CN115440636B - 一种硅片承载料托及具有其的运载水箱 - Google Patents
一种硅片承载料托及具有其的运载水箱 Download PDFInfo
- Publication number
- CN115440636B CN115440636B CN202211046907.2A CN202211046907A CN115440636B CN 115440636 B CN115440636 B CN 115440636B CN 202211046907 A CN202211046907 A CN 202211046907A CN 115440636 B CN115440636 B CN 115440636B
- Authority
- CN
- China
- Prior art keywords
- base
- silicon wafer
- silicon wafers
- silicon
- supporting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 98
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 93
- 239000010703 silicon Substances 0.000 title claims abstract description 93
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 15
- 239000000463 material Substances 0.000 title abstract description 16
- 235000012431 wafers Nutrition 0.000 claims abstract description 97
- 230000000903 blocking effect Effects 0.000 claims abstract description 28
- 238000003825 pressing Methods 0.000 claims description 17
- 230000003678 scratch resistant effect Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 10
- 230000005484 gravity Effects 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 239000012535 impurity Substances 0.000 description 5
- 239000011863 silicon-based powder Substances 0.000 description 5
- 239000000969 carrier Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202211046907.2A CN115440636B (zh) | 2022-08-30 | 2022-08-30 | 一种硅片承载料托及具有其的运载水箱 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202211046907.2A CN115440636B (zh) | 2022-08-30 | 2022-08-30 | 一种硅片承载料托及具有其的运载水箱 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN115440636A CN115440636A (zh) | 2022-12-06 |
CN115440636B true CN115440636B (zh) | 2024-03-22 |
Family
ID=84243957
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202211046907.2A Active CN115440636B (zh) | 2022-08-30 | 2022-08-30 | 一种硅片承载料托及具有其的运载水箱 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN115440636B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115889318B (zh) * | 2022-12-07 | 2024-10-22 | 西安奕斯伟材料科技股份有限公司 | 用于硅片脱胶的装置及设备 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012104580A (ja) * | 2010-11-09 | 2012-05-31 | Disco Abrasive Syst Ltd | ウエーハ収容カセット |
DE202018000701U1 (de) * | 2018-02-12 | 2018-02-20 | Rauch Möbelwerke GmbH | Palettenaufsatz zum Anbringen an eine Transportpalette und System zum Stapeln wenigstens zweier Transportpaletten |
CN208240632U (zh) * | 2018-05-22 | 2018-12-14 | 江阴佳泰电子科技有限公司 | 烘烤用晶圆匣 |
CN210120123U (zh) * | 2019-08-29 | 2020-02-28 | 阿特斯光伏电力(洛阳)有限公司 | 一种光伏硅片的脱胶承载周转装置 |
CN211828716U (zh) * | 2020-06-03 | 2020-10-30 | 通威太阳能(眉山)有限公司 | 硅片料盒 |
CN215869321U (zh) * | 2021-08-02 | 2022-02-18 | 杭州中为光电技术有限公司 | 硅片周转机构以及脱胶插片一体装置 |
CN216161716U (zh) * | 2021-08-27 | 2022-04-01 | 隆基绿能科技股份有限公司 | 一种插片机分片用料托及插片机 |
CN114334757A (zh) * | 2022-03-15 | 2022-04-12 | 广东高景太阳能科技有限公司 | 一种硅片的载片治具及运载装置 |
CN216597526U (zh) * | 2021-09-27 | 2022-05-24 | 楚雄隆基硅材料有限公司 | 一种可调式料托和插片机 |
-
2022
- 2022-08-30 CN CN202211046907.2A patent/CN115440636B/zh active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012104580A (ja) * | 2010-11-09 | 2012-05-31 | Disco Abrasive Syst Ltd | ウエーハ収容カセット |
DE202018000701U1 (de) * | 2018-02-12 | 2018-02-20 | Rauch Möbelwerke GmbH | Palettenaufsatz zum Anbringen an eine Transportpalette und System zum Stapeln wenigstens zweier Transportpaletten |
CN208240632U (zh) * | 2018-05-22 | 2018-12-14 | 江阴佳泰电子科技有限公司 | 烘烤用晶圆匣 |
CN210120123U (zh) * | 2019-08-29 | 2020-02-28 | 阿特斯光伏电力(洛阳)有限公司 | 一种光伏硅片的脱胶承载周转装置 |
CN211828716U (zh) * | 2020-06-03 | 2020-10-30 | 通威太阳能(眉山)有限公司 | 硅片料盒 |
CN215869321U (zh) * | 2021-08-02 | 2022-02-18 | 杭州中为光电技术有限公司 | 硅片周转机构以及脱胶插片一体装置 |
CN216161716U (zh) * | 2021-08-27 | 2022-04-01 | 隆基绿能科技股份有限公司 | 一种插片机分片用料托及插片机 |
CN216597526U (zh) * | 2021-09-27 | 2022-05-24 | 楚雄隆基硅材料有限公司 | 一种可调式料托和插片机 |
CN114334757A (zh) * | 2022-03-15 | 2022-04-12 | 广东高景太阳能科技有限公司 | 一种硅片的载片治具及运载装置 |
Also Published As
Publication number | Publication date |
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CN115440636A (zh) | 2022-12-06 |
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SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 519000 unit B25, 2nd floor, building 4, No. 153, Rongao Road, Hengqin New District, Zhuhai City, Guangdong Province Applicant after: Gaojing Solar Co.,Ltd. Applicant after: Guangdong Jinwan Gaojing Solar Energy Technology Co.,Ltd. Address before: 519000 unit B25, 2nd floor, building 4, No. 153, Rongao Road, Hengqin New District, Zhuhai City, Guangdong Province Applicant before: Guangdong Gaojing Solar Energy Technology Co.,Ltd. Applicant before: Guangdong Jinwan Gaojing Solar Energy Technology Co.,Ltd. |
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GR01 | Patent grant | ||
GR01 | Patent grant |