WO2023016257A1 - 触控结构及其制备方法、显示面板及显示装置 - Google Patents

触控结构及其制备方法、显示面板及显示装置 Download PDF

Info

Publication number
WO2023016257A1
WO2023016257A1 PCT/CN2022/108197 CN2022108197W WO2023016257A1 WO 2023016257 A1 WO2023016257 A1 WO 2023016257A1 CN 2022108197 W CN2022108197 W CN 2022108197W WO 2023016257 A1 WO2023016257 A1 WO 2023016257A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
touch
conductive layer
organic layer
organic
Prior art date
Application number
PCT/CN2022/108197
Other languages
English (en)
French (fr)
Inventor
王玉
崔国意
高涛
李泽亮
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US18/548,339 priority Critical patent/US20240134475A1/en
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to EP22855240.2A priority patent/EP4300272A1/en
Publication of WO2023016257A1 publication Critical patent/WO2023016257A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04107—Shielding in digitiser, i.e. guard or shielding arrangements, mostly for capacitive touchscreens, e.g. driven shields, driven grounds

Definitions

  • the present disclosure relates to the field of display technology, and in particular to a touch structure and a manufacturing method thereof, a display panel and a display device.
  • the organic light-emitting diode Organic Light-Emitting Diode, OLED for short
  • OLED Organic Light-Emitting Diode
  • a touch control structure includes at least one touch function layer group and at least one protective pad layer.
  • the at least one touch function layer group includes an organic layer and a conductive layer stacked in sequence.
  • At least one protective pad layer is provided in one-to-one correspondence with at least one touch function layer group, and the protection pad layer is located between the conductive layer and the organic layer of the corresponding touch function layer group.
  • the orthographic projection of the protection pad layer on the organic layer at least partially overlaps the orthographic projection of the conductive layer on the organic layer.
  • At least one touch function layer group includes a first touch function layer group and a second touch function layer group
  • the first touch function layer group includes a first organic layer and a first conductive layer stacked in sequence. layer.
  • the second touch function layer group is disposed on a side of the first conductive layer away from the first organic layer, and the second touch function layer group includes a second organic layer and a second conductive layer stacked in sequence.
  • At least one protective pad layer is provided corresponding to the first conductive layer and/or the second conductive layer.
  • the orthographic projection of the protection pad layer on the first organic layer at least partially overlaps the orthographic projection of the corresponding conductive layer on the first organic layer.
  • the orthographic projection of the protection pad layer on the first organic layer approximately coincides with the orthographic projection of the corresponding conductive layer on the first organic layer.
  • the orthographic projection of the protective cushion layer on the first organic layer is a closed figure, and the orthographic projection of the conductive layer corresponding to the protective cushion layer on the first organic layer is located within the range of the closed figure Inside.
  • the touch structure includes a touch area, and a binding area located on one side of the touch area.
  • the orthographic projection of the protective cushion layer on the first organic layer is staggered from the binding region.
  • the at least one protective pad layer includes a first protective pad layer and/or a second protective pad layer, the first protective pad layer is arranged corresponding to the first conductive layer, and is located on the first between the conductive layer and the first organic layer.
  • the second protective pad layer is disposed corresponding to the second conductive layer, and is located between the second conductive layer and the second organic layer.
  • the thickness of the conductive layer correspondingly provided with the protective pad layer is greater than or equal to 0.3 ⁇ m.
  • one of the first conductive layer and the second conductive layer is correspondingly provided with a protective pad layer, and the thickness of the conductive layer correspondingly provided with the protective pad layer is greater than the thickness of the other conductive layer.
  • one of the first conductive layer and the second conductive layer is correspondingly provided with a protective pad layer, and the thickness of the other of the first conductive layer and the second conductive layer is Less than 0.3 ⁇ m.
  • the touch structure includes a touch area
  • the touch structure includes a plurality of touch units disposed in the touch area
  • the plurality of touch units include a plurality of first touch unit and multiple second touch units.
  • Each first touch unit extends along a first direction
  • the plurality of first touch units are arranged side by side along a second direction.
  • Each second touch unit extends along the second direction, and the plurality of second touch units are arranged side by side along the first direction.
  • the first touch control unit includes a plurality of first touch electrodes and a plurality of first connection parts, and two adjacent first touch electrodes are electrically connected through the first connection parts.
  • the second touch unit includes a plurality of second touch electrodes and a plurality of second connection parts, and two adjacent second touch electrodes are electrically connected through the second connection parts.
  • the plurality of first touch electrodes, the plurality of second touch electrodes and the plurality of first connection parts are disposed on one of the first conductive layer and the second conductive layer
  • the plurality of second connection parts is disposed on the other of the first conductive layer and the second conductive layer.
  • the plurality of first touch electrodes, the plurality of second touch electrodes and the plurality of second connection parts are disposed on one of the first conductive layer and the second conductive layer,
  • the plurality of first connection parts are disposed on the other of the first conductive layer and the second conductive layer.
  • the plurality of first touch electrodes, the plurality of second touch electrodes and the plurality of first connection parts are disposed on the same conductive layer, and the plurality of second connection parts are located
  • the conductive layer is correspondingly provided with a protective cushion layer.
  • the plurality of first touch electrodes, the plurality of second touch electrodes and the plurality of second connection parts are arranged on the same conductive layer, and the conductive layer where the plurality of first connection parts are located is correspondingly arranged With protective underlayment.
  • the touch structure further includes a plurality of auxiliary electrodes, the plurality of first touch electrodes and the plurality of second touch electrodes are disposed on the first conductive layer and the second one of the conductive layers, and the plurality of auxiliary electrodes are disposed on the other of the first conductive layer and the second conductive layer.
  • the orthographic projection of each auxiliary electrode on the first organic layer at least partially overlaps with the orthographic projection of the first touch electrode or the second touch electrode on the first organic layer; the auxiliary electrode passes through the The via hole in the second organic layer is electrically connected with the first touch electrode or the second touch electrode.
  • the surface of the protection pad layer near the corresponding conductive layer has a plurality of pits
  • the surface of the conductive layer away from the corresponding protection pad layer has a plurality of pits
  • the material of the protective underlayment includes inorganic materials.
  • the thickness of the protection pad layer is smaller than the thickness of the organic layer of the corresponding touch function layer group.
  • a display panel in another aspect, includes a display substrate, and the touch structure according to any one of the above embodiments, the touch structure is disposed on the light emitting side of the display substrate.
  • the display substrate includes an encapsulation layer, and the touch control structure is directly disposed on the encapsulation layer.
  • a display device in yet another aspect, includes the display panel as described in any one of the above embodiments.
  • a method for preparing a touch structure includes at least one touch function layer group, and each touch function layer group includes an organic layer and a conductive layer stacked in sequence. Described preparation method comprises:
  • the preparation method further includes: forming a protective pad layer on the organic layer, the orthographic projection of the protective pad layer on the organic layer, and the conductive layer on the The orthographic projections on the organic layers at least partially overlap.
  • At least one touch function layer group includes a first touch function layer group and a second touch function layer group
  • the first touch function layer group includes a first organic layer and a second organic layer stacked in sequence
  • a conductive layer, the second touch function layer group includes a second organic layer and a second conductive layer stacked in sequence.
  • the first organic layer, the first conductive layer, the second organic layer, and the second conductive layer are sequentially formed.
  • the preparation method further includes: forming a first protection pad layer on the first organic layer, the first protection pad layer on the first organic layer The orthographic projection at least partially overlaps the orthographic projection of the first conductive layer on the first organic layer.
  • the preparation method further includes: forming a second protection pad layer on a side of the second organic layer away from the first organic layer, the second protection The orthographic projection of the pad layer on the first organic layer at least partially overlaps the orthographic projection of the second conductive layer on the first organic layer.
  • forming a first protective pad layer on the first organic layer includes:
  • a first protective film is formed on the first organic layer.
  • the first conductive layer is formed on a side of the first protective film away from the first organic layer.
  • the touch structure includes a touch area, and a binding area located on one side of the touch area.
  • a first protective pad layer on the first organic layer comprising:
  • a first protective film is formed on the first organic layer.
  • a second protective film is formed on a side of the second organic layer away from the first organic layer.
  • the second conductive layer is formed on a side of the second protective film away from the first organic layer.
  • the touch structure includes a touch area, and a binding area located on one side of the touch area.
  • a second protective film is formed on a side of the second organic layer away from the first organic layer.
  • FIG. 2 is a structural diagram of a display panel according to some embodiments.
  • FIG. 4A is a partial cross-sectional view of the display panel in FIG. 2 along the section line B-B';
  • Figure 5 is a partial enlarged view at M in Figure 4A;
  • 10-14 are partial cross-sectional views of various display panels along the section line B-B' according to some embodiments.
  • Fig. 15 is a structural diagram of another display panel according to some embodiments.
  • FIG. 16 is a partial cross-sectional view of the display panel in FIG. 15 along the section line C-C';
  • FIG. 18 is a partial cross-sectional view of the display panel in FIG. 17 along the section line D-D';
  • Fig. 19 is a structural diagram of another display panel according to some embodiments.
  • FIG. 20 is a partial cross-sectional view of the display panel in FIG. 19 along the section line E-E';
  • FIG. 24 is a partial cross-sectional view of the display panel in FIG. 23 along the section line H-H';
  • Fig. 27 is a structural diagram of a protective pad layer in a touch control structure of a display panel according to some embodiments.
  • Figure 36 is a partial enlarged view at N in Figure 2;
  • Figures 39 to 41 are step diagrams of a preparation method of the second protective cushion layer according to some embodiments.
  • first and second are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as “first” and “second” may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality” means two or more.
  • the expression “electrically connected” and its derivatives may be used.
  • the term “electrically connected” may be used when describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other.
  • a and/or B includes the following three combinations: A only, B only, and a combination of A and B.
  • the display device 1 may be an electroluminescence display device, and the electroluminescence display device may be an OLED display device, for example, an active matrix organic light emitting diode (Active Matrix Organic Light-Emitting Diode, referred to as AMOLED) display device.
  • AMOLED Active Matrix Organic Light-Emitting Diode
  • the display device 1 described above may be any device that displays an image regardless of whether it is moving (for example, video) or fixed (for example, still image) and regardless of text or text. More specifically, it is contemplated that the described embodiments may be implemented in or associated with a variety of electronic devices such as, but not limited to, mobile phones, wireless devices, personal data assistants (PDAs) , Handheld or Laptop Computers, GPS Receivers/Navigators, Cameras, MP4 Video Players, Camcorders, Game Consoles, Watches, Clocks, Calculators, Television Monitors, Flat Panel Displays, Computer Monitors, Automotive Displays (eg, odometer displays, etc.), navigators, cockpit controls and/or displays, displays for camera views (e.g., displays for rear-view cameras in vehicles), electronic photographs, electronic billboards or signage, projectors, building structures, packaging and aesthetic structures (for example, for a display of an image of a piece of jewelry), etc.
  • PDAs personal data assistants
  • Handheld or Laptop Computers GPS Receiv
  • the substrate 10 may be a multi-layer structure.
  • the substrate 10 may include a first polyimide layer, a buffer layer, and a second polyimide layer stacked in sequence.
  • the substrate 10 may include a first polyimide layer, a first buffer layer, a second polyimide layer and a second buffer layer which are sequentially stacked.
  • the display substrate 3 further includes an active layer 104 , a first gate insulating layer 105 , a first gate conductive layer 106 , a second gate insulating layer 107 , a second Gate conductive layer 108 , interlayer dielectric layer 109 and source-drain conductive layer 110 .
  • the first gate insulating layer 105 insulates between the active layer 104 and the first gate conductive layer 106
  • the second gate insulating layer 107 insulates between the first gate conductive layer 106 and the second gate conductive layer 108
  • the interlayer dielectric layer 109 insulates the second gate conductive layer 108 from the source-drain conductive layer 110 .
  • each pixel driving circuit includes a plurality of thin film transistors TFT and at least one capacitor C1 , and FIG. 3 shows one of the thin film transistors TFT and one capacitor C1 .
  • the thin film transistor TFT may include an active layer 104, a first gate insulating layer 105, a gate 106A disposed in the first gate conductive layer 106, a second gate insulating layer 107, an interlayer dielectric layer 109, and a gate 106A disposed in the source and drain The source 110A and the drain 110B in the conductive layer 110 .
  • the active layer 104 can be disposed on the substrate 10, the first gate insulating layer 105 covers the substrate 10 and the active layer 104, and the gate 106A is disposed on the side of the first gate insulating layer 105 away from the substrate 10.
  • the second gate insulating layer 107 covers the gate 106A and the first gate insulating layer 105
  • the interlayer dielectric layer 109 covers the second gate insulating layer 107
  • the source 110A and the drain 110B are arranged on the interlayer dielectric layer 109 away from the side of the substrate 10, the source 110A and the drain 110B can respectively pass through the via holes penetrating through the interlayer dielectric layer 109, the second gate insulating layer 107 and the first gate insulating layer 105 and the active layer.
  • 104 electrical connection is disposed on the substrate 10
  • the first gate insulating layer 105 covers the substrate 10 and the active layer 104
  • the gate 106A is disposed on the side of the first gate insulating layer 105 away from the substrate 10.
  • the gate 106A is disposed on the side of the active layer 104 away from the substrate 10 , that is, the gate 106A is located above the active layer 104 , and the thin film transistor TFT is a top-gate thin film transistor.
  • the gate 106A may also be disposed on the side of the active layer 104 close to the substrate 10 , that is, the gate 106A is located below the active layer 104 , and the thin film transistor TFT is a bottom gate thin film transistor.
  • the display substrate 3 further includes a passivation layer 111 and a planarization layer 112 sequentially stacked on the side of the source-drain conductive layer 110 away from the substrate 10.
  • the passivation layer 111 and the planarization layer 112 cover the source 110A and the drain.
  • the electrode 110B serves to protect the source electrode 110A and the drain electrode 110B.
  • the above-mentioned multiple film layers where the pixel driving circuit is located also include gate lines, data lines, VDD lines, and VSS lines, etc., and each pixel driving circuit is electrically connected to the gate lines, data lines, and VDD lines, and is used to provide power to the light emitting device L Output drive signal.
  • each pixel driving circuit is electrically connected to the gate lines, data lines, and VDD lines, and is used to provide power to the light emitting device L Output drive signal.
  • the VSS lines may be arranged around the display area AA in the peripheral area, and the light emitting device L is electrically connected to the VSS lines.
  • the second direction Y is consistent with the column direction of the plurality of sub-pixels arranged in an array in the display substrate 3 .
  • the multiple film layers where the driving circuit is located also include a gate driving circuit and clock signal lines, STV lines, VGH lines, VGL lines, etc. electrically connected to the gate driving circuit.
  • the display substrate 3 further includes a first electrode 113 disposed on the side of the planar layer 112 away from the substrate 10 , and the first electrode 113 is electrically connected to the source 110A through a via hole penetrating the planar layer 112 and the passivation layer 111 . connect.
  • the display substrate 3 further includes a pixel defining layer 114 disposed on a side of the flat layer 112 away from the substrate 10 , the pixel defining layer 114 has a plurality of openings, and each opening exposes at least part of the first electrode 113 , Each opening is located within a sub-pixel.
  • the light emitting device L includes a first electrode 113 , a light emitting functional layer EL and a second electrode 116 .
  • the luminescent functional layer EL is located in the opening of the pixel defining layer 114 and formed on the first electrode 113.
  • the luminescent functional layer EL may include small molecular organic materials or polymer molecular organic materials, which may be fluorescent or phosphorescent materials. , can emit red light, green light, blue light, or white light.
  • the luminescent functional layer EL can further include an electron transport layer (Election Transporting Layer, ETL for short), an electron injection layer (Election Injection Layer, EIL for short), a hole transport layer ( One or more layers in the Hole Transporting Layer (HTL for short) and the Hole Injection Layer (HIL for short).
  • the second electrode 116 covers the light emitting functional layer EL. It should be noted that, the second electrodes 116 of the light emitting devices L in each sub-pixel are connected to each other to form a planar electrode covering the entire layer, serving as a common electrode of each light emitting device L.
  • the first electrode 113 may be an anode
  • the second electrode 116 may be a cathode
  • the first electrode 113 of the light emitting device L is electrically connected to the pixel driving circuit to receive the driving signal from the pixel driving circuit, and the edge of the second electrode 116 extends to the peripheral area and is electrically connected to the VSS line to receive the VSS signal from the VSS line, An electric field is formed between the first electrode 113 and the second electrode 116 to excite the light-emitting functional layer EL to emit light.
  • the display substrate 3 further includes a support portion 115 disposed on the side of the pixel defining layer 114 away from the substrate 10 , and the support portion 115 can support and protect the film layer below it.
  • the display substrate 3 also includes an encapsulation layer 117 disposed on the side of the second electrode 116 away from the substrate 10.
  • the encapsulation layer 117 may include a first inorganic encapsulation sublayer 1171 and an organic encapsulation sublayer 1172 stacked in sequence. and the second inorganic encapsulation sublayer 1173 .
  • the encapsulation layer 117 is used for encapsulation of the display substrate 3 to prevent water and oxygen from entering and corroding the light emitting device L.
  • technologies for directly disposing the touch structure 4 on the packaging layer 117 of the display substrate 3 include FSLOC (Flexible Single-Layer On Cell) technology and FMLOC (Flexible Multi-Layer On Cell) technology.
  • the FSLOC technology can be based on the working principle of self-capacitance (or voltage) detection, and generally uses a single layer of metal to form the touch electrode.
  • self-capacitance or voltage
  • the touch IC detects the change of the self-capacitance value (or voltage value) of the touch electrode to identify the touch position of the finger, thereby realizing the display
  • the touch functionality of the device can be based on the working principle of self-capacitance (or voltage) detection, and generally uses a single layer of metal to form the touch electrode.
  • the FMLOC technology can be based on the working principle of mutual capacitance detection.
  • the touch structure 4 generally uses two layers of metal to form the touch driving electrodes (TX) and the touch sensing electrodes (RX).
  • TX touch driving electrodes
  • RX touch sensing electrodes
  • Some embodiments of the present disclosure provide a touch control structure 4, as shown in FIG. 4A and FIG. 4B, from the film layer structure of the touch control structure 4, the touch control structure 4 includes at least one touch function layer group 40, At least one touch function layer group 40 includes an organic layer 43 and a conductive layer 44 stacked in sequence.
  • the touch structure 4 includes two touch function layer groups 40, and each touch function layer group 40 includes an organic layer 43 and a conductive layer 44 stacked in sequence, that is, the touch structure 4 Including two conductive layers 44, in this case, the display panel 2 with the touch structure 4 adopts FMLOC technology.
  • the touch control structure 4 includes a touch function layer group 40, and the touch function layer group 40 includes an organic layer 43 and a conductive layer 44 stacked in sequence, that is, the touch structure 4 includes a
  • the conductive layer 44 in this case, the display panel 2 with the touch structure 4 adopts FSLOC technology.
  • the touch structure 4 also includes at least one protective pad layer 205, which is set in one-to-one correspondence with at least one touch function layer group 40, and the protective pad layer 205 is located on the corresponding touch pad layer. Between the conductive layer 44 and the organic layer 43 of the control function layer group 40. The orthographic projection of the protection pad layer 205 on the organic layer 43 at least partially overlaps the orthographic projection of the conductive layer 44 on the organic layer 43 .
  • the touch function layer group of the touch structure mostly adopts an inorganic layer and a conductive layer stacked in sequence.
  • the inventors of the present disclosure found that, for some display panels with larger display screens, the voltage signal transmitted by the electrode (for example, the second electrode 116 shown in FIG. 3 ) in the display substrate close to the touch structure, It will interfere with the voltage signal transmitted by the conductive layer in the touch structure, thereby affecting the touch performance of the touch structure.
  • the inorganic layer is an inorganic material layer, its bending performance is poor, so that the bending performance of the display panel formed by the display substrate and the touch structure is poor, which is not conducive to the preparation of a display panel with a curved screen.
  • the touch structure 4 includes at least one touch function layer group 40 , and each touch function layer group 40 includes an organic layer 43 and a conductive layer 44 stacked in sequence. Because the resistivity of the organic material is higher than that of the inorganic material, the organic layer 43 is used to replace the inorganic layer, which can reduce the voltage signal transmitted by the electrode close to the touch structure 4 in the display substrate 3 and affect the touch of the touch structure 4. The interference of the voltage signal transmitted by the conductive layer 44 in the functional layer group 40 can be prevented, thereby improving the touch performance of the touch structure 4 .
  • the organic layer 43 is an organic material layer, and the bending performance of the organic material layer is better than that of the inorganic material layer, which can improve the bending performance of the display panel 2 formed by the display substrate 3 and the touch structure 4, thereby facilitating A display panel 2 with a curved screen is prepared.
  • the conductive layer 44 is patterned by a dry etching process.
  • the etching gas used in the dry etching process includes chlorine gas. Chloride ions are easily adsorbed on the organic layer 43 and meet with water to generate acid. The acid will corrode the conductive layer 44 (refer to FIG. 28, the conductive layer 44 is a metal grid structure , the part of the mesh line of the metal grid that is located inside the circle is corroded). Therefore, by setting the protective pad layer 205 between the conductive layer 44 and the organic layer 43 of the touch function layer group 40, the orthographic projection of the protective pad layer 205 on the organic layer 43 is the same as the positive projection of the conductive layer 44 on the organic layer 43.
  • the projection overlaps at least partially, which can reduce the contact area between the conductive layer 44 and the organic layer 43 below it, so that in the process of etching the conductive layer 44, the phenomenon that the conductive layer 44 is corroded by the acid on the organic layer 43 can be improved (refer to 26, the conductive layer 44 is a metal grid structure, and the grid lines of the metal grid do not produce obvious corrosion phenomenon).
  • the touch structure 4 includes a touch area (Touch Area) TA, and along the thickness direction Z of the display substrate 3, the touch area TA roughly coincides with the display area AA.
  • Touch Area Touch Area
  • the touch structure 4 includes a plurality of touch units T arranged in the touch area TA, the plurality of touch units T includes a plurality of first touch units T1 and a plurality of second touch units T2, each first touch The unit T1 extends along the first direction X, and a plurality of first touch units T1 are arranged side by side along the second direction Y. Each second touch unit T2 extends along the second direction Y, and multiple second touch units T2 are arranged side by side along the first direction X.
  • the plurality of first touch units T1 and the plurality of second touch units T2 are insulated from each other.
  • the first touch unit T1 includes a plurality of first touch electrodes (touch sensing electrodes) T11, and a plurality of first connecting parts T12, and two adjacent first touch electrodes T11 are electrically connected through the first connecting parts T12. connect.
  • the second touch unit T2 includes a plurality of second touch electrodes (touch driving electrodes) T21 and a plurality of second connection portions T22, and two adjacent second touch electrodes T21 are electrically connected through the second connection portions T22.
  • the touch IC detects the change of the mutual capacitance between the first touch electrode T11 and the second touch electrode T21 to identify the touch action of the finger, thereby realizing the touch function of the display device.
  • the first direction X is consistent with the row direction of a plurality of sub-pixels arranged in an array in the display substrate 3 .
  • the protection pad layer 205 is disposed corresponding to the first touch function layer group 41 , and the protection pad layer 205 is also disposed correspondingly to the first conductive layer 202 and the first organic layer 201 of the first touch function layer group 41 .
  • the protection pad layer 205 is disposed corresponding to the second touch function layer group 42 , and the protection pad layer 205 is also disposed correspondingly to the second conductive layer 204 and the second organic layer 203 of the second touch function layer group 42 .
  • At least one protective pad layer 205 includes a first protective pad layer 2051, and the first protective pad layer 2051 is arranged corresponding to the first conductive layer 202 of the first touch function layer group 41.
  • the first The protection pad layer 2051 is located between the first conductive layer 202 and the first organic layer 201 .
  • At least one protective pad layer 205 includes a second protective pad layer 2052, the second protective pad layer 2052 is arranged corresponding to the second conductive layer 204, and the second protective pad layer 2052 is located on the second conductive layer 204 and the second organic layer 203.
  • the touch structure 4 includes a first protective pad layer 2051 and a second protective pad layer 2052, the first protective pad layer 2051 is arranged corresponding to the first conductive layer 202, and the first protective pad layer 2051 Located between the first conductive layer 202 and the first organic layer 201 .
  • the second protection pad layer 2052 is disposed corresponding to the second conductive layer 204 , and the second protection pad layer 2052 is located between the second conductive layer 204 and the second organic layer 203 .
  • the orthographic projection of the protection pad layer 205 on the first organic layer 201 at least partially overlaps the orthographic projection of the corresponding conductive layer 44 on the first organic layer 201 .
  • the orthographic projection of the first protection pad layer 2051 on the first organic layer 201 at least partially overlaps with the orthographic projection of the first conductive layer 202 on the first organic layer 201 .
  • the touch structure mostly adopts a first inorganic layer, a first conductive layer, a second inorganic layer and a second conductive layer which are sequentially stacked.
  • the inventors of the present disclosure found that, for some display panels with larger display screens, the voltage signal transmitted by the electrode (for example, the second electrode 116 shown in FIG. 3 ) in the display substrate close to the touch structure, It will interfere with the voltage signal transmitted by the first conductive layer and the second conductive layer in the touch structure, thereby affecting the touch performance of the touch structure.
  • first inorganic layer and the second inorganic layer are both inorganic material layers, their bending performance is poor, so that the bending performance of the display panel formed by the display substrate and the touch structure is poor, which is not conducive to the preparation of curved screen display. panel.
  • the first organic layer 201 is used to replace the first inorganic layer
  • the second organic layer 203 is used to replace the second inorganic layer, which can reduce the touch-sensitive structure 4 in the display substrate 3
  • the voltage signal transmitted by the electrodes interferes with the voltage signal transmitted by the first conductive layer 202 and the second conductive layer 204 in the touch structure 4 , thereby improving the touch performance of the touch structure 4 .
  • the conductive layer 44 is patterned by using a dry etching process.
  • the etching gas used in the dry etching process includes chlorine gas. Chloride ions are easily adsorbed on the organic layer 43 and meet with water to generate acid. The acid will corrode the conductive layer 44 (refer to FIG. 28, the conductive layer 44 is a metal grid structure , the part of the mesh line of the metal grid that is located inside the circle is corroded).
  • the orthographic projection of the protection pad layer 205 on the first organic layer 201 is the same as that of the corresponding conductive layer 44 on the first organic layer 201.
  • the orthographic projections on the organic layer 201 are at least partially overlapped, which can reduce the contact area between the conductive layer 44 and the organic layer 43 below, thereby improving the ability of the conductive layer 44 to be positioned on the organic layer 43 during the process of etching the conductive layer 44.
  • Acid corrosion phenomenon (refer to FIG. 26 , the conductive layer 44 is a metal grid structure, and the grid lines of the metal grid do not produce obvious corrosion phenomenon).
  • the material of the first organic layer 201 and the second organic layer 203 includes at least one of polymethyl methacrylate, organosilicon compound, polyimide or epoxy resin.
  • the thickness of the first organic layer 201 ranges from 1 ⁇ m to 4 ⁇ m, for example, the thickness is 1 ⁇ m, 2 ⁇ m, 2.5 ⁇ m, 3 ⁇ m or 4 ⁇ m.
  • the thickness of the second organic layer 203 ranges from 1 ⁇ m to 4 ⁇ m, for example, the thickness is 1 ⁇ m, 2 ⁇ m, 2.5 ⁇ m, 3 ⁇ m or 4 ⁇ m.
  • the material of the protection pad layer 205 includes inorganic materials, for example, the inorganic materials may include silicon nitride.
  • the inorganic material is not easy to absorb chlorine ions, and during the etching process of the conductive layer, the chlorine ions adsorbed on the inorganic material layer are very small, and the concentration of the acid generated when it meets water is very low. Therefore, using inorganic materials to form the protective pad layer 205 can reduce the corrosion phenomenon of the conductive layer.
  • the thickness of the protective pad layer 205 is smaller than the thickness of the organic layer 43 of the corresponding touch function layer group 40, and by setting the protective pad layer 205 thinner, it is beneficial to simplify the film-forming process of the protective pad layer 205 and patterning process.
  • the thickness of the first protective pad layer 2051 is smaller than the thickness of the first organic layer 201 .
  • the thickness of the second protection pad layer 2052 is smaller than the thickness of the second organic layer 203 .
  • the thickness of the protection pad layer 205 is in the range of 0.05 ⁇ m ⁇ 0.1 ⁇ m, for example, the thickness is 0.05 ⁇ m, 0.06 ⁇ m, 0.08 ⁇ m, 0.09 ⁇ m or 0.1 ⁇ m.
  • the first conductive layer 202 and the second conductive layer 204 are metal grid structures.
  • the touch electrodes of the metal grid structure have low resistance and high sensitivity, which can improve the touch sensitivity of the touch structure 4 .
  • the touch electrodes with the metal mesh structure have high mechanical strength, which can reduce the weight of the touch structure 4 .
  • the first conductive layer 202 and the second conductive layer 204 may be a single layer structure. In some other embodiments, the first conductive layer 202 and the second conductive layer 204 can also be a laminated structure, for example, the first conductive layer 202 and the second conductive layer 204 can be sequentially stacked titanium, aluminum and titanium metal layer.
  • the protective pad layer 205 can block the conductive layer 44 and the organic layer 43 below, so that the conductive layer 44 can be prevented from being corroded by the acid on the organic layer 43 during the etching process of the conductive layer 44 .
  • the orthographic projection of the protective pad layer 205 on the first organic layer 201 approximately coincides with the orthographic projection of the corresponding conductive layer 44 on the first organic layer 201 .
  • the orthographic projection of the protective pad layer 205 on the first organic layer 201 roughly coincides with the orthographic projection of the corresponding conductive layer 44 on the first organic layer 201, so that the outline of the protective pad layer 205 is consistent with the corresponding conductive layer 44.
  • the contours of the layers 44 are substantially the same, and the protective pad layer 205 can just block the corresponding conductive layer 44 and the organic layer 43 below the conductive layer 44, so that in the process of etching the conductive layer 44, the conductive layer 44 can be prevented from being located on the organic layer 43.
  • the problem of acid corrosion on layer 43 is substantially the same, and the protective pad layer 205 can just block the corresponding conductive layer 44 and the organic layer 43 below the conductive layer 44, so that in the process of etching the conductive layer 44, the conductive layer 44 can be prevented from being located on the organic layer 43.
  • FIG. 4A the orthographic projection of the first protective pad layer 2051 on the first organic layer 201 approximately coincides with the orthographic projection of the first conductive layer 202 on the first organic layer 201 .
  • FIG. 6 shows the arrangement of the first protection pad layer 2051 in the touch area TA.
  • FIG. 8 the orthographic projection of the second protective pad layer 2052 on the first organic layer 201 approximately coincides with the orthographic projection of the second conductive layer 204 on the first organic layer 201 .
  • FIG. 9 shows the arrangement of the second protection pad layer 2052 in the touch area TA.
  • a "closed figure” refers to a figure in a closed state in its dimension, a closed figure composed of N (N is a positive integer) line segments or arcs. Therefore, the orthographic projection of the protection cushion layer 205 on the first organic layer 201 is a closed figure, indicating that the protection cushion layer 205 is a film layer on the entire surface, and the inside of the protection cushion layer 205 is not hollowed out.
  • the orthographic projection of the protective cushion layer 205 on the first organic layer 201 is a closed figure, and the orthographic projection of the conductive layer 44 corresponding to the protective cushion layer 205 on the first organic layer 201 is within the range of the closed figure , so that the protective pad layer 205 can better block the corresponding conductive layer 44 and the organic layer 43 located below the conductive layer 44, so that in the process of etching the conductive layer 44, the conductive layer 44 can be prevented from contacting the organic layer 43 And the problem of being corroded by acid.
  • the orthographic projection of the protective pad layer 205 on the first organic layer 201 is roughly coincident with the orthographic projection of the organic layer 43 corresponding to the protective pad layer 205 on the first organic layer 201, so that the protective pad layer 205 covers the
  • the organic layer 43 under the conductive layer 44 can prevent the conductive layer 44 from being corroded by acid during the process of etching the conductive layer 44 .
  • the display panel 2 is located in the binding area BD and is provided with a plurality of pins 5, and is bound to a flexible circuit board (Flexible Printed Circuit, FPC for short) through a plurality of pins 5 to receive voltage from the flexible circuit board Signal.
  • FPC Flexible Printed Circuit
  • the first conductive layer 202 is provided with a first protective pad layer 2051 correspondingly, and the protective pad layer 205 is not provided under the second conductive layer 204 .
  • the orthographic projection of the first protective pad layer 2051 on the first organic layer 201 is a closed figure, and the orthographic projection of the first conductive layer 202 on the first organic layer 201 is located within the range of the closed figure, and is staggered from the binding region BD .
  • no protective pad layer 205 is disposed under the first conductive layer 202
  • a second protective pad layer 2052 is disposed on the second conductive layer 204 correspondingly.
  • the orthographic projection of the second protection pad layer 2052 on the first organic layer 201 approximately coincides with the orthographic projection of the second conductive layer 204 on the first organic layer 201 .
  • no protective pad layer 205 is provided under the first conductive layer 202
  • a second protective pad layer 2052 is provided correspondingly on the second conductive layer 204 .
  • the orthographic projection of the second protective pad layer 2052 on the first organic layer 201 is a closed figure
  • the orthographic projection of the second conductive layer 204 on the first organic layer 201 is located within the range of the closed figure, and is staggered from the binding region BD .
  • the first conductive layer 202 is correspondingly provided with a first protective pad layer 2051
  • the second conductive layer 204 is correspondingly provided with a second protective pad layer 2052 .
  • the orthographic projection of the first protective pad layer 2051 on the first organic layer 201 approximately coincides with the orthographic projection of the first conductive layer 202 on the first organic layer 201 .
  • the orthographic projection of the second protection pad layer 2052 on the first organic layer 201 approximately coincides with the orthographic projection of the second conductive layer 204 on the first organic layer 201 .
  • the first conductive layer 202 is correspondingly provided with a first protective pad layer 2051
  • the second conductive layer 204 is correspondingly provided with a second protective pad layer 2052 .
  • the orthographic projection of the first protective pad layer 2051 on the first organic layer 201 is a closed figure
  • the orthographic projection of the first conductive layer 202 on the first organic layer 201 is located within the range of the closed figure, and is staggered from the binding region BD .
  • the orthographic projection of the second protection pad layer 2052 on the first organic layer 201 approximately coincides with the orthographic projection of the second conductive layer 204 on the first organic layer 201 .
  • the first conductive layer 202 is correspondingly provided with a first protective pad layer 2051
  • the second conductive layer 204 is correspondingly provided with a second protective pad layer 2052 .
  • the orthographic projection of the first protective pad layer 2051 on the first organic layer 201 is a closed figure
  • the orthographic projection of the first conductive layer 202 on the first organic layer 201 is located within the range of the closed figure, and is staggered from the binding region BD .
  • the orthographic projection of the second protective pad layer 2052 on the first organic layer 201 is a closed figure, and the orthographic projection of the second conductive layer 204 on the first organic layer 201 is located within the range of the closed figure, and is staggered from the binding region BD .
  • the conductive layer 44 is patterned by a dry etching process, and the etching gas used in the dry etching process includes chlorine gas. Therefore, the smaller the thickness of the conductive layer 44 is, the shorter the etching time is, the less chlorine ions are adsorbed on the organic layer 43 , and the lower the concentration of the acid generated when encountering water. On the contrary, the thicker the conductive layer 44 is, the longer the etching time is, the more chlorine ions are adsorbed on the organic layer 43 , and the higher the concentration of the acid generated when it encounters water.
  • the thickness of the conductive layer 44 correspondingly provided with the protective pad layer 205 is greater than or equal to 0.3 ⁇ m, for example, the thickness may be 0.3 ⁇ m, 0.5 ⁇ m, 0.6 ⁇ m, 0.8 ⁇ m or 1.0 ⁇ m.
  • setting the conductive layer 44 thicker can reduce the resistance of the conductive layer 44 , thereby reducing the voltage drop generated when the conductive layer 44 transmits voltage signals, which is beneficial to improve the touch performance of the touch control structure 4 .
  • the first conductive layer 202 is provided with a first protective pad layer 2051 correspondingly, and the first conductive layer 202 may be thicker.
  • one of the first conductive layer 202 and the second conductive layer 204 is provided with the protection cushion layer 205 correspondingly, and the other one is not provided with the protection cushion layer 205 correspondingly.
  • the conductive layer 44 correspondingly provided with the protective pad layer 205 can be set thicker.
  • Conductive layer 44, the conductive layer 44 that is not correspondingly provided with the protective pad layer 205 can be set thinner, so that the thickness of the conductive layer 44 that is correspondingly provided with the protective pad layer 205 is greater than the thickness of the conductive layer 44 that is not correspondingly provided with the protective pad layer 205 .
  • the time for etching the conductive layer 44 can be shortened to reduce the chlorine ions adsorbed on the organic layer 43 and reduce the generation of chlorine ions on the organic layer 43 when they meet water. concentration of acid.
  • the protective pad layer 205 may not be provided between the conductive layer 44 and the underlying organic layer 43 , that is, the conductive layer 44 may be in direct contact with the organic layer 43 , and the corrosion phenomenon generated by the conductive layer 44 is relatively slight.
  • the first conductive layer 202 is correspondingly provided with a protective pad layer 205
  • the second conductive layer 204 is not provided with a corresponding protective pad layer 205
  • the thickness of the first conductive layer 202 is greater than that of the second conductive layer 204. thickness.
  • the first conductive layer 202 is not provided with a protective pad layer 205 correspondingly
  • the second conductive layer 204 is provided with a protective pad layer 205 correspondingly
  • the thickness of the second conductive layer 204 is greater than that of the first conductive layer 202 thickness.
  • one of the first conductive layer 202 and the second conductive layer 204 is provided with a protective pad layer 205 correspondingly, and the protective pad layer 205 is not correspondingly provided under the other. .
  • the conductive layer 44 not correspondingly provided with the protective pad layer 205 is set thinner.
  • the thickness of the conductive layer 44 without the protective pad layer 205 is less than 0.3 ⁇ m, for example, the thickness may be 0.1 ⁇ m, 0.15 ⁇ m, 0.2 ⁇ m, 0.26 ⁇ m or 0.28 ⁇ m.
  • the surface of the protective pad layer 205 near the corresponding conductive layer 44 has a plurality of pits S, and the surface of the conductive layer 44 away from the corresponding protective pad layer 205 has A plurality of dimples S.
  • a chemical vapor deposition (Chemical Vapor Deposition, CVD) process is adopted, that is, high-speed moving ions are used to bombard the target material, so that the protective cushion layer 205 is formed after the target material is deposited.
  • the surface of the protection pad layer 205 away from the first organic layer 201 will be bombarded by high-speed moving ions, forming a plurality of pits S. Therefore, the conductive layer 44 is prepared on the protective pad layer 205, and the conductive layer 44 is attached to the surface of the protective pad layer 205 by gravity, so that the surface of the conductive layer 44 away from the corresponding protective pad layer 205 has a plurality of pits S.
  • the surface of the conductive layer 44 away from the corresponding protective pad layer 205 has a plurality of pits S, so as to improve the surface roughness of the conductive layer 44, thereby reducing the resistance of the conductive layer 44 to external ambient light.
  • the reflective effect is used to reduce the influence on the display picture of the display panel 2 .
  • the following describes how the multiple touch control units T are arranged in the first conductive layer 202 and the second conductive layer 204 .
  • One of the conductive layer 202 and the second conductive layer 204 , and the plurality of second connection portions T22 are disposed on the other of the first conductive layer 202 and the second conductive layer 204 .
  • first touch electrodes T11 are directly electrically connected through the first connecting portion T12.
  • the second connection portion T22 is electrically connected to two adjacent second touch electrodes T21 through the via hole H in the second organic layer 203 .
  • a plurality of first touch electrodes T11, a plurality of second touch electrodes T21 and a plurality of first connection parts T12 are arranged on the second conductive layer 204, and the plurality of second The connecting portion T22 is disposed on the first conductive layer 202 .
  • the second conductive layer 204 is farther away from the display substrate 3 than the first conductive layer 202, and a plurality of first touch electrodes T11 and a plurality of second touch electrodes T21 are disposed on the second conductive layer 204, which can The interference of the voltage signal transmitted by the electrode close to the touch structure 4 in the display substrate 3 to the voltage signal transmitted by the first touch electrode T11 and the second touch electrode T21 is reduced.
  • a plurality of first touch electrodes T11, a plurality of second touch electrodes T21 and a plurality of first connecting parts T12 are arranged on the first conductive layer 202, and a plurality of second The connection portion T22 is disposed on the second conductive layer 204 .
  • a plurality of first touch electrodes T11, a plurality of second touch electrodes T21 and a plurality of second connection parts T22 are disposed on the first conductive layer 202 and the second In one of the conductive layers 204 , the plurality of first connection portions T12 are disposed on the other of the first conductive layer 202 and the second conductive layer 204 .
  • first connection portion T12 is electrically connected to two adjacent first touch electrodes T11 through the via hole H in the second organic layer 203 .
  • Two adjacent second touch electrodes T21 are directly electrically connected through the second connecting portion T22.
  • a plurality of first touch electrodes T11, a plurality of second touch electrodes T21 and a plurality of second connection parts T22 are arranged on the first conductive layer 202, and the plurality of first The connection portion T12 is disposed on the second conductive layer 204 .
  • a plurality of first touch electrodes T11, a plurality of second touch electrodes T21 and a plurality of second connection parts T22 are arranged on the second conductive layer 204, and the plurality of first The connecting portion T12 is disposed on the first conductive layer 202 .
  • a plurality of first touch electrodes T11, a plurality of second touch electrodes T21 and a plurality of first connecting parts T12 are disposed on the same conductive layer 44, and the plurality of first touch electrodes T11
  • the conductive layer 44 where the second connecting portion T22 is located is correspondingly provided with a protective pad layer 205 .
  • the two adjacent first touch electrodes T11 are directly electrically connected through the first connection part T12, and the second connection part T22 passes through the via hole H in the second organic layer 203 to connect with two adjacent first touch electrodes T11.
  • the two touch electrodes T21 are electrically connected, that is, the second connection portion T22 serves as a bridging electrode and electrically connects two adjacent second touch electrodes T21 across the first connection portion T12 .
  • the thickness of the second connection part T22 can be increased to reduce the resistance of the second connection part T22, thereby reducing the voltage
  • the voltage drop generated during the transmission of the signal on the second connection portion T22 is beneficial to improve the touch performance of the touch structure 4 .
  • first connection portion T12 is electrically connected to two adjacent first touch electrodes T11 through the via hole H in the second organic layer 203 .
  • the two adjacent second touch electrodes T21 are directly electrically connected through the second connection part T22, that is, the first connection part T12 serves as a bridging electrode and electrically connects two adjacent first touch electrodes across the second connection part T22. T11.
  • the thickness of the first connection part T12 can be increased to reduce the resistance of the first connection part T12, thereby Reducing the voltage drop generated during the transmission of the voltage signal on the first connecting portion T12 is beneficial to improving the touch performance of the touch structure 4 .
  • the touch structure 4 further includes a plurality of auxiliary electrodes F, and a plurality of first touch electrodes T11 and a plurality of second touch electrodes T21 are disposed on the first conductive layer. 202 and one of the second conductive layer 204 , and a plurality of auxiliary electrodes F are disposed on the other of the first conductive layer 202 and the second conductive layer 204 .
  • each auxiliary electrode F on the first organic layer 201 at least partially overlaps with the orthographic projection of the first touch electrode T11 or the second touch electrode T21 on the first organic layer 201, that is, each auxiliary electrode F
  • the electrode F corresponds to one touch electrode
  • the auxiliary electrode F is electrically connected to the corresponding touch electrode (the first touch electrode T11 or the second touch electrode T21 ) through the via hole H in the second organic layer 203 .
  • the auxiliary electrode F is connected in parallel with the first touch electrode T11 or the second touch electrode T21, which can reduce the resistance of the first touch electrode T11 or the second touch electrode T21, thereby reducing the voltage signal in the
  • the voltage drop generated during transmission on the first touch electrode T11 or the second touch electrode T21 is beneficial to improve the touch performance of the touch structure 4 .
  • a plurality of first touch electrodes T11 and a plurality of second touch electrodes T21 are disposed on the first conductive layer 202
  • a plurality of auxiliary electrodes F are disposed on the second conductive layer 204 .
  • a plurality of first touch electrodes T11 and a plurality of second touch electrodes T21 are disposed on the second conductive layer 204
  • a plurality of auxiliary electrodes F are disposed on the first conductive layer 202 .
  • the first touch electrode T11 and the second touch electrode T21 are disposed on the first conductive layer 202
  • the first connection part T12 is disposed on one of the first conductive layer 202 and the second conductive layer 204
  • the second connection portion T22 is disposed on the other of the first conductive layer 202 and the second conductive layer 204 .
  • the first connection portion T12 is disposed on the first conductive layer 202
  • the second connection portion T22 is disposed on the second conductive layer 204 .
  • the orthographic projection of the first connecting portion T12 on the display substrate 3 overlaps the orthographic projection of the second connecting portion T22 on the display substrate 3, and the area defined by the overlapping portion is the overlapping area B. .
  • the second organic layer 203 includes a plurality of isolation portions 2030, one isolation portion 2030 is provided in each overlapping region B, and the orthographic projection of the isolation portions 2030 on the display substrate 3 at least covers the overlapping region B, and located at both ends of the orthographic projection of the connection portion of the second conductive layer 204 on the display substrate 3 , protruding from the boundary C of the orthographic projection of the isolation portion 2030 on the display substrate 3 .
  • the first organic layer since the first organic layer includes organic materials, its high temperature resistance is poor, and it is necessary to use a low temperature process (for example, an exposure and development process) to open holes on the first organic layer, but the analysis of this opening method The force is small, and there is a phenomenon that the first organic layer cannot be penetrated, so that the conductive patterns in the first conductive layer and the conductive patterns in the second conductive layer cannot be electrically connected through the via holes in the first organic layer, resulting in an open circuit. Moreover, the low-temperature process is used to open holes on the first organic layer, and the uniformity of critical dimensions (CD for short) of different holes is poor.
  • a low temperature process for example, an exposure and development process
  • the second organic layer 203 is patterned to form a plurality of isolation portions 2030 .
  • Each overlapping area B is provided with an isolation part 2030, and the orthographic projection of the isolation part 2030 on the display substrate 3 at least covers the overlapping area B, and the first connection part T12 and the second connection part T22 are blocked by the isolation part 2030, so as to realize The first connecting portion T12 and the second connecting portion T22 are insulated in the overlapping region B.
  • the two ends of the orthographic projection of the connection portion of the second conductive layer 204 on the display substrate 3 protrude from the boundary C of the orthographic projection of the isolation portion 2030 on the display substrate 3, so that the two ends of the connection portion and the corresponding The surfaces of two adjacent touch electrodes are in contact and form electrical contact, so as to ensure a stable electrical connection between the touch electrodes and the connecting portion.
  • the problem of an open circuit between the touch electrode and the connection part due to the opening of holes on the second organic layer 203 by a low-temperature process is avoided because the holes cannot penetrate through the second organic layer 203 .
  • the first connection portion T12 is disposed on the first conductive layer 202
  • the second connection portion T22 is disposed on the second conductive layer 204
  • the two ends of the first connection portion T12 are connected to Two adjacent first touch electrodes T11 are directly electrically connected, and both ends of the second connection portion T22 are in contact with the surfaces of two adjacent second touch electrodes T21 to form electrical contact.
  • each first connecting portion T12 is integrally arranged with two adjacent first touch electrodes T11, which can reduce the resistance of the connecting portion between the first connecting portion T12 and the first touch electrode T11. .
  • the two ends of the orthographic projection of the second connecting portion T22 on the display substrate 3 protrude from the boundary C of the orthographic projection of the isolation portion 2030 on the display substrate 3 , and the two adjacent to the second connecting portion T22
  • the second touch electrodes T21 respectively ride on the surface of the second connection portion T22 to ensure a stable electrical connection between the second connection portion T22 and the second touch electrode T21 .
  • the problem of an open circuit between the second touch electrode T21 and the second connection portion T22 due to the opening of holes on the second organic layer 203 by a low-temperature process is avoided because the holes cannot penetrate through the second organic layer 203 .
  • the touch structure 4 further includes a third organic layer 206, and the third organic layer 206 is disposed on the side of the second conductive layer 204 away from the first organic layer 201 to protect the
  • the underlying film layers (for example, the second conductive layer 204 , the second organic layer 203 , the first conductive layer 202 and the first organic layer 201 ) function.
  • the material of the third organic layer 206 may include at least one of polymethyl methacrylate, organosilicon compound, polyimide, or epoxy resin.
  • the touch structure 4 includes at least one touch function layer group 40, and each touch function layer group 40 includes sequentially stacked layers.
  • the manufacturing method includes sequentially forming the organic layer 43 and the conductive layer 44 .
  • the preparation method before forming the conductive layer 44, also includes: forming a protective pad layer 205 on the organic layer 43, an orthographic projection of the protective pad layer 205 on the organic layer 43, and an orthographic projection of the conductive layer 44 on the organic layer 43 overlap at least partially.
  • the above-mentioned preparation method of the present disclosure uses the organic layer 43 to replace the inorganic layer, because the resistivity of the organic material is higher than that of the inorganic material, which can reduce the number of electrodes in the display substrate 3 close to the touch structure 4
  • the transmitted voltage signal interferes with the voltage signal transmitted by the conductive layer 44 in the touch structure 4 , thereby improving the touch performance of the touch structure 4 .
  • the organic layer 43 is an organic material layer, and the bending performance of the organic material layer is better than that of the inorganic material layer, which can improve the bending performance of the display panel 2 formed by the display substrate 3 and the touch structure 4, thereby facilitating A display panel 2 with a curved screen is prepared.
  • the conductive layer 44 is patterned by using a dry etching process.
  • the etching gas used in the dry etching process includes chlorine gas. Chloride ions are easily adsorbed on the organic layer 43 to generate acid when meeting water, and the acid will corrode the conductive layer 44 .
  • the orthographic projection of the protective pad layer 205 on the organic layer 43 at least partially overlaps with the orthographic projection of the conductive layer 44 on the organic layer 43, which can reduce the The small contact area between the conductive layer 44 and the organic layer 43 can improve the phenomenon that the conductive layer 44 is corroded by the acid on the organic layer 43 during the process of etching the conductive layer 44 .
  • At least one touch function layer group 40 includes a first touch function layer group 41 and a second touch function layer group 42, and the first touch function layer group 41 includes sequentially stacked
  • the first organic layer 201 and the first conductive layer 202 are provided
  • the second touch function layer group 42 includes a second organic layer 203 and a second conductive layer 204 which are sequentially stacked.
  • the preparation method includes sequentially forming a first organic layer 201 , a first conductive layer 202 , a second organic layer 203 and a second conductive layer 204 .
  • the preparation method further includes: forming a first protection pad layer 2051 on the first organic layer 201, the orthographic projection of the first protection pad layer 2051 on the first organic layer 201, and the second Orthographic projections of a conductive layer 202 on the first organic layer 201 are at least partially overlapped.
  • the first organic layer 201 is used to replace the first inorganic layer
  • the second inorganic layer 203 is used to replace the second inorganic layer, because the resistivity of the organic material is higher than that of the inorganic material, It can reduce the interference of the voltage signal transmitted by the electrode close to the touch control structure 4 in the display substrate 3 to the voltage signal transmitted by the first conductive layer 202 and the second conductive layer 204 in the touch structure 4, thereby improving Touch performance of touch structure 4.
  • both the first organic layer 201 and the second organic layer 203 are organic material layers, and the bending performance of the organic material layer is better than that of the inorganic material layer, which can improve the performance of the display panel formed by the display substrate 3 and the touch structure 4. 2, which facilitates the preparation of display panels 2 with curved screens.
  • the first conductive layer 202 is patterned by using a dry etching process.
  • the etching gas used in the dry etching process includes chlorine gas. Chloride ions are easily adsorbed on the first organic layer 201 to generate acid when meeting water, and the acid will corrode the conductive layer 44 .
  • the orthographic projection of the first protective pad layer 2051 on the first organic layer 201 is identical to that of the first conductive layer 202 at the second
  • the orthographic projections on an organic layer 201 overlap at least partially, so that the contact area between the first conductive layer 202 and the first organic layer 201 can be reduced, so that in the process of etching the first conductive layer 202, the first conductive layer 202 can be improved.
  • the preparation method includes sequentially forming a first organic layer 201 , a first conductive layer 202 , a second organic layer 203 and a second conductive layer 204 .
  • the preparation method further includes: forming a second protection pad layer 2052 on the side of the second organic layer 203 away from the first organic layer 201, the second protection pad layer 2052 is on the first organic layer
  • the orthographic projection on the first organic layer 201 at least partially overlaps with the orthographic projection of the second conductive layer 204 on the first organic layer 201 .
  • the first organic layer 201 is used to replace the first inorganic layer
  • the second inorganic layer 203 is used to replace the second inorganic layer, because the resistivity of the organic material is higher than that of the inorganic material, It can reduce the interference of the voltage signal transmitted by the electrode close to the touch control structure 4 in the display substrate 3 to the voltage signal transmitted by the first conductive layer 202 and the second conductive layer 204 in the touch structure 4, thereby improving Touch performance of touch structure 4.
  • both the first organic layer 201 and the second organic layer 203 are organic material layers, and the bending performance of the organic material layer is better than that of the inorganic material layer, which can improve the performance of the display panel formed by the display substrate 3 and the touch structure 4. 2, which facilitates the preparation of display panels 2 with curved screens.
  • the second conductive layer 204 is patterned by using a dry etching process.
  • the etching gas used in the dry etching process includes chlorine gas. Chloride ions are easily adsorbed on the second organic layer 203 to generate acid when meeting water, and the acid will corrode the conductive layer 44 .
  • the orthographic projection of the second protection pad layer 2052 on the first organic layer 201 is the same as that of the second conductive layer 204 at the second
  • the orthographic projections on an organic layer 201 are at least partially overlapped, so that the contact area between the second conductive layer 204 and the second organic layer 203 can be reduced, so that in the process of etching the second conductive layer 204, the second conductive layer 204 can be improved.
  • the preparation method includes sequentially forming a first organic layer 201 , a first conductive layer 202 , a second organic layer 203 and a second conductive layer 204 .
  • the preparation method further includes: forming a second protection pad layer 2052 on the side of the second organic layer 203 away from the first organic layer 201, the second protection pad layer 2052 is on the first organic layer
  • the orthographic projection on the first organic layer 201 at least partially overlaps with the orthographic projection of the second conductive layer 204 on the first organic layer 201 .
  • forming the first protective pad layer 2051 on the first organic layer 201 includes the following steps S11-S13:
  • a first protective film L1 is formed on the first organic layer 201 .
  • the touch structure 4 includes a touch area TA, and a binding area BD located on one side of the touch area TA, and the display substrate 3 includes a multi-layered area located in the binding area BD. pin 5.
  • Forming the first protective pad layer 2051 on the first organic layer 201 includes the following steps S21-S22:
  • a photoresist layer is provided on the surface of the first protective film L1 away from the first organic layer 201, and a mask is used to expose and develop the part of the photoresist layer located in the binding region BD , removing the part of the photoresist layer located in the binding region BD. Using the remaining photoresist layer as a mask, etch the part of the first protection film L1 located in the bonding region BD to obtain the first protection pad layer 2051 .
  • FIG. 36 it can be seen that the touch structure 4 shown in FIG. 37 , FIG. 38 , and FIG. 42 to FIG. 45 are partial cross-sectional views of the display panel 2 along the section line G-G' in FIG. 36 .
  • the first protective film L1 directly covers the plurality of pins 5 located in the bonding area BD of the display substrate 3 , and the patterning process is used to remove the pins 5 located in the bonding area of the first protective film L1 . part of the area BD to expose the plurality of pins 5 of the display panel 2 located in the bonding area BD, so as to facilitate the bonding of the plurality of pins 5 to the flexible circuit board.
  • the second protective pad layer 2052 is formed on the side of the second organic layer 203 away from the first organic layer 201, including the following steps S31-S33:
  • forming the first protection pad layer 2051 on the first organic layer 201 includes the following steps S41-S42:
  • a photoresist layer is provided on the surface of the second protective film L2 away from the first organic layer 201, and a mask plate is used to expose and develop the part of the photoresist layer located in the binding region BD to remove light
  • the resist layer is located in the part of the binding region BD.
  • etch the part of the second protection film L2 located in the bonding region BD to obtain the second protection pad layer 2052 .
  • the second protective film L2 is directly covered on the plurality of pins 5 located in the binding area BD of the display substrate 3 , and the second protective film L2 is removed by using a patterning process.
  • the part located in the binding area BD is used to expose the plurality of pins 5 of the display panel 2 located in the binding area BD, so as to facilitate the binding of the plurality of pins 5 to the flexible circuit board.
  • the first protective film L1 , the second organic layer 203 and the second protective film L2 are sequentially formed on the first organic layer 201 .
  • the same patterning process is used to respectively remove the first protection film L1 and the second protection film L2 at the binding region BD to obtain the first protection pad layer 2051 and the second protection pad layer 2052 .
  • a photoresist layer is provided on the surface of the second protective film L2 away from the first organic layer 201, and a mask plate is used to expose and develop the part of the photoresist layer located in the binding region BD to remove light
  • the resist layer is located in the part of the binding region BD.
  • the first protective film L1 and the second protective film L2 are directly covered on the plurality of pins 5 located in the binding area BD of the display substrate 3. Under the same patterning process, , remove the part of the first protective film L1 and the second protective film L2 located in the bonding area BD, to expose the plurality of pins 5 of the display panel 2 located in the binding area BD, so as to facilitate the connection of the plurality of pins 5 with the flexible circuit board to bind.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种触控结构，包括至少一个触控功能层组和至少一个保护垫层。其中，至少一个触控功能层组包括依次层叠设置的有机层和导电层。至少一个保护垫层与至少一个触控功能层组一一对应设置，所述保护垫层位于对应的触控功能层组的导电层和有机层之间。所述保护垫层在所述有机层上的正投影，与所述导电层在所述有机层上的正投影至少部分重叠。

Description

触控结构及其制备方法、显示面板及显示装置
本申请要求于2021年8月13日提交的、申请号为202110929096.X的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本公开涉及显示技术领域，尤其涉及一种触控结构及其制备方法、显示面板及显示装置。
背景技术
随着显示技术领域的发展，有机发光二极管(Organic Light-Emitting Diode，简称OLED)显示面板逐渐成为领域内主流产品之一。
目前，对于具有大尺寸触控显示屏的OLED显示面板，人们更加注重触控显示屏的触控性能和弯折性能。
公开内容
一方面，提供一种触控结构。所述触控结构包括至少一个触控功能层组和至少一个保护垫层。其中，所述至少一个触控功能层组包括依次层叠设置的有机层和导电层。至少一个保护垫层与至少一个触控功能层组一一对应设置，所述保护垫层位于对应的触控功能层组的导电层和有机层之间。所述保护垫层在所述有机层上的正投影，与所述导电层在所述有机层上的正投影至少部分重叠。
在一些实施例中，至少一个触控功能层组包括第一触控功能层组和第二触控功能层组，第一触控功能层组包括依次层叠设置的第一有机层和第一导电层。第二触控功能层组设置于所述第一导电层远离所述第一有机层的一侧，所述第二触控功能层组包括依次层叠设置的第二有机层和第二导电层。
其中，至少一个保护垫层与所述第一导电层和/或所述第二导电层对应设置。所述保护垫层在所述第一有机层上的正投影，与对应的导电层在所述第一有机层上的正投影至少部分重叠。
在一些实施例中，所述保护垫层在所述第一有机层上的正投影，与对应的导电层在所述第一有机层上的正投影大致重合。或，所述保护垫层在所述第一有机层上的正投影为封闭图形，与所述保护垫层对应的导电层在所述第一有机层上的正投影位于所述封闭图形的范围内。
在一些实施例中，所述触控结构包括触控区，及位于所述触控区一侧的绑定区。所述保护垫层在所述第一有机层上的正投影与所述绑定区相互错开。
在一些实施例中，所述至少一个保护垫层包括第一保护垫层和/或第二保 护垫层，所述第一保护垫层与所述第一导电层对应设置，位于所述第一导电层与所述第一有机层之间。所述第二保护垫层与所述第二导电层对应设置，位于所述第二导电层与所述第二有机层之间。
在一些实施例中，所述第一导电层和所述第二导电层中，对应设置有保护垫层的导电层的厚度大于或等于0.3μm。
在一些实施例中，所述第一导电层和所述第二导电层中的一者对应设置有保护垫层，对应设置有保护垫层的导电层的厚度，大于另一导电层的厚度。
在一些实施例中，所述第一导电层和所述第二导电层中的一者对应设置有保护垫层，所述第一导电层和所述第二导电层中的另一者的厚度小于0.3μm。
在一些实施例中，所述触控结构包括触控区，所述触控结构包括设置于所述触控区的多个触控单元，所述多个触控单元包括多个第一触控单元和多个第二触控单元。每个第一触控单元沿第一方向延伸，所述多个第一触控单元沿第二方向并列设置。每个第二触控单元沿第二方向延伸，所述多个第二触控单元沿第一方向并列设置。
所述第一触控单元包括多个第一触控电极，及多个第一连接部，相邻两个第一触控电极之间通过第一连接部电连接。所述第二触控单元包括多个第二触控电极，及多个第二连接部，相邻两个第二触控电极通过第二连接部电连接。其中，所述多个第一触控电极、所述多个第二触控电极和所述多个第一连接部设置于所述第一导电层和所述第二导电层中的一者，所述多个第二连接部设置于所述第一导电层和所述第二导电层中的另一者。
或，所述多个第一触控电极、所述多个第二触控电极和所述多个第二连接部设置于所述第一导电层和所述第二导电层中的一者，所述多个第一连接部设置于所述第一导电层和所述第二导电层中的另一者。
在一些实施例中，所述多个第一触控电极、所述多个第二触控电极和所述多个第一连接部设置于同一导电层，所述多个第二连接部所在的导电层对应设置有保护垫层。
或，所述多个第一触控电极、所述多个第二触控电极和所述多个第二连接部设置于同一导电层，所述多个第一连接部所在的导电层对应设置有保护垫层。
在一些实施例中，所述触控结构还包括多个辅助电极，所述多个第一触控电极和所述多个第二触控电极设置于所述第一导电层和所述第二导电层中的一者，所述多个辅助电极设置于所述第一导电层和所述第二导电层中的另 一者。每个辅助电极在所述第一有机层上的正投影，与第一触控电极或第二触控电极在所述第一有机层上的正投影至少部分重叠；所述辅助电极通过所述第二有机层中的过孔与第一触控电极或第二触控电极电连接。
在一些实施例中，所述保护垫层的靠近对应的导电层一侧的表面具有多个凹坑，所述导电层的远离对应的保护垫层一侧的表面具有多个凹坑。
在一些实施例中，所述保护垫层的材料包括无机材料。
在一些实施例中，所述保护垫层的厚度小于对应的触控功能层组的有机层的厚度。
另一方面，提供一种显示面板。所述显示面板包括显示基板，以及如上述任一实施例所述的触控结构，所述触控结构设置于所述显示基板的出光侧。
在一些实施例中，所述显示基板包括封装层，所述触控结构直接设置于所述封装层上。
又一方面，提供一种显示装置。所述显示装置包括如上述任一实施例所述的显示面板。
又一方面，提供一种触控结构的制备方法。所述触控结构包括至少一个触控功能层组，每个触控功能层组包括依次层叠设置的有机层和导电层。所述制备方法包括：
依次形成所述有机层和所述导电层。其中，在形成所述导电层之前，所述制备方法还包括：在所述有机层上形成保护垫层，所述保护垫层在所述有机层上的正投影，与所述导电层在所述有机层上的正投影至少部分重叠。
在一些实施例中，至少一个触控功能层组包括第一触控功能层组和第二触控功能层组，所述第一触控功能层组包括依次层叠设置的第一有机层和第一导电层，所述第二触控功能层组包括依次层叠设置的第二有机层和第二导电层。所述制备方法包括：
依次形成所述第一有机层、所述第一导电层、所述第二有机层和所述第二导电层。其中，在形成所述第一导电层之前，所述制备方法还包括：在所述第一有机层上形成第一保护垫层，所述第一保护垫层在所述第一有机层上的正投影，与所述第一导电层在所述第一有机层上的正投影至少部分重叠。
和/或，在形成所述第二导电层之前，所述制备方法还包括：在所述第二有机层远离所述第一有机层的一侧形成第二保护垫层，所述第二保护垫层在所述第一有机层上的正投影，与所述第二导电层在所述第一有机层上的正投影至少部分重叠。
在一些实施例中，在所述第一有机层上形成第一保护垫层，包括：
在所述第一有机层上形成第一保护薄膜。
在所述第一保护薄膜远离所述第一有机层的一侧形成所述第一导电层。
以所述第一导电层为掩膜，图案化所述第一保护薄膜，得到所述第一保护垫层。
或者，所述触控结构包括触控区，及位于所述触控区一侧的绑定区。在所述第一有机层上形成第一保护垫层，包括：
在所述第一有机层上形成第一保护薄膜。
去除所述第一保护薄膜的位于所述绑定区的部分，得到所述第一保护垫层。
在一些实施例中，在所述第二有机层远离所述第一有机层的一侧形成第二保护垫层，包括：
在所述第二有机层远离所述第一有机层的一侧形成第二保护薄膜。
在所述第二保护薄膜远离所述第一有机层的一侧形成所述第二导电层。
以所述第二导电层为掩膜，图案化所述第二保护薄膜，得到所述第二保护垫层。
或者，所述触控结构包括触控区，及位于所述触控区一侧的绑定区。在所述第二有机层远离所述第一有机层的一侧形成第二保护垫层，包括：
在所述第二有机层远离所述第一有机层的一侧形成第二保护薄膜。
去除所述第二保护薄膜的位于所述绑定区的部分，得到所述第二保护垫层。
附图说明
为了更清楚地说明本公开中的技术方案，下面将对本公开一些实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例的附图，对于本领域普通技术人员来讲，还可以根据这些附图获得其他的附图。此外，以下描述中的附图可以视作示意图，并非对本公开实施例所涉及的产品的实际尺寸、方法的实际流程、信号的实际时序等的限制。
图1为根据一些实施例的显示装置的结构图；
图2为根据一些实施例的显示面板的结构图；
图3为图2中的显示面板沿剖面线A-A＇的局部剖面图；
图4A为图2中的显示面板沿剖面线B-B＇的局部剖面图；
图4B为根据一些实施例的另一种显示面板沿剖面线B-B＇的局部剖面图；
图5为图4A中M处的局部放大图；
图6为图4A中的触控结构的多个第一保护垫层的俯视图；
图7为根据一些实施例的另一种显示面板沿剖面线B-B＇的局部剖面图；
图8为根据一些实施例的又一种显示面板沿剖面线B-B＇的局部剖面图；
图9为图8中的触控结构的多个第二保护垫层的俯视图；
图10～图14为根据一些实施例的多种显示面板沿剖面线B-B＇的局部剖面图；
图15为根据一些实施例的另一种显示面板的结构图；
图16为图15中的显示面板沿剖面线C-C＇的局部剖面图；
图17为根据一些实施例的又一种显示面板的结构图；
图18为图17中的显示面板沿剖面线D-D＇的局部剖面图；
图19为根据一些实施例的又一种显示面板的结构图；
图20为图19中的显示面板沿剖面线E-E＇的局部剖面图；
图21为根据一些实施例的又一种显示面板的结构图；
图22为图21中的显示面板沿剖面线F-F＇的局部剖面图；
图23为根据一些实施例的又一种显示面板的结构图；
图24为图23中的显示面板沿剖面线H-H＇的局部剖面图；
图25为根据一些实施例的显示面板中的隔离部的平面排布图；
图26为根据一些实施例的显示面板的触控结构中的导电层的结构图；
图27为根据一些实施例的显示面板的触控结构中的保护垫层的结构图；
图28为相关技术中的显示面板的触控结构中的导电层的结构图；
图29～图32为根据一些实施例的多种触控结构的制备方法的步骤图；
图33～图35为根据一些实施例的第一保护垫层的一种制备方法的各步骤图；
图36为图2中N处的局部放大图；
图37～图38为根据一些实施例的第一保护垫层的另一种制备方法的各步骤图；
图39～图41为根据一些实施例的第二保护垫层的一种制备方法的各步骤图；
图42～图43为根据一些实施例的第二保护垫层的另一种制备方法的各步骤图；
图44～图45为根据一些实施例的采用同一构图工艺制备第一保护垫层和第二保护垫层的各步骤图。
具体实施方式
下面将结合附图，对本公开一些实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开所提供的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。
除非上下文另有要求，否则，在整个说明书和权利要求书中，术语“包括(comprise)”及其他形式例如第三人称单数形式“包括(comprises)”和现在分词形式“包括(comprising)”被解释为开放、包含的意思，即为“包含，但不限于”。在说明书的描述中，术语“一个实施例(one embodiment)”、“一些实施例(some embodiments)”、“示例性实施例(exemplary embodiments)”、“示例(example)”、“特定示例(specific example)”或“一些示例(some examples)”等旨在表明与该实施例或示例相关的特定特征、结构、材料或特性包括在本公开的至少一个实施例或示例中。上述术语的示意性表示不一定是指同一实施例或示例。此外，所述的特定特征、结构、材料或特点可以以任何适当方式包括在任何一个或多个实施例或示例中。
以下，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本公开实施例的描述中，除非另有说明，“多个”的含义是两个或两个以上。
在描述一些实施例时，可能使用了“电连接”及其衍伸的表达。例如，描述一些实施例时可能使用了术语“电连接”以表明两个或两个以上部件彼此间有直接物理接触或电接触。
“A和/或B”，包括以下三种组合：仅A，仅B，及A和B的组合。
另外，“基于”的使用意味着开放和包容性，因为“基于”一个或多个所述条件或值的过程、步骤、计算或其他动作在实践中可以基于额外条件或超出所述的值。
如本文所使用的那样，“大致”包括所阐述的值以及处于特定值的可接受偏差范围内的平均值，其中所述可接受偏差范围如由本领域普通技术人员考虑到正在讨论的测量以及与特定量的测量相关的误差(即，测量系统的局限性)所确定。
本文参照作为理想化示例性附图的剖视图和/或平面图描述了示例性实施方式。在附图中，为了清楚，放大了层和区域的厚度。因此，可设想到由于例如制造技术和/或公差引起的相对于附图的形状的变动。因此，示例性实施方式不应解释为局限于本文示出的区域的形状，而是包括因例如制造而引起 的形状偏差。例如，示为矩形的蚀刻区域通常将具有弯曲的特征。因此，附图中所示的区域本质上是示意性的，且它们的形状并非旨在示出设备的区域的实际形状，并且并非旨在限制示例性实施方式的范围。
本公开的一些实施例提供了一种显示装置，如图1所示，显示装置1可以为电致发光显示装置，该电致发光显示装置可以为OLED显示装置，例如，有源矩阵有机发光二极管(Active Matrix Organic Light-Emitting Diode，简称AMOLED)显示装置。
上述显示装置1可以是显示不论运动(例如，视频)还是固定(例如，静止图像)的且不论文字还是的图像的任何装置。更明确地说，预期所述实施例可实施在多种电子装置中或与多种电子装置关联，所述多种电子装置例如(但不限于)移动电话、无线装置、个人数据助理(PDA)、手持式或便携式计算机、GPS接收器/导航器、相机、MP4视频播放器、摄像机、游戏控制台、手表、时钟、计算器、电视监视器、平板显示器、计算机监视器、汽车显示器(例如，里程表显示器等)、导航仪、座舱控制器和/或显示器、相机视图的显示器(例如，车辆中后视相机的显示器)、电子相片、电子广告牌或指示牌、投影仪、建筑结构、包装和美学结构(例如，对于一件珠宝的图像的显示器)等。
如图2和图3所示，显示装置1包括显示面板2，具有用于显示画面的显示区(Active Area，简称AA)AA。显示面板2包括显示基板3和触控结构4，触控结构4设置于显示基板3的出光侧E。
其中，如图3所示，显示基板3包括衬底10、以及设置于衬底10上的多个驱动电路和多个发光器件L。在此基础上，显示基板3包括多个亚像素，每个亚像素包括一个像素驱动电路和一个发光器件L，该像素驱动电路与该发光器件L电连接。
示例性地，衬底10可以为多层结构，例如，如图3所示，衬底10可包括依次层叠设置的第一聚酰亚胺层、缓冲层和第二聚酰亚胺层。又例如，衬底10可包括依次层叠设置的第一聚酰亚胺层、第一缓冲层、第二聚酰亚胺层和第二缓冲层。
如图3所示，显示基板3还包括依次层叠设置于衬底10上的有源层104、第一栅极绝缘层105、第一栅导电层106、第二栅极绝缘层107、第二栅导电层108、层间介质层109和源漏导电层110。
其中，第一栅极绝缘层105使有源层104与第一栅导电层106之间绝缘，第二栅极绝缘层107使第一栅导电层106与第二栅导电层108之间绝缘，层 间介质层109使第二栅导电层108与源漏导电层110之间绝缘。
如图3所示，每个像素驱动电路包括多个薄膜晶体管TFT和至少一个电容器C1，图3示出了其中一个薄膜晶体管TFT和一个电容器C1。
薄膜晶体管TFT可包括有源层104、第一栅极绝缘层105、设置于第一栅导电层106中的栅极106A、第二栅极绝缘层107、层间介质层109、设置于源漏导电层110中的源极110A和漏极110B。
示例性地，有源层104可设置于衬底10上，第一栅极绝缘层105覆盖衬底10及有源层104，栅极106A设置于第一栅极绝缘层105远离衬底10的一侧，第二栅极绝缘层107覆盖栅极106A和第一栅极绝缘层105，层间介质层109覆盖第二栅极绝缘层107，源极110A和漏极110B设置于层间介质层109远离衬底10的一侧，源极110A和漏极110B可分别通过贯穿层间介质层109、第二栅极绝缘层107和第一栅极绝缘层105三者的过孔与有源层104电连接。
可以理解的是，栅极106A设置于有源层104远离衬底10的一侧，即栅极106A位于有源层104的上方，该薄膜晶体管TFT为顶栅型薄膜晶体管。在另一些实施例中，栅极106A也可设置于有源层104靠近衬底10的一侧，即栅极106A位于有源层104的下方，该薄膜晶体管TFT为底栅型薄膜晶体管。
电容器C1可包括设置于第一栅导电层106中的第一极板106B，以及设置于第二栅导电层108中的第二极板108A，第一极板106B与栅极106A同层设置，第二极板108A设置于第二栅极绝缘层107与层间介质层109之间，并与第一极板106B相对设置。
如图3所示，显示基板3还包括依次层叠设置于源漏导电层110远离衬底10一侧的钝化层111和平坦层112，钝化层111和平坦层112覆盖源极110A和漏极110B，起到保护源极110A和漏极110B的作用。
此外，像素驱动电路所在的上述多个膜层还包括栅线、数据线、VDD线和VSS线等，每个像素驱动电路与栅线、数据线、VDD线电连接，用于向发光器件L输出驱动信号。其中，VDD线可以是在显示区AA沿第二方向Y延伸的多条，VSS线可以是在周边区围绕显示区AA设置，发光器件L与VSS线电连接。
其中，第二方向Y与显示基板3中阵列式布置的多个亚像素排列的列方向一致。
驱动电路所在的上述多个膜层还包括栅极驱动电路及与栅极驱动电路电连接的时钟信号线、STV线、VGH线和VGL线等。
如图3所示，显示基板3还包括设置于平坦层112远离衬底10一侧的第一电极113，第一电极113通过贯穿平坦层112和钝化层111的过孔与源极110A电连接。
如图3所示，显示基板3还包括设置于平坦层112远离衬底10一侧的像素界定层114，像素界定层114中具有多个开口，每个开口暴露第一电极113的至少部分，每个开口位于一个亚像素内。
如图3所示，发光器件L包括第一电极113、发光功能层EL和第二电极116。
其中，发光功能层EL位于像素界定层114的开口内并形成在第一电极113上，该发光功能层EL可包括小分子有机材料或聚合物分子有机材料，可以为荧光发光材料或磷光发光材料，可以发红光、绿光、蓝光，或白光等。并且，根据实际不同需要，在不同的示例中，发光功能层EL还可以进一步包括电子传输层(Election Transporting Layer，简称ETL)、电子注入层(Election Injection Layer，简称EIL)、空穴传输层(Hole Transporting Layer，简称HTL)以及空穴注入层(Hole Injection Layer，简称HIL)中的一层或多层。
第二电极116覆盖发光功能层EL。需要说明的是，各个亚像素中的发光器件L的第二电极116相互连接形成整层覆盖的面状电极，作为各个发光器件L的公共电极。
示例性地，第一电极113可为阳极，第二电极116可为阴极。
发光器件L的第一电极113与像素驱动电路电连接，以接收来自像素驱动电路的驱动信号，第二电极116的边缘延伸至周边区与VSS线电连接，以接收来自VSS线的VSS信号，使第一电极113与第二电极116之间形成电场，以激发发光功能层EL发光。
如图3所示，显示基板3还包括设置于像素界定层114远离衬底10一侧的支撑部115，该支撑部115可起到支撑保护位于其下方的膜层的作用。
如图3所示，显示基板3还包括设置于第二电极116远离衬底10一侧的封装层117，封装层117可包括依次层叠设置的第一无机封装子层1171、有机封装子层1172和第二无机封装子层1173。封装层117用于显示基板3的封装，防止水、氧进入而侵蚀发光器件L。
如图3所示，将触控结构4直接设置在显示基板3的封装层117上的技术包括FSLOC(Flexible Single-Layer On Cell)技术和FMLOC(Flexible Multi-Layer On Cell)技术。
其中，FSLOC技术可基于自容(或电压)检测的工作原理，一般采用单 层金属形成触控电极。在手指触摸显示装置的情况下，手指会带走触控单元上的电荷，触控IC通过检测触控电极的自容值(或电压值)的变化，来识别手指的触摸位置，从而实现显示装置的触控功能。
FMLOC技术可基于互容检测的工作原理，触控结构4一般采用两层金属形成触控驱动电极(TX)和触控感应电极(RX)。在手指触摸显示装置的情况下，手指会带走触控驱动电极或触控感应电极上的电荷，触控IC通过检测触控驱动电极与触控感应电极间的互容值变化，来识别手指的触摸位置，从而实现显示装置的触控功能。
本公开的一些实施例提供了一种触控结构4，如图4A和图4B所示，从触控结构4的膜层结构来看，触控结构4包括至少一个触控功能层组40，至少一个触控功能层组40包括依次层叠设置的有机层43和导电层44。
示例性地，如图4A所示，触控结构4包括两个触控功能层组40，每个触控功能层组40包括依次层叠设置的有机层43和导电层44，即触控结构4包括两个导电层44，在此情况下，具有该触控结构4的显示面板2采用FMLOC技术。
示例性地，如图4B所示，触控结构4包括一个触控功能层组40，该触控功能层组40包括依次层叠设置的有机层43和导电层44，即触控结构4包括一个导电层44，在此情况下，具有该触控结构4的显示面板2采用FSLOC技术。
如图4A和图4B所示，触控结构4还包括至少一个保护垫层205，至少一个保护垫层205与至少一个触控功能层组40一一对应设置，保护垫层205位于对应的触控功能层组40的导电层44和有机层43之间。保护垫层205在有机层43上的正投影，与导电层44在有机层43上的正投影至少部分重叠。
在相关技术中，触控结构的触控功能层组多采用依次层叠设置的无机层和导电层。经本公开的发明人研究发现，对于一些显示屏尺寸较大的显示面板，显示基板中的靠近触控结构的电极(例如，图3中示出的第二电极116)所传输的电压信号，会对触控结构中的导电层所传输的电压信号产生干扰，进而影响触控结构的触控性能。并且，由于无机层为无机材料层，其弯折性能较差，使得显示基板与触控结构形成的显示面板的弯折性能较差，不利于制备曲面屏的显示面板。
相较于相关技术，本公开的上述实施例，触控结构4包括至少一个触控功能层组40，每个触控功能层组40包括依次层叠设置的有机层43和导电层44。因为有机材料的电阻率比无机材料的电阻率大，采用有机层43替换无机 层，可以减小显示基板3中的靠近触控结构4的电极所传输的电压信号，对触控结构4的触控功能层组40中的导电层44所传输的电压信号的干扰，从而可提高触控结构4的触控性能。
并且，有机层43为有机材料层，有机材料层的弯折性能比无机材料层的弯折性能好，可提高显示基板3与触控结构4形成的显示面板2的弯折性能，从而有利于制备曲面屏的显示面板2。
此外，在制备导电层44的过程中，采用干法刻蚀工艺对导电层44进行图案化。干法刻蚀工艺所采用的刻蚀气体包括氯气，氯离子易吸附在有机层43上遇水产生酸，酸会对导电层44产生腐蚀作用(参考图28，导电层44为金属网格结构，金属网格的网格线的位于圆圈内的部分被腐蚀)。因此，通过在触控功能层组40的导电层44与有机层43之间设置保护垫层205，保护垫层205在有机层43上的正投影，与导电层44在有机层43上的正投影至少部分重叠，可以减小导电层44与其下方的有机层43的接触面积，从而在刻蚀导电层44的过程中，可改善导电层44被位于有机层43上的酸腐蚀的现象(参考图26，导电层44为金属网格结构，金属网格的网格线未产生明显的腐蚀现象)。
本公开的以下实施例，以显示面板2采用FMLOC技术为例进行具体说明。
在一些实施例中，如图2和图3所示，触控结构4包括触控区(Touch Area)TA，沿显示基板3的厚度方向Z，触控区TA与显示区AA大致重合。
触控结构4包括设置于触控区TA的多个触控单元T，多个触控单元T包括多个第一触控单元T1和多个第二触控单元T2，每个第一触控单元T1沿第一方向X延伸，多个第一触控单元T1沿第二方向Y并列设置。每个第二触控单元T2沿第二方向Y延伸，多个第二触控单元T2沿第一方向X并列设置。多个第一触控单元T1与多个第二触控单元T2相互绝缘。
第一触控单元T1包括多个第一触控电极(触控感应电极)T11，及多个第一连接部T12，相邻两个第一触控电极T11之间通过第一连接部T12电连接。第二触控单元T2包括多个第二触控电极(触控驱动电极)T21，及多个第二连接部T22，相邻两个第二触控电极T21通过第二连接部T22电连接。触控IC通过检测第一触控电极T11与第二触控电极T21间的互容值变化，来识别手指的触控动作，从而实现显示装置的触控功能。
其中，第一方向X与显示基板3中阵列式布置的多个亚像素排列的行方向一致。
如图4A所示，触控结构4的触控功能层组40包括第一触控功能层组41和第二触控功能层组42，其中，第一触控功能层组41包括依次层叠设置的第一有机层201和第一导电层202。第二触控功能层组42设置于第一导电层202远离第一有机层201的一侧，第二触控功能层组42包括依次层叠设置的第二有机层203和第二导电层204。
触控结构4还包括至少一个保护垫层205，保护垫层205与第一导电层202和/或第二导电层204对应设置，使保护垫层205位于对应的触控功能层组40的导电层44与有机层43之间。
需要说明的是，保护垫层205与触控功能层组40一一对应设置，保护垫层205与该触控功能层组40的导电层44和有机层43也是对应设置的。
例如，保护垫层205与第一触控功能层组41对应设置，保护垫层205与第一触控功能层组41的第一导电层202和第一有机层201也是对应设置的。
又例如，保护垫层205与第二触控功能层组42对应设置，保护垫层205与第二触控功能层组42的第二导电层204和第二有机层203也是对应设置的。
示例性地，如图4A所示，至少一个保护垫层205包括第一保护垫层2051，第一保护垫层2051与第一触控功能层组41的第一导电层202对应设置，第一保护垫层2051位于第一导电层202和第一有机层201之间。
示例性地，如图8所示，至少一个保护垫层205包括第二保护垫层2052，第二保护垫层2052与第二导电层204对应设置，第二保护垫层2052位于第二导电层204和第二有机层203之间。
示例性地，如图11所示，触控结构4包括第一保护垫层2051和第二保护垫层2052，第一保护垫层2051与第一导电层202对应设置，第一保护垫层2051位于第一导电层202和第一有机层201之间。第二保护垫层2052与第二导电层204对应设置，第二保护垫层2052位于第二导电层204和第二有机层203之间。
如图4A所示，保护垫层205在第一有机层201上的正投影，与对应的导电层44在第一有机层201上的正投影至少部分重叠。
示例性地，如图4A所示，第一保护垫层2051在第一有机层201上的正投影，与第一导电层202在第一有机层201上的正投影至少部分重叠。
在相关技术中，触控结构多采用依次层叠设置的第一无机层、第一导电层、第二无机层和第二导电层。经本公开的发明人研究发现，对于一些显示屏尺寸较大的显示面板，显示基板中的靠近触控结构的电极(例如，图3中示出的第二电极116)所传输的电压信号，会对触控结构中的第一导电层和第 二导电层所传输的电压信号产生干扰，进而影响触控结构的触控性能。并且，由于第一无机层和第二无机层均为无机材料层，其弯折性能较差，使得显示基板与触控结构形成的显示面板的弯折性能较差，不利于制备曲面屏的显示面板。
相较于相关技术，本公开的上述实施例，触控结构4包括依次层叠设置的第一触控功能层组41和第二触控功能层组42，即触控结构4包括依次层叠设置的第一有机层201、第一导电层202、第二有机层203和第二导电层204。因为有机材料的电阻率比无机材料的电阻率大，采用第一有机层201替换第一无机层，第二有机层203替换第二无机层，可以减小显示基板3中的靠近触控结构4的电极所传输的电压信号，对触控结构4中的第一导电层202和第二导电层204所传输的电压信号的干扰，从而可提高触控结构4的触控性能。
并且，第一有机层201和第二有机层203均为有机材料层，有机材料层的弯折性能比无机材料层的弯折性能好，可提高显示基板3与触控结构4形成的显示面板2的弯折性能，从而有利于制备曲面屏的显示面板2。
此外，在制备导电层44(第一导电层202和第二导电层204)的过程中，采用干法刻蚀工艺对导电层44进行图案化。干法刻蚀工艺所采用的刻蚀气体包括氯气，氯离子易吸附在有机层43上遇水产生酸，酸会对导电层44产生腐蚀作用(参考图28，导电层44为金属网格结构，金属网格的网格线的位于圆圈内的部分被腐蚀)。因此，通过在触控功能层组40的导电层44与有机层43之间设置保护垫层205，保护垫层205在第一有机层201上的正投影，与对应的导电层44在第一有机层201上的正投影至少部分重叠，可以减小导电层44与其下方的有机层43的接触面积，从而在刻蚀导电层44的过程中，可改善导电层44被位于有机层43上的酸腐蚀的现象(参考图26，导电层44为金属网格结构，金属网格的网格线未产生明显的腐蚀现象)。
在一些实施例中，第一有机层201和第二有机层203的材料包括聚甲基丙烯酸甲酯、有机硅化合物、聚酰亚胺或环氧树脂中的至少一种。
在一些实施例中，第一有机层201的厚度范围为1μm～4μm，例如，厚度为1μm、2μm、2.5μm、3μm或4μm。
在一些实施例中，第二有机层203的厚度范围为1μm～4μm，例如，厚度为1μm、2μm、2.5μm、3μm或4μm。
在一些实施例中，保护垫层205的材料包括无机材料，例如，无机材料可包括氮化硅。
可以理解的是，无机材料不易吸附氯离子，在对导电层进行刻蚀的过程中，吸附在无机材料层上的氯离子很少，遇水产生的酸的浓度很低。因此，采用无机材料形成保护垫层205，可以减弱导电层的腐蚀现象。
在一些实施例中，保护垫层205的厚度小于对应的触控功能层组40的有机层43的厚度，通过将保护垫层205设置的较薄，有利于简化保护垫层205的成膜工艺以及图案化工艺。
并且，根据前文所述，无机材料层的弯折性能较差，通过将保护垫层205设置的较薄，可提高显示基板3与触控结构4形成的显示面板2的弯折性能。
示例性地，如图4A所示，第一保护垫层2051的厚度小于第一有机层201的厚度。
示例性地，如图8所示，第二保护垫层2052的厚度小于第二有机层203的厚度。
在一些实施例中，保护垫层205的厚度范围为0.05μm～0.1μm，例如，厚度为0.05μm、0.06μm、0.08μm、0.09μm或0.1μm。
在一些实施例中，如图20所示，第一导电层202和第二导电层204为金属网格结构。金属网格结构的触控电极的电阻小、灵敏度较高，能够提高触控结构4的触控灵敏度。且金属网格结构的触控电极的机械强度高，可减小触控结构4的重量。
在一些实施例中，第一导电层202和第二导电层204可以是单层结构。在另一些实施例中，第一导电层202和第二导电层204也可以是叠层结构，例如，第一导电层202和第二导电层204可以是依次层叠设置的钛、铝和钛金属层。
在一些实施例中，如图4A所示，保护垫层205在第一有机层201上的正投影，至少覆盖对应的导电层44在第一有机层201上的正投影。
通过上述设置方式，保护垫层205可以阻隔导电层44与其下方的有机层43，从而在刻蚀导电层44的过程中，可避免导电层44被位于有机层43上的酸腐蚀的现象。
在一些实施例中，如图4A和图8所示，保护垫层205在第一有机层201上的正投影，与对应的导电层44在第一有机层201上的正投影大致重合。
可以理解的是，保护垫层205在第一有机层201上的正投影，与对应的导电层44在第一有机层201上的正投影大致重合，使保护垫层205的轮廓与对应的导电层44的轮廓大致相同，保护垫层205刚好可以阻隔对应的导电层44和位于该导电层44下方的有机层43，从而在刻蚀导电层44的过程中，可 避免导电层44被位于有机层43上的酸腐蚀的问题。
并且，在第一导电层202和第二导电层204为金属网格结构的情况下，保护垫层205的轮廓与对应的导电层44的轮廓大致相同，如图27所示，保护垫层205的形状也为网格状。
示例性地，如图4A所示，第一保护垫层2051在第一有机层201上的正投影，与第一导电层202在第一有机层201上的正投影大致重合。在此情况下，图6示出了第一保护垫层2051在触控区TA排布的情形。
示例性地，如图8所示，第二保护垫层2052在第一有机层201上的正投影，与第二导电层204在第一有机层201上的正投影大致重合。在此情况下，图9示出了第二保护垫层2052在触控区TA排布的情形。
在一些实施例中，如图7和图10所示，保护垫层205在第一有机层201上的正投影为封闭图形，与保护垫层205对应的导电层44在第一有机层201上的正投影位于封闭图形的范围内。
需要说明的是，“封闭图形”是指在所在维度中处于封闭状态的图形，由N(N为正整数)条线段或弧组成的闭合图形。因此，保护垫层205在第一有机层201上的正投影为封闭图形，说明保护垫层205为整面的膜层，保护垫层205的内部没有镂空。
本公开的上述实施例，保护垫层205在第一有机层201上的正投影为封闭图形，与保护垫层205对应的导电层44在第一有机层201上的正投影位于封闭图形的范围内，使保护垫层205可以更好地阻隔对应的导电层44和位于该导电层44下方的有机层43，从而在刻蚀导电层44的过程中，可避免导电层44与有机层43接触而被酸腐蚀的问题。
示例性地，保护垫层205在第一有机层201上的正投影与，与保护垫层205对应的有机层43在第一有机层201上的正投影大致重合，使保护垫层205覆盖位于该导电层44下方的有机层43，从而在刻蚀导电层44的过程中，可避免导电层44与有机层43接触而被酸腐蚀的问题。
在一些实施例中，如图2所示，触控结构4包括位于触控区TA一侧的绑定区BD，保护垫层205在第一有机层201上的正投影与绑定区BD相互错开。
可以理解的是，显示面板2位于绑定区BD设置有多个引脚5，通过多个引脚5与柔性线路板(Flexible Printed Circuit，简称FPC)绑定，以接收来自柔性线路板的电压信号。通过使保护垫层205在第一有机层201上的正投影与绑定区BD相互错开，使保护垫层205可以暴露多个引脚5，以便于多个引脚5与柔性线路板进行绑定。
在一些实施例中，如图4A所示，第一导电层202对应设置有第一保护垫层2051，第二导电层204的下方不设置保护垫层205。第一保护垫层2051在第一有机层201上的正投影，与第一导电层202在第一有机层201上的正投影大致重合。
在一些实施例中，如图7所示，第一导电层202对应设置有第一保护垫层2051，第二导电层204的下方不设置保护垫层205。第一保护垫层2051在第一有机层201上的正投影为封闭图形，第一导电层202在第一有机层201上的正投影位于封闭图形的范围内，且与绑定区BD相互错开。
在一些实施例中，如图8所示，第一导电层202的下方不设置保护垫层205，第二导电层204对应设置有第二保护垫层2052。第二保护垫层2052在第一有机层201上的正投影，与第二导电层204在第一有机层201上的正投影大致重合。
在一些实施例中，如图10所示，第一导电层202的下方不设置保护垫层205，第二导电层204对应设置有第二保护垫层2052。第二保护垫层2052在第一有机层201上的正投影为封闭图形，第二导电层204在第一有机层201上的正投影位于封闭图形的范围内，且与绑定区BD相互错开。
在一些实施例中，如图11所示，第一导电层202对应设置有第一保护垫层2051，第二导电层204对应设置有第二保护垫层2052。第一保护垫层2051在第一有机层201上的正投影，与第一导电层202在第一有机层201上的正投影大致重合。第二保护垫层2052在第一有机层201上的正投影，与第二导电层204在第一有机层201上的正投影大致重合。
在一些实施例中，如图12所示，第一导电层202对应设置有第一保护垫层2051，第二导电层204对应设置有第二保护垫层2052。第一保护垫层2051在第一有机层201上的正投影，与第一导电层202在第一有机层201上的正投影大致重合。第二保护垫层2052在第一有机层201上的正投影为封闭图形，第二导电层204在第一有机层201上的正投影位于封闭图形的范围内，且与绑定区BD相互错开。
在一些实施例中，如图13所示，第一导电层202对应设置有第一保护垫层2051，第二导电层204对应设置有第二保护垫层2052。第一保护垫层2051在第一有机层201上的正投影为封闭图形，第一导电层202在第一有机层201上的正投影位于封闭图形的范围内，且与绑定区BD相互错开。第二保护垫层2052在第一有机层201上的正投影，与第二导电层204在第一有机层201上的正投影大致重合。
在一些实施例中，如图14所示，第一导电层202对应设置有第一保护垫层2051，第二导电层204对应设置有第二保护垫层2052。第一保护垫层2051在第一有机层201上的正投影为封闭图形，第一导电层202在第一有机层201上的正投影位于封闭图形的范围内，且与绑定区BD相互错开。第二保护垫层2052在第一有机层201上的正投影为封闭图形，第二导电层204在第一有机层201上的正投影位于封闭图形的范围内，且与绑定区BD相互错开。
根据前文所述，在制备导电层44的过程中，采用干法刻蚀工艺对导电层44进行图案化，干法刻蚀工艺所采用的刻蚀气体包括氯气。因此，导电层44的厚度越小，则刻蚀的时间越短，吸附在有机层43上的氯离子越少，遇水产生的酸的浓度越低。与之相反的，导电层44的厚度越大，则刻蚀的时间越长，吸附在有机层43上的氯离子越多，遇水产生的酸的浓度越高。
基于此，在一些实施例中，如图4A和图8所示，第一导电层202和第二导电层204中，相对于未对应设置保护垫层205的导电层44，对应设置有保护垫层205的导电层44可以设置的较厚。
示例性地，对应设置有保护垫层205的导电层44的厚度大于或等于0.3μm，例如，厚度可以为0.3μm、0.5μm、0.6μm、0.8μm或1.0μm。
可以理解的是，由于导电层44与有机层43之间设置有保护垫层205，导电层44可设置的较厚，在刻蚀导电层44的过程中，即使有机层43上遇水产生浓度越高的酸，也不会对导电层44造成腐蚀作用。
并且，将导电层44设置的较厚，可降低导电层44的电阻，从而可减小导电层44传输电压信号时产生的压降，有利于提高触控结构4的触控性能。
示例性地，如图4A所示，第一导电层202对应设置有第一保护垫层2051，第一导电层202可以设置的较厚。
示例性地，如图8所示，第二导电层204对应设置有第二保护垫层2052，第二导电层204可以设置的较厚。
在一些实施例中，如图4A和图8所示，第一导电层202和第二导电层204中的一者对应设置有保护垫层205，对应设置有保护垫层205的导电层44的厚度，大于另一导电层44的厚度。
可以理解的是，第一导电层202和第二导电层204中的一者对应设置有保护垫层205，另一者未对应设置有保护垫层205。根据前文所述，相对于未对应设置保护垫层205的导电层44，对应设置有保护垫层205的导电层44可以设置的较厚，反过来讲，相对于对应设置有保护垫层205的导电层44，未对应设置保护垫层205的导电层44可以设置的较薄，使得对应设置有保护垫 层205的导电层44的厚度，大于未对应设置保护垫层205的导电层44的厚度。
本公开的上述实施例，由于导电层44设置的较薄，可以缩短刻蚀导电层44的时间，以减少吸附在有机层43上的氯离子，减小有机层43上的氯离子遇水产生的酸的浓度。在此情况下，导电层44与其下方的有机层43之间可以不设置保护垫层205，即导电层44可以与有机层43直接接触，导电层44产生的腐蚀现象较轻微。
示例性地，如图4A所示，第一导电层202对应设置有保护垫层205，第二导电层204未对应设置保护垫层205，第一导电层202的厚度大于第二导电层204的厚度。
示例性地，如图8所示，第一导电层202未对应设置有保护垫层205，第二导电层204对应设置保护垫层205，第二导电层204的厚度大于第一导电层202的厚度。
在一些实施例中，如图4A和图8所示，第一导电层202和第二导电层204中的一者对应设置有保护垫层205，另一者的下方未对应设置保护垫层205。相对于对应设置有保护垫层205的导电层44，未对应设置保护垫层205的导电层44设置的较薄。
示例性地，未设置保护垫层205的导电层44的厚度小于0.3μm，例如，厚度可以为0.1μm、0.15μm、0.2μm、0.26μm或0.28μm。
在一些实施例中，如图5所示，保护垫层205的靠近对应的导电层44一侧的表面具有多个凹坑S，导电层44的远离对应的保护垫层205一侧的表面具有多个凹坑S。
需要说明的是，在制备保护垫层205的过程中，采用化学气相沉积(Chemical Vapor Deposition，简称CVD)工艺，即采用高速运动的离子轰击靶材，使靶材沉积后形成保护垫层205，保护垫层205的远离第一有机层201一侧的表面会被高速运动的离子轰击，形成多个凹坑S。因此，在保护垫层205上制备导电层44，导电层44受重力作用与保护垫层205的表面贴合，使得导电层44的远离对应的保护垫层205一侧的表面具有多个凹坑S。
通过上述设置方式，使导电层44的远离对应的保护垫层205一侧的表面具有多个凹坑S，以提高导电层44的表面的粗糙度，从而可减弱导电层44对外界环境光的反射作用，以减小对显示面板2的显示画面的影响。
下面介绍多个触控单元T在第一导电层202和第二导电层204中的设置方式。
在一些实施例中，如图2、图4A、图15和图16所示，多个第一触控电极T11、多个第二触控电极T21和多个第一连接部T12设置于第一导电层202和第二导电层204中的一者，多个第二连接部T22设置于第一导电层202和第二导电层204中的另一者。
其中，相邻两个第一触控电极T11之间通过第一连接部T12直接电连接。第二连接部T22穿过第二有机层203中的过孔H与相邻两个第二触控电极T21电连接。
示例性地，如图2和图4A所示，多个第一触控电极T11、多个第二触控电极T21和多个第一连接部T12设置于第二导电层204，多个第二连接部T22设置于第一导电层202。
可以理解的是，第二导电层204相较第一导电层202更远离显示基板3，将多个第一触控电极T11和多个第二触控电极T21设置于第二导电层204，可以减小显示基板3中的靠近触控结构4的电极所传输的电压信号，对第一触控电极T11和第二触控电极T21所传输的电压信号的干扰。
并且，第二导电层204相较第一导电层202更靠近显示面板2的表面，将多个第一触控电极T11和多个第二触控电极T21设置于第二导电层204，在手指触摸显示面板2的表面时，有利于手指带走第一触控电极T11和第二触控电极T21上的电荷，从而有利于提高触控结构4的触控灵敏度。
示例性地，如图15和图16所示，多个第一触控电极T11、多个第二触控电极T21和多个第一连接部T12设置于第一导电层202，多个第二连接部T22设置于第二导电层204。
在一些实施例中，如图17～图20所示，多个第一触控电极T11、多个第二触控电极T21和多个第二连接部T22设置于第一导电层202和第二导电层204中的一者，多个第一连接部T12设置于第一导电层202和第二导电层204中的另一者。
其中，第一连接部T12穿过第二有机层203中的过孔H与相邻两个第一触控电极T11电连接。相邻两个第二触控电极T21之间通过第二连接部T22直接电连接。
示例性地，如图17和图18所示，多个第一触控电极T11、多个第二触控电极T21和多个第二连接部T22设置于第一导电层202，多个第一连接部T12设置于第二导电层204。
示例性地，如图19和图20所示，多个第一触控电极T11、多个第二触控电极T21和多个第二连接部T22设置于第二导电层204，多个第一连接部T12 设置于第一导电层202。
在一些实施例中，如图4A和图16所示，多个第一触控电极T11、多个第二触控电极T21和多个第一连接部T12设置于同一导电层44，多个第二连接部T22所在的导电层44对应设置有保护垫层205。
可以理解的是，相邻两个第一触控电极T11之间通过第一连接部T12直接电连接，第二连接部T22穿过第二有机层203中的过孔H与相邻两个第二触控电极T21电连接，即，第二连接部T22作为桥接电极，跨越第一连接部T12电连接相邻两个第二触控电极T21。
通过在第二连接部T22所在的导电层44的下方设置保护垫层205，根据前文所述，可增加第二连接部T22的厚度，以减小第二连接部T22的电阻，从而减小电压信号在第二连接部T22上传输的过程中产生的压降，有利于提高触控结构4的触控性能。
在一些实施例中，如图18和图20所示，多个第一触控电极T11、多个第二触控电极T21和多个第二连接部T22设置于同一导电层44，多个第一连接部T12所在的导电层44对应设置有保护垫层205。
可以理解的是，第一连接部T12穿过第二有机层203中的过孔H与相邻两个第一触控电极T11电连接。相邻两个第二触控电极T21之间通过第二连接部T22直接电连接，即，第一连接部T12作为桥接电极，跨越第二连接部T22电连接相邻两个第一触控电极T11。
与前述实施例的原理相同，通过在第一连接部T12所在的导电层44的下方设置保护垫层205，可增加第一连接部T12的厚度，以减小第一连接部T12的电阻，从而减小电压信号在第一连接部T12上传输的过程中产生的压降，有利于提高触控结构4的触控性能。
在一些实施例中，如图21和图22所示，触控结构4还包括多个辅助电极F，多个第一触控电极T11和多个第二触控电极T21设置于第一导电层202和第二导电层204中的一者，多个辅助电极F设置于第一导电层202和第二导电层204中的另一者。其中，每个辅助电极F在第一有机层201上的正投影，与第一触控电极T11或第二触控电极T21在第一有机层201上的正投影至少部分重叠，即每个辅助电极F对应一个触控电极，辅助电极F通过第二有机层203中的过孔H与对应的触控电极(第一触控电极T11或第二触控电极T21)电连接。
通过上述设置方式，采用辅助电极F与第一触控电极T11或第二触控电极T21并联，可降低第一触控电极T11或第二触控电极T21的电阻，从而可 减小电压信号在第一触控电极T11或第二触控电极T21上传输的过程中产生的压降，有利于提高触控结构4的触控性能。
示例性地，如图22所示，多个第一触控电极T11和多个第二触控电极T21设置于第一导电层202，多个辅助电极F设置于第二导电层204。
示例性地，多个第一触控电极T11和多个第二触控电极T21设置于第二导电层204，多个辅助电极F设置于第一导电层202。
在一些实施例中，第一触控电极T11和第二触控电极T21设置于第一导电层202，第一连接部T12设置于第一导电层202和第二导电层204中的一者，第二连接部T22设置于第一导电层202和第二导电层204中的另一者。
示例性地，如图23和图24所示，第一连接部T12设置于第一导电层202，第二连接部T22设置于第二导电层204。
参考图23和图24，第一连接部T12在显示基板3上的正投影，与第二连接部T22在显示基板3上的正投影相交叠，交叠部分所确定的区域为交叠区B。
如图24和图25所示，第二有机层203包括多个隔离部2030，每个交叠区B设置有一个隔离部2030，隔离部2030在显示基板3上的正投影至少覆盖交叠区B，且位于第二导电层204的连接部在显示基板3上的正投影的两端，伸出隔离部2030在显示基板3上的正投影的边界C。
在相关技术中，由于第一有机层包括有机材料，其耐高温性能较差，需要采用低温工艺(例如，曝光显影工艺)在第一有机层上开孔，但是这种开孔的方式的解析力较小，存在无法贯通第一有机层的现象，导致第一导电层中的导电图案与第二导电层中的导电图案，无法通过第一有机层中的过孔电连接而导致开路。并且，采用低温工艺在第一有机层上开孔，不同孔的关键尺寸(Critical Dimension，简称CD)的均一性较差。
本公开的上述实施例中的显示面板2，对第二有机层203进行图案化，形成多个隔离部2030。每个交叠区B设置有一个隔离部2030，隔离部2030在显示基板3上的正投影至少覆盖交叠区B，通过隔离部2030阻隔第一连接部T12与第二连接部T22，以实现第一连接部T12与第二连接部T22在交叠区B的绝缘。
并且，位于第二导电层204的连接部在显示基板3上的正投影的两端，伸出隔离部2030在显示基板3上的正投影的边界C，以便于该连接部的两端与相邻两个触控电极表面相接且形成电接触，保证触控电极与连接部之间的稳定电连接。并且，避免了采用低温工艺在第二有机层203上开孔，由于孔无法贯通第二有机层203而导致触控电极与连接部之间开路的问题。
在一些实施例中，如图23和图24所示，第一连接部T12设置于第一导电层202，第二连接部T22设置于第二导电层204，第一连接部T12的两端与相邻两个第一触控电极T11直接电连接，第二连接部T22的两端与相邻两个第二触控电极T21表面相接且形成电接触。
可以理解的是，参考图23，每个第一连接部T12与相邻两个第一触控电极T11一体设置，可以减小第一连接部T12与第一触控电极T11的连接部位的电阻。
参考图24，第二连接部T22在显示基板3上的正投影的两端，伸出隔离部2030在显示基板3上的正投影的边界C，且与第二连接部T22相邻的两个第二触控电极T21分别搭在第二连接部T22的表面上，保证第二连接部T22与第二触控电极T21之间的稳定电连接。并且，避免了采用低温工艺在第二有机层203上开孔，由于孔无法贯通第二有机层203而导致第二触控电极T21与第二连接部T22之间开路的问题。
在一些实施例中，如图4A所示，触控结构4还包括第三有机层206，第三有机层206设置于第二导电层204远离第一有机层201的一侧，起到保护位于其下方的膜层(例如，第二导电层204、第二有机层203、第一导电层202和第一有机层201)的作用。
在一些实施例中，第三有机层206的材料可包括聚甲基丙烯酸甲酯、有机硅化合物、聚酰亚胺或环氧树脂中的至少一种。
本公开的一些实施例还提供了一种触控结构的制备方法，如图29所示，触控结构4包括至少一个触控功能层组40，每个触控功能层组40包括依次层叠设置的有机层43和导电层44。
制备方法包括依次形成有机层43和导电层44。其中，在形成导电层44之前，制备方法还包括：在有机层43上形成保护垫层205，保护垫层205在有机层43上的正投影，与导电层44在有机层43上的正投影至少部分重叠。
相较于相关技术，本公开的上述制备方法，采用有机层43替换无机层，因为有机材料的电阻率比无机材料的电阻率大，可以减小显示基板3中的靠近触控结构4的电极所传输的电压信号，对触控结构4中的导电层44所传输的电压信号的干扰，从而可提高触控结构4的触控性能。
并且，有机层43为有机材料层，有机材料层的弯折性能比无机材料层的弯折性能好，可提高显示基板3与触控结构4形成的显示面板2的弯折性能，从而有利于制备曲面屏的显示面板2。
此外，在制备导电层44的过程中，采用干法刻蚀工艺对导电层44进行 图案化。干法刻蚀工艺所采用的刻蚀气体包括氯气，氯离子易吸附在有机层43上遇水产生酸，酸会对导电层44产生腐蚀作用。因此，通过在导电层44与有机层43之间设置保护垫层205，保护垫层205在有机层43上的正投影，与导电层44在有机层43上的正投影至少部分重叠，可以减小导电层44与有机层43的接触面积，从而在刻蚀导电层44的过程中，可改善导电层44被位于有机层43上的酸腐蚀的现象。
在一些实施例中，如图30所示，至少一个触控功能层组40包括第一触控功能层组41和第二触控功能层组42，第一触控功能层组41包括依次层叠设置的第一有机层201和第一导电层202，第二触控功能层组42包括依次层叠设置的第二有机层203和第二导电层204。
制备方法包括依次形成第一有机层201、第一导电层202、第二有机层203和第二导电层204。
其中，在形成第一导电层202之前，制备方法还包括：在第一有机层201上形成第一保护垫层2051，第一保护垫层2051在第一有机层201上的正投影，与第一导电层202在第一有机层201上的正投影至少部分重叠。
相较于相关技术，本公开的上述制备方法，采用第一有机层201替换第一无机层，第二无机层203替换第二无机层，因为有机材料的电阻率比无机材料的电阻率大，可以减小显示基板3中的靠近触控结构4的电极所传输的电压信号，对触控结构4中的第一导电层202和第二导电层204所传输的电压信号的干扰，从而可提高触控结构4的触控性能。
并且，第一有机层201和第二有机层203均为有机材料层，有机材料层的弯折性能比无机材料层的弯折性能好，可提高显示基板3与触控结构4形成的显示面板2的弯折性能，从而有利于制备曲面屏的显示面板2。
此外，在制备第一导电层202的过程中，采用干法刻蚀工艺对第一导电层202进行图案化。干法刻蚀工艺所采用的刻蚀气体包括氯气，氯离子易吸附在第一有机层201上遇水产生酸，酸会对导电层44产生腐蚀作用。因此，通过在第一导电层202与第一有机层201之间设置第一保护垫层2051，第一保护垫层2051在第一有机层201上的正投影，与第一导电层202在第一有机层201上的正投影至少部分重叠，可以减小第一导电层202与第一有机层201的接触面积，从而在刻蚀第一导电层202的过程中，可改善第一导电层202被位于第一有机层201上的酸腐蚀的现象。
在一些实施例中，如图31所示，制备方法包括依次形成第一有机层201、第一导电层202、第二有机层203和第二导电层204。
其中，在形成第二导电层204之前，制备方法还包括：在第二有机层203远离第一有机层201的一侧形成第二保护垫层2052，第二保护垫层2052在第一有机层201上的正投影，与第二导电层204在第一有机层201上的正投影至少部分重叠。
相较于相关技术，本公开的上述制备方法，采用第一有机层201替换第一无机层，第二无机层203替换第二无机层，因为有机材料的电阻率比无机材料的电阻率大，可以减小显示基板3中的靠近触控结构4的电极所传输的电压信号，对触控结构4中的第一导电层202和第二导电层204所传输的电压信号的干扰，从而可提高触控结构4的触控性能。
并且，第一有机层201和第二有机层203均为有机材料层，有机材料层的弯折性能比无机材料层的弯折性能好，可提高显示基板3与触控结构4形成的显示面板2的弯折性能，从而有利于制备曲面屏的显示面板2。
此外，在制备第二导电层204的过程中，采用干法刻蚀工艺对第二导电层204进行图案化。干法刻蚀工艺所采用的刻蚀气体包括氯气，氯离子易吸附在第二有机层203上遇水产生酸，酸会对导电层44产生腐蚀作用。因此，通过在第二导电层204与第二有机层203之间设置第二保护垫层2052，第二保护垫层2052在第一有机层201上的正投影，与第二导电层204在第一有机层201上的正投影至少部分重叠，可以减小第二导电层204与第二有机层203的接触面积，从而在刻蚀第二导电层204的过程中，可改善第二导电层204被位于第二有机层203上的酸腐蚀的现象。
在一些实施例中，如图32所示，制备方法包括依次形成第一有机层201、第一导电层202、第二有机层203和第二导电层204。
其中，在形成第一导电层202之前，制备方法还包括：在第一有机层201上形成第一保护垫层2051，第一保护垫层2051在第一有机层201上的正投影，与第一导电层202在第一有机层201上的正投影至少部分重叠。
并且，在形成第二导电层204之前，制备方法还包括：在第二有机层203远离第一有机层201的一侧形成第二保护垫层2052，第二保护垫层2052在第一有机层201上的正投影，与第二导电层204在第一有机层201上的正投影至少部分重叠。
在一些实施例中，在第一有机层201上形成第一保护垫层2051，包括如下S11～S13：
S11：如图33所示，在第一有机层201上形成第一保护薄膜L1。
S12：如图34所示，在第一保护薄膜L1远离第一有机层201的一侧形成 第一导电层202。
S13：如图35所示，以第一导电层202为掩膜，图案化第一保护薄膜L1，得到第一保护垫层2051。
在一些实施例中，如图2和图36所示，触控结构4包括触控区TA，及位于触控区TA一侧的绑定区BD，显示基板3包括位于绑定区BD的多个引脚5。在第一有机层201上形成第一保护垫层2051，包括如下S21～S22：
S21：如图37所示，在第一有机层201上形成第一保护薄膜L1。
S22：如图38所示，去除第一保护薄膜L1的位于绑定区BD的部分，得到第一保护垫层2051。
示例性地，在第一保护薄膜L1远离第一有机层201的一侧表面设置光刻胶层，采用掩膜版(Mask)，对光刻胶层的位于绑定区BD的部分进行曝光显影，去除光刻胶层位于绑定区BD的部分。以保留下来的光刻胶层作为掩膜，刻蚀第一保护薄膜L1位于绑定区BD的部分，得到第一保护垫层2051。
需要说明的是，结合图36可见，图37、图38、图42～图45中示出的触控结构4，均为图36中的显示面板2沿剖面线G-G＇的局部剖面图。
并且，如图37和图38所示，第一保护薄膜L1直接覆盖在显示基板3的位于绑定区BD的多个引脚5上，采用构图工艺，去除第一保护薄膜L1的位于绑定区BD的部分，以暴露显示面板2位于绑定区BD的多个引脚5，从而便于多个引脚5与柔性线路板进行绑定。
在一些实施例中，在第二有机层203远离第一有机层201的一侧形成第二保护垫层2052，包括如下S31～S33：
S31：如图39所示，在第二有机层203远离第一有机层201的一侧形成第二保护薄膜L2。
S32：如图40所示，在第二保护薄膜L2远离第一有机层201的一侧形成第二导电层204。
S13：如图41所示，以第二导电层204为掩膜，图案化第二保护薄膜L2，得到第二保护垫层2052。
在一些实施例中，在第一有机层201上形成第一保护垫层2051，包括如下S41～S42：
S41：如图42所示，在第二有机层203远离第一有机层201的一侧形成第二保护薄膜L2。
S42：如图43所示，去除第二保护薄膜L2的位于绑定区BD的部分，得到第二保护垫层2052。
示例性地，在第二保护薄膜L2远离第一有机层201的一侧表面设置光刻胶层，采用掩膜版，对光刻胶层的位于绑定区BD的部分进行曝光显影，去除光刻胶层位于绑定区BD的部分。以保留下来的光刻胶层作为掩膜，刻蚀第二保护薄膜L2位于绑定区BD的部分，得到第二保护垫层2052。
需要说明的是，如图42和图43所示，第二保护薄膜L2直接覆盖在显示基板3的位于绑定区BD的多个引脚5上，采用构图工艺，去除第二保护薄膜L2的位于绑定区BD的部分，以暴露显示面板2位于绑定区BD的多个引脚5，从而便于多个引脚5与柔性线路板进行绑定。
在另一些实施例中，如图44所示，在第一有机层201上依次形成第一保护薄膜L1、第二有机层203和第二保护薄膜L2。
如图45所示，采用同一构图工艺，分别去除第一保护薄膜L1和第二保护薄膜L2的位于绑定区BD的部分，得到第一保护垫层2051和第二保护垫层2052。
示例性地，在第二保护薄膜L2远离第一有机层201的一侧表面设置光刻胶层，采用掩膜版，对光刻胶层的位于绑定区BD的部分进行曝光显影，去除光刻胶层位于绑定区BD的部分。以保留下来的光刻胶层作为掩膜，刻蚀第一保护薄膜L1和第二保护薄膜L2位于绑定区BD的部分，得到第一保护垫层2051和第二保护垫层2052。
需要说明的是，如图44和图45所示，第一保护薄膜L1和第二保护薄膜L2直接覆盖在显示基板3的位于绑定区BD的多个引脚5上，在同一构图工艺下，去除第一保护薄膜L1和第二保护薄膜L2的位于绑定区BD的部分，以暴露显示面板2位于绑定区BD的多个引脚5，从而便于多个引脚5与柔性线路板进行绑定。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (21)

  1. 一种触控结构，包括：
    至少一个触控功能层组，所述至少一个触控功能层组包括依次层叠设置的有机层和导电层；
    至少一个保护垫层，与至少一个触控功能层组一一对应设置，所述保护垫层位于对应的触控功能层组的导电层和有机层之间；所述保护垫层在所述有机层上的正投影，与所述导电层在所述有机层上的正投影至少部分重叠。
  2. 根据权利要求1所述的触控结构，其中，至少一个触控功能层组包括：
    第一触控功能层组，包括依次层叠设置的第一有机层和第一导电层；
    第二触控功能层组，设置于所述第一导电层远离所述第一有机层的一侧，所述第二触控功能层组包括依次层叠设置的第二有机层和第二导电层；
    其中，至少一个保护垫层与所述第一导电层和/或所述第二导电层对应设置；所述保护垫层在所述第一有机层上的正投影，与对应的导电层在所述第一有机层上的正投影至少部分重叠。
  3. 根据权利要求2所述的触控结构，其中，所述保护垫层在所述第一有机层上的正投影，与对应的导电层在所述第一有机层上的正投影大致重合；或，
    所述保护垫层在所述第一有机层上的正投影为封闭图形，与所述保护垫层对应的导电层在所述第一有机层上的正投影位于所述封闭图形的范围内。
  4. 根据权利要求3所述的触控结构，其中，所述触控结构包括触控区，及位于所述触控区一侧的绑定区；
    所述保护垫层在所述第一有机层上的正投影与所述绑定区相互错开。
  5. 根据权利要求2～4中任一项所述的触控结构，其中，所述至少一个保护垫层包括第一保护垫层和/或第二保护垫层；
    所述第一保护垫层与所述第一导电层对应设置，位于所述第一导电层与所述第一有机层之间；
    所述第二保护垫层与所述第二导电层对应设置，位于所述第二导电层与所述第二有机层之间。
  6. 根据权利要求2～5中任一项所述的触控结构，其中，所述第一导电层和所述第二导电层中，对应设置有保护垫层的导电层的厚度大于或等于0.3μm。
  7. 根据权利要求6所述的触控结构，其中，所述第一导电层和所述第二导电层中的一者对应设置有保护垫层，对应设置有保护垫层的导电层的厚度，大于另一导电层的厚度。
  8. 根据权利要求7所述的触控结构，其中，所述第一导电层和所述第二导电层中的未对应设置有保护垫层的一者的厚度小于0.3μm。
  9. 根据权利要求2～8中任一项所述的触控结构，包括触控区；
    所述触控结构包括：
    多个触控单元，设置于所述触控区，包括多个第一触控单元和多个第二触控单元；每个第一触控单元沿第一方向延伸，所述多个第一触控单元沿第二方向并列设置；每个第二触控单元沿第二方向延伸，所述多个第二触控单元沿第一方向并列设置；
    所述第一触控单元包括多个第一触控电极，及多个第一连接部，相邻两个第一触控电极之间通过第一连接部电连接；
    所述第二触控单元包括多个第二触控电极，及多个第二连接部，相邻两个第二触控电极通过第二连接部电连接；
    其中，所述多个第一触控电极、所述多个第二触控电极和所述多个第一连接部设置于所述第一导电层和所述第二导电层中的一者，所述多个第二连接部设置于所述第一导电层和所述第二导电层中的另一者；或，
    所述多个第一触控电极、所述多个第二触控电极和所述多个第二连接部设置于所述第一导电层和所述第二导电层中的一者，所述多个第一连接部设置于所述第一导电层和所述第二导电层中的另一者。
  10. 根据权利要求9所述的触控结构，其中，所述多个第一触控电极、所述多个第二触控电极和所述多个第一连接部设置于同一导电层，所述多个第二连接部所在的导电层对应设置有保护垫层；或，
    所述多个第一触控电极、所述多个第二触控电极和所述多个第二连接部设置于同一导电层，所述多个第一连接部所在的导电层对应设置有保护垫层。
  11. 根据权利要求9或10所述的触控结构，还包括：
    多个辅助电极；所述多个第一触控电极和所述多个第二触控电极设置于所述第一导电层和所述第二导电层中的一者，所述多个辅助电极设置于所述第一导电层和所述第二导电层中的另一者；
    每个辅助电极在所述第一有机层上的正投影，与第一触控电极或第二触控电极在所述第一有机层上的正投影至少部分重叠；所述辅助电极通过所述第二有机层中的过孔与第一触控电极或第二触控电极电连接。
  12. 根据权利要求1～11中任一项所述的触控结构，其中，所述保护垫层的靠近对应的导电层一侧的表面具有多个凹坑，所述导电层的远离对应的保护垫层一侧的表面具有多个凹坑。
  13. 根据权利要求1～12中任一项所述的触控结构，其中，所述保护垫层的材料包括无机材料。
  14. 根据权利要求1～13中任一项所述的触控结构，其中，所述保护垫层的厚度小于对应的触控功能层组的有机层的厚度。
  15. 一种显示面板，包括：
    显示基板；
    如权利要求1～14中任一项所述的触控结构，所述触控结构设置于所述显示基板的出光侧。
  16. 根据权利要求15所述的显示面板，其中，所述显示基板包括封装层，所述触控结构直接设置于所述封装层上。
  17. 一种显示装置，包括如权利要求15或16所述的显示面板。
  18. 一种触控结构的制备方法，所述触控结构包括至少一个触控功能层组，每个触控功能层组包括依次层叠设置的有机层和导电层；
    所述制备方法包括：
    依次形成所述有机层和所述导电层；
    其中，在形成所述导电层之前，还包括：在所述有机层上形成保护垫层，所述保护垫层在所述有机层上的正投影，与所述导电层在所述有机层上的正投影至少部分重叠。
  19. 根据权利要求18所述的制备方法，其中，至少一个触控功能层组包括第一触控功能层组和第二触控功能层组，所述第一触控功能层组包括依次层叠设置的第一有机层和第一导电层；所述第二触控功能层组包括依次层叠设置的第二有机层和第二导电层；
    所述制备方法包括：
    依次形成所述第一有机层、所述第一导电层、所述第二有机层和所述第二导电层；
    其中，在形成所述第一导电层之前，还包括：在所述第一有机层上形成第一保护垫层，所述第一保护垫层在所述第一有机层上的正投影，与所述第一导电层在所述第一有机层上的正投影至少部分重叠；和/或，
    在形成所述第二导电层之前，还包括：在所述第二有机层远离所述第一有机层的一侧形成第二保护垫层，所述第二保护垫层在所述第一有机层上的正投影，与所述第二导电层在所述第一有机层上的正投影至少部分重叠。
  20. 根据权利要求19所述的制备方法，其中，在所述第一有机层上形成第一保护垫层，包括：
    在所述第一有机层上形成第一保护薄膜；
    在所述第一保护薄膜远离所述第一有机层的一侧形成所述第一导电层；
    以所述第一导电层为掩膜，图案化所述第一保护薄膜，得到所述第一保护垫层；或者，
    所述触控结构包括触控区，及位于所述触控区一侧的绑定区；在所述第一有机层上形成第一保护垫层，包括：
    在所述第一有机层上形成第一保护薄膜；
    去除所述第一保护薄膜的位于所述绑定区的部分，得到所述第一保护垫层。
  21. 根据权利要求19或20所述的制备方法，其中，在所述第二有机层远离所述第一有机层的一侧形成第二保护垫层，包括：
    在所述第二有机层远离所述第一有机层的一侧形成第二保护薄膜；
    在所述第二保护薄膜远离所述第一有机层的一侧形成所述第二导电层；
    以所述第二导电层为掩膜，图案化所述第二保护薄膜，得到所述第二保护垫层；或者，
    所述触控结构包括触控区，及位于所述触控区一侧的绑定区；在所述第二有机层远离所述第一有机层的一侧形成第二保护垫层，包括：
    在所述第二有机层远离所述第一有机层的一侧形成第二保护薄膜；
    去除所述第二保护薄膜的位于所述绑定区的部分，得到所述第二保护垫层。
PCT/CN2022/108197 2021-08-12 2022-07-27 触控结构及其制备方法、显示面板及显示装置 WO2023016257A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US18/548,339 US20240134475A1 (en) 2021-08-12 2022-07-26 Touch structure and manufacturing method thereof, display panel, and display device
EP22855240.2A EP4300272A1 (en) 2021-08-13 2022-07-27 Touch control structure and preparation method therefor, display panel, and display apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202110929096.XA CN115705105A (zh) 2021-08-13 2021-08-13 触控结构及其制备方法、显示面板及显示装置
CN202110929096.X 2021-08-13

Publications (1)

Publication Number Publication Date
WO2023016257A1 true WO2023016257A1 (zh) 2023-02-16

Family

ID=85181088

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/108197 WO2023016257A1 (zh) 2021-08-12 2022-07-27 触控结构及其制备方法、显示面板及显示装置

Country Status (4)

Country Link
US (1) US20240134475A1 (zh)
EP (1) EP4300272A1 (zh)
CN (1) CN115705105A (zh)
WO (1) WO2023016257A1 (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006351553A (ja) * 2006-09-04 2006-12-28 Tdk Corp 有機エレクトロルミネッセンス表示装置
CN104465695A (zh) * 2013-09-22 2015-03-25 昆山国显光电有限公司 带触控功能的amoled显示屏及其显示器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006351553A (ja) * 2006-09-04 2006-12-28 Tdk Corp 有機エレクトロルミネッセンス表示装置
CN104465695A (zh) * 2013-09-22 2015-03-25 昆山国显光电有限公司 带触控功能的amoled显示屏及其显示器

Also Published As

Publication number Publication date
EP4300272A1 (en) 2024-01-03
US20240134475A1 (en) 2024-04-25
CN115705105A (zh) 2023-02-17

Similar Documents

Publication Publication Date Title
US10741788B2 (en) Display device
US20220416206A1 (en) Display device
KR101574390B1 (ko) 유기 발광 다이오드, 터치 디스플레이 장치 및 그의 제조 방법
KR101992917B1 (ko) 표시 장치용 기판과, 그를 포함하는 유기 발광 표시 장치 및 그 제조 방법
KR20150066326A (ko) 터치패널을 구비한 유기전계 발광장치 및 그 제조방법
US11963382B2 (en) Display substrate and preparation method thereof, and display device
WO2021213050A1 (zh) 显示基板及其制备方法、显示装置
US20210134910A1 (en) Display panel, display apparatus, and method of fabricating the display panel
US20220406880A1 (en) Flexible display panel and manufacturing method therefor, and display device
WO2021093681A1 (zh) 显示背板及其制作方法和显示装置
US11868574B2 (en) Touch substrate, display panel and display device
TW201809818A (zh) 顯示裝置
WO2023016257A1 (zh) 触控结构及其制备方法、显示面板及显示装置
US11925074B2 (en) Display panel and electronic apparatus
US20220102462A1 (en) Display Substrate and Preparation Method Thereof, Bonding Method of Display Panel, and Display Apparatus
US20220399433A1 (en) Display Substrate and Display Apparatus
WO2021184372A1 (zh) 显示面板及显示装置
WO2021169568A1 (zh) 显示母板及其制备方法、显示基板和显示装置
KR102612736B1 (ko) 표시 장치용 기판과, 그를 포함하는 유기 발광 표시 장치 및 그 제조 방법
WO2023000188A1 (zh) 显示面板及显示装置
WO2022155806A1 (zh) 显示基板及其制备方法、显示装置
WO2022252230A1 (zh) 显示基板和显示装置
WO2023279255A1 (zh) 显示面板及显示装置
US11625132B2 (en) Touch pad and method for manufacturing the same, touch display device
WO2023030110A1 (zh) 显示基板、显示装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22855240

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 18548339

Country of ref document: US

WWE Wipo information: entry into national phase

Ref document number: 2022855240

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 2022855240

Country of ref document: EP

Effective date: 20230925

NENP Non-entry into the national phase

Ref country code: DE