WO2023282219A1 - 粘着テープ - Google Patents

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Publication number
WO2023282219A1
WO2023282219A1 PCT/JP2022/026549 JP2022026549W WO2023282219A1 WO 2023282219 A1 WO2023282219 A1 WO 2023282219A1 JP 2022026549 W JP2022026549 W JP 2022026549W WO 2023282219 A1 WO2023282219 A1 WO 2023282219A1
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WIPO (PCT)
Prior art keywords
styrene
pressure
butadiene
sensitive adhesive
tackifier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/026549
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English (en)
French (fr)
Japanese (ja)
Inventor
晃純 木村
佳明 山本
大輔 吉村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd filed Critical Denka Co Ltd
Priority to CN202280046322.2A priority Critical patent/CN117580923A/zh
Priority to EP22837635.6A priority patent/EP4353794B1/en
Priority to JP2023533116A priority patent/JP7538964B2/ja
Priority to KR1020247004735A priority patent/KR20240033013A/ko
Priority to US18/573,705 priority patent/US20240287359A1/en
Priority to MX2023015191A priority patent/MX2023015191A/es
Priority to CA3223562A priority patent/CA3223562A1/en
Publication of WO2023282219A1 publication Critical patent/WO2023282219A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C09J153/025—Vinyl aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J157/00—Adhesives based on unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09J157/02—Copolymers of mineral oil hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/21—Paper; Textile fabrics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/387—Block-copolymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/354—Applications of adhesives in processes or use of adhesives in the form of films or foils for automotive applications
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/26—Presence of textile or fabric
    • C09J2400/263—Presence of textile or fabric in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2453/00—Presence of block copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2493/00—Presence of natural resin

Definitions

  • the present invention relates to adhesive tapes.
  • Adhesive tapes are used in industrial fields such as home appliances, automobiles, construction, etc., for the purpose of, for example, joining various assembly members.
  • Adhesives used for adhesive tapes include acrylic adhesives and rubber adhesives, and acrylic adhesives are often used.
  • Patent Document 1 discloses a base polymer comprising a block copolymer of a monovinyl-substituted aromatic compound and a conjugated diene compound, and a tackifying resin (TH) having a hydroxyl value of 80 mgKOH/g or more.
  • TH tackifying resin
  • Patent Document 2 discloses a hot melt composition containing a styrene block copolymer (A) and a liquid softening agent (B), wherein the styrene block copolymer (A) is a styrene heat
  • the hot melt composition which is a hydrogenated product of a plastic elastomer, has a viscosity ratio ( ⁇ 1/ ⁇ 2) between the melt viscosity ( ⁇ 1) at 140°C and the melt viscosity ( ⁇ 2) at 180°C, and the melt viscosity at 180°C is Hot melt compositions are disclosed that are characterized by specific ranges.
  • Patent Document 3 a styrene-based thermoplastic elastomer A, a tackifying resin B, a plasticizer C, and a vinyl copolymer D having an ethylene-carbonyl bond are contained, and the mass part of the plasticizer C is C, and a hot melt adhesive characterized in that the ratio represented by D/C is 0.10 to 0.80, where D is the part by mass of the vinyl copolymer D having an ethylene-carbonyl bond. It is
  • JP 2013-216853 A Japanese Patent Application Laid-Open No. 2019-116608 JP 2020-203977 A
  • conventional rubber-based pressure-sensitive adhesives may not have sufficient adhesive strength for materials that are difficult to adhere to with acrylic pressure-sensitive adhesives, such as olefin-based materials.
  • acrylic pressure-sensitive adhesives such as olefin-based materials.
  • the adhesive physical properties may deteriorate, and there is a problem that the heat resistance is not sufficient.
  • the present invention has been made in view of such circumstances, and provides an adhesive tape having high adhesive strength to olefinic materials and good adhesive physical properties at high temperatures.
  • a pressure-sensitive adhesive tape comprising a pressure-sensitive adhesive layer containing a pressure-sensitive adhesive composition, wherein the pressure-sensitive adhesive composition comprises a styrene-butadiene block copolymer, a first tackifier, and a second tackifier.
  • the styrene-butadiene block copolymer contains a third tackifier, the butadiene portion of the styrene-butadiene block copolymer is partially hydrogenated, and the content of monomer units derived from styrene is 24% by mass or more.
  • the component a having a peak top molecular weight of 200,000 or more and 400,000 or less and the component b having a peak top molecular weight of 100,000 or more and less than 200,000 are included, and the first tackifier is used at 23 ° C. It is a liquid terpene-based resin, the second tackifier has a softening point of 70 to 120 ° C., the third tackifier is a terpene-phenolic resin having a softening point of 140 ° C. or higher, and the adhesive
  • the tape is a pressure-sensitive adhesive tape obtained by hot-melt coating a rayon-containing nonwoven fabric with the pressure-sensitive adhesive composition.
  • the present inventors found that in a pressure-sensitive adhesive tape comprising a pressure-sensitive adhesive layer containing a pressure-sensitive adhesive composition, the pressure-sensitive adhesive composition contains a styrene-butadiene-based block copolymer, a first tackifier, a second A tackifier and a third tackifier are blended, and a styrene-butadiene block copolymer in which the butadiene portion is partially hydrogenated is used as the styrene-butadiene block copolymer, and further the By specifying the content and molecular weight of monomer units derived from styrene, it was found that an adhesive tape having high adhesive strength to olefinic materials and good adhesive physical properties at high temperatures could be obtained, leading to the completion of the present invention. Arrived.
  • a pressure-sensitive adhesive tape comprising a pressure-sensitive adhesive layer containing a pressure-sensitive adhesive composition, wherein the pressure-sensitive adhesive composition comprises a styrene-butadiene block copolymer, a first tackifier, a second tackifier, a third in the styrene-butadiene block copolymer, the butadiene portion is partially hydrogenated, and the content of monomer units derived from styrene is 24% by mass or more,
  • the component a having a peak top molecular weight of 200,000 or more and 400,000 or less and the component b having a peak top molecular weight of 100,000 or more and less than 200,000 are included, and the first tackifier is a terpene that is liquid at 23°C.
  • the second tackifier has a softening point of 70 to 120° C.
  • the third tackifier is a terpene phenolic resin having a softening point of 140° C. or higher
  • the adhesive tape is A pressure-sensitive adhesive tape obtained by applying the pressure-sensitive adhesive composition to a rayon-containing nonwoven fabric by hot-melt coating.
  • the pressure-sensitive adhesive tape according to [1] wherein the nonwoven fabric containing rayon has a thickness of 30 to 50 ⁇ m.
  • the pressure-sensitive adhesive tape according to [1] or [2], wherein the coating amount of the pressure-sensitive adhesive composition is 60 g/m 2 or more on one side.
  • the adhesive tape which concerns on this invention the adhesive tape which has the high adhesive strength with respect to an olefin type material, and the favorable adhesive physical property in high temperature can be obtained.
  • ADVANTAGE OF THE INVENTION The adhesive tape which concerns on this invention can adhere
  • FIG. 1 is a schematic diagram of an adhesive tape according to one embodiment of the present invention.
  • the adhesive tape according to the present invention comprises an adhesive layer containing an adhesive composition.
  • the pressure-sensitive adhesive composition according to the present invention contains a styrene-butadiene block copolymer, a first tackifier, a second tackifier and a third tackifier.
  • the tackifier means a tackifier, and refers to a thermoplastic resin that is liquid or solid at room temperature and is added to enhance the adhesiveness.
  • Specific examples of tackifiers include rosin-based, terpene-based, and petroleum-based tackifiers.
  • the styrene-butadiene-based block copolymer according to the present invention is a block copolymer containing a block having a styrene-derived monomer unit and a block having a butadiene-derived monomer unit. means a polymer.
  • the styrene-butadiene-based block copolymer according to the present invention can also be used in combination of two or more styrene-butadiene-based block copolymers.
  • styrene-butadiene block copolymer according to one embodiment of the present invention will be described below.
  • the characteristics of the styrene-butadiene-based block copolymer (whole), which may include a plurality of types, contained in the pressure-sensitive adhesive composition according to the present invention will be described.
  • the butadiene-based block copolymer A and the styrene-butadiene-based block copolymer B will be described.
  • a styrene-butadiene-based block copolymer according to an embodiment of the present invention has a content of styrene-derived monomer units of 24% by mass or more.
  • the content of monomer units derived from styrene is, for example, 24, 25, 26, 27, 28, 29, 30, 35, 40, 45, 50% by mass. may be in the range between any two of By setting the amount in such a range, the resulting adhesive tape has appropriate adhesive strength and heat resistance to adherends.
  • the content of monomer units derived from styrene can be measured according to JIS K6383.
  • the content of monomer units derived from styrene in the styrene-butadiene-based block copolymer referred to here means all styrene-butadiene-based block copolymers contained in the pressure-sensitive adhesive composition according to the present invention.
  • the pressure-sensitive adhesive composition according to the present invention contains a styrene-butadiene block copolymer A and a styrene-butadiene block copolymer B
  • the styrene-butadiene block copolymer derived from styrene The content of monomer units means the content of monomer units derived from styrene contained in the styrene-butadiene block copolymer A and the content of monomer units derived from styrene contained in the styrene-butadiene block copolymer B. It means the total content of monomer units.
  • the butadiene portion is partially hydrogenated.
  • the butadiene portion of the styrene-butadiene-based block copolymer is preferably hydrogenated in an amount of 20 to 90% by mass, more preferably in an amount of 30 to 80% by mass.
  • Specific examples of styrene-butadiene block copolymers in which the butadiene portion is partially hydrogenated include styrene-butadiene-butylene-styrene block copolymers (SBBS).
  • the styrene-butadiene-based block copolymer according to the present invention contains monomer units derived from block ⁇ -styrene containing monomer units derived from block ⁇ -butadiene containing monomer units derived from styrene. It is preferred to include triblock copolymers containing block ⁇ . Further, the styrene-butadiene-based block copolymer according to the present invention includes a diblock copolymer containing block ⁇ containing monomer units derived from block ⁇ -butadiene containing monomer units derived from styrene. is preferred.
  • the block ⁇ containing monomer units derived from butadiene is preferably partially hydrogenated.
  • the block ⁇ containing monomer units derived from butadiene preferably has a butadiene block and a butylene block.
  • the styrene-butadiene-based block copolymer according to the present invention preferably contains 50 to 85% by mass of the diblock copolymer, when the styrene-butadiene-based block copolymer is 100% by mass. It is more preferable to contain % by mass.
  • the content of the diblock copolymer is, for example, 50, 55, 60, 65, 70, 75, 80, 85% by mass. may be within By setting the content of the diblock copolymer within the above numerical range, it is possible to obtain a pressure-sensitive adhesive composition having an appropriate tackiness.
  • the styrene-butadiene-based block copolymer is a component a having a peak top molecular weight of 200,000 or more and 400,000 or less and a component having a peak top molecular weight of 100,000 or more and less than 200,000 in GPC (gel permeation chromatography) measurement. including b.
  • GPC gel permeation chromatography
  • the component a having a peak top molecular weight of 200,000 or more and 400,000 or less and the component b having a peak top molecular weight of 100,000 or more and less than 200,000 are included in the GPC spectrum obtained by GPC measurement.
  • Component a has, for example, a peak top molecular weight of 200,000, 210,000, 220,000, 230,000, 240,000, 250,000, 260,000, 270,000, 280,000, 290,000, 300,000, 310,000, 320,000, 330,000, 340,000, 350,000, 360,000, 370,000, 380,000, 390,000, and 400,000 components, and may be within a range between any two of the numerical values exemplified here.
  • Component b is, for example, a peak top molecular weight of less than 100,000, 110,000, 120,000, 130,000, 140,000, 150,000, 160,000, 170,000, 180,000, 190,000, and 200,000. may be within a range between any two of the numerical values exemplified in .
  • the styrene-butadiene-based block copolymer is a component other than component a having a peak top molecular weight of 200,000 or more and 400,000 or less and a peak top molecular weight of 100,000 or more and less than 200,000 in GPC measurement.
  • the styrene-butadiene-based block copolymer may further have a component having a peak top molecular weight of 5,000 or more and less than 100,000.
  • 30,000, 40,000, 50,000, 60,000, 70,000, 80,000, 90,000, 100,000 components within a range between any two of the numerical values exemplified herein. may have components.
  • the styrene-butadiene-based block copolymer having the above molecular weight distribution can be obtained, for example, by appropriately selecting and combining two or more types of styrene-butadiene-based block copolymers having different peak top molecular weights, weight average molecular weights, and molecular weight distributions. Obtainable.
  • the styrene-butadiene-based block copolymer according to one embodiment of the present invention may contain two or more types of styrene-butadiene-based block copolymers, for example, 2, 3, 4, and 5 types of styrene-butadiene. system block copolymers.
  • a styrene-butadiene-based block copolymer according to one embodiment of the present invention may contain a styrene-butadiene-based block copolymer A and a styrene-butadiene-based block copolymer B.
  • Polymer A and styrene-butadiene-based block copolymer B may have different peak top molecular weights.
  • the styrene-butadiene block copolymer A can contain a styrene-butadiene block copolymer having a peak top molecular weight of 200,000 or more, and the styrene-butadiene block copolymer B has a peak top molecular weight of 100,000. More than 200,000 styrene-butadiene-based block copolymers may be included.
  • a styrene-butadiene-based block copolymer A according to one embodiment of the present invention contains a styrene-butadiene-based block copolymer having a peak top molecular weight of 200,000 or more and 400,000 or less.
  • the styrene-butadiene-based block copolymer A may contain a plurality of styrene-butadiene-based block copolymers, and has a peak top molecular weight of 200,000 or more and 400,000 or less styrene- In addition to the butadiene-based block copolymer, a styrene-butadiene-based block copolymer having a peak top molecular weight outside the above numerical range may also be included. In the styrene-butadiene-based block copolymer A according to one embodiment of the present invention, the butadiene portion is partially hydrogenated.
  • the styrene-butadiene block copolymer A is preferably hydrogenated in an amount of 20 to 90% by mass, more preferably in an amount of 30 to 80% by mass.
  • Specific examples of styrene-butadiene block copolymers in which the butadiene portion is partially hydrogenated include styrene-butadiene-butylene-styrene block copolymers (SBBS).
  • SBBS styrene-butadiene-butylene-styrene block copolymers
  • the hydrogenation rate can be analyzed from the peak of hydrogenated butadiene and the peaks derived from other monomer units in the composition analysis by H-NMR.
  • the styrene-butadiene block copolymer A according to the present invention contains monomer units derived from block ⁇ -styrene containing monomer units derived from block ⁇ -butadiene containing monomer units derived from styrene. It preferably contains a triblock copolymer containing a block ⁇ containing. Further, the styrene-butadiene-based block copolymer according to the present invention includes a diblock copolymer containing block ⁇ containing monomer units derived from block ⁇ -butadiene containing monomer units derived from styrene. is preferred.
  • the block ⁇ containing monomer units derived from butadiene is preferably partially hydrogenated.
  • the block ⁇ containing monomer units derived from butadiene preferably has a butadiene block and a butylene block.
  • the styrene-butadiene-based block copolymer according to the present invention preferably contains 50 to 85% by mass of the diblock copolymer, when the styrene-butadiene-based block copolymer is 100% by mass. It is more preferable to contain % by mass.
  • the content of the diblock copolymer is, for example, 50, 55, 60, 65, 70, 75, 80, 85% by mass. may be within
  • the styrene-butadiene-based block copolymer A has a content of monomer units derived from styrene of more than 20% by mass.
  • the content of monomer units derived from styrene in the styrene-butadiene-based block copolymer A is, for example, more than 20, 25, 30, 35, 40, 45, 50% by mass, and the numerical values exemplified here are It may be in the range between any two.
  • the styrene-butadiene-based block copolymer A according to one embodiment of the present invention preferably contains a styrene-butadiene-based block copolymer having a peak top molecular weight of 200,000 or more and 400,000 or less. That is, the styrene-butadiene-based block copolymer A according to one embodiment of the present invention preferably contains a component having a peak top molecular weight of 200,000 or more and 400,000 or less in GPC measurement.
  • the styrene-butadiene-based block copolymer A has a peak top molecular weight of 200,000, 210,000, 220,000, 230,000, 240,000, 250,000, 260,000, 270,000, 280,000, 290,000, 300,000, 31. 10,000, 320,000, 330,000, 340,000, 350,000, 360,000, 370,000, 380,000, 390,000, 400,000 components within a range between any two of the numerical values exemplified herein. may contain components of The styrene-butadiene-based block copolymer A may contain a component having a peak top molecular weight outside the above numerical range.
  • the styrene-butadiene-based block copolymer may further have a component having a peak top molecular weight of 10,000 or more and less than 100,000. It may have 50,000, 60,000, 70,000, 80,000, 90,000 components, less than 100,000 components, and components within a range between any two of the numerical values exemplified herein. may
  • the styrene-butadiene block copolymer A preferably has an MFR of less than 10 g/10 min measured at 200° C. and 5 kgf.
  • the styrene-butadiene block copolymer A has an MFR measured at 200° C. and 5 kgf of, for example, 1, 2, 3, 4, 5, 6, 7, 8, 9 g/10 min, less than 10 g/10 min, It may be in a range between any two of the numerical values exemplified here.
  • the styrene-butadiene-based block copolymer B may include a styrene-butadiene-based block copolymer having a peak top molecular weight of 100,000 or more and less than 200,000.
  • the styrene-butadiene-based block copolymer B may contain a plurality of styrene-butadiene-based block copolymers, and has a peak top molecular weight of 100,000 or more and less than 200,000 styrene- In addition to the butadiene-based block copolymer, a styrene-butadiene-based block copolymer having a peak top molecular weight of less than 100,000 or more than 200,000 may be included. In the styrene-butadiene-based block copolymer B according to one embodiment of the present invention, the butadiene portion is partially hydrogenated.
  • the styrene-butadiene block copolymer B is preferably hydrogenated in an amount of 20 to 90% by mass, more preferably in an amount of 30 to 80% by mass.
  • Specific examples of styrene-butadiene block copolymers in which the butadiene portion is partially hydrogenated include styrene-butadiene-butylene-styrene block copolymers (SBBS).
  • the styrene-butadiene-based block copolymer B according to the present invention contains monomer units derived from block ⁇ -styrene containing monomer units derived from block ⁇ -butadiene containing monomer units derived from styrene. It preferably contains a triblock copolymer containing a block ⁇ containing. Further, the styrene-butadiene-based block copolymer according to the present invention includes a diblock copolymer containing block ⁇ containing monomer units derived from block ⁇ -butadiene containing monomer units derived from styrene. is preferred.
  • the block ⁇ containing monomer units derived from butadiene is preferably partially hydrogenated. That is, the block ⁇ containing monomer units derived from butadiene preferably has a butadiene block and a butylene block.
  • the styrene-butadiene-based block copolymer according to the present invention preferably contains 50 to 85% by mass of the diblock copolymer, when the styrene-butadiene-based block copolymer is 100% by mass. It is more preferable to contain % by mass. Specifically, the content of the diblock copolymer is, for example, 50, 55, 60, 65, 70, 75, 80, 85% by mass. may be within
  • the styrene-butadiene-based block copolymer B has a content of monomer units derived from styrene of more than 20% by mass.
  • the content of monomer units derived from styrene in the styrene-butadiene-based block copolymer B is, for example, more than 20% by mass, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75 and 80% by mass, and may be within a range between any two of the numerical values exemplified here.
  • the styrene-butadiene-based block copolymer B according to one embodiment of the present invention preferably contains a styrene-butadiene-based block copolymer having a peak top molecular weight of 100,000 or more and less than 200,000. That is, the styrene-butadiene block copolymer B according to one embodiment of the present invention contains a component having a peak top molecular weight of 100,000 or more and less than 200,000 in GPC measurement.
  • Styrene-butadiene-based block copolymer B has a peak top molecular weight of 100,000, 110,000, 120,000, 130,000, 140,000, 150,000, 160,000, 170,000, 180,000, 190,000, 200,000 It may contain less than 1000 components, and may contain components within a range between any two of the numerical values recited herein.
  • the styrene-butadiene-based block copolymer B may contain a component having a peak top molecular weight outside the above numerical range.
  • the styrene-butadiene-based block copolymer may further have a component having a peak top molecular weight of 5,000 or more and less than 100,000. , 30,000, 40,000, 50,000, 60,000, 70,000, 80,000, 90,000 components, less than 100,000 components, and ranges between any two of the values exemplified herein. may have components within
  • the styrene-butadiene block copolymer B preferably has an MFR of 10 g/10 min or more measured at 200° C. and 5 kgf.
  • the styrene-butadiene-based block copolymer B has an MFR measured at 200° C. and 5 kgf of, for example, 10, 12, 13, 14, 15, 16, 17, 18, 19, 20 g/10 min. It may be in a range between any two of the numbers given.
  • the pressure-sensitive adhesive composition according to the present invention contains a first tackifier.
  • the first tackifier is a terpene-based resin that is liquid at 23°C.
  • the pressure-sensitive adhesive composition according to the present invention can contain the first tackifier singly or in combination of two or more.
  • terpene-based resins examples include Daimaron (liquid terpene resin, flash point 174 ° C.), YS resin CP (liquid terpene resin, flash point 178 ° C.), YS resin PX300N (terpene resin, flash point 202 ° C.), YS Polystar T30 ( Terpene phenol resin, flash point 205° C.) and YS resin LP (aromatic modified terpene resin, flash point 220° C.) are available from Yasuhara Chemical Co., Ltd.
  • YS resin LP is preferably included from the viewpoint of high flash point, low heat loss, and high compatibility with the styrene-butadiene block copolymer of the present invention.
  • the terpene resin that is liquid at 23°C preferably has a viscosity at 25°C of 500 to 150,000 cp, more preferably 1,000 to 100,000 cp.
  • the viscosity at 25° C. is, for example, 500, 1000, 2000, 5000, 10000, 20000, 50000, 100000, 120000, 150000 cp, and may be within a range between any two of the numerical values exemplified herein. .
  • the second tackifier has a softening point of 70-120°C.
  • the temperature of the second tackifier is preferably 80-120°C, more preferably 85-115°C.
  • the softening point is, for example, 70, 75, 80, 85, 90, 95, 100, 105, 110, 115, 120 ° C., and within the range between any two of the numerical values illustrated here There may be.
  • those satisfying the above conditions can be used singly or in combination of two or more.
  • C9 petroleum resin hydrogenated C9 petroleum resin, C5 petroleum resin, alicyclic petroleum resin, alicyclic/aromatic petroleum resin, rosin resin (polymerized rosin ester, modified polymerized rosin esters, stabilized rosin esters, etc.), terpene-based resins (terpene resins, aromatic modified terpene resins, terpene phenol resins, hydrogenated terpene phenol resins, etc.) and the like can be used.
  • terpene-based resins terpene resins, aromatic modified terpene resins, terpene phenol resins, hydrogenated terpene phenol resins, etc.
  • the second tackifier more preferably contains a terpene resin.
  • the third tackifier is a terpene phenolic resin having a softening point of 140° C. or higher.
  • the third tackifier preferably has a softening point of 140 to 180°C, more preferably 140 to 170°C.
  • the softening point is, for example, 140, 145, 150, 155, 160, 165, 170, 175, 180 ° C. It may be within the range between any two of the numerical values illustrated here .
  • terpene phenolic resins having a softening point of 140° C. or higher can be used singly or in combination of two or more.
  • a third tackifier is a terpene phenolic resin.
  • a terpene phenol-based resin is preferable from the viewpoint of having an excellent balance between melt viscosity and high-temperature adhesive strength. In particular, it preferably contains a terpene phenol resin from the viewpoint of obtaining a PSA composition that has a low melt viscosity and is easy to coat.
  • the pressure-sensitive adhesive composition according to one embodiment of the present invention may contain a tackifier having a softening point of 140° C. or higher and a tackifier other than a terpene phenol-based resin. Tackifiers other than terpene phenolic resins having a softening point of 140° C.
  • the pressure-sensitive adhesive composition according to one embodiment of the present invention may be a tackifier having a softening point of 140° C. or higher and may not contain a tackifier other than a terpene phenolic resin.
  • the softening point of the tackifier can be defined as a value measured based on the softening point test method (ring and ball method) specified in JIS K5902 and JIS K2207. Specifically, the sample is melted as quickly as possible at the lowest possible temperature and carefully filled into a ring placed on a flat metal plate to avoid the formation of bubbles. After it cools down, cut off the raised part from the plane including the top of the ring with a slightly heated knife. Next, a supporter (ring base) is placed in a glass container (heating bath) having a diameter of 85 mm or more and a height of 127 mm or more, and glycerin is poured to a depth of 90 mm or more.
  • ring and ball method the softening point test method
  • the steel ball (diameter 9.5 mm, weight 3.5 g) and the ring filled with the sample are immersed in the glycerin without touching each other, and the temperature of the glycerin is kept at 20° C. ⁇ 5° C. for 15 minutes. .
  • a steel ball is then centered on the surface of the sample in the ring and placed in position on the support.
  • the distance from the upper end of the ring to the glycerin surface is kept at 50 mm, a thermometer is placed, the center of the mercury ball of the thermometer is set at the same height as the center of the ring, and the container is heated.
  • the Bunsen burner flame used for heating is directed halfway between the center and the rim of the bottom of the vessel to ensure even heating.
  • the rate at which the bath temperature rises after reaching 40° C. from the start of heating can be 5.0 ⁇ 0.5° C. per minute.
  • the temperature at which the sample gradually softens and flows down the ring until it finally touches the bottom plate is read and taken as the softening point. Two or more softening points can be measured at the same time, and the average value can be used. Also, since the softening point is about 50° C. higher than the glass transition point of the tackifier, the softening point can be estimated by detecting the Tg using a DSC (differential scanning calorimeter).
  • the pressure-sensitive adhesive composition according to one embodiment of the present invention comprises a styrene-butadiene-based block copolymer, a first tackifier, a second It contains a tackifier and a third tackifier, and the content of each component is not particularly limited.
  • the pressure-sensitive adhesive composition according to one embodiment of the present invention depends on the type of each component, as an example, by setting the content of each component to the following, the pressure-sensitive adhesive composition further has high adhesive strength to olefinic materials and high It tends to be an adhesive tape having adhesive strength.
  • the pressure-sensitive adhesive composition according to one embodiment of the present invention preferably contains 45 to 55 parts by mass of the styrene-butadiene-based block copolymer per 100 parts by mass of the pressure-sensitive adhesive composition.
  • the content of the styrene-butadiene block copolymer is specifically, for example, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55 parts by mass, and the numerical values exemplified here may be in the range between any two of
  • the pressure-sensitive adhesive composition according to one embodiment of the present invention preferably contains 5 to 15 parts by mass of the first tackifier per 100 parts by mass of the pressure-sensitive adhesive composition.
  • the content of the first tackifier is, for example, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15 parts by mass, and any of the numerical values illustrated here It may be in a range between the two.
  • the pressure-sensitive adhesive composition according to one embodiment of the present invention preferably contains 10 parts by mass or more of the second tackifier, and 10 to 40 parts by mass when the pressure-sensitive adhesive composition is 100 parts by mass. is more preferable, and it is even more preferable to contain 15 to 25 parts by mass.
  • Specific examples of the content of the second tackifier are 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40 parts by mass, even if it is within the range between any two of the numerical values illustrated here good.
  • the pressure-sensitive adhesive composition according to one embodiment of the present invention preferably contains 10 to 30 parts by mass, preferably 15 to 25 parts by mass, of the third tackifier when the pressure-sensitive adhesive composition is 100 parts by mass. is preferred.
  • Specific examples of the content of the third tackifier are 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29 and 30 parts by mass, and may be within a range between any two of the numerical values exemplified here.
  • the pressure-sensitive adhesive composition according to one embodiment of the present invention contains 45 to 55 parts by mass of a styrene-butadiene block copolymer and 5 to 15 parts by mass of a first tackifier, per 100 parts by mass of the pressure-sensitive adhesive composition. It is preferable to contain 10 to 40 parts by mass of the second tackifier and 10 to 30 parts by mass of the third tackifier.
  • the pressure-sensitive adhesive composition according to one embodiment of the present invention is a pressure-sensitive adhesive tape having high adhesive strength to olefinic materials and high adhesive strength at high temperatures by setting the content of each component within the above numerical range. Cheap.
  • the pressure-sensitive adhesive composition according to the present invention contains plasticizers, antioxidants, ultraviolet absorbers, stabilizers, fillers, modifiers, and so on within a range that does not impede the effects of the present invention. It may contain various additives such as a substance.
  • the adhesive composition according to one embodiment of the present invention can contain a plasticizer.
  • the pressure-sensitive adhesive composition according to one embodiment of the present invention preferably has a plasticizer content of less than 4 parts by mass with respect to 100 parts by mass of the pressure-sensitive adhesive composition.
  • the content of the plasticizer is, for example, 0.5, 1.0, 1.5, 2.0, 2.5, 3.0, 3.5 parts by mass, less than 4 parts by mass, It may be in a range between any two of the numerical values exemplified here.
  • the pressure-sensitive adhesive composition according to one embodiment of the present invention may also contain no plasticizer.
  • plasticizers include phthalate-based plasticizers, polybutene, paraffin-based process oils, naphthene-based process oils, aromatic process oils, liquid paraffin, and hydrocarbon-based synthetic oils.
  • polybutene examples include homopolymers of isobutene, copolymers of isobutene and n-butene, and the like.
  • examples of commercially available products include “10N” manufactured by NOF, "Indopol H-100” manufactured by Ineos, “Nisseki Polybutene” manufactured by Nippon Petrochemical, “Tetrax” manufactured by Nippon Petrochemical and the like.
  • Examples of the paraffin-based process oil examples include “PW-32” manufactured by Idemitsu Kosan Co., Ltd., “Dianafresia S32” manufactured by Idemitsu Kosan Co., Ltd., and "PS-32” manufactured by Idemitsu Kosan Co., Ltd.
  • naphthenic process oils examples include “KN4010” manufactured by PetroChina, “Dianafrecia N28” manufactured by Idemitsu Kosan Co., Ltd., “Dianafrecia N90” manufactured by Idemitsu Kosan Co., Ltd., “Dianafrecia U46” manufactured by Idemitsu Kosan Co., Ltd., and Idemitsu. Kosan Co., Ltd. "Diana process oil NR” etc. are mentioned.
  • aromatic process oils examples include “Aromax” manufactured by Nippon Petrochemicals.
  • liquid paraffin examples include “P-100” manufactured by MORESCO and “Kaydol” manufactured by Sonneborn.
  • hydrocarbon-based synthetic oils examples include “Lucant HC-10” manufactured by Mitsui Chemicals, Inc. and “Lucant HC-20” manufactured by Mitsui Chemicals.
  • Phthalic acid ester plasticizers include DINA (diisononyl adipate), DEHP (di-(2-ethylhexyl) phthalate), DBP (dibutyl phthalate), BBP (butylbenzyl phthalate), DINP (diisononyl phthalate), DIDP (diisodecyl phthalate) and DNOP (di-normal octyl phthalate).
  • the total content of the plasticizers exemplified above is preferably within the above numerical range. Further, in the pressure-sensitive adhesive composition according to one embodiment of the present invention, it is particularly preferable that the total content of the phthalate-based plasticizer is within the above numerical range.
  • antioxidants examples include 2,6-di-t-butyl-4-methylphenol, n-octadecyl-3-(4′-hydroxy-3′,5′-di-t-butylphenyl)propionate, 2,2'-methylenebis(4-methyl-6-t-butylphenol), 2,2'-methylenebis(4-ethyl-6-t-butylphenol), 2,4-bis(octylthiomethyl)-o-cresol , 2-t-butyl-6-(3-t-butyl-2-hydroxy-5-methylbenzyl)-4-methylphenyl acrylate, 2,4-di-t-amyl-6-[1-(3 ,5-di-t-amyl-2-hydroxyphenyl)ethyl]phenyl acrylate, 2-[1-(2-hydroxy-3,5-di-tert-pentylphenyl)]acrylate, tetrakis[
  • UV absorbers examples include 2-(2'-hydroxy-5'-methylphenyl)benzotriazole, 2-(2'-hydroxy-3',5'-t-butylphenyl)benzotriazole, 2-( Benzotriazole UV absorbers such as 2′-hydroxy-3′,5′-di-t-butylphenyl)-5-chlorobenzotriazole, benzophenone UV absorbers such as 2-hydroxy-4-methoxybenzophenone, salicylic acid Examples include ester-based UV absorbers, cyanoacrylate-based UV absorbers, and hindered amine-based light stabilizers. These can be used alone or in combination.
  • the pressure-sensitive adhesive composition according to one embodiment of the present invention has a content of an antioxidant with respect to 100 parts by mass of the pressure-sensitive adhesive composition, for example, 0.1, 0.2, 0.3, 0.4, 0.5, 1.0, 1.5, 2.0, 2.5, 3.0, 3.5 parts by weight, even within a range between any two of the values exemplified herein. good.
  • fillers examples include, but are not limited to, calcium carbonate, kaolin, talc, titanium oxide, mica, styrene beads, and silica. These particulate fillers can be used singly or in combination.
  • a method for producing a pressure-sensitive adhesive composition according to an embodiment of the present invention includes raw materials containing a styrene-butadiene block copolymer, a first tackifier, a second tackifier, and a third tackifier can include a kneading step such as a tackifier for kneading with a kneader kneader.
  • an antioxidant and a plasticizer can be further added.
  • kneading can be performed, for example, for 3 to 30 minutes at 5 to 25 rpm.
  • a method for producing a pressure-sensitive adhesive composition according to one embodiment of the present invention is a styrene-butadiene-based block copolymer, further added with a styrene-butadiene-based block copolymer and kneaded after the step of kneading with a tackifier or the like. It is preferable to have an addition/kneading step. In the step of adding and kneading the styrene-butadiene block copolymer, kneading can be performed, for example, for 20 to 200 minutes at 5 to 25 rpm.
  • Adhesive Layer/Adhesive Tape The adhesive tape according to the present invention comprises an adhesive layer containing the above adhesive composition.
  • the pressure-sensitive adhesive tape according to the present invention is obtained by applying a pressure-sensitive adhesive composition to a rayon-containing nonwoven fabric by hot-melt coating.
  • the pressure-sensitive adhesive layer is formed by heating and dissolving the pressure-sensitive adhesive composition, for example, with a melter, and coating it on the substrate.
  • the coating method is not particularly limited, but it is preferable to heat, melt, and knead the raw materials of the pressure-sensitive adhesive and apply the adhesive by a hot-melt method. That is, the method for producing an adhesive tape according to one embodiment of the present invention preferably includes a coating step of applying the adhesive composition to a substrate by a hot-melt method.
  • Conventional adhesive tapes for the automotive field, etc. have a process of applying an adhesive composition, in which the adhesive is dissolved in a solvent such as solvent or water, to the base material, and volatilizing the solvent or water.
  • the pressure-sensitive adhesive composition according to the present invention has a low viscosity at high temperatures and can be applied by a hot-melt method, so that a pressure-sensitive adhesive tape can be produced in a short time with little energy and cost.
  • a coating method a non-contact coating method or a contact method can be adopted.
  • Cross coating can be given as an example of the non-contact coating method.
  • slot die coating can be cited as an example of the contact method.
  • the thickness of the nonwoven fabric containing rayon is preferably 30 to 50 ⁇ m.
  • the thickness of the nonwoven fabric containing rayon is, for example, , 50 ⁇ m, and may be in the range between any two of the values exemplified herein.
  • the adhesive tape is likely to have an excellent balance between adhesive strength and high-temperature constant-load peeling amount.
  • the nonwoven fabric containing rayon can be, for example, a nonwoven fabric containing at least wood fibers and rayon.
  • the nonwoven fabric containing rayon in the present invention may contain fibers other than rayon and wood fiber, and chemical fibers such as acetate fiber, polyester fiber, polyvinyl alcohol (PVA) fiber, polyamide fiber, polyolefin fiber, polyurethane fiber, etc. May contain.
  • resin (binder) such as viscose, PVA, polyacrylamide, etc. may be impregnated.
  • These rayon-containing nonwoven fabrics preferably have a basis weight of 10 to 60 g/m 2 . 60 g/m 2 and may be in the range between any two of the numbers exemplified herein. A thickness of 30 ⁇ m to 50 ⁇ m is particularly preferred.
  • the coating amount of the adhesive composition can be 60 g/m 2 or more on one side, preferably 60 to 70 g/m 2 on one side.
  • the coating amount is, for example, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79, 80 g/one side.
  • m 2 and may range between any two of the values exemplified herein.
  • the coating amount of the adhesive composition remove the adhesive from the tape after coating with a solvent, measure the weight of the substrate after drying, subtract this weight from the weight of the entire tape, and double-sided tape In the case of , it can be measured by dividing the weight by 2.
  • the thickness of the adhesive layer can be 50 to 100 ⁇ m on one side.
  • the thickness of the pressure-sensitive adhesive layer is, for example, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100 ⁇ m.
  • Conventional solvent-based pressure-sensitive adhesive compositions require a longer drying process depending on the thickness of the pressure-sensitive adhesive layer to form a thicker pressure-sensitive adhesive layer, resulting in increased energy consumption and cost.
  • the pressure-sensitive adhesive composition according to the present invention Viscosity at high temperature is within a specific range, and coating by hot melt method is possible, so that a relatively thick pressure-sensitive adhesive layer can be manufactured with less energy and cost than before, and in a short time. be able to.
  • the film thickness in the present invention can be measured by subtracting the film thickness of the substrate from the layer thickness of the tape and dividing the film thickness by 2 in the case of a double-faced tape.
  • a spring-type dial gauge specified in JIS B 7503 is used as the film thickness measuring machine, and the measurement pressure is 20 to 60 kpa.
  • Peacock manufactured by Ozaki Seisakusho is commercially available.
  • the pressure-sensitive adhesive tape according to the present invention is more preferably a double-sided tape having pressure-sensitive adhesive layers on both sides of a nonwoven fabric. Moreover, it is more preferable that the pressure-sensitive adhesive tape according to the present invention has a pressure-sensitive adhesive layer having the thickness described above on both sides of the nonwoven fabric.
  • FIG. 1 shows the configuration of an adhesive tape according to one embodiment of the present invention.
  • the adhesive tape has an adhesive layer 2 and an adhesive layer 4 having a thickness of 50 to 100 ⁇ m on both sides of the nonwoven fabric 3 .
  • the double-sided release film 1 is attached to the surface of the pressure-sensitive adhesive layer 2 opposite to the surface in contact with the nonwoven fabric.
  • the adhesive tape according to the present invention can have an adhesive strength of 12 N/19 mm or more, preferably 14 N/19 mm or more, to a PP plate (polypropylene plate) at 80°C.
  • the adhesive strength is, for example, 40 N/19 mm, and may be in the range between any two of the values exemplified here.
  • Adhesion can be controlled by adjusting the type and amount of the adhesive composition.
  • Adhesive strength can be determined by measuring 180° peel adhesive strength to a PP plate in an 80° C. atmosphere based on the method described in Examples.
  • the pressure-sensitive adhesive tape according to the present invention has a constant load peeling amount of 3 mm or more when pressed against a PP plate at 80 ° C. for 30 minutes with 2 kg, preferably 5 mm. It is preferable that it is above.
  • the constant load peeling amount is, for example, 3, 5, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 25, 30, 35, 40 mm, where It may be in a range between any two of the numerical values given.
  • the constant load peeling amount can be measured by the method described in Examples.
  • the adhesive strength and constant load peeling amount of the adhesive tape can be controlled by adjusting the type and amount of the adhesive composition blended, and the type, thickness, coating amount, etc. of the base material of the adhesive tape. .
  • the pressure-sensitive adhesive tape according to the present invention has high adhesion to PP plates at high temperatures and good adhesive properties at high temperatures.
  • the pressure-sensitive adhesive tape according to the present invention makes use of such properties and can bond various members together with higher reliability and at a lower cost in industrial fields such as home appliances, automobiles, and construction.
  • the adhesive tape according to one embodiment of the present invention can be used, for example, to fix automobile doors, ceilings, trunks, parts around instrument panels, to fix interior parts in the automobile field such as assembly around air conditioners and car navigation systems, OA equipment, It can be suitably used for home appliances and the like.
  • a kneader kneader (manufactured by Toshin Co., Ltd.) was heated to 200° C. in advance.
  • a first tackifier, a second tackifier and a third tackifier were added to a kneader kneader and kneaded at 15 rpm for 10 minutes.
  • a block copolymer was added and kneaded at 15 rpm for 100 minutes to obtain adhesive compositions 1-15.
  • Table 2 shows the blending amount (parts by mass) of each component.
  • the viscosity of the first tackifier in the table is the viscosity at 25°C.
  • the block copolymers Asaprene and Tuftec used in Examples and Comparative Examples are both styrene-butadiene-based block copolymers in which the butadiene portion is partially hydrogenated, styrene-butadiene-butylene- Styrene block copolymer (SBBS).
  • SBBS styrene-butadiene-butylene- Styrene block copolymer
  • PX1150N manufactured by Yasuhara Chemical Co., Ltd.
  • terpene resin softening point 115 ⁇ 5 ° C.
  • T-145 manufactured by Yasuhara Chemical Co., Ltd.
  • terpene phenol resin softening point 145 ⁇ 5 ° C.
  • PSA compositions 1 to 15 were heated to 200° C. with a melter and melted, and the substrates shown in the table were coated with a slot die coater (ITW Dynatec) so that the amount of coating shown in the table would be obtained. It was coated, laminated with a double-sided release paper, and wound up. Furthermore, the pressure-sensitive adhesive composition was applied to the surface not coated with the pressure-sensitive adhesive composition using a slot die coater (ITW Dynatec Co.) in the same manner so as to obtain the coating amount shown in the table.
  • IW Dynatec Co. slot die coater
  • Base material number 1 Wood pulp/rayon nonwoven fabric (manufactured by Daifuku Paper Co., Ltd., 5230) Basis weight 13g/ m2 Thickness (mm) 45 ⁇ m
  • Base material number 2 Wood pulp/rayon nonwoven fabric (manufactured by Daifuku Paper Co., Ltd., 5211) Basis weight 11g/ m2 Thickness (mm) 33 ⁇ m
  • Base material number 3 Wood pulp/rayon nonwoven fabric (manufactured by Daifuku Paper Co., Ltd., 5232) Basis weight 14g/ m2 Thickness (mm) 135 ⁇ m
  • Base material number 4 Wood pulp nonwoven fabric (manufactured by Daifuku Paper Co., Ltd., 5310) Basis weight 11g/ m2 Thickness (mm) 30 ⁇ m
  • Base material number 5 Wood pulp nonwoven fabric (manufactured by Daifuku Paper Co., Ltd., 5235) Basis weight 14g/ m2 Thickness (mm) 43 ⁇ m
  • Table 2 shows the values of melt mass flow rate (MFR) at 200° C. and 5 kgf for each styrene-butadiene block copolymer product.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
PCT/JP2022/026549 2021-07-09 2022-07-04 粘着テープ Ceased WO2023282219A1 (ja)

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Application Number Priority Date Filing Date Title
CN202280046322.2A CN117580923A (zh) 2021-07-09 2022-07-04 粘合带
EP22837635.6A EP4353794B1 (en) 2021-07-09 2022-07-04 Pressure-sensitive adhesive tape
JP2023533116A JP7538964B2 (ja) 2021-07-09 2022-07-04 粘着テープ
KR1020247004735A KR20240033013A (ko) 2021-07-09 2022-07-04 점착 테이프
US18/573,705 US20240287359A1 (en) 2021-07-09 2022-07-04 Pressure-sensitive adhesive tape
MX2023015191A MX2023015191A (es) 2021-07-09 2022-07-04 Cinta adhesiva sensible a la presion.
CA3223562A CA3223562A1 (en) 2021-07-09 2022-07-04 Pressure-sensitive adhesive tape

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WO2024203719A1 (ja) * 2023-03-28 2024-10-03 デンカ株式会社 ホットメルト粘着剤組成物、及び粘着テープ

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