WO2024041571A9 - 显示模组及显示装置 - Google Patents

显示模组及显示装置 Download PDF

Info

Publication number
WO2024041571A9
WO2024041571A9 PCT/CN2023/114447 CN2023114447W WO2024041571A9 WO 2024041571 A9 WO2024041571 A9 WO 2024041571A9 CN 2023114447 W CN2023114447 W CN 2023114447W WO 2024041571 A9 WO2024041571 A9 WO 2024041571A9
Authority
WO
WIPO (PCT)
Prior art keywords
main body
display panel
display
layer
line segment
Prior art date
Application number
PCT/CN2023/114447
Other languages
English (en)
French (fr)
Other versions
WO2024041571A1 (zh
Inventor
杨武城
梁恒镇
王鑫
蒲乾林
杨成洪
文偲嘉
李凡
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Publication of WO2024041571A1 publication Critical patent/WO2024041571A1/zh
Publication of WO2024041571A9 publication Critical patent/WO2024041571A9/zh

Links

Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G09F9/335Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/35Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Definitions

  • the present disclosure relates to the field of display technology, and in particular to a display module and a display device.
  • a display module in one aspect, includes a display panel, a flexible circuit board and a bonding structure.
  • the display panel has a light-emitting side and a backlight side opposite to the light-emitting side.
  • the display panel includes a protective cover, a display substrate and a heat dissipation film.
  • the display substrate is located between the protective cover and the heat dissipation film, and the protective cover is located on the side of the display substrate facing the light-emitting side.
  • the heat dissipation film includes an adhesive layer, at least one buffer layer and at least one heat dissipation layer.
  • the at least one buffer layer is located between the adhesive layer and the at least one heat dissipation layer, and the adhesive layer is located on the side of the at least one buffer layer close to the protective cover.
  • the flexible circuit board includes a main body, a neck and a connecting part.
  • the neck is located between the main body and the connecting part, and one end of the main body away from the neck is connected to the edge of the display panel.
  • the connecting part, the neck and at least part of the main body are located on the backlight side of the display panel.
  • the bonding structure is located between the main body and the at least one heat dissipation layer, and at least part of the bonding structure is located in the edge area of the main body close to the neck.
  • the bonding structure includes a first bonding structure.
  • the first bonding structure includes a first portion.
  • the first portion is located in an edge area of the main body portion close to the neck portion.
  • the neck portion extends in a first direction, and a ratio of a size of the first portion along the first direction to a size of the main body portion along the first direction is greater than or equal to 10% and less than or equal to 50%.
  • a direction parallel to the display panel and perpendicular to the first direction is a second direction. At least one end of the first portion along the second direction exceeds the neck portion.
  • a dimension of the first portion along the second direction is greater than a dimension of the neck portion along the first direction.
  • two ends of the first portion along the first direction are flush with two ends of an edge region of the main body portion close to the neck portion along the first direction.
  • the first bonding structure further includes a second portion.
  • the second portion is located on a side of the first portion away from the neck portion, and the second portion is connected to the first portion.
  • the ratio of the sum of the dimensions of the first portion and the second portion along the first direction to the dimension of the main body along the first direction is greater than or equal to 50% and less than or equal to 90%.
  • the ratio of the sum of the dimensions of the first portion and the second portion along the first direction to the dimension of the main body along the first direction is equal to 100%.
  • the orthographic projections of both the first portion and the second portion on the display surface of the display panel overlap with the orthographic projection of the main body on the display surface of the display panel.
  • the first bonding structure further includes a third portion.
  • the third portion is connected to the first portion to form a frame-shaped structure extending along the edge of the main body.
  • the bonding structure further includes a second bonding structure.
  • the second bonding structure is located inside the frame-shaped structure, and the second bonding structure and the frame-shaped structure are spaced apart.
  • the adhesive structure further includes a third adhesive structure.
  • the third adhesive structure is located on a side of the first portion away from the neck portion, and the third adhesive structure is spaced apart from the first portion.
  • the third bonding structure includes a plurality of fourth portions, and the plurality of fourth portions are arranged at intervals along the first direction.
  • the main body includes a first side edge close to the neck portion, including: a first line segment, a second line segment, and a third line segment.
  • the second line segment is connected to the neck portion, and the first line segment and the third line segment are respectively located on both sides of the second line segment.
  • the extension direction of the neck portion is the first direction.
  • the direction parallel to the display panel and perpendicular to the first direction is the second direction.
  • At least one of the first line segment and the third line segment extends along the second direction, and the length is greater than or equal to 2 mm.
  • the first line segment and the third line segment both extend along the second direction.
  • the first side further includes a fourth line segment, the fourth line segment is connected between the first line segment and the second line segment, and the middle portion of the fourth line segment protrudes toward the second side.
  • the second side is the opposite side of the first side in the main body.
  • the fourth line segment defines a groove structure, and the size of the groove structure along the second direction is greater than or equal to the size of the groove structure along the first direction.
  • the second line segment extends along the second direction.
  • the angle between the first line segment and the side of the neck portion extending along the first direction is an obtuse angle.
  • the neck portion includes a transition portion close to the main body portion, and the transition portion includes a mesh structure.
  • the transition portion includes a first transition portion and a second transition portion.
  • the first transition portion is closer to the main body portion than the second transition portion.
  • the width of the first transition portion gradually decreases along a third direction.
  • the third direction points from an end of the first transition portion close to the main body portion to an end of the first transition portion away from the main body portion.
  • the at least one buffer layer includes a first buffer layer and a second buffer layer.
  • the first buffer layer is located between the adhesive layer and the second buffer layer.
  • the elastic modulus of the second buffer layer is greater than the elastic modulus of the first buffer layer.
  • the at least one heat dissipation layer includes a first heat dissipation layer and a second heat dissipation layer. The second heat dissipation layer is located on a side of the first heat dissipation layer away from the adhesive layer.
  • the display module further comprises a shielding film.
  • the shielding film is located on a side of the main body away from the display panel.
  • the orthographic projection of the shielding film on the display surface of the display panel covers the orthographic projection of the main body on the display surface of the display panel.
  • at least one side boundary of the orthographic projection of the shielding film on the display surface of the display panel is located outside the orthographic projection of the main body on the display surface of the display panel.
  • the shielding film is orthographically projected on the display surface of the display panel and includes a first boundary close to the neck portion, and the first boundary is located outside the orthographic projection of the main body portion on the display surface of the display panel.
  • the orthographic projection of the shielding film on the display surface of the display panel includes a second boundary; the second boundary is connected to the first boundary and forms an obtuse angle.
  • the second boundary is located outside the orthographic projection of the main body on the display surface of the display panel.
  • the shielding film includes: a first insulating layer, a shielding layer, and a second insulating layer.
  • the shielding layer is located between the first insulating layer and the second insulating layer, and the first insulating layer is closer to the main body than the shielding layer.
  • the thickness of the second insulating layer is greater than or equal to the thickness of the first insulating layer.
  • the display module further includes a driver chip.
  • the driver chip is located on the backlight side of the display panel; the driver chip is used to drive the display panel.
  • the first insulating layer includes a first via hole. The driver chip contacts the shielding layer through the first via hole. In a direction parallel to the display surface of the display panel, a portion of the shielding layer protrudes from the main body and the first insulating layer, so that a portion of the shielding layer contacts the heat dissipation film.
  • the display module further comprises a heat-conducting structure.
  • the heat-conducting structure comprises a first heat-conducting structure and a second heat-conducting structure.
  • the driving chip contacts the shielding layer through the first heat-conducting structure.
  • the shielding layer contacts the heat dissipation film through the second heat-conducting structure.
  • a display device comprising: a display module as described in any of the above embodiments.
  • FIG1 is a structural diagram of a display device according to some embodiments.
  • FIG2A is a structural diagram of a display module according to some embodiments.
  • FIG2B is a structural diagram of a light-emitting side of a display module according to some embodiments.
  • FIG2C is a structural diagram of a backlight side of a display module according to some embodiments.
  • FIG2D is a structural diagram of a display module in a thickness direction according to some embodiments.
  • FIG2E is a cross-sectional view taken along the line M-M' in FIG2C ;
  • FIG. 3A is a diagram showing a connection between a bonding structure and a flexible circuit board according to some embodiments
  • FIG3B is a diagram showing a connection between a bonding structure and a flexible circuit board according to some other embodiments.
  • FIG3C is a diagram showing a connection between a bonding structure and a flexible circuit board according to yet other embodiments.
  • FIG3D is a diagram showing a connection between a bonding structure and a flexible circuit board according to some further embodiments.
  • FIG3E is a diagram showing a connection between a bonding structure and a flexible circuit board according to some further embodiments.
  • FIG3F is a diagram showing a connection between a bonding structure and a flexible circuit board according to yet other embodiments.
  • FIG3G is a diagram showing a connection between a bonding structure and a flexible circuit board according to yet other embodiments.
  • FIG3H is a diagram showing a connection between a bonding structure and a flexible circuit board according to some further embodiments.
  • FIG3I is a diagram showing a bonding structure and a flexible circuit board connection according to some further embodiments.
  • FIG4A is a connection diagram of a main body and a neck portion in a flexible circuit board according to some embodiments
  • FIG4B is a connection diagram of a main body and a neck portion in a flexible circuit board according to some other embodiments.
  • FIG4C is a connection diagram of a main body and a neck portion in a flexible circuit board according to some other embodiments.
  • FIG4D is a connection diagram of a main body and a neck portion in a flexible circuit board according to some further embodiments.
  • FIG4E is a connection diagram of a main body and a neck portion in a flexible circuit board according to some further embodiments.
  • FIG4F is a connection diagram of a main body and a neck portion in a flexible circuit board according to some other embodiments.
  • FIG4G is a connection diagram of a main body and a neck portion in a flexible circuit board according to some other embodiments.
  • Fig. 5A is another cross-sectional view taken along the line M-M' in Fig. 2C;
  • FIG5B is another cross-sectional view taken along the line M-M' in FIG2C ;
  • FIG5C is another cross-sectional view taken along the line M-M' in FIG2C ;
  • FIG6A is a structural diagram of a backlight side of a display module according to some other embodiments.
  • FIG6B is a cross-sectional view taken along the N-N' line in FIG6A;
  • FIG6C is another cross-sectional view taken along the line N-N' in FIG6A;
  • FIG6D is another cross-sectional view taken along the line N-N' in FIG6A;
  • FIG6E is a cross-sectional view taken along line I-I' in FIG6A;
  • FIG6F is a structural diagram of a backlight side of a display module according to yet other embodiments.
  • FIG6G is a cross-sectional view taken along the line F-F' in FIG6F;
  • FIG7A is an exploded view of a display module according to some embodiments.
  • FIG. 7B is an exploded view of a display module according to some other embodiments.
  • first and second are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.
  • a feature defined as “first” or “second” may explicitly or implicitly include one or more of the features.
  • plural means two or more.
  • the expression “connected” and its derivatives may be used.
  • the term “connected” may be used to indicate that two or more components are in direct physical or electrical contact with each other.
  • the term “coupled” may be used to indicate that two or more components are in direct physical or electrical contact.
  • the term “coupled” or “communicatively coupled” may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.
  • At least one of A, B and C has the same meaning and includes the following combinations of A, B and C: only A, only B, only C, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.
  • parallel includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°;
  • perpendicular includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°.
  • equal includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, the difference between the two equals is less than or equal to any one of 30%, 20%, 10% or 5% of either one.
  • Exemplary embodiments are described herein with reference to cross-sectional views and/or plan views that are idealized exemplary drawings.
  • the thickness of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and/or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device, and are not intended to limit the scope of the exemplary embodiments.
  • FIG. 1 is a structural diagram of a display device according to some embodiments.
  • some embodiments of the present disclosure provide a display device 200 , which includes a display module 100 .
  • the display device 200 also includes a frame, a display driver IC (Integrated Circuit), and other electronic accessories.
  • a display driver IC Integrated Circuit
  • the display device 200 may be an electroluminescent display device or a photoluminescent display device.
  • the display device may be a liquid crystal display device (LCD); the display device may also be an electroluminescent display device or a photoluminescent display device.
  • the electroluminescent display device may be an organic light-emitting diode (OLED) or a quantum dot electroluminescent display device (QLED).
  • the display device is a photoluminescent display device
  • the photoluminescent display device may be a quantum dot photoluminescent display device.
  • the display device may also be a Mini LED (Mini Light-Emitting Diode, Mini LED) display device and a Micro LED (Micro Light-Emitting Diode, Micro LED) display device.
  • the display device 200 includes a cover glass, a display panel 10, and a backlight assembly.
  • the backlight assembly is used to provide a light source for the display panel, so that the display panel 10 can display a picture.
  • the backlight module in the display device 200 may also include an optical film, which is located on the side of the light source in the backlight module close to the display panel 10.
  • the optical film may include a reflective sheet, a diffuser, a brightness enhancement film (prism sheet), a diffuser, etc., which can be used to improve the brightness and uniformity of light.
  • the display panel in the display device 200 includes a light-emitting substrate, and the light-emitting substrate can realize picture display.
  • the display device 200 can be any display device that displays images, whether in motion (e.g., video) or fixed (e.g., still images), and whether text or images. More specifically, it is expected that the display device of the embodiments described can be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers/navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigators, cockpit controls and/or displays, displays of camera views (e.g., displays of rear-view cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.
  • PDAs personal data assistants
  • GPS receivers/navigators cameras
  • MP4 video players
  • FIG. 2A is a structural diagram of a display module according to some embodiments.
  • FIG. 2B is a structural diagram of the light-emitting side of a display module according to some embodiments.
  • FIG. 2C is a structural diagram of the backlight side of a display module according to some embodiments.
  • FIG. 2D is a structural diagram of the thickness direction of a display module according to some embodiments.
  • the flexible circuit board 20 in the display module 100 shown in FIG. 2B has not been bent to the backlight side S2 of the display panel 10.
  • the flexible circuit board 20 in the display module 100 shown in FIG. 2A, FIG. 2C and FIG. 2D are all bent to the backlight side S2 of the display panel 10.
  • the display module 100 includes a display panel 10 and a flexible circuit board 20 .
  • the display panel 10 may be an OLED display panel.
  • the embodiment of the present disclosure does not limit the type of the display panel 10 and may be set according to actual needs.
  • the display panel 10 has a light emitting side S1 and a backlight side S2 opposite to the light emitting side S1.
  • the light emitting side S1 and the backlight side S2 are opposite to each other along a third direction Z, and the third direction Z is the direction of the thickness of the display panel 10.
  • the light emitting side S1 can be a side of the display panel 10 used to display light.
  • the backlight side S2 can be a side of the display panel 10 away from the light emitting side S1. That is, the light emitting side S1 is located on the front side of the display panel 10, and the backlight side S2 is located on the back side of the display panel 10.
  • Figure 2E is a cross-sectional view taken along the M-M’ line in Figure 2C.
  • the display panel 10 includes a protective cover plate 101 , a display substrate U and a heat dissipation film 40 .
  • the display substrate U is located between the protective cover plate 101 and the heat dissipation film 40 .
  • the protective cover plate 101 is located on a side of the display substrate U facing the light emitting side S1.
  • the protective cover plate 101 can be used to protect the display panel 10 (display substrate U) and prevent the display panel 10 (display substrate U) from being scratched.
  • the protective cover 101 is a flexible cover, and the material of the protective cover 101 includes at least one of transparent polyimide and ultra-thin glass.
  • the heat dissipation film 40 includes an adhesive layer 41, at least one buffer layer and at least one heat dissipation layer.
  • the at least one buffer layer is located between the adhesive layer 41 and the at least one heat dissipation layer, and the adhesive layer 41 is located on a side of the at least one buffer layer close to the protective cover 101.
  • the buffer layer may be the first buffer layer 42
  • the heat dissipation layer may be the first heat dissipation layer 43. That is, the heat dissipation film 40 includes the adhesive layer 41, the first buffer layer 42 and the first heat dissipation layer 43 as an example.
  • the heat dissipation film 40 can play a role in heat dissipation, which helps to quickly dissipate the heat generated by the display panel 10 when it is working, and can also play a role in shading.
  • the first heat dissipation layer 43 may be connected to the adhesive structure 30 , so that the main body 21 is fixed to the side of the first heat dissipation layer 43 away from the first buffer layer 42 , that is, the main body 21 may be located at the backlight side S2 of the display panel 10 .
  • the heat dissipation film 40 may be super clean foam (SCF for short).
  • the adhesive layer 41 may be a mesh adhesive (EMBO) layer, and the mesh pressure may be applied to the adhesive surface to print vertical and horizontal mesh patterns, which may prevent curling caused by the shrinkage of the adhesive layer and enhance the tightness of the heat dissipation film 40 and the display panel 10.
  • the mesh shape may also facilitate the exhaust of gas during the bonding process to prevent the generation of bubbles during bonding.
  • the adhesive material of the adhesive layer 41 may be acrylic adhesive or silicone.
  • the thickness of the adhesive layer 41 ranges from 0.03 mm to 0.2 mm.
  • the thickness of the adhesive layer 41 is relatively thin, and the adhesive layer 41 can meet the requirements of fixing the heat dissipation film 40 while being more conducive to the thinness of the display module 100 and preventing waste of resources.
  • the thickness of the adhesive layer 41 is equal to or close to 0.2 mm, the thickness of the adhesive layer 41 is thicker, and the adhesive layer 41 can meet the requirements of preventing waste of resources while playing a better role in bonding and fixing the heat dissipation film 40 and the display panel 10.
  • the thickness of the adhesive layer 41 ranges from 0.05 mm to 0.15 mm. In some other embodiments, the thickness of the adhesive layer 41 ranges from 0.08 mm to 0.12 mm.
  • the thickness of the adhesive layer 41 is one of 0.5 mm, 1 mm, 1.5 mm or 2 mm.
  • the material of the first buffer layer 42 may be foam.
  • the first buffer layer 42 may buffer external forces and prevent the display panel 10 from being damaged by the bonding pressure during the bonding process between the heat dissipation film 40 and the display panel 10 .
  • the thickness of the first buffer layer 42 ranges from 0.05 mm to 0.35 mm.
  • the thickness of the first buffer layer 42 is equal to or close to 0.05 mm, it can meet the demand of the display module 100 for buffering external forces while being more conducive to achieving the thinness of the display module 100 and preventing waste of resources.
  • the thickness of the first buffer layer 42 is equal to or close to 0.35 mm, it can meet the demand of the display module 100 for thinness and lightness while having a better buffering effect, preventing the heat dissipation film 40 from damaging the display panel 10 due to the bonding pressure during the bonding process of the display panel 10.
  • the material of the first heat dissipation layer 43 can be one of copper, aluminum or silver, so that the heat dissipation film 40 has a good heat dissipation effect.
  • the material of the first heat dissipation layer 43 can be copper.
  • the flexible printed circuit (FPC) 20 includes a main body 21, a neck 22 and a connecting portion 23.
  • the neck 22 is located between the main body 21 and the connecting portion 23.
  • the substrate in the flexible circuit board 20 may be a flexible substrate.
  • the flexibility of the flexible substrate may be utilized to bend at least a portion of the flexible circuit board 20 to the backlight side S2 of the display panel 10.
  • the connection portion 23, the neck portion 22, and at least a portion of the main body portion 21 in the flexible circuit board 20 are located on the backlight side S2 of the display panel 10.
  • the number of electronic devices on the backlight side S2 of the display panel 10 is relatively small compared to the electronic devices on the light-emitting side S1 of the display panel 10, bending at least a portion of the flexible circuit board 20 to the backlight side S2 of the display panel 10 can not only facilitate the wiring layout of the flexible circuit board 20, but also reduce the occupation of the border of the light-emitting side S1 of the display panel 10 by the flexible circuit board 20, which is conducive to achieving a narrow border of the display panel 10.
  • the material of the flexible substrate in the flexible circuit board 20 may be an organic material.
  • the material of the flexible substrate may be any one of polyimide (PI), polycarbonate (PC), or polyvinyl chloride (PVC).
  • an end Q1 of the main body portion 21 away from the neck portion 22 is connected to an edge Q2 of the display panel 10 .
  • a binding process is used to press one end of the main body 21 of the flexible circuit board 20 away from the neck portion 22 onto the display panel 10 to achieve electrical connection between the flexible circuit board 20 and the display panel 10 .
  • an end Q3 of the connection portion 23 away from the neck portion 22 is connected to the mainboard of the whole machine.
  • connection portion 23 may be a board-to-board connector (BTB).
  • BTB board-to-board connector
  • the board-to-board connector BTB is divided into a female connector (Rece) and a male connector (plug), which are mounted on the connection portion 23 of the flexible circuit board 20 and the overall host, respectively, and are plugged together to achieve electrical connection when in use.
  • the whole machine mainboard can be connected to the display panel 10 through the flexible circuit board 20 to provide a driving signal for the display panel 10.
  • the flexible circuit board 20 needs to be folded and pressed. Under the action of bending stress, the main body 21 of the flexible circuit board 20 and the backlight side S2 of the display panel 10 are easily peeled off, which reduces the stability of the structure of the display module 100 and is not conducive to the subsequent work of the display module 100.
  • the display panel 10 when the display panel 10 is a flexible display panel, the display panel 10 has the advantage of good flexibility.
  • the display panel 10 (display substrate U) includes a display portion, a bending portion and a binding portion, and the bending portion is located between the display portion and the binding portion.
  • the binding portion can be bent to the backlight side S2 of the display panel 10 through the bending portion.
  • the display module 100 may also include a support pad, which is located on the backlight side S2 of the display panel 10. The support pad can be used to support the non-binding portion to prevent the bending portion from breaking.
  • the binding portion of the display panel 10 includes a flexible circuit board 20, that is, when the binding portion is bent to the backlight side S2 of the display panel 10, the flexible circuit board 20 is entirely located on the backlight side S2 of the display panel 10, which can reduce the occupation of the frame of the light-emitting side S1 of the display panel 10 by the flexible circuit board 20, which is conducive to achieving a narrow frame of the display panel 10.
  • the flexible circuit board 20 is peeled off from the backlight side S2 of the display panel 10, which may cause uneven force on the backlight side S2 of the display panel 10, thereby easily causing mold printing problems on the light output side S1 of the display panel 10.
  • Some embodiments of the present disclosure provide a display module 100 further including a bonding structure 30.
  • the bonding structure 30 is located between the main body 21 and the display panel 10, and at least part of the bonding structure 30 is located in the edge area of the main body 21 near the neck 22.
  • An adhesive structure 30 is provided between the main body 21 and at least one heat dissipation layer, which can increase the adhesion between the main body 21 and at least one heat dissipation layer (the backlight side S2 of the display panel 10).
  • the main body 21 of the flexible circuit board 20 and at least one heat dissipation layer (the backlight side S2 of the display panel 10) can be prevented from peeling off due to the need to fold and press the flexible circuit board 20, thereby improving the stability of the structure of the display module 100.
  • it can also prevent the problem of mold printing on the light output side S1 of the display panel 10 due to uneven force on the backlight side S2 of the display panel 10, thereby improving the quality of the display module 100.
  • the adhesive structure 30 is disposed in the edge region W1 of the main body portion 21 close to the neck portion 22 .
  • the adhesive structure 30 is provided in the edge area W1 near the neck 22 of the main body 21, which can increase the adhesion between the edge area W1 and the display panel 10, and can prevent the edge area W1 from being repeatedly pulled up, causing the main body 21 to warp near the neck 22, resulting in the problem of peeling off the display panel 10. Since the tendency of the edge area W1 to be pulled up is slowed down, other positions except the edge area W1 can also be relatively prevented from being pulled up and peeling off the display panel 10. Thereby, the flexible circuit board 20 and the display panel 10 can be better fixed, and the stability of the display module 100 structure can be improved.
  • the material of the bonding structure 30 may be a colloid.
  • the material of the bonding structure 30 may be a transparent optical adhesive.
  • it may be any one of polymethyl methacrylate (PMMA), thermoplastic polyurethanes (TPU), thermoplastic elastomer (TPE), or thermoplastic polyester elastomer (TPEE), or a combination of two or more materials.
  • PMMA polymethyl methacrylate
  • TPU thermoplastic polyurethanes
  • TPE thermoplastic elastomer
  • TPEE thermoplastic polyester elastomer
  • FIG. 3A is a diagram showing a bonding structure and a flexible circuit board connection according to some embodiments.
  • the bonding structure 30 in the display module 100 includes a first bonding structure 31.
  • the first bonding structure 31 includes a first portion 311.
  • the first portion 311 is located in an edge region W1 of the main body 21 close to the neck portion 22.
  • the extension direction of the neck portion 22 is the first direction Y, and the ratio of the dimension D1 of the first portion 311 along the first direction Y to the dimension D2 of the main body 21 along the first direction Y is greater than or equal to 10% and less than or equal to 50%.
  • the ratio of the dimension D1 of the first part 311 of the first adhesive structure 31 along the first direction Y to the dimension D2 of the main body 21 along the first direction Y is equal to or close to 10%, the size of the first part 311 is small, which can prevent the size of the first part 311 from being too large, causing a waste of resources; at the same time, the adhesion between the main body 21 and the display panel 10 is ensured, and the main body 21 is prevented from peeling off the display panel 10.
  • the size of the first part 311 is larger, which can further improve the adhesion between the main body 21 and the display panel 10, prevent the main body 21 from warping, and cause the problem of peeling off the display panel 10; at the same time, it can also prevent the size of the first part 311 from being too large (for example, the ratio is greater than 50%), causing a waste of resources.
  • the extension direction of the neck portion 22 is the first direction Y
  • the ratio of the dimension D1 of the first portion 311 along the first direction Y to the dimension D2 of the main body portion 21 along the first direction Y is greater than or equal to 9% and less than or equal to 30%.
  • the size of the first portion 311 is relatively small, which can prevent the first portion 311 from being too large and causing a waste of resources while ensuring the adhesion between the main body 21 and the display panel 10.
  • the size of the first portion 311 is slightly larger, which can improve the adhesion between the main body 21 and the display panel 10 while preventing the first portion 311 from being too large and causing a waste of resources.
  • the extension direction of the neck portion 22 is the first direction Y
  • the ratio of the dimension D1 of the first portion 311 along the first direction Y to the dimension D2 of the main body portion 21 along the first direction Y is greater than or equal to 8% and less than or equal to 15%.
  • the size of the first portion 311 is smaller, which can prevent the first portion 311 from being too large and causing a waste of resources while ensuring the adhesion between the main body 21 and the display panel 10.
  • the size of the first portion 311 is slightly larger, which can improve the adhesion between the main body 21 and the display panel 10 while preventing the first portion 311 from being too large and causing a waste of resources.
  • the extension direction of the neck portion 22 is the first direction Y
  • the ratio of the dimension D1 of the first part 311 along the first direction Y to the dimension D2 of the main body portion 21 along the first direction Y is equal to one of 10%, 20%, 30%, 40% or 50%.
  • the dimension D2 of the main body 21 along the first direction Y ranges from 50 to 250 mm.
  • the dimension D2 of the main body 21 along the first direction Y is 50 mm.
  • the dimension D1 of the first part 311 along the first direction Y can be set to be greater than or equal to 5 mm.
  • the dimension D1 of the first part 311 along the first direction Y is equal to or close to 5 mm, the dimension of the first part 311 is relatively small, which can prevent the first part 311 from being too large and causing a waste of resources; at the same time, the adhesion between the main body 21 and the display panel 10 is ensured to prevent the main body 21 from peeling off the display panel 10.
  • a dimension D1 of the first portion 311 along the first direction Y is greater than or equal to 10 mm.
  • the first portion 311 When the dimension D1 of the first portion 311 along the first direction Y is equal to or close to 10 mm, the first portion 311 is slightly smaller, which can improve the adhesion between the main body 21 and the display panel 10 while preventing the first portion 311 from being too large and causing resource waste.
  • a dimension D1 of the first portion 311 along the first direction Y is greater than or equal to 20 mm.
  • the dimension of the first portion 311 along the first direction Y is equal to or close to 20 mm
  • the dimension of the first portion 311 can be slightly larger, which can better improve the adhesion between the main body 21 and the display panel 10, and at the same time can also prevent the dimension of the first portion 311 from being too large to a certain extent, thereby causing a waste of resources.
  • the size D1 of the first part 311 along the first direction Y can be further smaller than or equal to the size D2 of the main body 21 along the first direction Y. This prevents the first adhesive structure 31 from overflowing the main body 21 and being exposed to the air, absorbing air impurities and affecting the quality of the first adhesive structure 31. At the same time, it can also prevent the staff from touching the adhesive structure 30 with their fingers during the assembly of the display module 100, thereby affecting the assembly of the display module 100. In addition, it can also avoid the problem of waste of resources.
  • a dimension D1 of the first portion 311 along the first direction Y is one of 5 mm, 8 mm, 10 mm, 15 mm, 20 mm, 25 mm, or 30 mm.
  • FIG. 3B is a diagram showing a connection between a bonding structure and a flexible circuit board according to some other embodiments.
  • the direction parallel to the display panel 10 and perpendicular to the first direction Y is the second direction X. At least one end of the first portion 311 along the second direction X exceeds the neck portion 22 .
  • At least one end of the first portion 311 along the second direction X exceeds the neck portion 22, including the following two situations:
  • the first one is that one end of the first portion 311 along the second direction X exceeds the neck portion 22.
  • the disclosed embodiment does not specifically limit the position of the end of the first portion 311 that exceeds the neck portion 22 along the second direction X.
  • FIG3A is an example in which the first end 31a of the first portion 311 exceeds the neck portion 22. It is understood that in other embodiments, the second end 31b of the first portion 311 may also be arranged to exceed the neck portion 22.
  • the first end 31a and the second end 31b are arranged relatively along the second direction X.
  • the first end 31a of the first part 311 extends beyond the neck portion 22, and the second end 31b is retracted by no more than 50% of the width of the neck portion 22. This is equivalent to the first end 31a of the first part 311 extending beyond the boundary line O between the neck portion 22 and the main body portion 21, and the second end 31b is retracted by no more than 50% of the length of the boundary line O.
  • the tensile stress at the intersection line O between the main body 21 and the neck 22 of the flexible circuit board 20 is relatively large.
  • the tensile stress extends from the neck 22 to the main body 21.
  • the first portion 311 at this part can be used to increase the adhesion between the main body 21 and the display panel 10, resisting the tensile stress at the intersection line O, thereby reducing the probability of the main body 21 being repeatedly pulled up, thereby reducing the problem of the main body 21 peeling off the display panel 10.
  • the second end 31b does not retract more than 80% of the width of the neck portion 22, that is, the second end 31b does not retract more than 80% of the length of the boundary line O.
  • the second end 31b is flush with an end of the neck portion 22 away from the first end 31a.
  • the first portion 311 at this partial position can be utilized to better improve the adhesion between the main body 21 and the display panel 10, resisting partial tensile stress at all boundary line O positions, thereby better reducing the probability of the main body 21 being repeatedly pulled up, thereby reducing the problem of the main body 21 peeling off the display panel 10.
  • both ends of the first portion 311 along the second direction X are beyond the neck portion 22 , which is equivalent to both ends of the first portion 311 being beyond the boundary line O.
  • the first part 311 can be used to increase the adhesion between the main body 21 and the display panel 10, resisting the tensile stress at the intersection O and the intersection O. This can more effectively reduce the probability of the main body 21 being repeatedly pulled up, thereby reducing the problem of the main body 21 being peeled off the display panel 10 .
  • a dimension of the first portion 311 along the second direction X is greater than a dimension of the neck portion 22 along the first direction Y.
  • the dimension of the first portion 311 along the second direction X is set to be greater than the dimension of the neck portion 22 along the first direction Y. This ensures that the first portion 311 does not exceed one end of the neck portion 22, and the retraction degree of the first portion 311 does not exceed 50% of the width of the neck portion 22 as much as possible.
  • the first portion 311 can be used to increase the adhesion between the main body 21 and the display panel 10 to resist partial tensile stress at the boundary line O, thereby more effectively reducing the probability of the main body 21 being repeatedly pulled up, thereby reducing the problem of the main body 21 peeling off the display panel 10.
  • FIG. 3C is a diagram showing a bonding structure and a flexible circuit board connection according to some further embodiments.
  • two ends of the first portion 311 along the first direction Y are substantially flush with two ends of an edge region of the main body 21 close to the neck portion 22 along the first direction Y.
  • the first portion 311 can be used to increase the adhesion between the main body 21 and the display panel 10, resisting the partial tensile stress on the side of the main body 21 close to the neck 22, thereby more effectively reducing the probability of the main body 21 being repeatedly pulled up, thereby reducing the problem of the main body 21 peeling off the display panel 10.
  • approximately flush includes absolute flush and approximately flush. Due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), the distance between the first portion 311 and the two ends of the edge area of the main body 21 near the neck portion 22 along the first direction Y is within the acceptable deviation range, and the two ends of the main body 21 and the first portion 311 can be considered to be approximately flush, wherein the acceptable deviation range can be any one of 30%, 20%, 10% or 5% of any one of them.
  • the adhesive structure 30 may flow to a certain extent due to the material of the adhesive structure 30 .
  • the first portion 311 of the adhesive structure 30 may be set to reserve (retract) a distance relative to both ends of the edge region of the main body 21 close to the neck portion 22 along the first direction Y. This distance is used to compensate for the flow problem of the adhesive structure 30, and prevent the adhesive structure 30 from overflowing to the outside of the main body 21, which may affect the quality of the display module 100.
  • the range of the spacing may be less than or equal to 2 mm.
  • the spacing is equal to or close to 2 mm, sufficient space can be reserved to compensate for the flow problem of the adhesive structure 30, and avoid the adhesive structure 30 overflowing to the outside of the main body 21, which may affect the quality of the display module 100.
  • it can also prevent the spacing between the first portion 311 and the two ends of the main body 21 from being too large, which may affect the adhesion between the edge of the main body 21 and the display panel 10.
  • the range of the spacing may be less than or equal to 1 mm.
  • space can be reserved to compensate for the flow problem of the adhesive structure 30, and prevent the adhesive structure 30 from overflowing to the outside of the main body 21, causing problems affecting the quality of the display module 100.
  • it can also better prevent the spacing between the first part 311 and the two ends of the main body 21 from being too large, affecting the adhesion between the edge of the main body 21 and the display panel 10.
  • the range of the spacing may be less than or equal to 0.5 mm.
  • the spacing can not only meet the problem of compensating the lamination flow of the adhesive structure 30, but also prevent the stickiness between the edge of the main body and the display panel 10, which is beneficial to improving the quality of the display module 100.
  • the spacing may be one of 2 mm, 1.5 mm, 1 mm, 0.8 mm, 0.5 mm, 0.3 mm or 0.1 mm.
  • FIG. 3D is a diagram showing a bonding structure and a flexible circuit board connection according to some further embodiments.
  • the first bonding structure 31 further includes a second portion 312.
  • the second portion 312 is located on a side of the first portion 311 away from the neck portion 22, and the second portion 312 is connected to the first portion 311.
  • the ratio of the sum of the dimensions of the first portion 311 and the second portion 312 along the first direction Y to the dimension of the main body portion 21 along the first direction Y is greater than or equal to 50% and less than or equal to 90%.
  • the ratio of the sum of the dimensions of the first part 311 and the second part 312 along the first direction Y to the dimension of the main body 21 along the first direction Y is equal to or close to 50%, that is, when the ratio of the dimension of the first adhesive structure 31 along the first direction Y to the dimension of the main body 21 along the first direction Y is equal to or close to 50%, the problem of waste of resources caused by the excessive size of the first adhesive structure 31 can be prevented.
  • the requirement for adhesion between the main body 21 and the display panel 10 can be met, the problem of the main body 21 peeling off the display panel 10 can be achieved, the stability of the structure of the display module 100 is improved, and the quality of the display module 100 is improved.
  • the size of the first adhesive structure 31 is larger, which can further increase the adhesion between the main body 21 and the display panel 10, prevent the main body 21 from peeling off the display panel 10, improve the stability of the display module 100 structure, and improve the quality of the display module 100. At the same time, it can also prevent the problem of waste of resources caused by the excessive size of the first adhesive structure 31 to a certain extent.
  • the ratio of the sum of the dimensions of the first portion 311 and the second portion 312 along the first direction Y to the dimension of the main body 21 along the first direction Y is greater than or equal to 60% and less than or equal to 70%.
  • the ratio of the sum of the dimensions of the first portion 311 and the second portion 312 along the first direction Y to the dimension of the main body 21 along the first direction Y is equal to or close to 60%, that is, when the ratio of the dimension of the first adhesive structure 31 along the first direction Y to the dimension of the main body 21 along the first direction Y is equal to or close to 60%, the problem of waste of resources caused by the excessive size of the first adhesive structure 31 can be prevented.
  • the requirement for adhesion between the main body 21 and the display panel 10 can also be met, and the problem of preventing the main body 21 from peeling off the display panel 10 can be achieved.
  • the first adhesive structure 31 has a larger size, which can further increase the adhesion between the main body 21 and the display panel 10, and can prevent the main body 21 from peeling off the display panel 10. At the same time, it can also prevent the problem of waste of resources caused by the excessive size of the first adhesive structure 31 to a certain extent.
  • the ratio of the sum of the dimensions of the first portion 311 and the second portion 312 along the first direction Y to the dimension of the main body 21 along the first direction Y is 50%, 60%, 70%, 80% or 90%.
  • FIG. 3E is a diagram showing a connection between a bonding structure and a flexible circuit board according to yet other embodiments.
  • the first bonding structure 31 further includes a second portion 312.
  • the second portion 312 is located on a side of the first portion 311 away from the neck portion 22, and the second portion 312 is connected to the first portion 311.
  • the ratio of the sum of the dimensions of the first portion 311 and the second portion 312 along the first direction Y to the dimension of the main body portion 21 along the first direction Y is equal to 100%.
  • Such a configuration is equivalent to the sum of the dimensions of the first portion 311 and the second portion 312 along the first direction Y being equal to the dimension of the main body 21 along the first direction Y. That is, the dimension of the first adhesive structure 31 along the first direction Y is equal to the dimension of the main body 21 along the first direction Y.
  • the adhesion between the main body 21 and the display panel 10 can be better increased, and the problem of the main body 21 peeling off the display panel 10 can be prevented. At the same time, the problem of waste of resources caused by the excessive size of the first adhesive structure 31 can be prevented to a certain extent.
  • the thickness of the second portion 312 may be substantially equal to the thickness of the first portion 311 .
  • substantially equal includes absolute equality and approximate equality. Due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), the difference between the thickness of the second part 312 and the thickness of the first part 311 can be within an acceptable deviation range, and the thickness can be considered to be approximately equal. Among them, the acceptable deviation range can be any one of 30%, 20%, 10% or 5%.
  • the second portion 312 and the first portion 311 may be formed integrally, so that the second portion 312 and the first portion 311 may be realized through a one-step process, which is beneficial to simplifying the process of the first bonding structure 31 .
  • the first bonding structure 31 further includes a second part 312.
  • the embodiment of the present disclosure is not limited thereto, and on the basis of the first part 311 shown in FIG3A or FIG3B , the first bonding structure 31 further includes a second part 312.
  • the arrangement can be made according to actual conditions.
  • the orthographic projections of the first portion 311 and the second portion 312 on the display surface of the display panel 10 overlap with the orthographic projection of the main body 21 on the display surface of the display panel 10 .
  • Such an arrangement is equivalent to the orthographic projection of the first adhesive structure 31 on the display surface of the display panel 10 overlapping with the orthographic projection of the main body 21 on the display surface of the display panel 10.
  • the first adhesive structure 31 is provided at any position between the main body 21 and the display panel 10. This can prevent the main body 21 from warping at various positions and peeling off the display panel 10, further improve the stability of the structure of the display module 100, and improve the quality of the display module 100.
  • FIG. 3F is a diagram showing a bonding structure and a flexible circuit board connection according to some further embodiments.
  • the first adhesive structure 31 further includes a third portion 313.
  • the third portion 33 is connected to the first portion 311 to form a frame-shaped structure extending along the edge of the main body 21.
  • the frame-shaped structure is the first adhesive structure 31.
  • the first adhesive structure 31 provided in this embodiment is extended around the edge of the main body 21.
  • the first adhesive structure 31 is arranged to extend around the edge of the main body 21, which can help increase the adhesion between the edge of the main body 21 and the display panel 10, and prevent the edge of the main body 21 from being repeatedly pulled up and warping, thereby causing the problem of peeling from the display panel 10. This is conducive to improving the stability of the display module 100 structure and improving the quality of the display module 100.
  • FIG. 3G is a diagram showing a connection between a bonding structure and a flexible circuit board according to some further embodiments.
  • the adhesive structure 30 further includes a second adhesive structure 32 .
  • the second adhesive structure 32 is located inside the frame structure, and the second adhesive structure 32 and the frame structure are arranged at intervals. That is, on the basis of the first adhesive structure 31 extending around the edge of the main body 21, the adhesive structure 30 also includes the second adhesive structure 32.
  • the second adhesive structure 32 is located inside the frame structure.
  • the first adhesive structure 31 is provided to increase the adhesion between the edge of the main body 21 and the display panel 10.
  • the second adhesive structure 32 is provided to increase the adhesion between the middle of the main body 21 and the display panel 10.
  • the adhesion between the main body 21 and the display panel 10 can be increased by the adhesive structure 30. This prevents the main body 21 from being repeatedly pulled up and warping, thereby causing the problem of peeling from the display panel 10. This is beneficial to improving the stability of the structure of the display module 100 and the quality of the display module 100.
  • the thickness of the first adhesive structure 31 may be set to be in the range of 50 ⁇ m to 200 ⁇ m.
  • the thickness of the first adhesive structure 31 is equal to or close to 50 ⁇ m, the thickness of the first adhesive structure 31 is relatively thin, which can prevent the first adhesive structure 31 from being too thick and affecting the thinness of the display module 100. At the same time, the requirement for adhesion between the main body 21 and the display panel 10 can be guaranteed, the problem of the main body 21 peeling off the display panel 10 can be prevented, and the quality of the display module 100 can be improved.
  • the thickness of the first adhesive structure 31 is equal to or close to 200 ⁇ m, since the viscosity of the adhesive structure 30 is proportional to the thickness, the viscosity of the first adhesive structure 31 can be improved while increasing the thickness of the first adhesive structure 31.
  • the main body 21 and the display panel 10 can better play the role of fixing the main body 21 and the display panel 10, prevent the main body 21 from peeling off the display panel 10, and improve the quality of the display module 100. At the same time, it can also prevent the problem of the first adhesive structure 31 being too thick and affecting the thinness of the display module 100 to a certain extent.
  • the thickness of the first adhesive structure 31 ranges from 80 ⁇ m to 150 ⁇ m.
  • the first adhesive structure 31 When the thickness of the first adhesive structure 31 is equal to or close to 80 ⁇ m, the first adhesive structure 31 is relatively thin, which can prevent the first adhesive structure 31 from being too thick while ensuring the adhesion between the main body 21 and the display panel 10, thereby improving the quality of the display module 100.
  • the thickness of the first adhesive structure 31 When the thickness of the first adhesive structure 31 is equal to or close to 150 ⁇ m, it can better fix the main body 21 and the display panel 10, while preventing the first adhesive structure 31 from being too thick to a certain extent, thereby affecting the thinness of the display module 100.
  • the thickness of the first adhesive structure 31 may be 50 ⁇ m, 80 ⁇ m, 100 ⁇ m, 120 ⁇ m, 150 ⁇ m, 200 ⁇ m or 250 ⁇ m.
  • the thickness of the second adhesive structure 32 may be set to be in a range of 30 ⁇ m to 200 ⁇ m.
  • the thickness of the second adhesive structure 32 is equal to or close to 30 ⁇ m, the thickness of the second adhesive structure 32 is relatively thin, which can prevent the second adhesive structure 32 from being too thick and affecting the thinness of the display module 100. At the same time, the requirement for adhesion between the main body 21 and the display panel 10 can be guaranteed, the problem of the main body 21 peeling off the display panel 10 can be prevented, and the quality of the display module 100 can be improved.
  • the thickness of the second adhesive structure 32 is equal to or close to 200 ⁇ m, since the viscosity of the adhesive structure 30 is proportional to the thickness, the viscosity of the second adhesive structure 32 can be improved while increasing the thickness of the second adhesive structure 32.
  • the main body 21 and the display panel 10 can better play the role of fixing the main body 21 and the display panel 10, prevent the main body 21 from peeling off the display panel 10, and improve the quality of the display module 100. At the same time, it can also prevent the second adhesive structure 32 from being too thick and affecting the thinness of the display module 100 to a certain extent.
  • the thickness of the second adhesive structure 32 is in the range of 50 ⁇ m to 150 ⁇ m.
  • the second adhesive structure 32 When the thickness of the second adhesive structure 32 is equal to or close to 50 ⁇ m, the second adhesive structure 32 is relatively thin, which can prevent the second adhesive structure 32 from being too thick while ensuring the adhesion between the main body 21 and the display panel 10, thereby improving the quality of the display module 100.
  • the thickness of the second adhesive structure 32 When the thickness of the second adhesive structure 32 is equal to or close to 150 ⁇ m, it can better fix the main body 21 and the display panel 10, while preventing the second adhesive structure 32 from being too thick to a certain extent, thereby affecting the thinness of the display module 100.
  • the thickness of the second adhesive structure 32 may be 30 ⁇ m, 50 ⁇ m, 80 ⁇ m, 100 ⁇ m, 120 ⁇ m, 150 ⁇ m, 200 ⁇ m or 250 ⁇ m.
  • the thickness of the first adhesive structure 31 is greater than or equal to the thickness of the second adhesive structure.
  • the first type the thickness of the first adhesive structure 31 is equal to the thickness of the second adhesive structure 32. This arrangement can ensure the flatness of the adhesive structure 30 and simplify the process of the adhesive structure 30. At the same time, it can also ensure the adhesion between the main body 21 and the display panel 10 at various positions, which is conducive to improving the quality of the display module 100.
  • the second type the thickness of the second adhesive structure 32 is less than the thickness of the first adhesive structure 31.
  • the boundary position of the main body 21 of the flexible circuit board 20 is more easily pulled up. Therefore, setting the first adhesive structure 31 relatively thick can better improve the adhesion between the boundary position of the main body 21 and the display panel 10, and prevent the edge position of the main body 21 from being repeatedly pulled up and warping, thereby causing the problem of peeling from the display panel 10. It is beneficial to improve the stability of the display module 100 structure and improve the quality of the display module 100.
  • the thickness of the second adhesive structure 32 can be set relatively thin, which can not only meet the adhesion requirements between the middle of the main body 21 and the display panel 10, but also help save resources.
  • the difference between the thickness of the second adhesive structure 32 and the thickness of the first adhesive structure 31 may be set to be less than 20 ⁇ m.
  • the difference between the thickness of the second adhesive structure 32 and the thickness of the first adhesive structure 31 is less than 10 ⁇ m. This can better prevent the second adhesive structure 32 from being unable to contact the main body 21 and the display panel 10 at the same time due to the large difference between the thickness of the second adhesive structure 32 and the thickness of the first adhesive structure 31, that is, it can not improve the adhesion between the main body 21 and the display panel 10, and can also achieve a certain degree of resource saving.
  • the difference between the thickness of the second adhesive structure 32 and the thickness of the first adhesive structure 31 is 5 ⁇ m, 10 ⁇ m, 15 ⁇ m or 20 ⁇ m.
  • a minimum distance D3 between the first adhesive structure 31 and the second adhesive structure 32 is greater than or equal to 2 mm.
  • the minimum spacing D3 between the first adhesive structure 31 and the second adhesive structure 32 is set to be greater than or equal to 2 mm.
  • there is a gap between each adhesive structure which reduces the amount of material used in the adhesive structure 30 and is conducive to saving resources.
  • the minimum distance D3 between the first adhesive structure 31 and the second adhesive structure 32 is greater than or equal to 2 mm. Sufficient space can be reserved between the first adhesive structure 31 and the second adhesive structure 32.
  • the first adhesive structure 31 can flow into the space to prevent the first adhesive structure 31 from being too thick and affecting the flatness of the adhesive structure 30, thereby affecting the adhesion between the display panel 10 and the main body 21.
  • the minimum distance D3 may be 2 mm, 2.5 mm or 3 mm.
  • the adhesive structure 30 may further include a first auxiliary adhesive structure, and the first auxiliary adhesive structure may also be disposed around the second adhesive structure 32. That is, the first auxiliary adhesive structure may be located between the first adhesive structure 31 and the second adhesive structure 32.
  • providing the first auxiliary adhesive structure can further increase the adhesion between the main body 21 and the display panel 10 , thereby preventing the main body 21 from peeling off the display panel 10 and affecting the stability of the display module 100 structure.
  • the thickness of the first auxiliary adhesive structure may be set to be equal to the thickness of the first adhesive structure 31 and the thickness of the second adhesive structure 32 .
  • the flatness of the bonding structure 30 can be guaranteed, and the process of the bonding structure 30 can be simplified.
  • the adhesion between each position of the main body 21 and the display panel 10 can also be ensured, which is beneficial to improving the quality of the display module 100.
  • the first method is to set the thickness of the first auxiliary adhesive structure to be equal to the thickness of the first adhesive structure 31. Since the first auxiliary adhesive structure can be located between the first adhesive structure 31 and the second adhesive structure 32, that is, located outside the second adhesive structure 32, and the thickness is set equal to that of the first adhesive structure 31 at the outermost edge, the adhesion between the edge of the main body and the display panel 10 can be further increased.
  • the second method is to set the thickness of the first auxiliary adhesive structure to be equal to the thickness of the second adhesive structure 32. Since the first auxiliary adhesive structure can be located between the first adhesive structure 31 and the second adhesive structure 32, that is, the first auxiliary adhesive structure is located inside the first adhesive structure 31 and is set to have the same thickness as the second adhesive structure 32 disposed inside, the adhesion between the main body 21 and the display panel 10 can be improved to a certain extent while saving resources.
  • the thickness of the first auxiliary adhesive structure can be set to be less than the thickness of the first adhesive structure 31, and greater than the thickness of the second adhesive structure 32. Since the first auxiliary adhesive structure can be located between the first adhesive structure 31 and the second adhesive structure 32, the thickness of the first auxiliary adhesive structure is set to be less than the thickness of the first adhesive structure 31, and greater than the thickness of the second adhesive structure 32. This is equivalent to the thickness of the first adhesive structure 31, the first auxiliary adhesive structure, and the second adhesive structure 32 being reduced in sequence. On the one hand, it can improve the adhesion between the main body 21 and the display panel 10 to a certain extent while saving resources. On the other hand, due to the gradual thickness setting of the adhesive structure 30, it can also prevent the problem of uneven surface of the adhesive structure 30 due to the large thickness difference between the adhesive structures, thereby improving the quality of the display module 100.
  • FIG. 3H is a diagram showing a bonding structure and a flexible circuit board connection according to some further embodiments.
  • the adhesive structure 30 further includes a third adhesive structure 33.
  • the third adhesive structure 33 is located on a side of the first portion away from the neck portion 22, and the third adhesive structure 33 is spaced apart from the first portion.
  • the adhesive structure 30 further includes a third adhesive structure 33.
  • the third adhesive structure 33 is arranged on the side of the first part away from the neck part 22.
  • the third adhesive structure 33 can be used to increase the adhesion between the side of the first part away from the neck part 22 and the display panel 10, so as to prevent the edge of the main body 21 from being repeatedly pulled up and warped, thereby causing the problem of peeling from the display panel 10. This is beneficial to improving the stability of the structure of the display module 100 and the quality of the display module 100.
  • 3H illustrates an example in which the side of the third adhesive structure 33 away from the first portion 311 is flush with the edge Q2 of the display panel 10. It is understandable that in other embodiments, it is also possible to provide a gap between the side of the third adhesive structure 33 away from the first portion 311 and the edge Q2 of the display panel 10. This disclosure does not limit this.
  • the thickness of the first portion 311 of the first adhesive structure 31 is greater than or equal to the thickness of the third adhesive structure 33 .
  • the first type the thickness of the first portion 311 of the first adhesive structure 31 is equal to the thickness of the third adhesive structure 33. This arrangement can ensure the flatness of the adhesive structure 30 and simplify the process of the adhesive structure 30. At the same time, it can also ensure the adhesion between the main body 21 and the display panel 10 at various positions, which is conducive to improving the quality of the display module 100.
  • the second type the thickness of the first portion 311 of the first adhesive structure 31 is greater than the thickness of the third adhesive structure 33 .
  • the first adhesive structure 31 is relatively thick, which can better improve the adhesion between the main body 21 near the neck portion 22 and the display panel 10, and prevent the main body 21 at this position from being repeatedly pulled up and warping, thereby causing the problem of peeling from the display panel 10. This is beneficial to improving the stability of the display module 100 structure and the quality of the display module 100.
  • the thickness of the third adhesive structure 33 can be set relatively thin, which can not only meet the adhesion requirements between the middle position of the main body 21 and the display panel 10, but also help save resources.
  • the difference between the thickness of the third adhesive structure 33 and the thickness of the first adhesive structure 31 may be set to be less than 20 ⁇ m.
  • the difference between the thickness of the third adhesive structure 33 and the thickness of the first adhesive structure 31 is less than 10 ⁇ m. This can better prevent the third adhesive structure 33 from being unable to contact the main body 21 and the display panel 10 at the same time due to the difference between the thickness of the third adhesive structure 33 and the thickness of the first adhesive structure 31 being too large, that is, it cannot play a role in improving the adhesion between the main body 21 and the display panel 10, and can also achieve a certain degree of resource saving.
  • the difference between the thickness of the third adhesive structure 33 and the thickness of the first adhesive structure 31 is 5 ⁇ m, 10 ⁇ m, 15 ⁇ m or 20 ⁇ m.
  • a minimum distance D4 between the first adhesive structure 31 and the third adhesive structure 33 is greater than or equal to 2 mm.
  • the minimum distance D4 between the first adhesive structure 31 and the third adhesive structure 33 is set to be greater than or equal to 2 mm.
  • there is a gap between each adhesive structure which reduces the amount of material used in the adhesive structure 30 and is conducive to saving resources.
  • the minimum distance D4 between the first adhesive structure 31 and the third adhesive structure 33 is greater than or equal to 2 mm. Sufficient space can be reserved between the first adhesive structure 31 and the third adhesive structure 33.
  • the first adhesive structure 31 can flow into the space to prevent the first adhesive structure 31 from being too thick and affecting the flatness of the adhesive structure 30, thereby affecting the adhesion between the display panel 10 and the main body 21.
  • the minimum distance D4 may be 2 mm, 2.5 mm or 3 mm.
  • FIG. 3I is a diagram showing a bonding structure and a flexible circuit board connection according to some further embodiments.
  • the third adhesive structure 33 includes a plurality of fourth portions 331 , and the plurality of fourth portions 331 are arranged along the first direction Y at intervals.
  • FIG. 3H is equivalent to that the third adhesive structure 33 includes only one fourth part.
  • the third adhesive structure 33 is divided into a plurality of fourth parts 331.
  • Such a configuration can not only increase the bonding area between the third adhesive structure 33 and the main body 21 and the display panel 10, but also improve the adhesion between the main body 21 and the display panel 10.
  • the plurality of fourth parts 331 are arranged at intervals, which is also conducive to saving resources.
  • 3H illustrates an example in which the third bonding structure 33 includes two fourth parts 331.
  • the embodiment of the present disclosure does not limit the number of the fourth parts 331, and the number can be set according to actual needs.
  • the thicknesses of the fourth portions 331 are all equal, and the thickness of the fourth portions 331 is equal to the thickness of the first portions 311 .
  • Such a configuration can ensure the flatness of the bonding structure 30 and simplify the process of the bonding structure 30 .
  • the adhesion between the main body 21 and the display panel 10 at each position can also be ensured, which is beneficial to improving the quality of the display module 100 .
  • the thickness component of the fourth portion 331 increases in the direction from the main body portion 21 to the neck portion 22, but the thickness of the fourth portion 331 does not exceed the thickness of the first portion 311 in the first bonding structure 31. That is, the thickness component of the third bonding structure 33 increases in the direction from the main body portion 21 to the neck portion 22.
  • the above structure can gradually increase the adhesive force of the adhesive structure 30 in the direction from the main body 21 to the neck portion 22, which can further prevent the problem of warping and peeling of the display panel 10 due to the large tensile stress on the side of the main body 23 close to the neck portion 22.
  • the gradual thickness setting of the adhesive structure 30 it can also prevent the problem of uneven surface of the adhesive structure 30 due to the large thickness difference between the adhesive structures, thereby improving the quality of the display module 100.
  • FIG. 4A is a connection diagram of a main body portion and a neck portion in a flexible circuit board according to some embodiments.
  • the main body 21 includes a first side 210 near the neck portion 22, including: a first line segment 211, a second line segment 212, and a third line segment 213.
  • the second line segment 212 is connected to the neck portion 22, and the first line segment 211 and the third line segment 213 are respectively located on both sides of the second line segment 212.
  • the extension direction of the neck portion 22 is the first direction Y.
  • the direction parallel to the display panel 10 and perpendicular to the first direction Y is the second direction X.
  • At least one of the first line segment 211 and the third line segment 213 extends along the second direction X, and the length is greater than or equal to 2 mm.
  • the main body 21 and the neck 22 may be formed in one piece.
  • the second line segment 212 is a boundary line between the main body 21 and the neck 22 .
  • At least one of the first line segment 211 and the third line segment 213 extends along the second direction X, and has a length greater than or equal to 2 mm. The following three situations are included:
  • the first type As shown in FIG. 4A , the first line segment 211 extends along the second direction X, and the length is greater than or equal to 2 mm. Limiting the length of the first line segment 211 can help increase the width of the left side of the first side 210 of the main body 21, and increase the length of the first side 210 to a certain extent. In this way, the contact area between the main body 21 and the display panel 10 can also be increased. On the basis of setting the adhesive structure 30, the adhesion between the main body 21 and the display panel 10 can be more advantageously increased to prevent the main body 21 at this position from being repeatedly pulled up and warping, thereby causing the problem of peeling from the display panel 10. It is beneficial to improve the stability of the structure of the display module 100 and to improve the quality of the display module 100.
  • the second type As shown in FIG. 4A , the third line segment 213 extends along the second direction X, and the length is greater than or equal to 2 mm. Limiting the length of the third line segment 213 can be beneficial to increasing the width of the right side of the first side 210 of the main body 21, and increasing the length of the first side 210 to a certain extent. In this way, the contact area between the main body 21 and the display panel 10 can also be increased. On the basis of setting the adhesive structure 30, the adhesion between the main body 21 and the display panel 10 can be more advantageously increased to prevent the main body 21 at this position from being repeatedly pulled up and warping, thereby causing the problem of peeling from the display panel 10. It is beneficial to improve the stability of the structure of the display module 100 and to improve the quality of the display module 100.
  • the third type As shown in FIG. 4A , the first line segment 211 and the third line segment 213 both extend along the second direction X, and the length is greater than or equal to 2 mm. Limiting the length of the first line segment 211 and the third line segment 213 can be beneficial to increase the length of both sides of the first side 210 of the main body 21. It can also increase the contact area between the main body 21 and the display panel 10. On the basis of setting the adhesive structure 30, it can be more beneficial to increase the adhesion between the main body 21 and the display panel 10, and prevent the main body 21 at this position from being repeatedly pulled up and warping, thereby causing the problem of peeling from the display panel 10. It is beneficial to improve the stability of the structure of the display module 100 and to improve the quality of the display module 100.
  • the first line segment 211 and the third line segment 213 extends along the second direction X and has a length equal to or close to 2 mm, it is equivalent to at least one end of the main body 21 expanding outward relative to the neck portion 22, which can help the adhesive structure 30 increase the adhesion between this part of the main body 21 and the display panel 10, prevent the first side 210 from easily warping due to the large tensile stress received at the second line segment 212, and improve the quality of the display module 100.
  • At least one of the first line segment 211 and the third line segment 213 extends along the second direction X, and has a length of 2 mm, 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, or 10 mm.
  • the length of the first line segment 211 is substantially equal to the length of the third line segment 213 .
  • the length of the first line segment 211 is set to be substantially equal to the length of the third line segment 213, so that the neck portion 22 is connected to the middle position (second line segment 212) of the first edge 210 of the main body portion 21.
  • the structure of the flexible circuit board 20 is relatively regular, which is conducive to simplifying the process difficulty of the flexible circuit board 20.
  • FIG. 4B is a connection diagram of a main body and a neck portion in a flexible circuit board according to some other embodiments.
  • the length of the first line segment 211 is greater than the length of the third line segment 213 .
  • the length of the first line segment 211 is set to be greater than the length of the third line segment 213.
  • the length of the third line segment 213 is shorter, so that the neck portion 22 of the flexible circuit board 20 can avoid other components to prevent affecting the quality of the display module 100.
  • the length of the first line segment 211 is set to be longer, which can ensure the relative area between the main body 21 and the display panel 10, which can be beneficial for the adhesive structure 30 to increase the viscosity between the main body 21 and the display panel 10, prevent the main body 21 from peeling off the display panel 10, and improve the quality of the display module 100.
  • the length of the first line segment 211 is greater than or equal to 8 mm.
  • the contact area requirement between the main body 21 and the display panel 10 can be met, so that the adhesive structure 30 is provided between the main body 21 and the display panel 10 to increase the adhesion between the main body 21 and the adhesive structure 30. At the same time, it can also prevent the length of the first line segment 211 from being too long, which affects the layout of the flexible circuit board 20.
  • the length of the first line segment 211 is equal to one of 8 mm, 10 mm, 12 mm or 15 mm.
  • FIG. 4C is a connection diagram of a main body portion and a neck portion in a flexible circuit board according to some further embodiments.
  • the length of the first line segment 211 is less than the length of the third line segment 213 .
  • the length of the first line segment 211 is set to be less than the length of the third line segment 213. Among them, the length of the first line segment 211 is shorter, so that the neck portion 22 of the flexible circuit board 20 can avoid other components to prevent affecting the quality of the display module 100.
  • the length of the third line segment 213 is set to be longer, so that the relative area between the main body 21 and the display panel 10 can be guaranteed, which can be beneficial for the adhesive structure 30 to increase the viscosity between the main body 21 and the display panel 10, prevent the main body 21 from peeling off the display panel 10, and improve the quality of the display module 100.
  • the length of the third line segment 213 when the length of the first line segment 211 is less than the length of the third line segment 213 , the length of the third line segment 213 is greater than or equal to 8 mm.
  • the contact area requirement between the main body 21 and the display panel 10 can be met, so that the adhesive structure 30 is provided between the main body 21 and the display panel 10, and the adhesiveness between the main body 21 and the adhesive structure 30 is increased. At the same time, it can also prevent the length of the first line segment 211 from being too long, which affects the layout of the flexible circuit board 20.
  • the length of the third line segment 213 is equal to one of 8 mm, 10 mm, 12 mm or 15 mm.
  • FIG. 4D is a connection diagram of a main body and a neck portion in a flexible circuit board according to some further embodiments.
  • the first line segment 211 and the third line segment 213 both extend along the second direction X.
  • the first side 210 further includes a fourth line segment 214, which is connected between the first line segment 211 and the second line segment 212, and the middle portion of the fourth line segment 214 protrudes toward the second side 215.
  • the second side 215 is the opposite side of the first side 210 in the main body 21.
  • the fourth line segment 214 defines a groove structure C, and the dimension C1 of the groove structure C along the second direction X is greater than or equal to the dimension C2 of the groove structure C along the first direction Y.
  • the first side 210 of the main body 21 further includes a fourth line segment 214, the middle portion of which protrudes toward the second side 215 to form a groove structure C.
  • the fourth line segment 214 is connected between the first line segment 211 and the second line segment 212. That is, the groove structure C is provided on one side of the first line segment 211 close to the second line segment 212.
  • the groove structure C provided at this position can be used to relieve the tensile stress at the positions of the first line segment 211 and the second line segment 212, thereby preventing the first line segment 211 and the second line segment 212 in the main body 21 from being repeatedly pulled up and warped, thereby causing the problem of peeling off from the display panel 10. This is beneficial to improving the stability of the structure of the display module 100 and improving the quality of the display module 100.
  • the dimension C1 of the groove structure C along the second direction X is set to be greater than or equal to the dimension C2 of the groove structure C along the first direction Y. That is, the width C1 of the groove structure C is set to be greater than or equal to the depth C2 of the groove structure C.
  • FIG4D illustrates the example in which the width C1 of the groove structure C is equal to the depth C2 of the groove structure C. It is understandable that in other embodiments, the width C1 of the groove structure C may be set to be greater than the depth C2 of the groove structure C.
  • the width C1 of the groove structure C is greater than or equal to 5 mm.
  • the width C1 of the groove structure C can be larger, which is equivalent to occupying a larger proportion of the first side 210 of the main body 21 in the second direction X, and can better relieve the tensile stress at the positions of the first line segment 211 and the second line segment 212.
  • the depth C2 of the groove structure C is greater than or equal to 2 mm.
  • the depth C2 of the groove structure C can be set to be smaller, which can reduce the proportion of the main body 21 in the first direction Y, and prevent the size inside the main body 21 from being affected, thereby affecting the wiring inside the main body 21 and the layout of components. At the same time, it can also prevent the depth C2 of the groove structure C from being too deep, resulting in greater stress on the bottom of the groove structure C, which may cause problems affecting the quality of the main body 21.
  • the cross-section of the groove structure C may be U-shaped, that is, the bottom of the groove structure C is connected to the side wall of the groove structure C through an arc surface. This can also reduce the tensile stress on the groove structure C and prevent the quality of the flexible circuit board 20 from being affected.
  • the embodiment of the present disclosure does not limit the specific shape of the cross section of the groove structure C, and only takes the U-shape as an example. It is understandable that in other embodiments, the shape of the cross section of the groove structure C can be a semicircle.
  • the length of the first line segment 211 can be greater than or equal to the width C1 of the groove structure C.
  • the first line segment 211 can meet the contact area between the main body 21 and the display panel 10, so that the adhesive structure 30 can be used to increase the adhesion between the main body 21 and the display panel 10, prevent the main body 21 from peeling off the display panel 10, and improve the quality of the display module 100.
  • the length of the first line segment 211 can be greater than or equal to 5 mm.
  • 4D illustrates an example of setting the fourth line segment 214 between the first line segment 211 and the second line segment 212.
  • the present disclosure is not limited thereto, and it is understood that in other embodiments, the fourth line segment 214 may be set between the third line segment 213 and the second line segment 212.
  • the structure of the second line segment 212 may be the same as the structure of the corresponding first line segment 211, and will not be described in detail here.
  • FIG. 4E is a connection diagram of a main body and a neck portion in a flexible circuit board according to some further embodiments.
  • the second line segment 212 extends along the second direction X.
  • the angle ⁇ between the first line segment 211 and the side of the neck portion 22 extending along the first direction Y is an obtuse angle.
  • FIG. 4E illustrates the example of the first line segment 211 and the second direction X having an angle, that is, the first side edge 210 of the flexible circuit board 20 includes a hypotenuse (the first line segment 211) and a straight edge (the second line segment 212 and the third line segment 213).
  • the size of the main body 21 in the flexible circuit board 20 can be relatively reduced, so that other components arranged on the backlight surface of the display panel 10 can be better avoided to avoid short circuits or crosstalk problems.
  • the angle 90° ⁇ 170 When the angle ⁇ is equal to or close to 90°, the first line segment 211 is close to a horizontal state, which can better ensure the size of the main body 21, so that the main body 21 and the display panel 10 can be better fixed by the bonding structure 30. At the same time, some components arranged on the backlight side of the display panel 10 can be avoided to a certain extent. When the angle ⁇ is equal to or close to 170°, the components arranged on the backlight side of the display panel 10 can be better avoided. At the same time, the size requirements of the main body 21 can be met, and the main body 21 and the display panel 10 can be fixed by the bonding structure 30.
  • the angle is 120° ⁇ 150.
  • the angle ⁇ is equal to or close to 120°, some components disposed on the backlight side of the display panel 10 can be avoided to a certain extent while ensuring the size of the main body 21.
  • the angle ⁇ is equal to or close to 150°, the size requirement of the main body 21 can be met while better avoiding the components disposed on the backlight side of the display panel 10.
  • the angle ⁇ is one of 150°, 155°, 160°, 165° or 170°.
  • part of the adhesive structure 30 can be extended along the extension direction of the first line segment 211. This can help increase the adhesion between the main body 21 and the display panel 10 near the first line segment 211, prevent the main body 21 from peeling off the display panel 10, and improve the quality of the display module 100.
  • FIG. 4F is a connection diagram of a main body and a neck portion in a flexible circuit board according to some further embodiments.
  • the neck portion 22 includes a transition portion 220 close to the main body portion 21.
  • the transition portion 220 includes a grid structure T.
  • a grid structure T is provided on the side of the neck portion 22 close to the main body 21, and the grid structure can increase the softness of the side of the neck portion 22 close to the main body 21. Therefore, the grid structure T can be used to alleviate the tensile stress on the main body 21, which is helpful to prevent the main body 21 from peeling off the display panel 10 and improve the quality of the display module 100.
  • the neck portion 22 may include a flexible substrate and a routing layer located on one side of the flexible substrate.
  • the routing layer includes grid routing, and the grid routing is located in the transition portion 220 to form a grid structure T.
  • the present disclosure does not limit the specific signals transmitted by the grid routing, and can be set according to actual conditions.
  • the grid routing of the present disclosure can avoid using routing of high-frequency signals to prevent the problem of high-frequency signal crosstalk.
  • the ratio of the width of a grid line to the gap between adjacent grid lines in the grid structure T is in a range of 1:3 to 1:9.
  • the grid structure T can be used to reduce the tensile stress on the main body 21, which is conducive to preventing the main body 21 from peeling off the display panel 10 and improving the quality of the display module 100.
  • the grid structure T can be used to alleviate the tensile stress on the main body 21, thereby preventing the main body 21 from peeling off the display panel 10 and improving the quality of the display module 100. At the same time, it can also meet the demand of the display module 100 for the number of grid lines.
  • the ratio of the width of a grid line in the grid structure T to the gap between adjacent grid lines is in a range of 1:4 to 1:7.
  • the gap between adjacent grid lines is smaller, which is conducive to setting a larger number of grid lines. At the same time, it can also increase the softness of the side of the neck portion 22 close to the main body portion 21.
  • the gap between adjacent grid lines is larger, which is conducive to better increasing the softness of the side of the neck portion 22 close to the main body portion 21.
  • the demand for the number of grid lines of the display module 100 can also be met.
  • the ratio of the line width of the grid lines in the grid structure T to the gap between adjacent grid lines is one of 1:3, 1:4, 1:5, 1:6, 1:7, 1:8 or 1:9.
  • the transition portion 220 includes a first transition portion 221 and a second transition portion 222.
  • the first transition portion 221 is closer to the main body 21 than the second transition portion 222.
  • the width of the first transition portion 221 close to the main body 21 is greater than the width of the first transition portion 221 away from the main body 21.
  • the width of the neck portion 22 is generally smaller than that of the main body 21, the width of the side where the first transition portion 221 contacts the main body 21 is set wider, which can increase the connection area between the first transition portion 221 and the main body 21, and can disperse the tensile stress received at this position, thereby preventing stress concentration from causing cracks or warping.
  • the width of the first transition portion 221 gradually decreases along the third direction.
  • the third direction is from one end of the first transition portion 221 close to the main body 21 to one end of the first transition portion 221 away from the main body 21 .
  • the gradual width change of the first transition portion 221 can disperse the tensile stress more evenly, which is beneficial to more effectively prevent the problems of stress concentration, cracks or warping.
  • the first transition portion 221 includes a first side 221 a and a second side 221 b that are opposite to each other along the second direction X.
  • the first side 221 a is connected to the first line segment 211
  • the second side 221 b is connected to the third line segment 213 .
  • the angle at which the first side 221a intersects the first line segment 211 is an acute angle
  • the angle at which the second side 221b intersects the third line segment 213 is an acute angle. This is to achieve that the width of the first transition portion 221 close to the main body 21 is greater than the width of the first transition portion 221 away from the main body 21.
  • the width of the side where the first transition portion 221 contacts the main body 21 is wider, increasing the connection area between the first transition portion 221 and the main body 21, and the tensile stress received at this position can be more dispersed to prevent stress concentration, cracks, or warping.
  • first side 221a intersects the first line segment 211 at an angle of 45°
  • second side 221b intersects the third line segment 213 at an angle of 45°. This can increase the width of the side where the first transition portion 221 contacts the main body 21 and simplify the process.
  • FIG. 4G is a connection diagram of a main body and a neck portion in a flexible circuit board according to some further embodiments.
  • the first edge 221 a and the second edge 221 b are both arc-shaped edges.
  • the neck portion 22 is connected to the main body 21 through an arc edge, or a rounded corner design can be provided at the connection position between the neck portion 22 and the main body 21.
  • the arc edge can be further used to disperse the tensile stress at this position, thereby helping to reduce the tensile stress applied to the main body 21. This helps to prevent the main body 21 from peeling off the display panel 10 and improve the quality of the display module 100.
  • FIG5A is a cross-sectional view taken along the M-M’ line in FIG2C .
  • the display module 100 further includes a heat dissipation film 40.
  • the heat dissipation film 40 is located between the display panel 10 and the flexible circuit board 20.
  • the heat dissipation film 40 includes an adhesive layer 41, a first buffer layer 42, and a first heat dissipation layer 43.
  • the first buffer layer 42 is located between the adhesive layer 41 and the first heat dissipation layer 43; the adhesive layer 41 is closer to the display panel 10 than the first buffer layer 42.
  • the adhesive layer 41 on one side of the heat dissipation film 40 is connected to the display panel 10, and the first heat dissipation layer 43 on the other side of the heat dissipation film 40 can be connected to the adhesive structure 30.
  • the heat dissipation film 40 is attached to the backlight side S2 of the display panel 10, which can play a role in heat dissipation, help the heat generated by the display panel 10 when working to be quickly dissipated, and also play a role in light shielding.
  • FIG5A is another cross-sectional view taken along the line M-M’ in FIG2C .
  • At least one buffer layer includes a first buffer layer 42 and a second buffer layer 44. That is, the heat dissipation film 40 in this embodiment may include two buffer layers. The two buffer layers may be the first buffer layer 42 and the second buffer layer 44, respectively.
  • the heat dissipation film 40 includes an adhesive layer 41, a first buffer layer 42, a second buffer layer 44 and a first heat dissipation layer 43.
  • the adhesive layer 41 is closer to the display panel 10 than the first buffer layer 42.
  • the first buffer layer 42 is located between the adhesive layer 41 and the second buffer layer 44.
  • the elastic modulus of the second buffer layer 44 is greater than the elastic modulus of the first buffer layer 42.
  • the adhesive layer 41 on one side of the heat dissipation film 40 is connected to the display substrate U, and the first heat dissipation layer 43 on the other side of the heat dissipation film 40 can be connected to the adhesive structure 30.
  • the first buffer layer 42 and the second buffer layer 44 are located between the adhesive layer 41 and the first heat dissipation layer 43, and the second buffer layer 44 is located between the first buffer layer 42 and the first heat dissipation layer 43. That is, the second buffer layer 44 is farther away from the display substrate U relative to the first buffer layer 42.
  • the elastic modulus of the second buffer layer 44 is set to be greater than the elastic modulus of the first buffer layer 42, and the second buffer layer 44 has better elasticity and recovery performance than the first buffer layer 42.
  • the second buffer layer 44 can be used to resist part of the stress first, and then the remaining part of the stress is applied to the first buffer layer 42, and the first buffer layer 42 is used to buffer this part of the stress to prevent damage to the display panel 10.
  • the material of the second buffer layer 44 can be polyimide (full name: Polyimide, referred to as PI), thermoplastic polyurethanes (Thermoplastic Polyurethanes, Any one of TPU, TPE or TPEE, or a combination of two or more materials.
  • PI polyimide
  • thermoplastic polyurethanes Any one of TPU, TPE or TPEE, or a combination of two or more materials.
  • the present disclosure does not limit this, or other materials with a greater elastic modulus than foam may also be used.
  • the thickness of the second buffer layer 44 ranges from 0.02 mm to 0.2 mm.
  • the thickness of the second buffer layer 44 is equal to or close to 0.02 mm, it can meet the demand of the display module 100 for buffering and recovering external forces, and at the same time, it is more conducive to realizing the thinness of the display module 100 and preventing waste of resources.
  • the thickness of the second buffer layer 44 is equal to or close to 0.2 mm, it can meet the demand of the display module 100 for thinness and lightness, and at the same time, it can play a better buffering and recovering effect, preventing external forces from damaging the display panel 10.
  • the thickness of the second buffer layer 44 ranges from 0.05 mm to 0.18 mm. In some other embodiments, the thickness of the second buffer layer 44 ranges from 0.08 mm to 0.15 mm.
  • the thickness of the second buffer layer 44 is one of 0.05 mm, 0.08 mm, 0.1 mm, 0.12 mm, 0.15 mm, 0.18 mm or 0.2 mm.
  • FIG5B is another cross-sectional view taken along the line M-M’ in FIG2C .
  • At least one heat dissipation layer includes a first heat dissipation layer 43 and a second heat dissipation layer 45. That is, in this embodiment, the heat dissipation film 40 may include two heat dissipation layers, namely, the first heat dissipation layer 43 and the second heat dissipation layer 45.
  • the heat dissipation film 40 includes an adhesive layer 41, a first buffer layer 42, a first heat dissipation layer 43 and a second heat dissipation layer 45.
  • the adhesive layer 41 is closer to the display panel 10 than the first buffer layer 42.
  • the second heat dissipation layer 45 is located on the side of the first heat dissipation layer 43 away from the adhesive layer 41.
  • the adhesive layer 41 on one side of the heat dissipation film 40 is connected to the display substrate U, and the second heat dissipation layer 45 on the other side of the heat dissipation film 40 can be connected to the adhesive structure 30.
  • the first buffer layer 42 and the first heat dissipation layer 43 are located between the adhesive layer 41 and the second heat dissipation layer 45.
  • the second heat dissipation layer 45 is first used to dissipate heat from the display module 100, and then the first heat dissipation layer 43 is used to dissipate heat from the display module 100.
  • the first heat dissipation layer 43 and the second heat dissipation layer 45 can be used together to dissipate heat from the display module 100, so that the heat dissipation film 40 has a better heat dissipation effect.
  • the material of the second heat dissipation layer 45 may be graphite.
  • Figure 5C is another cross-sectional view taken along the M-M’ line in Figure 2C.
  • At least one heat dissipation layer includes a first heat dissipation layer 43 and a second heat dissipation layer 45.
  • At least one buffer layer includes a first buffer layer 42 and a second buffer layer 44. That is, the heat dissipation film 40 in this embodiment may include two buffer layers and two heat dissipation layers. The two buffer layers are respectively the first buffer layer 42 and the second buffer layer 44. The two heat dissipation layers are respectively the first heat dissipation layer 43 and the second heat dissipation layer 45.
  • the heat dissipation film 40 includes an adhesive layer 41, a first buffer layer 42, a second buffer layer 44, a first heat dissipation layer 43, and a second heat dissipation layer 45.
  • the second buffer layer 44 is located between the first buffer layer 42 and the first heat dissipation layer 43.
  • the elastic modulus of the second buffer layer 44 is greater than the elastic modulus of the first buffer layer 42.
  • the second heat dissipation layer 45 is located on a side of the first heat dissipation layer 43 away from the adhesive layer 41.
  • the adhesive layer 41 on one side of the heat dissipation film 40 is connected to the display substrate U, and the second heat dissipation layer 45 on the other side of the heat dissipation film 40 can be connected to the adhesive structure 30.
  • the first buffer layer 42, the second buffer layer 44 and the first heat dissipation layer 43 are located between the adhesive layer 41 and the second heat dissipation layer 45.
  • the second buffer layer 44 can be used to resist part of the stress first, and then the remaining part of the stress is applied to the first buffer layer 42, and the first buffer layer 42 is used to buffer the part of the stress to prevent damage to the display panel 10 (display substrate U).
  • first heat dissipation layer 43 and the second heat dissipation layer 45 can be used to jointly dissipate the heat of the display module 100, so that the heat dissipation film 40 has a better heat dissipation effect.
  • FIG. 6A is a structural diagram of a backlight side of a display module according to some other embodiments.
  • the display module 100 further includes a shielding film 50.
  • the shielding film 50 is located on a side of the main body 21 away from the display panel 10.
  • the orthographic projection of the shielding film 50 on the display surface of the display panel 10 covers the orthographic projection of the main body 21 on the display surface of the display panel 10.
  • the shielding film 50 can be used to shield external electromagnetic influences to ensure the display quality of the display module 100.
  • At least one side boundary B of the orthographic projection of the shielding film 50 on the display surface of the display panel 10 is set, and is located outside the orthographic projection of the main body 21 on the display surface of the display panel 10.
  • the shielding film 50 By setting at least one side boundary B of the orthographic projection of the shielding film 50 on the display surface of the display panel 10, it is located outside the orthographic projection of the main body 21 on the display surface of the display panel 10. That is, the shielding film 50 is set to expand to a certain extent relative to the main body 21. In this way, it can be prevented that in the case of uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), the orthographic projection of the shielding film 50 on the display surface of the display panel 10 cannot cover the orthographic projection of the entire main body 21 on the display surface of the display panel 10. Thereby, the shielding film 50 can be better utilized to shield the electromagnetic influence of the outside world and ensure the display quality of the display module 100.
  • the shielding film 50 is orthogonally projected on the display surface of the display panel 10 and includes a first boundary B1 near the neck portion 22 .
  • the first boundary B1 is located outside the orthogonal projection of the body portion 21 on the display surface of the display panel 10 .
  • the first boundary B1 of the orthographic projection of the shielding film 50 on the display surface of the display panel 10 is arranged to be located outside the orthographic projection of the main body 21 on the display surface of the display panel 10. That is, it is equivalent to that the shielding film 50 is expanded outward on the side close to the neck portion 22, and the orthographic projection of the shielding film 50 on the display surface of the display panel 10 may also cover a part of the orthographic projection of the neck portion 22 on the display surface of the display panel 10.
  • the shielding film 50 is located on the side of the flexible circuit board 20 away from the display panel 10, and the shielding film 50 is projected orthogonally on the display surface of the display panel 10, it can also cover the orthogonal projection of part of the neck portion 22 on the display surface of the display panel 10. Furthermore, the shielding film 50 can be used to fix the main body 21, prevent the main body 21 from being easily peeled off the display panel 10, and improve the quality of the display module 100.
  • the orthographic projection of the shielding film 50 on the display surface of the display panel 10 includes a second boundary B2.
  • the second boundary B2 is connected to the first boundary B1 and forms an obtuse angle.
  • the second boundary B is located outside the orthographic projection of the main body 21 on the display surface of the display panel 10.
  • the second boundary B2 of the shielding film 50 is also expanded relative to the main body 21, and the second boundary B2 is connected to the first boundary B1 and is at an obtuse angle.
  • the area P formed by the second boundary B2 and the first boundary B1 can be used to expand the end angle position J on the side of the main body 21 close to the neck portion 22.
  • the structure of the shielding film 50 as described above can utilize the area P formed by the second boundary B2 and the first boundary B1 of the shielding film 50 to play a role in fixing the end corner position J of the main body 21, further preventing the main body 21 from easily peeling off the display panel 10, and improving the quality of the display module 100.
  • the minimum distance between the orthographic projection of the first boundary B1 on the display surface of the display panel 10 and the orthographic projection of the corresponding edge of the main body 21 on the display surface of the display panel 10 is in the range of 2 mm to 15 mm.
  • the shielding film 50 When the minimum spacing is equal to or close to 2 mm, the shielding film 50 has a small outward expansion, which can effectively prevent waste of resources while shielding the electromagnetic influence of the outside world and fixing the main body 21. When the minimum spacing is equal to or close to 15 mm, the shielding film 50 has a large outward expansion, which can better shield the electromagnetic influence of the outside world and fix the main body 21 while preventing waste of resources, thereby improving the quality of the display module 100.
  • the minimum distance between the orthographic projection of the first boundary B1 on the display surface of the display panel 10 and the orthographic projection of the corresponding edge of the main body 21 on the display surface of the display panel 10 is in the range of 3.5 mm to 10 mm. In some other embodiments, the minimum distance between the orthographic projection of the first boundary B1 on the display surface of the display panel 10 and the orthographic projection of the corresponding edge of the main body 21 on the display surface of the display panel 10 is in the range of 5 mm to 8 mm.
  • the minimum distance between the orthographic projection of the first boundary B1 on the display surface of the display panel 10 and the orthographic projection of the corresponding edge of the main body 21 on the display surface of the display panel 10 is one of 2mm, 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm or 10mm.
  • FIG6B is a cross-sectional view taken along the N-N’ line in FIG6A .
  • the shielding film 50 includes: a first insulating layer 51, a shielding layer 52 and a second insulating layer 53.
  • the shielding layer 52 is located between the first insulating layer 51 and the second insulating layer 53, and the first insulating layer 51 is closer to the flexible circuit board 20 than the shielding layer 52.
  • the first insulating layer 51 is closer to the flexible circuit board 20 than the shielding layer 52, and can be used to insulate the flexible circuit board 20 from the shielding layer 52 to prevent a short circuit between the flexible circuit board 20 and the shielding layer 52. At the same time, the first insulating layer 51 can also be used to bond and fix to the flexible circuit board 20 and the shielding layer 52, respectively.
  • the first insulating layer 51 may be an insulating glue layer.
  • the thickness of the first insulating layer 51 ranges from 10 ⁇ m to 100 ⁇ m.
  • the shielding layer 52 and the flexible circuit board 20 can be fixedly bonded.
  • the thickness of the first insulating layer 51 is relatively thin, it can also be beneficial to the thinness of the display module 100 and avoid waste of resources.
  • the thickness of the first insulating layer 51 is equal to or close to 100 ⁇ m, it can prevent waste of resources.
  • the first insulating layer 51 since the thickness of the first insulating layer 51 is relatively thick, the first insulating layer 51 has stronger viscosity, which can better fix the shielding layer 52 and the flexible circuit board 20.
  • the thickness of the first insulating layer 51 ranges from 20 ⁇ m to 50 ⁇ m.
  • the thickness of the first insulating layer 51 is one of 10 ⁇ m, 20 ⁇ m, 30 ⁇ m, 40 ⁇ m or 50 ⁇ m.
  • the second insulating layer 53 is located on a side of the shielding layer 52 away from the first insulating layer 51, and the second insulating layer 53 is located on the outermost side of the shielding film 50.
  • the second insulating layer 53 can be used to protect the shielding layer 52.
  • the material of the first insulating layer 51 may be the same as that of the second insulating layer 53, both of which are insulating adhesive layers. In other examples, the material of the first insulating layer 51 may be different from that of the second insulating layer 53. This disclosure does not limit this.
  • the thickness of the second insulating layer 53 ranges from 20 ⁇ m to 100 ⁇ m.
  • the protective shielding layer 52 can be fixed.
  • the thickness of the second insulating layer 53 is relatively thin, it can also be beneficial to the thinness of the display module 100 and avoid waste of resources.
  • the thickness of the second insulating layer 53 is equal to or close to 100 ⁇ m, it can prevent waste of resources.
  • the thickness of the second insulating layer 53 is relatively thick, the viscosity of the second insulating layer 53 is stronger, and the shielding layer 52 can be better fixed and bonded.
  • the thickness of the first insulating layer 51 ranges from 30 ⁇ m to 50 ⁇ m.
  • the thickness of the first insulating layer 51 is one of 10 ⁇ m, 20 ⁇ m, 30 ⁇ m, 40 ⁇ m or 50 ⁇ m.
  • the thickness of the second insulating layer 53 is set to be greater than or equal to the thickness of the first insulating layer 51 .
  • the first type as shown in FIG. 6B , the thickness of the second insulating layer 53 is equal to the thickness of the first insulating layer 51 .
  • the second type the thickness of the second insulating layer 53 is greater than the thickness of the first insulating layer 51 .
  • the outer second insulating layer 53 is thicker to better protect the shielding layer 52 and the display module 100.
  • the inner first insulating layer 51 is thinner to save insulating layer resources when bonding the flexible circuit board 20 and the shielding layer 52.
  • Fig. 6C is another cross-sectional view taken along the N-N' direction in Fig. 6A.
  • Fig. 6D is another cross-sectional view taken along the N-N' direction in Fig. 6A.
  • the shielding film 50 when the shielding film 50 includes: a first insulating layer 51, a shielding layer 52, and a second insulating layer 53: at least one of the first insulating layer 51, the shielding layer 52, and the second insulating layer 53 can be arranged outside the orthographic projection of the main body 21 on the display surface of the display panel 10 at at least one boundary of the orthographic projection of the display surface of the display panel 10.
  • the film layer that expands outward in the shielding film 50 can be used to fix the main body 21, prevent the main body 21 from easily peeling off the display panel 10, and improve the quality of the display module 100.
  • FIG6B illustrates the expansion of the second insulating layer 53 as an example.
  • FIG6C illustrates the expansion of the shielding layer 52 as an example.
  • FIG6D illustrates the expansion of the first insulating layer 51 as an example.
  • the disclosed embodiment is not limited thereto, and any two layers of the shielding film 50 may be expanded, or all three layers may be expanded.
  • FIG6E is a cross-sectional view taken along line I-I’ in FIG6A .
  • the display module 100 further includes a driver chip 60.
  • the driver chip 60 is located on the backlight side S2 of the display panel 10.
  • the driver chip 60 is used to drive the display panel 10.
  • the first insulating layer 51 includes a first via K.
  • the driver chip 60 contacts the shielding layer 52 through the first via K. In a direction parallel to the display surface of the display panel 10, a portion of the shielding layer 52 protrudes from the flexible circuit board 20 and the first insulating layer 51, so that a portion of the shielding layer 52 contacts the heat dissipation film 40.
  • the driver chip 60 drives the display panel 10, and the driver chip 60 generates heat. Since the driver chip 60 contacts the shielding layer 52 through the first via K, and part of the shielding layer 52 contacts the heat dissipation film 40. At this time, the heat generated by the driver chip 60 will be conducted to the shielding layer 52, and the shielding layer 52 will conduct the part of the heat to the heat dissipation film 40. Thus, the heat dissipation film 40 can be used to dissipate heat from the driver chip 60. This prevents the driver chip 60 from being too hot, which will affect the performance and life of the driver chip 60.
  • FIG6E is illustrated by taking the shielding layer 52 as an example in which the shielding layer 52 is expanded and the first insulating layer 51 is not expanded. So that part of the shielding layer 52 is in contact with the heat dissipation film 40. At this time, the second insulating layer 53 can be set to expand outward, and the degree of expansion of the second insulating layer 53 has no effect on the contact between part of the shielding layer 52 and the heat dissipation film 40, and can be set flexibly.
  • the first insulating layer 51 when the first insulating layer 51 is also expanded outward, and the first insulating layer 51 is provided between the shielding layer 52 and the heat dissipation film 40, the first insulating layer 51 can be provided with a second via hole, so that part of the shielding layer 52 is in contact with the heat dissipation film 40 through the second via hole.
  • Fig. 6F is a structural diagram of the backlight side of the display module according to some other embodiments.
  • Fig. 6G is a cross-sectional diagram taken along the line F-F' in Fig. 6F.
  • the display module 100 further includes a driver chip 60.
  • the driver chip 60 is located on the backlight side S2 of the display panel 10” may include the following two situations:
  • the display panel 10 (display substrate U) includes a display portion and a binding portion.
  • the binding portion includes a flexible circuit board 20.
  • the flexible circuit board 20 can be bent to the backlight side of the display panel 10.
  • the driver chip 60 can be fixed on the flexible circuit board 20 by using COF (Chip On Film) technology. Further, the driver chip 60 is arranged at one end of the main body 21 close to the neck portion 22. Thus, the driver chip 60 is bent along the main body 21 to the backlight side of the display panel 10. Thus, the driver chip 60 and the flexible circuit board 20 can reduce the occupation of the frame of the light-emitting side S1 of the display panel 10, which is conducive to realizing a narrow frame of the display panel 10 and improving the screen-to-body ratio of the display module 100.
  • COF Chip On Film
  • the display panel 10 is a flexible display panel.
  • the display panel 10 (display substrate) includes a display portion 11, a bending portion 12, and a binding portion 13.
  • the bending portion 12 is located between the display portion 11 and the binding portion 13.
  • the binding portion 13 includes a flexible circuit board 20. The binding portion of the display panel 10 can be bent to the backlight side S2 of the display panel 10 using the bending portion 12.
  • the driving chip 60 can be fixed on the binding part using COP (Chip on Panel) technology, and the driving chip 60 is closer to the bending part 12 than the flexible circuit board 20.
  • COP Chip on Panel
  • the flexible circuit board 20 and the driving chip 60 can be bent to the backlight side of the display panel 10 along with the binding portion.
  • the driver chip 60 and the flexible circuit board 20 can reduce the occupation of the frame of the light-emitting side S1 of the display panel 10, which is conducive to realizing a narrow frame of the display panel 10 and improving the screen-to-body ratio of the display module 100.
  • FIG. 6E is illustrated by taking the display module shown in FIG. 6A as an example, but is not limited thereto.
  • the structure shown in FIG. 6E may also be applicable to the display module 100 shown in FIG. 6F .
  • the minimum distance between the driver chip 60 and the first via hole K is 0.5 mm to 2 mm in the direction parallel to the display surface of the display panel 10.
  • the first via hole K is set larger to facilitate the alignment and installation of the driver chip 60.
  • the minimum distance between the driving chip 60 and the first via hole K is equal to or close to 0.5 mm, It is possible to facilitate the alignment and installation of the driver chip 60 while preventing the size of the first via K from being too large, which may easily cause a short circuit between the shielding layer 52 and the flexible circuit board 20.
  • the minimum spacing between the driver chip 60 and the first via K is equal to or close to 2 mm, it is possible to prevent the size of the first via K from being too small, which may be unfavorable for the alignment and installation of the driver chip 60, while preventing the problem of easily causing a short circuit between the shielding layer 52 and the flexible circuit board 20.
  • the minimum spacing between the driver chip 60 and the first via hole K is 0.8 mm to 1.8 mm in a direction parallel to the display surface of the display panel 10. In still other embodiments, the minimum spacing between the driver chip 60 and the first via hole K is 1 mm to 1.5 mm in a direction parallel to the display surface of the display panel 10.
  • a minimum spacing between the driving chip 60 and the first via hole K is one of 0.2 mm, 0.5 mm, 0.8 mm, 1 mm, 1.2 mm, 1.5 mm, 1.8 mm or 2 mm.
  • the display module 100 further includes a heat-conducting structure 70.
  • the heat-conducting structure 70 includes a first heat-conducting structure 71 and a second heat-conducting structure 72.
  • the driving chip 60 contacts the shielding layer 52 through the first heat-conducting structure 71.
  • the shielding layer 52 contacts the heat dissipation film 40 through the second heat-conducting structure 72.
  • the first heat-conducting structure 71 makes the driving chip 60 indirectly contact with the shielding layer 52 , fixes the driving chip 60 and the shielding layer 52 , so that the heat generated by the driving chip 60 during operation can be conducted to the shielding layer 52 through the first heat-conducting structure 71 .
  • the shielding layer 52 is indirectly in contact with the heat dissipation film 40 through the second heat-conducting structure 72, and the shielding layer 52 and the heat dissipation film 40 are fixed, so that the heat from the driver chip 60 to the shielding layer 52 can be conducted to the heat dissipation film 40 through the second heat-conducting structure 72. Finally, the heat dissipation film 40 is used to dissipate the heat, so as to prevent the driver chip 60 from being too hot and affecting the performance and life of the driver chip 60.
  • the material of the first heat-conducting structure 71 and the material of the second heat-conducting structure 72 may be the same, both of which are heat-conducting adhesives. It is understood that in other embodiments, the material of the first heat-conducting structure 71 and the material of the second heat-conducting structure 72 may also be different. The present disclosure does not limit this, as long as it can be used to play the role of bonding and heat conduction.
  • FIG. 7A is an exploded view of a display module according to some embodiments.
  • FIG. 7B is an exploded view of a display module according to other embodiments.
  • FIG. 7A is illustrated by taking a display module using COF technology as an example.
  • FIG. 7B is illustrated by taking a display module using COP technology as an example.
  • the display panel 10 further includes a first optical adhesive layer 102 and a polarizer 103 .
  • the polarizer 103 is located between the display substrate 101 and the protective cover 101.
  • the polarizer 103 may be a circular polarizer.
  • the polarizer 103 may reduce external light emission and prevent the display panel 10 from generating a glare effect.
  • the first optical adhesive layer 102 is located between the protective cover plate 101 and the polarizer 103.
  • the protective cover plate 101 and the polarizer 103 are fixedly bonded by the first optical adhesive layer 102.
  • the material of the first optical adhesive layer 102 includes a heat-fixing resin adhesive or a light-curable resin.
  • the material of the first optical adhesive layer 102 is OCA optical adhesive (Optical Clear Adhesive).

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

公开了一种显示模组。所述显示模组包括显示面板、柔性线路板和粘接结构。所述显示面板具有出光侧以及与所述出光侧相对的背光侧。所述柔性线路板包括主体部、脖子部和连接部。所述脖子部位于主体部和连接部之间,所述主体部远离所述脖子部的一端与所述显示面板边缘连接。所述连接部、所述脖子部以及至少部分所述主体部位于所述显示面板的背光侧。所述粘接结构位于所述主体部和所述显示面板之间,且所述粘接结构的至少部分位于所述主体部中靠近所述脖子部的边缘区域。

Description

显示模组及显示装置
本申请要求于2022年8月24日提交的、申请号为202211021607.9的中国专利申请的优先权,其全部内容通过引用结合在本申请中。
技术领域
本公开涉及显示技术领域,尤其涉及一种显示模组及显示装置。
背景技术
随着科学技术的不断发展,越来越多的显示装置被广泛的应用到人们的日常生活以及工作当中,为人们的日常生活以及工作带来了巨大的便利,成为当今人们不可或缺的重要工具。
发明内容
一方面,提供一种显示模组。所述显示模组包括显示面板、柔性线路板和粘接结构。所述显示面板具有出光侧以及与所述出光侧相对的背光侧。所述显示面板包括保护盖板、显示基板和散热膜。所述显示基板位于所述保护盖板和所述散热膜之间,且所述保护盖板位于所述显示基板朝向所述出光侧的一侧。所述散热膜包括粘接层、至少一层缓冲层和至少一层散热层。所述至少一层缓冲层位于所述粘接层和所述至少一层散热层之间,且所述粘接层位于所述至少一层缓冲层靠近保护盖板的一侧。所述柔性线路板包括主体部、脖子部和连接部。所述脖子部位于主体部和连接部之间,所述主体部远离所述脖子部的一端与所述显示面板边缘连接。所述连接部、所述脖子部以及至少部分所述主体部位于所述显示面板的背光侧。所述粘接结构位于所述主体部和所述至少一层散热层之间,且所述粘接结构的至少部分位于所述主体部中靠近所述脖子部的边缘区域。
在一些实施例中,所述粘接结构包括第一粘接结构。所述第一粘接结构包括第一部分。所述第一部分位于所述主体部中靠近所述脖子部的边缘区域。所述脖子部的延伸方向为第一方向,所述第一部分沿第一方向的尺寸与所述主体部沿第一方向的尺寸的比值大于或等于10%,且小于或等于50%。
在一些实施例中,平行于所述显示面板且垂直于所述第一方向的方向为第二方向。所述第一部分沿所述第二方向的至少一端超出所述脖子部。
在一些实施例中,所述第一部分沿所述第二方向的尺寸,大于所述脖子部沿所述第一方向的尺寸。
在一些实施例中,所述第一部分沿所述第一方向的两端与所述主体部中靠近所述脖子部的边缘区域沿所述第一方向的两端平齐。
在一些实施例中,所述第一粘接结构还包括第二部分。所述第二部分位于所述第一部分远离所述脖子部的一侧,且所述第二部分与所述第一部分相连。其中,所述第一部分和所述第二部分沿第一方向的尺寸之和,与所述主体部沿第一方向的尺寸的比值大于或等于50%,且小于或等于90%。或者,所述第一部分和所述第二部分沿第一方向的尺寸之和,与所述主体部沿第一方向的尺寸的比值等于100%。
在一些实施例中,所述第一部分和所述第二部分两者在所述显示面板的显示面的正投影,与所述主体部在所述显示面板的显示面的正投影重叠。
在一些实施例中,所述第一粘接结构还包括第三部分。所述第三部分与所述第一部分相连,以围设成沿所述主体部的边缘延伸的框形结构。
在一些实施例中,所述粘接结构还包括第二粘接结构。所述第二粘接结构位于所述框形结构的内侧,所述第二粘接结构和所述框形结构间隔设置。
在一些实施例中,所述粘接结构还包括第三粘接结构。所述第三粘接结构位于所述第一部分远离所述脖子部的一侧,且所述第三粘接结构与所述第一部分间隔设置。
在一些实施例中,所述第三粘接结构包括多个第四部分,所述多个第四部分沿所述第一方向间隔排布。
在一些实施例中,所述主体部包括靠近所述脖子部一侧的第一侧边包括:第一线段、第二线段和第三线段。所述第二线段与所述脖子部连接,所述第一线段和所述第三线段分别位于所述第二线段的两侧。所述脖子部的延伸方向为第一方向。平行于所述显示面板且垂直于所述第一方向的方向为第二方向。所述第一线段与所述第三线段中的至少一个,沿所述第二方向延伸,且长度大于或等于2mm。
在一些实施例中,所述第一线段和所述第三线段均沿所述第二方向延伸。所述第一侧边还包括第四线段,所述第四线段连接于所述第一线段与所述第二线段之间,所述第四线段的中间部位向第二侧边凸出。所述第二侧边为所述主体部中所述第一侧边的对边。所述第四线段限定出槽结构,所述槽结构沿所述第二方向的尺寸大于或等于所述槽结构沿所述第一方向的尺寸。
在一些实施例中,所述第二线段沿所述第二方向延伸。所述第一线段与所述脖子部中沿所述第一方向延伸的侧边之间的夹角为钝角。
在一些实施例中,所述脖子部中包括靠近所述主体部的过渡部。所述过渡部包括网格结构。
在一些实施例中,所述过渡部包括第一过渡部和第二过渡部。所述第一过渡部相对于所述第二过渡部更靠近所述主体部。所述第一过渡部的宽度沿第三方向逐渐减小。所述第三方向由所述第一过渡部靠近所述主体部的一端指向所述第一过渡部远离所述主体部的一端。
在一些实施例中,所述至少一层缓冲层包括第一缓冲层和第二缓冲层。所述第一缓冲层位于所述粘接层和所述第二缓冲层之间。所述第二缓冲层的弹性模量大于所述第一缓冲层的弹性模量。和/或,所述至少一层散热层包括第一散热层和第二散热层。所述第二散热层位于所述第一散热层远离所述粘接层的一侧。
在一些实施例中,所述显示模组还包括屏蔽膜。所述屏蔽膜位于所述主体部远离所述显示面板的一侧。所述屏蔽膜在所述显示面板的显示面的正投影覆盖所述主体部在所述显示面板的显示面的正投影。且所述屏蔽膜在所述显示面板的显示面的正投影的至少一侧边界,位于所述主体部在所述显示面板的显示面的正投影的外部。
在一些实施例中,所述屏蔽膜在所述显示面板的显示面正投影,包括靠近所述脖子部的第一边界。所述第一边界位于所述主体部在所述显示面板的显示面的正投影的外部。
在一些实施例中,所述屏蔽膜在所述显示面板的显示面的正投影,包括第二边界;所述第二边界与所述第一边界相连,且呈钝角。所述第二边界位于所述主体部在所述显示面板的显示面的正投影的外部。
在一些实施例中,所述屏蔽膜包括:第一绝缘层、屏蔽层和第二绝缘层。所述屏蔽层位于所述第一绝缘层和所述第二绝缘层之间,且所述第一绝缘层相对于所述屏蔽层更靠近所述主体部。所述第二绝缘层的厚度大于或等于所述第一绝缘层的厚度。
在一些实施例中,所述显示模组还包括驱动芯片。所述驱动芯片位于所述显示面板的背光侧;所述驱动芯片用于驱动所述显示面板。所述第一绝缘层包括第一过孔。所述驱动芯片穿过所述第一过孔与所述屏蔽层接触。在平行于所述显示面板的显示面的方向上,所述屏蔽层的部分凸出于所述主体部和所述第一绝缘层,以使所述屏蔽层的部分与所述散热膜接触。
在一些实施例中,所述显示模组还包括导热结构。所述导热结构包括第一导热结构和第二导热结构。所述驱动芯片通过所述第一导热结构与所述屏蔽层接触。所述屏蔽层通过第二导热结构与所述散热膜接触。
另一方面,提供一种显示装置。所述显示装置包括:如上述任一实施例所述的显示模组。
附图说明
为了更清楚地说明本公开中的技术方案,下面将对本公开一些实施例中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本公开的一些实施例的附图,对于本领域普通技术人员来讲,还可以根据这些附图获得其他的附图。此外,以下描述中的附图可以视作示意图,并非对本公开实施例所涉及的产品的实际尺寸、方法的实际流程、信号的实际时序等的限制。
图1为根据一些实施例的显示装置的结构图;
图2A为根据一些实施例的显示模组的结构图;
图2B为根据一些实施例的显示模组的出光侧的结构图;
图2C为根据一些实施例的显示模组的背光侧的结构图;
图2D为根据一些实施例的显示模组的厚度方向的结构图;
图2E为图2C中M-M’向的一种剖面图;
图3A为根据一些实施例的粘接结构和柔性线路板连接图;
图3B为根据另一些实施例的粘接结构和柔性线路板连接图;
图3C为根据又一些实施例的粘接结构和柔性线路板连接图;
图3D为根据又一些实施例的粘接结构和柔性线路板连接图;
图3E为根据又一些实施例的粘接结构和柔性线路板连接图;
图3F为根据又一些实施例的粘接结构和柔性线路板连接图;
图3G为根据又一些实施例的粘接结构和柔性线路板连接图;
图3H为根据又一些实施例的粘接结构和柔性线路板连接图;
图3I为根据又一些实施例的粘接结构和柔性线路板连接图;
图4A为根据一些实施例的柔性线路板中主体部和脖子部的连接图;
图4B为根据另一些实施例的柔性线路板中主体部和脖子部的连接图;
图4C为根据又一些实施例的柔性线路板中主体部和脖子部的连接图;
图4D为根据又一些实施例的柔性线路板中主体部和脖子部的连接图;
图4E为根据又一些实施例的柔性线路板中主体部和脖子部的连接图;
图4F为根据又一些实施例的柔性线路板中主体部和脖子部的连接图;
图4G为根据又一些实施例的柔性线路板中主体部和脖子部的连接图;
图5A为图2C中M-M’向的另一种剖面图;
图5B为图2C中M-M’向的又一种剖面图;
图5C为图2C中M-M’向的又一种剖面图;
图6A为根据另一些实施例的显示模组的背光侧的结构图;
图6B为图6A中N-N’向的一种剖面图;
图6C为图6A中N-N’向的另一种剖面图;
图6D为图6A中N-N’向的又一种剖面图;
图6E为图6A中I-I’向的一种剖面图;
图6F为根据又一些实施例的显示模组的背光侧的结构图;
图6G为图6F中F-F’向的一种剖面图;
图7A为根据一些实施例的显示模组的爆炸图;
图7B为根据另一些实施例的显示模组的爆炸图。
具体实施方式
下面将结合附图,对本公开一些实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本公开一部分实施例,而不是全部的实施例。基于本公开所提供的实施例,本领域普通技术人员所获得的所有其他实施例,都属于本公开保护的范围。
除非上下文另有要求,否则,在整个说明书和权利要求书中,术语“包括(comprise)”及其其他形式例如第三人称单数形式“包括(comprises)”和现在分词形式“包括(comprising)”被解释为开放、包含的意思,即为“包含,但不限于”。在说明书的描述中,术语“一个实施例(one embodiment)”、“一些实施例(some embodiments)”、“示例性实施例(exemplary embodiments)”、“示例(example)”、“特定示例(specific example)”或“一些示例(some examples)”等旨在表明与该实施例或示例相关的特定特征、结构、材料或特性包括在本公开的至少一个实施例或示例中。上述术语的示意性表示不一定是指同一实施例或示例。此外,所述的特定特征、结构、材料或特点可以以任何适当方式包括在任何一个或多个实施例或示例中。
以下,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本公开实施例的描述中,除非另有说明,“多个”的含义是两个或两个以上。
在描述一些实施例时,可能使用了“连接”及其衍伸的表达。例如,描述一些实施例时可能使用了术语“连接”以表明两个或两个以上部件彼此间有直接物理接触或电接触。又如,描述一些实施例时可能使用了术语“耦接”以表明两个或两个以上部件有直接物理接触或电接触。然而,术语“耦接”或“通信耦合(communicatively coupled)”也可能指两个或两个以上部件彼此间并无直接接触,但仍彼此协作或相互作用。这里所公开的实施例并不必然限制于本文内容。
“A、B和C中的至少一个”具有相同含义,均包括以下A、B和C的组合:仅A,仅B,仅C,A和B的组合,A和C的组合,B和C的组合,及A、B和C的组合。
本文中“适用于”的使用意味着开放和包容性的语言,其不排除适用于或被配置为执行额外任务或步骤的设备。
另外,“基于”的使用意味着开放和包容性,因为“基于”一个或多个所述条件或值的过程、步骤、计算或其他动作在实践中可以基于额外条件或超出所述的值。
如本文所使用的那样,“约”、“大致”或“近似”包括所阐述的值以及处于特定值的可接受偏差范围内的平均值,其中所述可接受偏差范围如由本领域普通技术人员考虑到正在讨论的测量以及与特定量的测量相关的误差(即,测量系统的局限性)所确定。
如本文所使用的那样,“平行”、“垂直”、“相等”包括所阐述的情况以及与所阐述的情况相近似的情况,该相近似的情况的范围处于可接受偏差范围内,其中所述可接受偏差范围如由本领域普通技术人员考虑到正在讨论的测量以及与特定量的测量相关的误差(即,测量系统的局限性)所确定。例如,“平行”包括绝对平行和近似平行,其中近似平行的可接受偏差范围例如可以是5°以内偏差;“垂直”包括绝对垂直和近似垂直,其中近似垂直的可接受偏差范围例如也可以是5°以内偏差。“相等”包括绝对相等和近似相等,其中近似相等的可接受偏差范围内例如可以是相等的两者之间的差值小于或等于其中任一者的30%、20%、10%或5%中任一种。
应当理解的是,当层或元件被称为在另一层或基板上时,可以是该层或元件直接在另一层或基板上,或者也可以是该层或元件与另一层或基板之间存在中间层。
本文参照作为理想化示例性附图的剖视图和/或平面图描述了示例性实施方式。在附图中,为了清楚,放大了层和区域的厚度。因此,可设想到由于例如制造技术和/或公差引起的相对于附图的形状的变动。因此,示例性实施方式不应解释为局限于本文示出的区域的形状,而是包括因例如制造而引起的形状偏差。例如,示为矩形的蚀刻区域通常将具有弯曲的特征。因此,附图中所示的区域本质上是示意性的,且它们的形状并非旨在示出设备的区域的实际形状,并且并非旨在限制示例性实施方式的范围。
图1为根据一些实施例的显示装置的结构图。
如图1所示,本公开的一些实施例提供了一种显示装置200,该显示装置200包括显示模组100。
示例性的,显示装置200还包括框架、显示驱动IC(Integrated Circuit,集成电路)以及其他电子配件等。
示例性的,显示装置200可以为电致发光显示装置或光致发光显示装置。该显示装置可以为液晶显示装置(Liquid Crystal Display,简称LCD);该显示装置也可以为电致发光显示装置或光致发光显示装置。在该显示装置为电致发光显示装置的情况下,电致发光显示装置可以为有机电致发光显示装置(Organic Light-Emitting Diode,简称OLED)或量子点电致发光显示装置(Quantum Dot Light-Emitting Diodes,简称QLED)。在该显示装置为光致发光显示装置的情况下,光致发光显示装置可以为量子点光致发光显示装置。该显示装置也可以为Mini LED(Mini Light-Emitting Diode,简称Mini LED)显示装置和Micro LED(Micro Light-Emitting Diode,简称Micro LED)显示装置。
在显示装置200为液晶显示装置的情况下,在一些实施例中,显示装置200包括盖板玻璃、显示面板10以及背光组件。背光组件用于为显示面板提供光源,从而使显示面板10可以进行画面显示。在一些示例中,显示装置200中的背光模组还可以包括光学膜片,光学膜片位于背光模组中发光源靠近显示面板10的一侧。光学膜片可以包括反射片、扩散板、增亮膜(棱镜片)、扩散片等,可以用于提高光线的亮度和均匀性。
在显示装置200为OLED显示装置、QLED显示装置、Mini LED显示装置和Micro LED显示装置的情况下,在一些实施例中,显示装置200内的显示面板中包括发光基板,发光基板可以实现画面显示。
示例性的,上述显示装置200可以是显示不论运动(例如,视频)还是固定(例如,静止图像)的且不论文字还是的图像的任何显示装置。更明确地说,预期所述实施例的显示装置可实施应用在多种电子中或与多种电子装置关联,所述多种电子装置例如(但不限于)移动电话、无线装置、个人数据助理(PDA)、手持式或便携式计算机、GPS接收器/导航器、相机、MP4视频播放器、摄像机、游戏控制台、手表、时钟、计算器、电视监视器、平板显示器、计算机监视器、汽车显示器(例如,里程表显示器等)、导航仪、座舱控制器和/或显示器、相机视图的显示器(例如,车辆中后视相机的显示器)、电子相片、电子广告牌或指示牌、投影仪、建筑结构、包装和美学结构(例如,对于一件珠宝的图像的显示器)等。
以下以OLED显示装置为例进行说明:
图2A为根据一些实施例的显示模组的结构图。图2B为根据一些实施例的显示模组的出光侧的结构图。图2C为根据一些实施例的显示模组的背光侧的结构图。图2D为根据一些实施例的显示模组的厚度方向的结构图。其中,图2B所示显示模组100中的柔性线路板20还未弯折至显示面板10的背光侧S2。图2A、图2C和图2D所示的显示模组100中的柔性线路板20均被弯折至显示面板10的背光侧S2。
如图2A~图2D所示,本公开的一些实施例提供了一种显示模组100。显示模组100包括显示面板10和柔性线路板20。
显示面板10可以为OLED显示面板。本公开实施例对显示面板10的类型不做限定,可以根据实际需求设置。
示例性的,如图2D所示,显示面板10具有出光侧S1以及与出光侧S1相对的背光侧S2。出光侧S1和背光侧S2沿第三方向Z相对,第三方向Z为显示面板10厚度的方向。可以理解的是,出光侧S1可以为显示面板10用于显示发光的一侧。背光侧S2可以为显示面板10背离出光侧S1的一侧。也即,出光侧S1位于显示面板10的正面,则背光侧S2位于显示面板10的背面。
图2E为图2C中M-M’向的一种剖面图。
显示面板10包括保护盖板101、显示基板U散热膜40。显示基板U位于保护盖板101和散热膜40之间。
保护盖板101位于显示基板U朝向出光侧S1的一侧。保护盖板101可以用于保护显示面板10(显示基板U),防止显示面板10(显示基板U)被划伤。
示例性的,保护盖板101为柔性盖板。保护盖板101的材料包括透明聚酰亚胺、超薄玻璃中的至少一种。
散热膜40包括粘接层41、至少一层缓冲层和至少一层散热层。至少一层缓冲层位于粘接层41和至少一层散热层之间,且粘接层41位于至少一层缓冲层靠近保护盖板101的一侧。
以散热膜40包括一层缓冲层和一层散热层为例,该一层缓冲层可以为第一缓冲层42,该一层散热层可以为第一散热层43。也即,散热膜40包括粘接层41、第一缓冲层42和第一散热层43为例进行示意。
如上设置,散热膜40可以起到散热的作用,有助于显示面板10工作时产生的热量快速散发,此外可起到遮光的作用。
示例性的,第一散热层43可以与粘接结构30连接。以此将主体部21固定在第一散热层43远离第一缓冲层42的一侧,也即可以使主体部21位于显示面板10的背光侧S2。
在一些示例中,散热膜40可以是超净泡棉(Super clean foam;简称SCF)。
在一些示例中,粘接层41可以为网纹胶(EMBO)层,可以通过网格施压而使胶面印压上纵横的网纹,可以防止因胶层收缩所导致的卷曲现象,并加强散热膜40与显示面板10贴附的紧密性。同时网纹形状也可以便于贴合过程中排出气体,以防止贴合时产生气泡。示例性的,粘接层41的胶材可以采用亚克力胶或者硅胶。
在一些示例中,粘接层41的厚度范围为0.03mm~0.2mm。当粘接层41的厚度等于或趋近于0.03mm时,粘接层41的厚度较薄,粘接层41可以满足固定散热膜40的同时更利于显示模组100的轻薄化、以及有利于防止浪费资源。当粘接层41的厚度等于或趋近于0.2mm时,粘接层41的厚度更厚一些,粘接层41可以在满足防止浪费资源的同时起到更好的粘接固定散热膜40和显示面板10的作用。
在另一些实施例中,粘接层41的厚度范围为0.05mm~0.15mm。在又一些实施例中,粘接层41的厚度范围为0.08mm~0.12mm。
示例性的,粘接层41的厚度为0.5mm、1mm,1.5mm或2mm中一种。
在一些示例中,第一缓冲层42的材料可以为泡棉(Foam),第一缓冲层42可以缓冲外力,可防止散热膜40与显示面板10贴合过程中贴合压力对显示面板10造成损害。
在一些示例中,第一缓冲层42的厚度范围为0.05mm~0.35mm。当第一缓冲层42的厚度等于或趋近于0.05mm时,可以满足显示模组100对缓冲外力需求的同时更利于实现显示模组100的轻薄化,防止浪费资源。当第一缓冲层42的厚度等于或趋近于0.35mm时,可以满足显示模组100轻薄化需求的同时起到更好的缓冲效果,防止散热膜40与显示面板10贴合过程中贴合压力对显示面板10造成损害。
在一些示例中,第一散热层43的材料可以为铜、铝或银中一种,使散热膜40具有良好的散热作用。示例性的,第一散热层43的材料可以为铜。
柔性线路板(Flexible Printed Circuit,简称FPC)20包括主体部21、脖子部22和连接部23。脖子部22位于主体部21和连接部23之间。
在一些示例中,如图2C和图2D所示,柔性线路板20内的基板可以为柔性基板。可以通过利用柔性基板的柔韧性将至少部分柔性线路板20弯折至显示面板10的背光侧S2。例如,柔性线路板20中的连接部23、脖子部22以及至少部分主体部21位于显示面板10的背光侧S2。
由于显示面板10的背光侧S2的电子器件相对于显示面板10的出光侧S1的电子器件相对较少,将至少部分柔性线路板20弯折至显示面板10的背光侧S2,不仅可以便于实现柔性线路板20的走线布局,还可以减少柔性线路板20对显示面板10出光侧S1的边框的占用,有利于实现显示面板10的窄边框。
示例性的,柔性线路板20内的柔性基板的材料可以为有机材料。例如,柔性基板的材料可以为聚酰亚胺(Polyimide,简称:PI)、聚碳酸酯(Polycarbonate,简称:PC)或者聚氯乙烯(Polyvinyl Chloride,简称:PVC)中的任一个。
在一些示例中,如图2B所示,主体部21远离脖子部22的一端Q1与显示面板10边缘Q2连接。
示例性的,采用绑定工艺,将柔性线路板20中主体部21远离脖子部22的一端与显示面板10压合,以实现柔性线路板20与显示面板10电连接。
在一些示例中,如图2B所示,连接部23远离脖子部22的一端Q3与整机主板连接。
示例性的,连接部23可以为板对板连接器(Board to Board,简称BTB)。例如,板对板连接器BTB,分为母头连接器(Rece)和公头连接器(plug),两者分别在柔性线路板20的连接部23和整体主机上贴装,使用时对插嵌合实现电连接。
由此,通过设置主体部21远离脖子部22的一端Q1与显示面板10边缘Q2连接,且连接部23远离脖子部22的一端Q3与整机主板连接。整机主板可以通过柔性线路板20与显示面板10连接,用于为显示面板10提供驱动信号。
但是,由于显示模组100装配的因素,以及显示模组100点亮测试等因素,均会导致柔性线路板20需要反折按压,在弯曲应力的作用下,容易出现柔性线路板20的主体部21与显示面板10的背光侧S2剥离的现象,这样使得该显示模组100结构的稳定性降低,不利于显示模组100后续工作。
此外,在显示面板10为柔性显示面板时,显示面板10柔性较好的优点。显示面板10(显示基板U)包括显示部、弯折部和绑定部,弯折部位于显示部和绑定部之间。将绑定部可以通过弯折部弯折至显示面板10的背光侧S2。此时,显示模组100还可以包括支撑垫,支撑垫位于显示面板10的背光侧S2,支撑垫可以用于支撑不绑定部,防止弯折部发生断裂。显示面板10的绑定部包括柔性线路板20,也即在将绑定部弯折至显示面板10的背光侧S2时,将柔性线路板20全部位于显示面板10的背光侧S2,可以减少柔性线路板20对显示面板10出光侧S1的边框的占用,有利于实现显示面板10的窄边框。
然而,在将显示面板10和柔性线路板20贴合时,由于柔性线路板20与显示面板10的背光侧S2剥离,会导致显示面板10背光侧S2受力不均,由此容易的导致显示面板10的出光侧S1容易出现模印的问题。
而本公开一些实施例提供的一种显示模组100还包括粘接结构30。如图2C所示,粘接结构30位于主体部21和显示面板10之间,且粘接结构30的至少部分位于主体部21中靠近脖子部22的边缘区域。
在主体部21和至少一层散热层之间设有粘接结构30,可以增大主体部21和至少一层散热层(显示面板10的背光侧S2)之间的粘性。由此,可以防止由于柔性线路板20需要反折按压,导致容易出现柔性线路板20的主体部21与至少一层散热层(显示面板10的背光侧S2)剥离的现象,提高显示模组100结构的稳定性。同时,也可以防止由于显示面板10背光侧S2受力不均,导致显示面板10的出光侧S1容易出现模印的问题,提高显示模组100的质量。
并且,本实施例提供的显示模组100中,还设置粘接结构30的至少部分位于主体部21中靠近脖子部22的边缘区域W1。
由于在柔性线路板20被拉起时(向背离显示面板的一侧拉起),柔性线路板20主体部21和脖子部22交界的位置处受到的拉应力较大。而在主体部21中靠近脖子部22的边缘区域W1设置粘接结构30,可以增大边缘区域W1与显示面板10的粘性,可以防止边缘区域W1处被反复拉起,造成主体部21靠近脖子部22发生翘曲,导致剥离显示面板10的问题。而由于减缓了边缘区域W1被拉起的趋势,也可以相对防止除边缘区域W1其他位置处被拉起,剥离显示面板10。从而可以更好的起到固定柔性线路板20和显示面板10的作用,提高显示模组100结构的稳定。
在一些实施例中,如图2C所示,粘接结构30的材料可以为胶体。在一些示例中,粘接结构30的材料可以为透明光学胶。例如,可以为聚甲基丙烯酸甲酯(Polymethyl Methacrylate,简称PMMA)、热塑性聚氨酯橡胶(Thermoplastic Polyurethanes,简称TPU)、热塑性弹性体(Thermoplastic Elastomer,简称TPE)或热塑性聚酯弹性体(Thermoplastic Polyester Elastome,简称TPEE)中任意一种,或者两个以上组合的材料。本公开实施例对此不做限定。
图3A为根据一些实施例的粘接结构和柔性线路板连接图。
如图3A所示,本公开一些实施例提供的显示模组100中的粘接结构30包括第一粘接结构31。第一粘接结构31包括第一部分311。第一部分311位于主体部21中靠近脖子部22的边缘区域W1。脖子部22的延伸方向为第一方向Y,第一部分311沿第一方向Y的尺寸D1与主体部21沿第一方向Y的尺寸D2的比值大于或等于10%,且小于或等于50%。
当第一粘接结构31的第一部分311沿第一方向Y的尺寸D1,与主体部21沿第一方向Y的尺寸D2的比值等于或趋近于10%时,第一部分311的尺寸较小,可以防止粘第一部分311的尺寸过大,造成资源浪费的问题;同时保证主体部21和显示面板10的粘性,防止主体部21剥离显示面板10问题。当第一粘接结构31的第一部分311沿第一方向Y的尺寸D1,与主体部21沿第一方向Y的尺寸D2的比值等于或趋近于50%时,第一部分311的尺寸较大一些,可以更进一步的提高主体部21和显示面板10的粘性,防止主体部21发生翘曲,导致剥离显示面板10问题;同时也可以起到防止第一部分311的尺寸过大(例如,比例大于50%的情况),造成资源浪费的问题。
在一些示例中,脖子部22的延伸方向为第一方向Y,第一部分311沿第一方向Y的尺寸D1与主体部21沿第一方向Y的尺寸D2的比值大于或等于9%,且小于或等于30%。
当第一粘接结构31的第一部分311沿第一方向Y的尺寸D1与主体部21沿第一方向Y的尺寸D2的比值等于或趋近于9%时,第一部分311的尺寸较小,可以在防止第一部分311的尺寸过大,造成资源浪费的问题的同时保证主体部21和显示面板10之间对粘性的需求。当第一粘接结构31的第一部分311沿第一方向Y的尺寸D1与主体部21沿第一方向Y的尺寸D2的比值等于或趋近于30%时,第一部分311的尺寸稍大一些,可以在提高主体部21和显示面板10的粘性的同时也可以起到防止第一部分311的尺寸过大,造成资源浪费的问题。
在一些示例中,脖子部22的延伸方向为第一方向Y,第一部分311沿第一方向Y的尺寸D1与主体部21沿第一方向Y的尺寸D2的比值大于或等于8%,且小于或等于15%。
当第一粘接结构31的第一部分311沿第一方向Y的尺寸D1与主体部21沿第一方向Y的尺寸D2的比值等于或趋近于8%时,第一部分311的尺寸更小,可以在防止第一部分311的尺寸过大,造成资源浪费的问题的同时保证主体部21和显示面板10之间对粘性的需求。当第一粘接结构31的第一部分311沿第一方向Y的尺寸D1与主体部21沿第一方向Y的尺寸D2的比值等于或趋近于15%时,第一部分311的尺寸稍微大一些,可以在提高主体部21和显示面板10的粘性的同时也可以起到防止第一部分311的尺寸过大,造成资源浪费的问题。
示例性的,脖子部22的延伸方向为第一方向Y,第一部分311沿第一方向Y的尺寸D1与主体部21沿第一方向Y的尺寸D2的比值等于10%、20%、30%、40%或50%中的一种。
在一些实施例中,主体部21沿第一方向Y的尺寸D2的范围为50~250mm。例如,主体部21在沿第一方向Y的尺寸D2为50mm。此基础上,可以设置第一部分311沿第一方向Y的尺寸D1大于或等于5mm。
当第一部分311沿第一方向Y的尺寸D1等于或趋近于5mm时,第一部分311的尺寸较小,可以防止第一部分311的尺寸过大,造成资源浪费的问题;同时保证主体部21和显示面板10的粘性,防止主体部21剥离显示面板10问题。
在一些示例中,第一部分311沿第一方向Y的尺寸D1大于或等于10mm。
当第一部分311沿第一方向Y的尺寸D1等于或趋近于10mm时,第一部分311的尺寸稍小,可以提高一些主体部21和显示面板10之间粘性的同时防止第一部分311的尺寸过大,造成资源浪费。
在一些示例中,第一部分311沿第一方向Y的尺寸D1大于或等于20mm。
当第一部分311沿第一方向Y的尺寸D1等于或趋近于20mm时,第一部分311的尺寸可以稍大一些,可以更好的提高主体部21和显示面板10之间粘性,同时也可以起到一定程度防止第一部分311的尺寸过大,造成资源浪费的问题。
在一些示例中,基于上述对第一部分311沿第一方向Y的尺寸D1大小的限定,可以进一步第一部分311沿第一方向Y的尺寸D1小于或等于主体部21在沿第一方向Y的尺寸D2。防止第一粘接结构31溢出主体部21,暴露在空气中,容易吸收空气杂质,影响第一粘接结构31的质量。同时也可以防止在显示模组100组装过程中,工作人员手指触摸到粘接结构30,而影响对显示模组100的组装。此外,也可以起到避免资源浪费的问题。
在一些示例中,第一部分311沿第一方向Y的尺寸D1为5mm、8mm、10mm、15mm、20mm、25mm或30mm中一种。
图3B为根据另一些实施例的粘接结构和柔性线路板连接图。
在一些实施例中,如图3A和图3B所示,平行于显示面板10且垂直于第一方向Y的方向为第二方向X。第一部分311沿第二方向X的至少一端超出脖子部22。
第一部分311沿第二方向X的至少一端超出脖子部22,包括以下两种情况:
第一种,如图3A所示,第一部分311沿第二方向X的一端超出脖子部22。本公开实施例对第一部分311沿第二方向X超出脖子部22的端部位置不做具体限定。其中,图3A以第一部分311的第一端31a超出脖子部22为例进行示意。可以理解的是,在另一些实施例中,也可以设置第一部分311中的第二端31b超出脖子部22。其中,第一端31a和第二端31b沿第二方向X相对设置。
以第一部分311的第一端31a超出脖子部22为例:
第一部分311的第一端31a超出脖子部22,第二端31b内缩不超过脖子部22宽度的50%。相当于第一部分311的第一端31a超出脖子部22和主体部21交界线O,第二端31b内缩不超过交界线O长度的50%。
由于在柔性线路板20被拉起时(向背离显示面板的一侧拉起),柔性线路板20主体部21和脖子部22交界线O的位置处受到的拉应力较大。拉应力沿脖子部22指向主体部21方向延伸。如上设置,可以利用该部分位置处的第一部分311提高主体部21和显示面板10之间的粘力,抵抗部分交界线O位置处受到的部分拉应力,从而减缓主体部21被反复拉起的几率,从而降低主体部21剥离显示面板10的问题。
在一些示例中,第二端31b内缩不超过脖子部22宽度的80%,也即第二端31b内缩不超过交界线O长度的80%。例如,第二端31b与脖子部22远离第一端31a的一端平齐。
如上设置,可以利用该部分位置处的第一部分311更好的提高主体部21和显示面板10之间的粘力,抵抗全部交界线O位置处受到的部分拉应力,从而更好的减缓主体部21被反复拉起的几率,从而降低主体部21剥离显示面板10的问题。
第二种,如图3B所示,第一部分311沿第二方向X的两端均超出脖子部22。相当于第一部分311的两端均超出交界线O。
由于在柔性线路板20被拉起时(向背离显示面板的一侧拉起),柔性线路板20主体部21和脖子部22交界线O的位置处受到的拉应力较大,以及交界线O附近位置处的拉应力也较。拉应力沿脖子部22指向主体部21方向延伸。如上设置,可以利用第一部分311提高主体部21和显示面板10之间的粘力,抵抗交界线O位置处,以及交界线O附近位置处受到的部分拉应力, 从而更有力的减缓主体部21被反复拉起的几率,从而降低主体部21剥离显示面板10的问题。
在一些实施例中,如图3A所示,第一部分311沿第二方向X的尺寸,大于脖子部22沿第一方向Y的尺寸。
如图3A所示,在第一部分311沿第二方向X的一端超出脖子部22的基础上,设置第一部分311沿第二方向X的尺寸,大于脖子部22沿第一方向Y的尺寸。以使第一部分311未超出脖子部22的一端,尽量使第一部分311内缩程度不超过脖子部22宽度的50%。
以使可以利用该第一部分311提高主体部21和显示面板10之间的粘力,抵抗交界线O位置处受到的部分拉应力,从而更有力的减缓主体部21被反复拉起的几率,从而降低主体部21剥离显示面板10的问题。
图3C为根据又一些实施例的粘接结构和柔性线路板连接图。
在又一些实施例中,如图3C所示,第一部分311沿第一方向Y的两端与主体部21中靠近脖子部22的边缘区域沿第一方向Y的两端大致平齐。
由于在柔性线路板20被拉起时(向背离显示面板的一侧拉起),柔性线路板20主体部21和脖子部22交界线O的位置处受到的拉应力较大,以及交界线O附近位置处的拉应力也较。拉应力沿脖子部22指向主体部21方向延伸。如上设置,可以利用第一部分311提高主体部21和显示面板10之间的粘力,抵抗主体部21靠近脖子部22一侧受到的部分拉应力,从而更有力的减缓主体部21被反复拉起的几率,从而降低主体部21剥离显示面板10的问题。
需要说明的是,“大致平齐”包括绝对平齐和近似平齐。由于存在一定的不可控的误差(如制作工艺误差、设备精度、测量误差等),第一部分311和主体部21中靠近脖子部22的边缘区域沿第一方向Y的两端之间的间距在可接受偏差范围内,均可以认为主体部21和第一部分311的两端近似平齐其中,可接受偏差范围可以为其中任一者的30%、20%、10%或5%中任一种。
在一些示例中,在将第一部分311和显示面板10贴合时,由于粘接结构30材料的因素,粘接结构30会发生一定程度的流动。
进而,可以设置粘接结构30的第一部分311相对于主体部21中靠近脖子部22的边缘区域沿第一方向Y的两端预留(内缩)一段间距。利用该段间距补偿粘接结构30流动的问题,避免粘接结构30外溢至主体部21的外侧,导致影响显示模组100质量的问题。
在一些示例中,该间距的范围可以为小于或等于2mm。当该间距等于或趋近于2mm时,可以预留充分的空间补偿粘接结构30流动的问题,避免粘接结构30外溢至主体部21的外侧,导致影响显示模组100质量的问题。同时也可以防止第一部分311和主体部21两端的间距过大,影响主体部21边缘位置处与显示面板10之间粘性的问题。
在另一些示例中,该间距的范围可以为小于或等于1mm。当该间距等于或趋近于1mm时,可以预留空间补偿粘接结构30流动的问题,防止粘接结构30外溢至主体部21的外侧,导致影响显示模组100质量的问题。同时也可以更好防止第一部分311和主体部21两端的间距过大,影响主体部21边缘位置处与显示面板10之间粘性的问题。
在又一些示例中,该间距的范围可以为小于或等于0.5mm。当该间距等于或趋近于0.5mm时,该间距既可以满足补偿粘接结构30压合流动的问题,又防止主体部边缘位置处与显示面板10之间的粘性,有利于提高显示模组100的质量。
示例性的,该间距可以为2mm、1.5mm、1mm、0.8mm、0.5mm、0.3mm或0.1mm中的一种。
图3D为根据又一些实施例的粘接结构和柔性线路板连接图。
在一些实施例中,如图3D所示,第一粘接结构31还包括第二部分312。第二部分312位于第一部分311远离脖子部22的一侧,且第二部分312与第一部分311相连。其中,第一部分311和第二部分312沿第一方向Y的尺寸之和,与主体部21沿第一方向Y的尺寸的比值大于或等于50%,且小于或等于90%。
当第一部分311和第二部分312沿第一方向Y的尺寸之和,与主体部21沿第一方向Y的尺寸的比值等于或趋近于50%时,也即第一粘接结构31沿第一方向Y的尺寸,与主体部21沿第一方向Y的尺寸的比值等于或趋近于50%时,可以防止第一粘接结构31的尺寸过大造成资源浪费的问题。同时,也可以满足主体部21和显示面板10之间对粘性的需求,实现防止主体部21剥离显示面板10的问题,提高显示模组100结构的稳定性,提高显示模组100的质量。
当第一部分311和第二部分312沿第一方向Y的尺寸之和,与主体部21沿第一方向Y的尺寸的比值等于或趋近于90%时,也即第一粘接结构31沿第一方向Y的尺寸,与主体部21沿第一方向Y的尺寸的比值等于或趋近于90%时,第一粘接结构31的尺寸更大一些,可以更进一步的增大主体部21和显示面板10之间的粘性,可以防止主体部21剥离显示面板10的问题,提高显示模组100结构的稳定性,提高显示模组100的质量。同时,也可以一定程度上防止第一粘接结构31的尺寸过大造成资源浪费的问题。
在一些示例中,如图3D所示,第一部分311和第二部分312沿第一方向Y的尺寸之和,与主体部21沿第一方向Y的尺寸的比值大于或等于60%,且小于或等于70%。
当第一部分311和第二部分312沿第一方向Y的尺寸之和,与主体部21沿第一方向Y的尺寸的比值等于或趋近于60%时,也即第一粘接结构31沿第一方向Y的尺寸,与主体部21沿第一方向Y的尺寸的比值等于或趋近于60%时,可以防止第一粘接结构31的尺寸过大造成资源浪费的问题。同时,也可以满足主体部21和显示面板10之间对粘性的需求,实现防止主体部21剥离显示面板10的问题。
当第一部分311和第二部分312沿第一方向Y的尺寸之和,与主体部21沿第一方向Y的尺寸的比值等于或趋近于80%时,也即第一粘接结构31沿第一方向Y的尺寸,与主体部21沿第一方向Y的尺寸的比值等于或趋近于80%时,第一粘接结构31的尺寸较大一些,可以进一步的增大主体部21和显示面板10之间的粘性,可以防止主体部21剥离显示面板10的问题。同时,也可以一定程度上防止第一粘接结构31的尺寸过大造成资源浪费的问题。
在一些示例中,第一部分311和第二部分312沿第一方向Y的尺寸之和,与主体部21沿第一方向Y的尺寸的比值为50%、60%、70%、80%或90%中一种。
图3E为根据又一些实施例的粘接结构和柔性线路板连接图。
在一些实施例中,如图3E所示,第一粘接结构31还包括第二部分312。第二部分312位于第一部分311远离脖子部22的一侧,且第二部分312与第一部分311相连。其中,第一部分311和第二部分312沿第一方向Y的尺寸之和,与主体部21沿第一方向Y的尺寸的比值等于100%。
如此设置,相当于第一部分311和第二部分312沿第一方向Y的尺寸之和,与主体部21沿第一方向Y的尺寸相等。也即,第一粘接结构31沿第一方向Y的尺寸,与主体部21沿第一方向Y的尺寸相等。可以更好的增大主体部21和显示面板10之间的粘性,可以防止主体部21剥离显示面板10的问题。同时,也可以一定程度上防止第一粘接结构31的尺寸过大造成资源浪费的问题。
在一些实施例中,如图3D和图3E所示,第二部分312的厚度可以与第一部分311的厚度大致相等。
需要说明的是,“大致相等”包括绝对相等和近似相等。由于存在一定的不可控的误差(如制作工艺误差、设备精度、测量误差等),第二部分312的厚度可以与第一部分311的厚度的差值在可接受偏差范围内,均可以认为厚度近似相等。其中,可接受偏差范围可以为其中任一者的30%、20%、10%或5%中任一种。
在一些实施例中,如图3D和图3E所示,第二部分312和第一部分311可以一体化形成,使得第二部分312和第一部分311可以通过一步工艺实现,有利于简化第一粘接结构31的工艺制程。
如图3D和图3E所示,为在图3C所示的第一部分311的基础上,设置第一粘接结构31还包括第二部分312。但是本公开实施例并不限制于此,也可以在图3A或图3B所示第一部分311的基础上,设置第一粘接结构31还包括第二部分312。可以根据实际情况进行设置。
在一些实施例中,如图3D所示,第一部分311和第二部分312两者在显示面板10的显示面的正投影,与主体部21在显示面板10的显示面的正投影重叠。
如此设置,相当于第一粘接结构31在显示面板10的显示面的正投影,与主体部21在显示面板10的显示面的正投影重叠。以使主体部21和显示面板10之间的任意位置处,均设有第一粘接结构31。从而可以防止主体部21各个位置处翘曲,剥离显示面板10的问题,进一步提高显示模组100结构的稳定性,提高显示模组100的质量。
图3F为根据又一些实施例的粘接结构和柔性线路板连接图。
在一些实施例中,如图3F所示,第一粘接结构31还包括第三部分313。第三部分33与第一部分311相连,以围设成沿主体部21的边缘延伸的框形结构。该框形结构即为第一粘接结构31。也即相当于,本实施例提供的第一粘接结构31围绕主体部21的边缘延伸设置。
而由于在柔性线路板20被拉起时(向背离显示面板的一侧拉起),柔性线路板20主体部21的边界位置处更容易被拉起。进而设置第一粘接结构31围绕主体部21的边缘延伸,可以有利于增大主体部21边缘位置处与显示面板10之间的粘性,防止主体部21边缘位置处被反复拉起发生翘曲,进而导致与显示面板10剥离的问题。有利于提高显示模组100结构的稳定性,有利于提高显示模组100的质量。
图3G为根据又一些实施例的粘接结构和柔性线路板连接图。
在一些实施例中,如图3G所示,粘接结构30还包括第二粘接结构32。 第二粘接结构32位于框形结构的内侧,第二粘接结构32和框形结构间隔设置。也即,在设置第一粘接结构31围绕主体部21的边缘延伸的基础上,设置粘接结构30还包括第二粘接结构32。第二粘接结构32位于框形结构的内侧。
设置第一粘接结构31,可以增大主体部21边缘位置处与显示面板10之间的粘性。设置第二粘接结构32,可以增大主体部21中间位置处与显示面板10之间的粘性。从而,通过粘接结构30可以增大主体部21与显示面板10之间的粘性。从而防止主体部21被反复拉起发生翘曲,进而导致与显示面板10剥离的问题。有利于提高显示模组100结构的稳定性,有利于提高显示模组100的质量。
在一些实施例中,如图3G所示,可以设置第一粘接结构31的厚度范围为50μm~200μm。
当第一粘接结构31的厚度等于或趋近于50μm时,第一粘接结构31的厚度较薄,可以防止第一粘接结构31厚度较厚,影响显示模组100轻薄化的问题。同时,也可以保证主体部21和显示面板10之间对粘性的需求,防止主体部21剥离显示面板10的问题,提高显示模组100的质量。当第一粘接结构31的厚度等于或趋近于200μm,由于粘接结构30的粘性和厚度成正比,在增加第一粘接结构31的厚度的同时可以提高第一粘接结构31的粘性。也即,可以更好的起到固定主体部21和显示面板10的作用,防止主体部21剥离显示面板10的问题,提高显示模组100的质量。同时,也可以起到一定程度防止第一粘接结构31厚度较厚,影响显示模组100轻薄化的问题。
在另一些实施例中,第一粘接结构31的厚度范围为80μm~150μm。
当第一粘接结构31的厚度等于或趋近于80μm时,第一粘接结构31的厚度较薄,可以防止第一粘接结构31厚度较厚的同时保证主体部21和显示面板10之间对粘性的需求,提高显示模组100的质量。当第一粘接结构31的厚度等于或趋近于150μm,可以更好的起到固定主体部21和显示面板10作用的同时,一定程度防止第一粘接结构31厚度较厚,影响显示模组100轻薄化的问题。
示例性的,第一粘接结构31的厚度可以为50μm、80μm、100μm、120μm、150μm、200μm或250μm。
在一些实施例中,如图3G所示,可以设置第二粘接结构32的厚度范围为30μm~200μm。
当第二粘接结构32的厚度等于或趋近于30μm时,第二粘接结构32的厚度较薄,可以防止第二粘接结构32厚度较厚,影响显示模组100轻薄化的问题。同时,也可以保证主体部21和显示面板10之间对粘性的需求,防止主体部21剥离显示面板10的问题,提高显示模组100的质量。当第二粘接结构32的厚度等于或趋近于200μm,由于粘接结构30的粘性和厚度成正比,在增加第二粘接结构32的厚度的同时可以提高第二粘接结构32的粘性。也即,可以更好的起到固定主体部21和显示面板10的作用,防止主体部21剥离显示面板10的问题,提高显示模组100的质量。同时,也可以起到一定程度防止第二粘接结构32厚度较厚,影响显示模组100轻薄化的问题。
在另一些实施例中,第二粘接结构32的厚度范围为50μm~150μm。
当第二粘接结构32的厚度等于或趋近于50μm时,第二粘接结构32的厚度较薄,可以防止第二粘接结构32厚度较厚的同时保证主体部21和显示面板10之间对粘性的需求,提高显示模组100的质量。当第二粘接结构32的厚度等于或趋近于150μm,可以更好的起到固定主体部21和显示面板10作用的同时,一定程度防止第二粘接结构32厚度较厚,影响显示模组100轻薄化的问题。
示例性的,第二粘接结构32的厚度可以为30μm、50μm、80μm、100μm、120μm、150μm、200μm或250μm。
在一些实施例中,如图3G所示,第一粘接结构31的厚度大于等于第二粘接结构的厚度。
第一种:第一粘接结构31的厚度等于第二粘接结构32的厚度。如此设置,可以保证粘接结构30的平整度,简化粘接结构30的工艺制程。同时,也可以确保主体部21各个位置处与显示面板10之间的粘性,有利于提高显示模组100的质量。
第二种:第二粘接结构32的厚度小于第一粘接结构31的厚度。由于在柔性线路板20被拉起时(向背离显示面板的一侧拉起),柔性线路板20主体部21的边界位置处更容易被拉起。进而设置第一粘接结构31相对较厚,可以更好的提高主体部21的边界位置处与显示面板10之间的粘性,防止主体部21边缘位置处被反复拉起发生翘曲,进而导致与显示面板10剥离的问题。有利于提高显示模组100结构的稳定性,有利于提高显示模组100的质量。
而由于主体部21中间位置相对于边缘位置处受到的拉应力较小,相对不容易发生翘曲的问题。进而可以设置第二粘接结构32的厚度相对薄一些,既可以满足主体部21中间位置与显示面板10之间粘性的需求,还可以有利于节约资源。
在另一些实施例中,如图3G所示,在第二粘接结构32的厚度小于第一粘接结构31的厚度的基础上。可以设置第二粘接结构32的厚度与第一粘接结构31的厚度的差值为小于20μm。
可以在更好的节约资源的基础上,防止由于第二粘接结构32的厚度与第一粘接结构31的厚度的差值过大,导致第二粘接结构32的两侧无法同时接触主体部21和显示面板10,也即无法起到提高主体部21和显示面板10之间粘性的作用。
在又一些实施例中,如图3G所示,第二粘接结构32的厚度与第一粘接结构31的厚度的差值小于10μm。可以在更好的,防止由于第二粘接结构32的厚度与第一粘接结构31的厚度的差值过大,导致第二粘接结构32的两侧无法同时接触主体部21和显示面板10,也即无法起到提高主体部21和显示面板10之间粘性的作用的基础上,也可以实现一定程度节约资源的作用。
示例性的,第二粘接结构32的厚度与第一粘接结构31的厚度的差值为5μm、10μm、15μm或20μm中一种。
在一些实施例中,如图3G所示,第一粘接结构31和第二粘接结构32之间的最小间距D3大于或等于2mm。
在第一粘接结构31的厚度等于第二粘接结构32的厚度时,设置第一粘接结构31和第二粘接结构32之间的最小间距D3大于或等于2mm。相对于粘接结构30各个粘接结构之间设有间隙,减少粘接结构30材料的用量,有利于节约资源。
在第一粘接结构31的厚度大于第二粘接结构32的厚度时,第一粘接结构31和第二粘接结构32之间的最小间距D3大于或等于2mm。可以在第一粘接结构31和第二粘接结构32之间预留充分的空间,主体部21和显示面板10贴合时,第一粘接结构31可以向该空间内流动,防止第一粘接结构31的厚度过大,影响粘接结构30的平整度,从而影响显示面板10和主体部21之间的粘性。
示例性的,最小间距D3可以为2mm、2.5mm或3mm中一种。
在一些实施例中,如图3G所示,粘接结构30还可以包括第一辅助粘接结构,第一辅助粘接结构也可以围绕第二粘接结构32设置。也即,第一辅助粘接结构可以位于第一粘接结构31和第二粘接结构32之间。
此时,设置第一辅助粘接结构可以进一步增加主体部21和显示面板10之间的粘性,防止主体部21剥离显示面板10,影响显示模组100结构的稳定性。
在一些示例中,在第一粘接结构31的厚度等于第二粘接结构32的厚度的情况下:可以设置第一辅助粘接结构的厚度,与第一粘接结构31的厚度和第二粘接结构32的厚度均相等。
基于此,可以保证粘接结构30的平整度,简化粘接结构30的工艺制程。同时,也可以确保主体部21各个位置处与显示面板10之间的粘性,有利于提高显示模组100的质量。
在另一些示例中,如图3G所示,在第一粘接结构31的厚度大于第二粘接结构32的厚度的情况下:
第一种:可以设置第一辅助粘接结构的厚度等于第一粘接结构31的厚度。由于第一辅助粘接结构可以位于第一粘接结构31和第二粘接结构32之间,也即位于第二粘接结构32的外侧,设置与最外侧边缘的第一粘接结构31的厚度相等,可以进一步增大主体部边缘位置处与显示面板10之间的粘性。
第二种:可以设置第一辅助粘接结构的厚度等于第二粘接结构32的厚度。由于第一辅助粘接结构可以位于第一粘接结构31和第二粘接结构32之间,也即第一辅助粘接结构位于第一粘接结构31的内侧,设置与内侧设置的第二粘接结构32的厚度相等,可以在一定程度提高主体部21和显示面板10之间粘性的同时节约资源。
第三种:可以设置第一辅助粘接结构的厚度小于第一粘接结构31的厚度,大于第二粘接结构32的厚度。由于第一辅助粘接结构可以位于第一粘接结构31和第二粘接结构32之间,设置第一辅助粘接结构的厚度小于第一粘接结构31的厚度,大于第二粘接结构32的厚度。相当于第一粘接结构31、第一辅助粘接结构和第二粘接结构32的厚度依次降低。一方面,可以在一定程度提高主体部21和显示面板10之间粘性的同时节约资源。另一方面,由于粘接结构30的厚度渐变设置,也可以防止由于各个粘接结构之间厚度差异较大,导致粘接结构30的表面不平的问题,提高显示模组100的质量。
图3H为根据又一些实施例的粘接结构和柔性线路板连接图。
在一些实施例中,如图3H所示,粘接结构30还包括第三粘接结构33。第三粘接结构33位于第一部分远离脖子部22的一侧,且第三粘接结构33与第一部分间隔设置。
在粘接结构30包括第一粘接结构31的基础上,设置粘接结构30还包括第三粘接结构33。将第三粘接结构33设置在第一部分远离脖子部22的一侧。可以利用第三粘接结构33增大在第一部分远离脖子部22的一侧与显示面板10之间的粘性,防止主体部21边缘位置处被反复拉起发生翘曲,进而导致与显示面板10剥离的问题。有利于提高显示模组100结构的稳定性,有利于提高显示模组100的质量。
其中,图3H以第三粘接结构33远离第一部分311的一侧与显示面板10边缘Q2平齐为例进行示意。可以理解的是,在另一些实施例中,也可以设置,第三粘接结构33远离第一部分311的一侧与显示面板10边缘Q2之间具有间距。本公开对此不做限定。
在一些实施例中,如图3H所示,第一粘接结构31的第一部分311的厚度大于等于第三粘接结构33的厚度。
第一种:第一粘接结构31的第一部分311的厚度等于第三粘接结构33的厚度。如此设置,可以保证粘接结构30的平整度,简化粘接结构30的工艺制程。同时,也可以确保主体部21各个位置处与显示面板10之间的粘性,有利于提高显示模组100的质量。
第二种:第一粘接结构31的第一部分311的厚度大于第三粘接结构33的厚度。
由于在柔性线路板20被拉起时(向背离显示面板的一侧拉起),柔性线路板20主体部21靠近脖子部22一侧的位置处更容易被拉起。进而设置第一粘接结构31相对较厚,可以更好的提高主体部21靠近脖子部22一侧位置处与显示面板10之间的粘性,防止该位置处的主体部21被反复拉起发生翘曲,进而导致与显示面板10剥离的问题。有利于提高显示模组100结构的稳定性,有利于提高显示模组100的质量。
而由于主体部21远离脖子部22的位置处受到的拉应力较小,相对不容易发生翘曲的问题。进而可以设置第三粘接结构33的厚度相对薄一些,既可以满足主体部21中间位置与显示面板10之间粘性的需求,还可以有利于节约资源。
在另一些实施例中,如图3H所示,在第三粘接结构33的厚度小于第一粘接结构31的厚度的基础上。可以设置第三粘接结构33的厚度与第一粘接结构31的厚度的差值为小于20μm。
可以在更好的节约资源的基础上,防止由于第三粘接结构33的厚度与第一粘接结构31的厚度的差值过大,导致第三粘接结构33的两侧无法同时接触主体部21和显示面板10,也即无法起到提高主体部21和显示面板10之间粘性的作用。
在又一些实施例中,如图3H所示,第三粘接结构33的厚度与第一粘接结构31的厚度的差值小于10μm。可以在更好的,防止由于第三粘接结构33的厚度与第一粘接结构31的厚度的差值过大,导致第三粘接结构33的两侧无法同时接触主体部21和显示面板10,也即无法起到提高主体部21和显示面板10之间粘性的作用的基础上,也可以实现一定程度节约资源的作用。
示例性的,第三粘接结构33的厚度与第一粘接结构31的厚度的差值为5μm、10μm、15μm或20μm中一种。
在一些实施例中,如图3H所示,第一粘接结构31和第三粘接结构33之间的最小间距D4大于或等于2mm。
在第一粘接结构31的厚度等于第三粘接结构33的厚度时,设置第一粘接结构31和第三粘接结构33之间的最小间距D4大于或等于2mm。相对于粘接结构30各个粘接结构之间设有间隙,减少粘接结构30材料的用量,有利于节约资源。
在第一粘接结构31的厚度大于第三粘接结构33的厚度时,第一粘接结构31和第三粘接结构33之间的最小间距D4大于或等于2mm。可以在第一粘接结构31和第三粘接结构33之间预留充分的空间,主体部21和显示面板10贴合时,第一粘接结构31可以向该空间内流动,防止第一粘接结构31的厚度过大,影响粘接结构30的平整度,从而影响显示面板10和主体部21之间的粘性。
示例性的,最小间距D4可以为2mm、2.5mm或3mm中一种。
图3I为根据又一些实施例的粘接结构和柔性线路板连接图。
在一些实施例中,如图3I所示,第三粘接结构33包括多个第四部分331,多个第四部分331沿第一方向Y间隔排布。
与图3H的区别是,图3H相等于第三粘接结构33仅包括一个第四部分。第三粘接结构33分为多个第四部分331。如此设置,可以既有利于增加第三粘接结构33,与主体部21和显示面板10之间的粘接面积,有利于提高主体部21和显示面板10之间的粘性。多个第四部分331间隔设置,还有利于节约资源。
其中,图3H以第三粘接结构33包括2个第四部分331为例进行示意。但是本公开实施例对第四部分331的数量不做限定,可以根据实际需求进行设置。
在一些实施例中,如图3I所示,第四部分331的厚度均相等,且第四部分331的厚度等于第一部分311的厚度。
如此设置,可以保证粘接结构30的平整度,简化粘接结构30的工艺制程。同时,也可以确保主体部21各个位置处与显示面板10之间的粘性,有利于提高显示模组100的质量。
在另一些实施例中,如图3I所示,沿主体部21指向脖子部22的方向上,第四部分331的厚度组件增大,但是第四部分331的厚度最大不超过第一粘接结构31中第一部分311的厚度。也即,沿主体部21指向脖子部22的方向上,第三粘接结构33的厚度组件增加。
由于粘接结构30的粘性与粘接结构30的厚度成正比,上述结构可以使粘接结构30沿主体部21指向脖子部22的方向上的粘力逐渐增大,可以进一步防止由于主体部23靠近脖子部22的一侧所有拉应力较大发生翘曲,剥离显示面板10的问题。同时,由于粘接结构30的厚度渐变设置,也可以防止由于各个粘接结构之间厚度差异较大,导致粘接结构30的表面不平的问题,提高显示模组100的质量。
图4A为根据一些实施例的柔性线路板中主体部和脖子部的连接图。
在一些实施例中,如图4A所示,主体部21包括靠近脖子部22一侧的第一侧边210包括:第一线段211、第二线段212和第三线段213。第二线段212与脖子部22连接,第一线段211和第三线段213分别位于第二线段212的两侧。脖子部22的延伸方向为第一方向Y。平行于显示面板10且垂直于第一方向Y的方向为第二方向X。第一线段211与第三线段213中的至少一个,沿第二方向X延伸,且长度大于或等于2mm。
可以理解的是,在一些实施例中,主体部21和脖子部22可以一体化形成。此时,第二线段212属于主体部21和脖子部22之间的交界线。
其中,第一线段211与第三线段213中的至少一个,沿第二方向X延伸,且长度大于或等于2mm。包括以下三种情况:
第一种:如图4A所示,第一线段211沿第二方向X延伸,且长度大于或等于2mm。限定第一线段211的长度,可以有利于增大主体部21第一侧边210左边的宽度,一定程度的增大第一侧边210的长度。由此,也可以增大主体部21和显示面板10的接触面积,在设置粘接结构30的基础上,可以更有利的增大主体部21和显示面板10之间的粘性,防止该位置处的主体部21被反复拉起发生翘曲,进而导致与显示面板10剥离的问题。有利于提高显示模组100结构的稳定性,有利于提高显示模组100的质量。
第二种:如图4A所示,第三线段213沿第二方向X延伸,且长度大于或等于2mm。限定第三线段213的长度,可以有利于增大主体部21第一侧边210右边的宽度,一定程度的增大第一侧边210的长度。由此,也可以增大主体部21和显示面板10的接触面积,在设置粘接结构30的基础上,可以更有利的增大主体部21和显示面板10之间的粘性,防止该位置处的主体部21被反复拉起发生翘曲,进而导致与显示面板10剥离的问题。有利于提高显示模组100结构的稳定性,有利于提高显示模组100的质量。
第三种:如图4A所示,第一线段211与第三线段213,均沿第二方向X延伸,且长度大于或等于2mm。限定第一线段211和第三线段213的长度,可以有利于增大主体部21第一侧边210两侧的长度。也可以增大主体部21和显示面板10的接触面积,在设置粘接结构30的基础上,可以更有利的增大主体部21和显示面板10之间的粘性,防止该位置处的主体部21被反复拉起发生翘曲,进而导致与显示面板10剥离的问题。有利于提高显示模组100结构的稳定性,有利于提高显示模组100的质量。
当第一线段211与第三线段213中的至少一个,沿第二方向X延伸,且长度等于或趋近于2mm时,相当于主体部21至少一端相对于脖子部22外扩,可以有利于粘接结构30增大该部分主体部21和显示面板10之间的粘性,防止由于在第二线段212位置处收到的拉应力较大,导致的第一侧边210位置处容易发生翘曲的问题,提高显示模组100的质量。
示例性的,第一线段211与第三线段213中的至少一个,沿第二方向X延伸,且长度为2mm、3mm、4mm、5mm、6mm、7mm、8mm、9mm或10mm中一种。
在一些实施例中,如图4A所示,第一线段211的长度大致等于第三线段213的长度。
设置第一线段211的长度大致等于第三线段213的长度,使得脖子部22与主体部21第一边缘210的中间位置(第二线段212)连接。柔性线路板20的结构相对规整,有利于简化柔性线路板20的工艺难度。
图4B为根据另一些实施例的柔性线路板中主体部和脖子部的连接图。
在另一些实施例中,如图4B所示,第一线段211的长度大于第三线段213的长度。
由于显示面板10背光面会设置其他一些元器件,例如,显示面板10右侧,也即是第三线段213对应的位置处一侧设有一些其他元器件。设置第一线段211的长度大于第三线段213的长度。其中,第三线段213的长度较短,可以使得柔性线路板20的脖子部22避让其他元器件,防止影响显示模组100的质量。设置第一线段211的长度较长,可以保证主体部21与显示面板10之间的相对面积,可以有利于粘接结构30增大该部分主体部21和显示面板10之间的粘性,防止主体部21剥离显示面板10的问题,提高显示模组100的质量。
在一些实施例中,如图4A和图4B所示,在第一线段211的长度大于或等于第三线段213的长度的基础上:第一线段211的长度大于或等于8mm。
当第一线段211的长度等于或趋近于8mm时,可以满足主体部21和显示面板10之间对接触面积的需求,以在主体部21和显示面板10之间设有粘接结构30,增大主体部21和粘接结构30的粘性。同时,也可以防止第一线段211的长度过长,影响柔性线路板20的布局。
示例性的,第一线段211的长度等于8mm、10mm、12mm或15mm中一种。
图4C为根据又一些实施例的柔性线路板中主体部和脖子部的连接图。
在又一些实施例中,如图4C所示,第一线段211的长度小于第三线段213的长度。
由于显示面板10背光面会设置其他一些元器件,例如,显示面板10左侧,也即是第一线段211对应的位置处一侧设有一些其他元器件。设置第一线段211的长度小于第三线段213的长度。其中,第一线段211的长度较短,可以使得柔性线路板20的脖子部22避让其他阿元器件,防止影响显示模组100的质量。设置第三线段213的长度较长,可以保证主体部21与显示面板10之间的相对面积,可以有利于粘接结构30增大该部分主体部21和显示面板10之间的粘性,防止主体部21剥离显示面板10的问题,提高显示模组100的质量。
在一些实施例中,如图4A和图4C所示,在第一线段211的长度小于第三线段213的长度的情况下:第三线段213的长度大于或等于8mm。
当第三线段213的长度等于或趋近于8mm时,可以满足主体部21和显示面板10之间对接触面积的需求,以在主体部21和显示面板10之间设有粘接结构30,增大主体部21和粘接结构30的粘性。同时,也可以防止第一线段211的长度过长,影响柔性线路板20的布局。
示例性的,第三线段213的长度等于8mm、10mm、12mm或15mm中一种。
图4D为根据又一些实施例的柔性线路板中主体部和脖子部的连接图。
在又一些实施例中,如图4D所示,第一线段211和第三线段213均沿第二方向X延伸。第一侧边210还包括第四线段214,第四线段214连接于第一线段211与第二线段212之间,第四线段214的中间部位向第二侧边215凸出。第二侧边215为主体部21中第一侧边210的对边。第四线段214限定出槽结构C,槽结构C沿第二方向X的尺寸C1大于或等于槽结构C沿第一方向Y的尺寸C2。
主体部21第一侧边210还包括第四线段214,第四线段214的中间部位向第二侧边215凸出,形成一个槽结构C。且第四线段214连接于第一线段211与第二线段212之间。也即在第一线段211靠近第二线段212的一侧设有槽结构C。
在该位置处设有槽结构C可以用于缓解第一线段211和第二线段212位置处受到的拉应力,从而防止主体部21中第一线段211和第二线段212位置处被反复拉起发生翘曲,进而导致与显示面板10剥离的问题。有利于提高显示模组100结构的稳定性,有利于提高显示模组100的质量。
设置槽结构C沿第二方向X的尺寸C1大于或等于槽结构C沿第一方向Y的尺寸C2。也即,设置槽结构C的宽度C1大于或等于槽结构C的深度C2。其中,图4D以槽结构C的宽度C1等于槽结构C的深度C2为例进行示意。可以理解的是,在另一些实施例中,可以设置槽结构C的宽度C1大于槽结构C的深度C2。
在一些实施例中,结合图4D所示,槽结构C的宽度C1大于或等于5mm。设置槽结构C的宽度C1可以大一些,相当于在第二方向X上占主体部21第一侧边210的比例更多一些,可以更好的缓解第一线段211和第二线段212位置处受到的拉应力。
在一些实施例中,结合图4D所示,槽结构C的深度C2大于或等于2mm。设置槽结构C的深度C2可以小一些,可以减小在第一方向Y上占主体部21的比例,防止影响主体部21内的尺寸,从而影响主体部21内走线以及元器件的布局。同时,也可以防止槽结构C的深度C2过深导致槽结构C底部受到的应力更大,而有可能会导致影响主体部21质量的问题。
在一些实施例中,结合图4D所示,槽结构C截面的形状可以为U形,也即槽结构C的底部与槽结构C的侧壁通过弧形面连接。也可以实现减缓槽结构C受到的拉应力,防止影响柔性线路板20的质量。
但本公开实施例对槽结构C截面的具体形状不做限定,仅以U形为例进行示意。可以理解的是,在另一些实施例中,槽结构C截面的形状可以为半圆。
在一些实施例中,在设置第四线段214的基础上,第一线段211的长度可以大于或等于槽结构C的宽度C1。可以在利用槽结构C减小第一线段211和第二线段212位置处受到的拉应力的基础上,使第一线段211可以满足主体部21与显示面板10之间的接触面积,从而可以利用粘接结构30增大主体部21和显示面板10之间的粘性,防止主体部21剥离显示面板10的问题,提高显示模组100的质量。例如,此时第一线段211的长度可以大于或等于5mm。
其中,图4D以将第四线段214设置在第一线段211和第二线段212之间为例进行示意。但是本公开并不限制于此,可以理解的是,在另一些实施例中,可以将第四线段214设置在第三线段213和第二线段212之间。此时,第二线段212的结构可以与上述对应第一线段211的结构相同,在此不在赘述。
图4E为根据又一些实施例的柔性线路板中主体部和脖子部的连接图。
在又一些实施例中,如图4E所示,第二线段212沿第二方向X延伸。第一线段211与脖子部22中沿第一方向Y延伸的侧边之间的夹角α为钝角。
与图4A~图4D不同的是,图4A~图4D所示的第一线段211和第三线段213均沿第二方向X设置,可以相对简化柔性线路板20中第一侧边210的工艺难度。而图4E以第一线段211与第二方向X具有夹角为例进行示意,也即柔性线路板20的第一侧边210包括斜边(第一线段211)和直线边(第二线段212和第三线段213)。如此设置,可以相对减少柔性线路板20中主体部21的尺寸,从而可以更好的避让显示面板10背光面上设置的其他元件器,避免相互短路或者串扰的问题。
在一些示例中,夹角90°<α≤170。当夹角α等于或趋近于90°时,第一线段211接近水平状态,可以更好的保证主体部21的尺寸,从而利用粘接结构30更好的固定主体部21和显示面板10。同时,也可以一定程度的避让一些显示面板10背光侧设置的元器件。当夹角α等于或趋近于170°时,可以更好的避让显示面板10背光侧设置的元器件。同时也可以满足主体部21对尺寸的需求,可以利用粘接结构30固定主体部21和显示面板10。
在另一示例中,夹角120°<α≤150。当夹角α等于或趋近于120°时,可以在保证主体部21的尺寸的同时一定程度的避让一些显示面板10背光侧设置的元器件。当夹角α等于或趋近于150°时,可以在更好的避让显示面板10背光侧设置的元器件的同时也可以满足主体部21对尺寸的需求。
示例性的,夹角α为150°、155°、160°、165°或170°中的一种。
在一些实施例中,如图4E所示,在第一线段211与脖子部22中沿第一方向Y延伸的侧边之间的夹角α为钝角的基础上,粘接结构30的部分可以沿第一线段211的延伸方向延伸设置。由此,可以有利于增加第一线段211附近位置处主体部21和显示面板10之间的粘性,防止主体部21剥离显示面板10的问题,提高显示模组100的质量。
图4F为根据又一些实施例的柔性线路板中主体部和脖子部的连接图。
在又一些实施例中,如图4F所示,脖子部22中包括靠近主体部21的过渡部220。过渡部220包括网格结构T。
也即,在脖子部22靠近主体部21的一侧设有网格结构T,可以通过网格结构增加脖子部22靠近主体部21的一侧的柔软度。由此,可以利用网格结构T减缓对主体部21的拉应力,从而有利于防止主体部21剥离显示面板10的问题,提高显示模组100的质量。
在一些实施例中,如图4F所示,脖子部22可以包括柔性基板,以及位于柔性基板一侧的走线层。走线层包括网格走线,网格走线位于过渡部220,形成网格结构T。
本公开对网格走线具体传输的信号不做限定,可以根据实际情况进行设置。在一些示例中,本公开的网格走线避免采用高频信号的走线即可,防止高频信号串扰的问题。
在一些实施例中,如图4F所示,网格结构T中网格线的线宽和相邻网格线之间的间隙的比例范围为1:3~1:9。
当网格结构T中网格线的线宽和相邻网格线之间的间隙的比例等于或趋近于1:3时,相邻网格线之间的间隙较小,有利于设置更多数量的网格走线。同时,也可以起到增加脖子部22靠近主体部21的一侧的柔软度。由此,可以利用网格结构T减缓对主体部21的拉应力,从而有利于防止主体部21剥离显示面板10的问题,提高显示模组100的质量。
当网格结构T中网格线的线宽和相邻网格线之间的间隙的比例等于或趋近于1:9时,相邻网格线之间的间隙较大,有利于更好的增加脖子部22靠近主体部21的一侧的柔软度。由此,可以利用网格结构T减缓对主体部21的拉应力,从而有利于防止主体部21剥离显示面板10的问题,提高显示模组100的质量。同时,也可以满足显示模组100对网格走线数量的需求。
在另一些实施例中,如图4F所示,网格结构T中网格线的线宽和相邻网格线之间的间隙的比例范围为1:4~1:7。
当网格结构T中网格线的线宽和相邻网格线之间的间隙的比例等于或趋近于1:4时,相邻网格线之间的间隙小一些,有利于设置更多数量的网格走线。同时,也可以起到增加脖子部22靠近主体部21的一侧的柔软度。
当网格结构T中网格线的线宽和相邻网格线之间的间隙的比例等于或趋近于1:7时,相邻网格线之间的间隙大一些,有利于更好的增加脖子部22靠近主体部21的一侧的柔软度。同时,也可以满足显示模组100对网格走线数量的需求。
示例性的,网格结构T中网格线的线宽和相邻网格线之间的间隙的比例为1:3、1:4、1:5、1:6、1:7、1:8或1:9中一种。
在一些实施例中,如图4F所示,过渡部220包括第一过渡部221和第二过渡部222。第一过渡部221相对于第二过渡部222更靠近主体部21。第一过渡部221靠近主体部21一侧的宽度大于第一过渡部221远离主体部21一侧的宽度。
由于脖子部22的宽度一般小于主体部21的宽度。设置第一过渡部221与主体部21接触的一侧宽度更宽一些,可以增大第一过渡部221和主体部21之间的连接面积,可以将该位置处接受的拉应力更分散一些,防止出现应力集中出现裂纹或者翘曲的问题。
在另一些实施例中,如图4F所示,第一过渡部221的宽度沿第三方向逐渐减小。第三方向由第一过渡部221靠近主体部21的一端指向第一过渡部221远离主体部21的一端。
设置第一过渡部221的宽度渐变,可以起到更均匀的分散拉应力的作用,有利于更有效的防止出现应力集中出现裂纹或者翘曲的问题。
在一些实施例中,如图4F所示,第一过渡部221包括沿第二方向X上相对的第一边221a和第二边221b。第一边221a与第一线段211连接,第二边221b与第三线段213连接。
第一边221a与第一线段211相交的角度为锐角,第二边221b与第三线段213相交的角度为锐角。以实现第一过渡部221靠近主体部21一侧的宽度大于第一过渡部221远离主体部21一侧的宽度。第一过渡部221与主体部21接触的一侧宽度更宽一些,增大第一过渡部221和主体部21之间的连接面积,可以将该位置处接受的拉应力更分散一些,防止出现应力集中出现裂纹或者翘曲的问题。
示例性的,第一边221a与第一线段211相交的角度为45°,第二边221b与第三线段213相交的角度为45°。既可以有利于增大第一过渡部221与主体部21接触的一侧宽度,又可以有利于简化工艺难度。
图4G为根据又一些实施例的柔性线路板中主体部和脖子部的连接图。
在又一些示例中,如图4G所示,第一边221a和第二边221b均为弧形边。 脖子部22通过弧形边与主体部21连接,或者也可以为脖子部22与主体部21连接位置出圆角设计。可以进一步利用弧形边分散该位置处受到的拉应力,进而有利于减少施加在主体部21上的拉应力。从而有利于防止主体部21剥离显示面板10的问题,提高显示模组100的质量。
图5A为图2C中M-M’向的一种剖面图。
在一些实施例中,如图5A所示,显示模组100还包括散热膜40。散热膜40位于显示面板10和柔性线路板20之间。散热膜40包括粘接层41、第一缓冲层42和第一散热层43。第一缓冲层42位于粘接层41和第一散热层43之间;粘接层41相对于第一缓冲层42更靠近显示面板10。
如上结构,散热膜40一侧的粘接层41与显示面板10连接,散热膜40另一侧的第一散热层43可以与粘接结构30连接。以使散热膜40贴附在显示面板10的背光侧S2,可以起到散热的作用,有助于显示面板10工作时产生的热量快速散发,此外可起到遮光的作用。
图5A为图2C中M-M’向的另一种剖面图。
在另一些实施例中,如图5A所示,本实施例提供的散热膜40中:至少一层缓冲层包括第一缓冲层42和第二缓冲层44。也即,本实施例中的散热膜40中可以包括两层缓冲层。两层缓冲层可以分别为第一缓冲层42和第二缓冲层44。
基于此,散热膜40包括粘接层41、第一缓冲层42、第二缓冲层44和第一散热层43。粘接层41相对于第一缓冲层42更靠近显示面板10。第一缓冲层42位于粘接层41和第二缓冲层44之间。第二缓冲层44的弹性模量大于第一缓冲层42的弹性模量。
如上结构,散热膜40一侧的粘接层41与显示基板U连接,散热膜40另一侧的第一散热层43可以与粘接结构30连接。第一缓冲层42和第二缓冲层44位于粘接层41和第一散热层43之间,且第二缓冲层44位于第一缓冲层42与第一散热层43之间。也即第二缓冲层44相对于第一缓冲层42更远离显示基板U。基于此,设置第二缓冲层44的弹性模量大于第一缓冲层42的弹性模量,第二缓冲层44相对于第一缓冲层42具有更好的弹性和回复性能。当显示模组100受到外力冲击时,可以先利用第二缓冲层44抵抗部分应力,再将剩余部分应力作用至第一缓冲层42上,利用第一缓冲层42缓冲该部分应力,防止对显示面板10造成损害。
在一些实施例中,第二缓冲层44的材料可以为聚酰亚胺(英文全称:Polyimide,简称:PI)、热塑性聚氨酯弹性体(Thermoplastic Polyurethanes, 简称:TPU)、热塑性弹性体(Thermoplastic Elastomer,简称:TPE)或热塑性聚酯弹性体(Thermoplastic Polyester Elastome,简称:TPEE)中任意一种,或者两个以上组合的材料。本公开对此不做限定,或者其他弹性模量大于泡棉的材料也可以。
在一些实施例中,第二缓冲层44的厚度范围为0.02mm~0.2mm。当第二缓冲层44的厚度等于或趋近于0.02mm时,可以满足显示模组100对缓冲回复外力需求的同时更利于实现显示模组100的轻薄化,防止浪费资源。当第二缓冲层44的厚度等于或趋近于0.2mm时,可以满足显示模组100轻薄化需求的同时起到更好的缓冲回复效果,防止外力对显示面板10造成损害。
在另一些实施例中,第二缓冲层44的厚度范围为0.05mm~0.18mm。在又一些实施例中,第二缓冲层44的厚度范围为0.08mm~0.15mm。
示例性的,第二缓冲层44的厚度为0.05mm、0.08mm、0.1mm、0.12mm、0.15mm、0.18mm或0.2mm中一种。
图5B为图2C中M-M’向的又一种剖面图。
在一些实施例中,如图5B所示,本实施例提供的散热膜40中:至少一层散热层包括第一散热层43和第二散热层45。也即,本实施中散热膜40可以包括两层散热层,两层散热层分别为第一散热层43和第二散热层45。
基于此,散热膜40包括粘接层41、第一缓冲层42、第一散热层43和第二散热层45。粘接层41相对于第一缓冲层42更靠近显示面板10。第二散热层45位于第一散热层43远离粘接层41的一侧。
如上结构,散热膜40一侧的粘接层41与显示基板U连接,散热膜40另一侧的第二散热层45可以与粘接结构30连接。第一缓冲层42和第一散热层43,位于粘接层41和第二散热层45之间。先利用第二散热层45对显示模组100进行散热,再利用第一散热层43对显示模组100进行散热。也即,可以利用第一散热层43和第二散热层45共同对显示模组100进行散热,使散热膜40具有更好的散热效果。
在一些示例中,第二散热层45的材料可以为石墨。
图5C为图2C中M-M’向的又一种剖面图。
在一些实施例中,如图5C所示,本实施例提供的散热膜40中:至少一层散热层包括第一散热层43和第二散热层45。至少一层缓冲层包括第一缓冲层42和第二缓冲层44。也即,本实施例中的散热膜40中可以包括两层缓冲层和两层散热层。两层缓冲层分别为第一缓冲层42和第二缓冲层44。两层散热层分别为第一散热层43和第二散热层45。
基于此,散热膜40包括粘接层41、第一缓冲层42、第二缓冲层44、第一散热层43和第二散热层45。第二缓冲层44位于第一缓冲层42与第一散热层43之间。第二缓冲层44的弹性模量大于第一缓冲层42的弹性模量。第二散热层45位于第一散热层43远离粘接层41的一侧。
如上结构,散热膜40一侧的粘接层41与显示基板U连接,散热膜40另一侧的第二散热层45可以与粘接结构30连接。第一缓冲层42、第二缓冲层44和第一散热层43,位于粘接层41和第二散热层45之间。当显示模组100受到外力冲击时,可以先利用第二缓冲层44抵抗部分应力,再将剩余部分应力作用至第一缓冲层42上,利用第一缓冲层42缓冲该部分应力,防止对显示面板10(显示基板U)造成损害。并且,可以利用第一散热层43和第二散热层45共同对显示模组100进行散热,使散热膜40具有更好的散热效果。
图6A为根据另一些实施例的显示模组的背光侧的结构图。
在一些实施例中,如图6A所示,显示模组100还包括屏蔽膜50。屏蔽膜50位于主体部21远离显示面板10的一侧。屏蔽膜50在显示面板10的显示面的正投影覆盖主体部21在显示面板10的显示面的正投影。可以利用屏蔽膜50屏蔽外界的电磁影响,保证显示模组100的显示质量。
在一些实施例中,如图6A所示,屏蔽膜50在显示面板10的显示面的正投影覆盖主体部21在显示面板10的显示面的正投影的基础上,设置屏蔽膜50在显示面板10的显示面的正投影的至少一侧边界B,位于主体部21在显示面板10的显示面的正投影的外部。
通过设置屏蔽膜50在显示面板10的显示面的正投影的至少一侧边界B,位于主体部21在显示面板10的显示面的正投影的外部。也即设置屏蔽膜50相对于主体部21外扩一定程度。由此,可以防止在不可控的误差(如制作工艺误差、设备精度、测量误差等)的情况下,屏蔽膜50在显示面板10的显示面的正投影,无法覆盖全部主体部21在显示面板10的显示面的正投影的问题。从而可以更好的利用屏蔽膜50屏蔽外界的电磁影响,保证显示模组100的显示质量。
在一些实施例中,如图6A所示,屏蔽膜50在显示面板10的显示面正投影,包括靠近脖子部22的第一边界B1。第一边界B1位于主体部21在显示面板10的显示面的正投影的外部。
设置屏蔽膜50在显示面板10的显示面正投影的第一边界B1,位于主体部21在显示面板10的显示面的正投影的外部。也即,相当于屏蔽膜50在靠近脖子部22的一侧外扩,且屏蔽膜50在显示面板10的显示面正投影,也可以覆盖部分脖子部22在显示面板10的显示面正投影。
由于屏蔽膜50位于柔性线路板20远离显示面板10的一侧,且屏蔽膜50在显示面板10的显示面正投影,也可以覆盖部分脖子部22在显示面板10的显示面正投影。进而,可以利用屏蔽膜50起到固定主体部21的作用,防止主体部21容易剥离显示面板10的问题,提高显示模组100的质量。
在另一些实施例中,如图6A所示,屏蔽膜50在显示面板10的显示面的正投影,包括第二边界B2。第二边界B2与第一边界B1相连,且呈钝角。第二边界B位于主体部21在显示面板10的显示面的正投影的外部。
在本实施例中,屏蔽膜50的第二边界B2也相对于主体部21外扩,设置第二边界B2与第一边界B1相连,且呈钝角。可以利用第二边界B2与第一边界B1形成的区域P,相对于主体部21靠近脖子部22一侧的端角位置处J外扩。
由于柔性线路板20在被反复拉起时,主体部21靠近脖子部22的一侧边缘,以及该边缘的端部位置处受到的拉应力较大。如上设置屏蔽膜50的结构,可以利用屏蔽膜50的第二边界B2与第一边界B1形成的区域P,起到固定主体部21的端角位置处J的作用,进一步防止主体部21容易剥离显示面板10的问题,提高显示模组100的质量。
在一些实施例中,如图6A所示,第一边界B1在显示面板10的显示面正投影,与主体部21对应边缘在显示面板10的显示面正投影之间的最小间距的范围为2mm~15mm。
当该最小间距等于或趋近于2mm时,屏蔽膜50外扩程度较小,可以在起到屏蔽外界的电磁影响、固定主体部21的作用的同时可以有效防止资源浪费。当该最小间距等于或趋近于15mm时,屏蔽膜50外扩程度较大,可以在防止浪费资源的同时,更好的起到屏蔽外界的电磁影响、固定主体部21的作用,提高显示模组100的质量。
在另一些实施例中,第一边界B1在显示面板10的显示面正投影,与主体部21对应边缘在显示面板10的显示面正投影之间的最小间距的范围为3.5mm~10mm。在又一些实施例中,第一边界B1在显示面板10的显示面正投影,与主体部21对应边缘在显示面板10的显示面正投影之间的最小间距的范围为5mm~8mm。
示例性的,第一边界B1在显示面板10的显示面正投影,与主体部21对应边缘在显示面板10的显示面正投影之间的最小间距为2mm、3mm、4mm、5mm、6mm、7mm、8mm、9mm或10mm中一种。
图6B为图6A中N-N’向的一种剖面图。
在一些实施例中,屏蔽膜50包括:第一绝缘层51、屏蔽层52和第二绝缘层53。屏蔽层52位于第一绝缘层51和第二绝缘层53之间,且第一绝缘层51相对于屏蔽层52更靠近柔性线路板20。
第一绝缘层51相对于屏蔽层52更靠近柔性线路板20,可以用于使柔性线路板20与屏蔽层52绝缘,防止柔性线路板20与屏蔽层52短路。同时,也可以利用第一绝缘层51,分别与柔性线路板20和屏蔽层52粘接固定。
在一些示例中,第一绝缘层51可以为绝缘胶层。
在一些示例中,第一绝缘层51的厚度范围为10μm~100μm。第一绝缘层51的厚度等于或趋近于10μm时,可以满足固定粘接屏蔽层52和柔性线路板20,同时由于第一绝缘层51的厚度较薄,也可以有利于显示模组100的轻薄化,以及避免浪费资源。当第一绝缘层51的厚度等于或趋近于100μm时,可以满足防止浪费资源,同时由于第一绝缘层51的厚度较厚,第一绝缘层51的粘性更强,可以更好的固定粘接屏蔽层52和柔性线路板20。
在另一些示例中,第一绝缘层51的厚度范围为20μm~50μm。
示例性的,第一绝缘层51的厚度为10μm、20μm、30μm、40μm或50μm中一种。
第二绝缘层53位于屏蔽层52远离第一绝缘层51的一侧,第二绝缘层53位于屏蔽膜50内的最外侧。可以利用第二绝缘层53起到保护屏蔽层52的作用。
在一些示例中,第一绝缘层51的材料可以与第二绝缘层53的材料相同,均为绝缘胶层。在另一些示例中,第一绝缘层51的材料可以与第二绝缘层53的材料也可以不同。本公开实施例对此不做限定。
在一些示例中,第二绝缘层53的厚度范围为20μm~100μm。第二绝缘层53的厚度等于或趋近于20μm时,可以满足固定保护屏蔽层52,同时由于第二绝缘层53的厚度较薄,也可以有利于显示模组100的轻薄化,以及避免浪费资源。当第二绝缘层53的厚度等于或趋近于100μm时,可以满足防止浪费资源,同时由于第二绝缘层53的厚度较厚,第二绝缘层53的粘性更强,可以更好的固定粘接屏蔽层52。
在另一些示例中,第一绝缘层51的厚度范围为30μm~50μm。
示例性的,第一绝缘层51的厚度为10μm、20μm、30μm、40μm或50μm中一种。
在一些实施例中,如图6B所示,在第二绝缘层53相对于第一绝缘层51更远离显示面板10的基础上,设置第二绝缘层53的厚度大于或等于第一绝缘层51的厚度。
第一种:如图6B所示,第二绝缘层53的厚度等于第一绝缘层51的厚度。
设置屏蔽膜50中两个绝缘层厚度相等,可以简化屏蔽膜50的工艺难度。
第二种:第二绝缘层53的厚度大于第一绝缘层51的厚度。
设置外侧的第二绝缘层53的更厚一些,可以更好的起到保护屏蔽层52,以及显示模组100的作用。而设置内侧的第一绝缘层51的厚度更薄一些,可以在满足粘接柔性线路板20和屏蔽层52时,节省绝缘层的资源。
图6C为图6A中N-N’向的另一种剖面图。图6D为图6A中N-N’向的又一种剖面图。
在一些实施例中,如图6B~图6D所示,在屏蔽膜50包括:第一绝缘层51、屏蔽层52和第二绝缘层53的情况下:可以设置第一绝缘层51、屏蔽层52和第二绝缘层53中至少一层,在显示面板10的显示面正投影的至少一个边界,位于主体部21在显示面板10的显示面的正投影的外部。可以利用屏蔽膜50中外扩的那个膜层起到固定主体部21的作用,防止主体部21容易剥离显示面板10的问题,提高显示模组100的质量。
其中,图6B以第二绝缘层53外扩为例进行示意。图6C以屏蔽层52外扩为例进行示意。图6D以第一绝缘层51外扩为例金属示意。但本公开实施例并不限制于此,也可以设置屏蔽膜50中任意两层外扩,或者三层均外扩设计。
图6E为图6A中I-I’向的一种剖面图。
在一些实施例中,如图6A和图6E所示,显示模组100还包括驱动芯片60。驱动芯片60位于显示面板10的背光侧S2。驱动芯片60用于驱动显示面板10。第一绝缘层51包括第一过孔K。驱动芯片60穿过第一过孔K与屏蔽层52接触。在平行于显示面板10的显示面的方向上,屏蔽层52的部分凸出于柔性线路板20和第一绝缘层51,以使屏蔽层52的部分与散热膜40接触。
如此设置,当显示模组100工作时,驱动芯片60驱动显示面板10,驱动芯片60会产生热量。由于驱动芯片60穿过第一过孔K与屏蔽层52接触,且屏蔽层52的部分与散热膜40接触。此时,驱动芯片60产生的热量会导热至屏蔽层52上,屏蔽层52将该部分热量导热至散热膜40上。由此可以利用散热膜40对驱动芯片60进行散热。防止驱动芯片60的热量过高,影响驱动芯片60的性能和寿命。
其中,图6E以屏蔽层52外扩、第一绝缘层51未外扩为例进行示意。以使屏蔽层52的部分与散热膜40接触。此时,第二绝缘层53可以外扩设置,第二绝缘层53的外扩程度对屏蔽层52的部分与散热膜40接触无影响,可以灵活设置。可以理解的是,当第一绝缘层51也外扩的情况下,以及屏蔽层52和散热膜40之间设有第一绝缘层51时,第一绝缘层51可以设置第二过孔,以使屏蔽层52的部分通过第二过孔与散热膜40接触。
图6F为根据又一些实施例的显示模组的背光侧的结构图。图6G为图6F中F-F’向的一种剖面图。
其中,“显示模组100还包括驱动芯片60。驱动芯片60位于显示面板10的背光侧S2”可以包括以下两种情况:
第一种:如图6A所示,显示面板10(显示基板U)包括显示部和绑定部。绑定部包括柔性线路板20。柔性线路板20可以弯折至显示面板10的背光侧。
此时,驱动芯片60可以采用COF(Chip On Film,覆晶薄膜)技术固定在柔性线路板20上。进一步,设置驱动芯片60位于主体部21靠近脖子部22的一端。由此,驱动芯片60随该部分主体部21弯折至显示面板10的背光侧。由此,可以减少驱动芯片60和柔性线路板20对显示面板10出光侧S1的边框的占用,有利于实现显示面板10的窄边框,提高显示模组100的屏占比。
第二种:如图6F和图6G所示,显示面板10为柔性显示面板。显示面板10(显示基板)包括显示部11、弯折部12和绑定部13。弯折部12位于显示部11和绑定部13之间。绑定部13包括柔性线路板20。显示面板10的绑定部可以利用弯折部12弯折至显示面板10的背光侧S2。
此时,驱动芯片60可以采用COP(Chip on Panel)技术固定在绑定部上,且驱动芯片60相对于柔性线路板20更靠近弯折部12。
当绑定部利用弯折部12弯折至显示面板10的背光侧S2时,柔性线路板20和驱动芯片60均可以随该部分绑定部弯折至显示面板10的背光侧。由此,可以减少驱动芯片60和柔性线路板20对显示面板10出光侧S1的边框的占用,有利于实现显示面板10的窄边框,提高显示模组100的屏占比。
可以理解的是,上述图6E以图6A所示显示模组为例进行示意,但并不限制于此,图6E所示结构也可以适用于图6F所示的显示模组100。
在一些实施例中,如图6A和图6E所示,沿平行显示面板10显示面的方向上,驱动芯片60和第一过孔K之间的最小间距为0.5mm~2mm。设置第一过孔K的尺寸较大,可以便于驱动芯片60对位安装。
当驱动芯片60和第一过孔K之间的最小间距等于或趋近于0.5mm时, 可以在便于对位安装驱动芯片60的同时防止第一过孔K的尺寸过大,容易导致屏蔽层52和柔性线路板20短路的问题。当驱动芯片60和第一过孔K之间的最小间距等于或趋近于2mm时,可以在防止容易导致屏蔽层52和柔性线路板20短路的问题的同时,防止第一过孔K尺寸过小,不利于对位安装驱动芯片60的问题。
在另一些实施例中,沿平行显示面板10显示面的方向上,驱动芯片60和第一过孔K之间的最小间距为0.8mm~1.8mm。在又一些实施例中,沿平行显示面板10显示面的方向上,驱动芯片60和第一过孔K之间的最小间距为1mm~1.5mm。
示例性的,沿平行显示面板10显示面的方向上,驱动芯片60和第一过孔K之间的最小间距为0.2mm、0.5mm、0.8mm、1mm、1.2mm、1.5mm、1.8mm或2mm中一种。
在一些实施例中,如图6A和图6E所示,显示模组100还包括导热结构70。导热结构70包括第一导热结构71和第二导热结构72。驱动芯片60通过第一导热结构71与屏蔽层52接触。屏蔽层52通过第二导热结构72与散热膜40接触。
通过第一导热结构71使驱动芯片60与屏蔽层52间接接触,固定驱动芯片60与屏蔽层52,以使驱动芯片60工作时产生的热量可通过第一导热结构71导热至屏蔽层52。
通过第二导热结构72使屏蔽层52与散热膜40间接接触,固定屏蔽层52与散热膜40,以使驱动芯片60导热至屏蔽层52上的热量,可以通过第二导热结构72导热至散热膜40。最后,利用散热膜40对该部分热量进行散热处理,以此防止驱动芯片60的热量过高,影响驱动芯片60的性能和寿命。
在一些示例中,如图6A和图6E所示,第一导热结构71的材料和第二导热结构72的材料可以相同,均为导热胶。可以理解的是,在另一些实施例中,第一导热结构71的材料和第二导热结构72的材料也可以不同。本公开对此不做限定,只要可以用于起到粘接、导热的作用即可。
图7A为根据一些实施例的显示模组的爆炸图。图7B为根据另一些实施例的显示模组的爆炸图。其中,图7A以采用COF技术的显示模组为例进行示意。图7B以采用COP技术的显示模组为例进行示意。
在一些实施例中,如图7A和图7B所示,显示面板10还包括第一光学胶层102、偏光片103。
偏光片103位于显示基板U和保护盖板101之间。偏光片103可以为圆偏光片。此处,偏光片103可以减少外界光发射,防止显示面板10产生刺眼效果。
第一光学胶层102位于保护盖板101和偏光片103之间。以使保护盖板101和偏光片103通过第一光学胶层102固定粘接。第一光学胶层102的材料包括热固定树脂胶或光可固化树脂。示例性的,第一光学胶层102的材料为OCA光学胶(Optical Clear Adhesive)。
以上所述,仅为本公开的具体实施方式,但本公开的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本公开揭露的技术范围内,想到变化或替换,都应涵盖在本公开的保护范围之内。因此,本公开的保护范围应以所述权利要求的保护范围为准。

Claims (24)

  1. 一种显示模组,包括:
    显示面板,具有出光侧以及与所述出光侧相对的背光侧;所述显示面板包括保护盖板、显示基板和散热膜;所述显示基板位于所述保护盖板和所述散热膜之间,且所述保护盖板位于所述显示基板朝向所述出光侧的一侧;
    所述散热膜包括粘接层、至少一层缓冲层和至少一层散热层;所述至少一层缓冲层位于所述粘接层和所述至少一层散热层之间,且所述粘接层位于所述至少一层缓冲层靠近保护盖板的一侧;
    柔性线路板,所述柔性线路板包括主体部、脖子部和连接部;所述脖子部位于主体部和连接部之间;所述主体部远离所述脖子部的一端与所述显示面板边缘连接;所述连接部、所述脖子部以及至少部分所述主体部位于所述显示面板的背光侧;
    粘接结构,位于所述主体部和所述至少一层散热层之间,且所述粘接结构的至少部分位于所述主体部中靠近所述脖子部的边缘区域。
  2. 根据权利要求1所述的显示模组,其中,所述粘接结构包括第一粘接结构;
    所述第一粘接结构包括第一部分;所述第一部分位于所述主体部中靠近所述脖子部的边缘区域;
    所述脖子部的延伸方向为第一方向;
    所述第一部分沿第一方向的尺寸与所述主体部沿第一方向的尺寸的比值大于或等于10%,且小于或等于50%。
  3. 根据权利要求2所述的显示模组,其中,
    平行于所述显示面板且垂直于所述第一方向的方向为第二方向;
    所述第一部分沿所述第二方向的至少一端超出所述脖子部。
  4. 根据权利要求3所述的显示模组,其中,
    所述第一部分沿所述第二方向的尺寸,大于所述脖子部沿所述第一方向的尺寸。
  5. 根据权利要求2所述的显示模组,其中,
    所述第一部分沿所述第一方向的两端与所述主体部中靠近所述脖子部的边缘区域沿所述第一方向的两端平齐。
  6. 根据权利要求2~5中任一项所述的显示模组,其中,所述第一粘接结构还包括第二部分;
    所述第二部分位于所述第一部分远离所述脖子部的一侧,且所述第二部分与所述第一部分相连;
    其中,所述第一部分和所述第二部分沿第一方向的尺寸之和,与所述主体部沿第一方向的尺寸的比值大于或等于50%,且小于或等于90%;或者,所述第一部分和所述第二部分沿第一方向的尺寸之和,与所述主体部沿第一方向的尺寸的比值等于100%。
  7. 根据权利要求6所述的显示模组,其中,
    所述第一部分和所述第二部分两者在所述显示面板的显示面的正投影,与所述主体部在所述显示面板的显示面的正投影重叠。
  8. 根据权利要求2~5中任一项所述的显示模组,其中,所述第一粘接结构还包括第三部分;
    所述第三部分与所述第一部分相连,以围设成沿所述主体部的边缘延伸的框形结构。
  9. 根据权利要求8所述的显示模组,其中,所述粘接结构还包括第二粘接结构;
    所述第二粘接结构位于所述框形结构的内侧,所述第二粘接结构和所述框形结构间隔设置。
  10. 根据权利要求2~5中任一项所述的显示模组,其中,所述粘接结构还包括第三粘接结构;
    所述第三粘接结构位于所述第一部分远离所述脖子部的一侧,且所述第三粘接结构与所述第一部分间隔设置。
  11. 根据权利要求10所述的显示模组,其中,
    所述第三粘接结构包括多个第四部分,所述多个第四部分沿所述第一方向间隔排布。
  12. 根据权利要求1~11中任一项所述的显示模组,其中,所述主体部包括靠近所述脖子部一侧的第一侧边包括:第一线段、第二线段和第三线段;所述第二线段与所述脖子部连接,所述第一线段和所述第三线段分别位于所述第二线段的两侧;
    所述脖子部的延伸方向为第一方向;
    平行于所述显示面板且垂直于所述第一方向的方向为第二方向;
    所述第一线段与所述第三线段中的至少一个,沿所述第二方向延伸,且长度大于或等于2mm。
  13. 根据权利要求12所述的显示模组,其中,
    所述第一线段和所述第三线段均沿所述第二方向延伸;
    所述第一侧边还包括第四线段,所述第四线段连接于所述第一线段与所述第二线段之间,所述第四线段的中间部位向第二侧边凸出;所述第二侧边为所述主体部中所述第一侧边的对边;
    所述第四线段限定出槽结构,所述槽结构沿所述第二方向的尺寸大于或等于所述槽结构沿所述第一方向的尺寸。
  14. 根据权利要求12所述的显示模组,其中,
    所述第二线段沿所述第二方向延伸;所述第一线段与所述脖子部中沿所述第一方向延伸的侧边之间的夹角为钝角。
  15. 根据权利要求1~14中任一项所述的显示模组,其中,所述脖子部中包括靠近所述主体部的过渡部;
    所述过渡部包括网格结构。
  16. 根据权利要求1~15中任一项所述的显示模组,其中,
    所述过渡部包括第一过渡部和第二过渡部;所述第一过渡部相对于所述第二过渡部更靠近所述主体部;所述第一过渡部的宽度沿第三方向逐渐减小;所述第三方向由所述第一过渡部靠近所述主体部的一端指向所述第一过渡部远离所述主体部的一端。
  17. 根据权利要求1~16中任一项所述的显示模组,其中,
    所述至少一层缓冲层包括第一缓冲层和第二缓冲层;所述第一缓冲层位于所述粘接层和所述第二缓冲层之间;所述第二缓冲层的弹性模量大于所述第一缓冲层的弹性模量;
    和/或,
    所述至少一层散热层包括第一散热层和第二散热层,所述第二散热层位于所述第一散热层远离所述粘接层的一侧。
  18. 根据权利要求1~17中任一项所述的显示模组,还包括屏蔽膜;所述屏蔽膜位于所述主体部远离所述显示面板的一侧;所述屏蔽膜在所述显示面板的显示面的正投影覆盖所述主体部在所述显示面板的显示面的正投影;且所述屏蔽膜在所述显示面板的显示面的正投影的至少一侧边界,位于所述主体部在所述显示面板的显示面的正投影的外部。
  19. 根据权利要求18所述的显示模组,其中,所述屏蔽膜在所述显示面板的显示面正投影,包括靠近所述脖子部的第一边界;所述第一边界位于所述主体部在所述显示面板的显示面的正投影的外部。
  20. 根据权利要求19所述的显示模组,其中,所述屏蔽膜在所述显示面板的显示面的正投影,包括第二边界;所述第二边界与所述第一边界相连, 且呈钝角;
    所述第二边界位于所述主体部在所述显示面板的显示面的正投影的外部。
  21. 根据权利要求18或19所述的显示模组,所述屏蔽膜包括:第一绝缘层、屏蔽层和第二绝缘层;所述屏蔽层位于所述第一绝缘层和所述第二绝缘层之间,且所述第一绝缘层相对于所述屏蔽层更靠近所述主体部;
    所述第二绝缘层的厚度大于或等于所述第一绝缘层的厚度。
  22. 根据权利要求21所述的显示模组,还包括驱动芯片;所述驱动芯片位于所述显示面板的背光侧;所述驱动芯片用于驱动所述显示面板;
    所述第一绝缘层包括第一过孔;所述驱动芯片穿过所述第一过孔与所述屏蔽层接触;
    在平行于所述显示面板的显示面的方向上,所述屏蔽层的部分凸出于所述主体部和所述第一绝缘层,以使所述屏蔽层的部分与所述散热膜接触。
  23. 根据权利要求22所述的显示模组,其中,还包括导热结构;
    所述导热结构包括第一导热结构和第二导热结构;所述驱动芯片通过所述第一导热结构与所述屏蔽层接触;所述屏蔽层通过第二导热结构与所述散热膜接触。
  24. 一种显示装置,包括权利要求1~23中任一项所述的显示模组。
PCT/CN2023/114447 2022-08-24 2023-08-23 显示模组及显示装置 WO2024041571A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202211021607.9A CN115620638A (zh) 2022-08-24 2022-08-24 显示模组及显示装置
CN202211021607.9 2022-08-24

Publications (2)

Publication Number Publication Date
WO2024041571A1 WO2024041571A1 (zh) 2024-02-29
WO2024041571A9 true WO2024041571A9 (zh) 2024-04-11

Family

ID=84856681

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2023/114447 WO2024041571A1 (zh) 2022-08-24 2023-08-23 显示模组及显示装置

Country Status (2)

Country Link
CN (1) CN115620638A (zh)
WO (1) WO2024041571A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115620638A (zh) * 2022-08-24 2023-01-17 京东方科技集团股份有限公司 显示模组及显示装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108251007B (zh) * 2018-01-02 2023-07-04 武汉天马微电子有限公司 磁性胶带和显示装置
KR102562204B1 (ko) * 2018-12-13 2023-07-31 엘지디스플레이 주식회사 플렉서블 디스플레이 모듈 및 이를 포함하는 전자 기기
CN109493748B (zh) * 2019-01-04 2021-01-22 京东方科技集团股份有限公司 显示模组、显示装置及显示模组的制作方法
EP4009308A4 (en) * 2019-08-01 2022-08-10 BOE Technology Group Co., Ltd. DISPLAY APPARATUS AND METHOD OF ASSEMBLING IT
CN215345216U (zh) * 2021-06-28 2021-12-28 抚州联创电子有限公司 一种柔性电路板及电子设备
CN114144038A (zh) * 2021-12-01 2022-03-04 京东方科技集团股份有限公司 一种显示模组及显示装置
CN217112946U (zh) * 2022-02-17 2022-08-02 信利半导体有限公司 一种显示模组、移动终端及电子设备
CN115620638A (zh) * 2022-08-24 2023-01-17 京东方科技集团股份有限公司 显示模组及显示装置

Also Published As

Publication number Publication date
CN115620638A (zh) 2023-01-17
WO2024041571A1 (zh) 2024-02-29

Similar Documents

Publication Publication Date Title
US11204628B2 (en) Flexible display apparatus and electronic device comprising the same
WO2020015344A1 (zh) 显示面板及显示装置
US11460738B2 (en) Display device
WO2022088457A1 (zh) 显示模组
TWI352847B (en) Display device
WO2020015390A1 (zh) 显示面板及其制造方法
TWI518650B (zh) 顯示裝置
WO2024041571A9 (zh) 显示模组及显示装置
TWI693457B (zh) 面光源裝置、顯示裝置以及電子機器
CN110718159A (zh) Oled显示屏及oled显示装置
WO2019223726A1 (zh) 触控显示装置及其制造方法
US10739514B2 (en) Light source device, backlight device comprising the same and liquid crystal display device
JP2013160942A (ja) 半導体装置およびその製造方法、並びに電子機器
WO2017067101A1 (zh) 背光模块及液晶显示器
WO2017024756A1 (zh) 灯条、背光模组及其组装方法、显示装置
JP2005099221A (ja) Lcdの保持構造
JP4487553B2 (ja) 液晶表示装置
JP2007206125A (ja) Lcdバックライトフレーム、lcdモジュールの保持構造及び電子機器
WO2016176924A1 (zh) 光源组件及背光模块
TWI395015B (zh) 顯示裝置
US20240196701A1 (en) Display device and mobile terminal
JP6638439B2 (ja) 面光源装置、表示装置、及び電子機器
WO2018082360A1 (zh) 灯条、侧入式背光模组及显示装置
JP2012123170A (ja) 表示装置
US10725232B2 (en) Backlight device and liquid crystal display device comprising the same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23856659

Country of ref document: EP

Kind code of ref document: A1