WO2023216262A1 - 发热体及其制备方法、雾化组件及电子雾化装置 - Google Patents

发热体及其制备方法、雾化组件及电子雾化装置 Download PDF

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Publication number
WO2023216262A1
WO2023216262A1 PCT/CN2022/092858 CN2022092858W WO2023216262A1 WO 2023216262 A1 WO2023216262 A1 WO 2023216262A1 CN 2022092858 W CN2022092858 W CN 2022092858W WO 2023216262 A1 WO2023216262 A1 WO 2023216262A1
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Prior art keywords
heating
heating element
micropores
groove
groove structure
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PCT/CN2022/092858
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English (en)
French (fr)
Inventor
吕铭
赵月阳
张彪
黄容基
樊文远
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深圳麦克韦尔科技有限公司
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Priority to PCT/CN2022/092858 priority Critical patent/WO2023216262A1/zh
Publication of WO2023216262A1 publication Critical patent/WO2023216262A1/zh

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    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A24F40/48—Fluid transfer means, e.g. pumps
    • A24F40/485—Valves; Apertures

Definitions

  • the present application relates to the field of atomization technology, and in particular to a heating element and its preparation method, an atomization component and an electronic atomization device.
  • a typical electronic atomization device consists of a heating element, a battery and a control circuit.
  • the heating element determines the atomization effect and user experience of the electronic atomization device.
  • heating elements include cotton core heating elements and porous ceramic heating elements.
  • the structure of the cotton core heating element is mostly a spring-shaped metal heating wire wrapped around a cotton rope or fiber rope; the spring-shaped metal heating wire needs to play a structural support role in the structure of the cotton core heating element.
  • the metal heating wire The diameter of the wire is usually several hundred microns; the liquid aerosol-generating matrix to be atomized is absorbed by both ends of the cotton rope or fiber rope, and then transferred to the central metal heating wire to be heated and atomized.
  • One structure of the porous ceramic heating element is a spring-shaped metal heating wire embedded in a cylindrical porous ceramic body; the porous ceramic body plays the role of conducting and storing liquid.
  • porous ceramic heating element Another structure of the porous ceramic heating element is to print a metal thick film slurry on the porous ceramic body, and then sinter it at high temperature to form metal wires on the porous ceramic body; because the pore size distribution on the surface of the porous ceramic ranges from 1 ⁇ m to 100 ⁇ m, resulting in The surface roughness of porous ceramics is relatively large. In order to form a continuous and stable metal film conductor, the thickness of the metal film conductor usually exceeds 100 ⁇ m.
  • the metal heating wire or metal thick film wire when electricity is applied, the metal heating wire or metal thick film wire is heated, and the heat is conducted to the liquid in the cotton rope or porous ceramic body, so that the liquid is heated and atomized.
  • the metal heating wire or metal thick film conductor Since the metal heating wire or metal thick film conductor is a dense entity, when power is applied, the metal heating wire or metal thick film conductor needs to be heated first, and only the liquid near the metal heating wire or metal thick film conductor is heated by the metal heating wire or metal thick film conductor. With direct heating, the liquid at a distance needs to be heated and atomized by the heat conducted by cotton ropes or porous ceramic bodies. This heating method has the disadvantage of low atomization efficiency.
  • the present application provides a heating element and its preparation method, an atomization assembly and an electronic atomization device to solve the technical problem of low atomization efficiency of the heating element in the prior art.
  • the first technical solution provided by this application is to provide a heating element, which is used in an electronic atomization device and is used to heat an atomized aerosol-generating matrix, including a dense matrix and a heating layer; the dense A matrix, including a first surface and a second surface arranged oppositely; the dense matrix has a plurality of micropores penetrating the first surface and the second surface, and the micropores are used to generate the aerosol into a matrix It is guided from the second surface to the first surface; the first surface of the dense matrix is provided with a groove structure; and the heat-generating layer is provided in the groove structure.
  • the groove structure is offset from the plurality of micropores.
  • the thickness of the heat-generating layer is greater than or equal to 50 ⁇ m.
  • the thickness of the heat-generating layer is 50 ⁇ m-150 ⁇ m.
  • the material of the heating layer is one of nickel-chromium alloy, nickel-chromium iron alloy, and iron-chromium-aluminum alloy.
  • the heating element further includes a protective film, and the protective film is provided on a surface of the heating layer away from the bottom surface of the groove structure.
  • the protective film is partially provided in the groove structure; or the protective film is entirely provided in the groove structure.
  • the thickness of the protective film is 1 ⁇ m-30 ⁇ m.
  • the protective film is made of silicon dioxide or titanium nitride.
  • the heating layer and/or the protective film are formed by printing or a printing process.
  • the first surface of the dense substrate includes a heating area and an electrode area;
  • the groove structure includes a first groove located in the heating area and a second groove located in the electrode area, so The first groove is connected with the second groove;
  • the heating layer includes a heating part located in the first groove and a connecting part located in the second groove, the heating part and the The connector is connected.
  • the groove structure includes a plurality of first grooves arranged in parallel and two second grooves located on opposite sides of the heating area, and the two ends of the first groove are respectively It is connected with the two second grooves;
  • the heating part includes a plurality of first strip-shaped heating parts arranged in parallel, and the two ends of the first strip-shaped heating part are respectively connected with the two ends of the heating area on opposite sides. connected to each of the connecting parts;
  • a plurality of the micropores are arranged in an array; a plurality of the first grooves and a plurality of rows of the micropores are alternately arranged.
  • the groove structure further includes a plurality of third grooves located in the heating area, and the plurality of third grooves are arranged parallel to each other and intersecting with the first groove;
  • the heating part also includes a plurality of second strip-shaped heating parts arranged in parallel.
  • the second strip-shaped heating part is provided in the third groove.
  • the plurality of first strip-shaped heating parts and the plurality of third strip-shaped heating parts are arranged in parallel. Two strip-shaped heating parts are arranged crosswise;
  • a plurality of second grooves and a plurality of columns of micropores are arranged alternately.
  • the second groove is in an "L” shape; and the connecting portion is in an “L” shape.
  • the shape of the first groove is meandering.
  • the dense matrix is quartz, glass or dense ceramics.
  • the pore diameter of the micropores is 1 ⁇ m-100 ⁇ m, and the axis of the micropores is parallel to the thickness direction of the dense matrix.
  • the micropores are ordered through-holes.
  • the second technical solution provided by this application is to provide an atomization assembly, including a liquid storage chamber and a heating element; the liquid storage chamber is used to store a liquid aerosol generating substrate; the heating element It is the heating element described in any one of the above; the heating element is in fluid communication with the liquid storage chamber.
  • the third technical solution provided by this application is to provide an electronic atomization device, including an atomization component and a power supply component.
  • the atomization component is the atomization component described above, and the power supply component The component is electrically connected to the heating element.
  • the fourth technical solution provided by this application is to provide a method for preparing a heating element, including:
  • a dense matrix is provided; wherein the dense matrix includes a first surface and a second surface arranged oppositely, and the dense matrix has a plurality of micropores penetrating the first surface and the second surface;
  • a heat-generating layer is formed within the groove structure.
  • the step of forming a groove structure on the dense substrate having a plurality of micropores specifically includes:
  • the groove structure is formed on the dense substrate except for the area where the plurality of micropores are located.
  • the step of forming a heating layer in the groove structure specifically includes:
  • the groove structure is filled with conductive paste and the conductive paste is sintered through a printing process or printing process, wherein the thickness of the heat-generating layer is greater than or equal to 50 ⁇ m.
  • the method further includes: forming a protective film on a surface of the heating layer away from the bottom surface of the groove structure.
  • the step of forming a protective film on the surface of the heating layer away from the bottom surface of the groove structure specifically includes:
  • the protective film located on the surface of the heating layer is formed in the groove structure through a printing process or printing process.
  • this application discloses a heating element and its preparation method, an atomization assembly and an electronic atomization device.
  • the heating element includes a dense matrix and a heating layer; the dense matrix includes an oppositely arranged third A first surface and a second surface; the first surface of the dense matrix is provided with a groove structure; the heating layer is provided in the groove structure.
  • Figure 1 is a schematic structural diagram of an electronic atomization device provided by an embodiment of the present application.
  • Figure 2 is a schematic structural diagram of the atomization component of the electronic atomization device provided in Figure 1;
  • Figure 3 is a schematic structural diagram of the second embodiment of the heating element of the atomization assembly provided in Figure 2;
  • Figure 4 is a schematic cross-sectional structural diagram of the heating element provided in Figure 3 along line B-B;
  • Figure 5 is a schematic structural diagram of the third embodiment of the heating element of the atomization assembly provided in Figure 2;
  • Figure 6 is a schematic cross-sectional structural diagram of the heating element provided in Figure 5 along line B-B;
  • Figure 7 is a schematic structural diagram of the fourth embodiment of the heating element of the atomization assembly provided in Figure 2;
  • Figure 8 is a schematic structural diagram of another embodiment of the second groove of the heating element provided in Figure 7;
  • Figure 9 is a schematic structural diagram of the fifth embodiment of the heating element of the atomization assembly provided in Figure 2;
  • Figure 10 is a schematic structural diagram of the sixth embodiment of the heating element of the atomization assembly provided in Figure 2;
  • Figure 11 is a schematic flow chart of the first embodiment of the heating element preparation method provided by the present application.
  • Figure 12 is a schematic flow chart of the second embodiment of the heating element preparation method provided by this application.
  • first”, “second” and “third” in this application are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Thus, features defined as “first”, “second”, and “third” may explicitly or implicitly include at least one of said features.
  • the meaning of “plurality” is at least two, such as two, three, etc., unless otherwise clearly and specifically limited. All directional indications (such as up, down, left, right, front, back%) in the embodiments of this application are only used to explain the relative positional relationship between components in a specific posture (as shown in the drawings). , sports conditions, etc., if the specific posture changes, the directional indication will also change accordingly.
  • an embodiment means that a particular feature, structure or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application.
  • the appearances of recited phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those skilled in the art understand, both explicitly and implicitly, that the embodiments described herein may be combined with other embodiments.
  • FIG. 1 is a schematic structural diagram of an electronic atomization device provided by an embodiment of the present application.
  • an electronic atomization device 100 is provided.
  • the electronic atomization device 100 can be used to atomize an aerosol-generating substrate.
  • the electronic atomization device 100 includes an atomization component 1 and a power supply component 2 that are electrically connected to each other.
  • the atomization component 1 is used to store the aerosol-generating substrate and atomize the aerosol-generating substrate to form an aerosol that can be inhaled by the user.
  • the atomization component 1 can be used in different fields, such as medical treatment, beauty, leisure smoking, etc.
  • the atomization component 1 can be used in an electronic aerosolization device to atomize an aerosol-generating matrix and generate aerosol for smokers to inhale.
  • the following embodiments are all based on recreational smoking. example.
  • the power component 2 includes a battery (not shown) and a controller (not shown).
  • the battery is used to provide electrical energy for the operation of the atomization component 1, so that the atomization component 1 can atomize the aerosol-generating matrix to form an aerosol; the controller is used to control the operation of the atomization component 1.
  • the power supply component 2 also includes other components such as a battery holder and an air flow sensor.
  • the atomization component 1 and the power supply component 2 can be integrated or detachably connected, and can be designed according to specific needs.
  • the power of the electronic atomizer device does not exceed 10 watts, and the power is usually 6 watts-8.5 watts.
  • the battery voltage used in electronic atomization devices ranges from 2.5 volts to 4.4 volts.
  • the voltage range of the battery used is 3V-4.4V.
  • Figure 2 is a schematic structural diagram of the atomization component of the electronic atomization device provided in Figure 1.
  • the atomizing assembly 1 includes a housing 10 , a heating element 11 , and an atomizing seat 12 .
  • the atomizing seat 12 has an installation cavity (not labeled in the figure), and the heating element 11 is located in the installation cavity; the heating element 11 and the atomizing seat 12 are located in the housing 10 together.
  • the housing 10 is formed with a mist outlet channel 13.
  • the inner surface of the housing 10, the outer surface of the mist outlet channel 13 and the top surface of the atomization seat 12 cooperate to form a liquid storage chamber 14.
  • the liquid storage chamber 14 is used to store the liquid aerosol generated. matrix.
  • the heating element 11 is electrically connected to the power supply component 2, and uses an atomized aerosol-generating matrix to generate aerosol.
  • the atomization seat 12 includes an upper seat 121 and a lower seat 122.
  • the upper seat 121 and the lower seat 122 cooperate to form an installation cavity; the atomization surface of the heating element 11 cooperates with the cavity wall of the installation cavity to form an atomization cavity 120.
  • the upper seat 121 is provided with a lower liquid channel 1211; the aerosol generating matrix channel in the liquid storage chamber 14 flows into the heating body 11 through the lower liquid channel 1211, that is, the heating body 11 is in fluid communication with the liquid storage cavity 14.
  • the lower seat 122 is provided with an air inlet channel 15. The external air enters the atomization chamber 120 through the air inlet channel 15, and the atomized aerosol carried by the heating element 11 flows to the mist outlet channel 13. The user inhales through the port of the mist outlet channel 13. Aerosol.
  • Figure 3 is a schematic structural diagram of the second embodiment of the heating element of the atomization assembly provided in Figure 2.
  • Figure 4 is a schematic cross-sectional structural diagram of the heating element provided in Figure 3 along line B-B.
  • the heating element 11 includes a dense matrix 111 and a heating layer 112 .
  • the dense base 111 includes a first surface 1111 and a second surface 1112 that are oppositely arranged.
  • the first surface 1111 of the dense base 111 is provided with a groove structure 113 .
  • the heat-generating layer 112 is provided in the groove structure 113 .
  • the dense matrix 111 has a plurality of micropores 1113 penetrating the first surface 1111 and the second surface 1112.
  • the micropores 1113 are ordered through holes; the micropores 1113 are used to remove the aerosol-generating matrix from the second surface.
  • the surface 1112 is guided to the first surface 1111, and the aerosol-generating substrate is atomized by the heat-generating layer 112 to generate aerosol.
  • the aerosol-generating matrix in the liquid storage chamber 14 reaches the dense matrix 111 of the heating element 11 through the lower liquid channel 1211, and the capillary force of the micropores 1113 on the dense matrix 111 is used to remove the aerosol-generating matrix from the first part of the dense matrix 111.
  • the two surfaces 1112 are guided to the first surface 1111 of the dense matrix 111, so that the aerosol-generating matrix is atomized by the heating layer 112; that is, the micropores 1113 are connected to the liquid storage chamber 14 through the lower liquid channel 1211.
  • the material of the dense matrix 111 may be quartz, glass or dense ceramics.
  • the dense matrix 111 can be one of ordinary glass, quartz glass, borosilicate glass or photosensitive lithium aluminosilicate glass;
  • the dense matrix 111 is made of dense ceramics, the materials of the dense ceramics include aluminum nitride, silicon nitride, One or more of silicon carbide, alumina, and zirconia.
  • the path length for the heat generated by the heat-generating layer 112 to conduct to the micropores 1113 inside the dense matrix 111 is shortened. , which is conducive to faster atomization of the aerosol generation matrix in the micropores 1113, which is conducive to improving the atomization efficiency.
  • a dense dense matrix has a higher thermal conductivity than porous ceramics; taking dense ceramics as an example, the thermal conductivities of commonly used dense ceramics and porous ceramics are shown in Table 1.
  • the heat generated by the heating layer 112 is transmitted to the aerosol-generating matrix in the micropores 1113 through the dense ceramic material with high thermal conductivity, and the atomized aerosol-generating matrix is heated, which is beneficial to improving the atomization efficiency.
  • the micropores 1113 of the dense matrix 111 have a higher liquid conduction speed than the tortuous and disordered micropores of the dense matrix 111 of porous ceramics, further improving the atomization efficiency.
  • the porosity of the heating element 11 can be accurately controlled and the consistency of the product can be improved. That is to say, in mass production, the porosity of the dense matrix 111 in the heating element 11 is basically the same, and the thickness of the heating layer 112 formed on the dense matrix 111 is uniform, so that the atomization effect of the electronic atomization devices shipped from the same batch is consistent.
  • the heating element 11 with micropores 1113 in the sheet structure provided by the present application has a shorter liquid supply channel and a faster liquid supply speed, but the risk of liquid leakage is higher. big. Therefore, the inventor of the present application studied the effect of the ratio of the thickness of the dense matrix 111 to the aperture of the micropores 1113 on the liquid supply of the heating element 11, and found that increasing the thickness of the dense matrix 111 and reducing the aperture of the micropores 1113 can reduce liquid leakage. Risks will also reduce the liquid supply rate. Reducing the thickness of the dense matrix 111 and increasing the aperture of the micropores 1113 can increase the liquid supply rate but increase the risk of liquid leakage. The two are contradictory.
  • this application designs the thickness of the dense matrix 111, the aperture of the micropores 1113, and the ratio of the thickness of the dense matrix 111 to the aperture of the micropores 1113, so that the heating element 11 can operate at a power of 6 watts to 8.5 watts and a voltage of 2.5 volts. When working at 4.4 volts, it can achieve sufficient liquid supply and prevent liquid leakage.
  • the inventor of the present application also studied the ratio of the hole center distance of adjacent micropores 1113 to the micropore 1113 aperture, and found that if the ratio of the hole center distance of adjacent micropores 1113 to the micropore 1113 aperture is too large, the dense matrix 111 It is strong and easy to process, but the porosity is too small, which can easily lead to insufficient liquid supply; if the ratio of the hole center distance of adjacent micropores 1113 to the micropore 1113 aperture is too small, the porosity will be large and the liquid supply will be sufficient. , but the density of the dense matrix 111 is low and difficult to process; for this reason, this application also designs the ratio of the hole center distance of adjacent micropores 1113 to the diameter of the micropores 1113. On the premise of satisfying the liquid supply capacity, the ratio is as high as possible. The strength of the dense matrix 111 is improved.
  • the first surface 1111 and the second surface 1112 of the dense matrix 111 are arranged in parallel; the axis of the micropore 1113 is perpendicular to the first surface 1111 and the second surface 1112.
  • the thickness of the dense matrix 111 is equal to the length of the micropore 1113 equal.
  • the second surface 1112 is parallel to the first surface 1111, and the micropores 1113 penetrate from the first surface 1111 to the second surface 1112, which simplifies the production process of the dense matrix 111 and reduces the cost.
  • the distance between the first surface 1111 and the second surface 1112 is the thickness of the dense matrix 111 .
  • the first surface 1111 of the dense matrix 111 is a plane; the second surface 1112 of the dense matrix 111 is a non-planar surface, such as a bevel, a curved surface, a sawtooth surface, etc.
  • the second surface 1112 can be designed according to specific needs.
  • the micropores 1113 need to penetrate the first surface 1111 and the second surface 1112.
  • the cross section of the micropore 1113 is circular.
  • the micropores 1113 can be straight-through holes with uniform pore diameters, or they can be straight-through holes with uneven pore diameters, as long as the variation range of the pore diameters is within 50%; the straight-through holes refer to the micropores 1113 penetrating from the first surface 1111 to the second surface.
  • the axes of the two surfaces 1112 and the micropores 1113 are parallel to the thickness direction of the dense matrix 111 .
  • the micropores 1113 opened on the glass through laser induction and etching usually have large apertures at both ends and a small aperture in the middle. Therefore, it is sufficient to ensure that the pore diameter of the middle part of the micropore 1113 is not less than half of the pore diameter of the two end ports.
  • the thickness of the dense matrix 111 is 0.1 mm-1 mm. When the thickness of the dense matrix 111 is greater than 1 mm, it cannot meet the liquid supply demand, resulting in a decrease in aerosol volume, high heat loss, and high cost of setting up micropores 1113; when the thickness of the dense matrix 111 is less than 0.1 mm, density cannot be guaranteed
  • the strength of the base 111 is not conducive to improving the performance of the electronic atomization device.
  • the thickness of the dense matrix 111 is 0.2 mm-0.5 mm. It can be understood that the thickness of the dense matrix 111 is selected according to actual needs.
  • the pore diameter of the micropores 1113 on the dense matrix 111 is 1 ⁇ m-100 ⁇ m.
  • the pore diameter of the micropore 1113 is less than 1 ⁇ m, it cannot meet the liquid supply demand, resulting in a decrease in the amount of aerosol; when the pore diameter of the micropore 1113 is greater than 100 ⁇ m, the aerosol-generating matrix easily flows out of the micropore 1113 to the first surface 1111, causing liquid leakage. Resulting in a reduction in atomization efficiency.
  • the pore diameter of the micropores 1113 is 20 ⁇ m-50 ⁇ m. It can be understood that the diameter of the micropores 1113 is selected according to actual needs.
  • the ratio of the thickness of the dense matrix 111 to the aperture of the micropores 1113 is 20:1-3:1; optionally, the ratio of the thickness of the dense matrix 111 to the aperture of the micropores 1113 is 15:1-5:1.
  • the ratio of the thickness of the dense matrix 111 to the pore diameter of the micropores 1113 is greater than 20:1, the aerosol-generating matrix supplied by the capillary force of the micropores 1113 is difficult to meet the atomization demand of the heating element 11, which not only easily leads to dry burning , and the amount of aerosol generated in a single atomization decreases; when the ratio of the thickness of the dense matrix 111 to the pore diameter of the micropores 1113 is less than 3:1, the aerosol-generating matrix easily flows out from the micropores 1113 to the first surface 1111, The aerosol generation matrix is wasted, resulting in a decrease in atomization efficiency, thereby reducing the total aerosol volume.
  • the ratio of the hole center distance between two adjacent micropores 1113 to the aperture diameter of the micropores 1113 is 3:1-1.5:1, so that the micropores 1113 on the dense matrix 111 can satisfy the liquid supply capacity as much as possible. It is possible to improve the strength of the dense matrix 111; optionally, the ratio of the hole center distance between two adjacent micropores 1113 to the pore diameter of the micropore 1113 is 3:1-2:1; optionally, the ratio between two adjacent micropores 1113 The ratio of the hole center distance between the micropores 1113 to the aperture diameter of the micropores 1113 is 3:1-2.5:1.
  • the ratio of the thickness of the dense matrix 111 to the aperture of the micropores 1113 is 15:1-5:1, and the ratio of the hole center distance between two adjacent micropores 1113 to the aperture of the micropores 1113 is 3:1-2.5:1.
  • the dense matrix 111 has a regular shape. As shown in Figure 4, the dense matrix 111 is in the shape of a rectangular plate. The plurality of micropores 1113 provided on the dense matrix 111 are arranged in an array; that is, the multiple micropores 1113 provided on the dense matrix 111 are arranged in an array. The micropores 1113 are regularly arranged, and the hole center distance between adjacent micropores 1113 in the plurality of micropores 1113 is the same. It can be understood that the dense matrix 111 can also be cylindrical or arc-shaped, and can be specifically designed according to needs.
  • the groove structure 113 and the plurality of micropores 1113 are disposed in an offset manner, and there is no communication between the groove structure 113 and the micropores 1113 .
  • the first surface 1111 of the dense substrate 111 includes a heating area a and an electrode area b.
  • the groove structure 113 includes a first groove 1131 located in the heating area a and a second groove 1132 located in the electrode area b.
  • the first groove 1131 is connected with the second groove 1132 .
  • the heat-generating layer 112 includes a heat-generating part 1121 located in the first groove 1131 and a connecting part 1122 located in the second groove 1132 . Since the first groove 1131 and the second groove 1132 are connected, the heating part 1121 provided in the first groove 1131 is electrically connected to the connecting part 1122 provided in the second groove 1132 .
  • the connecting part 1122 is used as an electrode, and the connecting part 1122 is used for electrical connection with the power supply component 2 .
  • a second groove 1132 is provided on both sides of the first groove 1131 , that is, a connecting portion 1122 is provided on both sides of the heating part 1121 .
  • the groove structure 113 and the plurality of micropores 1113 are arranged in offset positions to ensure that the dense matrix 111 has a high liquid supply capacity.
  • the plurality of micropores 1113 are arranged in an array.
  • the groove structure 113 includes a plurality of first grooves 1131 arranged in parallel, and the plurality of first grooves 1131 are all connected with the second groove 1132; specifically, the two ends of the first groove 1131 are respectively connected to both sides of the heating area a.
  • the second groove 1132 is connected.
  • the plurality of micropores 1113 are arranged in an array; the plurality of first grooves 1131 and the plurality of rows of micropores 1113 are alternately arranged.
  • the heating part 1121 includes a plurality of first strip-shaped heating parts 1121a arranged in parallel. Both ends of the first strip-shaped heating part 1121a are respectively connected to two connecting parts 1122 on opposite sides of the heating area a.
  • the width of the first groove 1131 is the same as the diameter of the microhole 1113, which helps reduce the processing difficulty of forming the first groove 1131.
  • micropores 1113 are provided only in the heat-generating area a of the dense substrate 111, and there are no micropores 1113 in the electrode area b.
  • the resistance of the heating layer 112 formed in the groove structure 113 is 0.5 ohm-2 ohm. It can be understood that when the power of the electronic atomization device is 6 watts to 8.5 watts and the voltage range of the battery is 2.5 volts to 4.4 volts, in order to achieve the working resistance of the battery, the resistance range of the heating layer 112 of the heating element 11 at normal temperature is 0.5 ohm-2 ohm.
  • the thickness of the heating layer 112 is greater than or equal to 50 ⁇ m. It can be understood that the thickness of the heating layer 112 can be adaptively adjusted according to the thickness of the dense matrix 111, and the depth of the groove structure 113 can be adjusted accordingly. In one embodiment, the thickness of the heat-generating layer 112 is 50 ⁇ m-150 ⁇ m.
  • the material of the heating layer 112 is nickel-chromium alloy, nickel-chromium iron alloy, or iron-chromium-aluminum alloy.
  • the heating layer 112 is deposited in the groove structure 113 using a printing or printing process, and formed through a sintering process. Therefore, the heating part 1121 and the connecting part 1122 have an integrally formed structure.
  • the printing process can be screen printing, and the printing process can be inkjet printing.
  • the thickness of the heating layer 112 may be the same as the depth of the groove structure 113 , may be smaller than the depth of the groove structure 113 , or may be greater than the depth of the groove structure 113 . It can be understood that in the porous ceramic heating elements in the prior art, the heating layer is provided on the surface of the porous ceramic. When the thickness of the heating layer is greater than 50 ⁇ m, it is not easy to deposit a protective film on the surface of the heating layer away from the porous ceramic.
  • the heating layer 112 by placing At least part of the heating layer 112 is deposited in the groove structure 113, which can reduce the thickness of the first surface 1111 of the heating layer 112 exposed to the dense substrate 111, and facilitate the deposition of the protective film 114 described later on the surface of the heating layer 112 (Fig. 5
  • the heating element 11 provided will introduce the protective film 114 in detail).
  • connection portion 1122 of the heat-generating layer 112 is completely provided in the second groove 1132; or, the connection portion 1122 of the heat-generating layer 112 is partially provided in the second groove 1132 and part is provided on the first surface of the dense substrate 111. 1111 to connect external circuits through thimbles or wires, which can be designed as needed.
  • FIG. 5 is a schematic structural diagram of the third embodiment of the heating element of the atomization assembly provided in Figure 2.
  • Figure 6 is a diagram. 5 provides a schematic diagram of the cross-sectional structure of the heating element along line B-B.
  • the structure of the heating element 11 provided in Figure 5 is basically the same as that of the heating element 11 provided in Figure 3 .
  • the difference is that the heating element 11 also includes a protective film 114 , and the same parts will not be described again.
  • the heating element 11 also includes a protective film 114 , which is disposed on the surface of the heating layer 112 away from the bottom surface of the groove structure 113 .
  • the protective film 114 isolates the heating layer 112 from the aerosol-generating matrix and air, prevents the heating layer 112 from being corroded by the aerosol-generating matrix, and prevents the heating layer 112 from being oxidized at high temperatures, which is beneficial to extending the service life of the heating element 11 and improving the performance of the electronic atomization device. performance.
  • the protective film 114 can also prevent metal in the heating layer 112 from being precipitated and mixed in the aerosol.
  • the thickness of the protective film 114 is 1 ⁇ m-30 ⁇ m.
  • the protective film 114 is made of silicon dioxide or titanium nitride.
  • the protective film 114 is provided outside the groove structure 113 .
  • a mask is used to deposit the protective film 114 on the surface of the heating layer 112 through printing or printing process; at this time, the depth of the groove structure 113 is the same as the thickness of the heating layer 112 .
  • the printing process can be screen printing, and the printing process can be inkjet printing.
  • the protective film 114 is provided in the groove structure 113 .
  • the protective film 114 is deposited in the groove structure 113 using a printing or printing process.
  • the printing process can be screen printing, and the printing process can be inkjet printing.
  • the protective film 114 is partially disposed in the groove structure 113 , or the protective film 114 is entirely disposed in the groove structure 113 .
  • the protective film 114 in the groove structure 113 is beneficial to the overall flatness of the heating element 11; at this time, the depth of the groove structure 113 is greater than or equal to the sum of the thickness of the heating layer 112 and the thickness of the protective film 114.
  • the heating layer is provided on the surface of the dense substrate. When the thickness of the heating layer is greater than 50 ⁇ m, it is difficult to print a protective film on the surface of the heating layer away from the dense substrate; in this application, the heating layer 112 with a thickness of greater than or equal to 50 ⁇ m is difficult to print.
  • the slurry forming the heating layer 112 will shrink after high-temperature sintering, so that the thickness of the heating layer 112 exposed to the first surface 1111 of the dense matrix 111 is reduced, making it easier to deposit the protective film 114 again.
  • the protective film 114 is only provided on the heating part 1121 of the heating layer 112 and covers the entire heating part 1121 .
  • the depth of the groove structure 113 is greater than the thickness of the heating layer 112
  • the protective film 114 is disposed on the surface of the heating part 1121 away from the bottom surface of the first groove 1131 and fills the first groove 1131
  • the connecting part 1122 is away from the second groove.
  • the surface of the bottom surface of the groove 1132 is further provided with a metal layer 115 (as shown in Figures 5 and 6).
  • the metal layer 115 fills the second groove 1132 to facilitate the connection of the ejector pin and to reduce the ohmic resistance between the connection part 1122 and the ejector pin. Contact resistance.
  • the connecting portion 1122 is electrically connected to the power supply assembly 2 through an ejection pin.
  • the material of the protective film 114 may be silicon dioxide.
  • the protective film 114 is provided on the surface of the entire heating layer 112 , that is, the protective film 114 is provided on the surfaces of the heating part 1121 and the connecting part 1122 , and the protective film 114 has an opening so that part of the connecting part 1122 is exposed without affecting the connecting part.
  • 1122 Electrical connectivity to power supply assembly 2.
  • the protective film 114 on the surface of the connecting portion 1122 can also be made of conductive material, such as titanium diboride.
  • FIG. 7 is a schematic structural diagram of the fourth embodiment of the heating element of the atomization assembly provided in FIG. 2 .
  • the structure of the heating element 11 provided in Figure 7 is basically the same as that of the heating element 11 provided in Figure 3. The difference lies in the specific arrangement of the groove structure 113. The same parts will not be described again.
  • the groove structure 113 includes a first groove 1131 located in the heat generating area a, a third groove 1133 located in the heat generating area a, and a second groove 1132 located in the electrode area b. There are two second grooves 1132, which are located on opposite sides of the heating area a.
  • the groove structure 113 includes a plurality of first grooves 1131 arranged in parallel, and both ends of the first groove 1131 are respectively connected with two second grooves 1132; the groove structure 113 also includes a plurality of first grooves 1131 arranged in parallel. There are three grooves 1133, and the third groove 1133 intersects the first groove 1131.
  • the heating part 1121 is provided in a plurality of first grooves 1131 and a plurality of third grooves 1133 arranged in an intersection.
  • the heating part 1121 includes a plurality of first strip-shaped heating parts 1121a disposed in the first groove 1131 and a plurality of second strip-shaped heating parts 1121b disposed in the third groove 1133.
  • the plurality of first strip-shaped heating portions 1121a and the plurality of second strip-shaped heating portions 1121b are intersected to form a network structure. Both ends of the plurality of first strip-shaped heating parts 1121a are connected to the connecting parts 1122, and the plurality of second strip-shaped heating parts 1121b connect the plurality of first strip-shaped heating parts 1121a, so that the heating parts 1121 are heated more uniformly.
  • the length direction of the first groove 1131 is perpendicular to the length direction of the third groove 1133 .
  • a plurality of micropores 1113 are distributed in an array, a plurality of first grooves 1131 are alternately arranged with multiple rows of micropores 1113, and a plurality of third grooves 1133 are alternately arranged with multiple columns of micropores 1113, so that the groove structure 113 and a plurality of micropores 1113 are disposed in an offset manner.
  • first groove 1131 is connected with the second groove 1132; the connecting portion 1122 is completely provided in the second groove 1132, and the cross-sectional shape of the second groove 1132 is rectangular, that is, the connection of the heating layer 112
  • the cross-sectional shape of the portion 1122 is rectangular (as shown in Figure 7).
  • both the first groove 1131 and the third groove 1133 are connected with the second groove 1132; the connecting portion 1122 is completely provided in the second groove 1132, and the second groove 1132 is shaped like an "L". That is, the connecting portion 1122 of the heating layer 112 is in an “L” shape (as shown in FIG. 8 , which is a schematic structural diagram of another embodiment of the second groove of the heating element provided in FIG. 7 ).
  • the second groove 1132 includes a first sub-groove 1132a and a second sub-groove 1132b that communicate with each other.
  • the length direction of the first sub-groove 1132a is parallel to the row direction of the plurality of micropores 1113.
  • the length direction of the second sub-groove 1132b is parallel to the row direction of the plurality of micropores 1113.
  • the row directions of the micropores 1113 are parallel.
  • the connecting part 1122 includes a first extension part 1122a and a second extension part 1122b that are connected to each other.
  • the first extension part 1122a is provided in the first sub-slot 1132a
  • the second extension part 1122b is provided in the second sub-slot 1132b.
  • the two ends of the first strip-shaped heating part 1121a are respectively connected to the two second extension parts 1122b, and the two ends of the second strip-shaped heating part 1121b are respectively connected to the two first extension parts 1122a, so that the heating part 1121 is heated more uniformly.
  • FIG. 9 is a schematic structural diagram of the fifth embodiment of the heating element of the atomization assembly provided in FIG. 2 .
  • the structure of the heating element 11 provided in Figure 9 is basically the same as that of the heating element 11 provided in Figure 3. The difference lies in the specific arrangement of the groove structure 113. The same parts will not be described again.
  • the groove structure 113 includes a first groove 1131 located in the heat generating area a and a second groove 1132 located in the electrode area b.
  • the groove structure 113 only includes one first groove 1131.
  • the first groove 1131 extends in a meandering manner. The two ends of the first groove 1131 are respectively connected with the second grooves 1132 on both sides of the heating area a.
  • the first groove 1131 includes a plurality of sub-grooves 1131a and a plurality of communication grooves 1131b.
  • the communication grooves 1131b connect two adjacent sub-grooves 1131a; the length direction of the sub-grooves 1131a and the row direction of the plurality of microholes 1113 Parallel, the length direction of the communication grooves 1131b is parallel to the column direction of the plurality of microholes 1113, and the plurality of sub-grooves 1131a and the plurality of rows of microholes 1113 are alternately arranged, and the plurality of communication grooves 1131b are located between two adjacent columns of microholes 1113 , to realize the staggered arrangement of the groove structure 113 and the plurality of microholes 1113.
  • the shape of the heating part 1121 of the heating layer 112 is the same as the shape of the first groove 1131.
  • the shape of the connecting part 1122 of the heating layer 112 is the same as the shape of the second groove 1132, which will not be described again.
  • the two ends of the heating part 1121 are respectively with The two connecting parts 1122 are connected.
  • FIG. 10 is a schematic structural diagram of the sixth embodiment of the heating element of the atomization assembly provided in FIG. 2 .
  • the structure of the heating element 11 provided in Figure 10 is basically the same as that of the heating element 11 provided in Figure 3. The difference lies in the specific arrangement of the groove structure 113. The same parts will not be described again.
  • the groove structure 113 includes a first groove 1131 located in the heat generating area a and a second groove 1132 located in the electrode area b.
  • the groove structure 113 includes a plurality of first grooves 1131.
  • Each first groove 1131 extends from one side of the heating area a to the other side of the heating area a.
  • the two ends of each first groove 1131 are respectively It is connected with the second grooves 1132 on both sides of the heating area a.
  • each first groove 1131 includes a plurality of sub-grooves 1131a and a plurality of communication grooves 1131b.
  • the communication grooves 1131b connect two adjacent sub-grooves 1131a;
  • the row directions are parallel, the length direction of the communication grooves 1131b is parallel to the column direction of the plurality of micropores 1113, and the plurality of sub-grooves 1131a are located between two adjacent rows of micropores 1113, and the plurality of communication grooves 1131b are located in two adjacent columns. between the micropores 1113 to realize the staggered arrangement of the groove structure 113 and the plurality of micropores 1113.
  • the heating part 1121 includes a plurality of parallel sub-heating parts 1121a. The two ends of the sub-heating parts 1121a are respectively connected to two connecting parts 1122 on opposite sides of the heating area a.
  • the shape of the sub-heating part 1121a is the same as the shape of the first groove 1131, which will not be described again.
  • FIG. 11 is a schematic flow chart of a first embodiment of a heating element preparation method provided by the present application.
  • the preparation method of the heating element 11 specifically includes:
  • Step S11 Provide a dense matrix with multiple micropores.
  • the dense matrix 111 includes a first surface 1111 and a second surface 1112 that are oppositely arranged, and the micropores 1113 penetrate the first surface 1111 and the second surface 1112 .
  • Step S12 Form a groove structure on the dense matrix with multiple micropores.
  • the groove structure 113 is formed on the dense substrate 111 except for the area where the plurality of micropores 1113 are located. That is, the groove structure 113 and the plurality of micropores 1113 are disposed in a misaligned manner, and there is no communication between the groove structure 113 and the micropores 1113 .
  • Step S13 Form a heating layer in the groove structure.
  • the groove structure 113 is filled with conductive paste and the conductive paste is sintered to form the heat-generating layer 112 through a printing process or printing process, where the thickness of the heat-generating layer 112 is greater than or equal to 50 ⁇ m.
  • the printing process can be screen printing, and the printing process can be inkjet printing.
  • the arrangements of the dense matrix 111, the groove structure 113 and the heating layer 112 can be referred to the structures shown in Figures 3 to 10, and will not be described again.
  • the heating layer 112 is arranged in the groove structure 113 of the dense matrix 111, which shortens the heat conduction path of the heating layer 112 and can heat and atomize the aerosol-generating matrix in the micropores 1113 more quickly. , which is beneficial to improving atomization efficiency.
  • Figure 12 is a schematic flow chart of a second embodiment of a heating element preparation method provided by this application.
  • step S14 is also included after step S13.
  • Step S14 Form a protective film on the surface of the heating layer away from the bottom surface of the groove structure.
  • the protective film 114 located on the surface of the heat-generating layer 112 is formed in the groove structure 113 through a printing process or printing process.
  • the printing process can be screen printing, and the printing process can be inkjet printing.
  • the arrangement of the dense matrix 111, the groove structure 113, the heating layer 112, and the protective film 114 can be seen in the structure shown in Figures 5-6. Without going into details, the arrangement of the dense matrix 111, the groove structure 113, and the heating layer 112 can also be the structures shown in Figures 3, 4, and 7-10.

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Abstract

一种发热体(11)及其制备方法、雾化组件(1)、电子雾化装置(100)，发热体(11)包括致密基体(111)和发热层(112)；致密基体(111)包括相对设置的第一表面(1111)和第二表面(1112)；致密基体(111)具有贯穿第一表面(1111)和第二表面(1112)的多个微孔(1113)，微孔(1113)用于将气溶胶生成基质从第二表面(1112)导引至第一表面(1111)；致密基体(111)的第一表面(1111)设有凹槽结构(113)；发热层(112)设于凹槽结构内(113)。通过将发热层(112)设于致密基体(111)的凹槽结构(113)内，缩短了发热层(112)的热量传导路径，能够更快的将微孔(1113)内的气溶胶生成基质加热雾化，利于提高雾化效率。

Description

发热体及其制备方法、雾化组件及电子雾化装置 技术领域
本申请涉及雾化技术领域，尤其涉及一种发热体及其制备方法、雾化组件及电子雾化装置。
背景技术
典型的电子雾化装置由发热体、电池和控制电路等部分组成，发热体作为电子雾化装置的核心元件，其特性决定了电子雾化装置的雾化效果和使用体验。
目前，发热体常用的有棉芯发热体和多孔陶瓷发热体。棉芯发热体的结构大多为弹簧状的金属发热丝缠绕棉绳或纤维绳；弹簧状的金属发热丝在棉芯发热体结构中需要起到结构支撑的作用，为了达到足够的强度，金属发热丝的直径通常为数百微米；待雾化的液态气溶胶生成基质被棉绳或纤维绳两端吸取，然后传输至中心金属发热丝处被加热雾化。多孔陶瓷发热体的一种结构为弹簧状的金属发热丝内嵌于圆筒状的多孔陶瓷体；多孔陶瓷体起到导液、储液的作用。多孔陶瓷发热体的另一种结构为在多孔陶瓷体上印刷金属厚膜浆料，再高温烧结后在多孔陶瓷体上形成金属导线；由于多孔陶瓷表面的孔径分布在1μm-100μm不等，导致多孔陶瓷表面的粗糙度较大，为了形成连续稳定的金属膜导线，金属膜导线的厚度通常超过100μm。
另外，对于棉芯发热体和多孔陶瓷发热体的上述结构，通电时，金属发热丝或金属厚膜导线被加热，热量传导至棉绳或多孔陶瓷体内的液体，使液体被加热雾化。由于金属发热丝或金属厚膜导线为致密实体，通电时，金属发热丝或金属厚膜导线需要被优先加热，只有金属发热丝或金属厚膜导线附近的液体被金属发热丝或金属厚膜导线直接加热，远处的液体需要被棉绳或多孔陶瓷体所传导的热量加热雾化，这种加热方式存在雾化效率低的缺点。
发明内容
有鉴于此，本申请提供一种发热体及其制备方法、雾化组件及电子雾化装置，以解决现有技术中发热体雾化效率低的技术问题。
为了解决上述技术问题，本申请提供的第一个技术方案为：提供一种发热体，应用于电 子雾化装置，用于加热雾化气溶胶生成基质，包括致密基体和发热层；所述致密基体，包括相对设置的第一表面和第二表面；所述致密基体具有贯穿所述第一表面和所述第二表面的多个微孔，所述微孔用于将所述气溶胶生成基质从所述第二表面导引至所述第一表面；所述致密基体的第一表面设有凹槽结构；所述发热层设于所述凹槽结构内。
在一实施方式中，所述凹槽结构与多个所述微孔错位设置。
在一实施方式中，所述发热层的厚度大于等于50μm。
在一实施方式中，所述发热层的厚度为50μm-150μm。
在一实施方式中，所述发热层的材料为镍铬合金、镍铬铁合金、铁铬铝合金中的一种。
在一实施方式中，所述发热体还包括保护膜，所述保护膜设于所述发热层远离所述凹槽结构的底面的表面。
在一实施方式中，所述保护膜部分设于所述凹槽结构内；或所述保护膜全部设于所述凹槽结构内。
在一实施方式中，所述保护膜的厚度为1μm-30μm。
在一实施方式中，所述保护膜的材料为二氧化硅或氮化钛。
在一实施方式中，通过印刷或打印工艺形成所述发热层和/或所述保护膜。
在一实施方式中，所述致密基体的第一表面包括发热区域和电极区域；所述凹槽结构包括位于所述发热区域的第一凹槽和位于所述电极区域的第二凹槽，所述第一凹槽与所述第二凹槽连通；所述发热层包括位于所述第一凹槽内的发热部和位于所述第二凹槽内的连接部，所述发热部与所述连接部连接。
在一实施方式中，所述凹槽结构包括多个平行设置的第一凹槽以及位于所述发热区域相对两侧的两个所述第二凹槽，所述第一凹槽的两端分别与两个所述第二凹槽连通；所述发热部包括多个平行设置的第一条状发热部，所述第一条状发热部的两端分别与所述发热区域相对两侧的两个所述连接部连接；
多个所述微孔呈阵列排布；多个所述第一凹槽与多行所述微孔交替设置。
在一实施方式中，所述凹槽结构还包括位于所述发热区域的多个第三凹槽，多个所述第三凹槽相互平行设置且与所述第一凹槽交叉设置；所述发热部还包括多个平行设置的第二条状发热部，所述第二条状发热部设于所述第三凹槽内，多个所述第一条状发热部和多个所述第二条状发热部交叉设置；
多个所述第二凹槽与多列所述微孔交替设置。
在一实施方式中，所述第二凹槽的形状呈“L”形；所述连接部的形状呈“L”形。
在一实施方式中，所述第一凹槽的形状呈蜿蜒延伸。
在一实施方式中，所述致密基体为石英、玻璃或致密陶瓷。
在一实施方式中，所述微孔的孔径为1μm-100μm，所述微孔的轴线与所述致密基体的厚度方向平行。
在一实施方式中，所述微孔为有序的直通孔。
为了解决上述技术问题，本申请提供的第二个技术方案为：提供一种雾化组件，包括储液腔和发热体；所述储液腔用于存储液态气溶胶生成基质；所述发热体为上述任意一项所述的发热体；所述发热体与所述储液腔流体连通。
为了解决上述技术问题，本申请提供的第三个技术方案为：提供一种电子雾化装置，包括雾化组件和电源组件，所述雾化组件为上述所述的雾化组件，所述电源组件与所述发热体电连接。
为了解决上述技术问题，本申请提供的第四个技术方案为：提供一种发热体的制备方法，包括：
提供致密基体；其中，所述致密基体包括相对设置的第一表面和第二表面，所述致密基体具有贯穿所述第一表面和所述第二表面的多个微孔；
在具有多个所述微孔的所述致密基体上形成凹槽结构；
在所述凹槽结构内形成发热层。
在一实施方式中，所述在具有多个所述微孔的所述致密基体上形成凹槽结构的步骤具体包括：
在所述致密基体上除了多个所述微孔所在的区域形成所述凹槽结构。
在一实施方式中，所述在所述凹槽结构内形成发热层的步骤具体包括：
通过印刷工艺或打印工艺在所述凹槽结构内填充导电浆料以及烧结所述导电浆料，其中，所述发热层的厚度大于等于50μm。
在一实施方式中，还包括：在所述发热层远离所述凹槽结构的底面的表面形成保护膜。
在一实施方式中，所述在所述发热层远离所述凹槽结构的底面的表面形成保护膜的步骤具体包括：
通过印刷工艺或打印工艺在所述凹槽结构内形成位于所述发热层表面的所述保护膜。
本申请的有益效果：区别于现有技术，本申请公开了一种发热体及其制备方法、雾化组件及电子雾化装置，发热体包括致密基体和发热层；致密基体包括相对设置的第一表面和第二表面；致密基体的第一表面设有凹槽结构；发热层设于凹槽结构内。通过将发热层设于致 密基体的凹槽结构内，缩短了发热层的热量传导路径，能够更快的将微孔内的气溶胶生成基质加热雾化，利于提高雾化效率。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图。
图1是本申请实施例提供的电子雾化装置的结构示意图；
图2是图1提供的电子雾化装置的雾化组件的结构示意图；
图3是图2提供的雾化组件的发热体的第二实施方式的结构示意图；
图4是图3提供的发热体沿B-B线的截面结构示意图；
图5是图2提供的雾化组件的发热体的第三实施方式的结构示意图；
图6是图5提供的发热体沿B-B线的截面结构示意图；
图7是图2提供的雾化组件的发热体的第四实施方式的结构示意图；
图8是图7提供的发热体的第二凹槽另一实施方式的结构示意图；
图9是图2提供的雾化组件的发热体的第五实施方式的结构示意图；
图10是图2提供的雾化组件的发热体的第六实施方式的结构示意图；
图11是本申请提供的发热体制备方法第一实施例的流程示意图；
图12是本申请提供的发热体制备方法第二实施例的流程示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
以下描述中，为了说明而不是为了限定，提出了诸如特定系统结构、接口、技术之类的具体细节，以便透彻理解本申请。
本申请中的术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”、“第三”的特征可以明示或者隐含地包括至少一个所述特征。本申请的描述中，“多个”的含义是至少两 个，例如两个，三个等，除非另有明确具体的限定。本申请实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果所述特定姿态发生改变时，则所述方向性指示也相应地随之改变。本申请实施例中的术语“包括”和“具有”以及它们任何变形，意图在于覆盖不排他的包含。例如包含了一系列步骤或单元的过程、方法、系统、产品或设备没有限定于已列出的步骤或单元，而是可选地还包括没有列出的步骤或单元，或可选地还包括对于这些过程、方法、产品或设备固有的其它步骤或组件。
在本文中提及“实施例”意味着，结合实施例描述的特定特征、结构或特性可以包含在本申请的至少一个实施例中。在说明书中的各个位置出现所述短语并不一定均是指相同的实施例，也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是，本文所描述的实施例可以与其它实施例相结合。
下面结合附图和实施例对本申请进行详细的说明。
请参阅图1，图1是本申请实施例提供的电子雾化装置的结构示意图。
在本实施例中，提供一种电子雾化装置100。该电子雾化装置100可用于气溶胶生成基质的雾化。电子雾化装置100包括相互电连接的雾化组件1和电源组件2。
其中，雾化组件1用于存储气溶胶生成基质并雾化气溶胶生成基质以形成可供用户吸食的气溶胶。该雾化组件1具体可用于不同的领域，比如，医疗、美容、休闲吸食等。在一具体实施例中，该雾化组件1可用于电子气溶胶化装置，用于雾化气溶胶生成基质并产生气溶胶，以供抽吸者抽吸，以下实施例均以此休闲吸食为例。
雾化组件1的具体结构与功能可参见以下实施例所涉及的雾化组件1的具体结构与功能，且可实现相同或相似的技术效果，在此不再赘述。
电源组件2包括电池(图未示)和控制器(图未示)。电池用于为雾化组件1的工作提供电能，以使得雾化组件1能够雾化气溶胶生成基质形成气溶胶；控制器用于控制雾化组件1工作。电源组件2还包括电池支架、气流传感器等其他元件。
雾化组件1与电源组件2可以是一体设置，也可以是可拆卸连接，可以根据具体需要进行设计。
需要说明的是，电子雾化装置的功率不超过10瓦，功率通常为6瓦-8.5瓦。电子雾化装置采用的电池的电压范围为2.5伏-4.4伏。对于封闭式电子雾化装置(无需用户自行注入待雾化基质的电子雾化装置)，采用的电池的电压范围为3伏-4.4伏。
请参阅图2，图2是图1提供的电子雾化装置的雾化组件的结构示意图。
雾化组件1包括壳体10、发热体11、雾化座12。雾化座12具有安装腔(图未标)，发热体11设于该安装腔内；发热体11同雾化座12一起设于壳体10内。壳体10形成有出雾通道13，壳体10的内表面、出雾通道13的外表面与雾化座12的顶面配合形成储液腔14，储液腔14用于存储液态气溶胶生成基质。其中，发热体11与电源组件2电连接，以雾化气溶胶生成基质生成气溶胶。
雾化座12包括上座121和下座122，上座121与下座122配合形成安装腔；发热体11的雾化面与安装腔的腔壁配合形成雾化腔120。上座121上设有下液通道1211；储液腔14内的气溶胶生成基质通道下液通道1211流入发热体11，即，发热体11与储液腔14流体连通。下座122上设有进气通道15，外界气体经进气通道15进入雾化腔120，携带发热体11雾化好的气溶胶流至出雾通道13，用户通过出雾通道13的端口吸食气溶胶。
现有的发热体通常采用多孔陶瓷作为基体，由于多孔陶瓷的热导率较低，普遍为0.4W/m·K至1.0W/m·K，导热效果价差，导致发热体11雾化时热效率偏低。鉴于此，本申请将现有的多孔基体改为致密基体111，对发热体11进行改进，以提高雾化效率。下面对发热体11的基体为致密基体111的实施方式进行详细介绍。
请参阅图3和图4，图3是图2提供的雾化组件的发热体的第二实施方式的结构示意图，图4是图3提供的发热体沿B-B线的截面结构示意图。
发热体11包括致密基体111和发热层112。致密基体111包括相对设置的第一表面1111和第二表面1112，致密基体111的第一表面1111设有凹槽结构113。发热层112设于凹槽结构113内。
在本实施方式中，致密基体111具有贯穿第一表面1111和第二表面1112的多个微孔1113，微孔1113为有序的直通孔；微孔1113用于将气溶胶生成基质从第二表面1112导引至第一表面1111，气溶胶生成基质被发热层112雾化生成气溶胶。具体地，储液腔14中的气溶胶生成基质经过下液通道1211到达发热体11的致密基体111，利用致密基体111上微孔1113的毛细作用力将气溶胶生成基质从致密基体111的第二表面1112导引至致密基体111的第一表面1111，使气溶胶生成基质被发热层112雾化；也就是说，微孔1113通过下液通道1211与储液腔14连通。
致密基体111的材料可以为石英、玻璃或致密陶瓷。致密基体111为玻璃时，可以普通玻璃、石英玻璃、硼硅玻璃或光敏铝硅酸锂玻璃中的一种；致密基体111为致密陶瓷时，致密陶瓷的材料包括氮化铝、氮化硅、碳化硅、氧化铝、氧化锆中的一种或多种。
通过将发热层112设于凹槽结构113内，即，使发热层112嵌设于致密基体111的内部， 缩短了发热层112发热产生的热量传导至致密基体111内部的微孔1113的路径长度，利于更快的雾化微孔1113内的气溶胶生成基质，进而利于提高雾化效率。可以理解，致密致密基体相对于多孔陶瓷具有更高的热导率；以致密陶瓷为例，常用的致密陶瓷和多孔陶瓷的热导率如表1所示。发热体11在工作时，发热层112产生的热量通过高热导率的致密陶瓷材料传导至微孔1113内的气溶胶生成基质，加热雾化气溶胶生成基质，利于提高雾化效率。再者，致密基体111的微孔1113较致密基体111为多孔陶瓷的迂曲的无序微孔具有更高的导液速度，进一步提高了雾化效率。
表1 陶瓷材料的热导率
材料 氮化铝 氮化硅 碳化硅 氧化铝 氧化锆 多孔陶瓷
热导率(W/m·K) 180 27 200 45 3 0.4-1
本申请通过在致密基体111上设置多个具有毛细作用力的微孔1113，使得发热体11的孔隙率的大小可精确控制，提升产品的一致性。也就是说，在批量生产中，发热体11中致密基体111的孔隙率基本一致，形成于致密基体111上的发热层112的厚度均匀，使得同一批出厂的电子雾化装置雾化效果一致。
相对现有的棉芯发热体和多孔陶瓷发热体，本申请提供的这种带微孔1113的薄片式结构的发热体11供液通道更短，供液速度更快，但漏液风险液更大。因此，本申请发明人研究了致密基体111厚度与微孔1113的孔径的比例对发热体11供液的影响，结果发现，增大致密基体111厚度、减小微孔1113的孔径可以降低漏液风险但也会减小供液速率，减小致密基体111的厚度、增大微孔1113的孔径可以增大供液速率但又会提高漏液风险，二者相互矛盾。为此，本申请设计了致密基体111的厚度、微孔1113的孔径，以及致密基体111厚度与微孔1113孔径的比例，使发热体11在功率为6瓦-8.5瓦、电压为2.5伏-4.4伏工作时，既能实现充足的供液，也能防止漏液。
另外，本申请发明人还研究了相邻微孔1113的孔中心距与微孔1113孔径的比值，发现如果相邻微孔1113的孔中心距与微孔1113孔径的比值过大，致密基体111的强度较大也容易加工，但是孔隙率太小，容易导致供液量不足；如果相邻微孔1113的孔中心距与微孔1113孔径的比值过小，孔隙率较大，供液量充足，但是致密基体111的强度较小而且不容易加工；为此，本申请还设计了相邻微孔1113的孔中心距与微孔1113孔径的比值，在满足供液能力的前提下，尽可能提升了致密基体111的强度。
下面以致密基体111的材料为玻璃进行介绍。
具体地，致密基体111的第一表面1111和第二表面1112平行设置；微孔1113的轴线 与第一表面1111和第二表面1112垂直，此时，致密基体111的厚度与微孔1113的长度相等。可以理解，第二表面1112与第一表面1111平行，微孔1113由第一表面1111贯穿至第二表面1112，使得致密基体111的生产工艺简单，降低成本。第一表面1111与第二表面1112之间的距离为致密基体111的厚度。
可选的，致密基体111的第一表面1111为平面；致密基体111的第二表面1112为非平面，例如，斜面、弧面、锯齿面等，第二表面1112可以根据具体需要进行设计，只需使微孔1113贯穿第一表面1111和第二表面1112即可。
可选的，微孔1113的横截面为圆形。微孔1113可以为孔径均匀的直通孔，也可以为孔径不均匀的直通孔，只要孔径的变化范围在50％之内即可；直通孔指的是微孔1113从第一表面1111贯穿至第二表面1112，微孔1113的轴线与致密基体111的厚度方向平行。例如，由于制备工艺所限，通过激光诱导和腐蚀在玻璃上开设的微孔1113通常为两端孔径大中间孔径小。因此，只要确保微孔1113的中间部分的孔径不小于两端端口的孔径的一半即可。
致密基体111的厚度为0.1毫米-1毫米。致密基体111的厚度大于1毫米时，无法满足供液需求，导致气溶胶量下降，且造成的热损失多，设置微孔1113的成本高；致密基体111的厚度小于0.1毫米时，无法保证致密基体111的强度，不利于提高电子雾化装置的性能。可选的，致密基体111的厚度为0.2毫米-0.5毫米。可以理解的是，致密基体111的厚度根据实际需要进行选择。
致密基体111上微孔1113的孔径为1μm-100μm。微孔1113的孔径小于1μm时，无法满足供液需求，导致气溶胶量下降；微孔1113的孔径大于100μm时，气溶胶生成基质容易从微孔1113内流出至第一表面1111造成漏液，导致雾化效率下降。可选的，微孔1113的孔径为20μm-50μm。可以理解的是，微孔1113的孔径根据实际需要进行选择。
致密基体111厚度与微孔1113孔径的比例为20:1-3:1；可选的，致密基体111厚度与微孔1113孔径的比例为15:1-5:1。当致密基体111的厚度与微孔1113的孔径的比例大于20:1时，通过微孔1113的毛细作用力供给的气溶胶生成基质难以满足发热体11的雾化需求量，不仅容易导致干烧，且单次雾化产生的气溶胶量下降；当致密基体111的厚度与微孔1113的孔径的比例小于3:1时，气溶胶生成基质容易从微孔1113内流出至第一表面1111，气溶胶生成基质浪费，导致雾化效率下降，进而使得总气溶胶量降低。
相邻两个微孔1113之间的孔中心距与微孔1113的孔径的比例为3:1-1.5:1，以使致密基体111上的微孔1113在满足供液能力的前提下，尽可能提升致密基体111的强度；可选的，相邻两个微孔1113之间的孔中心距与微孔1113的孔径的比例为3:1-2:1；可选的，相邻两个 微孔1113之间的孔中心距与微孔1113的孔径的比例为3:1-2.5:1。
在一个具体实施例中，致密基体111的厚度与微孔1113的孔径的比例为15:1-5:1，相邻两个微孔1113之间的孔中心距与微孔1113的孔径的比例为3:1-2.5:1。
致密基体111为规则的形状，如图4所示，致密基体111为矩形板状，设置于致密基体111上的多个微孔1113呈阵列排布；即，设置于致密基体111上的多个微孔1113之间呈规则排布，多个微孔1113中相邻的微孔1113之间的孔中心距相同。可以理解，致密基体111也可以为筒状、弧形状，具体根据需要进行设计。
在本实施例中，凹槽结构113与多个微孔1113错位设置，且凹槽结构113与微孔1113之间不连通。
继续参见图3和图4，致密基体111的第一表面1111包括发热区域a和电极区域b。凹槽结构113包括位于发热区域a的第一凹槽1131和位于电极区域b的第二凹槽1132，第一凹槽1131与第二凹槽1132连通。发热层112包括位于第一凹槽1131内的发热部1121和位于第二凹槽1132内的连接部1122。由于第一凹槽1131和第二凹槽1132连通，设于第一凹槽1131内的发热部1121与设于第二凹槽1132内的连接部1122电连接。其中，连接部1122用作电极，连接部1122用于与电源组件2电连接。在第一凹槽1131的两侧分别设有一个第二凹槽1132，即，在发热部1121的两侧分别设有一个连接部1122。
凹槽结构113与多个微孔1113错位设置，以保证致密基体111具有较高的供液能力。在本实施方式中，多个微孔1113呈阵列排布。凹槽结构113包括多个平行设置的第一凹槽1131，多个第一凹槽1131均与第二凹槽1132连通；具体地，第一凹槽1131的两端分别与发热区域a两侧的第二凹槽1132连通。多个微孔1113呈阵列排布；多个第一凹槽1131与多行微孔1113交替设置。发热部1121包括多个平行设置的第一条状发热部1121a，第一条状发热部1121a的两端分别与发热区域a相对两侧的两个连接部1122连接。
可选的，第一凹槽1131的宽度与微孔1113的孔径相同，利于降低形成第一凹槽1131的加工难度。
可选的，仅在致密基体111的发热区域a设有微孔1113，在电极区域b并未设微孔1113。
可选的，形成于凹槽结构113内的发热层112的电阻为0.5欧姆-2欧姆。可以理解，在电子雾化装置的功率为6瓦-8.5瓦，电池的电压范围为2.5伏-4.4伏时，为了达到电池的工作电阻，发热体11的发热层112在常温下的电阻范围为0.5欧姆-2欧姆。
可选的，发热层112的厚度大于等于50μm。可以理解，发热层112的厚度可以根据致密基体111的厚度做适应性调整，相应地适应性调整凹槽结构113的深度。在一实施方式中， 发热层112的厚度为50μm-150μm。
可选的，发热层112的材料为镍铬合金、镍铬铁合金、铁铬铝合金。
可选的，发热层112采用印刷或打印工艺沉积于凹槽结构113内，并通过烧结工艺成型。因此，发热部1121和连接部1122为一体成型结构。其中，印刷工艺可以为丝网印刷，打印工艺可以为喷墨打印。
可选的，发热层112的厚度可以与凹槽结构113的深度相同，也可以小于凹槽结构113的深度，也可以大于凹槽结构113的深度。可以理解，现有技术中的多孔陶瓷发热体，发热层设于多孔陶瓷的表面，当发热层的厚度大于50μm时，不易在发热层远离多孔陶瓷的表面再沉积保护膜；而本申请通过将至少部分发热层112沉积于凹槽结构113内，可以减小发热层112暴露于致密基体111的第一表面1111的厚度，易于在发热层112的表面再沉积后续介绍的保护膜114(图5提供的发热体11对保护膜114进行详细介绍)。
可选的，发热层112的连接部1122完全设于第二凹槽1132内；或，发热层112的连接部1122部分设于第二凹槽1132内，部分设于致密基体111的第一表面1111上以便通过顶针或导线连接外部电路，具体根据需要进行设计。
由于发热层112主要是通过金属颗粒和玻璃相高温烧结而成，烧结致密性较差，易于高温氧化。鉴于此，本申请对其进一步改进，发热体11还包括保护膜114，请参阅图5，图5是图2提供的雾化组件的发热体的第三实施方式的结构示意图，图6是图5提供的发热体沿B-B线的截面结构示意图。
图5提供的发热体11与图3提供的发热体11的结构基本相同，不同之处在于：发热体11还包括保护膜114，相同部分不再赘述。
发热体11还包括保护膜114，保护膜114设于发热层112远离凹槽结构113的底面的表面。保护膜114将发热层112与气溶胶生成基质、空气隔离，防止发热层112被气溶胶生成基质腐蚀，且防止发热层112高温氧化，利于提高发热体11的使用寿命，提升电子雾化装置的性能。同时，保护膜114还可以防止发热层112中的金属析出混合在气溶胶中。
可选的，保护膜114的厚度为1μm-30μm。
可选的，保护膜114的材料为二氧化硅或氮化钛。
可选的，保护膜114设于凹槽结构113外。具体地，采用掩膜板，通过印刷或打印工艺将保护膜114沉积于发热层112表面；此时，凹槽结构113的深度与发热层112的厚度相同。其中，印刷工艺可以为丝网印刷，打印工艺可以为喷墨打印。
可选的，保护膜114设于凹槽结构113内。具体地，保护膜114采用印刷或打印工艺沉 积于凹槽结构113内。其中，印刷工艺可以为丝网印刷，打印工艺可以为喷墨打印。保护膜114部分设于凹槽结构113内，或保护膜114全部设于凹槽结构113内。
可以理解，将保护膜114设于凹槽结构113内，利于发热体11整体的平整性；此时，凹槽结构113的深度大于等于发热层112的厚度和保护膜114的厚度之和。相对于现有技术中的，发热层设于致密基体表面，发热层厚度大于50μm时，难以在发热层远离致密基体的表面再印刷保护膜；本申请通过将厚度大于等于50μm的发热层112的至少部分沉积在凹槽结构113内，高温烧结后形成发热层112的浆料会发生收缩，使得暴露于致密基体111的第一表面1111的发热层112厚度减小，易于再次沉积保护膜114。
可选的，保护膜114仅设置于发热层112的发热部1121，且将整个发热部1121全部覆盖。
例如，凹槽结构113的深度大于发热层112的厚度，保护膜114设置于发热部1121远离第一凹槽1131的底面的表面并将第一凹槽1131填满，连接部1122远离第二凹槽1132的底面的表面进一步设置金属层115(如图5和图6所示)，金属层115将第二凹槽1132填满，便于连接顶针，且用于减小连接部1122与顶针的欧姆接触电阻。其中，连接部1122通过顶针实现与电源组件2的电连接。此时，保护膜114的材料可以为二氧化硅。
可选的，保护膜114设置于整个发热层112的表面，即，发热部1121和连接部1122的表面均设有保护膜114，保护膜114具有开口使得部分连接部1122暴露，不影响连接部1122与电源组件2的电连接性。进一步，也可以将连接部1122表面的保护膜114采用导电材料，例如二硼化钛。
请参阅图7，图7是图2提供的雾化组件的发热体的第四实施方式的结构示意图。
图7提供的发热体11与图3提供的发热体11的结构基本相同，不同之处在于：凹槽结构113的具体设置方式，相同部分不再赘述。
在本实施方式中，凹槽结构113包括位于发热区域a的第一凹槽1131、位于发热区域a的第三凹槽1133和位于电极区域b的第二凹槽1132。其中，第二凹槽1132的数量为两个，分别位于发热区域a相对的两侧。
具体地，凹槽结构113包括多个平行设置的第一凹槽1131，第一凹槽1131的两端分别与两个第二凹槽1132连通；凹槽结构113还包括多个平行设置的第三凹槽1133，第三凹槽1133与第一凹槽1131交叉设置。发热部1121设置于交叉设置的多个第一凹槽1131和多个第三凹槽1133内。发热部1121包括多个设置于第一凹槽1131内的第一条状发热部1121a和多个设置于第三凹槽1133内的第二条状发热部1121b。多个第一条状发热部1121a和多 个第二条状发热部1121b交叉设置，呈网状结构。多个第一条状发热部1121a的两端均与连接部1122连接，多个第二条状发热部1121b将多个第一条状发热部1121a连接，使得发热部1121加热更加均匀。
可选的，第一凹槽1131的长度方向与第三凹槽1133的长度方向垂直。
可选的，多个微孔1113呈阵列分布，多个第一凹槽1131与多行微孔1113交替设置，多个第三凹槽1133与多列微孔1113交替设置，以使凹槽结构113与多个微孔1113错位设置。
可选的，仅第一凹槽1131与第二凹槽1132连通；连接部1122完全设于第二凹槽1132内，第二凹槽1132的横截面形状为矩形，即，发热层112的连接部1122的横截面形状为矩形(如图7所示)。
可选的，第一凹槽1131和第三凹槽1133均与第二凹槽1132连通；连接部1122完全设于第二凹槽1132内，第二凹槽1132的形状呈“L”形，即，发热层112的连接部1122的形状呈“L”形(如图8所示，图8是图7提供的发热体的第二凹槽另一实施方式的结构示意图)。第二凹槽1132包括相互连通的第一子槽1132a和第二子槽1132b，第一子槽1132a的长度方向与多个微孔1113的行方向平行，第二子槽1132b的长度方向与多个微孔1113的列方向平行。连接部1122包括相互连接的第一延伸部1122a和第二延伸部1122b，第一延伸部1122a设于第一子槽1132a内，第二延伸部1122b设于第二子槽1132b内。第一条状发热部1121a的两端分别与两个第二延伸部1122b连接，第二条状发热部1121b的两端分别与两个第一延伸部1122a连接，使得发热部1121加热更加均匀。
请参阅图9，图9是图2提供的雾化组件的发热体的第五实施方式的结构示意图。
图9提供的发热体11与图3提供的发热体11的结构基本相同，不同之处在于：凹槽结构113的具体设置方式，相同部分不再赘述。
在本实施方式中，凹槽结构113包括位于发热区域a的第一凹槽1131和位于电极区域b的第二凹槽1132。凹槽结构113仅包括一个第一凹槽1131，第一凹槽1131呈蜿蜒延伸，第一凹槽1131的两端分别与发热区域a两侧的第二凹槽1132连通。具体地，第一凹槽1131包括多个子凹槽1131a和多个连通槽1131b，连通槽1131b连接相邻的两个子凹槽1131a；子凹槽1131a的长度方向与多个微孔1113的行方向平行，连通槽1131b的长度方向与多个微孔1113的列方向平行，且多个子凹槽1131a与多行微孔1113交替设置，多个连通槽1131b位于相邻的两列微孔1113之间，以实现凹槽结构113与多个微孔1113错位设置。发热层112的发热部1121的形状与第一凹槽1131的形状相同，发热层112的连接部1122的形状 与第二凹槽1132的形状相同，不再赘述；发热部1121的两端分别与两个连接部1122连接。
请参阅图10，图10是图2提供的雾化组件的发热体的第六实施方式的结构示意图。
图10提供的发热体11与图3提供的发热体11的结构基本相同，不同之处在于：凹槽结构113的具体设置方式，相同部分不再赘述。
在本实施方式中，凹槽结构113包括位于发热区域a的第一凹槽1131和位于电极区域b的第二凹槽1132。凹槽结构113包括多个第一凹槽1131，每个第一凹槽1131均从发热区域a的一边呈蜿蜒延伸至发热区域a的另一边，每个第一凹槽1131的两端分别与发热区域a两侧的第二凹槽1132连通。具体地，每个第一凹槽1131包括多个子凹槽1131a和多个连通槽1131b，连通槽1131b连接相邻的两个子凹槽1131a；子凹槽1131a的长度方向与多个微孔1113的行方向平行，连通槽1131b的长度方向与多个微孔1113的列方向平行，且多个子凹槽1131a位于相邻的两行微孔1113之间，多个连通槽1131b位于相邻的两列微孔1113之间，以实现凹槽结构113与多个微孔1113错位设置。发热部1121包括多个平行设置的子发热部1121a，子发热部1121a的两端分别与发热区域a相对两侧的两个连接部1122连接。子发热部1121a的形状与第一凹槽1131的形状相同，不再赘述。
可以理解，图5提供的保护膜114也可以应用于图7-图10提供的发热体11。
请参阅图11，图11是本申请提供的发热体制备方法第一实施例的流程示意图。
发热体11的制备方法，具体包括：
步骤S11：提供致密基体，致密基体具有多个微孔。
具体地，致密基体111包括相对设置的第一表面1111和第二表面1112，微孔1113贯穿第一表面1111和第二表面1112。
步骤S12：在具有多个微孔的致密基体上形成凹槽结构。
具体地，在致密基体111上除了多个微孔1113所在的区域形成凹槽结构113，即，凹槽结构113与多个微孔1113错位设置，凹槽结构113与微孔1113之间不连通。
步骤S13：在凹槽结构内形成发热层。
具体地，通过印刷工艺或打印工艺在凹槽结构113内填充导电浆料以及烧结导电浆料形成发热层112，其中，发热层112的厚度大于等于50μm。印刷工艺可以为丝网印刷，打印工艺可以为喷墨打印。
需要说明的是，本申请实施例提供的发热体11的制备方法中，致密基体111、凹槽结构113和发热层112的设置可参见图3-图10中所示的结构，不再赘述。
在制备发热体11中，将发热层112设于致密基体111的凹槽结构113内，缩短了发热 层112的热量传导路径，能够更快的将微孔1113内的气溶胶生成基质加热雾化，利于提高雾化效率。
请参阅图12，图12是本申请提供的发热体制备方法第二实施例的流程示意图。
图12提供的发热体11的制备方法与图11提供的发热体11的制备方法不同之处在于：在步骤S13之后还包括步骤S14。
步骤S14：在发热层远离凹槽结构的底面的表面形成保护膜。
具体地，通过印刷工艺或打印工艺在凹槽结构113内形成位于发热层112表面的保护膜114。印刷工艺可以为丝网印刷，打印工艺可以为喷墨打印。
需要说明的是，本申请实施例提供的发热体11的制备方法中，致密基体111、凹槽结构113、发热层112、保护膜114的设置可参见图5-图6中所示的结构，不再赘述，其中，致密基体111、凹槽结构113、发热层112的设置还可以为图3、图4、图7-图10所示的结构。
以上仅为本申请的实施方式，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (25)

  1. 一种发热体，应用于电子雾化装置，用于加热雾化气溶胶生成基质，其中，包括：
    致密基体，包括相对设置的第一表面和第二表面；所述致密基体具有贯穿所述第一表面和所述第二表面的多个微孔，所述微孔用于将所述气溶胶生成基质从所述第二表面导引至所述第一表面；所述致密基体的第一表面设有凹槽结构；
    发热层，设于所述凹槽结构内。
  2. 根据权利要求1所述的发热体，其中，所述凹槽结构与多个所述微孔错位设置。
  3. 根据权利要求1所述的发热体，其中，所述发热层的厚度大于等于50μm。
  4. 根据权利要求3所述的发热体，其中，所述发热层的厚度为50μm-150μm。
  5. 根据权利要求1所述的发热体，其中，所述发热层的材料为镍铬合金、镍铬铁合金、铁铬铝合金中的一种。
  6. 根据权利要求1所述的发热体，其中，所述发热体还包括保护膜，所述保护膜设于所述发热层远离所述凹槽结构的底面的表面。
  7. 根据权利要求6所述的发热体，其中，所述保护膜部分设于所述凹槽结构内；或所述保护膜全部设于所述凹槽结构内。
  8. 根据权利要求6所述的发热体，其中，所述保护膜的厚度为1μm-30μm。
  9. 根据权利要求6所述的发热体，其中，所述保护膜的材料为二氧化硅或氮化钛。
  10. 根据权利要求6所述的发热体，其中，通过印刷或打印工艺形成所述发热层和/或所述保护膜。
  11. 根据权利要求2所述的发热体，其中，所述致密基体的第一表面包括发热区域和电极区域；所述凹槽结构包括位于所述发热区域的第一凹槽和位于所述电极区域的第二凹槽，所述第一凹槽与所述第二凹槽连通；所述发热层包括位于所述第一凹槽内的发热部和位于所述第二凹槽内的连接部，所述发热部与所述连接部连接。
  12. 根据权利要求11所述的发热体，其中，所述凹槽结构包括多个平行设置的第一凹槽以及位于所述发热区域相对两侧的两个所述第二凹槽，所述第一凹槽的两端分别与两个所述第二凹槽连通；所述发热部包括多个平行设置的第一条状发热部，所述第一条状发热部的两端分别与所述发热区域相对两侧的两个所述连接部连接；
    多个所述微孔呈阵列排布；多个所述第一凹槽与多行所述微孔交替设置。
  13. 根据权利要求12所述的发热体，其中，所述凹槽结构还包括位于所述发热区域的多个第三凹槽，多个所述第三凹槽相互平行设置且与所述第一凹槽交叉设置；所述发热部还包括多个平行设置的第二条状发热部，所述第二条状发热部设于所述第三凹槽内，多个所述第一条状发热部和多个所述第二条状发热部交叉设置；
    多个所述第二凹槽与多列所述微孔交替设置。
  14. 根据权利要求13所述的发热体，其中，所述第二凹槽的形状呈“L”形；所述连接部的形状呈“L”形。
  15. 根据权利要求11所述的发热体，其中，所述第一凹槽的形状呈蜿蜒延伸。
  16. 根据权利要求1所述的发热体，其中，所述致密基体为石英、玻璃或致密陶瓷。
  17. 根据权利要求1所述的发热体，其中，所述微孔的孔径为1μm-100μm，所述微孔的轴线与所述致密基体的厚度方向平行。
  18. 根据权利要求1所述的发热体，其中，所述微孔为有序的直通孔。
  19. 一种雾化组件，其中，包括：
    储液腔，用于存储液态气溶胶生成基质；
    发热体，所述发热体为权利要求1-18任意一项所述的发热体；所述发热体与所述储液腔流体连通。
  20. 一种电子雾化装置，其中，包括雾化组件和电源组件，所述雾化组件为权利要求19所述的雾化组件，所述电源组件与所述发热体电连接。
  21. 一种发热体的制备方法，其中，包括：
    提供致密基体，所述致密基体具有多个微孔；其中，所述致密基体包括相对设置的第一表面和第二表面，所述微孔贯穿所述第一表面和所述第二表面；
    在具有多个所述微孔的所述致密基体上形成凹槽结构；
    在所述凹槽结构内形成发热层。
  22. 根据权利要求21所述的发热体的制备方法，其中，所述在具有多个所述微孔的所述致密基体上形成凹槽结构的步骤具体包括：
    在所述致密基体上除了多个所述微孔所在的区域形成所述凹槽结构。
  23. 根据权利要求21所述的发热体的制备方法，其中，所述在所述凹槽结构内形成发热层的步骤具体包括：
    通过印刷工艺或打印工艺在所述凹槽结构内填充导电浆料以及烧结所述导电浆料，其中， 所述发热层的厚度大于等于50μm。
  24. 根据权利要求22所述的发热体的制备方法，其中，还包括：在所述发热层远离所述凹槽结构的底面的表面形成保护膜。
  25. 根据权利要求24所述的发热体的制备方法，其中，所述在所述发热层远离所述凹槽结构的底面的表面形成保护膜的步骤具体包括：
    通过印刷工艺或打印工艺在所述凹槽结构内形成位于所述发热层表面的所述保护膜。
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108185536A (zh) * 2018-02-13 2018-06-22 深圳麦克韦尔股份有限公司 电子烟及其雾化器
CN213639660U (zh) * 2018-02-13 2021-07-09 深圳麦克韦尔科技有限公司 电子烟及其雾化器
CN113115987A (zh) * 2021-04-21 2021-07-16 东莞市阿尔法电子科技有限公司 雾化芯及烟弹
WO2022033376A1 (zh) * 2020-08-10 2022-02-17 深圳麦克韦尔科技有限公司 雾化芯、电子雾化组件及电子雾化装置
CN114365870A (zh) * 2020-10-15 2022-04-19 深圳麦克韦尔科技有限公司 雾化组件及电子雾化装置
WO2022077359A1 (zh) * 2020-10-15 2022-04-21 深圳麦克韦尔科技有限公司 雾化组件及电子雾化装置
US20220117305A1 (en) * 2020-10-20 2022-04-21 Shenzhen Smoore Technology Limited Atomizing core, atomizer and electronic atomization device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108185536A (zh) * 2018-02-13 2018-06-22 深圳麦克韦尔股份有限公司 电子烟及其雾化器
CN213639660U (zh) * 2018-02-13 2021-07-09 深圳麦克韦尔科技有限公司 电子烟及其雾化器
WO2022033376A1 (zh) * 2020-08-10 2022-02-17 深圳麦克韦尔科技有限公司 雾化芯、电子雾化组件及电子雾化装置
CN114365870A (zh) * 2020-10-15 2022-04-19 深圳麦克韦尔科技有限公司 雾化组件及电子雾化装置
WO2022077359A1 (zh) * 2020-10-15 2022-04-21 深圳麦克韦尔科技有限公司 雾化组件及电子雾化装置
US20220117305A1 (en) * 2020-10-20 2022-04-21 Shenzhen Smoore Technology Limited Atomizing core, atomizer and electronic atomization device
CN113115987A (zh) * 2021-04-21 2021-07-16 东莞市阿尔法电子科技有限公司 雾化芯及烟弹

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