WO2023224363A1 - 봉지재 필름용 조성물 및 이를 포함하는 봉지재 필름 - Google Patents
봉지재 필름용 조성물 및 이를 포함하는 봉지재 필름 Download PDFInfo
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- WO2023224363A1 WO2023224363A1 PCT/KR2023/006625 KR2023006625W WO2023224363A1 WO 2023224363 A1 WO2023224363 A1 WO 2023224363A1 KR 2023006625 W KR2023006625 W KR 2023006625W WO 2023224363 A1 WO2023224363 A1 WO 2023224363A1
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- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 description 1
- CIAYYZGZMJDALI-UHFFFAOYSA-N n'-(triethoxysilylmethyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CNCCN CIAYYZGZMJDALI-UHFFFAOYSA-N 0.000 description 1
- NHBRUUFBSBSTHM-UHFFFAOYSA-N n'-[2-(3-trimethoxysilylpropylamino)ethyl]ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCNCCN NHBRUUFBSBSTHM-UHFFFAOYSA-N 0.000 description 1
- YLBPOJLDZXHVRR-UHFFFAOYSA-N n'-[3-[diethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CCO[Si](C)(OCC)CCCNCCN YLBPOJLDZXHVRR-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- PJIIFHZKHAFVIF-UHFFFAOYSA-N n'-[[diethoxy(methyl)silyl]methyl]ethane-1,2-diamine Chemical compound CCO[Si](C)(OCC)CNCCN PJIIFHZKHAFVIF-UHFFFAOYSA-N 0.000 description 1
- LIBWSLLLJZULCP-UHFFFAOYSA-N n-(3-triethoxysilylpropyl)aniline Chemical compound CCO[Si](OCC)(OCC)CCCNC1=CC=CC=C1 LIBWSLLLJZULCP-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- XCOASYLMDUQBHW-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)butan-1-amine Chemical compound CCCCNCCC[Si](OC)(OC)OC XCOASYLMDUQBHW-UHFFFAOYSA-N 0.000 description 1
- KOVKEDGZABFDPF-UHFFFAOYSA-N n-(triethoxysilylmethyl)aniline Chemical compound CCO[Si](OCC)(OCC)CNC1=CC=CC=C1 KOVKEDGZABFDPF-UHFFFAOYSA-N 0.000 description 1
- VNBLTKHUCJLFSB-UHFFFAOYSA-N n-(trimethoxysilylmethyl)aniline Chemical compound CO[Si](OC)(OC)CNC1=CC=CC=C1 VNBLTKHUCJLFSB-UHFFFAOYSA-N 0.000 description 1
- NQKOSCFDFJKWOX-UHFFFAOYSA-N n-[3-[diethoxy(methyl)silyl]propyl]aniline Chemical compound CCO[Si](C)(OCC)CCCNC1=CC=CC=C1 NQKOSCFDFJKWOX-UHFFFAOYSA-N 0.000 description 1
- DRRZZMBHJXLZRS-UHFFFAOYSA-N n-[3-[dimethoxy(methyl)silyl]propyl]cyclohexanamine Chemical compound CO[Si](C)(OC)CCCNC1CCCCC1 DRRZZMBHJXLZRS-UHFFFAOYSA-N 0.000 description 1
- FVMHCRMQWNASEI-UHFFFAOYSA-N n-[[diethoxy(methyl)silyl]methyl]aniline Chemical compound CCO[Si](C)(OCC)CNC1=CC=CC=C1 FVMHCRMQWNASEI-UHFFFAOYSA-N 0.000 description 1
- BNQFLOSSLHYGLQ-UHFFFAOYSA-N n-[[dimethoxy(methyl)silyl]methyl]aniline Chemical compound CO[Si](C)(OC)CNC1=CC=CC=C1 BNQFLOSSLHYGLQ-UHFFFAOYSA-N 0.000 description 1
- 229940078552 o-xylene Drugs 0.000 description 1
- SRSFOMHQIATOFV-UHFFFAOYSA-N octanoyl octaneperoxoate Chemical compound CCCCCCCC(=O)OOC(=O)CCCCCCC SRSFOMHQIATOFV-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000007539 photo-oxidation reaction Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 150000003141 primary amines Chemical group 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- ROEHNQZQCCPZCH-UHFFFAOYSA-N tert-butyl 2-tert-butylperoxycarbonylbenzoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1C(=O)OC(C)(C)C ROEHNQZQCCPZCH-UHFFFAOYSA-N 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- SGCFZHOZKKQIBU-UHFFFAOYSA-N tributoxy(ethenyl)silane Chemical compound CCCCO[Si](OCCCC)(OCCCC)C=C SGCFZHOZKKQIBU-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- YQPHUWZVHLZEPI-UHFFFAOYSA-N tris[[ethenyl(dimethyl)silyl]oxy]-methylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(O[Si](C)(C)C=C)O[Si](C)(C)C=C YQPHUWZVHLZEPI-UHFFFAOYSA-N 0.000 description 1
- XYVYGTWMOAIWOG-UHFFFAOYSA-N tris[[ethenyl(dimethyl)silyl]oxy]-phenylsilane Chemical compound C=C[Si](C)(C)O[Si](O[Si](C)(C)C=C)(O[Si](C)(C)C=C)C1=CC=CC=C1 XYVYGTWMOAIWOG-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2323/04—Homopolymers or copolymers of ethene
- C08J2323/08—Copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a composition for an encapsulant film containing an ethylene/alpha-olefin copolymer, an encapsulant film, and a solar cell module.
- solar cells are attracting attention as a means of generating energy without the risk of environmental pollution or depletion.
- solar cells When solar cells are used outdoors, such as on the roof of a building, they are generally used in the form of a solar cell module.
- the front glass/solar cell encapsulant/crystalline solar cell element/solar cell encapsulant/rear glass (or rear protective sheet) are laminated in that order.
- the solar cell encapsulation material ethylene/vinyl acetate copolymer or ethylene/alpha-olefin copolymer, which have excellent transparency, flexibility, adhesiveness, etc., are generally used.
- Solar cell modules are packaged by protecting solar cell elements such as silicon, gallium-arsenide, copper-indium-selenium, etc. with an upper transparent protective material and a lower substrate protective material, and fixing the solar cell elements and protective materials with a sealing material.
- sealing materials for solar cell elements in solar cell modules are manufactured by extruding ethylene/alpha-olefin copolymers mixed with organic peroxides or silane coupling agents into a sheet shape, and the obtained sheet-shaped sealing material is used.
- a solar cell module is manufactured by sealing the solar cell element.
- one way to improve productivity is to increase the affinity of the ethylene/alpha-olefin copolymer with various raw materials included in the composition for the encapsulant film to increase water absorption.
- cross-linking agents and cross-linking aids which are essential for manufacturing encapsulant films, are polar substances and have inevitably low absorption of non-polar ethylene/alpha-olefin copolymers, which is pointed out as one of the factors causing a decrease in productivity. .
- Patent Document 1 Japanese Patent Publication 2015-211189
- the purpose of the present invention is to shorten the impregnation time of the ethylene/alpha-olefin copolymer in the initial stage of manufacturing the encapsulant film by using a cross-linking agent and cross-linking aid that has high affinity for the ethylene/alpha-olefin copolymer.
- the present invention provides a composition for an encapsulant film, an encapsulant film, and a solar cell module.
- the present invention provides a composition for an encapsulant film, comprising an ethylene/alpha-olefin copolymer, a crosslinking agent, a crosslinking aid, and a silane coupling agent, wherein the crosslinking aid includes a compound represented by the following formula (1).
- R 1 to R 6 are each independently an alkyl group having 1 to 10 carbon atoms
- X is an aryl group having 6 to 30 carbon atoms, or , where L is an alkylene group having 1 to 10 carbon atoms, and R 7 is an alkyl group having 1 to 10 carbon atoms.
- the present invention provides a composition for an encapsulant film according to (1) above, wherein in Formula 1, R 1 to R 6 are each independently an alkyl group having 1 to 6 carbon atoms.
- the present invention provides a composition for an encapsulant film according to (1) or (2) above, wherein the compound represented by the formula (1) is selected from the following compounds.
- the present invention provides the composition for encapsulant film according to any one of (1) to (3) above, wherein the crosslinking aid is 0.01 part by weight to 1 part by weight based on 100 parts by weight of the composition for encapsulant film.
- the present invention further includes an allyl group-containing compound as a crosslinking aid, and the allyl group-containing compound is triallyl isocyanurate or triallyl cyanurate.
- a composition for an encapsulant film comprising at least one member selected from the group consisting of diallyl phthalate, diallyl fumarate, and diallyl maleate.
- the present invention provides a composition for an encapsulant film according to (5) above, wherein the molar ratio of the compound represented by Formula 1 and the allyl group-containing compound is 1:0.1 to 1:10.
- alpha-olefin is propylene, 1-butene, 1-pentene, 4-methyl-1-pentene, 1-hexene, 1-heptene , 1-octene, 1-decene, 1-undecene, 1-dodecene, 1-tetradecene, 1-hexadecene, and 1-eicocene.
- the present invention provides a composition for an encapsulant film according to any one of (1) to (7) above, wherein the alpha-olefin is contained in an amount greater than 0 and less than or equal to 99 mol% based on the ethylene/alpha-olefin copolymer.
- the present invention is a bag according to any one of (1) to (8) above, further comprising at least one selected from the group consisting of an unsaturated silane compound, an amino silane compound, a light stabilizer, a UV absorber, and a heat stabilizer.
- a composition for refilming is provided.
- the present invention provides an encapsulant film comprising the composition for an encapsulant film of any one of (1) to (9) above.
- the present invention provides a solar cell module including the encapsulant film of (10) above.
- the economic efficiency of the encapsulant film production process can be improved by shortening the immersion time of the ethylene/alpha-olefin copolymer.
- the composition for encapsulant film manufactured using the present invention exhibits an excellent degree of cross-linking.
- composition for an encapsulant film of the present invention includes (a) an ethylene/alpha-olefin copolymer, (b) a crosslinking agent, (c) a crosslinking aid, and (d) a silane coupling agent, and the crosslinking aid is represented by Formula 1 It is characterized by containing a compound that is.
- the composition for an encapsulant film of the present invention includes an ethylene/alpha-olefin copolymer.
- the ethylene/alpha-olefin copolymer is manufactured by copolymerizing ethylene and an alpha-olefin monomer.
- the alpha-olefin which refers to the portion derived from the alpha-olefin monomer in the copolymer, has 4 to 20 carbon atoms.
- Alpha-olefins specifically propylene, 1-butene, 1-pentene, 4-methyl-1-pentene, 1-hexene, 1-heptene, 1-octene, 1-decene, 1-undecene, 1-dodecene, Examples include 1-tetradecene, 1-hexadecene, or 1-eicocene, and these may be one type alone or a mixture of two or more types.
- the alpha-olefin may be 1-butene, 1-hexene, or 1-octene, and preferably 1-butene, 1-hexene, or a combination thereof.
- the content of alpha-olefin in the ethylene/alpha-olefin copolymer may be appropriately selected within a range that satisfies the above-mentioned physical property requirements, specifically, 0 to 99 mol%, and 10 to 50 mol%. may, but is not limited to this.
- the method of preparing or obtaining the ethylene/alpha-olefin copolymer is not limited, and a person skilled in the art can select and use an appropriate one in consideration of the physical properties and purpose of the composition for encapsulant film.
- the composition for an encapsulant film of the present invention includes a crosslinking agent.
- the crosslinking agent serves as a radical initiator in the manufacturing step of the silane-modified resin composition, and may serve to initiate a reaction in which an unsaturated silane compound is grafted onto the resin composition.
- the heat resistance durability of the final product, such as an encapsulant sheet can be improved by forming a crosslink between the silane-modified resin composition or between the silane-modified resin composition and the unmodified resin composition in the lamination step when manufacturing the optoelectronic device. there is.
- cross-linking agent is a cross-linking compound capable of initiating radical polymerization of vinyl groups or forming cross-linking bonds
- various cross-linking agents known in the technical field can be used, for example, organic peroxides, hydroperoxides, and azo compounds.
- organic peroxides, hydroperoxides, and azo compounds One or two or more types selected from the group consisting of can be used.
- the encapsulant for solar cells may include organic peroxide as a crosslinking agent, and the organic peroxide plays a role in improving the weather resistance of the encapsulant for solar cells.
- t-butylcumyl peroxide di-t-butyl peroxide, di-cumyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, 2,5-dimethyl- dialkyl peroxides such as 2,5-di(t-butylperoxy)-3-hexyne;
- Hydroperoxides such as cumene hydroperoxide, diisopropyl benzene hydroperoxide, 2,5-dimethyl-2,5-di(hydroperoxy)hexane, and t-butyl hydroperoxide;
- diacyl peroxides such as bis-3,5,5-trimethylhexanoyl peroxide, octanoyl peroxide, benzoyl peroxide, o-methylbenzoyl peroxide, and 2,4-dichlorobenzoyl peroxide;
- One or more types selected from may be included, but are not limited thereto.
- the organic peroxide may be an organic peroxide having a 1 hour half-life temperature of 120°C to 135°C, for example, 120°C to 130°C, 120°C to 125°C, preferably 121°C.
- the “1 hour half-life temperature” refers to the temperature at which the half-life of the crosslinking agent is 1 hour.
- the temperature at which the radical initiation reaction efficiently occurs varies. Therefore, when an organic peroxide having a 1-hour half-life temperature in the above-mentioned range is used as a crosslinking agent, the lamination process temperature for manufacturing an optoelectronic device A radical-initiated reaction, that is, a cross-linking reaction, can proceed effectively.
- the crosslinking agent is present in an amount of 0.01 to 2 parts by weight, for example, 0.05 to 1.5 parts by weight, 0.1 to 1.5 parts by weight, or 0.5 to 1.5 parts by weight, based on 100 parts by weight of the ethylene/alpha-olefin copolymer. It may be included as a negative content.
- the crosslinking agent is included in the above range, the heat resistance properties are sufficiently improved, and the formability of the encapsulant film is also excellent, so there may be no process limitations or deterioration of the encapsulant's physical properties.
- composition for an encapsulant film of the present invention includes a crosslinking aid, where the crosslinking aid includes a compound represented by the following formula (1).
- R 1 to R 6 are each independently an alkyl group having 1 to 10 carbon atoms
- X is an aryl group having 6 to 30 carbon atoms, or , where L is an alkylene group having 1 to 10 carbon atoms, and R 7 is an alkyl group having 1 to 10 carbon atoms.
- R 1 to R 6 may each independently be an alkyl group having 1 to 6 carbon atoms, or an alkyl group having 1 to 3 carbon atoms, such as a methyl group, an ethyl group, or a propyl group.
- L is an alkylene group having 1 to 10 carbon atoms, an alkylene group having 1 to 6 carbon atoms, such as a propylene group
- R 7 is an alkyl group having 1 to 10 carbon atoms, an alkyl group having 1 to 6 carbon atoms, or an alkyl group having 1 to 3 carbon atoms. , for example, may be a methyl group.
- the compound represented by Formula 1 may be selected from the following compounds.
- the crosslinking aid used in the present invention has high hydrophobicity and low liquid viscosity compared to triallyl isocyanurate (TAIC), which has been mainly used in the past, and thus has excellent compatibility with ethylene/alpha-olefin copolymers, making it suitable for bagging.
- TAIC triallyl isocyanurate
- the impregnation rate of ethylene/alpha-olefin copolymer in the composition for refilm can be improved.
- the degree of crosslinking of the composition for the encapsulant film by the above-described crosslinking agent can be increased, and thus the heat resistance and durability of the final product, such as the encapsulant film, can be further improved.
- the crosslinking aid is 0.01 to 1 part by weight based on 100 parts by weight of the ethylene/alpha-olefin copolymer, specifically, 0.05 part by weight or more, 0.1 part by weight or more, 0.2 part by weight or more, 0.3 part by weight or more, 1.0 part by weight. It may be less than or equal to 0.8 parts by weight.
- the effect of improving heat resistance through the crosslinking aid and increasing the impregnation speed of the ethylene/alpha-olefin copolymer can be sufficiently implemented, and deterioration of the physical properties of the encapsulant film can be suppressed.
- the composition for the encapsulant film may further include an allyl group-containing compound as a crosslinking aid.
- the allyl group-containing compound is triallyl isocyanurate, triallyl cyanurate, diallyl phthalate, It includes at least one member selected from the group consisting of diallyl fumarate and diallyl maleate.
- the molar ratio of the compound represented by Formula 1 and the allyl group-containing compound may be 1:0.1 to 1:10, specifically 1:2 to 1:5, more specifically 1:0.3 to 1:3, or It may be 1:0.3 to 1:0.8.
- the impregnation time of the ethylene/alpha-olefin copolymer can be shortened while also increasing the crosslinking of the composition for an encapsulant film.
- composition for an encapsulant film of the present invention includes a silane coupling agent, which can serve to improve the adhesion between the encapsulant film and the solar cell.
- silane coupling agent examples include N-( ⁇ -aminoethyl)- ⁇ -aminopropyltrimethoxysilane, N-( ⁇ -aminoethyl)- ⁇ -aminopropylmethyldimethoxysilane, and ⁇ -amino
- One or more types selected from the group consisting of propyltriethoxysilane, ⁇ -glycidoxypropyltrimethoxysilane, and ⁇ -methacryloxypropyltrimethoxysilane (MEMO) may be used, but are not limited thereto.
- the silane coupling agent may be included in an amount of 0.1 to 0.4 parts by weight based on 100 parts by weight of the composition for encapsulant film.
- content of the silane coupling agent is within the above range, adhesion to glass is excellent when manufacturing solar cell modules, preventing long-term performance deterioration of the module due to moisture penetration.
- composition for an encapsulant film of the present invention may further include at least one selected from the group consisting of an unsaturated silane compound, an amino silane compound, a light stabilizer, a UV absorber, and a heat stabilizer.
- the unsaturated silane compound may be included in a polymerized form in the silane-modified resin composition or amino silane-modified resin composition by grafting onto the main chain containing the polymerization units of the monomers of the copolymer of the present invention in the presence of a radical initiator or the like.
- the unsaturated silane compound is vinyltrimethoxy silane, vinyltriethoxy silane, vinyltripropoxy silane, vinyltriisopropoxy silane, vinyltributoxy silane, vinyltripentoxy silane, vinyltriphenoxy silane, or vinyl It may be triacetoxy silane, etc., and as an example, vinyl trimethoxy silane or vinyl triethoxy silane may be used, but it is not limited thereto.
- the amino silane compound is an unsaturated silane compound grafted to the main chain of the copolymer in the grafting modification step of the ethylene/alpha-olefin copolymer, such as a hydroxyl group that converts a reactive functional group such as an alkoxy group of vinyltriethoxysilane into a hydroxy group.
- a reactive functional group such as an alkoxy group of vinyltriethoxysilane into a hydroxy group.
- the amino silane compound participates as a reactant in a direct copolymerization reaction, thereby providing a moiety having an amine functional group to the amino silane modified resin composition.
- amino silane compound is a silane compound containing an amine group and is not particularly limited as long as it is a primary amine or secondary amine.
- amino silane compounds include aminotrialkoxysilane and aminodialkoxysilane, examples of which include 3-aminopropyltrimethoxysilane (APTMS) and 3-aminopropyltriethoxysilane.
- the light stabilizer may serve to prevent photo-oxidation by capturing active species that initiate photodeterioration of the resin, depending on the application to which the composition is applied.
- the type of light stabilizer that can be used is not particularly limited, and for example, known compounds such as hindered amine-based compounds or hindered piperidine-based compounds can be used.
- the UV absorber may absorb ultraviolet rays from sunlight or the like and convert them into harmless heat energy within the molecule, thereby preventing the active species that initiate photodeterioration in the resin composition from being excited.
- the specific type of UV absorber that can be used is not particularly limited, and for example, inorganic UV absorbers such as benzophenone-based, benzotriazole-based, acrylnitrile-based, metal complex salt-based, hindered amine-based, ultrafine particle titanium oxide or ultrafine particle zinc oxide.
- inorganic UV absorbers such as benzophenone-based, benzotriazole-based, acrylnitrile-based, metal complex salt-based, hindered amine-based, ultrafine particle titanium oxide or ultrafine particle zinc oxide.
- One type or a mixture of two or more types of absorbent may be used.
- examples of the heat stabilizer include tris(2,4-di-tert-butylphenyl)phosphite, bis[2,4-bis(1,1-dimethylethyl)-6-methylphenyl]ethyl ester phosphorous acid, and tetrakis. (2,4-di-tert-butylphenyl)[1,1-biphenyl]-4,4'-diylbisphosphonate and bis(2,4-di-tert-butylphenyl)pentaerythritol diphosphite, etc.
- Lactone-based heat stabilizers such as the reaction product of 8-hydroxy-5,7-di-tert-butyl-furan-2-one and o-xylene may be used, and one or two or more of the above may be used. there is.
- the content of the light stabilizer, UV absorber, and heat stabilizer is not particularly limited. That is, the content of the additive can be appropriately selected considering the use of the resin composition, the shape or density of the additive, etc., and is usually within the range of 0.01 parts by weight to 5 parts by weight based on 100 parts by weight of the total solid content of the composition for encapsulant film. can be adjusted appropriately.
- the present invention provides an encapsulant film containing the composition for the encapsulant film.
- the encapsulant film of the present invention can be manufactured by molding the composition for encapsulant film into a film or sheet shape.
- This molding method is not particularly limited, and for example, it can be manufactured by forming a sheet or film through a conventional process such as a T-die process or extrusion.
- the production of the encapsulant film is performed in an in situ process using a device in which the production of a modified resin composition using the composition for the encapsulant film and the film or sheet formation process are connected to each other. can do.
- the thickness of the encapsulant film can be adjusted to about 10 to 2,000 ⁇ m, or about 100 to 1,250 ⁇ m, taking into account the support efficiency and possibility of damage to the device in the optoelectronic device, lightening of the device, workability, etc., depending on the specific use. can be changed.
- the present invention provides a solar cell module including the encapsulant film.
- the solar cell module has a structure in which the gaps between solar cells arranged in series or parallel are filled with the encapsulant film of the present invention, a glass surface is disposed on the side where sunlight hits, and the back side is protected with a back sheet.
- various types and forms of solar cell modules manufactured in the art including encapsulant films can all be applied to the present invention.
- the glass surface can be made of tempered glass to protect the solar cell from external impact and prevent damage, and low iron tempered glass with a low iron content can be used to prevent reflection of sunlight and increase solar transmittance. may be used, but is not limited to this.
- the back sheet is a weather-resistant film that protects the back side of the solar cell module from the outside, and includes, for example, a fluorine-based resin sheet, a metal plate or metal foil such as aluminum, a cyclic olefin-based resin sheet, a polycarbonate-based resin sheet, and a poly(meth)acrylic resin.
- a fluorine-based resin sheet such as aluminum
- a metal plate or metal foil such as aluminum
- a cyclic olefin-based resin sheet such as aluminum
- a polycarbonate-based resin sheet such as aluminum
- poly(meth)acrylic resin include, but are not limited to, sheets, polyamide-based resin sheets, polyester-based resin sheets, and composite sheets laminated with a weather-resistant film and a barrier film.
- the solar cell module of the present invention can be manufactured without limitation according to methods known in the art, except that it includes the above-described encapsulant film.
- the solar cell module of the present invention is manufactured using an encapsulant film with excellent volume resistance. Electrons in the solar cell module move through the encapsulant film, preventing current from leaking to the outside, thereby deteriorating the insulation. This can greatly suppress the PID (Potential Induced Degradation) phenomenon, which causes leakage current and a rapid decrease in module output.
- PID Pressure Induced Degradation
- LG Chemical's LF675 (ethylene/1-butene copolymer, density 0.877 g/cc, MI 14.0) was used as the ethylene/alpha-olefin copolymer.
- the cross-linking agent When the impregnation was completed. Before the cross-linking agent is absorbed into the ethylene/alpha-olefin copolymer, it acts as a lubricant and maintains a low torque value. However, when the cross-linking agent is completely absorbed, the torque value increases. Therefore, the point at which the torque value rapidly increases is set as the impregnation completion time. will be.
- an encapsulant film with an average thickness of 550 ⁇ m was manufactured at a low temperature (extruder barrel temperature of 100°C or less) that does not allow high-temperature crosslinking.
- An encapsulant film was manufactured in the same manner as in Example 1, except for the changes shown in Table 1 below.
- Impregnation speed (impregnation completion time)
- the point at which the torque value rapidly increases is considered the impregnation completion time, and the time from the start of stirring to the completion of impregnation is measured and listed in Table 2 below.
- the crosslinking degree evaluation was conducted based on CPIA (China Photovoltaic Industry Association) standards and ASTM D2765.
- the encapsulant film prepared above was cut into 10 cm
- the MDR torque value of each sample was measured using an Alpha Technologies Production MDR (Moving Die Rheometer).
- the 550 ⁇ m encapsulant film prepared in the above Examples and Comparative Examples was cut into 1 g pieces and overlapped into four pieces to prepare a total sample of 4 g, which was then run and measured at 150°C for 20 minutes.
- M H values and M L values were measured under the corresponding conditions.
- the MDR torque (M H -M L ) was calculated by subtracting the M L value from the measured M H value.
- MH is the maximum torque
- ML is the minimum torque.
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Abstract
Description
가교 조제 종류 | 중량비 | 가교 조제 총량(phr) | |
실시예 1 | MPVS | - | 0.5 |
실시예 2 | MPVS | - | 0.25 |
실시예 3 | TVPS | - | 0.5 |
실시예 4 | MPVS+TAIC | 3:1 | 0.5 |
실시예 5 | MPVS+TAIC | 1:1 | 0.5 |
실시예 6 | MPVS+TAIC | 1:3 | 0.5 |
비교예 1 | TAIC | - | 0.5 |
비교예 2 | VTIPS | - | 0.5 |
비교예 3 | DVTMS | - | 0.5 |
비교예 4 | TVMS | - | 0.5 |
함침 완료 시간(min) | 가교도 | MH-ML | |
실시예 1 | 26 | 72 | 2.83 |
실시예 2 | 14 | 68 | 2.54 |
실시예 3 | 15 | 70 | 2.70 |
실시예 4 | 27 | 74 | 2.92 |
실시예 5 | 31 | 75 | 3.31 |
실시예 6 | 39 | 76 | 3.52 |
비교예 1 | 58 | 77 | 3.67 |
비교예 2 | 10 | 61 | 2.59 |
비교예 3 | 5 | 30 | 1.59 |
비교예 4 | 10 | 64 | 2.70 |
Claims (11)
- 청구항 1에 있어서,상기 화학식 1에서, R1 내지 R6은 각각 독립적으로 탄소수 1 내지 6의 알킬기인 봉지재 필름용 조성물.
- 청구항 1에 있어서,상기 가교 조제는 봉지재 필름용 조성물 100 중량부 기준 0.01 중량부 내지 1 중량부인 봉지재 필름용 조성물.
- 청구항 1에 있어서,가교 조제로서 알릴기 함유 화합물을 추가로 포함하고,상기 알릴기 함유 화합물은 트리알릴 이소시아누레이트, 트리알릴 시아누레이트, 디알릴 프탈레이트, 디알릴 푸마레이트 및 디알릴 말레에이트로 이루어진 군에서 선택된 1종 이상을 포함하는, 봉지재 필름용 조성물.
- 청구항 5에 있어서,상기 화학식 1로 표시되는 화합물 및 알릴기 함유 화합물의 몰비는 1 : 0.1 내지 1 : 10인 봉지재 필름용 조성물.
- 청구항 1에 있어서,상기 알파-올레핀은 프로필렌, 1-부텐, 1-펜텐, 4-메틸-1-펜텐, 1-헥센, 1-헵텐, 1-옥텐, 1-데센, 1-운데센, 1-도데센, 1-테트라데센, 1-헥사데센 및 1-에이코센으로 이루어진 군에서 선택된 1종 이상을 포함하는 봉지재 필름용 조성물.
- 청구항 1에 있어서,상기 알파-올레핀은 에틸렌/알파-올레핀 공중합체 기준 0 초과 99 이하 몰% 포함되는 봉지재 필름용 조성물.
- 청구항 1에 있어서,불포화 실란 화합물, 아미노 실란 화합물, 광 안정제, UV 흡수제 및 열 안정제로 이루어진 군에서 선택된 1종 이상을 추가로 포함하는 봉지재 필름용 조성물.
- 청구항 1 내지 9 중 어느 한 항의 봉지재 필름용 조성물을 포함하는 봉지재 필름.
- 청구항 10의 봉지재 필름을 포함하는 태양전지 모듈.
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EP23807882.8A EP4357402A1 (en) | 2022-05-16 | 2023-05-16 | Encapsulation film composition and encapsulation film comprising same |
JP2024515919A JP2024531699A (ja) | 2022-05-16 | 2023-05-16 | 封止材フィルム用組成物及びそれを含む封止材フィルム |
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JP2009173773A (ja) * | 2008-01-24 | 2009-08-06 | Toshiba Corp | シリコーン樹脂組成物および半導体装置 |
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JP2015211189A (ja) | 2014-04-30 | 2015-11-24 | 日本ポリエチレン株式会社 | 太陽電池封止材用樹脂組成物、並びにそれを用いた太陽電池封止材及び太陽電池モジュール |
KR20200070326A (ko) * | 2017-10-31 | 2020-06-17 | 다우 글로벌 테크놀로지스 엘엘씨 | 광전지 봉지재 필름용 폴리올레핀 조성물 |
KR20210014579A (ko) * | 2019-07-30 | 2021-02-09 | 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 | 핫멜트성 경화성 실리콘 조성물, 봉지제, 필름, 광 반도체 소자 |
CN114094102A (zh) * | 2021-11-03 | 2022-02-25 | 珠海冠宇电池股份有限公司 | 一种二次电池 |
-
2022
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2023
- 2023-05-16 CN CN202380012796.XA patent/CN117677660A/zh active Pending
- 2023-05-16 WO PCT/KR2023/006625 patent/WO2023224363A1/ko active Application Filing
- 2023-05-16 EP EP23807882.8A patent/EP4357402A1/en active Pending
- 2023-05-16 JP JP2024515919A patent/JP2024531699A/ja active Pending
Patent Citations (6)
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JP2009173773A (ja) * | 2008-01-24 | 2009-08-06 | Toshiba Corp | シリコーン樹脂組成物および半導体装置 |
KR20140117489A (ko) * | 2012-02-10 | 2014-10-07 | 미쓰이 가가쿠 토세로 가부시키가이샤 | 태양 전지 밀봉재 및 태양 전지 모듈 |
JP2015211189A (ja) | 2014-04-30 | 2015-11-24 | 日本ポリエチレン株式会社 | 太陽電池封止材用樹脂組成物、並びにそれを用いた太陽電池封止材及び太陽電池モジュール |
KR20200070326A (ko) * | 2017-10-31 | 2020-06-17 | 다우 글로벌 테크놀로지스 엘엘씨 | 광전지 봉지재 필름용 폴리올레핀 조성물 |
KR20210014579A (ko) * | 2019-07-30 | 2021-02-09 | 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 | 핫멜트성 경화성 실리콘 조성물, 봉지제, 필름, 광 반도체 소자 |
CN114094102A (zh) * | 2021-11-03 | 2022-02-25 | 珠海冠宇电池股份有限公司 | 一种二次电池 |
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CN117677660A (zh) | 2024-03-08 |
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