WO2024027486A1 - 检测组件、传感装置以及传感装置的制造方法 - Google Patents

检测组件、传感装置以及传感装置的制造方法 Download PDF

Info

Publication number
WO2024027486A1
WO2024027486A1 PCT/CN2023/107432 CN2023107432W WO2024027486A1 WO 2024027486 A1 WO2024027486 A1 WO 2024027486A1 CN 2023107432 W CN2023107432 W CN 2023107432W WO 2024027486 A1 WO2024027486 A1 WO 2024027486A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive terminal
housing
lead
cavity
detection
Prior art date
Application number
PCT/CN2023/107432
Other languages
English (en)
French (fr)
Inventor
程德志
张宇翔
杨善宏
黄隆重
金骑宏
Original Assignee
杭州三花研究院有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202210918950.7A external-priority patent/CN116817997A/zh
Priority claimed from CN202211211162.0A external-priority patent/CN116817985A/zh
Priority claimed from CN202211342263.1A external-priority patent/CN116794112A/zh
Application filed by 杭州三花研究院有限公司 filed Critical 杭州三花研究院有限公司
Publication of WO2024027486A1 publication Critical patent/WO2024027486A1/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance

Definitions

  • the present application relates to the field of measurement technology, and specifically to a detection component, a sensing device, and a manufacturing method of the sensing device.
  • the sensing device includes a detection component, a housing and a circuit board.
  • the detection component includes a detection element, a lead-out electrode and a conductive terminal.
  • the detection element is connected to the conductive terminal through the lead-out electrode, and is connected to the detection circuit through the conductive terminal.
  • the shell has a cavity, and the detection element, the lead-out electrode and some conductive terminals are accommodated in the cavity. Detection components are easily deformed under the action of external forces, affecting detection accuracy.
  • the present application provides a detection component, a sensing device and a manufacturing method of the sensing device, which can reduce the deformation of the detection component.
  • a first aspect of the present application provides a detection assembly.
  • the detection assembly includes a lead-out electrode and a conductive terminal.
  • the conductive terminal has a first end and a second end.
  • the first end has a first end.
  • the second end has a second end.
  • the lead-out electrode is located on the same side of the second end as the first end.
  • the lead-out electrode includes a connecting portion and an extension portion. , the connecting portion is connected to the first end portion, and the extending portion extends from the connecting portion in a direction away from the conductive terminal;
  • the connecting portion and the second end are located on the same side of the first end; or, the connecting portion and the second end are respectively located on the first end. on different sides, and the connecting portion is perpendicular to the extension direction of the conductive terminal;
  • the extension part and the second end part are located on the same side of the first end; or, the extension part and the second end part are respectively located on the first end on different sides, and the extending portion is perpendicular to the extending direction of the conductive terminal.
  • the lead-out electrode has a connecting portion and an extension portion, and the lead-out electrode is located on the same side of the second end as the first end portion.
  • the connecting portion and the second The end portion is located on the same side of the first end; alternatively, the connecting portion and the second end portion are located on different sides of the first end, and the connecting portion is perpendicular to the extension direction of the conductive terminal.
  • the extension part and the second end part are located on the same side of the first end; or, the extension part and the second end part are respectively located on different sides of the first end, and the extension part and the extension of the conductive terminal The direction is vertical. In this way, the portion of the lead electrode protruding from the conductive terminal is reduced, which can reduce possible deformation of the lead electrode due to external force.
  • the second aspect of the present application provides a sensing device, including a detection component, a housing and a circuit board.
  • the housing is connected to the circuit board.
  • the detection component is electrically connected to the circuit board.
  • the detection component The assembly includes a detection element, a lead-out electrode and a conductive terminal, the lead-out electrode is connected to the detection element, and the lead-out electrode is connected to the conductive terminal;
  • the conductive terminal includes a first end and a second end.
  • the first end has a first end
  • the second end has a second end.
  • the lead-out electrode The first end is located on the same side of the second end.
  • the lead-out electrode includes a connection part and an extension part.
  • the connection part is connected to the first end part, and the extension part extends from the connection part. Extending in a direction away from the conductive terminal;
  • the connecting portion and the second end are located on the same side of the first end; or, the connecting portion and the second end are respectively located on the first end. on different sides, and the connecting portion is perpendicular to the extension direction of the conductive terminal;
  • the extension part and the second end part are located on the same side of the first end; or, the extension part and the second end part are respectively located on the first end on different sides, and the extension part is perpendicular to the extension direction of the conductive terminal;
  • the housing has a cavity, the detection element, the lead-out electrode and the first end are all located within the cavity, and the second end is located outside the cavity.
  • the first side and the second side of the detection element are located on the same side of the first end as the second end; or, the first side and the second end are are respectively located on different sides of the first end, the second side and the second end are respectively located on different sides of the first end, and the second side is flush with the first end; or the first side and the second side are respectively located on the first end. different sides of the ends.
  • the portion of the lead electrode that protrudes from the conductive terminal is reduced, and during the assembly process of the detection component and the housing, the deformation of the lead electrode that may be caused by the collision between the detection element and the inner wall of the housing is reduced.
  • a third aspect of the present application provides a method for manufacturing a sensing device, including the following steps:
  • a detection component, a housing and a circuit board are provided, the detection component includes a detection element, a conductive part and a base, the detection element is connected to the conductive part, and the conductive part is connected to the base;
  • the housing is placed outside at least part of the detection component, and the housing and the circuit board are connected.
  • the detection component and the housing are connected to the circuit board respectively.
  • the cost of the base and the circuit board is reduced.
  • the difficulty of assembling the shells reduces the difficulty of manufacturing the detection device.
  • Figure 1 is a schematic diagram of a detection component in related technologies
  • Figure 2 is a schematic diagram of the assembly of the detection component and the housing in the related art
  • Figure 3 is a front view of the detection component provided by the first embodiment of the present application.
  • Figure 4 is a rear view of the detection component provided by the first embodiment of the present application.
  • Figure 5 is a perspective view of the detection component provided by the first embodiment of the present application.
  • Figure 6 is an exploded view of the detection component provided by the first embodiment of the present application.
  • Figure 7 is a top view of the detection component provided by the first embodiment of the present application.
  • Figure 8 is a schematic diagram of the connection between the lead electrode and the detection element in the first embodiment of the present application.
  • Figure 9 is a front view of the detection component provided by the second embodiment of the present application.
  • Figure 10 is a rear view of the detection component provided by the second embodiment of the present application.
  • Figure 11 is a perspective view of a detection component provided by the second embodiment of the present application.
  • Figure 12 is a front view of the detection component provided by the third embodiment of the present application.
  • Figure 13 is a perspective view of a detection component provided by the third embodiment of the present application.
  • Figure 14 is an exploded view of the detection component provided by the third embodiment of the present application.
  • Figure 15 is a top view of the detection component provided by the third embodiment of the present application.
  • Figure 16 is a schematic diagram of the connection between the lead electrode and the detection element in the third embodiment of the present application.
  • Figure 17 is a perspective view of a detection component provided by the fourth embodiment of the present application.
  • Figure 18 is a top view of the detection component provided by the fourth embodiment of the present application.
  • Figure 19 is a schematic diagram of a detection component provided by the fifth embodiment of the present application.
  • Figure 20 is a schematic diagram of a detection component provided by the sixth embodiment of the present application.
  • Figure 21 is a schematic diagram of a detection component provided by the seventh embodiment of the present application.
  • Figure 22 is a schematic diagram of the connection between the lead electrode and the detection element in the seventh embodiment of the present application.
  • Figure 23 is a schematic diagram of the assembly of the detection component and the housing provided by an embodiment of the present application.
  • Figure 24 is an exploded view of the detection component and housing provided by an embodiment of the present application.
  • Figure 25 is a schematic diagram of the assembly of the detection component and the housing provided by an embodiment of the present application.
  • Figure 26 is an exploded view of the detection component and housing provided by an embodiment of the present application.
  • Figure 27 is a cross-sectional view of a sensing device provided by an embodiment of the present application.
  • Figure 28 is a schematic diagram of the first housing and the second housing provided in an embodiment of the present application.
  • Figure 29 is a cross-sectional view of a sensing device provided by another embodiment of the present application.
  • Figure 30 is a schematic diagram of a sensing device provided by another embodiment of the present application.
  • Figure 31 is a cross-sectional view from another angle of a sensing device provided by another embodiment of the present application.
  • Figure 32 is another angular cross-sectional view of the sensing device provided by another embodiment of the present application.
  • Figure 33 is a schematic diagram of the first housing and the second housing provided in another embodiment of the present application.
  • Figure 34 is a schematic diagram of a circuit board provided by another embodiment of the present application.
  • the sensing device includes a detection component and a housing 5, as shown in Figure 2, for example.
  • the detection component is used to detect gas, ambient temperature, etc., and the housing 5 protects the detection component to reduce deformation of the detection component caused by external force.
  • the detection component includes a detection element 1, a lead electrode 2 and a conductive terminal 3. One end of the lead electrode 2 is connected to the conductive terminal 3, and the other end of the lead electrode 2 is connected to the detection element 1, for example as shown in Figure 1.
  • the lead-out electrode 2 protrudes from the conductive terminal 3, for example, as shown in the lead-out electrode 2 in FIG. 1.
  • the extraction electrode 2 is a flexible component and is easily deformed under the action of external force.
  • the detection element 1 and the lead electrode 2 protruding from the conductive terminal 3 first enter the inner cavity of the housing 5 and collide with the inner wall of the housing 5.
  • Lead electrode 2 Twisting and bending occur.
  • the deformation of the extraction electrode 2 will not only affect the transmission of the detection signal, but also easily lead to failure of its connection with the detection element 1 or the conductive terminal 3 .
  • the lead-out electrode 2 protrudes from one end of the conductive terminal 3, the entire detection assembly is tall, which is not conducive to miniaturization of the entire sensing device.
  • the first aspect of the present application provides a detection assembly 100 to reduce the deformation of the lead-out electrode under the action of external force.
  • the detection component 100 of the present application includes a detection element 1, a lead electrode 2 and a conductive terminal 3.
  • the lead electrode 2 is electrically connected to the conductive terminal 3, and the lead electrode 2 is electrically connected to the detection element 1, for example, as shown in Figure 3.
  • the detection signal of the detection element 1 is transmitted to the conductive terminal 3 through the lead-out electrode 2 and transmitted to the detection circuit through the conductive terminal 3.
  • FIGS. 3 to 8 are schematic diagrams of the first embodiment
  • FIGS. 9 to 11 are schematic diagrams of the second embodiment
  • FIGS. 12 to 16 are.
  • This is a schematic diagram of the third embodiment.
  • Figure 17 and Figure 18 are schematic diagrams of the fourth embodiment.
  • Figure 19 is a schematic diagram of the fifth embodiment.
  • Figure 20 is a schematic diagram of the sixth embodiment.
  • Schematic diagrams of the embodiment, for example, FIG. 21 and FIG. 22 are schematic diagrams of the seventh embodiment.
  • the conductive terminal 3 is a rigid component, which is not only used to transmit signals, but also supports the lead-out electrode 2 so that the lead-out electrode 2 is set upright, thereby fully contacting the detection element 1 with the substance to be detected, or fully exposing the detection element 1 to the in the environment being tested.
  • the detection assembly 100 includes at least a pair of lead-out electrodes 2 .
  • the shape, structure and size of the pair of lead-out electrodes 2 may be the same or different.
  • the detection component 100 includes a first lead-out electrode 21 and a second lead-out electrode 22 with the same shape, structure and size.
  • the first lead-out electrode 21 and the second lead-out electrode 22 form a pair of lead-out electrodes 2 .
  • the detection assembly 100 also includes at least a pair of conductive terminals 3 , and the shape, structure and size of the pair of conductive terminals 3 may be the same or different.
  • the detection component 100 includes a first conductive terminal 31 and a second conductive terminal 32 that have the same shape, structure, and size.
  • the first conductive terminal 31 and the second conductive terminal 32 form a pair of conductive terminals 3 .
  • Both the first conductive terminal 31 and the second conductive terminal 32 are columnar, for example, cylindrical.
  • the first conductive terminal 31 has a first end 311 and a second end 312 .
  • the first end 311 and the second end 312 of the first conductive terminal 31 are respectively located at two ends of the first conductive terminal 31 .
  • the first end of the first conductive terminal 31 The first end 311 of the first conductive terminal 31 is connected to the first lead-out electrode 21 .
  • the second end 312 of the first conductive terminal 31 is used to connect to the detection circuit.
  • the first end 311 of the first conductive terminal 31 has a first end 313 .
  • the second end 312 has a second end 314 .
  • the second conductive terminal 32 has a first end 321 and a second end 322 .
  • the first end 321 and the second end 322 of the second conductive terminal 32 are respectively located at two ends of the second conductive terminal 32 .
  • the first end 321 of the second conductive terminal 32 is connected to the second lead-out electrode 22 .
  • the second end 322 of the second conductive terminal 32 is used to connect to the detection circuit.
  • the first end 321 of the second conductive terminal 32 has a third One end 323, the second end 322 of the second conductive terminal 32 has a second end 324.
  • the second lead-out electrode 22 and the first end 321 of the second conductive terminal 32 are located on the same side of the second end 324 of the second conductive terminal 32 .
  • the height direction of the detection component 100 is in the same direction as the extension direction Z of the conductive terminal 3 .
  • the first end 313 of the first conductive terminal 31 , the second end 314 of the first conductive terminal 31 , the first end 323 of the second conductive terminal 32 and the second end 324 of the second conductive terminal 32 are respectively Can be an end face, for example, flat, curved, or rough.
  • the first ends 311 and 321 or the second ends 312 and 322 are tapered, the first ends 313 and 323 are point-shaped, or the second ends 314 and 324 are point-shaped.
  • the relative position of the lead-out electrode 2 and the conductive terminal 3 is designed in this application.
  • the following description takes the relative positions of the first extraction electrode 21 and the first conductive terminal 31 as an example.
  • the first lead-out electrode 21 includes a first connecting part 211 and a first extending part 212.
  • the first connecting part 211 is connected to the first end part 311 of the first conductive terminal 31.
  • the first extending part 212 is away from the first connecting part 211.
  • the direction of the first conductive terminal 31 extends, for example, as shown in FIGS. 3 to 6 .
  • the first connection portion 211 and the second end portion 312 of the first conductive terminal 31 are located on the same side of the first end 313 of the first conductive terminal 31 , for example, FIG. 3 ⁇ As shown in Figure 6, or as shown in Figure 21, or as shown in Figures 9 to 11.
  • the first end portion 311 has a side surface 315, and the first connecting portion 211 is connected to the side surface 315, as shown in Figures 4 and 6 . Since the diameter of the first conductive terminal 31 is smaller and the side surface 315 of the first conductive terminal 31 has a larger area, the first connecting portion 211 is connected to the side surface 315 of the first conductive terminal 31 .
  • connection is helpful to reduce the difficulty of connecting the first lead-out electrode 21 and the first conductive terminal 31 .
  • the first connecting portion 211 neither protrudes from the first end 313 nor the second end 314, and the first conductive terminal 31 can be used to block the first connecting portion 211.
  • External force reduces the deformation of the first connecting portion 211 under the action of external force.
  • At least part of the first extension 212 is located on the same side of the first end 313 of the first conductive terminal 31 as the second end 312 of the first conductive terminal 31 , for example as shown in FIG. 26 . In this way, the height of the portion of the first lead-out electrode 21 protruding outward from the first end 313 of the first conductive terminal 31 is reduced in the height direction of the detection component 100 , that is, the height of the first extension portion 212 is reduced, thereby reducing the to detect the height of the component 100.
  • the first connection portion 211 and the second end portion 312 of the first conductive terminal 31 are respectively located on different sides of the first end 313 of the first conductive terminal 31, and
  • the first connecting portion 211 is located in a plane perpendicular to the extension direction of the conductive terminal, for example, as shown in FIGS. 12 to 15 , or as shown in FIGS. 17 and 18 .
  • the first connecting portion 211 is connected to the first end 313 .
  • the first connecting portion 211 is slightly higher than the first end 313 and is substantially flush with the first end 313 .
  • the height difference between the top A1 and the first end 313 of the first connecting part 211 is approximately equal to the thickness of the first connecting part 211 in the direction perpendicular to the height of the detection component 100, as shown in FIG. 13 and Figure 14. In this way, the deformation of the first connecting part 211 under the action of external force can also be reduced.
  • the first extension part 212 and the second end part 312 of the first conductive terminal 31 are located on the same side of the first end 313 of the first conductive terminal 31 , for example, FIG. 3 ⁇ as shown in Figure 6, or as shown in Figures 9 to 11. In this way, in the extending direction of the conductive terminal, the first extension part 212 neither protrudes from the first end 313 nor the second end 314. When the detection component 100 collides with an external substance, the first conductive terminal 31 can block part of the external force for the first extension part 212, thereby reducing the deformation of the first extension part 212.
  • first extension portion 212 and the second end portion 312 of the first conductive terminal 31 are respectively located on different sides of the first end 313 of the first conductive terminal 31 , and the first extension portion 212 is located between the first end portion 312 and the second end portion 312 of the first conductive terminal 31 .
  • the first extension 212 is slightly higher than the first end 313 and is generally flush with the first end 313 .
  • the height difference between the top A2 of the first extension part 212 and the first end 313 is approximately equal to the height difference between the first extension part 212 and the first extension part 212 perpendicular to The thickness of the component 100 in the height direction is detected. In this way, the deformation of the first extension part 212 under the action of external force can also be reduced.
  • the first end 313 can reduce the deformation of the first extraction electrode 21 under the action of external force. Moreover, the overall height of the detection assembly 100 can also be reduced, which is beneficial to miniaturization of the detection assembly 100 .
  • the first connecting portion 211 and the first extending portion 212 are respectively located on different sides of the first end 313 of the first conductive terminal 31 .
  • the first connection part 211 is connected to the first end 313 of the first conductive terminal 31
  • the first connection part 211 is connected to the second end 312 of the first conductive terminal 31 They are respectively located on different sides of the first end 313 of the first conductive terminal 31, and the first connecting portion 211 is located in a plane perpendicular to the extension direction of the conductive terminal; along the extension direction Z of the conductive terminal 3, the first extension portion 212 and the The second end 312 of one conductive terminal 31 is located on the same side as the first end 313 of the first conductive terminal 31 .
  • the first connecting portion 211 and the second end portion 312 of the first conductive terminal 31 are located on the same side of the first end 313 of the first conductive terminal 31 .
  • the extension portion 212 and the second end portion 312 of the first conductive terminal 31 are respectively located on different sides of the first end 313 of the first conductive terminal 31 , and the first extension portion 212 is located in a plane perpendicular to the extension direction of the conductive terminal.
  • the first connecting portion 211 and the first extension portion 212 are located on the same side of the first end 313 of the first conductive terminal 31, for example, as shown in Figures 3 to 6, Or as shown in Figures 9 to 11.
  • the first connecting portion 211 and the first extension portion 212 of the first lead-out electrode 21 and the second end portion 312 of the first conductive terminal 31 are located between the first end 313 of the first conductive terminal 31 Same side. For example, as shown in FIGS. 12 to 15 , or as shown in FIGS.
  • the first connecting portion 211 and the first extending portion 212 of the first lead-out electrode 21 are in contact with the first conductive terminal 31
  • the second end portions 312 are respectively located on different sides of the first end 313 of the first conductive terminal 31, and the first lead-out electrode 21 is located in a plane perpendicular to the extension direction of the conductive terminal.
  • the first connecting portion 211 and the first extending portion 212 are located on the first end 313 of the first conductive terminal 31 .
  • one The same side of the end 313 can reduce the bending or twisting of the first lead-out electrode 21, thereby reducing the impact of the internal stress of the first lead-out electrode 21 on signal transmission.
  • the second lead-out electrode 22 includes a second connecting portion 221 and a second extending portion 222.
  • the second connecting portion 221 is connected to the first end portion 321 of the second conductive terminal 32.
  • the second extending portion 222 extends from the second connecting portion 221 to the first end portion 321 of the second conductive terminal 32.
  • 221 extends in a direction away from the first end 321 of the second conductive terminal 32 , for example, as shown in FIGS. 3 to 6 .
  • the relative positions of the first lead-out electrode 21 and the first conductive terminal 31 are the same as the relative positions of the second lead-out electrode 22 and the second conductive terminal 32 in this application, which will not be described again.
  • the first extension portion 212 is located on a side of the first conductive terminal 31 facing the second conductive terminal 32
  • the second extension portion 222 is located on a side of the second conductive terminal 32 facing the first conductive terminal 31 .
  • the first extension The second extension portion 212 and the second conductive terminal 32 are located on the same side of the first conductive terminal 31, and the second extension portion 222 and the first conductive terminal 31 are located on the same side of the second conductive terminal 32.
  • first extension portion 212 and the second extension portion 212 are located on the same side of the first conductive terminal 31.
  • the two extension portions 222 are located between the first conductive terminal 31 and the second conductive terminal 32 .
  • the first conductive terminal 31 and the second conductive terminal 32 can block the external force for the first extension part 212 and the second extension part 222 and reduce the deformation of the first extension part 212 and the second extension part 222 under the action of external force.
  • the extraction electrode 2 may be in the form of a film, a sheet or a line. Bending of the lead-out electrode 2 will cause an increase in internal stress, thereby affecting the transmission of electrical signals within the lead-out electrode 2 . Therefore, in some embodiments, the extraction electrode 2 is located in a plane parallel to the extension direction of the conductive terminals, such as shown in FIGS. 3 to 6 ; or, the plane is perpendicular to the extension direction of the conductive terminals, such as in FIG. 12 to Figure 15. In this way, the bending of the extraction electrode 2 can be reduced.
  • the lead-out electrode 2 may be slightly deviated from the plane, or may not be completely located in the plane. This situation is still regarded as the lead-out electrode 2 being located in the plane in this application. Or roughly in a plane.
  • the first lead-out electrode 21 is in the shape of a sheet
  • the second lead-out electrode 22 is in the shape of a sheet.
  • the first lead-out electrode 21 and the second lead-out electrode 22 are both sheet-shaped electrodes prepared by the PVD method and having a thickness of micron or millimeter level.
  • the first lead-out electrode 21 is connected to the first conductive terminal 31
  • the second lead-out electrode 22 is connected to the second conductive terminal.
  • the first extension part 212 is close to the second conductive terminal 32 relative to the first connection part 211 .
  • the second extending portion 222 is close to the first conductive terminal 31 relative to the second connecting portion 221, as shown in FIG. 21, for example.
  • the first extraction electrode 21 is flush with the second extraction electrode 22 . That is to say, the first lead-out electrode 21 and the second lead-out electrode 22 are located in the same plane, and the plane may be perpendicular or parallel to the extension direction of the conductive terminal, for example. In this way, the mutual influence between the first extraction electrode 21 and the second extraction electrode 22 can be reduced. Since both the first lead-out electrode 21 and the second lead-out electrode 22 are connected to the detection element 1, if the first lead-out electrode 21 and the second lead-out electrode 22 are not flush, at least one of the first lead-out electrode 21 and the second lead-out electrode 22 will Requires bending. As mentioned before, the bending of the lead electrode will cause internal stress and affect the transmission of electrical signals.
  • first lead-out electrode 21 and the second lead-out electrode 22 flush can reduce the generation of internal stress in the lead-out electrode.
  • the first lead-out electrode 21 and the second lead-out electrode 22 may slightly deviate from the "flush" position. This situation is still regarded as the third lead-out electrode in this application.
  • One lead-out electrode 21 is flush with or substantially flush with the second lead-out electrode 22 .
  • the first lead-out electrode 21 is located in a plane parallel to the extension direction of the conductive terminal 3, and the first lead-out electrode 21 is connected to the side 315 of the first conductive terminal 31, for example, FIG. 3 to FIG. 6 shown.
  • the first connection part 211 has a first connection end 2111 and a second connection end 2112.
  • the first connection end 2111 and the second connection end 2112 are respectively located at both ends of the first connection part 211 along the height direction or width direction of the detection assembly 100.
  • the first connection end 2111 of the first connection part 211 is close to the first end 313 of the first conductive terminal 31 relative to the second connection end 2112 of the first connection part 211 .
  • the first connection part 211 has a first connection part 2113 connected to the first extension part 212.
  • the first connection part 2113 may be located at the first connection end 2111, for example, as shown in Figures 3 to 6; or, the first connection part 2113 may be Located at the second connection end 2112, for example, as shown in Figures 9 to 11, or as shown in Figure 22; or, the first connection point 2113 can also be located at any position between the first connection end 2111 and the second connection end 2112.
  • the first connection point 2113 is located at the first connection end 2111 and the second connection end 2112, which can reduce the waste of manufacturing materials of the first lead-out electrode 21.
  • the second lead-out electrode 22 is located in a plane parallel to the extension direction of the conductive terminal, and the side surfaces of the second lead-out electrode 22 and the second conductive terminal 32 325 connection, as shown in Figure 3 to Figure 6.
  • the second connection part 221 has a first connection end 2211 and a second connection end 2212.
  • the first connection end 2211 and the second connection end 2212 are respectively located at both ends of the second connection part 221 along the height direction or width direction of the detection assembly 100.
  • the first connection end 2211 of the second connection part 221 is closer to the first end 323 of the second conductive terminal 32 relative to the second connection end 2212 of the second connection part 221 .
  • the second connection part 221 has a second connection point 2213 connected to the second extension part 222.
  • the second connection part 2213 may be located at the first connection end 2211 of the second connection part 221, for example, as shown in Figures 3 to 6; or, The second connection point 2113 can be located at the second connection end 2212, such as shown in Figures 9 to 11, or as shown in Figure 22; or, the second connection point 2113 can also be located at the first connection end 2211 and the second connection end 2212 anywhere in between.
  • first connecting portion 211 and the second connecting portion 221 have the same shape, structure, and size. In some embodiments, the first connecting part 211 and the second connecting part 221 are arranged symmetrically. For example, shown in Figure 3, Figure 7 and Figure 8. The first connecting part 211 and the second connecting part 221 are both in the shape of a sheet, and both the first connecting part 211 and the second connecting part 221 are in the shape of a strip. In FIGS. 12 to 15 , the first connecting part 211 and the second connecting part are 221 are all round.
  • first connection part 211 and the second connection part 221 are arranged axially symmetrically; in Figures 12 to 15, the first connection part 211 and the second connection part 221 are arranged axially symmetrically.
  • the first connecting part 211 and the second connecting part 221 are centrally symmetrical.
  • the lead-out electrode 2 and the conductive terminal 3 are connected by spot welding.
  • the reliability of the spot welding connection is poor, and the lead electrode 2 and the conductive terminal 3 are easily separated at the connection point, causing connection failure.
  • the connection portion includes a connection area 23 for connecting to the conductive terminal 3 , and the connection area 23 is linear or planar.
  • the connection area 23 of the first connection part 211 is linear, for example, as shown in FIG. 8 , the connection between the first connection part 211 and the first conductive terminal 31 is a line connection; when the connection area 23 of the first connection part 211 When in a planar shape, the connection between the first connecting portion 211 and the first conductive terminal 31 is a planar connection.
  • the connection area 23 of the second connection part 221 is linear, as shown in FIG.
  • connection between the second connection part 221 and the second conductive terminal 32 is a line connection; when the second connection part 221 When the connection area 23 is planar, the connection between the second connection portion 221 and the second conductive terminal 32 is a planar connection.
  • the lead electrode 2 can be separated from the conductive terminal 3, such as If the lead-out electrode 2 and the conductive terminal 3 leave linear connection traces on the lead-out electrode 2 or the conductive terminal 3 after they are separated, it means that the connection between the lead-out electrode 2 and the conductive terminal 3 is linear; if the lead-out electrode 2 and the conductive terminal 3 3. If there are planar connection traces left on the lead electrode 2 or the conductive terminal 3 after separation, it means that the connection between the lead electrode 2 and the conductive terminal 3 is planar.
  • the lead-out electrode 2 In order to realize signal transmission, the lead-out electrode 2 must be connected not only to the conductive terminal 3 but also to the detection element 1 .
  • the detection element 1 includes a detection part 11 and at least a pair of electrode parts 12 .
  • the detection part 11 is electrically connected to the electrode part 12, and the electrode part 12 is electrically connected to the extraction electrode 2, as shown in FIG. 16, for example.
  • the detection part 11 can generate an electrical signal under the influence of the detected substance or the detected parameter, for example, when the gas concentration changes, the electrical signal is transmitted to the extraction electrode 2 through the electrode part 12 and transmitted to the conductive terminal 3 detection circuit.
  • the detection element 1 includes an insulating substrate 13
  • the detection part 11 is a thermistor material covered on the surface of the insulating substrate 13
  • the electrode part 12 is a conductive layer covered on the surface of the insulating substrate 13 , for example, as shown in Figure 16 Show.
  • the detection circuit When a change in gas concentration causes a change in the temperature of the environment to which the thermistor material is exposed, the resistance of the thermistor material changes, and an electrical signal is generated.
  • the electrical signal is transmitted to the detection circuit through the electrode part 12, the extraction electrode 2 and the conductive terminal 3.
  • the plane of the first lead-out electrode 21 and the second lead-out electrode 22 is parallel to at least part of the surface of the detection element 1 . For example, it is parallel to the electrode part of the detection element. In this way, the deformation of the extraction electrode caused by the connection between the extraction electrode and the detection element can be reduced.
  • the plane where the lead-out electrode 2 is located is parallel to the insulating substrate 13 . In this way, the bending of the extraction electrode 2 caused by the connection between the extraction electrode 2 and the detection element 1 can be reduced, for example, as shown in FIG. 16 .
  • the detection part 11 is close to the first end 313 of the first conductive terminal or the first end 323 of the second conductive terminal relative to the insulating substrate 13 , for example, FIG. 12 and FIG. 16 shown. In this way, the detection part can be fully exposed to the environment.
  • the detection element 1 includes a detection substrate and internal electrodes disposed within the detection substrate.
  • the detection substrate is a ceramic substrate including thermistor material.
  • the change in gas concentration causes the temperature of the environment to which the detection substrate is exposed to change, the resistance of the detection substrate 14 changes, thereby generating an electrical signal.
  • the electrical signal is transmitted to the detection circuit through the internal electrode, the lead electrode 2 and the conductive terminal 3.
  • the electrode portion 12 is arranged symmetrically with respect to the axis of the detection element 1, for example As shown in Figure 16.
  • a pair of lead-out electrodes 2 are also symmetrically arranged.
  • the first extension part 212 includes a first connection section 2121 and a second connection section 2122 that are connected to each other.
  • the first connection section 2121 is connected to the electrode part 12 of the detection element 1
  • the second connection section 2122 is connected from the first connection section 2121 to the electrode part 12 of the detection element 1 .
  • the connecting section 2121 extends in a direction away from the detection element 1, and the second connecting section 2122 is connected to the first connecting part 211;
  • the second extending part 222 includes a third connecting section 2221 and a fourth connecting section 2222 that are connected to each other.
  • the third connecting section 2221 is connected to the electrode portion 12 of the detection element 1, the fourth connection section 2222 extends from the third connection section 2221 in a direction away from the detection element 1, the fourth connection section 2222 is connected to the second connection section 221; the first connection section 2121 is The third connecting section 2221 is parallel, for example, as shown in Figures 8 and 16. In this way, the connection between the pair of extraction electrodes 2 and the detection element 1 can be facilitated.
  • At least a portion of the second connecting section 2122 is parallel to at least a portion of the fourth connecting section 2222.
  • the second connecting section 2122 and the fourth connecting section 2222 extend in the same direction toward the outside of the detection element 1; for example, as shown in Figure 16, the second connecting section 2122 and the fourth connecting section 2222 extend in opposite directions. extends outside the detection element 1.
  • the first connection section 2121 and the second end 312 of the first conductive terminal 31 are respectively located on both sides of the first end 313 of the first conductive terminal 31, and the second connection section 2121 is located on both sides of the first end 313 of the first conductive terminal 31.
  • the segment 2122 is located on the same side of the first end 313 of the first conductive terminal 31 as shown in FIG. 22 .
  • the first connection section 2121 is located on the same side of the first end 313 of the first conductive terminal 31 as the second end 312 of the first conductive terminal 31
  • the second connection section 2122 is connected to the second end 312 of the first conductive terminal 31 .
  • the second end 312 of one conductive terminal 31 is located on the same side as the first end 313 of the first conductive terminal 31 .
  • the first extension 212 and the second end 312 of the first conductive terminal 31 are located on the same side of the first end 313 of the first conductive terminal 31 . That is to say, the first lead-out electrode 21 is not provided protruding from the first conductive terminal 31 .
  • the axis of the second connecting section 2122 is a curve.
  • the third connecting section 2221 and the second end 322 of the second conductive terminal 32 are respectively located on both sides of the first end 323 of the second conductive terminal 32, and the fourth The connecting section 2222 and the second end 322 of the second conductive terminal 32 are located on the same side of the first end 323 of the second conductive terminal 32 .
  • the third connecting section 2221 At least part of the second end 322 of the second conductive terminal 32 is located on the same side as the first end 323 of the second conductive terminal 32
  • the fourth connecting section 2222 is located on the second end 322 of the second conductive terminal 32 .
  • the same side of the first end 323 of the conductive terminal 32 That is to say, the second lead-out electrode 22 is not provided protruding from the second conductive terminal 32 .
  • the axis of fourth connecting section 2222 is a curve.
  • the first extension part 212 is arranged axially symmetrically or centrally symmetrically with respect to the second extension part 222 .
  • the first extraction electrode 21 and the second extraction electrode 22 are located in a plane parallel to the extension direction of the conductive terminal 3 .
  • An extension part 212 is arranged axially symmetrically with respect to the second extension part 222 , and the axis of the orthographic projection of the detection element 1 on the plane is the symmetry axis of the first extension part 212 and the second extension part 222 .
  • the first lead-out electrode 21 and the second lead-out electrode 22 are located in a plane perpendicular to the extension direction of the conductive terminal 3 , and the first extension part 212 is arranged symmetrically with respect to the center of the second extension part 222 .
  • the center of the orthographic projection of the element 1 on this plane is the center of symmetry of the first extension part 212 and the second extension part 222 .
  • the first extraction electrode 21 is axially symmetrical or centrally symmetrical with respect to the second electrode 22 .
  • the first lead-out electrode 21 and the second lead-out electrode 22 are located in a plane perpendicular to the extension direction of the conductive terminals.
  • the first lead-out electrode 21 is arranged symmetrically with respect to the center of the second lead-out electrode 22, and the detection element The center of the orthographic projection of 1 on this plane is the center of symmetry of the first lead-out electrode 21 and the second lead-out electrode 22.
  • the first lead-out electrode 21 and the second lead-out electrode 22 are located in a plane parallel to the extension direction of the conductive terminal.
  • the lead-out electrode 21 is arranged axially symmetrically with respect to the second lead-out electrode 22 , and the axis of the orthographic projection of the detection element 1 on this plane is the axis of symmetry of the first lead-out electrode 21 and the second lead-out electrode 22 .
  • the first extraction electrode 21 and the second extraction electrode 22 have a symmetrical structure, which can facilitate the transmission of electrical signals of the detection element 1 .
  • the lead electrode 2 is no higher or slightly higher than the first end 313 of the first conductive terminal 31, and the detection element 1 is electrically connected to the lead electrode 2 , therefore, the detection element 1 is also not higher or slightly higher than the first end 313 of the first conductive terminal 31 .
  • the detection element 1 has a first side 111 and a second side 112 , which are respectively located on different sides of the detection element 1 along the extension direction Z of the conductive terminal 3 .
  • the first side 111 and the second side 112 are located on the same side of the first end 313 of the first conductive terminal 31 as the second end 312 of the first conductive terminal 31, as shown in Figure 12 or Figure 22 shown.
  • first side 111 and the second end 312 of the first conductive terminal 31 are respectively located on different sides of the first end 313
  • the second side 112 and the second end 312 of the first conductive terminal 31 are respectively located at the first conductive terminal.
  • the first end of 313 is flush.
  • the height difference between the first side 111 of the detection element 1 and the first end 313 of the first conductive terminal 31 is approximately equal to the size of the detection element 1 in the extension direction of the conductive terminal 3 .
  • the first side 111 and the second side 112 are respectively located on different sides of the first end 313 of the first conductive terminal 31 , for example, as shown in FIG. 20 .
  • the relative positions of the detection element 1 and the second conductive terminal 32 are set in the same manner.
  • the first side 111 and the second side 112 are the same as the second end 322 of the second conductive terminal 32 located at the first end 323 of the second conductive terminal 32 side, as shown in Figure 12 or Figure 24.
  • the first side 111 and the second end 322 of the second conductive terminal 32 are respectively located on different sides of the first end 313 , and the second side 112 and the second end 322 of the second conductive terminal 32 are respectively located at the first conductive terminal.
  • the first side 111 is farther away from the first end 323 of the second conductive terminal 32 relative to the second side 112, and the second side 112 is connected to the second conductive terminal 32.
  • the first end 323 of the terminal 32 is flush.
  • the height difference between the second side 112 of the detection element 1 and the first end 323 of the second conductive terminal 32 is approximately equal to the size of the detection element 1 in the extension direction of the conductive terminal.
  • the first side 111 and the second side 112 are respectively located on different sides of the first end 323 of the second conductive terminal 32, for example, as shown in FIG. 20 .
  • the first conductive terminal 31 and the second conductive terminal 32 can be used to protect the detection element 1, and the effect of external force on the detection element can be reduced. For example, during the assembly process of the detection component 100 and the housing 5 , the collision between the detection element and the inner wall of the housing 5 is reduced.
  • the detection assembly 100 further includes a base 4, the conductive terminal 3 is fixedly connected to the base 4, and the conductive terminal 3 is disposed through the base 4, for example, as shown in Figures 5 and 13.
  • the first end 311 and the second end 312 of the first conductive terminal 31 are respectively located on different sides of the base 4, and the first end 321 and the second end of the second conductive terminal 32 322 are located on different sides of the base 4 respectively.
  • the base 4 includes a first support platform 401 and a second support platform 402.
  • the first support platform 401 is connected to the second support platform 402, and the conductive terminal 3 penetrates the first support platform 401 and the second support platform 402.
  • the projection of the first support platform 401 on the second support platform 402 is located within the outer contour of the second support platform 402.
  • the first support platform 401 and the second support platform 402 are both cylindrical, the outer diameter of the first support platform 401 is smaller than the outer diameter of the second support platform 402, and the first support platform 401
  • the central axis coincides with the central axis of the second supporting platform 402 .
  • the first support platform 401 has a first end surface 403, which is a plane; the second support platform 402 has a second end surface 404 and a third end surface 405, and the third end surface 405 is opposite to the second end surface.
  • 404 is close to the first end surface 403, and both the second end surface 404 and the third end surface 405 are circular planes.
  • the base 4 has a stepped shape. The radius of the first end surface 403 is smaller than the radius of the second end surface 404 .
  • the second end surface 404 is away from the first end 311 of the first conductive terminal 31 (or the first end 321 of the second conductive terminal 32) relative to the first end surface 403, and the first end surface 403 is opposite to The second end surface 404 is close to the first lead-out electrode 21 and the second lead-out electrode 22 .
  • the second aspect of the present application provides a sensing device, for example, as shown in Figure 23.
  • the sensing device includes the detection component 100 as mentioned above, the housing 5 and the circuit board 6.
  • the housing 5 is connected to the circuit board 6, and the detection The component 100 is electrically connected to the circuit board 6 .
  • the conductive terminal 3 of the detection component 100 is electrically connected to the circuit board 6 , and the conductive terminal 3 is fixedly connected to the circuit board 6 .
  • the detection component Due to the use of the detection component as mentioned above, it can not only reduce the deformation caused by the collision between the detection component and the inner wall of the housing during the assembly process, but also reduce the overall height of the sensing device, which is conducive to the miniaturization of the entire sensing device.
  • the housing 5 has a cavity 50.
  • the cavity 50 has a first opening 5001.
  • the cavity 50 is fluidly connected to the outside world of the sensing device through the first opening 5001.
  • the detection element 1 and the lead-out electrode 2 are both located in the cavity 50.
  • the first end 311 of the first conductive terminal 31 is located in the cavity 50, and the first The second end 312 of the conductive terminal 31 is located outside the cavity 50 ; the first end 321 of the second conductive terminal 32 is located within the cavity 50 , and the second end 322 of the second conductive terminal 32 is located outside the cavity 50 .
  • the first opening 5001 is connected to the outside of the sensing device, so that the gas to be detected can enter the chamber 50 through the first opening 5001, causing the resistance of the detection part 11 of the detection element 1 to change, and generate electrical signals.
  • the electrical signal is transmitted to the detection circuit through the lead-out electrode 2 and the conductive terminal 3, thereby realizing the detection of relevant parameters.
  • the housing 5 is directly connected to the base 4, and the housing 5 and the base 4 are fixedly connected or limitedly connected, such as shown in Figures 25 to 27; or the housing 5 is directly connected to the circuit board 6, and the housing 5 is directly connected to the circuit board 6.
  • the body 5 is fixedly or limitedly connected to the circuit board 6, and the base 4 is located in the housing 5.
  • the sensing device may be displaced or rotated during transportation and use. Fixed connection of the base 4 and the housing 5 with the circuit board 6 respectively can reduce the damage caused by the displacement or rotation between the detection component 100, the housing 5 and the circuit board 6. Damage to the sensing device caused by mutual collision and interference.
  • the base 4 and the shell 5 are connected to the circuit board 6 respectively. This means that the base 4 is directly connected to the circuit board 6, and the shell 5 is directly connected to the circuit board 6. However, the base 4 is not connected to the circuit board 6 through the shell 5, and the shell is not connected to the circuit board 6 through the shell 5. The body 5 is not connected to the circuit board 6 through the base 4 either.
  • the fixed connection may be bonding or welding, and the welding may be resistance welding, laser welding, ultrasonic welding, etc.
  • the limiting connection can be a detachable connection, such as a snap connection.
  • the housing 5 has a peripheral wall 531 located at the periphery of the cavity 50 .
  • the housing 5 has a third side 532 and a fourth side 533 .
  • the third side 532 is away from the circuit board 6 relative to the fourth side 533 along the thickness direction of the circuit board 6 .
  • the fourth side 533 has a flange portion 534 that extends from the peripheral wall 531 in a direction away from the housing 5 , and at least part of the flange portion 534 is welded or bonded to the base 4 ; or,
  • the edge 534 is at least partially welded or bonded to the circuit board 6 .
  • the connection area between the housing 5 and the base 4 or the circuit board 6 can be increased, and the connection reliability can be improved.
  • the housing 5 may not be provided with the flange portion 534 , and the outer end surface of the housing 5 is fixedly connected to the circuit board 6 , for example, as shown in FIGS. 29 to 32 .
  • the first support platform 401 and the second support platform of the housing 5 and the base 4 402 welding or bonding. Specifically, at least part of the peripheral wall 531 of the housing 5 is connected to the outer peripheral wall 4011 of the first support platform 401 , and at least part of the flange part 534 of the housing 5 is connected to the third end surface 405 of the second support platform 402 . In this way, the connection reliability between the base 4 and the housing 5 can be increased.
  • the surface of the base 4 for connecting to the circuit board 6 is a flat surface
  • the surface of the circuit board 6 for connecting to the base 4 is a flat surface.
  • the outer diameter of the base 4 is smaller than the inner diameter of the housing 5 . In this way, the housing 5 can be covered on the periphery of the base 4 .
  • the base 4 has a first central axis L1 and the housing 5 has a second central axis L2.
  • the first central axis L1 and the second central axis L2 coincide with each other, as shown in Figure 29, for example. In this way, the detection component 100 can be located in the center of the housing 5 .
  • the sensing device has a first cavity 501 and a second cavity 502.
  • the first cavity 501 is in gaseous communication with the outside world of the sensing device.
  • the first cavity 501 is an open cavity and the second cavity 502 is a closed cavity.
  • the detection component 100 includes a first detection component 101 and a second detection component 102.
  • the first detection component 101 is at least partially located in the first cavity 501
  • the second detection component 103 is at least partially located in the second cavity 502.
  • the second detection component 102 serves as a reference component of the first detection component 101, as shown in Figure 27, for correcting the detection results of the first detection component 101 and improving detection accuracy.
  • the gas to be detected enters the open cavity, and the thermal conductivity of the gas in the open cavity changes, thereby causing the resistance of the thermistor of the first detection component 101 to change.
  • the inability of the gas to be detected to enter the closed cavity affects the resistance of the thermistor of the second detection component 102 .
  • the housing of the first detection component 101 is connected to the housing of the second detection component 102, the heat/cold carried by the gas to be detected entering the open chamber is very easily conducted to the second detection component 102 through the housing. , causing the resistance value of the thermistor of the second detection component 102 to change, affecting its correction of the detection results, thereby reducing the detection accuracy.
  • the housing 5 includes a first housing 51 and a second housing 52.
  • the first housing 51 is located on the periphery of the first cavity 501
  • the second housing 52 is located on the periphery of the second cavity 502.
  • the first housing 51 and the second housing 52 are provided independently, and there is a gap between the first housing 51 and the second housing 52 . That is, the first housing 51 and the second housing 52 do not have a common wall, as shown in FIG. 25 and As shown in Figure 26.
  • the independently provided first housing 51 and the second housing 52 can also be connected together through a connecting plate.
  • the first housing 51 has a first cavity 511 , at least part of the first cavity 511 forms the first cavity 501 , the first cavity 511 has a first opening 5001 , and the first opening 5001 is in gaseous communication.
  • the second housing 52 outside the first cavity 501 and the sensing device, has a second cavity 521 , and at least part of the second cavity 521 forms the second cavity 502 .
  • the first housing 51 also has a second opening 5002, and the circuit board 6 fully covers the second opening 5002.
  • the first opening 5001 and the second opening 5002 are respectively located on both sides of the first housing 51 .
  • the second housing 52 has a third opening 5003, and the second housing 52 has a wall located at the periphery of the third opening 5003.
  • the circuit board 6 fully covers the third opening 5003, and along the height direction of the sensing device, the wall is on the edge of the circuit board.
  • the projection is located within the outer contour of the circuit board 6 .
  • the first opening 5001 is provided on the third side 532 of the first housing 51
  • the second opening 5002 is provided on the fourth side 533 of the first housing 51
  • the first housing 51 has a first side wall 5111
  • the first side wall 5111 is located on the third side 532
  • the first opening 5001 is provided on the first side wall 5111.
  • the fourth side 533 of the first housing 51 is welded to the first base 41 .
  • the projection of the peripheral wall 531 located around the second opening 5002 of the first housing 51 on the first base 41 is located within the outer contour of the first base 41 .
  • the third opening 5003 is provided on the fourth side 533 of the second housing 52 .
  • the second housing 52 has a second side wall 5211 located on the third side 532 of the second housing 52 .
  • the fourth side 533 of the second housing 52 is welded to the second base 42, and the third side 532 of the second housing 52 is sealingly connected to the second base 42.
  • the second housing 52 and the second base 42 form a closed cavity. That is, the second cavity 502 is closed.
  • the projection of the peripheral wall 531 located around the third opening 5003 of the second housing 52 on the second base 42 is located within the outer contour of the second base 42 . That is to say, the first base 41 fully covers the second opening 5002 of the first housing 51 , and the second base 42 fully covers the third opening 5003 of the second housing 52 .
  • At least one of the first housing 51 and the second housing 52 has a flange portion 534 .
  • the base 4 includes a first base 41 and a second base 42.
  • the first housing 51 and the first base 41 are both located at the periphery of the first cavity 501.
  • the first central axis L1 of the first base 41 passes through the first opening 5001.
  • the second housing 52 and the second base 42 are both located at the periphery of the second cavity 502.
  • the second housing 52 Sealing connection with the second base 42; alternatively, the circuit board 6 is located on the periphery of the first cavity 501 and the second cavity 502, the first base 41 is located in the first cavity 501, the second base 42 is located in the second cavity 502, and the second shell 52 is sealedly connected to the circuit board 6 .
  • the first detection component 101 includes a first detection element 1011
  • the second detection component 102 includes a second detection element 1021.
  • the first detection element 1011 is located in the first cavity 501
  • the second detection element 1021 is located in the second cavity 502. Since the first housing 51 and the second housing 52 are provided independently, the first housing 51 and the second housing 52 do not have a common side wall, so the distance between the first detection component 101 and the second detection component 102 can be reduced. heat transfer.
  • the second detection component 102 and the first detection component 101 can be arranged symmetrically.
  • the height direction of the first detection component 101 is parallel or in the same direction as the height direction of the second detection component 102 .
  • the axis of symmetry of the first detection assembly 101 is collinear with the axis of symmetry of the second detection assembly 102 .
  • the axis of the first housing 51 is collinear with the axis of the second housing 52 .
  • the first detection component 101 and the second detection component 102 each include at least one pair of conductive terminals 3, and each include at least one pair of lead-out electrodes 2.
  • At least one pair of conductive terminals 3 includes a first conductive terminal 31 and a second conductive terminal 32
  • at least one pair of lead-out electrodes 2 includes a first lead-out electrode 21 and a second lead-out electrode 22.
  • the first conductive terminal 31 and The first lead-out electrode 21 is electrically connected
  • the second conductive terminal 32 is electrically connected to the second lead-out electrode 22 .
  • the first detection element 1011 is electrically connected to the first conductive terminal 31 and the second conductive terminal 32 .
  • the second detection element 1021 is electrically connected to the first conductive terminal 31 and the second conductive terminal 32 .
  • At least one pair of extraction electrodes 21 and 22 is arranged axially symmetrically with respect to the first central axis L1
  • at least one pair of conductive terminals 31, 32 is arranged axially symmetrically with respect to the first central axis L1
  • the detection element 1 is arranged axially symmetrically with respect to the first central axis L1.
  • a central axis L1 is arranged axially symmetrically.
  • the gas enters the first cavity 501 through the first opening 5001 provided in the first housing 51, causing the detection element 1 of the first detection component 101 to generate changes in electrical signals, such as changes in resistance.
  • the second detection component 102 needs to be able to eliminate the influence of other environmental factors other than contact with the gas to be detected on the detection results. Therefore, in an ideal state, the first detection component 101 and the second detection component 102 are in the same environment, that is, except whether they are in contact with the gas to be detected, the first detection component 101 and the second detection component 102 is affected by environmental factors in roughly the same way. For example, the outside air comes into contact with the first housing 51 and the second housing 52 respectively.
  • the temperature change of the first housing 51 caused by the outside air coming into contact with the first housing 51 is roughly equal to the temperature change caused by the outside air coming into contact with the second housing 52 .
  • the resulting temperature change of the second housing 52 is approximately equal to the change caused by the heat transfer between the second housing 52 and the second detection component 102 . resulting in changes in the electrical signal of the second detection component 102 .
  • the detection element of the first detection component 101 and the detection element of the second detection component 102 are both thermistors, it is assumed that the gas to be measured enters the first chamber 501, causing the thermistor of the first detection component 101 to The resistance change is R1, and the heat of the first detection component 101 caused by other factors (for example, the gas flowing outside the first housing 51 undergoes heat conduction with the first detection component 101 through the first housing 51, etc.)
  • the change in resistance of the sensitive resistor is R2.
  • R x -R y R1.
  • the resistance change of the thermistor of the first detection component 101 only under the influence of contact with the gas to be measured can be obtained, and then the Relevant parameters of the gas to be measured (such as gas concentration) to improve detection accuracy.
  • R y R ⁇ R2.
  • the flow rate of the gas flowing to the first housing 51 is different from the flow rate of the gas flowing to the second housing 52
  • the temperature of the gas flowing to the first housing 51 is different from that of the gas flowing to the second housing 52
  • R y is infinitely close to R2.
  • the first detection component 101 and the second detection component 102 have the same structure and size, and the first detection component 101 and the first housing 51 are opposite to each other. The position is also roughly consistent with the relative position of the second detection component 102 and the second housing 52 settings remain consistent.
  • the circuit board 6 is flat.
  • the first housing 51 and the second housing 52 are arranged side by side on the same side of the circuit board 6 .
  • the first housing 51 and the second housing 52 are both columnar.
  • the first housing 51 and the second housing 52 protrude from the same side of the circuit board 6.
  • the first housing 51 The axis and the axis of the second housing 52 are both perpendicular to the circuit board 6 , and the axis of the first housing 51 passes through the first opening 5001 of the first housing 51 .
  • a third aspect of the present application provides a method for manufacturing a sensing device, including the following steps:
  • the detection component 100 includes a detection element 1, a conductive part 20 and a base 4.
  • the detection element 1 is connected to the conductive part 20, and the conductive part 20 is connected to the base 4. ;
  • the detection component 100 and the housing 5 are connected to the circuit board 6 respectively. Compared to the manufacturing method of first connecting the base and the housing to form a detection probe, and then connecting the detection probe and the circuit board. In other words, the assembly difficulty between the base 4 and the housing 5 is reduced, thereby reducing the manufacturing difficulty of the sensing device.
  • connection in step S2 is a fixed connection and an electrical connection. That is to say, step S2 not only realizes the fixed connection between the detection component 100 and the circuit board 6 , but also realizes the electrical connection between the two.
  • the detection element 1 of the detection assembly 100 is electrically connected and fixedly connected to the conductive part 20
  • the conductive part 20 is fixedly connected to the base 4
  • the conductive part 20 is electrically connected to the circuit board 6 .
  • the circuit board 6 is provided with a through hole 601 for mounting the conductive part 20, as shown in FIG. 34, for example.
  • step S2 connects the detection component 100 and the circuit board 6, including: penetrating the conductive part 20 through the through hole 601, filling the conductive material into the through hole 601, and electrically connecting the conductive part 20 and the circuit board 6 through the conductive material. Connections and fixed connections.
  • step S2 after step S2 is completed, there is a gap between the base 4 and the circuit board 6 . In this way, the impact of the detection component 100 on the heat dissipation of the circuit board 6 is reduced.
  • the conductive part 20 includes at least one pair of lead-out electrodes 21 , 22 and at least one pair of conductive terminals 31 , 32 , and the detection element
  • the component 1 is connected to at least one pair of lead-out electrodes 21 and 22, and the at least one pair of lead-out electrodes 21 and 22 is connected to at least one pair of conductive terminals 31 and 32.
  • At least a pair of conductive terminals 31 and 32 penetrate the base 4 and are fixedly connected to the base 4 .
  • the respective structures of the lead-out electrodes and the conductive terminals, as well as the connection relationship between the lead-out electrodes and the conductive terminals are as described above.
  • the method further includes: cutting the conductive terminal and removing the second end of the conductive terminal.
  • the first conductive terminal 31 includes a transition section 316 located within the through hole 601 of the circuit board 6 .
  • One end of the transition section 316 is connected to the first end 311 of the first conductive terminal 31
  • the other end of the transition section 316 is connected to the first end 311 of the first conductive terminal 31 .
  • the second end 312 of the first conductive terminal 31 is connected, for example in FIG. 29 .
  • the first conductive terminal 31 only includes the first end 311 located in the first cavity 501 and the transition section 316 located in the through hole 601 .
  • the second conductive terminal 32 includes a transition section 326.
  • the transition section 326 is located within the through hole 601 of the circuit board 6. One end of the transition section 326 is connected to the first end 321 of the second conductive terminal 32.
  • the transition section 326 has The other end is connected to the second end 322 of the second conductive terminal 32 .
  • the second conductive terminal 32 After cutting the second conductive terminal 32 , the second conductive terminal 32 only includes the first end 321 located in the second cavity 502 and the transition section 326 located in the through hole 601 , for example, as shown in FIG. 29 .
  • the first end 311 , the transition section 316 and the second end 312 of the first conductive terminal 31 are coaxial, and the radius of the first conductive terminal 31 is constant; the first end of the second conductive terminal 32 321.
  • the transition section 326 and the second end 322 are coaxial, and the radius of the second conductive terminal 32 is constant.
  • the housing 5 includes a first housing 51 and a second housing 52.
  • Step S3, connecting the housing 5 and the circuit board 6, includes the following steps:
  • the first housing 51 and the circuit board 6 are fixedly connected. At least part of the first cavity 511 forms the first cavity 501. The first housing 51 and the circuit board 6 are located at the periphery of the first cavity 501.
  • the first opening 5001 gas Continuously communicate with the outside world of the first cavity 501 and the sensing device;
  • the first cavity 501 formed by connecting the first housing 51 and the circuit board 6 is an open cavity, the first housing 51 and the circuit board 6 can be fixed, and the connection with the circuit board 6 can be It is a sealed connection, or it may not be a sealed connection.
  • the second housing 52 needs to be connected with the circuit
  • the boards 6 are connected to form a closed second cavity 502. Therefore, the connection between the second housing 52 and the circuit board 6 must not only achieve fixation of the two, but also meet the sealing requirements of the second cavity 502. Therefore, the second housing 52 is sealed with the circuit board 6 .

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)

Abstract

一种检测组件（100），包括引出电极（2）和导电端子（3），导电端子（2）具有第一端部（311）和第二端部（312），第一端部（311）具有第一末端（313），第二端部（312）具有第二末端（314），沿导电端子（3）的延伸方向，引出电极（2）与所述第一端部（311）位于第二末端（314）的相同侧，引出电极（2）与第二端部（312）位于第一末端（313）的相同侧；或者，引出电极（2）与第二端部（312）分别位于第一末端（313）的不同侧，并且引出电极（2）与导电端子（3）的延伸方向垂直。如此能够减少引出电极在外力作用下导致的变形。一种传感装置，包括检测组件（100）、壳体（5）和电路板（6），壳体（5）与电路板（6）连接，检测组件（100）与电路板（6）电性连接，检测组件（100）整体具有较低的高度，因此传感装置整体尺寸较小。一种传感装置的制造方法，底座（4）和壳体（5）分别与电路板（6）连接，降低了底座（4）与壳体（5）之间的组装难度，进而降低了传感装置的制造难度。

Description

检测组件、传感装置以及传感装置的制造方法 技术领域
本申请涉及测量技术领域，具体涉及一种检测组件、传感装置以及传感装置的制造方法。
背景技术
传感装置包括检测组件、壳体和电路板。检测组件包括检测元件、引出电极和导电端子，检测元件通过引出电极与导电端子连接，并通过导电端子连接至检测电路。壳体具有容腔，检测元件、引出电极以及部分导电端子容纳于容腔内。检测组件容易在外力作用下产生变形，影响检测精度。
因此，需要对传感装置的结构进行改进。
发明内容
本申请提供一种检测组件、传感装置以及传感装置的制造方法，能够减少检测组件的变形。
本申请的第一方面提供一种检测组件，所述检测组件包括引出电极和导电端子，所述导电端子具有第一端部和第二端部，所述第一端部具有第一末端，所述第二端部具有第二末端，沿所述导电端子的延伸方向，所述引出电极与所述第一端部位于所述第二末端的相同侧，所述引出电极包括连接部和延伸部，所述连接部与所述第一端部连接，所述延伸部自所述连接部向远离所述导电端子的方向延伸；
沿所述导电端子的延伸方向，所述连接部与所述第二端部位于所述第一末端的相同侧；或者，所述连接部与所述第二端部分别位于所述第一末端的不同侧，并且所述连接部与所述导电端子的延伸方向垂直；
沿所述导电端子的延伸方向，所述延伸部与所述第二端部位于所述第一末端的相同侧；或者，所述延伸部与所述第二端部分别位于所述第一末端的不同侧，并且所述延伸部与所述导电端子的延伸方向垂直。
在本申请的检测组件中，引出电极具有连接部和延伸部，引出电极与第一端部位于第二末端的相同侧。沿导电端子的延伸方向，连接部与第二 端部位于第一末端的相同侧；或者，连接部与第二端部分别位于第一末端的不同侧，并且连接部与导电端子的延伸方向垂直。沿所述导电端子的延伸方向，延伸部与第二端部位于第一末端的相同侧；或者，延伸部与第二端部分别位于第一末端的不同侧，并且延伸部与导电端子的延伸方向垂直。如此，引出电极凸出于导电端子的部分减少，能够减少引出电极可能在外力作用下导致的变形。
本申请的第二方面提供一种传感装置，包括检测组件、壳体和电路板，所述壳体与所述电路板连接，所述检测组件与所述电路板电性连接，所述检测组件包括检测元件、引出电极和导电端子，所述引出电极与所述检测元件连接，并且所述引出电极与所述导电端子连接；
所述导电端子包括第一端部和第二端部，所述第一端部具有第一末端，所述第二端部具有第二末端，沿所述导电端子的延伸方向，所述引出电极与所述第一端部位于所述第二末端的相同侧，所述引出电极包括连接部和延伸部，所述连接部与所述第一端部连接，所述延伸部自所述连接部向远离所述导电端子的方向延伸；
沿所述导电端子的延伸方向，所述连接部与所述第二端部位于所述第一末端的相同侧；或者，所述连接部与所述第二端部分别位于所述第一末端的不同侧，并且所述连接部与所述导电端子的延伸方向垂直；
沿所述导电端子的延伸方向，所述延伸部与所述第二端部位于所述第一末端的相同侧；或者，所述延伸部与所述第二端部分别位于所述第一末端的不同侧，并且所述延伸部与所述导电端子的延伸方向垂直；
所述壳体具有容腔，所述检测元件、所述引出电极和所述第一端部均位于所述容腔之内，所述第二端部位于所述容腔之外。
在本申请的传感装置中，沿导电端子的延伸方向，检测元件的第一侧和第二侧均与第二端部位于第一末端的相同侧；或者，第一侧与第二端部分别位于第一末端的不同侧，第二侧与第二端部分别位于第一末端的不同侧，并且第二侧与第一末端齐平；或者，第一侧与第二侧分别位于第一末端的不同侧。如此，引出电极凸出于导电端子的部分减少，在检测组件与壳体组装过程中，减少检测元件与壳体内壁发生碰撞可能导致的引出电极的变形。
本申请的第三方面提供一种传感装置的制造方法，包括以下步骤：
提供检测组件、壳体和电路板，所述检测组件包括检测元件、导电部和底座，所述检测元件与所述导电部连接，所述导电部与所述底座连接；
连接所述检测组件与所述电路板；
将所述壳体套设在至少部分所述检测组件之外，连接所述壳体与所述电路板。
在本申请提供的检测装置的制造方法中，检测组件和壳体分别与电路板连接，相对于先连接底座和壳体形成探头、再连接探头和电路板的制造方法而言，降低了底座与壳体之间的组装难度，进而降低了检测装置的制造难度。
附图说明
图1为相关技术中检测组件的示意图；
图2为相关技术中检测组件与壳体组装的示意图；
图3为本申请第一种实施方式提供的检测组件的正视图；
图4为本申请第一种实施方式提供的检测组件的后视图；
图5为本申请第一种实施方式提供的检测组件的立体图；
图6为本申请第一种实施方式提供的检测组件的爆炸图；
图7为本申请第一种实施方式提供的检测组件的俯视图；
图8为本申请第一种实施方式中引出电极与检测元件的连接示意图；
图9为本申请第二种实施方式提供的检测组件的正视图；
图10为本申请第二种实施方式提供的检测组件的后视图；
图11为本申请第二种实施方式提供的检测组件的立体图；
图12为本申请第三种实施方式提供的检测组件的正视图；
图13为本申请第三种实施方式提供的检测组件的立体图；
图14为本申请第三种实施方式提供的检测组件的爆炸图；
图15为本申请第三种实施方式提供的检测组件的俯视图；
图16为本申请第三种实施方式中引出电极与检测元件的连接示意图；
图17为本申请第四种实施方式提供的检测组件的立体图；
图18为本申请第四种实施方式提供的检测组件的俯视图；
图19为本申请第五种实施方式提供的检测组件的示意图；
图20为本申请第六种实施方式提供的检测组件的示意图；
图21为本申请第七种实施方式提供的检测组件的示意图；
图22为本申请第七种实施方式中引出电极与检测元件的连接示意图；
图23为本申请一种实施方式提供的检测组件与壳体组装的示意图；
图24为本申请一种实施方式提供的检测组件与壳体的爆炸图；
图25为本申请一种实施方式提供的检测组件与壳体组装的示意图；
图26为本申请一种实施方式提供的检测组件与壳体的爆炸图；
图27为本申请一种实施方式提供的传感装置的剖视图；
图28为本申请一种实施方式提供的第一壳体与第二壳体的示意图；
图29为本申请另一种实施方式提供的传感装置的剖视图；
图30为本申请另一种实施方式提供的传感装置的示意图；
图31为本申请另一种实施方式提供的传感装置的另一角度剖视图；
图32为本申请另一种实施方式提供的传感装置的又一角度剖视图；
图33为本申请另一种实施方式提供的第一壳体与第二壳体的示意图；
图34为本申请另一种实施方式提供的电路板的示意图。
具体实施方式
为了更好地理解本申请的技术方案，下面结合附图对本申请实施例进行详细描述。
应当明确，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
传感装置包括检测组件和壳体5，例如图2所示。检测组件用于对气体、环境温度等进行检测，壳体5对检测组件起保护作用，以减少外力导致的检测组件的变形。检测组件包括检测元件1、引出电极2和导电端子3，引出电极2的一端与导电端子3连接，引出电极2的另一端与检测元件1连接，例如图1所示。相关技术中，沿导电端子3的延伸方向Z，引出电极2的至少部分凸出于导电端子3设置，例如图1中引出电极2所示。引出电极2为柔性部件，在外力作用下容易发生变形。例如图2所示，在检测组件与壳体5组装的过程中，凸出于导电端子3设置的检测元件1和引出电极2首先进入壳体5内腔，与壳体5内壁发生碰撞后，引出电极2 发生扭曲和折弯。引出电极2的变形不仅会影响检测信号的传输，而且容易导致其与检测元件1或导电端子3的连接失效。此外，由于引出电极2凸出于导电端子3的一端设置，检测组件整体较高，不利于传感装置整体的小型化。
为此，本申请的第一方面提供一种检测组件100，以减少引出电极在外力作用下发生变形。本申请的检测组件100包括检测元件1、引出电极2和导电端子3，引出电极2与导电端子3电性连接，并且引出电极2与检测元件1电性连接，例如图3所示。检测元件1的检测信号通过引出电极2传输至导电端子3，并通过导电端子3传输至检测电路。
本申请提供七种实施方式的检测组件100，例如图3～8所示为第一种实施方式的示意图，例如图9～11所示为第二种实施方式的示意图，例如图12～16所示为第三种实施方式的示意图，例如图17和图18所示为第四种实施方式的示意图，例如图19所示为第五种实施方式的示意图，例如图20所示为第六种实施方式的示意图，例如图21和图22所示为第七种实施方式的示意图。
导电端子3为刚性部件，其不仅用于传输信号，还对引出电极2起支撑作用，使引出电极2竖立设置，进而使检测元件1与被检测物质充分接触，或者使检测元件1充分暴露在被检测环境中。
检测组件100包括至少一对引出电极2。一对引出电极2的形状、结构和尺寸可以相同或不同。例如图3和图4所示，检测组件100包括形状、结构和尺寸都相同的第一引出电极21和第二引出电极22，第一引出电极21和第二引出电极22构成一对引出电极2。
检测组件100还包括至少一对导电端子3，一对导电端子3的形状、结构和尺寸可以相同或不同。例如图3～图5所示，检测组件100包括形状、结构和尺寸都相同的第一导电端子31和第二导电端子32，第一导电端子31和第二导电端子32构成一对导电端子3。第一导电端子31和第二导电端子32均为柱状，例如圆柱状。
例如图3～图5所示，第一导电端子31具有第一端部311和第二端部312。沿导电端子3的延伸方向Z，第一导电端子31的第一端部311和第二端部312分别位于第一导电端子31的两端。第一导电端子31的第一端 部311与第一引出电极21连接，第一导电端子31的第二端部312用于与检测电路连接，第一导电端子31的第一端部311具有第一末端313，第一导电端子31的第二端部312具有第二末端314。沿导电端子3的延伸方向Z，第一引出电极21与第一导电端子31的第一端部311位于第一导电端子31的第二末端314的相同侧。第二导电端子32具有第一端部321和第二端部322。沿导电端子3的延伸方向Z，第二导电端子32的第一端部321和第二端部322分别位于第二导电端子32的两端。第二导电端子32的第一端部321与第二引出电极22连接，第二导电端子32的第二端部322用于与检测电路连接，第二导电端子32的第一端部321具有第一末端323，第二导电端子32的第二端部322具有第二末端324。沿导电端子3的延伸方向Z，第二引出电极22与第二导电端子32的第一端部321位于第二导电端子32的第二末端324的相同侧。在本申请的一些实施方式中，检测组件100的高度方向与导电端子3的延伸方向Z同向。
在一些实施方式中，第一导电端子31的第一末端313、第一导电端子31的第二末端314、第二导电端子32的第一末端323和第二导电端子32的第二末端324分别可以是端面，例如，平面、曲面或粗糙面。或者，当第一端部311、321，或者第二端部312、322呈锥形时，第一末端313、323呈点状，或者，第二末端314、324呈点状。
为了减少引出电极2在外力作用下产生的变形，本申请对引出电极2与导电端子3的相对位置进行设计。下面以第一引出电极21和第一导电端子31的相对位置为例进行说明。
第一引出电极21包括第一连接部211和第一延伸部212，第一连接部211与第一导电端子31的第一端部311连接，第一延伸部212自第一连接部211向远离第一导电端子31的方向延伸，例如图3～图6所示。
在一些实施方式中，沿导电端子3的延伸方向Z，第一连接部211与第一导电端子31的第二端部312位于第一导电端子31的第一末端313的相同侧，例如图3～图6示，或者图21所示，或者图9～图11所示。第一端部311具有侧面315，第一连接部211与侧面315连接，如图4和图6所示。由于第一导电端子31的直径较小，而第一导电端子31的侧面315具有较大的面积，因此第一连接部211与第一导电端子31的侧面315连 接，有利于降低第一引出电极21与第一导电端子31的连接难度。如此，在导电端子3的延伸方向上，第一连接部211既不凸出于第一末端313，也不凸出于第二末端314，能够利用第一导电端子31为第一连接部211阻挡外力，减少第一连接部211的在外力作用下的变形。
第一延伸部212的至少部分与第一导电端子31的第二端部312位于第一导电端子31的第一末端313的相同侧，例如图26所示。如此，减少了检测组件100的高度方向上，第一引出电极21从第一导电端子31的第一末端313向外凸伸部分的高度，也即降低了第一延伸部212的高度，从而降低了检测组件100的高度。
在另一些实施方式中，沿导电端子3的延伸方向Z，第一连接部211与第一导电端子31的第二端部312分别位于第一导电端子31的第一末端313的不同侧，并且第一连接部211位于与导电端子的延伸方向垂直的平面内，例如图12～图15所示，或者图17和图18所示。第一连接部211与第一末端313连接，第一连接部211略高于第一末端313，并且大致与第一末端313齐平。此时，沿导电端子的延伸方向Z，第一连接部211的顶部A1与第一末端313的高度之差，大致等于第一连接部211在垂直于检测组件100高度方向上的厚度，如图13和图14所示。如此，也能够减少第一连接部211在外力作用下的变形。
在一些实施方式中，沿导电端子3的延伸方向Z，第一延伸部212与第一导电端子31的第二端部312位于第一导电端子31的第一末端313的相同侧，例如图3～图6示，或者图9～图11所示。如此，在导电端子的延伸方向上，第一延伸部212既不凸出于第一末端313，也不凸出于第二末端314，在检测组件100与外界物质发生碰撞时，第一导电端子31能够为第一延伸部212阻挡一部分外力，从而减少第一延伸部212的变形。
在另一些实施方式中，第一延伸部212与第一导电端子31的第二端部312分别位于第一导电端子31的第一末端313的不同侧，并且第一延伸部212位于与导电端子的延伸方向垂直的平面内，例如图12～图15所示，或者图17和图18所示。第一延伸部212略高于第一末端313，并且大致与第一末端313齐平。此时，沿导电端子的延伸方向，第一延伸部212的顶部A2与第一末端313的高度之差，大致等于第一延伸部212在垂直于 检测组件100高度方向上的厚度。如此，也能够减少第一延伸部212在外力作用下的变形。
在本申请中，沿导电端子3的延伸方向Z，无论是第一引出电极21不高于第一导电端子31的第一末端313，还是第一引出电极21略高于第一导电端子31的第一末端313，都能够减少第一引出电极21在外力作用下产生的变形。而且，还能够减小检测组件100的整体高度，有利于检测组件100的小型化。
在一些实施方式中，沿导电端子3的延伸方向Z，第一连接部211和第一延伸部212分别位于第一导电端子31的第一末端313的不同侧。例如图19所示，第一连接部211与第一导电端子31的第一末端313连接，沿导电端子3的延伸方向Z，第一连接部211与第一导电端子31的第二端部312分别位于第一导电端子31的第一末端313的不同侧，并且第一连接部211位于与导电端子的延伸方向垂直的平面内；沿导电端子3的延伸方向Z，第一延伸部212与第一导电端子31的第二端部312位于第一导电端子31的第一末端313的相同侧。又例如图20所示，沿导电端子3的延伸方向Z，第一连接部211与第一导电端子31的第二端部312位于第一导电端子31的第一末端313的相同侧，第一延伸部212与第一导电端子31的第二端部312分别位于第一导电端子31的第一末端313的不同侧，并且第一延伸部212位于与导电端子的延伸方向垂直的平面内。
在另一些实施方式中，沿导电端子3的延伸方向Z，第一连接部211和第一延伸部212位于第一导电端子31的第一末端313的相同侧，例如图3～图6示，或者图9～图11所示。沿导电端子3的延伸方向Z，第一引出电极21的第一连接部211和第一延伸部212与第一导电端子31的第二端部312位于第一导电端子31的第一末端313的相同侧。例如图12～图15所示，或者图17～图19所示，沿导电端子3的延伸方向Z，第一引出电极21的第一连接部211和第一延伸部212与第一导电端子31的第二端部312分别位于第一导电端子31的第一末端313的不同侧，并且第一引出电极21位于与导电端子的延伸方向垂直的平面内。相对于第一连接部211和第一延伸部212分别位于第一导电端子31的第一末端313的不同侧的方案，第一连接部211和第一延伸部212位于第一导电端子31的第一 末端313的相同侧能够减少第一引出电极21的弯折或扭曲，从而减少第一引出电极21内部应力对信号传输的影响。
同样地，第二引出电极22包括第二连接部221和第二延伸部222，第二连接部221与第二导电端子32的第一端部321连接，第二延伸部222自第二连接部221向远离第二导电端子32的第一端部321的方向延伸，例如图3～图6示。与第一引出电极21与第一导电端子31的相对位置相同，本申请对第二引出电极22与第二导电端子32的相对位置进行相同的设置，在此不再赘述。
在一些实施方式中，第一延伸部212位于第一导电端子31朝向第二导电端子32的一侧，第二延伸部222位于第二导电端子32朝向第一导电端子31的一侧。例如图3～图6所示，或者，例如图21所示，或者如图9～图11所示，在第一导电端子31中心和第二导电端子32中心的连线方向上，第一延伸部212与第二导电端子32位于第一导电端子31的相同侧，第二延伸部222与第一导电端子31位于第二导电端子32的相同侧，也就是说，第一延伸部212和第二延伸部222位于第一导电端子31和第二导电端子32之间。如此，使得第一导电端子31和第二导电端子32能够为第一延伸部212和第二延伸部222阻挡外力，减少第一延伸部212和第二延伸部222在外力作用下的变形。
引出电极2可以薄膜状、片状或线状。引出电极2弯折会导致内应力增加，进而影响电信号在引出电极2内的传输。因此，在一些实施方式中，引出电极2位于平面内，所述平面与导电端子的延伸方向平行，例如图3～图6所示；或者，所述平面与导电端子的延伸方向垂直，例如图12～图15所示。如此，能够减少引出电极2的弯折。当然，在实际中，由于检测元件或引出电极的自重或者其他原因可能导致引出电极2稍微偏离平面，或者使其并不完全位于平面内，这种情况在本申请中仍视作引出电极2位于或大致位于平面内。
在一些实施方式中，第一引出电极21为薄片状，第二引出电极22为薄片状。例如，第一引出电极21和第二引出电极22均为通过PVD方法制备的、厚度为微米或毫米级别的薄片状电极。在一些实施方式中，当第一引出电极21与第一导电端子31连接，第二引出电极22与第二导电端 子32连接，且第一引出电极21和第二引出电极22与同一检测元件1连接时，第一延伸部212相对于第一连接部211靠近第二导电端子32。第二延伸部222相对于第二连接部221靠近第一导电端子31，例如图21所示。
在一些实施方式中，第一引出电极21与第二引出电极22齐平。也就是说，第一引出电极21与第二引出电极22位于相同的平面内，该平面例如可以是与导电端子的延伸方向垂直或平行。如此，能够减少第一引出电极21与第二引出电极22之间的相互影响。由于第一引出电极21与第二引出电极22均与检测元件1连接，若第一引出电极21与第二引出电极22不齐平，第一引出电极21和第二引出电极22中的至少一个需要弯折。如前所述，引出电极弯折会导致内应力产生，影响电信号的传输。因此，将第一引出电极21与第二引出电极22设置为齐平，能够减少引出电极中内应力的产生。当然，在实际中，由于检测元件或引出电极的自重或者其他原因可能导致第一引出电极21与第二引出电极22稍微偏离“齐平”的位置，这种情况在本申请中仍视作第一引出电极21与第二引出电极22齐平或大致齐平。
如前所述，在一些实施方式中，第一引出电极21位于与导电端子3的延伸方向平行的平面内，第一引出电极21与第一导电端子31的侧面315连接，例如图3～图6所示。第一连接部211具有第一连接端2111和第二连接端2112，第一连接端2111和第二连接端2112分别位于第一连接部211沿检测组件100的高度方向或者宽度方向的两端。第一连接部211的第一连接端2111相对于第一连接部211的第二连接端2112靠近第一导电端子31的第一末端313。第一连接部211具有与第一延伸部212连接的第一连接处2113，第一连接处2113可以位于第一连接端2111，例如图3～图6所示；或者，第一连接处2113可以位于第二连接端2112，例如图9～图11所示，或者例如图22所示；或者，第一连接处2113也可以位于第一连接端2111和第二连接端2112之间的任意位置。第一连接处2113位于第一连接端2111和第二连接端2112可以减少第一引出电极21的制造材料的浪费。
同样地，对于第二引出电极22而言，第二引出电极22位于与导电端子的延伸方向平行的平面内，第二引出电极22与第二导电端子32的侧面 325连接，例如图3～图6所示。第二连接部221具有第一连接端2211和第二连接端2212，第一连接端2211和第二连接端2212分别位于第二连接部221沿检测组件100的高度方向或者宽度方向的两端。第二连接部221的第一连接端2211相对于第二连接部221的第二连接端2212靠近第二导电端子32的第一末端323。第二连接部221具有与第二延伸部222连接的第二连接处2213，第二连接处2213可以位于第二连接部221的第一连接端2211，例如图3～图6所示；或者，第二连接处2113可以位于第二连接端2212，例如图9～图11所示，或者例如图22所示；或者，第二连接处2113也可以位于第一连接端2211和第二连接端2212之间的任意位置。
在一些实施方式中，第一连接部211和第二连接部221具有相同的形状、结构和尺寸。在一些实施方式中，第一连接部211与第二连接部221对称设置。例如图3、图7和图8所示。第一连接部211和第二连接部221均为薄片状，第一连接部211和第二连接部221均呈条状，在图12～图15中，第一连接部211和第二连接部221均为圆形。在图3～图8中，或者，在图9～图11中，或者图17和图18中，第一连接部211与第二连接部221轴对称设置；在图12～图15中，第一连接部211与第二连接部221中心对称设置。
相关技术中，引出电极2与导电端子3之间通过点焊的方式连接。点焊连接的可靠性较差，引出电极2与导电端子3容易在连接处分离，造成连接失效。
在一些实施方式中，连接部包括用于与导电端子3连接的连接区域23，连接区域23呈线状或面状。以第一引出电极21与第一导电端子31的连接为例。当第一连接部211的连接区域23呈线状时，例如图8所示，第一连接部211与第一导电端子31之间的连接为线连接；当第一连接部211的连接区域23呈面状时，第一连接部211与第一导电端子31之间的连接为面连接。同样的，当第二连接部221的连接区域23呈线状时，例如图8所示，第二连接部221与第二导电端子32之间的连接为线连接；当第二连接部221的连接区域23呈面状时，第二连接部221与第二导电端子32之间的连接为面连接。
为了判断连接区域的形状，可以将引出电极2与导电端子3分离，如 果引出电极2与导电端子3分离后在引出电极2或导电端子3上留下线状的连接痕迹，则说明引出电极2与导电端子3的连接处呈线状；如果引出电极2与导电端子3分离后在引出电极2或导电端子3上留下面状的连接痕迹，则说明引出电极2与导电端子3的连接处呈面状。
为了实现信号传输，引出电极2不仅要与导电端子3连接，还要与检测元件1连接。检测元件1包括检测部11和至少一对电极部12。检测部11与电极部12电连接，并且电极部12与引出电极2电连接，例如图16所示。检测部11能够在被检测物质或被检测参数的影响下产生电信号，例如，在气体浓度发生变化时产生电信号，电信号通过电极部12传输至引出电极2，并通过导电端子3传输至检测电路。
在一些实施方式中，检测元件1包括绝缘基板13，检测部11是覆设于绝缘基板13表面的热敏电阻材料，电极部12是覆设于绝缘基板13表面的导电层，例如图16所示。当气体浓度的变化导致热敏电阻材料所暴露的环境的温度发生变化时，热敏电阻材料的电阻发生变化，并由此产生电信号。电信号通过电极部12、引出电极2和导电端子3传输至检测电路。在一些实施方式中，第一引出电极21和第二引出电极22所在平面与检测元件1的至少部分表面平行。例如，与检测元件的电极部平行。如此，能够减少引出电极与检测元件连接导致的引出电极的变形。
在一些实施方式中，引出电极2所在的平面与绝缘基板13平行。如此，能够减少引出电极2与检测元件1连接导致的引出电极2的弯折，例如图16所示。
在一些实施方式中，沿导电端子3的延伸方向Z，检测部11相对于绝缘基板13靠近第一导电端子的第一末端313或第二导电端子的第一末端323，例如图12和图16所示。如此，能够使检测部充分暴露在环境中。
在另一些实施方式中，检测元件1包括检测基板和设置在检测基板之内的内部电极。检测基板是包括热敏电阻材料的陶瓷基板。当气体浓度的变化导致检测基板所暴露的环境的温度发生变化时，检测基板14的电阻发生变化，并由此产生电信号。电信号通过内部电极、引出电极2和导电端子3传输至检测电路。
在检测元件1中，电极部12相对于检测元件1的轴线对称设置，例 如图16所示。为了便于引出电极2与检测元件1的连接，一对引出电极2也对称设置。
在一些实施方式中，第一延伸部212包括相互连接的第一连接段2121和第二连接段2122，第一连接段2121与检测元件1的电极部12连接，第二连接段2122自第一连接段2121向远离检测元件1的方向延伸，第二连接段2122与第一连接部211连接；第二延伸部222包括相互连接的第三连接段2221和第四连接段2222，第三连接段2221与检测元件1的电极部12连接，第四连接段2222自第三连接段2221向远离检测元件1的方向延伸，第四连接段2222与第二连接部221连接；第一连接段2121与第三连接段2221平行，例如图8和图16所示。如此，能够方便一对引出电极2与检测元件1的连接。
在一些实施方式中，第二连接段2122的至少部分与第四连接段2222的至少部分平行。例如图8所示，第二连接段2122和第四连接段2222沿相同方向、向检测元件1之外延伸；例如图16所示，第二连接段2122和第四连接段2222沿相反方向、向检测元件1之外延伸。
在一些实施方式中，沿检测组件100的高度方向，第一连接段2121与第一导电端子31的第二端部312分别位于第一导电端子31的第一末端313的两侧，第二连接段2122与第一导电端子31的第二端部312位于第一导电端子31的第一末端313的相同侧，例如图22所示。
在一些实施方式中，第一连接段2121的至少部分与第一导电端子31的第二端部312分别位于第一导电端子31的第一末端313的相同侧，并且第二连接段2122与第一导电端子31的第二端部312位于第一导电端子31的第一末端313的相同侧。在一些实施方式中，第一延伸部212与第一导电端子31的第二端部312位于第一导电端子31的第一末端313的相同侧。也就是说，第一引出电极21没有凸出于第一导电端子31设置。在一些实施方式中，第二连接段2122的轴线是曲线。
在一些实施方式中，沿检测组件100的高度方向，第三连接段2221与第二导电端子32的第二端部322分别位于第二导电端子32的第一末端323的两侧，并且第四连接段2222与第二导电端子32的第二端部322位于第二导电端子32的第一末端323的相同侧。或者，第三连接段2221的 至少部分与第二导电端子32的第二端部322位于第二导电端子32的第一末端323的相同侧，并且第四连接段2222与第二导电端子32的第二端部322位于第二导电端子32的第一末端323的相同侧。也就是说，第二引出电极22没有凸出于第二导电端子32设置。在一些实施方式中，第四连接段2222的轴线是曲线。
在一些实施方式中，至少部分第一连接段2121的轴线平行于第一导电端子31的轴线，至少部分第三连接段2221的轴线平行于第二导电端子32的轴线，例如图26所示。在一些实施方式中，第一延伸部212相对于第二延伸部222轴对称设置或中心对称设置。例如图3～8所示，或者例如图9～图11所示，或者例如图21所示，第一引出电极21和第二引出电极22位于与导电端子3的延伸方向平行的平面内，第一延伸部212相对于第二延伸部222轴对称设置，检测元件1在该平面上的正投影的轴线为第一延伸部212和第二延伸部222的对称轴。例如图12～图15所示，第一引出电极21和第二引出电极22位于与导电端子3的延伸方向垂直的平面内，第一延伸部212相对于第二延伸部222中心对称设置，检测元件1在该平面上的正投影的中心为第一延伸部212和第二延伸部222的对称中心。
在一些实施方式中，第一引出电极21相对于第二电极22轴对称或中心对称。例如图12～图15所示，第一引出电极21和第二引出电极22位于与导电端子的延伸方向垂直的平面内，第一引出电极21相对于第二引出电极22中心对称设置，检测元件1在该平面上的正投影的中心为第一引出电极21和第二引出电极22的对称中心。例如图3～8所示，或者例如图9～图11所示，或者例如图21所示，第一引出电极21和第二引出电极22位于与导电端子的延伸方向平行的平面内，第一引出电极21相对于第二引出电极22轴对称设置，检测元件1在该平面上的正投影的轴线为第一引出电极21和第二引出电极22的对称轴。第一引出电极21和第二引出电极22具有对称结构能够有利于检测元件1电信号的传输。
在本申请中，如前所述，沿导电端子3的延伸方向Z，引出电极2不高于或略高于第一导电端子31的第一末端313，检测元件1与引出电极2电性连接，因此，检测元件1也不高于或略高于第一导电端子31的第一末端313。
下面以检测元件1与第一导电端子31的相对位置为例进行说明。在一些实施方式中，检测元件1具有第一侧111和第二侧112，沿导电端子3的延伸方向Z，第一侧111和第二侧112分别位于检测元件1的不同侧。沿导电端子的延伸方向，第一侧111和第二侧112均与第一导电端子31的第二端部312位于第一导电端子31的第一末端313的相同侧，如图12或图22所示。或者，第一侧111与第一导电端子31的第二端部312分别位于第一末端313的不同侧，第二侧112与第一导电端子31的第二端部312分别位于第一导电端子31的第一末端313的不同侧，沿导电端子的延伸方向，第一侧111相对于第二侧112远离第一导电端子31的第一末端313，并且第二侧112与第一导电端子31的第一末端313齐平。此时，沿导电端子3的延伸方向Z，检测元件1的第一侧111与第一导电端子31的第一末端313的高度之差大致等于检测元件1在导电端子3的延伸方向上的尺寸。或者，第一侧111与第二侧112分别位于第一导电端子31的第一末端313的不同侧，例如图20所示。
同样地，本申请对检测元件1与第二导电端子32的相对位置进行相同的设置。在一些实施方式中，沿导电端子3的延伸方向Z，第一侧111和第二侧112均与第二导电端子32的第二端部322位于第二导电端子32的第一末端323的相同侧，如图12或图24所示。或者，第一侧111与第二导电端子32的第二端部322分别位于第一末端313的不同侧，第二侧112与第二导电端子32的第二端部322分别位于第一导电端子31的第一末端313的不同侧，沿导电端子3的延伸方向Z，第一侧111相对于第二侧112远离第二导电端子32的第一末端323，并且第二侧112与第二导电端子32的第一末端323齐平。此时，沿导电端子3的延伸方向Z，检测元件1的第二侧112与第二导电端子32的第一末端323的高度之差大致等于检测元件1在导电端子的延伸方向上的尺寸。或者，第一侧111与第二侧112分别位于第二导电端子32的第一末端323的不同侧，例如图20所示。
如此，能够利用第一导电端子31和第二导电端子32对检测元件1起到防护作用，能够减少外力对检测元件的作用。例如，在检测组件100与壳体5组装过程中，减少检测元件与壳体5内壁的碰撞。
在一些实施方式中，检测组件100还包括底座4，导电端子3与底座4固定连接，并且导电端子3贯穿底座4设置，例如图5和图13所示。沿导电端子3的延伸方向Z，第一导电端子31的第一端部311和第二端部312分别位于底座4的不同侧，第二导电端子32的第一端部321和第二端部322分别位于底座4的不同侧。
底座4包括第一支撑台401和第二支撑台402，第一支撑台401与第二支撑台402连接，导电端子3贯穿第一支撑台401和第二支撑台402。沿检测组件100的高度方向，第一支撑台401在第二支撑台402的投影位于第二支撑台402的外轮廓之内。例如图26和图27所示，第一支撑台401和第二支撑台402均为圆柱状，第一支撑台401的外径小于第二支撑台402的外径，并且第一支撑台401的中心轴线与第二支撑台402的中心轴线重合。沿检测组件100的高度方向，第一支撑台401具有第一端面403，第一端面403为平面；第二支撑台402具有第二端面404和第三端面405，第三端面405相对第二端面404靠近第一端面403，第二端面404和第三端面405均为圆形的平面。底座4呈阶梯形状。第一端面403的半径小于第二端面404的半径。
沿检测组件100的高度方向，第二端面404相对于第一端面403远离第一导电端子31的第一端部311(或者第二导电端子32的第一端部321)，第一端面403相对于第二端面404靠近第一引出电极21和第二引出电极22。
本申请的第二方面提供一种传感装置，例如图23所示，传感装置包括如前所述的检测组件100、壳体5和电路板6，壳体5与电路板6连接，检测组件100与电路板6电性连接。检测组件100的导电端子3与电路板6电性连接，导电端子3与电路板6固定连接。
由于采用了如前所述的检测组件，不仅能够在组装过程中，减少检测组件与壳体内壁碰撞导致的变形，还能够降低传感装置整体的高度，有利于传感装置整体的小型化。
壳体5具有容腔50，容腔50具有第一开口5001，容腔50通过第一开口5001与传感装置的外界流体连通，检测元件1和引出电极2均位于容腔50之内。第一导电端子31的第一端部311位于容腔50之内，第一 导电端子31的第二端部312位于容腔50之外；第二导电端子32的第一端部321位于容腔50之内，第二导电端子32第二端部322位于容腔50之外。
在传感装置使用过程中，第一开口5001与传感装置的外界连通，由此被检测气体可以通过第一开口5001进入容腔50，使检测元件1的检测部11的电阻发生变化，并产生电信号。电信号通过引出电极2和导电端子3传输至检测电路，从而实现相关参数的检测。
在一些实施方式中，壳体5与底座4直接连接，壳体5与底座4固定连接或限位连接，例如图25～27所示；或者，壳体5与电路板6直接连接，且壳体5与电路板6固定连接或限位连接，底座4位于壳体5之内，壳体5至少部分与底座4之间具有间距，例如图29～32所示。也就是说，底座4和壳体5分别与电路板6固定连接。传感装置在运输和使用过程中可能会发生位移或转动，将底座4和壳体5分别与电路板6固定连接，能够减少位移或转动造成的检测组件100、壳体5和电路板6之间相互碰撞、干涉造成的传感装置的损伤。
底座4和壳体5分别与电路板6连接指的是，底座4与电路板6直接连接，壳体5与电路板6直接连接，但是底座4并非通过壳体5与电路板6连接，壳体5也并非通过底座4与电路板6连接。
在一些实施方式中，固定连接可以是粘接或焊接，焊接可以是电阻焊、激光焊、超声波焊等方式。限位连接可以是可拆卸连接方式，例如卡接。
在一些实施方式中，壳体5具有周壁531，周壁531位于容腔50的外围。壳体5具有第三侧532和第四侧533，沿电路板6的厚度方向，第三侧532相对于第四侧533远离电路板6。在一些实施方式中，第四侧533具有翻边部534，翻边部534自周壁531向远离壳体5的方向延伸，翻边部534的至少部分与底座4焊接或粘接；或者，翻边部534至少部分与电路板6焊接或粘接。通过设置翻边部534，能够增加壳体5与底座4或者电路板6的连接面积，提升连接可靠性。在另一些实施方式中，壳体5也可以不设置翻边部534，壳体5的外端面与电路板6固定连接，例如图29～32所示。
在一些实施方式中，壳体5与底座4的第一支撑台401和第二支撑台 402焊接或粘接。具体的，壳体5的周壁531的至少部分与第一支撑台401的外周壁4011连接，壳体5的翻边部534的至少部分与第二支撑台402的第三端面405连接。如此，能够增加底座4与壳体5的连接可靠性。
在一些实施方式中，底座4用于与电路板6连接的面为平面，电路板6用于与底座4连接的面为平面。如此，底座4与电路板6之间的连接通过平面与平面之间的连接实现，降低连接难度，增加连接面积和连接可靠性。
在一些实施方式中，底座4的外径小于壳体5的内径。如此，壳体5能够盖设在底座4的外围。
在一些实施方式中，底座4具有第一中心轴线L1，壳体5具有第二中心轴线L2。第一中心轴线L1与第二中心轴L2线重合，例如图29所示。如此，检测组件100能够位于壳体5中央。
在一些实施方式中，传感装置具有第一腔501和第二腔502，第一腔501与传感装置的外界气体性连通，第一腔501为开放腔，第二腔502为封闭腔。检测组件100包括第一检测组件101和第二检测组件102，第一检测组件101至少部分位于第一腔501，第二检测组件103至少部分位于第二腔502。第二检测组件102作为第一检测组件101的参比组件，例如图27，用于对第一检测组件101的检测结果进行修正，提高检测精度。检测时，待检测气体进入开放腔，开放腔中气体的热导率发生变化，进而使第一检测组件101的热敏电阻的阻值发生变化。对应地，待检测气体无法进入封闭腔对第二检测组件102的热敏电阻的阻值产生影响。
相关技术中，由于第一检测组件101的壳体与第二检测组件102的壳体相连，进入开放腔的待检测气体所携带的热量/冷量非常容易通过壳体传导至第二检测组件102，使第二检测组件102的热敏电阻的阻值发生变化，影响其对检测结果的修正，进而降低检测精度。
为了减少第一检测组件101和第二检测组件102之间的相互影响，本申请对壳体5进行设计。壳体5包括第一壳体51和第二壳体52，第一壳体51位于第一腔501的外围，第二壳体52位于第二腔502的外围。第一壳体51和第二壳体52分别独立设置，第一壳体51与第二壳体52之间有间距。也即，第一壳体51和第二壳体52不具有共用的壁，例如图25和 图26所示。在另一些实施例中，也可以通过一个连接板将独立设置的第一壳体51和第二壳体52连接到一起。
在一些实施方式中，第一壳体51具有第一容腔511，第一容腔511的至少部分形成第一腔501，第一容腔511具有第一开口5001，第一开口5001气体性连通第一腔501和传感装置的外界，第二壳体52具有第二容腔521，第二容腔521的至少部分形成第二腔502。第一壳体51还具有第二开口5002，电路板6全面覆盖第二开口5002。沿第一壳体51的高度方向，第一开口5001和第二开口5002分别位于第一壳体51的两侧。
第二壳体52具有第三开口5003，第二壳体52具有位于第三开口5003外围的壁面，电路板6全面覆盖第三开口5003，并且沿传感装置的高度方向，壁面在电路板的投影位于电路板6的外轮廓之内。
在一些实施方式中，第一开口5001设置于第一壳体51的第三侧532，第二开口5002设置于第一壳体51的第四侧533，例如图28所示，第一壳体51具有第一侧壁5111，第一侧壁5111位于第三侧532，第一开口5001设于第一侧壁5111。第一壳体51的第四侧533与第一底座41焊接。沿导电端子3的延伸方向Z，位于第一壳体51的第二开口5002外围的周壁531在第一底座41的投影位于第一底座41的外轮廓之内。第三开口5003设于第二壳体52的第四侧533。第二壳体52具有第二侧壁5211，第二侧壁5211位于第二壳体52的第三侧532。第二壳体52的第四侧533与第二底座42焊接，且第二壳体52的第三侧532与第二底座42密封连接，第二壳体52与第二底座42形成封闭腔，也即封闭的第二腔502。沿检测组件的高度方向，位于第二壳体52的第三开口5003外围的周壁531在第二底座42的投影位于第二底座42的外轮廓之内。也就是说，第一底座41全面覆盖第一壳体51的第二开口5002，第二底座42全面覆盖第二壳体52的第三开口5003。
在一些实施方式中，第一壳体51和第二壳体52中的至少一者具有翻边部534。
底座4包括第一底座41和第二底座42，第一壳体51和第一底座41均位于第一腔501的外围，第一底座41的第一中心轴线L1贯穿第一开口5001。第二壳体52和第二底座42均位于第二腔502的外围，第二壳体52 与第二底座42密封连接；或者，电路板6位于第一腔501和第二腔502的外围，第一底座41位于第一腔501，第二底座42位于第二腔502，第二壳体52与电路板6密封连接。
第一检测组件101包括第一检测元件1011，第二检测组件102包括第二检测元件1021，例如图31，第一检测元件1011位于第一腔501，第二检测元件1021位于第二腔502。由于第一壳体51和第二壳体52分别独立设置，第一壳体51和第二壳体52不具有共用的侧壁，因而能够减少第一检测组件101与第二检测组件102之间的热量传递。
为了使第一检测组件101与第二检测组件102的检测环境趋于相同，第二检测组件102与第一检测组件101可以对称设置。
在一些实施方式中，第一检测组件101的高度方向与第二检测组件102的高度方向平行或同向。在一些实施方式中，第一检测组件101的对称轴与第二检测组件102的对称轴共线。在一些实施方式中，第一壳体51的轴线与第二壳体52的轴线共线。
第一检测组件101和第二检测组件102分别包括至少一对导电端子3，以及分别包括至少一对引出电极2。至少一对导电端子3包括第一导电端子31和第二导电端子32，至少一对引出电极2包括第一引出电极21和第二引出电极22，例如图26所示，第一导电端子31与第一引出电极21电连接，第二导电端子32与第二引出电极22电连接。第一检测元件1011与第一导电端子31和第二导电端子32电连接。第二检测元件1021与第一导电端子31和第二导电端子32电连接。
在一些实施方式中，至少一对引出电极21、22相对于第一中心轴线L1轴对称设置，至少一对导电端子31、32相对于第一中心轴线L1轴对称设置，检测元件1相对于第一中心轴线L1轴对称设置。
在检测过程中，气体通过设于第一壳体51的第一开口5001进入第一腔501，使第一检测组件101的检测元件1产生电信号的变化，例如电阻的变化。第二检测组件102作为第一检测组件101的参比组件，需要能够排除是否与待检测气体接触以外的其他环境因素对检测结果的影响。因此，在理想状态下，第一检测组件101和第二检测组件102处于相同的环境，也即除了是否与待检测气体接触以外，第一检测组件101和第二检测组件 102所受到的环境因素的影响大致相同。例如，外界气体分别与第一壳体51和第二壳体52接触，外界气体与第一壳体51接触所导致的第一壳体51的温度变化大致等于外界气体与第二壳体52接触所导致的第二壳体52的温度变化。如此，第一壳体51与第一检测组件101之间的热量传递所导致的第一检测组件101的电信号的变化大致等于第二壳体52与第二检测组件102之间的热量传递所导致的第二检测组件102的电信号的变化。
简单而言，对于第一检测组件101的检测元件和第二检测组件102的检测元件均为热敏电阻的情况，假设待测气体进入第一腔501导致的第一检测组件101的热敏电阻的阻值变化为R1，其他因素(例如，流动在第一壳体51之外的气体通过第一壳体51与第一检测组件101发生热传导，等等)导致的第一检测组件101的热敏电阻的阻值的变化为R2。如此，检测到第一检测组件101的热敏电阻的阻值变化为Rx，Rx＝R1+R2。理想状态下，第二检测组件102与第一检测组件101处于相同的环境，因此，第二检测组件102的热敏电阻的阻值的变化Ry＝R2。也就是说，第一检测组件101的检测环境与第二检测组件102的检测环境的差别在于，第一检测组件101的热敏电阻与待测气体接触，而第二检测组件102的热敏电阻与待测气体不接触，因此，除了“与待测气体接触”这一因素之外的其他因素导致的热敏电阻的阻值变化都应该体现在第二检测组件102的检测结果Ry中。在对检测结果进行修正时，Rx-Ry＝R1，如此，就能得到第一检测组件101的热敏电阻仅仅在与待测气体接触的影响下所发生的阻值变化，进而推算出待测气体的相关参数(例如气体浓度)，提高检测精度。理想状态下，当待测气体的浓度为0时，Rx＝Ry。但是，实际情况下，由于第一检测组件101与第二检测组件102的位置不同，二者所处的环境仍然存在差别，导致Ry≠R2。例如，气体流至第一壳体51的流速与气体流至第二壳体52的流速不等，流动至第一壳体51的气体与流动至第二壳体52的温度不同，等等。为了提高检测精度，需要尽量使第一检测组件101和第二检测组件102所处于的环境相同，从而使Ry无限趋近于R2。为了使第一检测组件101和第二检测组件102处于相同的环境，第一检测组件101与第二检测组件102具有相同的结构和尺寸，并且第一检测组件101与第一壳体51的相对位置也大致和第二检测组件102与第二壳体52的相对位 置保持一致。
在一些实施方式中，电路板6为平板状。在电路板6为平板状时，第一壳体51和第二壳体52并排设置在电路板6的同一侧。例如图30和图31，第一壳体51和第二壳体52均呈柱状，第一壳体51和第二壳体52从电路板6的相同侧凸出设置，第一壳体51的轴线和第二壳体52的轴线均与电路板6垂直，第一壳体51的轴线贯穿第一壳体51的第一开口5001。
本申请的第三方面提供一种传感装置的制造方法，包括以下步骤：
S1、提供检测组件100、壳体5和电路板6，检测组件100包括检测元件1、导电部20和底座4，例如图29，检测元件1与导电部20连接，导电部20与底座4连接；
S2、连接检测组件100与电路板6；
S3、将壳体5套设在至少部分检测组件100之外，连接壳体5与电路板6。
在本申请提供的传感装置的制造方法中，检测组件100和壳体5分别与电路板6连接，相对于先连接底座和壳体形成检测探头、再连接检测探头和电路板的制造方法而言，降低了底座4与壳体5之间的组装难度，进而降低了传感装置的制造难度。
在一些实施方式中，步骤S2中的连接为固定连接和电性连接。也就是说，步骤S2不仅实现检测组件100与电路板6的固定连接，还实现二者的电性连接。
在一些实施方式中，检测组件100的检测元件1与导电部20电性连接且固定连接，导电部20与底座4固定连接，导电部20与电路板6电性连接。具体地，电路板6上设置有用于安装导电部20的通孔601，例如图34所示。在一些实施方式中，步骤S2连接检测组件100和电路板6，包括：将导电部20贯穿通孔601，将导电材料填充至通孔601内，导电部20和电路板6通过导电材料电性连接和固定连接。
在一些实施方式中，在步骤S2完成后，底座4与电路板6之间有间隙。如此，减少检测组件100对电路板6散热的影响。
在一些实施方式中，设置在电路板6上的通孔601至少有一对，导电部20包括至少一对引出电极21、22和至少一对导电端子31、32，检测元 件1与至少一对引出电极21、22连接，至少一对引出电极21、22与至少一对导电端子31、32连接。至少一对导电端子31、32贯穿底座4并且与底座4固定连接。引出电极和导电端子各自的结构，以及引出电极与导电端子的连接关系如前文所述。
在一些实施方式中，在步骤S2连接检测组件100和电路板6的步骤之后，还包括：裁剪导电端子，去除导电端子的第二端部。第一导电端子31包括过渡段316，过渡段316位于电路板6的通孔601之内，过渡段316的一端与第一导电端子31的第一端部311连接，过渡段316的另一端与第一导电端子31的第二端部312连接，例如图29。在对第一导电端子31进行裁剪后，第一导电端子31仅包括位于第一腔501的第一端部311和位于通孔601内的过渡段316。同样地，第二导电端子32包括过渡段326，过渡段326位于电路板6的通孔601之内，过渡段326的一端与第二导电端子32的第一端部321连接，过渡段326的另一端与第二导电端子32的第二端部322连接。在对第二导电端子32进行裁剪后，第二导电端子32仅包括位于第二腔502的第一端部321和位于通孔601内的过渡段326，例如图29所示。在一些实施方式中，第一导电端子31的第一端部311、过渡段316和第二端部312同轴，第一导电端子31的半径为常数；第二导电端子32的第一端部321、过渡段326和第二端部322同轴，第二导电端子32的半径为常数。
在一些实施方式中，壳体5包括第一壳体51和第二壳体52，步骤S3、连接壳体5和电路板6，包括以下步骤：
S31、固定连接第一壳体51和电路板6，至少部分第一容腔511形成第一腔501，第一壳体51和电路板6均位于第一腔501的外围，第一开口5001气体性连通第一腔501和传感装置的外界；
S32、固定连接第二壳体52和电路板6，并且密封连接第二壳体52和电路板6，至少部分第二容腔521形成第二腔502，第二腔502为密封腔，第二壳体52和电路板6均位于第二腔502的外围。
在本申请中，由于第一壳体51与电路板6连接形成的第一腔501为开放腔，因此，第一壳体51与电路板6能够固定即可，其与电路板6的连接可以是密封连接，也可以不是密封连接。而第二壳体52需要与电路 板6连接形成封闭的第二腔502，因此，第二壳体52与电路板6的连接不仅要实现二者的固定，还要满足第二腔502的密闭性要求。因此，第二壳体52与电路板6密封连接。
尽管已经示出和描述了本申请的实施例，本领域的普通技术人员可以理解：在不脱离本申请的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。

Claims (20)

  1. 一种检测组件，所述检测组件包括引出电极和导电端子，所述导电端子包括第一端部和第二端部，所述第一端部具有第一末端，所述第二端部具有第二末端，沿所述导电端子的延伸方向，所述引出电极与所述第一端部位于所述第二末端的相同侧，所述引出电极包括连接部和延伸部，所述连接部与所述第一端部连接，所述延伸部自所述连接部向远离所述导电端子的方向延伸；
    沿所述导电端子的延伸方向，所述连接部与所述第二端部位于所述第一末端的相同侧；或者，所述连接部与所述第二端部分别位于所述第一末端的不同侧，并且所述连接部与所述导电端子的延伸方向垂直；
    沿所述导电端子的延伸方向，所述延伸部与所述第二端部位于所述第一末端的相同侧；或者，所述延伸部与所述第二端部分别位于所述第一末端的不同侧，并且所述延伸部与所述导电端子的延伸方向垂直。
  2. 根据权利要求1所述的检测组件，其中，沿所述导电端子的延伸方向，所述连接部和所述延伸部位于所述第一末端的相同侧。
  3. 根据权利要求1所述的检测组件，其中，所述连接部与所述延伸部位于同一平面内，所述平面与导电端子的延伸方向平行，或者，所述平面与所述导电端子的延伸方向垂直。
  4. 根据权利要求1所述的检测组件，其中，所述连接部具有第一连接端和第二连接端，所述第一连接端和所述第二连接端分别位于所述连接部沿所述检测组件的高度方向或宽度方向的两端，所述第一端相对于所述第二端靠近所述第一末端；
    所述连接部具有与所述延伸部连接的连接处，所述连接处位于所述第一连接端；或者，所述连接处位于所述第二连接端。
  5. 根据权利要求1所述的检测组件，其中，所述连接部包括用于与所述导电端子连接的连接区域，所述连接区域呈线状或面状。
  6. 根据权利要求1所述的检测组件，其中，所述导电端子包括第一导电端子和第二导电端子，所述引出电极包括第一引出电极和第二引出电极；
    所述第一引出电极包括第一连接部和第一延伸部，所述第一连接部与所述第一导电端子的第一端部连接，所述第一延伸部自所述第一连接部向远离所述第一导电端子的方向延伸；
    所述第二引出电极包括第二连接部和第二延伸部，所述第二连接部与所述第二导电端子的第一端部连接，所述第二延伸部自所述第二连接部向远离所述第二导电端子的方向延伸；
    所述第一延伸部位于所述第一导电端子朝向所述第二导电端子的一侧，所述第二延伸部位于所述第二导电端子朝向所述第一导电端子的一侧。
  7. 根据权利要求6所述的检测组件，其中，所述检测组件包括检测元件，所述检测元件与所述引出电极电性连接；
    所述第一延伸部包括相互连接的第一连接段和第二连接段，所述第一连接段与所述检测元件连接，第二连接段自第一连接段向远离所述检测元件的方向延伸，并且所述第二连接段与所述第一连接部连接；
    所述第二延伸部包括相互连接的第三连接段和第四连接段，所述第三连接段与所述检测元件连接，所述第四连接段自所述第三连接段向远离所述检测元件的方向延伸，所述第四连接段与所述第二连接部连接；
    所述第一连接段与所述第三连接段平行。
  8. 根据权利要求6所述的检测组件，其中，所述检测组件包括检测元件，所述第一引出电极与所述第二引出电极位于同一平面内，所述检测元件的至少部分表面与所述平面平行。
  9. 根据权利要求6所述的检测组件，其中，所述第一引出电极相对于所述第二引出电极轴对称设置，或者，所述第一引出电极相对于所述第二引出电极中心对称设置。
  10. 根据权利要求1所述的检测组件，其中，所述检测组件包括检测元件，所述检测元件与所述引出电极电性连接；
    所述检测元件与所述第一端部位于所述第二末端的相同侧，所述检测元件具有第一侧和第二侧，沿所述导电端子的延伸方向，所述第一侧和所述第二侧分别位于所述检测元件的不同侧；
    沿所述导电端子的延伸方向，所述第一侧和所述第二侧均与所述第二 端部位于所述第一末端的相同侧；或者，所述第一侧与所述第二端部分别位于所述第一末端的不同侧，所述第二侧与所述第二端部分别位于所述第一末端的不同侧，并且所述第二侧与所述第一末端齐平；或者，所述第一侧与所述第二侧分别位于所述第一末端的不同侧。
  11. 一种传感装置，包括检测组件、壳体和电路板，所述壳体与所述电路板连接，所述检测组件与所述电路板电性连接，所述检测组件包括检测元件、引出电极和导电端子，所述引出电极与所述检测元件连接，并且所述引出电极与所述导电端子连接，其中，
    所述导电端子包括第一端部和第二端部，所述第一端部具有第一末端，所述第二端部具有第二末端，沿所述导电端子的延伸方向，所述引出电极与所述第一端部位于所述第二末端的相同侧，所述引出电极包括连接部和延伸部，所述连接部与所述第一端部连接，所述延伸部自所述连接部向远离所述导电端子的方向延伸；
    沿所述导电端子的延伸方向，所述连接部与所述第二端部位于所述第一末端的相同侧；或者，所述连接部与所述第二端部分别位于所述第一末端的不同侧，并且所述连接部与所述导电端子的延伸方向垂直；
    沿所述导电端子的延伸方向，所述延伸部与所述第二端部位于所述第一末端的相同侧；或者，所述延伸部与所述第二端部分别位于所述第一末端的不同侧，并且所述延伸部与所述导电端子的延伸方向垂直；
    所述壳体具有容腔，所述检测元件、所述引出电极和所述第一端部均位于所述容腔之内，所述第二端部位于所述容腔之外。
  12. 根据权利要求11所述的传感装置，其中，所述检测元件与所述第一端部位于所述第二末端的相同侧，所述检测元件具有第一侧和第二侧，沿所述导电端子的延伸方向，所述第一侧和所述第二侧分别位于所述检测元件的不同侧；
    沿所述导电端子的延伸方向，所述第一侧和所述第二侧均与所述第二端部位于所述第一末端的相同侧；或者，所述第一侧与所述第二端部分别位于所述第一末端的不同侧，所述第二侧与所述第二端部分别位于所述第一末端的不同侧，并且所述第二侧与所述第一末端齐平；或者，所述第一侧与所述第二侧分别位于所述第一末端的不同侧。
  13. 根据权利要求11所述的传感装置，其中，所述检测组件包括底座，所述导电端子贯穿所述底座，所述导电端子与所述底座固定连接，所述导电端子与所述电路板固定连接，所述检测元件与所述引出电极电性连接，所述引出电极与所述导电端子电性连接，所述导电端子与所述电路板电性连接；
    所述壳体与所述底座直接连接，所述壳体与所述底座固定连接或限位连接；或者，所述壳体与所述电路板直接连接，且所述壳体与所述电路板固定连接或限位连接，所述底座位于所述壳体之内，所述壳体至少部分与所述底座之间具有间距。
  14. 根据权利要求13所述的传感装置，其中，所述壳体具有周壁，所述周壁位于所述容腔的外围，所述壳体具有第三侧和第四侧，沿所述电路板的厚度方向，所述第三侧相对于所述第四侧远离所述电路板；
    所述第四侧具有翻边部，所述翻边部自所述周壁向远离所述壳体的方向延伸，所述翻边部的至少部分与所述底座焊接或粘接；或者，
    所述翻边部至少部分与所述电路板焊接或粘接。
  15. 根据权利要求13所述的传感装置，其中，所述底座包括第一支撑台和第二支撑台，所述第一支撑台与所述第二支撑台连接，所述导电端子贯穿所述第一支撑台和所述第二支撑台；
    沿所述导电端子的延伸方向，所述第一支撑台在所述第二支撑台的投影位于所述第二支撑台的外轮廓之内，所述第一支撑台和所述第二支撑台均与所述壳体焊接或粘接。
  16. 根据权利要求11所述的传感装置，其中，所述传感装置具有第一腔和第二腔，所述第一腔与所述传感装置的外界气体性连通，所述第二腔为封闭腔；
    所述检测组件包括第一检测组件和第二检测组件，所述第一检测组件包括第一检测元件，所述第二检测组件包括第二检测元件，所述第一检测元件位于所述第一腔，所述第二检测元件位于所述第二腔；
    所述壳体包括第一壳体和第二壳体，所述第一壳体位于所述第一腔的外围，所述第二壳体位于所述第二腔的外围，所述第一壳体和所述第二壳体分别独立设置，所述第一壳体与所述第二壳体之间有间距。
  17. 根据权利要求16所述的传感装置，其中，所述第一壳体具有第一容腔，所述第一容腔的至少部分形成所述第一腔，所述第一容腔具有第一开口，所述第一开口气体性连通所述第一腔和所述传感装置的外界，所述第二壳体具有第二容腔，所述第二容腔的至少部分形成所述第二腔；
    所述检测组件包括底座，所述导电端子贯穿所述底座，所述导电端子与所述底座固定连接，所述导电端子与所述电路板固定连接，所述导电端子与所述电路板电性连接；
    所述底座包括第一底座和第二底座，所述第一壳体和所述第一底座均位于所述第一腔的外围；所述第二壳体和所述第二底座均位于所述第二腔的外围，所述第二壳体与所述第二底座密封连接；或者，所述电路板位于所述第一腔和第二腔的外围，所述第一底座位于所述第一腔，所述第二底座位于所述第二腔，所述第二壳体与所述电路板密封连接。
  18. 如权利要求17所述的传感装置，其中，所述第一壳体具有第二开口，所述电路板覆盖所述第二开口，沿所述第一壳体的高度方向，所述第一开口和所述第二开口分别位于所述第一壳体的两侧；
    所述第二壳体具有第三开口，所述第二壳体具有位于所述第三开口外围的壁面，所述电路板覆盖所述第三开口，并且沿所述传感装置的高度方向，所述壁面在所述电路板的投影位于所述电路板的外轮廓之内。
  19. 如权利要求17所述的传感装置，其中，所述底座具有第一中心轴线，所述壳体具有第二中心轴线，所述第一中心轴线与所述第二中心轴线重合；
    所述第一底座的第一中心轴线贯穿所述第一开口。
  20. 一种传感装置的制造方法，包括以下步骤：
    提供检测组件、壳体和电路板，所述检测组件包括检测元件、导电部和底座，所述检测元件与所述导电部连接，所述导电部与所述底座连接；
    连接所述检测组件与所述电路板；
    将所述壳体套设在至少部分所述检测组件之外，连接所述壳体与所述电路板。
PCT/CN2023/107432 2022-08-02 2023-07-14 检测组件、传感装置以及传感装置的制造方法 WO2024027486A1 (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
CN202210918950.7 2022-08-02
CN202210918950.7A CN116817997A (zh) 2022-08-02 2022-08-02 检测组件和传感装置
CN202211211162.0 2022-09-30
CN202211211162.0A CN116817985A (zh) 2022-09-30 2022-09-30 传感装置
CN202211342263.1 2022-10-31
CN202211342263.1A CN116794112A (zh) 2022-10-31 2022-10-31 检测装置及其制造方法

Publications (1)

Publication Number Publication Date
WO2024027486A1 true WO2024027486A1 (zh) 2024-02-08

Family

ID=89848459

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2023/107432 WO2024027486A1 (zh) 2022-08-02 2023-07-14 检测组件、传感装置以及传感装置的制造方法

Country Status (1)

Country Link
WO (1) WO2024027486A1 (zh)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03186751A (ja) * 1989-12-18 1991-08-14 Toshiba Corp ガスセンサ
JP2003042991A (ja) * 2001-08-02 2003-02-13 Yazaki Corp 接触燃焼式ガスセンサ及び該センサを使用したガス警報器
CN107144606A (zh) * 2017-04-14 2017-09-08 天津理工大学 一种氧化锌纳米棒‑碳纳米管乙醇传感器及其制备方法
CN110998305A (zh) * 2017-08-09 2020-04-10 世美特株式会社 气体传感器、气体检测装置、气体检测方法及包括气体传感器、气体检测装置的装置
CN113574369A (zh) * 2019-03-19 2021-10-29 费加罗技研株式会社 气体检测器
CN115876847A (zh) * 2021-09-28 2023-03-31 杭州三花研究院有限公司 气体检测探头和气体检测探头的制造方法
CN116794120A (zh) * 2023-02-02 2023-09-22 杭州三花研究院有限公司 检测装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03186751A (ja) * 1989-12-18 1991-08-14 Toshiba Corp ガスセンサ
JP2003042991A (ja) * 2001-08-02 2003-02-13 Yazaki Corp 接触燃焼式ガスセンサ及び該センサを使用したガス警報器
CN107144606A (zh) * 2017-04-14 2017-09-08 天津理工大学 一种氧化锌纳米棒‑碳纳米管乙醇传感器及其制备方法
CN110998305A (zh) * 2017-08-09 2020-04-10 世美特株式会社 气体传感器、气体检测装置、气体检测方法及包括气体传感器、气体检测装置的装置
CN113574369A (zh) * 2019-03-19 2021-10-29 费加罗技研株式会社 气体检测器
CN115876847A (zh) * 2021-09-28 2023-03-31 杭州三花研究院有限公司 气体检测探头和气体检测探头的制造方法
CN116794120A (zh) * 2023-02-02 2023-09-22 杭州三花研究院有限公司 检测装置

Similar Documents

Publication Publication Date Title
US7712361B2 (en) Flow rate measuring apparatus having a resin plate for supporting a flow rate detecting element and a circuit board
JP5743922B2 (ja) 熱式空気流量測定装置
KR20150083029A (ko) 유체 매질의 온도 및 압력을 검출하기 위한 센서
CN113155354A (zh) 金属密封压力传感器
WO2024027486A1 (zh) 检测组件、传感装置以及传感装置的制造方法
JP5974621B2 (ja) 圧力センサ
CN118275493A (zh) 检测探头以及气体传感器
CN214471504U (zh) 一种金属密封压力传感器
JP6060208B2 (ja) 物理量測定装置
JP3145274B2 (ja) 圧力センサ
JP4984068B2 (ja) 圧力センサ
JPH08261857A (ja) 圧力センサ
JP6231183B2 (ja) 物理量測定装置
CN214309248U (zh) 传感器
CN113108829B (zh) 传感器组件
KR102105704B1 (ko) 근접센서 이용한 압력 및 온도 복합센서
CN116794112A (zh) 检测装置及其制造方法
KR102682014B1 (ko) 압력 센서
JP6435389B2 (ja) 物理量測定装置
CN116817998A (zh) 传感装置
JPH09178596A (ja) 圧力センサ
CN116817985A (zh) 传感装置
JPH07202283A (ja) 圧電センサ及びその製造方法
JPH10185735A (ja) 圧力センサモジュール
TW201842309A (zh) 紅外線感測器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23849194

Country of ref document: EP

Kind code of ref document: A1