WO2023276769A1 - Dispositif de balayage et dispositif d'inspection électrique - Google Patents

Dispositif de balayage et dispositif d'inspection électrique Download PDF

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Publication number
WO2023276769A1
WO2023276769A1 PCT/JP2022/024632 JP2022024632W WO2023276769A1 WO 2023276769 A1 WO2023276769 A1 WO 2023276769A1 JP 2022024632 W JP2022024632 W JP 2022024632W WO 2023276769 A1 WO2023276769 A1 WO 2023276769A1
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WO
WIPO (PCT)
Prior art keywords
independent
substrate
board
common
scanner device
Prior art date
Application number
PCT/JP2022/024632
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English (en)
Japanese (ja)
Inventor
雅也 椹木
Original Assignee
日本電産リード株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電産リード株式会社 filed Critical 日本電産リード株式会社
Priority to JP2023531830A priority Critical patent/JPWO2023276769A1/ja
Priority to CN202280045360.6A priority patent/CN117597587A/zh
Priority to KR1020237045161A priority patent/KR20240026153A/ko
Publication of WO2023276769A1 publication Critical patent/WO2023276769A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Definitions

  • the present invention relates to a scanner device that switches connection relationships between a plurality of probes and an inspection processing unit, and an electrical inspection device using the same.
  • a module substrate having a selection circuit is held substantially vertically by a connector on the opposite side of the substrate on which the contacts are provided, and a microcomputer controls the selection circuit to sequentially select the contacts for inspection.
  • a so-called scanner device is known (see, for example, Patent Document 1).
  • An object of the present invention is to provide a scanner device and an electrical inspection device that are difficult to increase in size.
  • a scanner device is a scanner device mounted on an electrical inspection device, and includes a first independent board that is a plate-shaped circuit board extending in a first direction, and a plate-shaped circuit board, a first common substrate arranged in parallel with the first independent substrate; a second common substrate, which is a plate-like circuit substrate and electrically connects the first independent substrate and the first common substrate; wherein the length of the first common substrate in the first direction is longer than the length of the first independent substrate in the first direction.
  • a scanner device is a scanner device that switches an electrical connection relationship with an inspection processing unit that performs an inspection based on an electric signal, and is formed in a plate shape extending in a predetermined first direction.
  • an independent substrate group in which a plurality of first independent substrates are arranged in parallel in a second direction orthogonal to the first direction; a first common substrate in which one of the first independent substrates of the independent substrate group is arranged in parallel; A plate-shaped second common substrate electrically connected to the end surfaces of the plurality of first independent substrates and electrically connected to the plate-shaped surface of the first common substrate.
  • an electrical inspection apparatus includes the scanner device described above.
  • a scanner device and an electrical inspection device having such a configuration are difficult to increase in size.
  • FIG. 1 is a schematic diagram conceptually showing the configuration of an electrical inspection apparatus using a scanner device according to an embodiment of the present invention
  • FIG. 2 is a side view schematically showing the structure of measurement units 2U and 2L shown in FIG. 1.
  • FIG. 3 is a perspective view schematically showing an example of the configuration of the scanner device 3 shown in FIG. 2
  • FIG. 4 is a schematic side view of the scanner device 3 shown in FIG. 3 as seen from the -Y direction
  • FIG. FIG. 4 is a schematic side view of the scanner device 3 shown in FIG. 3 as seen from the ⁇ Z direction
  • FIG. 10 is an explanatory diagram for explaining the effect of the configuration of the scanner device 3 that makes it difficult to increase the size
  • FIG. 4 is a schematic perspective view showing a modification of the scanner device shown in FIG. 3;
  • An electrical inspection apparatus 1 shown in FIG. 1 is an apparatus for inspecting an object B to be inspected.
  • the inspection object B may be, for example, a printed wiring board, a glass epoxy board, a flexible board, a ceramic multilayer wiring board, a package board for a semiconductor package, an interposer board, a film carrier, or the like.
  • Electronic parts such as CSP (Chip Size Package) and semiconductor elements (IC: Integrated Circuit) may be used, and electrode plates for displays such as liquid crystal displays, EL (Electro-Luminescence) displays, touch panel displays, touch panels, etc. It may be an electrode plate or any other object as long as it is subject to electrical inspection.
  • the electrical inspection apparatus 1 shown in FIG. 1 mainly includes measuring units 2U and 2L, a fixing device 101, a moving mechanism 102, an inspection processing unit 20, and a housing 103 that accommodates them.
  • the fixing device 101 is configured to fix the inspection object B at a predetermined position.
  • the measurement unit 2U is positioned above the inspection object B fixed to the fixing device 101. As shown in FIG.
  • the measurement unit 2L is positioned below the inspection object B fixed to the fixing device 101.
  • the measurement units 2U and 2L are provided with measurement jigs 4U and 4L for bringing the probes Pr into contact with a plurality of conductive portions provided on the inspection object B. As shown in FIG.
  • a plurality of probes Pr are attached to the measuring jigs 4U and 4L.
  • the measurement jigs 4U and 4L arrange and hold a plurality of probes Pr so as to correspond to the arrangement of conductive portions (inspection points) to be measured provided on the surface of the inspection object B.
  • FIG. The moving mechanism 102 appropriately moves the measuring units 2U and 2L within the housing 103 according to a control signal from the inspection processing unit 20, and moves the probes Pr of the measuring jigs 4U and 4L to respective inspection points of the inspection object B. make contact.
  • the electrical inspection apparatus 1 may be configured to include only one of the measurement units 2U and 2L.
  • the inspection processing unit 20 includes, for example, a CPU (Central Processing Unit) that executes predetermined arithmetic processing, a RAM (Random Access Memory) that temporarily stores data, and a ROM (Read Only Memory) that stores a predetermined control program. ), HDD (Hard Disk Drive), and other peripheral circuits. Then, the inspection processing unit 20 inspects the inspection object B, for example, by executing a control program stored in the storage unit.
  • a CPU Central Processing Unit
  • RAM Random Access Memory
  • ROM Read Only Memory
  • HDD Hard Disk Drive
  • the measurement unit 2U shown in FIG. 2 includes two scanner devices 3, 3, a measurement jig 4U, an aluminum plate 21, and a wiring board 22.
  • the scanner devices 3, 3 are attached to the upper surface of the aluminum plate 21, and the wiring board 22 is laminated on the lower surface of the aluminum plate 21.
  • a measurement jig 4U is attached to the lower surface of the wiring board 22 .
  • the rear ends of the probes Pr of the measuring jig 4U are connected to the wiring board 22, and the scanner devices 3, 3 are connected to the wiring board 22 through openings (not shown) formed in the aluminum plate 21. .
  • the wiring board 22 is provided with wirings for connecting the probes Pr and the scanner devices 3 , 3 . Thereby, each probe Pr and the scanner devices 3, 3 are electrically connected.
  • the measurement jig 4L is configured in substantially the same manner as the measurement jig 4U except that it is inverted upward (+X) and downward (-X), so the description thereof will be omitted.
  • the measuring units 2U and 2L are collectively referred to as the measuring unit 2, and the measuring jigs 4U and 4L are collectively referred to as the measuring jig 4.
  • the measuring jig 4 and the scanner devices 3, 3 are fixed by an aluminum plate 21. As shown in FIG.
  • the moving mechanism 102 moves the entire measuring section 2 supported by the aluminum plate 21 when positioning the probe Pr at the inspection point of the inspection object B. As shown in FIG.
  • Each of the measuring jigs 4U and 4L has approximately 1000 to 20000 probes Pr.
  • the scanner device 3 switches the electrical connection relationship with the inspection processing unit 20 that performs inspection based on electrical signals.
  • the scanner device 3 includes a power supply circuit, a voltmeter, an ammeter, and the like for inspecting the inspection object B.
  • FIG. Further, the scanner device 3 includes a switching circuit for switching the connection relationship between each probe Pr provided in the measuring jig 4 and the power supply circuit, voltmeter, ammeter, etc. according to a control signal from the inspection processing unit 20. I have. Therefore, several thousand, for example, 4096 probes Pr are electrically connected to one scanner device 3 via the wiring board 22 .
  • the scanner device 3 and the inspection processing unit 20 are connected by a cable (not shown) or the like so that signals can be transmitted and received between each unit in the scanner device 3 and the inspection processing unit 20 .
  • a measurement result obtained by a measuring circuit such as a voltmeter or an ammeter based on the signal obtained from the probe Pr selected by the switching circuit is transmitted to the inspection processing section 20 . That is, the scanner device 3 switches the probe Pr used for inspection among the plurality of probes Pr between the plurality of probes Pr and the inspection processing unit 20 .
  • the first independent board 31 is a circuit board having a substantially rectangular plate shape extending in the X direction (first direction).
  • the plurality of first independent substrates 31 are arranged to face each other in the Y direction (second direction) orthogonal to the X direction and arranged in parallel.
  • the ⁇ X side end of the first common substrate 41 is connected to the wiring substrate 22 by a connector (not shown) or the like. As a result, the wiring provided on the ⁇ X side end of the first common substrate 41 is electrically connected to the probe Pr through the wiring substrate 22 .
  • a switching circuit for selecting the probe Pr according to a control signal from the inspection processing section 20 is mounted on the first independent substrate 31 .
  • the first common board 41 is a circuit board having a substantially rectangular plate shape extending in the X direction.
  • the first common substrate 41 is arranged in parallel to face one of the plurality of first independent substrates 31, for example, the first independent substrate 31 located on the most +Y side.
  • the X-direction length L41 of the first common substrate 41 is longer than the X-direction length L31x of the first independent substrate 31 . Thereby, the first common substrate 41 protrudes to the +X side of the independent substrate group 33 .
  • At least one of the above-described power supply circuit, voltmeter, and ammeter is mounted on the first common substrate 41 .
  • the power supply circuit supplies voltage and current through the probe Pr used for conducting, breaking, or measuring electrical resistance of the object B to be inspected, and probes the power supply voltage for operating the semiconductor circuit included in the object B to be inspected. Pr.
  • the voltmeter and ammeter measure the voltage and current obtained from the object B to be inspected by the probe Pr. Measurement results such as voltage or current measured by the first common substrate 41 are transmitted to the inspection processing unit 20 .
  • the second common board 42 is a circuit board having a substantially rectangular plate shape extending in the Y direction.
  • the plane direction of the second common substrate 42 is along the XY plane.
  • the ⁇ X side end of the second common board 42 is electrically connected to the +X side ends of all the first independent boards 31 of the independent board group 33 by, for example, connectors (not shown).
  • the +Y side end of the second common substrate 42 is electrically connected to the -Y side substrate surface (plate surface) of the first common substrate 41 by, for example, a connector (not shown). Thereby, the first common substrate 41 is electrically connected to each first independent substrate 31 via the second common substrate 42 .
  • the length L41 of the first common substrate 41 is longer than the length L31x of the first independent substrate 31, and the first common substrate 41 protrudes toward the +X side of the independent substrate group 33, thereby It becomes easy to electrically connect the +Y side end portion of the second common substrate 42 to the plate-like surface of the first common substrate 41 on the -Y side.
  • a switching circuit a so-called multiplexer, is mounted for switching according to a control signal from.
  • the switching circuit that switches the connection relationship between the power supply circuit, the voltmeter, and the ammeter of the first common substrate 41 and each probe Pr according to the control signal from the inspection processing unit 20 has a plurality of first They are distributed on the independent substrate 31 and the second common substrate 42 .
  • the number of second common substrates 42 may be one, or, for example, as shown in FIG. 4, a plurality of second common substrates 42 may be provided in parallel. By providing a plurality of second common substrates 42, it becomes easy to increase the circuit scale of the switching circuit that can be mounted on the second common substrate 42.
  • FIG. 4 The number of second common substrates 42 may be one, or, for example, as shown in FIG. 4, a plurality of second common substrates 42 may be provided in parallel.
  • the first common substrate 41 is arranged to face the first independent substrate 31 , and the first common substrate 41 is electrically connected to each first independent substrate 31 via the second common substrate 42 .
  • the configuration in which they are connected makes it difficult for the scanner device 3 to become large.
  • the X-direction length of the second common substrate region 42′ necessary for mounting a circuit corresponding to the second common substrate 42 and the first independent substrate 31 on the substrate 400 is the same as in FIG. , the length is L41. Furthermore, since it is necessary to mount a circuit equivalent to that of the first common substrate 41 on the substrate 400, if the Z-direction length L31z of the first independent substrate 31 and the Y-direction length L400 of the substrate 400 are equal, Assuming that the first common substrate area 41' required for mounting the circuit corresponding to the first common substrate 41 has a length L41. Therefore, the scanner device employing the configuration shown in FIG. 6 has a length in the X direction twice as long as L41.
  • the length in the X direction of the scanner device 3 shown in FIG. 3 is L41, the length in the X direction is half that of the scanner device having the configuration shown in FIG.
  • the size of the scanner device 3 is less likely to increase, it becomes easier to move the scanner device 3 together with the measurement jig 4 by the moving mechanism 102 . If the scanner device becomes large, it is difficult to move it by the moving mechanism 102 . In that case, it is conceivable that the power supply circuit, voltmeter, ammeter, etc. mounted on the first common substrate 41 are arranged outside the scanner device and connected to each probe Pr by a cable. However, when the signal line is extended with a cable, the signal obtained from the probe Pr is affected by the resistance and impedance of the cable, resulting in a decrease in measurement accuracy.
  • the scanner device 3 that is difficult to increase in size, it is easy to move the scanner device 3 together with the measurement jig 4 without extending the signal line with a cable. As a result, it becomes easy to improve the measurement accuracy of the inspection object B by the scanner device 3 .
  • the second independent board 32 is a circuit board having a substantially rectangular plate-like shape whose surface direction is the same as that of the first independent board 31 .
  • One second independent substrate 32 is provided for each first independent substrate 31 .
  • one second independent substrate 32 may be provided for every two first independent substrates 31 , and two first independent substrates 31 may be connected to one second independent substrate 32 .
  • 16 second independent substrates 32 may be provided for 32 first independent substrates 31, so the number of substrates of the second independent substrates 32 can be reduced.
  • the Z-direction length L32 of the second independent substrate 32 is shorter than the Z-direction length L31z of the first independent substrate 31 .
  • the ⁇ X side end of the second independent board 32 is connected to a portion of the +X side end of the first independent board 31 that is not connected to the second common board 42 by, for example, a connector (not shown).
  • the second independent substrate 32 is not necessarily connected to all the first independent substrates 31 , and may be connected to at least one of the first independent substrates 31 .
  • the scanner device 3 may not have the second independent substrate 32 .
  • the third common board 43 is a circuit board having a substantially rectangular plate-like shape whose surface direction is along the YZ plane.
  • the third common board 43 is connected to the +X side ends of the one or more second independent boards 32 by, for example, a connector (not shown). Also, the third common board 43 is connected to the outside of the scanner device 3 by, for example, a cable (not shown).
  • the signal of the object to be measured is not necessarily limited to one that requires highly accurate measurement. Some signals to be measured may be high voltage, low frequency, or affected by cable resistance and impedance. Therefore, the second independent board 32 extracts a signal from the first independent board 31 that does not cause any problem even if it is affected by the resistance and impedance of the cable, and outputs the signal to the scanner device 3 via the third common board 43 and a cable (not shown). to be connected to a measuring circuit located outside the
  • the scanner device 3 By providing the scanner device 3 with the second independent substrate 32 and the third common substrate 43 in this manner, a signal that is not affected by cable resistance and impedance can be extracted and measured outside the scanner device 3. easier to do. As a result, there is no need to provide a measuring circuit for processing signals that are not affected by cable resistance and impedance in the scanner device 3, so that it is easy to make the scanner device 3 more difficult to increase in size. .
  • the second independent board 32 may be directly connected to the measuring circuit provided outside the scanner device 3 by a cable or the like. Also, the second independent substrate 32 and the third common substrate 43 may not be provided.
  • the parallel substrate 51 shown in FIGS. 4 and 5 has, for example, a substantially rectangular plate shape, and is arranged parallel to and facing the second common substrate.
  • the ⁇ X side end of the parallel board 51 is electrically connected to the +X side ends of all the first independent boards 31 of the independent board group 33 by, for example, connectors (not shown).
  • the +X side end of the parallel substrate 51 is connected to the outside of the scanner device 3 by, for example, a cable (not shown).
  • the parallel substrate 51 is not necessarily connected to all the first independent substrates 31 and may be connected to at least one of the first independent substrates 31 .
  • the scanner device 3 may not have the parallel substrate 51 .
  • a scanner device 3a shown in FIG. 7 differs from the scanner device 3 shown in FIG. Other points are the same as those of the scanner device 3, so the description thereof will be omitted, and the characteristic points of the scanner device 3a will be described below.
  • the second common board 42a is a circuit board having a substantially rectangular plate shape extending in the Y direction.
  • the surface direction of the second common substrate 42a is along the YZ plane.
  • the -X side substrate surface of the second common substrate 42a is electrically connected to the +X side end portions of all the first independent substrates 31 of the independent substrate group 33 by, for example, connectors (not shown).
  • the +Y side end of the second common board 42a is electrically connected to the ⁇ Y side board surface of the first common board 41 by, for example, a connector (not shown).
  • the first common substrate 41 is electrically connected to each first independent substrate 31 via the second common substrate 42a.
  • the length L41 of the first common substrate 41 is longer than the length L31x of the first independent substrate 31, and the first common substrate 41 protrudes toward the +X side of the independent substrate group 33, thereby It becomes easy to electrically connect the +Y side end of the second common substrate 42a to the plate-like surface of the first common substrate 41 on the -Y side.
  • the second common substrate 42a has a power supply circuit, a voltmeter, and an ammeter on the first common substrate 41 and signal wirings connected to switching circuits on the first independent substrates 31.
  • a switching circuit a so-called multiplexer, for switching the connection relationship according to a control signal from the inspection processing unit 20 is mounted.
  • the number of second common substrates 42a may be one, or, for example, as shown in FIG. 7, a plurality of second common substrates 42a may be provided in parallel. By providing a plurality of second common substrates 42a, it becomes easy to increase the circuit scale of the switching circuit that can be mounted on the second common substrate 42a.
  • the first common substrate 41 is arranged opposite to the first independent substrate 31, and the first common substrate 41 is electrically connected to each of the first independent substrates 31 via the second common substrate 42a.
  • the connected configuration facilitates making the scanner device 3a difficult to increase in size.
  • the surface direction of the second common substrate 42a is along the YZ plane, and the X direction is the plate thickness direction of the second common substrate 42a.
  • the size of the scanner device 3a is less likely to increase than that of the scanner device 3 in which the surface direction of the second common substrate 42 extends in the X direction.
  • a scanner device is a scanner device mounted on an electrical inspection device, and includes a first independent board which is a plate-shaped circuit board extending in a first direction, and a plate-shaped circuit board. a first common substrate arranged parallel to the first independent substrate; and a plate-like circuit substrate, the second common substrate electrically connecting the first independent substrate and the first common substrate. and, the length of the first common substrate in the first direction is longer than the length of the first independent substrate in the first direction.
  • the size of the scanner device is less likely to increase than when the first independent substrate and the first common substrate are arranged on a straight line.
  • a scanner device is a scanner device that switches an electrical connection relationship with an inspection processing unit that performs an inspection based on an electric signal, and is formed in a plate shape extending in a predetermined first direction.
  • an independent substrate group in which a plurality of first independent substrates are arranged in parallel in a second direction orthogonal to the first direction; a first common substrate in which one of the first independent substrates of the independent substrate group is arranged in parallel; A plate-shaped second common substrate electrically connected to the end surfaces of the plurality of first independent substrates and electrically connected to the plate-shaped surface of the first common substrate.
  • the number of probes can be increased by increasing the number of the first independent substrates. It becomes easier to let
  • the first independent substrate is arranged in parallel with one of the plurality of parallel arranged independent substrates, and the second common substrate is electrically connected to the end surfaces of the plurality of first independent substrates and the first Since it is electrically connected to the plate-shaped surface of the common substrate, it is easy to arrange the first common substrate and the second common substrate so as to be bent in an L shape along the edge of the independent substrate group. becomes. Therefore, the circuits mounted on the first common substrate and the second common substrate can be arranged compactly, which makes it easy to make the scanner device difficult to increase in size.
  • the surface direction of the second common substrate is along the second direction and the first direction, which are the separation directions between the first independent substrate and the first common substrate.
  • the space of the one end portion of the first independent substrate that is connected to the second common substrate may be small, so that the space of the one end portion of the first independent substrate that is not connected to the second common substrate may be replaced by another space. It becomes easy to connect a circuit board or the like.
  • the circuit mounting space is increased by the parallel board, so that it becomes easy to increase the circuit scale of the scanner device.
  • a second independent substrate which is a plate-shaped circuit substrate having the same surface direction as the first independent substrate and is connected to one end portion of the first independent substrate in the first direction. According to this configuration, among the signals obtained from the first independent substrate, those signals that do not need to be processed by the first common substrate can be easily processed by the second independent substrate.
  • the apparatus further includes a third common substrate, which is a plate-shaped circuit board and whose surface direction is perpendicular to the first direction, wherein the second independent substrate is located between the third common substrate and the first independent substrate. and the third common substrate is preferably connected to the second independent substrate. According to this configuration, it becomes easy to further process the signal obtained from the second independent substrate by the third common substrate.
  • the plane direction of the second common substrate is perpendicular to the first direction. According to this configuration, it becomes easy to dispose the second common substrate so as to cover the edge of the first independent substrate.
  • an electrical inspection apparatus includes the scanner device described above.
  • the size of the scanner device is less likely to increase.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

Le problème décrit par la présente invention est de fournir un dispositif de balayage et un dispositif d'inspection électrique présentant une sensibilité réduite aux augmentations de taille. À cet effet, l'invention concerne un dispositif de balayage 3 qui est monté dans un dispositif d'inspection électrique 1, le dispositif de balayage 3 comprenant un premier substrat individuel 31 qui est une carte de circuit imprimé en forme de carte et qui s'étend dans une première direction, un premier substrat commun 41 qui est une carte de circuit imprimé en forme de carte et qui est disposé en parallèle avec le premier substrat individuel 31, et un second substrat commun 42 qui est une carte de circuit imprimé en forme de carte et qui connecte électriquement le premier substrat individuel 31 et le premier substrat commun 41, la longueur dans la direction X du premier substrat commun 41 étant plus longue que la longueur dans la direction X du premier substrat individuel 31.
PCT/JP2022/024632 2021-06-29 2022-06-21 Dispositif de balayage et dispositif d'inspection électrique WO2023276769A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2023531830A JPWO2023276769A1 (fr) 2021-06-29 2022-06-21
CN202280045360.6A CN117597587A (zh) 2021-06-29 2022-06-21 扫描装置及电气检查装置
KR1020237045161A KR20240026153A (ko) 2021-06-29 2022-06-21 스캐너 장치 및 전기 검사 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021107630 2021-06-29
JP2021-107630 2021-06-29

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WO2023276769A1 true WO2023276769A1 (fr) 2023-01-05

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CN (1) CN117597587A (fr)
TW (1) TW202300938A (fr)
WO (1) WO2023276769A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0882655A (ja) * 1994-09-13 1996-03-26 Fujitsu Ltd 集積回路試験装置
JP2008180726A (ja) * 2003-04-04 2008-08-07 Advantest Corp 接続ユニットおよび試験装置
JP2010112789A (ja) * 2008-11-05 2010-05-20 Yamaha Fine Technologies Co Ltd 電気検査装置
JP2013250250A (ja) * 2012-06-04 2013-12-12 Advantest Corp テスターハードウェアおよびそれを用いた試験システム
JP2015099019A (ja) * 2013-11-18 2015-05-28 日置電機株式会社 スキャナ装置および基板検査装置
JP2015111082A (ja) * 2013-12-06 2015-06-18 富士通テレコムネットワークス株式会社 布線試験装置、布線試験方法及び基準値測定装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0882655A (ja) * 1994-09-13 1996-03-26 Fujitsu Ltd 集積回路試験装置
JP2008180726A (ja) * 2003-04-04 2008-08-07 Advantest Corp 接続ユニットおよび試験装置
JP2010112789A (ja) * 2008-11-05 2010-05-20 Yamaha Fine Technologies Co Ltd 電気検査装置
JP2013250250A (ja) * 2012-06-04 2013-12-12 Advantest Corp テスターハードウェアおよびそれを用いた試験システム
JP2015099019A (ja) * 2013-11-18 2015-05-28 日置電機株式会社 スキャナ装置および基板検査装置
JP2015111082A (ja) * 2013-12-06 2015-06-18 富士通テレコムネットワークス株式会社 布線試験装置、布線試験方法及び基準値測定装置

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TW202300938A (zh) 2023-01-01
CN117597587A (zh) 2024-02-23
JPWO2023276769A1 (fr) 2023-01-05
KR20240026153A (ko) 2024-02-27

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