CN211856811U

CN211856811U - Feedback type presintering device of running furnace

Info

Publication number: CN211856811U
Application number: CN202020254120.5U
Authority: CN
Inventors: 萧国庆
Original assignee: Hongbang Automation Co ltd
Current assignee: Hongbang Automation Co ltd
Priority date: 2020-03-05
Filing date: 2020-03-05
Publication date: 2020-11-03
Anticipated expiration: 2030-03-05

Abstract

A feedback type pre-burning device of a running furnace comprises at least one running frame arranged in the running furnace, at least one running plate and a feedback type pre-burning unit, wherein at least one transverse ventilation channel communicated with the inside of the running frame is formed above the running frame, one end of the transverse ventilation channel is connected to at least one negative pressure area or heat exhausting fan of the running furnace, the running plate is accommodated in the running frame and is combined with a linker connected with at least one test IC, the feedback type pre-burning unit is respectively connected with the linker and the running plate, and the feedback type pre-burning unit provides the environmental temperature of the running plate, the temperature sensing of the test IC, the automatic feedback control of the heat dissipation wind speed and the environmental temperature of the running plate, so as to dissipate the heat dissipation of the test IC on the running plate and each feedback type pre-burning unit to the transverse ventilation channel of the running frame, and is exhausted through one end of the transverse ventilation duct via the negative pressure area of the furnace or the exhaust fan.

Description

Feedback type presintering device of running furnace

Technical Field

The present invention relates to a feedback type burn-in device for a furnace, and more particularly to a feedback type burn-in device for testing an IC of a furnace and having automatic feedback control and heat dissipation airflow control for discharging the IC under different temperature rise conditions.

Background

The existing ICs (integrated circuits) such as a micro processing unit (CPU), a Graphics Processing Unit (GPU), a Chipset (Chipset), and a web application are all subjected to a burn-in test process such as the existing burn-in oven before the IC is shipped to test the electronic characteristics of the IC and the characteristics of the operating environment such as temperature rise, however, because the process is miniaturized and the IC design is increasingly complicated, such as the micro-processing unit, the graphic processing unit, the chipset and the network application, the IC has high energy consumption during the IC test and pre-burning, the problem is greatly increased, the temperature control accuracy during the pre-burning test is seriously affected, further leading to the overload situation of overvoltage or overcurrent of the burn-in test system, starting protection if the burn-in test system is light, and enabling the burn-in test system to be closed (shut down), the IC testing efficiency and productivity are seriously affected, and the protection system is not ready to start due to the instantaneous sudden rise of the testing temperature of the tested IC, so that the tested IC is damaged by melting.

In addition, most of the existing solutions for temperature equalization of the running furnace are to directly blow the test IC with the wind speed of the heat dissipation airflow or blow the test IC from the left side or the right side to the test IC, however, no matter blowing directly downwards, blowing directly from the left side or the right side, or sucking directly upwards, because the temperature equalization is circulated in a large enclosed space (Chamber), the temperature of each test IC is difficult to control, and the time for the temperature to stabilize is longer, and in order to achieve the temperature equalization control of each layer of test ICs in the existing running furnace, it is necessary to limit the type of each test IC in the same layer of the running furnace to be identical to the test conditions, so as to uniformly control the test temperature conditions, not only greatly limit the test scope and application of the test IC, but also each test IC cannot achieve the well-controlled and precise test temperature conditions because of the heat dissipation airflow with uneven temperature, therefore, the efficiency and precision of the IC burn-in test are greatly reduced, which is the problem to be solved by the IC test burn-in.

In addition, in the related prior patent documents, taiwan patent publication No. I659484 "electronic component pre-burning apparatus with air guiding mechanism" patent invention, No. I639844 "electronic component pre-burning test device and pre-burning furnace for its application" patent invention and No. I456219 "burn-in test device" patent invention disclose the typical existing furnace structure and technology, i.e. disclose the furnace structure with heat dissipating airflow recycled from the side or upper part, except that the problem of high energy consumption and benefit of the IC testing pre-burning is still existed, which seriously affects the temperature control during the pre-burning test, further causes the over-voltage or over-current overload condition of the pre-burning test system, and starts the protection, and shuts down the test system, and seriously affects the IC testing benefit and productivity, or because the IC testing temperature rises instantly, the protection system is not too late to start, in addition, the aforesaid patent documents are all circulating temperature equalization in a large-scale enclosed space, which results in that the temperature of each test IC is difficult to control, the time for the temperature to be stable is longer, and each test IC in each layer in the furnace must have the same property and the same test temperature environment, so that the test scope and application of the test IC are greatly limited, and each test IC cannot achieve the well-controlled and precise test temperature condition because of being in the non-uniform heat dissipation airflow, so that the efficiency and precision of the IC burn-in test are greatly reduced.

In addition, as the invention of taiwan patent publication No. I664431, "test system", discloses an IC burn-in test system remotely controlled by remote network connection, although the test IC in each running furnace can be remotely controlled by network link to perform burn-in test operation, the test system does not have a feedback system to truly feedback the test environment temperature of burn-in and REAL-TIME (REAL TIME) of each test IC, so that a remote monitor cannot accurately control the burn-in simulation temperature environment of the test IC, and each test IC in each layer of the typical existing running furnace still has to have the same property and the same test temperature environment, so that the test and application of the test IC are greatly limited, and each test IC is in the heat dissipation air flow with non-uniform temperature, so that the test temperature condition for good and accurate control cannot be achieved, thereby greatly reducing the efficiency and precision of the IC burn-in test.

SUMMERY OF THE UTILITY MODEL

The main technical problem to be solved by the present invention is to overcome the above-mentioned defects existing in the prior art, and provide a feedback type burn-in device for burn-in furnace, so as to eliminate the problem of high energy consumption of the existing IC test burn-in system for burn-in furnace shown in the prior art or each patent, which is severe in benefit of the IC test burn-in, and seriously affect the temperature control during burn-in test, and further lead to the over-voltage or over-current of the burn-in test system, and to start the protection, so as to close the burn-in test system, and seriously affect the IC test benefit and productivity; the test IC is damaged due to the fact that the protection system cannot be started in time because the test temperature of the IC rises suddenly instantly, the temperature of each test IC is difficult to control due to the fact that the temperature of each test IC is equalized in a large-scale closed space in a circulating mode, the time that the temperature tends to be stable is long, each test IC in each layer in the furnace is required to be in the same property and the same test temperature environment, the test scope and application of the test IC are greatly limited, each test IC cannot achieve the test temperature condition which can be well controlled and accurate due to the fact that each test IC is in heat dissipation airflow with different temperature, the cost of the IC burn-in test is greatly increased, and the efficiency and accuracy of the IC burn-in test are greatly reduced.

The utility model provides a technical scheme that its technical problem adopted is:

a feedback type burn-in device of a running furnace comprises:

at least one gallop frame, which is accommodated in a gallop furnace, at least one transverse ventilation duct communicated with the gallop frame is formed above the gallop frame, and one end of the transverse ventilation duct is connected to at least one negative pressure area or heat exhausting fan of the gallop furnace;

at least one reaction plate accommodated in the reaction frame and connected with a linker connected with at least one test IC, and

at least one feedback pre-burning unit linked to the linker and the test IC, the feedback pre-burning unit has the functions of the environmental temperature of the test IC, the temperature sensing of the test IC and the automatic feedback control of the pre-burning temperature, the heat dissipation wind speed and the environmental temperature of the test IC, so as to discharge the heat dissipation hot gas of the test IC on the test IC and the test IC on the feedback pre-burning unit to the transverse ventilation duct and discharge the heat dissipation hot gas to the negative pressure area or the exhaust fan of the test IC through one end of the transverse ventilation duct.

Furthermore, an accommodating space is arranged inside the runner support for accommodating the runner plate.

Furthermore, at least one hole-shaped air deflector is arranged below the transverse air duct of the reaction frame to be communicated with the transverse air duct of the reaction frame, so that the heat dissipation hot air of the reaction plate and the test ICs on each feedback type pre-burning unit is exhausted into the transverse air duct through the hole-shaped air deflector.

Furthermore, the hole-shaped air deflector of the gallows frame is provided with a plurality of air guide holes so as to be communicated with the transverse air duct.

Furthermore, one end of the transverse air duct of the gallop is provided with at least one hot air outlet which is communicated with the negative pressure area of the gallop and the exhaust fan.

Further, the feedback burn-in unit includes:

at least one base for connecting the connector of the test IC bearing the running board, the bottom of the base is connected with the running board, and the periphery of the base is respectively provided with at least one air inlet channel for introducing air on the surface of the running board;

at least one upper cover, which is combined above the base and is provided with a frame opening, the frame opening corresponds to the top surface of the test IC on the test IC linker, the four peripheries of the frame opening of the upper cover are respectively provided with at least one air duct, and the air duct is communicated with the air inlet channel of the base so as to introduce the air on the surface of the corresponding plate;

at least one heat radiation fin group combined above the upper cover, the bottom surface of the heat radiation fin group is provided with a connecting part which is connected with the top surface of the test IC through the frame opening of the upper cover;

at least one heater combined inside the radiating fin group to provide the radiating fin group with the function of simulating and testing temperature rise;

at least one fan, which is combined above the radiating fin group to provide the radiating function of radiating hot air exhaust of the radiating fin group and exhaust the air on the surface of the corresponding plate introduced by the air inlet channel of the base and the air channel of the upper cover;

at least one sensor, the sensor is set up between top surface of the test IC and radiating fin group, in order to detect the test IC tests the temperature rise temperature with the sensor; and the number of the first and second groups,

and at least one external controller respectively connected with the sensor, the heater and the fan, for testing the temperature rise according to the test IC sensed and fed back by the sensor, and respectively controlling the heating temperature of the heater and the heat dissipation air speed of the fan.

Furthermore, at least one accommodating hole is arranged in the radiating fin group of the feedback type pre-burning unit for accommodating and fixing the heater.

Furthermore, the bottom of the fan of the feedback pre-burning unit is combined with at least one fan seat, at least one opening is arranged in the fan seat, the bottom surface of the fan is communicated with the top surface of the radiating fin group through the opening, and a plurality of embedded sheets are arranged on the periphery of the fan seat and are embedded outside the upper cover through the embedded sheets.

Furthermore, at least one opening is formed on each of four peripheral edges of the fan base of the feedback type burn-in unit, so that external cold air can be respectively provided to suck and cool the heat dissipation fins from the four peripheral edges through the air suction operation of the fan.

Further, the sensor of the feedback burn-in unit is a temperature sensor.

Further, an external controller of the feedback burn-in unit is disposed on the corresponding board.

Further, the external controller of the feedback burn-in unit is linked with at least one external sensor to sense the external environment temperature, feedback air flow temperature, air speed flowing through the top surface of the test IC, and air volume state, and feed back to the external controller.

The utility model has the advantages that the heater contained in the radiating fin group in the feedback type pre-burning unit directly heats the radiating fin group at the simulated pre-burning temperature, so that the testing IC can reach the pre-burning testing temperature quickly, the sensor senses the temperature of the IC top surface and feeds back the temperature to the external controller to control the temperature rise, the temperature reduction degree and the heating time of the heater, the fan wind speed and the running time of the heater, the external sensor connected with the external controller can sense the environment temperature, the feedback wind flow temperature, the wind speed flowing through the testing IC top surface and the wind quantity state to the external controller, the temperature rise, the temperature reduction degree and the heating time of the heater, the fan wind speed and the running time of the fan can be further accurately controlled, and simultaneously, the radiating hot air of the radiating fan above each testing IC is discharged (absorbed) by each wind guide hole of the porous wind guide plate arranged on the bottom surface of the transverse ventilation channel above the Ben corresponding plate, further reducing the mutual interference of heat sources among the tested ICs, and further forming a feedback type pre-burning device which can independently and automatically feedback control the pre-burning temperature of the tested ICs and save the pre-burning energy, and can rapidly and stably achieve the effect of the temperature equalization of the tested ICs, and the running frame for accommodating the running plate can be installed and accommodated in the running furnace in a modularized way, the hot air outlet at one end of the transverse ventilation duct of the running frame can also be conveniently and systematically communicated to the negative pressure area and the exhaust fan of the running furnace, so that the heat dissipation hot air can be systematically discharged into the running furnace and then intensively discharged through the running furnace, in addition, the base, the upper cover, the heat dissipation fin group, the heater, the fan and the sensor of each feedback type pre-burning unit in the feedback type pre-burning device can be independently integrated and installed on each tested IC, independent and respectively to each this test IC's the energy distribution of burn-in power consumption and temperature control demand do the efficiency and feed back temperature control of burn-in individually, the device is retrencied and is made the maintenance simple and easy, so for the above-mentioned IC device of burn-in of current or each patent antecedent case, the utility model discloses a burn-in test cost can reduce by a wide margin, and further promote the value and the economic benefits of industry utilization.

The utility model has the advantages that the problem of high energy consumption of the IC test burn-in system of the prior running furnace shown in the prior art or the prior patent documents is solved, the problem is greatly improved, the temperature control during the burn-in test is seriously influenced, the overvoltage or overcurrent of the burn-in test system is further caused, the protection is started lightly, the burn-in test system is closed, and the IC test benefit and the productivity are seriously influenced; the test IC is damaged due to the fact that the protection system cannot be started in time because the test temperature of the IC rises suddenly instantly, the temperature of each test IC is difficult to control due to the fact that the temperature of each test IC is equalized in a large-scale closed space in a circulating mode, the time that the temperature tends to be stable is long, each test IC in each layer in the furnace is required to be in the same property and the same test temperature environment, the test scope and application of the test IC are greatly limited, each test IC cannot achieve the test temperature condition which can be well controlled and accurate due to the fact that each test IC is in heat dissipation airflow with different temperature, the cost of the IC burn-in test is greatly increased, and the efficiency and accuracy of the IC burn-in test are greatly reduced.

Drawings

The present invention will be further explained with reference to the drawings and examples.

Fig. 1 is a perspective view of a reaction type burn-in apparatus of a running furnace according to a first embodiment of the present invention;

fig. 2 is a cross-sectional view of a feedback burn-in apparatus of a running furnace according to a first embodiment of the present invention;

fig. 3 is a perspective view of a feedback burn-in unit of a feedback burn-in apparatus of a running furnace according to a first embodiment of the present invention;

fig. 4 is a three-dimensional exploded structural view of a feedback burn-in unit of a feedback burn-in apparatus of a running furnace according to a first embodiment of the present invention;

fig. 5 is a front view of a feedback burn-in unit of a feedback burn-in apparatus of a running furnace according to a first embodiment of the present invention;

fig. 6 is a plan view of a feedback burn-in unit of a feedback burn-in apparatus of a running oven according to a first embodiment of the present invention;

FIG. 7 is a cross-sectional view A-A' of FIG. 6;

fig. 8 is a circuit diagram of a control block between a running board of a feedback burn-in apparatus of a running furnace and a sensor, a heater, a fan and an additional controller of the feedback burn-in unit according to a first embodiment of the present invention;

fig. 9 is a diagram of a second embodiment of the present invention;

fig. 10 is a diagram of a third embodiment of the present invention;

fig. 11 is a preferred application example of the feedback type burn-in apparatus of the present invention.

The reference numbers in the figures illustrate:

100 feedback type burn-in device 10 running stand

11 accommodating space 12 transverse ventilation duct

121A wind guide hole of 121-hole wind guide plate

122 hot air outlet 20 running plate

30 feedback type burn-in unit 31 base

311 air inlet channel 32 upper cover

321 frame opening 322 air channel

33 heat sink fin set 331 connection part

34 heater 35 fan

351 fan seat 352 tabling sheet

353 opening 36 sensor

37 external controller 371 external sensor

200 ben furnace 210 negative pressure zone

220 exhaust fan 300 test IC

310 linker 400 heat dissipation hot air

500 ambient temperature airflow 600 external cold air

700 feedback heat flow 351A opening

332 containing hole

Detailed Description

Referring to fig. 1, fig. 2, fig. 3, fig. 4, fig. 5, fig. 6, fig. 7 and fig. 8, in a first embodiment of the feedback type pre-burning device 100 for a running oven according to the present invention, the feedback type pre-burning device 100 includes at least one running frame 10, the running frame 10 is accommodated inside a running oven 200 (as shown by a dotted line in fig. 11), an accommodating space 11 is disposed inside the running frame 10, at least one transverse air duct 12 communicated with the accommodating space 11 is formed above the running frame 10, at least one hole-shaped air guiding plate 121 is disposed below the transverse air duct 12, the hole-shaped air guiding plate 121 is provided with a plurality of air guiding holes 121A to communicate with the transverse air duct 12, and one end of the transverse air duct 12 is provided with a hot air outlet 122.

At least one runner plate 20, the runner plate 20 is accommodated in the accommodating space 11 inside the runner frame 10, and the runner plate 20 is connected to a linker 310 connected to at least one test IC300, the runner plate 20 has a function of performing a burn-in test on the test IC300, and the type of the test IC300 is not limited, and may be an IC such as a micro processing unit, a graphic processing unit, a chipset, a web application, and the like.

The present invention is not limited to the type of the at least one feedback burn-in unit 30, and the present invention includes at least one base 31, an upper cover 32, a heat dissipating fin set 33, a heater 34, a fan 35, a sensor 36 and an external controller 37 (as shown in fig. 8), wherein the bottom surface of the base 31 is combined with the corresponding plate 20 and the linker 310, and the bottom surface of the base 31 is respectively provided with at least one air inlet 311 for introducing air on the surface of the corresponding plate 20.

The top cover 32 has a frame opening 321, the frame opening 321 corresponds to the top surface of the testing IC300 of the testing IC linker 310 on the base 31, and the peripheral edges of the frame opening 321 of the top cover 32 are respectively provided with at least one air channel 322, the air channel 322 is communicated with the air inlet 311 of the base 31 (as shown in fig. 5) to introduce the air on the surface of the corresponding board 20.

The heat dissipating fin set 33 is combined above the upper cover 32, a connecting portion 331 is disposed on the bottom surface of the heat dissipating fin set 33, the connecting portion 331 is connected to the top surface of the test IC300 through the frame opening 321 of the upper cover 32, and at least one accommodating hole 332 is disposed inside the heat dissipating fin set 33.

The heater 34 is accommodated in the accommodating hole 332 inside the heat dissipating fin set 33, so as to provide the function of simulating and testing temperature rise of the heat dissipating fin set 33.

The bottom of the fan 35 is combined with at least one fan seat 351, the fan seat 351 is provided with at least one opening 351A, the opening 351A provides the bottom surface of the fan 35 to communicate with the top surface of the heat dissipation fin set 33, the periphery of the fan seat 351 is provided with a plurality of embedded sheets 352, so that the embedded sheets 352 are embedded outside the upper cover 32, the fan 35 is combined above the heat dissipation fin set 33, the embedded sheets 352 provide the bottom surface of the fan 35 to communicate with the top surface of the heat dissipation fin set 33, so as to provide the heat dissipation system function of discharging heat dissipation hot air from the heat dissipation fin set 30, the periphery of the fan seat 351 is respectively provided with at least one opening 353, and external cold air can be respectively provided to be sucked into and cooled down the heat dissipation fin set 30 through the suction operation of the fan 35.

The sensor 36 is disposed between the top surface of the test IC300 and the heat sink 33, so that the temperature rise of the test IC300 can be sensed by the sensor 36.

The external controller 37 is not limited in the installation position, in the first embodiment of the present invention, the external controller 37 is installed outside the running plate 20, and the external controller 37 is connected to the sensor 36, the heater 34 and the fan 35 respectively, so as to test the temperature rise according to the test IC300 fed back by the sensor 36, and control the heating temperature of the heater 34 and the heat dissipation wind speed of the fan 35 respectively.

Referring to fig. 9, a second embodiment of the feedback burn-in apparatus 100 of the present invention is shown, in which an external controller 37 of the feedback burn-in unit 30 is disposed on the burn-in board 20, and the external controller 37 is respectively connected to the sensor 36, the heater 34 and the fan 35 to respectively control the heating temperature of the heater 34 and the heat dissipation wind speed of the fan 35 according to the test IC test temperature rise fed back by the sensor 36.

Referring to fig. 10, a third embodiment of the feedback burn-in apparatus 100 of the present invention is shown, in which the external controller 37 of the feedback burn-in unit 30 shown in fig. 8 is connected to at least one external sensor 371, so that the external sensor 371 is used to sense the external environment temperature, the feedback air flow temperature, the air speed and the air volume flowing through the top surface of the test IC300 of the feedback burn-in apparatus 100 of the burn-in furnace, and the external sensor 371 is used to feed back the state to the external controller 37, so that the external controller 37 can more precisely control the heating temperature of the heater 34 and the heat dissipation air speed of the fan 35.

Referring to fig. 11, it is shown that the reaction burn-in device 100 of the reaction furnace of the present invention is preferably applied to a reaction furnace, wherein the reaction frame 10 is disposed inside a reaction furnace 200, the bottom surface of the linker 310 of the test IC300 is connected to the reaction plate 20, when the fan 35 of each reaction burn-in unit 30 of the reaction furnace reaction burn-in device 100 of the present invention is controlled by the external controller 37 to start and suck the heat dissipation gas 400 of the test IC300 and the heat dissipation fin set 33 of the reaction burn-in unit 30 upwards, the ambient temperature air flow 500 with lower external temperature is introduced in front of the accommodating space 11 of the reaction frame 10 to be cooled by the fan 20, the air inlet 311 of the base 31, the air channel 322 of the top cover 32, and the external cold air 600 continuously supplied to the test IC300 and the heat dissipation fin set 33 through the opening 353 of the seat 351, the majority of the heat dissipation hot air 400 is exhausted into the transverse air duct 12 through the air guiding holes 121A of the perforated air guiding plate 121 of the fan rack 10 (as shown by the arrow in fig. 11), and is exhausted to a negative pressure region 210 or the exhaust fan 220 of the fan rack 200 through a hot air outlet 122 on one side of the transverse air duct 121A, and a small portion of the heat dissipation hot air 400 contacts the portion of the perforated air guiding plate 121 where the air guiding holes 121A are not formed, and forms at least one feedback heat flow 700 downward to be fed back to the test IC300 for accelerating to reach the burn-in temperature.

In addition, it is worth mentioning that each base 31, the upper cover 32, the heat dissipating fin set 33, the heater 34, the fan 35, the sensor 36 and the external controller 37 of the feedback pre-burning unit 30 of the feedback pre-burning device 100 of the running oven according to the present invention can be independently integrated and mounted on each test IC300 of the running board 20, and can independently and respectively perform efficient energy distribution and individual feedback pre-burning temperature control according to the pre-burning energy consumption and temperature control requirements of each test IC300, so that not only the pre-burning test performance of the test ICs 300 can be greatly improved, but also the types and kinds of each test IC300 of the running board 20 can be not necessarily the same, that is, each test IC300 on the same running board 20 can be subjected to simulation test in different temperature rise environments, and each test IC300 can be combined with the feedback device 100 of the running oven according to the present invention, by the accurate control effect of the automatic feedback pre-burning temperature of the feedback pre-burning device 100 of the reaction furnace, the pre-burning temperature of each test IC300 can accurately reach the pre-burning temperature control of the environment uniform temperature, the cost of the pre-burning test of the test IC300 can be greatly reduced, and the test efficiency, the industrial utilization value and the economic benefit of the test IC300 are greatly improved.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, and all simple modifications, equivalent changes and modifications made by the technical spirit of the present invention to the above embodiments still fall within the scope of the technical solution of the present invention.

Claims

1. A feedback type burn-in device of a running furnace is characterized by comprising:

at least one reaction plate accommodated in the reaction frame and connected with at least one linker for connecting with the test IC, and

2. The feedback burn-in apparatus of claim 1, wherein the inside of the frame is provided with a receiving space for receiving the running board.

3. The feedback burn-in apparatus of claim 1, wherein at least one hole-shaped air deflector is disposed below the transverse air duct of the reaction frame to communicate with the transverse air duct of the reaction frame, so that the heat dissipation heat of the reaction plate and the test ICs on each feedback burn-in unit can be exhausted to the transverse air duct through the hole-shaped air deflector.

4. The feedback burn-in apparatus of claim 3, wherein the perforated wind deflector of the reaction frame is provided with a plurality of wind guiding holes for communicating with the transverse air duct.

5. The feedback burn-in apparatus of claim 1, wherein one end of the transverse air duct of the reaction frame is provided with at least one hot air outlet for communicating with the negative pressure region of the reaction furnace and the exhaust fan.

6. The feedback burn-in apparatus of a running oven of claim 1, wherein the feedback burn-in unit comprises:

at least one fan, which is combined above the radiating fin group to provide the radiating system function of radiating hot air exhaust of the radiating fin group and exhaust the air on the surface of the corresponding plate introduced by the air inlet channel of the base and the air channel of the upper cover;

7. The feedback burn-in apparatus of claim 6, wherein the heat dissipating fin set of the feedback burn-in unit has at least one receiving hole for receiving and fixing the heater.

8. The feedback-type burn-in device of claim 6, wherein the bottom of the fan of the feedback-type burn-in unit is coupled to at least one fan seat, the fan seat has at least one opening therein, the opening provides a bottom surface of the fan to communicate with the top surface of the heat-dissipating fin set, and the periphery of the fan seat has a plurality of engaging pieces, so that the engaging pieces engage with the outside of the top cover.

9. The feedback burn-in apparatus of claim 6, wherein the fan base of the feedback burn-in unit has at least one opening formed on each of four peripheral edges thereof for providing external cooling air to be drawn in from the four peripheral edges through the fan suction operation to cool the heat dissipating fins.

10. The feedback burn-in apparatus of the running oven of claim 6, wherein the sensor of the feedback burn-in unit is a temperature sensor.

11. The feedback burn-in apparatus of claim 6, wherein an external controller of the feedback burn-in unit is disposed on the running board.

12. The feedback burn-in apparatus of the running oven of claim 6, wherein the external controller of the feedback burn-in unit is linked to at least one external sensor for sensing external ambient temperature, feedback airflow temperature, wind speed and wind volume status flowing through the top surface of the test IC, and feeding back to the external controller.