WO2024018615A1 - Élément interposeur, procédé de fabrication de carte de circuit imprimé et procédé de conception - Google Patents

Élément interposeur, procédé de fabrication de carte de circuit imprimé et procédé de conception Download PDF

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Publication number
WO2024018615A1
WO2024018615A1 PCT/JP2022/028461 JP2022028461W WO2024018615A1 WO 2024018615 A1 WO2024018615 A1 WO 2024018615A1 JP 2022028461 W JP2022028461 W JP 2022028461W WO 2024018615 A1 WO2024018615 A1 WO 2024018615A1
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WO
WIPO (PCT)
Prior art keywords
interposer
resin
dimensions
image
base substrate
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Application number
PCT/JP2022/028461
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English (en)
Japanese (ja)
Inventor
慎二 瀧川
Original Assignee
株式会社Fuji
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Publication date
Application filed by 株式会社Fuji filed Critical 株式会社Fuji
Priority to PCT/JP2022/028461 priority Critical patent/WO2024018615A1/fr
Publication of WO2024018615A1 publication Critical patent/WO2024018615A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Definitions

  • the present invention relates to an interposer member, a circuit board manufacturing method, and a designing method.
  • An object of the present invention is to appropriately manufacture an interposer member.
  • an interposer member that is provided on a base board on which electrical components are mounted, and includes a conductive member that electrically connects the upper and lower sides of the interposer member.
  • An interposer member is disclosed that includes an enclosure member surrounding the periphery and a frame member erected along the outer edge of the base substrate.
  • the present specification provides a base substrate forming step in which a base substrate on which electrical components are mounted is formed of a curable resin, and a base substrate formed in the base substrate forming step.
  • an interposer member forming step of forming the interposer member from a curable resin A method for manufacturing a circuit board is disclosed, in which a frame member that is erected along the outer edge of the base substrate is formed on the base substrate using a curable resin.
  • the present specification provides a method for designing an interposer member provided on a base board on which electrical components are mounted, the upper and lower sides of the interposer member being electrically connected. Based on the dimensions and arrangement position of the conductive member to be connected, image data of an enclosing member surrounding the conductive member is generated, and based on the dimensions of the base substrate, the enclosing member is installed upright along the outer edge of the base substrate.
  • a design method for designing the interposer member by creating image data of the frame member is disclosed.
  • the interposer member includes an enclosure member that surrounds a conductive member that electrically connects the upper side and the lower side, and a frame member that stands up along the outer edge of the base substrate. This makes it possible to appropriately manufacture the interposer member.
  • FIG. 2 is a block diagram showing a control device.
  • FIG. 3 is a cross-sectional view showing a circuit with a resin laminate formed thereon.
  • FIG. 2 is a cross-sectional view showing a circuit in which pads are formed in holes in a resin laminate.
  • FIG. 2 is a cross-sectional view showing a circuit in which wiring is formed on a resin laminate.
  • FIG. 3 is a cross-sectional view showing a circuit with conductive resin paste discharged onto wiring.
  • FIG. 2 is a perspective view showing a circuit in which an interposer member is formed on a resin laminate.
  • FIG. 2 is a cross-sectional view showing a circuit in which an interposer member is formed on a resin laminate.
  • FIG. 2 is a cross-sectional view showing a circuit in which electronic components and probe pins are arranged.
  • FIG. 3 is a cross-sectional view showing the cover substrate.
  • FIG. 3 is a cross-sectional view showing a laminated substrate.
  • FIG. 3 is a diagram showing an interposer image. It is a figure showing a 3D image. It is a figure which shows the interposer member of an Example. It is a figure showing a conventional interposer member. It is a figure which shows the interposer member of a modification. It is a figure which shows the interposer image of a modification.
  • FIG. 1 shows an example of a circuit forming apparatus 10.
  • the circuit forming apparatus 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 24, a third modeling unit 25, a mounting unit 27, and a control device (see FIG. 2) 28.
  • the transport device 20 , the first modeling unit 22 , the second modeling unit 24 , the third modeling unit 25 , and the mounting unit 27 are arranged on the base 29 of the circuit forming apparatus 10 .
  • the base 29 has a generally rectangular shape, and in the following description, the longitudinal direction of the base 29 is the X-axis direction, the short direction of the base 29 is the Y-axis direction, and it is perpendicular to both the X-axis direction and the Y-axis direction. The direction will be described as the Z-axis direction.
  • the transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32.
  • the X-axis slide mechanism 30 includes an X-axis slide rail 34 and an X-axis slider 36.
  • the X-axis slide rail 34 is arranged on the base 29 so as to extend in the X-axis direction.
  • the X-axis slider 36 is held by the X-axis slide rail 34 so as to be slidable in the X-axis direction.
  • the X-axis slide mechanism 30 includes an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 is moved to any position in the X-axis direction by driving the electromagnetic motor 38.
  • the Y-axis slide mechanism 32 includes a Y-axis slide rail 50 and a stage 52.
  • the Y-axis slide rail 50 is disposed on the base 29 so as to extend in the Y-axis direction, and is movable in the X-axis direction.
  • One end of the Y-axis slide rail 50 is connected to the X-axis slider 36.
  • a stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction.
  • the Y-axis slide mechanism 32 includes an electromagnetic motor (see FIG. 2) 56, and the stage 52 is moved to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56. Thereby, the stage 52 is moved to an arbitrary position on the base 29 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.
  • the stage 52 has a base 60, a holding device 62, and a lifting device 64.
  • the base 60 is formed into a flat plate shape, and a substrate is placed on the top surface.
  • the holding device 62 is provided on both sides of the base 60 in the X-axis direction. Then, both edges of the substrate placed on the base 60 in the X-axis direction are held between the holding devices 62, so that the substrate is fixedly held. Further, the lifting device 64 is disposed below the base 60 and raises and lowers the base 60.
  • the first modeling unit 22 is a unit that models wiring on a substrate placed on the base 60 of the stage 52, and includes a first printing section 72 and a firing section 74.
  • the first printing section 72 has an inkjet head (see FIG. 2) 76, and the inkjet head 76 discharges metal ink in a linear manner.
  • Metal ink is made by dispersing nanometer-sized metal particles, such as silver, in a solvent. Note that the surface of the metal fine particles is coated with a dispersant to prevent agglomeration in the solvent. Further, the inkjet head 76 ejects metal ink from a plurality of nozzles using a piezo system using piezoelectric elements, for example.
  • the baking section 74 has an infrared irradiation device (see FIG. 2) 78.
  • the infrared irradiation device 78 is a device that irradiates the ejected metal ink with infrared rays.
  • the metal ink irradiated with infrared rays is fired and wiring is formed.
  • firing metal ink means that energy is applied to vaporize the solvent and decompose the protective film of the metal particles, that is, the dispersant, etc., and the metal particles contact or fuse to form a conductive layer. This is a phenomenon where the rate increases.
  • metal wiring is formed by firing the metal ink.
  • the second modeling unit 24 is a unit that models a resin layer on the substrate placed on the base 60 of the stage 52, and includes a second printing section 84 and a curing section 86.
  • the second printing section 84 has an inkjet head (see FIG. 2) 88, and the inkjet head 88 discharges ultraviolet curing resin.
  • Ultraviolet curable resin is a resin that is cured by irradiation with ultraviolet rays.
  • the inkjet head 88 may be of a piezo type using a piezoelectric element, for example, or may be a thermal type of heating resin to generate bubbles and ejecting the bubbles from a plurality of nozzles.
  • the curing section 86 includes a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92.
  • the flattening device 90 flattens the upper surface of the ultraviolet curable resin discharged by the inkjet head 88, and for example, scrapes off excess resin with a roller or blade while leveling the surface of the ultraviolet curable resin. to make the thickness of the ultraviolet curing resin uniform.
  • the irradiation device 92 includes a mercury lamp or an LED as a light source, and irradiates the discharged ultraviolet curing resin with ultraviolet rays. As a result, the discharged ultraviolet curing resin is cured and a resin layer is formed.
  • the third molding unit 25 is a unit that molds connection parts between electrodes and wiring of electronic components on a substrate placed on a base 60 of the stage 52, and includes a third printing part 100 and a first heating part. 102.
  • the third printing unit 100 has a dispenser (see FIG. 2) 106, and the dispenser 106 discharges conductive resin paste.
  • the conductive resin paste is made by dispersing micrometer-sized metal particles in a resin that hardens by heating at a relatively low temperature. Incidentally, the metal particles are in the form of flakes, and the viscosity of the conductive resin paste is relatively high compared to the metal ink.
  • the first heating section 102 has a heater (see FIG. 2) 108.
  • the heater 108 is a device that heats the conductive resin paste applied by the dispenser 106. In the heated conductive resin paste, the resin hardens. At this time, in the conductive resin paste, the resin hardens and contracts, and the flaky metal particles dispersed in the resin come into contact with each other. Thereby, the conductive resin paste exhibits conductivity. Further, the resin of the conductive resin paste is, for example, an organic adhesive, and exhibits adhesive strength by being cured by heating.
  • the mounting unit 27 is a unit for mounting components on a circuit board, and includes a supply section 120 and a mounting section 122.
  • the supply unit 120 has a plurality of tape feeders (see FIG. 2) 124 that feed out taped components one by one, and supplies the components at a supply position.
  • the plurality of tape feeders 124 of the supply unit 120 supply components such as electronic components and probe pins.
  • the supply unit 120 is not limited to the tape feeder 124, and may be a tray-type supply device that picks up and supplies electronic components from a tray. Further, the supply unit 120 may be configured to include both a tape type and a tray type, or other supply devices.
  • the mounting section 122 includes a mounting head (see FIG. 2) 126 and a moving device (see FIG. 2) 128.
  • the mounting head 126 has a suction nozzle (not shown) for suctioning and holding components.
  • the suction nozzle is supplied with negative pressure from a positive and negative pressure supply device (not shown), and suctions and holds the component by suctioning air. Then, by supplying a slight positive pressure from the positive and negative pressure supply device, the parts are separated.
  • the moving device 128 moves the mounting head 126 between the component supply position by the tape feeder 124 and the substrate placed on the base 60. As a result, in the mounting section 122, the component supplied from the tape feeder 124 is held by the suction nozzle, and the component held by the suction nozzle is mounted on the board.
  • control device 28 includes a controller 130 and a plurality of drive circuits 132, as shown in FIG.
  • the plurality of drive circuits 132 include the electromagnetic motors 38 and 56, a holding device 62, a lifting device 64, an inkjet head 76, an infrared irradiation device 78, an inkjet head 88, a flattening device 90, an irradiation device 92, a dispenser 106, a heater 108, It is connected to a tape feeder 124, a mounting head 126, and a moving device 128.
  • the controller 130 is mainly a computer, including a CPU, ROM, RAM, etc., and is connected to a plurality of drive circuits 132. As a result, the operations of the transport device 20 , the first modeling unit 22 , the second modeling unit 24 , the third modeling unit 25 , and the mounting unit 27 are controlled by the controller 130 .
  • a base substrate is formed on the base 60, and an interposer member is formed on the base substrate, thereby forming a circuit board.
  • the stage 52 is moved below the second modeling unit 24. Then, in the second modeling unit 24, as shown in FIG. 3, a resin laminate 150 is formed on the base 60 of the stage 52.
  • the resin laminate 150 has a plurality of holes 152 and insertion holes 154, and the ejection of the ultraviolet curable resin from the inkjet head 88 and the irradiation of the ejected ultraviolet curable resin with ultraviolet rays by the irradiation device 92 are repeated. It is formed by
  • the inkjet head 88 discharges ultraviolet curing resin in a thin film onto the upper surface of the base 60. At this time, the inkjet head 88 discharges the ultraviolet curing resin so that a predetermined position on the upper surface of the base 60 is exposed. Subsequently, when the ultraviolet curable resin is discharged in the form of a thin film, the ultraviolet curable resin is flattened by a flattening device 90 in the curing section 86 so that the thickness of the ultraviolet curable resin becomes uniform. Then, the irradiation device 92 irradiates the thin film of ultraviolet curing resin with ultraviolet rays. As a result, a thin film-like resin layer 156 is formed on the base 60.
  • the inkjet head 88 discharges a thin film of ultraviolet curing resin onto the thin film resin layer 156. That is, the inkjet head 88 discharges the ultraviolet curing resin in a thin film onto the resin layer 156 so that a predetermined position on the upper surface of the base 60 is exposed. Then, the thin film-shaped ultraviolet curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet ray curable resin discharged in the thin film shape with ultraviolet rays, thereby forming a layer on the thin film-shaped resin layer 156. A thin film-like resin layer 156 is laminated.
  • a resin laminate 150 having the following properties is formed. Further, the resin laminate 150 has a generally rectangular plate shape, and four insertion holes 154 are formed at the four corners of the resin laminate 150. Further, the plurality of holes 152 are formed in a number corresponding to the number of probe pins arranged at positions corresponding to the arrangement locations of probe pins, which will be described later. Note that two holes 152 are formed in the resin laminate 150.
  • the stage 52 is moved below the third modeling unit 25. Then, in the third printing section 100 of the third modeling unit 25, the dispenser 106 discharges the conductive resin paste 158 into each of the plurality of holes 152, as shown in FIG. At this time, the dispenser 106 discharges the conductive resin paste 158 so as to fill the inside of the hole 152. In this manner, when the conductive resin paste 158 is discharged into the hole 152, the resin laminate 150 is heated by the heater 108 in the first heating section 102. As a result, the conductive resin paste 158 hardens inside the hole 152, and pads 160 exposed on the lower and upper surfaces of the resin laminate 150 are formed.
  • the stage 52 is moved below the first modeling unit 22.
  • the inkjet head 76 discharges the metal ink 162 linearly onto the upper surface of the resin laminate 150 according to the circuit pattern, as shown in FIG.
  • the infrared irradiation device 78 irradiates the metal ink 162 with infrared rays in the firing section 74 of the first modeling unit 22 .
  • the metal ink 162 is fired, and the wiring 164 is formed on the resin laminate 150.
  • two wires 164 are formed on the upper surface of the resin laminate 150, one end of each of the two wires 164 is connected to the pad 160, and the other end of the two wires 164 is connected to the pad 160. are facing each other.
  • the stage 52 is moved below the third modeling unit 25.
  • the dispenser 106 pastes a conductive resin paste onto one end of each of the two wirings 164 connected to the pad 160, as shown in FIG. 166 is discharged, and a conductive resin paste 168 is discharged onto the opposite ends of the two wirings 164.
  • the conductive resin pastes 166, 168 are heated by the heater 108, so that the conductive resin pastes 166, 168 exhibit conductivity.
  • the stage 52 is moved below the second modeling unit 24.
  • the discharge of the ultraviolet curing resin from the inkjet head 88 and the irradiation of the ejected ultraviolet curing resin with ultraviolet light by the irradiation device 92 are repeated, as shown in FIGS. 7 and 8.
  • a plurality of cylindrical members 170 and frame members 172 are formed on the resin laminate 150.
  • the cylindrical member 170 and the frame member 172 are basically formed by the same method as the resin laminate 150.
  • the inkjet head 88 discharges the ultraviolet curable resin in an annular shape onto the upper surface of the resin laminate 150 so as to surround the conductive resin paste 166. Then, the ultraviolet curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curable resin with ultraviolet rays, thereby forming a ring-shaped resin layer. Then, by stacking the annular resin layers, a cylindrical first cylindrical member 170a surrounding the conductive resin paste 166 is formed on the upper surface of the resin laminate 150.
  • the inkjet head 88 discharges the ultraviolet curing resin in an annular shape onto the upper surface of the resin laminate 150 so as to surround the opening of the insertion hole 154. Then, the ultraviolet curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curable resin with ultraviolet rays, thereby forming a ring-shaped resin layer. Then, by stacking the annular resin layers, a cylindrical second cylindrical member 170b surrounding the opening of the insertion hole 154 is formed on the upper surface of the resin laminate 150.
  • the inkjet head 88 discharges the ultraviolet curing resin in a rectangular shape onto the upper surface of the resin laminate 150 so as to surround the conductive resin paste 168. Then, the ultraviolet curing resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curing resin with ultraviolet rays, thereby forming a rectangular resin layer. Then, by stacking the rectangular frame-shaped resin layers, a rectangular third cylinder member 170c that surrounds the conductive resin paste 168 is formed on the upper surface of the resin laminate 150. Note that the third cylindrical member 170c surrounds the conductive resin paste 168 discharged onto the ends of the two wires 164 facing each other.
  • the inkjet head 88 discharges the ultraviolet curable resin in a frame shape onto the upper surface of the resin laminate 150 along the outer edge of the resin laminate 150.
  • the ultraviolet curing resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curing resin with ultraviolet rays, thereby forming a frame-shaped resin layer.
  • a frame-shaped frame member 172 along the outer edge of the resin laminate 150 is formed on the upper surface of the resin laminate 150.
  • the frame member 172 is formed on the outer edge of the resin laminate 150, it may also be formed along the outer edge of the resin laminate 150 at a predetermined distance inside from the outer edge of the resin laminate 150. good.
  • the frame member 172 is formed linearly along the outer edge of the resin laminate 150, it may be formed so as to curve along the outer edge of the resin laminate 150. Note that the height dimension of the cylindrical member 170 and the height dimension of the frame member 172 are the same. Moreover, the thickness dimension of the cylinder member 170 and the thickness dimension of the frame member 172 are the same.
  • the stage 52 is moved below the mounting unit 27.
  • an electronic component (see FIG. 9) 180 is supplied by one of the plurality of tape feeders 124, and the electronic component 180 is held by a suction nozzle of the mounting head 126.
  • the electronic component 180 includes a component body 182 and two electrodes 184 disposed on the lower surface of the component body 182.
  • the mounting head 126 is moved by the moving device 128, and the electronic component 180 held by the suction nozzle is mounted on the upper surface of the resin laminate 150 inside the third cylindrical member 170c.
  • the electronic component 180 is mounted so that the electrode 184 of the electronic component 180 comes into contact with the conductive resin paste 168 discharged onto the end of the wiring 164.
  • a probe pin 190 is supplied by another tape feeder among the plurality of tape feeders 124, and the probe pin 190 is held by a suction nozzle of the mounting head 126.
  • the probe pin 190 has a generally cylindrical shape and is expandable and contractible in the length direction. Then, the mounting head 126 is moved by the moving device 128, and the probe pin 190 held by the suction nozzle is mounted on the upper surface of the resin laminate 150 inside the first cylindrical member 170a. At this time, the lower end surface of the probe pin 190 comes into contact with the conductive resin paste 166 discharged onto the end of the wiring 164.
  • the wiring 164 is formed on the resin laminate 150 and the electronic component 180 etc. are mounted, and the cylindrical member 170 and the frame member 172 surrounding the electronic component 180 etc. are formed on the resin laminate 150.
  • the circuit board 200 is formed. That is, the resin laminate 150 serves as the base of the circuit board 200, and the interposer member 204 made of the cylinder member 170 and the frame member 172 is formed on the base substrate 202 made of the resin laminate 150, wiring 164, etc. By doing so, the circuit board 200 is formed.
  • a cover substrate 210 shown in FIG. 10 is also formed.
  • the cover substrate 210 is formed using the same method used to form the pads 160 on the resin laminate 150 as shown in FIG. 4 when the circuit board 200 is produced. That is, as shown in FIG. 10, a resin laminate 150 having a hole 152 and an insertion hole 154 is formed on the upper surface of the base 60. Then, pad 160 is formed by discharging conductive resin paste 158 into hole 152 .
  • the inkjet head 76 in the first printing section 72 of the first modeling unit 22 applies two pieces of metal ink 212 onto the upper surface of the resin laminate 150. Discharge so as to connect the pads 160. Then, in the firing section 74 of the first modeling unit 22, an infrared ray irradiation device 78 irradiates the metal ink 212 with infrared rays. As a result, the metal ink 212 is fired, and the wiring 214 is formed on the resin laminate 150.
  • a resin laminate 216 is formed on the resin laminate 150 using the same method as the resin laminate 150.
  • the outer dimensions of the resin laminate 216 are the same as the outer dimensions of the resin laminate 150 except for the thickness dimension.
  • an insertion hole 218 is formed in the resin laminate 216 at the same position as the insertion hole 154 of the resin laminate 150 . In this way, by forming the resin laminate 216 on the resin laminate 150, the cover substrate 210 is formed.
  • two circuit boards 200 are formed, and the two circuit boards 200 and the cover board 210 are stacked and bolted together to form a laminated board 220.
  • two circuit boards 200 are stacked, and a cover board 210 is stacked on the two stacked circuit boards 200.
  • the upper end surface of the probe pin 190a of the lowest circuit board 200a comes into contact with the lower end surface of the pad 160b of the circuit board 200b stacked on the circuit board 200a.
  • the probe pin 190a electrically connects the upper side and the lower side of the interposer member 204a on the circuit board 200a.
  • the upper end surface of the probe pin 190b of the circuit board 200b contacts the lower end surface of the pad 160c of the cover substrate 210 stacked on the circuit board 200b.
  • the probe pin 190b electrically connects the upper and lower sides of the interposer member 204b on the circuit board 200b.
  • the inside of the second cylindrical member 170b of the circuit board 200a communicates with the insertion hole 154 of the circuit board 200b.
  • the inside of the second cylindrical member 170b of the circuit board 200b and the insertion hole 154 of the cover board 210 communicate with each other.
  • the insertion hole 154 of the circuit board 200a and the inside of the second cylindrical member 170b, the insertion hole 154 of the circuit board 200b and the inside of the second cylindrical member 170b, and the insertion holes 154 and 218 of the cover board 210 communicate with each other. .
  • the bolts 230 are inserted into the insertion hole 154 of the circuit board 200a and the inside of the second cylindrical member 170b, the insertion hole 154 of the circuit board 200b and the inside of the second cylindrical member 170b, and the insertion holes 154 and 218 of the cover board 210.
  • the circuit board 200a, the circuit board 200b, and the cover board 210 are bolted together. As a result, a laminated substrate 220 is formed.
  • the circuit board 200a, the circuit board 200b, and the cover board 210 are laminated and, for example, bolted together to form the laminated board 220.
  • a substrate is disposed on a robot hand, it is desired to reduce the weight of the substrate from the viewpoint of increasing the moving speed of the robot hand and controlling vibration damping.
  • the board be lightweight so that it can operate for a long time with one charge.
  • the interposer member 204 constituting the circuit board 200 can be formed into an arbitrary shape by discharging the ultraviolet curing resin at an arbitrary position.
  • the interposer member 204 is made of ultraviolet curing resin.
  • a design image (hereinafter referred to as a "CAD image") of the circuit board 200 is created using CAD (Computer Aided Design). Since the method for creating a CAD image is a well-known technique, the method for creating a CAD image will be briefly described.
  • CAD image the operator inputs the dimensions of the resin laminate 150 constituting the circuit board 200 and the locations of the electronic components 180, probe pins 190, bolts 230, and the like. Then, a CAD image is created based on the dimensions of the resin laminate 150 constituting the circuit board 200 and the positions of the electronic components 180, probe pins 190, bolts 230, and the like.
  • the dimensions of the resin laminate 150 and the locations of the electronic component 180, probe pin 190, and bolt 230 can be calculated.
  • the created CAD image is stored in the control device 28 of the circuit forming apparatus 10. The operator also registers the dimensions of the electronic component 180, probe pin 190, and bolt 230 in the control device 28.
  • the controller 130 of the control device 28 stores a first design program 250 (see FIG. 2). Then, the first design program 250 calculates the dimensions of the resin laminate 150 and the placement positions of the electronic component 180, the probe pin 190, and the bolt 230 based on the CAD image stored in the control device 28. The first design program 250 also acquires the dimensions of the electronic component 180, probe pin 190, and bolt 230 registered in the control device 28. The first design program 250 also displays an input image for inputting the height and thickness of the interposer member 204 on a display monitor (not shown). At this time, the operator inputs the height and thickness of the interposer member 204 on the input screen. Note that the input height dimension of the interposer member 204 is described as an input height dimension, and the input thickness dimension of the interposer member 204 is described as an input thickness dimension.
  • the first design program 250 then designs the interposer member 204 based on the dimensions of the resin laminate 150, the arrangement positions and dimensions of the electronic component 180, the probe pin 190, and the bolt 230, the input height dimension, and the input thickness dimension. design. At this time, the first design program 250 generates an image of the interposer member 204 (hereinafter referred to as 260 (described as an "interposer image”) (see FIG. 12).
  • the first design program 250 creates an image of the frame member 172 that constitutes the interposer member 204 (hereinafter referred to as "frame member image") based on the dimensions of the resin laminate 150 and the input thickness dimension. 262 (see FIG. 12).
  • frame member image a frame member image 262 having a frame shape having an outer edge with the same dimensions as the outer dimensions when viewed from above of the resin laminate 150 and a thickness with the same dimension as the input thickness dimension is created.
  • the frame member image 262 is a frame-shaped image having an outer edge having the same dimensions as the outer dimensions of the resin laminate 150 when viewed from above, and having a thickness equal to the input thickness dimension.
  • the first design program 250 also generates an image of the first cylindrical member 170a constituting the interposer member 204 (hereinafter referred to as "first cylindrical member image") based on the dimensions and arrangement position of the probe pin 190 and the input thickness dimension. ) 264 (see FIG. 12).
  • first cylindrical member image an image of the first cylindrical member 170a constituting the interposer member 204
  • first cylindrical member image an image of the first cylindrical member 170a constituting the interposer member 204 (hereinafter referred to as "first cylindrical member image”) based on the dimensions and arrangement position of the probe pin 190 and the input thickness dimension. ) 264 (see FIG. 12).
  • an annular first cylindrical member image 264 having an inner diameter slightly larger than the outer diameter of the probe pin 190 and a thickness equal to the input thickness dimension is created. be done.
  • the first cylindrical member image 264 is an annular image having an inner diameter that is slightly larger than the outer dimension of the probe pin 190 when viewed from above, and a thickness that is the same
  • the first design program 250 also generates an image of the second cylindrical member 170b that constitutes the interposer member 204 (hereinafter referred to as a "second cylindrical member image") based on the dimensions and arrangement positions of the bolts 230 and the input thickness dimensions. ) 266 (see FIG. 12) is created.
  • a second cylindrical member image having an inner diameter slightly larger than the outer diameter of the shaft portion of the bolt 230 and a thickness equal to the input thickness dimension.
  • the second cylindrical member image 266 is an annular image having an inner diameter slightly larger than the outer diameter of the shaft portion of the bolt 230 and a thickness equal to the input thickness dimension.
  • the first design program 250 also generates an image of the third cylindrical member 170c that constitutes the interposer member 204 (hereinafter referred to as "third cylindrical member image") based on the dimensions and arrangement position of the electronic component 180 and the input thickness dimension. ) 268 (see FIG. 12).
  • third cylindrical member image a frame-shaped third cylindrical member having an inner edge slightly larger than the outer dimension when viewed from above the electronic component 180 and having a thickness equal to the input thickness dimension.
  • Image 268 is created. That is, the third cylindrical member image 268 is a frame-shaped image that has an inner edge that is slightly larger than the outer dimension when viewed from above the electronic component 180, and has a thickness that is the same as the input thickness dimension.
  • the interposer image 260 is formed by forming the frame member image 262, the first cylinder member image 264, the second cylinder member image 266, and the third cylinder member image 268.
  • the interposer image 260 is formed by the first design program 250, and the number of resin layers stacked when forming the interposer member 204 is calculated, thereby designing the interposer member 204. That is, the first design program 250 is based on the dimensions of the resin laminate 150, the arrangement positions and dimensions of the electronic component 180, the probe pin 190, and the bolt 230, the input height dimension, and the input thickness dimension input by the operator. Thus, the interposer member 204 is designed.
  • the controller 130 of the control device 28 stores not only the first design program 250 but also a second design program 252 (see FIG. 2). Then, in the second design program 252, the dimensions of the resin laminate 150 and the positions and dimensions of the electronic components 180, probe pins 190, and bolts 230 are acquired from the 3D image of the base board 202 that constitutes the circuit board 200. Ru. Then, the interposer member 204 is designed based on the obtained dimensions of the resin laminate 150 and the positions and dimensions of the electronic component 180, probe pin 190, and bolt 230.
  • the CAD image is created based on the dimensions of the resin laminate 150 and the placement positions of the electronic component 180, probe pin 190, bolt 230, and the like. Therefore, a 3D image of the circuit board 200 is created based on the CAD image and the dimensions of the electronic component 180, probe pin 190, bolt 230, etc.
  • the created 3D image is then stored in the control device 28. Note that since the method for creating a 3D image is a well-known technique, a description of the method for creating a 3D image will be omitted.
  • the second design program 252 calculates the dimensions of the resin laminate 150 and the placement positions and dimensions of the electronic component 180, probe pin 190, and bolt 230 based on the 3D image stored in the control device 28. Specifically, the second design program 252 specifies an image (hereinafter referred to as "base board image") 280 (see FIG. 13) of the top surface of the base board 202 that constitutes the circuit board 200 based on the 3D image. . In the base board image 280, as shown in FIG. The outer dimensions, the outer diameter of the probe pin 190, and the outer diameter of the shaft portion of the bolt 230 can be recognized.
  • the second design program 252 determines the external dimensions of the resin laminate 150 as viewed from above, the arrangement of the electronic component 180, the probe pin 190, and the bolt 230 based on the 3D image stored in the control device 28. The position, the outer size of the electronic component 180 when viewed from above, the outer diameter of the probe pin 190, and the outer diameter of the bolt 230 are calculated.
  • an input image for inputting the height dimension and thickness dimension of the interposer member 204 is displayed on the display monitor.
  • the operator inputs the height and thickness of the interposer member 204 on the input screen.
  • the second design program 252 calculates the calculated outer dimensions of the resin laminate 150, the arrangement positions of the electronic component 180, the probe pin 190, and the bolt 230, the outer dimension of the electronic component 180, the outer diameter of the probe pin 190, and the location of the bolt 230.
  • An interposer image 260 is created based on the outer diameter and the input thickness dimension.
  • the method for creating the interposer image 260 in the second design program 252 is the same as the method for creating the interposer image 260 in the first design program 250. Also, in the second design program 252, similarly to the first design program 250, the number of laminated resin layers when forming the interposer member 204 is calculated.
  • the interposer image 260 is formed, and the number of resin layers stacked when forming the interposer member 204 is calculated, thereby designing the interposer member 204.
  • An interposer image 260 is formed.
  • the ultraviolet curable resin is ejected by the inkjet head 88 based on the interposer image 260. Then, the discharged ultraviolet curable resin is flattened by a flattening device 90 and irradiated with ultraviolet rays by an irradiation device 92, thereby forming a resin layer having the shape shown in FIG. Then, the interposer member 204 having the shape shown in FIG. 14 is formed by laminating resin layers corresponding to the number of layers calculated at the time of designing the interposer member 204.
  • a conventional interposer member 290 is a plate-shaped member, and a through hole 292 is formed at the position where the electronic component 180, probe pin 190, and bolt 230 are disposed.
  • the interposer member 204 shown in FIG. 14 and the interposer member 290 shown in FIG. It is the shape.
  • the interposer member 204 created by the circuit forming apparatus 10 includes the frame member 172 for supporting the substrate laminated on the interposer member 204, the electronic component 180, the probe pin 190, and the bolt 230. It has a shape composed of a cylindrical member 170.
  • the volume of the interposer member 204 created by the circuit forming apparatus 10 is clearly smaller than the volume of the conventional interposer member 290.
  • the weight of the interposer member 204 produced by the circuit forming apparatus 10 can be made much smaller than the weight of the conventional interposer member 290, and the weight of the board can be reduced.
  • the formation of a resin laminate is eliminated. It is also possible to reduce the time required for the process and the material used for the resin laminate.
  • the interposer member 204 is designed by the first design program 250 or the second design program 252, it is possible to reduce the time required to design the interposer member 204.
  • first cylindrical member 170a is an example of an enclosing member.
  • Frame member 172 is an example of a frame member.
  • Electronic component 180 is an example of an electrical component.
  • Probe pin 190 is an example of a conductive member.
  • Base substrate 202 is an example of a base substrate.
  • Interposer member 204 is an example of an interposer member.
  • the interposer member 204 includes the cylindrical member 170 and the frame member 172, but may include members other than the cylindrical member 170 and the frame member 172.
  • the interposer member 204 may further include a convex member 300, as shown in FIG. In such a case, by inputting the placement position and dimensions of the convex member 300 into the first design program 250 or the second design program 252, an image 302 of the convex member 300 is included as shown in FIG.
  • An interposer image 310 is formed.
  • an interposer member 204 including the cylindrical member 170, the frame member 172, and the convex member 300 is formed.
  • the arrangement position and dimensions of the convex member 300 may be included in the CAD image or 3D image, or may be registered in the control device 28.
  • the interposer member 204 includes the cylindrical member 170 for arranging the electronic component 180, the probe pin 190, and the bolt 230; It may be provided with a cylindrical member for arranging the. Further, as the cylindrical member 170, a first cylindrical member 170a for arranging the probe pin 190, a second cylindrical member 170b for arranging the bolt 230, and a third cylindrical member 170b for arranging the electronic component 180. Although the member 170c is employed, at least the first cylindrical member 170a may be employed.
  • the interposer member 204 includes at least the first cylindrical member 170a and the frame member 172, it also includes at least one of the second cylindrical member 170b, the third cylindrical member 170c, and the convex member 300. You can.
  • the interposer member 204 includes the first cylindrical member 170a, the second cylindrical member 170b, the third cylindrical member 170c, and the frame member 172.
  • a connecting member that connects each of the third cylinder member 170b, the third cylinder member 170c, and the frame member 172 may be provided. Since the interposer member 204 further includes a connecting member, it becomes possible to create an integral interposer member 204, and it becomes possible to distribute the interposer member 204 alone.
  • cylindrical member 170 surrounds the entire circumference of the electronic component 180, the probe pin 190, and the bolt 230, it may partially surround the periphery of the electronic component 180, the probe pin 190, and the bolt 230.
  • the cylindrical member 170 is not limited to a cylindrical shape, and may be a cylindrical member with a part cut off.
  • first cylindrical member 170a, the second cylindrical member 170b, the third cylindrical member 170c, and the frame member 172 have the same height, but the first cylindrical member 170a and the second cylindrical member 170b have the same height.
  • the third cylindrical member 170c and the frame member 172 may have different height dimensions.
  • first design program 250 and the second design program 252 are stored in the control device 28 of the circuit forming device 10
  • first design program 250 and the second design program 252 are stored in a device different from the circuit forming device 10, for example, an information processing device used for designing a circuit board.
  • a first design program 250, and a second design program 252 may be stored.
  • only one of the first design program 250 and the second design program 252 may be stored in the control device 28 of the circuit forming device 10 or in a device different from the circuit forming device 10.
  • an ultraviolet curable resin is used as the curable resin for forming the interposer member 204, but it is possible to use various resins such as a thermosetting resin and a two-component mixed resin. It is.
  • the upper surface of the ultraviolet curing resin discharged by the inkjet head 88 is flattened by the flattening device 90.
  • the ultraviolet curing resin does not need to be flattened after being ejected by the inkjet head 88.
  • the hardening section 86 does not need to be provided with the flattening device 90.
  • 170a First cylinder member (enclosure member) 172: Frame member 180: Electronic component (electrical component) 190: Probe pin (conducting member) 202: Base board 204: Interposer member (interposer member)

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

La présente invention concerne un élément interposeur qui est disposé sur un substrat de base sur lequel des composants électriques sont montés. L'élément interposeur comprend un élément environnant qui entoure la périphérie d'un élément conducteur qui connecte électriquement un côté supérieur et un côté inférieur de l'élément interposeur, et un élément de cadre qui est érigé le long des bords externes du substrat de base.
PCT/JP2022/028461 2022-07-22 2022-07-22 Élément interposeur, procédé de fabrication de carte de circuit imprimé et procédé de conception WO2024018615A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/028461 WO2024018615A1 (fr) 2022-07-22 2022-07-22 Élément interposeur, procédé de fabrication de carte de circuit imprimé et procédé de conception

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Application Number Priority Date Filing Date Title
PCT/JP2022/028461 WO2024018615A1 (fr) 2022-07-22 2022-07-22 Élément interposeur, procédé de fabrication de carte de circuit imprimé et procédé de conception

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016125275A1 (fr) * 2015-02-05 2016-08-11 富士機械製造株式会社 Appareil de conversion de données et système de fabrication additive
WO2021019684A1 (fr) * 2019-07-30 2021-02-04 株式会社Ｆｕｊｉ Procédé de fabrication de composants d'empilement
JP2022080062A (ja) * 2020-11-17 2022-05-27 株式会社Fuji 検出データ記憶装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016125275A1 (fr) * 2015-02-05 2016-08-11 富士機械製造株式会社 Appareil de conversion de données et système de fabrication additive
WO2021019684A1 (fr) * 2019-07-30 2021-02-04 株式会社Ｆｕｊｉ Procédé de fabrication de composants d'empilement
JP2022080062A (ja) * 2020-11-17 2022-05-27 株式会社Fuji 検出データ記憶装置

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