WO2023221171A1 - 一种显示面板、印刷装置及显示面板的制备方法 - Google Patents

一种显示面板、印刷装置及显示面板的制备方法 Download PDF

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Publication number
WO2023221171A1
WO2023221171A1 PCT/CN2022/096324 CN2022096324W WO2023221171A1 WO 2023221171 A1 WO2023221171 A1 WO 2023221171A1 CN 2022096324 W CN2022096324 W CN 2022096324W WO 2023221171 A1 WO2023221171 A1 WO 2023221171A1
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Prior art keywords
groove
display panel
conductor
substrate
grooves
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PCT/CN2022/096324
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English (en)
French (fr)
Inventor
邓红照
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Tcl华星光电技术有限公司
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Priority to US17/758,028 priority Critical patent/US20240170626A1/en
Publication of WO2023221171A1 publication Critical patent/WO2023221171A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F17/00—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Definitions

  • the present application relates to the field of display technology, and specifically to a display panel, a printing device, and a method for preparing a display panel.
  • MLEDs are sub-millimeter light-emitting diodes (English: Mini LED) and micron light-emitting diodes (English: Micro The general name of LED), MLED has the advantages of fast response, high color gamut, high PPI, low energy consumption, etc., and has gradually developed into a hot spot in future display technology.
  • the side printing process has a greater impact on the yield of display panels.
  • the side surface 1001 of the display panel 100 in the prior art is flat.
  • the printing head 2002 of the printing device 200 in the prior art protrudes from the body 2001 at the same height.
  • the difficulties in the side printing process of using the printing device 200 in the prior art to dip the conductive liquid 1002 and press it onto the side printing surface 1001 of the display panel 100 are mainly divided into two parts, one part comes from the disconnection of the conductive liquid 1002, and the other part It comes from the short circuit of the conductive liquid 1002 caused by multiple side prints.
  • the object of the present invention is to provide a display panel, a printing device and a method for manufacturing a display panel, which can solve the problems of conductive liquid disconnection and short circuit existing in the existing side printing process, resulting in low display panel yield and other problems.
  • the present invention provides a display panel, which includes: a substrate, which includes a first surface and a side stamp surface perpendicular to the first surface; a plurality of bonding terminals, which are parallel to each other and spaced apart from each other.
  • the bonding terminals include alternately arranged first bonding terminals and second bonding terminals; a plurality of first grooves are spaced on the side stamping surface of the substrate, so The first groove corresponds to the first bonding terminal one-to-one; a first protrusion is formed between any two adjacent first grooves; a plurality of first conductors are provided on the first On the substrate on the bottom surface of the groove, the first conductor corresponds to the first groove and is connected to the first bonding terminal in a one-to-one correspondence; and a plurality of second conductors are provided at On the substrate on the top surface of the first protrusion, the second conductor corresponds to the first protrusion in a one-to-one correspondence and is connected to the second bonding terminal in a one-to-one correspondence; any one of the first protrusions is One conductor and any one of the second conductors are not conductive with each other.
  • the material of the first conductor and the second conductor are the same.
  • any two first grooves have the same shape and size.
  • any two first protrusions have the same width.
  • the present invention also provides a printing device, which is used to prepare the display panel of the present invention.
  • the printing device includes: a body; a plurality of second grooves arranged at intervals on a side of the body. on the surface of the side; a second protrusion is formed between any two adjacent second grooves; a plurality of first printing heads are installed on the body on the top surface of the second protrusion; The first printing head corresponds to the second protrusion one-to-one; and a plurality of second printing heads are installed on the body on the bottom surface of the second groove; the second printing head and the second The grooves correspond one to one.
  • any two second grooves have the same shape and size.
  • any two second protrusions have the same width.
  • the printing device further includes: a plurality of hydrophobic and oleophobic layers disposed on two side walls of each second groove.
  • the material of the hydrophobic and oleophobic layer includes: one or more of metal phosphates, metal polyphosphate compounds, polytetrafluoroethylene, and fluorinated polyethylene.
  • the distance between the two hydrophobic and oleophobic layers of any one of the second grooves is greater than or equal to the width of the first protrusion.
  • the distance between the hydrophobic and oleophobic layers on the two side walls of any one of the second protrusions is less than or equal to the width of the first groove.
  • the present invention also provides a method for preparing a display panel, which includes the following steps: providing a substrate, the substrate including a first surface and a side stamp surface perpendicular to the first surface; A plurality of mutually parallel and spaced bonding terminals are prepared on the first surface of the substrate, and the bonding terminals include alternately arranged first bonding terminals and second bonding terminals; on the side stamped surface of the substrate A plurality of first grooves are provided at intervals, and the first grooves correspond to the first bonding terminals in a one-to-one manner; a first protrusion is formed between any two adjacent first grooves; and using The printing device of the present invention forms a first conductor on the substrate on the bottom surface of the first groove, and forms a second conductor on the substrate on the top surface of the first protrusion.
  • the conductors correspond to the first grooves in a one-to-one correspondence, and the first conductors are connected to the first bonding terminals in a one-to-one correspondence; the second conductors correspond to the first protrusions in a one-to-one correspondence, and the second conductors correspond to the first bonding terminals in a one-to-one correspondence.
  • the conductors are connected to the second bonding terminals in one-to-one correspondence; any one of the first conductors and any one of the second conductors are not conductive to each other.
  • the step of forming a first conductor on the substrate on the bottom surface of the first groove and forming a second conductor on the substrate on the top surface of the first protrusion further includes: first A hydrophobic and oleophobic layer is provided on the two side walls of each second groove, and then the printing device is used to dip in the conductive liquid, align the first printing head with the first groove, and press The body prints the conductive liquid on the first printing head onto the substrate on the bottom surface of the first groove to form the first conductor, and prints the conductive liquid on the second printing head The conductive liquid is printed onto the substrate on the top surface of the first protrusion to form the second conductor.
  • one of laser cutting, waterjet cutting, dry etching, and wet etching is used to provide a plurality of first grooves at intervals on the side imprint surface of the substrate.
  • the distance between the two hydrophobic and oleophobic layers in any one of the second grooves is greater than or equal to the width of the first protrusion.
  • the distance between the hydrophobic and oleophobic layers on the two side walls of any one of the second protrusions is less than or equal to the width of the first groove.
  • the first protrusion is fitted into the second groove, and the second protrusion and the second printing head are fitted into the first groove.
  • the present invention can increase the width of the first conductor and the second conductor, and reduce the risk of disconnection between the first conductor and the first bonding terminal, the second conductor and the second bonding terminal.
  • the first conductor and the second conductor of the present invention are not on the same plane, which can reduce the risk of short circuit between the first conductor and the second conductor.
  • the present invention prepares hydrophobic and oleophobic layers on the two side walls of each second groove.
  • the splicing seam is a concave-convex line, and the user's sensitivity to the contour of the concave-convex line is lower than that of a straight line; and the user is accustomed to moving from left to right and top to bottom to observe the splicing. Seams require longer observation time and a greater amount of information, so it takes longer to discover the seams. Therefore, when the display panels of the present invention are spliced, the seams are less obvious.
  • Figure 1 is a top view of a display panel in the prior art before side printing
  • Figure 2 is a top view of a display panel in the prior art after side printing
  • Figure 3 is a schematic diagram of a printing device in the prior art
  • Figure 4 is a top view of the display panel of the present invention after side printing
  • Figure 5 is a schematic diagram of the printing device of the present invention.
  • Figure 6 is a diagram of the preparation steps of the display panel of the present invention.
  • Figure 7 is a top view of the display panel of the present invention before side printing
  • Figure 8 is a schematic plan view of the splicing display device of the present invention.
  • Second conductor 16. The first bump;
  • the first printing head 24. Second printing head;
  • This embodiment provides a display panel 1.
  • the display panel is Mini LED.
  • the display panel 1 may also be a liquid crystal display (English: Liquid Crystal Display (LCD for short), Micro LED etc.
  • the display panel 1 includes a substrate 11 , a plurality of bonding terminals 12 , a plurality of first grooves 13 , a plurality of first conductors 14 and a plurality of second conductors 15 .
  • the substrate 11 includes: one of a glass plate, a printed circuit board, a BT resin plate and an aluminum plate.
  • the substrate 11 is a glass plate.
  • the substrate 11 includes a first surface 111 and a side surface 112 perpendicular to the first surface 111 .
  • the display panel 1 of this embodiment also includes a driving layer, and the driving layer includes a thin film transistor device.
  • the driving layer may also include a driving chip, such as: Micro IC, PM driver IC.
  • the bonding terminals 12 are arranged parallel to each other and spaced apart on the first surface 111 of the substrate 11 . This can prevent adjacent bonding terminals 12 from contacting each other to form a short circuit.
  • one end of the bonding terminal 12 is electrically connected to the thin film transistor device in the driving layer of the display panel 1 .
  • the bonding terminals 12 include alternately arranged first bonding terminals 121 and second bonding terminals 122 .
  • the first bonding terminal 121 and the second bonding terminal 122 are made of the same material.
  • the first bonding terminal 121 and the second bonding terminal 122 are both formed by one wire.
  • the first bonding terminal 121 can be formed by multiple wires, and the second bonding terminal 122 It can also be prepared and formed from multiple wires.
  • the first grooves 13 are spaced apart on the side printed surface 112 of the substrate 11 .
  • the first groove 13 corresponds to the first bonding terminal 121 one-to-one. That is, each first groove corresponds to one first bonding terminal 121 .
  • a first protrusion 16 is formed between any two adjacent first grooves 13 .
  • the two side walls of the first groove 13 are respectively reused as side walls of the two first protrusions 16 adjacent to the first groove 13 .
  • the first groove 13 can be made by laser cutting, waterjet cutting, dry etching or wet etching.
  • any two first grooves 13 have the same shape and size, and any two first protrusions 16 have the same width L. Therefore, the difficulty of the preparation process of the first groove 13 can be reduced.
  • the first conductor 14 is disposed on the substrate 11 located on the bottom surface of the first groove 13 .
  • the first conductor 14 corresponds to the first groove 13 in a one-to-one correspondence, and is connected to the first bonding terminal 121 in a one-to-one correspondence. That is, the first conductor 14 , the first groove 13 and the first bonding terminal 121 maintain a one-to-one correspondence with each other.
  • the first conductor 14 is made of silver paste. In other embodiments, the first conductor 14 may be made of conductive liquid made of other materials.
  • the second conductor 15 is disposed on the substrate 11 on the top surface of the first protrusion 16, the second conductor 15 corresponds to the first protrusion 16 one by one, and is connected to each of the first protrusions 16 in a one-to-one correspondence.
  • the second bonding terminal 122 is described.
  • the material of the second conductor 15 in this embodiment is the same as the material of the first conductor 14. Therefore, the printing device can prepare the first conductor 14 and the second conductor 15 at the same time, thereby improving the printing efficiency and reducing the preparation cost.
  • the first conductor 14 and the second conductor 15 of the present invention are not on the same plane, which can reduce the risk of short circuit between the first conductor 14 and the second conductor 15 .
  • any one of the first conductors 14 and any one of the second conductors 15 are not conductive with each other. This prevents a short circuit between the first conductor 14 and the second conductor 15 .
  • this embodiment provides a printing device 2 for preparing the display panel 1 of the present invention.
  • the printing device 2 includes: a body 21 , a second groove 22 , a first printing head 23 , a second printing head 24 , a hydrophobic and oleophobic layer 25 and a second protrusion 26 .
  • a plurality of second grooves 22 are spaced on the surface of one side of the body 21; a second protrusion 26 is formed between any two adjacent second grooves 22.
  • the two side walls of the second groove 22 are respectively reused as the side walls of the two second protrusions 26 adjacent to the second groove 22 .
  • any two second grooves 22 have the same shape and size, and any two second protrusions 26 have the same width. Therefore, the difficulty of the preparation process of the second groove 22 can be reduced.
  • first printing heads 23 are installed on the body 21 on the top surface of the second protrusion 26; the first printing heads 23 correspond to the second protrusions 26 one by one.
  • a plurality of second printing heads 24 are installed on the body 21 on the bottom surface of the second groove 22; the second printing heads 24 correspond to the second groove 22 one by one.
  • a plurality of hydrophobic and oleophobic layers 25 are disposed on two side walls of each second groove 22 .
  • the hydrophobic and oleophobic layer 25 is mainly used to prevent a short circuit between the first conductor 14 and the second conductor 15 caused by the conductive liquid being dipped in the two side walls of the second groove 22 .
  • the material of the hydrophobic and oleophobic layer 25 depends on the material of the conductive liquid.
  • the conductive liquid is an oily silver paste, and the oily silver paste is lipophilic.
  • the material of the hydrophobic and oleophobic layer 25 can be: metal phosphate, metal polyphosphate compound, etc.
  • the conductive liquid can be an aqueous silver paste, and the aqueous silver paste is lipophilic.
  • the material of the hydrophobic and oleophobic layer 25 can be: polytetrafluoroethylene, fluorinated polyethylene, etc.
  • the distance between the two hydrophobic and oleophobic layers 25 of any one of the second grooves 22 is greater than or equal to the width of the first protrusion 16 .
  • the distance between the two hydrophobic and oleophobic layers 25 of any second groove 22 is equal to the width of the first protrusion 16, thereby enabling the first protrusion 16 to Fitted into the second groove 22 .
  • the distance between the hydrophobic and oleophobic layers 25 on the two side walls of any one of the second protrusions 26 is less than or equal to the width of the first groove 13 .
  • the distance between the hydrophobic and oleophobic layers 25 on the two side walls of any second protrusion 26 is equal to the width of the first groove 13 , so that the second protrusion 26 can be The protrusion 26 can fit into the first groove 13 .
  • the present invention also provides a method for preparing a display panel 1, which includes the following steps: S10: Provide a substrate 11, the substrate 11 including a first surface 111 and a surface perpendicular to the The side printed surface 112 of the first surface 111; S20: Prepare a plurality of mutually parallel and spaced bonding terminals 12 on the first surface 111 of the substrate 11, the bonding terminals 12 include alternately arranged first bonding terminals 12.
  • a first conductor 14 is formed on the substrate 11, and a second conductor 15 is formed on the substrate 11 located on the top surface of the first protrusion 16. The first conductor 14 is in contact with the first groove 13.
  • the first conductor 14 is connected to the first bonding terminal 121 in one-to-one correspondence; the second conductor 15 is in one-to-one correspondence to the first protrusion 16, and the second conductor 15 is in one-to-one correspondence.
  • the second bonding terminal 122 any one of the first conductors and any one of the second conductors are not conductive to each other.
  • the present invention can increase the width of the first conductor 14 and the second conductor 15, and reduce the width of the first conductor 14 and the first bonding terminal 121, the second conductor 15 and the second bonding terminal. 122 risk of circuit breakage.
  • the first conductor 14 and the second conductor 15 of the present invention are not on the same plane, which can reduce the risk of short circuit between the first conductor 14 and the second conductor 15 .
  • the process of the present invention is simple, and the printing device 2 has strong compatibility.
  • Step S40 also includes: firstly setting a hydrophobic and oleophobic layer 25 on both side walls of each second groove 22, and then using the printing device 2 to dip the conductive liquid into the first printing head 23 and The first groove 13 is aligned, the body 21 is pressed, and the conductive liquid on the first printing head 23 is printed onto the substrate 11 located on the bottom surface of the first groove 13 to form a
  • the first conductor 14 is printed by printing the conductive liquid on the second printing head 24 onto the substrate 11 on the top surface of the first protrusion 16 to form the second conductor 15 .
  • step S40 when the body 21 is pressed, the distance between the two hydrophobic and oleophobic layers 25 of any one of the second grooves 22 is equal to the width of the first protrusion 16. 16 is embedded in the second groove 22; the distance between the hydrophobic and oleophobic layers 25 on the two side walls of any second protrusion 26 is equal to the width of the first groove 13, The second protrusion 26 and the second printing head 24 are engaged in the first groove 13 .
  • this embodiment also provides a spliced display device 3 , which is formed by splicing multiple display panels 1 of this embodiment.
  • the splicing display device 3 includes a splicing seam 31 located between two adjacent display panels.
  • the splicing seam 31 of this embodiment is an uneven line. Since the user is less sensitive to the contours of concave and convex lines than to straight lines; and the user is accustomed to observing from left to right and from top to bottom, the splicing seam 31 of this embodiment requires longer observation time and the amount of information It is larger, so it takes longer to find the splicing seam 31. Therefore, when the display panel 1 of the present invention is spliced, the splicing seam 31 is less obvious, which is beneficial to improving the user experience of the spliced display device 3.

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Abstract

一种显示面板（1）、印刷装置（2）及显示面板（1）的制备方法。通过印刷装置（2）与显示面板（1）相配合，可以增加第一导体（14）和第二导体（15）的宽度，降低第一导体（14）与第一邦定端子（121）、第二导体（15）和第二邦定端子（122）的断路风险。第一导体（14）与第二导体（15）不在同一平面，可以降低第一导体（14）与第二导体（15）的短路的风险。

Description

一种显示面板、印刷装置及显示面板的制备方法 技术领域
本申请涉及显示技术领域，具体涉及一种显示面板、印刷装置及显示面板的制备方法。
 背景技术
当今新型显示领域发展迅速，人们对全面屏或超大屏幕的需求逐步增长。MLED为次毫米发光二极管（英文：Mini LED）和微米发光二极管（英文：Micro LED）的总称，MLED具有反应快、高色域、高PPI、低能耗等优势，已经逐渐发展成未来显示技术的热点。
 技术问题
目前的Mini LED和Micro LED的技术比较复杂，且难点较多。其中的侧印制程对显示面板的良率影响较大。如图1、图2所示，现有技术中的显示面板100的侧印面1001为平面。如图3所示，现有技术中的印刷装置200的印刷头2002凸出于本体2001的高度相同。利用现有技术中的印刷装置200蘸取导电液1002，按压到显示面板100的侧印面1001上的侧印制程中存在的难点主要分为两部分，一部分来自于导电液1002的断路，一部分来自于多次侧印引起的导电液1002的短路。
 技术解决方案
本发明的目的是提供一种显示面板、印刷装置及显示面板的制备方法，其能够解决现有侧印制程中存在的导电液断路及短路问题，导致显示面板良率较低等问题。
为了解决上述问题，本发明提供了一种显示面板，其包括：衬底，其包括第一表面和垂直于所述第一表面的侧印面；多个邦定端子，相互平行且间隔设置于所述衬底的第一表面上；所述邦定端子包括交替设置的第一邦定端子和第二邦定端子；多个第一凹槽，间隔设置于所述衬底的侧印面上，所述第一凹槽与所述第一邦定端子一一对应；任意两个相邻的所述第一凹槽之间形成一个第一凸起；多个第一导体，设置于所述第一凹槽底面的所述衬底上，所述第一导体与所述第一凹槽一一对应，且一一对应连接至所述第一邦定端子；以及多个第二导体，设置于位于所述第一凸起顶面的所述衬底上，所述第二导体与所述第一凸起一一对应，且一一对应连接至所述第二邦定端子；任意一个所述第一导体与任意一个所述第二导体相互不导通。
进一步的，所述第一导体的材质与所述第二导体的材质相同。
进一步的，任意两个所述第一凹槽的形状及尺寸均相同。
进一步的，任意两个所述第一凸起的宽度均相同。
为了解决上述问题，本发明还提供了一种印刷装置，其用于制备本发明所述的显示面板，所述印刷装置包括：本体；多个第二凹槽，间隔设置于所述本体的一侧的表面上；任意两个相邻的所述第二凹槽之间形成一个第二凸起；多个第一印刷头，安装于所述第二凸起顶面的所述本体上；所述第一印刷头与所述第二凸起一一对应；以及多个第二印刷头，安装于所述第二凹槽底面的所述本体上；所述第二印刷头与所述第二凹槽一一对应。
进一步的，任意两个所述第二凹槽的形状及尺寸均相同。
进一步的，任意两个所述第二凸起的宽度均相同。
进一步的，所述印刷装置还包括：多个疏水疏油层，设置于每一所述第二凹槽的两个侧壁上。
进一步的，所述疏水疏油层的材质包括：金属磷酸盐，金属多聚磷酸盐化合物、聚四氟乙烯，氟化聚乙烯中的一种或多种。
进一步的，任意一个所述第二凹槽的两个所述疏水疏油层之间的间距大于等于所述第一凸起的宽度。
进一步的，任意一个所述第二凸起的两个侧壁上的所述疏水疏油层之间的间距小于等于所述第一凹槽的宽度。
为了解决上述问题，本发明还提供了一种显示面板的制备方法，其包括以下步骤：提供一衬底，所述衬底包括第一表面和垂直于所述第一表面的侧印面；在所述衬底的第一表面上制备多个相互平行且间隔的邦定端子，所述邦定端子包括交替设置的第一邦定端子和第二邦定端子；在所述衬底的侧印面上间隔设置多个第一凹槽，所述第一凹槽与所述第一邦定端子一一对应；任意两个相邻的所述第一凹槽之间形成一个第一凸起；以及利用本发明所述的印刷装置在所述第一凹槽底面的所述衬底上形成第一导体，在所述第一凸起顶面的所述衬底上形成第二导体，所述第一导体与所述第一凹槽一一对应，所述第一导体一一对应连接至所述第一邦定端子；所述第二导体与所述第一凸起一一对应，所述第二导体一一对应连接至所述第二邦定端子；任意一个所述第一导体与任意一个所述第二导体相互不导通。
进一步的，所述在所述第一凹槽底面的所述衬底上形成第一导体，在所述第一凸起顶面的所述衬底上形成第二导体的步骤还包括：先在每一所述第二凹槽的两个侧壁上设置疏水疏油层，然后再利用所述印刷装置蘸取导电液，将所述第一印刷头与所述第一凹槽进行对位，按压所述本体，将所述第一印刷头上的所述导电液印刷至所述第一凹槽底面的所述衬底上形成所述第一导体，将所述第二印刷头上的所述导电液印刷至所述第一凸起顶面的所述衬底上形成所述第二导体。
进一步的，采用激光切割、水刀切割、干法刻蚀以及湿法刻蚀中的一种在在所述衬底的侧印面上间隔设置多个第一凹槽。
进一步的，任意一个所述第二凹槽内的两个所述疏水疏油层之间的间距大于等于所述第一凸起的宽度。
进一步的，任意一个所述第二凸起的两个侧壁上的所述疏水疏油层之间的间距小于等于所述第一凹槽的宽度。
进一步的，按压所述本体时，所述第一凸起嵌合于所述第二凹槽内，所述第二凸起和所述第二印刷头嵌合于所述第一凹槽内。
 有益效果
本发明通过印刷装置与显示面板相配合，可以增加第一导体和第二导体的宽度，降低第一导体与第一邦定端子、第二导体和第二邦定端子的断路风险。本发明的第一导体与第二导体不在同一平面，可以降低第一导体与第二导体的短路的风险。本发明在每一所述第二凹槽的两个侧壁上制备疏水疏油层，印刷装置蘸取导电液时，第二凹槽的两个侧壁上不会蘸取导电液，使得第一凹槽的两个侧壁上的衬底上不覆盖导电液，进一步防止第一导体与第二导体之间发生短路现象。本发明的工艺简单，印刷装置的兼容性强。采用本发明的显示面板进行拼接时，拼接缝为凹凸线，用户对凹凸线的轮廓的敏感度低于对直线的敏感度；而且用户习惯从左到右，从上到下运动观察，拼接缝需要的观察时间更长，信息量更大，所以发现拼接缝的时间更长，因此本发明的显示面板进行拼接时，拼接缝更加不明显。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是现有技术中显示面板的侧印前的俯视图；
图2是现有技术中显示面板的侧印后的俯视图；
图3是现有技术中的印刷装置的示意图；
图4是本发明显示面板的侧印后的俯视图；
图5是本发明印刷装置的示意图；
图6是本发明的显示面板的制备步骤图；
图7是本发明显示面板的侧印前的俯视图；
图8是本发明拼接显示装置的平面示意图。
附图标记说明：
1、显示面板；                       2、印刷装置；
11、衬底；                          12、邦定端子；
13、第一凹槽；                      14、第一导体；
15、第二导体；                      16、第一凸起；
111、第一表面；                     112、侧印面；
121、第一邦定端子；                 122、第二邦定端子；
21、本体；                          22、第二凹槽；
23、第一印刷头；                    24、第二印刷头；
25、疏水疏油层；                    26、第二凸起。
 本发明的实施方式
以下结合说明书附图详细说明本发明的优选实施例，以向本领域中的技术人员完整介绍本发明的技术内容，以举例证明本发明可以实施，使得本发明公开的技术内容更加清楚，使得本领域的技术人员更容易理解如何实施本发明。然而本发明可以通过许多不同形式的实施例来得以体现，本发明的保护范围并非仅限于文中提到的实施例，下文实施例的说明并非用来限制本发明的范围。
在附图中，结构相同的部件以相同数字标号表示，各处结构或功能相似的组件以相似数字标号表示。此外，为了便于理解和描述，附图所示的每一组件的尺寸和厚度是任意示出的，本发明并没有限定每个组件的尺寸和厚度。
实施例1
本实施例提供了一种显示面板1。本实施例中，所述显示面板为Mini LED。其他实施例中，显示面板1也可以是液晶显示器（英文：Liquid Crystal Display ，简称LCD）、Micro LED等。
如图4所示，显示面板1包括：衬底11、多个邦定端子12、多个第一凹槽13、多个第一导体14以及多个第二导体15。
其中，衬底11包括：玻璃板、印制电路板、BT树脂板及铝板中的一种。本实施例中，所述衬底11为玻璃板。
其中，衬底11包括第一表面111和垂直于所述第一表面111的侧印面112。
事实上，本实施例的显示面板1还包括驱动层，驱动层包括薄膜晶体管器件。其他实施例中，驱动层的还可以包括驱动芯片，例如：Micro IC、PM driver IC。
其中，邦定端子12相互平行且间隔设置于所述衬底11的第一表面111上。由此，可以避免相邻的邦定端子12之间相互接触形成短路。本实施例中，邦定端子12一端电连接所述显示面板1的驱动层中的薄膜晶体管器件。
其中，邦定端子12包括交替设置的第一邦定端子121和第二邦定端子122。本实施例中，所述第一邦定端子121和第二邦定端子122的材质相同。本实施例中，第一邦定端子121和第二邦定端子122均有一根导线形成，在其他实施例中，第一邦定端子121可以由多根导线制备形成，第二邦定端子122也可以由多根导线制备形成。
其中，第一凹槽13间隔设置于所述衬底11的侧印面112上。所述第一凹槽13与所述第一邦定端子121一一对应。即，每一所述第一凹槽均对应于一个所述第一邦定端子121。任意两个相邻的所述第一凹槽13之间形成一个第一凸起16。第一凹槽13的两个侧壁分别复用为与该第一凹槽13相邻的两个第一凸起16的侧壁。
其中，第一凹槽13可以采用激光切割、水刀切割、干法刻蚀或者湿法刻蚀等方法制作。
其中，任意两个所述第一凹槽13的形状及尺寸均相同，任意两个所述第一凸起16的宽度L均相同。由此，可以降低第一凹槽13的制备工艺难度。
其中，第一导体14设置于位于所述第一凹槽13底面的所述衬底11上。所述第一导体14与所述第一凹槽13一一对应，且一一对应连接至所述第一邦定端子121。即，第一导体14、第一凹槽13以及第一邦定端子121互相之间保持一一对应关系。本实施例中，第一导体14的材质为银浆，在其他实施例中，第一导体14可以是采用其他材质的导电液。
其中，第二导体15设置于所述第一凸起16顶面的所述衬底11上，所述第二导体15与所述第一凸起16一一对应，且一一对应连接至所述第二邦定端子122。本实施例的第二导体15的材质与第一导体14的材质相同，由此印刷装置可以同时制备第一导体14和第二导体15，提升印刷效率，降低制备成本。本发明的第一导体14与第二导体15不在同一平面，可以降低第一导体14与第二导体15的短路的风险。
其中，任意一个所述第一导体14与任意一个所述第二导体15相互不导通。由此防止第一导体14与第二导体15之间发生短路现象。
如图5所示，本实施例提供了一种用于制备本发明所述的显示面板1的印刷装置2。所述印刷装置2包括：本体21、第二凹槽22、第一印刷头23、第二印刷头24、疏水疏油层25以及第二凸起26。
其中，多个第二凹槽22间隔设置于所述本体21的一侧的表面上；任意两个相邻的所述第二凹槽22之间形成一个第二凸起26。其中，第二凹槽22的两个侧壁分别复用为与该第二凹槽22相邻的两个第二凸起26的侧壁。
其中，任意两个所述第二凹槽22的形状及尺寸均相同，任意两个所述第二凸起26的宽度均相同。由此，可以降低第二凹槽22的制备工艺难度。
其中，多个第一印刷头23安装于所述第二凸起26顶面的所述本体21上；所述第一印刷头23与所述第二凸起26一一对应。
其中，多个第二印刷头24安装于所述第二凹槽22底面的所述本体21上；所述第二印刷头24与所述第二凹槽22一一对应。
其中，多个疏水疏油层25设置于每一所述第二凹槽22的两个侧壁上。疏水疏油层25主要用于防止第二凹槽22的两个侧壁上蘸取到导电液导致形成的第一导体14和第二导体15之间发生短路现象。其中，疏水疏油层25的材质取决于所述导电液的材质。本实施例中，所述导电液为油性银浆，油性银浆表现为亲油，针对该种银浆，疏水疏油层25材质可为：金属磷酸盐，金属多聚磷酸盐化合物等。在其他实施例中，所述导电液可以为水性银浆，水性银浆表现为亲油，针对该种银浆，疏水疏油层25材质可为：聚四氟乙烯，氟化聚乙烯等。
其中，任意一个所述第二凹槽22的两个所述疏水疏油层25之间的间距大于等于所述第一凸起16的宽度。本实施例中，任意一个所述第二凹槽22的两个所述疏水疏油层25之间的间距等于所述第一凸起16的宽度，由此可以使得所述第一凸起16能够嵌合于所述第二凹槽22内。
其中，任意一个所述第二凸起26的两个侧壁上的所述疏水疏油层25之间的间距小于等于所述第一凹槽13的宽度。本实施例中，任意一个所述第二凸起26的两个侧壁上的所述疏水疏油层25之间的间距等于所述第一凹槽13的宽度，由此可以使得所述第二凸起26能够嵌合于所述第一凹槽13内。
如图6、图7所示，本发明还提供了一种显示面板1的制备方法，其包括以下步骤：S10：提供一衬底11，所述衬底11包括第一表面111和垂直于所述第一表面111的侧印面112；S20：在所述衬底11的第一表面111上制备多个相互平行且间隔的邦定端子12，所述邦定端子12包括交替设置的第一邦定端子121和第二邦定端子122；S30：在所述衬底11的侧印面112上间隔设置多个第一凹槽13，所述第一凹槽13与所述第一邦定端子121一一对应；任意两个相邻的所述第一凹槽13之间形成一个第一凸起16；以及S40：利用本发明所述的印刷装置2在所述第一凹槽13底面的所述衬底11上形成第一导体14，在位于所述第一凸起16顶面的所述衬底11上形成第二导体15，所述第一导体14与所述第一凹槽13一一对应，所述第一导体14一一对应连接至所述第一邦定端子121；所述第二导体15与所述第一凸起16一一对应，所述第二导体15一一对应连接至所述第二邦定端子122，任意一个所述第一导体与任意一个所述第二导体相互不导通。
本发明通过印刷装置2与显示面板1相配合，可以增加第一导体14和第二导体15的宽度，降低第一导体14与第一邦定端子121、第二导体15和第二邦定端子122的断路风险。本发明的第一导体14与第二导体15不在同一平面，可以降低第一导体14与第二导体15的短路的风险。本发明的工艺简单，印刷装置2的兼容性强。
步骤S40还包括：先在每一所述第二凹槽22的两个侧壁上设置疏水疏油层25，然后再利用所述印刷装置2蘸取导电液，将所述第一印刷头23与所述第一凹槽13进行对位，按压所述本体21，将所述第一印刷头23上的所述导电液印刷至位于所述第一凹槽13底面的所述衬底11上形成所述第一导体14，将所述第二印刷头24上的所述导电液印刷至第一凸起16顶面的所述衬底11上形成所述第二导体15。
步骤S40中，按压所述本体21时，任意一个所述第二凹槽22的两个所述疏水疏油层25之间的间距等于所述第一凸起16的宽度，所述第一凸起16嵌合于所述第二凹槽22内；任意一个所述第二凸起26的两个侧壁上的所述疏水疏油层25之间的间距等于所述第一凹槽13的宽度，所述第二凸起26和第二印刷头24嵌合于所述第一凹槽13内。
如图8所示，本实施例还提供一种拼接显示装置3，其由多个本实施例的显示面板1拼接形成。拼接显示装置3包括位于相邻两个显示面板之间的拼接缝31。
如图8所示，本实施例的拼接缝31为凹凸线。由于用户对凹凸线的轮廓的敏感度低于对直线的敏感度；而且用户习惯从左到右，从上到下运动观察，本实施例的拼接缝31需要的观察时间更长，信息量更大，所以发现拼接缝31的时间更长，因此本发明的显示面板1进行拼接时，拼接缝31更加不明显，有利于提升拼接显示装置3的用户体验感。
进一步的，以上对本申请所提供的一种显示面板、印刷装置及显示面板的制备方法进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种显示面板，包括：
    衬底，其包括第一表面和垂直于所述第一表面的侧印面；
    多个邦定端子，相互平行且间隔设置于所述衬底的第一表面上；所述邦定端子包括交替设置的第一邦定端子和第二邦定端子；
    多个第一凹槽，间隔设置于所述衬底的侧印面上，所述第一凹槽与所述第一邦定端子一一对应；任意两个相邻的所述第一凹槽之间形成一个第一凸起；
    多个第一导体，设置于所述第一凹槽底面的所述衬底上，所述第一导体与所述第一凹槽一一对应，且一一对应连接至所述第一邦定端子；以及
    多个第二导体，设置于位于所述第一凸起顶面的所述衬底上，所述第二导体与所述第一凸起一一对应，且一一对应连接至所述第二邦定端子；
    任意一个所述第一导体与任意一个所述第二导体相互不导通。
  2. 根据权利要求1所述的显示面板，所述第一导体的材质与所述第二导体的材质相同。
  3. 根据权利要求1所述的显示面板，任意两个所述第一凹槽的形状及尺寸均相同。
  4. 根据权利要求1所述的显示面板，任意两个所述第一凸起的宽度均相同。
  5. 一种印刷装置，用于制备权利要求1所述的显示面板，所述印刷装置包括：
    本体；
    多个第二凹槽，间隔设置于所述本体的一侧的表面上；任意两个相邻的所述第二凹槽之间形成一个第二凸起；
    多个第一印刷头，安装于所述第二凸起顶面的所述本体上；所述第一印刷头与所述第二凸起一一对应；以及
    多个第二印刷头，安装于所述第二凹槽底面的所述本体上；所述第二印刷头与所述第二凹槽一一对应。
  6. 根据权利要求5所述的印刷装置，任意两个所述第二凹槽的形状及尺寸均相同。
  7. 根据权利要求5所述的印刷装置，任意两个所述第二凸起的宽度均相同。
  8. 根据权利要求5所述的印刷装置，还包括：
    多个疏水疏油层，设置于每一所述第二凹槽的两个侧壁上。
  9. 根据权利要求8所述的印刷装置，所述疏水疏油层的材质包括：金属磷酸盐，金属多聚磷酸盐化合物、聚四氟乙烯，氟化聚乙烯中的一种或多种。
  10. 根据权利要求8所述的印刷装置，任意一个所述第二凹槽的两个所述疏水疏油层之间的间距大于等于所述第一凸起的宽度。
  11. 根据权利要求8所述的印刷装置，任意一个所述第二凸起的两个侧壁上的所述疏水疏油层之间的间距小于等于所述第一凹槽的宽度。
  12. 一种显示面板的制备方法，包括以下步骤：
    提供一衬底，所述衬底包括第一表面和垂直于所述第一表面的侧印面；
    在所述衬底的第一表面上制备多个相互平行且间隔的邦定端子，所述邦定端子包括交替设置的第一邦定端子和第二邦定端子；
    在所述衬底的侧印面上间隔设置多个第一凹槽，所述第一凹槽与所述第一邦定端子一一对应；任意两个相邻的所述第一凹槽之间形成一个第一凸起；以及
    利用印刷装置在所述第一凹槽底面的所述衬底上形成第一导体，在所述第一凸起顶面的所述衬底上形成第二导体，所述第一导体与所述第一凹槽一一对应，所述第一导体一一对应连接至所述第一邦定端子；所述第二导体与所述第一凸起一一对应，所述第二导体一一对应连接至所述第二邦定端子；任意一个所述第一导体与任意一个所述第二导体相互不导通；
    所述印刷装置包括：
    本体；
    多个第二凹槽，间隔设置于所述本体的一侧的表面上；任意两个相邻的所述第二凹槽之间形成一个第二凸起；
    多个第一印刷头，安装于所述第二凸起顶面的所述本体上；所述第一印刷头与所述第二凸起一一对应；以及
    多个第二印刷头，安装于所述第二凹槽底面的所述本体上；所述第二印刷头与所述第二凹槽一一对应。
  13. 根据权利要求12所述的显示面板的制备方法，任意两个所述第二凹槽的形状及尺寸均相同。
  14. 根据权利要求12所述的显示面板的制备方法，任意两个所述第二凸起的宽度均相同。
  15. 根据权利要求12所述的显示面板的制备方法，所述在所述第一凹槽底面的所述衬底上形成第一导体，在所述第一凸起顶面的所述衬底上形成第二导体的步骤还包括：
    先在每一所述第二凹槽的两个侧壁上设置疏水疏油层，然后再利用所述印刷装置蘸取导电液，将所述第一印刷头与所述第一凹槽进行对位，按压所述本体，将所述第一印刷头上的所述导电液印刷至所述第一凹槽底面的所述衬底上形成所述第一导体，将所述第二印刷头上的所述导电液印刷至所述第一凸起顶面的所述衬底上形成所述第二导体。
  16. 根据权利要求15所述的显示面板的制备方法，所述疏水疏油层的材质包括：金属磷酸盐，金属多聚磷酸盐化合物、聚四氟乙烯，氟化聚乙烯中的一种或多种。
  17. 根据权利要求12所述的显示面板的制备方法，采用激光切割、水刀切割、干法刻蚀以及湿法刻蚀中的一种在在所述衬底的侧印面上间隔设置多个第一凹槽。
  18. 根据权利要求15所述的显示面板的制备方法，任意一个所述第二凹槽内的两个所述疏水疏油层之间的间距大于等于所述第一凸起的宽度。
  19. 根据权利要求18所述的显示面板的制备方法，任意一个所述第二凸起的两个侧壁上的所述疏水疏油层之间的间距小于等于所述第一凹槽的宽度。
  20. 根据权利要求19所述的显示面板的制备方法，按压所述本体时，所述第一凸起嵌合于所述第二凹槽内，所述第二凸起和所述第二印刷头嵌合于所述第一凹槽内。
PCT/CN2022/096324 2022-05-20 2022-05-31 一种显示面板、印刷装置及显示面板的制备方法 WO2023221171A1 (zh)

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CN107994058A (zh) * 2017-11-27 2018-05-04 京东方科技集团股份有限公司 显示基板及其制造方法、显示面板及其封装方法
CN108269823A (zh) * 2016-12-30 2018-07-10 乐金显示有限公司 发光二极管显示装置和使用其的多屏幕显示装置
CN114188468A (zh) * 2021-12-02 2022-03-15 Tcl华星光电技术有限公司 发光二极体显示器及其制作方法
CN114280862A (zh) * 2021-12-14 2022-04-05 Tcl华星光电技术有限公司 显示面板及其制备方法

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EP0614221A1 (en) * 1993-03-05 1994-09-07 Fujitsu Limited Integrated transmission line structure
US6025901A (en) * 1995-08-14 2000-02-15 Sharp Kabushiki Kaisha Liquid crystal display device and method for producing the same
CN108269823A (zh) * 2016-12-30 2018-07-10 乐金显示有限公司 发光二极管显示装置和使用其的多屏幕显示装置
CN107994058A (zh) * 2017-11-27 2018-05-04 京东方科技集团股份有限公司 显示基板及其制造方法、显示面板及其封装方法
CN114188468A (zh) * 2021-12-02 2022-03-15 Tcl华星光电技术有限公司 发光二极体显示器及其制作方法
CN114280862A (zh) * 2021-12-14 2022-04-05 Tcl华星光电技术有限公司 显示面板及其制备方法

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