIG. 1 is a schematic diagram illustrating the configuration of a sensor according to a first preferred embodiment of the present invention.
  • FIG. 2 is a schematic diagram illustrating the configuration of a sensor according to a second embodiment of the present invention.
  • 1 is a partial cross-sectional view showing an example of a liquid level sensor according to the present invention.
  • FIG. 1 is an assembly diagram showing an example of a liquid level sensor according to the present invention.
  • 1 is a front view showing an example of a main part of a liquid level sensor according to the present invention.
  • FIG. 2 is a partial cross-sectional view showing an example of a liquid level sensor according to the prior art.
  • the present invention provides a sensor for use in a vaporizer, comprising one or more sensor elements and a first flow path that delivers fluid from outside the sensor to the location of the sensor element. a flow path and a second flow path that is a flow path for returning the fluid delivered to the sensor element position by the first flow path to the outside of the sensor;
  • a sensor for use in a vaporizer, comprising one or more sensor elements and a first flow path that delivers fluid from outside the sensor to the location of the sensor element. a flow path and a second flow path that is a flow path for returning the fluid delivered to the sensor element position by the first flow path to the outside of the sensor;
  • This is an invention of a sensor that uses a fluid other than a gas as the fluid.
  • the sensor element included in the sensor according to the present invention detects, for example, the amount of the precursor of the material gas stored in a tank installed inside the vaporizer or the properties of the material gas (e.g., temperature and pressure). It is an element for As described above, many sensor elements have a maximum operating temperature that is the upper limit of the operating temperature at which they can be used for a long period of time while maintaining normal operation. Therefore, in order to continue using the sensor for a long time without replacing it at a temperature higher than the maximum operating temperature of the sensor element, it is necessary to maintain the operating temperature of the sensor element so that it does not exceed the maximum operating temperature. be.
  • the semiconductor element included in the sensor according to the present invention is a semiconductor element having a pn junction.
  • a semiconductor element having a pn junction has the property that its electrical conductivity changes greatly depending on the surrounding environment, so it can function as a sensor.
  • an optical sensor, a magnetic field sensor, a pressure sensor, an acceleration sensor, etc. can be used, but the semiconductor element according to the present invention is not limited to these sensors.
  • the semiconductor element included in the sensor according to the present invention is not limited to one in which only the portion that functions as a sensor is made of a semiconductor having a pn junction.
  • the sensor element itself is not a semiconductor
  • the amplifier or other peripheral circuitry associated with the sensor may be constructed of semiconductors, or both the sensor portion and the peripheral circuitry may be constructed of semiconductors. It may be an element that is
  • the number of sensor elements included in the sensor according to the present invention may be one, two, or more.
  • all the sensor elements may be of the same type, or different types of sensor elements may be mixed.
  • FIG. 1 is a schematic diagram showing an example of the configuration of a sensor according to the present invention in a first embodiment.
  • the sensor 2s according to the present invention has a first flow path 3, which is a flow path for delivering fluid from the outside of the sensor 2s to the position of the sensor element 2, and a first flow path, as described above.
  • a second flow path 4 is provided, which is a flow path for returning the fluid delivered to the position of the sensor element 2 by the path 3 to the outside of the sensor 2s.
  • the first flow path 3 and the second flow path 4 only need to each be configured as a continuous space, and the shapes of these spaces are not limited.
  • the shapes of the spaces constituting the first flow path 3 and the second flow path 4 are preferably such that there is little fluid resistance and the flow of fluid is less likely to be obstructed.
  • the first flow path 3 and the second flow path 4 may be directly connected to each other at the position of the sensor element 2, and are neither the first flow path 3 nor the second flow path 4 as illustrated in FIG. They may also be indirectly connected via a transition section.
  • Each of the first flow path 3 and the second flow path 4 may be one system, or each may branch midway into a plurality of systems, or may merge again.
  • the first flow path 3 is a flow path that delivers fluid from the outside of the sensor 2s to the position of the sensor element 2.
  • the first flow path 3 itself does not necessarily have to reach the position of the sensor element 2 from outside the sensor 2s.
  • the fluid is transferred from the outside of the sensor 2s to the sensor The fluid may be delivered to the location of the element 2.
  • the end of the first flow path 3 on the sensor element 2 side does not reach the position of the sensor element 2, the flow of fluid released from the first flow path 3 reaches the sensor element 2 and cools it. It is sufficient if the effect of
  • the second flow path 4 is a flow path that returns the fluid delivered to the position of the sensor element 2 by the first flow path 3 to the outside of the sensor 2s.
  • the second flow path 4 itself does not necessarily need to reach from the position of the sensor element 2 to the outside of the sensor 2s.
  • the first flow path 3 The fluid delivered to the position of the sensor element 2 may be returned to the outside of the sensor 2s.
  • the end of the second flow path 4 on the sensor element 2 side does not reach the position of the sensor element 2, it is delivered to the position of the sensor element 2 by the first flow path 3 and the sensor element 2 is cooled. It is only necessary that the flow of the fluid warmed by this is guided away from the position of the sensor element 2 and to the outside of the sensor 2s via the second flow path 4.
  • first flow path 3 and the second flow path 4 Due to the actions of the first flow path 3 and the second flow path 4 described above, heat is removed from the sensor element 2 by the fluid as a heat medium, and the heat is released to the outside of the sensor 2s.
  • first flow path 3 and the second flow path 4 may be constituted by an independent tubular member, and the first flow path 3 and the second flow path 4 may be formed by a single member.
  • the second flow path 4 may be configured integrally.
  • the fluid used when using the sensor 2s according to the present invention is a non-gaseous fluid obtained by vaporizing a precursor with a vaporizer to which the sensor 2s according to the present invention is applied.
  • any fluid may be used as long as it has the effect of cooling the sensor element 2, and any fluid that is generally used as a refrigerant may be used.
  • the fluid used to carry out the present invention is preferably a stable substance that has a large heat capacity, is easy to handle, and is difficult to chemically react with the walls of the first channel 3 and the second channel 4.
  • water, air, or an inert gas such as nitrogen gas is preferred as the fluid used to practice the present invention.
  • the temperature of the fluid supplied to the sensor 2s needs to be lower than the temperature around the sensor element 2.
  • the sensor element 2 comes into contact with the fluid delivered to the position of the sensor element 2 by the first flow path 3. A portion of the heat transferred from the periphery of the sensor element 2 toward the sensor element 2 is carried away from the position of the sensor element 2 to the outside by the fluid flow. Further, in general, the power consumption of the sensor element 2 is extremely small and the amount of heat generated by itself is small. Therefore, the temperature of the sensor element 2 roughly matches the temperature of the surrounding fluid. As a result, even if the temperature around the sensor 2s exceeds the maximum operating temperature of the sensor element 2, the temperature of the sensor element 2 can be maintained at a temperature lower than the temperature around the sensor 2s.
  • the present invention it is possible to provide the sensor 2s that can be used continuously for a long period of time at a temperature exceeding the maximum operating temperature of the sensor element 2 constituting the sensor 2s.
  • a sensor 2s including a sensor element 2 is disposed inside a tank 6 that accommodates a precursor of a material gas supplied by a vaporizer (not shown).
  • a vaporizer not shown
  • the arrangement of the sensor 2s in the vaporizer is not limited to the example shown in FIG. It can be placed in any position.
  • the vaporizer in this technical field, for example, in a vaporizer that supplies flammable material gas, for example, for the purpose of explosion protection, the vaporizer is housed inside a casing, and an inert gas is allowed to flow inside the casing.
  • an inert gas is allowed to flow inside the casing.
  • the inert gas for purging could also be used to cool the sensor element, since this would prevent the structure of the vaporizer from becoming more complicated and/or increase the manufacturing cost.
  • the senor according to the present invention is the above-described sensor, in which at least the member on which the sensor is disposed among the members constituting the vaporizer is housed inside the casing.
  • the vaporizer is configured such that the inside of the casing is purged by flowing an inert gas into the casing, and at least a part of the inert gas flows through the first flow path and the second flow path as the fluid.
  • a sensor configured to flow into a flow path.
  • the inert gas used as the fluid for cooling the sensor element include argon and nitrogen gas, but nitrogen gas is preferred from the perspective of reducing operating costs.
  • the vaporizer is already equipped with a mechanism for supplying inert gas from the outside to the inside of the casing and discharging the inert gas from the inside of the casing to the outside. Therefore, the inert gas for purging is supplied from the inert gas supply flow path for purging to the first flow path, and the inert gas is supplied from the second flow path to the inert gas discharge flow path for purging. By discharging the sensor element, a fluid flow path for cooling the sensor element can be easily constructed.
  • FIG. 2 is a schematic diagram illustrating the configuration of a sensor according to a first preferred embodiment of the present invention.
  • a sensor 2s is disposed inside a tank 6 constituting a vaporizer (not shown), and the tank 6 is housed inside a casing 10.
  • a first flow path 3 branches from a supply flow path 11 for supplying inert gas for purging into the inside of the casing 10, and a discharge flow for discharging the inert gas for purging.
  • the second channel 4 merges into the channel 12 . Thereby, a part of the inert gas can flow into the first flow path 3 and the second flow path 4 as a fluid for cooling the sensor element 2.
  • the sensor 2s is disposed inside the tank 6, and the tank 6 is housed inside the casing 10, as described above.
  • the supply channel 11 for supplying the inert gas for purging into the inside of the casing 10 is directly connected to the first channel 3, and the inert gas is supplied to the first flow path 3.
  • the fluid that has passed through the position of the sensor 2 is discharged into the housing 10 from the second flow path 4, and after passing through the internal space of the housing 10, there is an exhaust pipe for discharging inert gas for purging.
  • the liquid is discharged from the flow path 12 to the outside of the housing 10 . This allows all of the inert gas to flow into the first flow path 3 and the second flow path 4 as a fluid for cooling the sensor element 2 .
  • the senor according to the present invention further includes means for supplying fluid to the first flow path.
  • the means for supplying the fluid to the first flow path may include a pressure reducing valve connected to the cylinder to adjust the pressure of the gas to an appropriate value, and a pressure reducing valve connected to the cylinder to adjust the pressure of the gas to an appropriate value. It can be configured by a member such as piping that continuously supplies gas to the maintained first flow path.
  • the means for supplying the fluid to the first flow path is configured by means such as a pump that forcibly sends the fluid to the first flow path. be able to.
  • the fluid supplied to the first flow path is delivered to the position of the sensor element, it is discharged to the outside from the outlet of the second flow path.
  • the fluid released to the outside may be directly discharged into the atmosphere, or may be recovered using members such as piping and a vacuum pump.
  • the fluid thus recovered may be disposed of as is, or may be reused after cooling.
  • the semiconductor sensor according to the present invention includes a temperature sensor at or near the sensor element. In this configuration, by monitoring the temperature of the sensor element using the temperature sensor, it is possible to monitor whether the temperature of the sensor element exceeds the target value.
  • the present invention provides the sensor according to the first embodiment described above, further comprising a protective tube with one end closed and the other end open, and the sensor element
  • a protective tube with one end closed and the other end open
  • the sensor element This is an invention of a sensor placed inside a protection tube.
  • the first flow path is configured to deliver the fluid from the position of the other end of the protection tube to the position of the outermost sensor element, which is the sensor element closest to one end of the protection tube.
  • the second flow path is configured to return the fluid delivered to the position of the extreme sensor element by the first flow path to the position of the other end.
  • a sensor element is arranged in at least one of the first flow path or the second flow path.
  • FIG. 3 is a schematic diagram illustrating the configuration of a sensor according to the second embodiment of the present invention.
  • the protective tube 1 included in the sensor 2s illustrated in FIG. 3(a) is a straight tubular member, and the sensor element 2 is disposed inside the protective tube 1.
  • a plurality of sensor elements 2 are fixed to the surface of the holding member 2h.
  • the protection tube 1 has sufficient space therein to house the sensor element 2 and other members.
  • the protection tube 1 serves to protect the sensor element 2 by isolating the built-in sensor element 2 from the external environment.
  • One end (the lower end in FIG. 3) of the protection tube 1 is closed, which prevents the external environment from penetrating into the interior of the protection tube 1.
  • the other end (the upper end in FIG. 3) of the protection tube 1 is open, and is used to exchange electrical signals with the sensor element 2 and to cool the sensor element 2 through this open end.
  • the fluid can be delivered to the location of the sensor element.
  • the protective tube 1 according to the second embodiment is made of stainless steel or other metal or alloy.
  • the thickness of the tube wall of the protection tube 1 must not be too thin so as to ensure the strength to maintain the shape of the protection tube 1, and must not be so thick that it interferes with collecting information on the external environment. No. It is preferable that the protective tube 1 has a sufficient length so that the sensor element 2 can reach the position where sensing is to be performed.
  • the fluid is configured to be delivered to the position of the endmost sensor element, which is the sensor element 2 closest to the end (the above-mentioned one end).
  • the second flow path 4 is configured to return the fluid delivered to the position of the outermost sensor element by the first flow path 3 to the open end (the other end described above) of the protection tube 1. It is configured.
  • the first flow path 3 illustrated in FIG. Deliver fluid to.
  • the endmost sensor element closest to the closed end of the protection tube 1 refers to the sensor element located farthest from the open end of the protection tube 1.
  • the sensor 2s illustrated in FIG. 3(a) includes a plurality of sensor elements 2, but when the number of sensor elements 2 is one, the first flow path 3 extends to the position of that one sensor element It is enough to guide the fluid.
  • the first flow path 3 does not need to reach the sensor element 2, and the flow of fluid discharged from the first flow path 3 may reach the sensor element 2 to have a cooling effect. It is enough if it occurs.
  • the sensor element is arranged in at least one of the first flow path and the second flow path. If the extreme sensor element is arranged in the second flow path 4, the fluid delivered through the first flow path 3 to a position close to the closed end of the protective tube 1 is then transferred to the second flow path 4. The fluid may reach the outermost sensor element within the second flow path to provide cooling.
  • the case where the entire first flow path and a portion of the second flow path cooperate to deliver fluid to the outermost sensor element is also included in the embodiment of the first flow path in the present invention.
  • the second flow path according to the present invention is a flow path that returns the fluid delivered to the sensor element position by the first flow path to the outside of the sensor.
  • the second flow path according to the second embodiment returns the fluid delivered to the position of the outermost sensor element by the first flow path to the position of the open end of the protection tube. Since one side of the protection tube is closed, it is necessary to return the fluid that has been delivered to the position of the most extreme sensor element through the first flow path to the outside of the protection tube.
  • the second channel functions as a path for returning the fluid to the outside of the protection tube. Due to the action of the first flow path and the second flow path, heat is removed from the sensor element by the fluid as a heat medium, and the heat is released to the outside of the protection tube.
  • first flow path and the second flow path according to the present invention may be constituted by an independent tubular member, and the first flow path and the second flow path according to the present invention may be configured by a single member.
  • the second flow path may be integrally configured.
  • either the first flow path or the second flow path may be constituted by the inner wall of the protection tube.
  • a bottomed cylindrical second flow path 4 with one end closed and the other end open is connected to a protective tube at the closed end.
  • the protective tube 1 is housed inside the protective tube 1 with the protective tube 1 facing toward the closed end of the protective tube 1 .
  • a plurality of sensor elements 2 fixed to the holding member 2h and a cylindrical first flow path 3 are housed inside the second flow path 4, and the outermost sensor element 2 and the first flow path 3 are arranged in the vicinity of the bottom of the protection tube 1. 1 and the downstream end of the flow path 3 are adjacent to each other. Therefore, in the sensor 2s illustrated in FIG. It flows out from the end to the bottom of the second channel 4.
  • the outermost sensor element 2 located near the bottom of the second flow path 4 (that is, near the closed end of the protection tube 1) is first cooled by the fluid. Thereafter, as the fluid flows downstream (upper side in FIG. 3) along the second flow path 4, other sensor elements 2 are also cooled by contacting the fluid, and as shown by the black arrows, the second flow path Fluid is discharged from the downstream end of sensor 4 (the upper end in FIG. 3) to the outside of sensor 2s.
  • the fluid supplied to the upstream end of the first flow path 3 is transferred to the downstream end of the first flow path 3, as shown by the white arrow. and flows out to the bottom of the protection tube 1.
  • the outermost sensor element 2 located near the bottom of the protection tube 1 that is, near the closed end of the protection tube 1 is first cooled by the fluid. Thereafter, as the fluid flows downstream (upper side in FIG.
  • the sensor elements were arranged in the second flow path, but as described above, in the sensor according to the second embodiment, the sensor elements are arranged in the first flow path or the second flow path. It is arranged in at least one of the flow paths.
  • the sensor element when the sensor element is arranged in the first flow path or the second flow path, all the sensor elements including the outermost sensor element are present inside the first flow path or the second flow path, This refers to a state where the surface of the sensor element or its housing comes into contact with the fluid flowing in the first flow path or the second flow path and heat is removed.
  • all the sensor elements are arranged in at least one of the first flow path or the second flow path, and the sensor elements are not arranged in either the first flow path or the second flow path. does not exist.
  • all the sensor elements may be arranged only in either the first flow path or the second flow path, or all the sensor elements may be arranged in both the first flow path and the second flow path. They may be distributed and arranged.
  • At least one of the member forming the first flow path and the member forming the second flow path is made of a material having a lower thermal conductivity than the member forming the protection tube. It is made up of.
  • the fluid flowing through the first flow path and the second flow path functions as a heat medium that suppresses the temperature rise of the sensor element.
  • the temperature outside the protection tube is higher than the temperature of the fluid, there is a risk that the fluid will be heated by heat from the outside of the protection tube and its temperature will rise before the fluid is delivered to the sensor element.
  • At least one of the members constituting the first flow path and the second flow path is made of a material having a lower thermal conductivity than the member constituting the protection tube, heat from the outside of the protection tube is transmitted to the fluid. This prevents the temperature of the fluid from rising, allowing it to perform its original cooling function.
  • the material constituting at least one of the members constituting the first flow path and the second flow path is a material having a lower thermal conductivity than the member constituting the protection tube. Any material may be used as long as it is available.
  • the protection tube is made of metal or an alloy as described above
  • at least one of the first flow path and the second flow path is made of polytetrafluoroethylene or other material having a lower thermal conductivity than the protection tube. By using fluororesin, it is possible to suppress an increase in the temperature of the fluid.
  • the entire flow path may be made of a material having a lower thermal conductivity than the protection tube, and a portion of the flow path may have a lower thermal conductivity than the protection tube.
  • the material may be made of a material having a certain ratio. For example, if a flow path is made up of multiple members, even if some of those members have higher thermal conductivity than the members that make up the protective tube, the thermal conductivity of other parts If the temperature is low, the rise in temperature of the fluid in the entire flow path is suppressed.
  • the first flow path and the second flow path may themselves be made of a material having low thermal conductivity.
  • the flow path may have a structure in which a plurality of tubes are stacked in layers, and a material having low thermal conductivity may be used for some of the layers.
  • the protective tube may have a double structure consisting of an outer tube and an inner tube, and the gap between the two may be a vacuum. This space kept in vacuum is one embodiment of the "material having a lower thermal conductivity than the members constituting the protection tube" in the present invention.
  • the protective tube has a double structure consisting of an outer tube and an inner tube, and the material constituting at least one of the members constituting the first flow path and the second flow path constitutes the protective tube. The material may have a lower thermal conductivity than the other member.
  • the first flow path is arranged inside the second flow path.
  • the member forming the first flow path in the cross section of the protection tube is inside the member forming the second flow path. It means that it exists at a position where it comes into contact with the fluid flowing through the second flow path.
  • fluid is first delivered through a first channel disposed within the second channel to the location of the most extreme sensor element, and then through the second channel to the open end of the protection tube. Return to position. All the sensor elements, including the most extreme sensor element, are arranged in at least one of the first flow path or the second flow path, so that they come into contact with the fluid flowing through these flow paths.
  • the first flow path 3 is arranged inside the second flow path 4. That is, the sensor 2s illustrated in FIG. 3(a) satisfies the requirements as a sensor according to this preferred embodiment.
  • the present invention provides a liquid level sensor for use in a vaporizer, the sensor being closed at one end and open at the other end and extending vertically.
  • one or more sensor elements arranged inside the protection tube, and one of the sensor elements of the protection tube from the position of the other end (open end) of the protection tube.
  • the first flow path is a flow path configured to deliver fluid to the position of the outermost sensor element which is the sensor element closest to the end (closed end) of the sensor;
  • a second flow path configured to return the fluid delivered to the element position to the other end (open end) of the protection tube, and a magnet, and the vaporizer.
  • a float configured to move along the protective tube as the liquid level of the precursor changes to a gas by vaporizing it
  • the sensor element is located in at least one of the first flow path or the second flow path. and the fluid is not the fluid obtained by vaporizing the precursor by the vaporizer.
  • the protection tube is installed vertically, and its length coincides with the direction perpendicular to the liquid level of the liquid whose level is to be determined (the precursor of the material gas to be supplied by the vaporizer). It is arranged like this.
  • a float equipped with a magnet moves along the protection tube as the liquid level changes.
  • the sensor element turns on and off in response to the magnetic field generated by the magnet. By detecting this as an electrical signal, it is possible to know the position of the liquid surface where the float is present.
  • Specific examples of such sensor elements include, for example, Hall ICs and reed switches.
  • the sensor element used in this embodiment is not particularly limited as long as it can determine the position of the liquid surface where the float is present by outputting a signal corresponding to the magnetic field generated by the magnet.
  • the effect when fluid flows through the first flow path and the second flow path is the same as the effect in the first embodiment and the second embodiment, and the effect on all sensor elements including the outermost sensor element.
  • the protection tube, the first flow path, the second flow path, etc. in the third embodiment are the same as those in the second embodiment, so their description will be omitted here.
  • the liquid level sensor according to the third embodiment can be used as a liquid level sensor for a tank included in a vaporizer.
  • a vaporizer uses a method of heating the liquid material (precursor) stored in a tank to vaporize the material gas
  • the liquid level sensor that is in contact with the liquid material in the tank is also connected to the liquid material.
  • they are heated to the same temperature.
  • Some liquid materials cannot obtain the vapor pressure necessary for supplying material gas unless they are heated to a temperature exceeding the maximum operating temperature of the sensor element (for example, 100° C.).
  • the liquid level sensor according to the third embodiment even if the liquid material is heated to a temperature exceeding the maximum operating temperature of the sensor element, the temperature of the sensor element can be lowered to a temperature lower than the temperature of the liquid material. Therefore, the vapor pressure of the material gas can be increased while ensuring the long-term reliability of the sensor.
  • the embodiment of the present invention is not limited to a liquid level sensor.
  • the effects of the present invention can also be obtained when the semiconductor sensor in the first embodiment is replaced with an optical sensor, a magnetic field sensor, a pressure sensor, an acceleration sensor, etc. without departing from the gist of the present invention.
  • FIG. 7 is a partial sectional view showing an example of the structure of a vaporizer equipped with a liquid level sensor according to the prior art disclosed in Patent Document 1.
  • This liquid level sensor includes a protective tube 1 which is entirely provided inside a tank 6, has one end closed, the other end open, and extends vertically; A float comprising two or more Hall ICs (semiconductor elements) 2 having a pn junction and disposed inside the protection tube 1, and a magnet 5a, and configured to move along the protection tube as the liquid level fluctuates. 5.
  • the inside of the tank 6 is filled with a liquid material, and by heating the liquid material with a heater (not shown), the liquid material is vaporized and gas is generated.
  • the liquid material is a precursor of the material gas to be supplied by the vaporizer.
  • the temperature of the liquid material is measured by a temperature sensor 7.
  • a temperature sensor 7 In FIG. 7, only a port for inserting the tip of the temperature sensor 7 into the inside of the tank 6 is shown.
  • the generated gas accumulates in a space above the liquid level inside the tank 6.
  • the gas stored inside the tank 6 can be taken out to the outside of the tank 6 using piping (not shown) and used for various purposes.
  • the Hall IC (semiconductor element) 2 is configured to ground a connection point of a resistor string made up of a plurality of resistors connected in series.
  • the Hall IC (semiconductor element) 2 is activated by the magnetic field generated by the magnet 5a, the resistance value of the resistor string changes. By extracting an electrical signal corresponding to this resistance value, the position of the liquid surface of the liquid material can be detected.
  • the protective tube 1 is made of stainless steel. Air exists around the Hall IC (semiconductor element) 2 inside the protection tube 1 .
  • the liquid material stored in tank 6 is heated for the purpose of generating gas. When the temperature of the liquid material rises, first the temperature of the outer wall of the protection tube 1 that is in contact with the liquid material rises, and the heat is transmitted to the inner wall of the protection tube 1 by conduction. Next, heat is transferred from the inner wall of the protection tube 1 toward the Hall IC (semiconductor element) 2 by conduction, air convection, and electromagnetic radiation.
  • the closed end of the protection tube 1 is inserted deeply below the liquid level of the tank 6, and the area around the protection tube 1 is filled with heated liquid material. Since the cross-sectional area of the protection tube 1 is smaller than the area of the outer peripheral surface, the heat is emitted from the Hall IC (semiconductor element) 2 placed inside the protection tube 1 to the outside through the space on the inner diameter side of the protection tube 1. The amount of heat is smaller than the amount of heat transmitted from the outside of the protective tube 1 toward the inside. Therefore, when the thermal equilibrium state is reached, the temperature of the Hall IC (semiconductor element) 2 rises to approximately the same temperature as the liquid material. Therefore, in the vaporizer according to the prior art shown in FIG. 7, the maximum operating temperature of the Hall IC (semiconductor element) 2 is It was not possible to raise the temperature of the liquid material to a temperature exceeding (100°C).
  • FIG. 4 is a partial sectional view showing an example of the structure of a vaporizer equipped with a liquid level sensor according to the present invention.
  • the basic configuration of this liquid level sensor is the same as that of the prior art vaporizer shown in FIG. That is, the liquid level sensor illustrated in FIG. 4 is provided entirely inside the tank 6, one end is closed, the other end is open, and is provided so as to extend in the vertical direction.
  • a protection tube 1 made of stainless steel, two or more Hall ICs (semiconductor elements) 2 having a pn junction and placed inside the protection tube 1, and a magnet 5a are provided, and a magnet 5a is provided along the protection tube as the liquid level changes.
  • a float 5 configured to move.
  • the liquid level sensor according to the present invention also includes the Hall IC (semiconductor element) 2 closest to the closed end of the protection tube 1 from the position of the open end of the protection tube 1.
  • a first channel 3 that delivers fluid to the position of the farthest sensor element) 2b, and a first channel 3 that delivers the fluid to the position of the farthest Hall IC (the farthest semiconductor element) 2b when the protective tube 1 is opened.
  • It further includes a second flow path 4 that returns to the end position.
  • FIG. 7 only the port portion of the temperature sensor 7 that measures the temperature of the liquid material is shown in FIG. 4 as well.
  • the first flow path 3 is arranged inside the second flow path 4. That is, in FIG. 4, the first flow path 3 is constituted by a thin tube having an outer diameter sufficiently smaller than the inner diameter of the protection tube 1, and extends vertically from the open end of the protection tube 1 to the closed end. It is arranged so that it extends to.
  • the position of the end on the fluid outlet side, which is the lower side of the first flow path 3, is the lowest Hall IC (the most It is located below the position of the end sensor element) 2b.
  • the Hall IC (semiconductor element) 2 is not arranged inside the first flow path 3 .
  • the space inside the protection tube 1 from the lower tip of the first flow path 3 to the open end of the protection tube 1 excluding the first flow path 3 is as follows:
  • a second flow path 4 is configured. All Hall ICs (semiconductor elements) 2 are arranged in the second flow path 4.
  • the liquid level sensor shown in FIG. 4 includes means for supplying fluid to the first flow path 3.
  • fluid is supplied from the upper end of the first flow path 3 using a supply means (not shown).
  • the supplied fluid descends through the inside of the first flow path 3 and then flows out from the lower tip into the second flow path 4, which is the inside of the protection tube 1.
  • the fluid moves up the second flow path 4 while contacting the row of Hall ICs (semiconductor devices) 2, and is discharged to the outside from the open end of the protection tube 1.
  • FIG. 5 is an assembly diagram of a vaporizer equipped with the liquid level sensor illustrated in FIG. 4.
  • a sleeve 4a with an outer diameter of 10.0 mm and an inner diameter of 9.0 mm is placed above a stainless steel protection tube 1 with an inner diameter of 10.8 mm, and a sleeve 4a with an outer diameter of 9.0 mm closes the tip of the sleeve 4a.
  • a plug 4b is shown.
  • the plug 4b is inserted into the lower end of the sleeve 4a, and then the sleeve 4a is inserted until the lower end touches the closed end of the protective tube 1.
  • the inner diameter of this sleeve 4a corresponds to the outer diameter of the second flow path 4.
  • FIG. 6 is a front view illustrating a state in which the sleeve 4a, the plug 4b, the printed wiring board 2a, and the thin tube 3a constituting the first flow path 3 are assembled.
  • a plug 4b is inserted into the lower end of the sleeve 4a. This is to prevent the fluid supplied to the lower end of the sleeve 4a through the first flow path 3 from entering the gap between the inner diameter of the protection tube 1 and the outer diameter of the sleeve 4a.
  • the thin tube 3a constituting the first flow path 3 and the sleeve 4a constituting the second flow path are both made of a fluororesin having low thermal conductivity.
  • the stopper 4b is made of a silicone resin sponge.
  • FIG. 6B the lower end of the printed wiring board 2a is inserted into the sleeve 4a, and the thin tube 3a constituting the first flow path 3 is also inserted.
  • the fluid descending through the first flow path 3 is discharged from the tip of the thin tube 3a into the sleeve 4a and is prevented from descending by the stopper 4b. rise towards.
  • the lower end of the thin tube 3a constituting the first flow path 3 is cut diagonally, so even if the tip is in contact with the plug 4b, the fluid will not be released by the plug 4b. will not be hindered.
  • the fluid rising through the sleeve 4a is first delivered to the position of the endmost Hall IC (endmost sensor element) 2b, then comes into contact with other Hall ICs 2 one after another, and finally reaches the open end of the protection tube 1. reaches and is released to the outside.
  • the sleeve 4a constituting the outer wall of the second flow path 4 is made of fluororesin with low thermal conductivity, so that the heat on the inner wall of the protection tube 1 is not easily transmitted to the fluid flowing through the second flow path 4. It has become. Furthermore, the thin tube 3a of the first flow path 3 disposed inside the second flow path 4 is also made of fluororesin, and the plug 4b that closes the tip of the sleeve 4a is made of silicone resin. Almost no heat from the protective tube 1 is transferred to the fluid flowing through the flow path 3. Therefore, the temperature of the fluid delivered to the farthest Hall IC 2b is almost the same as the temperature of the fluid supplied to the first flow path 3.
  • Table 1 shows that when the tank 6 of the vaporizer shown in FIG. 4 is emptied and the bottom of the tank 6 is heated by a heater (not shown), the temperature detected by the temperature sensor 7 installed inside the tank is 110°C.
  • This data shows the relationship between the flow rate of nitrogen gas and the temperature of each part when nitrogen gas at room temperature is supplied to the first flow path 3 while controlling the temperature so that The temperature is measured on the inner diameter side of the protection tube 1 near the open end, and on the inner diameter side of the protection tube 1 near the open end of the protection tube 1, and on the Hall IC (semiconductor device) closest to the open end of the protection tube 1 in the row of Hall ICs (semiconductor devices) 2. Measurements were made at two locations (element) 2. The temperature was measured approximately 10 minutes after the flow rate of nitrogen gas stabilized, and the temperature of each part was stabilized.
  • the left column of Table 1 shows temperature data with the sleeve 4a and plug 4b shown in FIGS. 5 and 6. According to this, when the flow rate of nitrogen gas was zero, the temperature of the protection tube 1 and the temperature of the Hall IC (semiconductor element) 2 were almost equal, and both exceeded 90°C. When nitrogen gas was flowed, the higher the flow rate, the lower the temperature at each part and the larger the temperature difference between the two positions. From these results, if the liquid level sensor according to the present invention is used, even if the temperature of the tank 6 exceeds 100°C, the temperature of the Hall IC (semiconductor element) 2 can be maintained at a lower temperature. I know what I can do. Furthermore, it can be seen that by flowing nitrogen gas, the temperature of not only the Hall IC (semiconductor element) 2 but also the protection tube 1 is lowered.
  • the right column of Table 1 shows temperature data without the sleeve 4a and plug 4b shown in FIGS. 5 and 6.
  • the temperature drop in each part was smaller than when they were present, and the temperature difference was also smaller. From this, it can be seen that the effect of cooling the Hall IC 2 according to the present invention is better when the outer wall of the second flow path 4 is composed of the inner wall of the sleeve 4a, which has a low thermal conductivity, than when the outer wall of the second flow path 4 is composed of the inner wall of the protection tube 1. I know it's expensive.
  • Table 2 is data showing the relationship between the flow rate of nitrogen gas and the temperature of each part when the temperature of the tank detected by the temperature sensor 7 is controlled to be 140° C. in the same device configuration as in Table 1.
  • the left column of Table 2 shows temperature data with the sleeve 4a and plug 4b shown in FIGS. 5 and 6. According to this, it can be seen that even if the temperature of the tank is 140°C, the temperature of the Hall IC (semiconductor element) 2 can be cooled to less than 100°C by flowing nitrogen gas at a flow rate of 3.7 slm (standard liters per minute) or more. .
  • the first flow path, the second flow path, and the fluid supply means are added without substantially changing the structure of the liquid level sensor according to the prior art shown in FIG. By simply doing this, the applicable temperature range of the liquid level sensor can be expanded to the high temperature side.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Measuring Volume Flow (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5473310U (https=) * 1977-11-02 1979-05-24
JPH02110830U (https=) * 1989-02-23 1990-09-05
JPH0391927U (https=) * 1989-10-13 1991-09-19
JP2006208141A (ja) * 2005-01-27 2006-08-10 Nippon Kurin Gauge Kk 高温液体の液面検知装置
JP2021148496A (ja) * 2020-03-17 2021-09-27 東京エレクトロン株式会社 原料供給装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5104151B2 (ja) 2007-09-18 2012-12-19 東京エレクトロン株式会社 気化装置、成膜装置、成膜方法及び記憶媒体
JP7801998B2 (ja) 2020-06-30 2026-01-19 桑名金属工業株式会社 液位センサ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5473310U (https=) * 1977-11-02 1979-05-24
JPH02110830U (https=) * 1989-02-23 1990-09-05
JPH0391927U (https=) * 1989-10-13 1991-09-19
JP2006208141A (ja) * 2005-01-27 2006-08-10 Nippon Kurin Gauge Kk 高温液体の液面検知装置
JP2021148496A (ja) * 2020-03-17 2021-09-27 東京エレクトロン株式会社 原料供給装置

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