WO2023190186A1 - 光回路基板 - Google Patents

光回路基板 Download PDF

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Publication number
WO2023190186A1
WO2023190186A1 PCT/JP2023/011874 JP2023011874W WO2023190186A1 WO 2023190186 A1 WO2023190186 A1 WO 2023190186A1 JP 2023011874 W JP2023011874 W JP 2023011874W WO 2023190186 A1 WO2023190186 A1 WO 2023190186A1
Authority
WO
WIPO (PCT)
Prior art keywords
protrusion
optical
circuit board
region
optical waveguide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/011874
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
信哉 友澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to KR1020247031406A priority Critical patent/KR20240149961A/ko
Priority to US18/852,995 priority patent/US20250216606A1/en
Priority to JP2024512372A priority patent/JP7813873B2/ja
Priority to CN202380028704.7A priority patent/CN118946836A/zh
Publication of WO2023190186A1 publication Critical patent/WO2023190186A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/30—Optical coupling means for use between fibre and thin-film device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths

Definitions

  • the present invention relates to an optical circuit board and an optical module using the same.
  • optical fibers that can communicate large amounts of data at high speeds have been used for information communications. Transmission and reception of optical signals is performed between the optical fiber and the optical component.
  • Such optical components are mounted on an optical circuit board, for example, as described in Patent Document 1.
  • An optical circuit board includes a wiring board, a lower cladding located on the wiring board and having a first region and a second region, and an optical waveguide located on the first region and including a core and an upper cladding. , a guide structure located on the second region and adjacent to the optical waveguide.
  • the guide structure includes at least a first portion and a second portion that extend adjacent to each other from the outer edge side to the center side of the wiring board in plan view, and extends away from the second portion from the center end of the first portion. It has a third portion, and a fourth portion extending from the central end of the second portion away from the first portion.
  • the third portion and the fourth portion include at least one of the first protrusion and the second protrusion.
  • the first protrusion is located on the side opposite to the side adjacent to the first portion among the two side edges of the third portion in plan view, and on the side adjacent to the second portion among the two side edges of the fourth portion. It is a protrusion that protrudes from at least one of the opposite sides.
  • the second protrusion is a protrusion that protrudes into the lower cladding from at least one of the third portion and the fourth portion when viewed in cross section.
  • An optical module according to the present disclosure includes the optical circuit board described above and an optical connector connected to the optical circuit board in contact with the guide structure.
  • FIG. 1 is a plan view showing an optical module in which optical components and electronic components are mounted on an optical circuit board according to an embodiment of the present disclosure.
  • FIG. 2 is an enlarged explanatory diagram for explaining a cross section passing through the optical waveguide core of region R1 shown in FIG. 1.
  • FIG. 3 is an enlarged explanatory diagram for explaining the state of region R2 shown in FIG. 2 before and after the optical waveguide and the optical connector are connected.
  • 4 is a plan view seen from the direction of arrow A shown in FIG. 3.
  • FIG. 5 is an enlarged explanatory diagram for explaining region R3 shown in FIG. 4.
  • FIG. FIG. 6 is an explanatory diagram for explaining various embodiments of cross sections taken along the aa line shown in FIG. 5;
  • FIG. 6 is an explanatory diagram for explaining various embodiments of cross sections taken along the line bb shown in FIG. 5;
  • FIG. 2 is an enlarged cross-sectional view of a main part of an optical connector connected to an optical circuit board.
  • the optical circuit board according to the present disclosure has the configuration described in the section of means for solving the problems, so that even the edge portion of the board can be connected to the connector with high precision.
  • FIG. 1 is a plan view showing an optical module 10 in which an optical component 4 is mounted on an optical circuit board 1 according to an embodiment of the present disclosure.
  • An optical circuit board 1 includes a wiring board 2 and an optical waveguide 3.
  • the wiring board 2 included in the optical circuit board 1 includes a wiring board commonly used for optical circuit boards.
  • such a wiring board 2 includes, for example, a core board and buildup layers laminated on both sides of the core board.
  • the core substrate is not particularly limited as long as it is made of an insulating material. Examples of the material having insulation properties include resins such as epoxy resin, bismaleimide-triazine resin, polyimide resin, and polyphenylene ether resin. These resins may be used in combination of two or more.
  • the core substrate usually has through-hole conductors to electrically connect the upper and lower surfaces of the core substrate.
  • the core substrate may include a reinforcing material.
  • the reinforcing material include insulating cloth materials such as glass fiber, glass nonwoven fabric, aramid nonwoven fabric, aramid fiber, and polyester fiber. Two or more reinforcing materials may be used in combination.
  • inorganic fillers such as silica, barium sulfate, talc, clay, glass, calcium carbonate, and titanium oxide may be dispersed in the core substrate.
  • the buildup layer has a structure in which insulating layers and conductor layers are alternately stacked.
  • a part of the conductor layer located on the outermost surface (the conductor layer located on the upper surface of the wiring board 2) includes a conductor layer 21a on which the optical waveguide 3 is located.
  • the conductor layer 21a is made of metal such as copper, for example.
  • the insulating layer included in the build-up layer is not particularly limited as long as it is made of an insulating material like the core substrate. Examples of the material having insulation properties include resins such as epoxy resin, bismaleimide-triazine resin, polyimide resin, and polyphenylene ether resin. These resins may be used in combination of two or more.
  • each insulating layer may be made of the same resin or different resins.
  • the insulating layer included in the buildup layer and the core substrate may be made of the same resin or may be made of different resins.
  • the buildup layer usually has a via hole conductor for electrically connecting the layers.
  • inorganic fillers such as silica, barium sulfate, talc, clay, glass, calcium carbonate, and titanium oxide may be dispersed in the insulating layer included in the build-up layer.
  • the optical waveguide 3 included in the optical circuit board 1 is located on the surface of the conductor layer 21a existing on the surface of the wiring board 2.
  • FIG. 2 is an enlarged explanatory diagram illustrating a cross section of region R1 shown in FIG.
  • the optical waveguide 3 has a structure in which a lower cladding 31, an optical waveguide core 32, and an upper cladding 33 are laminated in this order from the conductor layer 21a side.
  • the lower cladding 31 included in the optical waveguide 3 is located on the surface of the wiring board 2, specifically on the surface of the conductor layer 21a present on the surface of the wiring board 2.
  • the lower cladding 31 has a first region 311 where an optical waveguide core 32 (described later) is located and a second region 312 where a guide structure 34 (described later) is located.
  • the material forming the lower cladding 31 is not limited, and examples include resins such as epoxy resin and silicone resin.
  • the upper cladding 33 included in the optical waveguide 3 is located in the first region 311. Like the lower clad 31, the upper clad 33 is also made of resin such as epoxy resin or silicone resin.
  • the lower cladding 31 and the upper cladding 33 may be made of the same material or different materials. Further, the lower cladding 31 and the upper cladding 33 may have the same thickness or different thicknesses.
  • the lower cladding 31 and the upper cladding 33 each have a thickness of approximately 5 ⁇ m or more and 150 ⁇ m or less, for example.
  • the optical waveguide core 32 included in the optical waveguide 3 is located in the first region 311.
  • the optical waveguide core 32 is a portion through which light that has entered the optical waveguide 3 propagates.
  • the end surface of the optical transmission line 41 included in the optical component 4 mounted on the wiring board 2 and the end surface of the optical waveguide core 32 of the optical waveguide 3 are positioned to face each other.
  • the end surface of the optical waveguide 3 including the end surface of the optical waveguide core 32 facing the optical component 4 mounted on the wiring board 2 is referred to as a first end surface 3a.
  • optical signals are transmitted and received between the optical waveguide core 32 and the optical transmission line 41.
  • the material forming the optical waveguide core 32 is not limited, and is appropriately set, for example, taking into consideration light transmittance, wavelength characteristics of propagating light, and the like. Examples of the material include resins such as epoxy resin and silicone resin.
  • the optical waveguide core 32 has a thickness of, for example, about 3 ⁇ m or more and 50 ⁇ m or less.
  • the end face opposite to the first end face 3a is the second end face 3b, which includes the end face of the lower cladding 31, the end face of the optical waveguide core 32, and the end face of the upper cladding 33 in the same plane.
  • the end surface of the optical waveguide 3 facing the optical connector 5a is the second end surface 3b.
  • FIG. 3 is an enlarged explanatory view (perspective view) for explaining the state before and after the optical waveguide 3 and the optical connector 5a are connected with respect to the region R2 shown in FIG.
  • FIG. 4 is a plan view seen from the direction of arrow A shown in FIG. 3, and the portion covered by the optical connector 5a is shown as a perspective view.
  • the direction parallel to the optical waveguide core 32 is defined as the X direction
  • the direction perpendicular to the optical waveguide core 32 is defined as the Y direction.
  • the lower cladding 31 included in the optical waveguide 3 has a first region 311 and a second region 312, as shown in FIGS. 3 and 4.
  • an optical waveguide core 32 and an upper cladding 33 are located, forming the optical waveguide 3.
  • the guide structure 34 is located in the second region 312 of the lower cladding 31 so as to be adjacent to the optical waveguide 3 (the first region 311 of the lower cladding 31, the optical waveguide core 32, and the upper cladding 33).
  • the guide structures 34 may be located on both sides of the optical waveguide 3 so as to sandwich the optical waveguide 3, as shown in FIGS. 3 and 4.
  • the guide structure 34 is used for positioning the optical connector 5a.
  • the material forming the guide structure 34 is not limited, and examples thereof include resins such as epoxy resin and silicone resin.
  • the guide structure 34 includes at least a first portion 341 and a second portion 342 that extend adjacent to each other from the outer edge side to the center side of the wiring board 2 in plan view, and a center side of the first portion 341.
  • a third portion 343 extends away from the second portion 342 from the end of the second portion 342
  • a fourth portion 344 extends away from the first portion 341 from the center end of the second portion 342 .
  • the optical connector 5a has a first recess C1 in which the guide structure 34 is housed and a second recess C2 in which the upper clad 33 is housed, for example, on the lower cladding 31 side, as shown in FIG. 8 described later.
  • the position of the optical connector 5a in the Y direction is determined by fitting the first part 341 and the second part 342 of the guide structure 34 into the first recess C1
  • the side surface of the optical connector 5a is determined by fitting the first part 341 and the second part 342 of the guide structure 34 into the third part 343 and the second part 342 of the guide structure 34.
  • the position in the X direction is determined by contacting the four portions 344. Thereby, the optical connector 5a is connected to a predetermined position with high precision.
  • the lengths of the first portion 341 and the second portion 342 included in the guide structure 34 are appropriately set according to the size of the optical connector 5a.
  • the width of the first portion 341 and the second portion 342 is, for example, 10 ⁇ m or more and 50 ⁇ m or less.
  • the lengths of the third portion 343 and the fourth portion 344 are appropriately set depending on the size of the optical connector 5a.
  • the widths of the third portion 343 and the fourth portion 344 are, for example, 10 ⁇ m or more and 50 ⁇ m or less.
  • the widths of the first portion 341 and the third portion 343 may be the same or different.
  • the widths of the second portion 342 and the fourth portion 344 may be the same or different.
  • the angle ⁇ between the first portion 341 and the third portion 343 is not limited, and may be approximately 90 degrees as shown in FIG. 4.
  • the angle between the second portion 342 and the fourth portion 344 is not limited, and may be approximately 90 degrees.
  • FIG. 5 is an enlarged explanatory diagram for explaining region R3 shown in FIG. 4.
  • FIG. The third portion 343 includes a first protrusion 34a, as shown in FIG.
  • the first protrusion 34a is a protrusion that protrudes from the side opposite to the side adjacent to the first portion 341 among the two side edges of the third portion 343 in plan view.
  • the first protrusion 34a is made of the material that forms the guide structure 34 described above.
  • the length L1 of the first protrusion 34a that is, the length from the side edge of the third portion 343 on the opposite side to the side adjacent to the first portion 341 in plan view from the tip to the tip is, for example, 30 ⁇ m or more and 150 ⁇ m or less.
  • the width of the third portion 343 may be approximately the same as the width of the third portion 343.
  • FIG. 6 is an explanatory diagram for explaining various embodiments of a cross section taken along the line aa shown in FIG. 5.
  • the third portion 343 has a first protrusion 34a that protrudes from the side adjacent to the first portion 341 and the opposite side of the two side edges of the third portion 343. have.
  • the third portion 343 may include a second protrusion 34b that protrudes from the third portion 343 to the lower cladding 31 (second region 312) in cross-sectional view, as shown in FIG. 6(B).
  • FIG. 6(B) shows a case where the third portion 343 does not have the first protrusion 34a.
  • the second protrusion 34b is also made of the material forming the guide structure 34 described above.
  • the thickness (depth) L2 of the second protrusion 34b is not limited, and may be, for example, approximately 10% or more of the thickness of the lower cladding 31.
  • both the first protrusion 34a and the second protrusion 34b may protrude from the third portion 343. That is, the third portion 343 only needs to include at least one of the first protrusion 34a and the second protrusion 34b.
  • a third protrusion 34c may be included that protrudes from the first protrusion 34a to the lower cladding 31 (second region 312) in cross-sectional view.
  • the third protrusion 34c is also made of the material forming the guide structure 34 described above.
  • the thickness (depth) L3 of the third protrusion 34c is not limited, and may be, for example, approximately 10% or more of the thickness of the lower cladding 31.
  • the third protrusion 34c may have the same thickness as the second protrusion 34b, or may have a different thickness.
  • both the first protrusion 34a and the second protrusion 34b may protrude from the third portion 343, and the third protrusion 34c may protrude from the first protrusion 34a.
  • the fourth portion 344 also includes at least one of the first protrusion 34a and the second protrusion 34b. Furthermore, the third protrusion 34c may protrude from the first protrusion 34a located in the fourth portion 344.
  • the direction in which the third portion 343 extends and the direction in which the first protrusion portion 34a protrudes may be perpendicular to each other. That is, in plan view, the angle between the first protrusion 34a located in the third portion 343 and the third portion 343 may be 90 degrees.
  • the direction in which the fourth portion 344 extends and the direction in which the first protrusion portion 34a protrudes may be perpendicular to each other. That is, the angle formed by the first protrusion 34a located in the fourth portion 344 and the fourth portion 344 may be 90 degrees in plan view.
  • the first portion 341 may include a fourth protrusion 34d, as shown in FIG.
  • the fourth protrusion 34d is a protrusion that protrudes from the first portion 341 toward the region sandwiched between the first portion 341 and the second portion 342 in plan view.
  • the fourth protrusion 34d is made of the material that forms the guide structure 34 described above.
  • the length L4 of the fourth protruding portion 34d that is, the length from the side edge of the first portion 341 on the second portion 342 side to the tip in plan view is, for example, 30 ⁇ m or more and 150 ⁇ m or less, and the first portion 341
  • the width may be approximately the same as the width of the .
  • FIG. 7 is an explanatory diagram for explaining various embodiments of a cross section taken along line bb shown in FIG. 5.
  • the first portion 341 has a fourth protrusion 34d that protrudes from the first portion 341 toward an area sandwiched between the first portion 341 and the second portion 342, as shown in FIGS. 5 and 7(A). have.
  • the first portion 341 may include a fifth protrusion 34e that protrudes from the first portion 341 to the lower cladding 31 (second region 312) in cross-sectional view, as shown in FIG. 7(B).
  • FIG. 7(B) shows a case where the first portion 341 does not have the fourth protrusion 34d.
  • the fifth protrusion 34e is also made of the material forming the guide structure 34 described above.
  • the thickness (depth) L5 of the fifth protrusion 34e is not limited, and may be, for example, about 10% or more of the thickness of the lower cladding 31, and has the same depth as the second protrusion 34b and the third protrusion 34c. It may be
  • both the fourth protrusion 34d and the fifth protrusion 34e may protrude from the first portion 341. That is, the first portion 341 may include at least one of the fourth protrusion 34d and the fifth protrusion 34e.
  • a sixth protrusion 34f that protrudes from the fourth protrusion 34d to the lower cladding 31 (second region 312) in cross-sectional view may be included.
  • the sixth protrusion 34f is also made of the material forming the guide structure 34 described above.
  • the thickness (depth) L6 of the sixth protrusion 34f is not limited, and may be approximately 10% or more of the thickness of the lower cladding 31, for example.
  • the sixth protrusion 34f may have the same thickness as the fifth protrusion 34e, or may have a different thickness.
  • both the fourth protrusion 34d and the fifth protrusion 34e may protrude from the first portion 341, and the sixth protrusion 34f may protrude from the fourth protrusion 34d.
  • the second portion 342 also includes at least one of the fourth protrusion 34d and the fifth protrusion 34e. Furthermore, the sixth protrusion 34f may protrude from the fourth protrusion 34d located in the second portion 342.
  • the direction in which the first portion 341 extends and the direction in which the fourth protrusion 34d protrudes may be perpendicular to each other. That is, in plan view, the angle between the fourth protrusion 34d located on the first portion 341 and the first portion 341 may be 90 degrees.
  • the direction in which the second portion 342 extends and the direction in which the fourth protrusion 34d protrudes may be perpendicular to each other. That is, in plan view, the angle between the fourth protrusion 34d located in the second portion 342 and the second portion 342 may be 90 degrees.
  • the wiring board 2 is prepared.
  • the wiring board 2 has a mounting area for the optical component 4 and a forming area for the optical waveguide 3 on its upper surface, which are adjacent to each other.
  • the formation region of the optical waveguide 3 of the wiring board 2 includes a conductor layer 21a that is part of the outermost conductor layer (the conductor layer located on the upper surface of the wiring board 2).
  • the mounting area of the wiring board 2 includes pads 21b that are part of the conductor layer located on the outermost surface.
  • the conductor layer 21a and the pad 21b are made of metal such as copper, for example.
  • a lower cladding 31 is formed in a region including the formation region of the optical waveguide 3. Specifically, a resin layer made of resin such as epoxy resin or silicone resin is laminated so as to cover the region where the optical waveguide 3 is formed. Next, the lower cladding 31 is formed by exposure and development.
  • the optical waveguide core 32 is formed in the first region 311 of the lower cladding 31, and the guide structure 34 is formed in the second region 312 of the lower cladding 31.
  • the optical waveguide core 32 and the guide structure 34 may be formed simultaneously or separately.
  • the guide structure 34 is preferably formed at the same time as the optical waveguide core 32.
  • the second protrusion 34b, the third protrusion 34c, the fifth protrusion 34e, and the sixth protrusion 34f protruding from the second region 312 of the lower cladding 31 are formed.
  • a recessed portion for the formation is formed in the second region 312 of the lower cladding 31.
  • the method for forming this recessed portion is not limited, and examples thereof include an exposure method, a laser method, and the like. Examples of the exposure method include a method using a halftone mask and a method of forming an extremely small diameter hole. Examples of the laser method include a method using an excimer laser.
  • a material for forming the optical waveguide core 32 and the guide structure 34 is applied to the lower cladding 31.
  • the first area 311 and the second area 312 of the area are coated or pasted.
  • the optical waveguide core 32 and the guide structure 34 are formed by performing exposure processing and development processing.
  • an upper cladding 33 that covers the optical waveguide core 32 is formed in the first region 311 of the lower cladding 31.
  • the upper clad 33 is also formed by exposing and developing a resin such as epoxy resin or silicone resin.
  • the lower cladding 31 and the upper cladding 33 may be made of the same material or different materials. Further, the lower cladding 31 and the upper cladding 33 may have the same thickness or different thicknesses.
  • the guide structure 34 is formed in the second region 312 of the lower cladding 31.
  • the optical circuit board 2 including such a guide structure 34 is used, for example, as an optical module. That is, the optical module according to the present disclosure includes the optical circuit board 1 according to one embodiment and the optical connector 5a connected to the optical circuit board 3 in contact with the guide structure 34.
  • the optical component 4 mounted on the optical module 10 includes an optical transmission path 41.
  • An example of the optical component 4 including such an optical transmission path 41 is a silicon photonics device.
  • Examples of the electronic component 6 include an ASIC (Application Specific Integrated Circuit), a driver IC, and the like.
  • the optical component 4 is electrically connected to a pad 21b located in the optical component mounting area of the wiring board 2 via the solder 7.
  • the pad 21b is a part of the conductor layer located on the upper surface of the wiring board 2.
  • a silicon photonics device is, for example, a type of optical component having an optical transmission path 41 having a core made of silicon (Si) and a cladding made of silicon dioxide (SiO 2 ).
  • the silicon photonics device includes a Si waveguide as the optical transmission path 41, and further includes a passivation film, a light source section, a photodetection section, etc., although not shown.
  • the optical transmission line 41 (Si waveguide 41) is located at one end of the optical waveguide 3 so as to face the optical waveguide core 32 included in the optical waveguide 3.
  • an electrical signal from the wiring board 2 is propagated via the solder 7 to a light source included in the optical component 4 (silicon photonics device).
  • the light source section receives the propagated electrical signal and emits light.
  • the emitted optical signal is propagated via the optical transmission line 41 (Si waveguide 41) and the optical waveguide core 32 to the optical fiber 5 connected via the optical connector 5a.
  • FIG. 8 is an enlarged cross-sectional view of a main part showing a state (left half) in which the connector 5a is connected to the optical circuit board 1.
  • the connector 5a has, for example, on the lower cladding 31 side, a first recess C1 in which the guide structure 34 is accommodated and a second recess C2 in which the upper cladding 33 is accommodated.
  • the first recess C1 has approximately the same width as the guide structure 34. Thereby, the connector 5a can be connected to a prescribed position on the optical circuit board 1 in the Y direction shown in FIG.
  • the optical circuit board according to the present disclosure is not limited to the optical circuit board 1 according to the above-described embodiment.
  • the angle between the first portion 341 and the third portion 343 is approximately 90 degrees
  • the angle between the second portion 342 and the fourth portion 344 is also approximately 90 degrees. It is.
  • the angle ⁇ formed by the first portion and the third portion does not necessarily have to be 90 degrees.
  • the angle between the first portion and the third portion may be an obtuse angle (for example, more than 90 degrees and less than 180 degrees).
  • the angle between the second portion and the fourth portion may also be an obtuse angle, similar to the angle between the first portion and the third portion.
  • Optical circuit board 2 Wiring board 21a Conductor layer 21b Pad 3 Optical waveguide 31 Lower cladding 311 First region 312 Second region 32 Optical waveguide core 33 Upper cladding 34 Guide structure 341 First portion 342 Second portion 343 Third portion 344 Fourth portion 34a First protrusion 34b Second protrusion 34c Third protrusion 34d Fourth protrusion 34e Fifth protrusion 34f Sixth protrusion 4 Optical component 41 Optical transmission line (silicon waveguide (Si waveguide)) 5 Optical fiber 5a Optical connector 6 Electronic component 7 Solder 10 Optical module

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)
PCT/JP2023/011874 2022-03-31 2023-03-24 光回路基板 Ceased WO2023190186A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020247031406A KR20240149961A (ko) 2022-03-31 2023-03-24 광회로 기판
US18/852,995 US20250216606A1 (en) 2022-03-31 2023-03-24 Optical circuit board
JP2024512372A JP7813873B2 (ja) 2022-03-31 2023-03-24 光回路基板
CN202380028704.7A CN118946836A (zh) 2022-03-31 2023-03-24 光电路基板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022060159 2022-03-31
JP2022-060159 2022-03-31

Publications (1)

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WO2023190186A1 true WO2023190186A1 (ja) 2023-10-05

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PCT/JP2023/011874 Ceased WO2023190186A1 (ja) 2022-03-31 2023-03-24 光回路基板

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US (1) US20250216606A1 (https=)
JP (1) JP7813873B2 (https=)
KR (1) KR20240149961A (https=)
CN (1) CN118946836A (https=)
TW (1) TWI876309B (https=)
WO (1) WO2023190186A1 (https=)

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US7936953B2 (en) * 2005-07-15 2011-05-03 Xyratex Technology Limited Optical printed circuit board and manufacturing method
US8288877B1 (en) * 2008-10-25 2012-10-16 Hrl Laboratories, Llc Actuator enhanced alignment of self-assembled microstructures
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