WO2023193505A1 - 互联组件和通信模块 - Google Patents

互联组件和通信模块 Download PDF

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Publication number
WO2023193505A1
WO2023193505A1 PCT/CN2023/071923 CN2023071923W WO2023193505A1 WO 2023193505 A1 WO2023193505 A1 WO 2023193505A1 CN 2023071923 W CN2023071923 W CN 2023071923W WO 2023193505 A1 WO2023193505 A1 WO 2023193505A1
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WO
WIPO (PCT)
Prior art keywords
layer
conductive
support plate
ground
component
Prior art date
Application number
PCT/CN2023/071923
Other languages
English (en)
French (fr)
Inventor
鲁向前
张�杰
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2023193505A1 publication Critical patent/WO2023193505A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L49/00—Packet switching elements
    • H04L49/40—Constructional details, e.g. power supply, mechanical construction or backplane

Definitions

  • This application relates to the field of communication technology, and in particular to an interconnection component and a communication module.
  • an optical communication module integrates an optical chip and an electrical chip.
  • the optical chip and the electrical chip can be electrically connected through metal conductive parts on the carrier board, thereby enabling the electrical chip to drive the optical chip.
  • the size of the above-mentioned metal conductive parts is large, which is not conducive to miniaturization of the optical communication module.
  • Embodiments of the present application provide an interconnection component and a communication module.
  • the size of the conductive parts on the interconnection component is smaller, which is beneficial to miniaturization of the interconnection component and the communication module.
  • a first aspect of the embodiment of the present application provides an interconnection assembly, including a support plate.
  • the support plate has a plurality of first openings arranged at intervals.
  • the plurality of first openings penetrate the support plate along the thickness direction;
  • the opposite ends of the conductive member along the thickness direction of the support plate are located outside the first opening.
  • the orthographic projection of the conductive member located outside the first opening on the support plate does not exceed the hole edge of the corresponding first opening. .
  • the interconnection component may include a support plate, and the support plate may be used to carry the components to be connected (for example, the components to be connected may be optical chips and/or electrical chips).
  • the support plate has a plurality of first openings arranged at intervals, and the plurality of first openings penetrate the support plate along the thickness direction.
  • a conductive member is provided in the first opening, and the conductive member is disposed in the first opening, and the conductive member The opposite ends along the thickness direction of the support plate are located outside the first opening, thereby facilitating the electrical connection between the conductive component and the external component to be connected.
  • the orthographic projection of the conductive component located outside the first opening on the support plate does not exceed the hole edge of the corresponding first opening, so that the conductive component occupies a smaller area of the support plate, so that the area that can be placed on the carrier board
  • the communication module is highly integrated.
  • arranging more conductive parts on the carrier board will not lead to a larger volume of the carrier board, which is conducive to the miniaturization of the communication module, thereby meeting the development trend of small size and high integration of communication modules.
  • it also includes a ground layer, and the ground layer is connected to the support plate; the plurality of first openings include signal holes and ground holes, and conductive elements located in the ground holes are electrically connected to the ground layer, and the conductive elements located in the signal holes are electrically connected to the ground layer. The conductive parts in the holes are electrically isolated from the ground layer.
  • the ground layer includes a first ground layer
  • the support plate includes two plate surfaces opposite and spaced apart along the thickness direction, and at least one plate surface is covered with the first ground layer.
  • the ground layer includes a second ground layer
  • the support board includes a stacked first support layer. and a second support layer, the second ground layer is located between the first support layer and the second support layer; the second ground layer has a plurality of second openings arranged at intervals, the second openings are arranged corresponding to the first openings, and Communicated with each other, the conductive member is inserted into the corresponding first opening and the second opening.
  • the first support layer and the second support layer protect the second ground layer.
  • a conductive layer is further included, the conductive layer is located on the surface of the support plate, and at least part of the conductive layer is electrically connected to the ground layer.
  • the conductive layer can increase the shielding area of the ground layer and improve the shielding effect.
  • the conductive layer is located on the side wall surface of the support plate, and the conductive layer located on the side wall surface is electrically connected to the ground layer.
  • the conductive layer located on the side wall can increase the shielding area of the ground layer and improve the shielding effect.
  • the conductive layer is located on the wall surface of the ground hole and the signal hole, the conductive layer located on the wall surface of the ground hole is electrically connected to the ground layer, and the conductive layer located on the wall surface of the signal hole is electrically connected to the ground layer.
  • the ground plane is electrically isolated.
  • the conductive layer located on the hole wall of the ground hole can increase the shielding area of the ground layer and improve the shielding effect.
  • the conductive member includes conductive glue.
  • the conductive adhesive has strong plasticity and can form conductive parts of various shapes, and can make the conductive parts smaller in size so that the conductive parts occupy a smaller area of the support plate, thereby meeting the requirements of small size and high integration of communication modules. development trend.
  • a second aspect of the embodiment of the present application provides a communication module, including a first to-be-connected component, a second to-be-connected component and the interconnection component in the above-mentioned first aspect.
  • the first to-be-connected component and the second to-be-connected component are respectively located on the interconnection module. Opposite sides of the component along the thickness direction are electrically connected through conductive components of the interconnection component.
  • the communication module provided in this embodiment includes an interconnection component.
  • the interconnection component may include a support plate.
  • the support plate may be used to carry components to be connected (for example, the components to be connected may be optical chips and/or electrical chips).
  • the support plate has a plurality of first openings arranged at intervals, and the plurality of first openings penetrate the support plate along the thickness direction.
  • a conductive member is provided in the first opening, and the conductive member is disposed in the first opening, and the conductive member The opposite ends along the thickness direction of the support plate are located outside the first opening, thereby facilitating the electrical connection between the conductive component and the external component to be connected.
  • the orthographic projection of the conductive component located outside the first opening on the support plate does not exceed the hole edge of the corresponding first opening, so that the conductive component occupies a smaller area of the support plate, so that the area that can be placed on the carrier board
  • the communication module is highly integrated.
  • arranging more conductive parts on the carrier board will not lead to a larger volume of the carrier board, which is conducive to the miniaturization of the communication module, thereby meeting the development trend of small size and high integration of communication modules.
  • it also includes a connecting piece, a first pressing piece and a second pressing piece arranged oppositely, and the first to-be-connected piece, the interconnection component and the second to-be-connected piece are pressed against the first pressing piece. between the first pressing piece and the second pressing piece; the connecting piece is inserted into the first pressing piece, the first to-be-connected piece, the interconnection component, the second to-be-connected piece and the second pressing piece, and one end of the connecting piece is connected to the first The pressing piece is connected, and the other end of the connecting piece is connected to the second pressing piece.
  • the first pressing part and the second pressing part can make a stable connection between the first part to be connected and the second part to be connected.
  • Figure 1 is a schematic structural diagram of a communication module provided by an embodiment of the present application.
  • Figure 2 is a schematic structural diagram of an interconnection component, a first component to be connected and a second component to be connected provided by an embodiment of the present application;
  • Figure 3 is a schematic structural diagram of a support plate provided by an embodiment of the present application.
  • Figure 4 is another structural schematic diagram of the support plate provided by the embodiment of the present application.
  • Figure 5 is a schematic structural diagram of the first ground layer provided by the embodiment of the present application.
  • Figure 6 is a top view of the first ground layer provided by the embodiment of the present application.
  • Figure 7 is a schematic structural diagram of the first ground layer and conductive layer provided by the embodiment of the present application.
  • Figure 8 is a schematic structural diagram of the first hollow part in the actual product provided by the embodiment of the present application.
  • Figure 9 is a schematic structural diagram of the second ground layer provided by the embodiment of the present application.
  • Figure 10 is a schematic structural diagram of the conductive layer on the side wall provided by the embodiment of the present application.
  • Figure 11 is a schematic structural diagram of the conductive layer in the first opening provided by the embodiment of the present application.
  • Figure 12 is a schematic structural diagram of preparing a conductive member according to an embodiment of the present application.
  • Figure 13 is a top view of a conductive member prepared according to an embodiment of the present application.
  • 100-communication module 200-interconnection component
  • an optical chip and an electrical chip are integrated into an optical communication module.
  • the optical chip and the electrical chip can be electrically connected through a carrier board, thereby enabling the electrical chip to drive the optical chip.
  • the carrier plate is provided with a through hole, and a metal conductive part is provided in the through hole, and the metal conductive part is formed by stamping a metal material.
  • the metal conductive parts formed by stamping are large in size, and the orthographic projection of the metal conductive parts on the carrier board exceeds the through holes more, resulting in the metal conductive parts occupying a larger area of the carrier board, making There are fewer metal conductive parts that can be placed on the carrier board, resulting in a lower integration level of the optical communication module.
  • the carrier board will be larger in size, which is not conducive to the miniaturization of the optical communication module and cannot meet the development trend of small size and high integration of optical communication modules.
  • the interconnection component may include a support plate, and the support plate may be used to carry components to be connected (for example, the components to be connected may be optical chips and/or electrical chips).
  • the support plate has a plurality of first openings arranged at intervals, and the plurality of first openings penetrate the support plate along the thickness direction.
  • a conductive member is provided in the first opening, and the conductive member is disposed in the first opening, and the conductive member The opposite ends along the thickness direction of the support plate are located outside the first opening, from This facilitates the electrical connection between the conductive component and the external component to be connected.
  • the orthographic projection of the conductive component located outside the first opening on the support plate does not exceed the hole edge of the corresponding first opening, so that the conductive component occupies a smaller area of the support plate, so that the area that can be placed on the carrier board
  • the communication module is highly integrated.
  • arranging more conductive parts on the carrier board will not lead to a larger volume of the carrier board, which is conducive to the miniaturization of the communication module, thereby meeting the development trend of small size and high integration of communication modules.
  • the communication module 100 provided by the embodiment of the present application will be described below with reference to Figures 1-13.
  • the communication module 100 provided by the embodiment of the present application, as shown in Figure 1 and Figure 2, the communication module 100 can include a first to-be-connected component 310, a second to-be-connected component 320 and an interconnection component 200.
  • the interconnection component 200 is located in the first to-be-connected component. between the member 310 and the second member 320 to be connected, the first member 310 and the second member 320 to be connected are respectively located on opposite sides of the interconnection assembly 200 along the thickness direction, the first member 310 and the second member 320 to be connected 320 is electrically connected through the interconnection component 200 .
  • the first component 310 to be connected may include any one or more of a chip (such as an optical chip or an electrical chip) or a circuit motherboard
  • the second component 320 may include a chip (such as an optical chip or an electrical chip) or a circuit motherboard. Any one or more of them; of course, the first to-be-connected component 310 and the second to-be-connected component 320 may also include other electronic components, which are not limited by the embodiments of this application.
  • the first to-be-connected component 310 is located on one side of the interconnection component 200 along the thickness direction, and the number of the first to-be-connected component 310 located on this side may be at least one. When there are multiple first components 310 to be connected, each first component 310 to be connected may be the same or different.
  • the second to-be-connected member 320 is located on the other side of the interconnection component 200 along the thickness direction, and the number of the second to-be-connected member 320 located on this side may be at least one. When the number of the second components to be connected 320 is multiple, each of the second components to be connected 320 may be the same or different.
  • the first component 310 to be connected may be an optical chip.
  • the optical chip is located on one side of the interconnection component 200.
  • the optical chip is electrically connected to the interconnection component 200.
  • the second component 320 to be connected may be a circuit mainboard.
  • the circuit mainboard is located on On the other side of the interconnection component 200, the circuit mainboard is electrically connected to the interconnection component 200, thereby enabling interconnection between the optical chip and the circuit mainboard.
  • the first component 310 to be connected may be an optical chip.
  • the optical chip is located on one side of the interconnection component 200.
  • the optical chip is electrically connected to the interconnection component 200.
  • the second component 320 to be connected may be an electrical chip.
  • the electrical chip is located on one side of the interconnection component 200.
  • the electrical chip is electrically connected to the interconnection component 200, thereby enabling interconnection between the optical chip and the electrical chip.
  • the first component 310 to be connected may be a first circuit mainboard.
  • the first circuit mainboard is located on one side of the interconnection component 200.
  • the first circuit mainboard is electrically connected to the interconnection component 200.
  • the second component 320 to be connected may be The second circuit main board is located on the other side of the interconnection component 200.
  • the second circuit main board is electrically connected to the interconnection component 200, so that the first circuit main board and the second circuit main board are interconnected.
  • This embodiment of the present application takes the first component 310 to be connected as an optical chip, the second component 320 to be connected as an electrical chip, and the communication module 100 as an optical communication module as an example for description.
  • the communication module 100 is an optical communication module.
  • the optical chip and the electrical chip are packaged on the same interconnection component 200.
  • the hybrid packaging method is used to increase the packaging density of the optical communication module, thereby increasing the number of optical communication modules in the same area. channels to support optical interconnection of large-capacity data.
  • the electrical chip can be a chip including a driver or a transimpedance amplifier and other devices, used to generate, amplify and/or receive electrical signals;
  • the optical chip can be a chip with optical signal transmission/processing functions, thereby being able to realize optical signals and electrical signals. signal conversion.
  • the electrical chip and the optical chip are electrically connected through the interconnection component 200.
  • the electrical signal generated or amplified by the electrical chip can be transmitted to the optical chip through the interconnection component 200.
  • the optical chip can convert the electrical signal into an optical signal and transmit it.
  • the communication module 100 may further include a first pressing member 610 and a first pressing member 610 that are arranged oppositely.
  • Two pressing parts 620 the first pressing part 610 is located on the side of the first part to be connected 310 facing away from the second part to be connected 320, and the second pressing part 620 is located on the side of the second part to be connected 320 facing away from the first part to be connected 310
  • the first pressing part 610 and the second pressing part 620 press the first to-be-connected part 310 , the interconnecting component 200 and the second to-be-connected part 320 to the first and second pressing parts 610 and 620 620 to achieve a stable connection between the first to-be-connected component 310 and the second to-be-connected component 320 to achieve stable signal transmission.
  • the first pressing member 610 may be directly pressed on the first member 310 to be connected, or indirectly pressed on the first member 310 to be connected through other structural members.
  • the second pressing component 620 can be directly pressed on the second component to be connected 320 , or indirectly pressed on the second component to be connected 320 through other structural components.
  • the material of the first pressing part 610 may include plastic, metal, ceramic, etc.
  • the material of the second pressing part 620 may include plastic, metal, ceramic, etc.
  • the communication module 100 may further include a connecting member 500 , which is used to connect the first pressing member 610 and the second pressing member 620 .
  • the connecting piece 500 can be inserted into any one or more of the first pressing piece 610, the first to-be-connected piece 310, the interconnection component 200, the second to-be-connected piece 320 and the second pressing piece 620, thereby avoiding the second pressing piece.
  • the structural components inserted into the connecting member 500 among the pressing member 610 , the first member to be connected 310 , the interconnection component 200 , the second member to be connected 320 and the second pressing member 620 are misaligned.
  • one end of the connecting piece 500 is connected to the first pressing piece 610, and the other end of the connecting piece 500 is connected to the second pressing piece 620, so that the first pressing piece 610 and the second pressing piece 620 are connected through the connecting piece 500. connections between.
  • the interconnection component 200 provided by the embodiment of the present application is described below.
  • the interconnection component 200 provided by the embodiment of the present application can be used in the communication module 100 in the above embodiment.
  • the interconnection assembly 200 may include a support plate 210 for carrying the first to-be-connected component 310 and the second to-be-connected component 320 .
  • the support plate 210 may have a plurality of first openings 220 arranged at intervals.
  • the plurality of first openings 220 penetrate the support plate 210 along the thickness direction, and conductive elements are disposed in the first openings 220 .
  • the conductive member 230 is used to realize the electrical connection between the first member 310 to be connected and the second member 320 to be connected.
  • the first pin 311 is provided on the side of the first component 310 facing the interconnection component 200
  • the second pin 321 is provided on the side of the second component 320 facing the interconnection component 200 .
  • the support plate 210 includes two plate surfaces that are opposite and spaced apart along the thickness direction, and the two plate surfaces include a first plate surface 211 and a second plate surface 212 . Opposite ends of the conductive member 230 along the thickness direction of the support plate 210 are located outside the first opening 220 , that is, the two ends of the conductive member 230 extend out of the first opening 220 and are exposed outside the first opening 220 .
  • One end of the conductive member 230 is located outside the first board surface 211, and the conductive member 230 located outside the first board surface 211 is electrically connected to the first pin 311 of the first component 310 to be connected; the other end of the conductive component 230 is located on the first board surface 211.
  • the conductive component 230 located outside the second board surface 212 is electrically connected to the second pin 321 of the second component to be connected 320, so as to realize the connection between the first component to be connected 310 and the second component to be connected 320. electrical connection between.
  • the orthographic projection of the conductive member 230 located outside the first opening 220 on the support plate 210 does not exceed the corresponding hole edge of the first opening 220 . That is, the size of the conductive member 230 located outside the first opening 220 is less than or equal to the size of the first opening 220, and the conductive member 230 will not occupy additional area of the support plate 210, so that the area of the support plate 210 occupied by the conductive member 230 is larger. Small, so that more conductive parts 230 can be installed on the support plate 210, and the integration level of the communication module 100 is higher.
  • the support plate 210 when more conductive parts 230 are provided on the support plate 210, the support plate 210 will not be larger in size, which is conducive to the miniaturization of the communication module 100, thereby meeting the development trend of small size and high integration of the communication module 100. .
  • the size of the conductive member 230 located outside the first opening 220 may be smaller than the size of the first opening 220.
  • the orthographic projection of the conductive member 230 outside the first opening 220 on the support plate 210 is located within the first opening 220 and has a distance from the edge of the first opening 220 .
  • the size of the conductive member 230 located outside the first opening 220 may be equal to the size of the first opening 220
  • the orthographic projection of the conductive member 230 located outside the first opening 220 on the support plate 210 is equal to the size of the first opening 220
  • the conductive member 230 includes conductive glue.
  • Conductive adhesive is an adhesive that has a certain degree of conductivity after curing or drying. It connects a variety of conductive materials together to form a conductive path between the connected conductive materials.
  • the conductive glue may include an elastic medium, such as a silica gel medium or a rubber medium, and conductive particles such as carbon or metal are arranged in the medium. Due to the strong plasticity of the conductive adhesive, the conductive member 230 can be formed into various shapes, and the volume of the conductive member 230 can be made smaller, so that the conductive member 230 occupies a smaller area of the support plate 210, thereby satisfying the small size and requirements of the communication module 100. The development trend of high integration.
  • the conductive member 230 can be formed using a stencil printing process or an automatic injection dispensing process, and its preparation is relatively simple.
  • the elastic medium can produce better deformation, so that the interconnection component 200 can have lower requirements on the surface flatness of the first to-be-connected component 310 and the second to-be-connected component 320. Even when the flatness of the surface of the connector 320 is poor, a better connection can be achieved, thereby improving the fault tolerance rate of the interconnection component 200 .
  • the hole wall of the first opening 220 can provide supporting force for the conductive adhesive to prevent the conductive adhesive from being extruded and collapsing in the horizontal direction, and to prevent the conductive adhesive from being excessively deformed and unable to connect with the first to-be-connected component 310 and the second to-be-connected component. 320 connection.
  • the plurality of first openings 220 include a plurality of signal holes 221 and a plurality of ground holes 222.
  • the signal holes 221 are used to transmit signals and form signal channels; the ground holes 222 are used to form isolation protection for the signal holes 221. Avoid electromagnetic waves from interfering with signal transmission through the signal hole 221.
  • the interfering electromagnetic waves may be generated in adjacent signal holes 221 , or may be generated by electronic components in the communication module 100 , or may be generated by electronic components outside the communication module 100 .
  • a plurality of ground holes 222 are provided around the outer periphery of the signal hole 221.
  • the number of ground holes 222 provided on the outer periphery of the signal hole 221 includes, but is not limited to, 2, 3, 4, or 5 or more.
  • the ground hole 222 semi-encloses or completely surrounds the signal hole 221, and two adjacent ground holes 222 may be in contact or have a distance between them.
  • the number of signal holes 221 surrounded by the plurality of ground holes 222 may include, but is not limited to, 1 or 2 or more.
  • ten ground holes 222 are arranged around the outer periphery of the two signal holes 221 to provide better isolation protection for the signal holes 221 .
  • the interconnection component 200 may include a ground layer.
  • the ground layer is connected to the support plate 210 and is used to form isolation protection.
  • the conductive member 230 located in the ground hole 222 is electrically connected to the ground layer, so that the conductive member 230 in the ground hole 222 is grounded to form isolation protection for the signal hole 221 .
  • the conductive member 230 located in the ground hole 222 and the ground layer may be electrically connected through connections (including contact connections, fixed connections, etc.).
  • the conductive member 230 located in the signal hole 221 is electrically isolated from the ground layer, thereby forming a signal channel to achieve signal transmission.
  • the conductive member 230 located in the signal hole 221 and the ground layer may be spaced apart or isolated by an insulating member to achieve electrical isolation.
  • the support plate 210 provided in the embodiment of the present application is described below.
  • the support plate 210 may be an integral piece.
  • the support plate 210 can be an injection-molded porous support structure, which has a relatively simple process and low preparation difficulty.
  • the support plate 210 may first form an initial support structure, and then open holes in the initial support structure to form a porous support structure. In this way, the integrally formed support plate 210 has higher overall structural stability.
  • the support plate 210 may include multiple support layers stacked in sequence, and the materials of the multiple support layers may be the same or different to meet different requirements of the support plate 210 .
  • the number of supporting layers may include, but is not limited to, 2, 3, 4, or 5 or more.
  • the plurality of support layers may include a first support layer 214 and a second support layer 214.
  • the layer 215, the first support layer 214 and the second support layer 215 are stacked.
  • ground layer provided by the embodiment of the present application is described below.
  • the ground layer may include a first ground layer 241, and the first ground layer 241 may cover the first board surface 211 and the second board surface 212. At least one.
  • the first ground layer 241 may cover the first board surface 211; or the second board surface 212; or the first board surface 211 and the second board surface 212.
  • the conductive member 230 located in the ground hole 222 is electrically connected to the first ground layer 241 to achieve grounding.
  • the conductive member 230 located in the signal hole 221 is electrically isolated from the first ground layer 241, thereby forming a signal channel.
  • the first ground layer 241 may cover the first board surface 211 .
  • a plurality of first hollow portions 244 can be provided on the first ground layer 241.
  • One first hollow portion 244 covers at least one signal hole 221 and is located between the signal hole 221 inside the first hollow portion 244 and the first ground layer 241. are arranged at intervals, so that the signal hole 221 located inside the first hollow part 244 is electrically isolated from the first ground layer 241, and the conductive member 230 located in the signal hole 221 is electrically isolated from the first ground layer 241 to form a signal aisle.
  • the number of signal holes 221 inside the first hollow portion 244 is one or two or more.
  • the first ground layer 241 may cover the second board surface 212 .
  • a plurality of first hollow portions 244 can be provided on the first ground layer 241.
  • One first hollow portion 244 covers at least one signal hole 221 and is located between the signal hole 221 inside the first hollow portion 244 and the first ground layer 241. are arranged at intervals, so that the signal hole 221 located inside the first hollow part 244 is electrically isolated from the first ground layer 241, and the conductive member 230 located in the signal hole 221 is electrically isolated from the first ground layer 241 to form a signal aisle.
  • the number of signal holes 221 inside the first hollow portion 244 is one or two or more.
  • the first ground layer 241 may be provided on both the first board surface 211 and the second board surface 212. The principle thereof is similar to the above embodiment and will not be described again. At this time, the first ground layer 241 covers a larger area, so that the first ground layer 241 and the conductive member 230 in the ground hole 222 form a relatively closed ground network, and its shielding effect is better, thereby reducing the impact on the signal hole 221 Neutralize signal interference, reduce signal loss, and enable high-speed transmission.
  • the first ground layer 241 can be provided on at least one board surface.
  • the first ground layer 241 may include a metal plating layer.
  • a metal plating layer can be formed on the surface of the support plate 210 through electroplating, chemical plating, or other methods. Then, the metal plating on the surface of the support plate 210 is laser engraved, and the metal plating near the signal hole 221 is removed to form the first hollow part 244. The metal plating outside the first hollow part 244 forms the first ground layer 241, so that the signal The hole 221 is separated from the first ground layer 241 outside the first hollow portion 244 to form an independent signal channel.
  • the metal plating layer on the surface of the first hollow portion 244 can be completely or partially removed, as long as the conductive component 230 in the signal hole 221 can be electrically isolated from the first ground layer 241 .
  • Figure 8 shows that in the actual product, part of the first ground layer 241 is removed by laser engraving to form the first hollow part 244, so that the signal hole 221 inside the first hollow part 244 is spaced apart from the first ground layer 241 on the board surface. , to achieve electrical isolation between the signal hole 221 and the first ground layer 241 to form a signal channel.
  • the ground layer may include a second ground layer 242 .
  • the second ground layer 242 is located in the support plate 210 .
  • the second ground layer 242 may be embedded in the support plate 210 . In this way, the support plate 210 protects the second ground layer 242 .
  • the support board 210 may include a first support layer 214 and a second support layer 215 , and a second ground layer 242 is located between the first support layer 214 and the second support layer 215 .
  • the second ground layer 242 may have a plurality of second openings 243 arranged at intervals.
  • the second openings 243 are arranged in one-to-one correspondence with the first openings 220 and are connected to each other.
  • a conductive member 230 is inserted into a corresponding first opening. hole 220 and a second opening 243. At least part of the first opening 220 and The size of at least some of the second openings 243 may be the same or different.
  • the conductive member 230 located in the ground hole 222 is electrically connected to the second ground layer 242 to achieve grounding.
  • the conductive member 230 located in the signal hole 221 is electrically isolated from the second ground layer 242, thereby forming a signal channel.
  • the first support layer 214, the second support layer 215, and the second ground layer 242 may form a circuit board, that is, a circuit board process is used to prepare the first support layer 214, the second support layer 215, and the second ground layer. 242, its technology is relatively mature, existing equipment can be used, and the cost is low.
  • a second hollow portion may be provided on the second ground layer 242 to electrically isolate the signal hole 221 from the second ground layer 242.
  • the principle is similar to the formation of the first hollow portion 244 on the first ground layer 241. No longer.
  • the second hollow part may be surrounding the outer periphery of the second opening 243 corresponding to the signal hole 221, or the second hollow part may overlap with the second opening 243 (the second hollow part is the second opening 243) .
  • first ground layer 241 and the second ground layer 242 can be provided separately or at the same time.
  • the interconnection component 200 may also include a conductive layer 245 , and at least part of the conductive layer 245 may be electrically connected to the ground layer (the first ground layer 241 and/or the second ground layer 242 ), so as to The shielding area of the ground layer is increased, thereby improving the shielding effect and improving the transmission performance of the interconnection component 200 .
  • the conductive layer 245 may cover the surface of the support plate 210 or be embedded in the interior of the support plate 210 .
  • the conductive layer 245 provided in the embodiment of the present application is described below.
  • the conductive layer 245 may cover part or all of the side walls of the support plate 210 .
  • the side wall surface of the support plate 210 is a wall surface extending along the thickness direction of the support plate 210 .
  • the conductive layer 245 on the side wall can be connected to the ground layer, thereby increasing the shielding area of the ground layer and improving the shielding effect of the ground layer.
  • the conductive layer 245 on the side wall is arranged around the support plate 210, which can provide a better isolation effect on electromagnetic wave interference outside the support plate 210.
  • a conductive layer 245 may be provided in the first opening 220 , that is, the wall surface of the first opening 220 may be covered with the conductive layer 245 .
  • part or all of the hole wall of a first opening 220 may be covered with a conductive layer 245; part of the ground holes 222 or all of the ground holes 222 may be covered with the conductive layer 245, part of the signal
  • the hole wall surface of the hole 221 or all the signal holes 221 may be covered with a conductive layer 245.
  • the conductive layer 245 located in the signal hole 221 can be electrically isolated from the ground layer, so that the conductive element 230 located in the signal hole 221 is electrically isolated from the ground layer, to form a signal channel. It can be understood that the conductive layer 245 in the signal hole 221 can extend outside the signal hole 221 and cover the area of the first hollow portion 244 close to the signal hole 221 . The conductive layer 245 extending outside the signal hole 221 is connected to the first ground. The layers 241 are spaced apart for electrical isolation.
  • the conductive layer 245 located in the ground hole 222 can be electrically connected to the ground layer, thereby increasing the shielding area of the ground layer and improving the shielding effect of the ground layer.
  • the connection between the conductive layer 245 and the conductive element 230 located in the ground hole 222 is relatively stable, so that the electrical connection between the conductive element 230 and the ground layer is relatively stable.
  • the conductive member 230 located in the ground hole 222 and the ground layer can be electrically connected through the conductive layer 245 in the ground hole 222 .
  • the conductive layer 245 may include a metal plating layer.
  • a metal plating layer may be formed on the side wall surface of the support plate 210 or the hole wall surface of the first opening 220 through electroplating, chemical plating, or other methods.
  • both the first ground layer 241 and the conductive layer 245 may include metal plating layers.
  • the first ground layer 241 and The conductive layer 245 can be formed in one step, thereby simplifying the preparation process and improving the connection stability between the first ground layer 241 and at least part of the conductive layer 245.
  • ground layer and the conductive layer 245 that are attached to the support plate 210 are used to achieve isolation protection. Compared with using a metal cover to achieve isolation protection, the ground layer and the conductive layer 245 occupy a smaller volume, which is beneficial to The communication module 100 is miniaturized to meet the development trend of small size and high integration of the communication module 100 . In addition, the ground layer and the conductive layer 245 cover a wide area, have good shielding effect and small signal loss, and can effectively ensure the high-speed transmission rate of the interconnection component 200.
  • the interconnection component 200 may include positioning holes 250 that penetrate the support plate 210 and the ground layer along the thickness direction of the interconnection component 200 .
  • the size of the positioning hole 250 located on the ground layer may be greater than or equal to the size of the positioning hole 250 located on the support plate 210 .
  • the positioning member 730 can be inserted into the positioning hole 250 to fix the support plate 210 , and then the first positioning member 730 is dispensing or printing.
  • the conductive member 230 is formed in the opening 220 to avoid misalignment of the support plate 210 .
  • steel mesh 720 may be provided on opposite sides of the support plate 210 along the thickness direction, and the steel mesh 720 may be provided with printed openings corresponding to the first openings 220 one-to-one. .
  • Glue and after the conductive glue solidifies (for example, using light, heat, etc.), the steel mesh 720 is removed, thereby obtaining the formed conductive member 230.
  • the length and size of the conductive member 230 extending out of the first opening 220 can be effectively controlled by controlling the thickness of the steel mesh 720 and the size of the printing opening.
  • the positioning hole 250 has many functions, and there is no need to provide a separate hole for the connector 500 .
  • connection should be understood in a broad sense.
  • it can be a fixed connection or a fixed connection.
  • Indirect connection through an intermediary can be the internal connection between two elements or the interaction between two elements.

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Abstract

本申请提供一种互联组件和通信模块，包括支撑板，支撑板具有多个间隔设置的第一开孔，多个第一开孔沿厚度方向贯穿支撑板；第一开孔中设置有导电件，导电件沿支撑板厚度方向的相对两端均位于第一开孔外，位于第一开孔外的导电件在支撑板上的正投影不超出对应的第一开孔的孔边缘。从而使得导电件占用的支撑板的面积较小，使得载板上能够设置的导电件较多，通信模块的集成度较高。另外，在载板上设置较多的导电件，不会导致载板的体积较大，有利于通信模块的小型化，从而满足通信模块小尺寸和高集成度的发展趋势。因此，本申请提供的互联组件和通信模块，互联组件上的导电件的尺寸较小，有利于互联组件和通信模块的小型化。

Description

互联组件和通信模块
本申请要求于2022年04月08日提交中国专利局、申请号为202220814985.1、申请名称为“互联组件和通信模块”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及通信技术领域，特别涉及一种互联组件和通信模块。
背景技术
在通信技术领域，随着数据处理需求的不断增长，未来数据中心将更多地引入光互连系统来提升机柜间、板间、片间乃至片上的通信带宽。其中，光具有较小信号衰减、低能耗、高带宽等优点。超小尺寸并且高度集成的光通信模块能够适应于光互连系统巨大的带宽需求。
相关技术中，光通信模块中集成了光芯片和电芯片，光芯片和电芯片可以通过载板上的金属导电件电性连接，从而实现电芯片对光芯片的驱动。
然而，上述金属导电件的尺寸较大，从而不利于光通信模块的小型化。
发明内容
本申请实施例提供一种互联组件和通信模块，互联组件上的导电件的尺寸较小，有利于互联组件和通信模块的小型化。
本申请实施例的第一方面提供一种互联组件，包括支撑板，支撑板具有多个间隔设置的第一开孔，多个第一开孔沿厚度方向贯穿支撑板；第一开孔中设置有导电件，导电件沿支撑板厚度方向的相对两端均位于第一开孔外，位于第一开孔外的导电件在支撑板上的正投影不超出对应的第一开孔的孔边缘。
本实施例提供的互联组件，互联组件可以包括支撑板，支撑板可以用于承载待连接件(例如，待连接件可以为光芯片和/或电芯片)。支撑板具有多个间隔设置的第一开孔，多个第一开孔沿厚度方向贯穿支撑板，第一开孔中设置有导电件，导电件穿设在第一开孔中，且导电件的沿支撑板厚度方向的相对两端均位于第一开孔外，从而便于导电件与外部的待连接件电性连接。其中，位于第一开孔外的导电件在支撑板上的正投影不超出对应的第一开孔的孔边缘，以使得导电件占用的支撑板的面积较小，使得载板上能够设置的导电件较多，通信模块的集成度较高。另外，在载板上设置较多的导电件，不会导致载板的体积较大，有利于通信模块的小型化，从而满足通信模块小尺寸和高集成度的发展趋势。
在一种可能的实施方式中，还包括接地层，接地层与支撑板连接；多个第一开孔包括信号孔和接地孔，位于接地孔中的导电件与接地层电性连接，位于信号孔中的导电件与接地层电性隔离。
这样，能够对信号孔产生较好的屏蔽效果，以实现高速通信。
在一种可能的实施方式中，接地层包括第一接地层，支撑板包括沿厚度方向相对且间隔设置的两个板面，至少一个板面上覆盖有第一接地层。
这样，第一接地层的设置方式较为简单。
在一种可能的实施方式中，接地层包括第二接地层，支撑板包括层叠设置的第一支撑层 和第二支撑层，第二接地层位于第一支撑层和第二支撑层之间；第二接地层具有多个间隔设置的第二开孔，第二开孔与第一开孔对应设置且相互连通，导电件插装在对应的第一开孔和第二开孔中。
这样，第一支撑层和第二支撑层对第二接地层起保护作用。
在一种可能的实施方式中，还包括导电层，导电层位于支撑板的表面，至少部分导电层与接地层电性连接。
这样，导电层能够增加接地层的屏蔽面积，提高屏蔽效果。
在一种可能的实施方式中，导电层位于支撑板的侧壁面上，位于侧壁面上的导电层与接地层电性连接。
这样，位于侧壁面上的导电层能够增加接地层的屏蔽面积，提高屏蔽效果。
在一种可能的实施方式中，导电层位于接地孔和信号孔的孔壁面上，位于接地孔的孔壁面上的导电层与接地层电性连接，位于信号孔的孔壁面上的导电层与接地层电性隔离。
这样，位于接地孔的孔壁面上的导电层够增加接地层的屏蔽面积，提高屏蔽效果。
在一种可能的实施方式中，导电件包括导电胶。
这样，导电胶的可塑性强，能够形成各种形状的导电件，且能够使得导电件的体积较小，以使导电件占用支撑板的面积较小，从而满足通信模块小尺寸和高集成度的发展趋势。
本申请实施例的第二方面提供一种通信模块，包括第一待连接件、第二待连接件和上述第一方面中的互联组件，第一待连接件和第二待连接件分别位于互联组件沿厚度方向的相对两侧，且通过互联组件的导电件电性连接。
本实施例提供的通信模块，通信模块包括互联组件，互联组件可以包括支撑板，支撑板可以用于承载待连接件(例如，待连接件可以为光芯片和/或电芯片)。支撑板具有多个间隔设置的第一开孔，多个第一开孔沿厚度方向贯穿支撑板，第一开孔中设置有导电件，导电件穿设在第一开孔中，且导电件的沿支撑板厚度方向的相对两端均位于第一开孔外，从而便于导电件与外部的待连接件电性连接。其中，位于第一开孔外的导电件在支撑板上的正投影不超出对应的第一开孔的孔边缘，以使得导电件占用的支撑板的面积较小，使得载板上能够设置的导电件较多，通信模块的集成度较高。另外，在载板上设置较多的导电件，不会导致载板的体积较大，有利于通信模块的小型化，从而满足通信模块小尺寸和高集成度的发展趋势。
在一种可能的实施方式中，还包括连接件、相对设置的第一压设件和第二压设件，第一待连接件、互联组件和第二待连接件压合于第一压设件和第二压设件之间；连接件插装在第一压设件、第一待连接件、互联组件、第二待连接件和第二压设件中，连接件的一端与第一压设件连接，连接件的另一端与第二压设件连接。
这样，第一压设件和第二压设件能够使得第一待连接件和第二待连接件之间稳定的连接。
本申请的构造以及它的其他目的及有益效果将会通过结合附图而对优选实施例的描述而更加明显易懂。
附图说明
图1为本申请实施例提供的通信模块的结构示意图；
图2为本申请实施例提供的互联组件、第一待连接件和第二待连接件的结构示意图；
图3为本申请实施例提供的支撑板的结构示意图；
图4为本申请实施例提供的支撑板的另一结构示意图；
图5为本申请实施例提供的第一接地层的结构示意图；
图6为本申请实施例提供的第一接地层的俯视图；
图7为本申请实施例提供的第一接地层和导电层的结构示意图；
图8为本申请实施例提供的实际产品中第一镂空部的结构示意图；
图9为本申请实施例提供的第二接地层的结构示意图；
图10为本申请实施例提供的侧壁面上的导电层的结构示意图；
图11为本申请实施例提供的第一开孔中的导电层的结构示意图；
图12为本申请实施例提供的制备导电件的结构示意图；
图13为本申请实施例提供的制备导电件的俯视图。
附图标记说明：
100-通信模块；                   200-互联组件；
210-支撑板；                     211-第一板面；
212-第二板面；                   214-第一支撑层；
215-第二支撑层；                 220-第一开孔；
221-信号孔；                     222-接地孔；
230-导电件；                     241-第一接地层；
242-第二接地层；                 243-第二开孔；
244-第一镂空部；                 245-导电层；
250-定位孔；                     310-第一待连接件；
311-第一引脚；                   320-第二待连接件；
321-第二引脚；                   500-连接件；
610-第一压设件；                 620-第二压设件；
710-点胶头；                     720-钢网；
730-定位件。
具体实施方式
本申请的实施方式部分使用的术语仅用于对本申请的具体实施例进行解释，而非旨在限定本申请。
相关技术中，光通信模块中集成了光芯片和电芯片，光芯片和电芯片可以通过载板电性连接，从而实现电芯片对光芯片的驱动。其中，载板中设置有通孔，通孔中设置有金属导电件，金属导电件由金属材料冲压而形成。
然而，受限于冲压工艺，由冲压成型的金属导电件，其体积较大，金属导电件在载板上的正投影超出通孔较多，导致金属导电件占用载板的面积较大，使得载板上能够设置的金属导电件较少，导致光通信模块的集成度较低。另外，若在载板上设置较多的该金属导电件，则会导致载板的体积较大，不利于光通信模块的小型化，无法满足光通信模块小尺寸和高集成度的发展趋势。
基于上述问题，本申请实施例提供一种互联组件和通信模块，互联组件可以包括支撑板，支撑板可以用于承载待连接件(例如，待连接件可以为光芯片和/或电芯片)。支撑板具有多个间隔设置的第一开孔，多个第一开孔沿厚度方向贯穿支撑板，第一开孔中设置有导电件，导电件穿设在第一开孔中，且导电件的沿支撑板厚度方向的相对两端均位于第一开孔外，从 而便于导电件与外部的待连接件电性连接。其中，位于第一开孔外的导电件在支撑板上的正投影不超出对应的第一开孔的孔边缘，以使得导电件占用的支撑板的面积较小，使得载板上能够设置的导电件较多，通信模块的集成度较高。另外，在载板上设置较多的导电件，不会导致载板的体积较大，有利于通信模块的小型化，从而满足通信模块小尺寸和高集成度的发展趋势。
以下结合图1-图13对本申请实施例提供的通信模块100进行说明。
本申请实施例提供的通信模块100，如图1和图2所示，通信模块100可以包括第一待连接件310、第二待连接件320和互联组件200，互联组件200位于第一待连接件310和第二待连接件320之间，第一待连接件310和第二待连接件320分别位于互联组件200沿厚度方向的相对两侧，第一待连接件310和第二待连接件320通过互联组件200电性连接。
第一待连接件310可以包括芯片(如光芯片、电芯片)、电路主板中的任意一种或多种，第二待连接件320以包括芯片(如光芯片、电芯片)、电路主板中的任意一种或多种；当然的，第一待连接件310和第二待连接件320还可以包括其他电子元件，本申请实施例对此不做限制。
其中，第一待连接件310位于互联组件200沿厚度方向的其中一侧，位于该侧的第一待连接件310的数量可以为至少一个。当第一待连接件310的数量为多个时，各个第一待连接件310可以相同或不同。另外，第二待连接件320位于互联组件200沿厚度方向的另一侧，位于该侧的第二待连接件320的数量可以为至少一个。当第二待连接件320的数量为多个时，各个第二待连接件320可以相同或不同。
示例性的，第一待连接件310可以为光芯片，光芯片位于互联组件200的其中一侧，光芯片与互联组件200电性连接，第二待连接件320可以为电路主板，电路主板位于互联组件200的另一侧，电路主板与互联组件200电性连接，从而使得光芯片与电路主板之间实现互联。
示例性的，第一待连接件310可以为光芯片，光芯片位于互联组件200的其中一侧，光芯片与互联组件200电性连接，第二待连接件320可以为电芯片，电芯片位于互联组件200的另一侧，电芯片与互联组件200电性连接，从而使得光芯片与电芯片之间实现互联。
示例性的，第一待连接件310可以为第一电路主板，第一电路主板位于互联组件200的其中一侧，第一电路主板与互联组件200电性连接，第二待连接件320可以为第二电路主板，第二电路主板位于互联组件200的另一侧，第二电路主板与互联组件200电性连接，从而使得第一电路主板与第二电路主板之间实现互联。
本申请实施例以第一待连接件310为光芯片，第二待连接件320为电芯片，通信模块100为光通信模块为例进行说明。
该通信模块100为光通信模块，将光芯片和电芯片封装在同一互联组件200上，采用混合封装的方式，提高了光通信模块的封装密度，进而在相同的面积下，增加了光通信模块的通道，以便于支撑大容量数据的光互联。
其中，电芯片可以为包括驱动器或跨阻放大器等器件的芯片，用于产生、放大和/或接收电信号；光芯片可以为具有光信号传输/处理功能的芯片，从而能够实现光信号和电信号的互相转换。
示例性的，电芯片和光芯片通过互联组件200电性连接，电芯片产生或放大的电信号可以通过互联组件200传输给光芯片，光芯片可以将电信号转换成光信号传输出去。
一些实施例中，如图1所示，通信模块100还包可以括相对设置的第一压设件610和第 二压设件620，第一压设件610位于第一待连接件310背离第二待连接件320的一侧，第二压设件620位于第二待连接件320背离第一待连接件310的一侧，第一压设件610和第二压设件620将第一待连接件310、互联组件200和第二待连接件320压合于第一压设件610和第二压设件620之间，以使得第一待连接件310和第二待连接件320之间稳定连接，从而实现稳定的信号传输。
其中，第一压设件610可以直接压设在第一待连接件310上，或者，通过其他结构件间接压设在第一待连接件310上。第二压设件620可以直接压设在第二待连接件320上，或者，通过其他结构件间接压设在第二待连接件320上。
示例性的，第一压设件610的材料可以包括塑料、金属、陶瓷等，第二压设件620的材料可以包括塑料、金属、陶瓷等。
示例性的，如图1所示，通信模块100还可以包括连接件500，连接件500用于连接第一压设件610和第二压设件620。连接件500可以插装在第一压设件610、第一待连接件310、互联组件200、第二待连接件320和第二压设件620中的任意一个或多个中，从而避免第一压设件610、第一待连接件310、互联组件200、第二待连接件320和第二压设件620中被连接件500插装的结构部件错位。其中，连接件500的一端与第一压设件610连接，连接件500的另一端与第二压设件620连接，从而通过连接件500将第一压设件610和第二压设件620之间连接。
以下对本申请实施例提供的互联组件200进行说明。
本申请实施例提供的互联组件200，该互联组件200可以用于上述实施例中的通信模块100。
如图3和图4所示，互联组件200可以包括支撑板210，支撑板210用于承载第一待连接件310和第二待连接件320。
如图5和图6所示，支撑板210可以具有多个间隔设置的第一开孔220，多个第一开孔220沿厚度方向贯穿支撑板210，第一开孔220中设置有导电件230，导电件230用于实现第一待连接件310和第二待连接件320之间的电性连接。
如图1和图3所示，第一待连接件310朝向互联组件200的一侧设置有第一引脚311，第二待连接件320朝向互联组件200的一侧设置有第二引脚321。支撑板210包括沿厚度方向相对且间隔设置的两个板面，两个板面包括第一板面211和第二板面212。导电件230沿支撑板210厚度方向的相对两端均位于第一开孔220外，即导电件230的两端伸出第一开孔220而暴露在第一开孔220外部。导电件230的其中一端位于第一板面211外，位于第一板面211外的导电件230与第一待连接件310的第一引脚311电性连接；导电件230的另一端位于第二板面212外，位于第二板面212外的导电件230与第二待连接件320的第二引脚321电性连接，以实现第一待连接件310和第二待连接件320之间的电性连接。
本实施例中，位于第一开孔220外的导电件230在支撑板210上的正投影不超出对应的第一开孔220的孔边缘。即位于第一开孔220外的导电件230的尺寸小于等于第一开孔220的尺寸，导电件230不会额外占用支撑板210的面积，以使得导电件230占用的支撑板210的面积较小，使得支撑板210上能够设置的导电件230较多，通信模块100的集成度较高。另外，在支撑板210上设置较多的导电件230时，不会导致支撑板210的体积较大，有利于通信模块100的小型化，从而满足通信模块100小尺寸和高集成度的发展趋势。
可以理解的是，导电件230的尺寸较小时，其传输损耗较小，能够有利于实现高速传输。
示例性的，位于第一开孔220外的导电件230的尺寸可以小于第一开孔220的尺寸，位 于第一开孔220外的导电件230在支撑板210上的正投影位于第一开孔220内，且与第一开孔220的边缘之间具有间距。或者，位于第一开孔220外的导电件230的尺寸可以等于第一开孔220的尺寸，位于第一开孔220外的导电件230在支撑板210上的正投影与第一开孔220的孔边缘重合，从而使得导电件230与第一待连接件310和第二待连接件320之间的接触面积较大，其连接稳定性较高。
示例性的，导电件230包括可以导电胶。导电胶是一种固化或干燥后具有一定导电性的胶黏剂，它将多种导电材料连接在一起，使被连接的导电材料之间形成导电的通路。导电胶可以包括弹性介质，例如硅胶介质或者橡胶介质，并在介质中设置碳或金属等导电粒子。由于导电胶的可塑性强，能够形成各种形状的导电件230，且能够使得导电件230的体积较小，以使导电件230占用支撑板210的面积较小，从而满足通信模块100小尺寸和高集成度的发展趋势。例如，可以采用钢板印刷工艺或者自动注射点胶工艺形成导电件230，其制备较为简单。另外，弹性介质可以产生较好的形变，使得互联组件200可以对第一待连接件310和第二待连接件320的表面平整度的需求较低，在第一待连接件310和第二待连接件320的表面的平整度较差的情况下，也可以实现较好的连接，从而提高互联组件200的容错率。第一开孔220的孔壁可以给导电胶提供支撑力，避免导电胶被挤压而沿水平方向胀塌，避免导电胶过度形变而无法实现与第一待连接件310和第二待连接件320的连接。
本实施例中，多个第一开孔220包括多个信号孔221和多个接地孔222，信号孔221用于传输信号，形成信号通道；接地孔222用于对信号孔221形成隔离保护，避免电磁波干扰信号孔221的信号传输。
其中，干扰的电磁波可以是相邻的信号孔221中产生的，也可以是通信模块100中的电子元件产生的，还可以是通信模块100外部的电子元件产生的。
示例性的，多个接地孔222围设在信号孔221的外周，例如，信号孔221的外周设置的接地孔222包括但不限于为2个、3个、4个或5个及上。接地孔222对信号孔221形成半包围或者全包围，相邻两个接地孔222之间可以接触或者具有间距。另外，多个接地孔222包围的信号孔221的数量可以包括但不限于为1个或2个及以上。如图5中A部分所示，10个接地孔222围设在2个信号孔221的外周，以对信号孔221产生较好的隔离保护。
本实施例中，互联组件200可以包括接地层，接地层与支撑板210连接，接地层用于形成隔离保护。位于接地孔222中的导电件230与接地层电性连接，从而使得接地孔222中的导电件230接地，以对信号孔221形成隔离保护。例如，位于接地孔222中的导电件230与接地层之间可以通过连接(包括接触连接、固定连接等)实现电性连接。另外，位于信号孔221中的导电件230与接地层电性隔离，从而形成信号通道，实现信号传输。例如，位于信号孔221中的导电件230与接地层之间可以采用间隔设置、通过绝缘件隔离等方式以实现电性隔离。
以下对本申请实施例提供的支撑板210进行说明。
第一种实施方式中，如图3所示，支撑板210可以为一体件。例如，支撑板210可以是注塑成型的多孔支撑结构，其工艺较为简单，制备难度较低。或者，支撑板210可以先形成初始支撑结构，在初始支撑结构上开孔以形成多孔的支撑结构。这样，一体成型的支撑板210的整体结构稳定性较高。
第二种实施方式中，支撑板210可以包括多个依次层叠的支撑层，多个支撑层的材料可以相同或不同，以满足支撑板210的不同需求。例如，支撑层的数量可以包括但不限于为2个、3个、4个或5个及以上。如图4所示，多个支撑层可以包括第一支撑层214和第二支撑 层215，第一支撑层214和第二支撑层215层叠设置。
以下对本申请实施例提供的接地层进行说明。
第一种实施方式中，如图5、图6和图7所示，接地层可以包括第一接地层241，第一接地层241可以覆盖在第一板面211和第二板面212中的至少一者。第一接地层241可以覆盖在第一板面211；或，第二板面212；或，第一板面211和第二板面212。
其中，位于接地孔222中的导电件230与第一接地层241电性连接，从而实现接地。位于信号孔221中的导电件230与第一接地层241电性隔离，从而形成信号通道。
示例性的，第一接地层241可以覆盖在第一板面211上。可以在该第一接地层241上设置多个第一镂空部244，一个第一镂空部244覆盖至少一个信号孔221，位于第一镂空部244内侧的信号孔221与第一接地层241之间间隔设置，从而使得位于第一镂空部244内侧的信号孔221与第一接地层241之间电性隔离，位于信号孔221内的导电件230与第一接地层241电性隔离，以形成信号通道。例如，第一镂空部244内侧的信号孔221的数量为1个或2个及以上。
示例性的，第一接地层241可以覆盖在第二板面212上。可以在该第一接地层241上设置多个第一镂空部244，一个第一镂空部244覆盖至少一个信号孔221，位于第一镂空部244内侧的信号孔221与第一接地层241之间间隔设置，从而使得位于第一镂空部244内侧的信号孔221与第一接地层241之间电性隔离，位于信号孔221内的导电件230与第一接地层241电性隔离，以形成信号通道。例如，第一镂空部244内侧的信号孔221的数量为1个或2个及以上。
示例性的，第一板面211和第二板面212上可以均设置有第一接地层241，其原理与上述实施例类似，不再赘述。此时，第一接地层241覆盖的面积较大，使得第一接地层241与接地孔222中的导电件230构成较为封闭的接地网络，其屏蔽效果较好，从而可以减小对信号孔221中信号的干扰，降低信号损失，能够实现高速传输。
可以理解的是，上述多种支撑板210的实施方式中，均可以在至少一个板面上设置第一接地层241。
示例性的，第一接地层241可以包括金属镀层。可以通过电镀、化学镀等方式在支撑板210的板面上形成金属镀层。然后对支撑板210的板面上的金属镀层进行激光雕刻，去除信号孔221附近的金属镀层形成第一镂空部244，第一镂空部244外侧的金属镀层形成第一接地层241，从而使得信号孔221与第一镂空部244外侧的第一接地层241分开，形成独立的信号通道。其中，第一镂空部244的板面上的金属镀层可以完全去除或者部分去除，只要能够将信号孔221中的导电件230与第一接地层241电性隔离即可。
图8中示出了实际产品中被激光雕刻去除部分第一接地层241而形成第一镂空部244，使得第一镂空部244内侧的信号孔221与板面上的第一接地层241间隔设置，以实现信号孔221和第一接地层241电性隔离，形成信号通道。
第二种实施方式中，接地层可以包括第二接地层242。第二接地层242位于支撑板210中。例如，第二接地层242可以嵌入到支撑板210中。这样，支撑板210对第二接地层242起保护作用。
具体的，如图4和图9所示，支撑板210可以包括第一支撑层214和第二支撑层215，第二接地层242位于第一支撑层214和第二支撑层215之间。第二接地层242可以具有多个间隔设置的第二开孔243，第二开孔243与第一开孔220一一对应设置且相互连通，一个导电件230插装在对应的一个第一开孔220和一个第二开孔243中。至少部分第一开孔220和 至少部分第二开孔243的尺寸可以相同或不同。当第一开孔220和第二开孔243的尺寸一致时，两者可以一次形成，其制备工艺较为简单。
其中，位于接地孔222中的导电件230与第二接地层242电性连接，从而实现接地。位于信号孔221中的导电件230与第二接地层242电性隔离，从而形成信号通道。
示例性的，第一支撑层214、第二支撑层215和第二接地层242可以形成电路板，即采用电路板的工艺来制备第一支撑层214、第二支撑层215和第二接地层242，其工艺较为成熟，能够使用现有的设备，成本较低。
示例性的，第二接地层242上可设置有第二镂空部，以使信号孔221与第二接地层242电性隔离，其原理与第一接地层241上形成第一镂空部244类似，不再赘述。第二镂空部可以围设在与信号孔221对应的第二开孔243的外周，或者，第二镂空部可以与该第二开孔243重合(第二镂空部即该第二开孔243)。
需要说明的是，第一接地层241和第二接地层242可以单独设置，也可以同时设置。
一些实施例中，如图7所示，互联组件200还可以包括导电层245，至少部分导电层245可以与接地层电性连接(第一接地层241和/或第二接地层242)，以增加接地层的屏蔽面积，从而提高屏蔽效果，以提升互联组件200的传输性能。其中，导电层245可以覆盖在支撑板210的表面或者嵌入在支撑板210的内部。
以下对本申请实施例提供的导电层245进行说明。
如图10所示，导电层245可以覆盖在支撑板210的部分或全部的侧壁面上。支撑板210的侧壁面是支撑板210沿厚度方向延伸的壁面。侧壁面上的导电层245可以与接地层连接，从而可以增大接地层的屏蔽面积，提高接地层的屏蔽效果。另外，侧壁面上的导电层245围设在支撑板210的四周，可以对支撑板210外的电磁波干扰起到较好的隔离效果。
另一些示例中，如图11所示，第一开孔220中可以设置有导电层245，即第一开孔220的孔壁面上可以覆盖有导电层245。其中，一个第一开孔220的孔壁面的部分或者全部可以覆盖有导电层245；部分数量的接地孔222或者全部数量的接地孔222的孔壁面上可以覆盖有导电层245，部分数量的信号孔221或者全部数量的信号孔221的孔壁面上可以覆盖有导电层245。
在信号孔221中设置有导电层245的实施方式中，位于信号孔221中的导电层245可以与接地层电性隔离，从而使得位于信号孔221中的导电件230与接地层电性隔离，以形成信号通道。可以理解的是，信号孔221中导电层245可以延伸至信号孔221外，而覆盖在第一镂空部244的靠近信号孔221的区域，延伸至信号孔221外的导电层245与第一接地层241间隔设置，以电性隔离。
在接地孔222中设置有导电层245的实施方式中，位于接地孔222中的导电层245可以与接地层电性连接，从而可以增大接地层的屏蔽面积，提高接地层的屏蔽效果。另外，位于接地孔222中的导电层245与导电件230的连接较稳定性较高，使得导电件230与接地层的电性连接较为稳定。此时，位于接地孔222中的导电件230与接地层之间可以通过接地孔222中的导电层245电性连接。
在信号孔221和接地孔222中均设置导电层245时，其原理与上述实施例类似，不再赘述。
示例性的，导电层245可以包括金属镀层。可以通过电镀、化学镀等方式在支撑板210的侧壁面或第一开孔220的孔壁面上形成金属镀层。在同时设置有第一接地层241和导电层245的实施方式中，第一接地层241和导电层245均可以包括金属镀层，第一接地层241和 导电层245可以为一次成型，从而简化制备工艺，提高第一接地层241和至少部分导电层245的连接稳定性。
可以理解的是，采用与支撑板210贴合的接地层和导电层245来实现隔离保护，相比与采用金属罩来实现隔离保护，接地层和导电层245所占用的体积较小，有利于通信模块100的小型化，从而满足通信模块100小尺寸和高集成度的发展趋势。另外，接地层和导电层245的覆盖面积较广，其屏蔽效果较好，信号损失小，能够有效保证互联组件200的高速传输速率。
一些实施例中，如图12所示，互联组件200可以包括定位孔250，定位孔250沿互联组件200的厚度方向贯穿支撑板210以及接地层。位于接地层的定位孔250尺寸可以大于等于位于支撑板210的定位孔250尺寸。
如图12和图13所示，在制备导电件230的过程中，可以将定位件730插装在定位孔250中，以对支撑板210进行固定，再通过点胶或印刷等方式在第一开孔220中形成导电件230，从而避免支撑板210的错位。另一些示例中，在制备导电件230的过程中，支撑板210的沿厚度方向的相对两侧可以设置钢网720，钢网720中设置有与第一开孔220一一对应的印刷开孔。可以用点胶头710在钢网720的印刷开孔和第一开孔220中注入导电胶，用刮刀去除多余的导电胶，使得印刷开孔和第一开孔220中压实并填满导电胶，待导电胶凝固(例如采用光、热等手段固化)，移除钢网720，从而得到成型的导电件230。其中，可以通过控制钢网720的厚度以及印刷开孔的大小，对伸出第一开孔220外的导电件230的长度和大小进行有效的控制。
可以理解的是，如图1所示，连接件500插装在互联组件200时，可以插装在定位孔250中，定位孔250的作用较为丰富，无需为连接件500单独设孔。
在本申请实施例的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应作广义理解，例如，可以是固定连接，也可以是通过中间媒介间接相连，可以是两个元件内部的连通或者两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请实施例中的具体含义。
术语“第一”、“第二”、“第三”、“第四”等(如果存在)是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。
最后应说明的是：以上各实施例仅用以说明本申请实施例的技术方案，而非对其限制；尽管参照前述各实施例对本申请实施例进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请实施例各实施例技术方案的范围。

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  1. 一种互联组件，其特征在于，包括支撑板，所述支撑板具有多个间隔设置的第一开孔，多个所述第一开孔沿厚度方向贯穿所述支撑板；
    所述第一开孔中设置有导电件，所述导电件沿所述支撑板厚度方向的相对两端均位于所述第一开孔外，位于所述第一开孔外的所述导电件在所述支撑板上的正投影不超出对应的所述第一开孔的孔边缘。
  2. 根据权利要求1所述的互联组件，其特征在于，还包括接地层，所述接地层与所述支撑板连接；
    多个所述第一开孔包括信号孔和接地孔，位于所述接地孔中的所述导电件与所述接地层电性连接，位于所述信号孔中的所述导电件与所述接地层电性隔离。
  3. 根据权利要求2所述的互联组件，其特征在于，所述接地层包括第一接地层，所述支撑板包括沿厚度方向相对且间隔设置的两个板面，至少一个所述板面上覆盖有所述第一接地层。
  4. 根据权利要求2所述的互联组件，其特征在于，所述接地层包括第二接地层，所述支撑板包括层叠设置的第一支撑层和第二支撑层，所述第二接地层位于所述第一支撑层和所述第二支撑层之间；
    所述第二接地层具有多个间隔设置的第二开孔，所述第二开孔与所述第一开孔对应设置且相互连通，所述导电件插装在对应的所述第一开孔和所述第二开孔中。
  5. 根据权利要求2-4任一所述的互联组件，其特征在于，还包括导电层，所述导电层位于所述支撑板的表面，至少部分所述导电层与所述接地层电性连接。
  6. 根据权利要求5所述的互联组件，其特征在于，所述导电层位于所述支撑板的侧壁面上，位于所述侧壁面上的所述导电层与所述接地层电性连接。
  7. 根据权利要求5所述的互联组件，其特征在于，所述导电层位于所述接地孔和所述信号孔的孔壁面上，位于所述接地孔的孔壁面上的所述导电层与所述接地层电性连接，位于所述信号孔的孔壁面上的所述导电层与所述接地层电性隔离。
  8. 根据权利要求1-4任一所述的互联组件，其特征在于，所述导电件包括导电胶。
  9. 一种通信模块，其特征在于，包括第一待连接件、第二待连接件和上述权利要求1-8任一所述的互联组件，所述第一待连接件和所述第二待连接件分别位于所述互联组件沿厚度方向的相对两侧，且通过所述互联组件的导电件电性连接。
  10. 根据权利要求9所述的通信模块，其特征在于，还包括连接件、相对设置的第一压设件和第二压设件，所述第一待连接件、所述互联组件和所述第二待连接件压合于所述第一压设件和所述第二压设件之间；
    所述连接件插装在所述第一压设件、所述第一待连接件、所述互联组件、所述第二待连接件和所述第二压设件中，所述连接件的一端与所述第一压设件连接，所述连接件的另一端与所述第二压设件连接。
PCT/CN2023/071923 2022-04-08 2023-01-12 互联组件和通信模块 WO2023193505A1 (zh)

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CN110099509A (zh) * 2019-04-08 2019-08-06 Oppo广东移动通信有限公司 电路板及电子设备
CN112136209A (zh) * 2019-04-24 2020-12-25 深圳市汇顶科技股份有限公司 集成转接件的第一元件、互联结构及其制备方法
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CN110099509A (zh) * 2019-04-08 2019-08-06 Oppo广东移动通信有限公司 电路板及电子设备
CN112136209A (zh) * 2019-04-24 2020-12-25 深圳市汇顶科技股份有限公司 集成转接件的第一元件、互联结构及其制备方法
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