WO2023155449A1 - Dispositif de test de vieillissement de puce - Google Patents

Dispositif de test de vieillissement de puce Download PDF

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Publication number
WO2023155449A1
WO2023155449A1 PCT/CN2022/124849 CN2022124849W WO2023155449A1 WO 2023155449 A1 WO2023155449 A1 WO 2023155449A1 CN 2022124849 W CN2022124849 W CN 2022124849W WO 2023155449 A1 WO2023155449 A1 WO 2023155449A1
Authority
WO
WIPO (PCT)
Prior art keywords
test
chip
honeycomb panel
box
air
Prior art date
Application number
PCT/CN2022/124849
Other languages
English (en)
Chinese (zh)
Inventor
刘冬喜
陈宽勇
Original Assignee
海拓仪器(江苏)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 海拓仪器(江苏)有限公司 filed Critical 海拓仪器(江苏)有限公司
Publication of WO2023155449A1 publication Critical patent/WO2023155449A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2862—Chambers or ovens; Tanks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling

Definitions

  • the invention relates to a chip aging test device, which is suitable for the technical field of chip aging testing.
  • the aging test is mainly to place the product in a high temperature, high temperature, high humidity or low temperature environment for electrified operation, monitor the electrical variables of the product during operation, and the chemical or physical changes that occur, so as to screen out defective products.
  • test chambers of current aging test devices are equipped with multi-layer test carrier boards, which can perform aging tests on chips in large quantities.
  • the heat generation of about 10KW will not only make the test environment of each chip different, but also easily cause the temperature around the chip to reduce the accuracy of the test results.
  • test environment is consistent, and the gas flow in the air circulation process of the above-mentioned equipment is relatively scattered, and the heat dissipation efficiency is very low, which cannot meet the heat dissipation requirements of high heat generation during the test of chip products; further, in the patent application number CN202110739083.6
  • An S-shaped air duct structure is disclosed, which achieves the purpose of synchronizing the test environment of each tested product and dissipating heat for the tested product by opening an air outlet above each tested product, but this type of structure will occupy A large number of test spaces reduces the number of products that can be accommodated in the test chamber, which not only reduces the test efficiency, but also increases the production cost of the equipment.
  • the present invention proposes a chip aging test device.
  • a chip aging test device including a box body, at least one test assembly arranged inside the box body, each test assembly includes a test chamber for accommodating chips, is arranged on the periphery of the test chamber and A circulating air channel connected with the test chamber, a circulating fan for forming circulating air in the test chamber and the circulating air channel, a heating device for heating the space in the test chamber, a cooling device for cooling the space in the test chamber, and
  • the electric control box adjacent to the test chamber is used to power on the chip.
  • the chip carrier divides the test chamber into several test areas for testing chips. Each test area is on the inner wall of its opposite sides. There are air inlets and air outlets connecting the test area with the circulating air duct, which can form air circulation in the test area, and can not only make the environment in the test chamber reach For testing requirements, it is also possible to dissipate heat from the chip through circulating air to prevent accumulated temperature around the chip.
  • Each test assembly also includes a first honeycomb panel for guiding the airflow blown into each test area from the circulating air duct, a second honeycomb panel for guiding the airflow blowing into the circulating air duct from each testing area, the first The honeycomb panel is arranged on the upstream side of the air inlet along the airflow direction, and the second honeycomb panel is arranged on the downstream side of the air outlet along the airflow direction.
  • the first honeycomb panel and the second honeycomb panel are respectively arranged on the test
  • the airflow flowing through the test area forms a regular gas flow column, which improves the flow rate of the circulating air, and can quickly take away the heat emitted by the chip during the test process, thereby improving the heat dissipation efficiency of the circulating air.
  • the number and position of the deflectors corresponding to the air inlets and used to guide the airflow to the corresponding air inlets are set on the inner wall of the circulating air duct opposite to the air inlets.
  • Each deflector are arranged obliquely from the side connected to the inner wall of the circulating air duct to the side close to the air inlet from the upstream to the downstream of the airflow direction, and the length of each deflector located downstream of the airflow direction is greater than that located upstream of the airflow direction.
  • the length of the deflector, the inclined deflector can not only change the air flow direction, send the airflow from the air inlet to the test area, but also guide the inertia of the air flow to further increase the air flow rate;
  • the board can evenly distribute the air volume sent to each test area to ensure that the air volume of each layer of the test area is equal, and prevent the problem of inaccurate test results caused by inconsistent test environments for different chips in the same test chamber.
  • mesh plates are provided between the first honeycomb panel and the air inlet, and between the second honeycomb panel and the air outlet, which can protect the honeycomb panel and prevent foreign objects from damaging or scratching the honeycomb panel during operation. , It can also prevent foreign objects from falling into the circulating air duct and causing the air duct to be blocked.
  • the air volume of the circulating fan is 2000m3/h ⁇ 18000m3/h, ensuring that the air volume can meet the heat dissipation standard required for chip aging.
  • the diameter of the inscribed circle of the honeycomb holes of the first honeycomb panel and the second honeycomb panel is 4mm ⁇ 12mm, and the thickness of the first honeycomb panel and the second honeycomb panel is not less than 5mm, ensuring that the air flow column formed by the circulating wind The structure is stable, and at the same time, it also ensures that the airflow has enough travel to form an air column.
  • the circulating fan, the heat output part of the heating device, and the cold output part of the refrigeration device are all arranged in the circulating air duct, so as to form a circulating air that can simulate the test environment inside the test chamber.
  • the aging test device also includes a central control host installed in the box for controlling the work of the aging test device, a control panel embedded in the surface of the box for issuing control commands, and a control panel embedded in the surface of the box for A display panel showing the working status of the aging test device.
  • the output terminal of the control panel is connected with the input terminal of the central control host, which is convenient for the operator to output control instructions, and the central control host controls the aging test device to work according to the control instructions;
  • the input terminal of the display panel is connected with the output terminal of the central control host , which is convenient for the operator to observe and judge the data and status in the test through the display panel.
  • the input end of the heating device, the input end of the refrigeration device, and the input end of the circulation fan are all connected to the output end of the central control host, and the operator can control the heating device, refrigeration device and circulation fan through the control panel.
  • the surface of the box body is provided with emergency stop switches with the same number as the number of test components for emergency shutdown of the corresponding test components, and the output end of each emergency stop switch is connected to the input end of the central control host, When an abnormality or emergency occurs during the test, the operator can interrupt the test process and shut down the device through the emergency stop switch to prevent accidental damage to the device and improve safety.
  • the electronic control box is provided with an acquisition board connected to the chip carrier board one by one for collecting chip test data. Inside the box, data collection can be performed on the chip during the test at room temperature to prevent the harsh test environment from affecting the test data collection and improve the accuracy of the test results.
  • the surface of the box body is embedded with the same number of barometers as the number of test components, and each barometer is connected to the test cavity in the corresponding test component, which is convenient for the operator to intuitively judge the pressure environment in the test cavity, It can be adjusted in time when abnormal pressure occurs.
  • the present invention has the following advantages compared with the prior art:
  • the chip aging test device of the present invention can form a regular gas flow column when the circulating air flows through the test area through the honeycomb plate, increase the flow velocity of the circulating air, and then improve the heat dissipation efficiency of the circulating air;
  • the air volume of each test area can prevent the inconsistency of the test environment caused by the different degrees of heat dissipation between the test areas of each layer; at the same time, the deflector can guide the air flow direction and make reasonable use of its flow inertia to send it from the circulating air duct into the air flow.
  • the test area makes the process of circulating flow smoother and further increases the flow rate of circulating air.
  • the invention can meet the high heat dissipation requirements when a large number of chips are closely arranged for aging tests, and can also ensure that the test environment of each chip remains consistent, thereby improving the test efficiency and the accuracy of test results.
  • Fig. 1 is a structural representation of an embodiment of the present invention
  • Fig. 2 is an exploded view of the test assembly in the embodiment shown in Fig. 1;
  • Fig. 3 is a side view of the embodiment shown in Fig. 1;
  • present embodiment provides a kind of chip burn-in test device, comprise box body 1, at least one test assembly 2 that is arranged inside the box body, each test assembly 2 all comprises the test cavity that is used to accommodate chip 21.
  • the circulation air duct 22 arranged on the periphery of the test chamber 21 and communicated with the test chamber 21, the circulation fan 23 used to form a circulating air in the test chamber 21 and the circulation air duct 22, and the heating device for heating the space in the test chamber 21
  • the cold output parts of the refrigeration device 25 are all arranged in the circulating air duct 22, so as to form a circulating air that can simulate the test environment inside the test chamber 21.
  • the air volume of the circulating fan 23 is 2000m3/h ⁇ 18000m3/h, which can be Make sure that the air volume can meet the heat
  • the test chamber 21 is provided with several chip carrier boards 211 arranged up and down for loading chips, and the chip carrier board 211 divides the test chamber 21 into several test areas 27 for testing chips, and each test area 27 is in its
  • the inner walls of the opposite sides are respectively provided with an air inlet 271 and an air outlet 272 that make the test area 27 communicate with the circulating air duct 22, so that the air circulation can be formed in the test area 27, and not only can pass through the test area 27 with heat, water vapor or cold air.
  • a large amount of circulating air makes the environment in the test chamber 21 meet the test requirements, and can also dissipate heat from the chip through the circulating air to prevent accumulated temperature around the chip.
  • Each test assembly 2 also comprises the first honeycomb panel 28 for being blown into the airflow guide of each test area 27 from the circulation air duct 22, and the first honeycomb panel 28 for being blown into the airflow guide of the circulation air duct 22 from each test area 27.
  • Two honeycomb panels 29, the first honeycomb panel 28 is arranged on the upstream side of the air inlet 271 along the airflow direction, and the second honeycomb panel 29 is arranged on the downstream side of the air outlet 272 along the airflow direction, specifically, the first The honeycomb panel 28 and the second honeycomb panel 29 are respectively arranged on both sides of the test area 27, the diameter of the inscribed circle of the honeycomb holes of the first honeycomb panel 28 and the second honeycomb panel 29 is 4mm ⁇ 12mm, and the first honeycomb panel 28 and the second honeycomb panel The thickness of the second honeycomb panel 29 is not less than 5mm, so that the airflow flowing through the test area 27 forms a regular gas flow column, which improves the flow rate of the circulating air, and can quickly take away the heat emitted
  • the heat dissipation efficiency of the circulating air is to meet the high heat dissipation requirements during the chip test.
  • the number and position of the inner wall opposite to the air inlet 271 in the circulating air duct 22 are all corresponding to the air inlet 271 and are used to guide the airflow to the corresponding inlet.
  • the deflectors 221 of the tuyere 271, each deflector 221 is inclined from the side connected to the inner wall of the circulating air duct 22 to the side close to the air inlet 271 from the upstream to the downstream of the airflow direction, and each is located in the direction of the airflow.
  • the length of the deflector 221 downstream of the direction is greater than the length of the deflector 221 located upstream of the airflow direction, and the deflector 221 arranged obliquely can not only change the air flow direction, but also send the airflow into the test area 27 from the air inlet 271. , can also guide the inertia of the air flow, and further increase the air flow rate; at the same time, the deflectors 221 of different sizes can also evenly distribute the air volume sent into each test area 27, ensuring that the air volume passed into each test area 27 is equal, This prevents the problem of inaccurate test results caused by inconsistent test environments of different chips in the same test chamber 21 .
  • the aging test device also includes a central control host 3 arranged in the box 1 for controlling the work of the aging test device, a control panel 4 embedded in the surface of the box 1 for issuing control commands, and a control panel 4 embedded in the surface of the box 1.
  • the display panel 5 used to display the working status of the aging test device, the output terminal of the control panel 4 is connected with the input terminal of the central control host 3, which is convenient for the operator to output control instructions, and the central control host 3 controls the aging test according to the control instructions
  • the device works; the input end of the display panel 5 is connected with the output end of the central control host 3, so that the operator can observe and judge the data and status in the test through the display panel 5.
  • the input end of the heating device 24, the input end of the cooling device 25, and the input end of the circulating fan 23 are all connected to the output end of the central control host 3, and the operator can control the heating device 24, the cooling device 25 and the circulating fan through the control panel 4 23 jobs.
  • the electric control box 26 is provided with an acquisition board 261 connected to the chip carrier board 211 in one-to-one correspondence for collecting chip test data.
  • the acquisition boards 261 are all connected to the central control host 3.
  • data collection can be performed on the chips in the testing process under normal temperature environment, so as to prevent the adverse testing environment from affecting the collection of test data and improve the accuracy of test results.
  • mesh panels 20 are arranged between the first honeycomb panel 28 and the air inlet 271, and between the second honeycomb panel 29 and the air outlet 272, which can protect the honeycomb panels. Preventing foreign matter from damaging or scratching the honeycomb panel during operation can also prevent foreign matter from falling into the circulating air duct 22 and causing the air duct to be blocked.
  • the surface of the casing 1 is provided with the same number of emergency stop switches 6 for emergency shutdown of the corresponding test assemblies 2 as the number of test assemblies 2, each emergency stop switch 6
  • the output terminals are all connected to the input terminals of the central control host 3.
  • the surface of the casing 1 is embedded with the same number of air pressure gauges 7 as the number of test assemblies 2, and each air pressure gauge 7 is communicated with the test cavity 21 in the corresponding test assembly 2 , it is convenient for the operator to visually judge the pressure environment in the test chamber 21, and can adjust it in time when the pressure is abnormal.

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  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

L'invention concerne un dispositif de test de vieillissement de puce, le dispositif comprenant un corps de boîte (1) et au moins un ensemble de test (2). Chaque ensemble de test (2) comprend une cavité de test (21), un conduit d'air de circulation (22), un premier contreplaqué alvéolaire (28) et un second contreplaqué alvéolaire (29) ; une pluralité de zones de test (27) sont disposées dans la cavité de test (21) ; une sortie d'air (272) et une entrée d'air (271) sont formées sur des parois internes de deux côtés de chaque zone de test (27) ; le premier contreplaqué alvéolaire (28) est disposé du côté amont de l'entrée d'air (271) dans la direction d'écoulement d'air ; le second contreplaqué alvéolaire (29) est disposé du côté aval de la sortie d'air (272) dans la direction d'écoulement d'air ; des panneaux de guidage d'écoulement (221) sont disposés sur la paroi interne du conduit d'air de circulation (22) à l'opposé de l'entrée d'air (271) ; et chaque panneau de guidage d'écoulement (221) est disposé obliquement à partir du côté le plus éloigné de l'entrée d'air (271) vers le côté proche de l'entrée d'air (271) de l'amont vers l'aval dans la direction d'écoulement d'air. Le dispositif peut satisfaire à des exigences de dissipation de chaleur élevées lorsqu'un grand nombre de puces sont étroitement agencées pendant un test de vieillissement, et peut également assurer la cohérence d'un environnement de test où chaque puce est située, ce qui permet d'améliorer l'efficacité du test et la précision d'un résultat de test.
PCT/CN2022/124849 2022-02-16 2022-10-12 Dispositif de test de vieillissement de puce WO2023155449A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202210140273.0 2022-02-16
CN202210140273.0A CN114184940B (zh) 2022-02-16 2022-02-16 一种芯片老化试验装置

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WO2023155449A1 true WO2023155449A1 (fr) 2023-08-24

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WO (1) WO2023155449A1 (fr)

Cited By (2)

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CN116990671A (zh) * 2023-09-21 2023-11-03 叩持(西安)电子信息技术有限公司 一种图形处理芯片gpu老化试验装置
CN117310230A (zh) * 2023-11-27 2023-12-29 南京捷希科技有限公司 一种天线基站老化测试箱

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CN114184940B (zh) * 2022-02-16 2022-05-20 海拓仪器(江苏)有限公司 一种芯片老化试验装置
CN115508660B (zh) * 2022-11-17 2023-03-21 海拓仪器(江苏)有限公司 一种电子器件老化测试装置
CN116166067A (zh) * 2022-12-30 2023-05-26 至誉科技（武汉）有限公司 支持多腔体独立控温的Chamber装置的方法
CN116224038B (zh) * 2023-01-06 2023-11-14 法特迪精密科技（苏州）有限公司 一种芯片温度循环老化测试台的芯片座
CN116359715B (zh) * 2023-05-26 2023-11-03 南京芯驰半导体科技有限公司 多芯片的测试方法、装置、电子设备及存储介质

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Publication number Priority date Publication date Assignee Title
CN116990671A (zh) * 2023-09-21 2023-11-03 叩持(西安)电子信息技术有限公司 一种图形处理芯片gpu老化试验装置
CN116990671B (zh) * 2023-09-21 2023-12-12 叩持(西安)电子信息技术有限公司 一种图形处理芯片gpu老化试验装置
CN117310230A (zh) * 2023-11-27 2023-12-29 南京捷希科技有限公司 一种天线基站老化测试箱
CN117310230B (zh) * 2023-11-27 2024-03-29 南京捷希科技股份有限公司 一种天线基站老化测试箱

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