WO2023184162A1 - 一种显示模组及车载显示装置 - Google Patents

一种显示模组及车载显示装置 Download PDF

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Publication number
WO2023184162A1
WO2023184162A1 PCT/CN2022/083762 CN2022083762W WO2023184162A1 WO 2023184162 A1 WO2023184162 A1 WO 2023184162A1 CN 2022083762 W CN2022083762 W CN 2022083762W WO 2023184162 A1 WO2023184162 A1 WO 2023184162A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
pads
display module
flexible circuit
strip
Prior art date
Application number
PCT/CN2022/083762
Other languages
English (en)
French (fr)
Inventor
王佳祥
冯彬峰
李飞
黄棋
金尚楠
李裕民
崔志宏
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to PCT/CN2022/083762 priority Critical patent/WO2023184162A1/zh
Priority to CN202280000593.4A priority patent/CN117157691A/zh
Priority to US18/022,119 priority patent/US20240251612A1/en
Publication of WO2023184162A1 publication Critical patent/WO2023184162A1/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/90—Assemblies of multiple devices comprising at least one organic light-emitting element
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
    • H05K5/0018—Casings, cabinets or drawers for electric apparatus with operator interface units having an electronic display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/179—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED

Definitions

  • the present disclosure relates to the field of display technology, and in particular to a display module and a vehicle-mounted display device.
  • LCDs liquid crystal displays
  • a display panel at least one flexible circuit board, and at least one printed circuit board;
  • the display panel includes a plurality of connection pads located in the binding area;
  • the flexible circuit board includes a first body, a plurality of output pads and a plurality of input pads.
  • the first body includes a bendable portion and a flat portion connected to each other.
  • the bendable portion includes a flat portion compared to the flat portion.
  • the plurality of output pads are located on the protruding portion and are boundly connected to the plurality of connection pads.
  • the plurality of input pads are located on the flat portion away from the bendable portion. one side;
  • the printed circuit board includes a second body and a plurality of bonding pads.
  • the second body includes a strip-shaped body part and at least one branch part connected to a long side of the strip-shaped body part.
  • the plurality of bonding pads are The fixed pad is located on at least one side of each branch part adjacent to the strip main part, and the plurality of binding pads are bound and connected to the plurality of input pads.
  • each of the output pads extends along a first direction and is arranged in sequence along a second direction that intersects with the first direction
  • each of the input pads extends along a third direction and is arranged along a second direction that intersects with the first direction.
  • the fourth directions intersecting the third direction are arranged in sequence, the first direction is substantially the same as the fourth direction, and the second direction is substantially the same as the third direction.
  • the flat portion includes a first side adjacent to the protruding portion, a second side opposite to the first side, and a third side away from the bendable portion.
  • side, the first side and the second side both extend along the second direction, and the first side is longer than the second side, and the third side is longer than the second side.
  • the first direction is inclined at a preset angle.
  • the fourth direction is substantially the same as the extension direction of the third side.
  • the flexible circuit board further includes a driver chip located on the flat part, and the driver chip is located on a side of the plurality of input pads close to the bendable part.
  • the driver chip extends generally along the first direction.
  • the extension direction of the driver chip is substantially the same as the extension direction of the flat portion away from the third side of the bendable portion.
  • the flexible circuit board further includes a plurality of signal traces, each of which is electrically connected to the driver chip and the corresponding output pad, and each of the signal traces is electrically connected to the driver chip and the corresponding output pad.
  • the signal traces are approximately the same length.
  • the signal traces electrically connected to the output pads close to the driver chip among the plurality of output pads are designed in a curve, and the signal traces of the plurality of output pads that are away from the The signal traces electrically connected to the output pads of the driver chip are designed in a straight line.
  • the shape of the orthographic projection on the flexible circuit board of the signal trace electrically connected to the output pad close to the driver chip among the plurality of output pads includes a single At least one of a triangle, a triangle zigzag, a single rectangle, a rectangular zigzag, and an arc.
  • the plurality of bonding pads extend along the third direction and are sequentially arranged along a fourth direction intersecting the third direction.
  • two of the at least one branch portions located at the edge are provided with the plurality of bonding pads only on one side adjacent to the short side of the strip-shaped main body portion, The plurality of bonding pads are provided on both sides of the other branch portion adjacent to the strip-shaped main portion.
  • the plurality of bonding pads are provided on both sides of each branch part adjacent to the strip-shaped main part.
  • the short side of the strip-shaped main part protrudes from the outermost branch part.
  • the short side of the strip-shaped main part is flush with the corresponding side of the outermost branch part.
  • Embodiments of the present disclosure also provide a vehicle-mounted display device, including:
  • the above-mentioned display module as well as the film encapsulation layer, touch function layer, filter layer and protective cover located on the display module.
  • Figure 1 is a schematic structural diagram of one of the COF Bonding solutions in related technologies
  • Figure 2 is a schematic structural diagram of one of the PCB and COF Bonding locations where Peeling occurs in the COF Bonding solution in the related art
  • Figure 3 is a schematic structural diagram of an IC Crack in the COF Bonding solution in related technologies
  • Figure 4 is a schematic structural diagram of a flexible circuit board provided by an embodiment of the present disclosure.
  • Figure 5 is a schematic structural diagram of a flexible circuit board provided by an embodiment of the present disclosure.
  • Figure 6 is a schematic structural diagram of a flexible circuit board provided by an embodiment of the present disclosure.
  • Figure 7 is a schematic structural diagram of a flexible circuit board provided by an embodiment of the present disclosure.
  • Figure 8 is a schematic structural diagram of a flexible circuit board provided by an embodiment of the present disclosure.
  • Figure 9 is a schematic structural diagram of a flexible circuit board provided by an embodiment of the present disclosure.
  • Figure 10 is a schematic structural diagram of a flexible circuit board provided by an embodiment of the present disclosure.
  • Figure 11 is a schematic structural diagram of a flexible circuit board provided by an embodiment of the present disclosure.
  • Figure 12 is a schematic structural diagram of a flexible circuit board provided by an embodiment of the present disclosure.
  • Figure 13 is a schematic structural diagram of a printed circuit board provided by an embodiment of the present disclosure.
  • Figure 14 is a schematic structural diagram of a printed circuit board provided by an embodiment of the present disclosure.
  • Figure 15 is a schematic structural diagram of a printed circuit board provided by an embodiment of the present disclosure.
  • Figure 16 is a schematic structural diagram of a display module provided by an embodiment of the present disclosure.
  • Figure 17 is a schematic structural diagram of a display device provided by an embodiment of the present disclosure.
  • Figure 18 is a schematic structural diagram of a display device provided by an embodiment of the present disclosure.
  • Figure 19 is a schematic structural diagram of a display device provided by an embodiment of the present disclosure.
  • Figure 20 is a schematic structural diagram of a display device provided by an embodiment of the present disclosure.
  • Figure 21 is a schematic structural diagram of a display device provided by an embodiment of the present disclosure.
  • Figure 22 is a schematic diagram of the corresponding Bonding area expansion in the Bonding scheme shown in Figure 1;
  • Figure 23 is a schematic diagram of the corresponding Bonding area expansion in the Bonding scheme shown in Figure 20;
  • FIG. 24 is a schematic structural diagram of a vehicle-mounted display device provided by an embodiment of the present disclosure.
  • FIG 1 shows one of the structural schematic diagrams of the chip on film (Chip on Film, COF) 03 being bonded to the panel (Panel) 01 and the printed circuit board (Printed Circuit Board, PCB) 02 respectively in the related technology.
  • Panel 01 becomes C-shaped after being attached to the C-shaped cover (Cover Glass, CG).
  • the CG is not shown in the figure.
  • Figure 2 shows the use of the C-shaped cover glass (CG) shown in Figure 1.
  • FIG 3 is a schematic diagram of one of the reverse structures corresponding to the COF Bonding scheme shown in Figure 1.
  • the position of the bonding position between PCB 02 and COF 03 is peeled off (Peeling) as shown in the dotted box M in Figure 2, and the position of the integrated circuit (Integrated Circuit, IC) 04 on COF 03 as cracked (Crack) is shown in the dotted box N in Figure 3 ).
  • IC integrated Circuit
  • embodiments of the present disclosure provide a display module and a vehicle-mounted display device to prevent IC breakage and PCB detachment, and improve the performance of flexible circuit boards and printed circuit boards.
  • Figure 4 is a schematic structural diagram of a flexible circuit board in an embodiment of the present disclosure.
  • the flexible circuit board provided by an embodiment of the present disclosure includes:
  • the first body 10 includes a bendable portion 11 and a flat portion 12 connected to each other.
  • the bendable portion 11 includes a protruding portion 110 that protrudes compared to the flat portion 12;
  • a plurality of output pads 20 are located on the protruding portion 110, and the plurality of output pads 20 are used for binding connection with the display panel;
  • a plurality of input pads 30 are located on a side of the flat portion 12 away from the bendable portion 11 , and are used for binding connection with a printed circuit board.
  • the first body 10 includes a bendable portion 11 and a flat portion 12 connected to each other.
  • the bendable portion 11 includes a protruding portion 110 that protrudes compared to the flat portion 12 .
  • the bendable portion 11 can be bent into a C-shape, S-shape, etc., and during the bending process, the flat portion 12 can remain straight.
  • the bendable portion 11 and the flat portion 12 may constitute an L-shaped first body 10.
  • the flexible circuit board has an L-shaped design.
  • the flexible circuit board also includes a plurality of output pads 20 located on the protruding portion 110 , and the plurality of output pads 20 are used for binding connection with the display panel. That is to say, the flexible circuit board and the display panel can be bonded and connected through the plurality of output pads 20 .
  • the flexible circuit board can output control signals related to the display function to the display panel via the plurality of output pads 20, thus ensuring the performance of the flexible circuit board.
  • the specific number of the multiple output pads 20 can be set according to actual application needs, and is not limited here.
  • the flexible circuit board also includes a plurality of input pads 30 located on the side of the flat portion 12 away from the bendable portion 11 , and the plurality of input pads 30 are used for binding connection with the printed circuit board. That is to say, the flexible circuit board and the printed circuit board can be bonded and connected through the plurality of input pads 30 . In this case, the printed circuit board can output relevant signals to the flexible circuit board through the plurality of input pads 30, thereby ensuring the performance of the flexible circuit board.
  • the specific number of the multiple input pads 30 can be set according to actual application needs, and is not limited here.
  • the included bendable portion 11 includes a protruding portion 110 that protrudes compared to the flat portion 12 , but also the included flat portion 12 is bent at the bendable portion 11 Keep it straight during the process.
  • the flexible circuit board in the related art after the flexible circuit board is subsequently bound and connected to the display panel and the printed circuit board respectively, during the process of bending the display panel, not only can the breakage caused by the bending of the flexible circuit board be avoided , it can also avoid bonding defects caused by pulling the bonding position between the flexible circuit board and the printed circuit board, thereby improving the performance of the flexible circuit board.
  • each of the output pads 20 extends along a first direction and is sequentially arranged along a second direction intersecting the first direction
  • each input pad 30 extends along a third direction and is arranged along a second direction intersecting with the first direction.
  • the fourth directions intersecting the third direction are arranged in sequence, the first direction is substantially the same as the fourth direction, and the second direction is substantially the same as the third direction.
  • a plurality of Each of the output pads 20 extends along a first direction and is sequentially arranged along a second direction that intersects the first direction.
  • Each of the plurality of input pads 30 extends along a third direction and is arranged along a second direction that intersects with the first direction.
  • the fourth directions intersecting the third direction are arranged in sequence, the first direction is substantially the same as the fourth direction, and the second direction is substantially the same as the third direction.
  • the direction shown by arrow x is the first direction
  • the direction shown by arrow y is the second direction
  • the direction shown by arrow y’ is the third direction
  • the direction shown by arrow x’ is the fourth direction. It should be noted that in the embodiment of the present disclosure, “substantially the same” may mean exactly the same, or may also mean approximately the same.
  • Figure 5 illustrates the situation where the first direction is exactly the same as the fourth direction, and the second direction is exactly the same as the third direction.
  • the arrangement of the flat portion 12 in the flexible circuit board can be in the following situations, but is not limited to the following situations.
  • the flat portion 12 includes a first side 121 adjacent to the protruding portion 110 , and a second side opposite to the first side 121 .
  • Side 122 is a third side 123 away from the bendable portion 11 . Both the first side 121 and the second side 122 extend along the second direction, and the first side 121 is longer than The second side 122 and the third side 123 are inclined at a preset angle compared to the first direction.
  • the flat portion 12 includes a first side 121 adjacent to the protruding portion 110 and a second side 122 opposite to the first side 121 .
  • the flat portion 12 also includes a side away from the bendable portion 11 .
  • the third side 123, the first side 121 and the second side 122 all extend along the second direction, and the first side 121 is longer than the second side 122.
  • the third side 123 is inclined at an angle compared to the first direction.
  • the preset angle is as shown in Figure 6.
  • the preset angle is ⁇ .
  • those skilled in the art can preset the specific value of the preset angle of the third side 123 compared to the first direction according to actual application needs, which is not limited here.
  • the fourth direction is substantially the same as the extending direction of the third side 123 .
  • the flexible circuit board may be a COF, as shown in FIGS. 8 to 10 .
  • the flexible circuit board further includes a driver chip 40 located on the flat part 12 .
  • the driver chip 40 is located on the plurality of flat parts 12 .
  • An input pad 30 is close to the side of the bendable portion 11 .
  • the flexible circuit board also includes a driver chip 40 located on the flat part 12 .
  • the driver chip 40 is used to load the display panel bound to the multiple output pads 20 through the multiple output pads 20 .
  • Control signals related to display functions such as clock signals, frame start signals, high potential signals, low potential signals, etc.
  • the driver chip 40 is located on one side of the plurality of input pads 30 close to the flexible portion 11 , and the spatial distribution between the plurality of input pads 30 and the driver chip 40 does not interfere with each other.
  • the driver chip 40 extends generally along the first direction. This improves the space utilization of the flat portion 12 .
  • the extension direction of the driver chip 40 is substantially the same as the extension direction of the flat portion 12 away from the third side 123 of the bendable portion 11 .
  • the problem of uneven wiring resistance of the flexible circuit board is improved, and the performance of the flexible circuit board is improved.
  • the driver chip 40 in addition to arranging the driver chip 40 in the above-mentioned manner, it can also be arranged in other ways based on the concept of this disclosure, which is not limited here.
  • the flexible circuit board also includes a plurality of signal traces 50 , each of the signal traces 50 is electrically connected to the driver chip 40 and the corresponding output pad 20 respectively.
  • the lengths of the signal traces 50 are approximately the same.
  • the flexible circuit board also includes a plurality of signal traces 50.
  • the specific number of the multiple signal traces 50 can be set according to actual application needs, and is not limited here.
  • Each of the plurality of signal traces 50 is electrically connected to the driver chip 40 and the corresponding output pad 20 of the plurality of output pads 20 respectively.
  • the length of each signal trace 50 is approximately the same. In this way, By adjusting the length of each signal trace 50, the length of each signal trace 50 can be adjusted to be approximately the same, ensuring that the resistance of each signal trace 50 is approximately the same. After being bound and connected to the display panel, the display uniformity of the display panel is ensured and the display effect of the display panel is improved.
  • the flexible circuit board also includes a plurality of traces electrically connected to the driver chip 40 and the plurality of input pads 30 respectively. Each trace is arranged in a straight line, and each trace is directly connected to the corresponding input pad 30. Multiple traces can be distributed in a fan shape, thereby ensuring that relevant signals can be loaded to the driver chip 40 through each input pad 30 and ensuring the performance of the flexible circuit board.
  • the signal traces 50 electrically connected to the output pads 20 of the plurality of output pads 20 close to the driver chip 40 are designed in a curve.
  • the signal traces 50 electrically connected to the output pads 20 of the plurality of output pads 20 that are away from the driver chip 40 are designed in a straight line.
  • the signal trace 50 electrically connected to the output pad 20 of the plurality of output pads 20 close to the driver chip 40 has an orthogonal projection shape on the flexible circuit board. Including at least one of a single triangle, a triangular zigzag, a single rectangle, a rectangular zigzag, and an arc.
  • the signal trace 50 electrically connected to the output pad 20 close to the driver chip 40 has a rectangular zigzag shape projected onto the flexible circuit board.
  • Figure 11 does not illustrate the arrangement of all signal traces 60.
  • the same public concept can be used to set up each signal trace 60, which will not be described in detail here.
  • the signal traces 50 electrically connected to the output pads 20 of the plurality of output pads 20 that are away from the driver chip 40 are designed in a straight line, so that the length of each signal trace 50 is set to be approximately the same, thereby ensuring that the length of each signal trace 50 is approximately the same.
  • the resistance of the wire 50 is uniform, thereby improving the performance of the flexible circuit board.
  • the signal traces 50 electrically connected to the output pads 20 of the multiple output pads 20 away from the driver chip 40 are designed in a straight line, and the multiple output pads 20
  • the signal trace 50 electrically connected to the output pad 20 of the driver chip 40 is projected onto the flexible circuit board in a rectangular zigzag shape and includes multiple rectangular repeating units of the same size. If the rectangular repeating units are of equal density, Distributed on the corresponding signal traces 50, along the first direction and in the direction away from the driver chip 40, the number of rectangular repeating units on the multiple signal traces 50 shows a decreasing trend.
  • Each signal in Figure 11 The traces 60 can be arranged using the same concept, and will not be described in detail here. In this way, the uniformity of the resistance of each signal trace 50 is ensured, thereby improving the performance of the flexible circuit board.
  • each signal trace 50 includes a signal trace extending along the first direction.
  • a first portion 501 and a second portion 502 extending in said second direction.
  • the signal trace 50 designed in a curved shape includes at least one curved unit.
  • the at least one curved unit may be provided only in the first part 501, or may be provided only in the second part 502, or may be provided separately.
  • each signal trace 50 can also be set according to the bending performance of the flexible circuit board, which is not limited here.
  • FIG. 11 and FIG. 12 only illustrate the arrangement of part of the signal traces 50 .
  • the signals between each output pad 20 and the driver chip 40 can be configured according to the same design concept as above. Route 50 for setting, which will not be described in detail here.
  • the flexible circuit board also includes a bendable area B.
  • the bendable area B is located on the side of the multiple output pads 20 close to the bendable portion 11. After the pad 20 is bound and connected to the display panel, the part of the flexible circuit board on the side of the bendable area B away from the plurality of output pads 20 can be bent along the bendable area B to the back of the display panel, thereby ensuring Narrow bezel design of the display panel.
  • the portion of each signal trace 50 located in the bendable area B is designed in a straight line, which avoids breakage of the signal trace 50 and improves the performance of the display panel.
  • the flexible circuit board in the embodiment of the present disclosure can also be provided with other structures according to actual application needs. For other structures, reference can be made to related technologies, which will not be described in detail here.
  • an embodiment of the present disclosure also provides a printed circuit board, which includes:
  • the second body 60 includes a strip-shaped main part 601 and at least one branch part 602 connected to the long side of the strip-shaped main part 601; wherein, the at least one branch part 602 can be one, or it can be It is multiple and is not limited here.
  • a plurality of bonding pads 70 are located at at least one side of each branch portion 602 adjacent to the strip-shaped main portion 601 .
  • the plurality of bonding pads 70 extend along the third direction and along the The fourth direction intersecting the third direction is arranged in sequence, and the plurality of binding pads 70 are used for binding with the plurality of input pads 30 of the flexible circuit board as described in any one of the above.
  • the printed circuit board provided by the embodiment of the present disclosure includes a second body 60 .
  • the second body 60 includes a strip-shaped main body part 601 and at least one branch connected to the long side of the strip-shaped main body part 601 .
  • the specific number of branch parts 602 and at least one branch part 602 can be set according to actual application needs, and is not limited here.
  • the printed circuit board also includes at least one side adjacent to each branch portion 602 and the bar-shaped main portion 601 , wherein there are two adjacent sides between each branch portion 602 and the bar-shaped main portion 601 .
  • multiple pads may be provided on one side of the branch part 602 adjacent to the bar-shaped main part 601, or both sides of the branch part 602 connected to the bar-shaped main part 601 may be provided with multiple pads.
  • the plurality of bonding pads 70 extend along the third direction and are sequentially arranged along the fourth direction that intersects the third direction, where the direction shown by arrow y' represents the third direction, and the direction shown by arrow x' represents the fourth direction. direction.
  • the plurality of bonding pads 70 are used for bonding the multiple input pads 30 of the flexible circuit board as described above.
  • the printed circuit board can be arranged in the following ways, but is not limited to the following ways.
  • the two branch portions 602 located at the edge of the at least one branch portion 602 are only adjacent to one side of the short side of the strip-shaped main portion 601 .
  • the plurality of bonding pads 70 are provided on one side of the branch portion 602 and the other two sides adjacent to the strip-shaped main portion 601 are provided with the plurality of bonding pads 70 .
  • the two branch portions 602 located at the edge of at least one branch portion 602 are only provided with a plurality of bonding pads 70 on one side adjacent to the short side of the strip body portion 601 .
  • At least one branch portion A plurality of bonding pads 70 are provided on two sides of the other branch portions 602 in 602 adjacent to the short sides of the bar-shaped main portion 601.
  • each branch portion 602 is compared with the bar-shaped main portion 601.
  • the plurality of bonding pads 70 are symmetrically arranged relative to the center line of the strip portion, thereby ensuring the structural stability of the printed circuit board.
  • the plurality of bonding pads 70 are provided on both sides of each branch portion 602 adjacent to the strip-shaped main portion 601 .
  • the uniformity of force on each branch portion 602 of the printed circuit board is ensured, and the usability performance of the printed circuit board is improved.
  • the short side of the strip-shaped main part 601 protrudes from the outermost branch part 602 .
  • the short side of the strip-shaped main part 601 is flush with the corresponding side of the outermost branch part 602 .
  • the long side of the printed circuit board can be made shorter, ensuring a thinner and lighter design of the printed circuit board.
  • an embodiment of the present disclosure also provides a display module, including:
  • the display panel 100 at least one flexible circuit board 200 and at least one printed circuit board 300;
  • the display panel 100 includes a plurality of connection pads located in the binding area (not shown in Figure 16); at least one flexible circuit board 200 may be one, or may be multiple, which is not limited here; at least One printed circuit board 300 may be one or multiple, which is not limited here.
  • Figure 16 illustrates a situation where the display module includes four flexible circuit boards 200 and one printed circuit board 300.
  • the number of at least one flexible circuit board 200 and at least one printed circuit board 300 in the display module can also be set according to actual application needs.
  • the number of printed circuit boards 300 is not limited here.
  • the flexible circuit board 200 includes a first body 10 , a plurality of output pads 20 and a plurality of input pads 30 .
  • the first body 10 includes a bendable portion 11 and a flat portion 12 connected to each other.
  • the bendable portion 11 includes a protruding portion 110 that protrudes compared to the flat portion 12.
  • the plurality of output pads 20 are located on the protruding portion 110 and are bound and connected to the plurality of connection pads.
  • the plurality of input pads 20 are The disk 30 is located on the side of the flat part 12 away from the bendable part 11;
  • the printed circuit board 300 includes a second body 60 and a plurality of bonding pads 70 .
  • the second body 60 includes a strip-shaped main part 601 and at least one branch part connected to a long side of the strip-shaped main part 601 602.
  • the plurality of bonding pads 70 are located on at least one side of each of the branch portions 602 adjacent to the strip-shaped main portion 601, and the plurality of bonding pads 70 are connected to the plurality of inputs. Pad 30 bonding connection.
  • the flexible circuit board 200 can adopt the structure shown in Figure 8
  • the printed circuit board 300 can adopt the structure shown in Figure 13 structure
  • the flexible circuit board 200 and the printed circuit board 300 are electrically connected through the plurality of input pads 30 and the plurality of bonding pads 70 , so that the printed circuit board 300 passes through the plurality of bonding pads 70
  • a plurality of input pads 30 can output relevant signals to the printed circuit board.
  • the flexible circuit board 200 and the display panel 100 can be electrically connected through the plurality of output pads 20 and the plurality of connection pads. In this way, the flexible circuit board 200 can be electrically connected through the plurality of output pads 20 and the plurality of connection pads.
  • the control signal related to the display function is output to the display substrate, thereby ensuring the performance of the display device.
  • the display module provided by the embodiment of the present disclosure is not limited to including four flexible circuit boards 200 , but may also include other numbers of flexible circuit boards 200 , and the number of flexible circuit boards 200 may be set according to actual application needs. The number is not limited here.
  • the flexible circuit board 200 adopts a non-flat design (special-shaped design) as shown in FIG. 16.
  • the flat The portion 12 is kept straight, which not only avoids breakage caused by bending of the flexible circuit board 200, but also avoids bonding defects caused by pulling the bonding position between the flexible circuit board 200 and the printed circuit board, thus ensuring the performance of the display device.
  • each of the output pads 20 extends along the first direction and is sequentially arranged along the second direction intersecting the first direction
  • each of the input pads 30 extends along the third direction. and are arranged in sequence along a fourth direction that intersects the third direction, the first direction is substantially the same as the fourth direction, and the second direction is substantially the same as the third direction.
  • Figure 17 is a schematic structural diagram of a display module.
  • the flexible circuit board 200 can adopt the structure shown in Figure 9, and the printed circuit board 300 can adopt a structure similar to Figure 13. structure, wherein, in the flexible circuit board 200, the flat portion 12 includes a first side 121 adjacent to the protruding portion 110, a second side 122 opposite to the first side 121, and away from the first side 121.
  • the third side 123 of the bendable portion 11, the first side 121 and the second side 122 all extend along the second direction, and the first side 121 is longer than the second side.
  • the side 122 and the third side 123 are inclined at a preset angle compared to the first direction, and the preset angle may be as shown in ⁇ in FIG. 9 .
  • FIG. 18 is a schematic structural diagram of a display module.
  • the flexible circuit board 200 can adopt the structure shown in FIG. 10
  • the printed circuit board 300 can adopt the structure shown in FIG. 10 .
  • a similar structure is shown in FIG. 13 , wherein the fourth direction is substantially the same as the extending direction of the third side 123 .
  • the flexible circuit board 200 further includes a driver chip 40 located on the flat part 12 , and the driver chip 40 is located close to the plurality of input pads 30 One side of the bendable portion 11 .
  • the driver chip 40 can be configured with reference to FIGS. 8 to 10 , and will not be described in detail here.
  • the driver chip 40 extends generally along the first direction.
  • the extension direction of the driver chip 40 is substantially the same as the extension direction of the flat portion 12 away from the third side 123 of the bendable portion 11 .
  • the flexible circuit board 200 further includes a plurality of signal traces 50 , each of the signal traces 50 is electrically connected to the driver chip 40 and the corresponding output pad 20 , respectively.
  • the lengths of the signal traces 50 are approximately the same.
  • the signal traces 50 electrically connected to the output pads 20 of the plurality of output pads 20 close to the driver chip 40 are designed in a curve, and among the plurality of output pads 20 The signal trace 50 electrically connected to the output pad 20 away from the driver chip 40 is designed in a straight line.
  • the shape of the orthographic projection on the flexible circuit board of the signal trace 50 electrically connected to the output pad 20 of the plurality of output pads 20 close to the driver chip 40 includes At least one of a single triangle, a triangular zigzag, a single rectangle, a rectangular zigzag, and an arc.
  • the signal wiring 50 may be arranged as shown in FIG. 11 or FIG. 12 , and will not be described in detail here. Of course, the signal wiring 50 can also be set according to actual application needs, which is not limited here.
  • the plurality of bonding pads 70 in the printed circuit board 300 extend along the third direction and are sequentially arranged along the fourth direction intersecting the third direction.
  • the fourth direction intersecting the third direction.
  • the two branch portions 602 located at the edge of the at least one branch portion 602 are only arranged on one side adjacent to the short side of the strip-shaped main portion 601 .
  • the plurality of bonding pads 70 are provided on both sides of the other branch portion 602 adjacent to the strip-shaped main portion 601 .
  • the plurality of bonding pads 70 are provided on both sides of each branch portion 602 adjacent to the strip-shaped main portion 601 .
  • the short side of the strip-shaped main part 601 protrudes from the outermost branch part 602 .
  • the short side of the strip-shaped main part 601 is flush with the corresponding side of the outermost branch part 602 .
  • the principle of the problem solved by the display module is similar to that of the aforementioned flexible circuit board 200 and printed circuit board 300. Therefore, the implementation of the display module can refer to the implementation of the aforementioned flexible circuit board 200 and printed circuit board 300. Repeat No further details will be given.
  • the special-shaped flexible circuit board 200 and the special-shaped printed circuit board 300 can be combined in various ways.
  • the flexible circuit board 200 and the printed circuit board 300 can be configured according to the number of flexible circuit boards 200 and other design requirements.
  • the number of flexible circuit boards 200 is related to the screen resolution. For example, if the resolution is 2560*1600 and true RGB pixel arrangement is used, the number of flexible circuit boards 200 is n.
  • the number of flexible circuit boards 200 can also be set according to actual application needs, and is not limited here.
  • the display module can have the following settings, but it is not limited to the following settings.
  • the display device can be set according to actual application needs, which is not limited here.
  • the two branch portions 602 located at the edge of the printed circuit board 300 are only provided with one side adjacent to the short side of the strip-shaped main portion 601 .
  • a plurality of bonding pads 70 are provided on both sides of at least one branch portion 602 where the other branch portions 602 are adjacent to the strip-shaped main portion 601 .
  • Each flexible circuit board 200 is smaller than a printed circuit board.
  • the center lines of the plate 300 are symmetrically distributed.
  • a plurality of bonding pads 70 are provided on both sides of each branch portion 602 of the printed circuit board 300 adjacent to the strip-shaped main portion 601 , and The short side of the strip-shaped main part 601 protrudes from the outermost branch part 602 , and each flexible circuit board 200 is symmetrically distributed relative to the center line of the printed circuit board 300 .
  • a plurality of bonding pads 70 are provided on both sides of each branch portion 602 adjacent to the strip-shaped main portion 601 of the printed circuit board 300, and The short side of the strip-shaped main part 601 is flush with the corresponding side of the outermost branch part 602 , and each flexible circuit board 200 is symmetrically distributed relative to the center line of the printed circuit board 300 .
  • the positional relationship between the display panel 100 and the flexible circuit board 200 and the printed circuit board 300 in the display module can also be set according to this method.
  • the disclosed inventive concept uses other methods to configure the display module, which will not be described in detail here.
  • parameters related to the flexible circuit board 200 , the printed circuit board 300 and the display panel 100 in the display module can be set according to the following rules.
  • a represents the extension length of the third side 123 of the flat portion 12 along the fourth direction, and the specific numerical range of the extension length depends on the number of the plurality of input pads 30 and the spacing between two adjacent pads ( Pitch);
  • b represents the length of the branch portion 602 extending beyond the flat portion 12 along the fourth direction, and the corresponding numerical range can satisfy b ⁇ 3.5mm;
  • c represents the extension length of the branch portion 602 along the fourth direction, and the corresponding numerical range can be Satisfies c ⁇ (a+2b);
  • d represents the distance from the branch part 602 to the bendable area B, and the corresponding numerical range may be satisfies d ⁇ (0.06*(Bonding tolerance of the printed circuit board 300)+0.15*(printed circuit Shape tolerance of the board 300) + 0.5* (bending tolerance of the flexible circuit
  • k The corresponding value is much smaller than the minimum length of the PCB in the traditional solution in Figure 1 (for example, its minimum length is (l-7.06*2+3.5*2)).
  • the range satisfies (j ⁇ m+0.5*(glue width)+the
  • the flexible circuit board 200 and the printed circuit board 300 will be heated during Bonding to make the anisotropic conductive film (ACF) effective.
  • ACF anisotropic conductive film
  • the flexible circuit board 200 and the printed circuit board 300 are heated, Expansion will occur when the flexible circuit board 200 and the printed circuit board 300 are made of different materials, and the corresponding expansion coefficients and amounts of expansion are also different. It is usually necessary to pre-shrink the flexible circuit board 200 and the printed circuit board 300 with different values to achieve The purpose of improving Bonding yield.
  • the corresponding Bonding area expansion diagram is shown in Figure 22.
  • the small arrow represents the expansion direction of the flexible circuit board
  • the large arrow represents the expansion direction of the printed circuit board.
  • the corresponding Bonding area expansion diagram is shown in Figure 23.
  • the small arrow represents the expansion direction of the flexible circuit board 200
  • the large arrow represents the expansion direction of the printed circuit board 300.
  • the circuit board 200 and the printed circuit board 300 expand simultaneously.
  • the Pin contact area is relatively stable and the bonding yield is high.
  • an embodiment of the present disclosure also provides a vehicle-mounted display device.
  • the vehicle-mounted display device includes:
  • the display module 1000 may be arranged in a non-rectangular shape, such as C-shaped or S-shaped.
  • the vehicle-mounted display device may be C-shaped or S-shaped, and the vehicle-mounted display device may be applied to the vehicle.
  • the vehicle can be a motor vehicle or a non-motor vehicle.
  • the vehicle-mounted display device can be set at the position of the navigator and used as a navigator.
  • the vehicle-mounted display device can also be set at the position of the front view mirror, and the vehicle-mounted display device can also be set as a navigation device. Within the line of sight of the co-pilot, of course, the specific position and function of the vehicle-mounted display device can be set according to actual application needs, which are not limited here.
  • the thin film encapsulation layer 2000 is used to encapsulate the display module 1000 to block water and oxygen erosion and prevent water and oxygen from entering the display module 1000 and causing the display module 1000 to fail.
  • the thin film encapsulation layer 2000 may include a first inorganic layer, a second inorganic layer and an organic layer located between the first inorganic layer and the second inorganic layer.
  • the material of the first inorganic layer may be silicon oxide, silicon nitride, nitrogen. At least one of silicon oxide, the material of the second inorganic layer can be at least one of silicon oxide, silicon nitride, and silicon oxynitride.
  • the thin film encapsulation layer 2000 may also include more film layers in which inorganic layers and organic layers are alternately arranged, which is not limited here.
  • the vehicle-mounted display device also includes a touch functional layer 3000 (Flexible Multi-Layer On Cell, FMLOC) located on the thin film encapsulation layer 2000.
  • the touch functional layer can be directly produced on the thin film encapsulation layer 2000.
  • the touch function layer 3000 is accordingly arranged in the film layer structure, so there is no need to set up an additional touch substrate, thereby ensuring the light and thin design of the vehicle display device while ensuring the touch control of the vehicle display device. Function.
  • the vehicle-mounted display device also includes a filter layer 4000 located on the touch function layer 3000.
  • the filter layer 4000 can be a polarizer or a color filter.
  • the thickness of the polarizer is generally thicker.
  • COE color filter on encapsulation
  • the vehicle-mounted display device further includes a protective cover 5000 located on the filter layer 4000 .
  • a protective cover 5000 located on the filter layer 4000 .
  • the coating includes one or more of an AG (anti-glare) protective film layer, an AF (anti-fingerprint) protective film layer, and a UV (anti-ultraviolet) protective film layer, which is not limited here.

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Abstract

本公开提供了一种显示模组及车载显示装置，其中，该显示模组包括：显示面板、至少一个柔性电路板以及至少一个印刷电路板；显示面板包括位于绑定区的多个连接焊盘；柔性电路板包括第一本体、多个输出焊盘和多个输入焊盘，第一本体包括相互连接的可弯曲部和平坦部，可弯曲部包括相较于平坦部突出的突出部，多个输出焊盘位于突出部，且与多个连接焊盘绑定连接，多个输入焊盘位于平坦部背离可弯曲部的一侧；印刷电路板包括第二本体和多个绑定焊盘，第二本体包括条形主体部和与条形主体部的长边连接的至少一个分支部，多个绑定焊盘位于各个分支部与条形主体部相邻的至少一个侧边，且多个绑定焊盘与多个输入焊盘绑定连接。

Description

一种显示模组及车载显示装置 技术领域
本公开涉及显示技术领域，特别涉及一种显示模组及车载显示装置。
背景技术
随着人们对车载显示体验需求的提升，车载显示的形态越来越多样化。传统基于液晶显示器(Liquid Crystal Display，LCD)的车载显示，因通常为平面或者大曲率R≥1000mm的刚性形态，无法满足多形态化的需求。
目前，基于柔性有机发光半导体(Organic Light-Emitting Diode，OLED)实现小半径的弯曲及S形等多种形态的车载显示，成为目前的主流趋势。
发明内容
本公开实施例提供的显示模组，包括：
显示面板、至少一个柔性电路板以及至少一个印刷电路板；
其中，所述显示面板包括位于绑定区的多个连接焊盘；
所述柔性电路板包括第一本体、多个输出焊盘和多个输入焊盘，所述第一本体包括相互连接的可弯曲部和平坦部，所述可弯曲部包括相较于所述平坦部突出的突出部，所述多个输出焊盘位于所述突出部，且与所述多个连接焊盘绑定连接，所述多个输入焊盘位于所述平坦部背离所述可弯曲部的一侧；
所述印刷电路板包括第二本体和多个绑定焊盘，所述第二本体包括条形主体部和与所述条形主体部的长边连接的至少一个分支部，所述多个绑定焊盘位于各个所述分支部与所述条形主体部相邻的至少一个侧边，且所述多个绑定焊盘与所述多个输入焊盘绑定连接。
在一种可能的实现方式中，各个所述输出焊盘沿第一方向延伸且沿与所述第一方向相交的第二方向依次排列，各个输入焊盘沿第三方向延伸且沿与所述第三方向相交的第四方向依次排列，所述第一方向与所述第四方向大致 相同，所述第二方向与所述第三方向大致相同。
在一种可能的实现方式中，所述平坦部包括与所述突出部邻接的第一侧边，与所述第一侧边相对设置的第二侧边，远离所述可弯曲部的第三侧边，所述第一侧边和所述第二侧边均沿所述第二方向延伸，且所述第一侧边长于所述第二侧边，所述第三侧边相较于所述第一方向倾斜一预设角度。
在一种可能的实现方式中，所述第四方向与所述第三侧边的延伸方向大致相同。
在一种可能的实现方式中，其中，所述柔性电路板还包括驱动芯片，位于所述平坦部，所述驱动芯片位于所述多个输入焊盘靠近所述可弯曲部的一侧。
在一种可能的实现方式中，所述驱动芯片大致沿所述第一方向延伸。
在一种可能的实现方式中，所述驱动芯片的延伸方向与所述平坦部远离所述可弯曲部的第三侧边的延伸方向大致相同。
在一种可能的实现方式中，所述柔性电路板还包括多条信号走线，每条所述信号走线分别与所述驱动芯片和相应的所述输出焊盘电连接，各条所述信号走线的长度大致相同。
在一种可能的实现方式中，所述多个输出焊盘中靠近所述驱动芯片的所述输出焊盘所电连接的信号走线呈曲线设计，所述多个输出焊盘中背离所述驱动芯片的所述输出焊盘所电连接的信号走线呈直线设计。
在一种可能的实现方式中，所述多个输出焊盘中靠近所述驱动芯片的所述输出焊盘所电连接的信号走线，在所述柔性电路板上的正投影的形状包括单个三角形、三角锯齿形、单个矩形、矩形锯齿形、弧形中的至少一种。
在一种可能的实现方式中，所述多个绑定焊盘沿所述第三方向延伸且沿与所述第三方向相交的第四方向依次排列。
在一种可能的实现方式中，所述至少一个分支部中位于边缘的两个分支部仅与所述条形主体部的短边相邻的一个侧边设置所述多个绑定焊盘，其他分支部与所述条形主体部相邻的两个侧边均设置所述多个绑定焊盘。
在一种可能的实现方式中，各个所述分支部与所述条形主体部相邻的两个侧边均设置所述多个绑定焊盘。
在一种可能的实现方式中，所述条形主体部的短边突出于最外侧的分支部。
在一种可能的实现方式中，所述条形主体部的短边与最外侧的分支部相应侧边齐平设置。
本公开实施例还提供了车载显示装置，包括：
上述显示模组，以及位于所述显示模组上的薄膜封装层、触控功能层、滤光层和保护盖板。
附图说明
图1为相关技术中COF Bonding方案的其中一种结构示意图；
图2为相关技术中COF Bonding方案中PCB与COF Bonding位置发生Peeling的其中一种结构示意图；
图3为相关技术中COF Bonding方案中IC Crack的其中一种结构示意图；
图4为本公开实施例提供的一种柔性电路板的其中一种结构示意图；
图5为本公开实施例提供的一种柔性电路板的其中一种结构示意图；
图6为本公开实施例提供的一种柔性电路板的其中一种结构示意图；
图7为本公开实施例提供的一种柔性电路板的其中一种结构示意图；
图8为本公开实施例提供的一种柔性电路板的其中一种结构示意图；
图9为本公开实施例提供的一种柔性电路板的其中一种结构示意图；
图10为本公开实施例提供的一种柔性电路板的其中一种结构示意图；
图11为本公开实施例提供的一种柔性电路板的其中一种结构示意图；
图12为本公开实施例提供的一种柔性电路板的其中一种结构示意图；
图13为本公开实施例提供的一种印刷电路板的其中一种结构示意图；
图14为本公开实施例提供的一种印刷电路板的其中一种结构示意图；
图15为本公开实施例提供的一种印刷电路板的其中一种结构示意图；
图16为本公开实施例提供的一种显示模组的其中一种结构示意图；
图17为本公开实施例提供的一种显示装置的其中一种结构示意图；
图18为本公开实施例提供的一种显示装置的其中一种结构示意图；
图19为本公开实施例提供的一种显示装置的其中一种结构示意图；
图20为本公开实施例提供的一种显示装置的其中一种结构示意图；
图21为本公开实施例提供的一种显示装置的其中一种结构示意图；
图22为图1所示的Bonding方案中相应的Bonding区膨胀示意图；
图23为图20所示的Bonding方案中相应的Bonding区膨胀示意图；
图24为本公开实施例提供的一种车载显示装置的其中一种结构示意图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。并且在不冲突的情况下，本公开中的实施例及实施例中的特征可以相互组合。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。
需要注意的是，附图中各图形的尺寸和形状不反映真实比例，目的只是示意说明本公开内容。并且自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。
在相关技术中，基于柔性OLED的车载显示可以实现小半径的弯曲及S形等多种形态。如图1所示为相关技术中覆晶薄膜(Chip on Film，COF)03分别与面板(Panel)01和印刷电路板(Printed Circuit Board，PCB)02绑定 (Bonding)的其中一种结构示意图，如图2和图3所示为Panel 01贴合到C形盖板(Cover Glass，CG)上后变为C形，图中未示意出CG，其中，图2为采用图1所示的COF Bonding方案对应的其中一种正面结构示意图，图3为采用图1所示的COF Bonding方案对应的其中一种反面结构示意图。PCB 02与COF 03Bonding位置发生脱落(Peeling)的位置如图2中虚线框M所示，COF 03上集成电路(Integrated Circuit，IC)04断裂(Crack)的位置如图3中虚线框N所示)。由于通道数等原因，矩形COF 03随Panel 01弯曲时，由于COF 03上的IC 04及COF 03所绑定的PCB 02为平直刚性部件，不会随着COF 03弯曲，从而导致IC Crack以及PCB Bonding不良。
鉴于此，本公开实施例提供了一种显示模组和车载显示装置，用于避免IC断裂以及PCB脱落，提高柔性电路板和印刷电路板的使用性能。
如图4所示为本公开实施例中柔性电路板的其中一种结构示意图，具体来讲，本公开实施例提供的柔性电路板，包括：
第一本体10，所述第一本体10包括相互连接的可弯曲部11和平坦部12，所述可弯曲部11包括相较于所述平坦部12突出的突出部110；
多个输出焊盘20，位于所述突出部110，所述多个输出焊盘20用于与显示面板绑定连接；
多个输入焊盘30，位于所述平坦部12背离所述可弯曲部11的一侧，所述多个输入焊盘30用于与印刷电路板绑定连接。
仍结合图4所示，第一本体10包括相互连接的可弯曲部11和平坦部12，可弯曲部11包括相较于平坦部12突出的突出部110。其中，可弯曲部11可以被弯曲至C形、S形等形态，且在弯曲过程中，平坦部12可以保持平直。在具体实施过程中，可弯曲部11与平坦部12可以构成L形的第一本体10，相应地，柔性电路板呈L形设计。
仍结合图4所示，柔性电路板还包括位于突出部110的多个输出焊盘20，多个输出焊盘20用于与显示面板绑定连接。也就是说，可以通过多个输出焊盘20将柔性电路板与显示面板绑定连接。这样的话，柔性电路板经多个输出 焊盘20可以将与显示功能有关的控制信号输出至显示面板，从而保证了柔性电路板的使用性能。此外，可以根据实际应用需要来设置多个输出焊盘20的具体数量，在此不做限定。
柔性电路板还包括位于平坦部12且背离可弯曲部11一侧的多个输入焊盘30，多个输入焊盘30用于与印刷电路板绑定连接。也就是说，可以通过多个输入焊盘30将柔性电路板与印刷电路板绑定连接。这样的话，印刷电路板经多个输入焊盘30可以将相关信号输出至柔性电路板，从而保证了柔性电路板的使用性能。此外，可以根据实际应用需要来设置多个输入焊盘30的具体数量，在此不做限定。
由于本公开实施例所提供的柔性电路板的第一本体10，不仅所包括的可弯曲部11包括相较于平坦部12突出的突出部110，而且所包括平坦部12在可弯曲部11弯曲过程中保持平直。与相关技术中的柔性电路板相比，在后续将柔性电路板分别与显示面板和印刷电路板绑定连接之后，在弯曲显示面板的过程中，不仅可以避免因柔性电路板弯曲所致的断裂，还可以避免柔性电路板与印刷电路板Bonding位置发生拉扯所致的Bonding不良，从而提高了柔性电路板的使用性能。
在本公开实施例中，各个所述输出焊盘20沿第一方向延伸且沿与所述第一方向相交的第二方向依次排列，各个输入焊盘30沿第三方向延伸且沿与所述第三方向相交的第四方向依次排列，所述第一方向与所述第四方向大致相同，所述第二方向与所述第三方向大致相同。
在其中一种示例性实施例中，如图5所示，为了保证柔性电路板信号输入与信号输出的功能，提高柔性电路板分别与显示面板和印刷电路板之间的绑定性能，多个输出焊盘20中各个输出焊盘20沿第一方向延伸，且沿与第一方向相交的第二方向依次排列，多个输入焊盘30中各个输入焊盘30沿第三方向延伸且沿与第三方向相交的第四方向依次排列，第一方向与第四方向大致相同，第二方向与第三方向大致相同。其中，箭头x所示的方向为第一方向，箭头y所示的方向为第二方向，箭头y’所示的方向为第三方向，箭头x’ 所示的方向为第四方向。需要说明的是，在本公开实施例中，“大致相同”可以是完全相同，还可以是近似相同。图5中示意出了第一方向与第四方向完全相同，第二方向与第三方向完全相同的情况。
在本公开实施例中，柔性电路板中平坦部12的设置情况可以有以下几种情况，但又不仅限于以下几种情况。在其中一种示例性实施例中，如图6所示，所述平坦部12包括与所述突出部110邻接的第一侧边121，与所述第一侧边121相对设置的第二侧边122，远离所述可弯曲部11的第三侧边123，所述第一侧边121和所述第二侧边122均沿所述第二方向延伸，且所述第一侧边121长于所述第二侧边122，所述第三侧边123相较于所述第一方向倾斜一预设角度。
仍结合图6所示，平坦部12包括与突出部110邻接的第一侧边121，与该第一侧边121相对设置的第二侧边122，平坦部12还包括远离可弯曲部11的第三侧边123，第一侧边121和第二侧边122均沿第二方向延伸，且第一侧边121长于第二侧边122，第三侧边123相较于第一方向倾斜一预设角度，如图6所示，预设角度为α。当然，本领域技术人员可以根据实际应用需要预先设置第三侧边123相较于第一方向所倾斜的预设角度的具体数值，在此不做限定。
在其中一种示例性实施例中，如图7所示，所述第四方向与所述第三侧边123的延伸方向大致相同。
在本公开实施例中，柔性电路板可以为COF，如图8至图10所示，所述柔性电路板还包括驱动芯片40，位于所述平坦部12，所述驱动芯片40位于所述多个输入焊盘30靠近所述可弯曲部11的一侧。
仍结合图8至图10所示，柔性电路板还包括位于平坦部12的驱动芯片40，驱动芯片40用于通过多个输出焊盘20向与多个输出焊盘20绑定的显示面板加载与显示功能相关的控制信号，比如，时钟信号、帧起始信号、高电位信号、低电位信号等。此外，驱动芯片40位于多个输入焊盘30靠近可弯曲部11的一侧，多个输入焊盘30与驱动芯片40之间空间分布上互不干扰。
结合图8和图9所示，在其中一种示例性实施例中，所述驱动芯片40大致沿所述第一方向延伸。从而提高了平坦部12的空间利用率。
结合图10所示，在其中一种示例性实施例中，所述驱动芯片40的延伸方向与所述平坦部12远离所述可弯曲部11的第三侧边123的延伸方向大致相同。如此一来，改善了柔性电路板的走线电阻不均的问题，提高了柔性电路板的使用性能。当然，除了上述提及的方式来设置驱动芯片40之外，还可以基于本公开构思采用其它方式来设置，在此不做限定。
在本公开实施例中，所述柔性电路板还包括多条信号走线50，每条所述信号走线50分别与所述驱动芯片40和相应的所述输出焊盘20电连接，各条所述信号走线50的长度大致相同。
在具体实施过程中，柔性电路板还包括多条信号走线50，可以根据实际应用需要来设置多条信号走线50的具体条数，在此不做限定。多条信号走线50中每条信号走线50分别与驱动芯片40和多个输出焊盘20中相应的输出焊盘20电连接，各条信号走线50的长度大致相同，如此一来，可以通过调整各条信号走线50的长度，将各条信号走线50的长度调整为大致相同，保证了各条信号走线50的电阻大致相同，在柔性电路板通过多个输出焊盘20与显示面板绑定连接之后，保证了显示面板的显示均一性，提高了显示面板的显示效果。此外，柔性电路板还包括分别与驱动芯片40和多个输入焊盘30电连接的多条走线，各条走线呈直线设置，且各条走线与相应的输入焊盘30直接相连，多条走线可以是呈扇形分布，从而保证了可以通过各个输入焊盘30对驱动芯片40加载相关信号，保证了柔性电路板的使用性能。
在其中一种示例性实施例中，结合图11所示，所述多个输出焊盘20中靠近所述驱动芯片40的所述输出焊盘20所电连接的信号走线50呈曲线设计，所述多个输出焊盘20中背离所述驱动芯片40的所述输出焊盘20所电连接的信号走线50呈直线设计。
在本公开实施例中，所述多个输出焊盘20中靠近所述驱动芯片40的所述输出焊盘20所电连接的信号走线50，在所述柔性电路板上的正投影的形状 包括单个三角形、三角锯齿形、单个矩形、矩形锯齿形、弧形中的至少一种。
仍结合图11所示，多个输出焊盘20中靠近驱动芯片40的输出焊盘20所电连接的信号走线50，在柔性电路板上的投影形状为矩形锯齿形的其中一种结构示意图，图11中未示意出所有的信号走线60的设置情况，可以采用同样的公开构思对每条信号走线60进行设置，在此不做详述。多个输出焊盘20中背离驱动芯片40的输出焊盘20所电连接的信号走线50呈直线设计，以便将各条信号走线50的长度设置为大致相同，从而保证了各条信号走线50的电阻的均一性，进而提高了柔性电路板的使用性能。
在其中一种示例性实施例中，如图11所示，多个输出焊盘20中背离驱动芯片40的输出焊盘20所电连接的信号走线50呈直线设计，多个输出焊盘20中靠近驱动芯片40的输出焊盘20所电连接的信号走线50，在柔性电路板上的投影形状为矩形锯齿形，且包括尺寸相同的多个矩形重复单元，若各个矩形重复单元等密度分布在相应的信号走线50，则沿所述第一方向且背离所述驱动芯片40的方向，多条信号走线50上的矩形重复单元的数量呈减小趋势，图11中各条信号走线60可以采用相同的构思进行设置，在此不做详述。如此一来，保证了各条信号走线50的电阻的均一性，进而提高了柔性电路板的使用性能。
在其中一种示例性实施例中，如图12所示，多个输出焊盘20与驱动芯片40电连接的多条信号走线50中，每条信号走线50包括沿第一方向延伸的第一部分501和沿所述第二方向延伸的第二部分502。在具体实施过程中，呈曲线设计的信号走线50包括至少一个曲线单元，该至少一个曲线单元可以是仅设置在第一部分501，还可以是仅设置在第二部分502，还可以是分别设置在第一部分501和第二部分502。当然，还可以根据柔性电路板的弯折性能对各条信号走线50进行设置，在此不做限定。
需要说明的是，图11和图12中仅示意出了其中部分信号走线50的设置情况，当然，可以根据上述同样的设计构思，对每个输出焊盘20与驱动芯片40之间的信号走线50进行设置，在此不做详述。
在本公开实施例提供的柔性电路板中，柔性电路板还包括可弯折区B，可弯折区B位于多个输出焊盘20靠近可弯曲部11的一侧，在通过多个输出焊盘20与显示面板绑定连接之后，可以沿可弯折区B将柔性电路板中可弯折区B背离多个输出焊盘20的一侧的部分弯折至显示面板的背面，从而保证了显示面板的窄边框设计。此外，仍结合图11所示，各条信号走线50位于可弯折区B的部分呈直线设计，避免了信号走线50的断裂，提高了显示面板的使用性能。当然，本公开实施例中的柔性电路板除了可以包括上述提及的结构之外，还可以根据实际应用需要来设置其它结构，对于其它结构可以参照相关技术来设置，在此不做详述。
基于同一公开构思，如图13所示，本公开实施例还提供了一种印刷电路板，其中，包括：
第二本体60，所述第二本体60包括条形主体部601和与所述条形主体部601的长边连接的至少一个分支部602；其中，至少一个分支部602可以是一个，还可以是多个，在此不做限定。
多个绑定焊盘70，位于各个所述分支部602与所述条形主体部601相邻的至少一个侧边，所述多个绑定焊盘70沿第三方向延伸且沿与所述第三方向相交的第四方向依次排列，所述多个绑定焊盘70用于与如上面任一项所述的柔性电路板的所述多个输入焊盘30绑定。
仍结合图13所示，本公开实施例所提供的印刷电路板包括第二本体60，该第二本体60包括条形主体部601和与该条形主体部601的长边连接的至少一个分支部602，对于至少一个分支部602的具体数量可以根据实际应用需要来设置，在此不做限定。印刷电路板还包括位于各个分支部602与条形主体部601相邻的至少一个侧边，其中，各个分支部602与条形主体部601之间相邻的侧边有两个。在具体实施过程中，可以是分支部602与条形主体部601相邻的一个侧边设置有多个焊盘，还可以是分支部602与条形主体部601相连的两个侧边均设置有多个焊盘，可以根据实际应用来设置，在此不做限定。多个绑定焊盘70沿第三方向延伸且沿与第三方向相交的第四方向依次排列， 其中，箭头y’所示的方向表示第三方向，箭头x’所示的方向表示第四方向。在具体实施过程中，多个绑定焊盘70用于如前述所述的柔性电路板的多个输入焊盘30绑定。
在本公开实施例中，印刷电路板可以有以下几种设置方式，但又不仅限于以下几种设置方式。在其中一种示例性实施例中，仍结合图13所示，所述至少一个分支部602中位于边缘的两个分支部602仅与所述条形主体部601的短边相邻的一个侧边设置所述多个绑定焊盘70，其他分支部602与所述条形主体部601相邻的两个侧边均设置所述多个绑定焊盘70。
仍结合图13所示，至少一个分支部602中位于边缘的两个分支部602仅与条形主体部601的短边相邻的一个侧边设置多个绑定焊盘70，至少一个分支部602中其他分支部602与条形主体部601的短边相邻的两个侧边均设置多个绑定焊盘70，在具体实施过程中，各个分支部602相较于条形主体部601的中心线对称设置，相应地，多个绑定焊盘70相较于条形部的中心线对称设置，从而保证了印刷电路板的结构稳定性。
在本公开实施例中，如图14和图15所示，各个所述分支部602与所述条形主体部601相邻的两个侧边均设置所述多个绑定焊盘70。在后续印刷电路板通过多个绑定焊盘70与柔性电路板绑定连接时，保证了印刷电路板各个分支部602受力的均一性，提高了印刷电路板的使用性能。
在其中一种示例性实施例中，如图14所示，所述条形主体部601的短边突出于最外侧的分支部602。
在其中一种示例性实施例中，如图15所示，所述条形主体部601的短边与最外侧的分支部602相应侧边齐平设置。相较于图14的设置来说，印刷电路板的长边可以做的更短，保证了印刷电路板的轻薄化设计。
基于同一公开构思，如图16所示，本公开实施例还提供了一种显示模组，包括：
显示面板100、至少一个柔性电路板200以及至少一个印刷电路板300；
其中，所述显示面板100包括位于绑定区的多个连接焊盘(图16中未示 意出)；至少一个柔性电路板200可以是一个，还可以是多个，在此不做限定；至少一个印刷电路板300可以是一个，还可以是多个，在此不做限定。图16中示意出了显示模组包括四个柔性电路板200和一个印刷电路板300的情况，当然，还可以根据实际应用需要来设置显示模组中至少一个柔性电路板200个数以及至少一个印刷电路板300的个数，在此不做限定。
所述柔性电路板200包括第一本体10、多个输出焊盘20和多个输入焊盘30，所述第一本体10包括相互连接的可弯曲部11和平坦部12，所述可弯曲部11包括相较于所述平坦部12突出的突出部110，所述多个输出焊盘20位于所述突出部110，且与所述多个连接焊盘绑定连接，所述多个输入焊盘30位于所述平坦部12背离所述可弯曲部11的一侧；
所述印刷电路板300包括第二本体60和多个绑定焊盘70，所述第二本体60包括条形主体部601和与所述条形主体部601的长边连接的至少一个分支部602，所述多个绑定焊盘70位于各个所述分支部602与所述条形主体部601相邻的至少一个侧边，且所述多个绑定焊盘70与所述多个输入焊盘30绑定连接。
以显示模组包括四个柔性电路板200和一个印刷电路板300为例，仍结合图16所示，柔性电路板200可以采用图8所示的结构，印刷电路板300可以采用图13所示的结构，相应地，通过多个输入焊盘30和多个绑定焊盘70将柔性电路板200和印刷电路板300电连接，如此一来，印刷电路板300经多个绑定焊盘70和多个输入焊盘30可以将相关信号输出至印刷电路板。而且，可以通过多个输出焊盘20和多个连接焊盘将柔性电路板200和显示面板100电连接，如此一来，柔性电路板200经多个输出焊盘20和多个连接焊盘可以将与显示功能相关的控制信号输出至显示基板，从而保证了显示装置的使用性能。
需要说明的是，本公开实施例所提供的显示模组不仅限于包括四个柔性电路板200的情况，还可以包括其它数量的柔性电路板200，可以根据实际应用需要来设置柔性电路板200的个数，在此不做限定。
在本公开实施例所提供的显示模组中，柔性电路板200采用图16所示的非平直设计(异形设计)，在后续弯折柔性电路板200的可弯曲部11的过程中，平坦部12保持平直，不仅避免了柔性电路板200弯曲所致的断裂，而且还避免了柔性电路板200与印刷电路板Bonding位置发生拉扯所致的Bonding不良，保证了显示装置的使用性能。
结合图16以及图5至图12所示，各个所述输出焊盘20沿第一方向延伸且沿与所述第一方向相交的第二方向依次排列，各个输入焊盘30沿第三方向延伸且沿与所述第三方向相交的第四方向依次排列，所述第一方向与所述第四方向大致相同，所述第二方向与所述第三方向大致相同。
在本公开实施例中，如图17所示为显示模组的其中一种结构示意图，在图17中，柔性电路板200可以采用图9所示的结构，印刷电路板300可以采用图13类似的结构，其中，在柔性电路板200中，所述平坦部12包括与所述突出部110邻接的第一侧边121，与所述第一侧边121相对设置的第二侧边122，远离所述可弯曲部11的第三侧边123，所述第一侧边121和所述第二侧边122均沿所述第二方向延伸，且所述第一侧边121长于所述第二侧边122，所述第三侧边123相较于所述第一方向倾斜一预设角度，预设角度可以是如图9中α所示。
在其中一种示例性实施例中，如图18所示为显示模组的其中一种结构示意图，在图18中，柔性电路板200可以采用图10所示的结构，印刷电路板300可以采用图13类似的结构，其中，所述第四方向与所述第三侧边123的延伸方向大致相同。
在本公开实施例中，如图16至图18所示，所述柔性电路板200还包括驱动芯片40，位于所述平坦部12，所述驱动芯片40位于所述多个输入焊盘30靠近所述可弯曲部11的一侧。其中，驱动芯片40可以参照图8至图10进行设置，在此不做详述。
在其中一种示例性实施例中，仍结合图8和图9所示，所述驱动芯片40大致沿所述第一方向延伸。
在其中一种示例性实施例中，如图10所示，所述驱动芯片40的延伸方向与所述平坦部12远离所述可弯曲部11的第三侧边123的延伸方向大致相同。
在本公开实施例中，所述柔性电路板200还包括多条信号走线50，每条所述信号走线50分别与所述驱动芯片40和相应的所述输出焊盘20电连接，各条所述信号走线50的长度大致相同。
在本公开实施例中，所述多个输出焊盘20中靠近所述驱动芯片40的所述输出焊盘20所电连接的信号走线50呈曲线设计，所述多个输出焊盘20中背离所述驱动芯片40的所述输出焊盘20所电连接的信号走线50呈直线设计。
在公开实施例中，所述多个输出焊盘20中靠近所述驱动芯片40的所述输出焊盘20所电连接的信号走线50，在所述柔性电路板上的正投影的形状包括单个三角形、三角锯齿形、单个矩形、矩形锯齿形、弧形中的至少一种。在其中一种示例性实施例中，信号走线50可以是参照图11或图12所示进行设置，在此不做详述。当然，还可以根据实际应用需要来设置信号走线50，在此不做限定。
在本公开实施例中，所述印刷电路板300中所述多个绑定焊盘70沿所述第三方向延伸且沿与所述第三方向相交的第四方向依次排列，具体设计可以参照图13所述，在此不做详述。
在本公开实施例中，仍结合图16所示，所述至少一个分支部602中位于边缘的两个分支部602仅与所述条形主体部601的短边相邻的一个侧边设置所述多个绑定焊盘70，其他分支部602与所述条形主体部601相邻的两个侧边均设置所述多个绑定焊盘70。
在本公开实施例中，如图19和图20所示，各个所述分支部602与所述条形主体部601相邻的两个侧边均设置所述多个绑定焊盘70。
仍结合图19所示，所述条形主体部601的短边突出于最外侧的分支部602。
仍结合图20所示，所述条形主体部601的短边与最外侧的分支部602相应侧边齐平设置。
在具体实施过程中，显示模组所解决问题的原理与前述柔性电路板200和印刷电路板300相似，因此该显示模组的实施可以参见前述柔性电路板200和印刷电路板300的实施，重复之处不再赘述。
根据前述的柔性电路板200的结构与相应印刷电路板300的结构，在显示模组中，异形的柔性电路板200与异形的印刷电路板300的配合可以采用多种方式，在具体实施过程中，可以根据柔性电路板200的数量以及其它设计要求来设置柔性电路板200与印刷电路板300。其中，柔性电路板200的数量与屏幕分辨率相关，比如，采用分辨率为2560*1600，真RGB像素排列，柔性电路板200的数量n，具体的数值范围为：n＝2560*3/1920＝4，其中，通道数为1920。当然，还可以根据实际应用需要来设置柔性电路板200的数量，在此不做限定。在具体实施过程中，显示模组可以有以下几种设置方式，但又不仅限于以下几种设置方式，可以根据实际应用需要来设置显示装置，在此不做限定。
在其中一种示例性实施例中，如图16至图18所示，印刷电路板300中位于边缘的两个分支部602仅与条形主体部601的短边相邻的一个侧边设置多个绑定焊盘70，至少一个分支部602中其他分支部602与条形主体部601相邻的两个侧边均设置多个绑定焊盘70，各个柔性电路板200相较于印刷电路板300的中心线呈对称分布。
在其中一种示例性实施例中，如图19所示，印刷电路板300中各个分支部602与条形主体部601相邻的两个侧边均设置有多个绑定焊盘70，且条形主体部601的短边突出于最外侧的分支部602，各个柔性电路板200相较于印刷电路板300的中心线呈对称分布。
在其中一种示例性实施例中，如图20所示，印刷电路板300中各个分支部602与条形主体部601相邻的两个侧边均设置有多个绑定焊盘70，且条形主体部601的短边与最外侧的分支部602相应侧边齐平设置，各个柔性电路板200相较于印刷电路板300的中心线呈对称分布。
需要说明的是，在具体实施过程中，除了可以采用上述提及的相关方式 来设置显示模组中的显示面板100与柔性电路板200和印刷电路板300的位置关系之外，还可以根据本公开的发明构思采用其它方式来设置显示模组，在此不做详述。
在其中一种示例性实施例中，结合图21所示，显示模组中柔性电路板200、印刷电路板300和显示面板100相关的参数可以按照以下规则进行设置。其中，a表示平坦部12的第三侧边123沿第四方向的延伸长度，延伸长度的具体数值范围取决于多个输入焊盘30的个数以及相邻两个焊盘之间的间距(Pitch)；b表示沿第四方向分支部602超出平坦部12的长度，相应的数值范围可以是满足b≥3.5mm；c表示分支部602沿第四方向的延伸长度，相应的数值范围可以是满足c≥(a+2b)；d表示分支部602到可弯折区B的距离，相应的数值范围可以是满足d≥(0.06*(印刷电路板300的Bonding公差)+0.15*(印刷电路板300的外形公差)+0.5*(柔性电路板200的弯折公差))，在其中一种示例性实施例中，d可以是0.7mm；e表示可弯折区B的宽度，相应的数值范围取决于弯折半径；f表示多个输出焊盘20沿第二方向的绑定宽度，相应的数值范围可以是满足(1.5*(Bonding宽度)+0.5*(涂胶宽度)＝2*(根据具体项目调整))；g表示柔性电路板200沿第一方向的延伸长度，相应的数值范围满足(g＝a+b+d+e+f)；l表示显示面板100显示区(Active Area，AA)沿第二方向的延伸宽度，相应的数值范围可以是满足(l≥i*n+h*(n-1)+7.06*(柔性电路板200距AA区的距离))；k表示条形主体部601沿第三方向的延伸长度，相应的数值范围可以是满足(k＝l-7.06*2-i*2-j*2+m*2)，在本公开实施例中，k对应的数值远小于图1传统方案中PCB的最小长度(比如，其最小长度为(l-7.06*2+3.5*2))，相应地，在本公开实施例中，可以有更小尺寸的印刷电路板300；h表示相邻两个柔性电路板200中可弯曲部11之间距离，相应的数值范围满足规范值≥17.024mm；i表示多个输出焊盘20沿第二方向的延伸长度，相应的数值范围取决于与多个输出焊盘20的个数和相邻两个输出焊盘20之间的间距(Pitch)；j表示平坦部12沿第二方向的延伸长度，相应的数值范围满足(j≥m+0.5*(涂胶宽度)+驱动芯片40沿第一方向的长度 +压接需求宽度)；m表示柔性电路板200多个输入焊盘30沿第三方向的延伸长度。当然，可以根据实际应用需要来设置a-m的相关数值，在此不做限定。
在本公开实施例中，柔性电路板200和印刷电路板300在Bonding时会加热以使异方性导电胶膜(Anisotropic Conductive Film，ACF)生效，当由于柔性电路板200和印刷电路板300受热时会发生膨胀，而且柔性电路板200与印刷电路板300的材料不同，相应的膨胀系数不同，膨胀量也不同，通常需要对柔性电路板200和印刷电路板300进行不同数值的预缩以达到提高Bonding良率的目的。如图1所示的Bonding方案中，相应的Bonding区膨胀示意图如图22所示，其中，小箭头表示柔性电路板的膨胀方向，大箭头表示印刷电路板的膨胀方向，四个柔性电路板同时Bonding在印刷电路板，受热后印刷电路板整体膨胀，而各个柔性电路板自身膨胀，极容易产生柔性电路板和印刷电路板对应的焊盘(Pin)接触面积不足造成Bonding不良。
在采用本公开实施例图20所示的Bonding方案时，相应的Bonding区膨胀示意图如图23所示，小箭头表示柔性电路板200的膨胀方向，大箭头表示印刷电路板300的膨胀方向，柔性电路板200和印刷电路板300同步膨胀，在采用和图22相同的Bonding精度及间距(Pitch)的情况下，Pin接触面积比较稳定，Bonding良率较高。
基于同一公开构思，如图24所示，本公开实施例还提供了一种车载显示装置，该车载显示装置包括：
如上面所述的显示模组1000，以及位于所述显示模组1000上的薄膜封装层2000、触控功能层3000、滤光层4000和保护盖板5000。
在具体实施过程中，车载显示装置所解决问题的原理与前述柔性电路板200和印刷电路板300相似，重复之处不再赘述。在其中一种应用场景中，显示模组1000可以是呈非矩形设置，比如，C形或S形，相应地，车载显示装置为C形或S形，可以将车载显示装置应用在车辆上，车辆可以是机动车，还可以是非机动车。比如，将车载显示装置应用在机动车上，可以将车载显示装置设置在导航仪的位置，并作为导航仪，还可以将车载显示装置设置在 前视镜的位置，还可以将车载显示装置设置在副驾驶的视线范围内，当然，可以根据实际应用需要来设置车载显示装置的具体位置以及功能，在此不做限定。
在具体实施过程中，薄膜封装层2000用于对显示模组1000进行封装以阻隔水氧侵蚀，避免水氧进入显示模组1000而造成显示模组1000失效。其中，薄膜封装层2000可以包括第一无机层、第二无机层和位于第一无机层和第二无机层之间的有机层，第一无机层的材料可以为氧化硅、氮化硅、氮氧化硅中的至少一种，第二无机层的材料可以为氧化硅、氮化硅、氮氧化硅中的至少一种。当然，薄膜封装层2000还可以包括无机层和有机层交替设置的更多膜层，在此不做限定。
在具体实施过程中，车载显示装置还包括位于薄膜封装层2000上的触控功能层3000(Flexible Multi-Layer On Cell，FMLOC)，相应地，可以在薄膜封装层2000上直接制作触控功能层3000的各膜层，相应地，将触控功能层3000设置于膜层结构中，因而无需另外设置触控基板，从而在保证车载显示装置轻薄化设计的同时，保证了车载显示装置的触控功能。
在具体实施过程中，车载显示装置还包括位于触控功能层3000上的滤光层4000，滤光层4000可以为偏光片，还可以为彩色滤光片。偏光片的厚度一般较厚，当滤光层4000采用彩色滤光片时，即采用一种封装上的彩色滤光片(Color Filter On Encapsulation，COE)技术，保证了车载显示装置的轻薄化设计。
在具体实施过程中，车载显示装置还包括位于滤光层4000上的保护盖板5000。不仅可以通过保护盖板5000保护显示模组不受损伤，还可以通过在保护盖板5000上设置具有特定功能的涂层来提高车载显示装置的使用性能。该涂层包括AG(抗眩光)保护膜层、AF(防指纹)保护膜层、UV(防紫外线)保护膜层中的一种或几种，在此不做限定。
在具体实施过程中，对于该车载显示装置的其它必不可少的组成部分均为本领域的普通技术人员应该理解具有的，在此就不做赘述，也不应作为对 本公开的限制。
尽管已描述了本公开的优选实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例作出另外的变更和修改。所以，所附权利要求意欲解释为包括优选实施例以及落入本公开范围的所有变更和修改。
显然，本领域的技术人员可以对本公开进行各种改动和变型而不脱离本公开的精神和范围。这样，倘若本公开的这些修改和变型属于本公开权利要求及其等同技术的范围之内，则本公开也意图包含这些改动和变型在内。

Claims (16)

  1. 一种显示模组，其中，包括：
    显示面板、至少一个柔性电路板以及至少一个印刷电路板；
    其中，所述显示面板包括位于绑定区的多个连接焊盘；
    所述柔性电路板包括第一本体、多个输出焊盘和多个输入焊盘，所述第一本体包括相互连接的可弯曲部和平坦部，所述可弯曲部包括相较于所述平坦部突出的突出部，所述多个输出焊盘位于所述突出部，且与所述多个连接焊盘绑定连接，所述多个输入焊盘位于所述平坦部背离所述可弯曲部的一侧；
    所述印刷电路板包括第二本体和多个绑定焊盘，所述第二本体包括条形主体部和与所述条形主体部的长边连接的至少一个分支部，所述多个绑定焊盘位于各个所述分支部与所述条形主体部相邻的至少一个侧边，且所述多个绑定焊盘与所述多个输入焊盘绑定连接。
  2. 如权利要求1所述的显示模组，其中，各个所述输出焊盘沿第一方向延伸且沿与所述第一方向相交的第二方向依次排列，各个输入焊盘沿第三方向延伸且沿与所述第三方向相交的第四方向依次排列，所述第一方向与所述第四方向大致相同，所述第二方向与所述第三方向大致相同。
  3. 如权利要求2所述的显示模组，其中，所述平坦部包括与所述突出部邻接的第一侧边，与所述第一侧边相对设置的第二侧边，远离所述可弯曲部的第三侧边，所述第一侧边和所述第二侧边均沿所述第二方向延伸，且所述第一侧边长于所述第二侧边，所述第三侧边相较于所述第一方向倾斜一预设角度。
  4. 如权利要求3所述的显示模组，其中，所述第四方向与所述第三侧边的延伸方向大致相同。
  5. 如权利要求2-4任一项所述的显示模组，其中，所述柔性电路板还包括驱动芯片，位于所述平坦部，所述驱动芯片位于所述多个输入焊盘靠近所述可弯曲部的一侧。
  6. 如权利要求5所述的显示模组，其中，所述驱动芯片大致沿所述第一方向延伸。
  7. 如权利要求5所述的显示模组，其中，所述驱动芯片的延伸方向与所述平坦部远离所述可弯曲部的第三侧边的延伸方向大致相同。
  8. 如权利要求5-7任一项所述的显示模组，其中，所述柔性电路板还包括多条信号走线，每条所述信号走线分别与所述驱动芯片和相应的所述输出焊盘电连接，各条所述信号走线的长度大致相同。
  9. 如权利要求8所述的显示模组，其中，所述多个输出焊盘中靠近所述驱动芯片的所述输出焊盘所电连接的信号走线呈曲线设计，所述多个输出焊盘中背离所述驱动芯片的所述输出焊盘所电连接的信号走线呈直线设计。
  10. 如权利要求9所述的显示模组，其中，所述多个输出焊盘中靠近所述驱动芯片的所述输出焊盘所电连接的信号走线，在所述柔性电路板上的正投影的形状包括单个三角形、三角锯齿形、单个矩形、矩形锯齿形、弧形中的至少一种。
  11. 如权利要求2-10任一项所述的显示模组，其中，所述多个绑定焊盘沿所述第三方向延伸且沿与所述第三方向相交的第四方向依次排列。
  12. 如权利要求11所述的显示模组，其中，所述至少一个分支部中位于边缘的两个分支部仅与所述条形主体部的短边相邻的一个侧边设置所述多个绑定焊盘，其他分支部与所述条形主体部相邻的两个侧边均设置所述多个绑定焊盘。
  13. 如权利要求11所述的显示模组，其中，各个所述分支部与所述条形主体部相邻的两个侧边均设置所述多个绑定焊盘。
  14. 如权利要求11-13任一项所述的显示模组，其中，所述条形主体部的短边突出于最外侧的分支部。
  15. 如权利要求11-13任一项所述的显示模组，其中，所述条形主体部的短边与最外侧的分支部相应侧边齐平设置。
  16. 一种车载显示装置，其中，所述车载显示装置包括：
    如权利要求1-15任一项所述的显示模组，以及位于所述显示模组上的薄膜封装层、触控功能层、滤光层和保护盖板。
PCT/CN2022/083762 2022-03-29 2022-03-29 一种显示模组及车载显示装置 WO2023184162A1 (zh)

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US18/022,119 US20240251612A1 (en) 2022-03-29 2022-03-29 Display module and vehicle display apparatus

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150043176A1 (en) * 2013-08-06 2015-02-12 Samsung Display Co., Ltd. Circuit board and display device having the same
CN105931572A (zh) * 2016-07-11 2016-09-07 京东方科技集团股份有限公司 柔性显示设备及其制造方法
CN113376882A (zh) * 2020-02-25 2021-09-10 三星显示有限公司 显示装置和制造显示装置的方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150043176A1 (en) * 2013-08-06 2015-02-12 Samsung Display Co., Ltd. Circuit board and display device having the same
CN105931572A (zh) * 2016-07-11 2016-09-07 京东方科技集团股份有限公司 柔性显示设备及其制造方法
CN113376882A (zh) * 2020-02-25 2021-09-10 三星显示有限公司 显示装置和制造显示装置的方法

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