Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
  • H01B1/20—Conductive material dispersed in non-conductive organic material
  • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
  • H01B1/14—Conductive material dispersed in non-conductive inorganic material
  • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F10/00—Individual photovoltaic cells, e.g. solar cells
  • H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
  • H10F10/14—Photovoltaic cells having only PN homojunction potential barriers
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F71/00—Manufacture or treatment of devices covered by this subclass
  • H10F71/121—The active layers comprising only Group IV materials
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F77/00—Constructional details of devices covered by this subclass
  • H10F77/20—Electrodes
  • H10F77/206—Electrodes for devices having potential barriers
  • H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F77/00—Constructional details of devices covered by this subclass
  • H10F77/30—Coatings
  • H10F77/306—Coatings for devices having potential barriers
  • H10F77/311—Coatings for devices having potential barriers for photovoltaic cells
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E10/00—Energy generation through renewable energy sources
  • Y02E10/50—Photovoltaic [PV] energy
  • Y02E10/546—Polycrystalline silicon PV cells

Definitions

• the present invention relates to a conductive paste used for forming electrodes of semiconductor devices and the like.
• the present invention relates to a conductive paste for forming electrodes of solar cells.
• the present invention also relates to a solar cell manufactured using the conductive paste for electrode formation, and a method for manufacturing a solar cell.
• Semiconductor devices such as crystalline silicon solar cells that use crystalline silicon, which is formed by processing monocrystalline silicon or polycrystalline silicon into a flat plate shape, have electrodes on the surface of the silicon substrate for electrical contact with the outside of the device. It is common for electrodes to be formed using a conductive paste for formation. Among semiconductor devices in which electrodes are formed in this manner, the production volume of crystalline silicon solar cells has increased significantly in recent years. These solar cells have an impurity diffusion layer, an antireflection film, and a light incident side surface electrode on one surface of a crystalline silicon substrate, and a back surface electrode on the other surface. The power generated by the crystalline silicon solar cell can be extracted to the outside by the light incident side front surface electrode and the back surface electrode.
• a conductive paste containing a conductive powder, a glass frit, an organic binder, a solvent, and other additives is used to form the electrodes of conventional crystalline silicon solar cells.
• Silver particles are mainly used as the conductive powder.
• Patent Document 1 describes a method for improving ohmic contact behavior between a contact grid and an emitter layer of a silicon solar cell. Specifically, the method described in Patent Document 1 describes the following. That is, a silicon solar cell (1) is first provided with the emitter layer, the contact grid (5) and the back contact (3). Said contact grid (5) is electrically connected to one pole of a voltage source. A contact device electrically connected to the other pole of the voltage source is connected to the back contact (3). The voltage source applies a voltage lower than the breakdown voltage in the opposite direction to the forward direction of the silicon solar cell (1). While this voltage is applied, a point light source (13) is induced across the sun-facing side of the silicon solar cell (1).
• a subsection on the side facing the sun is point-irradiated to induce a current to flow in the subarea.
• This current acts on the subsection for a period of 1 msec to 100 msec.
• the current is reduced by a ratio of the area of the subsection to the area of the silicon solar cell (1) by 10 to 30 times the magnitude of the short circuit current of the silicon solar cell (1) measured under standard test conditions.
• the size is equivalent to that of
• Patent Document 2 describes a process for improving ohmic contact behavior between a contact grid and an emitter layer in a silicon solar cell. Specifically, as the process of Patent Document 2, a predetermined voltage is applied in the forward direction and the reverse direction of the silicon solar cell, and a point light source is guided to the solar side of the silicon solar cell, thereby It is described that irradiation is applied to a cross section of a subsection on the surface side.
• Patent Document 3 describes a method for manufacturing a crystalline silicon solar cell using a conductive paste for forming an electrode of a crystalline silicon solar cell containing an inorganic material.
• Patent Document 3 describes a conductive paste containing conductive particles and glass frit as an inorganic material. It is described that the glass frit contained in the conductive paste of Patent Document 3 contains 70 to 90% by weight of PbO based on 100% by weight of the glass frit, and does not contain Al 2 O 3 .
• Patent Document 4 describes a conductive composition containing silver powder, glass powder containing PbO, and a vehicle made of an organic substance.
• the conductive composition is a conductive composition for forming an electrode that penetrates a silicon nitride layer and is electrically connected to an n-type semiconductor layer formed under the silicon nitride layer.
• the basicity of the glass powder contained in the conductive composition is 0.6 or more and 0.8 or less, and the transition point of the glass is 300°C to 450°C. There is.
• FIG. 5 shows an example of a schematic cross-sectional view of a general crystalline silicon solar cell.
• an impurity diffusion layer 4 is provided on the light incident side surface (light incident side surface) of a crystalline silicon substrate 1 (for example, an n-type crystalline silicon substrate 1).
• a crystalline silicon substrate 1 for example, an n-type crystalline silicon substrate 1).
• an antireflection film 2 is formed on the impurity diffusion layer 4. Since the antireflection film 2 also has a function as a passivation film, the antireflection film 2 is sometimes referred to as the passivation film 2.
• an electrode pattern of the light incident side surface electrode 20 (surface electrode) is printed on the antireflection film 2 using a conductive paste using a screen printing method or the like, and the conductive paste is dried and baked at a predetermined temperature.
• the light incident side surface electrode 20 is formed by this.
• the conductive paste fires through the antireflection film 2 during firing at this predetermined temperature. This fire-through allows the light incident side surface electrode 20 to be formed in contact with the impurity diffusion layer 4 .
• fire-through refers to etching the antireflection film 2, which is an insulating film, with a glass frit or the like contained in a conductive paste to make the light incident side surface electrode 20 and the impurity diffusion layer 4 electrically conductive.
• the electrode pattern when the electrode pattern is fired, the electrode pattern fires through the anti-reflection film 2, so that the anti-reflection film 2 disappears and the light incident side surface electrode 20 and the impurity diffusion layer 4 are removed. are in contact with.
• a pn junction is formed at the interface between the n-type crystalline silicon substrate 1 and the impurity diffusion layer 4.
• Electrons and holes (carriers) are extracted to the outside as a current through these electrodes.
• FIG. 2 shows an example of a schematic diagram of the light incident side surface of a crystalline silicon solar cell.
• a bus bar electrode (light incident side bus bar electrode 20a) and a light incident side finger electrode 20b (simply referred to as "finger") as the light incident side surface electrode 20. (sometimes referred to as “electrode 20b") are arranged.
• electrode 20b electrons of the electron-hole pairs generated by the incident light incident on the crystalline silicon solar cell are collected on the finger electrode 20b and further collected on the light incident side bus bar electrode 20a.
• a metal ribbon for interconnection whose periphery is covered with solder is soldered to the light incident side bus bar electrode 20a, and current is taken out to the outside by this metal ribbon.
• the contact resistance between the light incident side surface electrode 20 and the impurity diffusion layer 4 is required to be low.
• the laser treatment process refers to forming the light incident side surface electrode 20, applying a predetermined voltage so that a current flows in the opposite direction to the forward direction of the crystalline silicon solar cell, and This refers to a technique for obtaining low contact resistance by irradiating the light incident side surface of a solar cell with light from a solar cell.
• fill factor FF
• Voc open circuit voltage
• FIG. 1 shows an example of a schematic cross-sectional view showing a structure in which a light-incidence side surface electrode 20 is formed on the light-incidence side surface of a crystalline silicon solar cell using a laser treatment process. As shown in FIG. 1, when a laser treatment process is used, the antireflection film 2 is present in most of the area between the light incident side surface electrode 20 and the impurity diffusion layer 4.
• the above-mentioned predetermined voltage is applied so that a current flows in the opposite direction to the forward direction in the pn junction, and light from a point light source is irradiated to generate carriers (electrons and holes).
• a current flows in a small region between the light incident side surface electrode 20 and the impurity diffusion layer 4, and the region is locally heated. Due to the local heating, a minute portion where the impurity diffusion layer 4 does not exist is formed between the light incident side surface electrode 20 and the impurity diffusion layer 4 .
• an AgSi alloy 30 (alloy of silver and silicon), which is a locally minute electrically conductive portion (locally conductive portion), is formed in the impurity diffusion layer 4 in contact with the light incident side surface electrode 20. is thought to be formed. Note that the AgSi alloy 30 is not shown in FIG. 1 because it is locally formed in a limited area. It is thought that this locally formed minute electrically conductive portion enables good electrical continuity between the light incident side surface electrode 20 and the impurity diffusion layer 4. Further, an antireflection film 2 (passivation film) is present in most of the area between the light incident side surface electrode 20 and the impurity diffusion layer 4 except for the part where the local conduction part is formed.
• the fill factor (FF) of the solar cell can be improved without reducing the open circuit voltage (Voc). Therefore, the conductive paste used to form the light incident side surface electrode 20 by the laser treatment process may have different properties from conventional conductive paste (conductive paste that can fire through the antireflection film 2). is necessary.
• the electrode pattern of the conductive paste is fired, which fires through the antireflection film 2 and creates an impurity diffusion layer. Contact 4. During this fire-through, there is a problem in that the impurity diffusion layer 4 is damaged and the performance of the crystalline silicon solar cell is degraded.
• the antireflection film 2 is basically not fired through. Therefore, by using the laser treatment process, damage to the impurity diffusion layer 4 can be suppressed.
• an object of the present invention is to provide a conductive paste suitable for forming electrodes by a laser treatment process for manufacturing crystalline silicon solar cells.
• the present invention has the following configuration.
• Configuration 1 is a conductive paste for forming electrodes of solar cells, (A) conductive particles; (B) an organic vehicle; (C) includes a glass frit; Basicity B of the glass frit (C) GF , and the unit weight part in the conductive paste when the content of the conductive particles (A) in the conductive paste is 100 parts by weight. (C) A conductive paste in which the product B (GF ⁇ G) of glass frit content G is in the range of 0.25 to 1.45.
• Configuration 2 is the conductive paste of Configuration 1, wherein the conductive particles (A) include silver particles.
• Structure 3 is the conductive paste of Structure 1 or 2, in which (B) the organic vehicle contains at least one selected from ethyl cellulose, rosin ester, acrylic, and an organic solvent.
• Configuration 4 is such that the product of the PbO content C PbO in the (C) glass frit in units of mol% and the content G of the (C) glass frit is 20 to 139.
• the conductive paste has any one of configurations 1 to 3 within the range.
• Configuration 5 is the conductive paste according to any one of Configurations 1 to 4, wherein the content G of the glass frit (C) is 0.3 to 4.0 parts by weight.
• Configuration 6 is the conductive paste according to any one of Configurations 1 to 4, wherein the content G of the glass frit (C) is 0.5 to 1.5 parts by weight.
• Configuration 7 is the conductive paste of any of Configurations 1 to 6, wherein the glass transition point of the glass frit (C) is 300 to 600°C.
• Configuration 8 is the conductive paste of any one of Configurations 1 to 7, in which the glass frit (C) contains at least one selected from ZnO, V 2 O 5 , WO 3 and Nb 2 O 3 .
• Configuration 9 is the conductive paste of any of Configurations 1 to 8, wherein the conductive paste further contains (D) aluminum particles.
• Configuration 10 is such that the content of the aluminum particles (D) in the conductive paste is 0.1 to 2 when the content of the conductive particles (A) in the conductive paste is 100 parts by weight. 0 parts by weight of the conductive paste of Configuration 9.
• Structure 11 is a conductive paste for forming electrodes of solar cells,
• the solar cell is a first conductivity type semiconductor substrate; a second conductivity type semiconductor layer disposed on one surface of the first conductivity type semiconductor substrate; a back electrode arranged to be electrically connected to the other surface of the first conductivity type semiconductor substrate; a passivation film disposed in contact with the surface of the second conductivity type semiconductor layer; a light incident side surface electrode disposed on at least a part of the surface of the passivation film, the light-incidence-side surface electrode is configured to have a back surface electrode such that a current flows in a direction opposite to the forward direction between the second conductivity type semiconductor layer and the first conductivity type semiconductor substrate;
• the light incidence side surface electrode is treated to irradiate the light incidence side surface of the solar cell with light from a point light source while applying a voltage between the light incidence side surface electrode and the light incidence side surface electrode,
• the conductive paste according to any one of configurations 1 to 10, wherein the conductive paste is a
• Configuration 12 includes a first conductivity type semiconductor substrate; a second conductivity type semiconductor layer disposed on one surface of the first conductivity type semiconductor substrate; a back electrode arranged to be electrically connected to the other surface of the first conductivity type semiconductor substrate; a passivation film disposed in contact with the surface of the second conductivity type semiconductor layer; A solar cell comprising a light incident side surface electrode disposed on at least a part of the surface of the passivation film, the light-incidence-side surface electrode is configured to have a back surface electrode such that a current flows in a direction opposite to the forward direction between the second conductivity type semiconductor layer and the first conductivity type semiconductor substrate; The light incidence side surface electrode is treated to irradiate the light incidence side surface of the solar cell with light from a point light source while applying a voltage between the light incidence side surface electrode and the light incidence side surface electrode, The solar cell is a solar cell in which the light incident side surface electrode is a fired body of the conductive paste according to any one of Structures 1 to 10.
• Configuration 13 is a first conductivity type crystalline silicon substrate; a second conductivity type silicon emitter layer disposed on one surface of the first conductivity type crystalline silicon substrate; a back electrode arranged to be electrically connected to the other surface of the first conductivity type crystalline silicon substrate; a passivation film disposed in contact with a surface of the second conductivity type silicon emitter layer; A solar cell comprising a light incident side surface electrode containing silver disposed on at least a part of the surface of the passivation film, the second conductivity type silicon emitter layer has a local conduction portion that is in direct contact with the light incident side surface electrode without a passivation film; the local conduction portion includes an alloy of silver and silicon,
• the solar cell is a solar cell in which the light incident side surface electrode is a fired body of a conductive paste according to any one of Structures 1 to 10.
• Configuration 14 is a method for manufacturing a solar cell, comprising: preparing a semiconductor substrate of a first conductivity type; forming a second conductivity type semiconductor layer on one surface of the first conductivity type semiconductor substrate; forming a back electrode so as to be electrically connected to the other surface of the first conductivity type semiconductor substrate; forming a passivation film in contact with a surface of the second conductivity type semiconductor layer; forming a light incident side surface electrode on at least a part of the surface of the passivation film; The back surface electrode and the light incident side surface electrode are arranged such that a current flows in a direction opposite to the forward direction between the second conductivity type semiconductor layer and the first conductivity type semiconductor substrate.
• Configuration 14 is the use of the conductive paste of any of Configurations 1 to 11 to form an electrode of a solar cell.
• the present invention it is possible to provide a method for manufacturing a high-performance crystalline silicon solar cell using a conductive paste suitable for forming electrodes by a laser treatment process. Further, according to the present invention, it is possible to provide a high-performance crystalline silicon solar cell manufactured by a manufacturing method including formation of electrodes by a laser treatment process.
• 1 is an example of a schematic cross-sectional view showing a structure in which a light-incidence side surface electrode is formed on the light-incidence side surface of a crystalline silicon solar cell by a laser treatment process using the conductive paste of the present embodiment. It is an example of the schematic diagram of the light-incidence side surface of a crystalline silicon solar cell. It is an example of a schematic diagram of the back side of a crystalline silicon solar cell. 1 is an example of a schematic cross-sectional view of a double-sided crystalline silicon solar cell using the conductive paste of the present embodiment.
• FIG. 3 is a schematic cross-sectional view showing a state in which the image disappears due to fire-through.
• FIG. 3 is a schematic plan view showing a resistivity measurement pattern for an electrode formed using a conductive paste.
• FIG. 2 is a schematic plan view showing a contact resistance measurement pattern for an electrode formed using a conductive paste.
• FIG. 2 is a schematic plan view showing a measurement pattern of a photoluminescence imaging method (PL method) for an electrode formed using a conductive paste.
• PL method photoluminescence imaging method
• crystalline silicon includes single crystal and polycrystalline silicon.
• crystalline silicon substrate refers to a material formed from crystalline silicon into a shape suitable for forming an element, such as a flat plate, for forming a semiconductor device such as an electric element or an electronic element. Any method may be used to produce crystalline silicon. For example, the Czochralski method can be used in the case of single crystal silicon, and the casting method can be used in the case of polycrystalline silicon. Further, polycrystalline silicon ribbons produced by other manufacturing methods, such as a ribbon pulling method, polycrystalline silicon formed on a different type of substrate such as glass, etc. can also be used as the crystalline silicon substrate. Moreover, a "crystalline silicon solar cell” refers to a solar cell produced using a crystalline silicon substrate.
• glass frit is mainly composed of multiple types of oxides, such as metal oxides, and is generally used in the form of glass-like particles.
• This embodiment is a conductive paste for forming electrodes of solar cells.
• the conductive paste of this embodiment includes (A) conductive particles, (B) an organic vehicle, and (C) glass frit.
• the conductive paste of this embodiment is characterized in that the basicity of the (C) glass frit and the content of the (C) glass frit in the conductive paste are appropriately controlled.
• FF fill factor
• Voc open circuit voltage
• Jsc short circuit current
• FF and Voc are in a trade-off relationship, and it is difficult to increase both FF and Voc at the same time.
• Patent Documents 1 and 2 disclose that by employing a laser processing process when manufacturing a crystalline silicon solar cell, a grid-shaped electrode that is a light incident side surface electrode and an impurity diffusion layer (emitter layer) are formed. It is described that the contact resistance between the light incident side surface electrode and the impurity diffusion layer can be significantly lowered by improving the ohmic contact behavior between them. Therefore, by performing the laser treatment process, FF can be improved without reducing Voc.
• the present inventors found that when a laser treatment process was applied to a solar cell in which a light incident side surface electrode was formed using a conventional conductive paste (for example, the conductive paste described in Patent Document 3), It has been found that this has an adverse effect on the antireflection film (passivation film) and the impurity diffusion layer (and substrate), resulting in a decrease in the conversion efficiency of the solar cell. Further, the present inventors have discovered that the cause is that the fire-through property (reactivity) of the conventional conductive paste to the antireflection film (passivation film) is too strong.
• a conventional conductive paste for example, the conductive paste described in Patent Document 3
• the present inventors have found that by adjusting the basicity and content of the glass frit to an appropriate range, the reactivity of the glass frit to an antireflection film (passivation film) can be made appropriate. . Having obtained the above knowledge, the present inventors have discovered a conductive paste that can be preferably used during the production of crystalline silicon using a laser treatment process, and have arrived at the present invention.
• the conductive paste of this embodiment can be preferably used to form a light incident side surface electrode by a laser treatment process when manufacturing a crystalline silicon solar cell.
• the antireflection film 2 is basically not fired through when forming the light incident side surface electrode 20. Furthermore, even if the light-incidence-side surface electrode 20 is subjected to a laser treatment process, most of the antireflection film 2 (passivation film) in contact with the light-incidence-side surface electrode 20 does not disappear. In other words, most of the area between the light incident side surface electrode 20 and the impurity diffusion layer 4 (for example, 90% or more of the area of the interface) is The antireflection film 2 (passivation film) is present in a portion (preferably a portion of 95% or more, more preferably a portion of 99% or more). Therefore, by using a laser treatment process when forming the light incident side surface electrode 20, damage to the impurity diffusion layer 4 can be suppressed.
• a finger electrode 20b is arranged as a light-incidence side surface electrode 20 on the light-incidence side surface of the crystalline silicon solar cell.
• the holes among the electron-hole pairs generated by the incident light incident on the crystalline silicon solar cell pass through the impurity diffusion layer 4 (for example, the p-type impurity diffusion layer 4), and then pass through the finger It is collected at the electrode 20b. Therefore, the contact resistance between the finger electrode 20b and the impurity diffusion layer 4 is required to be low.
• the conductive paste of this embodiment can be preferably used for forming the finger electrodes 20b.
• the light-incidence side surface electrode 20 and the back surface electrode 15, which are electrodes for extracting current from the crystalline silicon solar cell to the outside, may be collectively referred to as “electrodes.”
• One type of crystalline silicon solar cell is a double-sided power generation type crystalline silicon solar cell that generates power by inputting light from two surfaces (first and second light incident side surfaces).
• electrodes formed on the first and second light incident side surfaces can be preferably used using the conductive paste of this embodiment.
• the conductive paste of this embodiment is preferable for forming the light incident side surface electrode 20 formed on the surface (light incident side surface) of the antireflection film 2 (passivation film) formed on the impurity diffusion layer.
• the back electrode 15 may be formed on the surface (back surface) opposite to the light incident side surface using the conductive paste of this embodiment.
• a passivation film is formed on the back surface of a crystalline silicon solar cell, and a back electrode 15 may be formed on the passivation film.
• the conductive paste of this embodiment is used to connect the back electrode 15 and the crystalline silicon substrate 1 of the solar cell through the passivation film on the back surface. electrical contact can be made to the
• the impurity diffusion layer 4 formed on the light incident side surface is a p-type impurity diffusion layer 4.
• the impurity diffusion layer 4 in the case of a solar cell using the crystalline silicon substrate 1 is sometimes referred to as a "silicon emitter layer.”
• an antireflection film 2 is formed on the surface of the p-type impurity diffusion layer 4.
• the passivation film can be a single layer or a multilayer film.
• the passivation film is a single layer, it is preferably a thin film made of silicon nitride (SiN) (SiN film) because it can effectively passivate the surface of the silicon substrate.
• the passivation film has multiple layers, it can be a laminated film (SiN/SiO x film) of a thin film made of silicon nitride and a thin film made of silicon oxide.
• the SiN/SiO x film is a passivation film, the SiN / SiO It is preferable to form.
• the SiO x film may be a natural oxide film of a silicon substrate.
• a crystalline silicon solar cell can have a light incident side bus bar electrode 20a and/or a back TAB electrode 15a.
• the light incident side bus bar electrode 20a has the function of electrically connecting the finger electrode 20b for collecting current generated by the solar cell and the metal ribbon for interconnection.
• the back TAB electrode 15a has the function of electrically connecting the back surface entire surface electrode 15b for collecting current generated by the solar cell and the metal ribbon for interconnect. If the finger electrode 20b comes into contact with the crystalline silicon substrate 1, the surface defect density of the surface (interface) of the crystalline silicon substrate 1 in the portion in contact with the finger electrode 20b will increase, and the solar cell performance will deteriorate. .
• the conductive paste of the present invention especially as a conductive paste for the finger electrode 20b, has low fire-through property (reactivity) with respect to the anti-reflection film 2, and thus does not completely fire-through the anti-reflection film 2. Therefore, when the finger electrode 20b is formed using the conductive paste of the present invention, the passivation film in the portion in contact with the crystalline silicon substrate 1 can be maintained as it is, and this can prevent recombination of carriers. This can prevent an increase in surface defect density. Therefore, the conductive paste of this embodiment described above can be suitably used as a conductive paste for forming the finger electrodes 20b of a crystalline silicon solar cell. The conductive paste of this embodiment can also be suitably used as a back electrode 15 (back finger electrode 15c) of a double-sided crystalline silicon solar cell, as shown in FIG. Further, the entire electrode 20 can be formed using the conductive paste of this embodiment.
• the conductive paste of this embodiment is formed by applying the above-mentioned predetermined voltage and irradiating it with light from a point light source, thereby forming the conductive paste between the light incident side surface electrode 20 and the impurity diffusion layer 4 (silicon emitter layer). ), current flows through the small area between the two, causing local heating.
• an AgSi alloy 30, which is a local electrically conductive portion (locally conductive portion), is formed in the impurity diffusion layer 4 (silicon emitter layer) in contact with the light incident side surface electrode 20. .
• the conductive paste used to form the light incident side surface electrode by the laser treatment process needs to have properties different from conventional conductive pastes (conductive pastes that can fire through the anti-reflection film 2). It is.
• the conductive paste of this embodiment includes (A) conductive particles.
• metal particles or alloy particles can be used as the conductive particles.
• the metal contained in the metal particles or alloy particles include silver, gold, copper, nickel, zinc, and tin.
• Silver particles (Ag particles) can be used as the metal particles.
• the conductive paste of this embodiment can contain metals other than silver, such as gold, copper, nickel, zinc, and tin. From the viewpoint of obtaining low electrical resistance and high reliability, the conductive particles are preferably silver particles made of silver. Note that the silver particles made of silver can contain other metal elements as unavoidable impurities. Further, a large number of silver particles (Ag particles) may be referred to as silver powder (Ag powder). The same applies to other particles.
• the particle shape and particle size (also referred to as particle diameter or particle size) of the conductive particles are not particularly limited.
• the particle shape may be, for example, spherical or scale-like.
• the particle size of the conductive particles can be defined by the particle size of 50% of the integrated value of all particles (D50).
• D50 is also referred to as average particle diameter. Note that the average particle diameter (D50) can be determined from the results of particle size distribution measurement by a microtrack method (laser diffraction scattering method).
• the average particle diameter (D50) of the conductive particles is preferably 0.5 to 2.5 ⁇ m, more preferably 0.8 to 2.2 ⁇ m.
• the average particle diameter (D50) of the conductive particles is within a predetermined range, the reactivity of the conductive paste with respect to the passivation film can be suppressed during firing of the conductive paste. Note that if the average particle diameter (D50) is larger than the above range, problems such as clogging may occur during screen printing.
• the size of the silver particles can be expressed as a BET specific surface area (also simply referred to as "specific surface area").
• the BET specific surface area of the silver particles is preferably 0.1 to 1.5 m 2 /g, more preferably 0.2 to 1.2 m 2 /g.
• the BET specific surface area can be measured using, for example, a fully automatic specific surface area measuring device Macsoeb (manufactured by MOUNTEC).
• the conductive paste of this embodiment includes (B) an organic vehicle.
• the organic vehicle can include an organic binder and a solvent.
• the organic binder and the solvent play a role such as adjusting the viscosity of the conductive paste, and neither is particularly limited. It is also possible to use an organic binder dissolved in a solvent.
• the organic vehicle contains at least one selected from ethyl cellulose, rosin ester, acrylic, and an organic solvent.
• screen printing of the conductive paste can be suitably performed, and the shape of the printed pattern can be appropriately controlled. It can be made into a shape.
• the organic binder can be selected from cellulose resins (for example, ethyl cellulose, nitrocellulose, etc.) and (meth)acrylic resins (for example, polymethyl acrylate, polymethyl methacrylate, etc.). It is preferable that the organic vehicle contained in the conductive paste of this embodiment contains at least one selected from ethyl cellulose, rosin ester, butyral, acrylic, and an organic solvent.
• the amount of the organic binder added is usually 0.1 to 30 parts by weight, preferably 0.2 to 5 parts by weight, per 100 parts by weight of silver particles.
• organic solvents examples include alcohols (for example, terpineol, ⁇ -terpineol, ⁇ -terpineol, etc.), esters (for example, esters containing a hydroxyl group, 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate,
• alcohols for example, terpineol, ⁇ -terpineol, ⁇ -terpineol, etc.
• esters for example, esters containing a hydroxyl group, 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate
• One or more types can be selected and used from diethylene glycol monobutyl ether acetate (butyl carbitol acetate, etc.).
• the amount of the solvent added is usually 0.5 to 30 parts by weight, preferably 2 to 25 parts by weight, per 100 parts by weight of silver particles.
• a specific example of the organic solvent is diethylene glycol monobutyl ether
• the conductive paste of this embodiment includes (C) glass frit.
• the conductive paste of the present embodiment has (C) the basicity B GF of the glass frit, and the content of (A) conductive particles in the conductive paste in parts by weight based on 100 parts by weight.
• the product B GF ⁇ G with the content G of the glass frit (C) in units of 0.25 to 1.45, preferably 0.3 to 1.4, and 0.4 to A range of 1.2 is more preferred.
• Basicity B of glass frit Product B of GF and content G By adjusting GF ⁇ G to an appropriate range, the reactivity of glass frit to antireflection film 2 (passivation film) can be made appropriate. . Therefore, the conductive paste of the embodiment can be preferably used when manufacturing crystalline silicon using a laser treatment process.
• the basicity of the glass frit can be calculated by the method described in Patent Document 4 (Japanese Unexamined Patent Publication No. 2009-231826). That is, "basicity” defines the basicity of glass powder using the formula shown in "K. Morinaga, H. Yoshida And H. Takebe: J. AmCerm. Soc., 77, 3113 (1994)". be able to. Specifically, it is as follows.
• the bonding force between M i and O of the oxide M i O is given by the following equation as the cation-oxygen ion attractive force Ai.
• the ionic radius r i of oxygen ions is 1.40 nm.
• the basicity (B GF ) defined in this way represents the oxygen donating ability as described above, and the larger the value, the easier it is to donate oxygen, and the easier it is for oxygen to be exchanged with other metal oxides. That is, "basicity" can be said to represent the degree of dissolution into a glass melt.
• the basicity (B GF ) of the glass frit of this embodiment is preferably from 0.30 to less than 0.80, more preferably from 0.35 to 0.75, and from 0.40 to 0.70. It is more preferable that When the basicity (B GF ) is within this range, the reactivity of the glass frit to the passivation film can be made appropriate by adjusting the amount of glass frit added in the conductive paste. .
• the content G of glass frit in the conductive paste of this embodiment is preferably 0.3 to 4.0 parts by weight, and 0.4 to 3.0 parts by weight, based on 100 parts by weight of the conductive particles. parts by weight, even more preferably from 0.5 to 2.0 parts by weight, and particularly preferably from 0.5 to 1.5 parts by weight.
• the glass frit included in the conductive paste of this embodiment is one or more selected from PbO, SiO 2 , Al 2 O 3 , B 2 O 3 , ZnO, V 2 O 5 , WO 3 and Nb 2 O 3 It is preferable to include.
• the glass frit included in the conductive paste of this embodiment more preferably contains PbO, SiO 2 , Al 2 O 3 , B 2 O 3 and ZnO.
• the glass frit (C) preferably contains at least one selected from ZnO, V 2 O 5 , WO 3 and Nb 2 O 3 .
• the basicity of the glass frit can be adjusted to an appropriate range.
• the glass frit contains PbO.
• the content of PbO in the glass frit (100 mol%) is preferably 25 to 60 mol%, more preferably 30 to 55 mol%, and even more preferably 40 to 55 mol%.
• the glass frit contains SiO2 .
• the content of SiO 2 in the glass frit (100 mol%) is preferably 20 to 65 mol%, more preferably 25 to 60 mol%.
• SiO 2 in the glass frit By including SiO 2 in the glass frit, reactivity to the passivation film can be suppressed.
• the glass frit contains Al 2 O 3 .
• the content of Al 2 O 3 in the glass frit (100 mol%) is preferably 3.0 to 6.8 mol%, more preferably 3.5 to 6 mol%.
• the glass frit contains B2O3 .
• the content of B 2 O 3 in the glass frit (100 mol%) is preferably 3.0 to 15 mol%, more preferably 3.5 to 12 mol%.
• the glass frit contains ZnO.
• the content of ZnO in the glass frit (100 mol%) is preferably 5 to 20 mol%, more preferably 8 to 15 mol%.
• the basicity of the glass frit can be adjusted to an appropriate range.
• the conductive paste of the present embodiment has a product of (C) PbO content C PbO in mol% in the glass frit and (C) content G of the glass frit C PbO ⁇ G of 20 to 139. It is preferably in the range of , more preferably in the range of 22 to 130, even more preferably in the range of 26 to 105. If the product C PbO.G exceeds 139, the reactivity between the glass frit and the passivation film becomes too high. Further, if the product C PbO.G is less than 20, the contact resistance between the obtained electrode and the impurity diffusion layer becomes too high.
• the glass transition point (Tg) of the glass frit (C) is preferably 300 to 600°C, more preferably 320 to 500°C, and more preferably 350 to 450°C. is even more preferable.
• (C) Reactivity to the passivation film can be suppressed by setting the glass transition point (Tg) of the glass frit to 300° C. or higher. Further, by setting the glass transition point (Tg) to 600° C. or lower, the contact resistance between the obtained electrode and the impurity diffusion layer can be reduced.
• the glass transition point (Tg) can be measured as follows. That is, using a differential thermal balance (TG-DTA2000S manufactured by Mac Science Co., Ltd.), the sample glass powder and the reference material were set on the differential thermal balance, and the temperature was raised at a heating rate of 10°C/min as the measurement conditions. The temperature is raised from room temperature to 900° C. to obtain a curve (DTA curve) in which the temperature difference between the sample glass powder and the reference material is plotted against temperature. The first inflection point of the DTA curve obtained in this way can be set as the glass transition point Tg.
• TG-DTA2000S manufactured by Mac Science Co., Ltd.
• the shape of the glass frit particles is not particularly limited, and for example, spherical, irregular shapes, etc. can be used. Further, the particle size is not particularly limited either. From the viewpoint of workability, etc., the average particle diameter (D50) of the particles is preferably in the range of 0.1 to 10 ⁇ m, more preferably in the range of 0.5 to 5 ⁇ m.
• the glass frit particles one type of particles each containing a predetermined amount of a plurality of necessary oxides can be used. Furthermore, particles made of a single oxide can be used as different particles for each of a plurality of required oxides. Further, it is also possible to use a combination of plural types of particles having different compositions of the plurality of required oxides.
• the conductive paste may further include (D) aluminum particles.
• (D) Aluminum particles can be included as particles separate from (A) conductive particles.
• aluminum has properties as a p-type impurity.
• the conductive paste printed on the crystalline silicon is fired, aluminum in the conductive paste diffuses into the crystalline silicon and becomes a p-type impurity. Therefore, when forming an electrode on the surface of a p-type impurity diffusion layer of a crystalline silicon substrate, the conductive paste contains aluminum particles to maintain low contact resistance between the electrode and the p-type impurity diffusion layer. Obtainable. Therefore, when forming an electrode on the surface of a p-type impurity diffusion layer of a crystalline silicon substrate, it is preferable that the conductive paste contains aluminum particles.
• the conductive paste of the present embodiment contains (D) aluminum particles
• the content of particles is preferably 0.1 to 2.0 parts by weight, more preferably 0.5 to 2.0 parts by weight.
• the conductive paste contains a predetermined amount of aluminum particles, low contact resistance can be obtained between the electrode and the p-type impurity diffusion layer.
• the conductive paste of this embodiment should (D) not contain aluminum particles (( D) The content of aluminum particles is zero) is preferred.
• the aluminum particles mainly contain the element aluminum.
• the purity of aluminum in the aluminum particles is, for example, preferably 99.7% or more, more preferably 99.9% or more.
• the aluminum particles can contain impurities other than aluminum, for example, other metal elements that are inevitably included. Further, the aluminum particles can include alloys of aluminum and other metal elements, oxides of aluminum, and the like.
• the shape of the aluminum particles is exemplified by spherical or ellipsoidal shapes, but is not limited to these. From the viewpoint of good printability and good reaction with the semiconductor substrate, the shape of the aluminum particles is preferably spherical.
• the average particle diameter (D50) of the aluminum particles is also not particularly limited. It is preferable that the average particle diameter (D50) of the aluminum particles is 1 ⁇ m or more and 20 ⁇ m or less because the printability of the paste composition is improved and the reactivity with the semiconductor substrate is also improved. More preferably, the average particle diameter (D50) of the aluminum particles is 2 to 4 ⁇ m.
• the conductive paste of this embodiment can contain additives and additives other than those described above, within a range that does not adversely affect the solar cell characteristics of the resulting solar cell.
• the conductive paste of this embodiment may further contain additives selected from plasticizers, antifoaming agents, dispersants, leveling agents, stabilizers, adhesion promoters, etc. as necessary. .
• additives selected from plasticizers, antifoaming agents, dispersants, leveling agents, stabilizers, adhesion promoters, etc.
• plasticizers at least one selected from phthalic acid esters, glycolic acid esters, phosphoric acid esters, sebacic acid esters, adipic acid esters, citric acid esters, etc.
• phthalic acid esters glycolic acid esters
• phosphoric acid esters phosphoric acid esters
• sebacic acid esters phosphoric acid esters
• adipic acid esters citric acid esters, etc.
• the conductive paste of the present embodiment can contain additives other than those described above, as long as they do not adversely affect the solar cell characteristics of the resulting solar cell.
• the conductive paste of the present embodiment further includes at least one additive selected from titanium resinate, titanium oxide, cobalt oxide, cerium oxide, silicon nitride, copper manganese tin, aluminosilicate, and aluminum silicate. I can do it.
• these additives can be in the form of particles (additive particles).
• the amount of additive added to 100 parts by weight of silver particles is preferably 0.01 to 5 parts by weight, more preferably 0.05 to 2 parts by weight.
• the additive is preferably copper manganese tin, aluminosilicate or aluminum silicate.
• Additives can include both aluminosilicates and aluminum silicates.
• the conductive paste of this embodiment is manufactured by adding silver particles, glass frit, and other additives and/or additives as necessary to an organic binder and a solvent, mixing them, and dispersing them. be able to.
• Mixing can be performed, for example, with a planetary mixer. Dispersion can also be carried out using a three-roll mill. Mixing and dispersion are not limited to these methods, and various known methods can be used.
• This embodiment is a solar cell in which at least a part of the electrode is formed using the above-mentioned conductive paste.
• 1 and 4 show schematic cross-sectional views of crystalline silicon solar cells.
• crystalline silicon, silicon carbide, germanium, gallium arsenide, etc. can be used as the material for the semiconductor substrate.
• the material of the semiconductor substrate is preferably crystalline silicon (monocrystalline silicon, polycrystalline silicon, etc.).
• the solar cell of this embodiment includes a semiconductor substrate of a first conductivity type, a semiconductor layer of a second conductivity type disposed on one surface of the semiconductor substrate of the first conductivity type, and a semiconductor layer of a second conductivity type disposed on one surface of the semiconductor substrate of the first conductivity type. It includes a passivation film (antireflection film 2) disposed in contact with the surface of the semiconductor layer, and a light incident side surface electrode 20 disposed on at least a portion of the surface of the passivation film. Moreover, the solar cell of this embodiment can include the back electrode 15 arranged so as to be electrically connected to the other surface of the semiconductor substrate of the first conductivity type.
• the first conductivity type semiconductor substrate is a crystalline silicon substrate 1
• the second conductivity type semiconductor layer is an impurity diffusion layer 4
• the passivation film is an antireflection film 2.
• the first conductivity type semiconductor substrate is an n-type semiconductor substrate or a p-type semiconductor substrate.
• the second conductivity type semiconductor layer is a p-type semiconductor layer or an n-type semiconductor layer.
• a p-type semiconductor layer (p-type impurity diffusion layer 4) is arranged on one surface of the semiconductor substrate.
• an n-type semiconductor layer is arranged on one surface of the semiconductor substrate.
• the material of the semiconductor substrate is preferably silicon. Therefore, the semiconductor substrate is preferably a crystalline silicon substrate.
• the passivation film can be an antireflection film 2.
• the passivation film is preferably a thin film made of silicon nitride.
• the light incident side surface electrode 20 of the solar cell of this embodiment can be a fired body of the conductive paste of this embodiment.
• the conductive paste of this embodiment can be used to manufacture a solar cell having this structure.
• the conductive paste of this embodiment can be preferably used to form the light incident side surface electrode 20 of a crystalline silicon solar cell using a laser treatment process.
• the laser treatment process means that a back electrode 15 is formed between the second conductivity type semiconductor layer and the first conductivity type semiconductor substrate so that a current flows in the opposite direction to the forward direction in the pn junction.
• This refers to a process in which light from a point light source is applied to the light incident side surface of the solar cell while applying a voltage to the light incident side surface electrode 20.
• the light from the point light source generates carriers (electron-hole pairs) inside the semiconductor substrate, and application of a voltage makes it possible to move the carriers, that is, to cause current to flow.
• the voltage is applied so that the direction of current flow in the pn junction is opposite to the forward direction. Therefore, when the semiconductor substrate is an n-type semiconductor substrate and the semiconductor layer is a p-type semiconductor layer, the back electrode 15 and the light incident side surface are A voltage is applied to the electrode 20. Further, when the semiconductor substrate is a p-type semiconductor substrate and the semiconductor layer is an n-type semiconductor layer, the back electrode 15 and the light incident side surface are arranged so that the current flows from the n-type semiconductor layer to the p-type semiconductor substrate. A voltage is applied to the electrode 20.
• the first conductivity type semiconductor substrate of the solar cell of this embodiment is preferably an n-type semiconductor substrate, and more preferably an n-type crystalline silicon substrate.
• the second conductivity type semiconductor layer of the solar cell of this embodiment is preferably a p-type semiconductor layer, and more preferably a p-type impurity diffusion layer 4 made of crystalline silicon.
• the mobility of electrons, which are carriers, in an n-type crystalline silicon substrate is higher than the mobility of holes, which are carriers, in a p-type crystalline silicon substrate. Therefore, in order to obtain a solar cell with high conversion efficiency, it is advantageous to use an n-type crystalline silicon substrate.
• the first conductivity type semiconductor substrate is an n-type crystalline silicon substrate 1
• the second conductivity type semiconductor layer is a p-type impurity diffusion layer 4 (sometimes simply referred to as "impurity diffusion layer 4"). This will be explained using a solar cell as an example.
• an antireflection film 2 (passivation film) exists in most of the space between the light incident side surface electrode 20 and the impurity diffusion layer 4.
• the above-mentioned predetermined voltage is applied so that a current flows in the opposite direction to the forward direction in the pn junction, and light from a point light source (for example, laser light) is irradiated on the light incident side.
• a current flows through a small region between the surface electrode 20 and the impurity diffusion layer 4, and the region is locally heated.
• an AgSi alloy 30 (alloy of silver and silicon) which is a locally electrically conductive part (locally conductive part) is formed between the light incident side surface electrode 20 and the impurity diffusion layer 4. is formed. That is, the local conduction portion includes an alloy of silver and silicon. Further, in the local conduction section, the impurity diffusion layer 4 (second conductivity type silicon emitter layer) is in direct contact with the light incident side surface electrode without interposing the antireflection film 2 (passivation film). This locally formed electrically conductive portion (locally conductive portion) enables good electrical conduction between the light incident side surface electrode 20 and the impurity diffusion layer 4.
• the conductive paste of this embodiment has lower reactivity with the antireflection film 2 than conventional conductive pastes, and has a reactivity with the antireflection film 2 (passivation film) suitable for the laser treatment process. Therefore, the conductive paste of this embodiment can be preferably used to form the light incident side surface electrode 20 of a crystalline silicon solar cell using a laser treatment process.
• the crystalline silicon solar cell shown in FIG. 1 can have a back electrode 15 having the structure shown in FIG. 3.
• the back electrode 15 is arranged so as to be electrically connected to the other surface of the first conductivity type semiconductor substrate.
• the back electrode 15 can generally include a back full surface electrode 15b and a back TAB electrode 15a electrically connected to the back full surface electrode 15b.
• FIG. 4 shows an example of a cross-sectional schematic diagram of a bifacial type crystalline silicon solar cell.
• the double-sided crystalline silicon solar cell shown in FIG. 4 includes an impurity diffusion layer 4, an antireflection film 2, and a back passivation film 14.
• the method of this embodiment is used.
• a conductive paste it is possible to form an electrically conductive part (local conductive part) in the passivation film (antireflection film 2) on the light incident side surface and the back surface passivation film 14 using a laser treatment process. .
• the conductive paste of this embodiment described above can be suitably used as a conductive paste for forming the finger electrodes 20b of a crystalline silicon solar cell. Further, the conductive paste of this embodiment can also be used as a conductive paste for forming the back electrode 15 of a double-sided crystalline solar cell.
• the busbar electrode of the crystalline silicon solar cell shown in FIG. 1 includes a light incident side busbar electrode 20a shown in FIG. 2 and a back TAB electrode 15a as shown in FIG.
• a metal ribbon for interconnection whose periphery is covered with solder is soldered to the light incident side bus bar electrode 20a and the back surface TAB electrode 15a.
• This metal ribbon allows the current generated by the solar cell to be extracted to the outside of the crystalline silicon solar cell.
• the double-sided crystalline solar cell shown in FIG. 4 can also have a light incident side bus bar electrode 20a and a back TAB electrode having the same shape as the light incident side bus bar electrode 20a.
• the width of the busbar electrode (the light incident side busbar electrode 20a and the back TAB electrode 15a) can be approximately the same width as the metal ribbon for interconnect. In order for the busbar electrode to have low electrical resistance, it is preferable that the width be wide. On the other hand, in order to increase the light incident area on the light incident side surface, it is better that the width of the light incident side bus bar electrode 20a is narrower. Therefore, the busbar electrode width can be set to 0.05 to 5 mm, preferably 0.08 to 3 mm, more preferably 0.1 to 2 mm, and still more preferably 0.15 to 1 mm. Furthermore, the number of busbar electrodes can be determined depending on the size of the crystalline silicon solar cell. The number of busbar electrodes is arbitrary.
• the number of busbar electrodes can be three, four, or more.
• the optimal number of busbar electrodes can be determined by simulating solar cell operation so as to maximize the conversion efficiency of the crystalline silicon solar cell. Note that since the crystalline silicon solar cells are connected in series with each other by the interconnect metal ribbon, it is preferable that the numbers of the light incident side bus bar electrodes 20a and the back surface TAB electrodes 15a are the same. For the same reason, it is preferable that the widths of the light incident side bus bar electrode 20a and the back surface TAB electrode 15a are the same.
• the area occupied by the light incident side surface electrode 20 on the light incident side surface is preferably as small as possible. Therefore, it is preferable that the finger electrodes 20b on the light incident side surface have a width as narrow as possible and a small number of finger electrodes. On the other hand, from the viewpoint of reducing electrical loss (ohmic loss), it is preferable that the finger electrodes 20b have a wide width and a large number of finger electrodes 20b. Further, from the viewpoint of reducing the contact resistance between the finger electrode 20b and the crystalline silicon substrate 1 (impurity diffusion layer 4), it is preferable that the width of the finger electrode 20b is wide.
• the number of busbar electrodes can be determined depending on the size of the crystalline silicon solar cell and the width of the busbar electrode.
• the optimum width and number of finger electrodes 20b can be determined by simulation of solar cell operation so as to maximize the conversion efficiency of the crystalline silicon solar cell.
• the width and number of back finger electrodes 15c of the back electrode 15 of the double-sided crystalline silicon solar cell shown in FIG. 4 can be similarly determined.
• the solar cell can be a crystalline silicon solar cell.
• the solar cell is a crystalline silicon solar cell.
• the method for manufacturing a solar cell of this embodiment includes printing the above-mentioned conductive paste on the surface of the antireflection film 2 on the second conductivity type semiconductor layer (impurity diffusion layer 4), drying it, and baking it. This includes the step of forming an electrode (light incident side surface electrode) by doing this.
• an electrode light incident side surface electrode
• the method for manufacturing a solar cell of this embodiment includes the step of preparing a first conductivity type (p-type or n-type) semiconductor substrate (for example, crystalline silicon substrate 1).
• a first conductivity type semiconductor substrate for example, crystalline silicon substrate 1.
• a case where a crystalline silicon solar cell is manufactured using an n-type crystalline silicon substrate 1 will be described as an example.
• the surface of the crystalline silicon substrate 1 on the light incident side has a pyramid-shaped texture structure.
• the method for manufacturing a solar cell of this embodiment includes a step of forming a second conductivity type semiconductor layer on one surface of the first conductivity type semiconductor substrate.
• the method for manufacturing a crystalline silicon solar cell according to the present embodiment includes a step of forming a second conductivity type semiconductor layer (impurity diffusion layer 4) on one surface of the crystalline silicon substrate 1 prepared in the above-mentioned step.
• a second conductivity type semiconductor layer impurity diffusion layer 4
• a p-type impurity diffusion layer 4 in which a p-type impurity such as B (boron) is diffused is formed as the impurity diffusion layer 4.
• a p-type impurity diffusion layer 4 in which an n-type impurity such as B (boron) is diffused is formed as the impurity diffusion layer 4.
• a p-type impurity diffusion layer 4 in which an n-type impurity such as P (phosphorus) is diffused is formed as an impurity diffusion layer.
• the impurity diffusion layer 4 When forming the impurity diffusion layer 4, it can be formed so that the sheet resistance of the impurity diffusion layer 4 is 40 to 150 ⁇ /square, preferably 45 to 120 ⁇ /square.
• the depth at which the impurity diffusion layer 4 is formed can be 0.3 ⁇ m to 1.0 ⁇ m.
• the depth of the impurity diffusion layer 4 refers to the depth from the surface of the impurity diffusion layer 4 to the pn junction.
• the depth of the pn junction can be set to a depth from the surface of the impurity diffusion layer 4 until the impurity concentration in the impurity diffusion layer 4 becomes the impurity concentration of the substrate.
• the method for manufacturing a solar cell according to the present embodiment includes a step of forming a back electrode 15 so as to be electrically connected to the other surface of the first conductivity type semiconductor substrate (n-type crystalline silicon substrate).
• the back electrode 15 can be formed either before or after the light incident side surface electrode 20 is formed.
• the firing for forming the back electrode 15 can be performed simultaneously with or separately from the firing for forming the light incident side front electrode 20.
• the method for manufacturing a crystalline silicon solar cell according to the present embodiment includes printing a conductive paste on the other surface (back surface) of the crystalline silicon substrate 1 and baking it to form the back electrode 15. do.
• the second impurity diffusion layer 16 can be formed.
• the back electrode 15 using the conductive paste (conductive composition) of this embodiment and performing a laser treatment process, a low resistance is created between the back electrode 15 and the crystalline silicon substrate 1. A conductive portion can be formed. Therefore, in the case of a double-sided crystal solar cell, it is preferable to form the back electrode 15 using the conductive paste of this embodiment. In this case, the back electrode 15 is a fired body of the conductive paste of this embodiment.
• the method for manufacturing a solar cell of this embodiment includes forming a passivation film in contact with the surface of the second conductivity type semiconductor layer (impurity diffusion layer 4).
• the passivation film can be an anti-reflection film 2.
• an antireflection film 2 that also functions as a passivation film is formed on the surface of the impurity diffusion layer 4 formed in the above steps.
• a silicon nitride film SiN film
• the silicon nitride film layer also functions as a passivation film on the light incident side surface. Therefore, when a silicon nitride film is used as the antireflection film 2, a high-performance crystalline silicon solar cell can be obtained.
• the antireflection film 2 is a silicon nitride film, it can exhibit an antireflection function against incident light.
• the silicon nitride film can be formed by a PECVD (Plasma Enhanced Chemical Vapor Deposition) method or the like.
• the method for manufacturing a solar cell of this embodiment includes a step of forming a light incident side surface electrode 20 on at least a portion of the surface of the passivation film (antireflection film 2).
• the above-mentioned conductive paste is used to form the light incident side surface electrode 20. Therefore, the light incident side surface electrode 20 is a fired body of the above-mentioned conductive paste.
• the light incident side surface electrode 20 is formed by printing a conductive paste on the surface of the antireflection film 2 and baking it. Note that during the firing for forming the light-incident-side front surface electrode 20, the firing for forming the back surface electrode 15 can be performed at the same time.
• the pattern of the light incident side surface electrode 20 printed using the conductive paste of this embodiment is dried at a temperature of about 100 to 150° C. for several minutes (for example, 0.5 to 5 minutes). .
• the light incident side bus bar electrode 20a and the light incident side finger electrode 20b of the light incident side surface electrode 20 can be formed using the conductive paste of this embodiment.
• a conductive paste for forming the back surface electrode 15 is printed and dried.
• the conductive paste of the present embodiment can be preferably used to form electrodes (the light incident side surface electrode 20 and, depending on the case, the back surface electrode 15) of a solar cell such as a crystalline silicon solar cell.
• the printed conductive paste is dried and fired under predetermined firing conditions in the atmosphere using a firing furnace such as a tubular furnace.
• the firing atmosphere is air
• the firing temperature is 500 to 1000°C, more preferably 600 to 1000°C, still more preferably 500 to 900°C, particularly preferably 700 to 900°C.
• the firing is preferably carried out in a short time, and the temperature profile (temperature-time curve) during the firing is preferably peak-like.
• the in-out time of the firing furnace is preferably 10 to 100 seconds, more preferably 20 to 80 seconds, and even more preferably 40 to 60 seconds. .
• the method for manufacturing a solar cell of this embodiment includes performing the above-described laser treatment process. That is, the method for manufacturing a solar cell according to the present embodiment includes a method of manufacturing a semiconductor layer of a second conductivity type (p-type impurity diffusion layer 4) and a semiconductor substrate of a first conductivity type (n-type crystalline silicon substrate 1). While applying a voltage between the back surface electrode 15 and the light incident side surface electrode 20 so that a current flows in the opposite direction to the forward direction between them, light from a point light source (for example, laser light) is applied to the solar cell. This includes irradiating the light incident side surface. The laser treatment process enables good electrical continuity between the light incident side surface electrode 20 and the impurity diffusion layer 4.
• the crystalline silicon solar cell of this embodiment can be manufactured.
• the crystalline silicon solar cell of this embodiment obtained as described above is electrically connected with a metal ribbon for interconnection, and laminated with a glass plate, a sealing material, a protective sheet, etc., thereby forming a solar cell module.
• a metal ribbon for interconnect a metal ribbon (for example, a ribbon made of copper) whose periphery is covered with solder can be used.
• solder commercially available solders can be used, such as those whose main component is tin, specifically, leaded solder containing lead and lead-free solder.
• a high-performance crystalline silicon solar cell can be obtained by forming predetermined electrodes of the solar cell using the conductive paste of this embodiment and performing a laser treatment process. I can do it.
• a measurement substrate simulating a single-crystal silicon solar cell was used to evaluate the degree of deterioration of the passivation film by the photoluminescence imaging method (PL method), as well as the contact resistance and specific resistance of the formed electrodes. By doing so, the performance of the conductive pastes of the examples of this embodiment and the comparative examples was evaluated.
• PL method photoluminescence imaging method
• Tables 1 to 3 show the compositions of the conductive pastes of Examples 1 to 14 and Comparative Examples 1 to 4.
• the compositions shown in Tables 1 to 3 and the compositions of each component below are shown as parts by weight of each component based on 100 parts by weight of (A) silver particles.
• Each component contained in the conductive paste is as follows.
• (A) Silver particles Table 4 shows the product number, manufacturer, shape, average particle diameter (D50), TAP density, and BET specific surface area of silver particles A1 and A2 used in the conductive pastes of Examples and Comparative Examples. .
• Tables 1 to 3 show the amounts of silver particles A1 and A2 in the conductive pastes of Examples and Comparative Examples.
• the average particle diameter (D50) was determined by measuring the particle size distribution using the microtrack method (laser diffraction scattering method) and obtaining the value of the median diameter (D50) from the result of the particle size distribution measurement. The same applies to the average particle diameter (D50) of other components.
• a fully automatic specific surface area measuring device Macsoeb manufactured by MOUNTEC was used to measure the BET specific surface area.
• the BET specific surface area was measured by the BET one-point method using nitrogen gas adsorption after preliminary drying at 100° C. and flowing nitrogen gas for 10 minutes.
• (B) Organic Vehicle An organic binder and a solvent were used as the organic vehicle. Ethylcellulose (0.4 parts by weight) with an ethoxy content of 48 to 49.5% by weight was used as an organic binder. Diethylene glycol monobutyl ether acetate (butyl carbitol acetate) (3 parts by weight) was used as a solvent.
• Glass Frit Table 5 shows the composition, basicity, and glass transition point of glass frits A to G used in the conductive pastes of Examples and Comparative Examples. Note that the average particle diameter (D50) of glass frits A to G was 2 ⁇ m. Tables 1 to 3 show the type (any of A to G) of glass frit (C) and content G (parts by weight) of the conductive pastes of Examples and Comparative Examples.
• the glass transition points of glass frits A to G were measured. Table 5 shows the measured values of the glass transition points of glass frits A to G.
• the glass transition point of the glass frit was measured as follows. That is, approximately 50 mg of glass frits A to G were placed as samples in a platinum cell, and alumina powder was used as a standard sample in an atmospheric atmosphere using a differential thermal analyzer (manufactured by Rigaku Co., Ltd., TG-8120) to heat the samples from room temperature to 800 mg. DTA curves were obtained at a heating rate of 20°C/min to 0°C. The starting point (extrapolation point) of the first endotherm of the DTA curve was defined as the glass transition point.
• Glass frits A to G were manufactured as follows. That is, first, oxide powder serving as a raw material was weighed, mixed, and placed in a crucible. The crucible was placed in a heated oven, and the contents of the crucible were heated to the melt temperature and maintained at the melt temperature until the raw materials were sufficiently melted. The crucible was then removed from the oven and the molten contents were stirred evenly. Next, the contents of the crucible were rapidly cooled at room temperature using two stainless steel rolls to obtain a glass plate. Finally, glass frit with the desired particle size could be obtained by pulverizing the plate glass in a mortar to uniformly disperse it and sieving it through a mesh sieve.
• a glass frit having an average particle diameter (D50) of 149 ⁇ m can be obtained by sieving the material through a 100 mesh sieve and remaining on a 200 mesh sieve. By further pulverizing this glass frit, a glass frit having an average particle diameter (D50) of 2 ⁇ m could be obtained.
• Table 6 shows the product number, manufacturer, shape, and average particle diameter (D50) of aluminum particles D1 and D2 used in the conductive pastes of Examples and Comparative Examples.
• Tables 1 to 3 show the amounts (parts by weight) of aluminum particles D1 and D2 in the conductive pastes of Examples and Comparative Examples.
• conductive pastes of Examples and Comparative Examples were prepared by mixing the materials in the weight proportions shown in Tables 1 to 3 using a planetary mixer, and further dispersing them using a three-roll mill to form a paste.
• the reactivity of the conductive paste with respect to the passivation film was evaluated using a photoluminescence imaging method (referred to as "PL method").
• the PL method can evaluate the reactivity of a conductive paste to a passivation film in a non-destructive, non-contact manner and in a short time.
• the PL method is a method in which a sample is irradiated with light with an energy greater than the forbidden band width to cause it to emit light, and the state of defects in the crystal and surface/interface defects is evaluated from the state of the light emission. be.
• the defects act as recombination centers for electron-hole pairs generated by light irradiation, and correspondingly, the band formation due to photoluminescence occurs.
• Edge emission intensity decreases.
• the passivation film is eroded by the printed/fired electrode and a surface defect is formed at the interface between the passivation film and the single-crystal silicon substrate (i.e., the surface of the single-crystal silicon substrate), a surface defect is formed.
• the photoluminescence intensity of the portion that is, the portion of the electrode formed on the sample
• the reactivity of the prototype conductive paste with passivation can be evaluated based on the intensity of this photoluminescence.
• the method for prototyping a substrate for evaluation by the PL method is as follows.
• the substrate used was an n-type single crystal silicon substrate (substrate thickness 200 ⁇ m).
• a silicon oxide layer of about 20 ⁇ m thick was formed on the above substrate by dry oxidation, and then etched with a solution containing hydrogen fluoride, pure water, and ammonium fluoride to remove damage on the substrate surface. Furthermore, heavy metals were washed with an aqueous solution containing hydrochloric acid and hydrogen peroxide.
• a texture structure (uneven shape) was formed on both sides of this substrate by wet etching. Specifically, a pyramid-shaped texture structure was formed on both surfaces (the light incident side surface and the back surface) by wet etching (sodium hydroxide aqueous solution). Thereafter, it was washed with an aqueous solution containing hydrochloric acid and hydrogen peroxide. Next, boron was implanted into one surface (light incident side surface) of the substrate having a textured structure to form a p-type diffusion layer to a depth of about 0.5 ⁇ m. The sheet resistance of the p-type diffusion layer was 60 ⁇ / ⁇ .
• phosphorus was implanted into the other surface (back surface) having the textured structure of the substrate to form an n-type diffusion layer to a depth of about 0.5 ⁇ m.
• the sheet resistance of the n-type diffusion layer was 20 ⁇ / ⁇ . Boron and phosphorus were simultaneously implanted by thermal diffusion.
• a substrate 1 was prepared by cutting the substrate thus obtained into a square of 25 mm x 25 mm.
• a 13 mm x 13 mm square electrode pattern 22 was printed on the surface of the substrate 1 using a conductive paste for electrode formation, and dried.
• the substrate 1 with the electrode pattern 22 printed on its surface using conductive paste as described above was heated using a belt furnace (firing furnace) CDF7210 manufactured by Despatch Industries, Inc. at a peak temperature of 720°C and a firing furnace in-out time. was fired for 50 seconds.
• a belt furnace firing furnace
• Measurement by the PL method was performed using a Photoluminescence Imaging System device (model number LIS-R2) manufactured by BT Imaging.
• Light from an excitation light source (wavelength 650 nm, output 3 mW) is irradiated onto the back surface of the substrate (the surface on which the electrode pattern of the light incident side surface electrode 20 is not formed) to obtain an image of the emission intensity of photoluminescence.
• an excitation light source (wavelength 650 nm, output 3 mW) is irradiated onto the back surface of the substrate (the surface on which the electrode pattern of the light incident side surface electrode 20 is not formed) to obtain an image of the emission intensity of photoluminescence.
• Figures 9 and 10 show images of photoluminescence intensity measured by the PL method.
• FIG. 9 shows an image of the photoluminescence intensity measured by the PL method of a sample in which the electrode pattern 22 was formed using the conductive paste of Example 4.
• the image of the portion where the electrode pattern 22 is formed is brighter than in FIG. 10, which will be described later. This indicates that the reduction in the photoluminescence intensity of the portion of the light incident side surface electrode 20 where the electrode pattern was formed was suppressed. Therefore, in the case of the sample shown in FIG. 9, it can be said that the passivation function of the passivation film was maintained by forming the electrode pattern of the light incident side surface electrode 20. Therefore, in the case of the sample using the conductive paste of Example 4 shown in FIG. 9, it can be said that the surface defect density on the surface of single crystal silicon substrate 1 did not increase.
• the conductive paste of Comparative Example 1 was used to form the light incident side surface electrode 20.
• the image of the portion of the light incident side surface electrode 20 where the electrode pattern is formed is darker. This indicates that the photoluminescence intensity of the portion of the light incident side surface electrode 20 where the electrode pattern was formed was reduced. Therefore, in the case of the sample using the conductive paste of Comparative Example 1 shown in FIG. 10, by forming the electrode pattern of the light incident side surface electrode 20, the passivation function of the passivation film is impaired, It can be said that the surface defect density on the surface of the substrate 1 has increased.
• Tables 1 to 3 show the measured values (PL values) of the photoluminescence intensity of Examples and Comparative Examples.
• the PL value is the average value of the emission intensity of photoluminescence near the electrode.
• the PL value is a numerical value that varies depending on the spectrum and intensity of the irradiation light from the excitation light source, the optical system for measurement, etc., and is a value in an arbitrary unit.
• the magnitude of the PL value of each sample can be compared. It can be said that the degree of carrier recombination (degree of deterioration of passivation function) can be evaluated. It can be said that the higher the PL value, the better the passivation function of the passivation film.
• FIG. 11 shows a cross-sectional SEM photograph (magnification: :20,000 times).
• FIG. 12 shows a cross-sectional SEM photograph ( Magnification: 20,000 times).
• the antireflection film 2 in the case of a sample with a high PL value, the antireflection film 2 (passivation film) maintains almost the same shape even after the formation of the light incident side surface electrode 20, and the antireflection film 2 (passivation film) maintains almost the same shape. Film 2 (passivation film) is not eroded by the glass frit.
• FIG. 11 shows a cross-sectional SEM photograph (magnification: :20,000 times).
• the antireflection film 2 (passivation film) is eroded by the glass frit, and most of the antireflection film 2 (passivation film) has disappeared. . That is, it can be said that the conductive paste of Comparative Example 1 is a conductive paste that can fire through the passivation film. Note that the portion labeled "Glass" in FIG. 12 is a glass component resulting from the glass frit contained in the conductive paste. From the above, it is clear that the presence or absence of reactivity of the conductive paste with respect to the antireflection film 2 (passivation film) can be evaluated by measuring the PL value using the above-mentioned PL method.
• the PL values of the samples obtained using the conductive pastes (conductive compositions) of Examples 1 to 14 of the present embodiment were 5522 (Example 2) or higher.
• the PL value of Comparative Example 1 was 4900
• the PL value of Comparative Example 2 was as low as 4800. Therefore, it can be said that in Comparative Examples 1 and 2, the passivation function of the passivation film is lower than in the example of the present embodiment, so that the performance of the solar cell is degraded.
• the PL value did not change significantly before and after the laser treatment process. This is believed to be because the laser processing process is a process for locally forming minute electrically conductive parts and does not affect most of the antireflection film 2 (passivation film).
• a p-type impurity diffusion layer was formed on one surface of an n-type crystalline silicon substrate (substrate thickness 200 ⁇ m), and a film was further formed on the p-type impurity diffusion layer.
• a silicon nitride film an antireflection film 2 which is a passivation film having a thickness of about 60 nm was formed to obtain a substrate for measuring contact resistance.
• the conductive pastes shown in Tables 1 to 3 were used to form electrodes on the surface of the substrate (light incident side surface) on which the p-type diffusion layer was formed in the single-crystal silicon solar cells of Examples and Comparative Examples.
• Printing of the conductive paste was performed by screen printing method.
• a pattern consisting of a 1.5 mm wide light incident side bus bar electrode 20a and a 60 ⁇ m wide light incident side finger electrode 20b is printed so that the film thickness is about 20 ⁇ m, Thereafter, it was dried at 150° C. for about 1 minute.
• the back electrode 15 (the electrode on the front surface on which the n-type diffusion layer was formed), a commercially available Ag paste was printed by a screen printing method. Note that the electrode pattern of the back electrode 15 has the same electrode pattern shape as the light incident side electrode 20. Thereafter, it was dried at 150° C. for about 60 seconds. The film thickness of the conductive paste for the back electrode 15 after drying was about 20 ⁇ m. Thereafter, both sides were simultaneously fired using a belt furnace (firing furnace) CDF7210 manufactured by Despatch Industries, Inc. at a peak temperature of 720° C. and a firing furnace in-out time of 50 seconds. A single-crystal silicon solar cell was produced in the manner described above.
• the solar cell thus obtained was cut into a 15 mm x 15 mm square, as shown in FIG. 7, to obtain a sample for contact resistance measurement.
• light-incidence-side finger electrodes 20b each having a width of 60 ⁇ m and a length of 15.0 mm are arranged at intervals of 1.5 mm on the light-incidence side surface of the cut solar cell (sample for contact resistance measurement). It will be placed in This light incident side finger electrode 20b was used as a pattern for contact resistance measurement.
• the contact resistance of the contact resistance measurement patterns of Examples and Comparative Examples before the laser treatment process was determined by the TLM method (Transfer length Method) using GP 4 TEST Pro manufactured by GP Solar.
• the solar cell thus obtained was cut into squares of 15 mm x 15 mm as shown in Figure 7, and the contact resistance after the laser treatment process was determined using the same method as the contact resistance measurement before the laser treatment process. Ta.
• the contact resistance value before the laser treatment process is 450 m ⁇ cm 2 or less, it can be used as an electrode for a solar cell by performing the laser treatment process. Similarly, if the contact resistance is 300 ⁇ cm 2 or less, it can be more preferably used as an electrode for a solar cell by performing a laser treatment process.
• the contact resistance value after the laser treatment process is 20 m ⁇ cm 2 or less, it can be preferably used as the electrode 20 of a solar cell. Similarly, if the contact resistance is 9 m ⁇ cm 2 or less, it can be more preferably used as an electrode for a solar cell.
• the contact resistance of the samples obtained using the conductive pastes (conductive compositions) of Examples 1 to 14 of the present embodiment before the laser treatment process was 440 m ⁇ cm 2 (Example 1) It was as follows. On the other hand, the contact resistance of Comparative Example 3 was 640 m ⁇ cm 2 , and the contact resistance of Comparative Example 4 was as high as 804 m ⁇ cm 2 . Further, the contact resistance of the samples obtained using the conductive pastes (conductive compositions) of Examples 1 to 14 of the present embodiment after the laser treatment process was 18 m ⁇ cm 2 (Example 1) or less. .
• Comparative Example 3 was 21 m ⁇ cm 2
• the contact resistance of Comparative Example 4 was as high as 32 m ⁇ cm 2 . Therefore, it can be said that in Comparative Examples 3 and 4, the contact resistance is higher than in the example of the present embodiment, so that the performance of the solar cell is deteriorated. That is, it can be said that Comparative Examples 3 and 4 cannot be preferably used as electrodes for solar cells.
• Examples and Comparative Examples The specific resistance of Examples and Comparative Examples was measured using the following procedure. That is, a silicon substrate with a width of 15 mm, a length of 15 mm, and a thickness of 180 ⁇ m was prepared. On this substrate, a pattern made of conductive paste as shown in FIG. 6 was printed using a 325 mesh stainless steel screen.
• a silicon substrate with the patterns of Examples and Comparative Examples coated on the substrate printed on the surface was heated in a belt furnace (firing furnace) CDF7210 manufactured by Despatch Industries, Inc. at a peak temperature of 720°C. Both sides were fired simultaneously with an in-out time of 50 seconds.
• a sample for resistivity measurement was prepared in the manner described above.
• the specific resistance of the conductive film pattern of the sample for resistivity measurement which was obtained by firing the conductive pastes of Examples and Comparative Examples, was measured.
• the resistance value was measured using a 4-terminal method using a multimeter model 2001 manufactured by Toyo Technica.
• the cross-sectional area of the conductive film pattern was measured using a confocal microscope OPTELICS H1200 manufactured by Lasertec and a surface roughness profile measuring device 1500SD2. Measurements were taken at 50 locations within a 1.6 mm range, and the average value was determined. Specific resistance was calculated using the cross-sectional area and the measured resistance value.
• the specific resistance of the conductive films obtained using the conductive pastes (conductive compositions) of Examples 1 to 14 of the present embodiment and Comparative Examples 1 to 4 was 8 ⁇ cm (Examples 11 and 18) or less.
• a specific resistance of 15 ⁇ cm or less can be suitably used as an electrode. Therefore, it can be said that by using the conductive paste of this embodiment, an electrode with a preferable specific resistance can be obtained.
• the PL value is sufficiently high, the contact resistance is low, and the specific resistance is also low. Therefore, it can be said that by using the conductive paste of this embodiment, a high-performance crystalline silicon solar cell can be obtained.
• the contact resistance was lowered by performing the laser treatment process. If the contact resistance is low, the fill factor (FF) increases.
• the survival rate of the antireflection film 2 (passivation film) between the electrode 20 and the impurity diffusion layer 4 is high. Therefore, recombination of carriers can be suppressed to a low level. Therefore, when the conductive paste of this embodiment is used, it can be said that there is a low possibility that the open circuit voltage (Voc) will decrease. From the above, when an electrode is formed using the conductive paste of this embodiment, a solar cell having the characteristic that the fill factor (FF) can be improved without reducing the open circuit voltage (Voc). It can be said that batteries can be obtained.
• FIG. 13 shows an SEM photograph (magnification: 20,000 times) of a cross section of a solar cell produced under the same conditions as in Example 5, observed after the laser treatment process using a high-magnification scanning electron microscope (SEM).
• SEM scanning electron microscope

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