WO2023225957A9 - 显示面板及显示装置 - Google Patents

显示面板及显示装置 Download PDF

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Publication number
WO2023225957A9
WO2023225957A9 PCT/CN2022/095329 CN2022095329W WO2023225957A9 WO 2023225957 A9 WO2023225957 A9 WO 2023225957A9 CN 2022095329 W CN2022095329 W CN 2022095329W WO 2023225957 A9 WO2023225957 A9 WO 2023225957A9
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WIPO (PCT)
Prior art keywords
groove
layer
display area
base substrate
display panel
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PCT/CN2022/095329
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English (en)
French (fr)
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WO2023225957A1 (zh
Inventor
张波
王天明
郑海
王大伟
承天一
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to CN202280001468.5A priority Critical patent/CN117581653A/zh
Priority to PCT/CN2022/095329 priority patent/WO2023225957A1/zh
Publication of WO2023225957A1 publication Critical patent/WO2023225957A1/zh
Publication of WO2023225957A9 publication Critical patent/WO2023225957A9/zh

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  • the present disclosure relates to the field of display technology, and specifically, to a display panel and a display device.
  • the purpose of the present disclosure is to overcome the above-mentioned shortcomings of the prior art and provide a display panel and a display device.
  • a display panel having a display area and a non-display area connected to the display area.
  • the display panel includes a substrate, a first lead, a barrier dam and a packaging layer; the first lead is provided on the substrate One side of the substrate extends from the display area to the non-display area; the barrier dam is located in the non-display area and surrounds the display area.
  • the barrier dam includes an insulating layer group, and the insulating layer group is located on the side of the first lead away from the base substrate.
  • the insulating layer group is provided with a groove on the side away from the base substrate, and the depth of the groove is less than the thickness of the insulating layer group;
  • the encapsulation layer is provided on the side of the barrier dam away from the base substrate, the encapsulation layer includes an organic encapsulation layer, and the organic encapsulation layer
  • the orthographic projection of the edge of the layer away from the display area on the base substrate is located within the orthographic projection of the barrier dam on the base substrate.
  • the groove includes a plurality of groove branches parallel to each other, the plurality of groove branches are located on a side of the barrier dam close to the display area, and the plurality of groove branches form protrusions on a side away from the display area.
  • the main body has a plurality of convex branches formed between the plurality of groove branches, and the convex branches intersect with the convex main body.
  • an included angle of 20 degrees to 30 degrees is formed between the protruding branches and the protruding main body.
  • the width of the protruding body is 1/6-1/3 of the width of the barrier dam
  • the width of the protruding branches is 1/3-1/2 of the width of the barrier dam
  • the width of two adjacent protrusions is The distance between the starting branches is 1/6-5/12 of the width of the barrier dam.
  • the width of the protruding branches gradually decreases from a side close to the base substrate to a side away from the base substrate.
  • the side of the protruding branch close to the display area is an inclined plane inclined away from the display area
  • the side of the protruding body close to the display area is an inclined plane inclined away from the display area
  • the groove is located in the middle of the barrier dam.
  • the groove includes a groove body and a plurality of groove branches.
  • the groove body is arranged along the extension direction of the barrier dam.
  • the plurality of groove branches are provided in the groove.
  • the main body is close to one side of the display area and connected with the groove main body.
  • the plurality of groove branches are parallel to each other and form an included angle of 20 degrees to 60 degrees with the groove body.
  • the width of the protruding body is 1/6-1/3
  • the width of the protruding branches is 1/3-1/2 of the width of the barrier dam
  • the width of the protruding branches is between two adjacent protruding branches. The distance is 1/6-5/12 of the width of the barrier dam.
  • the groove is located in the middle of the barrier dam, and the width of the groove gradually increases from a side close to the base substrate to a side away from the base substrate.
  • the width of the groove is 1/3-7/12 of the width of the barrier dam.
  • the depth of the groove is equal to the depth of the groove, which is equal to the thickness of the third insulating layer, or the sum of the thickness of the second insulating layer and the thickness of the third insulating layer.
  • the width of the barrier dam is 50um ⁇ 80um.
  • the groove includes a plurality of groove segments intermittently arranged along the extension direction of the barrier dam
  • the display panel further includes a second lead
  • the second lead is provided on a side of the packaging layer away from the base substrate, and Located between two adjacent groove sections.
  • the distance between two adjacent groove segments is 30um ⁇ 100um.
  • the display panel further includes a first planarization layer and a pixel definition layer.
  • the first planarization layer is provided on a side of the first lead away from the base substrate and is located in the display area;
  • the pixel definition layer is provided On the side of the first planarization layer away from the base substrate;
  • the insulating layer group includes a first insulating layer and a third insulating layer away from the base substrate in sequence, and the first insulating layer and the first planarization layer are arranged in the same layer and with the same material, The third insulating layer and the pixel defining layer are arranged in the same layer and made of the same material.
  • the display panel further includes a second planarization layer disposed between the first planarization layer and the pixel definition layer; the insulating layer group further includes a second insulating layer, a second The insulating layer is disposed between the first insulating layer and the third insulating layer, and is of the same layer and material as the second planarization layer.
  • the non-display area includes a binding area and a border area.
  • the binding area is located on one side of the display area, and a blocking dam is provided in the binding area.
  • the border area is located on the other side of the display area. The area is provided with multiple blocking dams in sequence in the direction away from the display area.
  • the groove is located on a side of the insulating layer group of the barrier dam in the binding area away from the substrate.
  • a display device including the display panel according to one aspect of the present disclosure.
  • FIG. 1 is a cross-sectional structural view of a display panel according to an embodiment of the present disclosure.
  • FIG. 2 is a cross-sectional structural view of another display substrate according to an embodiment of the present disclosure.
  • Figure 3 is a partial cross-sectional structural view of another display substrate according to an embodiment of the present disclosure.
  • FIG. 4 is a schematic diagram of a barrier dam of another display substrate according to an embodiment of the present disclosure.
  • Figure 5 is a partial enlarged view of part A in Figure 4.
  • Figure 6 is a schematic diagram of another barrier dam of another display substrate according to an embodiment of the present disclosure.
  • Figure 7 is a partial enlarged view of part B in Figure 6.
  • FIG. 8 is a schematic diagram of another barrier dam of another display substrate according to an embodiment of the present disclosure.
  • FIG. 9 is a C-C cross-sectional view of FIG. 8 .
  • FIG. 10 is a partial perspective view of another barrier dam of another display panel according to an embodiment of the present disclosure.
  • FIG. 11 is a schematic plan view of another display panel according to an embodiment of the present disclosure.
  • Figure 12 is a partial enlarged view of the N part in Figure 11.
  • FIG. 13 is a schematic plan view of another display panel according to an embodiment of the present disclosure.
  • 13-Drive circuit layer 131-Active layer, 132-Gate insulation layer, 133-Gate, 134-Interlayer insulation layer, 135-Interlayer dielectric layer, 1361-First source electrode, 1362-Drain electrode, 137 -Protective layer, 1381-second source, 139-data line;
  • 16-pixel layer 161-pixel electrode, 162-light-emitting layer, 163-common electrode;
  • 17-encapsulation layer 171-first inorganic encapsulation layer, 172-organic encapsulation layer, 173-second inorganic encapsulation layer;
  • 18-Touch control layer 181-First touch control layer, 1811-Touch driving metal grid, 1812-Touch sensing metal grid, 182-Second touch control layer, 183-Second passivation layer, 184- first passivation layer, 185-touch signal line, 1851-first part, 1852-second part;
  • Example embodiments will now be described more fully with reference to the accompanying drawings.
  • Example embodiments may, however, be embodied in various forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concepts of the example embodiments.
  • the same reference numerals in the drawings indicate the same or similar structures, and thus their detailed descriptions will be omitted.
  • the drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale.
  • the display panel generally includes a base substrate 11 , a driving circuit layer 13 , a planarization layer group 14 and a pixel layer 16 .
  • the driving circuit layer 13 is provided on one side of the base substrate 11 , and the planarization layer group 14
  • the driving circuit layer 13 is disposed on a side away from the base substrate 11
  • the pixel layer 16 is disposed on a side of the planarization layer group 14 away from the base substrate 11 .
  • the display panel may further include a buffer layer 12 disposed between the base substrate 11 and the driving circuit layer 13 .
  • the base substrate 11 may be a base substrate of inorganic material or a base substrate of organic material.
  • the material of the base substrate 11 may be glass materials such as soda-lime glass, quartz glass, sapphire glass, or may be stainless steel, aluminum, nickel, etc. metallic material.
  • the base substrate 11 may also be a flexible base substrate.
  • the material of the base substrate 11 may be polyimide (PI).
  • the base substrate 11 may also be a composite of multiple layers of materials.
  • the base substrate 11 may include a bottom film layer (Bottom Film), a pressure-sensitive adhesive layer, and a pressure-sensitive adhesive layer that are stacked in sequence. A first polyimide layer and a second polyimide layer.
  • the driving circuit layer 13 is provided with a driving circuit for driving sub-pixels.
  • any driving circuit may include a transistor and a storage capacitor.
  • the transistor may be a thin film transistor, and the thin film transistor may be selected from a top gate thin film transistor, a bottom gate thin film transistor, or a dual gate thin film transistor; taking a top gate thin film transistor as an example, the driving circuit layer 13 may include an active layer.
  • the active layer 131 is provided on one side of the base substrate 11 and located in the display area 101 .
  • the material of the active layer 131 may be amorphous silicon semiconductor material, low-temperature polysilicon semiconductor material, metal oxide semiconductor material, organic semiconductor material or other types of semiconductor materials; therefore, the thin film transistor may be an N-type thin film transistor or a P-type thin film transistor.
  • the active layer 131 may include a channel region and two doping regions of different doping types located on both sides of the channel region.
  • the gate insulating layer 132 can cover the active layer 131 and the base substrate 11 , and the material of the gate insulating layer 132 is an insulating material such as silicon oxide.
  • the gate 1331 is provided in the display area 101 .
  • the gate electrode 1331 is disposed on the side of the gate insulating layer 132 away from the base substrate 11 and directly opposite the active layer 131 , that is, the projection of the gate electrode 1331 on the base substrate 11 is located on the side of the active layer 131 on the base substrate 11 Within the projection range, for example, the projection of the gate 1331 on the base substrate 11 coincides with the projection of the channel region of the active layer 131 on the base substrate 11 .
  • the driving circuit layer 13 also includes an interlayer insulating layer 134 covering the gate electrode 1331 and the gate insulating layer 132.
  • the driving circuit layer 13 also includes an interlayer dielectric layer 135.
  • the interlayer dielectric layer 135 is disposed on the interlayer insulating layer. 134 is away from the side of the base substrate 11 .
  • the interlayer insulating layer 134 and the interlayer dielectric layer 135 are both made of insulating materials, but the materials of the interlayer insulating layer 134 and the interlayer dielectric layer 135 may be different.
  • the first source-drain metal layer is disposed on the surface of the interlayer dielectric layer 135 away from the base substrate 11.
  • the first source-drain metal layer includes a first source electrode 1361 and a drain electrode 1362.
  • the first source electrode 1361 and the drain electrode 1362 are disposed on the display region 101 and is connected to the active layer 131.
  • the first source electrode 1361 and the drain electrode 1362 are respectively connected to the two corresponding doped regions of the active layer 131 through via holes.
  • a protective layer 137 is provided on the side of the first source-drain metal layer away from the base substrate 11, and the protective layer 137 covers the first source-drain metal layer.
  • a planarization layer group 14 is provided on the side of the first source-drain metal layer away from the base substrate 11. The planarization layer group 14 is provided on a side of the protective layer 137 away from the base substrate 11. The planarization layer group 14 covers the protective layer 137. And the surface of the planarization layer group 14 away from the base substrate 11 is flat.
  • the planarization layer group 14 may include a first planarization layer 141 covering the protective layer 137 .
  • the display panel may further include a second source-drain metal layer.
  • a second planarization layer 142 is provided on a side of the second source-drain metal layer away from the base substrate 11 .
  • the second planarization layer 142 covers the second source-drain metal layer and the first The planarization layer 141 is on a side away from the base substrate 11 .
  • the second source-drain metal layer includes a second source electrode 1381, and the second source electrode 1381 is connected to the first source electrode 1361 through a via hole.
  • the driving circuit layer 13 also includes first leads, and the first leads may include data lines 139.
  • the data lines 139 are distributed in the same layer as the first source electrode 1361, the drain electrode 1362, or the second source electrode 1381 in the array substrate. . It should be noted that the first lead extends from the display area to the non-display area.
  • a pixel definition layer 15 and a pixel layer 16 may be provided on a side of the planarization layer group 14 away from the base substrate 11 , and the pixel definition layer 15 and the pixel layer 16 are located in the display area 101 .
  • the pixel definition layer 15 has a plurality of pixel openings 151.
  • the pixel layer 16 includes a plurality of sub-pixels, and the plurality of sub-pixels are respectively provided in the plurality of pixel openings 151.
  • Multiple sub-pixel arrays are distributed on the side of the driving backplane 10 away from the base substrate 11 .
  • Specific sub-pixels may be located on the side of the planarization layer group 14 away from the base substrate 11 . It should be noted that the sub-pixels may include red sub-pixels, green sub-pixels and blue sub-pixels according to different emitting colors.
  • the pixel layer 16 may include a plurality of pixel electrodes 161, a light-emitting layer 162 and a common electrode 163.
  • the pixel electrode 161 is located on the surface of the driving backplane 10 away from the base substrate 11, and the light-emitting layer 162 is located on the surface of the pixel electrode 161 away from the base substrate 11.
  • the common electrode 163 is provided on the surface of the light-emitting layer 162 away from the base substrate 11 .
  • the pixel electrode 161 is connected to the first source electrode 1361 or the second source electrode 1381.
  • the driving circuit layer 13 only includes the first source electrode 1361 and the first planarization layer 141
  • the pixel electrode 161 is connected to the first source electrode 1361 through the via hole on the first planarization layer 141, and the pixel definition layer 15 is provided to cover it.
  • the driving circuit layer 13 also includes a second source-drain metal layer and a second planarization layer 142
  • the pixel electrode 161 is connected to the second source electrode 1381 through the via hole on the second planarization layer 142, and the pixel definition layer 15 is provided.
  • the second source-drain metal layer and the second planarization layer 142 are covered.
  • the common electrode 163 can be used as a cathode, and the pixel electrode 161 can be used as an anode.
  • the pixel electrode 161 is connected to the positive electrode of the power supply, and the common electrode 163 is connected to the negative electrode of the power supply.
  • a signal can be applied through the pixel electrode 161 and the common electrode 163 to drive the luminescent layer 162 to emit light. , to display the image, the specific lighting principle will not be described in detail here.
  • the light-emitting layer 162 may include an electro-organic light-emitting material.
  • the light-emitting layer 162 may include an auxiliary layer and a light-emitting material layer sequentially stacked on the pixel electrode 161 .
  • a pattern area is provided on the mask plate, and processes such as evaporation are used to form auxiliary layers of sub-pixels of different colors and light-emitting layers 162 of sub-pixels of different colors.
  • the display panel of the present disclosure may also include an encapsulation layer 17.
  • the encapsulation layer 17 is provided on the side of the pixel layer 16 away from the base substrate 11, thereby covering the pixel layer 16 to prevent water and oxygen erosion.
  • the encapsulation layer 17 may have a single-layer or multi-layer structure, and the material of the encapsulation layer 17 may include organic or inorganic materials, which are not specifically limited here.
  • the encapsulation layer 17 may include a first inorganic encapsulation layer 171, an organic encapsulation layer 172 and a second inorganic encapsulation layer 173.
  • the first inorganic encapsulation layer 171 is provided on the side of the pixel layer 16 away from the base substrate 11.
  • the organic encapsulation layer 172 is disposed on the side of the first inorganic encapsulation layer 171 away from the base substrate 11
  • the second inorganic encapsulation layer 173 is disposed on the side of the organic encapsulation layer 172 away from the base substrate 11 .
  • the non-display area 102 Due to the flow of liquid organic encapsulating materials, it is easy for the liquid organic encapsulating materials to overflow. In order to prevent the organic encapsulating materials from overflowing, especially at the lower frame position, the non-display area 102 has been provided with devices located sequentially away from the display area.
  • the multiple barrier dams 20 of 101 use multiple barrier dams 20 to play the role of multiple barriers.
  • Two barrier dams 20 are taken as an example for illustration.
  • the barrier dam 20 is provided on the side of the protective layer 137 away from the base substrate 11 and includes a first barrier dam 202 and a second barrier dam 201 .
  • the first barrier dam 202 surrounds the display area 101 Set up; the second barrier dam 201 is arranged around the first barrier dam 202; the encapsulation layer 17 is provided on the side of the first barrier dam 202 and the second barrier dam 201 away from the base substrate 11.
  • the stacked pattern of the first barrier dam 202 and the second barrier dam 201 includes an insulating layer group 203 and one or more layers of the first planarization layer 141 , the second planarization layer 142 and the pixel definition layer 15 Same layer material settings.
  • the lamination pattern of the first barrier dam 202 and the lamination pattern of the second barrier dam 201 may be set to be the same.
  • the stacked patterns of the first barrier dam 202 and the second barrier dam 201 both include a first insulating layer 2031, and the first insulating layer 2031 and the first planarization layer 141 are arranged in the same layer and with the same material.
  • a second insulating layer 2032 may also be provided on the first insulating layer 2031, and the second insulating layer 2032 and the second planarization layer 142 are provided in the same layer and made of the same material.
  • a third insulating layer 2033 may also be provided on the second insulating layer 2032 , and the third insulating layer 2033 and the pixel defining layer 15 are provided in the same layer and made of the same material.
  • the lamination pattern of the first barrier dam 202 and the lamination pattern of the second barrier dam 201 may be set to be different.
  • the stacked pattern of the first barrier dam 202 includes a second insulating layer 2032 and a third insulating layer 2033.
  • the second insulating layer 2032 and the second planarization layer 142 are arranged in the same layer and with the same material.
  • the third insulating layer 2033 is bounded by the pixels.
  • Layer 15 is set with the same layer and material.
  • the stacked pattern of the second barrier dam 201 includes a first insulating layer 2031, a second insulating layer 2032 and a third insulating layer 2033.
  • the first insulating layer 2031 and the first planarization layer 141 are arranged in the same layer and made of the same material.
  • 2032 and the second planarization layer 142 are arranged in the same layer and the same material, and the third insulating layer 2033 and the pixel defining layer 15 are arranged in the same layer and the same material.
  • the height of the first barrier dam 202 relative to the base substrate 11 is higher than that of the second barrier dam 201 relative to the base substrate 11 The height is low, which lengthens the path for external water vapor and oxygen to enter the display area 101, increases the difficulty of entering the display area 101, and further improves the blocking ability of the barrier dam 20.
  • packaging with multiple barrier dams 20 can prevent organic packaging materials from overflowing and can also play a good blocking role, the greater the number of barrier dams 20 , the wider the area occupied by the barrier dams 20 in the non-display area 102 will be. Large, resulting in a larger width of the non-display area 102 of the display panel.
  • the display area 101 also includes a touch control layer 18.
  • the touch control layer 18 may be a mutual-capacitance touch control.
  • the touch control layer 18 includes a first touch control layer 181 and a second touch control layer 182.
  • the first touch control layer 181 may be is a metal mesh layer (Metal Mesh, MM)
  • the second touch control layer 182 can be a bridge metal layer (Bridge Metal, BM)
  • the first touch control layer 181 can also be a bridge metal layer (Bridge Metal, BM).
  • the second touch control layer 182 may be a metal mesh layer (Metal Mesh, MM).
  • the first touch control layer 181 is a metal mesh layer (Metal Mesh, MM), and the second touch control layer 182 is a bridge metal layer (Bridge Metal, BM).
  • the first touch control layer 181 is located in the display area 101 and can be divided into a touch-driven metal grid 1811 and a touch-sensitive metal grid 1812 according to the horizontal and vertical directions. Among them, the touch-sensitive metal grid 1812 and the touch-driven metal grid One of the 1811 is connected to each other, and the other is connected through the second touch control layer 182 .
  • a first passivation layer 184 is provided on the side of the first touch control layer 181 away from the base substrate 11
  • a second passivation layer 183 is provided on the side of the second touch control layer 182 away from the base substrate 11 .
  • a second lead is provided on the side of the second inorganic encapsulation layer 173 away from the base substrate 11.
  • the second lead may be a touch signal line 185, a plurality of touch signal lines 185 and a touch driving metal mesh.
  • the grid 1811 and the touch-sensitive metal grid 1812 respectively correspond to electrical connections.
  • the touch signal line 185 may include: a first part 1851 provided in the same layer as the metal mesh layer MM, and a second part 1852 provided in the same layer as the bridge metal layer BM and electrically connected to the first part 1851.
  • the touch signal line 185 as a double-layer trace including the first part 1851 and the second part 1852, it is possible that after one layer of the trace is partially broken, the metal mesh layer MM can still be connected to the metal mesh layer MM through the other layer of trace.
  • Loading touch signals effectively solves the problem of single-layer wiring breakage that easily leads to touch failure; in addition, compared to single-layer wiring designs, double-layer wiring can also reduce the resistance value of the touch signal line 185 .
  • the first part 1851 and the second part 1852 are electrically connected through a via hole penetrating the inorganic insulation layer.
  • the touch signal lines 185 are usually provided between the barrier dam 20 and the edge of the display area, but the width of this area is limited. To arrange all the touch signal lines 185, the width of this area is required, which will increase the non-display capacity of the display panel. The width of the area.
  • the display panel has a display area 101 and a non-display area 102 connected to the display area 101.
  • the display panel includes a base substrate 11, a first lead, a barrier dam 20 and a packaging layer 17; A lead is provided on one side of the base substrate 11 and extends from the display area 101 to the non-display area 102; the barrier dam 20 is provided in the non-display area 102 and surrounds the display area 101.
  • the barrier dam 20 includes an insulating layer group 203.
  • the layer group 203 is provided on the side of the first lead away from the base substrate 11.
  • the insulating layer group 203 is provided with a groove 204 on the side far away from the base substrate 11.
  • the depth of the groove 204 is less than the thickness of the insulating layer group 203; the packaging layer 17 is provided on the side of the barrier dam 20 away from the base substrate 11.
  • the encapsulation layer 17 includes an organic encapsulation layer 172.
  • the orthographic projection of the edge of the organic encapsulation layer 172 away from the display area 101 on the base substrate 11 is located on the side of the barrier dam 20 on the substrate. within the orthographic projection on the substrate 11.
  • the barrier dam 20 includes an insulating layer group 203.
  • a groove 204 is provided on the side of the insulating layer group 203 away from the base substrate 11. After the liquid organic encapsulating material flows from the display area 101 to the highest point of the barrier dam 20, the excess liquid organic The encapsulation material can directly fall into the groove 204 to prevent excess liquid organic encapsulation material from flowing across the barrier dam 20 to outside the encapsulation area, so that the orthographic projection of the edge of the organic encapsulation layer 172 away from the display area 101 on the substrate 11 is located
  • the barrier dam 20 is in the orthographic projection on the base substrate 11 .
  • the display panel only includes one barrier dam 20 , and the width of the area where the barrier dam 20 is provided in the non-display area 102 becomes smaller, so that the width of the entire non-display area 102 becomes smaller.
  • the display area of the display panel is basically the same as the display area of the display panel shown in FIG. 1 , and therefore will not be described again.
  • the difference is that the non-display area 102 of the display panel only includes one barrier dam 20 , and the barrier dam 20 includes an insulating layer group 203 .
  • the insulating layer group 203 includes a first insulating layer 2031 , a second insulating layer that are located away from the base substrate 11 in sequence. layer 2032 and the third insulating layer 2033.
  • the first insulating layer 2031 and the first planarization layer 141 are arranged in the same layer and the same material.
  • the second insulating layer 2032 and the second planarization layer 142 are arranged in the same layer and the same material.
  • the third insulating layer 2033 The insulating layer group 203 is provided with the same layer and material as the pixel defining layer 15 , and a groove 204 is provided on the side away from the base substrate 11 . It should be noted that the width of the barrier dam is 50um ⁇ 80um.
  • the structure and arrangement of the grooves are as shown in Figures 4 and 5.
  • a groove 204 is provided on the side of the insulating layer group 203 away from the base substrate 11. 204 is located in the middle of the barrier dam 20.
  • the distance between one groove wall of the groove 204 and the side of the barrier dam 20 close to the display area 101 is equal to the distance between the other groove wall of the groove 204 opposite to one groove wall and the barrier dam 20 away from the display area.
  • the length of the groove 204 is equal to the length of the barrier dam 20
  • the width d 2 of the groove 204 is 1/3-7/12 of the width d 1 of the barrier dam 20
  • the depth of the groove 204 is equal to the thickness of the third insulating layer 2033 .
  • the width d 2 of the groove 204 gradually increases from the side close to the base substrate 11 to the side away from the base substrate 11 , that is, along the thickness direction of the insulation layer group 203 , the cross-sectional shape of the groove 204 is an inverted trapezoid. It should be noted that the width direction of the barrier dam 20 is perpendicular to the extension direction of the barrier dam 20 .
  • the overflowing liquid organic encapsulating material can be allowed to fall directly into the groove 204 to block the continued flow of the liquid organic encapsulating material.
  • the distance d 3 between the barrier dam 20 and the display area 101 is 1/2-3/4 of the width d 1 of the barrier dam 20 .
  • the width d 1 of the barrier dam 20 is set to 60um
  • the distance d 3 between the barrier dam 20 and the display area 101 is 30um-45um
  • the width d 2 of the groove 204 can be set to 20um-35um
  • the width d 2 of the groove 204 can be set to 20um-35um.
  • the depth can be set to 1.5um ⁇ 2.3um
  • the length of the groove 204 is consistent with the length of the barrier dam 20 . More specifically, the width d 2 of the groove 204 can be set to 20 um
  • the depth of the groove 204 can be set to 1.5 um ⁇ 2.0 um
  • the distance d 3 between the barrier dam 20 and the display area 101 is 40 um.
  • the width of the groove 204 should not be too small. If it is too small, it will be difficult to form a continuous recessed portion when the barrier dam 20 is patterned. Of course, the width of the groove 204 should not be too large. If it is too large, the structure of the barrier dam 20 may be damaged, causing the protrusions on both sides of the groove 204 to be removed during exposure and development, and the effect of blocking the organic packaging material will not be achieved.
  • the structure and arrangement of the groove are as shown in Figures 6 and 7.
  • the groove 204 is located in the middle of the barrier dam 20.
  • the groove 204 includes a groove body 2041 and a plurality of grooves.
  • the groove branches 2042 are arranged along the extension direction of the barrier dam 20 .
  • the groove branches 2042 are provided on the side of the groove body 2041 away from the display area 101 and are connected with the groove body 2041 .
  • the plurality of groove branches 2042 are parallel to each other and form an included angle a of 20 degrees to 60 degrees with the groove body 2041 .
  • a groove body 2041 and a groove branch 2042 are formed on the side of the insulating layer group 203 away from the base substrate 11 , and the first inorganic encapsulation layer 171 will form a depression corresponding to the groove branch 2042 and the groove body 2041 .
  • the organic encapsulation layer 172 is formed, the depression corresponding to the groove branch 2042 will destroy the equilibrium state of the surface tension of the liquid organic material. Under the action of the capillary effect, the liquid organic material moves along the depression corresponding to the groove branch 2042.
  • the recess corresponding to the groove body 2041 spreads until it is blocked by the side of the recess corresponding to the groove body 2041 away from the display area 101, which can prevent the problem of organic material overflow due to the inability to accurately control the leveling boundary of the organic material. , avoiding the overflow of organic materials can cause the organic materials to come into contact with external water and oxygen, resulting in packaging failure.
  • the groove body 2041 is a strip groove 204 arranged along the extension direction of the barrier dam 20.
  • the length of the groove body 2041 is equal to the length of the barrier dam 20.
  • the width d6 of the groove body 2041 is always in the extension direction of the groove body 2041.
  • the width d 6 of the groove body 2041 is equal to 1/6-1/4 of the width d 1 of the barrier dam 20
  • the groove branch 2042 is a strip-shaped recess provided obliquely on the side of the groove body 2041 close to the display area 101
  • Groove 204, groove branch 2042 and groove body 2041 are interconnected, groove branch 2042 extends along its inclined direction, the angle a between groove branch 2042 and groove body 2041 is 20 degrees - 60 degrees
  • groove branch The length d4 of the groove branch 2042 is 1 /6-1/2 of the width d1 of the barrier dam 20, and the width d5 of the groove branch 2042 is 1/6-5/12 of the width d1 of the barrier dam 20.
  • the depth of the groove body 2041 and the depth of the groove branches 2042 are always the same in the extension direction of the barrier dam 20 and the width direction of the barrier dam 20 , and are both equal to the thickness of the third insulating layer 2033 .
  • the width d 1 of the barrier dam 20 is set to 60um, and the distance between the barrier dam 20 and the edge of the pixel definition layer 15 is 30um-45um.
  • the width d6 of the groove body 2041 can be set to 10um-15um, and the length of the groove body 2041 is equal to the length of the barrier dam 20.
  • the groove branch 2042 is provided on the side of the groove body 2041 close to the display area 101.
  • the angle a between the groove branch 2042 and the groove body 2041 is 45 degrees.
  • the width d5 of the groove branch 2042 is 10um-25um.
  • the length d 4 is 10um-30um.
  • the depth of the groove main body 2041 and the depth of the groove branches 2042 can both be set to 1.5um ⁇ 2.3um.
  • the width d 6 of the groove body 2041 can be set to 10um
  • the length of the groove body 2041 is equal to the length of the barrier dam 20
  • the width d 5 of the groove branch 2042 can be set to 10um
  • the length of the groove branch 2042 It can be set to 20um
  • the distance between the barrier dam 20 and the edge of the pixel definition layer 15 is 40um.
  • the groove 204 includes a plurality of groove branches 2042 that are parallel to each other.
  • the plurality of groove branches 2042 are located on the barrier dam 20 and close to the display area 101.
  • a plurality of groove branches 2042 form a raised body 205 on the side away from the display area 101, and a plurality of raised branches 206 are formed between the plurality of groove branches 2042, and the raised branches 206 intersect with the raised body 205, Specifically, an included angle b of 20 degrees to 30 degrees is formed between the protruding branches 206 and the protruding main body 205 .
  • the protrusion body 205 and the protrusion branches 206 are formed on the side of the insulating layer group 203 away from the base substrate 11 , and the first inorganic encapsulation layer 171 will form protrusions corresponding to the protrusion body 205 and the protrusion branches 206 .
  • the organic encapsulation layer 172 is formed, the protrusions corresponding to the protruding branches 206 will destroy the equilibrium state of the surface tension of the liquid organic material. Under the action of the capillary effect, the liquid organic material moves along the protrusions corresponding to the protruding branches 206 .
  • a groove branch 2042 is provided on the side of the barrier dam 20 close to the display area 101.
  • the formation of the protruding body 205 and the protruding branches 206 increases the contact area with the liquid organic material, which is approximately closer to the display area 101 than the barrier dam 20. 162% increase when one side is set to flat. The contact area between the liquid organic material and the barrier dam 20 is increased, which can further slow down the flow speed of the liquid organic material.
  • the portions where the protruding main body 205 and the protruding branches 206 are in contact with the liquid organic material can be configured as vertical surfaces, and the portions where the protruding main body 205 and the protruding branches 206 are in contact with the liquid organic material can also be configured as inclined surfaces.
  • the surface of the protruding body 205 close to the display area 101 is an inclined surface that is inclined away from the display area 101 .
  • the surface of the protruding branch 206 close to the display area 101 is an inclined surface that is inclined away from the display area 101 .
  • the width of the protruding branches 206 gradually decreases from the side close to the base substrate 11 to the side away from the base substrate 11 .
  • the contact area of the liquid organic material with the inclined surface is obviously larger than the contact area with the vertical surface, and the protruding body 205 and the protruding branches 206 are in contact with the liquid organic material. Setting the part as a slope further increases the contact area between the liquid organic material and the barrier dam 20, which can further slow down the flow speed of the liquid organic material on the basis of the above.
  • the width d 10 of the raised body 205 is always consistent in the extension direction of the groove body 2041
  • the width d 10 of the raised body 205 is 1/6-1/3 of the width d 1 of the barrier dam 20
  • the raised branches The width d 11 of 206 is 1/3-1/2 of the width d 1 of the barrier dam 20
  • the distance between two adjacent protruding branches 206 is 1/6-5/12 of the width d 1 of the barrier dam 20 .
  • the width d 1 of the barrier dam 20 is set to 50um, and the distance between the barrier dam 20 and the edge of the pixel definition layer 15 is 30um-45um.
  • the width d 10 of the protruding body 205 is 10um-20um, the width d 11 of the protruding branches 206 is 20um-30um, and the distance d 9 between two adjacent protruding branches 206 is 10um-25um.
  • the raised branch 206 includes a horizontal side, a first hypotenuse and a second hypotenuse.
  • the horizontal side is arranged close to the display area.
  • the first hypotenuse and the second hypotenuse are respectively connected to both sides of the horizontal side.
  • the first hypotenuse and the second hypotenuse are parallel to each other, the first hypotenuse and the horizontal side form an included angle b, the second hypotenuse and the horizontal side form an included angle c that is complementary to the included angle b, the first hypotenuse
  • the length d 8 is 20um
  • the length d 7 of the second hypotenuse is 85um
  • the distance between the barrier dam 20 and the edge of the pixel definition layer 15 is 30um.
  • the width of the raised branch 206 located in the second insulating layer 2032 is 35um
  • the width of the raised branch 206 located in the third insulating layer 2033 is 30um
  • the distance between the second insulating layer 2032 of two adjacent raised branches 206 is 20um.
  • the distance between the third insulating layer 2033 of two adjacent protruding branches 206 is 25um.
  • the distance between the barrier dam 20 and the display area 101 of this structure is shorter, which can further reduce the width of the non-display area 102, thereby making the frame of the display panel narrower.
  • the dimensions of all structures of the barrier dam 20 are based on the side close to the base substrate 11 .
  • Figures 11 and 12 show a display panel.
  • An encapsulation layer 17 is provided on the side of the barrier dam 20 away from the base substrate 11.
  • a plurality of touch signal lines 185 are provided on the side of the encapsulation layer 17 away from the base substrate 11.
  • the plurality of touch signal lines 185 may include: a plurality of first traces L1 and a plurality of second traces L2 arranged in parallel along the first direction X; wherein the plurality of first traces L1 are on the substrate 11
  • the orthographic projection is located between the orthographic projection of the barrier dam 20 on the substrate substrate 11 and the display area 101 .
  • the orthographic projection of the plurality of second traces L2 on the substrate substrate 11 is located between the orthographic projection of the barrier dam 20 on the substrate substrate 11 .
  • the side away from the display area 101 is projected.
  • the plurality of touch signal lines 185 may also include: a plurality of third wiring lines L3 and a plurality of fourth wiring lines L4 arranged in parallel along the second direction Y; wherein the second direction Y intersects the first direction X;
  • the three traces L3 and the first trace L1 correspond to a one-to-one structure, and the fourth trace L4 and the second trace L2 correspond to a one-to-one structure; a plurality of third traces L3 and a plurality of fourth traces
  • the orthographic projection of L4 on the base substrate 11 spans the orthographic projection of the barrier dam 20 on the base substrate 11 .
  • the first trace L1 inside the barrier dam 20 can be led out to the outside of the barrier dam 20 , which facilitates the realization of touch signal lines.
  • 185 is connected to the external drive circuit.
  • the second trace L2 outside the barrier dam 20 can be led out to the inside of the barrier dam 20 , which facilitates the connection between the touch signal line 185 and the touch driving metal grid 1811 or the touch sensing metal grid 1812 in the display area 101 electrical connection.
  • the second lead is provided on the side of the encapsulation layer 17 away from the base substrate 11 , specifically on the side of the second inorganic encapsulation layer 173 away from the base substrate 11 .
  • the second inorganic encapsulation layer 173 will be at a position corresponding to the groove 204
  • the groove 204 includes a plurality of groove segments 2040 intermittently arranged along the extension direction of the barrier dam 20, and the second lead is arranged between two adjacent ones. between trough segments 2040.
  • the distance between two adjacent groove segments 2040 is 30um ⁇ 100um.
  • a bending area BA can also be provided on the side of the barrier dam 20 away from the display area 101 .
  • the orthographic projection of the second trace L2 on the substrate substrate 11 may be located between the orthographic projection of the barrier dam 20 on the substrate substrate 11 and the bending area BA;
  • the third trace L3 is on the substrate
  • the orthographic projection on the substrate 11 may be located between the orthographic projection of the corresponding first trace L1 on the substrate 11 and the bending area BA;
  • the orthographic projection of the fourth trace L4 on the substrate 11 may be located between the orthographic projection of the corresponding first trace L1 on the substrate 11 and the bending area BA.
  • the third trace L3 extends from the integrated first trace L1 to the bending area BA, and the fourth trace L4 extends from the integrated second trace L2 to the inside of the barrier dam 20 .
  • the non-display area 102 may also include a pad area PA located on the side of the bending area BA away from the barrier dam 20; the plurality of touch signal lines 185 may also include: a plurality of fifth trace lines L5 arranged in parallel along the second direction Y. and a plurality of sixth traces L6; wherein, a plurality of fifth traces L5 and a plurality of sixth traces L6 are arranged side by side on a side of the second trace L2 adjacent to the central axis of the substrate substrate 11 in the second direction Y. side.
  • the fifth trace L5, the third trace L3 and the first trace L1 correspond to one-to-one structure, and the fifth trace L5 is connected to one end of the central axis adjacent to the first trace L1 through the third trace L3, and
  • the fifth trace L5 extends to the pad area PA through the bending area BA;
  • the sixth trace L6, the fourth trace L4 and the second trace L2 correspond to one-to-one structure, and the fourth trace L4 and the second trace
  • the end of the line L2 away from the central axis is connected to the sixth trace L6 and the end of the second trace L2 adjacent to the central axis is connected, and the sixth trace L6 extends to the pad area PA through the bending area BA.
  • the pad area PA has a plurality of contact pads (or pads, Pads), and each contact pad is configured to be electrically connected to a fifth trace L5 or a sixth trace L6.
  • the contact pads may be exposed on the surface of the pad area PA, that is, not covered by any layer, so as to facilitate electrical connection to the flexible printed circuit board.
  • the flexible printed circuit board is electrically connected to the external controller and is configured to transmit signals or power from the external controller to the fifth trace L5 and the sixth trace L6.
  • the plurality of touch signal lines 185 may also include: a plurality of seventh wiring lines L7 and a plurality of eighth wiring lines L8 arranged in parallel along the second direction Y; wherein the seventh wiring lines L7 and the first wiring lines L1 are one by one.
  • the seventh trace L7 is connected to the end of the first trace L1 away from the central axis;
  • the eighth trace L8 and the fourth trace L4 correspond to an integrated structure, and the eighth trace L8 is connected to the fourth trace L4.
  • the end of the line L4 away from the second trace L2 is connected.
  • the seventh trace L7 can be in the adjacent non-display area 102 extends along the second direction Y.
  • the eighth trace L8 can also be in this phase. It extends in the second direction Y adjacent to the non-display area 102 . This arrangement minimizes the wiring length of the touch signal line 185 , thereby making the resistance value of the touch signal line 185 smaller and avoiding signal delay on the touch signal line 185 .
  • the plurality of touch signal lines 185 can be divided into two groups, and the two groups of touch signal lines 185 are arranged symmetrically with respect to the central axis EF of the substrate substrate 11 in the second direction Y. Specifically, the touch signal lines 185 are routed on both sides of the barrier dam 20 in the same manner on both sides of the central axis EF of the base substrate 11 in the second direction Y, but the details of the two sets of touch signal lines 185 are not limited. Quantity, that is to say, the number of the two sets of touch signal lines 185 can be the same or different. This arrangement facilitates balanced wiring, improves process stability, and enables further narrowing of the non-display area 102 design.
  • Figure 13 shows another display panel.
  • the non-display area 102 of the display panel includes a binding area 1021 and a frame area 1022.
  • the binding area 1021 is located on one side of the display area 101.
  • the binding area 1021 is only provided with a first barrier dam. 202.
  • the insulating layer group 203 of the first barrier dam 202 in the binding area 1021 is provided with a groove 204 on the side away from the base substrate 11; the frame area 1022 is provided on the other side of the display area 101, and the frame area 1022 is along the edge away from the display.
  • a first barrier dam 202 and a second barrier dam 201 are arranged in sequence in the direction of the area 101.
  • the first barrier dam 202 is arranged around the display area 101
  • the second barrier dam 201 is arranged around the first barrier dam 202.
  • Embodiments of the present disclosure provide a display device.
  • the display device may include any of the above display panels.
  • the display device also includes other necessary components and components, taking a display as an example, such as a casing, a circuit board, a power cord, etc.
  • a display such as a casing, a circuit board, a power cord, etc.
  • Those skilled in the art can determine the configuration of the display device based on the details of the display device. The specific usage requirements will be supplemented accordingly and will not be repeated here.
  • the display device can be a traditional electronic device, such as a mobile phone, a computer, a television, or a camcorder, or it can be an emerging wearable device, such as VR glasses, which are not listed here.

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Abstract

一种显示面板及显示装置。显示面板包括衬底基板（11）、第一引线、阻挡坝（20）和封装层（17）。第一引线设于衬底基板（11）的一侧，自显示区（101）延伸至非显示区（102）。阻挡坝（20）设于非显示区（102），且围绕显示区（101）设置，阻挡坝（20）包括绝缘层组（203），绝缘层组（203）设于第一引线远离衬底基板（11）的一侧，绝缘层组（203）远离衬底基板（11）的一侧设有凹槽（204），凹槽（204）的深度小于绝缘层组（203）的厚度。封装层（17）设于阻挡坝（20）远离衬底基板（11）的一侧，封装层（17）包括有机封装层（172），有机封装层（172）远离显示区（101）的边沿在衬底基板（11）上的正投影位于阻挡坝（20）在衬底基板（11）上的正投影内，从而非显示区（102）设置阻挡坝（20）的区域的宽度变小。

Description

显示面板及显示装置 技术领域
本公开涉及显示技术领域，具体而言，涉及一种显示面板及显示装置。
背景技术
根据市场需求，越来越多的消费者对显示装置的边框的要求越来高，追求极窄边框。
目前，显示面板封装时，为防止有机封装层外溢的情况出现，通常在非显示区设置多个阻挡坝，增大了非显示的宽度。
需要说明的是，在上述背景技术部分公开的信息仅用于加强对本公开的背景的理解，因此可以包括不构成对本领域普通技术人员已知的现有技术的信息。
发明内容
本公开的目的在于克服上述现有技术的不足，提供一种显示面板及显示装置。
根据本公开的一个方面，提供一种显示面板，具有显示区和与显示区连接的非显示区，显示面板包括衬底基板、第一引线、阻挡坝和封装层；第一引线设于衬底基板的一侧，自显示区延伸至非显示区；阻挡坝设于非显示区，且围绕显示区设置，阻挡坝包括绝缘层组，绝缘层组设于第一引线远离衬底基板的一侧，绝缘层组远离衬底基板的一侧设有凹槽，凹槽的深度小于绝缘层组的厚度；封装层设于阻挡坝远离衬底基板的一侧，封装层包括有机封装层，有机封装层远离显示区的边沿在衬底基板上的正投影位于阻挡坝在衬底基板上的正投影内。
在本公开的一个实施例中，凹槽包括多个相互平行的凹槽分支，多个凹槽分支位于阻挡坝靠近显示区的一侧，多个凹槽分支远离显示区的一侧形成凸起主体，多个凹槽分支之间形成多个凸起分支，凸起分支与凸起主体相交。
在本公开的一个实施例中，凸起分支与凸起主体之间形成20度-30度的夹角。
在本公开的一个实施例中，凸起主体的宽度为阻挡坝宽度的1/6-1/3，凸起分支的宽度为阻挡坝宽度的1/3-1/2，相邻两个凸起分支之间的距离为阻挡坝宽度的1/6-5/12。
在本公开的一个实施例中，沿显示面板的厚度方向，凸起分支的宽度自靠近衬底基板的一侧向远离衬底基板的一侧逐渐缩小。
在本公开的一个实施例中，凸起分支靠近显示区的一面为向远离显示区的方向倾斜的斜面，凸起主体靠近显示区的一面为向远离显示区的方向倾斜的斜面。
在本公开的一个实施例中，凹槽位于阻挡坝的中部，凹槽包括凹槽主体和多个凹槽分支，凹槽主体沿阻挡坝的延伸方向设置，多个凹槽分支设于凹槽主体靠近显示区的一侧，且与凹槽主体连通。
在本公开的一个实施例中，多个凹槽分支相互平行，且与凹槽主体之间形成20度-60度的夹角。
在本公开的一个实施例中，凸起主体的宽度为1/6-1/3，凸起分支的宽度为阻挡坝宽度的1/3-1/2，相邻两个凸起分支之间的距离为阻挡坝宽度的1/6-5/12。
在本公开的一个实施例中，凹槽位于阻挡坝的中部，凹槽的宽度自靠近衬底基板的一侧向远离衬底基板的一侧逐渐增大。
在本公开的一个实施例中，凹槽的宽度为阻挡坝宽度的1/3-7/12。
在本公开的一个实施例中，凹槽的深度等于凹槽的深度等于第三绝缘层的厚度，或第二绝缘层的厚度与第三绝缘层的厚度之和。
在本公开的一个实施例中，阻挡坝的宽度为50um～80um。
在本公开的一个实施例中，凹槽包括沿阻挡坝的延伸方向间断设置的多个槽段，显示面板还包括第二引线，第二引线设于封装层远离衬底基板的一侧，且位于相邻两个槽段之间。
在本公开的一个实施例中，相邻两个槽段之间的距离为30um～100um。
在本公开的一个实施例中，显示面板还包括第一平坦化层和像素界 定层，第一平坦化层设于第一引线远离衬底基板的一侧，且位于显示区；像素界定层设于第一平坦化层远离衬底基板的一侧；绝缘层组包括依次远离衬底基板的第一绝缘层和第三绝缘层，第一绝缘层与第一平坦化层同层同材料设置，第三绝缘层与像素界定层同层同材料设置。
在本公开的一个实施例中，显示面板还包括第二平坦化层，第二平坦化层设于第一平坦化层与像素界定层之间；绝缘层组还包括第二绝缘层，第二绝缘层设于第一绝缘层与第三绝缘层之间，且与第二平坦化层同层同材料设置。
在本公开的一个实施例中，非显示区包括绑定区和边框区，绑定区设于显示区一侧，绑定区设有一个阻挡坝；边框区设于显示区的其他侧，边框区沿远离显示区的方向依次设有多个阻挡坝。
在本公开的一个实施例中，凹槽位于绑定区的阻挡坝的绝缘层组远离衬底基板的一侧。
根据本公开的另一个方面，提供一种显示装置，包括本公开的一个方面所述的显示面板。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性和解释性的，并不能限制本公开。
附图说明
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本公开的实施例，并与说明书一起用于解释本公开的原理。显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本公开实施例涉及的一种显示面板的剖面结构图。
图2为本公开实施例涉及的另一种显示基板的剖面结构图。
图3为本公开实施例涉及的另一种显示基板的局部剖面结构图
图4为本公开实施例涉及的另一种显示基板的一种阻挡坝的示意图。
图5为图4中A部位的局部放大图。
图6为本公开实施例涉及的另一种显示基板的另一种阻挡坝的示意 图。
图7为图6中B部位的局部放大图。
图8为本公开实施例涉及的另一种显示基板的又一种阻挡坝的示意图。
图9为图8的C-C剖视图。
图10为本公开实施例涉及的另一种显示面板的又一种阻挡坝的局部立体图。
图11为本公开实施例涉及的另一种显示面板的平面示意图。
图12为图11中N部位的局部放大图。
图13为本公开实施例涉及的又一种显示面板的平面示意图。
附图标记说明：
101-显示区，102-非显示区，1021-绑定区，1022-边框区；
10-驱动背板，11-衬底基板，12-缓冲层；
13-驱动电路层，131-有源层，132-栅绝缘层，133-栅极，134-层间绝缘层，135-层间介质层，1361-第一源极，1362-漏极，137-保护层，1381-第二源极，139-数据线；
14-平坦化层组，141-第一平坦化层，142-第二平坦化层；
15-像素界定层，151-像素开口；
16-像素层，161-像素电极，162-发光层，163-公共电极；
17-封装层，171-第一无机封装层，172-有机封装层，173-第二无机封装层；
18-触感控制层，181-第一触感控制层，1811-触控驱动金属网格，1812-触控感应金属网格，182-第二触感控制层，183-第二钝化层，184-第一钝化层，185-触控信号线，1851-第一部分，1852-第二部分；
20-阻挡坝，201-第二阻挡坝，202-第一阻挡坝；
203-绝缘层组，2031-第一绝缘层，2032-第二绝缘层，2033-第三绝缘层；
204-凹槽，2040-槽段，2041-凹槽主体，2042-凹槽分支；
205-凸起主体，206-凸起分支。
具体实施方式
现在将参考附图更全面地描述示例实施方式。然而，示例实施方式能够以多种形式实施，且不应被理解为限于在此阐述的实施方式；相反，提供这些实施方式使得本公开将全面和完整，并将示例实施方式的构思全面地传达给本领域的技术人员。图中相同的附图标记表示相同或类似的结构，因而将省略它们的详细描述。此外，附图仅为本公开的示意性图解，并非一定是按比例绘制。
虽然本说明书中使用相对性的用语，例如“上”“下”来描述图标的一个组件对于另一组件的相对关系，但是这些术语用于本说明书中仅出于方便，例如根据附图中所述的示例的方向。能理解的是，如果将图标的装置翻转使其上下颠倒，则所叙述在“上”的组件将会成为在“下”的组件。当某结构在其它结构“上”时，有可能是指某结构一体形成于其它结构上，或指某结构“直接”设置在其它结构上，或指某结构通过另一结构“间接”设置在其它结构上。
用语“一个”、“一”、“该”、“所述”和“至少一个”用以表示存在一个或多个要素/组成部分/等；用语“包括”和“具有”用以表示开放式的包括在内的意思并且是指除了列出的要素/组成部分/等之外还可存在另外的要素/组成部分/等；用语“第一”、“第二”和“第三”等仅作为标记使用，不是对其对象的数量限制。
如图1所示，显示面板一般可以包括衬底基板11、驱动电路层13、平坦化层组14和像素层16，驱动电路层13设于衬底基板11的一侧，平坦化层组14设于驱动电路层13远离衬底基板11的一侧，像素层16设于平坦化层组14远离衬底基板11的一侧。另外，显示面板还可以包括缓冲层12，缓冲层12设于衬底基板11与驱动电路层13之间。
衬底基板11可以为无机材料的衬底基板，也可以为有机材料的衬底基板。举例而言，在本公开的一种实施方式中，衬底基板11的材料可以为钠钙玻璃(soda-lime glass)、石英玻璃、蓝宝石玻璃等玻璃材料，或者可以为不锈钢、铝、镍等金属材料。
在本公开的另一种实施方式中，衬底基板11也可以为柔性衬底基板，例如衬底基板11的材料可以为聚酰亚胺(polyimide，PI)。衬底基板11 还可以为多层材料的复合，举例而言，在本公开的一种实施方式中，衬底基板11可以包括依次层叠设置的底膜层(Bottom Film)、压敏胶层、第一聚酰亚胺层和第二聚酰亚胺层。
在本公开中，驱动电路层13设置有用于驱动子像素的驱动电路。在驱动电路层13中，任意一个驱动电路可以包括有晶体管和存储电容。进一步地，晶体管可以为薄膜晶体管，薄膜晶体管可以选自顶栅型薄膜晶体管、底栅型薄膜晶体管或者双栅型薄膜晶体管；以顶栅型薄膜晶体管为例，驱动电路层13可包括有源层131、栅绝缘层132、栅极133、第一源漏金属层，其中：
有源层131设于衬底基板11的一侧，且位于显示区101。有源层131的材料可以为非晶硅半导体材料、低温多晶硅半导体材料、金属氧化物半导体材料、有机半导体材料或者其他类型的半导体材料；因此薄膜晶体管可以为N型薄膜晶体管或者P型薄膜晶体管。有源层131可包括沟道区和位于沟道区两侧的两个不同掺杂类型的掺杂区。
栅绝缘层132可覆盖有源层131和衬底基板11，且栅绝缘层132的材料为氧化硅等绝缘材料。
栅极1331设于显示区101。栅极1331设于栅绝缘层132远离衬底基板11的一侧，且与有源层131正对，即栅极1331在衬底基板11上的投影位于有源层131在衬底基板11的投影范围内，例如，栅极1331在衬底基板11上的投影与有源层131的沟道区在衬底基板11的投影重合。
驱动电路层13还包括层间绝缘层134，层间绝缘层134覆盖栅极1331和栅绝缘层132，驱动电路层13还包括层间介质层135，层间介质层135设于层间绝缘层134远离衬底基板11的一侧。层间绝缘层134及层间介质层135均为绝缘材料，但层间绝缘层134与层间介质层135的材料可以不同。
第一源漏金属层设于层间介质层135远离衬底基板11的表面，第一源漏金属层包括第一源极1361和漏极1362，第一源极1361和漏极1362设于显示区101，且与有源层131连接，例如，第一源极1361和漏极1362分别通过过孔与对应的有源层131的两个掺杂区连接。
在第一源漏金属层远离衬底基板11的一侧设保护层137，保护层137 覆盖第一源漏金属层。第一源漏金属层远离衬底基板11的一侧设平坦化层组14，平坦化层组14设于保护层137远离衬底基板11的一侧，平坦化层组14覆盖保护层137，且平坦化层组14远离衬底基板11的表面为平面。
具体地，平坦化层组14可以包括第一平坦化层141，第一平坦化层141覆盖保护层137。显示面板还可以包括第二源漏金属层，第二源漏金属层远离衬底基板11的一侧设第二平坦化层142，第二平坦化层142覆盖第二源漏金属层以及第一平坦化层141远离衬底基板11的一侧。第二源漏金属层包括第二源极1381，第二源极1381通过过孔与第一源极1361连接。
需要说明的是，驱动电路层13还包括第一引线，第一引线可以包括数据线139，数据线139与阵列基板中的第一源极1361、漏极1362或第二源极1381同层分布。需要说明的是，第一引线由显示区延伸至非显示区。
在平坦化层组14远离衬底基板11的一侧可以设置有像素界定层15和像素层16，像素界定层15和像素层16位于显示区101。像素界定层15具有多个像素开口151，像素层16包括多个子像素，多个子像素分别设于多个像素开口151内。多个子像素阵列分布于驱动背板10远离衬底基板11的一侧，具体子像素可以位于平坦化层组14远离衬底基板11的一侧。需要说明的是，子像素根据发光颜色的不同，可以包括红色子像素、绿色子像素和蓝色子像素。
像素层16可以包括多个像素电极161、发光层162和公共电极163，像素电极161位于驱动背板10远离衬底基板11的表面，发光层162设于像素电极161远离衬底基板11的表面，公共电极163设于发光层162远离衬底基板11的表面。
像素电极161与第一源极1361或第二源极1381连接。当驱动电路层13仅包括第一源极1361和第一平坦化层141时，像素电极161穿过第一平坦化层141上的过孔与第一源极1361连接，设置像素界定层15覆盖第一电极161、第一平坦化层141。当驱动电路层13还包括第二源漏金属层和第二平坦化层142时，像素电极161穿过第二平坦化层142 上的过孔与第二源极1381连接，设置像素界定层15覆盖第二源漏金属层和第二平坦化层142。
公共电极163可作为阴极，像素电极161可作为阳极，像素电极161与电源的正极相连，公共电极163与电源的负电极相连，可通过像素电极161和公共电极163施加信号可驱动发光层162发光，以显示图像，具体发光原理在此不再详述。发光层162可包含电致有机发光材料，例如，发光层162可包括依次层叠于像素电极161上的辅助层和发光材料层。一般在掩膜板上设图案区，采用蒸镀等工艺形成不同颜色子像素的辅助层及不同颜色子像素的发光层162。
此外，本公开的显示面板还可包括封装层17，封装层17设于像素层16远离衬底基板11的一侧，从而将像素层16包覆起来，防止水氧侵蚀。封装层17可为单层或多层结构，封装层17的材料可包括有机或无机材料，在此不做特殊限定。
在本实施例中，封装层17可以包括第一无机封装层171、有机封装层172和第二无机封装层173，第一无机封装层171设于像素层16远离衬底基板11的一侧，有机封装层172设于第一无机封装层171远离衬底基板11的一侧，第二无机封装层173设于有机封装层172远离衬底基板11的一侧。
因为液态的有机封装材料的流动，容易出现液态的有机封装材料外溢的情况，为了防止有机封装材料外溢，尤其是下侧的边框位置，一直以来都是在非显示区102设有依次远离显示区101的多个阻挡坝20，采用多个阻挡坝20起到多重阻挡的作用。
以两个阻挡坝20为例进行说明，阻挡坝20设于保护层137远离衬底基板11的一侧，包括第一阻挡坝202和第二阻挡坝201，第一阻挡坝202环绕显示区101设置；第二阻挡坝201环绕第一阻挡坝202设置；第一阻挡坝202和第二阻挡坝201远离衬底基板11的一侧设有封装层17。
第一阻挡坝202和第二阻挡坝201的叠层图案包括绝缘层组203，绝缘层组203与第一平坦化层141、第二平坦化层142和像素界定层15的一层或多层同层材料设置。
第一阻挡坝202的叠层图案和第二阻挡坝201的叠层图案可以设置为相同。第一阻挡坝202和第二阻挡坝201的叠层图案均包括第一绝缘层2031，第一绝缘层2031与第一平坦化层141同层同材料设置。还可以在第一绝缘层2031上设第二绝缘层2032，第二绝缘层2032与第二平坦化层142同层同材料设置。还可以在第二绝缘层2032上设第三绝缘层2033，第三绝缘层2033与像素界定层15同层同材料设置。
第一阻挡坝202的叠层图案和第二阻挡坝201的叠层图案可以设置为不同。例如：第一阻挡坝202的叠层图案包括第二绝缘层2032和第三绝缘层2033，第二绝缘层2032与第二平坦化层142同层同材料设置，第三绝缘层2033与像素界定层15同层同材料设置。第二阻挡坝201的叠层图案包括第一绝缘层2031、第二绝缘层2032和第三绝缘层2033，第一绝缘层2031与第一平坦化层141同层同材料设置，第二绝缘层2032与第二平坦化层142同层同材料设置，第三绝缘层2033与像素界定层15同层同材料设置。
由于第一阻挡坝202比第二阻挡坝201少了第一绝缘层2031的膜层图案，所以第一阻挡坝202相对于衬底基板11的高度比第二阻挡坝201相对于衬底基板11的高度低，这样使外部水汽和氧气进入显示区101的路径变长，增加进入显示区101的难度，进一步提高阻挡坝20的阻挡能力。
虽然多个阻挡坝20进行封装能防止有机封装材料外溢，还能起到很好的阻挡作用，但阻挡坝20的数量越多，在非显示区102设置阻挡坝20所占用的区域的宽度越大，导致显示面板的非显示区102的宽度较大。
显示区101还包括触感控制层18，触感控制层18可以为互容式触感控制，其中，触感控制层18包括第一触感控制层181和第二触感控制层182，第一触感控制层181可以为金属网格层(Metal Mesh，MM)，第二触感控制层182可以为桥接金属层(Bridge Metal，BM)，第一触感控制层181也可以为桥接金属层(Bridge Metal，BM)，第二触感控制层182可以为金属网格层(Metal Mesh，MM)。下面以第一触感控制层181为金属网格层(Metal Mesh，MM)，第二触感控制层182为桥接金属层(Bridge Metal，BM)进行说明。第一触感控制层181位于显示 区101，按照横纵方向可以分为触控驱动金属网格1811和触控感应金属网格1812，其中，触控感应金属网格1812和触控驱动金属网格1811中的一个相互连接，另一个通过第二触感控制层182连接。第一触感控制层181远离衬底基板11的一侧设有第一钝化层184，第二触感控制层182远离衬底基板11的一侧设有第二钝化层183。
在非显示区102，第二无机封装层173远离衬底基板11的一侧设有第二引线，第二引线可以是触控信号线185，多条触控信号线185与触控驱动金属网格1811、触控感应金属网格1812分别对应电连接。触控信号线185可以包括：与金属网格层MM同层设置的第一部分1851，以及与桥接金属层BM同层设置并与第一部分1851电连接的第二部分1852。
通过将触控信号线185设置为包括第一部分1851和第二部分1852的双层走线，可以使得在其中一层走线局部断裂后，仍可通过另一层走线对金属网格层MM加载触控信号，从而有效解决了单层走线断裂容易导致触控失效的问题；另外，相较于单层走线的设计，双层走线还可以减小触控信号线185的电阻值。在具体实施时，第一部分1851与第二部分1852之间通过贯穿无机绝缘层的过孔电连接。
但触控信号线185通常设于阻挡坝20与显示区的边沿之间，但该区域的宽度有限，要设置所有的触控信号线185，需要该区域的宽度，这样会增加显示面板非显示区的宽度。
基于此，本公开实施方式提供了一种显示面板。如图2至图12所示，该显示面板，具有显示区101和与显示区101连接的非显示区102，显示面板包括衬底基板11、第一引线、阻挡坝20和封装层17；第一引线设于衬底基板11的一侧，自显示区101延伸至非显示区102；阻挡坝20设于非显示区102，且围绕显示区101设置，阻挡坝20包括绝缘层组203，绝缘层组203设于第一引线远离衬底基板11的一侧，绝缘层组203远离衬底基板11的一侧设有凹槽204，凹槽204的深度小于绝缘层组203的厚度；封装层17设于阻挡坝20远离衬底基板11的一侧，封装层17包括有机封装层172，有机封装层172远离显示区101的边沿在衬底基板11上的正投影位于阻挡坝20在衬底基板11上的正投影内。
阻挡坝20包括绝缘层组203，绝缘层组203远离衬底基板11的一侧设有凹槽204，液态的有机封装材料由显示区101流动至阻挡坝20的最高点后，多余的液态有机封装材料可以直接落入凹槽204内，避免多余的液态有机封装材料跨过阻挡坝20流动至封装区外，使得有机封装层172远离显示区101的边沿在衬底基板11上的正投影位于阻挡坝20在衬底基板11上的正投影内。该显示面板仅包括一个阻挡坝20，非显示区102设置阻挡坝20的区域的宽度变小，从而整个非显示区102的宽度变小。
如图2和图3所示，该显示面板的显示区与图1示出的显示面板的显示区基本相同，因此不再进行赘述。不同之处在于，该显示面板的非显示区102仅包括一个阻挡坝20，阻挡坝20包括绝缘层组203，绝缘层组203包括依次远离衬底基板11的第一绝缘层2031、第二绝缘层2032和第三绝缘层2033，第一绝缘层2031与第一平坦化层141同层同材料设置，第二绝缘层2032与第二平坦化层142同层同材料设置，第三绝缘层2033与像素界定层15同层同材料设置，绝缘层组203远离衬底基板11的一侧设有凹槽204。需要说明的是，阻挡坝的宽度为50um～80um。
在本实施例中，凹槽的结构及设置方式如图4和图5所示，沿阻挡坝20的宽度方向，绝缘层组203远离衬底基板11的一侧设有凹槽204，凹槽204位于阻挡坝20的中部，凹槽204的一个槽壁与阻挡坝20靠近显示区101的一面之间的距离，等于凹槽204与一个槽壁相对的另一个槽壁与阻挡坝20远离显示区101的一面之间的距离。凹槽204的长度等于阻挡坝20的长度，凹槽204的宽度d 2为阻挡坝20宽度d 1的1/3-7/12，凹槽204的深度等于第三绝缘层2033的厚度。凹槽204的宽度d 2自靠近衬底基板11的一侧向远离衬底基板11的一侧逐渐增大，即沿绝缘层组203的厚度方向，凹槽204的截面形状为倒梯形。需要说明的是，阻挡坝20的宽度方向垂直于阻挡坝20的延伸方向。可以让外溢的液态有机封装材料直接落入凹槽204内，阻挡液态有机封装材料的继续流动。阻挡坝20与显示区101之间的距离d 3为阻挡坝20宽度d 1的1/2-3/4。
举例说明，阻挡坝20的宽度d 1设为60um，阻挡坝20与显示区101之间的距离d 3为30um-45um，凹槽204的宽度d 2可以设为20um-35um， 凹槽204的深度可以设为1.5um～2.3um，凹槽204的长度同阻挡坝20的长度保持一致。更为具体地，凹槽204的宽度d 2可以设为20um，凹槽204的深度可以设为1.5um～2.0um，阻挡坝20与显示区101之间的距离d 3为40um。
需要说明的是，凹槽204的宽度不宜太小，太小难以在阻挡坝20图形化时，形成连续的凹陷部。当然，凹槽204的宽度也不宜太大，太大可能会破坏阻挡坝20的结构，使得凹槽204两边的凸起在曝光显影时被去掉，起不到阻挡有机封装材料的效果。
在本实施例中，凹槽的结构及设置方式如图6和图7所示，沿阻挡坝20的宽度方向，凹槽204位于阻挡坝20的中部，凹槽204包括凹槽主体2041和多个凹槽分支2042，凹槽主体2041沿阻挡坝20的延伸方向设置，多个凹槽分支2042设于凹槽主体2041远离显示区101的一侧，且与凹槽主体2041连通。多个凹槽分支2042相互平行，且与凹槽主体2041之间形成20度-60度的夹角a。
在绝缘层组203远离衬底基板11的一侧形成凹槽主体2041和凹槽分支2042，第一无机封装层171会形成对应于凹槽分支2042和凹槽主体2041的凹陷。在形成有机封装层172时，对应于凹槽分支2042的凹陷将破坏液态的有机材料的表面张力的平衡状态，在毛细效应的作用下，液态的有机材料沿对应于凹槽分支2042的凹陷向对应于凹槽主体2041的凹陷扩散，直至被对应于凹槽主体2041的凹陷远离显示区101的一侧阻挡，可防止因无法准确控制有机材料的流平边界而出现的有机材料溢流的问题，避免有机材料溢流可使有机材料与外界水氧接触，导致封装失效。
凹槽主体2041为沿阻挡坝20延伸方向设置的条形凹槽204，凹槽主体2041的长度等于阻挡坝20的长度，凹槽主体2041的宽度d 6在凹槽主体2041的延伸方向上始终保持一致，凹槽主体2041的宽度d 6等于阻挡坝20宽度d 1的1/6-1/4，凹槽分支2042为倾斜设置于凹槽主体2041靠近显示区101的一侧的条形凹槽204，凹槽分支2042与凹槽主体2041相互连通，凹槽分支2042沿其倾斜方向延伸，凹槽分支2042与凹槽主体2041之间的夹角a为20度-60度，凹槽分支2042的长度d 4为阻挡坝 20宽度d 1的1/6-1/2，凹槽分支2042的宽度d 5为阻挡坝20宽度d 1的1/6-5/12。
需要说明的是，凹槽主体2041的深度和凹槽分支2042的深度在阻挡坝20的延伸方向和阻挡坝20的宽度方向始终相同，均等于第三绝缘层2033的厚度。
举例说明，阻挡坝20的宽度d 1设为60um，阻挡坝20与像素界定层15的边沿之间的距离为30um-45um。凹槽主体2041的宽度d 6可以设为10um-15um，凹槽主体2041的长度等于阻挡坝20的长度。凹槽分支2042设于凹槽主体2041靠近显示区101的一侧，凹槽分支2042与凹槽主体2041之间的夹角a为45度，凹槽分支2042的宽度d 5为10um-25um，长度d 4为10um-30um。凹槽主体2041的深度和凹槽分支2042的深度均可以设为1.5um～2.3um。更为具体地，凹槽主体2041的宽度d 6可以设为10um，凹槽主体2041的长度等于阻挡坝20的长度，凹槽分支2042的宽度d 5可以设为10um，凹槽分支2042的长度可以设为20um，阻挡坝20与像素界定层15的边沿之间的距离为40um。
在本实施例中，凹槽的结构及设置方式如图8至图10所示，凹槽204包括多个相互平行的凹槽分支2042，多个凹槽分支2042位于阻挡坝20靠近显示区101的一侧，多个凹槽分支2042远离显示区101的一侧形成凸起主体205，多个凹槽分支2042之间形成多个凸起分支206，凸起分支206与凸起主体205相交，具体凸起分支206与凸起主体205之间形成20度-30度的夹角b。
在绝缘层组203远离衬底基板11的一侧形成凸起主体205和凸起分支206，第一无机封装层171会形成对应于凸起主体205和凸起分支206的凸起。在形成有机封装层172时，对应于凸起分支206的凸起将破坏液态的有机材料的表面张力的平衡状态，在毛细效应的作用下，液态的有机材料沿对应于凸起分支206的凸起向对应于凸起主体205的凸起扩散，直至被对应于凸起主体205的靠近显示区101的一侧阻挡，可防止因无法准确控制有机材料的流平边界而出现的有机材料溢流的问题，避免有机材料溢流可使有机材料与外界水氧接触，导致封装失效。
另外，阻挡坝20靠近显示区101的一侧设置凹槽分支2042，形成 凸起主体205和凸起分支206的情况增大了与液态有机材料的接触面积，大约比阻挡坝20靠近显示区101的一侧设为平面的情况增加162％。液态有机材料与阻挡坝20接触的面积增加，可进一步延缓液态有机材料的流动速度。
凸起主体205及凸起分支206与液态有机材料接触的部位可以设为垂直面，凸起主体205及凸起分支206与液态有机材料接触的部位也可以设为斜面。在本实施例中，凸起主体205靠近显示区101的一面为向远离显示区101的方向倾斜的斜面。凸起分支206靠近显示区101的一面为向远离显示区101的方向倾斜的斜面。沿显示面板的厚度方向，凸起分支206的宽度自靠近衬底基板11的一侧向远离衬底基板11的一侧逐渐缩小。
在绝缘层的厚度和凹槽204的深度不变的情况下，液态有机材料接触与斜面的接触面积显然是大于与垂直面的接触面积，凸起主体205及凸起分支206与液态有机材料接触的部位设为斜面进一步增大了液态有机材料与阻挡坝20接触的面积，可在上述基础上进一步延缓液态有机材料的流动速度。
其中，凸起主体205的宽度d 10在凹槽主体2041的延伸方向上始终保持一致，凸起主体205的宽度d 10为阻挡坝20宽度d 1的1/6-1/3，凸起分支206的宽度d 11为阻挡坝20宽度d 1的1/3-1/2，相邻两个凸起分支206之间的距离为阻挡坝20宽度d 1的1/6-5/12。
举例说明，阻挡坝20的宽度d 1设为50um，阻挡坝20与像素界定层15的边沿之间的距离为30um-45um。凸起主体205的宽度d 10为10um-20um，凸起分支206的宽度d 11为20um-30um，相邻两个凸起分支206之间的距离d 9为10um-25um。
当凸起分支206与凸起主体205之间的夹角b为20度时，凸起分支206远离凸起主体205的一侧与凸起主体205之间的距离d 12为30um，凸起分支206的宽度为d 11为30um，凸起分支206包括水平边、第一斜边和第二斜边，水平边靠近显示区设置，第一斜边和第二斜边分别连接于水平边的两端，第一斜边与第二斜边相互平行，第一斜边与水平边之间形成夹角b，第二斜边与水平边形成与夹角b互补的夹角c，第一斜边 的长度d 8为20um，第二斜边的长度d 7为85um，阻挡坝20与像素界定层15的边沿之间的距离为30um。
凸起分支206位于第二绝缘层2032的宽度为35um，凸起分支206位于第三绝缘层2033的宽度为30um，相邻两个凸起分支206的第二绝缘层2032之间的距离为20um，相邻两个凸起分支206的第三绝缘层2033之间的距离为25um。
可以理解的是，该结构的阻挡坝20与显示区101之间的距离更短，可以进一步减小非显示区102的宽度，从而使得显示面板的边框更窄。
需要说明的是，阻挡坝20所有结构涉及的尺寸均以靠近衬底基板11的一侧为基准。
图11和图12示出了一种显示面板，阻挡坝20远离衬底基板11的一侧设置封装层17，封装层17远离衬底基板11的一侧设有多条触控信号线185，多条触控信号线185可以包括：沿第一方向X平行设置的多条第一走线L1和多条第二走线L2；其中，多条第一走线L1在衬底基板11上的正投影位于阻挡坝20在衬底基板11上的正投影与显示区101之间，多条第二走线L2在衬底基板11上的正投影位于阻挡坝20在衬底基板11上的正投影远离显示区101的一侧。
通过将多条第一走线L1放置在阻挡坝20内侧的非显示区102，并将与第一走线L1平行设置的多条第二走线L2设置在阻挡坝20外侧的非显示区102，从而可以将阻挡坝20外侧的空间合理利用起来，进而有效减小了阻挡坝20以内非显示区102的宽度，利于实现更窄边框设计的产品需求。
多条触控信号线185还可以包括：沿第二方向Y平行设置的多条第三走线L3和多条第四走线L4；其中，第二方向Y与第一方向X交叉设置；第三走线L3与第一走线L1一一对应为一体结构，第四走线L4与第二走线L2一一对应为一体结构；多条第三走线L3、以及多条第四走线L4在衬底基板11上的正投影跨越阻挡坝20在衬底基板11上的正投影。
通过设置跨越阻挡坝20的多条第三走线L3和多条第四走线L4，一方面可以将阻挡坝20内侧的第一走线L1引出至阻挡坝20外侧，利于实 现触控信号线185与外部驱动电路连接。另一方面，可以将阻挡坝20外侧的第二走线L2引出至阻挡坝20内侧，利于实现触控信号线185与显示区101内触控驱动金属网格1811或触控感应金属网格1812的电连接。
第二引线设于封装层17远离衬底基板11的一侧，具体是设于第二无机封装层173远离衬底基板11的一侧，第二无机封装层173会在凹槽204对应的位置形成凹陷，为了防止第二引线落入第二无机封装层173表面的凹陷内，凹槽204包括沿阻挡坝20的延伸方向间断设置的多个槽段2040，将第二引线设于相邻两个槽段2040之间。能够消除形成第二引线时，因阻挡坝20远离衬底基板11的一侧不平坦导致第二引线分布不均，相邻两根第二引线之间因曝光不充分存在残留，造成相邻之间可能相互接触所引起短路的风险。具体地，相邻两个槽段2040之间的距离为30um～100um。
还可以在阻挡坝20远离显示区101的一侧设置弯折区BA。在这种情况下，第二走线L2在衬底基板11上的正投影可以位于阻挡坝20在衬底基板11上的正投影与弯折区BA之间；第三走线L3在衬底基板11上的正投影可以位于对应第一走线L1在衬底基板11上的正投影与弯折区BA之间；第四走线L4在衬底基板11上的正投影可以位于对应第二走线L2在衬底基板11上的正投影与第一走线L1在衬底基板11上的正投影之间。换言之，第三走线L3自一体化设计的第一走线L1处向弯折区BA延伸，第四走线L4自一体化设计的第二走线L2处向阻挡坝20内侧延伸。
非显示区102还可以包括位于弯折区BA远离阻挡坝20一侧的焊盘区PA；多条触控信号线185还可以包括：沿第二方向Y平行设置的多条第五走线L5和多条第六走线L6；其中，多条第五走线L5和多条第六走线L6并排设置于第二走线L2邻近衬底基板11在第二方向Y上的中心轴的一侧。
第五走线L5、第三走线L3与第一走线L1一一对应为一体结构，第五走线L5通过第三走线L3与第一走线L1邻近的中心轴的一端相连，且第五走线L5经过弯折区BA延伸至焊盘区PA；第六走线L6、第四走 线L4与第二走线L2一一对应为一体结构，第四走线L4与第二走线L2远离中心轴的一端相连，第六走线L6与第二走线L2邻近中心轴的一端相连，且第六走线L6经过弯折区BA延伸至焊盘区PA。
焊盘区PA具有多个接触垫(或称焊盘、Pad)，每个接触垫被配置为电连接一条第五走线L5或一条第六走线L6。接触垫可以是暴露在焊盘区PA表面的，即不被任何层覆盖，这样便于电连接到柔性印刷电路板。柔性印刷电路板与外部控制器电连接，被配置为将来自外部控制器的信号或电力传输至第五走线L5和第六走线L6。
多条触控信号线185还可以包括：沿第二方向Y平行设置的多条第七走线L7和多条第八走线L8；其中，第七走线L7与第一走线L1一一对应为一体结构，第七走线L7与第一走线L1远离中心轴的一端相连；第八走线L8与第四走线L4一一对应为一体结构，第八走线L8与第四走线L4远离第二走线L2的一端相连。
由于第一走线L1远离中心轴的一端位于多条第三走线L3所在非显示区102的相邻非显示区102内，因此，第七走线L7可以在该相邻非显示区102内沿第二方向Y上延伸。另外，由于第四走线L4远离第二走线L2的一端位于多条第三走线L3所在非显示区102的相邻非显示区102内，因此，第八走线L8也可以在该相邻非显示区102内沿第二方向Y上延伸。这样设置最大限度地减小了触控信号线185的布线长度，从而使得触控信号线185的电阻值较小，避免了触控信号线185的上信号延迟。
多条触控信号线185可以划分为两组，两组触控信号线185关于衬底基板11在第二方向Y上的中心轴EF对称设置。具体而言，触控信号线185在阻挡坝20内外两侧布线的方式在衬底基板11在第二方向Y上的中心轴EF两侧相同，但不限定两组触控信号线185的具体数量，也就是说，两组触控信号线185的数量可以相同，也可以不同。这样设置，便于均衡布线，提高工艺稳定性，且实现了非显示区102的进一步窄化设计。
图13示出了另外一种显示面板。与图12的不同之处在于，该显示面板的非显示区102包括绑定区1021和边框区1022，绑定区1021设于 显示区101一侧，绑定区1021仅设有第一阻挡坝202，位于绑定区1021的第一阻挡坝202的绝缘层组203远离衬底基板11的一侧设有凹槽204；边框区1022设于显示区101的其他侧，边框区1022沿远离显示区101的方向依次设有第一阻挡坝202和第二阻挡坝201，第一阻挡坝202环绕显示区101设置，第二阻挡坝201环绕第一阻挡坝202设置。
本公开实施方式提供了一种显示装置。显示装置可以包括上面任意一项所述的显示面板。
需要说明的是，该显示装置除了显示面板以外，还包括其他必要的部件和组成，以显示器为例，具体例如外壳、电路板、电源线，等等，本领域技术人员可根据该显示装置的具体使用要求进行相应地补充，在此不再赘述。
显示装置可以是传统电子设备，例如：手机、电脑、电视和摄录放影机，也可以是新兴的穿戴设备，例如VR眼镜，在此不一一进行列举。
本领域技术人员在考虑说明书及实践这里公开的发明后，将容易想到本公开的其它实施方案。本申请旨在涵盖本公开的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本公开的真正范围和精神由所附的权利要求指出。

Claims (20)

  1. 一种显示面板，具有显示区和与所述显示区连接的非显示区，其中，所述显示面板包括：
    衬底基板；
    第一引线，设于所述衬底基板的一侧，自所述显示区延伸至所述非显示区；
    阻挡坝，设于所述非显示区，且围绕所述显示区设置，所述阻挡坝包括绝缘层组，所述绝缘层组设于所述第一引线远离衬底基板的一侧，所述绝缘层组远离所述衬底基板的一侧设有凹槽，所述凹槽的深度小于所述绝缘层组的厚度；
    封装层，设于所述阻挡坝远离所述衬底基板的一侧，所述封装层包括有机封装层，所述有机封装层远离所述显示区的边沿在所述衬底基板上的正投影位于所述阻挡坝在所述衬底基板上的正投影内。
  2. 根据权利要求1所述的显示面板，其中，所述凹槽包括多个相互平行的凹槽分支，多个所述凹槽分支位于所述阻挡坝靠近所述显示区的一侧，多个所述凹槽分支远离所述显示区的一侧形成凸起主体，多个所述凹槽分支之间形成多个凸起分支，所述凸起分支与所述凸起主体相交。
  3. 根据权利要求2所述的显示面板，其中，所述凸起分支与所述凸起主体之间形成20度-30度的夹角。
  4. 根据权利要求2所述的显示面板，其中，所述凸起主体的宽度为所述阻挡坝宽度的1/6-1/3，所述凸起分支的宽度为所述阻挡坝宽度的1/3-1/2，相邻两个凸起分支之间的距离为所述阻挡坝宽度的1/6-5/12。
  5. 根据权利要求2所述的显示面板，其中，沿所述显示面板的厚度方向，所述凸起分支的宽度自靠近所述衬底基板的一侧向远离所述衬底基板的一侧逐渐缩小。
  6. 根据权利要求2所述的显示面板，其中，所述凸起分支靠近所述显示区的一面为向远离所述显示区的方向倾斜的斜面，所述凸起主体靠近所述显示区的一面为向远离所述显示区的方向倾斜的斜面。
  7. 根据权利要求1所述的显示面板，其中，所述凹槽位于所述阻挡坝的中部，所述凹槽包括凹槽主体和多个凹槽分支，所述凹槽主体沿所 述阻挡坝的延伸方向设置，多个所述凹槽分支设于所述凹槽主体靠近所述显示区的一侧，且与所述凹槽主体连通。
  8. 根据权利要求7所述的显示面板，其中，多个所述凹槽分支相互平行，且与所述凹槽主体之间形成20度-60度的夹角。
  9. 根据权利要求8所述的显示面板，其中，所述凹槽主体的宽度等于所述阻挡坝宽度的1/6-1/4，所述凹槽分支的长度为所述阻挡坝宽度的1/6-1/2，所述凹槽分支的宽度为所述阻挡坝宽度的1/6-5/12。
  10. 根据权利要求1所述的显示面板，其中，所述凹槽位于所述阻挡坝的中部，所述凹槽的宽度自靠近所述衬底基板的一侧向远离所述衬底基板的一侧逐渐增大。
  11. 根据权利要求1所述的显示面板，其中，所述凹槽的宽度为所述阻挡坝宽度的1/3-7/12。
  12. 根据权利要求1所述的显示面板，其中，所述凹槽的深度等于所述凹槽的深度等于所述第三绝缘层的厚度，或所述第二绝缘层的厚度与所述第三绝缘层的厚度之和。
  13. 根据权利要求1所述的显示面板，其中，所述阻挡坝的宽度为50um～80um。
  14. 根据权利要求1所述的显示面板，其中，所述凹槽包括沿所述阻挡坝的延伸方向间断设置的多个槽段，所述显示面板还包括：
    第二引线，设于所述封装层远离所述衬底基板的一侧，且位于相邻两个所述槽段之间。
  15. 根据权利要求14所述的显示面板，其中，相邻两个所述槽段之间的距离为30um～100um。
  16. 根据权利要求1所述的显示面板，其中，所述显示面板还包括：
    第一平坦化层，设于所述第一引线远离所述衬底基板的一侧，且位于所述显示区；
    像素界定层，设于所述第一平坦化层远离所述衬底基板的一侧；
    所述绝缘层组包括依次远离所述衬底基板的第一绝缘层和第三绝缘层，所述第一绝缘层与所述第一平坦化层同层同材料设置，所述第三绝缘层与所述像素界定层同层同材料设置。
  17. 根据权利要求16所述的显示面板，其中，所述显示面板还包括：
    第二平坦化层，设于所述第一平坦化层与所述像素界定层之间；
    所述绝缘层组还包括第二绝缘层，所述第二绝缘层设于所述第一绝缘层与所述第三绝缘层之间，且与所述第二平坦化层同层同材料设置。
  18. 根据权利要求1所述的显示面板，其中，所述非显示区包括：
    绑定区，设于所述显示区一侧，所述绑定区设有一个阻挡坝；
    边框区，设于所述显示区的其他侧，所述边框区沿远离所述显示区的方向依次设有多个阻挡坝。
  19. 根据权利要求18所述的显示面板，其中，所述凹槽位于所述绑定区的所述阻挡坝的绝缘层组远离所述衬底基板的一侧。
  20. 一种显示装置，其中，包括权利要求1至19任一项所述的显示面板。
PCT/CN2022/095329 2022-05-26 2022-05-26 显示面板及显示装置 WO2023225957A1 (zh)

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