WO2024012323A1 - Adhesive coating apparatus - Google Patents
Adhesive coating apparatus Download PDFInfo
- Publication number
- WO2024012323A1 WO2024012323A1 PCT/CN2023/105868 CN2023105868W WO2024012323A1 WO 2024012323 A1 WO2024012323 A1 WO 2024012323A1 CN 2023105868 W CN2023105868 W CN 2023105868W WO 2024012323 A1 WO2024012323 A1 WO 2024012323A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- driving member
- plasma cleaning
- product
- glue
- coating
- Prior art date
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 123
- 239000011248 coating agent Substances 0.000 title claims abstract description 121
- 239000000853 adhesive Substances 0.000 title abstract 10
- 230000001070 adhesive effect Effects 0.000 title abstract 10
- 238000004140 cleaning Methods 0.000 claims abstract description 98
- 239000003292 glue Substances 0.000 claims description 92
- 238000010438 heat treatment Methods 0.000 claims description 32
- 238000001179 sorption measurement Methods 0.000 claims description 23
- 238000004026 adhesive bonding Methods 0.000 claims description 20
- 230000005540 biological transmission Effects 0.000 claims description 10
- 238000001914 filtration Methods 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 2
- 230000032258 transport Effects 0.000 claims description 2
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 23
- 238000010586 diagram Methods 0.000 description 21
- 230000008569 process Effects 0.000 description 20
- 239000000428 dust Substances 0.000 description 13
- 238000005086 pumping Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000000356 contaminant Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000033764 rhythmic process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/10—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed before the application
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
Definitions
- the present application relates to the technical field of gluing, and in particular to a gluing equipment.
- the molding technology or dispensing process is used to integrally seal the surface of display panel substrates such as Mini-LED (semiconductor display device) direct display and backlight.
- Mini-LED semiconductor display device
- Multiple luminescent chips are installed on the substrate, and then glue is applied to the surface of the substrate to fix the multiple luminescent chips.
- the main technical problem solved by this application is to provide a glue coating device to solve the problem that the glue coating device in the prior art cannot reliably solve pits and bubbles.
- a glue coating equipment which includes: a plasma cleaning device, the plasma cleaning device includes a first mounting platform and a plasma cleaning head, the first mounting platform It is used to place the product to be glued, and the plasma cleaning head faces the product to be glued, and is used to clean the product and make the plasma adhere to the surface of the product; a coating device, the coating device is used to clean the cleaned product.
- the product to be glued is coated with glue.
- the plasma cleaning device further includes a first driving member, the moving end of the first driving member is connected to the first mounting table or the plasma cleaning head, and drives the first mounting table or the plasma cleaning head. Movement in the first direction.
- the plasma cleaning device further includes: a first driving member, the first driving member is used to drive the second driving member to move in the first direction; a second driving member, the second driving member is configured to Placed at the moving end of the first driving member, the moving end of the second driving member is connected to the first mounting platform, and the second driving member drives the first mounting platform along the second direction or the third direction. sports.
- the first mounting platform includes a first mounting plate and a first adsorption plate.
- the first adsorption plate is disposed on a side of the first mounting plate close to the plasma cleaning head and is used to adsorb and fix the to-be-processed plate. Glue coated products.
- the first mounting plate is provided with a plurality of through holes.
- the plasma cleaning device includes a first workbench and a first frame, the first frame is disposed on the first workbench, and the plasma cleaning head is disposed on the first frame.
- the first frame includes a first support column, a second support column and a first connection part, and the first support column and the second support column are arranged on the first workbench close to the plasma cleaning
- the first connection part connects the first support column and the second support column, and the plasma cleaning head is arranged on the first connection part.
- the gluing equipment further includes a first air filter chamber, and the plasma cleaning device is arranged in the first air filter chamber.
- the first air filter chamber also includes a first filter screen and a first exhaust hole; the first filter screen and the first exhaust hole are both arranged at the bottom of the first air filter chamber. .
- the coating device includes: a second mounting platform, the second mounting platform is used to mount the product to be glued; a coating die, the coating die faces the second mounting platform; a heating device , the heating device faces the second mounting platform and is used to heat the glue sprayed from the coating die.
- the coating device further includes: a third driving member, the third driving member is used to drive the fourth driving member to move in the first direction; a fourth driving member, the fourth driving member is disposed on the first The moving ends of the three driving members, the moving end of the fourth driving member are connected to the second mounting platform, and the fourth driving member drives the second mounting platform to move along the second direction or the third direction.
- the second mounting platform includes a second mounting plate and a second mounting plate disposed on the second mounting plate.
- a second adsorption plate a second heating element is provided on one side of the second adsorption plate close to the second installation plate, and the product to be glued is adsorbed and fixed on the second adsorption plate.
- a second heat insulation plate is provided between the second mounting plate and the second heating element.
- the glue coating equipment further includes a vacuum chamber, and the coating device is arranged in the vacuum chamber.
- the gluing equipment further includes a transmission device, which transports the products to be glued after processing by the plasma cleaning device to the second placement stage of the coating device.
- the glue coating equipment further includes a second air filtration chamber, and the plasma cleaning device, the transmission device and the coating device are all arranged in the second air filtration chamber.
- the second air filter chamber includes: an air intake assembly and an exhaust assembly, the air intake assembly is disposed on a side wall of the second air filter chamber, and the exhaust assembly is disposed on the second air filter chamber.
- the air intake component has a built-in air filter element.
- the coating device further includes a second workbench and a second frame, the second frame is disposed on the second workbench, and the coating die and the heating device are respectively disposed on the second workbench.
- the heating device and the coating die are arranged side by side, and both face the product to be coated.
- the second frame includes a third support column, a fourth support column and a second connection part; the third support column and the fourth support column are arranged on the second workbench close to the coating
- the second connection part connects the third support column and the fourth support column, and the coating die head and the heating device are arranged side by side on the second connection part.
- this application uses a plasma cleaning head to clean the product to be coated before applying glue to the product to be coated, thereby enhancing the roughness of the surface of the product to be coated This enhances the friction of the glue on the surface of the product. Make the friction force greater than the surface tension of the glue itself, thereby reducing the movement of the glue and reducing the number of pits and bubbles on the surface of the glue.
- Figure 1 is a cross-sectional view of the luminescent panel
- FIG. 2 is a schematic structural diagram of an embodiment of the gluing equipment provided by the present application.
- the gluing equipment includes a plasma cleaning device, a moving device and a coating device;
- Figure 3 is a schematic structural diagram of the mobile device in Figure 2;
- FIG 4 is a schematic structural diagram of an embodiment of the plasma cleaning device in Figure 2.
- the plasma cleaning device includes a first mounting table and a plasma cleaning head;
- Figure 5 is an exploded view of the plasma cleaning device in Figure 4.
- Figure 6 is a schematic structural diagram of the first mounting platform in Figure 4.
- Figure 7 is a schematic cross-sectional view of the first mounting platform in Figure 4.
- FIG 8 is a schematic structural diagram of another embodiment of the plasma cleaning device in Figure 2.
- the glue coating equipment also includes a first air filter chamber;
- Figure 9 is a schematic structural diagram of the first air filter chamber in Figure 8.
- Figure 10 is a schematic structural diagram of the first filter screen in Figure 9;
- Figure 11 is a schematic structural diagram of an embodiment of the coating device in Figure 2.
- the coating device includes a second mounting table, a coating die and a heating device;
- Figure 12 is an exploded view of the coating device in Figure 11;
- Figure 13 is a schematic structural diagram of the second mounting platform in Figure 11;
- Figure 14 is a schematic cross-sectional view of the second mounting platform in Figure 11;
- Figure 15 is a schematic structural diagram of another embodiment of the coating device in Figure 2.
- the glue coating equipment also includes a vacuum chamber;
- Figure 16 is a schematic structural diagram of the second air filter chamber in Figure 2;
- Fig. 17 is a schematic structural diagram of the second filter screen in Fig. 16.
- first”, “second” and “third” in the embodiments of this application are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, features defined as “first”, “second”, and “third” may explicitly or implicitly include at least one of these features.
- “plurality” means at least two, such as two, three, etc., unless otherwise clearly and specifically limited. All directional indications (such as up, down, left, right, front, back%) in the embodiments of this application are only used to explain the relative positional relationship between components in a specific posture (as shown in the drawings). , sports conditions, etc., if the specific posture changes, the directional indication will also change accordingly.
- an embodiment means that a particular feature, structure or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application.
- the appearances of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those skilled in the art understand, both explicitly and implicitly, that the embodiments described herein may be combined with other embodiments.
- FIG. 1 is a cross-sectional view of the light emitting panel 200 .
- a plurality of luminescent chips 220 are mounted on the display substrate 210 .
- glue is applied to the surface of the display substrate 210 to fix the plurality of luminescent chips 220 . Since there are bubbles in the glue coating 230 and defects such as point-like bumps and convexes on the glue surface formed by shrinkage under the surface tension of the glue, these defects will cause light reflection and refraction, affecting the display effect.
- the glue coating equipment 100 provided in this application is a glue coating equipment 100 that can solve the problems of pits and bubbles in the glue coating 230 during the coating process.
- FIG. 2 is the structure of an embodiment of the gluing equipment provided by this application.
- FIG. 4 is a schematic structural diagram of an embodiment of the plasma cleaning device in FIG. 2 .
- the present application provides a gluing equipment 100.
- the gluing equipment 100 includes a plasma cleaning device 110 and a coating device 130.
- the plasma cleaning device 110 includes a first mounting table 111 and a plasma cleaning head 112 .
- the product to be coated is placed on the first mounting platform 111, and then the surface of the product is cleaned by the plasma cleaning head 112 facing the first mounting platform 111, and the plasma is allowed to adhere to the surface of the product to increase the roughness of the surface of the product.
- glue is applied to the cleaned product to be glued through the coating device 130 .
- the plasma cleaning head 112 ionizes the air, and the ionized ions neutralize the dirt on the product surface and then remove it.
- the ionized plasma with a temperature of 50°C-120°C adheres to the surface of the product.
- the polarity of the plasma increases the surface roughness of the product and enhances the friction of the glue on the surface of the product.
- the friction force experienced by the glue on the surface of the product is greater than the surface tension of the glue, which improves the adhesion between the product and the glue coating 230 and prevents the glue from shrinking too fast to form pits and bubbles.
- the temperature of the plasma after ionization is controlled to be about 80°C.
- Plasma with a temperature of about 80° C. adheres to the surface of the product, and its effect of removing pits and bubbles in the glue coating 230 is more significant.
- the user can select the model of the plasma cleaning head 112 as needed.
- the plasma cleaning head 112 is selected based on: Among them, the diameter of the plasma cleaning head 112 is d, the moving speed of the product is v, the product length is l, the product width is w, the equipment production rhythm requirement is t, and the switching time of the plasma cleaning head 112 is t 0 (by the plasma cleaning head 112 The start-stop time interval and the moving speed of the first driving member 115 and the second driving member 116 are determined).
- the plasma cleaning device 110 includes a first driving member 115 .
- the moving end of the first driving member 115 is connected to the first mounting platform 111 .
- the first driving member 115 drives the first mounting table 111 to move in the first direction, and cooperates with the plasma cleaning head 112 to thoroughly clean the surface of the product to be coated.
- the first direction is the X-axis direction, as shown in Figure 4.
- the moving end of the first driving member 115 may also be connected to the plasma cleaning head 112 .
- the first driving member 115 drives the plasma cleaning head 112 to move in the first direction, so that the plasma cleaning head 112 is on the surface of the product to be coated Clean thoroughly.
- the plasma cleaning device 110 further includes a second driving member 116 , and the moving end of the second driving member 116 is connected to the first mounting platform 111 .
- the second driving member 116 drives the first mounting table 111 to move in the second direction, and cooperates with the plasma cleaning head 112 to thoroughly clean the surface of the product to be glued.
- the second direction is the Y-axis direction, which is perpendicular to the X-axis direction, as shown in Figure 4.
- the second driving member 116 can also drive the first mounting table 111 to move in the third direction, and cooperate with the plasma cleaning head 112 to thoroughly clean the surface of the product to be coated.
- the third direction is the Z-axis direction, which is perpendicular to the X-axis and Y-axis directions, as shown in Figure 4.
- the plasma cleaning device 110 may be installed with the first driving member 115 and the second driving member 116 at the same time.
- Figure 5 is an exploded view of the plasma cleaning device in Figure 4.
- the second driving member 116 is disposed at the moving end of the first driving member 115 , and the moving end of the second driving member 116 is connected to the first mounting platform 111 .
- the first driving member 115 drives the second driving member 116 to move along the first direction. That is, the first driving member 115 can indirectly drive the first mounting table 111 to move in the X-axis direction, as shown in FIG.
- the second driving member 116 drives the first mounting table 111 to move in the second direction. That is, the second driving member 116 can drive the first mounting table 111 to move in the Y-axis direction, thereby ensuring that the spray range of the plasma cleaning head 112 can cover the target area. Glue all parts across the width of the product.
- the plasma cleaning head 112 can clean every part of the product surface.
- the plasma cleaning device 110 includes but is not limited to a first workbench 117 and a first frame 118 .
- the first frame 118 is disposed on the first workbench 117
- the plasma cleaning head 112 is disposed on the first frame 118 .
- the first frame 118 includes but is not limited to a first support column 1181 , a second support column 1182 and a first connection part 1183 .
- the first support column 1181 and the second support column 1182 are provided on a side of the first workbench 117 close to the plasma cleaning head 112 , and the first connection portion 1183
- the first support column 1181 and the second support column 1182 are connected.
- the plasma cleaning head 112 is disposed on the first connection part 1183 and faces the product to be glued.
- FIG. 6 is a schematic structural view of the first mounting platform in FIG. 4 ;
- FIG. 7 is a schematic cross-sectional view of the first mounting platform in FIG. 4 .
- the first mounting platform 111 includes but is not limited to a first mounting plate 1111 and a first adsorption plate 1112 .
- the first adsorption plate 1112 is disposed on a side of the first mounting plate 1111 close to the plasma cleaning head 112 .
- the first adsorption plate 1112 can select an adsorption plate corresponding to the model of the product to be glued. During the cleaning process, the product to be glued is adsorbed and fixed on the first adsorption plate 1112 .
- the first mounting platform 111 may only include the first mounting plate 1111 . During the cleaning process, the product to be glued is directly placed on the first mounting plate 1111.
- the first mounting plate 1111 is provided with several through holes.
- the product to be glued is adsorbed and fixed on the first adsorption plate 1112, and a number of through holes opened on the first mounting plate 1111 can facilitate dust removal, thereby reducing the occurrence of pits and bubbles in the glue coating 230. question.
- the through hole direction is the Z-axis direction, as shown in Figure 4.
- FIG. 8 is a schematic structural diagram of another embodiment of the plasma cleaning device in FIG. 2 .
- the gluing equipment 100 includes, but is not limited to, the first air filter chamber 120 .
- the plasma cleaning device 110 is disposed in the first air filter chamber 120 . Because the plasma cleaning head 112 will produce impurities when cleaning the product surface, this embodiment is provided with a first air filter chamber 120.
- the plasma cleaning devices 110 are installed in the first air filter chamber 120 so that they are physically separated from other parts. open to prevent them from interfering with each other.
- the user can select the model of the first air filter chamber 120 as needed.
- Figure 9 is a schematic structural diagram of the first air filter chamber in Figure 8.
- Fig. 10 is a schematic structural diagram of the first filter screen in Fig. 9.
- the first air filter chamber 120 includes but is not limited to a first filter 121 and a first exhaust hole 122 .
- the first filter 121 and the first exhaust hole 122 are both disposed at the bottom of the first air filter chamber 120 .
- the first filter 121 is used to absorb impurities and adsorb dust pollutants inside the first air filter chamber 120 .
- the first filter 121 is used to absorb dust inside the first air filter chamber 120 to ensure the cleanliness inside the first air filter chamber 120 and prevent dust from being mixed in the glue coating 230 during the subsequent glue coating process. and further causes the glue coating 230 to form pits and bubbles.
- At least one side wall of the first air filter chamber 120 can be opened for placing the product to be glued into the plasma cleaning device 110 or taking out the product to be glued after cleaning.
- the coating device 130 includes, but is not limited to, a second mounting table 131 , a coating die 132 and a heating device 139 .
- the heating device 139 and the coating die 132 both face the second mounting table 131 .
- the product to be glued is placed on the second placing platform 131 .
- the coating die 132 applies glue to the product to be coated, and then heats the product to be coated through the heating device 139 to reduce the surface tension of the glue so that the friction force experienced by the glue on the product surface is greater than the surface tension of the glue to prevent the glue from shrinking Pits and bubbles are formed too quickly, and the curing efficiency of the glue coating 230 on the product to be glued is also accelerated.
- the heating device 139 may be assembled from multiple heating rods, or the heating device 139 may be an infrared heating lamp, which is not specifically limited here.
- the coating device 130 includes, but is not limited to, a third driving member 135 and a fourth driving member 136 .
- the fourth driving member 136 is disposed at the moving end of the third driving member 135 , and the moving end of the fourth driving member 136 is connected to the second mounting platform 131 .
- the third driving member 135 drives the fourth driving member 136 to move along the first direction.
- the third driving member 135 indirectly drives the second mounting platform 131 to move in the X-axis direction, thereby ensuring that the spray range of the glue outlet of the coating die 132 can cover all parts in the length direction of the product to be glued.
- the glue coating width of the coating die 132 is wider, that is, the glue coating width of the coating die 132 Larger than the width of the product to be glued.
- the fourth driving member 136 drives the second mounting platform 131 to move in the second direction, that is, the fourth driving member 136 drives the second mounting platform 131 to move in the Y-axis direction, thereby adjusting The relative position of the product to be coated and the coating die 132.
- the fourth driving member 136 can also drive the second mounting platform 131 to move in the third direction. That is, the fourth driving member 136 drives the second mounting platform 131 to move in the Z-axis direction, thereby adjusting the vertical positional relationship between the product to be coated and the coating die 132 .
- the coating device 130 also includes, but is not limited to, a second workbench 137 and a second frame 138 .
- the second frame 138 is disposed on the second workbench 137
- the coating die 132 and the heating device 139 are respectively disposed on the opposite side walls of the second frame 138, and the heating device 139 It is arranged side by side with the coating die 132 .
- the second frame 138 includes, but is not limited to, a third support column 1381 , a fourth support column 1382 and a second connection part 1383 .
- the third support column 1381 and the fourth support column 1382 are disposed on a side of the second workbench 137 close to the coating die 132, and the second connection portion 1383 connects the The third support column 1381 and the fourth support column 1382, the coating die 132 and the heating device 139 are arranged side by side on the second connection part 1383 and face the product to be glued.
- Figure 13 is a schematic structural diagram of the second placement platform in Figure 11;
- Figure 14 is a schematic cross-sectional view of the second placement platform in Figure 11.
- the second mounting platform 131 includes, but is not limited to, a second mounting plate 1311 and a second adsorption plate 1312 .
- the second adsorption plate 1312 is disposed on a side of the second mounting plate 1311 close to the coating die 132 .
- a second heating element 1313 is provided on a side of the second adsorption plate 1312 close to the second mounting plate 1311 .
- the second adsorption plate 1312 can select the adsorption plate of the corresponding model according to the model of the product to be glued.
- the product to be glued is adsorbed and fixed on the second adsorption plate 1312.
- the third driving member 135 drives the second mounting platform 131 to move along the first direction and cooperates with the coating die 132 to apply the glue in the coating die 132 on the product.
- the second heating element 1313 begins to heat the product fixed on the second adsorption plate 1312 to reduce the surface tension of the glue.
- the friction force experienced by the glue on the surface of the product is greater than the surface tension of the glue, preventing the glue from shrinking too fast to form pits and bubbles, and at the same time speeding up the curing efficiency of the glue coating 230 on the product surface.
- the second heating element 1313 and the heating device 139 are started at the same time to heat the product from both front and back sides of the product.
- a second heat insulation plate 1314 is provided between the second mounting plate 1311 and the second heating element 1313 .
- the second heat insulation plate 1314 is used to prevent the second heating element 1313 from conducting heat to the second workbench 137, thereby preventing burns to people.
- the second mounting platform 131 may only include a second mounting plate 1311. During the gluing process, the product to be glued is directly placed on the second mounting plate 1311.
- the gluing equipment 100 also includes, but is not limited to, a vacuum chamber 140 .
- the coating device 130 is disposed in the vacuum chamber 140 .
- the vacuum chamber 140 Before applying glue to the product to be glued, the vacuum chamber 140 needs to be evacuated to facilitate the elimination of bubbles in the glue coating 230 .
- the vacuum formation may be formed by a negative pressure driving member, and the negative pressure driving member may use a vacuum pump.
- the product needs to be allowed to stand for the glue to solidify. Since the product is placed in the vacuum chamber 140, when there are bubbles in the glue, the bubbles will float up.
- one side of the vacuum chamber 140 can be opened for putting the product to be glued into or taking out the glued product.
- the second heating element 1313 and the heating device 139 heat the product from both front and back sides of the product at the same time, which can speed up the floating speed of bubbles in the glue coating 230 .
- This application provides a glue coating equipment 100 that also includes a transmission device 150.
- the plasma cleaning device 110 and the coating device 130 are respectively disposed on opposite sides of the transmission device 150 .
- the plasma cleaning device 110 cleans the surface of the product to be coated through the plasma cleaning head 112 and causes the plasma to adhere to the product surface;
- the transmission device 150 takes out the cleaned product to be coated and puts it into the coating In the device 130;
- the coating device 130 passes
- the over-coating die 132 applies glue to the surface of the product to be glued.
- the transmission device 150 may be a transplanting arm. Please refer to Figure 3, which is a schematic structural diagram of the mobile device in Figure 2.
- the transplanting arm has a rotatable support column 151 and a support plate 152 on the support column 151 . After the cleaned products are placed on the support plate 152 , the products on the support plate 152 are brought close to the coating device 130 by rotating the support plate 151 .
- the transmission device 150 may also be a robotic arm, a conveyor belt, etc., which is not specifically limited here.
- the gluing equipment 100 further includes a second air filter chamber 160 .
- the plasma cleaning device 110 , the transmission device 150 and the coating device 130 are all disposed in the second air filter chamber 160 .
- Figure 16 is a schematic structural view of the second air filter chamber in Figure 2
- Figure 17 is a schematic structural view of the second filter screen in Figure 16.
- the second air filter chamber 160 includes, but is not limited to, an air intake assembly 161 and an exhaust assembly 162 .
- the air inlet assembly 161 is disposed on the side wall of the second air filter chamber 160
- the exhaust assembly 162 is disposed on the bottom of the second air filter chamber 160 .
- the air inlet assembly 161 has a built-in air filter element to ensure that the air entering the second air filter chamber 160 is clean (does not contain dust, foreign matter, etc.); the second air filter element in the exhaust assembly 162
- the filter 1622 absorbs dust pollutants inside the second air filter chamber 160, and the gas is discharged from the second exhaust hole 1621. This prevents dust contaminants from entering the glue coating 230 and reduces pits and bubbles generated on the surface of the glue coating 230 .
- the first air filter chamber 120 and the second air filter chamber 160 may share a filter screen and an exhaust hole.
- the user can select the model of the second air filter chamber 160 as needed.
- This application uses the coating device 130 before applying glue to the product to be glued.
- the plasma cleaning head 112 cleans the product to be glued, which increases the roughness of the surface of the product to be glued and enhances the friction of the glue on the surface of the product. Make the friction force greater than the surface tension of the glue itself, thereby reducing the movement of the glue and reducing the number of pits and bubbles on the surface of the glue.
Landscapes
- Coating Apparatus (AREA)
Abstract
An adhesive coating apparatus (100). The adhesive coating apparatus (100) comprises a plasma cleaning device (110) and a coating device (130). The plasma cleaning device (110) comprises a first placement table (111) and a plasma cleaning head (112), wherein the first placement table (111) is used for having a product to be coated with adhesive placed thereon, and the plasma cleaning head (112) faces said product and is used for cleaning the product and makes plasma adhere to the surface of the product. The coating device (130) is used for coating a cleaned said product with an adhesive. By using the plasma cleaning head to clean the product to be coated with adhesive, the roughness of the surface of said product is enhanced, and the friction force of the adhesive on the surface of the product is enhanced, such that the friction force is greater than the surface tension of the adhesive itself, thereby reducing the movement of the adhesive, and the number of pits and bubbles generated on the surface of the adhesive is thus decreased.
Description
本申请涉及涂胶技术领域,特别是涉及一种涂胶设备。The present application relates to the technical field of gluing, and in particular to a gluing equipment.
现有的新型显示屏幕行业,在Mini-LED(半导体显示器件)直显、背光等显示面板基板的表面整体封胶采用的模压成型技术或者点胶工艺。基板上安装有多个发光晶粒,然后将胶水涂敷于基板的表面,将多个发光晶粒固定。In the existing new display screen industry, the molding technology or dispensing process is used to integrally seal the surface of display panel substrates such as Mini-LED (semiconductor display device) direct display and backlight. Multiple luminescent chips are installed on the substrate, and then glue is applied to the surface of the substrate to fix the multiple luminescent chips.
然而,由于胶水里面有气泡、粉尘等杂质,因此,在胶水固化的过程中,在胶水表面张力作用下极易收缩形成的胶面点状凹凸的缺陷。这些缺陷会造成光线反射和折射现象,影响显示效果。However, because there are impurities such as bubbles and dust in the glue, during the curing process of the glue, it is easy to shrink and form point-like uneven defects on the glue surface under the action of the surface tension of the glue. These defects will cause light reflection and refraction, affecting the display effect.
发明内容Contents of the invention
本申请主要解决的技术问题是提供一种涂胶设备,以解决现有技术中涂胶装置无法可靠解决凹坑和气泡的问题。The main technical problem solved by this application is to provide a glue coating device to solve the problem that the glue coating device in the prior art cannot reliably solve pits and bubbles.
为解决上述技术问题,本申请采用的一个技术方案是:提供一种涂胶设备,其包括:等离子清洗装置,所述等离子清洗装置包括第一载置台及等离子清洗头,所述第一载置台用于载置待涂胶产品,所述等离子清洗头面向所述待涂胶产品,用于清洗产品并使等离子体附着于产品表面;涂布装置,所述涂布装置用于对清洗后的待涂胶产品进行涂敷胶水。In order to solve the above technical problems, one technical solution adopted by this application is to provide a glue coating equipment, which includes: a plasma cleaning device, the plasma cleaning device includes a first mounting platform and a plasma cleaning head, the first mounting platform It is used to place the product to be glued, and the plasma cleaning head faces the product to be glued, and is used to clean the product and make the plasma adhere to the surface of the product; a coating device, the coating device is used to clean the cleaned product. The product to be glued is coated with glue.
其中,所述等离子清洗装置还包括第一驱动件,所述第一驱动件的移动端连接所述第一载置台或所述等离子清洗头,驱动所述第一载置台或所述等离子清洗头沿第一方向运动。Wherein, the plasma cleaning device further includes a first driving member, the moving end of the first driving member is connected to the first mounting table or the plasma cleaning head, and drives the first mounting table or the plasma cleaning head. Movement in the first direction.
其中,所述等离子清洗装置还包括:第一驱动件,所述第一驱动件用于驱动第二驱动件沿第一方向运动;第二驱动件,所述第二驱动件设
置于所述第一驱动件的移动端,所述第二驱动件的移动端连接所述第一载置台,所述第二驱动件驱动所述第一载置台沿第二方向或者第三方向运动。Wherein, the plasma cleaning device further includes: a first driving member, the first driving member is used to drive the second driving member to move in the first direction; a second driving member, the second driving member is configured to Placed at the moving end of the first driving member, the moving end of the second driving member is connected to the first mounting platform, and the second driving member drives the first mounting platform along the second direction or the third direction. sports.
其中,所述第一载置台包括第一安装板和第一吸附板,所述第一吸附板设置于所述第一安装板靠近所述等离子清洗头的一侧,用于吸附固定所述待涂胶产品。Wherein, the first mounting platform includes a first mounting plate and a first adsorption plate. The first adsorption plate is disposed on a side of the first mounting plate close to the plasma cleaning head and is used to adsorb and fix the to-be-processed plate. Glue coated products.
其中,所述第一安装板上开设有多个通孔。Wherein, the first mounting plate is provided with a plurality of through holes.
其中,所述等离子清洗装置包括第一工作台和第一机架,所述第一机架设置于所述第一工作台上,所述等离子清洗头设置在所述第一机架上。Wherein, the plasma cleaning device includes a first workbench and a first frame, the first frame is disposed on the first workbench, and the plasma cleaning head is disposed on the first frame.
其中,所述第一机架包括第一支撑柱、第二支撑柱及第一连接部,所述第一支撑柱和所述第二支撑柱设置在所述第一工作台靠近所述等离子清洗头的一侧,所述第一连接部连接所述第一支撑柱和所述第二支撑柱,所述等离子清洗头设置于所述第一连接部。Wherein, the first frame includes a first support column, a second support column and a first connection part, and the first support column and the second support column are arranged on the first workbench close to the plasma cleaning On one side of the head, the first connection part connects the first support column and the second support column, and the plasma cleaning head is arranged on the first connection part.
其中,所述涂胶设备还包括第一空气过滤腔室,所述等离子清洗装置设置在所述第一空气过滤腔室内。Wherein, the gluing equipment further includes a first air filter chamber, and the plasma cleaning device is arranged in the first air filter chamber.
其中,所述第一空气过滤腔室内还包括第一过滤网及第一排气孔;所述第一过滤网和所述第一排气孔均设置在所述第一空气过滤腔室的底部。Wherein, the first air filter chamber also includes a first filter screen and a first exhaust hole; the first filter screen and the first exhaust hole are both arranged at the bottom of the first air filter chamber. .
其中,所述涂布装置包括:第二载置台,所述第二载置台用于载置待涂胶产品;涂布模头,所述涂布模头面向所述第二载置台;加热装置,所述加热装置面向所述第二载置台,用于对涂布模头喷出的胶水进行加热。Wherein, the coating device includes: a second mounting platform, the second mounting platform is used to mount the product to be glued; a coating die, the coating die faces the second mounting platform; a heating device , the heating device faces the second mounting platform and is used to heat the glue sprayed from the coating die.
其中,所述涂布装置还包括:第三驱动件,所述第三驱动件用于驱动第四驱动件沿第一方向运动;第四驱动件,所述第四驱动件设置于所述第三驱动件的移动端,所述第四驱动件的移动端连接所述第二载置台,所述第四驱动件驱动所述第二载置台沿着所述第二方向或者第三方向运动。Wherein, the coating device further includes: a third driving member, the third driving member is used to drive the fourth driving member to move in the first direction; a fourth driving member, the fourth driving member is disposed on the first The moving ends of the three driving members, the moving end of the fourth driving member are connected to the second mounting platform, and the fourth driving member drives the second mounting platform to move along the second direction or the third direction.
其中,所述第二载置台包括第二安装板及设置在所述第二安装板上
的第二吸附板;所述第二吸附板靠近所述第二安装板的一侧设有第二加热件,所述待涂胶产品吸附固定在所述第二吸附板上。Wherein, the second mounting platform includes a second mounting plate and a second mounting plate disposed on the second mounting plate. a second adsorption plate; a second heating element is provided on one side of the second adsorption plate close to the second installation plate, and the product to be glued is adsorbed and fixed on the second adsorption plate.
其中,所述第二安装板与所述第二加热件之间设置有第二隔热板。Wherein, a second heat insulation plate is provided between the second mounting plate and the second heating element.
其中,所述涂胶设备还包括真空腔室,所述涂布装置设置在所述真空腔室内。Wherein, the glue coating equipment further includes a vacuum chamber, and the coating device is arranged in the vacuum chamber.
其中,所述涂胶设备还包括传输装置,所述传输装置将所述等离子清洗装置处理后的待涂胶产品运至所述涂布装置的第二载置台。Wherein, the gluing equipment further includes a transmission device, which transports the products to be glued after processing by the plasma cleaning device to the second placement stage of the coating device.
其中,所述涂胶设备还包括第二空气过滤腔室,所述等离子清洗装置、所述传输装置及所述涂布装置均设置在所述第二空气过滤腔室内。Wherein, the glue coating equipment further includes a second air filtration chamber, and the plasma cleaning device, the transmission device and the coating device are all arranged in the second air filtration chamber.
其中,所述第二空气过滤腔室包括:进气组件和排气组件,所述进气组件设置于所述第二空气过滤腔室的侧壁,所述排气组件设置于所述第二空气过滤腔室的底部;其中,所述排气组件包括第二排气孔和第二过滤网。Wherein, the second air filter chamber includes: an air intake assembly and an exhaust assembly, the air intake assembly is disposed on a side wall of the second air filter chamber, and the exhaust assembly is disposed on the second air filter chamber. The bottom of the air filter chamber; wherein the exhaust assembly includes a second exhaust hole and a second filter.
其中,所述进气组件内置有空气滤芯。Wherein, the air intake component has a built-in air filter element.
其中,所述涂布装置还包括第二工作台和第二机架,所述第二机架设置于所述第二工作台上,所述涂布模头和所述加热装置分别设置在所述第二机架的相对两侧壁上,且所述加热装置与所述涂布模头并排设置,且均面向所述待涂胶产品。Wherein, the coating device further includes a second workbench and a second frame, the second frame is disposed on the second workbench, and the coating die and the heating device are respectively disposed on the second workbench. On the opposite side walls of the second frame, the heating device and the coating die are arranged side by side, and both face the product to be coated.
其中,所述第二机架包括第三支撑柱、第四支撑柱及第二连接部;所述第三支撑柱和所述第四支撑柱设置在所述第二工作台靠近所述涂布模头的一侧,所述第二连接部连接所述第三支撑柱和所述第四支撑柱,所述涂布模头和所述加热装置并排设置于所述第二连接部。Wherein, the second frame includes a third support column, a fourth support column and a second connection part; the third support column and the fourth support column are arranged on the second workbench close to the coating On one side of the die head, the second connection part connects the third support column and the fourth support column, and the coating die head and the heating device are arranged side by side on the second connection part.
本申请的有益效果是:区别于现有技术,本申请通过在涂布装置对待涂胶产品进行涂敷胶水之前,使用等离子清洗头对待涂胶产品进行清洗,增强了待涂胶产品表面的粗糙度,增强了胶水在产品表面的摩擦力。使该摩擦力大于胶水本身的表面张力,从而减少胶水移动,降低胶水表面产生凹坑和气泡的数量。The beneficial effects of this application are: different from the existing technology, this application uses a plasma cleaning head to clean the product to be coated before applying glue to the product to be coated, thereby enhancing the roughness of the surface of the product to be coated This enhances the friction of the glue on the surface of the product. Make the friction force greater than the surface tension of the glue itself, thereby reducing the movement of the glue and reducing the number of pits and bubbles on the surface of the glue.
为了更清楚地说明本申请实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without exerting creative efforts.
图1是发光板的截面图;Figure 1 is a cross-sectional view of the luminescent panel;
图2是本申请提供的涂胶设备一实施例的结构示意图,所述涂胶设备包括等离子清洗装置、移动装置以及涂布装置;Figure 2 is a schematic structural diagram of an embodiment of the gluing equipment provided by the present application. The gluing equipment includes a plasma cleaning device, a moving device and a coating device;
图3是图2中移动装置的结构示意图;Figure 3 is a schematic structural diagram of the mobile device in Figure 2;
图4是图2中等离子清洗装置一实施例的结构示意图,所述等离子清洗装置包括第一载置台和等离子清洗头;Figure 4 is a schematic structural diagram of an embodiment of the plasma cleaning device in Figure 2. The plasma cleaning device includes a first mounting table and a plasma cleaning head;
图5是图4中等离子清洗装置的爆炸图;Figure 5 is an exploded view of the plasma cleaning device in Figure 4;
图6是图4中第一载置台的结构示意图;Figure 6 is a schematic structural diagram of the first mounting platform in Figure 4;
图7是图4中第一载置台的截面示意图;Figure 7 is a schematic cross-sectional view of the first mounting platform in Figure 4;
图8是图2中等离子清洗装置另一实施例的结构示意图,所述涂胶设备还包括第一空气过滤腔室;Figure 8 is a schematic structural diagram of another embodiment of the plasma cleaning device in Figure 2. The glue coating equipment also includes a first air filter chamber;
图9是图8中第一空气过滤腔室的结构示意图;Figure 9 is a schematic structural diagram of the first air filter chamber in Figure 8;
图10是图9中第一过滤网的结构示意图;Figure 10 is a schematic structural diagram of the first filter screen in Figure 9;
图11是图2中涂布装置一实施例的结构示意图,所述涂布装置包括第二载置台、涂布模头以及加热装置;Figure 11 is a schematic structural diagram of an embodiment of the coating device in Figure 2. The coating device includes a second mounting table, a coating die and a heating device;
图12是图11中涂布装置的爆炸图;Figure 12 is an exploded view of the coating device in Figure 11;
图13是图11中第二载置台的结构示意图;Figure 13 is a schematic structural diagram of the second mounting platform in Figure 11;
图14是图11中第二载置台的截面示意图;Figure 14 is a schematic cross-sectional view of the second mounting platform in Figure 11;
图15是图2中涂布装置另一实施例的结构示意图,所述涂胶设备还包括真空腔室;Figure 15 is a schematic structural diagram of another embodiment of the coating device in Figure 2. The glue coating equipment also includes a vacuum chamber;
图16是图2中第二空气过滤腔室的结构示意图;Figure 16 is a schematic structural diagram of the second air filter chamber in Figure 2;
图17是图16中第二过滤网的结构示意图。Fig. 17 is a schematic structural diagram of the second filter screen in Fig. 16.
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案
进行清楚、完整地描述,显然,所描述的实施例仅是本申请的一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. To describe clearly and completely, it is obvious that the described embodiments are only some, not all, of the embodiments of the present application. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.
本申请实施例中的术语“第一”、“第二”、“第三”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”、“第三”的特征可以明示或者隐含地包括至少一个该特征。本申请的描述中,“多个”的含义是至少两个,例如两个,三个等,除非另有明确具体的限定。本申请实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等,如果该特定姿态发生改变时,则该方向性指示也相应地随之改变。本申请实施例中的术语“包括”和“具有”以及它们任何变形,意图在于覆盖不排他的包含。例如包含了一系列步骤或单元的过程、方法、系统、产品或设备没有限定于已列出的步骤或单元,而是可选地还包括没有列出的步骤或单元,或可选地还包括对于这些过程、方法、产品或设备固有的其他步骤或组件。The terms “first”, “second” and “third” in the embodiments of this application are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, features defined as "first", "second", and "third" may explicitly or implicitly include at least one of these features. In the description of this application, "plurality" means at least two, such as two, three, etc., unless otherwise clearly and specifically limited. All directional indications (such as up, down, left, right, front, back...) in the embodiments of this application are only used to explain the relative positional relationship between components in a specific posture (as shown in the drawings). , sports conditions, etc., if the specific posture changes, the directional indication will also change accordingly. The terms "including" and "having" and any variations thereof in the embodiments of this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes Other steps or components inherent to such processes, methods, products or devices.
在本文中提及“实施例”意味着,结合实施例描述的特定特征、结构或特性可以包含在本申请的至少一个实施例中。在说明书中的各个位置出现该短语并不一定均是指相同的实施例,也不是与其他实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是,本文所描述的实施例可以与其他实施例相结合。Reference herein to "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The appearances of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those skilled in the art understand, both explicitly and implicitly, that the embodiments described herein may be combined with other embodiments.
请参阅图1,图1是发光板200的截面图。显示基板210上安装有多个发光晶粒220,然后,将胶水涂敷于显示基板210的表面,将多个发光晶粒220固定。由于胶水涂层230里面有气泡以及在胶水表面张力作用下收缩形成的胶面点状凹凸的缺陷,该缺陷会造成光线反射和折射现象,影响显示效果。本申请提供的涂胶设备100是一款能够解决涂敷过程中胶水涂层230存在凹坑和气泡等问题的涂胶设备100。Please refer to FIG. 1 , which is a cross-sectional view of the light emitting panel 200 . A plurality of luminescent chips 220 are mounted on the display substrate 210 . Then, glue is applied to the surface of the display substrate 210 to fix the plurality of luminescent chips 220 . Since there are bubbles in the glue coating 230 and defects such as point-like bumps and convexes on the glue surface formed by shrinkage under the surface tension of the glue, these defects will cause light reflection and refraction, affecting the display effect. The glue coating equipment 100 provided in this application is a glue coating equipment 100 that can solve the problems of pits and bubbles in the glue coating 230 during the coating process.
请参阅图2和图4,图2是本申请提供的涂胶设备一实施例的结构
示意图。图4是图2中等离子清洗装置一实施例的结构示意图。本申请提供一种涂胶设备100,在一个实施例中,该涂胶设备100包括等离子清洗装置110和涂布装置130。其中,等离子清洗装置110包括第一载置台111及等离子清洗头112。待涂胶产品放置于第一载置台111上,然后通过面向第一载置台111的等离子清洗头112对其产品表面进行清洗,并使等离子体附着于产品表面,增加产品表面的粗糙度。然后通过涂布装置130对清洗后的待涂胶产品进行涂敷胶水。Please refer to Figures 2 and 4. Figure 2 is the structure of an embodiment of the gluing equipment provided by this application. Schematic diagram. FIG. 4 is a schematic structural diagram of an embodiment of the plasma cleaning device in FIG. 2 . The present application provides a gluing equipment 100. In one embodiment, the gluing equipment 100 includes a plasma cleaning device 110 and a coating device 130. The plasma cleaning device 110 includes a first mounting table 111 and a plasma cleaning head 112 . The product to be coated is placed on the first mounting platform 111, and then the surface of the product is cleaned by the plasma cleaning head 112 facing the first mounting platform 111, and the plasma is allowed to adhere to the surface of the product to increase the roughness of the surface of the product. Then, glue is applied to the cleaned product to be glued through the coating device 130 .
在具体实施过程中,等离子清洗头112将空气电离,电离后的离子体与产品表面的脏污中和后将其去除。同时电离后温度在50℃-120℃的等离子体附着在产品表面,等离子体的极性增加了产品表面粗糙度,增强胶水在产品表面的摩擦力。使得胶水在产品表面所受的摩擦力大于胶水表面张力,提高了产品与胶水涂层230的附着力,防止胶水收缩过快形成凹坑和气泡。可选的,在等离子清洗头112将空气电离的过程中,控制电离后的等离子体温度在80℃左右。温度在80℃左右的等离子体附着在产品表面,其去除胶水涂层230中的凹坑和气泡的效果更加显著。During the specific implementation process, the plasma cleaning head 112 ionizes the air, and the ionized ions neutralize the dirt on the product surface and then remove it. At the same time, the ionized plasma with a temperature of 50℃-120℃ adheres to the surface of the product. The polarity of the plasma increases the surface roughness of the product and enhances the friction of the glue on the surface of the product. The friction force experienced by the glue on the surface of the product is greater than the surface tension of the glue, which improves the adhesion between the product and the glue coating 230 and prevents the glue from shrinking too fast to form pits and bubbles. Optionally, during the process of ionizing the air by the plasma cleaning head 112, the temperature of the plasma after ionization is controlled to be about 80°C. Plasma with a temperature of about 80° C. adheres to the surface of the product, and its effect of removing pits and bubbles in the glue coating 230 is more significant.
可选的,用户可根据需要选择等离子清洗头112的型号。在一个具体的实施例中,等离子清洗头112选型依据为:其中,等离子清洗头112直径为d,产品的移动速度为v,产品长度为l,产品宽度为w,设备生产节拍要求为t,等离子清洗头112的切换时间为t0(由等离子清洗头112启停时间间隔和第一驱动件115、第二驱动件116的移动速度来决定)。Optionally, the user can select the model of the plasma cleaning head 112 as needed. In a specific embodiment, the plasma cleaning head 112 is selected based on: Among them, the diameter of the plasma cleaning head 112 is d, the moving speed of the product is v, the product length is l, the product width is w, the equipment production rhythm requirement is t, and the switching time of the plasma cleaning head 112 is t 0 (by the plasma cleaning head 112 The start-stop time interval and the moving speed of the first driving member 115 and the second driving member 116 are determined).
具体地,所述等离子清洗装置110包括第一驱动件115。第一驱动件115的移动端连接所述第一载置台111。在清洗过程中,第一驱动件115驱动第一载置台111在第一方向上移动,配合所述等离子清洗头112对待涂胶产品的表面进行彻底的清洗。其中,第一方向为X轴方向,如图4所示。Specifically, the plasma cleaning device 110 includes a first driving member 115 . The moving end of the first driving member 115 is connected to the first mounting platform 111 . During the cleaning process, the first driving member 115 drives the first mounting table 111 to move in the first direction, and cooperates with the plasma cleaning head 112 to thoroughly clean the surface of the product to be coated. Among them, the first direction is the X-axis direction, as shown in Figure 4.
可选地,在其他实施例中,所述第一驱动件115的移动端还可以连接所述等离子清洗头112。在清洗过程中,第一驱动件115驱动等离子清洗头112在第一方向移动,使得等离子清洗头112对待涂胶产品表面
进行彻底清洗。Optionally, in other embodiments, the moving end of the first driving member 115 may also be connected to the plasma cleaning head 112 . During the cleaning process, the first driving member 115 drives the plasma cleaning head 112 to move in the first direction, so that the plasma cleaning head 112 is on the surface of the product to be coated Clean thoroughly.
具体的,等离子清洗装置110还包括第二驱动件116,所述第二驱动件116的移动端连接所述第一载置台111。在清洗过程中,第二驱动件116驱动第一载置台111在第二方向上移动,配合所述等离子清洗头112对待涂胶产品的表面进行彻底的清洗。其中,所述第二方向为Y轴方向,与X轴方向垂直,如图4所示。Specifically, the plasma cleaning device 110 further includes a second driving member 116 , and the moving end of the second driving member 116 is connected to the first mounting platform 111 . During the cleaning process, the second driving member 116 drives the first mounting table 111 to move in the second direction, and cooperates with the plasma cleaning head 112 to thoroughly clean the surface of the product to be glued. Wherein, the second direction is the Y-axis direction, which is perpendicular to the X-axis direction, as shown in Figure 4.
可选地,根据需要,在其他实施例中,第二驱动件116还可以驱动第一载置台111在第三方向上移动,配合所述等离子清洗头112对待涂胶产品的表面进行彻底的清洗。其中,所述第三方向为Z轴方向,垂直于X轴和Y轴方向,如图4所示。Optionally, as needed, in other embodiments, the second driving member 116 can also drive the first mounting table 111 to move in the third direction, and cooperate with the plasma cleaning head 112 to thoroughly clean the surface of the product to be coated. Wherein, the third direction is the Z-axis direction, which is perpendicular to the X-axis and Y-axis directions, as shown in Figure 4.
可选地,在其他实施例中,等离子清洗装置110可以同时安装有第一驱动件115和第二驱动件116。请参阅图5,图5是图4中等离子清洗装置的爆炸图。具体的,第二驱动件116设置于第一驱动件115的移动端,第二驱动件116的移动端连接第一载置台111。在清洗过程中,当待涂胶产品放置在第一载置台111后,第一驱动件115驱动第二驱动件116沿着第一方向运动。也即第一驱动件115可间接驱动第一载置台111在X轴方向运动,如图4所示,从而保证等离子清洗头112的喷射范围可以覆盖待涂胶产品长度方向上的所有部位。第二驱动件116驱动第一载置台111沿着第二方向运动,也即第二驱动件116可驱动第一载置台111在Y轴方向运动,从而保证等离子清洗头112的喷射范围可以覆盖待涂胶产品宽度方向上的所有部位。通过第一驱动件115和第二驱动件116的相互配合,能够使等离子清洗头112对产品表面的每一处进行清洗。Alternatively, in other embodiments, the plasma cleaning device 110 may be installed with the first driving member 115 and the second driving member 116 at the same time. Please refer to Figure 5, which is an exploded view of the plasma cleaning device in Figure 4. Specifically, the second driving member 116 is disposed at the moving end of the first driving member 115 , and the moving end of the second driving member 116 is connected to the first mounting platform 111 . During the cleaning process, after the product to be glued is placed on the first mounting table 111, the first driving member 115 drives the second driving member 116 to move along the first direction. That is, the first driving member 115 can indirectly drive the first mounting table 111 to move in the X-axis direction, as shown in FIG. 4 , thereby ensuring that the spray range of the plasma cleaning head 112 can cover all parts in the length direction of the product to be glued. The second driving member 116 drives the first mounting table 111 to move in the second direction. That is, the second driving member 116 can drive the first mounting table 111 to move in the Y-axis direction, thereby ensuring that the spray range of the plasma cleaning head 112 can cover the target area. Glue all parts across the width of the product. Through the mutual cooperation of the first driving member 115 and the second driving member 116, the plasma cleaning head 112 can clean every part of the product surface.
具体地,等离子清洗装置110包括但不限于第一工作台117和第一机架118。在本实施例中,第一机架118设置于所述第一工作台117上,等离子清洗头112设置在第一机架118上。在等离子清洗装置110中,第一机架118包括但不限于第一支撑柱1181、第二支撑柱1182以及第一连接部1183。所述第一支撑柱1181和第二支撑柱1182设置在所述第一工作台117靠近所述等离子清洗头112的一侧,所述第一连接部1183
连接所述第一支撑柱1181和第二支撑柱1182,所述等离子清洗头112设置于所述第一连接部1183,且面向所述待涂胶产品。Specifically, the plasma cleaning device 110 includes but is not limited to a first workbench 117 and a first frame 118 . In this embodiment, the first frame 118 is disposed on the first workbench 117 , and the plasma cleaning head 112 is disposed on the first frame 118 . In the plasma cleaning device 110 , the first frame 118 includes but is not limited to a first support column 1181 , a second support column 1182 and a first connection part 1183 . The first support column 1181 and the second support column 1182 are provided on a side of the first workbench 117 close to the plasma cleaning head 112 , and the first connection portion 1183 The first support column 1181 and the second support column 1182 are connected. The plasma cleaning head 112 is disposed on the first connection part 1183 and faces the product to be glued.
请参阅图6和图7,图6是图4中第一载置台的结构示意图;图7是图4中第一载置台的截面示意图。具体的,第一载置台111包括但不限于第一安装板1111和第一吸附板1112。其中,所述第一吸附板1112设置于所述第一安装板1111靠近所述等离子清洗头112的一侧。在等离子清洗装置110中,所述第一吸附板1112可以根据待涂胶产品的型号不同,选择对应型号的吸附板。在清洗过程中,所述待涂胶产品吸附固定在所述第一吸附板1112上。Please refer to FIGS. 6 and 7 . FIG. 6 is a schematic structural view of the first mounting platform in FIG. 4 ; FIG. 7 is a schematic cross-sectional view of the first mounting platform in FIG. 4 . Specifically, the first mounting platform 111 includes but is not limited to a first mounting plate 1111 and a first adsorption plate 1112 . The first adsorption plate 1112 is disposed on a side of the first mounting plate 1111 close to the plasma cleaning head 112 . In the plasma cleaning device 110, the first adsorption plate 1112 can select an adsorption plate corresponding to the model of the product to be glued. During the cleaning process, the product to be glued is adsorbed and fixed on the first adsorption plate 1112 .
可选地,在其他实施例中,所述第一载置台111可以只包括第一安装板1111。在清洗过程中,待涂胶产品直接放置在第一安装板1111上。Alternatively, in other embodiments, the first mounting platform 111 may only include the first mounting plate 1111 . During the cleaning process, the product to be glued is directly placed on the first mounting plate 1111.
可选地,在又一个实施例中,所述第一安装板1111上开设有若干通孔。在清洗过程中,待涂胶产品被吸附固定于所述第一吸附板1112,而第一安装板1111上开设的若干通孔可以便于除尘,进而减少胶水涂层230中出现凹坑和气泡等问题。可选地,通孔方向为Z轴方向,如图4所述。Optionally, in yet another embodiment, the first mounting plate 1111 is provided with several through holes. During the cleaning process, the product to be glued is adsorbed and fixed on the first adsorption plate 1112, and a number of through holes opened on the first mounting plate 1111 can facilitate dust removal, thereby reducing the occurrence of pits and bubbles in the glue coating 230. question. Optionally, the through hole direction is the Z-axis direction, as shown in Figure 4.
请参阅图8,图8是图2中等离子清洗装置另一实施例的结构示意图。具体地,涂胶设备100包括但不限于第一空气过滤腔室120。在本实施例中,所述等离子清洗装置110设置在所述第一空气过滤腔室120内。因为等离子清洗头112清洗产品表面会产生杂质,本实施例设有第一空气过滤腔室120,等离子清洗装置110均安装在第一空气过滤腔室120内,使得与其他部分在物理上分隔开,防止其相互干扰。Please refer to FIG. 8 , which is a schematic structural diagram of another embodiment of the plasma cleaning device in FIG. 2 . Specifically, the gluing equipment 100 includes, but is not limited to, the first air filter chamber 120 . In this embodiment, the plasma cleaning device 110 is disposed in the first air filter chamber 120 . Because the plasma cleaning head 112 will produce impurities when cleaning the product surface, this embodiment is provided with a first air filter chamber 120. The plasma cleaning devices 110 are installed in the first air filter chamber 120 so that they are physically separated from other parts. open to prevent them from interfering with each other.
可选的,用户可根据需要选择第一空气过滤腔室120的型号。在一个具体的实施例中,第一空气过滤腔室120选型依据为:其中,设备腔体体积为v,初始微尘数量Q1(万级无尘室,Q1=29300),设备正常工作时微尘数量为Qn(千级无尘室,Qn=2930),n为真空泵等效抽气次数。综合考虑抽气量和抽气时间,确定抽气泵型号和腔体尺寸大小。Optionally, the user can select the model of the first air filter chamber 120 as needed. In a specific embodiment, the first air filter chamber 120 is selected based on: Among them, the volume of the equipment cavity is v, the initial dust quantity Q1 (10,000-level clean room, Q1=29300), the number of dust particles when the equipment is working normally is Qn (1,000-level clean room, Qn=2930), and n is the vacuum pump Equivalent pumping times. Determine the air pump model and cavity size by comprehensively considering the air pumping volume and air pumping time.
请参阅图9和图10,图9是图8中第一空气过滤腔室的结构示意图,
图10是图9中第一过滤网的结构示意图。具体地,所述第一空气过滤腔室120包括但不限于第一过滤网121和第一排气孔122。所述第一过滤网121和第一排气孔122均设置在所述第一空气过滤腔室120的底部。在清洗过程中,所述第一过滤网121用于吸收杂质,将第一空气过滤腔室120内部的粉尘污染物吸附住。本实施例通过第一过滤网121将第一空气过滤腔室120内部的粉尘吸附,保证该第一空气过滤腔室120内部的洁净度,防止后续涂胶过程中,粉尘混合在胶水涂层230中并进一步导致胶水涂层230形成凹坑和气泡。Please refer to Figures 9 and 10. Figure 9 is a schematic structural diagram of the first air filter chamber in Figure 8. Fig. 10 is a schematic structural diagram of the first filter screen in Fig. 9. Specifically, the first air filter chamber 120 includes but is not limited to a first filter 121 and a first exhaust hole 122 . The first filter 121 and the first exhaust hole 122 are both disposed at the bottom of the first air filter chamber 120 . During the cleaning process, the first filter 121 is used to absorb impurities and adsorb dust pollutants inside the first air filter chamber 120 . In this embodiment, the first filter 121 is used to absorb dust inside the first air filter chamber 120 to ensure the cleanliness inside the first air filter chamber 120 and prevent dust from being mixed in the glue coating 230 during the subsequent glue coating process. and further causes the glue coating 230 to form pits and bubbles.
可选地,所述第一空气过滤腔室120至少一侧壁可以打开,用于将所述待涂胶产品放入所述等离子清洗装置110或在清洗完以后取出所述待涂胶产品。Optionally, at least one side wall of the first air filter chamber 120 can be opened for placing the product to be glued into the plasma cleaning device 110 or taking out the product to be glued after cleaning.
请参阅图11,图11是图2中涂布装置一实施例的结构示意图。该涂布装置130包括但不限于第二载置台131、涂布模头132以及加热装置139。在涂布装置130中,加热装置139与涂布模头132均面向所述第二载置台131。在涂胶过程中,待涂胶产品放置于所述第二载置台131上。涂布模头132对待涂胶产品进行涂胶,之后通过加热装置139对待涂胶产品进行加热,降低胶水的表面张力,使的胶水在产品表面所受的摩擦力大于胶水表面张力,防止胶水收缩过快形成凹坑和气泡,同时也加快了待涂胶产品上胶水涂层230的固化效率。可选地,加热装置139可以是由多个加热棒组装而成,或者所述加热装置139为红外加热灯管,在此不做具体限定。Please refer to Figure 11, which is a schematic structural diagram of an embodiment of the coating device in Figure 2. The coating device 130 includes, but is not limited to, a second mounting table 131 , a coating die 132 and a heating device 139 . In the coating device 130 , the heating device 139 and the coating die 132 both face the second mounting table 131 . During the gluing process, the product to be glued is placed on the second placing platform 131 . The coating die 132 applies glue to the product to be coated, and then heats the product to be coated through the heating device 139 to reduce the surface tension of the glue so that the friction force experienced by the glue on the product surface is greater than the surface tension of the glue to prevent the glue from shrinking Pits and bubbles are formed too quickly, and the curing efficiency of the glue coating 230 on the product to be glued is also accelerated. Optionally, the heating device 139 may be assembled from multiple heating rods, or the heating device 139 may be an infrared heating lamp, which is not specifically limited here.
请参阅图12,图12是图11中涂布装置的爆炸图。涂布装置130包括但不限于第三驱动件135和第四驱动件136。具体的,第四驱动件136设置于所述第三驱动件135的移动端,第四驱动件136的移动端连接第二载置台131。在涂胶过程中,当待涂胶产品放置在第二载置台131后,第三驱动件135驱动第四驱动件136沿着第一方向移动。也即第三驱动件135间接驱动第二载置台131在X轴方向运动,从而保证涂布模头132的出胶口的喷射范围可以覆盖待涂胶产品长度方向上的所有部位。可选地,涂布模头132的涂胶宽度较宽,也即涂布模头132的涂胶宽度
大于待涂胶产品的宽度。当待涂胶产品的型号发生改变后,第四驱动件136驱动第二载置台131沿着第二方向移动,也即第四驱动件136驱动第二载置台131在Y轴方向运动,从而调整待涂胶产品与涂布模头132的相对位置。Please refer to Figure 12, which is an exploded view of the coating device in Figure 11. The coating device 130 includes, but is not limited to, a third driving member 135 and a fourth driving member 136 . Specifically, the fourth driving member 136 is disposed at the moving end of the third driving member 135 , and the moving end of the fourth driving member 136 is connected to the second mounting platform 131 . During the gluing process, after the product to be glued is placed on the second placing platform 131, the third driving member 135 drives the fourth driving member 136 to move along the first direction. That is, the third driving member 135 indirectly drives the second mounting platform 131 to move in the X-axis direction, thereby ensuring that the spray range of the glue outlet of the coating die 132 can cover all parts in the length direction of the product to be glued. Optionally, the glue coating width of the coating die 132 is wider, that is, the glue coating width of the coating die 132 Larger than the width of the product to be glued. When the model of the product to be coated is changed, the fourth driving member 136 drives the second mounting platform 131 to move in the second direction, that is, the fourth driving member 136 drives the second mounting platform 131 to move in the Y-axis direction, thereby adjusting The relative position of the product to be coated and the coating die 132.
可选地,根据需要,在其他实施例中,第四驱动件136还可以驱动第二载置台131在第三方向上移动。也即第四驱动件136驱动第二载置台131在Z轴方向运动,从而调整待涂胶产品与涂布模头132竖直方向上的位置关系。Optionally, as needed, in other embodiments, the fourth driving member 136 can also drive the second mounting platform 131 to move in the third direction. That is, the fourth driving member 136 drives the second mounting platform 131 to move in the Z-axis direction, thereby adjusting the vertical positional relationship between the product to be coated and the coating die 132 .
可选地,所述涂布装置130还包括但不限于第二工作台137和第二机架138。在本实施例中,第二机架138设置于所述第二工作台137上,涂布模头132和加热装置139分别设置在第二机架138的相对两侧壁上,且加热装置139与涂布模头132并排设置。具体的,第二机架138包括但不限于第三支撑柱1381、第四支撑柱1382以及第二连接部1383。在涂布装置130中,所述第三支撑柱1381和第四支撑柱1382设置在所述第二工作台137靠近所述涂布模头132的一侧,所述第二连接部1383连接所述第三支撑柱1381和第四支撑柱1382,所述涂布模头132和所述加热装置139并排设置于所述第二连接部1383,且面向所述待涂胶产品。Optionally, the coating device 130 also includes, but is not limited to, a second workbench 137 and a second frame 138 . In this embodiment, the second frame 138 is disposed on the second workbench 137, the coating die 132 and the heating device 139 are respectively disposed on the opposite side walls of the second frame 138, and the heating device 139 It is arranged side by side with the coating die 132 . Specifically, the second frame 138 includes, but is not limited to, a third support column 1381 , a fourth support column 1382 and a second connection part 1383 . In the coating device 130, the third support column 1381 and the fourth support column 1382 are disposed on a side of the second workbench 137 close to the coating die 132, and the second connection portion 1383 connects the The third support column 1381 and the fourth support column 1382, the coating die 132 and the heating device 139 are arranged side by side on the second connection part 1383 and face the product to be glued.
请参阅图13和图14,图13是图11中第二载置台的结构示意图;图14是图11中第二载置台的截面示意图。具体地,第二载置台131包括但不限于第二安装板1311和第二吸附板1312。在本实施例中,所述第二吸附板1312设置于所述第二安装板1311靠近所述涂布模头132的一侧。所述第二吸附板1312靠近所述第二安装板1311的一侧设有第二加热件1313。第二吸附板1312可以根据待涂胶产品的型号不同,选择对应型号的吸附板。在涂胶过程中,所述待涂胶产品吸附固定在所述第二吸附板1312上。第三驱动件135驱动第二载置台131沿着第一方向运动,配合涂布模头132,从而将涂布模头132内的胶水涂敷在产品上。当涂布模头132将胶水涂敷在产品上以后,所述第二加热件1313开始对固定在第二吸附板1312上的产品进行加热,降低胶水的表面张力。
使的胶水在产品表面所受的摩擦力大于胶水表面张力,防止胶水收缩过快形成凹坑和气泡,同时起到加快产品表面胶水涂层230固化效率的作用。可选地,第二加热件1313和加热装置139同时启动,从产品的正反两面同时对产品进行加热。Please refer to Figures 13 and 14. Figure 13 is a schematic structural diagram of the second placement platform in Figure 11; Figure 14 is a schematic cross-sectional view of the second placement platform in Figure 11. Specifically, the second mounting platform 131 includes, but is not limited to, a second mounting plate 1311 and a second adsorption plate 1312 . In this embodiment, the second adsorption plate 1312 is disposed on a side of the second mounting plate 1311 close to the coating die 132 . A second heating element 1313 is provided on a side of the second adsorption plate 1312 close to the second mounting plate 1311 . The second adsorption plate 1312 can select the adsorption plate of the corresponding model according to the model of the product to be glued. During the gluing process, the product to be glued is adsorbed and fixed on the second adsorption plate 1312. The third driving member 135 drives the second mounting platform 131 to move along the first direction and cooperates with the coating die 132 to apply the glue in the coating die 132 on the product. After the coating die 132 applies glue on the product, the second heating element 1313 begins to heat the product fixed on the second adsorption plate 1312 to reduce the surface tension of the glue. The friction force experienced by the glue on the surface of the product is greater than the surface tension of the glue, preventing the glue from shrinking too fast to form pits and bubbles, and at the same time speeding up the curing efficiency of the glue coating 230 on the product surface. Optionally, the second heating element 1313 and the heating device 139 are started at the same time to heat the product from both front and back sides of the product.
可选地,所述第二安装板1311和第二加热件1313之间设置有第二隔热板1314。在涂布装置130中,第二隔热板1314用于防止第二加热件1313将热量传导至第二工作台137,避免对人造成烫伤。可选地,在其他实施例中,所述第二载置台131可以只包括第二安装板1311。在涂胶过程中,待涂胶产品直接放置在第二安装板1311上。Optionally, a second heat insulation plate 1314 is provided between the second mounting plate 1311 and the second heating element 1313 . In the coating device 130, the second heat insulation plate 1314 is used to prevent the second heating element 1313 from conducting heat to the second workbench 137, thereby preventing burns to people. Alternatively, in other embodiments, the second mounting platform 131 may only include a second mounting plate 1311. During the gluing process, the product to be glued is directly placed on the second mounting plate 1311.
请参阅图15,图15是图2中涂布装置另一实施例的结构示意图。涂胶设备100还包括但不限于真空腔室140。在本实施例中,所述涂布装置130设置在所述真空腔室140内。在对待涂胶产品进行涂胶之前,需要对真空腔室140进行抽真空处理,便于将胶水涂层230中的气泡排除。可选地,该真空形成可由负压驱动件形成,负压驱动件可采用真空泵。当产品涂敷胶水后,产品需静置使胶水固化,由于该产品放置在真空腔室140内,当胶水内有气泡,该气泡将上浮。可选地,所述真空腔室140的一侧可以打开,用于将待涂胶产品放入或将涂胶后的产品取出。Please refer to Figure 15, which is a schematic structural diagram of another embodiment of the coating device in Figure 2. The gluing equipment 100 also includes, but is not limited to, a vacuum chamber 140 . In this embodiment, the coating device 130 is disposed in the vacuum chamber 140 . Before applying glue to the product to be glued, the vacuum chamber 140 needs to be evacuated to facilitate the elimination of bubbles in the glue coating 230 . Alternatively, the vacuum formation may be formed by a negative pressure driving member, and the negative pressure driving member may use a vacuum pump. After the product is coated with glue, the product needs to be allowed to stand for the glue to solidify. Since the product is placed in the vacuum chamber 140, when there are bubbles in the glue, the bubbles will float up. Optionally, one side of the vacuum chamber 140 can be opened for putting the product to be glued into or taking out the glued product.
可选地,当产品静置时,第二加热件1313和加热装置139从产品的正反两面同时对产品进行加热,可以加快胶水涂层230内气泡的上浮速度。Optionally, when the product is standing, the second heating element 1313 and the heating device 139 heat the product from both front and back sides of the product at the same time, which can speed up the floating speed of bubbles in the glue coating 230 .
静置预固化平台排泡原理:由公式:可知温度升高,液体内部的气泡体积增大,压强变小,气泡浮力大于重力,气泡加速上浮;真空腔室140内部压强小于气泡内部压强,气泡达到液面后破裂,完成排泡。Principle of foam discharge on static pre-curing platform: from the formula: It can be seen that as the temperature increases, the volume of bubbles inside the liquid increases and the pressure becomes smaller. The buoyancy of the bubbles is greater than gravity, and the bubbles accelerate to float. The internal pressure of the vacuum chamber 140 is less than the internal pressure of the bubbles, and the bubbles burst when they reach the liquid surface, completing the bubble discharge.
请继续参阅图2,本申请提供一种涂胶设备100还包括传输装置150。等离子清洗装置110和涂布装置130分别设置于传输装置150相对的两侧。在具体实施过程中,等离子清洗装置110通过等离子清洗头112对待涂胶产品表面进行清洗,并使等离子体附着于产品表面;传输装置150将清洗后的待涂胶产品取出,并放入涂布装置130中;涂布装置130通
过涂布模头132对待涂胶产品表面进行涂敷胶水。Please continue to refer to Figure 2. This application provides a glue coating equipment 100 that also includes a transmission device 150. The plasma cleaning device 110 and the coating device 130 are respectively disposed on opposite sides of the transmission device 150 . During the specific implementation process, the plasma cleaning device 110 cleans the surface of the product to be coated through the plasma cleaning head 112 and causes the plasma to adhere to the product surface; the transmission device 150 takes out the cleaned product to be coated and puts it into the coating In the device 130; the coating device 130 passes The over-coating die 132 applies glue to the surface of the product to be glued.
在具体实施例中,所述传输装置150可以为移栽臂。请参阅图3,图3是图2中移动装置的结构示意图。移栽臂具有可以转动的支柱151以及支柱151上的支撑板152。当清洗后的产品被放置到支撑板152上后,通过旋转支柱151使支撑板152上的产品靠近涂布装置130。可选地,所述传输装置150还可以是机械臂、传送带等,在此不做具体限定。In a specific embodiment, the transmission device 150 may be a transplanting arm. Please refer to Figure 3, which is a schematic structural diagram of the mobile device in Figure 2. The transplanting arm has a rotatable support column 151 and a support plate 152 on the support column 151 . After the cleaned products are placed on the support plate 152 , the products on the support plate 152 are brought close to the coating device 130 by rotating the support plate 151 . Optionally, the transmission device 150 may also be a robotic arm, a conveyor belt, etc., which is not specifically limited here.
请继续参阅图2,在具体实施例中,涂胶设备100还包括第二空气过滤腔室160。在本实施例中,所述等离子清洗装置110、传输装置150以及涂布装置130均设置在所述第二空气过滤腔室160内。通过在涂胶设备100中增加第二空气过滤腔室160,从而避免粉尘污染物进入胶水涂层230内,减少胶水涂层230产生的凹坑和气泡。Please continue to refer to FIG. 2 . In a specific embodiment, the gluing equipment 100 further includes a second air filter chamber 160 . In this embodiment, the plasma cleaning device 110 , the transmission device 150 and the coating device 130 are all disposed in the second air filter chamber 160 . By adding a second air filter chamber 160 to the glue coating equipment 100, dust contaminants are prevented from entering the glue coating 230, and pits and bubbles generated by the glue coating 230 are reduced.
请参阅图16和图17,图16是图2中第二空气过滤腔室的结构示意图,图17是图16中第二过滤网的结构示意图。第二空气过滤腔室160包括但不限于进气组件161和排气组件162。在本实施例中,所述进气组件161设置于所述第二空气过滤腔室160的侧壁,所述排气组件162设置于所述第二空气过滤腔室160的底部。在第二空气过滤腔室160内,进气组件161内置有空气滤芯,确保进入第二空气过滤腔室160内部的空气是洁净的(不含粉尘异物等);排气组件162中的第二过滤网1622将第二空气过滤腔室160内部的粉尘污染物吸附住,气体从第二排气孔1621排出。从而避免粉尘污染物进入胶水涂层230内,减少胶水涂层230表面产生的凹坑和气泡。可选地,第一空气过滤腔室120和第二空气过滤腔室160可以共用过滤网和排气孔。Please refer to Figures 16 and 17. Figure 16 is a schematic structural view of the second air filter chamber in Figure 2, and Figure 17 is a schematic structural view of the second filter screen in Figure 16. The second air filter chamber 160 includes, but is not limited to, an air intake assembly 161 and an exhaust assembly 162 . In this embodiment, the air inlet assembly 161 is disposed on the side wall of the second air filter chamber 160 , and the exhaust assembly 162 is disposed on the bottom of the second air filter chamber 160 . In the second air filter chamber 160, the air inlet assembly 161 has a built-in air filter element to ensure that the air entering the second air filter chamber 160 is clean (does not contain dust, foreign matter, etc.); the second air filter element in the exhaust assembly 162 The filter 1622 absorbs dust pollutants inside the second air filter chamber 160, and the gas is discharged from the second exhaust hole 1621. This prevents dust contaminants from entering the glue coating 230 and reduces pits and bubbles generated on the surface of the glue coating 230 . Alternatively, the first air filter chamber 120 and the second air filter chamber 160 may share a filter screen and an exhaust hole.
可选的,用户可根据需要选择第二空气过滤腔室160的型号。在一个具体的实施例中,第二空气过滤腔室160选型依据为:其中,设备腔体体积为v,初始微尘数量Q1(万级无尘室,Q1=29300),设备正常工作时微尘数量为Qn(千级无尘室,Qn=2930),n为真空泵等效抽气次数。综合考虑抽气量和抽气时间,确定抽气泵型号和腔体尺寸大小。Optionally, the user can select the model of the second air filter chamber 160 as needed. In a specific embodiment, the second air filter chamber 160 is selected based on: Among them, the volume of the equipment cavity is v, the initial dust quantity Q1 (10,000-level clean room, Q1=29300), the number of dust particles when the equipment is working normally is Qn (1,000-level clean room, Qn=2930), and n is the vacuum pump Equivalent pumping times. Determine the air pump model and cavity size by comprehensively considering the air pumping volume and air pumping time.
本申请通过在涂布装置130对待涂胶产品进行涂敷胶水之前,使用
等离子清洗头112对待涂胶产品进行清洗,增强了待涂胶产品表面的粗糙度,增强了胶水在产品表面的摩擦力。使该摩擦力大于胶水本身的表面张力,从而减少胶水移动,降低胶水表面产生凹坑和气泡的数量。This application uses the coating device 130 before applying glue to the product to be glued. The plasma cleaning head 112 cleans the product to be glued, which increases the roughness of the surface of the product to be glued and enhances the friction of the glue on the surface of the product. Make the friction force greater than the surface tension of the glue itself, thereby reducing the movement of the glue and reducing the number of pits and bubbles on the surface of the glue.
以上所述仅为本申请的部分实施例,并非因此限制本申请的保护范围,凡是利用本申请说明书及附图内容所作的等效装置或等效流程变换,或直接或间接运用在其他相关的技术领域,均同理包括在本申请的专利保护范围内。
The above are only some embodiments of the present application, and do not limit the scope of protection of the present application. Any equivalent device or equivalent process transformation made using the description and drawings of the present application, or directly or indirectly used in other related The technical fields are all equally included in the scope of patent protection of this application.
Claims (20)
- 一种涂胶设备,其特征在于,包括:A kind of glue coating equipment, which is characterized in that it includes:等离子清洗装置,所述等离子清洗装置包括第一载置台及等离子清洗头,所述第一载置台用于载置待涂胶产品,所述等离子清洗头面向所述待涂胶产品,用于清洗产品并使等离子体附着于产品表面;Plasma cleaning device, the plasma cleaning device includes a first mounting platform and a plasma cleaning head. The first mounting platform is used to place the product to be glued. The plasma cleaning head faces the product to be glued and is used for cleaning. The product causes the plasma to adhere to the surface of the product;涂布装置,所述涂布装置用于对清洗后的待涂胶产品进行涂敷胶水。Coating device, the coating device is used to apply glue to the cleaned product to be glued.
- 如权利要求1所述的涂胶设备,其特征在于,所述等离子清洗装置还包括:The glue coating equipment according to claim 1, characterized in that the plasma cleaning device further includes:第一驱动件,所述第一驱动件的移动端连接所述第一载置台或所述等离子清洗头,驱动所述第一载置台或所述等离子清洗头沿第一方向运动。A first driving member, the moving end of the first driving member is connected to the first mounting platform or the plasma cleaning head, and drives the first mounting platform or the plasma cleaning head to move in the first direction.
- 如权利要求1所述的涂胶设备,其特征在于,所述等离子清洗装置还包括:The glue coating equipment according to claim 1, characterized in that the plasma cleaning device further includes:第一驱动件,所述第一驱动件用于驱动第二驱动件沿第一方向运动;a first driving member, the first driving member is used to drive the second driving member to move in the first direction;第二驱动件,所述第二驱动件设置于所述第一驱动件的移动端,所述第二驱动件的移动端连接所述第一载置台,所述第二驱动件驱动所述第一载置台沿第二方向或者第三方向运动。The second driving member is disposed at the moving end of the first driving member. The moving end of the second driving member is connected to the first mounting platform. The second driving member drives the second driving member. A loading platform moves along the second direction or the third direction.
- 如权利要求1-3任一所述的涂胶设备,其特征在于,所述第一载置台包括第一安装板和第一吸附板,所述第一吸附板设置于所述第一安装板靠近所述等离子清洗头的一侧,用于吸附固定所述待涂胶产品。The glue coating equipment according to any one of claims 1 to 3, characterized in that the first mounting platform includes a first mounting plate and a first adsorption plate, and the first adsorption plate is disposed on the first mounting plate. The side close to the plasma cleaning head is used to adsorb and fix the product to be glued.
- 如权利要求4所述的涂胶设备,其特征在于,所述第一安装板上开设有多个通孔。The gluing equipment of claim 4, wherein the first mounting plate is provided with a plurality of through holes.
- 如权利要求1-3任一所述的涂胶设备,其特征在于,所述等离子清洗装置包括第一工作台和第一机架,所述第一机架设置于所述第一工作台上,所述等离子清洗头设置在所述第一机架上。The glue coating equipment according to any one of claims 1 to 3, characterized in that the plasma cleaning device includes a first workbench and a first frame, and the first frame is disposed on the first workbench. , the plasma cleaning head is arranged on the first frame.
- 如权利要求6所述的涂胶设备,其特征在于,所述第一机架包括第一支撑柱、第二支撑柱及第一连接部,所述第一支撑柱和所述第二支撑柱设置在所述第一工作台靠近所述等离子清洗头的一侧,所述第一连 接部连接所述第一支撑柱和所述第二支撑柱,所述等离子清洗头设置于所述第一连接部。The glue coating equipment according to claim 6, characterized in that the first frame includes a first support column, a second support column and a first connection part, the first support column and the second support column is arranged on the side of the first workbench close to the plasma cleaning head, and the first connecting The connection part connects the first support column and the second support column, and the plasma cleaning head is arranged on the first connection part.
- 如权利要求1-3任一所述的涂胶设备,其特征在于,还包括第一空气过滤腔室,所述等离子清洗装置设置在所述第一空气过滤腔室内。The glue coating equipment according to any one of claims 1 to 3, further comprising a first air filtration chamber, and the plasma cleaning device is arranged in the first air filtration chamber.
- 如权利要求8所述的涂胶设备,其特征在于,所述第一空气过滤腔室内还包括第一过滤网及第一排气孔;The glue coating equipment of claim 8, wherein the first air filter chamber further includes a first filter and a first exhaust hole;所述第一过滤网和所述第一排气孔均设置在所述第一空气过滤腔室的底部。The first filter screen and the first exhaust hole are both provided at the bottom of the first air filter chamber.
- 如权利要求1所述的涂胶设备,其特征在于,所述涂布装置包括:The glue coating equipment according to claim 1, characterized in that the coating device includes:第二载置台,所述第二载置台用于载置待涂胶产品;a second loading platform, the second loading platform is used to place products to be glued;涂布模头,所述涂布模头面向所述第二载置台;a coating die, the coating die facing the second placing table;加热装置,所述加热装置面向所述第二载置台,用于对涂布模头喷出的胶水进行加热。A heating device faces the second placing platform and is used to heat the glue sprayed from the coating die.
- 如权利要求10所述的涂胶设备,其特征在于,所述涂布装置还包括:The glue coating equipment according to claim 10, characterized in that the coating device further includes:第三驱动件,所述第三驱动件用于驱动第四驱动件沿第一方向运动;a third driving member, the third driving member is used to drive the fourth driving member to move in the first direction;第四驱动件,所述第四驱动件设置于所述第三驱动件的移动端,所述第四驱动件的移动端连接所述第二载置台,所述第四驱动件驱动所述第二载置台沿第二方向或者第三方向运动。A fourth driving member, the fourth driving member is provided at the moving end of the third driving member, the moving end of the fourth driving member is connected to the second mounting platform, and the fourth driving member drives the third The second placing platform moves along the second direction or the third direction.
- 如权利要求10所述的涂胶设备,其特征在于,所述第二载置台包括第二安装板及设置在所述第二安装板上的第二吸附板;The glue coating equipment of claim 10, wherein the second mounting platform includes a second mounting plate and a second adsorption plate disposed on the second mounting plate;所述第二吸附板靠近所述第二安装板的一侧设有第二加热件,所述待涂胶产品吸附固定在所述第二吸附板上。A second heating element is provided on a side of the second adsorption plate close to the second installation plate, and the product to be glued is adsorbed and fixed on the second adsorption plate.
- 如权利要求12所述的涂胶设备,其特征在于,所述第二安装板与所述第二加热件之间设置有第二隔热板。The glue coating equipment according to claim 12, characterized in that a second heat insulation plate is provided between the second mounting plate and the second heating element.
- 如权利要求10-13任一所述的涂胶设备,其特征在于,还包括真空腔室,所述涂布装置设置在所述真空腔室内。The glue coating equipment according to any one of claims 10 to 13, further comprising a vacuum chamber, and the coating device is arranged in the vacuum chamber.
- 如权利要求10-13任一所述的涂胶设备,其特征在于,还包括传输装置,所述传输装置将所述等离子清洗装置处理后的待涂胶产品运至 所述涂布装置的第二载置台。The gluing equipment according to any one of claims 10 to 13, further comprising a transmission device that transports the products to be glued after processing by the plasma cleaning device to The second mounting platform of the coating device.
- 如权利要求15所述的涂胶设备,其特征在于,还包括第二空气过滤腔室,所述等离子清洗装置、所述传输装置及所述涂布装置均设置在所述第二空气过滤腔室内。The glue coating equipment according to claim 15, further comprising a second air filter chamber, the plasma cleaning device, the transmission device and the coating device are all arranged in the second air filter chamber. indoor.
- 如权利要求16所述的涂胶设备,其特征在于,所述第二空气过滤腔室包括:进气组件和排气组件,所述进气组件设置于所述第二空气过滤腔室的侧壁,所述排气组件设置于所述第二空气过滤腔室的底部;The gluing equipment of claim 16, wherein the second air filtration chamber includes: an air inlet assembly and an exhaust assembly, and the air inlet assembly is disposed on a side of the second air filtration chamber. wall, the exhaust assembly is disposed at the bottom of the second air filter chamber;其中,所述排气组件括第二排气孔和第二过滤网。Wherein, the exhaust assembly includes a second exhaust hole and a second filter.
- 如权利要求17所述的涂胶设备,其特征在于,所述进气组件内置有空气滤芯。The glue coating equipment according to claim 17, characterized in that the air inlet assembly has a built-in air filter element.
- 如权利要求10-13任一所述的涂胶设备,其特征在于,所述涂布装置还包括第二工作台和第二机架,所述第二机架设置于所述第二工作台上,所述涂布模头和所述加热装置分别设置在所述第二机架的相对两侧壁上,且所述加热装置与所述涂布模头并排设置,且均面向所述待涂胶产品。The glue coating equipment according to any one of claims 10 to 13, characterized in that the coating device further includes a second workbench and a second frame, and the second frame is disposed on the second workbench. On the machine, the coating die head and the heating device are respectively arranged on opposite side walls of the second frame, and the heating device and the coating die head are arranged side by side, and both face the to-be-treated Glue coated products.
- 如权利要求19所述的涂胶设备,其特征在于,所述第二机架包括第三支撑柱、第四支撑柱及第二连接部;所述第三支撑柱和所述第四支撑柱设置在所述第二工作台靠近所述涂布模头的一侧,所述第二连接部连接所述第三支撑柱和所述第四支撑柱,所述涂布模头和所述加热装置并排设置于所述第二连接部。 The gluing equipment of claim 19, wherein the second frame includes a third support column, a fourth support column and a second connection part; the third support column and the fourth support column Disposed on the side of the second workbench close to the coating die, the second connection portion connects the third support column and the fourth support column, the coating die and the heating The devices are arranged side by side on the second connection part.
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CN202221807315.3U CN218308986U (en) | 2022-07-12 | 2022-07-12 | Gluing equipment |
CN202221807315.3 | 2022-07-12 |
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WO2024012323A1 true WO2024012323A1 (en) | 2024-01-18 |
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PCT/CN2023/105868 WO2024012323A1 (en) | 2022-07-12 | 2023-07-05 | Adhesive coating apparatus |
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CN218308986U (en) * | 2022-07-12 | 2023-01-17 | 江苏立导科技有限公司 | Gluing equipment |
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JP2000140741A (en) * | 1998-11-05 | 2000-05-23 | Toray Ind Inc | Apparatus and method for coating, and method and apparatus for manufacture of member for display |
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