WO2023279255A1 - 显示面板及显示装置 - Google Patents

显示面板及显示装置 Download PDF

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Publication number
WO2023279255A1
WO2023279255A1 PCT/CN2021/104691 CN2021104691W WO2023279255A1 WO 2023279255 A1 WO2023279255 A1 WO 2023279255A1 CN 2021104691 W CN2021104691 W CN 2021104691W WO 2023279255 A1 WO2023279255 A1 WO 2023279255A1
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WO
WIPO (PCT)
Prior art keywords
touch
display
layer
area
display substrate
Prior art date
Application number
PCT/CN2021/104691
Other languages
English (en)
French (fr)
Inventor
曾扬
杨富强
王裕
张元其
文平
张顺
罗昶
王威
陈天赐
张毅
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to CN202180001795.6A priority Critical patent/CN115777092A/zh
Priority to PCT/CN2021/104691 priority patent/WO2023279255A1/zh
Publication of WO2023279255A1 publication Critical patent/WO2023279255A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means

Definitions

  • the present disclosure relates to the field of display technology, and in particular, to a display panel and a display device.
  • AMOLED Active Matrix Organic Light-Emitting Diode
  • the touch function layer can be formed directly on the thin film encapsulation layer (TFE for short) of the display substrate by using a photolithography process.
  • the touch function layer includes a touch unit and a peripheral trace (Trace), each touch unit is electrically connected to at least one peripheral trace, and a sensing signal is transmitted to the touch unit through the peripheral trace.
  • a display panel has a display area, including a display substrate, a first barrier wall, a barrier portion, a first encapsulation layer and a plurality of touch wires.
  • the first retaining wall is disposed on the display side of the display substrate and surrounds the display area.
  • the blocking portion is disposed between the first blocking wall and the display area, and at least partially surrounds the display area.
  • the first encapsulation layer covers at least the display area, including a first surface close to the display substrate, a second surface away from the display substrate, and a transition surface connecting the first surface and the second surface .
  • a plurality of touch control lines are arranged on a side of the first packaging layer away from the display substrate, and the orthographic projection of the plurality of touch control lines on the display substrate is the same as that of the second surface on the display substrate.
  • the projection at least partially overlaps and is offset from the orthographic projection of the transition surface on the display substrate.
  • the orthographic projection of the at least part of the transition surface on the display substrate is located at the boundary of the orthographic projection of the blocking portion on the display substrate that is far away from the display area, and the touch control line that is farthest from the display area among the plurality of touch lines.
  • the area between the traces and the orthographic projection on the display substrate is configured to the display substrate.
  • At least part of the boundary of the orthographic projection of the second surface on the display substrate is located at a boundary close to the display area of the orthographic projection of the blocking portion on the display substrate, and is far from the orthographic projection of the blocking portion on the display substrate. Displays the area between the boundaries of the region.
  • an edge portion of the blocking portion close to the display area includes a slope, and an edge portion of the first encapsulation layer close to the blocking portion climbs up along the slope.
  • the transition surface is an arc surface, and the shape of the arc surface is adapted to the shape of the slope surface.
  • At least part of the boundary of the orthographic projection of the first surface and the second surface on the display substrate is located at the boundary of the orthographic projection of the blocking part on the display substrate close to the display area, and The area between the orthographic projections of the touch traces farthest from the display area among the plurality of touch traces on the display substrate.
  • the transition surface is substantially perpendicular to the plane where the display substrate is located.
  • the transition surface is an arc surface, and the arc surface bends toward the inside of the first encapsulation layer.
  • the display substrate includes a substrate and a flat layer, and the flat layer is disposed on the substrate.
  • the display substrate is provided with a groove between the blocking portion and the display area, the groove at least partially surrounds the display area, and along the thickness direction of the display substrate, the groove at least partially through the planar layer.
  • the orthographic projection of at least one of the plurality of touch control lines on the display substrate at least partially overlaps with the area where the groove is located.
  • the flat layer includes a first flat layer and a second flat layer, the first flat layer is disposed on the substrate, and the second flat layer is disposed on the first flat layer away from the substrate side.
  • the trench at least partially penetrates the first planar layer and/or the second planar layer.
  • the first encapsulation layer includes a filling portion filling the trench, and a covering portion located at least in a partial area of the display substrate except the trench.
  • a side of the filling part away from the display substrate is substantially in the same plane as a side of the covering part away from the display substrate.
  • the display panel further has a peripheral area surrounding the display area, and the peripheral area includes a touch wiring area located on one side of the display area.
  • the first retaining wall and the blocking portion are disposed in the peripheral area, and the portion of the blocking portion located in the touch wiring area is provided with an opening.
  • the opening is funnel-shaped, and in the funnel-shaped opening, the end with a larger diameter is close to the display area, and the end with a smaller diameter is close to the touch trace in the first retaining wall. part of the district.
  • the blocking portion includes a main body and two edges, and the main body is located in an area of the peripheral area other than the touch wiring area. At least part of each edge is located in the touch wiring area.
  • the two edges are respectively located on opposite sides of a center line of the display substrate extending along the first direction, and are respectively connected to two ends of the main body portion.
  • the opening is formed between the two edges.
  • the first direction is substantially perpendicular to the boundary line between the display area and the touch wiring area.
  • each edge includes a connection section and a guide section, one end of the connection section is connected to the main body, and the other end is connected to the guide section.
  • the distance between the ends of the two guiding segments close to the connecting segment is greater than the distance between the ends of the two guiding segments away from the connecting segment.
  • the ratio of the maximum dimension of the opening along the second direction to the maximum dimension of the part of the first barrier wall located in the touch wiring area along the second direction is greater than or equal to 0.5 and less than 1.
  • the second direction is substantially parallel to the boundary line between the display area and the touch wiring area.
  • the blocking portion is disposed around the display area.
  • the display panel further includes a second encapsulation layer, the second encapsulation layer is disposed between the display substrate and the first encapsulation layer, and covers at least the display area, the blocking portion and the Describe the first retaining wall. A part of the second encapsulation layer covering the blocking portion is away from the surface of the display substrate, and is substantially on the same plane as the second surface of the first encapsulation layer.
  • the display substrate includes a substrate, and a plurality of first insulating layers, and the plurality of first insulating layers are stacked on the substrate.
  • the plurality of first insulating layers includes at least one of a gate insulating layer, an interlayer dielectric layer, a passivation layer, a first planar layer, a second planar layer, a pixel defining layer, and a support portion.
  • Both the barrier portion and the first barrier wall include a sublayer or a plurality of sublayers stacked, and at least one sublayer is located in at least one layer of the plurality of first insulating layers.
  • the maximum height of the blocking portion is approximately equal to the maximum height of the first retaining wall.
  • the display panel further includes a second retaining wall disposed on a side of the first retaining wall away from the display area and surrounding the display area.
  • the second barrier includes a sublayer or a plurality of sublayers stacked, and at least one sublayer is located in at least one of the plurality of first insulating layers.
  • the maximum height of the second retaining wall is greater than the maximum height of the first retaining wall.
  • the display panel further has a peripheral area surrounding the display area, and the peripheral area includes a touch wiring area located on one side of the display area.
  • the distance between the blocking portion and the first barrier wall is the same as the distance between the blocking portion and the first blocking wall.
  • the ratio of the distance between the touch traces farthest from the display area among the plurality of touch traces is less than or equal to 3.
  • the barrier part in the peripheral area except the touch wiring area, along the direction of the plane where the display substrate is located, the barrier part is farthest from the plurality of touch wirings to the display.
  • the distance between the touch traces in the area ranges from 40 ⁇ m to 60 ⁇ m.
  • the distance between the barrier part and the first barrier wall ranges from 140 ⁇ m to 160 ⁇ m.
  • the display panel further includes a touch function layer disposed on the display substrate.
  • the touch function layer includes a plurality of first touch units and a plurality of second touch units, each first touch unit extends along a first direction, and the plurality of first touch units are arranged side by side along a second direction.
  • Each second touch unit extends along the second direction, and the plurality of second touch units are arranged side by side along the first direction.
  • each touch unit is electrically connected with at least one touch wire.
  • the touch function layer includes an electrode layer stacked on the display substrate, a second insulating layer and a bridging layer, the second insulating layer is located between the electrode layer and the bridging layer, and the bridging layer Located on the side of the electrode layer close to or away from the display substrate.
  • the first touch control unit includes a plurality of first touch electrodes and a plurality of first connection parts, and two adjacent first touch electrodes are electrically connected through the first connection parts.
  • the second touch unit includes a plurality of second touch electrodes and a plurality of second connection parts, and two adjacent second touch electrodes are electrically connected through the second connection parts.
  • first touch electrode, the first connection part and the second touch electrode are arranged on the electrode layer, and the second connection part is arranged on the bridging layer.
  • first touch electrode, the second touch electrode and the second connection part are arranged on the electrode layer, and the first connection part is arranged on the bridging layer.
  • the touch control wiring includes a first touch sub-wire disposed on the electrode layer and a second touch sub-wire disposed on the bridging layer, the first touch sub-wire and the The second touch sub-wires are electrically connected through at least one via hole in the second insulating layer.
  • the plurality of first touch electrodes and the plurality of second touch electrodes include a metal grid structure.
  • the display panel further includes at least one shielding line located on the side away from the display area of the plurality of touch control lines, and the orthographic projection of the shielding line on the display substrate is the same as the orthographic projection of the blocking portion.
  • the projections do not overlap, and are located in the area between the orthographic projection of the transition surface on the display substrate and the orthographic projection of the touch trace farthest from the display area among the plurality of touch traces on the display substrate.
  • the minimum thickness of the first packaging layer at the intersection of the touch wiring farthest from the display area and the first packaging layer among the plurality of touch wirings is greater than or equal to the The maximum thickness of the first encapsulation layer where the shielded wire overlaps the first encapsulation layer.
  • the ratio of the difference between the minimum thickness and the maximum thickness to the minimum thickness is within 30%.
  • a display device in another aspect, includes the display panel as described in any one of the above embodiments.
  • FIG. 1 is a structural diagram of a display panel according to some embodiments of the present disclosure
  • FIG. 2 is a partial enlarged view of the touch wiring area of the display panel in FIG. 1;
  • FIG. 3 is a partial enlarged view of the display panel at M in FIG. 1;
  • Fig. 4 is a sectional view of the display panel in Fig. 3 along the section line B-B';
  • FIG. 5 is another structural diagram of a display panel according to some embodiments of the present disclosure.
  • FIG. 6 is another structural diagram of a display panel according to some embodiments of the present disclosure.
  • FIG. 7 is a cross-sectional view of the display panel in FIG. 3 along the section line C-C';
  • FIG. 8 is a partially enlarged view of the display panel at N in FIG. 7;
  • FIG. 9 is a cross-sectional view of the display panel in FIG. 1 along the section line A-A';
  • FIG. 10 is another structural diagram of a display panel according to some embodiments of the present disclosure.
  • FIG. 11 is a cross-sectional view of the display panel in FIG. 10 along the section line D-D';
  • Fig. 12 is another structural diagram of a display panel according to some embodiments of the present disclosure.
  • FIG. 13 is a cross-sectional view of the display panel in FIG. 12 along the section line E-E';
  • Fig. 14 is another structural diagram of a display panel according to some embodiments of the present disclosure.
  • FIG. 15 is a cross-sectional view of the display panel in FIG. 14 along the section line F-F';
  • Fig. 16 is another structural diagram of a display panel according to some embodiments of the present disclosure.
  • FIG. 17 is a structural diagram of a display device according to some embodiments of the present disclosure.
  • FIG. 18 is a flowchart of a manufacturing method of a display panel according to some embodiments of the present disclosure.
  • FIG. 19 is a flowchart of another manufacturing method of a display panel according to some embodiments of the present disclosure.
  • FIG. 20 to FIG. 23 are diagrams of various steps of preparing a display panel according to some embodiments of the present disclosure.
  • first and second are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as “first” and “second” may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality” means two or more.
  • the expression “electrically connected” and its derivatives may be used.
  • the term “electrically connected” may be used when describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other.
  • a and/or B includes the following three combinations: A only, B only, and a combination of A and B.
  • Standard layer refers to a layer structure formed by using the same film-forming process to form a film layer for forming a specific pattern, and then using the same mask to form a patterning process.
  • a patterning process may include multiple exposure, development or etching processes, and the specific patterns in the formed layer structure can be continuous or discontinuous, and these specific patterns may also be at different heights Or have different thicknesses.
  • Exemplary embodiments are described herein with reference to cross-sectional and/or plan views that are idealized exemplary drawings.
  • the thickness of layers and regions are exaggerated for clarity. Accordingly, variations in shape from the drawings as a result, for example, of manufacturing techniques and/or tolerances are contemplated.
  • example embodiments should not be construed as limited to the shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an etched region illustrated as a rectangle will, typically, have curved features.
  • the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of example embodiments.
  • ink-jet printing technology is used to spray ink on the display side of the display panel, and after the ink is dried, an encapsulating film layer is formed to block water vapor and air.
  • the display panel has a display area and a peripheral area located around the display area. There is a retaining wall around the display area, and the retaining wall is used to block the flow of ink to prevent the ink from overflowing, and the position where the retaining wall is located is the cut-off position of inkjet printing.
  • the ink will climb along the side wall of the retaining wall, so that the area of the dried encapsulating film layer close to the retaining wall forms a climbing slope, and the climbing area of the encapsulating film layer corresponds to the peripheral area of the display panel.
  • photolithography is used to form a plurality of touch lines, and each touch line is connected to each touch panel located in the display area.
  • the unit is electrically connected and used for transmitting sensing signals to the touch unit.
  • the touch traces are located in the climbing area of the packaging film layer, in the process of preparing the touch traces by photolithography, the photoresist used in the photolithography process has fluidity, and is affected by gravity in the climbing area. Flow, resulting in uneven thickness of the photoresist layer after drying, which in turn causes the critical dimension bias (CD bias) of the touch trace not to meet the design value.
  • CD bias critical dimension bias
  • the ink in order to prevent the ink from overflowing from the retaining wall, it is necessary to reduce the amount of ink sprayed, but there is a shrinkage phenomenon after the ink is dried. Since the surface of the display substrate of the display panel has a groove, and the groove is located on the side of the barrier wall close to the display area, the shrinkage of the ink will make the cut-off position of inkjet printing unable to reach the barrier wall, that is, the boundary of the packaging film layer cannot reach the barrier wall. The walls, and even the encapsulation film cannot completely cover the trench. In the process of preparing touch traces by photolithography, the photoresist accumulates thicker in the grooves that are not covered by the packaging film layer. After exposure and development, the photoresist corresponding to the grooves cannot be completely removed, which leads to touch traces. The film layer between the wires remains, causing a short circuit in the touch wires.
  • some embodiments of the present disclosure provide a display panel 100.
  • the display panel 100 has a display area AA (English full name: Active Area) for displaying images.
  • the display panel 100 includes a display substrate 1 having a display side B, and the display side B of the display substrate 1 can display images.
  • the display panel 100 further includes a first retaining wall 2, the first retaining wall 2 is arranged on the display side B of the display substrate 1, and the first retaining wall 2 is arranged around the display area AA, that is, the first retaining wall 2
  • the shape of the orthographic projection of the barrier wall 2 on the display substrate 1 is a closed ring.
  • the display panel 100 further includes a blocking portion 3 disposed between the first blocking wall 2 and the display area AA, and at least part of the blocking portion 3 is disposed around the display area AA.
  • the display panel 100 further includes a first encapsulation layer 4 , and the first encapsulation layer 4 at least covers the display area AA.
  • the first packaging layer 4 includes a first surface 41 close to the display substrate 1 , a second surface 42 away from the display substrate 1 , and a transition surface 43 connecting the first surface 41 and the second surface 42 .
  • inkjet printing technology is used to spray ink on the display side B of the display substrate 1, and the first encapsulation layer 4 is formed after the ink is dried to absorb water vapor.
  • Both the blocking part 3 and the first blocking wall 2 can block the ink, so as to prevent the ink from flowing around.
  • the ink since the ink has fluidity, and the ink is leveled by gravity, in the first encapsulation layer 4 formed after the ink is dried, the first surface 41 of the first encapsulation layer 4 and the surface of the display substrate 1 Correspondingly, the transition surface 43 of the first encapsulation layer 4 is not flat, and the second surface 42 of the first encapsulation layer 4 is relatively flat.
  • the shape of the surface of the transition surface 43 of the first encapsulation layer 4 depends on the cut-off position of the inkjet printing, if the cut-off position of the inkjet printing reaches the blocking portion 3, the surface shape of the transition surface 43 will be in contact with it.
  • the surface of the blocking part 3 is adapted.
  • the surface of the barrier portion 3 that the transition surface 43 of the first encapsulation layer 4 contacts is an arc-shaped slope surface 31, and the shape of the transition surface 43 of the first encapsulation layer 4 is an arc surface. The face is bent towards the inside of the first encapsulation layer 4 .
  • the first encapsulation layer 4 is an organic barrier layer, which has the functions of flexibility and water vapor absorption.
  • the material of the ink required to prepare the first encapsulation layer 4 may include an acrylic-based polymer.
  • the display panel 100 further includes a plurality of touch wires 5 disposed on a side of the first packaging layer 4 away from the display substrate 1 .
  • the orthographic projection of the plurality of touch lines 5 on the display substrate 1 at least partially overlaps with the orthographic projection of the second surface 42 of the first encapsulation layer 4 on the display substrate 1 , and overlaps with the orthographic projection of the transition surface 43 on the display substrate 1 .
  • the projections are staggered.
  • each touch wire 5 is electrically connected to each touch unit located in the display area AA, and is used for transmitting sensing signals to the touch unit.
  • the orthographic projections of the plurality of touch wires 5 on the display substrate 1 are located within the range of the orthographic projections of the second surface 42 on the display substrate 1 , and are staggered from the orthographic projections of the transition surface 43 on the display substrate 1 .
  • the orthographic projection of at least part of the transition surface 43 of the first encapsulation layer 4 on the display substrate 1 is located at the boundary S2 of the orthographic projection of the blocking portion 3 on the display substrate 1 away from the display area AA, An area C between the orthographic projection of the touch wiring 5 farthest from the display area AA among the plurality of touch wiring 5 on the display substrate 1 .
  • the orthographic projections of the transition surface 43 on the display substrate 1 are all located, and the orthographic projection of the blocking portion 3 on the display substrate 1 is far away from the boundary S2 of the display area AA, which is farthest from the display area AA among the plurality of touch traces 5 .
  • the orthographic projection of the transition surface 43 of the first encapsulation layer 4 on the display substrate 1 is located, and the orthographic projection of the blocking portion 3 on the display substrate 1 is away from the boundary S2 of the display area AA.
  • the area C between the orthographic projection of the touch wiring 5 farthest from the display area AA among the plurality of touch wiring 5 on the display substrate 1, that is, the cut-off position of inkjet printing is the blocking part 3, and the first package
  • the boundary of the layer 4 can reach the barrier 3 .
  • a plurality of touch wires 5 are arranged on the side of the first encapsulation layer 4 away from the display substrate 1 (the second surface of the first encapsulation layer 4 Surface 42), to avoid disposing multiple touch traces 5 on the transition surface 43 of the first packaging layer 4, which is beneficial to control the critical dimension bias (CD bias) of the touch traces 5.
  • CD bias critical dimension bias
  • the orthographic projection of the plurality of touch wires 5 on the display substrate 1 at least partially overlaps with the orthographic projection of the second surface 42 on the display substrate 1 , and is offset from the orthographic projection of the transition surface 43 on the display substrate 1 .
  • the second surface 42 of the first encapsulation layer 4 can cover the area corresponding to the touch trace 5 on the display substrate 1 , so as to improve the flatness of the surface of the display substrate 1 located in this area. In the process of preparing the touch wires 5 by photolithography, it is possible to avoid film residue between the touch wires 5 due to incomplete removal of the photoresist, thereby avoiding a short circuit of the touch wires 5 .
  • the acute angle between the slope 31 of the blocking portion 3 and the plane where the display substrate 1 is located ranges from 40° to 60°, for example, The slope of the slope 31 is 40°, 45°, 50°, 55° or 60°.
  • the minimum included angle between the transition surface 43 of the first encapsulation layer 4 and the first surface 41 ranges from 40° to 90°.
  • the minimum included angle is 40°, 50°, 65°, 80° or 90°.
  • the minimum included angle between the transition surface 43 of the first encapsulation layer 4 and the second surface 42 ranges from 0° to 90°, for example, the minimum included angle is 0°, 30°, 45°, 80° or 90°.
  • a configuration of the first encapsulation layer 4 is introduced below.
  • At least part of the boundary S1 of the orthographic projection of the blocking portion 3 on the display substrate 1 close to the display area AA is located on the transition surface 43 of the first encapsulation layer 4 on the display substrate. 1 in the range of the orthographic projection.
  • the boundary S1 of the orthographic projection of the blocking portion 3 on the display substrate 1 close to the display area AA is located within the range of the orthographic projection of the transition surface 43 of the first encapsulation layer 4 on the display substrate 1 .
  • At least part of the boundary S1 of the orthographic projection of the blocking portion 3 on the display substrate 1 close to the display area AA is located within the range of the orthographic projection of the transition surface 43 of the first encapsulation layer 4 on the display substrate 1, including The following situations:
  • the boundary S1 close to the display area AA of the orthographic projection of the barrier portion 3 on the display substrate 1 at least partially coincides with the boundary of the orthographic projection of the transition surface 43 of the first encapsulation layer 4 on the display substrate 1 .
  • the boundary S1 of the orthographic projection of the blocking portion 3 on the display substrate 1 and close to the boundary S1 of the display area AA is located within the range of the orthographic projection of the transition surface 43 of the first encapsulation layer 4 on the display substrate 1, and the blocking portion 3 is in the display area.
  • the boundary S1 of the orthographic projection on the substrate 1 close to the display area AA does not coincide with the boundary of the orthographic projection of the transition surface 43 of the first encapsulation layer 4 on the display substrate 1 .
  • the boundary S1 is an area E between the orthographic projection of the touch wiring 5 farthest from the display area AA among the plurality of touch wirings 5 on the display substrate 1 .
  • the boundary of the orthographic projection of the first surface 41 of the first encapsulation layer 4 on the display substrate 1 is located at the boundary S1 of the orthographic projection of the barrier part 3 on the display substrate 1 close to the display area AA, and is connected to the plurality of contact strips.
  • the area E between the orthographic projections of the touch traces 5 farthest from the display area AA on the display substrate 1 in 5 includes the following situations:
  • the boundary of the orthographic projection of the first surface 41 on the display substrate 1 coincides with the boundary S1 of the orthographic projection of the blocking portion 3 on the display substrate 1 close to the display area AA.
  • the boundary of the orthographic projection of the first surface 41 on the display substrate 1 coincides with the orthographic projection of the touch trace 5 farthest from the display area AA among the plurality of touch traces 5 on the display substrate 1 .
  • the boundary of the orthographic projection of the first surface 41 on the display substrate 1 is located at the boundary S1 of the orthographic projection of the blocking portion 3 on the display substrate 1 that is close to the display area AA, and is farthest from the plurality of touch lines 5 to the display.
  • the boundary of the orthographic projection of the first surface 41 on the display substrate 1 does not coincide with the boundary S1 of the orthographic projection of the blocking portion 3 on the display substrate 1 close to the display area AA; the boundary of the first surface 41 on the display substrate 1 The boundary of the orthographic projection does not coincide with the orthographic projection of the touch wiring 5 farthest from the display area AA among the plurality of touch wirings 5 on the display substrate 1 .
  • At least part of the boundary of the orthographic projection of the second surface 42 of the first encapsulation layer 4 on the display substrate 1 is located near the display area AA of the orthographic projection of the blocking portion 3 on the display substrate 1
  • the boundary of the orthographic projection of the second surface 42 of the first encapsulation layer 4 on the display substrate 1 is located at the boundary S1 of the orthographic projection of the barrier part 3 on the display substrate 1 close to the display area AA, and the barrier part 3 An area D between the boundaries S2 away from the display area AA of the orthographic projection on the display substrate 1 .
  • the boundary of the orthographic projection of the second surface 42 of the first encapsulation layer 4 on the display substrate 1 is located at the boundary S1 of the orthographic projection of the blocking portion 3 on the display substrate 1 close to the display area AA, and
  • the orthographic projection of the blocking portion 3 on the display substrate 1 includes the following situations:
  • the boundary of the orthographic projection of the second surface 42 on the display substrate 1 coincides with the boundary S1 of the orthographic projection of the blocking portion 3 on the display substrate 1 close to the display area AA.
  • the boundary of the orthographic projection of the second surface 42 on the display substrate 1 coincides with the boundary S2 of the orthographic projection of the blocking portion 3 on the display substrate 1 away from the display area AA.
  • the boundary of the orthographic projection of the second surface 42 on the display substrate 1 is located within the range of the orthographic projection of the blocking portion 3 on the display substrate 1 . Moreover, the boundary of the orthographic projection of the second surface 42 on the display substrate 1 does not coincide with the boundary S1 of the orthographic projection of the blocking portion 3 on the display substrate 1 close to the display area AA; the boundary of the second surface 42 on the display substrate 1 The boundary of the orthographic projection does not coincide with the boundary S2 of the orthographic projection of the blocking portion 3 on the display substrate 1 that is far away from the display area AA.
  • the inkjet printing ink exceeds at least part of the boundary S1 of the orthographic projection of the blocking portion 3 on the display substrate 1 near the display area AA, and the ink just does not overflow the blocking portion 3, improving The phenomenon that the ink climbs along the slope 31 of the edge portion of the blocking portion 3 close to the display area AA is avoided.
  • at least part of the boundary S1 of the orthographic projection of the blocking portion 3 on the display substrate 1 close to the display area AA is located within the range of the orthographic projection of the transition surface 43 of the first encapsulation layer 4 on the display substrate 1 , to ensure the flatness of the second surface 42 of the first encapsulation layer 4 .
  • the edge portion of the first encapsulation layer 4 close to the barrier portion 3 climbs up along the slope 31 .
  • the edge portion of the first encapsulation layer 4 near the blocking portion 3 climbs up along the slope 31, because the amount of ink sprayed is relatively large, and the fluidity of the ink fills up the slope 31 area of the blocking portion 3, thereby The phenomenon that the ink climbs along the slope of the blocking portion 3 is improved, which is beneficial to improving the flatness of the second surface 42 of the first encapsulation layer 4 .
  • the transition surface 43 of the first encapsulation layer 4 is an arc surface, and the shape of the arc surface is adapted to the shape of the slope surface 31 .
  • the edge portion of the first encapsulation layer 4 close to the barrier portion 3 climbs up along the slope 31, and the transition surface 43 of the first encapsulation layer 4 is in contact with the slope 31 of the barrier 3 (actually, the slope of the barrier 3
  • the slope surface 31 is also covered with an encapsulation film layer, and the transition surface 43 of the first encapsulation layer 4 is in contact with the encapsulation film layer). Due to the fluidity of the ink of inkjet printing, the first encapsulation layer 4 formed after drying can be better bonded to the barrier portion 3 (the encapsulation film layer covering the slope 31), so that the first encapsulation layer 4
  • the shape of the arc is adapted to the shape of the slope 31 .
  • the transition surface 43 of the first encapsulation layer 4 is an arc surface, and the arc surface bends toward the inside of the first encapsulation layer 4 .
  • the barrier portion 3 has a slope surface 31.
  • the transition surface 43 of the first encapsulation layer 4 is adapted to the side surface of the barrier portion 3, the transition surface of the first encapsulation layer 4 43 is an arc surface, and the arc surface bends toward the inside of the first encapsulation layer 4 .
  • At least part of the boundaries of the orthographic projections of the first surface 41 and the second surface 42 of the first encapsulation layer 4 on the display substrate 1 are located, and the barrier part 3 is on the display substrate 1
  • the boundaries of the orthographic projections of the first surface 41 and the second surface 42 of the first encapsulation layer 4 on the display substrate 1 are both located, and the boundary of the orthographic projection of the blocking part 3 on the display substrate 1 is close to the boundary of the display area AA S1 , an area E between the orthographic projection of the touch wiring 5 farthest from the display area AA among the plurality of touch wiring 5 on the display substrate 1 .
  • the boundary of the orthographic projection of the first surface 41 and the second surface 42 of the first encapsulation layer 4 on the display substrate 1 is located in the near display area of the orthographic projection of the blocking part 3 on the display substrate 1
  • the area E between the boundary S1 of AA and the orthographic projection of the touch wiring 5 farthest from the display area AA on the display substrate 1 among the plurality of touch wiring 5 includes the following situations:
  • the boundary of the orthographic projection of the first surface 41 and the second surface 42 of the first encapsulation layer 4 on the display substrate 1 coincides with the boundary S1 of the orthographic projection of the blocking portion 3 on the display substrate 1 near the display area AA.
  • the boundaries of the orthographic projections of the first surface 41 and the second surface 42 of the first encapsulation layer 4 on the display substrate 1 are all connected to the touch wiring 5 farthest from the display area AA among the plurality of touch wirings 5 on the display.
  • the orthographic projections on substrate 1 are coincident.
  • the boundaries of the orthographic projections of the first surface 41 and the second surface 42 of the first encapsulation layer 4 on the display substrate 1 are both located at the boundary S1 of the orthographic projection of the blocking portion 3 on the display substrate 1 close to the display area AA, An area E between the orthographic projection of the touch wiring 5 farthest from the display area AA among the plurality of touch wiring 5 on the display substrate 1 .
  • the boundaries of the orthographic projections of the first surface 41 and the second surface 42 on the display substrate 1 do not coincide with the boundary S1 of the orthographic projection of the blocking portion 3 on the display substrate 1 close to the display area AA; the first surface 41 The boundary of the orthographic projection of the second surface 42 on the display substrate 1 does not coincide with the orthographic projection of the touch wiring 5 farthest from the display area AA among the plurality of touch wirings 5 on the display substrate 1 .
  • the boundary of the orthographic projection of the first surface 41 and the second surface 42 of the first encapsulation layer 4 on the display substrate 1 does not reach or just reaches the barrier portion 3 on the display substrate.
  • the orthographic projection on 1 is close to at least part of the boundary S1 of the display area AA. It can be seen that during the drying process of the ink, the amount of ink sprayed is relatively small, so that the ink is not enough to climb along the slope 31 of the blocking portion 3 . Moreover, due to the fluidity of the ink, the ink can be leveled under the action of gravity, so that the second surface 42 of the first encapsulation layer 4 is relatively flat.
  • the amount of ink sprayed should ensure that the printing cut-off position of the ink can reach the touch trace 5 farthest from the display area AA among the plurality of touch traces 5, so that the first surface 41 of the first packaging layer 4 At least part of the border of the orthographic projection of the second surface 42 on the display substrate 1 reaches or exceeds the orthographic projection of the touch wiring 5 farthest from the display area AA among the plurality of touch wiring 5 on the display substrate 1, so that The orthographic projections of the plurality of touch wires 5 on the display substrate 1 are within the range of the orthographic projection of the first encapsulation layer 4 on the display substrate 1 .
  • the transition surface 43 of the first encapsulation layer 4 is substantially perpendicular to the plane where the display substrate 1 is located.
  • the side surfaces of the blocking portion 3 are substantially perpendicular to the plane where the display substrate 1 is located.
  • the transition surface 43 of the first encapsulation layer 4 is adapted to the side surface of the blocking portion 3 , so the transition surface 43 of the first encapsulation layer 4 is approximately equal to the plane where the display substrate 1 is located. vertical.
  • the display panel 100 provided in some embodiments of the present disclosure is described by taking the display panel 100 as an organic light-emitting diode (Organic Light-Emitting Diode, OLED for short) display panel as an example.
  • OLED Organic Light-Emitting Diode
  • the display substrate 1 includes a substrate 10 , and a driving circuit and a light emitting device stacked on the substrate 10 .
  • the substrate 10 can be a flexible substrate, which can improve the flexibility of the display substrate 1 and make the display substrate 1 bendable and bendable, so as to expand the application range of the display substrate 1 .
  • the substrate 10 may also be set as a rigid substrate, and the performance of the substrate 10 may be determined according to actual requirements of the product.
  • the substrate 10 may be a single-layer structure, for example, the substrate 10 is a glass substrate.
  • the substrate 10 may be a multilayer structure, for example, as shown in FIG. 103.
  • the substrate 10 may include a polyimide layer and a buffer layer that are sequentially stacked.
  • the substrate 10 may include a plurality of polyimide layers and a plurality of buffer layers stacked.
  • the material of the buffer layer 102 may include inorganic materials, for example, the material of the buffer layer 102 may include silicon nitride, silicon oxide or silicon oxynitride, so as to block water vapor, air and alkaline ions.
  • the display substrate 1 includes an active layer 104 , a first gate insulating layer 105 , a first gate conductive layer 106 , a second The gate insulating layer 107 , the second gate conductive layer 108 , the interlayer dielectric layer 109 and the first source-drain conductive layer 110 .
  • the first gate insulating layer 105 insulates between the active layer 104 and the first gate conductive layer 106
  • the second gate insulating layer 107 insulates between the first gate conductive layer 106 and the second gate conductive layer 108
  • the interlayer dielectric layer 109 insulates the second gate conductive layer 108 from the first source-drain conductive layer 110 .
  • the driving circuit includes multiple thin film transistors TFT and multiple capacitor structures C1 , and FIG. 9 shows a situation of one thin film transistor TFT and one capacitor structure C1 .
  • the thin film transistor TFT may include an active layer 104, a first gate insulating layer 105, a gate 106A disposed in the first gate conductive layer 106, a second gate insulating layer 107, an interlayer dielectric layer 109 .
  • the source electrode 110A and the drain electrode 110B disposed in the first source-drain conductive layer 110 .
  • the active layer 104 can be disposed on the substrate 10, the first gate insulating layer 105 covers the substrate 10 and the active layer 104, and the gate 106A is disposed on the side of the first gate insulating layer 105 away from the substrate 10.
  • the second gate insulating layer 107 covers the gate 106A and the first gate insulating layer 105
  • the interlayer dielectric layer 109 covers the second gate insulating layer 107
  • the source 110A and the drain 110B are arranged on the interlayer dielectric layer 109 away from the side of the substrate 10, the source 110A and the drain 110B can respectively pass through the via holes penetrating through the interlayer dielectric layer 109, the second gate insulating layer 107 and the first gate insulating layer 105 and the active layer.
  • 104 electrical connections are provided.
  • the gate 106A is disposed on the side of the active layer 104 away from the substrate 10 , that is, the gate 106A is located above the active layer 104 , and the thin film transistor TFT is a top-gate thin film transistor.
  • the gate 106A may also be disposed on the side of the active layer 104 close to the substrate 10 , that is, the gate 106A is located below the active layer 104 , and the thin film transistor TFT is a bottom gate thin film transistor.
  • the materials of the first gate insulating layer 105, the second gate insulating layer 107, and the interlayer dielectric layer 109 all include inorganic materials, for example, the materials may include silicon oxide, silicon nitride, or silicon oxynitride, etc., It can block water vapor, air and alkaline ions.
  • the material of the source electrode 110A and the drain electrode 110B may include a metal material or an alloy material, for example, the material of the source electrode 110A and the drain electrode 110B may include molybdenum, aluminum or titanium.
  • the source electrode 110A and the drain electrode 110B may have a single-layer structure, for example, both the source electrode 110A and the drain electrode 110B are a molybdenum metal layer, an aluminum metal layer, or a titanium metal layer.
  • the source electrode 110A and the drain electrode 110B may have a multi-layer structure, for example, both the source electrode 110A and the drain electrode 110B are three-layer metal stacks of titanium (Ti), aluminum (Al), and titanium (Ti).
  • the capacitive structure C1 may include a first plate 106B disposed in the first gate conductive layer 106, and a second plate 108A disposed in the second gate conductive layer 108.
  • the first plate 106B and The gate electrode 106A is arranged in the same layer, and the second electrode plate 108A is arranged between the second gate insulating layer 107 and the interlayer dielectric layer 109 , and is arranged opposite to the first electrode plate 106B.
  • the materials of the grid 106A, the first pole plate 106B, and the second pole plate 108A may include metal materials or alloy materials, for example, the materials may include molybdenum, aluminum, or titanium.
  • the display substrate 1 further includes a planarization layer (PLN for short) disposed on the substrate 10 .
  • the display substrate 1 is provided with a groove 6 between the barrier portion 3 and the display area AA, the groove 6 at least partially surrounds the display area AA, and along the thickness direction Z of the display substrate 1 , the groove 6 at least partially penetrates the flat layer.
  • the display substrate 1 further includes a first gate driving circuit and a second gate driving circuit arranged on the substrate 10, and the first gate driving circuit and the second gate driving circuit are arranged in parallel along the first direction X set up.
  • the trench 6 is at least partially located in the region between the first gate drive circuit and the second gate drive circuit, the orthographic projection of the trench 6 on the substrate 10, and the first gate drive circuit on the substrate 10 The orthographic projections do not overlap, and do not overlap with the orthographic projections of the second gate driving circuit on the substrate 10 .
  • the planar layer can be a single-layer structure or a multi-layer structure.
  • the material of the planar layer may include an organic material, for example, the material of the planar layer may include photoresist, acrylic-based polymer or silicon-based polymer, and the like.
  • the trench 6 partially surrounds the display area AA.
  • the layout space of the touch wires 5 is limited and the number of the touch wires 5 is large, at least one touch wire 5 among the plurality of touch wires 5
  • the orthographic projection on the display substrate 1 at least partially overlaps with the area where the groove 6 is located.
  • the orthographic projection of one touch wiring 5 among the plurality of touch wiring 5 on the display substrate 1 overlaps with the area where the groove 6 is located.
  • the planar layer includes a first planar layer 112 disposed on the substrate 10 , and a second planar layer disposed on the side of the first planar layer 112 away from the substrate 10 114.
  • first planar layer 112 and the second planar layer 114 may be a single-layer structure, or may be a multi-layer structure.
  • the trench 6 at least partially penetrates the first planar layer 112 .
  • the trench 6 at least partially penetrates the second planar layer 114 .
  • the groove 6 at least partially penetrates the first planar layer 112 and the second planar layer 114 .
  • first source-drain conductive layer 110 and the second source-drain conductive layer 113 are not provided in the area where the trench 6 is located. Therefore, the first planar layer 112 and the second planar layer 112 do not need to be provided in the area where the trench 6 is located.
  • the layer 114 can be understood as that the groove 6 at least partially penetrates the first planar layer 112 and the second planar layer 114 .
  • the first encapsulation layer 4 includes a filling portion 44 filling the trench 6 , and a covering portion 45 located in at least part of the display substrate 1 except the trench 6 .
  • the filling part 44 of the first encapsulation layer 4 is on a side far away from the display substrate 1 , and is substantially in the same plane as the covering part 45 is on a side far away from the display substrate 1 .
  • the covering portion 45 of the first encapsulation layer 4 is disposed in a part of the display substrate 1 except for the groove 6 .
  • the ink can fill up the groove 6 under the action of gravity.
  • the filling part 44 of the formed first encapsulation layer 4 is formed on the side away from the display substrate 1, and the covering part 45 is formed.
  • the side away from the display substrate 1 is substantially on the same plane.
  • the groove 6 is filled with ink, so that the second surface 42 of the first encapsulation layer 4 is relatively flat.
  • the display substrate 1 further includes a passivation layer 111 disposed between the first source-drain conductive layer 110 and the first planar layer 112 , and the passivation layer 111 covers the source electrode.
  • 110A and the drain 110B serve to protect the source 110A and the drain 110B.
  • the material of the passivation layer 111 may include inorganic materials, for example, the material of the passivation layer 111 may include silicon oxide, silicon nitride, or silicon oxynitride.
  • the display substrate 1 further includes a second source-drain conductive layer 113 disposed on the side of the first flat layer 112 away from the substrate 10 , and the second source-drain conductive layer 113 Including the via electrode 113A, the via electrode 113A is electrically connected to the source electrode 110A or the drain electrode 110B through a via hole penetrating through both the first planar layer 112 and the passivation layer 111.
  • FIG. 9 shows that the via electrode 113A passes through the A situation where the vias of both the first planar layer 112 and the passivation layer 111 are electrically connected to the source 110A.
  • the material of the via electrode 113A may include a metal material or an alloy material, for example, the material of the via electrode 113A may include molybdenum, aluminum, or titanium.
  • the via electrodes 113A may have a single-layer structure, for example, all of the via electrodes 113A are molybdenum metal layers, aluminum metal layers, or titanium metal layers.
  • the via electrode 113A may be a multi-layer structure, for example, the via electrode 113A is a three-layer metal stack of titanium (Ti), aluminum (Al), and titanium (Ti).
  • the display substrate 1 further includes a first electrode 115 disposed on the side of the second flat layer 114 away from the substrate 10 , and the first electrode 115 passes through the second flat layer 114
  • the via holes of the vias are electrically connected to the transfer electrode 113A, so that the voltage signal is transmitted from the source electrode 110A to the first electrode 115 through the transfer electrode 113A.
  • the material of the first electrode 115 may include indium tin oxide, indium zinc oxide or zinc oxide and the like.
  • the display substrate 1 further includes a pixel defining layer 116 disposed on the side of the second planar layer 114 away from the substrate 10 .
  • the pixel defining layer 116 has a plurality of openings, each Each opening exposes at least part of the first electrode 115, and each opening is located in a sub-pixel area.
  • each opening exposes a middle portion of the first electrode 115
  • the pixel defining layer 116 covers an edge portion of the first electrode 115 .
  • the material of the pixel defining layer 116 may include an organic material, for example, the material of the pixel defining layer 116 may include photoresist.
  • the light emitting device includes a first electrode 115 , a light emitting functional layer EL and a second electrode 118 .
  • the luminescent functional layer EL is located in the opening of the pixel defining layer 116 and formed on the first electrode 115.
  • the luminescent functional layer EL may include a small molecular organic material or a polymer molecular organic material, and may be a fluorescent luminescent material. Or phosphorescent light-emitting materials, which can emit red light, green light, blue light, or white light.
  • the luminescent functional layer EL can further include an electron transport layer (election transporting layer, ETL for short), an electron injection layer (election injection layer, EIL for short), a hole transport layer ( One or more layers in the hole transporting layer (HTL for short) and the hole injection layer (HIL for short).
  • the second electrode 118 covers the light-emitting functional layer EL, and the polarity of the second electrode 118 is opposite to that of the first electrode 115 .
  • an electric field is formed between the first electrode 115 and the second electrode 118 to excite the light-emitting functional layer EL to emit light.
  • the first electrode 115 may be an anode
  • the second electrode 118 may be a cathode
  • the material of the second electrode 118 may include lithium, aluminum, magnesium or silver and the like.
  • the display panel 100 may include a plurality of sub-pixel regions arranged in an array, each sub-pixel region is provided with a light-emitting device, and the second electrodes 118 of each light-emitting device are connected across the entire surface, that is, The second electrode 118 is a planar electrode disposed on the display substrate 200 and serves as a common electrode of each light emitting device.
  • the display substrate 1 further includes a support portion 117 disposed on the side of the pixel defining layer 116 away from the substrate 10 , the support portion 117 can support and protect the film layer below it. effect.
  • the protective film layer mainly appears during the transfer process of the semi-finished product to avoid damage to the semi-finished product during the transfer process.
  • a protective film layer can be covered, and the protective film layer can be removed when the luminescent material needs to be evaporated.
  • the supporting part 232 can prevent the device from contacting the first electrode 115 and causing damage to the first electrode 115 .
  • the supporting part 232 can prevent the device from contacting the light-emitting functional layer EL, which may affect the light-emitting effect of the light-emitting functional layer EL.
  • the supporting portion 117 may be made of the same material as the pixel defining layer 116 and be disposed on the same layer.
  • a structure of the blocking portion 3 is introduced below.
  • the display panel 100 further has a peripheral area BB surrounding the display area AA, and the peripheral area BB includes a touch wiring area FA located on one side of the display area AA.
  • the first blocking wall 2 and the blocking portion 3 are disposed in the peripheral area BB, and the portion of the blocking portion 3 located in the touch wiring area FA is provided with an opening 32 .
  • the blocking portion 3 in the process of inkjet printing, when the amount of ink sprayed is large, the ink can preferentially overflow from the blocking portion 3 at the opening 32 of the touch wiring area FA, which can The flow direction of the ink plays a controlling role, preventing the ink from overflowing from the part of the blocking part 3 outside the touch wiring area FA.
  • the opening 32 of the blocking portion 3 is funnel-shaped.
  • the end with a larger diameter is close to the display area AA, and the end with a smaller diameter is close to the first The part of the retaining wall 2 located in the touch routing area FA.
  • the opening 32 of the blocking portion 3 By setting the opening 32 of the blocking portion 3 in a funnel shape, the opening 32 can drain the ink, which is beneficial for the ink to overflow from the opening 32 .
  • the end with a larger diameter is close to the display area AA, and the end with a smaller diameter is close to the part of the first retaining wall 2 located in the touch wiring area FA, so that the ink can flow from the opening 32 through a larger diameter.
  • One end of the nozzle flows to the end with a smaller diameter, which plays a role in converging the ink.
  • the blocking portion 3 includes a main body portion 33 and two edges 34, the main body portion 33 is located in the peripheral area BB except the touch wiring area FA, and each edge At least part of 34 is located in the touch wiring area FA.
  • part of each edge 34 is located in the touch wiring area FA, and part is located in the peripheral area BB except the touch wiring area FA.
  • the two edges 34 are respectively located on opposite sides of the center line L1 of the display substrate 1 extending along the first direction Y, and are respectively connected to the two ends of the main body portion 33 , and a blocking portion is formed between the two edges 34 3, so that ink can overflow from the opening 32 between the two edges 34.
  • the first direction Y is a direction substantially perpendicular to the boundary line L2 between the display area AA and the touch wiring area FA.
  • each edge 34 includes a connecting segment 341 and a guiding segment 342 , one end of the connecting segment 341 is connected to the main body portion 33 , and the other end of the connecting segment 341 is connected to the guiding segment 342 .
  • the distance D1 between the ends of the two guide segments 342 close to the connecting segment 341 is greater than the distance D2 between the ends of the two guide segments 342 away from the connecting segment 341, that is, the two guide segments 342 are funnel-shaped
  • the two guide segments 342 play a role in draining the ink, which is beneficial for the ink to overflow from the opening 32, and the two guide segments 342 have a converging effect on the ink.
  • the arc transition between the connecting section 341 and the guiding section 342 of the edge 34 can reduce the resistance to ink at the connection between the connecting section 341 and the guiding section 342 , which facilitates the flow of ink along the connecting section 341 to the guiding section 342 .
  • FIG. 1 and FIG. 2 there is a gap G between the guiding section 342 of the edge 34 and the part of the first barrier wall 2 located in the touch wiring area FA.
  • the ink overflows from the opening 32 of the blocking part 3 through the gap G between the guide section 342 and the first retaining wall 2, which can control the flow of the ink and prevent the ink from flowing
  • the part of the barrier part 3 outside the touch wiring area FA overflows.
  • the gap G between the guide section 342 of the edge 34 and the part of the first retaining wall 2 located in the touch wiring area FA ranges from 40 ⁇ m to 60 ⁇ m, for example, the gap distance is 40 ⁇ m, 45 ⁇ m, 50 ⁇ m, 55 ⁇ m or 60 ⁇ m.
  • the maximum dimension of the opening 32 of the blocking portion 3 along the second direction X (that is, the distance D1 between the ends of the two guiding segments 342 close to the connecting segment 341 ), is the same as,
  • the ratio of the largest dimension D3 along the second direction X of the part of the retaining wall 2 located in the touch wiring area FA is greater than or equal to 0.5 and less than 1, for example, the ratio is 0.5, 0.6, 0.7, 0.8, 0.9 or 0.98.
  • the second direction X is substantially parallel to the boundary line between the display area AA and the touch wiring area FA.
  • the touch wire area FA among the plurality of touch wires 5 located in the touch wire area FA, at least part of the touch wires 5 do not overlap with the barrier portion 3 .
  • each touch trace 5 includes a lead segment disposed in the touch trace area FA, and a trace segment disposed in the peripheral area BB except the touch trace area FA.
  • One end of the lead segment is electrically connected to the wiring segment, and the other end is electrically connected to the touch signal terminal.
  • the surface of the region where the barrier portion 3 is provided on the display substrate 1 may not be flat. During the process, the remaining film layer between the touch traces 5 due to incomplete removal of the photoresist can be avoided, thereby avoiding short circuit of the touch traces 5 .
  • all the touch wires 5 located in the touch wire area FA do not overlap with the barrier part 3 .
  • the blocking portion 3 is arranged around the display area AA, so that the ink of the inkjet printing can flow in the area surrounded by the blocking portion 3 and prevent the ink from overflowing the blocking portion 3 .
  • the display panel 100 further includes a second encapsulation layer 7, the second encapsulation layer 7 is disposed between the display substrate 1 and the first encapsulation layer 4, and the second encapsulation layer 7 covers at least the display area AA, the blocking portion 3 and the first blocking wall 2 .
  • the part of the second encapsulation layer 7 covering the barrier portion 3 is away from the surface of the display substrate 1 , and is substantially in the same plane as the second surface 42 of the first encapsulation layer 4 . It can be understood that the ink just does not overflow the blocking portion 3, and the ink fills up the slope 31 of the blocking portion 3, which improves the climbing phenomenon of the ink along the slope of the blocking portion 3, and improves the first encapsulation layer 4. The flatness of the two faces 42 .
  • the second encapsulation layer 7 is an inorganic barrier layer, which has the function of blocking water vapor and air.
  • the material of the second encapsulation layer 7 may include silicon nitride, silicon oxide or silicon oxynitride and the like.
  • the display panel 100 further includes a third encapsulation layer 8 , the third encapsulation layer 8 is disposed on the side of the first encapsulation layer 4 away from the display substrate 1 , and the third encapsulation layer 8
  • the layer 8 at least covers the display area AA, the blocking portion 3 and the first blocking wall 2, and has the function of blocking water vapor and air.
  • the third encapsulation layer 8 is an inorganic barrier layer.
  • the material of the third encapsulation layer 8 may include silicon nitride, silicon oxide, or silicon oxynitride.
  • the display substrate 1 includes a substrate 10, and a plurality of first insulating layers stacked on the substrate 10, and the plurality of first insulating layers include the aforementioned Gate insulating layer (first gate insulating layer 105 and second gate insulating layer 107), interlayer dielectric layer 109, passivation layer 111, first flat layer 112, second flat layer 114, pixel defining layer 116 and at least one of the support parts 117 .
  • both the blocking portion 3 and the first blocking wall 2 include a sublayer or a plurality of sublayers stacked, and at least one sublayer is located in at least one of the plurality of first insulating layers.
  • the blocking portion 3 includes two sub-layers stacked, one sub-layer is disposed on the second planar layer 114 , and the other sub-layer is disposed on the pixel defining layer 116 .
  • one sublayer of the blocking portion 3 is disposed on the first flat layer 112 , and the other sublayer is disposed on the pixel defining layer 116 .
  • one sublayer of the barrier part 3 is disposed on the first planar layer 112 , and the other sublayer is disposed on the second planar layer 114 .
  • the first retaining wall 2 includes two sub-layers stacked, one sub-layer is disposed on the second flat layer 114 , and the other sub-layer is disposed on the pixel defining layer 116 .
  • one sublayer of the first barrier wall 2 is disposed on the first flat layer 112, and the other sublayer is disposed on the pixel defining layer 116.
  • one sublayer of the first retaining wall 2 is disposed on the first flat layer 112
  • the other sublayer is disposed on the second flat layer 114 .
  • the maximum height of the blocking portion 3 is substantially equal to the maximum height of the first blocking wall 2 .
  • one sublayer of the blocking portion 3 is disposed on the second flat layer 114, another sublayer is disposed on the pixel defining layer 116, and one sublayer of the first barrier 2 is disposed on the second flat layer 114.
  • the flat layer 114 and another sub-layer are disposed on the pixel defining layer 116 . Since the membrane structure of the barrier part 3 is the same as that of the first barrier wall 2 , the maximum height of the barrier part 3 is approximately equal to the maximum height of the first barrier wall 2 .
  • the display panel 100 further includes a second retaining wall 9, the second retaining wall 9 is disposed on the side of the first retaining wall 2 away from the display area AA, and the second retaining wall 9 A wall 9 surrounds the display area AA for blocking ink spillage.
  • the second retaining wall 9 includes one sublayer or a plurality of sublayers stacked, and at least one sublayer is located in at least one layer of the plurality of first insulating layers.
  • the maximum height of the second retaining wall 9 is greater than the maximum height of the first retaining wall 2 , and the second retaining wall 9 can block more ink than the first retaining wall 2 , and has a better blocking effect.
  • the second retaining wall 9 includes three sub-layers stacked, and the three sub-layers are respectively disposed on the first flat layer 15 , the second flat layer 17 and the pixel defining layer 19 .
  • one sublayer of the first retaining wall 2 is disposed on the second flat layer 114, the other sublayer is disposed on the pixel defining layer 116, and the three sublayers of the second retaining wall 9 are disposed respectively In the first flat layer 15 , the second flat layer 17 and the pixel defining layer 19 . Since the second retaining wall 9 includes more film layers than the first retaining wall 2 , the maximum height of the second retaining wall 9 is greater than the maximum height of the first retaining wall 2 .
  • the blocking portion 3 and the first blocking wall 2 in the area of the peripheral area BB except the touch wiring area FA, along the direction of the plane where the display substrate 1 is located, the blocking portion 3 and the first blocking wall 2
  • the ratio of the distance between the blocking part 3 and the distance between the touch wiring 5 farthest from the display area AA among the barrier part 3 and the touch wiring 5 farthest from the display area AA is less than or equal to 3, for example, the ratio is 3, 2.5, 2, 1.5 or 1.
  • the blocking portion 3 is connected to the plurality of touch wiring lines.
  • the distance between the touch wires 5 farthest from the display area AA in the wires 5 ranges from 40 ⁇ m to 60 ⁇ m, for example, the distance is 40 ⁇ m, 46 ⁇ m, 50 ⁇ m, 58 ⁇ m or 60 ⁇ m.
  • the blocking portion 3 and the first blocking wall 2 ranges from 140 ⁇ m to 160 ⁇ m, for example, the distance is 140 ⁇ m, 145 ⁇ m, 150 ⁇ m, 156 ⁇ m or 160 ⁇ m.
  • the blocking portion 3 is connected to the plurality of touch wiring lines.
  • the distance between the touch traces 5 farthest from the display area AA in the lines 5 ranges from 40 ⁇ m to 60 ⁇ m, and the distance between the barrier portion 3 and the first barrier wall 2 ranges from 140 ⁇ m to 160 ⁇ m.
  • On cell technology mainly includes FMLOC (Flexible Multi-Layer On Cell) technology and FSLOC (Flexible Single-Layer On Cell) technology.
  • FMLOC technology is based on the working principle of mutual capacitance detection, and generally uses two layers of metal to form TX (touch Drive electrode) and RX (touch sensing electrode), the IC realizes the touch action by detecting the mutual capacitance between TX and RX.
  • FSLOC technology is based on the working principle of self-capacitance (or voltage) detection.
  • a single layer of metal is used to form the touch electrode, and the IC detects the self-capacitance (or voltage) of the electrode to realize the touch action.
  • the display panel 100 provided in some embodiments of the present disclosure is described by taking the display panel 100 using the FMLOC technology as an example.
  • the display panel 100 further includes a touch function layer disposed on the display substrate 1, and the touch function layer includes a plurality of first touch units T and a plurality of second touch units.
  • each first touch unit T extends along the first direction Y, and multiple first touch units T are arranged side by side along the second direction X.
  • Each second touch unit R extends along the second direction X, and multiple second touch units R are arranged side by side along the first direction Y.
  • each touch unit is electrically connected to at least one touch wire 5 , and a voltage signal is transmitted to the touch unit electrically connected to it through the touch wire 5 .
  • both ends of each first touch unit T are electrically connected to a touch wire 5, and one end of each second touch unit R is electrically connected to a touch wire 5. connect.
  • both ends of each first touch unit T are electrically connected to a touch wire 5
  • both ends of each second touch unit R are electrically connected to a touch wire 5 .
  • the first touch unit T includes a plurality of first touch electrodes T1 and a plurality of first connection portions T2, and two adjacent first touch electrodes T1 are electrically connected through the first connection portions T2. connect.
  • the first touch electrodes T1 are touch driving electrodes.
  • the second touch control unit R includes a plurality of second touch electrodes R1 and a plurality of second connection parts R2, and two adjacent second touch electrodes R1 are electrically connected through the second connection parts R2. connect.
  • the second touch electrodes R1 are touch sensing electrodes.
  • the touch function layer includes an electrode layer 201, a second insulating layer 202 and a bridging layer 203 stacked on the display substrate 1, and the second insulating layer 202 is located between the electrode layer 201 and the bridging layer. Between the layers 203 , the bridging layer 203 is located on the side of the electrode layer 201 away from the display substrate 1 .
  • a plurality of first touch electrodes T1, a plurality of second touch electrodes R1 and a plurality of second connection parts R2 are disposed on the electrode layer 201, that is, the first touch electrodes T1, the second touch electrodes R1 and the second The connection part R2 is provided on the same layer.
  • a plurality of first connecting portions T2 are disposed on the bridging layer 203 .
  • the first connection portion T2 is electrically connected to two adjacent first touch electrodes T1 through different via holes 202A in the second insulating layer 202 .
  • every two adjacent second touch electrodes R1 are directly electrically connected through the second connecting portion R2.
  • a plurality of first touch electrodes T1, a plurality of first connection parts T2 and a plurality of second touch electrodes R1 are disposed on the electrode layer 201, that is, the first touch electrodes
  • the control electrode T1, the first connection portion T2 and the second touch electrode R1 are arranged on the same layer.
  • a plurality of second connecting portions T2 are disposed on the bridging layer 203 .
  • every two adjacent first touch electrodes T1 are directly electrically connected through the first connecting portion T2.
  • the second connection portion R2 is electrically connected to two adjacent second touch electrodes R1 through different via holes 202A in the second insulating layer 202 .
  • the touch substrate 100 includes an electrode layer 201 stacked on the display substrate 1 , a second insulating layer 202 and a bridging layer 203 , and the electrode layer 201 is located on the bridging layer 203
  • the second insulating layer 202 is located between the electrode layer 201 and the bridging layer 203 , and a plurality of via holes 202A are provided in the second insulating layer 202 .
  • a plurality of first touch electrodes T1, a plurality of second touch electrodes R1 and a plurality of second connection parts R2 are disposed on the electrode layer 201, that is, the first touch electrodes T1, the second touch electrodes R1 and the second connection parts R2 is set on the same floor.
  • a plurality of first connecting portions T2 are disposed on the bridging layer 203 .
  • first touch electrodes T1 are respectively electrically connected to the first connection portion T2 through different via holes 202A in the second insulating layer 202 .
  • second touch electrodes R1 are directly electrically connected through the second connecting portion R2.
  • a plurality of first touch electrodes T1, a plurality of second touch electrodes R1 and a plurality of first connection parts T2 are disposed on the electrode layer 201, that is, the first touch The control electrode T1, the second touch electrode R1 and the first connection part T2 are arranged in the same layer.
  • a plurality of second connecting portions R2 are disposed on the bridging layer 203 .
  • first touch electrodes T1 are directly electrically connected through the first connecting portion T2.
  • second touch electrodes R1 are respectively electrically connected to the second connection portion R2 through different via holes 202A in the second insulating layer 202 .
  • the touch wiring 5 includes a first touch sub-line 51 disposed on the electrode layer 201 and a second touch sub-line 52 disposed on the bridging layer 203 , the first touch The sub-wire 51 is electrically connected to the second touch sub-wire 52 through at least one via hole 202A in the second insulating layer 202 .
  • the impedance of the touch wire 5 can be reduced, thereby reducing the voltage drop generated by the voltage signal transmitted by the touch wire 5 .
  • the touch function layer further includes a first protective layer 205 disposed between the display substrate 1 and the electrode layer 201, and the first protective layer 205 functions to protect the display substrate 1. role.
  • the material of the first protective layer 205 may include an inorganic material, for example, the material of the first protective layer 205 may include silicon nitride, silicon oxide, or silicon oxynitride.
  • the touch function layer further includes a second protective layer 204 disposed on the side of the bridging layer 203 away from the display substrate 1 , and the second protective layer 204 functions to protect the touch unit. and the function of touch trace 5.
  • the material of the second protection layer 204 may include organic materials, for example, the material of the second protection layer 204 may include polyimide and the like.
  • the plurality of first touch electrodes T1 and the plurality of second touch electrodes R1 include a metal mesh structure.
  • the touch electrodes with the metal mesh structure have low resistance and high sensitivity, which can improve the touch sensitivity of the display panel 100 .
  • the touch electrodes with the metal mesh structure have high mechanical strength, which can reduce the weight of the display panel 100 , thereby reducing the weight of the display device using the display panel 100 .
  • the display panel 100 further includes at least one shielding line L located on the side away from the display area AA of the plurality of touch traces 5 , and the shielding line L on the display substrate 1
  • the orthographic projection does not overlap with the orthographic projection of the blocking portion 3, and the orthographic projection of the transition surface 43 on the display substrate 1 is on the display substrate 1 with the touch trace 5 farthest from the display area AA among the plurality of touch traces 5 The area between the orthographic projections on .
  • the second surface 42 of the first encapsulation layer 4 can cover the area on the display substrate 1 corresponding to the shielding line L, so as to improve the flatness of the surface of the display substrate 1 located in this area.
  • the residue of the film layer between the shielding line L and the touch trace 5 due to incomplete removal of the photoresist, thereby avoiding the shielding line L and the touch trace. 5 Short circuit occurs.
  • the shielding line L may be a ground line (Ground, GND for short), used for transmitting a ground voltage signal.
  • the shielding line L may be a panel crack detection line (Panel Crack Detect, PCD for short), which is used to transmit a detection voltage signal.
  • the shielding line L may be a guard line (Guard), which is used to shield interference between signals.
  • the touch wire 5 farthest from the display area AA overlaps with the first packaging layer 4 , and the first packaging layer 4
  • the portion located at the overlap is the first portion.
  • the shielding line L overlaps with the first encapsulation layer 4 , and the overlapped portion of the first encapsulation layer 4 is a second portion, and the minimum thickness of the first portion is greater than or equal to the maximum thickness of the second portion.
  • the shielding line L is located on the side away from the display area AA of the plurality of touch wiring lines 5 , that is, the shielding line L is closer to the first package than the plurality of touch wiring lines 5 . Edge area of layer 4.
  • the minimum thickness of the first part of the first encapsulation layer 4 is made greater than the maximum thickness of the second part.
  • the minimum thickness of the first part of the first encapsulation layer 4 is equal to the maximum thickness of the second part.
  • the difference between the minimum thickness of the first portion of the first encapsulation layer 4 and the maximum thickness of the second portion, and the ratio of the difference to the minimum thickness is within 30%.
  • the ratio is within 30%, the ratio is within 25%, the ratio is within 20%, or the ratio is within 10%.
  • the ratio is 0, that is, the minimum thickness of the first part of the first encapsulation layer 4 is approximately equal to the maximum thickness of the second part.
  • the display device 200 includes the display panel 100 in any of the above embodiments.
  • the orthographic projection of the transition surface 43 of the first encapsulation layer 4 of the display panel 100 on the display substrate 1 is located, and the orthographic projection of the blocking portion 3 on the display substrate 1 is
  • the area between the boundary near the display area AA and the orthographic projection of the touch wiring 5 farthest from the display area AA among the multiple touch lines 5 on the display substrate 1 makes the second surface of the first encapsulation layer 4 42 is flatter than the transition surface 43, and the multiple touch traces 5 are arranged on the side of the first packaging layer 4 away from the display substrate 1 (the second surface 42 of the first packaging layer 4), so as to avoid multiple touch
  • the wiring 5 is disposed on the transition surface 43 of the first packaging layer 4 , which is beneficial to control the critical dimension bias (CD bias) of the touch wiring 5 .
  • CD bias critical dimension bias
  • the first encapsulation layer 4 can cover the area corresponding to the touch trace 5 on the display substrate 1 , which improves the flatness of the surface of the display substrate 1 located in this area.
  • the above-mentioned display device 200 may be an electroluminescent display device, and the electroluminescent display device may be an organic electroluminescent display device (Organic Light-Emitting Diode, OLED for short) or a quantum dot electroluminescent display device (Quantum Dot Light Emitting Diodes). , referred to as QLED).
  • OLED Organic Light-Emitting Diode
  • QLED Quantum Dot Light Emitting Diodes
  • the display device 200 described above may be any device that displays an image regardless of whether it is moving (for example, video) or fixed (for example, still image) and regardless of text or text. More specifically, it is contemplated that the described embodiments may be implemented in or associated with a variety of electronic devices such as, but not limited to, mobile phones, wireless devices, personal data assistants (PDAs) , Handheld or Laptop Computers, GPS Receivers/Navigators, Cameras, MP4 Video Players, Camcorders, Game Consoles, Watches, Clocks, Calculators, Television Monitors, Flat Panel Displays, Computer Monitors, Automotive Displays (eg, odometer displays, etc.), navigators, cockpit controls and/or displays, displays for camera views (e.g., displays for rear-view cameras in vehicles), electronic photographs, electronic billboards or signage, projectors, building structures, packaging and aesthetic structures (for example, for a display of an image of a piece of jewelry), etc.
  • PDAs personal data assistants
  • Handheld or Laptop Computers GPS Receiv
  • Some embodiments of the present disclosure also provide a method for manufacturing a display panel. As shown in FIG. 18 , the method includes the following steps S1-S4:
  • a bridging metal layer is formed on the display side B of the display substrate 1, and a photoresist pattern is formed on the side of the bridging metal layer away from the display substrate 1 by using an exposure and development process, and the bridging metal layer is etched using the photoresist pattern as a mask.
  • the metal layer forms the bridging layer 203 .
  • the bridging layer 203 is provided with the first connection part T2 and the second touch sub-line 52 of the touch trace 5 .
  • the bridging layer 203 is a stacked structure, including titanium, aluminum and titanium stacked.
  • a second insulating layer 202 is formed on the side of the bridging layer 203 away from the display substrate 1 .
  • a first insulating film is formed on the side of the bridging layer 203 away from the display substrate 1, and a photoresist pattern is formed on the side of the first insulating film far away from the display substrate 1 by using an exposure and development process. mask, etch a plurality of via holes 202A in the second insulating layer 202 .
  • an electrode layer 201 is formed on the side of the second insulating layer 202 away from the display substrate 1 .
  • an electrode metal layer is formed on the side of the second insulating layer 202 away from the display substrate 1, and a photoresist pattern is formed on the side of the electrode metal layer away from the display substrate 1 by using an exposure and development process.
  • the electrode metal layer is etched with a mask to form the electrode layer 201 .
  • the first touch electrode T1 , the second touch electrode R1 , the second connection portion R2 , and the first touch sub-line 51 of the touch trace 5 are disposed in the electrode layer 201 .
  • the electrode layer 201 is a stacked structure, including titanium, aluminum and titanium stacked.
  • the preparation method further includes the following S11:
  • a first protection layer 205 is formed on the display substrate 1 .
  • a chemical vapor deposition (Chemical Vapor Deposition, CVD for short) process may be used to form the first protection layer 205 on the display substrate 1 .
  • the material of the first protective layer 205 may include an inorganic material, for example, the material of the first protective layer 205 may include silicon nitride, silicon oxide, or silicon oxynitride.
  • the preparation method further includes the following S41:
  • the second protection layer 204 is formed by using a photolithography process.
  • the material of the second protection layer 204 may include organic materials, for example, the material of the second protection layer 204 may include polyimide and the like.

Abstract

一种显示面板，具有显示区，包括显示基板、第一挡墙、阻挡部、第一封装层和多条触控走线。第一挡墙设置于显示基板的显示侧，且围绕显示区。阻挡部设置于第一挡墙与显示区之间，且至少部分围绕显示区。第一封装层至少覆盖显示区，包括靠近显示基板的第一面，远离显示基板的第二面，及连接第一面和第二面的过渡面。多条触控走线设置于第一封装层远离显示基板的一侧，多条触控走线在显示基板上的正投影，与第二面在显示基板上正投影至少部分重叠，且与过渡面在显示基板上的正投影相错开。过渡面在显示基板上的正投影位于，阻挡部在显示基板上的正投影的远离显示区的边界，与多条触控走线中最远离显示区的触控走线在显示基板上的正投影之间的区域。

Description

显示面板及显示装置 技术领域
本公开涉及显示技术领域，尤其涉及一种显示面板及显示装置。
背景技术
随着有源矩阵有机发光二极管(Active Matrix Organic Light-Emitting Diode，简称AMOLED)显示装置朝着轻薄化的方向发展，On Cell技术(触控显示屏一体化技术)逐渐受到人们的关注。
On Cell技术是指将触控功能层设置在显示面板的显示侧。其中，在一些技术中，可直接在显示基板的薄膜封装层(Thin Film Encapsulation，简称TFE)上，采用光刻工艺形成触控功能层。其中，触控功能层包括触控单元及外围走线(Trace)，每个触控单元与至少一条外围走线电连接，通过外围走线向触控单元传输感测信号。
公开内容
一方面，提供一种显示面板。所述显示面板具有显示区，包括显示基板、第一挡墙、阻挡部、第一封装层和多条触控走线。所述第一挡墙设置于所述显示基板的显示侧，且围绕所述显示区。所述阻挡部设置于所述第一挡墙与所述显示区之间，且至少部分围绕所述显示区。所述第一封装层至少覆盖所述显示区，包括靠近所述显示基板的第一面，远离所述显示基板的第二面，及连接所述第一面和所述第二面的过渡面。多条触控走线设置于所述第一封装层远离所述显示基板的一侧，所述多条触控走线在显示基板上的正投影，与所述第二面在显示基板上正投影至少部分重叠，且与所述过渡面在显示基板上的正投影相错开。所述至少部分过渡面在显示基板上的正投影位于，所述阻挡部在显示基板上的正投影的远离显示区的边界，与所述多条触控走线中最远离显示区的触控走线在显示基板上的正投影之间的区域。
在一些实施例中，所述阻挡部在显示基板上的正投影的靠近显示区的至少部分边界，位于所述过渡面在显示基板上的正投影的范围内。所述第一面在显示基板上的正投影的至少部分边界，位于所述阻挡部在显示基板上的正投影的靠近显示区的边界，与所述多条触控走线中最远离显示区的触控走线在显示基板上的正投影之间的区域。所述第二面在显示基板上的正投影的至少部分边界，位于所述阻挡部在显示基板上的正投影的靠近显示区的边界，与所述阻挡部在显示基板上的正投影的远离显示区的边界之间的区域。
在一些实施例中，所述阻挡部靠近显示区的边缘部分包括坡面，所述第 一封装层靠近所述阻挡部的边缘部分沿所述坡面爬升。
在一些实施例中，所述过渡面为弧面，所述弧面的形状与所述坡面的形状相适应。
在一些实施例中，所述第一面和所述第二面在显示基板上的正投影的至少部分边界均位于，所述阻挡部在显示基板上的正投影的靠近显示区的边界，与所述多条触控走线中最远离显示区的触控走线在显示基板上的正投影之间的区域。
在一些实施例中，所述过渡面与所述显示基板所在的平面大致垂直。或，所述过渡面为弧面，所述弧面朝向所述第一封装层内弯曲。
在一些实施例中，所述显示基板包括衬底和平坦层，平坦层设置于所述衬底上。其中，所述显示基板设置有位于所述阻挡部与所述显示区之间的沟槽，所述沟槽至少部分围绕所述显示区，且沿所述显示基板的厚度方向，所述沟槽至少部分贯穿所述平坦层。所述多条触控走线中的至少一条触控走线在显示基板上的正投影，与所述沟槽所在的区域至少部分重叠。
在一些实施例中，所述平坦层包括第一平坦层和第二平坦层，第一平坦层设置于所述衬底上，第二平坦层设置于所述第一平坦层远离所述衬底的一侧。所述沟槽至少部分贯穿所述第一平坦层和/或第二平坦层。
在一些实施例中，所述第一封装层包括填充所述沟槽的填充部分，及位于所述显示基板中除沟槽以外的至少部分区域的覆盖部分。所述填充部分远离所述显示基板的一面，与所述覆盖部分远离所述显示基板的一面大致处于同一平面。
在一些实施例中，所述显示面板还具有围绕所述显示区的周边区，所述周边区包括位于所述显示区一侧的触控走线区。所述第一挡墙和所述阻挡部设置于所述周边区，所述阻挡部位于所述触控走线区的部分设有开口。
在一些实施例中，所述开口为漏斗状，漏斗状的开口中，口径较大的一端靠近所述显示区，口径较小的一端靠近所述第一挡墙中位于所述触控走线区的部分。
在一些实施例中，所述阻挡部包括主体部分和两个边沿，主体部分位于所述周边区中除所述触控走线区以外的区域。每个边沿的至少部分位于所述触控走线区。所述两个边沿分别位于所述显示基板沿第一方向延伸的中线的相对两侧，且分别与所述主体部分的两端连接。所述两个边沿之间形成所述开口。所述第一方向为大致垂直于显示区与触控走线区的交界线的方向。
在一些实施例中，每个边沿包括连接段和引导段，所述连接段的一端与 主体部分连接，另一端与所述引导段连接。两个边沿中，两个引导段的靠近连接段的一端之间距离，大于两个引导段的远离连接段的一端之间距离。
在一些实施例中，所述连接段与所述引导段之间圆弧过渡。
在一些实施例中，所述引导段与所述第一挡墙位于所述触控走线区的部分之间具有间隙。
在一些实施例中，所述开口沿第二方向的最大尺寸，与，所述第一挡墙中位于触控走线区的部分沿第二方向的最大尺寸的比值大于或等于0.5，且小于1。所述第二方向为大致平行于显示区与触控走线区的交界线的方向。
在一些实施例中，所述阻挡部围绕所述显示区设置。
在一些实施例中，所述显示面板还包括第二封装层，第二封装层设置于所述显示基板与所述第一封装层之间，至少覆盖所述显示区、所述阻挡部和所述第一挡墙。所述第二封装层中覆盖所述阻挡部的部分远离显示基板的表面，与所述第一封装层的第二面大致处于同一平面。
在一些实施例中，所述显示基板包括衬底，及多个第一绝缘层，多个第一绝缘层层叠设置于所述衬底上。所述多个第一绝缘层包括栅极绝缘层、层间介质层、钝化层、第一平坦层、第二平坦层、像素界定层和支撑部中的至少一者。所述阻挡部和所述第一挡墙均包括一个子层或层叠设置的多个子层，至少一个子层位于所述多个第一绝缘层中的至少一层。
在一些实施例中，所述阻挡部的最大高度，与所述第一挡墙的最大高度大致相等。
在一些实施例中，所述显示面板还包括第二挡墙，第二挡墙设置于所述第一挡墙远离所述显示区的一侧，且围绕所述显示区。所述第二挡墙包括一个子层或层叠设置的多个子层，至少一个子层位于所述多个第一绝缘层中的至少一层。所述第二挡墙的最大高度，大于所述第一挡墙的最大高度。
在一些实施例中，所述显示面板还具有围绕所述显示区的周边区，所述周边区包括位于所述显示区一侧的触控走线区。在所述周边区中除触控走线区之外的区域，沿所述显示基板所在的平面方向，所述阻挡部与所述第一挡墙之间的距离，与所述阻挡部与所述多条触控走线中最远离显示区的触控走线之间的距离的比值小于或等于3。
在一些实施例中，在所述周边区中除触控走线区之外的区域，沿所述显示基板所在的平面方向，所述阻挡部与所述多条触控走线中最远离显示区的触控走线之间的距离为范围为40μm～60μm。和/或，在所述周边区中除触控走线区之外的区域，沿所述显示基板所在的平面方向，所述阻挡部与所述第 一挡墙之间的距离范围为140μm～160μm。
在一些实施例中，所述显示面板还包括触控功能层，触控功能层设置于所述显示基板上。触控功能层包括多个第一触控单元和多个第二触控单元，每个第一触控单元沿第一方向延伸，所述多个第一触控单元沿第二方向并列设置。每个第二触控单元沿第二方向延伸，所述多个第二触控单元沿第一方向并列设置。其中，每个触控单元与至少一条触控走线电连接。
所述触控功能层包括层叠设置于所述显示基板上的电极层、第二绝缘层和桥接层，所述第二绝缘层位于所述电极层和所述桥接层之间，所述桥接层位于所述电极层靠近或远离所述显示基板的一侧。所述第一触控单元包括多个第一触控电极，及多个第一连接部，相邻两个第一触控电极之间通过第一连接部电连接。所述第二触控单元包括多个第二触控电极，及多个第二连接部，相邻两个第二触控电极之间通过第二连接部电连接。
其中，第一触控电极、第一连接部和第二触控电极设置于所述电极层，第二连接部设置于所述桥接层。或，第一触控电极、第二触控电极和第二连接部设置于所述电极层，第一连接部设置于所述桥接层。
在一些实施例中，所述触控走线包括设置于所述电极层的第一触控子线和设置于所述桥接层的第二触控子线，所述第一触控子线和所述第二触控子线之间通过所述第二绝缘层中的至少一个过孔电连接。
在一些实施例中，所述多个第一触控电极和所述多个第二触控电极包括金属网格结构。
在一些实施例中，显示面板还包括位于所述多条触控走线远离显示区一侧的至少一条屏蔽线，所述屏蔽线在所述显示基板上的正投影与所述阻挡部的正投影不重叠，且位于所述过渡面在显示基板上的正投影，与所述多条触控走线中最远离显示区的触控走线在显示基板上的正投影之间的区域。
在一些实施例中，所述多条触控走线中最远离显示区的触控走线与所述第一封装层交叠处的所述第一封装层的最小厚度，大于或等于所述屏蔽线与所述第一封装层交叠处的所述第一封装层的最大厚度。
在一些实施例中，所述最小厚度和最大厚度的差值，与所述最小厚度的比值在30％以内。
另一方面，提供一种显示装置。所述显示装置包括如上述任一实施例所述的显示面板。
附图说明
为了更清楚地说明本公开中的技术方案，下面将对本公开一些实施例中 所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例的附图，对于本领域普通技术人员来讲，还可以根据这些附图获得其他的附图。此外，以下描述中的附图可以视作示意图，并非对本公开实施例所涉及的产品的实际尺寸、方法的实际流程、信号的实际时序等的限制。
图1为根据本公开的一些实施例的显示面板的一种结构图；
图2为图1中的显示面板的触控走线区的局部放大图；
图3为图1中的显示面板在M处的局部放大图；
图4为图3中的显示面板沿剖面线B-B＇的剖面图；
图5为根据本公开的一些实施例的显示面板的另一种结构图；
图6为根据本公开的一些实施例的显示面板的又一种结构图；
图7为图3中的显示面板沿剖面线C-C＇的剖面图；
图8为图7中的显示面板在N处的局部放大图；
图9为图1中的显示面板沿剖面线A-A＇的剖面图；
图10为根据本公开的一些实施例的显示面板的又一种结构图；
图11为图10中的显示面板沿剖面线D-D＇的剖面图；
图12为根据本公开的一些实施例的显示面板的又一种结构图；
图13为图12中的显示面板沿剖面线E-E＇的剖面图；
图14为根据本公开的一些实施例的显示面板的又一种结构图；
图15为图14中的显示面板沿剖面线F-F＇的剖面图；
图16为根据本公开的一些实施例的显示面板的又一种结构图；
图17为根据本公开的一些实施例的显示装置的结构图；
图18为根据本公开的一些实施例的显示面板的一种制备方法的流程图；
图19为根据本公开的一些实施例的显示面板的另一种制备方法的流程图；
图20～图23为根据本公开的一些实施例的制备显示面板的各步骤图。
具体实施方式
下面将结合附图，对本公开一些实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开所提供的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。
除非上下文另有要求，否则，在整个说明书和权利要求书中，术语“包括(comprise)”及其其他形式例如第三人称单数形式“包括(comprises)” 和现在分词形式“包括(comprising)”被解释为开放、包含的意思，即为“包含，但不限于”。在说明书的描述中，术语“一个实施例(one embodiment)”、“一些实施例(some embodiments)”、“示例性实施例(exemplary embodiments)”、“示例(example)”、“特定示例(specific example)”或“一些示例(some examples)”等旨在表明与该实施例或示例相关的特定特征、结构、材料或特性包括在本公开的至少一个实施例或示例中。上述术语的示意性表示不一定是指同一实施例或示例。此外，所述的特定特征、结构、材料或特点可以以任何适当方式包括在任何一个或多个实施例或示例中。
以下，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本公开实施例的描述中，除非另有说明，“多个”的含义是两个或两个以上。
在描述一些实施例时，可能使用了“电连接”及其衍伸的表达。例如，描述一些实施例时可能使用了术语“电连接”以表明两个或两个以上部件彼此间有直接物理接触或电接触。
“A和/或B”，包括以下三种组合：仅A，仅B，及A和B的组合。
如本文所使用的那样，“大致”包括所阐述的值以及处于特定值的可接受偏差范围内的平均值，其中所述可接受偏差范围如由本领域普通技术人员考虑到正在讨论的测量以及与特定量的测量相关的误差(即，测量系统的局限性)所确定。
“同层”指的是采用同一成膜工艺形成用于形成特定图形的膜层，然后利用同一掩模板通过一次构图工艺形成的层结构。根据特定图形的不同，一次构图工艺可能包括多次曝光、显影或刻蚀工艺，而形成的层结构中的特定图形可以是连续的也可以是不连续的，这些特定图形还可能处于不同的高度或者具有不同的厚度。
本文参照作为理想化示例性附图的剖视图和/或平面图描述了示例性实施方式。在附图中，为了清楚，放大了层和区域的厚度。因此，可设想到由于例如制造技术和/或公差引起的相对于附图的形状的变动。因此，示例性实施方式不应解释为局限于本文示出的区域的形状，而是包括因例如制造而引起的形状偏差。例如，示为矩形的蚀刻区域通常将具有弯曲的特征。因此，附图中所示的区域本质上是示意性的，且它们的形状并非旨在示出设备的区域的实际形状，并且并非旨在限制示例性实施方式的范围。
在相关技术中，采用喷墨打印(Ink-jet printing，简称IJP)技术，在显示面板的显示侧喷涂墨水，待墨水烘干后形成封装膜层，起到阻隔水汽和空气的作用。显示面板具有显示区，以及位于显示区四周的周边区。在显示区的四周围绕有挡墙，挡墙用于阻挡墨水的流淌以防止墨水溢出，挡墙所在的位置即为喷墨打印的截止位置。墨水在烘干的过程中，会沿着挡墙的侧壁攀爬，使得烘干后的封装膜层靠近挡墙的区域形成爬坡，封装膜层的爬坡区域对应显示面板的周边区。
目前，在显示面板的周边区，且位于封装膜层远离显示面板的一侧，采用光刻工艺，形成多条触控走线，每条触控走线与位于显示区内的每个触控单元电连接，用于向触控单元传输感测信号。但是，由于触控走线处于封装膜层的爬坡区域，采用光刻工艺制备触控走线的过程中，光刻工艺所采用的光刻胶具有流动性，在爬坡区域受重力作用而流淌，导致烘干后的光刻胶层的厚度不均匀，进而导致触控走线的关键尺寸工艺偏差(Critical Dimension bias，简称CD bias)不符合设计值。
并且，为防止墨水从挡墙溢出，需要减少墨水的喷涂量，但是，待墨水烘干后存在内缩的现象。由于显示面板的显示基板的表面具有沟槽，该沟槽位于挡墙靠近显示区的一侧，墨水内缩会使得喷墨打印的截止位置无法达到挡墙，即封装膜层的边界无法到达挡墙，甚至封装膜层不能完全覆盖沟槽。采用光刻工艺制备触控走线的过程中，光刻胶在没有封装膜层覆盖的沟槽处堆积较厚，经曝光显影后光刻胶对应沟槽处不能完全去除，进而导致触控走线之间的膜层残留，导致触控走线发生短路。
为解决上述问题，如图1所示，本公开的一些实施例提供了一种显示面板100，显示面板100具有用于显示画面的显示区AA(英文全称：Active Area)。
如图1和图7所示，显示面板100包括显示基板1，显示基板1具有显示侧B，显示基板1的显示侧B可显示画面。
如图1和图2所示，显示面板100还包括第一挡墙2，第一挡墙2设置于显示基板1的显示侧B，且第一挡墙2围绕显示区AA设置，即第一挡墙2在显示基板1上的正投影的形状为封闭的环形。
如图1和图2所示，显示面板100还包括阻挡部3，阻挡部3设置于第一挡墙2与显示区AA之间，且阻挡部3的至少部分围绕显示区AA设置。
可以理解的是，如图1和图2所示，在阻挡部3部分围绕显示区AA的情况下，阻挡部3在显示基板1上的正投影的形状不封闭；如图16所示，在阻挡部3全部围绕显示区AA的情况下，阻挡部3在显示基板1上的正投影 的形状为封闭的环形。
如图3和图4所示，显示面板100还包括第一封装层4，第一封装层4至少覆盖显示区AA。第一封装层4包括靠近显示基板1的第一面41，远离显示基板1的第二面42，及连接第一面41和第二面42的过渡面43。
需要说明的是，在制备显示面板100的过程中，采用喷墨打印技术，在显示基板1的显示侧B喷涂墨水，待墨水烘干后形成第一封装层4，起到吸收水汽的作用，以保证显示面板100的良好封装。阻挡部3和第一挡墙2都可以对墨水起到阻挡的作用，以避免墨水四处流淌。
可以理解的是，由于墨水具有流动性，且墨水受重力作用而流平，使得墨水烘干后形成的第一封装层4中，第一封装层4的第一面41与显示基板1的表面相贴合，第一封装层4的过渡面43不平坦，第一封装层4的第二面42较平坦。
需要提出的是，第一封装层4的过渡面43的表面的形状取决于喷墨打印的截止位置，若喷墨打印的截止位置到达阻挡部3，则过渡面43的表面形状，与其所接触的阻挡部3的表面相适配。例如，如图3所示，第一封装层4的过渡面43所接触的阻挡部3的表面为弧形的坡面31，第一封装层4的过渡面43的形状为弧面，且弧面朝向第一封装层4内弯曲。
示例性地，第一封装层4为有机阻隔层，具有柔性和吸收水汽的作用。例如，制备第一封装层4所需的墨水的材料可包括丙烯酸基聚合物。
如图3和图7所示，显示面板100还包括多条触控走线5，多条触控走线5设置于第一封装层4远离显示基板1的一侧。多条触控走线5在显示基板1上的正投影，与第一封装层4的第二面42在显示基板1上正投影至少部分重叠，且与过渡面43在显示基板1上的正投影相错开。
需要说明的是，每条触控走线5与位于显示区AA内的每个触控单元电连接，用于向触控单元传输感测信号。
示例性地，多条触控走线5在显示基板1上的正投影位于第二面42在显示基板1上正投影范围内，且与过渡面43在显示基板1上的正投影相错开。
如图4和图5所示，第一封装层4的至少部分过渡面43在显示基板1上的正投影位于，阻挡部3在显示基板1上的正投影的远离显示区AA的边界S2，与多条触控走线5中最远离显示区AA的触控走线5在显示基板1上的正投影之间的区域C。
示例性地，过渡面43在显示基板1上的正投影全部位于，阻挡部3在显示基板1上的正投影的远离显示区AA的边界S2，与多条触控走线5中最远 离显示区AA的触控走线5在显示基板1上的正投影之间的区域C。
本公开的上述实施例中的显示面板100，第一封装层4的过渡面43在显示基板1上的正投影位于，阻挡部3在显示基板1上的正投影的远离显示区AA的边界S2，与多条触控走线5中最远离显示区AA的触控走线5在显示基板1上的正投影之间的区域C，即喷墨打印的截止位置为阻挡部3，第一封装层4的边界可以到达阻挡部3。由于第一封装层4的第二面42相较过渡面43更平坦，将多条触控走线5设置于第一封装层4远离显示基板1的一侧(第一封装层4的第二面42)，避免将多条触控走线5设置于第一封装层4的过渡面43，有利于控制触控走线5的关键尺寸工艺偏差(Critical Dimension bias，简称CD bias)。
并且，多条触控走线5在显示基板1上的正投影，与第二面42在显示基板1上正投影至少部分重叠，且与过渡面43在显示基板1上的正投影相错开，第一封装层4的第二面42可以覆盖显示基板1上对应触控走线5的区域，以提高显示基板1位于该区域的表面平坦度。在采用光刻工艺制备触控走线5的过程中，可避免由于光刻胶去除不完全而导致触控走线5之间的膜层残留，从而避免触控走线5发生短路。
在一些实施例中，如图4所示，阻挡部3的坡面31，与显示基板1所在的平面之间所夹的锐角(坡面31的坡度)范围为40°～60°，例如，坡面31的坡度为40°、45°、50°、55°或60°。
在一些实施例中，如图4～图6所示，第一封装层4的过渡面43，与第一面41之间的最小夹角范围为40°～90°，例如，最小夹角为40°、50°、65°、80°或90°。
如图4～图6所示，第一封装层4的过渡面43，与第二面42之间的最小夹角范围为0°～90°，例如，最小夹角为0°、30°、45°、80°或90°。
下面介绍第一封装层4的一种设置方式。
在一些实施例中，如图3和图4所示，阻挡部3在显示基板1上的正投影的靠近显示区AA的至少部分边界S1，位于第一封装层4的过渡面43在显示基板1上的正投影的范围内。
示例性地，阻挡部3在显示基板1上的正投影的靠近显示区AA的边界S1，位于第一封装层4的过渡面43在显示基板1上的正投影的范围内。
需要说明的是，阻挡部3在显示基板1上的正投影的靠近显示区AA的至少部分边界S1，位于第一封装层4的过渡面43在显示基板1上的正投影的范围内，包括下列情形：
阻挡部3在显示基板1上的正投影的靠近显示区AA的边界S1，与第一封装层4的过渡面43在显示基板1上的正投影的边界至少部分重合。
或者，阻挡部3在显示基板1上的正投影的靠近显示区AA的边界S1，位于第一封装层4的过渡面43在显示基板1上的正投影的范围内，且阻挡部3在显示基板1上的正投影的靠近显示区AA的边界S1，与第一封装层4的过渡面43在显示基板1上的正投影的边界不重合。
如图3和图4所示，第一封装层4的第一面41在显示基板1上的正投影的至少部分边界，位于阻挡部3在显示基板1上的正投影的靠近显示区AA的边界S1，与多条触控走线5中最远离显示区AA的触控走线5在显示基板1上的正投影之间的区域E。
示例性地，第一封装层4的第一面41在显示基板1上的正投影的边界，位于阻挡部3在显示基板1上的正投影的靠近显示区AA的边界S1，与多条触控走线5中最远离显示区AA的触控走线5在显示基板1上的正投影之间的区域E。
需要说明的是，第一面41在显示基板1上的正投影的至少部分边界，位于阻挡部3在显示基板1上的正投影的靠近显示区AA的边界S1，与多条触控走线5中最远离显示区AA的触控走线5在显示基板1上的正投影之间的区域E，包括下列情形：
第一面41在显示基板1上的正投影的边界，与阻挡部3在显示基板1上的正投影的靠近显示区AA的边界S1重合。
或者，第一面41在显示基板1上的正投影的边界，与多条触控走线5中最远离显示区AA的触控走线5在显示基板1上的正投影重合。
或者，第一面41在显示基板1上的正投影的边界，位于阻挡部3在显示基板1上的正投影的靠近显示区AA的边界S1，与多条触控走线5中最远离显示区AA的触控走线5在显示基板1上的正投影之间的区域E。并且，第一面41在显示基板1上的正投影的边界，与阻挡部3在显示基板1上的正投影的靠近显示区AA的边界S1不重合；第一面41在显示基板1上的正投影的边界，与多条触控走线5中最远离显示区AA的触控走线5在显示基板1上的正投影不重合。
如图3和图4所示，第一封装层4的第二面42在显示基板1上的正投影的至少部分边界，位于阻挡部3在显示基板1上的正投影的靠近显示区AA的边界S1，与阻挡部3在显示基板1上的正投影的远离显示区AA的边界S2之间的区域D。
示例性地，第一封装层4的第二面42在显示基板1上的正投影的边界，位于阻挡部3在显示基板1上的正投影的靠近显示区AA的边界S1，与阻挡部3在显示基板1上的正投影的远离显示区AA的边界S2之间的区域D。
需要说明的是，第一封装层4的第二面42在显示基板1上的正投影的至少部分边界，位于阻挡部3在显示基板1上的正投影的靠近显示区AA的边界S1，与阻挡部3在显示基板1上的正投影的远离显示区AA的边界S2之间的区域D，包括下列情形：
第二面42在显示基板1上的正投影的边界，与阻挡部3在显示基板1上的正投影的靠近显示区AA的边界S1重合。
或者，第二面42在显示基板1上的正投影的边界，与阻挡部3在显示基板1上的正投影的远离显示区AA的边界S2重合。
或者，第二面42在显示基板1上的正投影的边界，位于阻挡部3在显示基板1上的正投影的范围内。并且，第二面42在显示基板1上的正投影的边界，与阻挡部3在显示基板1上的正投影的靠近显示区AA的边界S1不重合；第二面42在显示基板1上的正投影的边界，与阻挡部3在显示基板1上的正投影的远离显示区AA的边界S2不重合。
本公开的上述实施例，结合图4可见，喷墨打印的墨水超出阻挡部3在显示基板1上的正投影的靠近显示区AA的至少部分边界S1，且墨水刚好没有溢出阻挡部3，改善了墨水沿阻挡部3的靠近显示区AA的边缘部分的坡面31攀爬的现象。待墨水烘干后，使阻挡部3在显示基板1上的正投影的靠近显示区AA的至少部分边界S1，位于第一封装层4的过渡面43在显示基板1上的正投影的范围内，保证第一封装层4的第二面42的平坦度。
在一些实施例中，如图4所示，第一封装层4靠近阻挡部3的边缘部分沿坡面31爬升。
需要说明的是，第一封装层4靠近阻挡部3的边缘部分沿坡面31爬升，是由于墨水的喷涂量较大，利用墨水的流动性填平了阻挡部3的坡面31区域，从而改善了墨水沿阻挡部3的坡面攀爬的现象，有利于提高第一封装层4的第二面42的平坦度。
在一些实施例中，如图4所示，第一封装层4的过渡面43为弧面，该弧面的形状与坡面31的形状相适应。
可以理解的是，第一封装层4靠近阻挡部3的边缘部分沿坡面31爬升，第一封装层4的过渡面43与阻挡部3的坡面31相接触(实际上，阻挡部3的坡面31还覆盖有封装膜层，第一封装层4的过渡面43与该封装膜层相接 触)。由于喷墨打印的墨水具有流动性，使得烘干后形成的第一封装层4可与阻挡部3(覆盖坡面31的封装膜层)较好地贴合，从而使得第一封装层4的弧面的形状与坡面31的形状相适应。
在一些实施例中，如图4所示，第一封装层4的过渡面43为弧面，弧面朝向第一封装层4内弯曲。
可以理解的是，参考图4，阻挡部3具有坡面31，在此情况下，由于第一封装层4的过渡面43与阻挡部3的侧面相适配，第一封装层4的过渡面43为弧面，弧面朝向第一封装层4内弯曲。
下面介绍第一封装层4的另一种设置方式。
在一些实施例中，如图5所示，第一封装层4的第一面41和第二面42在显示基板1上的正投影的至少部分边界均位于，阻挡部3在显示基板1上的正投影的靠近显示区AA的边界S1，与多条触控走线5中最远离显示区AA的触控走线5在显示基板1上的正投影之间的区域E。
示例性地，第一封装层4的第一面41和第二面42在显示基板1上的正投影的边界均位于，阻挡部3在显示基板1上的正投影的靠近显示区AA的边界S1，与多条触控走线5中最远离显示区AA的触控走线5在显示基板1上的正投影之间的区域E。
需要说明的是，第一封装层4的第一面41和第二面42在显示基板1上的正投影的至少部分边界均位于，阻挡部3在显示基板1上的正投影的靠近显示区AA的边界S1，与多条触控走线5中最远离显示区AA的触控走线5在显示基板1上的正投影之间的区域E，包括下列情形：
第一封装层4的第一面41和第二面42在显示基板1上的正投影的边界均与阻挡部3在显示基板1上的正投影的靠近显示区AA的边界S1重合。
或者，第一封装层4的第一面41和第二面42在显示基板1上的正投影的边界均与多条触控走线5中最远离显示区AA的触控走线5在显示基板1上的正投影重合。
或者，第一封装层4的第一面41和第二面42在显示基板1上的正投影的边界均位于，阻挡部3在显示基板1上的正投影的靠近显示区AA的边界S1，与多条触控走线5中最远离显示区AA的触控走线5在显示基板1上的正投影之间的区域E。并且，第一面41和第二面42在显示基板1上的正投影的边界，均不与阻挡部3在显示基板1上的正投影的靠近显示区AA的边界S1重合；第一面41和第二面42在显示基板1上的正投影的边界，均不与多条触控走线5中最远离显示区AA的触控走线5在显示基板1上的正投影重 合。
本公开的上述实施例，结合图5，第一封装层4的第一面41和第二面42在显示基板1上的正投影的至少部分边界，未到达或刚好到达阻挡部3在显示基板1上的正投影的靠近显示区AA的至少部分边界S1。可见，在墨水烘干的过程中，墨水的喷涂量较少，使的墨水不足以沿着阻挡部3的坡面31攀爬。并且，由于墨水具有流动性，墨水受重力作用可以流平，使得第一封装层4的第二面42较为平坦。
需要注意的是，墨水的喷涂量应保证，墨水的打印截止位置可以到达多条触控走线5中最远离显示区AA的触控走线5，使第一封装层4的第一面41和第二面42在显示基板1上的正投影的至少部分边界，到达或超出多条触控走线5中最远离显示区AA的触控走线5在显示基板1上的正投影，使多条触控走线5在显示基板1上的正投影位于第一封装层4在显示基板1上正投影范围内。
下面介绍第一封装层4的又一种设置方式。
在一些实施例中，如图6所示，第一封装层4的过渡面43与显示基板1所在的平面大致垂直。
可以理解的是，参考图6，阻挡部3的侧面与显示基板1所在的平面大致垂直。在此情况下，由于墨水具有流动性，使第一封装层4的过渡面43与阻挡部3的侧面相适配，因此，第一封装层4的过渡面43与显示基板1所在的平面大致垂直。
本公开的一些实施例所提供的显示面板100，以显示面板100为有机发光二极管(Organic Light-Emitting Diode，简称OLED)显示面板为例进行说明。
在一些实施例中，如图7～图9所示，显示基板1包括衬底10、以及层叠设置于衬底10上的驱动电路和发光器件。
示例性地，衬底10可为柔性衬底，可提高显示基板1的柔性，使显示基板1具有可弯曲、可弯折等性能，以便于扩大显示基板1的适用范围。
示例性地，衬底10也可设置为刚性衬底，衬底10的性能可根据产品的实际需求而定。
示例性地，衬底10可以为单层结构，例如，衬底10为玻璃基板。
示例性地，衬底10可以为多层结构，例如，如图7所示，衬底10可包括依次层叠设置的第一聚酰亚胺层101、缓冲层102和第二聚酰亚胺层103。又例如，衬底10可包括依次层叠设置的聚酰亚胺层和缓冲层。再例如，衬底10可包括层叠设置的多个聚酰亚胺层和多个缓冲层。
示例性地，缓冲层102的材料可包括无机材料，例如，缓冲层102的材料可包括氮化硅、氧化硅或氮氧化硅，起到阻隔水汽、空气和碱性离子的作用。
在一些实施例中，如图7～图9所示，显示基板1包括依次层叠设置于衬底10上的有源层104、第一栅极绝缘层105、第一栅导电层106、第二栅极绝缘层107、第二栅导电层108、层间介质层109和第一源漏导电层110。
其中，第一栅极绝缘层105使有源层104与第一栅导电层106之间绝缘，第二栅极绝缘层107使第一栅导电层106与第二栅导电层108之间绝缘，层间介质层109使第二栅导电层108与第一源漏导电层110之间绝缘。
如图9所示，驱动电路包括多个薄膜晶体管TFT和多个电容结构C1，图9示出了一个薄膜晶体管TFT和一个电容结构C1的情形。
如图9所示，薄膜晶体管TFT可包括有源层104、第一栅极绝缘层105、设置于第一栅导电层106中的栅极106A、第二栅极绝缘层107、层间介质层109、设置于第一源漏导电层110中的源极110A和漏极110B。
示例性地，有源层104可设置于衬底10上，第一栅极绝缘层105覆盖衬底10及有源层104，栅极106A设置于第一栅极绝缘层105远离衬底10的一侧，第二栅极绝缘层107覆盖栅极106A和第一栅极绝缘层105，层间介质层109覆盖第二栅极绝缘层107，源极110A和漏极110B设置于层间介质层109远离衬底10的一侧，源极110A和漏极110B可分别通过贯穿层间介质层109、第二栅极绝缘层107和第一栅极绝缘层105三者的过孔与有源层104电连接。
可以理解的是，栅极106A设置于有源层104远离衬底10的一侧，即栅极106A位于有源层104的上方，该薄膜晶体管TFT为顶栅型薄膜晶体管。在另一些实施例中，栅极106A也可设置于有源层104靠近衬底10的一侧，即栅极106A位于有源层104的下方，该薄膜晶体管TFT为底栅型薄膜晶体管。
示例性地，第一栅极绝缘层105、第二栅极绝缘层107和层间介质层109的材料均包括无机材料，例如，材料均可包括氧化硅、氮化硅或氮氧化硅等，可起到阻隔水汽、空气和碱性离子的效果。
示例性地，源极110A和漏极110B的材料可以包括金属材料或者合金材料，例如，源极110A和漏极110B的材料可包括钼、铝或钛等。
示例性地，源极110A和漏极110B可以为单层结构，例如，源极110A和漏极110B均为钼金属层或铝金属层或钛金属层。
示例性地，源极110A和漏极110B可以为多层结构，例如，源极110A 和漏极110B均为钛(Ti)、铝(Al)、钛(Ti)三层金属叠层。
如图9所示，电容结构C1可包括设置于第一栅导电层106中的第一极板106B，以及设置于第二栅导电层108中的第二极板108A，第一极板106B与栅极106A同层设置，第二极板108A设置于第二栅极绝缘层107与层间介质层109之间，并与第一极板106B相对设置。
示例性地，栅极106A和第一极板106B、第二极板108A的材料可以包括金属材料或者合金材料，例如，材料可包括钼、铝或钛等。
在一些实施例中，显示基板1还包括设置于衬底10上的平坦层(Planarization Layer，简称PLN)。显示基板1设置有位于阻挡部3与显示区AA之间的沟槽6，沟槽6至少部分围绕显示区AA，且沿显示基板1的厚度方向Z，沟槽6至少部分贯穿平坦层。
需要说明的是，显示基板1还包括设置于衬底10上的第一栅极驱动电路和第二栅极驱动电路，第一栅极驱动电路和第二栅极驱动电路沿第一方向X并列设置。沟槽6至少部分位于，第一栅极驱动电路与第二栅极驱动电路之间的区域，沟槽6在衬底10上的正投影，与第一栅极驱动电路在衬底10上的正投影不重叠，且与第二栅极驱动电路在衬底10上的正投影不重叠。
示例性地，平坦层可为单层结构，也可为多层结构。
示例性地，平坦层的材料可包括有机材料，例如，平坦层的材料可包括光刻胶、丙烯酸基聚合物或硅基聚合物等。
示例性地，沟槽6部分围绕显示区AA。
如图3和图7所示，由于触控走线5的排布空间有限，且触控走线5的数量较多，因此，多条触控走线5中的至少一条触控走线5在显示基板1上的正投影，与沟槽6所在的区域至少部分重叠。
示例性地，多条触控走线5中的一条触控走线5在显示基板1上的正投影，与沟槽6所在的区域重叠。
在一些实施例中，如图7～图9所示，平坦层包括设置于衬底10上的第一平坦层112，以及设置于第一平坦层112远离衬底10一侧的第二平坦层114。
示例性地，第一平坦层112和第二平坦层114可为单层结构，也可为多层结构。
沿显示基板1的厚度方向Z，沟槽6至少部分贯穿第一平坦层112。
或者，沿显示基板1的厚度方向Z，沟槽6至少部分贯穿第二平坦层114。
或者，如图1和图7所示，沿显示基板1的厚度方向Z，沟槽6至少部分贯穿第一平坦层112和第二平坦层114。
结合图7可见，沟槽6所在的区域没有设置第一源漏导电层110和第二源漏导电层113，因此，在沟槽6所在的区域不需要设置第一平坦层112和第二平坦层114，可以理解为，沟槽6至少部分贯穿第一平坦层112和第二平坦层114。
在一些实施例中，如图7和图8所示，第一封装层4包括填充沟槽6的填充部分44，及位于显示基板1中除沟槽6以外的至少部分区域的覆盖部分45。第一封装层4的填充部分44远离显示基板1的一面，与覆盖部分45远离显示基板1的一面大致处于同一平面。
示例性地，第一封装层4的覆盖部分45设置于显示基板1中除沟槽6以外的部分区域。
可以理解的是，由于墨水具有流动性，墨水受重力作用可以填平沟槽6，待墨水烘干后，形成的第一封装层4的填充部分44远离显示基板1的一面，与覆盖部分45远离显示基板1的一面大致处于同一平面。
通过上述设置方式，采用墨水填平沟槽6，使得第一封装层4的第二面42较为平坦。采用光刻工艺制备触控走线的过程中，可避免由于光刻胶去除不完全而导致触控走线5之间的膜层残留，从而避免触控走线5发生短路。
在一些实施例中，如图7～图9所示，显示基板1还包括设置于第一源漏导电层110与第一平坦层112之间的钝化层111，钝化层111覆盖源极110A和漏极110B，起到保护源极110A和漏极110B的作用。
示例性地，钝化层111的材料可包括无机材料，例如，钝化层111的材料可包括氧化硅、氮化硅或者氮氧化硅等。
在一些实施例中，如图7～图9所示，显示基板1还包括设置于第一平坦层112远离衬底10一侧的第二源漏导电层113，第二源漏导电层113中包括转接电极113A，转接电极113A通过贯穿第一平坦层112和钝化层111二者的过孔与源极110A或漏极110B电连接，图9中示出了转接电极113A通过贯穿第一平坦层112和钝化层111二者的过孔与源极110A电连接的情形。
示例性地，转接电极113A的材料可以包括金属材料或者合金材料，例如，转接电极113A的材料可包括钼、铝或钛等。
示例性地，转接电极113A可以为单层结构，例如，转接电极113A均为钼金属层或铝金属层或钛金属层。
示例性地，转接电极113A可以为多层结构，例如，转接电极113A均为钛(Ti)、铝(Al)、钛(Ti)三层金属叠层。
在一些实施例中，如图7～图9所示，显示基板1还包括设置于第二平坦 层114远离衬底10一侧的第一电极115，第一电极115通过第二平坦层114中的过孔与转接电极113A电连接，从而实现了电压信号从源极110A经转接电极113A传输至第一电极115。
示例性地，第一电极115的材料可包括氧化铟锡、氧化铟锌或氧化锌等。
在一些实施例中，如图7～图9所示，显示基板1还包括设置于第二平坦层114远离衬底10一侧的像素界定层116，像素界定层116中具有多个开口，每个开口暴露第一电极115的至少部分，每个开口位于一个子像素区域内。
示例性地，如图9所示，每个开口暴露第一电极115的中间部分，且像素界定层116覆盖第一电极115的边缘部分。
示例性地，像素界定层116的材料可包括有机材料，例如，像素界定层116的材料可包括光刻胶。
在一些实施例中，如图7～图9所示，发光器件包括第一电极115、发光功能层EL和第二电极118。
如图9所示，发光功能层EL位于像素界定层116的开口内并形成在第一电极115上，该发光功能层EL可包括小分子有机材料或聚合物分子有机材料，可以为荧光发光材料或磷光发光材料，可以发红光、绿光、蓝光，或白光等。并且，根据实际不同需要，在不同的示例中，发光功能层EL还可以进一步包括电子传输层(election transporting layer，简称ETL)、电子注入层(election injection layer，简称EIL)、空穴传输层(hole transporting layer，简称HTL)以及空穴注入层(hole injection layer，简称HIL)中的一层或多层。
如图9所示，第二电极118覆盖发光功能层EL，且该第二电极118的极性与第一电极115的极性相反。通过分别向第一电极115和第二电极118传输电压信号，使第一电极115与第二电极118之间形成电场，以激发发光功能层EL发光。
示例性地，第一电极115可为阳极，第二电极118可为阴极。
示例性地，第二电极118的材料可包括锂、铝、镁或银等。
需要说明的是，如图9所示，显示面板100可包括多个阵列排布的子像素区域，每个子像素区域内设置有一个发光器件，各发光器件的第二电极118整面连接，即第二电极118为设置在显示基板200上的面状电极，作为各个发光器件的公共电极。
在一些实施例中，如图9所示，显示基板1还包括设置于像素界定层116远离衬底10一侧的支撑部117，该支撑部117可起到支撑保护位于其下方的膜层的作用。
需要说明的是，保护膜层主要出现在半成品转移的过程中，以避免转移过程中半成品出现损坏的情况。示例性地，在将制作完支撑部232的显示基板1转移到蒸镀产线的过程中，可覆盖一层保护膜层，当需要进行发光材料的蒸镀时，可将保护膜层移除。或者，在制备发光功能层EL的过程中，支撑部232可避免设备与第一电极115接触而导致第一电极115的损坏。又或者，在制备第二电极118的过程中，支撑部232可避免设备与发光功能层EL接触而导致影响发光功能层EL的发光效果。
示例性地，支撑部117可与像素界定层116的材料相同且同层设置。
下面介绍阻挡部3的一种结构。
在一些实施例中，如图1和图2所示，显示面板100还具有围绕显示区AA的周边区BB，周边区BB包括位于显示区AA一侧的触控走线区FA。第一挡墙2和阻挡部3设置于周边区BB，阻挡部3位于触控走线区FA的部分设有开口32。
通过上述阻挡部3的设置方式，在喷墨打印的过程中，在墨水的喷涂量较大的情况下，墨水可以优先从阻挡部3在触控走线区FA的开口32处溢出，可对墨水的流向起到控制作用，避免墨水从阻挡部3的在触控走线区FA以外的部分溢出。
在一些实施例中，如图1和图2所示，阻挡部3的开口32为漏斗状，漏斗状的开口32中，口径较大的一端靠近显示区AA，口径较小的一端靠近第一挡墙2中位于触控走线区FA的部分。
通过将阻挡部3的开口32设置为漏斗状，开口32对墨水起到引流的作用，有利于墨水从开口32处溢出。并且，漏斗状的开口32中，口径较大的一端靠近显示区AA，口径较小的一端靠近第一挡墙2中位于触控走线区FA的部分，使墨水从开口32的口径较大的一端流至口径较小的一端，对墨水起到汇聚的作用。
在一些实施例中，如图1和图2所示，阻挡部3包括主体部分33和两个边沿34，主体部分33位于周边区BB中除触控走线区FA以外的区域，每个边沿34的至少部分位于触控走线区FA。
示例性地，如图1所示，每个边沿34的部分位于触控走线区FA，部分位于周边区BB中除触控走线区FA以外的区域。
如图1所示，两个边沿34分别位于显示基板1沿第一方向Y延伸的中线L1的相对两侧，且分别与主体部分33的两端连接，两个边沿34之间形成了阻挡部3的开口32，使墨水可以从两个边沿34之间的开口32处溢出。其中， 第一方向Y为大致垂直于显示区AA与触控走线区FA的交界线L2的方向。
在一些实施例中，如图1和图2所示，每个边沿34包括连接段341和引导段342，连接段341的一端与主体部分33连接，连接段341的另一端与引导段342连接。两个边沿34中，两个引导段342的靠近连接段341的一端之间距离D1，大于两个引导段342的远离连接段341的一端之间距离D2，即两个引导段342呈漏斗状，两个引导段342对墨水起到引流的作用，有利于墨水从开口32处溢出，并且，两个引导段342对墨水具有汇聚的作用。
在一些实施例中，如图1和图2所示，边沿34的连接段341与引导段342之间圆弧过渡，可减小连接段341与引导段342之间的连接处对墨水的阻力，有利于墨水沿着连接段341流至引导段342。
在一些实施例中，如图1和图2所示，边沿34的引导段342与第一挡墙2位于触控走线区FA的部分之间具有间隙G。在墨水的喷涂量较大的情况下，墨水从阻挡部3的开口32，经引导段342与第一挡墙2之间的间隙G溢出，可对墨水的流向起到控制作用，避免墨水从阻挡部3的在触控走线区FA以外的部分溢出。
示例性地，沿第一方向Y，边沿34的引导段342与第一挡墙2位于触控走线区FA的部分之间的间隙G距离范围为40μm～60μm，例如，间隙距离为40μm、45μm、50μm、55μm或60μm。
在一些实施例中，如图1所示，阻挡部3的开口32沿第二方向X的最大尺寸(即，两个引导段342的靠近连接段341的一端之间距离D1)，与，第一挡墙2中位于触控走线区FA的部分沿第二方向X的最大尺寸D3的比值大于或等于0.5，且小于1，例如，比值为0.5、0.6、0.7、0.8、0.9或0.98。其中，第二方向X为大致平行于显示区AA与触控走线区FA的交界线的方向。
在一些实施例中，如图2所示，位于触控走线区FA的多条触控走线5中，至少部分触控走线5与阻挡部3不交叠。
需要说明的是，每条触控走线5包括设置于触控走线区FA的引线段，以及设置于周边区BB除触控走线区FA外的区域的走线段。引线段的一端与走线段电连接，另一端与触控信号端电连接。
可以理解的是，显示基板1设置阻挡部3的区域的表面可能会不平坦，通过使至少部分触控走线5与阻挡部3不交叠，在采用光刻工艺制备触控走线5的过程中，可避免由于光刻胶去除不完全而导致触控走线5之间的膜层残留，从而避免触控走线5发生短路。
示例性地，位于触控走线区FA的全部触控走线5，与阻挡部3不交叠。
下面介绍阻挡部3的另一种结构。
在一些实施例中，如图16所示，阻挡部3围绕显示区AA设置，使喷墨打印的墨水在阻挡部3所围的区域内流动，避免墨水溢出阻挡部3。
在一些实施例中，如图4和图9所示，显示面板100还包括第二封装层7，第二封装层7设置于显示基板1与第一封装层4之间，且第二封装层7至少覆盖显示区AA、阻挡部3和第一挡墙2。
结合图4可见，第二封装层7中覆盖阻挡部3的部分远离显示基板1的表面，与第一封装层4的第二面42大致处于同一平面。可以理解的是，墨水刚好没有溢出阻挡部3，且墨水填平了阻挡部3的坡面31，改善了墨水沿阻挡部3的坡面攀爬的现象，提高了第一封装层4的第二面42的平坦度。
示例性地，第二封装层7为无机阻隔层，具有阻隔水汽和空气的作用。例如，第二封装层7的材料可包括氮化硅、氧化硅或氮氧化硅等。
在一些实施例中，如图4和图9所示，显示面板100还包括第三封装层8，第三封装层8设置于第一封装层4远离显示基板1的一侧，且第三封装层8至少覆盖显示区AA、阻挡部3和第一挡墙2，具有阻隔水汽和空气的作用。
示例性地，第三封装层8为无机阻隔层，例如，第三封装层8的材料可包括氮化硅、氧化硅或氮氧化硅等。
在一些实施例中，如图4和图9所示，显示基板1包括衬底10，以及层叠设置于衬底10上的多个第一绝缘层，多个第一绝缘层包括前文所述的栅极绝缘层(第一栅极绝缘层105和第二栅极绝缘层107)、层间介质层109、钝化层111、第一平坦层112、第二平坦层114、像素界定层116和支撑部117中的至少一者。
其中，阻挡部3和第一挡墙2均包括一个子层或层叠设置的多个子层，至少一个子层位于多个第一绝缘层中的至少一层。
示例性地，如图4所示，阻挡部3包括层叠设置的两个子层，一个子层设置于第二平坦层114，另一个子层设置于像素界定层116。
示例性地，阻挡部3的一个子层设置于第一平坦层112，另一个子层设置于像素界定层116。
示例性地，阻挡部3的一个子层设置于第一平坦层112，另一个子层设置于第二平坦层114。
示例性地，如图4所示，第一挡墙2包括层叠设置的两个子层，一个子层设置于第二平坦层114，另一个子层设置于像素界定层116。
示例性地，第一挡墙2的一个子层设置于第一平坦层112，另一个子层设 置于像素界定层116。
示例性地，第一挡墙2的一个子层设置于第一平坦层112，另一个子层设置于第二平坦层114。
在一些实施例中，如图4所示，阻挡部3的最大高度，与第一挡墙2的最大高度大致相等。
可以理解的是，如图4所示，阻挡部3的一个子层设置于第二平坦层114，另一个子层设置于像素界定层116，第一挡墙2的一个子层设置于第二平坦层114，另一个子层设置于像素界定层116。由于阻挡部3的膜层结构与第一挡墙2的膜层结构相同，因此，阻挡部3的最大高度，与第一挡墙2的最大高度大致相等。
在一些实施例中，如图3和图4所示，显示面板100还包括第二挡墙9，第二挡墙9设置于第一挡墙2远离显示区AA的一侧，且第二挡墙9围绕显示区AA，用于阻挡墨水溢出。
如图4所示，第二挡墙9包括一个子层或层叠设置的多个子层，至少一个子层位于多个第一绝缘层中的至少一层。第二挡墙9的最大高度，大于第一挡墙2的最大高度，第二挡墙9相比第一挡墙2可以阻挡更多的墨水，起到更好的阻挡效果。
示例性地，第二挡墙9包括层叠设置的三个子层，三个子层分别设置于第一平坦层15、第二平坦层17及像素界定层19。
可以理解的是，如图4所示，第一挡墙2的一个子层设置于第二平坦层114，另一个子层设置于像素界定层116，第二挡墙9的三个子层分别设置于第一平坦层15、第二平坦层17及像素界定层19。由于第二挡墙9所包括的膜层数量比第一挡墙2所包括的膜层数量多，因此，第二挡墙9的最大高度，大于第一挡墙2的最大高度。
在一些实施例中，如图1和图16所示，在周边区BB中除触控走线区FA之外的区域，沿显示基板1所在的平面方向，阻挡部3与第一挡墙2之间的距离，与阻挡部3与多条触控走线5中最远离显示区AA的触控走线5之间的距离的比值小于或等于3，例如，比值为3、2.5、2、1.5或1。
在一些实施例中，如图1和图16所示，在周边区BB中除触控走线区FA之外的区域，沿显示基板1所在的平面方向，阻挡部3与多条触控走线5中最远离显示区AA的触控走线5之间的距离范围为40μm～60μm，例如，距离为40μm、46μm、50μm、58μm或60μm。
在一些实施例中，如图1和图16所示，在周边区BB中除触控走线区FA 之外的区域，沿显示基板1所在的平面方向，阻挡部3与第一挡墙2之间的距离范围为140μm～160μm，例如，距离为140μm、145μm、150μm、156μm或160μm。
在一些实施例中，如图1和图16所示，在周边区BB中除触控走线区FA之外的区域，沿显示基板1所在的平面方向，阻挡部3与多条触控走线5中最远离显示区AA的触控走线5之间的距离范围为40μm～60μm，且阻挡部3与第一挡墙2之间的距离范围为140μm～160μm。
目前On cell技术主要包括FMLOC(Flexible Multi-Layer On Cell)技术和FSLOC(Flexible Single-Layer On Cell)技术两类，FMLOC技术基于互容检测的工作原理，一般采用两层金属形成TX(触控驱动电极)和RX(触控感应电极)，IC通过检测TX和RX间的互容来实现触控动作。FSLOC技术基于自容(或电压)检测的工作原理，一般采用单层金属形成触控电极，IC通过检测电极自容(或电压)来实现触控动作。
本公开的一些实施例所提供的显示面板100，以显示面板100采用FMLOC技术为例进行说明。
在一些实施例中，如图1所示，显示面板100还包括设置于显示基板1上的触控功能层，触控功能层包括多个第一触控单元T和多个第二触控单元R，每个第一触控单元T沿第一方向Y延伸，多个第一触控单元T沿第二方向X并列设置。每个第二触控单元R沿第二方向X延伸，多个第二触控单元R沿第一方向Y并列设置。其中，每个触控单元与至少一条触控走线5电连接，通过触控走线5向与其电连接的触控单元传输电压信号。
示例性地，如图1所示，每个第一触控单元T的两端均与一条触控走线5电连接，每个第二触控单元R的一端与一条触控走线5电连接。
示例性地，每个第一触控单元T的两端均与一条触控走线5电连接，每个第二触控单元R的两端均与一条触控走线5电连接。
如图1所示，第一触控单元T包括多个第一触控电极T1，及多个第一连接部T2，相邻两个第一触控电极T1之间通过第一连接部T2电连接。
示例性地，第一触控电极T1为触控驱动电极。
如图1所示，第二触控单元R包括多个第二触控电极R1，及多个第二连接部R2，相邻两个第二触控电极R1之间通过第二连接部R2电连接。
示例性地，第二触控电极R1为触控感应电极。
通过上述设置方式，第一触控电极T1与第二触控电极R1之间能够产生互容，这些触控电极在被触摸后互容值会发生变化，从而通过检测互容值的 变化量可进行触摸位置的判断。
在一些实施例中，如图9所示，触控功能层包括层叠设置于显示基板1上的电极层201、第二绝缘层202和桥接层203，第二绝缘层202位于电极层201和桥接层203之间，桥接层203位于电极层201远离显示基板1的一侧。
其中，多个第一触控电极T1、多个第二触控电极R1和多个第二连接部R2设置于电极层201，即第一触控电极T1、第二触控电极R1和第二连接部R2同层设置。多个第一连接部T2设置于桥接层203。
沿第一方向Y，第一连接部T2穿过第二绝缘层202中的不同过孔202A与相邻两个第一触控电极T1电连接。沿第二方向X，每相邻两个第二触控电极R1之间通过第二连接部R2直接电连接。
在一些实施例中，如图10和图11所示，多个第一触控电极T1、多个第一连接部T2和多个第二触控电极R1设置于电极层201，即第一触控电极T1、第一连接部T2和第二触控电极R1同层设置。多个第二连接部T2设置于桥接层203。
沿第一方向Y，每相邻两个第一触控电极T1之间通过第一连接部T2直接电连接。沿第二方向X，第二连接部R2穿过第二绝缘层202中的不同过孔202A与相邻两个第二触控电极R1电连接。
在另一些实施例中，如图12和图13所示，触控基板100包括层叠设置于显示基板1上的电极层201、第二绝缘层202和桥接层203，电极层201位于桥接层203远离显示基板1的一侧，第二绝缘层202位于电极层201与桥接层203之间，第二绝缘层202中设有多个过孔202A。
多个第一触控电极T1、多个第二触控电极R1和多个第二连接部R2设置于电极层201，即第一触控电极T1、第二触控电极R1和第二连接部R2同层设置。多个第一连接部T2设置于桥接层203。
沿第一方向Y，相邻两个第一触控电极T1分别穿过第二绝缘层202中的不同过孔202A与第一连接部T2电连接。沿第二方向X，相邻两个第二触控电极R1之间通过第二连接部R2直接电连接。
在一些实施例中，如图14和图15所示，多个第一触控电极T1、多个第二触控电极R1和多个第一连接部T2设置于电极层201，即第一触控电极T1、第二触控电极R1和第一连接部T2同层设置。多个第二连接部R2设置于桥接层203。
沿第一方向Y，相邻两个第一触控电极T1之间通过第一连接部T2直接电连接。沿第二方向X，相邻两个第二触控电极R1分别穿过第二绝缘层202 中的不同过孔202A与第二连接部R2电连接。
在一些实施例中，如图7所示，触控走线5包括设置于电极层201的第一触控子线51和设置于桥接层203的第二触控子线52，第一触控子线51和第二触控子线52之间通过第二绝缘层202中的至少一个过孔202A电连接。通过第一触控子线51与第二触控子线52并联，可减小触控走线5的阻抗，从而减小触控走线5传输电压信号所产生的压降。
在一些实施例中，如图7和图9所示，触控功能层还包括设置于显示基板1与电极层201之间的第一保护层205，第一保护层205起到保护显示基板1的作用。
示例性地，第一保护层205的材料可包括无机材料，例如，第一保护层205的材料可包括氮化硅、氧化硅或氮氧化硅等。
在一些实施例中，如图7和图9所示，触控功能层还包括设置于桥接层203远离显示基板1一侧的第二保护层204，第二保护层204起到保护触控单元和触控走线5的作用。
示例性地，第二保护层204的材料可包括有机材料，例如，第二保护层204的材料可包括聚酰亚胺等。
在一些实施例中，如图3所示，多个第一触控电极T1和多个第二触控电极R1包括金属网格(metal mesh)结构。金属网格结构的触控电极的电阻小、灵敏度较高，能够提高显示面板100的触控灵敏度。且金属网格结构的触控电极的机械强度高，可减小显示面板100的重量，从而可减小应用显示面板100的显示装置的重量。
在一些实施例中，如图3和图4所示，显示面板100还包括位于多条触控走线5远离显示区AA一侧的至少一条屏蔽线L，屏蔽线L在显示基板1上的正投影与阻挡部3的正投影不重叠，且位于过渡面43在显示基板1上的正投影，与多条触控走线5中最远离显示区AA的触控走线5在显示基板1上的正投影之间的区域。
通过上述设置方式，第一封装层4的第二面42可以覆盖显示基板1上对应屏蔽线L的区域，以提高显示基板1位于该区域的表面平坦度。在采用光刻工艺制备屏蔽线L的过程中，可避免由于光刻胶去除不完全而导致屏蔽线L与触控走线5之间的膜层残留，从而避免屏蔽线L与触控走线5发生短路。
在一些实施例中，屏蔽线L可以是接地线(Ground，简称GND)，用于传输接地电压信号。或者，屏蔽线L可以是面板裂纹检测线(Panel Crack Detect，简称PCD)，用于传输检测电压信号。又或者，屏蔽线L可以是保 护线(Guard)，用于屏蔽信号之间的干扰。
在一些实施例中，如图3和图4所示，多条触控走线5中最远离显示区AA的触控走线5与第一封装层4交叠，且第一封装层4的位于该交叠处的部分为第一部分。屏蔽线L与第一封装层4交叠，且第一封装层4的位于该交叠处的部分为第二部分，第一部分的最小厚度，大于或等于第二部分的最大厚度。
可以理解的是，如图3所示，屏蔽线L位于多条触控走线5的远离显示区AA的一侧，即，屏蔽线L相较多条触控走线5更靠近第一封装层4的边缘区域。
示例性地，在第一封装层4的中间区域较厚，边缘区域较薄的情况下，使第一封装层4的第一部分的最小厚度，大于第二部分的最大厚度。
示例性地，在第一封装层4的各区域的厚度大致相等的情况下，使第一封装层4的第一部分的最小厚度，等于第二部分的最大厚度。
在一些实施例中，第一封装层4的第一部分的最小厚度，与第二部分的最大厚度的差值，该差值与最小厚度的比值在30％以内。
示例性地，比值在30％以内、比值在25％以内、比值在20％以内，或比值在10％以内。
例如，该比值为0，即第一封装层4的第一部分的最小厚度，与第二部分的最大厚度大致相等。
本公开的一些实施例还提供了一种显示装置，如图17所示，显示装置200包括上述任一实施例中的显示面板100。
本公开的上述实施例中的显示装置200，显示面板100的第一封装层4的过渡面43在显示基板1上的正投影的至少部分位于，阻挡部3在显示基板1上的正投影的靠近显示区AA的边界，与多条触控走线5中最远离显示区AA的触控走线5在显示基板1上的正投影之间的区域，使第一封装层4的第二面42相较过渡面43更平坦，将多条触控走线5设置于第一封装层4远离显示基板1的一侧(第一封装层4的第二面42)，避免将多条触控走线5设置于第一封装层4的过渡面43，有利于控制触控走线5的关键尺寸工艺偏差(Critical Dimension bias，简称CD bias)。
并且，第一封装层4可以覆盖显示基板1上对应触控走线5的区域，提高了显示基板1位于该区域的表面平坦度。在采用光刻工艺制备触控走线5的过程中，可避免由于光刻胶去除不完全而导致触控走线5之间的膜层残留，从而避免触控走线5发生短路。
上述显示装置200可以为电致发光显示装置，该电致发光显示装置可以为有机电致发光显示装置(Organic Light-Emitting Diode，简称OLED)或量子点电致发光显示装置(Quantum Dot Light Emitting Diodes，简称QLED)。
上述显示装置200可以是显示不论运动(例如，视频)还是固定(例如，静止图像)的且不论文字还是的图像的任何装置。更明确地说，预期所述实施例可实施在多种电子装置中或与多种电子装置关联，所述多种电子装置例如(但不限于)移动电话、无线装置、个人数据助理(PDA)、手持式或便携式计算机、GPS接收器/导航器、相机、MP4视频播放器、摄像机、游戏控制台、手表、时钟、计算器、电视监视器、平板显示器、计算机监视器、汽车显示器(例如，里程表显示器等)、导航仪、座舱控制器和/或显示器、相机视图的显示器(例如，车辆中后视相机的显示器)、电子相片、电子广告牌或指示牌、投影仪、建筑结构、包装和美学结构(例如，对于一件珠宝的图像的显示器)等。
本公开的一些实施例还提供了一种显示面板的制备方法，如图18所示，制备方法包括如下S1～S4：
S1：制备显示基板1。
S2：如图20所示，在显示基板1的显示侧B形成桥接层203。
示例性地，在显示基板1的显示侧B形成桥接金属层，采用曝光显影工艺，在桥接金属层远离显示基板1的一侧形成光刻胶图案，以光刻胶图案为掩膜刻蚀桥接金属层形成桥接层203。
示例性地，桥接层203中设置有第一连接部T2，及触控走线5的第二触控子线52。
示例性地，桥接层203为叠层结构，包括层叠设置的钛、铝和钛。
S3：如图21所示，在桥接层203远离显示基板1的一侧，形成第二绝缘层202。
示例性地，在桥接层203远离显示基板1的一侧形成第一绝缘薄膜，采用曝光显影工艺，在第一绝缘薄膜远离显示基板1的一侧形成光刻胶图案，以光刻胶图案为掩膜，在第二绝缘层202中刻蚀出多个过孔202A。
S4：如图22所示，在第二绝缘层202远离显示基板1的一侧，形成电极层201。
示例性地，在第二绝缘层202远离显示基板1的一侧形成电极金属层，采用曝光显影工艺，在电极金属层远离显示基板1的一侧形成光刻胶图案，以光刻胶图案为掩膜刻蚀电极金属层形成电极层201。
示例性地，电极层201中设置有第一触控电极T1、第二触控电极R1、第二连接部R2，及触控走线5的第一触控子线51。
示例性地，电极层201为叠层结构，包括层叠设置的钛、铝和钛。
在一些实施例中，如图19所示，在上述S2之前，制备方法还包括如下S11：
S11：如图20所示，在显示基板1上形成第一保护层205。
示例性地，可采用化学气相沉积(Chemical Vapor Deposition，简称CVD)工艺，在显示基板1上形成第一保护层205。
示例性地，第一保护层205的材料可包括无机材料，例如，第一保护层205的材料可包括氮化硅、氧化硅或氮氧化硅等。
在一些实施例中，如图19所示，在上述S4之后，制备方法还包括如下S41：
S41：如图23所示，形成覆盖电极层201的第二保护层204。
示例性地，采用光刻工艺，形成第二保护层204。
示例性地，第二保护层204的材料可包括有机材料，例如，第二保护层204的材料可包括聚酰亚胺等。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (30)

  1. 一种显示面板，具有显示区，包括：
    显示基板；
    第一挡墙，设置于所述显示基板的显示侧，且围绕所述显示区；
    阻挡部，设置于所述第一挡墙与所述显示区之间，且至少部分围绕所述显示区；
    第一封装层，至少覆盖所述显示区；所述第一封装层包括靠近所述显示基板的第一面，远离所述显示基板的第二面，及连接所述第一面和所述第二面的过渡面；
    多条触控走线，设置于所述第一封装层远离所述显示基板的一侧；所述多条触控走线在显示基板上的正投影，与所述第二面在显示基板上正投影至少部分重叠，且与所述过渡面在显示基板上的正投影相错开；
    其中，所述至少部分过渡面在显示基板上的正投影位于，所述阻挡部在显示基板上的正投影的远离显示区的边界，与所述多条触控走线中最远离显示区的触控走线在显示基板上的正投影之间的区域。
  2. 根据权利要求1所述的显示面板，其中，所述阻挡部在显示基板上的正投影的靠近显示区的至少部分边界，位于所述过渡面在显示基板上的正投影的范围内；
    所述第一面在显示基板上的正投影的至少部分边界，位于所述阻挡部在显示基板上的正投影的靠近显示区的边界，与所述多条触控走线中最远离显示区的触控走线在显示基板上的正投影之间的区域；
    所述第二面在显示基板上的正投影的至少部分边界，位于所述阻挡部在显示基板上的正投影的靠近显示区的边界，与所述阻挡部在显示基板上的正投影的远离显示区的边界之间的区域。
  3. 根据权利要求1或2所述的显示面板，其中，所述阻挡部靠近显示区的边缘部分包括坡面，所述第一封装层靠近所述阻挡部的边缘部分沿所述坡面爬升。
  4. 根据权利要求3所述的显示面板，其中，所述过渡面为弧面，所述弧面的形状与所述坡面的形状相适应。
  5. 根据权利要求1所述的显示面板，其中，所述第一面和所述第二面在显示基板上的正投影的至少部分边界均位于，所述阻挡部在显示基板上的正投影的靠近显示区的边界，与所述多条触控走线中最远离显示区的触控走线在显示基板上的正投影之间的区域。
  6. 根据权利要求1～5中任一项所述的显示面板，其中，所述过渡面与所述显示基板所在的平面大致垂直；或，
    所述过渡面为弧面，所述弧面朝向所述第一封装层内弯曲。
  7. 根据权利要求1～6中任一项所述的显示面板，其中，所述显示基板包括：
    衬底；
    平坦层，设置于所述衬底上；
    其中，所述显示基板设置有位于所述阻挡部与所述显示区之间的沟槽，所述沟槽至少部分围绕所述显示区，且沿所述显示基板的厚度方向，所述沟槽至少部分贯穿所述平坦层；
    所述多条触控走线中的至少一条触控走线在显示基板上的正投影，与所述沟槽所在的区域至少部分重叠。
  8. 根据权利要求7所述的显示面板，其中，所述平坦层包括：
    第一平坦层，设置于所述衬底上；
    第二平坦层，设置于所述第一平坦层远离所述衬底的一侧；
    所述沟槽至少部分贯穿所述第一平坦层和/或第二平坦层。
  9. 根据权利要求7或8所述的显示面板，其中，所述第一封装层包括填充所述沟槽的填充部分，及位于所述显示基板中除沟槽以外的至少部分区域的覆盖部分；
    所述填充部分远离所述显示基板的一面，与所述覆盖部分远离所述显示基板的一面大致处于同一平面。
  10. 根据权利要求1～9中任一项所述的显示面板，其中，所述显示面板还具有围绕所述显示区的周边区，所述周边区包括位于所述显示区一侧的触控走线区；
    所述第一挡墙和所述阻挡部设置于所述周边区，所述阻挡部位于所述触控走线区的部分设有开口。
  11. 根据权利要求10所述的显示面板，其中，所述开口为漏斗状，漏斗状的开口中，口径较大的一端靠近所述显示区，口径较小的一端靠近所述第一挡墙中位于所述触控走线区的部分。
  12. 根据权利要求10或11所述的显示面板，其中，所述阻挡部包括：
    主体部分，位于所述周边区中除所述触控走线区以外的区域；
    两个边沿，每个边沿的至少部分位于所述触控走线区；所述两个边沿分别位于所述显示基板沿第一方向延伸的中线的相对两侧，且分别与所述主体 部分的两端连接；所述两个边沿之间形成所述开口；所述第一方向为大致垂直于显示区与触控走线区的交界线的方向。
  13. 根据权利要求12所述的显示面板，其中，每个边沿包括连接段和引导段，所述连接段的一端与主体部分连接，另一端与所述引导段连接；
    两个边沿中，两个引导段的靠近连接段的一端之间距离，大于两个引导段的远离连接段的一端之间距离。
  14. 根据权利要求13所述的显示面板，其中，所述连接段与所述引导段之间圆弧过渡。
  15. 根据权利要求13或14所述的显示面板，其中，所述引导段与所述第一挡墙位于所述触控走线区的部分之间具有间隙。
  16. 根据权利要求12～15中任一项所述的显示面板，其中，所述开口沿第二方向的最大尺寸，与，所述第一挡墙中位于触控走线区的部分沿第二方向的最大尺寸的比值大于或等于0.5，且小于1；所述第二方向为大致平行于显示区与触控走线区的交界线的方向。
  17. 根据权利要求1～9中任一项所述的显示面板，其中，所述阻挡部围绕所述显示区设置。
  18. 根据权利要求1～17中任一项所述的显示面板，还包括：
    第二封装层，设置于所述显示基板与所述第一封装层之间，至少覆盖所述显示区、所述阻挡部和所述第一挡墙；所述第二封装层中覆盖所述阻挡部的部分远离显示基板的表面，与所述第一封装层的第二面大致处于同一平面。
  19. 根据权利要求1～18中任一项所述的显示面板，其中，所述显示基板包括：
    衬底；
    多个第一绝缘层，层叠设置于所述衬底上；所述多个第一绝缘层包括栅极绝缘层、层间介质层、钝化层、第一平坦层、第二平坦层、像素界定层和支撑层中的至少一者；
    所述阻挡部和所述第一挡墙均包括一个子层或层叠设置的多个子层，至少一个子层位于所述多个第一绝缘层中的至少一层。
  20. 根据权利要求19所述的显示面板，其中，所述阻挡部的最大高度，与所述第一挡墙的最大高度大致相等。
  21. 根据权利要求19或20所述的显示面板，还包括：
    第二挡墙，设置于所述第一挡墙远离所述显示区的一侧，且围绕所述显示区；
    所述第二挡墙包括一个子层或层叠设置的多个子层，至少一个子层位于所述多个第一绝缘层中的至少一层；
    所述第二挡墙的最大高度，大于所述第一挡墙的最大高度。
  22. 根据权利要求1～21中任一项所述的显示面板，其中，所述显示面板还具有围绕所述显示区的周边区，所述周边区包括位于所述显示区一侧的触控走线区；
    在所述周边区中除触控走线区之外的区域，沿所述显示基板所在的平面方向，所述阻挡部与所述第一挡墙之间的距离，与所述阻挡部与所述多条触控走线中最远离显示区的触控走线之间的距离的比值小于或等于3。
  23. 根据权利要求22所述的显示面板，其中，在所述周边区中除触控走线区之外的区域，
    沿所述显示基板所在的平面方向，所述阻挡部与所述多条触控走线中最远离显示区的触控走线之间的距离范围为40μm～60μm；和/或，
    沿所述显示基板所在的平面方向，所述阻挡部与所述第一挡墙之间的距离范围为140μm～160μm。
  24. 根据权利要求1～23中任一项所述的显示面板，还包括：
    触控功能层，设置于所述显示基板上，包括：
    多个第一触控单元和多个第二触控单元；每个第一触控单元沿第一方向延伸，所述多个第一触控单元沿第二方向并列设置；每个第二触控单元沿第二方向延伸，所述多个第二触控单元沿第一方向并列设置；其中，每个触控单元与至少一条触控走线电连接；
    所述触控功能层包括层叠设置于所述显示基板上的电极层、第二绝缘层和桥接层，所述第二绝缘层位于所述电极层和所述桥接层之间，所述桥接层位于所述电极层靠近或远离所述显示基板的一侧；
    所述第一触控单元包括多个第一触控电极，及多个第一连接部，相邻两个第一触控电极之间通过第一连接部电连接；
    所述第二触控单元包括多个第二触控电极，及多个第二连接部，相邻两个第二触控电极之间通过第二连接部电连接；
    其中，第一触控电极、第一连接部和第二触控电极设置于所述电极层，第二连接部设置于所述桥接层；或，
    第一触控电极、第二触控电极和第二连接部设置于所述电极层，第一连接部设置于所述桥接层。
  25. 根据权利要求24所述的显示面板，其中，所述触控走线包括设置于 所述电极层的第一触控子线和设置于所述桥接层的第二触控子线，所述第一触控子线和所述第二触控子线之间通过所述第二绝缘层中的至少一个过孔电连接。
  26. 根据权利要求24或25所述的显示面板，其中，所述多个第一触控电极和所述多个第二触控电极包括金属网格结构。
  27. 根据权利要求1～26中任一项所述的显示面板，还包括位于所述多条触控走线远离显示区一侧的至少一条屏蔽线，所述屏蔽线在所述显示基板上的正投影与所述阻挡部的正投影不重叠，且位于所述过渡面在显示基板上的正投影，与所述多条触控走线中最远离显示区的触控走线在显示基板上的正投影之间的区域。
  28. 根据权利要求27所述的显示面板，其中，所述多条触控走线中最远离显示区的触控走线与所述第一封装层交叠处的所述第一封装层的最小厚度，大于或等于所述屏蔽线与所述第一封装层交叠处的所述第一封装层的最大厚度。
  29. 根据权利要求28所述的显示面板，其中，所述最小厚度和最大厚度的差值，与所述最小厚度的比值在30％以内。
  30. 一种显示装置，包括如上权利要求1～29中任一项所述的显示面板。
PCT/CN2021/104691 2021-07-06 2021-07-06 显示面板及显示装置 WO2023279255A1 (zh)

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CN112181204A (zh) * 2020-09-29 2021-01-05 上海天马有机发光显示技术有限公司 一种显示面板及显示装置
CN112510064A (zh) * 2019-09-16 2021-03-16 三星显示有限公司 显示设备
CN112563309A (zh) * 2020-08-17 2021-03-26 京东方科技集团股份有限公司 显示面板
CN112799550A (zh) * 2021-03-04 2021-05-14 上海天马有机发光显示技术有限公司 一种触控显示面板及触控显示装置
CN113068416A (zh) * 2019-11-01 2021-07-02 京东方科技集团股份有限公司 显示面板及其制作方法、显示装置

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CN112510064A (zh) * 2019-09-16 2021-03-16 三星显示有限公司 显示设备
CN113068416A (zh) * 2019-11-01 2021-07-02 京东方科技集团股份有限公司 显示面板及其制作方法、显示装置
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