WO2018082360A1 - 灯条、侧入式背光模组及显示装置 - Google Patents

灯条、侧入式背光模组及显示装置 Download PDF

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Publication number
WO2018082360A1
WO2018082360A1 PCT/CN2017/096522 CN2017096522W WO2018082360A1 WO 2018082360 A1 WO2018082360 A1 WO 2018082360A1 CN 2017096522 W CN2017096522 W CN 2017096522W WO 2018082360 A1 WO2018082360 A1 WO 2018082360A1
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WO
WIPO (PCT)
Prior art keywords
light
backlight module
light bar
edge
circuit board
Prior art date
Application number
PCT/CN2017/096522
Other languages
English (en)
French (fr)
Inventor
李文军
Original Assignee
京东方科技集团股份有限公司
北京京东方茶谷电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 北京京东方茶谷电子有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/743,110 priority Critical patent/US10483245B2/en
Publication of WO2018082360A1 publication Critical patent/WO2018082360A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the present disclosure relates to a light bar, a side-lit backlight module, and a display device.
  • an LED Light Emitting Diode
  • a light mixing distance between the LEDs is long, at least greater than 2.5 mm, which results in a light incident distance of the backlight module. It must be above 2.8mm, which hinders the maximization of the visible area of the electronic device, thus limiting the development of the narrow bezel technology.
  • At least one embodiment of the present disclosure provides a light bar including: a circuit board and an integrated illuminator disposed on the circuit board; wherein the integrated illuminator includes a package and a plurality of light sources, the package The object is configured to package the plurality of light sources.
  • the material of the package is a light transmissive material.
  • the plurality of light sources are connected in parallel or in series.
  • the light source is an LED
  • the plurality of the LEDs are packaged by a direct package.
  • the integrated illuminator is perpendicular to the circuit board, and the distance from the light emitting surface to the edge of the circuit board adjacent to the light emitting surface is W1, wherein 0.3 mm ⁇ W1 ⁇ 1.0 mm.
  • the distance from the edge of the integrated illuminator to the edge of the circuit board is L1, where L1>0.5 mm.
  • the integrated illuminator is fixedly connected to the circuit board through a pad having a radius R ⁇ 0.3 mm.
  • the thickness of the circuit board is D1, wherein 0.06 mm ⁇ D1 ⁇ 0.12 mm.
  • the integrated illuminator has a thickness D2, wherein 0.3 mm ⁇ D2 ⁇ 0.6 mm.
  • At least one embodiment of the present disclosure also provides a side-lit backlight module including any of the above light strips.
  • the edge-lit backlight module provided by at least one embodiment of the present disclosure further includes a light guide plate, wherein the light guide plate is disposed on a light emitting surface side of the light bar, and the circuit board is disposed on the light guide plate.
  • the light guide plate is disposed on a light emitting surface side of the light bar
  • the circuit board is disposed on the light guide plate.
  • the light bar is fixed to the light guide plate by a rubber provided on a main surface of the circuit board, and the preparation glue is covered by The integrated illuminator is exposed on the light bar.
  • the preparation glue extends beyond one side edge of the light bar along the width direction of the light bar.
  • the width of the preparation glue beyond the edge of the light bar is W2, wherein 0.25 mm ⁇ W2 ⁇ 1.0 mm.
  • the edge-lit backlight module provided by at least one embodiment of the present disclosure further includes an optical film disposed on a light-emitting side of the light guide plate, wherein the optical film overlaps the preparation glue beyond the light bar. On one side of the edge.
  • the thickness of the preparation glue is D3, wherein 0.03 mm ⁇ D3 ⁇ 0.06 mm.
  • a gap between the preparation glue and the integrated illuminator is W3, where 0.1 mm ⁇ W3 ⁇ 0.15 mm.
  • the edge-lit backlight module provided by at least one embodiment of the present disclosure further includes a shading An adhesive tape, wherein the light shielding tape is disposed on a back surface of the wiring board of the light bar, and extends from an edge of the circuit board to above the light guide plate.
  • the distance from the light-emitting surface of the light bar to the edge of the light-shielding tape above the light guide plate is K, where 0.8 mm ⁇ K ⁇ 2.0mm.
  • At least one embodiment of the present disclosure further provides a display device including any of the above-described side-lit backlight modules.
  • FIG. 1 is a schematic structural diagram of a light bar according to an embodiment of the present disclosure
  • Figure 2 is a cross-sectional view of the light bar of Figure 1 taken along line AA';
  • FIG. 3 is a schematic structural diagram of a light bar according to an embodiment of the present disclosure.
  • FIG. 4 is a schematic structural diagram of a side-entry backlight module according to an embodiment of the present disclosure
  • FIG. 5 is a schematic diagram of providing a glue on a light bar according to an embodiment of the present disclosure
  • FIG. 6 is a schematic diagram of providing a glue on a light bar according to another embodiment of the present disclosure.
  • FIG. 1 is a schematic structural view of a light bar according to an embodiment of the present disclosure
  • FIG. 2 is a cross-sectional view of the light bar of FIG. 1 taken along AA′.
  • the light bar includes a circuit board 10 and an integrated illuminator 20 disposed on the circuit board 10; the integrated illuminator 20 includes an encapsulant 22 and a plurality of light sources 21, and the package 22 is configured as a package.
  • the plurality of light sources 21 are, for example, integrally packaged with the plurality of light sources 21.
  • the material of the package 22 is a light transmissive material such as transparent glass, transparent resin or transparent plastic.
  • the circuit board 10 is configured to provide a signal to the light source 21 to cause the light source 21 to illuminate.
  • the circuit board 10 is, for example, an FPC, in view of the fact that the FPC (Flexible Printed Circuit) is small in size, light in weight, and freely bendable.
  • the dotted frame portion in Fig. 1 is a trace 11 extending from the wiring board 10.
  • the trace 11 is electrically connected to the light source 21 and connected to an external device.
  • the plurality of light sources 21 may be connected in series or in parallel, which is not specifically limited herein.
  • the light source is an LED
  • the plurality of LEDs are packaged by a direct package.
  • the light source 21 is, for example, a light-emitting bare chip.
  • the integrated light-emitting body 20 can be obtained by integrally encapsulating a plurality of light-emitting bare chips.
  • the length of the integrated illuminator 20 is less than the length of the circuit board 10, and the width of the integrated illuminator 20 is less than the width of the circuit board 10.
  • the length and width of the integrated illuminator 20, as well as the length and width of the circuit board 10, may depend on the device to which the light bar is actually applied.
  • the length of the circuit board 10 is related to the length of the mobile phone.
  • the width of the circuit board 10 may be between 2.0 mm and 2.8 mm, for example, about 2.2 mm, 2.3 mm, 2.4 mm, or 2.8 mm, etc.; the width of the corresponding integrated illuminator 20 may be between 0.5 mm and 0.8 mm. For example, it is about 0.5 mm, 0.6 mm, 0.7 mm, or 0.8 mm, and the like.
  • the thickness D1 of the wiring board 10 can be controlled between 0.06 mm and 0.12 mm, for example, about 0.06 mm, 0.08 mm, 0.09 mm, 0.10 mm, or 0.12 mm, or the like.
  • the thickness of the integrated illuminator 20 is related to the thickness of the light source 21, and the thickness D2 of the integrated illuminator 20 can be controlled between 0.3 mm and 0.6 mm, for example, about 0.3 mm, 0.4 mm, 0.5 mm, or 0.6 mm. . Based on this, when the light source 21 is selected, the light source 21 having a small thickness is selected as much as possible.
  • the light bar includes a plurality of point light sources, and the light mixing distance between the point light sources is at least 2.5 mm, which is disadvantageous for the narrow frame design.
  • the integrated light-emitting body 20 is obtained by encapsulating the plurality of light sources 21 by using the package 22, so that the light emitted from the integrated light-emitting body 20 is denser, thereby mixing the integrated light-emitting body 20.
  • the light distance is reduced, thereby shortening the light incident distance of the backlight module, and is advantageous for realizing a backlight module structure with an ultra-short light entrance distance, thereby increasing the visible area of the display device, thereby realizing a narrow border of the display device. design.
  • FIG. 3 is a schematic structural diagram of a light bar according to an embodiment of the present disclosure.
  • LED Light Emitting Diode
  • the light source 21 can be The LED 201 and the plurality of LEDs 201 are packaged by a COB (Chip On Board) package.
  • the LED 201 can be an LED bare chip.
  • a plurality of LEDs 201 are packaged by COB encapsulation, and the package method includes: first soldering a plurality of LEDs 201 on a substrate by a soldering technique, and then integrating the substrate on which the plurality of LEDs 201 are soldered by a COB integrated packaging technology.
  • the package method includes: first soldering a plurality of LEDs 201 on a substrate by a soldering technique, and then integrating the substrate on which the plurality of LEDs 201 are soldered by a COB integrated packaging technology.
  • an integrated illuminator 20 as shown in FIG. 3 can be obtained at this time.
  • the substrate is soldered to the wiring board 10.
  • the substrate is a metal substrate
  • the material of the metal substrate is, for example, an aluminum alloy or a copper alloy. Due to the electrical conductivity of the metal, on the one hand, the circuit board 10 can drive the integrated illuminant 20 to emit light. On the other hand, the metal substrate can contribute to heat dissipation of the light bar, thereby improving the life of the light bar.
  • the embodiment of the present disclosure encapsulates the plurality of LEDs 201 by a COB package, so that the light mixing distance of the integrated illuminator 20 can be 0.5 mm to 1.5 mm, for example, about 0.5 mm. 0.7mm, 0.9mm, 1.2mm or 1.5mm, etc., which is more conducive to the realization of the ultra-short light-into-light backlight module structure, and the COB package can ensure the light-emitting performance of the light bar.
  • the light-emitting surface of the integrated illuminator 20 (for example, the surface from which light is emitted in FIG. 3) is perpendicular to the wiring board 10; the distance from the light-emitting surface to the upper edge 10a of the wiring board 10 adjacent to the light-emitting surface Is W1, where 0.3 mm ⁇ W1 ⁇ 1.0 mm, for example, W1 is approximately 0.3 mm, 0.5 mm, 0.7 mm, 0.9 mm or 1.0 mm, or the like.
  • the light bar When the light bar is applied to the structure of the side-lit backlight module, for example, the light bar can be fixed on the light guide plate. At this time, if the distance W1 between the light-emitting surface and the upper edge 10a of the circuit board 10 close to the light-emitting surface is too short, It is easy to cause the light guide plate to be fixed to the light bar. Therefore, the phenomenon that the light guide plate is detached occurs; if W1 is too long, the loss of the light emission of the LED 201 is excessively large. Therefore, the range of W1 is selected to be 0.3 mm ⁇ W1 ⁇ 1.0 mm.
  • the range of W1 can also be selected to be 0.3 mm ⁇ W1 ⁇ 0.6 mm.
  • the distance from the left edge of the integrated illuminator 20 to the left edge 10b of the adjacent wiring board 10 is L1, for example, L1 > 0.5 mm.
  • L1 the distance from the left edge of the integrated illuminator 20 to the left edge 10b of the adjacent wiring board 10 is L1, for example, L1 > 0.5 mm.
  • the length of L1 cannot be too long.
  • the length of L1 is less than 1/10 of the length of the board.
  • the distance from the right edge of the integrated illuminator 20 to the right edge 10c of the circuit board 10 is L2
  • the distance from the left edge of the integrated illuminant 20 to the left edge of the circuit board 10 is L1
  • L1 may be equal to or not Equal to L2.
  • L1 is equal to L2 as an example for description.
  • the two ends of the circuit board 10 can be fixed along the length direction of the circuit board 10 and the light guide plate of the backlight module, and at this time, along the circuit board 10 Leave enough area at both ends in the length direction. Since the width of the wiring board 10 is small, L1 is set to be sufficiently large along the length direction of the wiring board 10. Through actual measurement, it is found that L1>0.5mm can meet the fixing of the light bar and the light guide plate structure of the backlight module. For example, the length of L1 is about 0.5mm, 0.6mm or 0.8mm.
  • the integrated illuminator 20 is fixedly connected to the wiring board 10 through the pads 23.
  • the radius of the pad 23 can be selected to be R ⁇ 0.3 mm.
  • the radius R of the pad 23 is about 0.2. Mm, 0.25mm or 0.3mm.
  • the number of the pads is not limited herein as long as the integrated illuminator 20 can be fixed on the circuit board 10.
  • At least one embodiment of the present disclosure further provides a side-in type backlight module, which includes any of the above light bars.
  • FIG. 4 is a schematic structural diagram of a side-lit backlight module according to an embodiment of the present disclosure.
  • the side-lit backlight module further includes a light guide plate 40 disposed on one side (for example, a light-emitting surface) of the main surface 101 of the light bar; the light bar passes through the preparation glue 80 and the light guide plate 40 . fixed.
  • the glue 80 covers the light bar and exposes the integrated illuminator 20.
  • FIG. 5 is a schematic diagram of providing a glue on a light bar according to an embodiment of the present disclosure.
  • the edge of the glue 80 covering the light bar may extend beyond the light bar.
  • FIG. 6 is a schematic diagram of providing a glue on a light bar according to another embodiment of the present disclosure.
  • the edge of the preparation glue 80 covering the light bar may not exceed the light bar as long as the light bar can be fixed to the light guide plate 40.
  • the glue 80 is also used to fix the light bar and the plastic frame 60.
  • the cover 80 is covered on the partial main surface 101 of the light bar and the integrated illuminator 20 is exposed.
  • the light bar and the light guide plate 40 in the backlight module can be fixed.
  • the adverse effect on the illumination caused by the preparation of the illuminant 20 by the glue 80 is avoided.
  • the gap W3 between the preparation glue 80 and the integrated illuminator 20 is between 0.1 mm and 0.15 mm, for example, W3 is about 0.1 mm, 0.12 mm, 0.13 mm, or 0.15 mm, etc., so that When the preparation glue 80 and the integrated illuminator 20 are too close, the integrated illuminator 20 generates heat, which causes the preparation glue 80 to thermally expand.
  • the thickness D3 of the preparation glue 80 can be selected from 0.03 mm to 0.06 mm.
  • the thickness D3 of the preparation glue 80 may be about 0.03 mm, 0.04 mm, or 0.05 mm or the like.
  • the edge-lit backlight module further includes an optical film 50 disposed on the light-emitting side of the light guide plate 40, as shown in FIG. 5, along the width direction of the light bar, that is, the direction of BB'.
  • the glue 80 is beyond the side edge of the light bar, and the optical film 50 is overlapped on the portion of the glue 80 that extends beyond the light bar.
  • the width of the preparation glue 80 beyond the edge of the light bar is W2, wherein 0.25 mm ⁇ W2 ⁇ 1.0 mm, for example, about 0.25 mm, 0.3 mm, 0.5 mm or 1.0 mm.
  • the range of W2 may also be 0.25 mm ⁇ W2 ⁇ 0.4 mm.
  • the optical film 50 may include a diffusion sheet 51, a lower prism 52, and an upper prism 53 which are sequentially disposed on the light guide plate 40.
  • the diffusion sheet 51 can be overlapped on a portion of the glue 80 that is beyond the light bar.
  • the optical film 50 has a certain gap between the light strip and the light strip.
  • the width of the slit can be about 0.2 mm.
  • the width of the preparation glue 80 beyond the edge of the light bar is W2, 0.25 mm ⁇ W2 ⁇ 1.0 mm, and on the one hand, it can be ensured that the optical film 50 and the preparation glue 80 are overlapped.
  • the gap between the optical film 50 and the light bar is reserved, and on the other hand, the problem that the light loss is too large due to the excessive W2 can be avoided.
  • the side-entry backlight module further includes a light-shielding tape 70 disposed above the circuit board 10 of the light bar and extending from an edge of the circuit board 10 to above the light guide plate 40.
  • the distance from the light-emitting surface of the light bar to the edge of the light-shielding tape 70 above the light guide plate 40 is K, for example, 0.8 mm ⁇ K ⁇ 2.0 mm.
  • the distance from the light exit surface of the light bar to the edge of the light shielding tape 70 above the light guide plate 40 may be about 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm, or 1.2 mm.
  • the distance from the light-emitting surface of the light bar to the edge of the light-shielding tape 70 above the light guide plate 40 may be 0.8 mm ⁇ K ⁇ 1.0 mm.
  • the light-shielding tape 70 can shield the light of the brightness unevenness of the light-emitting surface of the backlight module on the one hand, so that the light is uniformly incident on the display area of the display device; on the other hand, the light-shielding tape 70 can also fix the optical film 50.
  • the light incident distance of the side-entry backlight module can reach about 0.8 mm in the limit case.
  • the light-input distance can be reduced by up to 2mm, and the corresponding visible area can be increased by 2mm.
  • the side-lit backlight module further includes a reflective sheet 30 disposed on the opposite side of the light-emitting side of the light guide plate 40, wherein the reflective sheet 30 is prepared by the reflective sheet 81. It is fixed with the light bar and the plastic frame 60.
  • Embodiments of the present disclosure can improve the utilization of light by providing the reflection sheet 30.
  • At least one embodiment of the present disclosure further provides a display device including any of the above-described side-lit backlight modules.
  • the light bar in the display device encapsulates the plurality of light sources 21 through the package 22 to obtain the integrated illuminator 20, so that the light emitted from the integrated illuminator 20 is denser, thereby reducing the light mixing distance of the integrated illuminator 20. Therefore, the light entrance distance of the side-entry backlight module can be shortened, which is advantageous for realizing the structure of the backlight module under the ultra-short light entrance distance, increasing the visible area of the display device, and thereby realizing the narrow frame structure of the display device. .
  • the display device may be any display product or component such as an OLED panel, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, or the like.
  • a display product or component such as an OLED panel, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, or the like.
  • the light bar, the side-lit backlight module and the display device provided by the embodiments of the present disclosure have at least one of the following beneficial effects:
  • the light bar provided by at least one embodiment of the present disclosure can reduce the light mixing distance of the side-entry backlight module, thereby reducing the light incident distance of the backlight module and increasing the visible area of the display device.
  • the side-entry backlight module provided by at least one embodiment of the present disclosure can shorten the light entrance distance of the backlight module, and is beneficial to realize the structure of the backlight module under the ultra-short light entrance distance, and increase the visibility of the display device.
  • the area in turn, enables a narrow bezel structure of the display device.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Planar Illumination Modules (AREA)

Abstract

一种灯条、侧入式背光模组及显示装置，灯条包括：线路板（10）以及设置在线路板（10）上的集成发光体（20）；其中，集成发光体（20）包括封装物（22）和多个光源（21），封装物（22）配置为封装多个光源（21）。该灯条可以减小背光模组的混光距离，从而减小背光模组的入光距离，增大显示装置的可视区。

Description

灯条、侧入式背光模组及显示装置
相关申请的交叉引用
本申请要求于2016年11月2日递交的中国专利申请第201621169497.0号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开涉及一种灯条、侧入式背光模组及显示装置。
背景技术
随着显示技术的高速发展，窄边框、宽视角已经成为显示面板的主流发展方向，窄边框、宽视角可以给用户带来更好的视觉体验。在目前的电子设备的结构中，作为光源的LED(发光二极管，Light Emitting Diode)为点光源，LED之间的混光距离较长，至少大于2.5mm，这就导致背光模组的入光距离必须在2.8mm以上，从而阻碍了电子设备可视区的最大化，因而使得窄边框技术的发展受到了限制。
发明内容
本公开至少一实施例提供一种灯条，该灯条包括：线路板以及设置在所述线路板上的集成发光体；其中，所述集成发光体包括封装物和多个光源，所述封装物配置为封装所述多个光源。
例如，在本公开至少一实施例提供的灯条中，所述封装物的材料为可透光的材料。
例如，在本公开至少一实施例提供的灯条中，所述多个光源以并联或串联方式连接。
例如，在本公开至少一实施例提供的灯条中，所述光源为LED，多个所述LED通过直装式封装方式进行封装。
例如，在本公开至少一实施例提供的灯条中，所述集成发光体的 发光面与所述线路板垂直，所述发光面到与所述发光面靠近的所述线路板的边缘的距离为W1，其中0.3mm≤W1≤1.0mm。
例如，在本公开至少一实施例提供的灯条中，沿所述线路板的长度方向，所述集成发光体的边缘到靠近所述线路板边缘的距离为L1，其中L1＞0.5mm。
例如，在本公开至少一实施例提供的灯条中，所述集成发光体通过焊盘与所述线路板固定连接，所述焊盘的半径R≤0.3mm。
例如，在本公开至少一实施例提供的灯条中，所述线路板的厚度为D1，其中0.06mm≤D1≤0.12mm。
例如，在本公开至少一实施例提供的灯条中，所述集成发光体的厚度为D2，其中0.3mm≤D2≤0.6mm。
本公开至少一实施例还提供一种侧入式背光模组，包括上述任一灯条。
例如，本公开至少一实施例提供的侧入式背光模组，还包括导光板，其中，所述导光板设置在所述灯条的出光面一侧，所述线路板设置在所述导光板之上。
例如，在本公开至少一实施例提供的侧入式背光模组中，所述灯条通过设置在所述线路板的主表面上的备胶与所述导光板固定，所述备胶覆盖在所述灯条上且露出所述集成发光体。
例如，在本公开至少一实施例提供的侧入式背光模组中，沿所述灯条的宽度方向，所述备胶超出所述灯条的一侧边缘。
例如，在本公开至少一实施例提供的侧入式背光模组中，所述备胶超出所述灯条边缘的宽度为W2，其中0.25mm≤W2≤1.0mm。
例如，本公开至少一实施例提供的侧入式背光模组，还包括设置在所述导光板出光侧的光学膜片，所述光学膜片搭接在所述备胶超出所述灯条的一侧边缘上。
例如，在本公开至少一实施例提供的侧入式背光模组中，所述备胶的厚度为D3，其中0.03mm≤D3≤0.06mm。
例如，在本公开至少一实施例提供的侧入式背光模组中，所述备胶与所述集成发光体之间的间隙为W3，其中0.1mm≤W3≤0.15mm。
例如，本公开至少一实施例提供的侧入式背光模组，还包括遮光 胶带，其中，所述遮光胶带设置在所述灯条的线路板的背表面，且从所述线路板的边缘延伸至所述导光板之上。
例如，在本公开至少一实施例提供的侧入式背光模组中，所述灯条的出光面到所述遮光胶带位于所述导光板之上的边缘的距离为K，其中0.8mm≤K≤2.0mm。
本公开至少一实施例还提供一种显示装置，包括上述任一侧入式背光模组。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1为本公开一实施例提供的一种灯条的结构示意图；
图2为图1中的灯条沿AA′向的剖视图；
图3为本公开一实施例提供的一种灯条的结构示意图；
图4为本公开一实施例提供的一种侧入式背光模组的结构示意图；
图5为本公开一实施例提供的在灯条上设置备胶的示意图；以及
图6为本公开另一实施例提供的在灯条上设置备胶的示意图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本发明所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物 理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
需要说明的是，附图中各部件的形状和大小不反映真实比例，目的只是示意说明本公开的内容。
本公开一实施例提供一种灯条，例如，图1为本公开一实施例提供的一种灯条的结构示意图，图2为图1中的灯条沿AA′向的剖视图。如图1和图2所示，该灯条包括线路板10以及设置在线路板10上的集成发光体20；该集成发光体20包括封装物22和多个光源21，封装物22配置为封装多个光源21，例如对多个光源21进行一体化封装。
例如，该封装物22的材料为可透光的材料，例如，透明玻璃、透明树脂或者透明塑料等。
例如，线路板10配置为向光源21提供信号，以使光源21发光。考虑到FPC(Flexible Printed Circuit，简称柔性线路板)具有体积小、重量轻，且可自由弯曲等特点，线路板10例如为FPC。
图1中虚线框部分为伸出线路板10的走线11，例如，该走线11与光源21电连接，并与外界装置连接。
至少一些实施例中，多个光源21可以串联连接，也可以并联连接，在此不做具体限定。例如，光源为LED，多个LED通过直装式封装的方式进行封装。
光源21例如为发光裸芯片，在此基础上，集成发光体20可以是通过对多个发光裸芯片进行一体化封装得到的。
至少一些实施例中，集成发光体20的长度小于线路板10的长度，集成发光体20的宽度小于线路板10的宽度。在此基础上，集成发光体20的长度和宽度、以及线路板10的长度和宽度可以根据灯条实际应用的设备而定。
例如，当该灯条用于手机背光模组时，由于手机背光模组一般采用侧入式背光模组，因而线路板10的长度与手机的长度相关。线路板10的宽度可以在2.0mm～2.8mm之间，例如，大约为2.2mm、2.3mm、2.4mm或者2.8mm等；相应的集成发光体20的宽度可以在0.5mm～0.8mm之间，例如，大约为0.5mm、0.6mm、0.7mm或者0.8mm等。
如图2所示，线路板10的厚度D1可以控制在0.06mm～0.12mm之间，例如，大约为0.06mm、0.08mm、0.09mm、0.10mm或者0.12mm等。
例如，集成发光体20的厚度与光源21的厚度相关，该集成发光体20的厚度D2可以控制在0.3mm～0.6mm之间，例如，大约为0.3mm、0.4mm、0.5mm或者0.6mm等。基于此，在选择光源21时，尽量选择厚度较小的光源21。
目前，灯条包括多个点光源，点光源之间的混光距离至少为2.5mm，这样不利于窄边框设计。在本公开的实施例提供的灯条中，通过利用封装物22对多个光源21进行封装得到集成发光体20，使该集成发光体20出射的光线更加密集，从而使集成发光体20的混光距离减小，因而，可缩短背光模组的入光距离，有利于实现超短入光距离的背光模组结构，从而可以增大显示装置的可视区，进而可以实现显示装置的窄边框设计。
例如，图3为本公开一实施例提供的一种灯条的结构示意图。考虑到LED(Light Emitting Diode，发光二极管)具有亮度高、热量低、能耗小、寿命长等优点，且其厚度可做到小于0.3mm，因此，如图3所示，该光源21可以为LED201，多个LED201通过COB(Chip On Board，板上晶片直装式)封装的方式进行封装。
例如，LED201可以为LED裸芯片。
例如，将多个LED201通过COB封装的方式进行封装，该封装方式包括：先通过焊接技术将多个LED201焊接在基板上，然后通过COB一体化封装技术对焊接有多个LED201的基板进行一体化封装，此时可得到如图3所示的集成发光体20。在此基础上，将基板焊接在线路板10上。
例如，该基板为金属基板，该金属基板的材料例如为铝合金或者铜合金。由于金属的导电性，一方面，可使线路板10驱动集成发光体20发光，另一方面，金属基板可有助于灯条的散热，因而可提高灯条的寿命。
本公开的实施例通过COB封装方式对多个LED201进行封装，可使集成发光体20的混光距离达到0.5mm～1.5mm，例如，大约0.5mm、 0.7mm、0.9mm、1.2mm或者1.5mm等，从而更有利于实现超短入光距离的背光模组结构，而且，采用COB封装方式，可以保证灯条的发光性能。
例如，如图3所示，该集成发光体20的发光面(例如，图3中光出射的表面)与线路板10垂直；发光面到与发光面靠近的线路板10的上边缘10a的距离为W1，其中0.3mm≤W1≤1.0mm，例如，W1大约为0.3mm、0.5mm、0.7mm、0.9mm或者1.0mm等。
当灯条应用于侧入式背光模组结构时，例如可以将灯条固定于导光板上，此时，若发光面到与发光面靠近的线路板10的上边缘10a的距离W1过短，容易导致导光板与灯条固定不紧。从而发生导光板脱落的现象；若W1过长，又会导致LED201发光的损耗过大，因此，W1的范围选择为0.3mm≤W1≤1.0mm。
例如，W1的范围还可以选择为0.3mm≤W1≤0.6mm。
例如，如图3所示，沿线路板10的长度方向，集成发光体20的左边缘到靠近的线路板10的左边缘10b的距离为L1，例如，L1＞0.5mm。当然L1的长度也不能太长，例如，L1的长度小于线路板长度的1/10。
例如，如图3所示，集成发光体20的右边缘到线路板10右边缘10c的距离为L2，集成发光体20的左边缘到线路板10左边缘的距离为L1，L1可以等于或不等于L2。本公开实施例中，以L1等于L2为例进行说明。
当灯条应用于侧入式背光模组结构时，例如可以沿线路板10的长度方向，将线路板10的两端与背光模组的导光板固定，此时，在线路板10的沿其长度方向的两端留出足够的面积。由于线路板10的宽度较小，因此沿线路板10的长度方向，将L1设置为足够大。通过实测，发现L1＞0.5mm便可满足灯条与背光模组导光板结构的固定，例如，L1的长度为大约0.5mm、0.6mm或者0.8mm等。
如图3所示，该集成发光体20通过焊盘23与线路板10固定连接。在此情况下，若焊盘23的半径过大，会导致入光距离相应的增大，因此，焊盘23的半径可以选择为R≤0.3mm，例如，焊盘23的半径R大约为0.2mm、0.25mm或者0.3mm等。
需要说明的是，焊盘的个数在此不做限定，只要能使集成发光体20固定在线路板10上即可。
本公开至少一实施例还提供一种侧入式背光模组，该侧入式背光模组包括上述任一灯条。
例如，图4为本公开一实施例提供的一种侧入式背光模组的结构示意图。如图4所示，该侧入式背光模组还包括导光板40，导光板40设置在灯条的主表面101的一侧(例如出光面)；该灯条通过备胶80与导光板40固定。例如，该备胶80覆盖在灯条上且露出集成发光体20。
例如，图5为本公开一实施例提供的在灯条上设置备胶的示意图。例如，如图5所示，在该灯条的主表面101的一侧，即出光面的一侧，覆盖在灯条上的备胶80的边缘可以超出该灯条。
例如，图6为本公开另一实施例提供的在灯条上设置备胶的示意图。如图6所示，覆盖在灯条上的备胶80的边缘也可以不超出灯条，只要能使灯条与导光板40固定即可。
例如，备胶80除使灯条与导光板40固定外，如图4所示，该备胶80还用于使灯条与胶框60固定。
本公开的实施例中，通过使备胶80覆盖在灯条的部分主表面101上且露出集成发光体20，一方面，可以使灯条与背光模组中的导光板40等结构固定，另一方面，避免由于备胶80覆盖集成发光体20而造成对发光带来的不利影响。
例如，如图5所示，备胶80与集成发光体20之间的间隙W3在0.1mm～0.15mm之间，例如，W3为大约0.1mm、0.12mm、0.13mm或者0.15mm等，这样可避免由于备胶80与集成发光体20过于靠近时，集成发光体20发热而导致备胶80热膨胀。
例如，如图4所示，如果备胶80的厚度D3过厚，会挡住集成发光体20发出的光；若备胶80的厚度D3太薄时，会导致其固定效果不好，因此，备胶80的厚度D3可以选择为0.03mm～0.06mm。例如备胶80的厚度D3可以为大约0.03mm、0.04mm、或0.05mm等。
例如，如图4所示，该侧入式背光模组还包括设置在导光板40出光侧的光学膜片50，如图5所示，沿灯条的宽度方向即BB’的方向， 备胶80超出灯条的一侧边缘，光学膜片50搭接在备胶80的超出灯条的部分。备胶80超出灯条边缘的宽度为W2，其中0.25mm≤W2≤1.0mm，例如为大约0.25mm、0.3mm、0.5mm或者1.0mm等。例如，W2的范围还可以为0.25mm≤W2≤0.4mm。
例如，光学膜片50可以包括依次设置在导光板40上的扩散片51、下棱镜52和上棱镜53。扩散片51可搭接在备胶80的超出灯条的部分上。
例如，为了防止由于灯条发热膨胀与光学膜片50之间产生挤压，而导致的侧入式背光模组翘起的问题，该光学膜片50与灯条之间具有一定的缝隙，该缝隙的宽度可以为大约0.2mm。
例如，在本公开的实施例中，备胶80超出灯条边缘的宽度为W2，0.25mm≤W2≤1.0mm，一方面可以保证在光学膜片50与备胶80搭接的基础上，还预留出光学膜片50与灯条之间的缝隙，另一方面，还可避免由于W2过大而导致光损耗太大的问题。
例如，如图4所示，该侧入式背光模组还包括设置在灯条的线路板10上方，且从线路板10的边缘延伸至导光板40上方的遮光胶带70。该灯条的出光面到遮光胶带70的位于导光板40上方的边缘的距离为K，例如，0.8mm≤K≤2.0mm。例如该灯条的出光面到遮光胶带70的位于导光板40上方的边缘的距离为K的值可以为大约0.8mm、0.9mm、1.0mm、1.1mm或者1.2mm等。例如，该灯条的出光面到遮光胶带70的位于导光板40上方的边缘的距离为K的范围还可以为：0.8mm≤K≤1.0mm。
例如，遮光胶带70一方面可以遮蔽背光模组出光面亮度不均部分的光，从而使光均匀入射到显示装置的显示区；另一方面，遮光胶带70还可以固定光学膜片50。
例如，在本公开的实施例中，侧入式背光模组的入光距离在极限情况下，可达到大约0.8mm。相对于目前的侧入式背光模组最多可减少2mm的入光距离，相应的可视区可增加2mm。
例如，如图4所示，该侧入式背光模组还包括反射片30，该反射片30设置在导光板40的出光侧相对的另一侧，其中，反射片30通过反射片备胶81与灯条、胶框60固定。
本公开的实施例通过设置反射片30，可提高光的利用率。
本公开至少一实施例还提供一种显示装置，包括上述任一侧入式背光模组。
例如，该显示装置中的灯条，通过封装物22对多个光源21进行封装得到集成发光体20，使集成发光体20出射的光线更加密集，从而使集成发光体20的混光距离减小，因而，可缩短侧入式背光模组的入光距离，有利于实现超短入光距离下的背光模组的结构，增大显示装置的可视区，进而可实现显示装置的窄边框结构。
例如，该显示装置可以为该显示装置可以为OLED面板、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
例如，本公开的实施例提供的灯条、侧入式背光模组及显示装置，具有以下至少一项有益效果：
(1)本公开至少一实施例提供的灯条，可以减小侧入式背光模组的混光距离，从而减小背光模组的入光距离，增大显示装置的可视区。
(2)本公开至少一实施例提供的侧入式背光模组，可缩短背光模组的入光距离，有利于实现超短入光距离下的背光模组结构，增大显示装置的可视区，进而可实现显示装置的窄边框结构。
有以下几点需要说明：
(1)本公开实施例附图只涉及到与本公开实施例涉及到的结构，其他结构可参考通常设计。
(2)为了清晰起见，在用于描述本公开的实施例的附图中，层或区域的厚度被放大或缩小，即这些附图并非按照实际的比例绘制。可以理解，当诸如层、膜、区域或基板之类的元件被称作位于另一元件“上”或“下”时，该元件可以“直接”位于另一元件“上”或“下”，或者可以存在中间元件。
(3)在不冲突的情况下，本公开的实施例及实施例中的特征可以相互组合以得到新的实施例。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (20)

  1. 一种灯条，包括：线路板以及设置在所述线路板上的集成发光体；其中，所述集成发光体包括封装物和多个光源，所述封装物配置为封装所述多个光源。
  2. 根据权利要求1所述的灯条，其中，所述封装物的材料为可透光的材料。
  3. 根据权利要求1所述的灯条，其中，所述多个光源以并联或串联方式连接。
  4. 根据权利要求1所述的灯条，其中，所述光源为LED，多个所述LED通过直装式封装方式进行封装。
  5. 根据权利要求1-4中任一项所述的灯条，其中，所述集成发光体的发光面与所述线路板垂直，所述发光面到与所述发光面靠近的所述线路板的边缘的距离为W1，其中0.3mm≤W1≤1.0mm。
  6. 根据权利要求1-4中任一项所述的灯条，其中，沿所述线路板的长度方向，所述集成发光体的边缘到靠近所述线路板边缘的距离为L1，其中L1＞0.5mm。
  7. 根据权利要求1-4中任一项所述的灯条，其中，所述集成发光体通过焊盘与所述线路板固定连接，所述焊盘的半径R≤0.3mm。
  8. 根据权利要求1-7中任一项所述的灯条，其中，所述线路板的厚度为D1，其中0.06mm≤D1≤0.12mm。
  9. 根据权利要求1-7中任一项所述的灯条，其中，所述集成发光体的厚度为D2，其中0.3mm≤D2≤0.6mm。
  10. 一种侧入式背光模组，包括权利要求1-9中任一项所述的灯条。
  11. 根据权利要求10所述的侧入式背光模组，还包括导光板，其中，所述导光板设置在所述灯条的出光面一侧，所述线路板设置在所述导光板之上。
  12. 根据权利要求11所述的侧入式背光模组，其中，所述灯条通过设置在所述线路板的主表面上的备胶与所述导光板固定，所述备胶覆盖在所述灯条上且露出所述集成发光体。
  13. 根据权利要求12所述的侧入式背光模组，其中，沿所述灯条的宽度方向，所述备胶超出所述灯条的一侧边缘。
  14. 根据权利要求13所述的侧入式背光模组，其中，所述备胶超出所述灯条边缘的宽度为W2，其中0.25mm≤W2≤1.0mm。
  15. 根据权利要求12所述的侧入式背光模组，还包括设置在所述导光板出光侧的光学膜片，所述光学膜片搭接在所述备胶超出所述灯条的一侧边缘上。
  16. 根据权利要求12-15中任一项所述的侧入式背光模组，其中，所述备胶的厚度为D3，其中0.03mm≤D3≤0.06mm。
  17. 根据权利要求16所述的侧入式背光模组，其中，所述备胶与所述集成发光体之间的间隙为W3，其中0.1mm≤W3≤0.15mm。
  18. 根据权利要求10-17中任一项所述的侧入式背光模组，还包括遮光胶带，其中，所述遮光胶带设置在所述灯条的线路板的背表面，且从所述线路板的边缘延伸至所述导光板之上。
  19. 根据权利要求18所述的侧入式背光模组，其中，所述灯条的出光面到所述遮光胶带位于所述导光板之上的边缘的距离为K，其中0.8mm≤K≤2.0mm。
  20. 一种显示装置，包括权利要求10-19中任一项所述的侧入式背光模组。
PCT/CN2017/096522 2016-11-02 2017-08-09 灯条、侧入式背光模组及显示装置 WO2018082360A1 (zh)

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