WO2023174244A1 - 一种硅片的载片治具及运载装置 - Google Patents

一种硅片的载片治具及运载装置 Download PDF

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Publication number
WO2023174244A1
WO2023174244A1 PCT/CN2023/081254 CN2023081254W WO2023174244A1 WO 2023174244 A1 WO2023174244 A1 WO 2023174244A1 CN 2023081254 W CN2023081254 W CN 2023081254W WO 2023174244 A1 WO2023174244 A1 WO 2023174244A1
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WIPO (PCT)
Prior art keywords
silicon wafer
bottom plate
support rod
rubber pad
connecting plate
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Application number
PCT/CN2023/081254
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English (en)
French (fr)
Inventor
徐志群
孙彬
付明全
邓持清
马伟萍
Original Assignee
高景太阳能股份有限公司
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Application filed by 高景太阳能股份有限公司 filed Critical 高景太阳能股份有限公司
Publication of WO2023174244A1 publication Critical patent/WO2023174244A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders

Definitions

  • the present invention relates to the field of semiconductor technology, and in particular to a silicon wafer carrier jig and a carrier device.
  • Silicon wafers are thin slices cut from single crystal silicon and are mainly used to produce integrated circuits.
  • silicon wafers require multiple processes. Among them, there is a lack of continuous automated processes between the degumming process and the cleaning process, and manual handling is required. However, since the thickness of silicon wafers is generally 150 microns, the edges of silicon wafers are easily chipped and silicon falls during manual handling.
  • the invention provides a silicon wafer carrying jig and a carrying device, which solves the problem that silicon wafers are prone to edge chipping and silicon falling during the transfer of production processes.
  • the present invention provides a silicon wafer carrying fixture, including: a bottom plate, a baffle, a connecting plate, a support rod and a rubber pad;
  • baffles There are two baffles and they are arranged on the bottom plate at intervals;
  • the two ends of the connecting plate are respectively connected to one end of the two baffles away from the bottom plate;
  • One end of the support rod is connected to the bottom plate, and the other end is connected to the connecting plate;
  • the bottom plate, the two baffles, the connecting plate and the support rod are enclosed to form a frame-shaped structure with adjacent two sides open;
  • the rubber pad is arranged on the upper surface of the bottom plate, and the shape of the rubber pad is adapted to the area enclosed by the two baffles and the support rod on the bottom plate;
  • the upper surface of the rubber pad is inclined, and the side of the rubber pad away from the support rod is higher than the side close to the support rod. Silicon wafers can be stacked on the rubber pad.
  • An embodiment of the present invention provides a silicon wafer carrying jig, which is enclosed by a bottom plate, two baffles, connecting plates and support rods to form a frame-shaped structure with adjacent sides open and a rubber pad with an inclined upper surface. set up Placed in the area formed by the two baffles and the support rod on the bottom plate, the silicon wafers can be stacked and placed on the rubber pad obliquely. The silicon wafers tilt downward by their own gravity and abut against one side of the support rod. Reduce the front and back sliding of the silicon wafer during the transfer process, thereby reducing the problems of edge chipping and silicon falling.
  • the base plate is provided with two symmetrical groups of first limiting holes, and a line connecting the two groups of first limiting holes is parallel to the first side of the base plate.
  • the baffles are correspondingly connected to the two sets of first limiting holes.
  • a second limiting hole is provided on the bottom plate, the second limiting hole is close to the first side, and one end of the support rod passes through the second limiting hole. Fixedly installed on the base plate.
  • the baffle is L-shaped, the short end of the baffle is connected to the first limiting hole, the long end of the baffle is connected to the connecting plate, and the The short end is opposite the long end.
  • the connecting plate is U-shaped, the first section and the third section of the connecting plate are respectively connected to the long ends of the two baffles, and the second section of the connecting plate Connected to the support rod.
  • a guide hole is opened on a side of the rubber pad away from the support rod.
  • the upper surface of the bottom plate is provided with a groove, the groove is adapted to the guide hole, and one end of the groove extends to the bottom plate away from the support rod. side.
  • the present invention provides a silicon wafer carrying device, including a box and a plurality of silicon wafer carrying jigs as in any of the above possible implementations;
  • a plurality of limiting rubber strips are provided on the longitudinal side wall of the box, and the chip carrying jig of each silicon wafer is clamped between two adjacent limiting rubber strips.
  • a base is provided at the bottom of the box, and a side of the base away from the longitudinal side wall is higher than a side of the base close to the longitudinal side wall. side.
  • a detachable filter screen is provided at the bottom of the box, and several through holes are provided on the base. Debris can fall along with the through holes and collect into the on the filter.
  • the silicon wafer carrying jig is clamped between two adjacent limiting rubber strips. After the degumming process is completed, the silicon wafers can be directly stacked and placed on the carrier after being removed.
  • the carrier device transports the silicon wafers to the cleaning process, and then stacks the silicon wafers together with the wafer fixture Take it out from the box and carry out loading and cleaning.
  • the use of the carrying device of the present invention can reduce the number of times the silicon wafer is transported, and the silicon wafer always tilts against the support rod due to its own gravity, reducing the risk of the silicon wafer falling back and forth during the transfer process. , Reduce the probability of edge chipping and silicon falling.
  • Figure 1 is a schematic structural diagram of a silicon wafer carrier jig provided by an embodiment of the present invention
  • Figure 2 is a schematic structural diagram of a base plate provided by an embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of a baffle provided by an embodiment of the present invention.
  • Figure 4 is a schematic structural diagram of a connecting plate provided by an embodiment of the present invention.
  • FIG. 5 is a schematic structural diagram of a silicon wafer carrying device provided by an embodiment of the present invention.
  • first and second are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Therefore, features defined as “first” and “second” may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.
  • the production process of silicon wafers requires multiple processes. Among them, there is a lack of continuous automated process between the degumming process and the cleaning process, and manual transfer is required. Generally, workers will take off their clothes The silicon wafers completed with glue are transported to a transfer car filled with pure water, and the silicon wafers are transferred to the cleaning process through the transfer car. In the cleaning process, the silicon wafers are first taken out of the pure water, moved to a flat-bottomed jig, and then Start automatic cleaning and loading. In the process of multiple transportations, there is a lack of effective fixation of silicon wafers, which can easily cause collisions with each other, easily cause edge chipping and silicon falling, and affect the yield rate of silicon wafers.
  • embodiments of the present invention provide a silicon wafer carrier jig.
  • a silicon wafer loading jig shown in Figure 1 it includes: a bottom plate 1, two baffles 2, a connecting plate 3, a support rod 4 and a rubber pad 5; the support rod 4 and the two baffles 2 are both provided On the upper end surface of the base plate 1, two baffles 2 are arranged at intervals, and the distance between the two baffles 2 should be adapted to the length or width of the silicon wafer, and the support rod 4 is arranged between the two baffles 2 And it is enclosed with the two baffles 2 and the bottom plate 1 to form a frame-shaped structure with the upper end and one side open.
  • the connecting plate 3 is arranged on the upper end of the baffle 2, and the two ends of the connecting plate 3 are connected to the two baffles 2 respectively.
  • the rubber pad 5 is arranged on the upper end surface of the frame-shaped structure area on the base plate 1, and the shape of the rubber pad 5 is consistent with the area of the frame-shaped structure Adaptation, the rubber pad 5 has anti-slip properties, the upper surface of the rubber pad 5 is inclined, and the side of the rubber pad 5 away from the support rod 4 is higher than the side close to the support rod 4, and the silicon wafers can be stacked and placed on the rubber pad at an angle 5, and the silicon wafer always has one end against the support rod 4 due to its own gravity, ensuring that the silicon wafer will not slide back and forth and fall out from the open side of the frame structure during transportation, while the two sides Each baffle 2 can constrain the degree of freedom of the silicon wafer in the left and right directions, thereby preventing the silicon wafer from shaking and causing bruises and other problems.
  • the upper end and one side of the frame-shaped structure of the embodiment are open to facilitate the robot or
  • the upper surface of the rubber pad 5 has an inclination angle of 10° to 15° compared to the horizontal plane. At this time, it can effectively ensure that impurities and debris on the silicon wafer can fall or roll off along the inclined plane to avoid the problem of two There are impurities between the silicon wafers that may cause scratches or bruises, and it also avoids the problem of deformation of the support rod 4 due to greater pressure on the support rod 4 when several silicon wafers are stacked. It should be noted that in this embodiment, the chip carrier jig is always immersed in pure water while waiting for loading, and the degummed silicon wafers are stacked one by one in the chip carrier jig at intervals. Impurity debris on the upper surface of the silicon wafer can be washed away along the inclined surface and water flow.
  • the bottom plate 1 is provided with two symmetrical sets of first limiting holes 11.
  • the connection line of the two sets of first limiting holes 11 is parallel to the first side 101 of the bottom plate 1.
  • the two baffles 2 can It corresponds to plugging into two In the set of first limit holes 11, the lower end of the specific baffle 2 is provided with a limit pin that matches the first limit hole 11. It can also be the inner diameter of the first limit hole 11 and the outer dimensions of the baffle 2.
  • the baffle 2 can also be fixedly mounted on the base plate 1 by screws in conjunction with the first limiting hole 11. When screws are used for connection, the first limiting hole 11 is a threaded hole.
  • the base plate 1 is also provided with a second limit hole 12, which is close to the first side 101.
  • One end of the support rod 4 is fixedly installed on the base plate 1 through the second limit hole 12. Specifically, it can be The support rod 4 is inserted into the second limit hole 12, or one end of the support rod 4 is provided with a threaded hole, and the screw passes through the second limit hole 12 and the support rod 4 is fixedly installed on the base plate 1 through the threaded hole. superior.
  • the rubber pad 5 on the bottom plate 1 is used to support the silicon wafer.
  • the support rod 4 can limit the tilted downward movement of the silicon wafer to ensure that it will not slide forward and backward when the silicon wafer is transferred.
  • the two ends of the connecting plate 3 are connected to two baffles 2 respectively.
  • the end of the support rod 4 away from the base plate 1 is also fixedly connected to the connecting plate 3, that is, the connecting plate 3 can increase the structural strength and ensure that the two baffles 2 and the support rod 4 are enclosed in a frame shape on the base plate 1
  • the structure can constrain the silicon wafer in the horizontal left and right directions and the front and rear directions.
  • first limiting holes 11 / second limiting holes 12 can be determined according to actual conditions.
  • Each group of first limiting holes 11 / second limiting holes 12 has multiple hole positions, the baffle 2 is connected to the first limiting hole 11 , and the support rod 4 is connected to the second limiting hole 12 .
  • the baffle 2 is connected to different first limiting holes 11, and the support rod 4 is connected to different second limiting holes 12, so that the shape and area of the upper surface of the bottom plate 1 can be changed to adapt to silicon wafers of different specifications. .
  • connection between the baffle 2 and the first limit hole 11, and the connection between the support rod 4 and the second limit hole 12 only require a certain gap between the silicon wafer, the baffle 2 and the support rod 4, which can ensure that the silicon wafer The piece will not slip off, nor will it rub or collide with the baffle 2 or the support rod 4 to cause edge chipping.
  • the baffle 2 is L-shaped, the short end 21 of the baffle 2 is connected to the first limiting hole 11, the long end 22 of the baffle 2 is connected to the connecting plate 3, and the short end 21 is connected to the connecting plate 3.
  • the long ends 22 are opposite. Since the transfer of the silicon wafer needs to be immersed in pure water, the baffle 2 is designed to be L-shaped and cannot form a connected side wall with the support rod 4. In this way, when the wafer carrier jig is taken out of the pure water, the pure water It will flow out from the gap between the baffle 2 and the support rod 4, reducing the resistance of the water when the slide fixture is taken out, and at the same time preventing water from remaining in the slide fixture.
  • the connecting plate 3 is U-shaped.
  • the first section 31 and the third section 33 of the connecting plate 3 are respectively connected to the long ends 22 of the two baffles 2.
  • the second section of the connecting plate 3 is 32 connected with support rod 4 catch.
  • the connecting plate 3 is adapted to the long end 22 of the baffle 2 .
  • the connecting plate 3 can not only fix the long end 22 of the baffle 2 and a section of the support rod 4, but can also be used as a handle to take the carrier device.
  • the length dimension of the long end 22 is 1.5-2 times that of the short end 21, and the length dimension of the first section 31 and the third section 33 is 1-1.5 times that of the long end 22.
  • the connecting plate 3 can The structural strength of the baffle 2 and the support rod 4 is effectively strengthened, and the extended length of the long end 22 is just convenient for human hands to take, so that workers can use the long end 22 as a handle to take out the slide jig from the box 6 .
  • the support rod 4 is cylindrical. At this time, the side surface of the support rod 4 is in point contact with one side of the silicon wafer. The contact area between the silicon wafer and the support rod 4 reduces the risk of the silicon wafer being damaged by collision; further , the outer surface of the support rod 4 is covered with an anti-collision layer, which can be a soft material such as plastic, to prevent the silicon chip from directly impacting the support rod 4.
  • an anti-collision layer which can be a soft material such as plastic, to prevent the silicon chip from directly impacting the support rod 4.
  • this embodiment defines that the support rod 4 is installed on the base plate 1 close to the first side 101.
  • the base plate 2 also has a second side 102 opposite to the first side 101.
  • the tilt direction of the rubber pad 5 is Specifically, the side of the rubber pad 5 close to the second side 102 of the bottom plate 1 is higher than the side of the rubber pad 5 close to the first side 101 of the bottom plate 1 , that is, the side of the rubber pad 5 away from the support rod 4 is higher.
  • the first side 101 is parallel to the second side 102. In this way, the silicon wafer is placed on the rubber pad 5. Due to its own gravity, one side of the silicon wafer can resist the connecting rod, preventing the wafer from The front and back sliding occurs during the transfer process, making the placement more stable.
  • the guide hole 51 is opened on the side of the rubber pad 5 away from the support rod 4 , that is, the guide hole 51 is opened on the side of the rubber pad 5 close to the second side 102 .
  • the flow guide hole 51 is a through hole that penetrates the rubber pad 5 .
  • the upper surface of the base plate 1 is provided with a groove, the groove is adapted to the guide hole 51, and one end of the groove extends to the side of the base plate 1 away from the support rod 4, that is, the groove extends to the second Side 102.
  • the groove is opposite to the guide hole 51 in the vertical direction, and one end of the groove extends to the second side 102 of the base plate 1 .
  • the pure water flowing through the guide hole 51 can be discharged along the groove. Reduce the resistance when the slide fixture is taken out of pure water, and at the same time, facilitate the drainage of accumulated water after taking it out.
  • An embodiment of the present invention provides a silicon wafer carrying device. As shown in FIG. 5 , it includes a box 6 and a plurality of silicon wafer carrying fixtures; the longitudinal side walls of the box 6 are provided with a plurality of limiting rubber strips. 61, per silicon wafer The slide fixture is clamped between two adjacent limiting rubber strips 61 .
  • the box 6 is filled with pure water, and the silicon wafer carrier jig can be clamped or plugged between two adjacent limiting strips 61 , and the degummed silicon wafers are stacked on the chip carrier jig at an angle one by one. , workers manually or use a driving mechanism to transfer the carrier device to the cleaning process.
  • each wafer-carrying jig can stack multiple silicon wafers, and multiple wafer-carrying jigs can be stored in the box 6 at the same time, increasing the loading capacity of the carrier device, thereby reducing the handling of the carrier device. times, reducing the risk of silicon wafer edge chipping and silicon falling.
  • the limiting rubber strip 61 can firmly place the chip carrier fixture in the box 6, reduce shaking during the transfer process, avoid collisions between silicon wafers and between silicon wafers and carrier chips, and further reduce edge chipping. There is a possibility of silicon falling; specifically, the long end 22 of the baffle 2 can be clamped between the two limiting rubber strips 61.
  • the worker When taking the chip carrier jig, the worker only needs to remove the chip carrier jig from the box. Lift the inside of the body 6 until the long end 22 separates from the limiting rubber strip 61, and the long ends 22 of the two baffles 2 are fixedly connected through the connecting plate 3 to enhance the structural strength and prevent the slide fixture from shaking.
  • the two baffles 2 The long end 22 is spaced apart from the support rod 4. When lifting the chip carrier fixture, water can flow out from the gap between the baffle 2 and the support rod, thereby reducing the resistance of lifting the chip carrier fixture.
  • a base 62 is provided at the bottom of the box 6 , and the side of the base 62 away from the longitudinal side wall is higher than the side of the base 62 close to the longitudinal side wall.
  • the inclined design of the base 62 can make the slide fixture placed on the base 62 also tilt. At this time, the open side of the slide fixture faces the middle position of the box 6, and the back of the slide fixture is against
  • the longitudinal side walls of the box 6 are supported, that is, the support rods 4 are close to the longitudinal side walls of the box 6, so that the silicon wafer can be placed more stably.
  • the base 62 can also facilitate the taking of the slide jig.
  • the bottom of the box 6 is provided with a removable filter
  • the base 62 is provided with several through holes. Debris can fall through the through holes and be collected on the filter, that is, the silicon wafer is soaked after degumming is completed. In the pure water, the debris on the silicon wafer is washed and falls onto the filter screen, so that workers can easily clean the debris and other impurities in the box 6 .

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  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

本发明公开一种硅片的载片治具及运载装置，涉及半导体领域，解决了硅片在生产工序转移中容易崩边、产生硅落的问题。具体方案包括：底板、两个挡板、连接板和支撑杆相围合形成相邻两侧敞开的框型结构；胶垫设置于底板的上表面；胶垫的上表面倾斜，且胶垫上远离支撑杆的一侧高于靠近支撑杆的一侧，硅片可堆叠放置在胶垫上。本方案通过底板、两个挡板、连接板和支撑杆相围合形成具有相邻两侧敞开的框型结构，上表面倾斜的胶垫设置于底板上两个挡板和支撑杆相围合形成的区域内，硅片可倾斜地堆叠放置在胶垫上，硅片通过自身的重力作用倾斜朝下并抵接在支撑杆的一侧，减少硅片在中转过程中前后的滑动，从而减少崩边、硅落的问题。

Description

一种硅片的载片治具及运载装置 技术领域
本发明涉及半导体技术领域，尤其涉及一种硅片的载片治具及运载装置。
背景技术
硅片是指由单晶硅切割成的薄片,主要用来生产集成电路。
生产硅片要经过多道工序，其中在脱胶工序和清洗工序间缺乏连续自动化的流程，需要人工搬运。可是由于硅片的厚度一般在150微米，导致硅片在人工搬运的过程中很容易崩边和产生硅落。
实用新型内容
本发明提供一种硅片的载片治具及运载装置，解决了硅片在生产工序转移中容易崩边、产生硅落的问题。
为达到上述目的，本发明采用如下技术方案：
第一方面，本发明提供一种硅片的载片治具，包括：底板、挡板、连接板、支撑杆和胶垫；
所述挡板有两个且间隔设置在所述底板上；
所述连接板的两端分别连接于两个所述挡板的远离所述底板的一端；
所述支撑杆的一端连接于所述底板，另一端连接于所述连接板；
所述底板、两个所述挡板、所述连接板和所述支撑杆相围合形成相邻两侧敞开的框形结构；
所述胶垫设置于所述底板的上表面，且所述胶垫的形状与两个所述挡板和所述支撑杆在所述底板上围成的区域适配；
所述胶垫的上表面倾斜，且所述胶垫上远离所述支撑杆的一侧高于靠近所述支撑杆的一侧，硅片可堆叠放置在所述胶垫上。
本发明实施例提供的一种硅片的载片治具，通过底板、两个挡板、连接板和支撑杆相围合形成具有相邻两侧敞开的框形结构，上表面倾斜的胶垫设 置于底板上两个挡板和支撑杆相围合形成的区域内，硅片可倾斜地堆叠放置在胶垫上，硅片通过自身的重力作用倾斜朝下并抵接在支撑杆的一侧，减少硅片在中转过程中前后的滑动，从而减少崩边、硅落的问题。
在一种可能的实现方式中，所述底板上设有对称的两组第一限位孔，两组所述第一限位孔的连线与所述底板的第一侧边平行，两个所述挡板对应连接于两组所述第一限位孔上。
在一种可能的实现方式中，所述底板上设有第二限位孔，所述第二限位孔靠近所述第一侧边，所述支撑杆的一端通过所述第二限位孔固定安装在所述底板上。
在一种可能的实现方式中，所述挡板呈L形，所述挡板的短端连接于所述第一限位孔，所述挡板的长端连接于所述连接板，所述短端与所述长端相对。
在一种可能的实现方式中，所述连接板呈U形，所述连接板的第一段和第三段分别连接于两个所述挡板的长端，所述连接板的第二段与所述支撑杆连接。
在一种可能的实现方式中，所述胶垫上远离所述支撑杆的一侧开设有导流孔。
在一种可能的实现方式中，所述底板的上表面开设有凹槽，所述凹槽与所述导流孔相适配，且所述凹槽的一端延伸至所述底板上远离所述支撑杆的一侧。
第二方面，本发明提供一种硅片的运载装置，包括箱体和多个如上述任一种可能实现方式中的硅片的载片治具；
所述箱体的纵向侧壁设有多个限位胶条，每个所述硅片的载片治具卡设于相邻的两个所述限位胶条之间。
在一种可能的实现方式中，所述箱体的底部设有基座，且所述基座的远离所述纵向侧壁的一侧高于所述基座的靠近所述纵向侧壁的一侧。
在一种可能的实现方式中，所述箱体的底部设置有可拆卸的滤网，所述基座上设置有若干个通孔，碎渣可随所述通孔掉落并汇集到所述滤网上。
本发明实施例提供的硅片的运载装置，硅片的载片治具卡设于相邻的两个限位胶条之间，脱胶工序完成后的硅片取下后可直接堆叠放置在载片治具上，运载装置将硅片转运到清洗工序，然后将堆叠放置的硅片连同载片治具 从箱体上提取出来，进行上料清洗。相比于现有技术，采用本发明的运载装置可减少硅片的搬运次数，并且硅片以自身重力作用始终倾斜抵接支撑杆，降低了转运过程中硅片前后滑动而发生掉落的风险，减少崩边，产生硅落的几率。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的一种硅片的载片治具的结构示意图；
图2为本发明实施例提供的底板的结构示意图；
图3为本发明实施例提供的挡板的结构示意图；
图4为本发明实施例提供的连接板的结构示意图；
图5为本发明实施例提供的一种硅片的运载装置结构示意图。
附图标记：1-底板；11-第一限位孔；12-第二限位孔；101-第一侧边；102-第二侧边；2-挡板；21-短端；22-长端；3-连接板；31-第一段；32-第二段；33-第三段；4-支撑杆；5-胶垫；51-导流孔；6-箱体；61-限位胶条；62-基座。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
以下，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本公开实施例的描述中，除非另有说明，“多个”的含义是两个或两个以上。
相关技术中，在硅片的生产过程中，需要多个工序。其中，在脱胶工序和清洗工序之间，缺乏连续的自动化流程，需要人工转运。一般是工人将脱 胶完成的硅片搬运到充满纯水的中转车上，通过中转车将硅片转移至清洗工序，清洗工序中，先将硅片从纯水中捞出，移动到平底的治具上，再开始自动清洗上料。在多次搬运的过程中缺乏对硅片的有效固定，很容易发生相互碰撞，很容易造成崩边和硅落，影响硅片的良品率。
为了解决硅片在生产工序转移中容易崩边、产生硅落的问题，本发明实施例提供了一种硅片的载片治具。
参照图1所示的一种硅片的载片治具，包括：底板1、两个挡板2、连接板3、支撑杆4和胶垫5；支撑杆4和两个挡板2均设置在底板1的上端面且两个挡板2间隔设置，并且两个挡板2之间的距离应与硅片的长度尺寸或宽度尺寸适配，支撑杆4设置在两个挡板2之间且与两个挡板2以及底板1相围合形成上端和其中一侧敞开的框形结构，连接板3设置在挡板2的上端，并且连接板3的两端分别与两个挡板2的远离底板1的一端连接，支撑杆4则是连接于连接板3的中部；胶垫5设置在底板1上框形结构区域的上端面，并且胶垫5的形状与该框形结构的区域适配，胶垫5具有防滑性，胶垫5的上表面倾斜，并且胶垫5上远离支撑杆4的一侧高于靠近支撑杆4的一侧，硅片可倾斜的堆叠放置在胶垫5上，并且硅片因自身的重力作用，使其一端始终抵靠在支撑杆4上，确保在搬运过程中硅片不会前后滑动而自框形结构的敞开的一侧掉出，而两个挡板2可以对硅片在左右方向的自由度进行约束，进而避免硅片发生晃动而造成磕伤等问题，而实施例的框形结构的上端和其中一侧敞开是为了方便机械手或者是人工手动将硅片叠放在该载片治具上或者从该载片治具取出。
可选的，胶垫5的上表面相较于水平面的倾斜角度为10°至15°，此时可以有效保证硅片上的杂质碎屑等可以沿倾斜面掉落或滚落，避免因两片硅片之间存在杂质而导致划伤或磕伤等问题，同时也避免若干个硅片堆叠放置时对支撑杆4有较大的压力而导致支撑杆4发生变形的问题。有必要说明的是，在本实施例中，该载片治具在等待装料时始终浸没在纯水中，完成脱胶的硅片间隔地逐片堆叠放置在该载片治具内，此时硅片上表面的杂质碎屑可以沿倾斜面以及水流冲刷走。
参照图2所示，底板1上设有对称的两组第一限位孔11，两组第一限位孔11的连线与底板1的第一侧边101平行，两个挡板2可以是对应插接于两 组第一限位孔11中，具体的挡板2的下端设置有与第一限位孔11相配合的限位销，也可以是第一限位孔11的内径与挡板2的外形尺寸适配，还可以是挡板2通过螺钉与第一限位孔11相配合固定安装在底板1上，采用螺钉连接时，该第一限位孔11则为螺纹孔。底板1上还设置有第二限位孔12，第二限位孔12靠近第一侧边101，支撑杆4的一端通过第二限位孔12固定安装在底板1上，具体的，可以是支撑杆4插接到第二限位孔12内，也可以是支撑杆4的一端设置有螺纹孔，螺钉穿过第二限位孔12并通过该螺纹孔将支撑杆4固定安装在底板1上。
底板1上的胶垫5用于支撑硅片，支撑杆4可限制硅片倾斜朝下移动，保证在硅片转移时不会前后滑动，连接板3的两端分别连接两个挡板2，支撑杆4上远离底板1的一端也与连接板3固定连接，即连接板3能够起到增加结构强度的作用，确保两个挡板2和支撑杆4在底板1上围合形成的框形结构对硅片在水平左右方向和前后方向都能进行约束。
需要说明的是，一组第一限位孔11/第二限位孔12具有的孔数可以根据实际情况而定。
每一组第一限位孔11/第二限位孔12均有多个孔位，挡板2与第一限位孔11连接，支撑杆4与第二限位孔12连接。挡板2与不同的第一限位孔11连接，以及支撑杆4与不同的第二限位孔12连接，均可以改变底板1上表面的形状和面积，以此来适应不同规格的硅片。挡板2与第一限位孔11的连接，以及支撑杆4与第二限位孔12的连接，以硅片与挡板2和支撑杆4之间存在一定间隙即可，既能保障硅片不会滑落，也不会与挡板2或支撑杆4摩擦或碰撞造成崩边。
参照图3所示，可选的，挡板2呈L形，挡板2的短端21连接于第一限位孔11，挡板2的长端22连接于连接板3，短端21与长端22相对。由于硅片的转移需要浸泡在纯水中，因此将挡板2设计为L形，与支撑杆4并不能形成连接的侧壁，这样，当载片治具从纯水中取出时，纯水会从挡板2和支撑杆4的间隙中流出，减少载片治具取出时水的阻力，同时防止积水留在载片治具中。
参照图4所示，可选的，连接板3呈U形，连接板3的第一段31和第三段33分别连接于两个挡板2的长端22，连接板3的第二段32与支撑杆4连 接。连接板3与挡板2的长端22相适配。连接板3不仅能够固定连接挡板2的长端22和支撑杆4的一段，还能够作为拿取载片治具的把手，工人手动或机械手通过该连接板3水平搬运该载片装置时，硅片倾斜放置于胶垫5上，并且支撑杆4阻挡硅片倾斜朝下的一侧，进而可以保障在转移过程中硅片不会相对载片装置前后滑动，有效避免硅落而造成崩边的问题。
可选的，长端22的长度尺寸为短端21的1.5-2倍，第一段31和第三段33的长度尺寸为长端22的1-1.5倍，此结构比例下连接板3能够有效加强挡板2和支撑杆4的结构强度，并且长端22延伸的长度正好方便人手拿取，从而工人将长端22作为把手将载片治具从箱体6中取出。
可选的，支撑杆4成圆柱形，此时支撑杆4的侧表面与硅片的一侧为点接触，硅片与支撑杆4的接触面积，降低硅片磕碰受损的风险；进一步的，支撑杆4的外表面包覆有防撞层，其可以是塑料等软质材料，避免硅片直接冲击支撑杆4。
可选的，本实施例定义支撑杆4安装于底板1上靠近第一侧边101的位置，底板上2还具有与第一侧边101相对的第二侧边102，胶垫5的倾斜方向具体为胶垫5的靠近底板1的第二侧边102的一侧高于胶垫5的靠近底板1的第一侧边101的一侧，即胶垫5的远离支撑杆4的一侧高于靠近支撑杆4的一侧，第一侧边101与第二侧边102平行，这样，硅片放置在胶垫5上，硅片由于自身重力，一侧能够抵住连接杆，避免硅片在转运过程中发生前后滑动，放置更加平稳。
可选的，胶垫5上远离支撑杆4的一侧开设有导流孔51，即导流孔51开设在胶垫5靠近第二侧边102的一侧。导流孔51是贯穿胶垫5的通孔。当载片治具从纯水中取出时，纯水能够从导流孔51中流出，减少拿取的阻力。
可选的，底板1的上表面开设有凹槽，凹槽与导流孔51相适配，且凹槽的一端延伸至底板1上远离支撑杆4的一侧，即凹槽延伸至第二侧边102。凹槽在竖直方向上与导流孔51相对，且凹槽的一端延伸至底板1的第二侧边102。这样，从导流孔51中流过的纯水能够顺着凹槽排出。减少载片治具从纯水中取出时的阻力，同时，取出后，有利于积水的排出。
本发明实施例提供了一种硅片的运载装置，参照图5所示，包括箱体6和多个硅片的载片治具；箱体6的纵向侧壁设有多个限位胶条61，每个硅片 的载片治具卡设于相邻的两个限位胶条61之间。箱体6内注有纯水，硅片的载片治具可卡接或插接在相邻两个限位胶条61之间，脱胶后的硅片逐片倾斜堆叠在载片治具上，工人手动或者是采用驱动机构将运载装置转运到清洗工序，硅片和载片治具也随该运载装置移送至清洗工序，然后将载片治具直接提取出来，进行上料清洗。相比于现有技术，每个载片治具可以堆叠多个硅片，而箱体6内又可以同时存放多个载片治具，增加运载装置的装载量，从而可以减少运载装置的搬运次数，降低了硅片崩边，产生硅落的风险。
同时，限位胶条61能够稳固放置于箱体6内的载片治具，在转运过程中，减少晃动，避免硅片之间以及硅片与载片之间的碰撞，进一步降低崩边，产生硅落的可能；具体的，可以是挡板2的长端22卡接于两个限位胶条61之间，在取用载片治具时，工人仅需将载片治具自箱体6内提升至长端22脱离限位胶条61即可，而且两个挡板2的长端22通过连接板3固定连接增强结构强度，避免载片治具发生晃动，两个挡板2的长端22与支撑杆4间隔设置，提升载片治具时，水可以自挡板2与支撑杆之间的间隙流出，减少提升载片治具的阻力。
箱体6的底部设有基座62，且基座62的远离纵向侧壁的一侧高于基座62的靠近纵向侧壁的一侧。基座62的倾斜设计，能够使放置在基座62上的载片治具也倾斜，此时载片治具上敞开的一侧朝向箱体6的中间位置，而载片治具的背部抵住箱体6的纵向侧壁，即支撑杆4靠近箱体6的纵向侧壁，使得硅片放置更加稳固。基座62也能够方便载片治具的拿取。
可选的，箱体6的底部设置有可拆卸的滤网，基座62上设有若干个通孔，碎渣可随通孔掉落并汇集到滤网上，即脱胶完成后的硅片浸泡在纯水中，硅片上的碎渣被冲刷掉落至滤网上，从而工人能够方便清理箱体6内的碎渣等杂质。
以上所述，仅为本发明的具体实施方式，但本发明的保护范围并不局限于此，任何在本发明揭露的技术范围内的变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应以所述权利要求的保护范围为准。

Claims (10)

  1. 一种硅片的载片治具，其特征在于，包括：底板(1)、挡板(2)、连接板(3)、支撑杆(4)和胶垫(5)；
    所述挡板(2)有两个且间隔设置在所述底板(1)上；
    所述连接板(3)的两端分别连接于两个所述挡板(2)的远离所述底板(1)的一端；
    所述支撑杆(4)的一端连接于所述底板(1)，另一端连接于所述连接板(3)；
    所述底板(1)、两个所述挡板(2)、所述连接板(3)和所述支撑杆(4)相围合形成相邻两侧敞开的框形结构；
    所述胶垫(5)设置于所述底板(1)的上表面，且所述胶垫(5)的形状与两个所述挡板(2)和所述支撑杆(4)在所述底板(1)上围成的区域适配；
    所述胶垫(5)的上表面倾斜，且所述胶垫(5)上远离所述支撑杆(4)的一侧高于靠近所述支撑杆(4)的一侧，硅片可堆叠放置在所述胶垫(5)上。
  2. 根据权利要求1所述的一种硅片的载片治具，其特征在于，所述底板(1)上设有对称的两组第一限位孔(11)，两组所述第一限位孔(11)的连线与所述底板(1)的第一侧边(101)平行，两个所述挡板(2)对应连接于两组所述第一限位孔(11)上。
  3. 根据权利要求2所述的一种硅片的载片治具，其特征在于，所述底板(1)上设有第二限位孔(12)，所述第二限位孔(12)靠近所述第一侧边(101)，所述支撑杆(4)的一端通过所述第二限位孔(12)固定安装在所述底板(1)上。
  4. 根据权利要求2所述的一种硅片的载片治具，其特征在于，所述挡板(2)呈L形，所述挡板(2)的短端(21)连接于所述第一限位孔(11)，所述挡板(2)的长端(22)连接于所述连接板(3)，所述短端(21)与所述长端(22)相对。
  5. 根据权利要求4所述的一种硅片的载片治具，其特征在于，所述连接板(3)呈U形，所述连接板(3)的第一段(31)和第三段(33)分别连接 于两个所述挡板(2)的长端(22)，所述连接板(3)的第二段(32)与所述支撑杆(4)连接。
  6. 根据权利要求1所述的一种硅片的载片治具，其特征在于，所述胶垫(5)上远离所述支撑杆(4)的一侧开设有导流孔(51)。
  7. 根据权利要求6所述的一种硅片的载片治具，其特征在于，所述底板(1)的上表面开设有凹槽，所述凹槽与所述导流孔(51)相适配，且所述凹槽的一端延伸至所述底板(1)上远离所述支撑杆(4)的一侧。
  8. 一种硅片的运载装置，其特征在于，包括箱体(6)和多个如权利要求1至7任一项所述的硅片的载片治具；所述箱体(6)的纵向侧壁设有多个限位胶条(61)，每个所述硅片的载片治具卡设于相邻的两个所述限位胶条(61)之间。
  9. 根据权利要求8所述的一种硅片的运载装置，其特征在于，所述箱体(6)的底部设有基座(62)，且所述基座(62)的远离所述纵向侧壁的一侧高于所述基座(62)的靠近所述纵向侧壁的一侧。
  10. 根据权利要求9所述的一种硅片的运载装置，其特征在于，所述箱体(6)的底部设置有可拆卸的滤网，所述基座(62)上设置有若干个通孔，碎渣可随所述通孔掉落并汇集到所述滤网上。
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