CN211856811U - Feedback type pre-burning device of the blast furnace - Google Patents

Abstract

A feedback type pre-burning device of a running furnace comprises at least one running frame arranged in the running furnace, at least one running plate and a feedback type pre-burning unit, wherein at least one transverse ventilation channel communicated with the inside of the running frame is formed above the running frame, one end of the transverse ventilation channel is connected to at least one negative pressure area or heat exhausting fan of the running furnace, the running plate is accommodated in the running frame and is combined with a linker connected with at least one test IC, the feedback type pre-burning unit is respectively connected with the linker and the running plate, and the feedback type pre-burning unit provides the environmental temperature of the running plate, the temperature sensing of the test IC, the automatic feedback control of the heat dissipation wind speed and the environmental temperature of the running plate, so as to dissipate the heat dissipation of the test IC on the running plate and each feedback type pre-burning unit to the transverse ventilation channel of the running frame, and is exhausted through one end of the transverse ventilation duct via the negative pressure area of the furnace or the exhaust fan.

Description

Feedback type pre-burning device of the blast furnace

technical field

The utility model relates to a feedback type pre-burning device for a burnin furnace, in particular to a test IC pre-burning device applied to a burnin furnace, and an automatic feedback with different temperature rise conditions of the respective test ICs Feedback burn-in device for control and discharge of cooling air flow control.

Background technique

ICs (integrated circuits) such as existing microprocessor units (CPUs), graphics processing units (GPUs), chip sets (Chipset) and Netcom applications all need to go through the burn-in test process such as the existing ovens before leaving the factory, so as to test The electronic characteristics of the IC and the characteristics of the working environment such as temperature rise, but due to the shrinking of the process and the increasing complexity of IC design, such as ICs such as micro processing units, graphics processing units, chipsets and Netcom applications, during the IC test burn-in The problem of high energy consumption is severe, which seriously affects the temperature control accuracy during the burn-in test, which in turn leads to the occurrence of over-voltage or over-current overload of the burn-in test system. shut down), and seriously affect the test efficiency and productivity of the IC, especially because the test temperature of the test IC suddenly rises, making the protection system too late to start, and the test IC melts down.

In addition, most of the existing solutions for temperature equalization in the furnace are to blow the test IC directly at the cooling airflow speed, or blow the test IC from the left or the right side, but whether it is blowing directly down, or blowing directly from the left or right side Or upward and direct suction, because the temperature is circulated in a large closed space (Chamber), which makes it difficult to control the temperature of each test IC, and the time for the temperature to stabilize is also longer. The test temperature control of each layer of test ICs in the furnace must limit the type and test conditions of each test IC in the same layer of the furnace to be exactly the same, so as to control the test temperature conditions uniformly, not only to make the test IC The scope and application of the test are greatly limited, and each test IC is also under the heat dissipation airflow of uneven temperature, which cannot achieve well-controlled and accurate test temperature conditions, which makes the IC burn-in test performance and accuracy. As a result, the speed is greatly reduced, which is a problem that needs to be solved in the current IC test burn-in.

In addition, in terms of related prior patent technical documents, the Chinese Taiwan Patent Publication No. I659484 "Electronic component burn-in device with air guide mechanism" invention patent case, No. I639844 "Electronic component burn-in test device and its application of the burn-in Furnace" invention patent case and No. I456219 "burn-in test device" invention patent case both disclose the structure and technology of the typical existing furnace as above, that is, disclose the structure of the furnace in which the cooling air is recycled from the side or the top, In addition to the above-mentioned high energy consumption problem during the burn-in test of the IC test, the problem of high energy consumption is more severe, which seriously affects the temperature control during the burn-in test, which in turn leads to the occurrence of over-voltage or over-current overload of the burn-in test system. Shutting down the burn-in test system will seriously affect the IC test efficiency and productivity, or the protection system will not be able to start in time due to the sudden rise of IC test temperature, which will lead to the problems and shortcomings of the test IC meltdown. Moreover, the above-mentioned patent case, The temperature of each test IC is difficult to control, and the temperature tends to be stable for a long time. Moreover, each test IC of each layer in the furnace must have the same properties and characteristics. The same test temperature environment greatly limits the test scope and application of the test IC, and each test IC is also under the heat dissipation airflow of uneven temperature, so it cannot achieve well-controlled and accurate test temperature conditions. As a result, the performance and accuracy of the IC burn-in test are greatly reduced.

In addition, another example is the Chinese Taiwan Patent Gazette No. I664431 "Testing System" Invention Patent, which discloses an IC burn-in test system with remote network connection and remote control, although it can test ICs in each furnace In addition, the network link is used to remotely perform the burn-in test operation, but there is no feedback system in the test system to truthfully feedback the burn-in and real-time (REAL TIME) test environment temperature of each test IC, so that the remote monitor cannot be used. Precisely control the burn-in simulation temperature environment of the test IC, and each layer in the above-mentioned typical conventional furnace must also be of the same nature and the same test temperature environment, so that the test range of the test IC and the The application is greatly limited, and each test IC is also under the uneven temperature cooling airflow, which cannot achieve well-controlled and accurate test temperature conditions, so that the performance and accuracy of the IC burn-in test are greatly improved. Problems and disadvantages of needle lowering.

Utility model content

The main technical problem to be solved by the present utility model is to overcome the above-mentioned defects in the prior art, and provide a feedback type pre-burning device for a charging furnace, so as to eliminate the above-mentioned existing or the existing problems shown in the previous cases of each patent. The problem of high energy consumption in the IC test burn-in system of the furnace is severe, which seriously affects the temperature control during the burn-in test, which in turn leads to over-voltage or over-current of the burn-in test system. Then the protection is activated, the burn-in test system is shut down, and the IC test efficiency and productivity are seriously affected; in severe cases, the IC test temperature suddenly rises, making the protection system too late to start, resulting in the test IC being melted down and circulating in a large confined space. The uniform temperature makes it difficult to control the temperature of each test IC, and it takes a long time for the temperature to stabilize. Moreover, each test IC of each layer in the furnace must also have the same properties and the same test temperature environment, so that the The test scope and application of test ICs are greatly limited, and each test IC is also under the heat dissipation airflow of uneven temperature, so it cannot achieve well-controlled and accurate test temperature conditions, which makes the IC burn-in test. As a result, the cost is greatly increased, and the performance and accuracy of the IC burn-in test are greatly reduced.

The technical scheme adopted by the utility model to solve its technical problems is:

A feedback type pre-burning device for a blast furnace, comprising:

At least one response frame, which is accommodated in a response furnace, at least one horizontal ventilation channel is formed above the response frame and communicated with the interior of the response frame, and one end of the horizontal ventilation channel is connected to the furnace. At least one negative pressure zone or heat exhaust fan;

at least one response board, which is accommodated inside the response frame, and which is connected to the linker to which at least one test IC is connected, and

At least one feedback burn-in unit is connected to the link connected to the test IC and the response board, and the feedback burn-in unit has the ambient temperature of the response board, the temperature sensing of the test IC and the burn-in temperature of the test IC , The function of automatic feedback control of heat dissipation wind speed and ambient temperature, so as to discharge the heat dissipation heat of the test IC on the response board and each feedback burn-in unit to the horizontal air channel, and pass the one end of the horizontal air channel to the horizontal air channel. The negative pressure area of the furnace or the exhaust fan is discharged.

Further, an accommodating space is provided inside the response frame for accommodating the response board.

Further, at least one hole-shaped air deflector is arranged below the transverse ventilation channel of the response frame to communicate with the transverse ventilation channel of the response frame, so that the response board and the test IC on each feedback burn-in unit are The heat dissipation hot air is discharged into the lateral ventilation channel through the hole-shaped air deflector.

Further, the hole-shaped air guide plate of the responsive frame is provided with several air guide holes to communicate with the transverse air passage.

Further, at least one hot air outlet is provided at one end of the transverse ventilation channel of the response frame to communicate with the negative pressure area of the response furnace and the exhaust fan.

Further, the feedback burn-in unit includes:

At least one base is used to connect the connector of the test IC carrying the response board, the bottom surface of the base is connected with the response board, and at least one air inlet is respectively provided around the base, which can be introduced into the surface of the response board. Air;

At least one upper cover is combined with the top of the base, the upper cover is provided with a frame opening, the frame opening corresponds to the top surface of the test IC on the test IC connector, and the peripheral edges of the frame opening of the upper cover are respectively provided with at least one vent a channel, the air channel is communicated with the air intake channel of the base to introduce the air on the surface of the response plate;

at least one heat dissipation fin set is combined on the upper part of the upper cover, a connecting part is provided on the bottom surface of the heat dissipation fin set, and the connecting part is connected to the top surface of the test IC through the frame opening of the upper cover;

At least one heater is combined inside the heat dissipation fin group to provide the function of the heat dissipation fin group to simulate and test the temperature rise;

At least one fan is combined above the heat dissipation fin set to provide the heat dissipation function of the heat dissipation fin set to discharge the heat dissipation heat, and to respond to the air on the surface of the plate introduced through the air inlet channel of the base and the air channel of the upper cover discharged together;

at least one sensor, the sensor is arranged between the top surface of the test IC and the heat dissipation fin group, so as to sense the test temperature rise temperature of the test IC by the sensor; and,

At least one external controller is connected to the sensor, the heater and the fan respectively, to test the temperature rise according to the test IC sensed and fed back by the sensor, and to control the heating temperature of the heater and the cooling wind speed of the fan respectively.

Further, at least one accommodating hole is provided in the heat dissipation fin group of the feedback type burn-in unit for accommodating and fixing the heater.

Further, the bottom of the fan of the feedback burn-in unit is combined with at least one fan seat, the fan seat is provided with at least one opening, and the bottom surface of the fan is provided in communication with the top surface of the heat dissipation fin group through the opening, and the periphery of the fan seat is provided with several numbers. an inserting piece, so that the inserting piece is downwardly fitted to the outside of the upper cover.

Further, at least one opening is formed on the peripheral edge of the fan base of the feedback type burn-in unit, respectively, which can respectively provide external cold air from the peripheral edge to inhale and cool the heat dissipation fins through the fan inhalation operation.

Further, the sensor of the feedback burn-in unit is a temperature sensor.

Further, the external controller of the feedback burn-in unit is arranged on the response board.

Further, the external controller of the feedback burn-in unit is linked with at least one external sensor to sense external ambient temperature, feedback airflow temperature, wind speed and air volume state flowing through the top surface of the test IC, and feed back to the external controller.

The effect of the present invention is that the heat dissipation fin group is directly heated by the heater placed in the heat dissipation fin group in the feedback type burn-in unit, so that the test IC can quickly reach the pre-heating temperature. The temperature of the burn-in test is fed back to the external controller through the sensor sensing IC top surface temperature to control the heating and cooling temperature of the heater, its heating time, the fan speed and its running time. The external sensor senses the ambient temperature, feeds back the air flow temperature, and feeds back the air speed and air volume status through the top surface of the test IC to the external controller, which further precisely controls the heater's rising and falling temperature and its heating time, fan speed and its temperature. At the same time, through the air guide holes of the perforated air guide plate on the bottom surface of the lateral air channel above the response frame to which the response board belongs, the heat dissipation heat of the cooling fan above each test IC is exhausted (suction). ) out, thereby reducing the mutual interference of heat sources among the test ICs, and forming a feedback burn-in device that can automatically control the test IC burn-in temperature and average temperature and save burn-in energy, and can quickly and stably achieve each Test the effect of IC temperature uniformity, and the cooling rack containing the cooling board can be installed in the cooling furnace in a modular way. It is systematically connected to the negative pressure area and exhaust fan of the furnace, so that the heat dissipation heat can be systematically discharged into the furnace, and then discharged centrally through the furnace. The base, upper cover, heat dissipation fin group, heater, fan and sensor of each feedback burn-in unit in the feedback burn-in device of the utility model can be independently integrated and installed on each test IC, independently and separately for The burn-in energy consumption and temperature control requirements of the test ICs are efficiently distributed and individually feedback burn-in temperature control. The device is simplified and the manufacturing and maintenance are simple. Therefore, compared with the IC burn-in devices of the above-mentioned existing or previous patents Therefore, the cost of the burn-in test of the present invention can be greatly reduced, and the value and economic benefit of the industrial utilization of the present invention can be further improved.

The beneficial effect of the present invention is to eliminate the problem of high energy consumption during the IC test pre-burn that exists in the existing IC test burn-in system of the above-mentioned existing or the previous patent cases. Seriously affects the temperature control during burn-in test, which in turn leads to over-voltage or over-current of the burn-in test system. In light cases, protection is activated, which shuts down the burn-in test system and seriously affects IC test efficiency and productivity. The sudden rise makes the protection system too late to start, which leads to the meltdown of the test IC, and the temperature is circulated in a large confined space, making it difficult to control the temperature of each test IC, and the time for the temperature to stabilize is longer. Each layer of the test IC in the furnace must also be of the same nature and the same test temperature environment, which greatly limits the test scope and application of the test IC, and causes each test IC to dissipate heat due to uneven temperature. Under the air flow, well-controlled and accurate test temperature conditions cannot be achieved, so the cost of the IC burn-in test is greatly increased, and the performance and accuracy of the IC burn-in test are greatly reduced.

Description of drawings

The present utility model will be further described below in conjunction with the accompanying drawings and embodiments.

Fig. 1 is the three-dimensional appearance structure diagram of the feedback type pre-burning device of the reaction furnace according to the first embodiment of the present utility model;

2 is a cross-sectional view of the feedback pre-burning device of the furnace according to the first embodiment of the present utility model;

3 is a three-dimensional appearance structural diagram of a feedback type pre-burning unit of the feedback type pre-burning device of the reaction furnace according to the first embodiment of the present invention;

4 is a three-dimensional exploded structural diagram of a feedback type pre-burning unit of the feedback type pre-burning device of the reaction furnace according to the first embodiment of the present utility model;

Fig. 5 is the front view of the feedback type pre-burning unit of the feedback type pre-burning device of the reaction furnace according to the first embodiment of the present utility model;

6 is a top view of a feedback type pre-burning unit of the feedback type pre-burning device of the reaction furnace according to the first embodiment of the present utility model;

Fig. 7 is the sectional view of A-A' of Fig. 6;

8 is a control block circuit diagram between the response board of the feedback type burn-in device of the response furnace and the sensor, heater, fan and external controller of the feedback type burn-in unit according to the first embodiment of the present invention;

Fig. 9 is the second embodiment diagram of the present utility model;

Fig. 10 is the third embodiment diagram of the present utility model;

FIG. 11 is a preferred application example of the feedback type pre-burning device of the blast furnace of the present invention.

Description of the labels in the figure:

100 Feedback burn-in device 10 Response rack

11 Accommodating space 12 Lateral ventilation ducts

121 Perforated air deflector 121A Air deflector

122 Hot air outlet 20 Pentium plate

30 Feedback burn-in unit 31 Base

311 Air intake 32 Top cover

321 Frame mouth 322 Airway

33 Heat dissipation fin set 331 Connection part

34 Heater 35 Fan

351 Fan base 352 Fitting piece

353 Cutout 36 Sensor

37 External controller 371 External sensor

200 Pending furnace 210 Negative pressure zone

220 Exhaust Fan 300 Test IC

310 Linker 400 Cooling Heat

500 Ambient temperature airflow 600 Outside cool air

700 Feedback Heat Flow 351A Opening

332 accommodating hole

Detailed ways

Please refer to FIG. 1 , FIG. 2 , FIG. 3 , FIG. 4 , FIG. 5 , FIG. 6 , FIG. 7 and FIG. 8 . The pre-burning device 100 includes at least one response frame 10, and the response frame 10 is placed inside a response furnace 200 (shown by the dotted line in FIG. 11 ), and an accommodation space 11 is provided inside the response frame 10, In addition, at least one lateral ventilation channel 12 communicated with the accommodating space 11 is formed on the upper part of the response frame 10 , and at least one hole-shaped wind deflector 121 is provided below the transverse ventilation channel 12 . There are several air guide holes 121A to communicate with the lateral ventilation channel 12 , and a hot air outlet 122 is provided at one end of the lateral ventilation channel 12 .

At least one response board 20, the response board 20 is accommodated in the accommodating space 11 inside the response frame 10, and the response board 20 is connected to the connector 310 connected to at least one test IC 300, the response board 20 has the function of performing a burn-in test on the test IC 300. The type of the above-mentioned test IC 300 is not limited, and may be ICs such as a micro processing unit, a graphics processing unit, a chip set, and a Netcom application.

At least one feedback burn-in unit 30 , the type of which is not limited, includes at least one base 31 , an upper cover 32 , a set of cooling fins 33 , a heater 34 , a fan 35 , a sensor 36 and an external controller 37 in the present invention (as shown in FIG. 8 ) as an example, the bottom surface of the base 31 is combined with the response plate 20 and the connector 310 , and at least one air inlet 311 is respectively provided on the periphery of the bottom surface of the base 31 for introducing the Respond to the air on the surface of the plate 20 .

The upper cover 32 is provided with a frame opening 321, the frame opening 321 corresponds to the top surface of the test IC 300 of the test IC connector 310 on the base 31, and at least one vent is respectively provided around the frame opening 321 of the upper cover 32 A channel 322 is connected to the air channel 311 of the base 31 (as shown in FIG. 5 ) to introduce the air on the surface of the response plate 20 .

The heat dissipation fin set 33 is combined on the top of the upper cover 32 , and a connecting portion 331 is formed on the bottom surface of the heat dissipation fin set 33 . The connecting portion 331 is connected to the top of the test IC 300 through the frame opening 321 of the upper cover 32 . and at least one accommodating hole 332 is formed inside the heat dissipation fin set 33 .

The heater 34 is combined and accommodated in the accommodating hole 332 inside the heat dissipation fin set 33 to provide the heat dissipation fin set 33 with a function of simulating temperature rise.

The bottom of the fan 35 is combined with at least one fan base 351 . The fan base 351 is provided with at least one opening 351A, through which the bottom surface of the fan 35 communicates with the top surface of the heat dissipation fin set 33 . The fan base 351 is provided with several The inserting piece 352 is inserted downwardly on the outside of the upper cover 32 by the inserting piece 352 , so that the fan 35 is combined on the top of the heat dissipation fin set 33 , and the bottom surface of the fan 35 is provided with the bottom surface of the fan 35 by the inserting piece 352 . The top surface of the heat dissipation fin set 33 is connected to provide the function of a heat dissipation system for the heat dissipation of the heat dissipation fin set 30 to discharge heat. The cooling fins 30 are sucked in and cooled by the fan 35 .

The sensor 36 is disposed between the top surface of the test IC 300 and the heat dissipation fin set 33 , so as to sense the test temperature rise of the test IC 300 by the sensor 36 .

The location of the external controller 37 is not limited. In the first embodiment of the present invention, the external controller 37 is set outside the response board 20 as an example, and the external controller 37 is connected to the The sensor 36 , the heater 34 and the fan 35 test the temperature rise according to the test IC 300 sensed and fed back by the sensor 36 , and control the heating temperature of the heater 34 and the cooling wind speed of the fan 35 respectively.

Please refer to FIG. 9 again, which is the second embodiment of the feedback type pre-burning device 100 of the response furnace of the present invention, wherein the external controller 37 of the feedback type pre-burning unit 30 is displayed on the response board 20, and the external controller 37 is connected to the sensor 36, the heater 34 and the fan 35, respectively, to test the temperature rise according to the test IC sensed and fed back by the sensor 36, and to control the heating temperature of the heater 34 and The cooling wind speed of the fan 35 .

Please refer to FIG. 10 again, which is the third embodiment of the feedback type pre-burning device 100 of the reaction furnace of the present invention, which shows that the external controller 37 of the feedback type pre-burning unit 30 as shown in FIG. 8 is connected to at least one The external sensor 371 is used to sense the external ambient temperature of the feedback pre-burning device 100 of the furnace, the temperature of the feedback air flow, the air speed and air volume state flowing through the top surface of the test IC 300 by the external sensor 371, and the external sensor 371 The 371 feedback is provided to the external controller 37 , so that the external controller 37 can more accurately control the heating temperature of the heater 34 and the cooling wind speed of the fan 35 .

Please refer to FIG. 11 again, which is a preferred application example of the feedback pre-burning device 100 of the response furnace of the present invention, wherein the response rack 10 is shown to be installed inside a response furnace 200 to test the IC 300 The bottom surface of the linker 310 is connected to the response board 20. When the fans 35 of the feedback type pre-burning units 30 in the feedback type pre-burning device 100 of the response furnace of the present invention are controlled and activated by the above-mentioned external controller 37, When the test IC 300 and the heat dissipation hot air 400 of the heat dissipation fin group 33 of the feedback burn-in unit 30 are sucked upward and discharged, the front of the accommodation space 11 of the response frame 10 will introduce the ambient temperature air flow 500 with a lower external temperature, respectively. The test IC 300 and the heat dissipation fin set 33 are continuously supplied through the surface of the response board 20 , the air inlet 311 of the base 31 , the air passage 322 of the upper cover 32 , and the external cold air 600 through the opening 353 of the fan base 351 . The cooling control is performed, and most of the heat dissipation hot air 400 is discharged upward into the lateral air channel 12 through the air guide holes 121A of the hole-shaped air guide plate 121 of the response frame 10 (as shown by the arrow direction in FIG. 11 ), and is discharged to a negative pressure area 210 or exhaust fan 220 of the furnace 200 through a hot air outlet 122 on one side of the lateral ventilation channel 121A, and a small part of the heat dissipation hot air 400 is touching the hole-shaped air guide plate 121 When the air guide hole 121A is not provided, at least one feedback heat flow 700 is formed downward to provide feedback to the test IC 300 for accelerating the burn-in temperature.

In addition, it is worth mentioning that the bases 31 , the upper cover 32 , the heat dissipation fin group 33 , the heating fins 33 , the bases 31 , the upper cover 32 , the heat dissipation fin set 33 , the feedback type pre-burning unit 30 in the feedback type pre-burning device 100 of the above-mentioned utility model The device 34 , the fan 35 , the sensor 36 and the external controller 37 can be independently integrated and installed on each test IC 300 of the response board 20 , independently and separately for the burn-in power consumption and temperature control requirements of each test IC 300 . Efficient energy distribution and individual feedback burn-in temperature control can not only greatly improve the performance of the test IC 300 burn-in test, but also make the types and types of the test ICs 300 of the response board 20 not necessarily the same. That is to say, each test IC 300 on the same response board 20 can be used for simulation tests of different temperature rise and temperature environments, and each test IC 300 can be combined with the feedback type burn-in of the response furnace of the present invention. The device 100, through the precise control effect of the automatic feedback pre-burning temperature of the feedback type pre-burning device 100 of the reaction furnace, enables the pre-burning temperature of each test IC300 to accurately reach the pre-burning temperature control of the ambient average temperature, which can be greatly reduced. The cost of the test IC 300 burn-in test greatly improves its test performance, industrial utilization value and economic benefits.

The above are only preferred embodiments of the present invention, and are not intended to limit the present invention in any form. Any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical essence of the present invention, All still belong to the scope of the technical solution of the present invention.

Claims (12)

1. A feedback type burn-in device of a running furnace is characterized by comprising:

at least one gallop frame, which is accommodated in a gallop furnace, at least one transverse ventilation duct communicated with the gallop frame is formed above the gallop frame, and one end of the transverse ventilation duct is connected to at least one negative pressure area or heat exhausting fan of the gallop furnace;

at least one reaction plate accommodated in the reaction frame and connected with at least one linker for connecting with the test IC, and

at least one feedback pre-burning unit linked to the linker and the test IC, the feedback pre-burning unit has the functions of the environmental temperature of the test IC, the temperature sensing of the test IC and the automatic feedback control of the pre-burning temperature, the heat dissipation wind speed and the environmental temperature of the test IC, so as to discharge the heat dissipation hot gas of the test IC on the test IC and the test IC on the feedback pre-burning unit to the transverse ventilation duct and discharge the heat dissipation hot gas to the negative pressure area or the exhaust fan of the test IC through one end of the transverse ventilation duct.

2. The feedback burn-in apparatus of claim 1, wherein the inside of the frame is provided with a receiving space for receiving the running board.

3. The feedback burn-in apparatus of claim 1, wherein at least one hole-shaped air deflector is disposed below the transverse air duct of the reaction frame to communicate with the transverse air duct of the reaction frame, so that the heat dissipation heat of the reaction plate and the test ICs on each feedback burn-in unit can be exhausted to the transverse air duct through the hole-shaped air deflector.

4. The feedback burn-in apparatus of claim 3, wherein the perforated wind deflector of the reaction frame is provided with a plurality of wind guiding holes for communicating with the transverse air duct.

5. The feedback burn-in apparatus of claim 1, wherein one end of the transverse air duct of the reaction frame is provided with at least one hot air outlet for communicating with the negative pressure region of the reaction furnace and the exhaust fan.

6. The feedback burn-in apparatus of a running oven of claim 1, wherein the feedback burn-in unit comprises:

at least one base for connecting the connector of the test IC bearing the running board, the bottom of the base is connected with the running board, and the periphery of the base is respectively provided with at least one air inlet channel for introducing air on the surface of the running board;

at least one upper cover, which is combined above the base and is provided with a frame opening, the frame opening corresponds to the top surface of the test IC on the test IC linker, the four peripheries of the frame opening of the upper cover are respectively provided with at least one air duct, and the air duct is communicated with the air inlet channel of the base so as to introduce the air on the surface of the corresponding plate;

at least one heat radiation fin group combined above the upper cover, the bottom surface of the heat radiation fin group is provided with a connecting part which is connected with the top surface of the test IC through the frame opening of the upper cover;

at least one heater combined inside the radiating fin group to provide the radiating fin group with the function of simulating and testing temperature rise;

at least one fan, which is combined above the radiating fin group to provide the radiating system function of radiating hot air exhaust of the radiating fin group and exhaust the air on the surface of the corresponding plate introduced by the air inlet channel of the base and the air channel of the upper cover;

at least one sensor, the sensor is set up between top surface of the test IC and radiating fin group, in order to detect the test IC tests the temperature rise temperature with the sensor; and the number of the first and second groups,

and at least one external controller respectively connected with the sensor, the heater and the fan, for testing the temperature rise according to the test IC sensed and fed back by the sensor, and respectively controlling the heating temperature of the heater and the heat dissipation air speed of the fan.

7. The feedback burn-in apparatus of claim 6, wherein the heat dissipating fin set of the feedback burn-in unit has at least one receiving hole for receiving and fixing the heater.

8. The feedback-type burn-in device of claim 6, wherein the bottom of the fan of the feedback-type burn-in unit is coupled to at least one fan seat, the fan seat has at least one opening therein, the opening provides a bottom surface of the fan to communicate with the top surface of the heat-dissipating fin set, and the periphery of the fan seat has a plurality of engaging pieces, so that the engaging pieces engage with the outside of the top cover.

9. The feedback burn-in apparatus of claim 6, wherein the fan base of the feedback burn-in unit has at least one opening formed on each of four peripheral edges thereof for providing external cooling air to be drawn in from the four peripheral edges through the fan suction operation to cool the heat dissipating fins.

10. The feedback burn-in apparatus of the running oven of claim 6, wherein the sensor of the feedback burn-in unit is a temperature sensor.

11. The feedback burn-in apparatus of claim 6, wherein an external controller of the feedback burn-in unit is disposed on the running board.

12. The feedback burn-in apparatus of the running oven of claim 6, wherein the external controller of the feedback burn-in unit is linked to at least one external sensor for sensing external ambient temperature, feedback airflow temperature, wind speed and wind volume status flowing through the top surface of the test IC, and feeding back to the external controller.

Images