WO2018082360A1 - 灯条、侧入式背光模组及显示装置 - Google Patents
灯条、侧入式背光模组及显示装置 Download PDFInfo
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- WO2018082360A1 WO2018082360A1 PCT/CN2017/096522 CN2017096522W WO2018082360A1 WO 2018082360 A1 WO2018082360 A1 WO 2018082360A1 CN 2017096522 W CN2017096522 W CN 2017096522W WO 2018082360 A1 WO2018082360 A1 WO 2018082360A1
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- WIPO (PCT)
- Prior art keywords
- light
- backlight module
- light bar
- edge
- circuit board
- Prior art date
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Definitions
- the present disclosure relates to a light bar, a side-lit backlight module, and a display device.
- an LED Light Emitting Diode
- a light mixing distance between the LEDs is long, at least greater than 2.5 mm, which results in a light incident distance of the backlight module. It must be above 2.8mm, which hinders the maximization of the visible area of the electronic device, thus limiting the development of the narrow bezel technology.
- At least one embodiment of the present disclosure provides a light bar including: a circuit board and an integrated illuminator disposed on the circuit board; wherein the integrated illuminator includes a package and a plurality of light sources, the package The object is configured to package the plurality of light sources.
- the material of the package is a light transmissive material.
- the plurality of light sources are connected in parallel or in series.
- the light source is an LED
- the plurality of the LEDs are packaged by a direct package.
- the integrated illuminator is perpendicular to the circuit board, and the distance from the light emitting surface to the edge of the circuit board adjacent to the light emitting surface is W1, wherein 0.3 mm ⁇ W1 ⁇ 1.0 mm.
- the distance from the edge of the integrated illuminator to the edge of the circuit board is L1, where L1>0.5 mm.
- the integrated illuminator is fixedly connected to the circuit board through a pad having a radius R ⁇ 0.3 mm.
- the thickness of the circuit board is D1, wherein 0.06 mm ⁇ D1 ⁇ 0.12 mm.
- the integrated illuminator has a thickness D2, wherein 0.3 mm ⁇ D2 ⁇ 0.6 mm.
- At least one embodiment of the present disclosure also provides a side-lit backlight module including any of the above light strips.
- the edge-lit backlight module provided by at least one embodiment of the present disclosure further includes a light guide plate, wherein the light guide plate is disposed on a light emitting surface side of the light bar, and the circuit board is disposed on the light guide plate.
- the light guide plate is disposed on a light emitting surface side of the light bar
- the circuit board is disposed on the light guide plate.
- the light bar is fixed to the light guide plate by a rubber provided on a main surface of the circuit board, and the preparation glue is covered by The integrated illuminator is exposed on the light bar.
- the preparation glue extends beyond one side edge of the light bar along the width direction of the light bar.
- the width of the preparation glue beyond the edge of the light bar is W2, wherein 0.25 mm ⁇ W2 ⁇ 1.0 mm.
- the edge-lit backlight module provided by at least one embodiment of the present disclosure further includes an optical film disposed on a light-emitting side of the light guide plate, wherein the optical film overlaps the preparation glue beyond the light bar. On one side of the edge.
- the thickness of the preparation glue is D3, wherein 0.03 mm ⁇ D3 ⁇ 0.06 mm.
- a gap between the preparation glue and the integrated illuminator is W3, where 0.1 mm ⁇ W3 ⁇ 0.15 mm.
- the edge-lit backlight module provided by at least one embodiment of the present disclosure further includes a shading An adhesive tape, wherein the light shielding tape is disposed on a back surface of the wiring board of the light bar, and extends from an edge of the circuit board to above the light guide plate.
- the distance from the light-emitting surface of the light bar to the edge of the light-shielding tape above the light guide plate is K, where 0.8 mm ⁇ K ⁇ 2.0mm.
- At least one embodiment of the present disclosure further provides a display device including any of the above-described side-lit backlight modules.
- FIG. 1 is a schematic structural diagram of a light bar according to an embodiment of the present disclosure
- Figure 2 is a cross-sectional view of the light bar of Figure 1 taken along line AA';
- FIG. 3 is a schematic structural diagram of a light bar according to an embodiment of the present disclosure.
- FIG. 4 is a schematic structural diagram of a side-entry backlight module according to an embodiment of the present disclosure
- FIG. 5 is a schematic diagram of providing a glue on a light bar according to an embodiment of the present disclosure
- FIG. 6 is a schematic diagram of providing a glue on a light bar according to another embodiment of the present disclosure.
- FIG. 1 is a schematic structural view of a light bar according to an embodiment of the present disclosure
- FIG. 2 is a cross-sectional view of the light bar of FIG. 1 taken along AA′.
- the light bar includes a circuit board 10 and an integrated illuminator 20 disposed on the circuit board 10; the integrated illuminator 20 includes an encapsulant 22 and a plurality of light sources 21, and the package 22 is configured as a package.
- the plurality of light sources 21 are, for example, integrally packaged with the plurality of light sources 21.
- the material of the package 22 is a light transmissive material such as transparent glass, transparent resin or transparent plastic.
- the circuit board 10 is configured to provide a signal to the light source 21 to cause the light source 21 to illuminate.
- the circuit board 10 is, for example, an FPC, in view of the fact that the FPC (Flexible Printed Circuit) is small in size, light in weight, and freely bendable.
- the dotted frame portion in Fig. 1 is a trace 11 extending from the wiring board 10.
- the trace 11 is electrically connected to the light source 21 and connected to an external device.
- the plurality of light sources 21 may be connected in series or in parallel, which is not specifically limited herein.
- the light source is an LED
- the plurality of LEDs are packaged by a direct package.
- the light source 21 is, for example, a light-emitting bare chip.
- the integrated light-emitting body 20 can be obtained by integrally encapsulating a plurality of light-emitting bare chips.
- the length of the integrated illuminator 20 is less than the length of the circuit board 10, and the width of the integrated illuminator 20 is less than the width of the circuit board 10.
- the length and width of the integrated illuminator 20, as well as the length and width of the circuit board 10, may depend on the device to which the light bar is actually applied.
- the length of the circuit board 10 is related to the length of the mobile phone.
- the width of the circuit board 10 may be between 2.0 mm and 2.8 mm, for example, about 2.2 mm, 2.3 mm, 2.4 mm, or 2.8 mm, etc.; the width of the corresponding integrated illuminator 20 may be between 0.5 mm and 0.8 mm. For example, it is about 0.5 mm, 0.6 mm, 0.7 mm, or 0.8 mm, and the like.
- the thickness D1 of the wiring board 10 can be controlled between 0.06 mm and 0.12 mm, for example, about 0.06 mm, 0.08 mm, 0.09 mm, 0.10 mm, or 0.12 mm, or the like.
- the thickness of the integrated illuminator 20 is related to the thickness of the light source 21, and the thickness D2 of the integrated illuminator 20 can be controlled between 0.3 mm and 0.6 mm, for example, about 0.3 mm, 0.4 mm, 0.5 mm, or 0.6 mm. . Based on this, when the light source 21 is selected, the light source 21 having a small thickness is selected as much as possible.
- the light bar includes a plurality of point light sources, and the light mixing distance between the point light sources is at least 2.5 mm, which is disadvantageous for the narrow frame design.
- the integrated light-emitting body 20 is obtained by encapsulating the plurality of light sources 21 by using the package 22, so that the light emitted from the integrated light-emitting body 20 is denser, thereby mixing the integrated light-emitting body 20.
- the light distance is reduced, thereby shortening the light incident distance of the backlight module, and is advantageous for realizing a backlight module structure with an ultra-short light entrance distance, thereby increasing the visible area of the display device, thereby realizing a narrow border of the display device. design.
- FIG. 3 is a schematic structural diagram of a light bar according to an embodiment of the present disclosure.
- LED Light Emitting Diode
- the light source 21 can be The LED 201 and the plurality of LEDs 201 are packaged by a COB (Chip On Board) package.
- the LED 201 can be an LED bare chip.
- a plurality of LEDs 201 are packaged by COB encapsulation, and the package method includes: first soldering a plurality of LEDs 201 on a substrate by a soldering technique, and then integrating the substrate on which the plurality of LEDs 201 are soldered by a COB integrated packaging technology.
- the package method includes: first soldering a plurality of LEDs 201 on a substrate by a soldering technique, and then integrating the substrate on which the plurality of LEDs 201 are soldered by a COB integrated packaging technology.
- an integrated illuminator 20 as shown in FIG. 3 can be obtained at this time.
- the substrate is soldered to the wiring board 10.
- the substrate is a metal substrate
- the material of the metal substrate is, for example, an aluminum alloy or a copper alloy. Due to the electrical conductivity of the metal, on the one hand, the circuit board 10 can drive the integrated illuminant 20 to emit light. On the other hand, the metal substrate can contribute to heat dissipation of the light bar, thereby improving the life of the light bar.
- the embodiment of the present disclosure encapsulates the plurality of LEDs 201 by a COB package, so that the light mixing distance of the integrated illuminator 20 can be 0.5 mm to 1.5 mm, for example, about 0.5 mm. 0.7mm, 0.9mm, 1.2mm or 1.5mm, etc., which is more conducive to the realization of the ultra-short light-into-light backlight module structure, and the COB package can ensure the light-emitting performance of the light bar.
- the light-emitting surface of the integrated illuminator 20 (for example, the surface from which light is emitted in FIG. 3) is perpendicular to the wiring board 10; the distance from the light-emitting surface to the upper edge 10a of the wiring board 10 adjacent to the light-emitting surface Is W1, where 0.3 mm ⁇ W1 ⁇ 1.0 mm, for example, W1 is approximately 0.3 mm, 0.5 mm, 0.7 mm, 0.9 mm or 1.0 mm, or the like.
- the light bar When the light bar is applied to the structure of the side-lit backlight module, for example, the light bar can be fixed on the light guide plate. At this time, if the distance W1 between the light-emitting surface and the upper edge 10a of the circuit board 10 close to the light-emitting surface is too short, It is easy to cause the light guide plate to be fixed to the light bar. Therefore, the phenomenon that the light guide plate is detached occurs; if W1 is too long, the loss of the light emission of the LED 201 is excessively large. Therefore, the range of W1 is selected to be 0.3 mm ⁇ W1 ⁇ 1.0 mm.
- the range of W1 can also be selected to be 0.3 mm ⁇ W1 ⁇ 0.6 mm.
- the distance from the left edge of the integrated illuminator 20 to the left edge 10b of the adjacent wiring board 10 is L1, for example, L1 > 0.5 mm.
- L1 the distance from the left edge of the integrated illuminator 20 to the left edge 10b of the adjacent wiring board 10 is L1, for example, L1 > 0.5 mm.
- the length of L1 cannot be too long.
- the length of L1 is less than 1/10 of the length of the board.
- the distance from the right edge of the integrated illuminator 20 to the right edge 10c of the circuit board 10 is L2
- the distance from the left edge of the integrated illuminant 20 to the left edge of the circuit board 10 is L1
- L1 may be equal to or not Equal to L2.
- L1 is equal to L2 as an example for description.
- the two ends of the circuit board 10 can be fixed along the length direction of the circuit board 10 and the light guide plate of the backlight module, and at this time, along the circuit board 10 Leave enough area at both ends in the length direction. Since the width of the wiring board 10 is small, L1 is set to be sufficiently large along the length direction of the wiring board 10. Through actual measurement, it is found that L1>0.5mm can meet the fixing of the light bar and the light guide plate structure of the backlight module. For example, the length of L1 is about 0.5mm, 0.6mm or 0.8mm.
- the integrated illuminator 20 is fixedly connected to the wiring board 10 through the pads 23.
- the radius of the pad 23 can be selected to be R ⁇ 0.3 mm.
- the radius R of the pad 23 is about 0.2. Mm, 0.25mm or 0.3mm.
- the number of the pads is not limited herein as long as the integrated illuminator 20 can be fixed on the circuit board 10.
- At least one embodiment of the present disclosure further provides a side-in type backlight module, which includes any of the above light bars.
- FIG. 4 is a schematic structural diagram of a side-lit backlight module according to an embodiment of the present disclosure.
- the side-lit backlight module further includes a light guide plate 40 disposed on one side (for example, a light-emitting surface) of the main surface 101 of the light bar; the light bar passes through the preparation glue 80 and the light guide plate 40 . fixed.
- the glue 80 covers the light bar and exposes the integrated illuminator 20.
- FIG. 5 is a schematic diagram of providing a glue on a light bar according to an embodiment of the present disclosure.
- the edge of the glue 80 covering the light bar may extend beyond the light bar.
- FIG. 6 is a schematic diagram of providing a glue on a light bar according to another embodiment of the present disclosure.
- the edge of the preparation glue 80 covering the light bar may not exceed the light bar as long as the light bar can be fixed to the light guide plate 40.
- the glue 80 is also used to fix the light bar and the plastic frame 60.
- the cover 80 is covered on the partial main surface 101 of the light bar and the integrated illuminator 20 is exposed.
- the light bar and the light guide plate 40 in the backlight module can be fixed.
- the adverse effect on the illumination caused by the preparation of the illuminant 20 by the glue 80 is avoided.
- the gap W3 between the preparation glue 80 and the integrated illuminator 20 is between 0.1 mm and 0.15 mm, for example, W3 is about 0.1 mm, 0.12 mm, 0.13 mm, or 0.15 mm, etc., so that When the preparation glue 80 and the integrated illuminator 20 are too close, the integrated illuminator 20 generates heat, which causes the preparation glue 80 to thermally expand.
- the thickness D3 of the preparation glue 80 can be selected from 0.03 mm to 0.06 mm.
- the thickness D3 of the preparation glue 80 may be about 0.03 mm, 0.04 mm, or 0.05 mm or the like.
- the edge-lit backlight module further includes an optical film 50 disposed on the light-emitting side of the light guide plate 40, as shown in FIG. 5, along the width direction of the light bar, that is, the direction of BB'.
- the glue 80 is beyond the side edge of the light bar, and the optical film 50 is overlapped on the portion of the glue 80 that extends beyond the light bar.
- the width of the preparation glue 80 beyond the edge of the light bar is W2, wherein 0.25 mm ⁇ W2 ⁇ 1.0 mm, for example, about 0.25 mm, 0.3 mm, 0.5 mm or 1.0 mm.
- the range of W2 may also be 0.25 mm ⁇ W2 ⁇ 0.4 mm.
- the optical film 50 may include a diffusion sheet 51, a lower prism 52, and an upper prism 53 which are sequentially disposed on the light guide plate 40.
- the diffusion sheet 51 can be overlapped on a portion of the glue 80 that is beyond the light bar.
- the optical film 50 has a certain gap between the light strip and the light strip.
- the width of the slit can be about 0.2 mm.
- the width of the preparation glue 80 beyond the edge of the light bar is W2, 0.25 mm ⁇ W2 ⁇ 1.0 mm, and on the one hand, it can be ensured that the optical film 50 and the preparation glue 80 are overlapped.
- the gap between the optical film 50 and the light bar is reserved, and on the other hand, the problem that the light loss is too large due to the excessive W2 can be avoided.
- the side-entry backlight module further includes a light-shielding tape 70 disposed above the circuit board 10 of the light bar and extending from an edge of the circuit board 10 to above the light guide plate 40.
- the distance from the light-emitting surface of the light bar to the edge of the light-shielding tape 70 above the light guide plate 40 is K, for example, 0.8 mm ⁇ K ⁇ 2.0 mm.
- the distance from the light exit surface of the light bar to the edge of the light shielding tape 70 above the light guide plate 40 may be about 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm, or 1.2 mm.
- the distance from the light-emitting surface of the light bar to the edge of the light-shielding tape 70 above the light guide plate 40 may be 0.8 mm ⁇ K ⁇ 1.0 mm.
- the light-shielding tape 70 can shield the light of the brightness unevenness of the light-emitting surface of the backlight module on the one hand, so that the light is uniformly incident on the display area of the display device; on the other hand, the light-shielding tape 70 can also fix the optical film 50.
- the light incident distance of the side-entry backlight module can reach about 0.8 mm in the limit case.
- the light-input distance can be reduced by up to 2mm, and the corresponding visible area can be increased by 2mm.
- the side-lit backlight module further includes a reflective sheet 30 disposed on the opposite side of the light-emitting side of the light guide plate 40, wherein the reflective sheet 30 is prepared by the reflective sheet 81. It is fixed with the light bar and the plastic frame 60.
- Embodiments of the present disclosure can improve the utilization of light by providing the reflection sheet 30.
- At least one embodiment of the present disclosure further provides a display device including any of the above-described side-lit backlight modules.
- the light bar in the display device encapsulates the plurality of light sources 21 through the package 22 to obtain the integrated illuminator 20, so that the light emitted from the integrated illuminator 20 is denser, thereby reducing the light mixing distance of the integrated illuminator 20. Therefore, the light entrance distance of the side-entry backlight module can be shortened, which is advantageous for realizing the structure of the backlight module under the ultra-short light entrance distance, increasing the visible area of the display device, and thereby realizing the narrow frame structure of the display device. .
- the display device may be any display product or component such as an OLED panel, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, or the like.
- a display product or component such as an OLED panel, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, or the like.
- the light bar, the side-lit backlight module and the display device provided by the embodiments of the present disclosure have at least one of the following beneficial effects:
- the light bar provided by at least one embodiment of the present disclosure can reduce the light mixing distance of the side-entry backlight module, thereby reducing the light incident distance of the backlight module and increasing the visible area of the display device.
- the side-entry backlight module provided by at least one embodiment of the present disclosure can shorten the light entrance distance of the backlight module, and is beneficial to realize the structure of the backlight module under the ultra-short light entrance distance, and increase the visibility of the display device.
- the area in turn, enables a narrow bezel structure of the display device.
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- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
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Abstract
Description
Claims (20)
- 一种灯条,包括:线路板以及设置在所述线路板上的集成发光体;其中,所述集成发光体包括封装物和多个光源,所述封装物配置为封装所述多个光源。
- 根据权利要求1所述的灯条,其中,所述封装物的材料为可透光的材料。
- 根据权利要求1所述的灯条,其中,所述多个光源以并联或串联方式连接。
- 根据权利要求1所述的灯条,其中,所述光源为LED,多个所述LED通过直装式封装方式进行封装。
- 根据权利要求1-4中任一项所述的灯条,其中,所述集成发光体的发光面与所述线路板垂直,所述发光面到与所述发光面靠近的所述线路板的边缘的距离为W1,其中0.3mm≤W1≤1.0mm。
- 根据权利要求1-4中任一项所述的灯条,其中,沿所述线路板的长度方向,所述集成发光体的边缘到靠近所述线路板边缘的距离为L1,其中L1>0.5mm。
- 根据权利要求1-4中任一项所述的灯条,其中,所述集成发光体通过焊盘与所述线路板固定连接,所述焊盘的半径R≤0.3mm。
- 根据权利要求1-7中任一项所述的灯条,其中,所述线路板的厚度为D1,其中0.06mm≤D1≤0.12mm。
- 根据权利要求1-7中任一项所述的灯条,其中,所述集成发光体的厚度为D2,其中0.3mm≤D2≤0.6mm。
- 一种侧入式背光模组,包括权利要求1-9中任一项所述的灯条。
- 根据权利要求10所述的侧入式背光模组,还包括导光板,其中,所述导光板设置在所述灯条的出光面一侧,所述线路板设置在所述导光板之上。
- 根据权利要求11所述的侧入式背光模组,其中,所述灯条通过设置在所述线路板的主表面上的备胶与所述导光板固定,所述备胶覆盖在所述灯条上且露出所述集成发光体。
- 根据权利要求12所述的侧入式背光模组,其中,沿所述灯条的宽度方向,所述备胶超出所述灯条的一侧边缘。
- 根据权利要求13所述的侧入式背光模组,其中,所述备胶超出所述灯条边缘的宽度为W2,其中0.25mm≤W2≤1.0mm。
- 根据权利要求12所述的侧入式背光模组,还包括设置在所述导光板出光侧的光学膜片,所述光学膜片搭接在所述备胶超出所述灯条的一侧边缘上。
- 根据权利要求12-15中任一项所述的侧入式背光模组,其中,所述备胶的厚度为D3,其中0.03mm≤D3≤0.06mm。
- 根据权利要求16所述的侧入式背光模组,其中,所述备胶与所述集成发光体之间的间隙为W3,其中0.1mm≤W3≤0.15mm。
- 根据权利要求10-17中任一项所述的侧入式背光模组,还包括遮光胶带,其中,所述遮光胶带设置在所述灯条的线路板的背表面,且从所述线路板的边缘延伸至所述导光板之上。
- 根据权利要求18所述的侧入式背光模组,其中,所述灯条的出光面到所述遮光胶带位于所述导光板之上的边缘的距离为K,其中0.8mm≤K≤2.0mm。
- 一种显示装置,包括权利要求10-19中任一项所述的侧入式背光模组。
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CN107102477B (zh) * | 2017-06-13 | 2020-06-19 | 厦门天马微电子有限公司 | Led灯条、背光模组及显示装置 |
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