WO2024038670A1 - Composition de silicone durcissable aux uv, produit durci et agent de revêtement de plaquettes de silicium - Google Patents

Composition de silicone durcissable aux uv, produit durci et agent de revêtement de plaquettes de silicium Download PDF

Info

Publication number
WO2024038670A1
WO2024038670A1 PCT/JP2023/022591 JP2023022591W WO2024038670A1 WO 2024038670 A1 WO2024038670 A1 WO 2024038670A1 JP 2023022591 W JP2023022591 W JP 2023022591W WO 2024038670 A1 WO2024038670 A1 WO 2024038670A1
Authority
WO
WIPO (PCT)
Prior art keywords
sio
curable silicone
component
silicone composition
group
Prior art date
Application number
PCT/JP2023/022591
Other languages
English (en)
Japanese (ja)
Inventor
武春 豊島
利之 小材
Original Assignee
信越化学工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 信越化学工業株式会社 filed Critical 信越化学工業株式会社
Publication of WO2024038670A1 publication Critical patent/WO2024038670A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the present invention relates to an ultraviolet curable silicone composition, a cured product, and a silicon wafer coating agent.
  • UV-curable silicone materials have a long pot life under light-shielded conditions, and also have the characteristic of rapidly curing even at room temperature after irradiation with UV rays, so they are effective, for example, in applications where they are cured on large-area substrates. be.
  • the manufacturing of semiconductor silicon involves hundreds of physical and chemical processing steps on silicon substrates, and defects such as cracks in the silicon substrate and scratches from excavated pieces can occur during processing. There are cases where Therefore, it is thought that the yield can be improved by using a coating agent that protects the silicon substrate during processing.
  • silicone rubber is flexible and has excellent mechanical strength, so it can prevent warping and cracking of the silicon substrate, and it also has excellent chemical resistance, so it is suitable for such coating agents. It is considered useful.
  • UV-curable silicone materials are considered to be useful from the viewpoint of pot life and curing speed. Conceivable.
  • Adhesive aids such as alkoxysilanes and epoxy group-containing compounds are generally added to silicone coating agents and silicone adhesives in order to impart adhesion to substrates.
  • these adhesion aid components may stick to the silicon substrate or processing equipment, and may cause contamination and equipment contamination.
  • the present invention was made in view of the above circumstances, and provides an ultraviolet curable silicone composition that adheres well to metal silicon without the addition of an adhesion aid such as an alkoxysilane or an epoxy group-containing compound.
  • an adhesion aid such as an alkoxysilane or an epoxy group-containing compound.
  • the present inventors discovered that a predetermined alkenyl group-containing organopolysiloxane, a predetermined linear organohydrogenpolysiloxane, and a predetermined linear organohydrogenpolysiloxane that can be activated by light with a wavelength of 200 to 500 nm.
  • the present invention was completed based on the discovery that a composition containing a platinum group metal catalyst adheres well to metallic silicon without the addition of an adhesion aid.
  • the present invention 1.
  • R 1 each independently represents an unsubstituted or substituted monovalent hydrocarbon group
  • A each independently represents an alkenyl group
  • m is an integer of 1 to 10,000.
  • an ultraviolet curable silicone composition 2.
  • a cured product of the ultraviolet curable silicone composition of 1 or 2 4.
  • a silicon wafer coating agent comprising one or two ultraviolet curable silicone compositions is provided.
  • the ultraviolet curable silicone composition of the present invention adheres well to metal silicon even without the addition of an adhesion aid such as an alkoxysilane or an epoxy group-containing compound.
  • an adhesion aid such as an alkoxysilane or an epoxy group-containing compound.
  • sufficient working time can be secured before irradiation with ultraviolet rays, and curing proceeds rapidly even at room temperature after irradiation with ultraviolet rays, making it suitable as a coating agent for silicon wafers.
  • the ultraviolet curable silicone composition according to the present invention contains the following components (A) to (C) as essential components.
  • Component (A) in the ultraviolet curable silicone composition of the present invention includes at least one of the following components (i) and (ii).
  • Component (i) is represented by the following formula (1), has at least two, preferably two, alkenyl groups bonded to a silicon atom in one molecule, and has a viscosity of 50 to 10,000,000 mPa at 23°C. ⁇ S is a linear organopolysiloxane.
  • R 1 each independently represents an unsubstituted or substituted monovalent hydrocarbon group
  • A each independently represents an alkenyl group
  • m is an integer of 1 to 10,000. It is.
  • the unsubstituted or substituted monovalent hydrocarbon group for R 1 may be linear, branched, or cyclic. Further, the number of carbon atoms is not particularly limited, but preferably 1 to 10 carbon atoms, more preferably 1 to 5 carbon atoms.
  • monovalent hydrocarbon groups include alkyl groups such as methyl, ethyl, n-propyl, n-butyl, n-pentyl, n-hexyl, and n-heptyl groups; aralkyl groups such as benzyl and phenethyl groups; chloro Examples include halogenated alkyl groups such as methyl, 3-chloropropyl, and 3,3,3-trifluoropropyl groups, and among these, methyl group is preferred from the viewpoint of heat resistance.
  • the alkenyl group of A may be linear, branched, or cyclic. Further, the number of carbon atoms is not particularly limited, but preferably 2 to 10 carbon atoms, more preferably 2 to 5 carbon atoms. Specific examples of the alkenyl group include vinyl, allyl, butenyl, pentenyl, hexenyl and the like, with vinyl being particularly preferred.
  • m is an integer of 1 to 10,000, preferably an integer of 100 to 1,000. If m is 0, it will be highly volatile under atmospheric pressure, and if it exceeds 10,000, it will become highly viscous, resulting in poor workability and will not mix uniformly with components (B) and (C). It becomes difficult.
  • the viscosity of component (i) at 23° C. is 50 to 10,000,000 mPa ⁇ s, preferably 1,000 to 100,000 mPa ⁇ s. If the viscosity is less than 50 mPa ⁇ s, it will easily volatilize under atmospheric pressure or reduced pressure during defoaming, and if it exceeds 10,000,000 mPa ⁇ s, the workability will deteriorate and the components (B) and (C) ) It becomes difficult to mix uniformly with the ingredients. Note that the viscosity in the present invention is a value measured using a rotational viscometer.
  • the molecular weight of component (i) is not particularly limited, but the weight average molecular weight (Mw) is preferably 500 to 500,000, more preferably 1,000 to 100,000.
  • the weight average molecular weight in the present invention is a standard polystyrene equivalent value measured by GPC (gel permeation chromatography) using a THF solvent (the same applies hereinafter).
  • Component (ii) is an organopolysiloxane represented by the following average formula (2).
  • R 1 3 SiO 1/2 p
  • R 1 and A include the same groups as exemplified in formula (1) above, and preferred examples thereof are also the same as above.
  • the ratio (p+q)/r of T units to Q units in component (ii) is preferably 0.3 to 2.0, more preferably 0.5 to 1.0.
  • the weight average molecular weight of component (ii) is preferably 1,000 to 50,000, more preferably 2,000 to 10,000.
  • component (ii) may become solid at 25° C., it may be used after being dissolved in an organopolysiloxane as shown in component (i) above.
  • the usage ratio is preferably ⁇ (i) component ⁇ / ⁇ (ii) component ⁇ (mass ratio) of 0.3 to 10, and 0.5 -3 is more preferable.
  • the viscosity of the mixture of component (i) and component (ii) at 23° C. is preferably 1 to 100,000 mPa ⁇ s, more preferably 5 to 10,000 mPa ⁇ s. If the viscosity is 100,000 mPa ⁇ s or less, fluidity is high and handling is easy.
  • Component (B) in the ultraviolet curable silicone composition of the present invention is represented by the following average formula (3), and preferably contains at least two hydrogen atoms bonded to a silicon atom in one molecule. is a linear organohydrogenpolysiloxane having three elements. (R 1 3 SiO 1/2 ) s (H (3-b) R 1 b SiO 1/2 ) 2-s (HR 1 1 SiO 2/2 ) t (R 1 2 SiO 2/2 ) u (3 )
  • R 1 may be the same as in formula (1) above, but is preferably a methyl group.
  • b is 1 or 2, preferably 2.
  • s is an integer satisfying 0 ⁇ s ⁇ 2, preferably 0 or 2, and more preferably 2.
  • t and u are positive integers satisfying 2 ⁇ t+u ⁇ 800 and 0.6 ⁇ t/(t+u+2) ⁇ 1.0, but 7 ⁇ t+u ⁇ 700 and 0.7 ⁇ u/( A positive integer satisfying t+u+2) ⁇ 0.9 is preferable. If t+u is less than 2, three-dimensional crosslinking cannot be formed and a cured silicone product cannot be obtained. If t+u is more than 800, component (B) becomes highly viscous, and components (A) and (C) ) It becomes difficult to mix with other components. Further, if t/(t+u+2) is less than 0.6, the composition will harden slowly, and if it exceeds 1.0, the hardness of the obtained cured product will change greatly over time.
  • the kinematic viscosity of component (B) at 23° C. is preferably 0.5 to 20,000 mm 2 /s, more preferably 1 to 500 mm 2 /s.
  • the kinematic viscosity is a value measured using a Cannon-Fenske viscometer.
  • the weight average molecular weight of component (B) is preferably 600 to 60,000, more preferably 1,000 to 10,000.
  • the amount of organopolysilixane (B) is preferably 1 to 200 parts by weight, more preferably 1 to 50 parts by weight, per 100 parts by weight of component (A). With such a blending amount, sufficient hardness and strength can be obtained when the ultraviolet curable silicone composition is cured.
  • the organohydrogenpolysiloxane as component (B) has a molar ratio of SiH groups in component (B) to alkenyl groups in component (A) (Si-H/alkenyl group) of 0.8.
  • Si-H/alkenyl group is preferably blended in an amount of 1.0 to 4.0, more preferably 1.7 to 4.0, even more preferably 1.7 to 4.0. It is suitable that the amount is 3.5, more preferably 2.0 to 3.5, particularly preferably 2.0 to 3.0.
  • Component (C) in the ultraviolet curable silicone composition of the present invention is a platinum group metal catalyst that is activated by light with a wavelength of 200 to 500 nm, that is, it is inactive under light shielding, and When irradiated with light with a wavelength of 200 to 500 nm, it changes to a platinum group metal catalyst active at room temperature, and hydrosilylates the alkenyl group in component (A) and the silicon-bonded hydrogen atom in component (B). It is a catalyst to promote reactions.
  • component (C) examples include ( ⁇ 5 -cyclopentadienyl) trialiphatic platinum compounds or derivatives thereof.
  • cyclopentadienyltrimethylplatinum, methylcyclopentadienyltrimethylplatinum, and cyclopentadienyl group-modified derivatives thereof are preferred.
  • a bis( ⁇ -diketonato)platinum compound can also be suitably used as the component (C).
  • bis(acetylacetonato)platinum compounds and derivatives thereof modified with an acetylacetonato group are preferred.
  • the content of component (C) is not particularly limited as long as it promotes curing (hydrosilylation reaction) of the ultraviolet curable silicone composition of the present invention, but the content of component (A) and (B)
  • the amount of metal atoms in component (C) is preferably in the range of 0.01 to 500 ppm, more preferably 0.05 to 100 ppm, and more preferably 0.01 to 100 ppm, based on the total mass of the components. An amount of 50 ppm is even more preferred.
  • components (A) to (C) may be added to the ultraviolet curable silicone composition of the present invention as long as they do not impair the purpose of the present invention.
  • Other components include, for example, reaction control agents that control the reactivity of platinum catalysts, thixotropic control agents such as fumed silica; reinforcing agents such as fumed silica and crystalline silica; metal oxides and metal hydroxides. and viscosity modifiers such as non-reactive silicone oil having no reactive functional groups.
  • the ultraviolet curable silicone composition of the present invention does not contain adhesion aids such as alkoxysilanes and epoxy group-containing compounds, which are commonly used as adhesion agents that impart adhesion to substrates. preferable. These adhesion aid components may stick to the silicon substrate or processing equipment, resulting in contamination and equipment contamination.
  • Light having a wavelength of 200 to 500 nm, preferably 250 to 350 nm is used to cure the ultraviolet curable silicone composition of the present invention.
  • the irradiation intensity is preferably 30 to 2,000 mW/cm 2 and the irradiation dose is preferably 150 to 10,000 mJ/cm 2 .
  • the ultraviolet curable silicone composition of the present invention has excellent productivity because it can be cured at a relatively mild temperature of 100° C. or less after irradiation with ultraviolet rays in a short period of about several minutes. Furthermore, it can be cured in a short time of several minutes to several hours even at room temperature.
  • A-i-1) Organopolysiloxane represented by the following average formula (viscosity 1,000 mPa ⁇ s at 23°C) ViMe 2 SiO (Me 2 SiO) 300 SiMe 2 Vi (A-i-2): Organopolysiloxane represented by the following average formula (viscosity 5,000 mPa ⁇ s at 23°C) ViMe 2 SiO (Me 2 SiO) 430 SiMe 2 Vi (A-ii-1): A mixture of an organopolysiloxane with a weight average molecular weight of 4,500 represented by the average formula below and an organopolysiloxane represented by (A-i-2) above (mass ratio 1: 1) (ViMe 2 SiO 1/2 ) 0.07 (Me 3 SiO 1/2 ) 0.39 (SiO 4/2 ) 0.54
  • (B) Component (B-1): Dimethylsiloxane/methylhydrogensiloxane copolymer (dimethylsiloxane/methylhydrogensiloxane) blocked with trimethylsiloxy groups at both ends of the molecular chain and having a kinematic viscosity of 44.7 mm 2 /s at 23°C, represented by the average formula below. Content of silicon-bonded hydrogen atoms 0.0112 mol/g) (In the formula, the arrangement of each siloxane unit in parentheses is arbitrary.)
  • C Component (C-1): 2-(2-butoxyethoxy)ethyl acetate solution of bisacetylacetonatoplatinum complex (platinum concentration 0.5% by mass)
  • C-2 Toluene solution of methylcyclopentadienyltrimethylplatinum complex (platinum concentration 0.5% by mass)
  • Examples 2-1 to 2-5, Comparative Examples 2-1 to 2-6 The cured products obtained by curing the ultraviolet curable silicone compositions obtained in Examples 1-1 to 1-5 and Comparative Examples 1-1 to 1-6 were evaluated as follows. The results are shown in Table 2.
  • the ultraviolet curable silicone composition was irradiated with ultraviolet light using a UV-LED lamp with a wavelength of 365 nm at an irradiation intensity of 100 mW/cm 2 and a dose of 3,000 mJ/cm 2 , and then allowed to stand at 23°C for 24 hours.
  • the composition was cured to obtain a cured product.
  • the durometer A hardness of the 6 mm thick cured product was measured using a rubber hardness meter P2-A type (manufactured by Asker).
  • the ultraviolet curable silicone compositions prepared in Examples 1-1 to 1-5 had excellent adhesion to silicon wafers without adding an adhesion aid.
  • the ultraviolet curable silicone compositions of Comparative Examples 1-1 to 1-6 in which components outside the range of component (B) of the present invention were used had poor adhesion to silicon wafers.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Composition contenant (A) (i) et/ou (ii), (i) polysiloxane (1) AR1 2Si(OR1 2Si)mOSiR1 2A (1), (ii) polysiloxane, (2) (R1 3SiO1/2)p(A(3-a)R1 aSiO1/2)q(SiO4/2)r, (2) (R1 étant un groupe hydrocarbure monovalent, A étant un groupe alcényle, m étant 1-10 000, p > 0, q > 0, r > 0, p + q + r = 1, a étant 1 ou 2), (B) polysiloxane d'hydrogène (3) (R1 3SiO1/2)s(H(3-b)R1 bSiO1/2)2-s(HR1 1SiO2/2)t(R1 2SiO2/2)u (3) (R1 étant comme ci-dessus. b étant 1 ou 2, 0 ≤ s ≤ 2, 2 ≤ t + u ≤ 800, 0,6 ≤ t/(t + u + 2) ≤ 1. 0), et (C) un catalyseur à groupe platine activé par une lumière d'une longueur d'onde comprise entre 200 et 500 nm, où (B) groupes Si-H/(A) groupes alcényles = 0,8 à 4,0 (rapport molaire), qui adhère bien au silicium métallique même sans ajout d'un adjuvant d'adhérence.
PCT/JP2023/022591 2022-08-16 2023-06-19 Composition de silicone durcissable aux uv, produit durci et agent de revêtement de plaquettes de silicium WO2024038670A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022129461A JP2024026920A (ja) 2022-08-16 2022-08-16 紫外線硬化型シリコーン組成物、硬化物およびシリコンウェハーコーティング剤
JP2022-129461 2022-08-16

Publications (1)

Publication Number Publication Date
WO2024038670A1 true WO2024038670A1 (fr) 2024-02-22

Family

ID=89941434

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2023/022591 WO2024038670A1 (fr) 2022-08-16 2023-06-19 Composition de silicone durcissable aux uv, produit durci et agent de revêtement de plaquettes de silicium

Country Status (2)

Country Link
JP (1) JP2024026920A (fr)
WO (1) WO2024038670A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006177989A (ja) * 2004-12-20 2006-07-06 Dow Corning Toray Co Ltd 活性化エネルギー線硬化性シリコーン組成物及びそれを用いたネガ型パターン形成方法
JP2013063391A (ja) * 2011-09-16 2013-04-11 Shin-Etsu Chemical Co Ltd 光硬化型シリコーン樹脂組成物を用いる硬化薄膜の製造方法
JP2016053140A (ja) * 2014-09-04 2016-04-14 信越化学工業株式会社 シリコーン組成物
JP2019218495A (ja) * 2018-06-21 2019-12-26 信越化学工業株式会社 紫外線硬化型シリコーンゴム組成物および硬化物
JP2021001257A (ja) * 2019-06-20 2021-01-07 信越化学工業株式会社 室温硬化型シリコーンゴム組成物
JP2021178883A (ja) * 2020-05-11 2021-11-18 信越化学工業株式会社 光硬化性シリコーン組成物、接着剤、シリコーン硬化物

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006177989A (ja) * 2004-12-20 2006-07-06 Dow Corning Toray Co Ltd 活性化エネルギー線硬化性シリコーン組成物及びそれを用いたネガ型パターン形成方法
JP2013063391A (ja) * 2011-09-16 2013-04-11 Shin-Etsu Chemical Co Ltd 光硬化型シリコーン樹脂組成物を用いる硬化薄膜の製造方法
JP2016053140A (ja) * 2014-09-04 2016-04-14 信越化学工業株式会社 シリコーン組成物
JP2019218495A (ja) * 2018-06-21 2019-12-26 信越化学工業株式会社 紫外線硬化型シリコーンゴム組成物および硬化物
JP2021001257A (ja) * 2019-06-20 2021-01-07 信越化学工業株式会社 室温硬化型シリコーンゴム組成物
JP2021178883A (ja) * 2020-05-11 2021-11-18 信越化学工業株式会社 光硬化性シリコーン組成物、接着剤、シリコーン硬化物

Also Published As

Publication number Publication date
JP2024026920A (ja) 2024-02-29

Similar Documents

Publication Publication Date Title
JP5342830B2 (ja) 光硬化性オルガノポリシロキサン組成物
JP3669718B2 (ja) ワンパッケージのオルガノシロキサン組成物
JPH08143672A (ja) 接着促進用添加剤及びその中に含まれる硬化性オルガノシロキサン組成物
JP2010036577A (ja) ガスバリアー性硬化オルガノポリシロキサン樹脂フィルム及びその製造方法
TWI831823B (zh) 可雙重固化有機聚矽氧烷組成物
CA2336195A1 (fr) Compositions de silicone a double processus de durcissement
JP4663969B2 (ja) 硬化性シリコーンレジン組成物およびその硬化物
AU737212B2 (en) Dual curing silicone compositions
JPH08225742A (ja) 低温硬化性オルガノシロキサン組成物
JPH08176447A (ja) 硬化性シリコーン組成物およびその硬化物
JP7041094B6 (ja) ダイボンディング用シリコーン組成物、その硬化物、及び光半導体装置
TWI765957B (zh) 無溶劑型矽酮組成物、剝離紙以及剝離膜
JP2019218495A (ja) 紫外線硬化型シリコーンゴム組成物および硬化物
JP2007258317A (ja) 半導体装置の製造方法
WO2024038670A1 (fr) Composition de silicone durcissable aux uv, produit durci et agent de revêtement de plaquettes de silicium
JP7347387B2 (ja) 紫外線硬化型有機変性シリコーン組成物および硬化物
JP7397236B2 (ja) 基材接着性が強化されたｕｖ／湿気二重硬化組成物
JP7347388B2 (ja) 紫外線硬化型有機変性シリコーン組成物および硬化物
JP5960613B2 (ja) 半導体デバイスの製造方法
WO2020202932A1 (fr) Composition d'adhésif de silicone durcissable par addition
TW202024240A (zh) 加成硬化型聚矽氧樹脂組成物、其硬化物及光半導體裝置
KR102478712B1 (ko) 신속한 공기 경화를 위한 유기폴리실록산 클러스터 중합체
JP7132188B2 (ja) トリアリルシアヌレート含有付加硬化型シリコーン組成物及びその製造方法
US20230242712A1 (en) Organopolysiloxane cluster polymer for rapid air uv cure
FI92597C (fi) Irrokepaperipäällysteissä käytettävä organopolysiloksaanikoostumus

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23854708

Country of ref document: EP

Kind code of ref document: A1