WO2023155449A1

WO2023155449A1 - Chip aging test device

Info

Publication number: WO2023155449A1
Application number: PCT/CN2022/124849
Authority: WO
Inventors: 刘冬喜; 陈宽勇
Original assignee: 海拓仪器(江苏)有限公司
Priority date: 2022-02-16
Filing date: 2022-10-12
Publication date: 2023-08-24
Also published as: CN114184940A; CN114184940B

Abstract

A chip aging test device, comprising a box body (1) and at least one test assembly (2). Each test assembly (2) comprises a test cavity (21), a circulating air duct (22), a first cellular board (28), and a second cellular board (29); a plurality of test areas (27) are provided in the test cavity (21); an air outlet (272) and an air inlet (271) are formed on inner walls of two sides of each test area (27); the first cellular board (28) is provided on the side of the upstream of the air inlet (271) in the airflow direction; the second cellular board (29) is provided on the side of the downstream of the air outlet (272) in the airflow direction; flow guide boards (221) are provided on the inner wall of the circulating air duct (22) opposite to the air inlet (271); and each flow guide board (221) is obliquely provided from the side farthest from the air inlet (271) to the side close to the air inlet (271) from the upstream to the downstream in the airflow direction. The device can satisfy high heat dissipation requirements when a large number of chips are closely arranged for aging test, and can also ensure the consistency of a test environment where each chip is located, thereby improving the test efficiency and the accuracy of a test result.

Description

A chip aging test device

technical field

The invention relates to a chip aging test device, which is suitable for the technical field of chip aging testing.

Background technique

With the vigorous development of high-tech industries such as 5G communications, semiconductor chips, and aerospace technology, the importance of electronic devices such as chips that are widely used in such industries has become increasingly prominent. In order to be able to control the quality of chip products, Products are usually subject to aging tests before they leave the factory. The aging test is mainly to place the product in a high temperature, high temperature, high humidity or low temperature environment for electrified operation, monitor the electrical variables of the product during operation, and the chemical or physical changes that occur, so as to screen out defective products.

Most of the test chambers of current aging test devices are equipped with multi-layer test carrier boards, which can perform aging tests on chips in large quantities. The heat generation of about 10KW will not only make the test environment of each chip different, but also easily cause the temperature around the chip to reduce the accuracy of the test results.

In the prior art, most of the air circulation is set in the test chamber to facilitate the heat dissipation of the product under test. For example, the equipment disclosed in the patent with the application number CN202010165431. However, due to the upper and lower multi-layer structures in the test chamber, it is easy for the test layer located upstream of the airflow to have a small air volume and poor heat dissipation, while the test layer located downstream of the airflow has a large air volume and good heat dissipation. The test environment is consistent, and the gas flow in the air circulation process of the above-mentioned equipment is relatively scattered, and the heat dissipation efficiency is very low, which cannot meet the heat dissipation requirements of high heat generation during the test of chip products; further, in the patent application number CN202110739083.6 An S-shaped air duct structure is disclosed, which achieves the purpose of synchronizing the test environment of each tested product and dissipating heat for the tested product by opening an air outlet above each tested product, but this type of structure will occupy A large number of test spaces reduces the number of products that can be accommodated in the test chamber, which not only reduces the test efficiency, but also increases the production cost of the equipment. At the same time, due to the small size of chip products, the device for chip testing Among them, there is only a distance of about 150mm between each layer of test carrier boards, and the arrangement is very tight. The structure disclosed in the above-mentioned patent cannot be applied to this kind of test situation.

technical problem

In order to solve the above defects in the prior art, the present invention proposes a chip aging test device.

technical solution

The technical solution adopted in the present invention is: a chip aging test device, including a box body, at least one test assembly arranged inside the box body, each test assembly includes a test chamber for accommodating chips, is arranged on the periphery of the test chamber and A circulating air channel connected with the test chamber, a circulating fan for forming circulating air in the test chamber and the circulating air channel, a heating device for heating the space in the test chamber, a cooling device for cooling the space in the test chamber, and The electric control box adjacent to the test chamber is used to power on the chip.

There are a number of chip carriers arranged up and down in the test chamber for loading chips. The chip carrier divides the test chamber into several test areas for testing chips. Each test area is on the inner wall of its opposite sides. There are air inlets and air outlets connecting the test area with the circulating air duct, which can form air circulation in the test area, and can not only make the environment in the test chamber reach For testing requirements, it is also possible to dissipate heat from the chip through circulating air to prevent accumulated temperature around the chip.

Each test assembly also includes a first honeycomb panel for guiding the airflow blown into each test area from the circulating air duct, a second honeycomb panel for guiding the airflow blowing into the circulating air duct from each testing area, the first The honeycomb panel is arranged on the upstream side of the air inlet along the airflow direction, and the second honeycomb panel is arranged on the downstream side of the air outlet along the airflow direction. Specifically, the first honeycomb panel and the second honeycomb panel are respectively arranged on the test On both sides of the test area, the airflow flowing through the test area forms a regular gas flow column, which improves the flow rate of the circulating air, and can quickly take away the heat emitted by the chip during the test process, thereby improving the heat dissipation efficiency of the circulating air. To meet the high heat dissipation requirements during chip testing; the number and position of the deflectors corresponding to the air inlets and used to guide the airflow to the corresponding air inlets are set on the inner wall of the circulating air duct opposite to the air inlets. Each deflector They are arranged obliquely from the side connected to the inner wall of the circulating air duct to the side close to the air inlet from the upstream to the downstream of the airflow direction, and the length of each deflector located downstream of the airflow direction is greater than that located upstream of the airflow direction. The length of the deflector, the inclined deflector can not only change the air flow direction, send the airflow from the air inlet to the test area, but also guide the inertia of the air flow to further increase the air flow rate; The board can evenly distribute the air volume sent to each test area to ensure that the air volume of each layer of the test area is equal, and prevent the problem of inaccurate test results caused by inconsistent test environments for different chips in the same test chamber.

Further, mesh plates are provided between the first honeycomb panel and the air inlet, and between the second honeycomb panel and the air outlet, which can protect the honeycomb panel and prevent foreign objects from damaging or scratching the honeycomb panel during operation. , It can also prevent foreign objects from falling into the circulating air duct and causing the air duct to be blocked.

Furthermore, the air volume of the circulating fan is 2000m³/h~18000m³/h, ensuring that the air volume can meet the heat dissipation standard required for chip aging.

Further, the diameter of the inscribed circle of the honeycomb holes of the first honeycomb panel and the second honeycomb panel is 4mm~12mm, and the thickness of the first honeycomb panel and the second honeycomb panel is not less than 5mm, ensuring that the air flow column formed by the circulating wind The structure is stable, and at the same time, it also ensures that the airflow has enough travel to form an air column.

Further, the circulating fan, the heat output part of the heating device, and the cold output part of the refrigeration device are all arranged in the circulating air duct, so as to form a circulating air that can simulate the test environment inside the test chamber.

Further, the aging test device also includes a central control host installed in the box for controlling the work of the aging test device, a control panel embedded in the surface of the box for issuing control commands, and a control panel embedded in the surface of the box for A display panel showing the working status of the aging test device. The output terminal of the control panel is connected with the input terminal of the central control host, which is convenient for the operator to output control instructions, and the central control host controls the aging test device to work according to the control instructions; the input terminal of the display panel is connected with the output terminal of the central control host , which is convenient for the operator to observe and judge the data and status in the test through the display panel.

Furthermore, the input end of the heating device, the input end of the refrigeration device, and the input end of the circulation fan are all connected to the output end of the central control host, and the operator can control the heating device, refrigeration device and circulation fan through the control panel.

Further, the surface of the box body is provided with emergency stop switches with the same number as the number of test components for emergency shutdown of the corresponding test components, and the output end of each emergency stop switch is connected to the input end of the central control host, When an abnormality or emergency occurs during the test, the operator can interrupt the test process and shut down the device through the emergency stop switch to prevent accidental damage to the device and improve safety.

Furthermore, the electronic control box is provided with an acquisition board connected to the chip carrier board one by one for collecting chip test data. Inside the box, data collection can be performed on the chip during the test at room temperature to prevent the harsh test environment from affecting the test data collection and improve the accuracy of the test results.

Further, the surface of the box body is embedded with the same number of barometers as the number of test components, and each barometer is connected to the test cavity in the corresponding test component, which is convenient for the operator to intuitively judge the pressure environment in the test cavity, It can be adjusted in time when abnormal pressure occurs.

Beneficial effect

Due to the application of the above-mentioned technical solutions, the present invention has the following advantages compared with the prior art:

The chip aging test device of the present invention can form a regular gas flow column when the circulating air flows through the test area through the honeycomb plate, increase the flow velocity of the circulating air, and then improve the heat dissipation efficiency of the circulating air; The air volume of each test area can prevent the inconsistency of the test environment caused by the different degrees of heat dissipation between the test areas of each layer; at the same time, the deflector can guide the air flow direction and make reasonable use of its flow inertia to send it from the circulating air duct into the air flow. The test area makes the process of circulating flow smoother and further increases the flow rate of circulating air. The invention can meet the high heat dissipation requirements when a large number of chips are closely arranged for aging tests, and can also ensure that the test environment of each chip remains consistent, thereby improving the test efficiency and the accuracy of test results.

Description of drawings

Hereinafter, some specific embodiments of the present invention will be described in detail by way of illustration and not limitation with reference to the accompanying drawings. The same reference numerals in the drawings designate the same or similar components or parts. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the attached picture:

Fig. 1 is a structural representation of an embodiment of the present invention;

Fig. 2 is an exploded view of the test assembly in the embodiment shown in Fig. 1;

Fig. 3 is a side view of the embodiment shown in Fig. 1;

Wherein, the reference signs are explained as follows:

1. Box; 2. Test components; 20. Stencil; 21. Test cavity; 211. Chip carrier; 22. Circulating air duct; 221. Deflector; 23. Circulating fan; 24. Heating device; 25. Refrigeration device; 26. Electric control box; 261. Acquisition board; 27. Test area; 271. Air inlet; 272. Air outlet; 28. First honeycomb panel; 29. Second honeycomb panel; 3. Central control host; 4 , Control panel; 5, Display panel; 6, Emergency stop switch; 7, Barometer.

Embodiments of the present invention

The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are part of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "first" and "second" are used for description purposes only, and should not be understood as indicating or implying relative importance. In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as there is no conflict with each other.

With reference to accompanying drawing 1-3, present embodiment provides a kind of chip burn-in test device, comprise box body 1, at least one test assembly 2 that is arranged inside the box body, each test assembly 2 all comprises the test cavity that is used to accommodate chip 21. The circulation air duct 22 arranged on the periphery of the test chamber 21 and communicated with the test chamber 21, the circulation fan 23 used to form a circulating air in the test chamber 21 and the circulation air duct 22, and the heating device for heating the space in the test chamber 21 The heating device 24, the cooling device 25 for cooling the space in the test chamber 21 and the electric control box 26 adjacent to the test chamber 21 for switching on the power supply for the chip, the heat output part of the circulating fan 23, the heating device 24, The cold output parts of the refrigeration device 25 are all arranged in the circulating air duct 22, so as to form a circulating air that can simulate the test environment inside the test chamber 21. Specifically, the air volume of the circulating fan 23 is 2000m³/h~18000m³/h, which can be Make sure that the air volume can meet the heat dissipation standard required for chip aging.

The test chamber 21 is provided with several chip carrier boards 211 arranged up and down for loading chips, and the chip carrier board 211 divides the test chamber 21 into several test areas 27 for testing chips, and each test area 27 is in its The inner walls of the opposite sides are respectively provided with an air inlet 271 and an air outlet 272 that make the test area 27 communicate with the circulating air duct 22, so that the air circulation can be formed in the test area 27, and not only can pass through the test area 27 with heat, water vapor or cold air. A large amount of circulating air makes the environment in the test chamber 21 meet the test requirements, and can also dissipate heat from the chip through the circulating air to prevent accumulated temperature around the chip.

Each test assembly 2 also comprises the first honeycomb panel 28 for being blown into the airflow guide of each test area 27 from the circulation air duct 22, and the first honeycomb panel 28 for being blown into the airflow guide of the circulation air duct 22 from each test area 27. Two honeycomb panels 29, the first honeycomb panel 28 is arranged on the upstream side of the air inlet 271 along the airflow direction, and the second honeycomb panel 29 is arranged on the downstream side of the air outlet 272 along the airflow direction, specifically, the first The honeycomb panel 28 and the second honeycomb panel 29 are respectively arranged on both sides of the test area 27, the diameter of the inscribed circle of the honeycomb holes of the first honeycomb panel 28 and the second honeycomb panel 29 is 4mm ~ 12mm, and the first honeycomb panel 28 and the second honeycomb panel The thickness of the second honeycomb panel 29 is not less than 5mm, so that the airflow flowing through the test area 27 forms a regular gas flow column, which improves the flow rate of the circulating air, and can quickly take away the heat emitted by the chip during the test, thereby improving the performance of the test area. The heat dissipation efficiency of the circulating air is to meet the high heat dissipation requirements during the chip test. The number and position of the inner wall opposite to the air inlet 271 in the circulating air duct 22 are all corresponding to the air inlet 271 and are used to guide the airflow to the corresponding inlet. The deflectors 221 of the tuyere 271, each deflector 221 is inclined from the side connected to the inner wall of the circulating air duct 22 to the side close to the air inlet 271 from the upstream to the downstream of the airflow direction, and each is located in the direction of the airflow. The length of the deflector 221 downstream of the direction is greater than the length of the deflector 221 located upstream of the airflow direction, and the deflector 221 arranged obliquely can not only change the air flow direction, but also send the airflow into the test area 27 from the air inlet 271. , can also guide the inertia of the air flow, and further increase the air flow rate; at the same time, the deflectors 221 of different sizes can also evenly distribute the air volume sent into each test area 27, ensuring that the air volume passed into each test area 27 is equal, This prevents the problem of inaccurate test results caused by inconsistent test environments of different chips in the same test chamber 21 .

The aging test device also includes a central control host 3 arranged in the box 1 for controlling the work of the aging test device, a control panel 4 embedded in the surface of the box 1 for issuing control commands, and a control panel 4 embedded in the surface of the box 1. The display panel 5 used to display the working status of the aging test device, the output terminal of the control panel 4 is connected with the input terminal of the central control host 3, which is convenient for the operator to output control instructions, and the central control host 3 controls the aging test according to the control instructions The device works; the input end of the display panel 5 is connected with the output end of the central control host 3, so that the operator can observe and judge the data and status in the test through the display panel 5. The input end of the heating device 24, the input end of the cooling device 25, and the input end of the circulating fan 23 are all connected to the output end of the central control host 3, and the operator can control the heating device 24, the cooling device 25 and the circulating fan through the control panel 4 23 jobs.

The electric control box 26 is provided with an acquisition board 261 connected to the chip carrier board 211 in one-to-one correspondence for collecting chip test data. The acquisition boards 261 are all connected to the central control host 3. In the electric control box 26, data collection can be performed on the chips in the testing process under normal temperature environment, so as to prevent the adverse testing environment from affecting the collection of test data and improve the accuracy of test results.

In a more preferred embodiment, mesh panels 20 are arranged between the first honeycomb panel 28 and the air inlet 271, and between the second honeycomb panel 29 and the air outlet 272, which can protect the honeycomb panels. Preventing foreign matter from damaging or scratching the honeycomb panel during operation can also prevent foreign matter from falling into the circulating air duct 22 and causing the air duct to be blocked.

In a more preferred embodiment, the surface of the casing 1 is provided with the same number of emergency stop switches 6 for emergency shutdown of the corresponding test assemblies 2 as the number of test assemblies 2, each emergency stop switch 6 The output terminals are all connected to the input terminals of the central control host 3. When an abnormality or emergency occurs during the test, the operator can interrupt the test process and shut down the device through the emergency stop switch 6 to prevent the risk of device damage caused by accidents and improve safety. sex.

In a more preferred embodiment, the surface of the casing 1 is embedded with the same number of air pressure gauges 7 as the number of test assemblies 2, and each air pressure gauge 7 is communicated with the test cavity 21 in the corresponding test assembly 2 , it is convenient for the operator to visually judge the pressure environment in the test chamber 21, and can adjust it in time when the pressure is abnormal.

The above-mentioned embodiments are only to illustrate the technical concept and characteristics of the present invention. Equivalent changes or modifications made in the spirit shall fall within the protection scope of the present invention.

Claims

A chip aging test device, comprising:

box (1);

At least one test assembly (2), the test assembly (2) is arranged inside the box (1), each test assembly (2) includes a test cavity (21) for accommodating chips, and is arranged in the A circulating air duct (22) around the testing chamber (21) and communicating with the testing chamber (21), a circulating fan for forming circulating air in the testing chamber (21) and the circulating air duct (22) (23), a heating device (24) for heating the space in the test chamber (21), a cooling device (25) for cooling the space in the test chamber (21), and a cooling device for cooling the chip Electric control box (26) connected to power supply;

A plurality of chip carriers (211) for loading chips, the plurality of chip carriers (211) are arranged in the test cavity (21) along the vertical direction, and the plurality of chip carriers (211) will The test chamber (21) is divided into a number of test areas (27), and each test area (27) is respectively provided with the inner walls of the opposite sides so that the test area (27) and the circulating air duct (22) connected air inlet (271) and air outlet (272);

Wherein, each said test component (2) also includes:

The first honeycomb panel (28) used to guide the airflow blown into each of the test areas (27) from the circulating air duct (22), the first honeycomb panel (28) is arranged at the air inlet ( 271) upstream along the airflow direction;

The second honeycomb panel (29) used to guide the airflow blown into the circulating air duct (22) from each of the test areas (27), the second honeycomb panel (29) is arranged at the air outlet ( 272) downstream along the airflow direction;

A plurality of deflectors (221) are arranged on the inner wall of the circulating air duct (22) opposite to the air inlet (271), the number of the deflectors (221) is equal to that of the test area (27), and each deflector The positions of the plates (221) correspond to the air inlets (271) to guide the airflow to the corresponding air inlets (271), and each of the deflectors (221) connects with the circulating air duct (22) The side where the inner walls are connected is inclined from upstream to downstream in the direction of airflow toward the side close to the air inlet (271).
The chip aging test device according to claim 1, characterized in that: the lengths of the plurality of deflectors (221) gradually increase from upstream to downstream in the airflow direction.
The chip aging test device according to claim 1, characterized in that: between the first honeycomb panel (28) and the air inlet (271), between the second honeycomb panel (29) and the air outlet Stencils (20) are arranged between (272).
The chip aging test device according to claim 1, characterized in that: the air volume of the circulating fan (23) is 2000m³/h~18000m³/h.
The chip aging test device according to claim 1, characterized in that: the diameter of the inscribed circle of the honeycomb holes of the first honeycomb panel (28) and the second honeycomb panel (29) is 4mm~12mm, and the The thickness of the first honeycomb panel (28) and the second honeycomb panel (29) is not less than 5mm.
The chip aging test device according to claim 1, characterized in that: the circulation fan (23), the heat output part of the heating device (24), and the cooling output part of the refrigeration device (25) are all set in the circulating air duct (22).
The chip aging test device according to claim 1, further comprising a central control host (3) arranged in the box (1) for controlling the work of the aging test device, embedded in the box ( 1) The control panel (4) on the surface for issuing control commands, the display panel (5) embedded on the surface of the box (1) for displaying the working status of the aging test device, the control panel ( The output end of 4) is connected to the input end of the central control host (3), and the input end of the display panel (5) is connected to the output end of the central control host (3).
The chip aging test device according to claim 7, characterized in that: the input end of the heating device (24), the input end of the cooling device (25), and the input end of the circulating fan (23) are all connected to The output terminals of the central control host (3) are connected to each other.
The chip aging test device according to claim 7, characterized in that: the surface of the box (1) is provided with the same number of test components as the number of the test components (2) corresponding to the emergency shutdown The emergency stop switch (6) of the component (2), the output end of each of the emergency stop switches (6) is connected to the input end of the central control host (3).
The chip aging test device according to claim 7, characterized in that: the electric control box (26) is provided with a one-to-one corresponding connection with the chip carrier board (211) for collecting the chip test data A collection board (261), the collection board (261) is connected to the central control host (3).
The chip aging test device according to claim 1, characterized in that: the surface of the box (1) is embedded with the same number of barometers (7) as the number of the test components (2), and each of the The air pressure gauges (7) are all in communication with the test cavity (21) in the corresponding test component (2).