WO2023282217A1 - 粘着テープ - Google Patents

粘着テープ Download PDF

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Publication number
WO2023282217A1
WO2023282217A1 PCT/JP2022/026547 JP2022026547W WO2023282217A1 WO 2023282217 A1 WO2023282217 A1 WO 2023282217A1 JP 2022026547 W JP2022026547 W JP 2022026547W WO 2023282217 A1 WO2023282217 A1 WO 2023282217A1
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WO
WIPO (PCT)
Prior art keywords
tackifier
pressure
sensitive adhesive
styrene
adhesive tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/026547
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English (en)
French (fr)
Japanese (ja)
Inventor
晃純 木村
佳明 山本
大輔 吉村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd filed Critical Denka Co Ltd
Priority to US18/573,849 priority Critical patent/US20240228836A1/en
Priority to JP2023533114A priority patent/JP7538962B2/ja
Priority to MX2023015194A priority patent/MX2023015194A/es
Priority to EP22837633.1A priority patent/EP4353793B1/en
Priority to CN202280044643.9A priority patent/CN117545817A/zh
Priority to KR1020247004733A priority patent/KR20240033012A/ko
Priority to CA3223407A priority patent/CA3223407A1/en
Publication of WO2023282217A1 publication Critical patent/WO2023282217A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/387—Block-copolymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/06—Copolymers with styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J157/00—Adhesives based on unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09J157/02—Copolymers of mineral oil hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J193/00—Adhesives based on natural resins; Adhesives based on derivatives thereof
    • C09J193/04—Rosin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/354—Applications of adhesives in processes or use of adhesives in the form of films or foils for automotive applications
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/26—Presence of textile or fabric
    • C09J2400/263—Presence of textile or fabric in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2453/00—Presence of block copolymer

Definitions

  • the present invention relates to adhesive tapes.
  • Adhesive tapes are used in industrial fields such as home appliances, automobiles, construction, etc., for the purpose of, for example, joining various assembly members.
  • Adhesives used for adhesive tapes include acrylic adhesives and rubber adhesives, and acrylic adhesives are often used. However, acrylic pressure-sensitive adhesives do not have sufficient adhesion to olefinic materials.
  • Patent Document 1 discloses a base polymer comprising a block copolymer of a monovinyl-substituted aromatic compound and a conjugated diene compound, and a tackifying resin (TH) having a hydroxyl value of 80 mgKOH/g or more.
  • TH tackifying resin
  • Patent Document 2 discloses a hot melt composition containing a styrene block copolymer (A) and a liquid softening agent (B), wherein the styrene block copolymer (A) is a styrene heat
  • the hot melt composition which is a hydrogenated product of a plastic elastomer, has a viscosity ratio ( ⁇ 1/ ⁇ 2) between the melt viscosity ( ⁇ 1) at 140°C and the melt viscosity ( ⁇ 2) at 180°C, and the melt viscosity at 180°C is Hot melt compositions are disclosed that are characterized by specific ranges.
  • Patent Document 3 a styrene-based thermoplastic elastomer A, a tackifying resin B, a plasticizer C, and a vinyl copolymer D having an ethylene-carbonyl bond are contained, and the mass part of the plasticizer C is C, and a hot melt adhesive characterized in that the ratio represented by D/C is 0.10 to 0.80, where D is the part by mass of the vinyl copolymer D having an ethylene-carbonyl bond. It is
  • JP 2013-216853 A Japanese Patent Application Laid-Open No. 2019-116608 JP 2020-203977 A
  • Conventional rubber-based adhesives may exhibit high adhesive strength to materials that are difficult to adhere to with acrylic adhesives, such as olefin-based materials. was not sufficient.
  • conventional adhesive tapes mainly have a process of applying an adhesive composition in which the adhesive is dissolved in a solvent such as solvent or water to the base material and volatilizing the solvent or water. The required energy and cost were large, and the manufacturing time was long. Accordingly, there has been a demand for an adhesive composition that has a low melt viscosity at high temperatures and that can be applied sufficiently by various hot-melt methods, for example.
  • the present invention has been made in view of such circumstances, and is an adhesive tape having a holding power for olefinic materials at high temperatures, which was difficult with adhesive tapes using conventional rubber adhesives, Moreover, the present invention provides an adhesive tape having high adhesive strength.
  • a pressure-sensitive adhesive tape comprising a pressure-sensitive adhesive layer containing a pressure-sensitive adhesive composition
  • the pressure-sensitive adhesive composition comprises a styrene-butadiene block copolymer, a first tackifier, and a second tackifier.
  • the third tackifier wherein the styrene-butadiene-based block copolymer is partially hydrogenated in the butadiene portion
  • the first tackifier comprises a rosin ester that is liquid at 23°C and a rosin ester that is liquid at 23°C.
  • At least one liquid terpene resin the second tackifier has a softening point of 70 to 120 ° C.
  • the third tackifier has a softening point of 140 ° C. or higher
  • JISZ0237 is 100 minutes or more at 70° C.
  • the melt viscosity of the adhesive composition at 200° C. is 100,000 cp or less.
  • the present inventors found that in a pressure-sensitive adhesive tape comprising a pressure-sensitive adhesive layer containing a pressure-sensitive adhesive composition, the pressure-sensitive adhesive composition contains a styrene-butadiene-based block copolymer in which the butadiene portion is partially hydrogenated.
  • a first tackifier, a second tackifier, and a third tackifier, each having specific physical properties, are combined, and the holding power of the adhesive tape and the viscosity of the adhesive composition at high temperatures are improved.
  • the pressure-sensitive adhesive tape has sufficiently high holding power and adhesive strength, and the present invention was completed.
  • a pressure-sensitive adhesive tape comprising a pressure-sensitive adhesive layer containing a pressure-sensitive adhesive composition, wherein the pressure-sensitive adhesive composition comprises a styrene-butadiene block copolymer, a first tackifier, a second tackifier, and a 3 tackifiers, wherein the styrene-butadiene block copolymer is partially hydrogenated in the butadiene portion, and the first tackifier is a rosin ester liquid at 23°C and a terpene liquid at 23°C at least one of the system resins, the second tackifier has a softening point of 70 to 120 ° C., the third tackifier has a softening point of 140 ° C.
  • the pressure-sensitive adhesive composition comprises a styrene-butadiene block copolymer, a first tackifier, a second tackifier, and a 3 tackifiers, wherein the styren
  • the adhesive tape contains 45 to 55 parts by mass of the styrene-butadiene block copolymer and 5 to 15 parts by mass of the first tackifier, per 100 parts by mass of the adhesive composition. part, 10 parts by mass or more of the second tackifier, and a total of 30 to 50 parts by mass of the second tackifier and the third tackifier.
  • the adhesive tape which concerns on this invention the adhesive tape which has the high adhesive force with respect to the olefinic material in a high temperature, and the holding power in a high temperature can be obtained.
  • the pressure-sensitive adhesive tape according to the present invention has a low melt viscosity at high temperatures, and for example, a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer containing an adhesive composition that can be sufficiently coated by various hot-melt methods can be obtained.
  • the pressure-sensitive adhesive tape according to the present invention can make use of its properties to bond various members together with higher reliability and at a lower cost in industrial fields such as home appliances, automobiles, and construction. Since the adhesive tape according to one embodiment of the present invention has the above characteristics, it can be It can be suitably used for fixing parts, OA equipment, home appliances, and the like.
  • FIG. 1 is a schematic diagram of an adhesive tape according to one embodiment of the present invention.
  • the adhesive tape according to the present invention comprises an adhesive layer containing an adhesive composition.
  • the adhesive composition according to the present invention contains a styrene-butadiene block copolymer, a first tackifier, a second tackifier and a third tackifier.
  • the tackifier means a tackifier, and refers to a thermoplastic resin that is liquid or solid at room temperature and is added to enhance the adhesiveness.
  • Specific examples of tackifiers include rosin-based, terpene-based, and petroleum-based tackifiers.
  • the styrene-butadiene-based block copolymer according to the present invention is a block copolymer containing a block having a styrene-derived monomer unit and a block having a butadiene-derived monomer unit. means a polymer.
  • Styrene-butadiene-based block copolymers can be used singly. For example, those having different contents of monomer units derived from styrene or those having different diblock copolymer contents. can be used in combination of two or more.
  • the styrene-butadiene-based block copolymer preferably has a styrene-derived monomer unit content of 5 to 50% by mass, more preferably 10 to 40% by mass.
  • the content of monomer units derived from styrene is, for example, 5, 10, 15, 20, 25, 30, 35, 40, 45, 50% by mass. or within a range between the two. By setting the amount in such a range, the obtained adhesive tape has appropriate adhesive strength and holding power to the adherend.
  • the content of monomer units derived from styrene can be measured according to JIS K6383.
  • the butadiene portion is partially hydrogenated.
  • the butadiene portion of the styrene-butadiene-based block copolymer is preferably hydrogenated in an amount of 20 to 90% by mass, more preferably in an amount of 30 to 80% by mass.
  • Specific examples of styrene-butadiene block copolymers in which the butadiene portion is partially hydrogenated include styrene-butadiene-butylene-styrene block copolymers (SBBS).
  • the styrene-butadiene-based block copolymer according to the present invention contains monomer units derived from block B-styrene containing monomer units derived from block A-butadiene containing monomer units derived from styrene.
  • a triblock copolymer containing block C is preferably included.
  • the styrene-butadiene-based block copolymer according to the present invention includes a block A containing monomer units derived from styrene and a diblock copolymer containing block B containing monomer units derived from butadiene. is preferred.
  • the block B containing monomer units derived from butadiene is preferably partially hydrogenated.
  • the block B containing monomer units derived from butadiene preferably has a butadiene block and a butylene block.
  • the styrene-butadiene-based block copolymer according to the present invention preferably contains 50 to 85% by mass of the diblock copolymer, when the styrene-butadiene-based block copolymer is 100% by mass. It is more preferable to contain % by mass.
  • the content of the diblock copolymer is, for example, 50, 55, 60, 65, 70, 75, 80, 85% by mass.
  • styrene-butadiene block copolymer may be used for the adhesive, but two or more types may be used in combination.
  • resins with different viscosities and styrene contents it is possible to adjust adhesive strength and melt viscosity within appropriate ranges.
  • the weight-average molecular weight of the styrene-butadiene-based block copolymer is not particularly limited, but is, for example, preferably 30,000 to 500,000, more preferably 60,000 to 300,000.
  • a weight average molecular weight can be calculated
  • the first tackifier according to the present invention is at least one of a rosin ester that is liquid at 23°C and a terpene resin that is liquid at 23°C.
  • a rosin ester that is liquid at 23°C or a terpene resin that is liquid at 23°C can be used singly or in combination of two or more.
  • a liquid rosin ester for example, Super Ester A-18, Estergum AT, etc. are sold by Arakawa Chemical Co., Ltd., and can be freely selected and used.
  • terpene-based resins can be preferably used because they lower the viscosity during coating but do not lower the holding power.
  • terpene-based resins examples include Daimaron (liquid terpene resin, flash point 174 ° C.), YS resin CP (liquid terpene resin, flash point 178 ° C.), YS resin PX300N (terpene resin, flash point 202 ° C.), YS POLYSTAR T30 (terpene phenolic resin, flash point 205°C) and YS Resin LP (aromatic modified terpene resin, flash point 220°C) are commercially available from Yasuhara Chemical Co., Ltd., and can be freely selected and used. Among them, YS resin LP can be preferably used because it has a high flash point, low heat loss, and high compatibility with the styrene-butadiene block copolymer of the present invention.
  • the first tackifier preferably has a viscosity at 25° C. of 500 to 150,000 cp, more preferably 1,000 to 100,000 cp.
  • the viscosity at 25° C. is, for example, 500, 1000, 2000, 5000, 10000, 20000, 50000, 100000, 120000, 150000 cp, and may be within a range between any two of the numerical values exemplified herein. .
  • the second tackifier has a softening point of 70-120°C.
  • the second tackifier those having a softening point of 70 to 120° C. can be used singly or in combination of two or more.
  • the temperature of the second tackifier is preferably 80-120°C, more preferably 85-115°C.
  • the softening point is, for example, 70, 75, 80, 85, 90, 95, 100, 105, 110, 115, 120 ° C., and within the range between any two of the numerical values illustrated here There may be.
  • C9 petroleum resin hydrogenated C9 petroleum resin, C5 petroleum resin, alicyclic petroleum resin, alicyclic/aromatic petroleum resin, rosin resin (polymerized rosin ester, modified polymerized rosin esters, stabilized rosin esters, etc.), terpene-based resins (terpene resins, aromatic modified terpene resins, terpene phenol resins, hydrogenated terpene phenol resins, etc.) can be used.
  • terpene-based resins terpene resins, aromatic modified terpene resins, terpene phenol resins, hydrogenated terpene phenol resins, etc.
  • the second tackifier more preferably contains a terpene resin.
  • the third tackifier has a softening point of 140° C. or higher.
  • the third tackifier those having a softening point of 140° C. or higher can be used singly or in combination of two or more.
  • the third tackifier preferably has a softening point of 140 to 180°C, more preferably 140 to 170°C.
  • the softening point is, for example, 140, 145, 150, 155, 160, 165, 170, 175, 180 ° C. It may be within the range between any two of the numerical values illustrated here .
  • the softening point of the tackifier can be defined as a value measured based on the softening point test method (ring and ball method) specified in JIS K5902 and JIS K2207. Specifically, the sample is melted as quickly as possible at the lowest possible temperature and carefully filled into a ring placed on a flat metal plate to avoid the formation of bubbles. After it cools down, cut off the raised part from the plane including the top of the ring with a slightly heated knife. Next, a supporter (ring base) is placed in a glass container (heating bath) having a diameter of 85 mm or more and a height of 127 mm or more, and glycerin is poured to a depth of 90 mm or more.
  • ring and ball method the softening point test method
  • the steel ball (diameter 9.5 mm, weight 3.5 g) and the ring filled with the sample are immersed in the glycerin without touching each other, and the temperature of the glycerin is kept at 20° C. ⁇ 5° C. for 15 minutes. .
  • a steel ball is then centered on the surface of the sample in the ring and placed in position on the support.
  • the distance from the upper end of the ring to the glycerin surface is kept at 50 mm, a thermometer is placed, the center of the mercury ball of the thermometer is set at the same height as the center of the ring, and the container is heated.
  • the Bunsen burner flame used for heating is directed halfway between the center and the rim of the bottom of the vessel to ensure even heating.
  • the rate at which the bath temperature rises after reaching 40° C. from the start of heating can be 5.0 ⁇ 0.5° C. per minute.
  • the temperature at which the sample gradually softens and flows down the ring until it finally touches the bottom plate is read and taken as the softening point. Two or more softening points can be measured at the same time, and the average value can be used. Also, since the softening point is about 50° C. higher than the glass transition point of the tackifier, the softening point can be estimated by detecting the Tg using a DSC (differential scanning calorimeter).
  • C9 petroleum resin hydrogenated C9 petroleum resin
  • C5 petroleum resin alicyclic petroleum resin, alicyclic/aromatic petroleum resin
  • terpene resin aromatic modified terpene resins, terpene phenol resins, hydrogenated terpene phenol resins, etc.
  • rosin-based resins polymerized rosin esters, modified polymerized rosin esters, stabilized rosin esters, etc.
  • alkylphenol compounds and the like.
  • the third tackifier can include hydrogenated C9 petroleum resin, C5 petroleum resin, terpene resin. From the viewpoint of cost, hydrogenated C9 petroleum resin and C5 petroleum resin are preferable. Hydrogenated C9 petroleum resin is more preferable from the viewpoint of less odor than other petroleum resins.
  • a terpene phenol resin is preferably included from the viewpoint of obtaining a PSA composition that has a low melt viscosity and is easy to coat.
  • the pressure-sensitive adhesive composition according to one embodiment of the present invention contains a styrene-butadiene-based block copolymer, a first tackifier, a second tackifier, and a third tackifier. Mandatory to include. Further, in the pressure-sensitive adhesive composition according to one embodiment of the present invention, the holding power of the pressure-sensitive adhesive tape provided with the pressure-sensitive adhesive layer made of the pressure-sensitive adhesive composition and the melt viscosity of the pressure-sensitive adhesive composition are adjusted within the ranges described below. For example, the content of each component is not particularly limited.
  • the pressure-sensitive adhesive composition according to one embodiment of the present invention depends on the type of each component. is easier to adjust, and the adhesive force of the adhesive tape is easier to control.
  • the pressure-sensitive adhesive composition according to one embodiment of the present invention preferably contains 45 to 55 parts by mass of the styrene-butadiene-based block copolymer per 100 parts by mass of the pressure-sensitive adhesive composition.
  • the content of the styrene-butadiene block copolymer is specifically, for example, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55 parts by mass, and the numerical values exemplified here may be in the range between any two of
  • the pressure-sensitive adhesive composition according to one embodiment of the present invention preferably contains 5 to 15 parts by mass of the first tackifier per 100 parts by mass of the pressure-sensitive adhesive composition.
  • the content of the first tackifier is, for example, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15 parts by mass, and any of the numerical values illustrated here It may be in a range between the two.
  • the pressure-sensitive adhesive composition according to one embodiment of the present invention preferably contains 10 parts by mass or more of the second tackifier, and 10 to 40 parts by mass when the pressure-sensitive adhesive composition is 100 parts by mass. is more preferable, and it is even more preferable to contain 15 to 25 parts by mass.
  • Specific examples of the content of the second tackifier are 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40 parts by mass, even if it is within the range between any two of the numerical values illustrated here good.
  • the pressure-sensitive adhesive composition according to one embodiment of the present invention preferably contains a total of 30 to 50 parts by mass of the second tackifier and the third tackifier per 100 parts by mass of the pressure-sensitive adhesive composition. .
  • the contents of the second tackifier and the third tackifier are, for example, 46, 47, 48, 49, 50 parts by mass, and may be within a range between any two of the numerical values exemplified here.
  • the pressure-sensitive adhesive composition according to one embodiment of the present invention preferably contains 10 to 30 parts by mass, preferably 15 to 25 parts by mass, of the third tackifier when the pressure-sensitive adhesive composition is 100 parts by mass. is preferred.
  • Specific examples of the content of the third tackifier are 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29 and 30 parts by mass, and may be within a range between any two of the numerical values exemplified here.
  • the pressure-sensitive adhesive composition according to one embodiment of the present invention contains 45 to 55 parts by mass of a styrene-butadiene block copolymer and 5 to 15 parts by mass of a first tackifier, per 100 parts by mass of the pressure-sensitive adhesive composition.
  • Parts by mass, 10 parts by mass or more of the second tackifier, and a total of 30 to 50 parts by mass of the second tackifier and the third tackifier are more preferably contained, and the styrene-butadiene block copolymer is 45 to 55 parts by mass, 5 to 15 parts by mass of the first tackifier, 10 parts by mass or more of the second tackifier, 10 parts by mass or more of the third tackifier, the second tackifier and the third tackiness It is more preferable to contain 30 to 50 parts by mass of fire in total.
  • the pressure-sensitive adhesive composition according to one embodiment of the present invention includes, when the pressure-sensitive adhesive composition is 100 parts by mass, 45 to 55 parts by mass of a styrene-butadiene block copolymer and 5 parts by mass of the first tackifier. It is even more preferable to contain up to 15 parts by mass, 10 to 40 parts by mass or more of the second tackifier, and 10 to 30 parts by mass of the third tackifier.
  • the holding power and adhesive strength of the pressure-sensitive adhesive tape are more appropriately adjusted, and the pressure-sensitive adhesive composition
  • the adhesive tape has a lower melt viscosity at 200°C.
  • the pressure-sensitive adhesive composition according to the present invention contains plasticizers, antioxidants, ultraviolet absorbers, stabilizers, fillers, modifiers, and so on within a range that does not impede the effects of the present invention. It may contain various additives such as a substance.
  • the adhesive composition according to one embodiment of the present invention can contain a plasticizer.
  • the pressure-sensitive adhesive composition according to one embodiment of the present invention preferably has a plasticizer content of less than 4 parts by mass with respect to 100 parts by mass of the pressure-sensitive adhesive composition.
  • the content of the plasticizer is, for example, 0.5, 1.0, 1.5, 2.0, 2.5, 3.0, 3.5 parts by mass. may be in the range between any two of
  • the pressure-sensitive adhesive composition according to one embodiment of the present invention may also contain no plasticizer.
  • the pressure-sensitive adhesive composition according to one embodiment of the present invention comprises a styrene-butadiene-based block copolymer and first, second and third tackifiers, and the blending amounts of these tackifiers provide the adhesive tape holding power And by adjusting the melt viscosity of the adhesive composition to be appropriate, the holding power, adhesive strength, and adhesiveness of the adhesive tape can be improved even if the plasticizer content is small or no plasticizer is included.
  • the resulting pressure-sensitive adhesive tape has an excellent balance of melt viscosities at 200°C of the agent composition.
  • plasticizers include phthalate-based plasticizers, polybutene, paraffin-based process oils, naphthene-based process oils, aromatic process oils, liquid paraffin, and hydrocarbon-based synthetic oils.
  • polybutene examples include homopolymers of isobutene, copolymers of isobutene and n-butene, and the like.
  • examples of commercially available products include “10N” manufactured by NOF, "Indopol H-100” manufactured by Ineos, “Nisseki Polybutene” manufactured by Nippon Petrochemical, “Tetrax” manufactured by Nippon Petrochemical and the like.
  • Examples of the paraffin-based process oil examples include “PW-32” manufactured by Idemitsu Kosan Co., Ltd., “Dianafresia S32” manufactured by Idemitsu Kosan Co., Ltd., and "PS-32” manufactured by Idemitsu Kosan Co., Ltd.
  • naphthenic process oils examples include “KN4010” manufactured by PetroChina, “Dianafrecia N28” manufactured by Idemitsu Kosan Co., Ltd., “Dianafrecia N90” manufactured by Idemitsu Kosan Co., Ltd., “Dianafrecia U46” manufactured by Idemitsu Kosan Co., Ltd., and “Dianafrecia U46” manufactured by Idemitsu Kosan Co., Ltd. "Diana Process Oil NR” and the like.
  • aromatic process oils examples include “Aromax” manufactured by Nippon Oil Co., Ltd.
  • liquid paraffin examples include “P-100” manufactured by MORESCO and “Kaydol” manufactured by Sonneborn.
  • hydrocarbon-based synthetic oils examples include “Lucant HC-10” manufactured by Mitsui Chemicals, Inc. and “Lucant HC-20” manufactured by Mitsui Chemicals.
  • Phthalic acid ester plasticizers include DINA (diisononyl adipate), DEHP (di-(2-ethylhexyl) phthalate), DBP (dibutyl phthalate), BBP (butylbenzyl phthalate), DINP (diisononyl phthalate), DIDP (diisodecyl phthalate) and DNOP (di-normal octyl phthalate).
  • the total content of the plasticizers exemplified above is preferably within the above numerical range.
  • it is particularly preferable that the total content of the phthalate-based plasticizer is within the above numerical range.
  • antioxidants examples include 2,6-di-t-butyl-4-methylphenol, n-octadecyl-3-(4′-hydroxy-3′,5′-di-t-butylphenyl)propionate, 2,2'-methylenebis(4-methyl-6-t-butylphenol), 2,2'-methylenebis(4-ethyl-6-t-butylphenol), 2,4-bis(octylthiomethyl)-o-cresol , 2-t-butyl-6-(3-t-butyl-2-hydroxy-5-methylbenzyl)-4-methylphenyl acrylate, 2,4-di-t-amyl-6-[1-(3 ,5-di-t-amyl-2-hydroxyphenyl)ethyl]phenyl acrylate, 2-[1-(2-hydroxy-3,5-di-tert-pentylphenyl)]acrylate, tetrakis[
  • UV absorbers examples include 2-(2'-hydroxy-5'-methylphenyl)benzotriazole, 2-(2'-hydroxy-3',5'-t-butylphenyl)benzotriazole, 2-( Benzotriazole UV absorbers such as 2′-hydroxy-3′,5′-di-t-butylphenyl)-5-chlorobenzotriazole, benzophenone UV absorbers such as 2-hydroxy-4-methoxybenzophenone, salicylic acid Examples include ester-based UV absorbers, cyanoacrylate-based UV absorbers, and hindered amine-based light stabilizers. These can be used alone or in combination.
  • fillers examples include, but are not limited to, calcium carbonate, kaolin, talc, titanium oxide, mica, styrene beads, and silica. These particulate fillers can be used singly or in combination.
  • the adhesive composition according to one embodiment of the present invention must have a melt viscosity at 200° C. of 100,000 cp or less for hot-melt coating. Further, the melt viscosity at 200°C is more preferably 20,000 cp or more and 90,000 cp or less. Specifically, the melt viscosity at 200° C. is, for example, 20,000, 30,000, 40,000, 50,000, 60,000, 70,000, 80,000, 90,000, 100,000 cp. or within a range between the two.
  • the melt viscosity at 200° C. can be controlled by appropriately selecting the type of blending of the pressure-sensitive adhesive composition and adjusting the blending amount.
  • the melt viscosity of the pressure-sensitive adhesive composition can be measured using a rheometer at 200° C. and a shear rate of 10 (1/s).
  • a method for producing a pressure-sensitive adhesive composition according to one embodiment of the present invention includes a tackifier or the like that kneads raw materials including a first tackifier, a second tackifier, and a third tackifier with a kneader kneader.
  • a kneading step can be included.
  • an antioxidant and a plasticizer can be further added.
  • kneading step such as a tackifier, kneading can be performed, for example, for 3 to 30 minutes at 5 to 25 rpm.
  • a method for producing a pressure-sensitive adhesive composition according to one embodiment of the present invention is a styrene-butadiene-based block copolymer, further added with a styrene-butadiene-based block copolymer and kneaded after the step of kneading with a tackifier or the like. It is preferable to have an addition/kneading step. In the step of adding and kneading the styrene-butadiene block copolymer, kneading can be performed, for example, for 20 to 200 minutes at 5 to 25 rpm.
  • Adhesive Layer/Adhesive Tape The adhesive tape according to the present invention comprises an adhesive layer containing the above adhesive composition.
  • the pressure-sensitive adhesive layer is formed by heating and dissolving the pressure-sensitive adhesive composition, for example, with a melter, and coating it on the substrate.
  • the coating method is not particularly limited, but it is preferable to heat, melt, and knead the raw materials of the pressure-sensitive adhesive and apply the adhesive by a hot-melt method. That is, the method for producing an adhesive tape according to one embodiment of the present invention preferably includes a coating step of applying the adhesive composition to a substrate by a hot-melt method.
  • Conventional adhesive tapes for the automotive field, etc. have a process of applying an adhesive composition, in which the adhesive is dissolved in a solvent such as solvent or water, to the base material, and volatilizing the solvent or water.
  • the pressure-sensitive adhesive composition according to the present invention has a low viscosity at high temperatures and can be applied by a hot-melt method, so that a pressure-sensitive adhesive tape can be produced in a short time with little energy and cost.
  • a coating method a non-contact coating method or a contact method can be adopted.
  • Cross coating can be given as an example of the non-contact coating method.
  • slot die coating can be cited as an example of the contact method.
  • the thickness of the pressure-sensitive adhesive layer is not particularly limited, it is preferably 40 to 100 ⁇ m.
  • the thickness of the pressure-sensitive adhesive layer is, for example, 40, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100 ⁇ m. may be within the range of Conventional solvent-based pressure-sensitive adhesive compositions require a longer drying process depending on the thickness of the pressure-sensitive adhesive layer to form a thicker pressure-sensitive adhesive layer, resulting in increased energy consumption and cost.
  • the pressure-sensitive adhesive composition according to the present invention Viscosity at high temperature is within a specific range, and coating by hot melt method is possible, so that a relatively thick pressure-sensitive adhesive layer can be manufactured with less energy and cost than before, and in a short time. be able to.
  • the pressure-sensitive adhesive tape according to the present invention is more preferably a double-sided tape having pressure-sensitive adhesive layers on both sides of a nonwoven fabric. Moreover, it is more preferable that the pressure-sensitive adhesive tape according to the present invention has a pressure-sensitive adhesive layer having the thickness described above on both sides of the nonwoven fabric.
  • FIG. 1 shows the configuration of an adhesive tape according to one embodiment of the present invention.
  • the adhesive tape has an adhesive layer 2 and an adhesive layer 4 on both sides of the nonwoven fabric 3 .
  • the double-sided release film 1 is attached to the surface of the pressure-sensitive adhesive layer 2 opposite to the surface in contact with the nonwoven fabric.
  • the adhesive tape according to the present invention preferably has an adhesive strength to polypropylene resin at 80°C based on JIS Z0237 of 2.40 N/cm or more, more preferably 3.00 N/cm or more. Even more preferably, it is 3.50 N/cm or more.
  • the adhesive strength is, for example, 2.40, 2.50, 2.60, 2.70, 2.80, 2.90, 3.00, 3.50, 4.00, 4.50, 5.00, 5.50, 6.00, 6.50, 7.00, 7.50, 8.00, 8.50, 9.00, 9.50, 10.00 N/cm, where It may be in a range between any two of the numerical values given.
  • Adhesion is adjusted by adjusting the type and amount of the adhesive composition, and in particular, the formulation of the adhesive composition is adjusted so that the holding power of the adhesive tape and the melt viscosity of the adhesive composition are within specific numerical ranges. It can be controlled by adjusting the type and amount. Adhesive strength can be obtained by measuring 180° peel adhesive strength to polypropylene resin in an 80° C. atmosphere based on JIS Z0237 "10. Adhesive strength.”
  • the adhesive tape according to the present invention has a holding power at 70°C based on JIS Z0237 of 100 minutes or more, preferably 150 minutes or more.
  • the holding power is, for example, 1100, 1150, 1200, 1250, 1300 minutes, and may be in the range between any two of the values exemplified here.
  • Holding power can be controlled by adjusting the formulation type and amount of the adhesive composition.
  • the holding power is determined by attaching an adhesive tape with an adhesive area of 25 mm ⁇ 25 mm to a SUS plate in an atmosphere of 70 ° C based on JIS Z0237 "13. Holding power", setting the load to 1 kg, and measuring the time until the weight falls. can be evaluated with
  • the pressure-sensitive adhesive tape according to the present invention has high adhesive strength and high holding power to olefin-based materials such as polypropylene at high temperatures, has low viscosity at high temperatures, and can be coated by a hot-melt method. Therefore, the adhesive tape can be produced in a short time with less energy and cost.
  • the pressure-sensitive adhesive tape according to the present invention makes use of such properties and can bond various members together with higher reliability and at a lower cost in industrial fields such as home appliances, automobiles, and construction.
  • the adhesive tape according to one embodiment of the present invention is used, for example, for fixing parts around automobile doors and ceilings, trunk rooms, and instrument panels, fixing interior parts in the automobile field such as assembly around air conditioners and car navigation systems, and OA equipment. , home appliances and the like.
  • a kneader kneader (manufactured by Toshin Co., Ltd.) was heated to 200° C. in advance.
  • a first tackifier, a second tackifier, a third tackifier, an antioxidant and a plasticizer were added to a kneader kneader and kneaded at 15 rpm for 10 minutes.
  • a styrene-butadiene block copolymer in which the butadiene portion was partially hydrogenated was added and further kneaded at 15 rpm for 100 minutes to obtain adhesive compositions 1-27.
  • Tables 1 and 2 show the blending amounts (parts by mass) of each component.
  • the viscosity of the first tackifier in the table is the viscosity at 25°C.
  • the softening points and the like of the components used as the third tackifier are shown below.
  • QUINTONE2940 manufactured by Zeon Corporation: C5, softening point 141°C P-140 (manufactured by Arakawa Chemical Co., Ltd.): Hydrogenated C9, softening point 140 ° C.
  • T-145 manufactured by Yasuhara Chemical Co., Ltd.
  • terpene phenol resin softening point 145 ° C.
  • T-160 manufactured by Yasuhara Chemical Co., Ltd.
  • terpene phenol resin softening point 160 ° C.
  • DS-816 (manufactured by Harima Kasei Co., Ltd.): Polymerized rosin ester, softening point 150°C DS-822 (manufactured by Harima Kasei Co., Ltd.): polymerized rosin ester, softening point 165°C
  • weight-average molecular weights of the components used as the styrene-butadiene-based block copolymer in which the butadiene portion is partially hydrogenated are shown below.
  • Asaprene N521 manufactured by Asahi Kasei Corporation: SBBS (a styrene-butadiene-based block copolymer in which the butadiene portion is partially hydrogenated, a styrene-butadiene-butylene-styrene block copolymer), weight average molecular weight 15
  • Ten Thousand Tuftec P1500 manufactured by Asahi Kasei Corporation
  • SBBS styrene-butadiene-butylene-styrene block copolymer, which is a styrene-butadiene-based block copolymer in which the butadiene portion is partially hydrogenated
  • the pressure-sensitive adhesive compositions 1 to 27 were heated to 200° C. with a melter and dissolved, and then applied to a cellulose/rayon nonwoven fabric (Daifuku Paper Co., Ltd., 5200 18 g/m 2 ) at a thickness of 50 ⁇ m using a slot die coater (ITW Dynatec). It was processed, laminated with a double-sided release paper, and wound up. Further, a 50 ⁇ m-thick adhesive composition was applied to the surface not coated with the adhesive composition using a slot die coater (ITW Dynatec).
  • the film thickness in the present invention was measured by subtracting the film thickness of the substrate from the layer thickness of the tape, and dividing the film thickness by 2 in the case of a double-faced tape.
  • a spring type dial gauge specified in JIS B 7503 was used as the film thickness measuring machine, and the measuring pressure was set to 20 to 60 kpa.
  • Adhesive strength the adhesive strength (180° peel adhesive strength) to polypropylene resin was measured in an 80°C atmosphere.
  • a PET film having a thickness of 25 ⁇ m was attached to one side of a double-sided tape, and the other side of the tape was attached to a polypropylene plate and pressed under pressure of 2 kg. This sample was set in an autograph, and after 30 minutes had passed, the adhesive force was measured.
  • the polypropylene plate used for this measurement was a 2 mm thick Kobe poly sheet (product number: PP-N-BN, manufactured by Showa Denko Materials Co., Ltd.) punched into 5 cm x 20 cm pieces. The results are shown in Tables 1 and 2.
  • Double-sided release film Adhesive layer 3
  • Nonwoven fabric Adhesive layer

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
PCT/JP2022/026547 2021-07-09 2022-07-04 粘着テープ Ceased WO2023282217A1 (ja)

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US18/573,849 US20240228836A1 (en) 2021-07-09 2022-07-04 Adhesive tape
JP2023533114A JP7538962B2 (ja) 2021-07-09 2022-07-04 粘着テープ
MX2023015194A MX2023015194A (es) 2021-07-09 2022-07-04 Cinta adhesiva.
EP22837633.1A EP4353793B1 (en) 2021-07-09 2022-07-04 Adhesive tape
CN202280044643.9A CN117545817A (zh) 2021-07-09 2022-07-04 粘合带
KR1020247004733A KR20240033012A (ko) 2021-07-09 2022-07-04 점착 테이프
CA3223407A CA3223407A1 (en) 2021-07-09 2022-07-04 Adhesive tape

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JP2021114312 2021-07-09
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