WO2023232132A1 - 晶圆处理装置和晶圆处理方法 - Google Patents

晶圆处理装置和晶圆处理方法 Download PDF

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Publication number
WO2023232132A1
WO2023232132A1 PCT/CN2023/097929 CN2023097929W WO2023232132A1 WO 2023232132 A1 WO2023232132 A1 WO 2023232132A1 CN 2023097929 W CN2023097929 W CN 2023097929W WO 2023232132 A1 WO2023232132 A1 WO 2023232132A1
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Prior art keywords
wafer
grating plate
imaging element
light source
light
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PCT/CN2023/097929
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English (en)
French (fr)
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徐振华
张亮
葛晓景
罗丛德
王建军
牛奔
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华为技术有限公司
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Publication of WO2023232132A1 publication Critical patent/WO2023232132A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Definitions

  • Embodiments of the present disclosure relate generally to the field of wafer processing equipment, and specifically to wafer processing devices and wafer processing methods.
  • wafer edge etching technology was developed to etch away a certain area of the wafer edge, thereby improving product yield during the process.
  • the wafer rotates together with the wafer stage, and the edge of the wafer is etched by the edge etching nozzle.
  • the alignment between the wafer and the wafer stage becomes very important.
  • Embodiments of the present disclosure are intended to provide a wafer processing apparatus and method to solve the aforementioned or other potential technical problems.
  • the wafer processing apparatus and the wafer processing method according to the embodiments of the present disclosure can improve the alignment accuracy of the wafer and the wafer stage, thereby improving the yield of the wafer, and can also improve the wafer and the wafer stage. Alignment efficiency to improve throughput of wafer processing equipment.
  • a first aspect of the present disclosure provides a wafer processing apparatus.
  • the wafer handling device includes: a wafer stage that can rotate along a rotation axis; a robotic arm including a robot hand for handling the wafer and placing the wafer on the wafer stage; a controller; and a calibration component , including: a grating plate, fixed relative to the wafer stage; a light source, fixed relative to the grating plate; and an imaging element, fixedly provided on the mechanical arm, and adapted to receive light emitted from the light source and transmitted through Light from the grating plate; wherein the controller is configured to control the robotic arm or an adjustment device on the robotic arm to adjust the position of the wafer based on detection of the received light by the imaging element; wherein the wafer is carried on the wafer stage
  • the grating plate and the imaging element are respectively located on opposite sides of the plane where the upper surface of the wafer stage is located, and the upper surface is used to carry the wafer.
  • the calibration component can be used to determine whether the wafer and the wafer stage rotation axis are aligned, and during the alignment process, the wafer stage and the wafer do not need to be rotated, and a robotic arm or a robotic arm is used.
  • the adjustment device on the wafer can complete the position adjustment of the wafer, so the alignment between the wafer and the wafer stage is faster and more efficient.
  • the use of optical elements (grating plates) to achieve alignment can improve the alignment accuracy of the wafer and the wafer stage. Therefore, the wafer processing apparatus of the present disclosure can achieve fast and efficient wafer alignment, with high throughput rate and high product yield.
  • the edge of the wafer is located between the grating plate and the imaging element, so that a portion of the light emitted by the light source is blocked by the wafer, and another portion of the light emitted by the light source is blocked. A portion is incident on the imaging element.
  • the edge position of the wafer can be sensed using the grating plate and imaging element, thereby determining whether the wafer is aligned with the rotation axis of the wafer stage, which helps to quickly and accurately align the wafer with the rotation axis of the wafer stage. allow.
  • the grating plate includes: at least one one-dimensional grating plate arranged along a first direction and at least one one-dimensional grating plate arranged along a second direction, the first direction being perpendicular to the second direction.
  • the wafer processing device includes a plurality of imaging elements, which are respectively arranged corresponding to the one-dimensional grating plates.
  • the grating plate includes at least one two-dimensional grating plate.
  • the structure of the calibration component can be further simplified by providing a two-position grating plate.
  • the imaging element includes a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS) element; with the wafer stage carrying the wafer, the light source, grating plate, wafer, and imaging element rotate along the The axis directions are arranged in sequence.
  • CCD charge coupled device
  • CMOS complementary metal oxide semiconductor
  • the sequential arrangement of the light source, grating plate, wafer and imaging element is conducive to quickly determining the edge position of the wafer to improve the efficiency of wafer alignment.
  • the adjustment device includes at least one adjustment element installed on the robotic arm.
  • the adjustment element includes a motor and a pushing part driven by the motor.
  • the pushing part is used to move the wafer.
  • the pushing portion when viewed along the direction of the rotation axis, does not overlap with the grating plate; or when viewed along the direction of the rotation axis, the pushing portion overlaps the grating plate, and the pushing portion is made of a light-transmitting material.
  • the pushing part does not affect the transmission of light to the imaging element.
  • the pushing part and the grating plate are aligned, the pushing part is made of a light-transmitting material, so that light can be transmitted to the imaging element.
  • the controller is configured to control the motor to move the pusher based on the light received by the imaging element, thereby adjusting the position of the wafer.
  • the position of the wafer can be adjusted to align with the center of the wafer stage.
  • the controller is configured to control the movement of the robotic arm to adjust the position of the wafer based on light received by the imaging element.
  • the wafer position is adjusted by movement of the robotic arm to align it with the wafer stage.
  • the wafer processing device further includes: a chamber to accommodate the wafer stage; and a nozzle disposed in the chamber for etching the edge of the wafer.
  • a wafer processing method includes the following steps: moving the robotic arm to place the wafer on the wafer carrier such that an edge of the wafer is located between the grating plate and the imaging element, wherein the imaging element is disposed on the robotic arm and the grating element is relative to the wafer carrier.
  • the stage is fixed; the light source fixed relative to the wafer stage is made to emit light toward the grating plate and the imaging element; part of the light emitted by the light source can be blocked by the wafer, and the other part of the light emitted by the light source is incident on the imaging element; utilizing the imaging element Receive light emitted from the light source and transmitted through the grating plate; determine based on the received light that the center of the wafer is misaligned with the rotation axis of the wafer stage; move the robotic arm or actuate an adjustment device on the robotic arm, to adjust the wafer position.
  • a wafer processing method can quickly and accurately align a wafer with a wafer stage, which improves device throughput and wafer yield.
  • the adjustment device includes at least one adjustment element provided on the robotic arm, and the adjustment element includes: a motor and a pushing part driven by the motor; the method further includes: determining that the center of the wafer is not aligned with the position of the rotation axis. When the accuracy is correct, the motor is controlled to move the pushing part to adjust the position of the wafer.
  • the method further includes: rotating the wafer stage to rotate the wafer synchronously; and etching an edge of the wafer.
  • Figure 1 shows a schematic diagram of a wafer processing apparatus according to some embodiments of the present disclosure
  • FIG. 2 shows a view of a partial structure of a wafer processing apparatus according to some embodiments of the present disclosure, in which a robotic arm and a calibration component are mainly shown;
  • FIG. 3 shows a schematic diagram of a robot hand on a robot arm for handling wafers according to some embodiments of the present disclosure
  • Figure 4 shows a schematic diagram of an adjustment element on a robotic arm according to some embodiments of the present disclosure
  • Figure 5 shows a schematic layout of the grating plate, wafer, wafer stage and adjustment elements of the wafer processing device during the alignment process
  • Figure 6 shows a schematic layout of the grating plate, wafer and wafer stage of the wafer processing device during the alignment process
  • FIG. 7 shows a schematic layout of a grating plate, a wafer, and a wafer stage of a wafer processing apparatus during an alignment process
  • FIG. 8 illustrates a flowchart of a wafer processing method according to an embodiment of the present disclosure.
  • the term “include” and its variations mean an open inclusion, ie, "including but not limited to.” Unless otherwise stated, the term “or” means “and/or”. The term “based on” means “based at least in part on.” The terms “one example embodiment” and “an embodiment” mean “at least one example embodiment.” The term “another embodiment” means “at least one additional embodiment”. The terms “first,” “second,” etc. may refer to different or the same object. Other explicit and implicit definitions may be included below.
  • Embodiments of the present disclosure provide a wafer processing device and method, which can improve the alignment accuracy and efficiency of the rotation axis of the wafer and the wafer stage, and improve the throughput rate of the wafer processing device.
  • Figure 1 shows a schematic diagram of a wafer processing apparatus according to some embodiments of the present disclosure.
  • the wafer processing device may include four areas from left to right: wafer supply area 1, index transfer area 2, relay area 3, and wafer processing area 4.
  • a plurality of wafers 40 are transported on the wafer supply area 1 .
  • a transfer robot 101 is provided in the index transfer area 2, which is used to transfer the required wafers 40 to the wafer storage equipment 102 in the relay area 3 according to instructions.
  • the wafer processing area 4 is provided with one or more wafer processing chambers 103 (four chambers 103 are shown in the figure).
  • Each wafer processing chamber 103 includes a wafer stage 30 and a grating plate 22 and light source 21 (not shown in the figure).
  • a robotic arm 10 is also provided in the wafer processing area 4.
  • the robotic arm 10 is used to grab the wafer 40 from the wafer storage equipment 102 and transport the wafer 40 to the wafer stage 30 in the designated chamber 103 for processing.
  • the robot arm 10 is provided with a robot arm 110 for transporting wafers and an optional adjustment element 11 .
  • FIG. 2 illustrates a partial structural view of a wafer processing apparatus according to some embodiments of the present disclosure, in which a robotic arm and a calibration component are mainly shown.
  • a wafer processing apparatus includes a wafer stage 30 , a robotic arm 10 and a calibration component.
  • the robot arm 10 includes a robot arm 110 for transporting the wafer, and is used for placing the wafer 40 on the wafer stage 30 .
  • 3 shows a schematic diagram of a robot hand on a robot arm for handling wafers according to some embodiments of the present disclosure.
  • Figure 3 shows a robot for holding wafers. It should be understood that this disclosure is not intended to limit the specific form of the robot, and other forms of handling robots are also possible, such as suction cup type robots.
  • Wafer stage 30 rotatably supports wafer 40 and has a rotation axis X.
  • the wafer stage 30 drives the wafer 40 to rotate around the rotation axis X.
  • a nozzle may also be disposed within the chamber 103 to etch the edge of the wafer 40 .
  • the calibration assembly is capable of aligning the center of the wafer 40 with the rotation axis X of the wafer stage 30 . In this way, as the wafer stage 30 drives the wafer 40 to rotate, it can be ensured that the roundness of the wafer 40 meets the requirements of the finished product.
  • roundness of wafer 40 means how close a shape drawn along the edge of wafer 40 is to an ideal circle. The higher the roundness of the wafer 40 , the closer the shape drawn along the edge of the wafer 40 is to an ideal circle.
  • the calibration assembly includes a grating plate 22 fixed relative to the wafer stage 30 , a light source 21 fixed relative to the grating plate 22 , and an imaging element 23 fixedly disposed on the robotic arm 10 .
  • the imaging element 23 receives the light emitted from the light source 21 and incident on the imaging element 23 through the grating plate 22 .
  • the wafer 40 is placed on the wafer stage 30 with the grating plate 22 and the imaging element 23 located on opposite sides of the wafer 40 .
  • the position of the wafer 40 can be determined, thereby aligning the rotation axis X of the wafer 40 and the wafer stage 30 .
  • the position of the wafer 40 is different, the amount of light blocked by the wafer 40 is also different, resulting in different light transmitted from the grating plate 22 . In this way, the transmitted light patterns received by the imaging element 23 are also different. Based on the light information received by the imaging element 23 , the position of the wafer 40 can be determined, and then the position of the wafer 40 can be adjusted to align with the rotation axis X of the wafer stage 30 .
  • the grating plate 22 has an inboard end 25 and an outboard end 26 along a radial direction relative to the axis of rotation X. Viewed along the rotation axis X direction, the edge of the wafer 40 is located between the inner end 25 and the outer end 26 .
  • the grating plate 22 is a transparent glass plate with a grating pattern disposed thereon, and the light will form a specific pattern in the imaging element 23 after passing through the grating plate 22 .
  • the light source 21 , the grating plate 22 , the wafer 40 and the imaging element 23 are sequentially arranged along the rotation axis direction X.
  • the edge of the wafer 40 is located between the grating plate 22 and the imaging element 23 , so that a portion of the light emitted by the light source can is blocked by the wafer, and another portion of the light from the source is incident on the imaging element.
  • imaging elements include charge coupled devices (CCD) or complementary metal oxide semiconductor (CMOS) elements.
  • CCD charge coupled devices
  • CMOS complementary metal oxide semiconductor
  • the wafer processing apparatus may further include at least one adjustment element 11 mounted on the robotic arm 10 .
  • Figure 4 shows a schematic diagram of an adjustment element on a robotic arm according to some embodiments of the present disclosure.
  • the adjusting element 11 includes a motor 12 and a pushing part 121 driven by the motor 12 .
  • the pushing part 121 is used to move the wafer 40 .
  • the wafer processing apparatus may include at least three adjustment elements 11 on the robot arm 10 , for example four adjustment elements 11 .
  • the wafer processing apparatus may further include a controller configured to control the motor 12 to move the pushing part 121 based on the light received by the imaging element 23, thereby adjusting the position of the wafer 40 to align the center of the wafer 40 with the rotation.
  • Axis X Alignment configured to control the motor 12 to move the pushing part 121 based on the light received by the imaging element 23, thereby adjusting the position of the wafer 40 to align the center of the wafer 40 with the rotation.
  • the controller may be configured to control the movement of the robot arm 10 carrying the wafer 40 based on the light received by the imaging element 23 to adjust the position of the wafer 40 on the wafer stage 30 to thereby move the wafer 40 to the wafer stage 30 .
  • the center of circle 40 is aligned with the axis of rotation X.
  • Figure 5 shows a schematic layout of the grating plate, wafer, wafer stage and adjustment elements of the wafer handling apparatus during the alignment process.
  • the pushing part 121 and the grating plate 22 may not overlap. In other embodiments, when viewed along the direction of the rotation axis
  • the grating plate may include: at least one one-dimensional grating plate 221 arranged along the first direction A and at least one one-dimensional grating plate 222 arranged along the second direction B, the first direction A being perpendicular to the second direction B.
  • one one-dimensional grating plate 221 is arranged along the first direction A
  • one one-dimensional grating plate 222 is arranged along the second direction B. It should be understood that the present disclosure is not intended to limit the number of grating plates, and other numbers of grating plates are possible. For example, three grating plates or a larger number of grating plates are evenly distributed around the wafer stage 30 .
  • the number of grating plates may vary.
  • Figure 6 shows a schematic layout of the grating plate, wafer and wafer stage of the wafer processing apparatus during the alignment process.
  • two one-dimensional grating plates 221 are arranged along the first direction A
  • one one-dimensional grating plate 222 is arranged along the second direction B.
  • the grating pattern of the at least one one-dimensional grating plate 221 arranged along the first direction A extends along the first direction A
  • the grating pattern of 222 extends along the second direction B.
  • the present disclosure is not intended to limit the number of grating plates, and other numbers of grating plates are possible.
  • along the second direction B there may be two grating plates.
  • this may take the form of a two-dimensional grating plate.
  • Figure 7 shows a schematic layout of the grating plate, wafer and wafer stage of the wafer processing apparatus during the alignment process.
  • the grating plate 22 includes at least one two-dimensional grating plate 223 .
  • the grating pattern of the two-dimensional grating plate 223 includes optical patterns extending along the first direction A and the second direction B respectively.
  • the wafer processing device includes multiple imaging elements and multiple light sources, and each imaging element 23 is respectively provided corresponding to the grating plate 22 (which may be a one-dimensional grating plate or a two-dimensional grating plate).
  • the corresponding light source 21 , the corresponding grating plate 22 , the wafer 40 and the corresponding imaging element 23 are sequentially arranged along the direction of the rotation axis X.
  • Embodiments of the present disclosure also provide a wafer processing method. This method may be performed by the wafer processing apparatus described above.
  • FIG. 8 illustrates a flowchart of a wafer processing method according to an embodiment of the present disclosure.
  • the method includes moving the robot arm 10 to place the wafer 40 on the wafer stage 30 such that an edge of the wafer 40 is located between the grating plate 22 and the imaging element 23 , where the imaging element 23 is disposed on the machine.
  • the grating element 22 is mounted on the arm 10 and fixed relative to the wafer stage 30 .
  • the method includes: causing the light source 21 fixed relative to the wafer stage 30 to emit light toward the grating plate 22 and the imaging element 23; a portion of the light emitted by the light source is blocked by the wafer, and another portion of the light emitted by the light source incident on the imaging element.
  • the method includes utilizing imaging element 23 to receive light emitted from light source 21 and transmitted through grating plate 22 .
  • the method includes determining, based on the received light, that the center of the wafer 40 is misaligned with the rotational axis X of the wafer stage 30 .
  • the method includes moving the robotic arm 10 or actuating an adjustment device on the robotic arm 10 to adjust the position of the wafer 40 .
  • the adjustment device includes at least one adjustment element 11 provided on the robotic arm 10 .
  • the adjustment element 11 includes a motor 12 and a pushing part 121 driven by the motor 12 .
  • the method also includes: when it is determined that the center of the wafer 40 is not aligned with the position of the rotation axis Rotation axis X alignment.
  • the method may further include: rotating the wafer stage 30 to rotate the wafer 40 synchronously; and performing etching processing on the edge of the wafer 40, such as edge etching processing.

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Abstract

本公开的实施例涉及晶圆处理装置和晶圆处理方法。晶圆处理装置包括：晶圆载台，晶圆载台可沿旋转轴线旋转；机械臂，包括机械手，用于搬运晶圆并将晶圆放置在晶圆载台上；控制器；以及校准组件，包括：光栅板，相对于晶圆载台固定；光源，相对于光栅板固定；以及成像元件，固定设置在机械臂上，并且适于接收从光源发出的、透过光栅板的光；其中，控制器被配置成基于成像元件对接收到的光的检测，控制机械臂或机械臂上的调整装置来调整晶圆的位置；其中，在晶圆载台承载晶圆的情况下，光栅板和成像元件分别位于晶圆载台的上表面所在平面相对两侧，上表面用于承载晶圆。本公开的实施例提供的装置和方法能够提高晶圆对准效率和对准精度。

Description

晶圆处理装置和晶圆处理方法
本申请要求于2022年6月2日提交中国专利局、申请号为202210624555.8、发明名称为“晶圆处理装置和晶圆处理方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本公开的实施例总体涉及晶圆处理设备领域，具体涉及晶圆处理装置和晶圆处理方法。
背景技术
在晶圆的加工处理过程中，由于热循环和应力等原因，晶圆边缘的薄膜会产生堆积等问题，由此在晶圆的边缘产生薄膜碎裂、薄膜剥落以及颗粒缺陷等缺陷，这会降低产品的良率。为了解决晶圆边缘的上述问题，开发出晶圆边缘刻蚀技术，以将晶圆边缘的一定区域刻蚀掉，进而改善工艺处理过程中的产品良率。
在晶圆边缘刻蚀处理过程中，晶圆随晶圆载台一起旋转，由边缘刻蚀喷头实现对晶圆边缘的刻蚀。为了保证晶圆边缘的圆度，晶圆与晶圆载台之间的对准就变得非常重要。在传统的晶圆与晶圆载台对准方法中，需要分多次小角度旋转晶圆载台和调整晶圆位置。这导致晶圆与晶圆载台的对准精度不高，而且整个晶圆对准需要数分钟的时间，严重降低了晶圆处理设备的吞吐率和加工效率。
发明内容
本公开的实施例旨在提供一种晶圆处理装置和方法，以解决前述或其他潜在的技术问题。
根据本公开的实施例的晶圆处理装置和晶圆处理方法可以提高晶圆与晶圆载台的对准精度，从而改善晶圆的良率，而且，还能够提高晶圆和晶圆载台的对准效率，以改善晶圆处理装置的吞吐率。
本公开的第一方面，提供一种晶圆处理装置。晶圆处理装置包括：晶圆载台，晶圆载台可沿旋转轴线旋转；机械臂，包括机械手，用于搬运晶圆并将晶圆放置在晶圆载台上；控制器；以及校准组件，包括：光栅板，相对于晶圆载台固定；光源，相对于光栅板固定；以及成像元件，固定设置在机械臂上，并且适于接收从光源发出的、透过 光栅板的光；其中，控制器被配置成基于成像元件对接收到的光的检测，控制机械臂或机械臂上的调整装置来调整晶圆的位置；其中，在晶圆载台承载晶圆的情况下，光栅板和成像元件分别位于晶圆载台的上表面所在平面相对两侧，上表面用于承载晶圆。
根据本公开的实施例，利用校准组件就可以确定晶圆与晶圆载台旋转轴线是否对准，而且在对准过程中，不需要晶圆载台和晶圆旋转，利用机械臂或机械臂上的调整装置就能完成晶圆的位置调整，因此晶圆与晶圆载台的对准速度更快，效率更高。相比于电容式传感器，利用光学元件(光栅板)来实现对准，能够提高晶圆与晶圆载台的对准精度。因此，本公开的晶圆处理装置能够实现快速和高效的晶圆对准，具有高的吞吐率和高的产品良率。
在一些实施例中，在晶圆载台承载晶圆的情况下，晶圆的边缘位于光栅板和成像元件之间，使得光源发出的光的一部分被晶圆遮挡，并且光源发出的光的另一部分入射到成像元件。利用光栅板和成像元件可以感测晶圆的边缘位置，从而可以确定晶圆是否与晶圆载台旋转轴线对准，这有助于快速和准确地将晶圆与晶圆载台旋转轴线对准。
在一些实施例中，光栅板包括：沿第一方向布置的至少一个一维光栅板和沿第二方向布置的至少一个一维光栅板，第一方向垂直于第二方向。通过在相互垂直的两个方向上布置光栅板，可以容易地确定晶圆的位置，使得晶圆能够与晶圆载台旋转轴线精确对准。
在一些实施例中，晶圆处理装置包括多个成像元件，分别与一维光栅板对应设置。
在一些实施例中，光栅板包括至少一个二维光栅板。通过设置二位光栅板可以进一步简化校准组件的结构。
在一些实施例中，成像元件包括电荷耦合元件(CCD)或互补金属氧化物半导体(CMOS)元件；在晶圆载台承载晶圆的情况下，光源、光栅板、晶圆和成像元件沿旋转轴线方向依次布置。在实施对准操作过程中，依次布置的光源、光栅板、晶圆和成像元件有利于快速地确定晶圆的边缘位置，以提高晶圆对准的效率。
在一些实施例中，调整装置包括安装在机械臂上的至少一个调整元件，调整元件包括：电机和受电机驱动的推动部，推动部用于移动晶圆。利用机械臂上的调整元件来调整晶圆的位置，可以避免在每个晶圆载台周围都布置调整机构，这有助于降低成本和简化结构。而且，与安装在腔室内的调整元件相比，设置在机械臂上的调整元件更加容易安装和维护。
在一些实施例中，沿旋转轴线的方向观察，推动部与光栅板不重叠；或者沿旋转轴线的方向观察，推动部与光栅板重叠，并且推动部由透光材料制成。通过错开地布置推动部和光栅板，推动部不影响光传输到成像元件。而在推动部和光栅板对齐的情况下，通过将推动部设置为透光材料，使得光可以传输到成像元件。
在一些实施例中，控制器被配置成基于成像元件接收到的光，控制电机以移动推动部，从而调整晶圆的位置。由此，晶圆的位置可以被调整，进而与晶圆载台的中心对准。
在一些实施例中，控制器被配置成基于成像元件接收到的光，控制机械臂移动，以调整晶圆的位置。通过机械臂的移动来调整晶圆位置以将其与晶圆载台对准。与传统的每个晶圆载台上都需要单独的调整元件相比，本公开的实施例降低了调整元件的使用量并且由此降低了成本。
在一些实施例中，晶圆处理装置还包括：腔室，容纳晶圆载台；以及喷嘴，设置在腔室内，用于刻蚀晶圆的边缘。
在本公开的第二方面，提供了一种晶圆处理方法。方法包括以下步骤：移动机械臂以将晶圆放置在晶圆载台上，使得晶圆的边缘位于光栅板和成像元件之间，其中成像元件设置在机械臂上并且光栅元件相对于晶圆载台固定；使相对于晶圆载台固定的光源朝向光栅板和成像元件发射光；光源发出的光的一部分能够被晶圆遮挡，并且光源发出的光的另一部分入射到成像元件；利用成像元件接收从光源发出的、透过光栅板的光；基于所接收到的光，确定晶圆的中心与晶圆载台的旋转轴线未对准；移动机械臂或致动机械臂上的调整装置，以调整晶圆的位置。
根据本公开的实施例，晶圆处理方法可以快速且准确地将晶圆与晶圆载台对准，这提高了装置的吞吐率和晶圆的良率。
在一些实施例中，调整装置包括设置在机械臂上的至少一个调整元件，调整元件包括：电机和受电机驱动的推动部；方法还包括：在确定晶圆的中心未与旋转轴线的位置对准的情况下，控制电机以移动推动部，从而调整晶圆的位置。
在一些实施例中，方法还包括：旋转晶圆载台以使晶圆同步旋转；以及对晶圆的边缘进行刻蚀加工。
应当理解，发明内容部分中所描述的内容并非旨在限定本公开的实施例的关键或重要特征，亦非用于限制本公开的范围。本公开的其它特征将通过以下的描述变得容易理解。
附图说明
结合附图并参考以下详细说明，本公开各实施例的上述和其他特征、优点及方面将变得更加明显。在附图中，相同或相似的附图标记表示相同或相似的元素，其中：
图1示出了根据本公开的一些实施例的晶圆处理装置的示意图；
图2示出了根据本公开的一些实施例的晶圆处理装置的部分结构的视图，其中主要示出了机械臂和校准组件；
图3示出了根据本公开的一些实施例的机械臂上的用于搬运晶圆的机械手的示意图；
图4示出了根据本公开的一些实施例的机械臂上的调整元件的示意图；
图5示出了在对准过程中，晶圆处理装置的光栅板、晶圆、晶圆载台和调整元件的示意性布局；
图6示出了在对准过程中，晶圆处理装置的光栅板、晶圆和晶圆载台的示意性布局；
图7示出了在对准过程中，晶圆处理装置的光栅板、晶圆和晶圆载台的示意性布局；以及
图8示出了根据本公开的实施例的晶圆处理方法的流程图。
具体实施方式
下面将参照附图更详细地描述本公开的实施例。虽然附图中显示了本公开的某些实施例，然而应当理解的是，本公开可以通过各种形式来实现，而且不应该被解释为限于这里阐述的实施例，相反提供这些实施例是为了更加透彻和完整地理解本公开。应当理解的是，本公开的附图及实施例仅用于示例性作用，并非用于限制本公开的保护范围。
在本公开的实施例的描述中，术语“包括”及其类似用语应当理解为开放性包含，即“包括但不限于”。术语“基于”应当理解为“至少部分地基于”。术语“一个实施例”或“该实施例”应当理解为“至少一个实施例”。术语“第一”、“第二”等等可以指代不同的或相同的对象。下文还可能包括其他明确的和隐含的定义。
下面将参照附图更详细地描述本公开的优选实施例。虽然附图中显示了本公开的优选实施例，然而应该理解，可以以各种形式实现本公开而不应被这里阐述的实施例所限制。相反，提供这些实施例是为了使本公开更加透彻和完整，并且能够将本公开的范围完整地传达给本领域的技术人员。
在本文中使用的术语“包括”及其变形表示开放性包括，即“包括但不限于”。除非特别申明，术语“或”表示“和/或”。术语“基于”表示“至少部分地基于”。术语“一个示例实施例”和“一个实施例”表示“至少一个示例实施例”。术语“另一实施例”表示“至少一个另外的实施例”。术语“第一”、“第二”等等可以指代不同的或相同的对象。下文还可能包括其他明确的和隐含的定义。
本公开的实施例提供了一种晶圆处理装置和方法，可以提高晶圆与晶圆载台旋转轴线的对准精度和对准效率，提高晶圆处理装置的吞吐率。
图1示出了根据本公开的一些实施例的晶圆处理装置的示意图。如图1所示，晶圆处理装置从左至右可以包括晶圆供应区1、索引转运区2、中继区3、晶圆处理区4四个区域。多个晶圆40在晶圆供应区1上输送。在索引转运区2内设置有转运机械手101，其用于根据指令将所需晶圆40转运至中继区3的晶圆存放设备102中。
晶圆处理区4设置有一个或多个晶圆处理腔室103(图中示例性示出四个腔室103)，每个晶圆处理腔室103内包括晶圆载台30、光栅板22以及光源21(图中未示出)。
晶圆处理区4内还设置有机械臂10，机械臂10用于从晶圆存放设备102抓取晶圆并将晶圆40搬运到指定的腔室103中的晶圆载台30上以进行相应的加工处理。如图1所示，机械臂10上设置有用于搬运晶圆的机械手110和可选的调整元件11。
图2示出了根据本公开的一些实施例的晶圆处理装置的部分结构的视图，其中主要示出了机械臂和校准组件。
如图2所示，根据本公开的实施例，晶圆处理装置包括晶圆载台30、机械臂10和校准组件。机械臂10上包括搬运晶圆的机械手110，用于将晶圆40放置在晶圆载台30上。图3示出了根据本公开的一些实施例的机械臂上的用于搬运晶圆的机械手的示意图。图3示出的是用于夹持晶圆的机械手。应当理解，本公开并不旨在限制机械手的具体形式，其他形式的搬运机械手也是可行的，例如吸盘式机械手。
晶圆载台30可旋转地支撑晶圆40并且具有旋转轴线X。在对晶圆进行处理加工(例如边缘刻蚀加工)时，晶圆载台30带动晶圆40绕旋转轴线X旋转。在一些实施例中，喷嘴也可以设置在腔室103内，以刻蚀晶圆40的边缘。
校准组件能够将晶圆40的中心与晶圆载台30的旋转轴线X对准。这样，随着晶圆载台30带动晶圆40旋转，可以保证晶圆40的圆度符合成品要求。在本公开的上下文中，晶圆40的圆度意指沿晶圆40的边缘绘制出的形状与理想圆形的接近程度。晶圆40的圆度越高，则沿晶圆40的边缘绘制出的形状越接近理想圆形。
如图2所示，校准组件包括相对于晶圆载台30固定的光栅板22、相对于光栅板22固定的光源21和固定设置在机械臂10上的成像元件23。成像元件23接收从光源21发出并透过光栅板22入射到成像元件23的光。
在对准过程中，晶圆40被放置在晶圆载台30上，光栅板22和成像元件23分别位于晶圆40的相对两侧。如图2中的箭头所示，光源21发出的光在透过光栅板22以后，一部分光会被晶圆40遮挡而不会被成像元件23接收，但是，另一部分光没有被晶圆40遮挡且能被成像元件23接收。基于成像元件获得的光信息，就可以确定晶圆40的位置，从而对准晶圆40和晶圆载台30的旋转轴线X。
由于晶圆40的位置不同，因此其遮挡的光的量也不同，导致从光栅板22透过的光不同。这样成像元件23接收到的透射光图案也是不同的。基于成像元件23接收到的光信息，可以确定晶圆40的位置，进而调整晶圆40的位置以使其与晶圆载台30的旋转轴线X对准。
如图2所示，在一些实施例中，相对于旋转轴线X，光栅板22沿着径向方向具有内侧端25和外侧端26。沿着旋转轴线X方向观察，晶圆40的边缘位于内侧端25和外侧端26之间。在一些实施例中，光栅板22是一种透明玻璃板，其上设置有光栅图案，光在透过光栅板22后会在成像元件23中形成特定的图案。
在一些实施例中，如图2所示，在晶圆载台30承载晶圆40的情况下，光源21、光栅板22、晶圆40和成像元件23沿旋转轴线方向X依次布置。在一些实施例中，如图2所示，在晶圆载台30承载晶圆40的情况下，晶圆40的边缘位于光栅板22和成像元件23之间，使得光源发出的光的一部分能够被晶圆遮挡，并且光源发出的光的另一部分入射到成像元件。
在一些实施例中，成像元件包括电荷耦合元件(CCD)或互补金属氧化物半导体(CMOS)元件。
在一些实施例中，晶圆处理装置还可以包括安装在机械臂10上的至少一个调整元件11。图4示出了根据本公开的一些实施例的机械臂上的调整元件的示意图。调整元件11包括电机12和受电机12驱动的推动部121，推动部121用于移动晶圆40。在一些实施例中，晶圆处理装置可以包括在机械臂10上的至少三个调整元件11，例如四个调整元件11。
晶圆处理装置还可以包括控制器，控制器被配置成基于成像元件23接收到的光，控制电机12以移动推动部121，从而调整晶圆40的位置，以将晶圆40的中心与旋转轴线X对准。
替代地或附加地，控制器可以被配置成基于成像元件23接收到的光，控制搬运晶圆40的机械臂10移动，以调整晶圆40在晶圆载台30上的位置，进而将晶圆40的中心与旋转轴线X对准。
图5示出了在对准过程中，晶圆处理装置的光栅板、晶圆、晶圆载台和调整元件的示意性布局。在一些实施例中，如图5所示，沿旋转轴线X的方向观察，推动部121与光栅板22可以不重叠。在另一些实施例中，沿旋转轴线X的方向观察，推动部121与光栅板22(包括两个光栅板221和222)可以重叠，并且此时推动部121由透光材料制成。
在一些实施例中，光栅板可以包括：沿第一方向A布置的至少一个一维光栅板221和沿第二方向B布置的至少一个一维光栅板222，第一方向A垂直于第二方向B。在一些实施例中，如图5所示，沿第一方向A布置一个一维光栅板221，沿第二方向B布置一个一维光栅板222。应当理解，本公开并不旨在限制光栅板的数量，其他数量的光栅板也是可行的。例如均布在晶圆载台30周围的三个光栅板或者更多个数量的光栅板。
在另一些实施例中，光栅板的数量可以不同。图6示出了在对准过程中，晶圆处理装置的光栅板、晶圆和晶圆载台的示意性布局。如图6所示，沿第一方向A布置两个一维光栅板221，沿第二方向B布置一个一维光栅板222。在图5至图6所示的示例中，沿第一方向A布置的至少一个一维光栅板221的光栅图案沿着第一方向A延伸，沿第二方向B布置的至少一个一维光栅板222的光栅图案沿着第二方向B延伸。应当理解，本公开并不旨在限制光栅板的数量，其他数量的光栅板也是可行的。例如沿第二方向B，可以有两个光栅板。
在一些实施例中，可以采取二维光栅板的形式。图7示出了在对准过程中，晶圆处理装置的光栅板、晶圆和晶圆载台的示意性布局。如图7所示，光栅板22包括至少一个二维光栅板223。二维光栅板223的光栅图案包括分别沿着第一方向A和第二方向B延伸的光学图案。
在一些实施例中，晶圆处理装置包括多个成像元件和多个光源，每个成像元件23分别与光栅板22(可以是一维光栅板，也可以是二维光栅板)对应设置。再次参考图2，在晶圆载台30承载晶圆40的情况下，相应的光源21、相应的光栅板22、晶圆40和相应的成像元件23沿旋转轴线X的方向依次布置。
本公开的实施例还提供了一种晶圆处理方法。该方法可以由前文所述的晶圆处理装置来执行。
图8示出了根据本公开的实施例的晶圆处理方法的流程图。
在框802中，方法包括：移动机械臂10以将晶圆40放置在晶圆载台30上，使得晶圆40的边缘位于光栅板22和成像元件23之间，其中成像元件23设置在机械臂10上并且光栅元件22相对于晶圆载台30固定。
在框804中，方法包括：使相对于晶圆载台30固定的光源21朝向光栅板22和成像元件23发射光；光源发出的光的一部分被晶圆遮挡，并且光源发出的光的另一部分入射到成像元件。
在框806中，方法包括：利用成像元件23接收从光源21发出的、透过光栅板22的光。
在框808中，方法包括：基于所接收到的光，确定晶圆40的中心与晶圆载台30的旋转轴线X未对准。
在框810中，方法包括：移动机械臂10或致动机械臂10上的调整装置，以调整晶圆40的位置。
在一些实施例中，调整装置包括设置在机械臂10上的至少一个调整元件11，调整元件11包括：电机12和受电机12驱动的推动部121。方法还包括：在确定晶圆40的中心未与旋转轴线X的位置对准的情况下，控制电机12以移动推动部121，从而调整/改变晶圆40的位置，使得晶圆40的中心与旋转轴线X对准。
在一些实施例中，方法还可以包括：旋转晶圆载台30以使晶圆40同步旋转；以及对晶圆40的边缘进行刻蚀加工，例如边缘刻蚀加工。
以上已经描述了本公开的各实施例，上述说明是示例性的，并非穷尽性的，并且也不限于所披露的各实施例。在不偏离所说明的各实施例的范围和精神的情况下，对于本技术领域的普通技术人员来说许多修改和变更都是显而易见的。本文中所用术语的选择，旨在最好地解释各实施例的原理、实际应用或对市场中的技术的改进，或者使本技术领域的其它普通技术人员能理解本文披露的各实施例。
尽管已经采用特定于结构特征和/或方法逻辑动作的语言描述了本主题，但是应当理解所附权利要求书中所限定的主题未必局限于上面描述的特定特征或动作。相反，上面所描述的特定特征和动作仅仅是实现权利要求书的示例形式。

Claims (14)

  1. 一种晶圆处理装置，其特征在于，包括：
    晶圆载台，所述晶圆载台可沿旋转轴线旋转；
    机械臂，包括机械手，用于搬运晶圆并将所述晶圆放置在所述晶圆载台上；
    控制器；以及
    校准组件，包括：
    光栅板，相对于所述晶圆载台固定；
    光源，相对于所述光栅板固定；以及
    成像元件，固定设置在所述机械臂上，并且适于接收从所述光源发出的、透过所述光栅板的光；
    其中，所述控制器被配置成基于所述成像元件对接收到的光的检测，控制所述机械臂或所述机械臂上的调整装置来调整所述晶圆的位置；
    其中，在所述晶圆载台承载所述晶圆的情况下，所述光栅板和所述成像元件分别位于所述晶圆载台的上表面所在平面相对两侧，所述上表面用于承载所述晶圆。
  2. 根据权利要求1所述的装置，其特征在于，在所述晶圆载台承载所述晶圆的情况下，所述晶圆的边缘位于所述光栅板和所述成像元件之间，使得所述光源发出的光的一部分被所述晶圆遮挡，并且所述光源发出的光的另一部分入射到所述成像元件。
  3. 根据权利要求1或2所述的装置，其特征在于，所述光栅板包括：沿第一方向布置的至少一个一维光栅板和沿第二方向布置的至少一个一维光栅板，所述第一方向垂直于所述第二方向。
  4. 根据权利要求3所述的装置，其特征在于，包括多个所述成像元件，分别与所述一维光栅板对应设置。
  5. 根据权利要求1或2所述的装置，其特征在于，所述光栅板包括至少一个二维光栅板。
  6. 根据权利要求1所述的装置，其特征在于，所述成像元件包括电荷耦合元件(CCD)或互补金属氧化物半导体(CMOS)元件；
    在所述晶圆载台承载所述晶圆的情况下，所述光源、所述光栅板、所述晶圆和所述成像元件沿所述旋转轴线方向依次布置。
  7. 根据权利要求1所述的装置，其特征在于，所述调整装置包括安装在所述机械臂上的至少一个调整元件，所述调整元件包括：电机和受所述电机驱动的推动部，所述推动部用于移动所述晶圆。
  8. 根据权利要求7所述的装置，其特征在于，沿所述旋转轴线的方向观察，所述推动部与所述光栅板不重叠；或者
    沿所述旋转轴线的方向观察，所述推动部与所述光栅板重叠，并且所述推动部由透光材料制成。
  9. 根据权利要求7或8所述的装置，其特征在于，所述控制器被配置成基于所述成像元件接收到的光，控制所述电机以移动所述推动部，从而调整所述晶圆的位置。
  10. 根据权利要求1所述的装置，其特征在于，所述控制器被配置成基于所述成像元件接收到的光，控制所述机械臂移动，以调整所述晶圆的位置。
  11. 根据权利要求1所述的装置，其特征在于，还包括：
    腔室，容纳所述晶圆载台；以及
    喷嘴，设置在所述腔室内，用于刻蚀所述晶圆的边缘。
  12. 一种晶圆处理方法，其特征在于，包括以下步骤：
    移动机械臂以将晶圆放置在晶圆载台上，使得所述晶圆的边缘位于光栅板和成像元件之间，其中成像元件设置在所述机械臂上并且所述光栅元件相对于所述晶圆载台固定；
    使相对于所述晶圆载台固定的光源朝向所述光栅板和所述成像元件发射光；所述光源发出的光的一部分被所述晶圆遮挡，并且所述光源发出的光的另一部分入射到所述成像元件；
    利用所述成像元件接收从所述光源发出的、透过所述光栅板的光；
    基于所接收到的光，确定所述晶圆的中心与所述晶圆载台的旋转轴线未对准；
    移动所述机械臂或致动所述机械臂上的调整装置，以调整所述晶圆的位置。
  13. 根据权利要求12所述的方法，其特征在于，所述调整装置包括设置在所述机械臂上的至少一个调整元件，所述调整元件包括：电机和受所述电机驱动的推动部；所述方法还包括：
    在确定所述晶圆的中心未与所述旋转轴线的位置对准的情况下，控制所述电机以移动所述推动部，从而调整所述晶圆的位置。
  14. 根据权利要求12所述的方法，其特征在于，还包括：
    旋转所述晶圆载台以使所述晶圆同步旋转；以及
    对所述晶圆的边缘进行刻蚀加工。
PCT/CN2023/097929 2022-06-02 2023-06-02 晶圆处理装置和晶圆处理方法 WO2023232132A1 (zh)

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CN101498897A (zh) * 2008-12-17 2009-08-05 上海微电子装备有限公司 边缘曝光装置及其控制方法
CN101794721A (zh) * 2009-01-08 2010-08-04 日东电工株式会社 半导体晶圆的定位装置
CN105632971A (zh) * 2014-11-26 2016-06-01 上海微电子装备有限公司 一种硅片处理装置及方法
CN110729226A (zh) * 2019-09-06 2020-01-24 福建省福联集成电路有限公司 一种晶圆圆心校准的方法和装置
CN113066746A (zh) * 2020-01-02 2021-07-02 长鑫存储技术有限公司 预对准装置及应用于该装置的预对准方法

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JPH1022369A (ja) * 1996-06-28 1998-01-23 Nikon Corp 基板のプリアライメント装置
CN101241313A (zh) * 2008-03-11 2008-08-13 上海微电子装备有限公司 基于机器视觉的光刻装置对准系统与对准方法
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