Classifications

• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
  • C09J11/02—Non-macromolecular additives
  • C09J11/06—Non-macromolecular additives organic
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
  • C09J11/08—Macromolecular additives
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
  • C09J129/02—Homopolymers or copolymers of unsaturated alcohols
  • C09J129/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
  • C09J133/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J139/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Adhesives based on derivatives of such polymers
  • C09J139/04—Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
  • C09J139/06—Homopolymers or copolymers of N-vinyl-pyrrolidones
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
  • C09J171/02—Polyalkylene oxides
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J7/00—Adhesives in the form of films or foils
  • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J7/00—Adhesives in the form of films or foils
  • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
  • C09J7/38—Pressure-sensitive adhesives [PSA]
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
  • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W95/00—Packaging processes not covered by the other groups of this subclass
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/04—Oxygen-containing compounds
  • C08K5/05—Alcohols; Metal alcoholates
  • C08K5/053—Polyhydroxylic alcohols
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
  • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2429/00—Presence of polyvinyl alcohol
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
  • H10H29/01—Manufacture or treatment
  • H10H29/02—Manufacture or treatment using pick-and-place processes
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
  • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
  • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
  • H10P72/7414—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
  • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
  • H10P72/7428—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
  • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
  • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer

Definitions

• the present invention relates to a water-soluble adhesive composition for capturing components, a water-soluble adhesive sheet for capturing components, and a method for manufacturing electronic components.
• the present invention provides a water-soluble adhesive composition for capturing components and a water-soluble adhesive sheet for capturing components for capturing elements on a substrate in the manufacture of electronic components, and a water-soluble adhesive composition for capturing components and a water-soluble adhesive sheet for capturing components.
• the present invention relates to a method for manufacturing electronic components using adhesive sheets.
• materials with adhesive layers are used for the purpose of preventing foreign matter from adhering or for efficient production of semiconductor chips or image display devices. .
• Patent Document 1 proposes a method for manufacturing a display device using light emitting diodes (LEDs).
• the manufacturing method describes a method in which a large number of LED elements that become pixels are formed on one wafer, and then dicing and enlarged transfer using a temporary holding member having an adhesive layer (pressure-sensitive adhesive layer) are performed.
• Patent Document 2 proposes a method of separating an LED element from a base material by using laser light when enlarging transfer is performed.
• the LED element when transferring an LED element from a source substrate to a destination substrate by transfer, the LED element may be displaced from a predetermined position on the destination substrate. In addition, there have been cases where the LED element collides with the transfer destination member and bounces back, making it impossible to arrange the LED element at a desired position.
• an object of the present invention is to provide a water-soluble adhesive composition for capturing parts and a water-soluble adhesive sheet for capturing parts, which have excellent shock absorption properties and adhesive properties and are suitable for capturing parts.
• An object of the present invention is to provide a method for manufacturing electronic components that enables highly accurate and efficient manufacturing using a water-soluble adhesive composition for capturing components and a water-soluble adhesive sheet for capturing components.
• a water-soluble adhesive composition for capturing parts that includes (A) a water-soluble adhesive and (B) a water-soluble plasticizer (excluding the above component (A)), (B) a water-soluble
• the viscosity of the plasticizer is 50,000 mPa ⁇ s or less at room temperature (25°C), and the ratio of the content of (B) water-soluble plasticizer to the content of (A) water-soluble adhesive ((B)/(A) ) is greater than 0.5 and less than or equal to 3.0.
• a water-soluble plasticizer having a viscosity of 50,000 mPa ⁇ s or less at room temperature (25°C) is contained in a predetermined ratio with respect to the content of the water-soluble adhesive.
• the shock absorbing properties, adhesiveness, and adhesion of the water-soluble adhesive composition for trapping components are improved, and damage to components (elements) or misalignment can be suppressed during the manufacture of electronic components.
• a water-soluble adhesive composition for capturing parts that includes (A) a water-soluble adhesive and (B) a water-soluble plasticizer (excluding the above component (A)), (B) a water-soluble
• the plasticizer is liquid at room temperature (25°C) and has a molecular weight of 5000 or less, and the ratio of the content of the (B) water-soluble plasticizer to the content of the (A) water-soluble adhesive ((B)/
• a water-soluble adhesive composition for capturing parts characterized in that (A)) is greater than 0.5 and less than or equal to 3.0.
• the water-soluble adhesive composition for parts trapping of the present invention since it is liquid and contains a water-soluble plasticizer with a molecular weight of 5000 or less in a predetermined ratio with respect to the content of the water-soluble adhesive, the water-soluble adhesive composition for parts trapping The impact absorption properties, adhesiveness, and adhesion of the soluble adhesive composition are improved, and the occurrence of damage or misalignment of components (elements) can be suppressed during the manufacture of electronic components.
• a water-soluble adhesive composition for capturing parts containing (A) a water-soluble adhesive and (B) a water-soluble plasticizer (excluding the component (A)), (A) a water-soluble
• the weight average molecular weight of the adhesive is 1.0 ⁇ 10 4 or more and 1.0 ⁇ 10 6 or less, and the ratio of the content of (B) water-soluble plasticizer to the content of (A) water-soluble adhesive (( There is provided a water-soluble adhesive composition for capturing parts, characterized in that B)/(A)) is greater than 0.5 and less than or equal to 3.0.
• the water-soluble adhesive composition for parts trapping of the present invention since it contains a water-soluble adhesive having a weight molecular weight of 1.0 ⁇ 10 4 or more and 1.0 ⁇ 10 6 or less in a predetermined ratio, the water-soluble adhesive composition for parts trapping The impact absorption properties and adhesion properties of the adhesive composition are improved, and the occurrence of damage or misalignment of components (elements) can be suppressed during the manufacture of electronic components.
• the water-soluble adhesive is selected from the group consisting of vinyl alcohol polymers, vinyl pyrrolidone polymers, acrylic polymers, and saccharides.
• it contains at least one water-soluble adhesive. According to the embodiment described above, it is possible to provide a water-soluble adhesive composition for capturing parts that has excellent tackiness and adhesiveness as well as excellent washability.
• the water-soluble plasticizer (B) is preferably a monohydric or polyhydric alcohol that is liquid at room temperature (25° C.). According to the embodiments described above, it is possible to provide a water-soluble adhesive composition for capturing parts that has excellent compatibility with water-soluble adhesives, excellent tackiness and adhesiveness, and also excellent washability.
• the water-soluble plasticizer (B) preferably has a boiling point of 120° C. or higher. According to the embodiment described above, it is possible to provide a water-soluble adhesive composition for capturing parts that is difficult to evaporate and whose physical properties are less likely to change when a bonding process involving heating and/or pressure is performed after capturing the parts. .
• the water-soluble plasticizer includes at least one selected from glycerin, diglycerin, polyethylene glycol, ethylene glycol, propylene glycol, and polypropylene glycol. It is preferable. According to the above embodiment, since glycerin, diglycerin, polyethylene glycol, ethylene glycol, propylene glycol, and polypropylene glycol all have high boiling points, they are difficult to evaporate during the bonding process that involves heating and/or pressure. The formation of vapor bubbles (so-called "voids") within the composition can be suppressed. It also has the effect of being excellent in water washability.
• a water-soluble pressure-sensitive adhesive sheet for capturing components which is characterized by having a layer formed by forming the water-soluble pressure-sensitive adhesive composition for capturing components into a sheet.
• the water-soluble pressure-sensitive adhesive sheet for capturing components of the present invention by forming the water-soluble pressure-sensitive adhesive composition for capturing components into a sheet, it has excellent shock absorption properties, adhesive properties, and adhesion properties, and is also excellent in handling during application and peeling. This effect can also be achieved, and the efficiency of work related to capturing parts can be improved.
• the water-soluble pressure-sensitive adhesive sheet for capturing parts can significantly reduce the amount of liquid components, it also has the effect of improving transportation efficiency and improving storage stability.
• a method for manufacturing an electronic component which includes a step of capturing a component using the water-soluble adhesive composition for capturing a component described above.
• a water-soluble adhesive composition for capturing components with excellent shock absorbing properties and adhesive properties is used, collisions between components (elements) and members to which they are transferred during the transfer process are avoided. It is possible to suppress the damage caused by this and bounce back, and to prevent the failure of capturing (mounting) the component (element) at the desired position. This enables highly accurate and efficient manufacturing of electronic components.
• a method for manufacturing an electronic component which includes a step of capturing a component using the above water-soluble adhesive sheet for capturing a component.
• a water-soluble adhesive sheet for capturing components with excellent shock absorbing properties and adhesive properties is used, collisions between components (elements) and the member to be transferred during the transfer process can be avoided. It is possible to exhibit the effect of suppressing damage and rebound, and preventing failure to capture (mount) components (elements) at desired positions.
• a water-soluble adhesive sheet for capturing parts which is easy to handle during application and peeling, it is effective in facilitating operations related to capturing and removing residue after capturing when manufacturing electronic components. . This enables highly accurate and efficient manufacturing of electronic components.
• a water-soluble adhesive composition for capturing parts and a water-soluble adhesive sheet for capturing parts which have excellent shock absorption properties, adhesive properties, and excellent handling properties during application and peeling, and are suitable for capturing parts.
• the water-soluble adhesive composition for capturing parts and the water-soluble adhesive sheet for capturing parts it is possible to provide a method for producing electronic components that enables efficient production with high precision.
• FIG. 2 is a schematic diagram showing a non-contact transfer process which is an example of a component capturing process using the water-soluble adhesive composition for capturing components (water-soluble adhesive sheet for capturing components) of the present invention.
• FIG. 2 is a schematic diagram showing a contact transfer process which is an example of a component capturing process using the water-soluble adhesive composition for capturing components (water-soluble adhesive sheet for capturing components) of the present invention.
• Water-soluble adhesive composition for capturing parts and water-soluble adhesive sheet for capturing parts are used for capturing parts, and furthermore, after capturing, they can be removed by washing with water.
• the electronic component to be captured is an element selected from a semiconductor element, a liquid crystal element, a photoelectric conversion element, a piezoelectric element, a thin film transistor element, a thin film diode element, a resistive element, a switching element, a micromagnetic element, a microscopic optical element, or Examples include a part of these elements or a combination of these elements.
• the water-soluble adhesive composition for capturing parts and the water-soluble adhesive sheet for capturing parts of the present invention will be explained below mainly on the premise that semiconductor elements are captured on a substrate, but the invention is not limited to this. It's not a thing.
• the water-soluble adhesive composition for capturing components of the present invention is also simply referred to as a "capturing composition”
• the water-soluble adhesive sheet for capturing components is also simply referred to as a "capturing sheet.”
• the water-soluble adhesive composition for capturing components and the water-soluble adhesive sheet for capturing components of the present invention have shock absorbing properties that can absorb semiconductor elements such as LED elements separated from a transfer source substrate by, for example, energy rays (lasers, etc.). , has adhesiveness/tackiness to capture the received semiconductor element at a desired position on the substrate, and adhesiveness/adhesion to the substrate. Further, in the water-soluble adhesive composition for capturing components and the water-soluble adhesive sheet for capturing components of the present invention, residues can be dissolved in water and removed in the washing step.
• the present invention can be composed of a liquid part-trapping water-soluble adhesive composition, by forming a parts-trapping water-soluble adhesive sheet having a layer formed from a parts-trapping water-soluble adhesive composition into a sheet shape, Compared to a water-soluble adhesive composition for trapping, the process of applying to a wiring board and drying can be omitted, and handling becomes easier, so that work efficiency can be improved. Furthermore, compared to the water-soluble adhesive composition for capturing parts, the water-soluble adhesive sheet for capturing parts can significantly reduce the amount of liquid components, so that the transportation efficiency can be improved and the storage stability can be improved.
• the surface for capturing parts (mounting surface) becomes flat compared to applying a liquid water-soluble adhesive composition for capturing parts, so the water-soluble adhesive sheet for capturing parts of the present invention It can be placed stably.
• the shape of the water-soluble adhesive sheet for capturing components of the present invention is not particularly limited.
• Examples of the shape of the water-soluble adhesive sheet for capturing parts of the present invention include polygons (e.g., rectangles, rectangles, triangles, etc.), circles, ellipses, irregular shapes, etc. when viewed from above. It will be done.
• the shape of the water-soluble pressure-sensitive adhesive sheet for capturing components of the present invention may be any desired shape, such as a shape that matches the shape of the adherend substrate. Alternatively, it may be processed into a desired shape using a known method such as cutting. Furthermore, after forming into a roll, the required amount can be cut and used.
• the thickness of the water-soluble pressure-sensitive adhesive sheet for capturing components of the present invention is not particularly limited, but is preferably, for example, 1 ⁇ m or more, more preferably 3 ⁇ m or more, and even more preferably 5 ⁇ m or more. It is preferable that the thickness of the water-soluble pressure-sensitive adhesive sheet for capturing components of the present invention is 1 ⁇ m or more because impact absorption properties are improved. Further, the upper limit of the thickness of the water-soluble pressure-sensitive adhesive sheet for capturing components of the present invention is preferably 500 ⁇ m or less, more preferably 100 ⁇ m or less, and even more preferably 50 ⁇ m or less. It is preferable that the thickness of the water-soluble pressure-sensitive adhesive sheet for capturing components of the present invention is 500 ⁇ m or less, since the amount of residue is small and the time required for the water-washing process for sheet removal can be shortened.
• the thickness of the water-soluble adhesive sheet for capturing components of the present invention is appropriately selected depending on the relationship with the height of bumps formed on semiconductor elements.
• the trapping sheet is thicker than the height of the bump, the bottom and side surfaces of the semiconductor element come into contact with the trapping sheet, thereby suppressing the rebound of the semiconductor element.
• the water-soluble adhesive composition for capturing parts and the water-soluble adhesive sheet for capturing parts of the present invention contain a water-soluble plasticizer (B), but the water-soluble plasticizer (B) is a liquid component and is contained in a high proportion.
• the top surface of the trapping sheet tends to get wet on the sides of the semiconductor element bumps and the sides of the semiconductor element during the initial stage of rebound after the semiconductor element has sunk, and the surface tension and adhesive force caused by this wetting can cause the semiconductor element to bounce back and the semiconductor element to get wet. Demonstrates the effect of suppressing element damage.
• the capture sheet covers the top surface of the semiconductor element, further increasing the resistance to rebound, making it difficult to carry out the process of capturing the semiconductor element at high speed.
• the positional deviation will be smaller.
• the effect of suppressing the rebound of a semiconductor element is that in the initial stage of rebound, "the trapping sheet is wet on the bump side of the semiconductor element (wet by the bump of the semiconductor element)" and “the trapping sheet is wet on the side of the semiconductor element".
• the rebound suppression effect increases.
• the ratio between the thickness of the water-soluble adhesive sheet for capturing components of the present invention and the height of the bumps on the semiconductor element is set to 1 from the viewpoint of positional deviation and damage to the semiconductor element when capturing the semiconductor element. .0 or more is preferable, 1.2 or more is more preferable, and 1.5 or more is still more preferable.
• the ratio of the thickness of the water-soluble adhesive sheet for component capturing of the present invention to the height of the bump is 1.0 or more, it is difficult for the bumps of the semiconductor element to shift from the desired position of the electrode of the substrate in the semiconductor element capturing process. preferable.
• the semiconductor element sinks (again) due to the softening of the capturing sheet, causing the bumps of the semiconductor element to come into contact with the substrate electrodes.
• the thickness of the capture sheet is significantly thicker than the semiconductor element height (the shortest distance between the lower surface of the semiconductor element's bump and the upper surface of the semiconductor element), the distance for the semiconductor element to (re)sink is long, and During assembly, the semiconductor element may shake and become misaligned from the substrate electrode.
• the ratio between the thickness of the water-soluble adhesive sheet for capturing components of the present invention and the height of the bumps is such that the semiconductor element can be captured without shifting its position. From the viewpoint of positional deviation due to sinking of the semiconductor element in a later bonding step, the ratio is preferably 5.0 or less, more preferably 3.6 or less, and even more preferably 2.3 or less. If the ratio between the thickness of the water-soluble adhesive sheet for capturing parts of the present invention and the height of the bumps on the semiconductor element is 3.0 or less, the semiconductor element may sink during the bonding process after capturing the semiconductor element at a desired position. Misalignment between the bumps of the element and the substrate electrodes can be suppressed.
• the height of the bumps formed on the semiconductor element is not particularly limited, but is, for example, 1 ⁇ m or more and 50 ⁇ m or less.
• the lower limit of the height of the bump is preferably 1 ⁇ m or more, more preferably 2 ⁇ m or more, and even more preferably 3 ⁇ m or more.
• the upper limit of the height of the bump is preferably 50 ⁇ m or less, more preferably 30 ⁇ m or less, and even more preferably 20 ⁇ m or less.
• the water-soluble adhesive composition for capturing parts and the water-soluble adhesive sheet for capturing parts of the present invention contain (A) a water-soluble adhesive and (B) a water-soluble plasticizer.
• the content of component (A) is, for example, 10% by mass or more and 65% by mass or less, based on the entire capturing sheet. It is preferable that component (A) is 10% by mass or more because of the moldability of the sheet. It is preferable that component (A) is 65% by mass or less because of tackiness and adhesion.
• the lower limit of the content of component (A) is preferably 20% by mass or more, more preferably 25% by mass or more, and even more preferably 30% by mass or more, from the viewpoint of improving the moldability of the sheet.
• the upper limit of the content of component (A) is preferably 65% by mass or less, more preferably 60% by mass or less, and even more preferably 55% by mass or less, from the viewpoint of tackiness and adhesiveness.
• the content of component (B) is, for example, preferably 35% by mass or more, more preferably 40% by mass or more, and even more preferably 50% by mass or more, based on the entire capturing sheet. It is preferable that the content of component (B) is 35% by mass or more because it improves prevention of positional shift in the transfer process of semiconductor elements from the viewpoint of adhesive strength, adhesion strength, surface tension, and rheological properties.
• the properties as a liquid are improved, the wettability to semiconductor elements is improved, and rebounding of the semiconductor elements can be suppressed.
• the polymer chains of the water-soluble adhesive move easily, resulting in excellent shock absorption.
• the content of component (B) is preferably 300% by mass or less, more preferably 250% by mass or less, and even more preferably 200% by mass or less, based on component (A). It is preferable from the viewpoint of sheet formability that the content of component (B) is 300% by mass or less.
• the water-soluble adhesive which is component (A), is the main component constituting the capture composition and capture sheet, and has a polymer as its main component.
• the water-soluble adhesive of component (A) is a component having water solubility, and is a component that exhibits tackiness either alone or by adding a water-soluble plasticizer.
• water-soluble means that it dissolves without turbidity when made into a 1% by mass aqueous solution at room temperature (25° C.).
• tackiness refers to a sheet prepared by adding 30 parts by mass or 50 parts by mass of a water-soluble adhesive (component (A)) or a water-soluble plasticizer (component (B)) at room temperature (25 parts by mass). After pressing a sheet (1 cm x 5 cm x 10 ⁇ m) against, for example, a PET film (non-release treated surface) at When a cut-out PET film is hung vertically, the sheet and PET film do not peel off immediately.
• the water-soluble adhesive composition for capturing parts and the water-soluble adhesive sheet for capturing parts of the present invention have tackiness and adhesiveness (pressure-sensitive adhesiveness) to semiconductor elements, and tackiness and adhesion to substrates. properties, inhibiting decomposition or melting properties under heating and/or pressure during the bonding process, and water solubility.
• the polymer constituting component (A) includes those that exhibit tackiness and adhesiveness by themselves, or those that exhibit tackiness and adhesiveness by forming a gel.
• the water-soluble adhesive composition for capturing parts and the water-soluble adhesive sheet for capturing parts of the present invention are melted in the bonding process for electrically connecting the substrate and the semiconductor element with heating and/or pressure, and the water-soluble adhesive composition for capturing parts and the water-soluble adhesive sheet for capturing parts of the present invention are melted in the bonding process for electrically connecting the substrate and the semiconductor element.
• the softening point of the polymer constituting component (A) is not particularly limited as long as the scavenging composition or the scavenging sheet melts in the bonding step.
• the amount of (B) water-soluble plasticizer relative to the content of (A) water-soluble adhesive in the capture composition or capture sheet may be reduced.
• the softening point of the polymer constituting component (A) will be (A)
• the temperature is preferably 200°C or lower, more preferably 150°C or lower, and 100°C or lower. The following is more preferable, and 80° C. or less is even more preferable.
• the softening point of the polymer constituting component (A) is preferably 40°C or higher, and 100°C or higher, from the viewpoint that it can be formed into a sheet even if it contains a large amount of (B) water-soluble plasticizer.
• the temperature is more preferably 150°C or higher, even more preferably 200°C or higher.
• the solubility of the polymer constituting component (A) is not particularly limited as long as it can be washed with water.
• the solubility of the polymer constituting component (A) in water at 90° C. is preferably 0.05 g/g-H 2 O or more, more preferably 0.10 g/g-H 2 O or more, and 0.05 g/g-H 2 O or more. More preferably 30 g/g-H 2 O or more. Note that a concentration of 0.05 g/g-H 2 O or more is preferable because cleaning can be performed in a short time even at room temperature and cleaning residue can be eliminated or extremely reduced.
• component (A) exceeds, for example, 1.0 ⁇ 10 6 , it will take a long time to dissolve in water during washing, and washing residues are likely to be generated. Therefore, from the viewpoint of shortening the washing time and reducing washing residue, it is preferable to decompose component (A) into a lower molecular weight to improve the dissolution rate.
• component (A) is a natural polymer
• various known hydrolases can be used.
• component (A) contains a polymer of starch, ⁇ -glucose such as pullulan, or/and a derivative thereof
• hydrolytic enzymes such as amylase, glucoamylase, and prunase can be mentioned.
• a natural polymer containing a polymer of ⁇ -glucose and/or a derivative thereof such as carboxymethyl cellulose (CMC)
• cellulase and the like can be mentioned.
• protease can be mentioned.
• the weight average molecular weight Mw of the polymer constituting component (A) is preferably 1.0 ⁇ 10 4 or more, more preferably 5.0 ⁇ 10 4 or more, and 1.0 ⁇ More preferably 10 5 or more.
• the weight average molecular weight Mw of the polymer constituting component (A) is determined from the viewpoint of sinking of the semiconductor element into the trapping composition (or trapping sheet) due to softening of the water-soluble adhesive and water washability. It is preferably 1.0 ⁇ 10 6 or less, more preferably 8.0 ⁇ 10 5 or less, and even more preferably 4.0 ⁇ 10 5 or less.
• the molecular weight distribution Mw/Mn (here, Mn indicates the number average molecular weight) of the polymer constituting component (A) is not particularly limited.
• the lower limit of the molecular weight distribution Mw/Mn is preferably 1.5 or more, more preferably 1.8 or more.
• the upper limit of the molecular weight distribution Mw/Mn is preferably 30 or less, more preferably 15 or less, and even more preferably 8 or less.
• the vinyl alcohol polymer refers to a polymer having a hydroxyethylene repeating unit represented by the general formula (1).
• the structure represented by general formula (1) is also referred to as a vinyl alcohol repeating unit.
• the vinyl alcohol polymer may have a homopolymer structure in which the repeating unit consists only of vinyl alcohol repeating units, or may have a copolymer structure having other repeating units.
• a vinyl alcohol polymer with a homopolymer structure consisting only of vinyl alcohol repeating units will be simply referred to as a "homopolymer”
• a vinyl alcohol polymer with a copolymer structure having other repeating units will be simply referred to as " Also called "copolymer”.
• Vinyl alcohol-based polymers are generally produced by monopolymerizing or copolymerizing a monomer (e.g., vinyl acid) with a protected hydroxyl group of vinyl alcohol, and then undergoing modification (e.g., hydrolysis, etc.) to remove the protecting group. It is then manufactured. Therefore, examples of repeating units other than vinyl alcohol repeating units include units in which repeating units before modification remain.
• a monomer e.g., vinyl acid
• modification e.g., hydrolysis, etc.
• repeating units before modification examples include vinyl formate, vinyl acetate, vinyl propionate, vinyl butyrate, vinyl isobutyrate, vinyl pivalate, vinyl versatate, vinyl caproate, vinyl caprylate, vinyl laurate, vinyl palmitate, Included are repeating units derived from vinyl stearate, vinyl oleate, vinyl trifluoroacetate, vinyl benzoate, butyl vinyl ether and trimethylsilyl vinyl ether.
• a repeating unit in a vinyl alcohol polymer in a state in which the functional group before modification remains without being modified is also referred to as an "unmodified repeating unit."
• the number of remaining unmodified repeating units may be one or more.
• Vinyl alcohol polymers are generally produced by saponifying vinyl acetate polymers. For this reason, vinyl alcohol copolymerization in which a vinyl acetate polymer whose pre-modification repeating unit is derived from vinyl acetate, which is easily available, is modified is preferably used.
• solubility in water and adhesiveness are influenced by the degree of saponification and degree of polymerization.
• the degree of saponification in a vinyl alcohol polymer consisting of vinyl alcohol repeating units and unmodified repeating units is the ratio of the number of vinyl alcohol repeating units to the total number of repeating units ([number of vinyl alcohol repeating units]/ ⁇ [vinyl alcohol repeating units]). number of repeating units]+[number of unmodified repeating units] ⁇ ratio).
• the solubility of a vinyl alcohol polymer composed of vinyl alcohol repeating units and unmodified repeating units in water decreases whether the degree of saponification is too high or too low. Furthermore, even when the degree of polymerization is high, the solubility in water decreases. Therefore, in a vinyl alcohol polymer composed of unmodified repeating units, the degree of saponification and degree of polymerization are selected depending on the type of unmodified repeating units.
• the lower limit of the degree of saponification is preferably 30% or more, more preferably 40% or more, and even more preferably 50% or more.
• the upper limit of the degree of saponification is preferably 90% or less, more preferably 80% or less, and even more preferably 70% or less. If it is within the above range, it can be preferably used because it will not crystallize and become difficult to dissolve in water, or it will not become difficult to dissolve in water due to the lack of hydrophilic groups.
• the vinyl alcohol polymer can contain one or more types of repeating units other than vinyl alcohol repeating units and unmodified repeating units.
• repeating units other than vinyl alcohol repeating units and unmodified repeating units include ethylene, (meth)acrylic acid, maleic acid, vinylpyrrolidone, aminoalkyl esters of (meth)acrylic acid, and those represented by general formula (2).
• Examples include repeating units derived from monomers (for example, oxyethylene monoallyl ether and ethyl carbitol (meth)acrylate).
• repeating units other than vinyl alcohol repeating units and unmodified repeating units are also referred to as "third repeating units.”
• the degree of saponification can be measured by 1 H-NMR if there is a third repeating unit (oxyalkylene structure, etc.), or by JIS K6726 if there is no third repeating unit. .
• R 1 and R 3 independently represent a hydrogen atom or an organic group
• R 2 represents an ether bond, an ester bond, an amide bond, an alkylene having 1 to 6 carbon atoms, a composite group thereof, or a single bond.
• A represents an alkylene group having 2 to 22 carbon atoms.
• n represents an integer of 1 or more.
• R 1 in general formula (2) represents a hydrogen atom or an organic group having 1 to 20 carbon atoms, and the organic group naturally includes one or more of the following elements: O, N, S, Si, and P. May contain.
• the organic group for R1 include an alkyl group, an acyl group, an acyloxy group, an alkoxycarbonyl group, an alkyl ester group (acyloxy-substituted hydrocarbyl group and an alkoxycarbonyl-substituted hydrocarbyl group), an alkylamidoalkylene group, and a sulfonic acid group. can.
• alkyl group examples include methyl group, ethyl group, n-propyl group, i-propyl group, butyl group, pentyl group and hexyl group.
• acyl group examples include methylcarbonyl group, ethylcarbonyl group, n-propylcarbonyl group, i-propylcarbonyl group, butylcarbonyl group, pentylcarbonyl group and hexylcarbonyl group.
• alkyl ester group examples include methyloxycarbonylmethylene group, methylcarbonyloxymethylene group, ethyloxycarbonylethylene group, and ethylcarbonyloxyethylene group.
• alkylamidoalkylene group examples include N,N'-dimethylamidealkylene group and N,N'-diethylamidealkylene group.
• R 1 is preferably a hydrogen atom or an alkyl group, acyl group, alkyl ester group or alkylamidoalkylene group having 1 to 10 carbon atoms, more preferably a hydrogen atom or a methyl group, and even more preferably a hydrogen atom. It is preferable that R 1 is a hydrogen atom because the glass transition temperature of the polymer can be lowered.
• R 2 in general formula (2) is an ether bond (-O-), an ester bond (-COO-, -OCO-), an amide bond (-NHCO-, -OCNH-), an alkylene having 1 to 6 carbon atoms, or Represents these composite groups or single bonds.
• R 3 in general formula (2) represents a hydrogen atom or an organic group having 1 to 20 carbon atoms, and the organic group is naturally one or more of the following elements: O, N, S, Si, and P. May contain.
• the organic group for R3 include an alkyl group, an acyl group, an alkoxycarbonyl group, an alkyl ester group (acyloxy-substituted hydrocarbyl group and an alkoxycarbonyl-substituted hydrocarbyl group), an alkylamide group, an alkylamidoalkylene group, and a sulfonic acid group. I can do it.
• alkyl group examples include methyl group, ethyl group, n-propyl group, i-propyl group, butyl group, pentyl group and hexyl group.
• acyl group examples include methylcarbonyl group, ethylcarbonyl group, n-propylcarbonyl group, i-propylcarbonyl group, butylcarbonyl group, pentylcarbonyl group and hexylcarbonyl group.
• alkyl ester group examples include methyloxycarbonylmethylene group, methylcarbonyloxymethylene group, ethyloxycarbonylethylene group, and ethylcarbonyloxyethylene group.
• alkylamidoalkylene group examples include N,N'-dimethylamidealkylene group and N,N'-diethylamidealkylene group.
• R 3 is preferably a hydrogen atom or an alkyl group, acyl group, alkyl ester group or alkylamidoalkylene group having 1 to 10 carbon atoms, and more preferably a hydrogen atom or a methyl group.
• a in general formula (2) represents a linear or branched alkylene group having 2 to 22 carbon atoms.
• n is 2 or more, the plural A's may be the same or different.
• the carbon number of A in general formula (2) is preferably 10 or less, more preferably 4 or less, even more preferably 3 or less, and particularly preferably 2.
• Examples of A in general formula (2) include dimethylene (ethylene), trimethylene, methylethylene, tetramethylene, 1-methylpropylene, 2-methylpropylene, and 1-ethylethylene.
• an oxyalkylene group that acts as a hydrophobic group and has a small number of carbon atoms is more hydrophilic than an oxyalkylene group that has a large number of carbon atoms. Therefore, in the general formula (2), the oxyalkylene structure represented by "AO" is most preferably an oxyethylene structure.
• the repeating number n in general formula (2) represents the number of oxyalkylene structures represented by "AO" which is a hydrophilic group. Therefore, in general, as the number of n increases, the hydrophilicity of the repeating unit represented by general formula (2) improves. Therefore, the lower limit of the number of repetitions n in general formula (2) is preferably 2 or more, more preferably 5 or more, and even more preferably 6 or more. Further, the upper limit of the number of repetitions n in general formula (2) is preferably 300 or less, more preferably 200 or less, even more preferably 65 or less, and particularly preferably 20 or less. By setting the number n of repeating units of the oxyalkylene group within the above range, the solubility in low-temperature water can be improved, and the adhesiveness can also be improved.
• the content of the third repeating unit is not particularly limited as long as the vinyl alcohol polymer exhibits tackiness and adhesiveness (pressure-sensitive adhesiveness) and can be dissolved in water. Therefore, the proportion of the third repeating unit is selected from the viewpoints of tackiness, adhesiveness (pressure-sensitive adhesiveness), and water solubility depending on the type of the third repeating unit.
• the ratio of the third repeating unit in the vinyl alcohol polymer (“third repeating unit” x 100/"vinyl alcohol repeating unit” + "unmodified repeating unit” + “third repeating unit") is:
• the content is preferably 0.5 mol% or more, more preferably 3.0 mol% or more, and even more preferably 5.0 mol% or more.
• the proportion of the third repeating unit in the vinyl alcohol polymer is preferably 20 mol% or less, more preferably 10 mol% or less, and even more preferably 5 mol% or less. If it is 20 mol % or less, it can be preferably used because the sheet formability is good.
• the content ratio of vinyl alcohol repeating units in the vinyl alcohol polymer is not particularly limited as long as the vinyl alcohol polymer exhibits adhesiveness (pressure-sensitive adhesiveness) and can be dissolved in water.
• the proportion of vinyl alcohol repeating units in the vinyl alcohol polymer is preferably 20 mol% or more, more preferably 30 mol% or more, and even more preferably 40 mol% or more. If it is 20 mol% or more, it is preferable because adhesiveness is good.
• the proportion of vinyl alcohol repeating units in the vinyl alcohol polymer is preferably 90 mol% or less, more preferably 80 mol% or less, and even more preferably 60 mol% or less. If it is 90 mol% or less, it is preferable because adhesiveness is good.
• polymers containing repeating units derived from monomers having a (poly)oxyalkylene structure have improved water solubility. Therefore, as the third repeating unit, a repeating unit derived from a monomer having a (poly)oxyalkylene structure is preferable.
• the third repeating unit is water-soluble, the water solubility of the vinyl alcohol polymer can be improved without depending on the vinyl alcohol repeating unit. Therefore, from the viewpoint of solubility in water, the degree of saponification of the vinyl alcohol polymer can be lowered compared to the degree of saponification of a vinyl alcohol polymer that does not contain the third repeating unit. Furthermore, as a result of lowering the proportion of crystalline vinyl alcohol repeating units, the glass transition temperature of the vinyl alcohol copolymer can be lowered, and the tackiness and adhesiveness can be improved. Therefore, the third repeating unit is more preferably a repeating unit derived from a monomer having a (poly)oxyalkylene structure, and even more preferably a repeating unit represented by general formula (2).
• the vinyl alcohol homopolymer or vinyl alcohol copolymer may have a structure represented by general formula (3) at at least one end of the polymer.
• R 4 represents an ether bond, an ester bond, an amide bond, an alkylene having 1 to 6 carbon atoms, or a composite group thereof or a single bond
• R 5 and R 6 independently represent a hydrogen atom or a carbon
• R 7 represents a hydrogen atom or an organic group having 1 to 20 carbon atoms.
• m represents an integer of 1 or more.
• R 4 , R 7 and m in general formula (3) are as described for R 2 , R 3 and n in general formula (2), respectively.
• R 5 and R 6 are independently a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and when m is 2 or more, R 5 or R 6 may be the same or different. You can leave it there. Examples of the alkyl group in R 5 and R 6 include methyl group, ethyl group, n-propyl group, i-propyl group, butyl group, pentyl group and hexyl group.
• a hydrogen atom is preferred from the viewpoint of improving the water solubility of the vinyl alcohol polymer.
• the vinyl alcohol polymer is a single polymer selected from vinyl alcohol homopolymers, vinyl alcohol copolymers, and vinyl alcohol polymers having a structure represented by the general formula (3) at least at one end. or two or more types may be used. In addition, when two or more types are used, two or more types selected from vinyl alcohol copolymers, or two or more types selected from vinyl alcohol copolymers having a structure represented by general formula (3) at least at one terminal. may also be used.
• the vinylpyrrolidone polymer refers to a polymer having a structure represented by general formula (4) as a main repeating unit.
• the vinyl pyrrolidone polymer may be a vinyl pyrrolidone homopolymer or a copolymer.
• copolymerization components include ethylene, (meth)acrylic acid, maleic acid, vinylpyrrolidone, aminoalkyl esters of (meth)acrylic acid, and monomers represented by general formula (2) (for example, oxyethylene monoallyl). ether, ethyl carbitol (meth)acrylate, etc.).
• the proportion of copolymerized components in the vinylpyrrolidone polymer is preferably 30 mol% or less, more preferably 10 mol% or less, even more preferably 5 mol% or less. If it is 30 mol % or less, it is preferable because it does not inhibit the formation of strong hydrogen bonds with water accompanied by heat generation and has good solubility in water. Note that vinylpyrrolidone is particularly useful and preferred because it is easily available and has excellent water solubility and adhesiveness.
• the acrylic polymer refers to a polymer having a structure obtained by addition polymerization of a monomer having a (meth)acryloyloxy structure as a main repeating unit.
• Water-soluble acrylic polymers include hydroxyl groups, carboxyl groups (including salts of carboxyl groups, such as functional groups such as sodium carboxylate and ammonium carboxylate), and oxyalkylene groups (for example, oxyethylene structures or oxypropylene structures). structure, etc.) or an amino group (including salts of amino groups, such as functional groups such as ammonium hydrochloride and ammonium sulfate). It is more preferable for the acrylic polymer to have a hydroxyl group or an oxyalkylene group, since this improves water solubility.
• the acrylic polymer used in the present invention has adhesiveness (pressure-sensitive adhesiveness) either alone or by containing a water-soluble plasticizer (B), the glass transition temperature is 120°C or lower.
• the temperature is preferably 80°C or lower, more preferably 50°C or lower.
• the method for measuring the glass transition temperature was based on JIS K6240 (DSC method).
• acrylic polymer examples include hydrophilic acrylic monomers (acrylic acid, carboxyethyl acrylate, hydroxyethyl acrylate, 2-(2-ethoxyethoxy)ethyl acrylate, polyoxyethylene acrylate, one or more selected from polyoxypropylene acrylate, polyoxyethylene polyoxypropylene acrylate, etc.) and alkyl acrylate esters (methyl acrylate, ethyl acrylate, propylene acrylate, butyl acrylate, acrylic acid 2-ethylhexyl, etc.), methacrylic acid monomers (methacrylic acid, methacrylic acid alkyl esters, methacrylic acid hydroxyalkyl esters, methacrylic acid poly(oxyalkylene), etc.), and one or more types selected from acrylonitrile. Examples include copolymers.
• the proportion of monomers other than the hydrophilic acrylic acid monomer in the acrylic polymer is not particularly limited as long as it is soluble in water and has a glass transition temperature of preferably 120° C. or lower.
• the proportion of the monomer is, for example, preferably 30 mol% or less, more preferably 10 mol% or less, and even more preferably 5 mol% or less.
• Acrylic polymers include, for example, hydrophilic acrylic acid monomers that induce homopolymers with low glass transition temperatures, and polar groups (carboxyl groups) that improve adhesion (pressure-sensitive adhesiveness) to metals. and hydroxyl group), etc., and (meth)acrylic acid alkyl esters are combined and copolymerized.
• saccharide refers to a polymer having the properties of the water-soluble adhesive described above.
• pullulan is a repeating unit represented by general formula (5)
• hydroxyethyl cellulose is a repeating unit represented by general formula (6)
• carboxymethyl cellulose is a repeating unit represented by general formula (7)
• starch. etc. can be mentioned.
• R 8 independently represents a hydrogen atom or a mono- or polyoxyalkylene group having a hydrogen atom at the end.
• R 9 independently represents a hydrogen atom, CH 2 COONa or CH 2 COONH 4.
• the water-soluble plasticizer that is component (B) acts as a plasticizer for component (A), and has the effect of making component (A), which is the main component of the scavenging composition and scavenging sheet of the present invention, more flexible. have This absorbs the impact when the semiconductor element separated from the transfer source substrate comes into contact with the capturing composition and capturing sheet of the present invention, and prevents damage to the semiconductor element and displacement due to rebound.
• the water-soluble plasticizer (B) is preferably in a liquid state at the time of capturing or bonding components in order to make component (A) more flexible. For example, it is preferably liquid at room temperature (25° C.).
• the water-soluble plasticizer (B) in the present invention is other than component (A).
• the water-soluble plasticizer (B) in the present invention contains water.
• the boiling point of the water-soluble plasticizer (B) is not particularly limited, but is, for example, 120°C or higher, preferably 150°C or higher, and more preferably 180°C or higher.
• the boiling point of the water-soluble plasticizer is 120°C or higher, it is difficult to evaporate during trapping, so the characteristics of the water-soluble adhesive composition for trapping parts and the water-soluble adhesive sheet for trapping parts of the present invention during trapping and bonding are It has the effect of being difficult to change.
• the water-soluble adhesive composition for capturing components and the water-soluble adhesive sheet for capturing components of the present invention are subjected to a bonding process that involves heating and/or pressure
• the water-soluble plasticizer is used during the bonding process.
• a plasticizer that is a liquid whose vapor pressure at a temperature of is less than atmospheric pressure is preferred. If the plasticizer is a liquid whose vapor pressure is less than atmospheric pressure at this temperature, evaporation will not occur, thus suppressing the formation of vapor bubbles (so-called "voids") in the scavenging composition and scavenging sheet. can do.
• the upper limit of the boiling point of the water-soluble plasticizer (B) is not particularly limited, but is, for example, 500° C. or lower.
• the solubility of the water-soluble plasticizer (B) in water is preferably 0.10 g/g-H 2 O or more, and 0.30 g/g- More preferably H 2 O or more, and even more preferably 0.50 g/g-H 2 O or more.
• the water-soluble plasticizer does not inhibit the meltability of component (A) in the bonding process and not only has excellent water solubility, but also has the property that the aqueous solution of the (B) water-soluble plasticizer has a low viscosity. It is preferable that there be.
• the water-soluble plasticizer (B) is preferably liquid at room temperature (25° C.).
• the upper limit of the viscosity of the water-soluble plasticizer (B) is preferably 50,000 mPa ⁇ s or less, more preferably 40,000 mPa ⁇ s or less, even more preferably 1,000 mPa ⁇ s or less, and 600 mPa ⁇ s or less at room temperature (25°C). Even more preferred.
• the lower limit is not particularly limited, but is preferably 0.8 mPa ⁇ s or more, more preferably 1.0 mPa ⁇ s or more.
• the molecular weight of the compound used as the water-soluble plasticizer (B) is preferably 5000 or less, more preferably 3000 or less, even more preferably 1000 or less, and 800 or less. is even more preferable, and 600 or less is particularly preferable.
• the molecular weight of a water-soluble plasticizer having a distribution in molecular weight means a weight average molecular weight.
• a water-soluble plasticizer is selected that does not impair the effects of the present invention due to a decrease in solvent solubility, meltability, and meltability due to reaction or interaction with component (A). For example, when component (A) and component (B) react to form a three-dimensional crosslinked structure, solvent solubility, meltability, and surface tension are impaired.
• the water-soluble plasticizer that is component (B) of the present invention is preferably a monohydric or polyhydric alcohol and an alkanolamine. Since these have multiple hydrophilic functional groups, they are excellent in water solubility.
• examples of the water-soluble plasticizer include glycerin, diglycerin, ethylene glycol, diethylene glycol, propane-1,2-diol, 1,3-propanediol, diethylene glycol monomethyl ether, ethanolamine, and triglycerin.
• examples include methanolamine and the like.
• examples of the polymeric water-soluble plasticizer include polyethylene glycol, terminal monoalkoxy polyethylene glycol, terminal dialkoxy polyethylene glycol, polyglycerin, propylene glycol, polypropylene glycol, and the like.
• the water-soluble plasticizer (B) is preferably glycerin, diglycerin, polyethylene glycol, polypropylene glycol, and triethanolamine.
• Glycerin, diglycerin, polyethylene glycol, polypropylene glycol and triethanolamine have excellent miscibility with water and high boiling points. This is because the capture sheet has excellent meltability and surface tension in the bonding process and excellent water washability in the cleaning process.
• Glycerin, diglycerin, polyethylene glycol and polypropylene glycol, which are easily available and easy to handle, are more preferred, and glycerin and polyethylene glycol are even more preferred.
• the ratio of the content of (B) water-soluble plasticizer to the content of (A) water-soluble adhesive is greater than 0.5 and 3.0 or less. As shown in the examples below, if this value is not met, sufficient shock absorption, adhesiveness and adhesion may not be obtained, and the handling properties during application and peeling may be poor.
• the trapping sheet of the present invention can contain water in an amount of 10% by mass or less based on the entire trapping sheet, within a range that does not impede the effects of the present invention.
• the scavenging composition and scavenging sheet of the present invention may contain other components within a range that does not impede the effects of the present invention.
• Other components include lubricants, antioxidants, antistatic agents, surfactants, heat stabilizers, rust preventives, surface conditioners (leveling agents), and the like.
• the scavenging composition and scavenging sheet of the present invention preferably do not contain a thermosetting resin. This is because the thermosetting resin hardens during the bonding process and may not be removed by washing with water or the like.
• the water-soluble adhesive composition for capturing parts of the present invention can be manufactured using a known manufacturing method. For example, it can be manufactured by using the raw materials shown in Tables 1 and 2, which will be described later, and kneading them using a mixer or the like.
• the water-soluble adhesive sheet for capturing components of the present invention can be manufactured using a known manufacturing method for manufacturing sheets containing adhesives. For example, it can be manufactured by forming a layer using the water-soluble adhesive composition for capturing components of the present invention on a prepared release sheet.
• the base material of the release sheet include polyester, polyolefin, and polyamide.
• the polyester include polyethylene terephthalate, polytetramethylene terephthalate, polyethylene naphthalate, and polytetramethylene terephthalate.
• Examples of the polyolefin include linear low density polyethylene, low density polyethylene, medium density polyethylene, and polypropylene.
• Examples of the polyamide include polycaprolactam, polyhexamethylene adipamide, polytetramethylene adipamide, polyhexamethylene isophthalamide, polyhexamethylene sebacamide, polyhexamethylene dodecamide, polyhexamethylene terephthalamide, and polynonamate. Examples include methylene terephthalamide, polydecamethylene terephthalamide, polyundecane lactam, polydodecane lactam, and polymethaxylylene adipamide.
• the release sheet may be subjected to a known release treatment on at least one side.
• a layer using the water-soluble adhesive composition for capturing components of the present invention may be formed on one or both sides of the release sheet.
• the method of providing a layer using the scavenging composition of the present invention is not particularly limited, and any known method can be used.
• it can be manufactured by dissolving or dispersing a composition containing all or part of the components constituting the capture sheet in a solvent and applying the composition to a release sheet.
• the solvent include water, organic solvents, and mixtures of water and organic solvents.
• organic solvents include methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, 2-methyl 1-propanol, 2-methyl 2-propanol, 1-pentanol, 2-pentanol, 3- Examples include pentanol, 2-methyl 1-butanol, 2-methyl 2-butanol, 3-methyl 1-butanol, 3-methyl 2-butanol, 2,2-dimethyl 1-propanol and the like.
• coating method There are no particular limitations on the coating method as long as it allows the layer formed using the scavenging composition of the present invention to have a uniform thickness.
• methods for forming a layer of uniform thickness include spin coating, blade coating, slit coating, and slot die coating.
• a liquid component for example, component (B)
• the drying temperature is 60 to 140°C, preferably 80 to 120°C.
• the water-soluble pressure-sensitive adhesive composition for capturing parts and the water-soluble pressure-sensitive adhesive sheet for capturing parts of the present invention can be used, for example, to manufacture electronic components having the following steps.
• the method of using the water-soluble pressure-sensitive adhesive sheet for capturing parts of the present invention will be mainly explained. Note that the following explanation regarding the method of using the water-soluble adhesive composition for capturing components (water-soluble adhesive sheet for capturing components) can be replaced with the explanation of the method for manufacturing the electronic component of the present invention.
• Step of placing the capture sheet (capture composition) of the present invention on the electrode surface side of the wiring board and bonding (coating) (2) On the capture sheet (capture composition) of the present invention (3) A bonding process to electrically bond the semiconductor element to the wiring board (4) A cleaning process to remove residue (5) A wiring board drying process
• the capturing sheet of the present invention is placed on the electrode surface side of the wiring board, and in the bonding step, the capturing sheet of the present invention formed on the release sheet is bonded to the wiring board.
• the capture sheet of the present invention includes a release sheet, the release sheet is peeled off.
• the electrode surface of the wiring board may be cleaned. Washing can be performed using an organic solvent, an acidic aqueous solution, a basic aqueous solution, or the like.
• the wiring substrate is not particularly limited as long as it has wiring, and examples thereof include a TFT backplane which is a glass substrate, an FR-4 glass epoxy substrate, a ceramic substrate, and a silicone wafer. Note that instead of the bonding step using the trapping sheet of the present invention, a step may be performed in which the trapping composition of the present invention is directly applied to the electrode surface side of the wiring board and dried.
• ⁇ (2) Capture process> In the process of capturing semiconductor elements on the capturing sheet of the present invention, components (elements) are placed at desired positions on the substrate. This capturing step may also serve as what is called a transfer step in semiconductor manufacturing. In the transfer step, the position of the semiconductor element on the wiring board is determined, and the semiconductor element is transferred from the substrate on which the semiconductor element is formed or the substrate temporarily holding the semiconductor element, which is the transfer source, onto the capturing sheet of the present invention, which is the transfer destination. This is the process of moving the Note that as the transfer process, a non-contact transfer process and a contact transfer process are known, but they are not particularly limited.
• FIG. 1 a non-contact transfer process will be explained based on FIG. 1 as an example.
• the transfer process using the capture sheet of the present invention is not limited to the illustrated embodiment. Note that some parts of the drawings are enlarged or reduced in order to make the explanation easier to understand.
• the transfer destination substrate 1A shown in FIG. 1(a) manufactured in the above (1) bonding step the surface opposite to the surface of the water-soluble adhesive sheet 11A for capturing parts of the present invention bonded to the wiring board 12A. and the surface of the transfer source substrate 2A having the semiconductor element 21A are placed facing each other with a gap therebetween.
• the transfer source substrate 2A shown in FIG. 1(a) has a semiconductor element 21A held on an adhesive layer 22A formed on one side of a holding substrate 23A that temporarily holds the element.
• an energy beam (laser etc.) Irradiate 3 As shown in FIG. 1(b), from the surface of the transfer source substrate 2A opposite to the surface on which the semiconductor elements 21A are formed, an energy beam (laser etc.) Irradiate 3. By irradiating the energy beam (laser etc.) 3, the semiconductor element 21A is separated from the transfer source substrate 2A as shown in FIG. Transcribe.
• a transfer source substrate 2B including a holding substrate 23B on which a semiconductor element 21B different from the semiconductor element 21A is temporarily held is placed on the transfer destination substrate 1A as desired. move to the desired position. After the movement, as shown in FIGS. 1(e) and 1(f), the process related to (ii) above is repeated.
• the holding substrates 23A and 23B in the transfer source substrates 2A and 2B may be made of, for example, a sapphire substrate, quartz glass, glass, or plastic.
• the separation between the holding substrate 23A and the semiconductor element 21A and the separation between the holding substrate 23B and the semiconductor element 21B are achieved by, for example, decomposing (and (foaming), agglomeration, or softening/melting. Therefore, in order to make the adhesive layers 22A and 22B efficiently absorb the energy of the energy rays (laser etc.) 3, it is preferable that the holding substrates 23A and 23B transmit the energy rays 3 or have low absorption. .
• the components constituting the adhesive layers 22A and 22B on the transfer source substrates 2A and 2B include an adhesive component.
• the adhesive component include silicone, acrylic polymer, polyvinyl alcohol polymer, and vinylpyrrolidone polymer.
• the components constituting the adhesive layers 22A and 22B may include a component that foams or a crosslinking component that promotes aggregation by the energy beam (laser) 3.
• An example of the energy beam 3 is a laser.
• lasers include excimer lasers and harmonic YAG lasers.
• a contact transfer process will be described as another form of the transfer process based on FIG. 2.
• This embodiment is the same as the non-contact transfer process except that the semiconductor element on the holding substrate that temporarily holds the element is brought into contact with the capturing sheet of the present invention on the substrate for transfer. Therefore, the following (i) to (iv) will be explained, and the explanation of other contents common to the non-contact transfer process will be omitted.
• an energy beam (laser etc.) Irradiate 3 As shown in FIG. 2(c), from the surface of the transfer source substrate 2C opposite to the surface on which the semiconductor elements 21C are formed, an energy beam (laser etc.) Irradiate 3. By irradiating the energy beam (laser etc.) 3, the semiconductor element 21C is separated from the transfer source substrate 2C, which is the transfer source, as shown in FIG. Glue and transfer.
• All the semiconductor elements formed on the holding substrate in the above non-contact transfer process or contact transfer process may be irradiated with an energy beam (laser) to transfer the semiconductor elements at once. Further, in (iii) in the non-contact transfer step or contact transfer step, the transfer destination substrates 1A and 1B may be moved instead of or together with the holding substrates (23B and 23D). good.
• an energy beam laser
• the element forming substrate is used instead of or together with the transfer source substrates (2A, 2B, 2C, and 2D) in the non-contact transfer process or the contact transfer process.
• the element forming substrate includes one in which a laminate having various layers such as a conductive layer is formed on a sapphire substrate, and a semiconductor crystal is grown on this laminate to form a light emitting diode.
• the crystal is irradiated with a laser through the sapphire substrate, the surface of the layer at the interface with the sapphire substrate decomposes, making it possible to separate the light-emitting diodes.
• the bonding step of electrically bonding the element to the wiring board heating and/or pressure is applied to soften or melt the capturing composition and capturing sheet of the present invention.
• the element and the wiring board are electrically bonded by softening or melting the trapping composition of the present invention and the trapping sheet that were between the element and the wiring board.
• the temperature in the bonding step is selected depending on the characteristics of the resin and solder, and is, for example, 150° C. or 160° C., and may be heated in multiple stages. Further, the maximum temperature of the bonding step is selected depending on the heat resistance of the semiconductor element, etc., and is preferably 260°C or lower, more preferably 240°C or lower, and even more preferably 230°C or lower.
• the scavenging composition and scavenging sheet of the present invention remain after the bonding process. Therefore, the residue is removed by washing.
• water from which ions have been removed (ultra-pure water, ion-exchanged water, distilled water, etc.) may be used, or a mixture of a water-soluble organic solvent and water may be used, but these methods have a low environmental impact. From the viewpoint of easy availability, only water from which ions have been removed is preferred.
• water from which ions have been removed and a mixture of water and a water-soluble organic solvent will also be referred to as "water etc.”
• An additive that hydrolyzes the water-soluble adhesive may be added to the water or the like.
• Examples include hydrolytic enzymes such as amylase, glucoamylase, prunase, cellulase, and protease. When using the hydrolytic enzyme, it is preferable to wash at the optimal pH and temperature range that produces high enzyme activity. Depending on the enzyme, additives such as Ca 2+ may be added to further enhance the enzyme activity. You can also do that.
• water-soluble organic solvents include alcohols and ketones, but alcohol is preferred. When using water-soluble organic solvents, they may be used alone or in combination of two or more. Examples of alcohols include methanol, ethanol, n-propanol, n-butanol, etc., and examples of ketones include acetone, methyl ethyl ketone, etc.
• a mixture of ion-free water and a water-soluble organic solvent may be used, and the mixing ratio is not particularly limited, but from the viewpoint of reducing environmental load, it is preferable that the ratio of the water-soluble organic solvent is low.
• a surfactant may be added to the water etc. as an additive for the purpose of improving the intrusion of water etc. into narrow gaps.
• other additives that improve cleaning performance may be added.
• the temperature of the water used is selected depending on the solubility of component (A) and component (B).
• the temperature of water used in washing is preferably 10°C or higher, more preferably 20°C or higher, and even more preferably 30°C or higher. If it is 10°C or higher, it is preferable because there is a tendency for there to be no or less residue after washing.
• the temperature of water used in washing is preferably 80°C or lower, more preferably 70°C or lower, and even more preferably 60°C or lower. If it is 80° C. or lower, it is preferable because energy consumption is low and environmental impact is low.
• each enzyme has an optimal temperature range in which its activity is high, so it is preferable to wash at the above temperature.
• the drying process for wiring boards can be done by dehydrating using centrifugal force (spin dryer) or by using highly evaporative and water-miscible organic solvents (isopropanol, etc.) and washing them with the organic solvent and then drying them. good.
• the drying temperature can be appropriately designed depending on the boiling point of the solvent, etc.
• Measurement method (1) Composition calculation of capture sheet In the capture sheets in Tables 3 and 4, the amount of water contained in the capture sheets was measured by the Karl Fischer method. In addition, (A) water-soluble adhesive and (B) water-soluble plasticizer are assumed to not be removed from the system by evaporation etc. during the drying process of manufacturing the capture sheet, and solvents other than water are not removed from the system. The composition was calculated assuming that all of (2) Measurement of viscosity Viscosity was measured using a rotational viscometer (TVE-25H model viscometer manufactured by Toki Sangyo Co., Ltd.) for a sample at 25°C.
• a rotational viscometer (TVE-25H model viscometer manufactured by Toki Sangyo Co., Ltd.) for a sample at 25°C.
• the rotation speeds are 1 rpm (polyglycerin), 50 rpm (glycerin, PEG600, PPG3000), and 100 rpm (diethylene glycol, ethylene glycol, propylene glycol, PEG400, diethylene glycol monomethyl ether).
• Evaluation method (1) Evaluation method of adhesive strength Glass plate (As One, product name: slide glass, thickness 1.0 to 1.2 mm, weight 5 g) and water-soluble adhesive sheet for capturing parts (thickness 5 ⁇ m) The polyethylene terephthalate film was peeled off after being pressed against the film using a roller at room temperature (25°C). The bottom of a cylindrical glass tube with a diameter of 10 mm was pressed against the center of the glass plate to which the capture sheet was attached, and the tube was lifted by hand. Then, the time required for the capture sheet to separate from the bottom of the glass tube and for the glass plate to fall was measured. ⁇ : Did not fall for 41 seconds or more. ⁇ : Fell within 21 to 40 seconds. ⁇ : Fell within 20 seconds.
• both the adhesive force and tackiness described above are for evaluating the capturing ability of the water-soluble pressure-sensitive adhesive sheet for capturing parts.
• Tables 1 and 2 show the components and proportions of the raw materials (water-soluble adhesive compositions for capturing parts) used to manufacture the sheets of Examples and Comparative Examples.
• Tables 3 and 4 show the ratio and evaluation results based on the mass of each component of the sheet (water-soluble adhesive sheet for capturing parts) manufactured using the raw material (water-soluble adhesive composition for capturing parts).
• Example 1 Manufacture of capture sheet
• 50 parts by mass of polyvinylpyrrolidone (Daiichi Kogyo Seiyaku Co., Ltd., K-30) and 35 parts by mass of polyethylene glycol (manufactured by NOF Corporation, PEG #400) were dissolved in 350 parts by mass of ion-exchanged water to obtain a polyvinylpyrrolidone solution.
• Ta A polyvinylpyrrolidone solution was applied to a release-treated polyethylene terephthalate film (manufactured by Lintec Corporation, 6502) using an applicator. It was dried at 100°C to obtain a capture sheet having a thickness of 5 ⁇ m. Note that the temperature during drying in the following Examples and Comparative Examples is 100° C. when the solvent is ion-exchanged water or ethanol, and 120° C. when the solvent is 1-butanol.
• Example 2 Manufacture of capture sheet
• a polyvinylpyrrolidone solution in which 50 parts by mass of polyvinylpyrrolidone (Daiichi Kogyo Seiyaku Co., Ltd., K-50) and 45 parts by mass of diethylene glycol were dissolved in 350 parts by mass of ethanol was used.
• a capture sheet was obtained in the same manner.
• Example 3 Manufacture of capture sheet
• a polyvinylpyrrolidone solution in which 50 parts by mass of polyvinylpyrrolidone (Nippon Shokubai Co., Ltd., K-85N) and 60 parts by mass of ethylene glycol were dissolved in 350 parts by mass of 1-butanol was used.
• a capture sheet was obtained in the same manner.
• Example 4 Manufacture of capture sheet
• 50 parts by mass of polyvinylpyrrolidone (Nippon Shokubai Co., Ltd., K-85N) and 70 parts by mass of polyethylene glycol (manufactured by NOF Corporation, PEG #400) were dissolved in 350 parts by mass of ethanol.
• a trapping sheet was obtained in the same manner, except that the polyvinylpyrrolidone solution was used.
• Example 5 Manufacture of capture sheet
• 50 parts by mass of polyvinylpyrrolidone Nippon Shokubai Co., Ltd., K-85N
• 80 parts by mass of polyethylene glycol Fuji Film Wako Pure Chemical Industries, Ltd., PEG #600
• 1-butanol A trapping sheet was obtained in the same manner except that a polyvinylpyrrolidone solution dissolved in 350 parts by mass was used.
• Example 6 Manufacture of capture sheet
• 50 parts by mass of polyvinylpyrrolidone Nippon Shokubai Co., Ltd., K-85N
• 90 parts by mass of polypropylene glycol Fuji Film Wako Pure Chemical Industries, Ltd., PPG #3000
• 1-butanol A trapping sheet was obtained in the same manner except that a polyvinylpyrrolidone solution dissolved in 350 parts by mass was used.
• Example 7 Manufacture of capture sheet
• a polyvinylpyrrolidone solution in which 50 parts by mass of polyvinylpyrrolidone (Nippon Shokubai Co., Ltd., K-85N) and 110 parts by mass of propylene glycol were dissolved in 350 parts by mass of 1-butanol was used.
• a capture sheet was obtained in the same manner.
• Example 8 Manufacture of capture sheet
• 50 parts by mass of polyvinylpyrrolidone (Nippon Shokubai Co., Ltd., K-90N) and 130 parts by mass of polyglycerin (manufactured by Daicel Corporation, PLG 20PW) were dissolved in 350 parts by mass of ethanol.
• a trapping sheet was obtained in the same manner except that a polyvinylpyrrolidone solution was used.
• Example 9 Manufacture of capture sheet
• 50 parts by mass of polyvinylpyrrolidone (Nippon Shokubai Co., Ltd., K-90N) and 140 parts by mass of polyglycerin (manufactured by Daicel Corporation, PLG 20PW) were dissolved in 350 parts by mass of ethanol.
• a trapping sheet was obtained in the same manner except that a polyvinylpyrrolidone solution was used.
• Example 10 Manufacture of capture sheet
• polyvinylpyrrolidone solution in Example 1 50 parts by mass of polyvinyl alcohol (manufactured by Nippon Gosei Kagaku Kogyo Co., Ltd., GOHSENOL (registered trademark) GR-14), 40 parts by mass of diethylene glycol monomethyl ether, and 350 parts by mass of ion-exchanged water.
• a trapping sheet was obtained in the same manner except that a dissolved polyvinyl alcohol solution was used.
• Example 11 Manufacture of capture sheet
• a polyacrylic acid solution in which 50 parts by mass of polyacrylic acid (manufactured by Nippon Shokubai Co., Ltd., AS-58) and 100 parts by mass of glycerin were dissolved in 350 parts by mass of ion-exchanged water was used.
• a capture sheet was obtained in the same manner except that
• Example 12 Manufacture of capture sheet
• pullulan manufactured by Hayashibara Co., Ltd.
• polyethylene glycol Fuji Film Wako Pure Chemical Industries, Ltd., PEG #600
• 20 parts by mass of glycerin 20 parts by mass of glycerin
• 350 parts by mass of ethanol 50 parts by mass of ethanol.
• a trapping sheet was obtained in the same manner except that a pullulan solution dissolved in the same amount was used.
• Example 13 Manufacture of capture sheet
• polyvinylpyrrolidone solution in Example 1 30 parts by mass of polyvinylpyrrolidone (K-85N, manufactured by Nippon Shokubai Co., Ltd.) and 20 parts by mass of polyvinyl alcohol (Gosenol (registered trademark) GR-14, manufactured by Nippon Gosei Kagaku Kogyo Co., Ltd.)
• a trapping sheet was obtained in the same manner except that a mixed solution of 90 parts by mass of glycerin dissolved in 100 parts by mass of ion-exchanged water and 250 parts by mass of 1-butanol was used.
• Example 1 instead of the polyvinylpyrrolidone solution in Example 1, 50 parts by mass of polyvinylpyrrolidone (Daiichi Kogyo Seiyaku Co., Ltd., K-30), 25 parts by mass of polyethylene glycol (manufactured by NOF Corporation, PEG #400), and 350 parts by mass of ethanol. A comparative sheet was obtained in the same manner except that a polyvinylpyrrolidone solution dissolved in .
• Example 2 Same as Example 1 except that instead of the polyvinylpyrrolidone solution in Example 1, a polyvinylpyrrolidone solution in which 50 parts by mass of polyvinylpyrrolidone (Nippon Shokubai Co., Ltd., K-90N) and 160 parts by mass of polyglycerin were dissolved in 350 parts by mass of ethanol was used. A comparison sheet was obtained.
• the weight average molecular weight Mw of the water-soluble adhesive used as component (A) in Examples and Comparative Examples is as follows. ⁇ Polyvinylpyrrolidone K-30 45,000, K-50 250,000, K-85N 340,000, K-90N 360,000 ⁇ Polyvinyl alcohol (GR-14) 29,000 ⁇ Polyacrylic acid (AS-58) 800,000 ⁇ Pullulan 200,000
• PEG Polyethylene glycol
• PPG Polypropylene glycol
• the water-soluble adhesive composition for capturing parts and the water-soluble adhesive sheet for capturing parts of the present invention can be suitably used as a composition for capturing parts and a sheet for capturing parts.
• it is suitably used as a member when arranging semiconductor elements on a substrate in the manufacture of electronic components.
• the electronic component manufacturing method of the present invention can easily capture components (semiconductor elements, etc.) at desired positions on a substrate, and is suitably used as a manufacturing method that allows highly accurate and efficient manufacturing.
• 1A, 1B Transfer destination board, 11A, 11B... Water-soluble adhesive sheet for capturing parts, 12A, 12B... Wiring board, 2A, 2B, 2C, 2D... Transfer source board, 21A, 21B, 21C, 21D... Semiconductor element, 22A, 22B, 22C, 22D... Adhesive layer, 23A, 23B, 23C, 23D... Holding substrate, 3... Energy beam

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