CN211856811U - Feedback type pre-burning device of the blast furnace - Google Patents
Feedback type pre-burning device of the blast furnace Download PDFInfo
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Abstract
Description
技术领域technical field
本实用新型是关于一种奔应炉的反馈式预烧装置,尤指一种应用于奔应(burnin)炉的测试IC预烧,以及,具有各别测试IC的不同温升条件的自动反馈控制与散热气流控制排出的反馈式预烧装置。The utility model relates to a feedback type pre-burning device for a burnin furnace, in particular to a test IC pre-burning device applied to a burnin furnace, and an automatic feedback with different temperature rise conditions of the respective test ICs Feedback burn-in device for control and discharge of cooling air flow control.
背景技术Background technique
现有微处理单元(CPU)、图形处理单元(GPU)、芯片组(Chipset)与网通应用等IC(集成电路)在于出厂前均需经由如现有奔应炉的预烧测试过程,借以测试该IC的电子特性及诸如温升的工作环境特性,但由于制程的微缩与IC设计的日趋复杂化,如微处理单元、图形处理单元、芯片组与网通应用等IC,于IC测试预烧时其高耗能问题益形剧烈,严重影响预烧测试时的温度控制精确度,进而导致预烧测试系统的过电压或过电流的过载情形发生,轻则启动保护,让预烧测试系统关闭(shut down),并严重影响IC测试效益及产能,重则因测试IC的测试温度瞬间骤升,让保护系统来不及启动,而导致该测试IC熔毁。ICs (integrated circuits) such as existing microprocessor units (CPUs), graphics processing units (GPUs), chip sets (Chipset) and Netcom applications all need to go through the burn-in test process such as the existing ovens before leaving the factory, so as to test The electronic characteristics of the IC and the characteristics of the working environment such as temperature rise, but due to the shrinking of the process and the increasing complexity of IC design, such as ICs such as micro processing units, graphics processing units, chipsets and Netcom applications, during the IC test burn-in The problem of high energy consumption is severe, which seriously affects the temperature control accuracy during the burn-in test, which in turn leads to the occurrence of over-voltage or over-current overload of the burn-in test system. shut down), and seriously affect the test efficiency and productivity of the IC, especially because the test temperature of the test IC suddenly rises, making the protection system too late to start, and the test IC melts down.
另外,现有奔应炉均温解决方案,多为以散热气流风速直吹该测试IC或者由左或由右侧吹向测试IC,然而不论是向下直吹、或左或右侧直吹或向上直吸,因皆是以大型密闭空间内(Chamber)循环均温,导致各测试IC温度较难控制,温度趋于稳定的时间也较久,并且,为了达到在该上述现有奔应炉中每一层测试IC的测试均温控制,必需限制该奔应炉在同一层中的每一个测试IC的型式与测试条件必需完全相同,以便统一控制测试温度条件,不但使该测试IC的测试范畴及应用受到极大限制,并且,每个测试IC也因处于不均温的散热气流下,而无法达到予以控制良好及精准的测试温度条件,而使该IC预烧测试的效能及精准度因而大幅针降低,实乃目前IC测试预烧所极待解决的课题。In addition, most of the existing solutions for temperature equalization in the furnace are to blow the test IC directly at the cooling airflow speed, or blow the test IC from the left or the right side, but whether it is blowing directly down, or blowing directly from the left or right side Or upward and direct suction, because the temperature is circulated in a large closed space (Chamber), which makes it difficult to control the temperature of each test IC, and the time for the temperature to stabilize is also longer. The test temperature control of each layer of test ICs in the furnace must limit the type and test conditions of each test IC in the same layer of the furnace to be exactly the same, so as to control the test temperature conditions uniformly, not only to make the test IC The scope and application of the test are greatly limited, and each test IC is also under the heat dissipation airflow of uneven temperature, which cannot achieve well-controlled and accurate test temperature conditions, which makes the IC burn-in test performance and accuracy. As a result, the speed is greatly reduced, which is a problem that needs to be solved in the current IC test burn-in.
此外,在相关的先前专利技术文献方面,中国台湾专利公报第I659484号「具导风机构之电子组件预烧设备」发明专利案、第I639844号「电子组件预烧测试装置及其应用之预烧炉」发明专利案及第I456219号「烧机测试装置」发明专利案,则皆揭示如上述典型现有奔应炉结构及技术,即揭示散热气流由侧面或上方循环利用的奔应炉结构,除了仍存在上述于IC测试预烧时其高耗能问题益形剧烈,严重影响预烧测试时的温度控制,进而导致预烧测试系统的过电压、或过电流的过载情况发生,启动保护,让预烧测试系统关闭,并严重影响IC测试效益及产能,或因IC测试温度瞬间骤升,让保护系统来不及启动,而导致测试IC熔毁的问题及缺点外,并且,上述专利前案,皆是以大型密闭空间内循环均温,导致各测试IC温度较难控制,温度趋于稳定的时间也较久,并且,该奔应炉中的各层每个测试IC亦必需是相同性质及同样的测试温度环境,使该测试IC的测试范畴及应用受到极大限制,以及,每个测试IC也因处于不均温的散热气流下,而无法达到予以控制良好及精准的测试温度条件,而使该IC预烧测试的效能及精准度因而大幅针降低。In addition, in terms of related prior patent technical documents, the Chinese Taiwan Patent Publication No. I659484 "Electronic component burn-in device with air guide mechanism" invention patent case, No. I639844 "Electronic component burn-in test device and its application of the burn-in Furnace" invention patent case and No. I456219 "burn-in test device" invention patent case both disclose the structure and technology of the typical existing furnace as above, that is, disclose the structure of the furnace in which the cooling air is recycled from the side or the top, In addition to the above-mentioned high energy consumption problem during the burn-in test of the IC test, the problem of high energy consumption is more severe, which seriously affects the temperature control during the burn-in test, which in turn leads to the occurrence of over-voltage or over-current overload of the burn-in test system. Shutting down the burn-in test system will seriously affect the IC test efficiency and productivity, or the protection system will not be able to start in time due to the sudden rise of IC test temperature, which will lead to the problems and shortcomings of the test IC meltdown. Moreover, the above-mentioned patent case, The temperature of each test IC is difficult to control, and the temperature tends to be stable for a long time. Moreover, each test IC of each layer in the furnace must have the same properties and characteristics. The same test temperature environment greatly limits the test scope and application of the test IC, and each test IC is also under the heat dissipation airflow of uneven temperature, so it cannot achieve well-controlled and accurate test temperature conditions. As a result, the performance and accuracy of the IC burn-in test are greatly reduced.
除此之外,再如中国台湾专利公报第I664431号「测试系统」发明专利案,则揭示一种以远程网络联机遥控的IC预烧测试系统,虽可就每一个奔应炉中的测试IC加以用网络链接来遥控进行预烧测试操作,但该测试系统中并没有回馈系统以如实回馈各个测试IC的预烧及实时(REAL TIME)的测试环境温度,而无法让远程监控者,可以加以精确控制该测试IC的预烧仿真温度环境,而仍有上述典型现有奔应炉中的各层每个测试IC亦必需是相同性质及同样的测试温度环境,使该测试IC的测试范畴及应用受到极大限制,以及,每个测试IC也因处于不均温的散热气流下,而无法达到予以控制良好及精准的测试温度条件,而使该IC预烧测试的效能及精准度因而大幅针降低的问题及缺点。In addition, another example is the Chinese Taiwan Patent Gazette No. I664431 "Testing System" Invention Patent, which discloses an IC burn-in test system with remote network connection and remote control, although it can test ICs in each furnace In addition, the network link is used to remotely perform the burn-in test operation, but there is no feedback system in the test system to truthfully feedback the burn-in and real-time (REAL TIME) test environment temperature of each test IC, so that the remote monitor cannot be used. Precisely control the burn-in simulation temperature environment of the test IC, and each layer in the above-mentioned typical conventional furnace must also be of the same nature and the same test temperature environment, so that the test range of the test IC and the The application is greatly limited, and each test IC is also under the uneven temperature cooling airflow, which cannot achieve well-controlled and accurate test temperature conditions, so that the performance and accuracy of the IC burn-in test are greatly improved. Problems and disadvantages of needle lowering.
实用新型内容Utility model content
本实用新型所要解决的主要技术问题在于,克服现有技术存在的上述缺陷,而提供一种奔应炉的反馈式预烧装置,以消除上述现有或各专利前案所示的现有奔应炉的IC测试预烧系统所存在的于IC测试预烧时其高耗能问题益形剧烈,严重影响预烧测试时的温度控制,进而导致预烧测试系统的过电压或过电流,轻则启动保护,让预烧测试系统关闭,并严重影响IC测试效益及产能;重则因IC测试温度瞬间骤升,让保护系统来不及启动,而导致测试IC熔毁,并且以大型密闭空间内循环均温,导致各测试IC温度较难控制,温度趋于稳定的时间也较久,以及,该奔应炉中的各层每个测试IC亦必需是相同性质及同样的测试温度环境,使该测试IC的测试范畴及应用受到极大限制,并使每个测试IC也因处于不均温的散热气流下,而无法达到予以控制良好及精准的测试温度条件,而使该IC预烧测试的成本因而大幅增加,以及IC预烧测试的效能及精准度因而大幅针降低的问题。The main technical problem to be solved by the present utility model is to overcome the above-mentioned defects in the prior art, and provide a feedback type pre-burning device for a charging furnace, so as to eliminate the above-mentioned existing or the existing problems shown in the previous cases of each patent. The problem of high energy consumption in the IC test burn-in system of the furnace is severe, which seriously affects the temperature control during the burn-in test, which in turn leads to over-voltage or over-current of the burn-in test system. Then the protection is activated, the burn-in test system is shut down, and the IC test efficiency and productivity are seriously affected; in severe cases, the IC test temperature suddenly rises, making the protection system too late to start, resulting in the test IC being melted down and circulating in a large confined space. The uniform temperature makes it difficult to control the temperature of each test IC, and it takes a long time for the temperature to stabilize. Moreover, each test IC of each layer in the furnace must also have the same properties and the same test temperature environment, so that the The test scope and application of test ICs are greatly limited, and each test IC is also under the heat dissipation airflow of uneven temperature, so it cannot achieve well-controlled and accurate test temperature conditions, which makes the IC burn-in test. As a result, the cost is greatly increased, and the performance and accuracy of the IC burn-in test are greatly reduced.
本实用新型解决其技术问题所采用的技术方案是:The technical scheme adopted by the utility model to solve its technical problems is:
一种奔应炉的反馈式预烧装置,包括:A feedback type pre-burning device for a blast furnace, comprising:
至少一奔应架,该奔应架纳置于一奔应炉内,该奔应架的上方形成至少一与奔应架内部连通的横向通风道,横向通风道一端连结至该奔应炉的至少一负压区或排热风扇;At least one response frame, which is accommodated in a response furnace, at least one horizontal ventilation channel is formed above the response frame and communicated with the interior of the response frame, and one end of the horizontal ventilation channel is connected to the furnace. At least one negative pressure zone or heat exhaust fan;
至少一奔应板,该奔应板纳置于该奔应架内部,且该奔应板供至少一测试IC所连结的链接器连结,以及at least one response board, which is accommodated inside the response frame, and which is connected to the linker to which at least one test IC is connected, and
至少一反馈式预烧单元,链接于该测试IC所连结的链接器与奔应板上,该反馈式预烧单元具有该奔应板环境温度、测试IC温度感测及测试IC的预烧温度、散热风速及环境温度的自动反馈控制的功能,借以将该奔应板及各反馈式预烧单元上的测试IC的散热热气排出至该横向通风道,并透过该横向通风道一端向该奔应炉的负压区或排风扇排出。At least one feedback burn-in unit is connected to the link connected to the test IC and the response board, and the feedback burn-in unit has the ambient temperature of the response board, the temperature sensing of the test IC and the burn-in temperature of the test IC , The function of automatic feedback control of heat dissipation wind speed and ambient temperature, so as to discharge the heat dissipation heat of the test IC on the response board and each feedback burn-in unit to the horizontal air channel, and pass the one end of the horizontal air channel to the horizontal air channel. The negative pressure area of the furnace or the exhaust fan is discharged.
进一步地,该奔应架的内部设有一容纳空间,以供纳置该奔应板。Further, an accommodating space is provided inside the response frame for accommodating the response board.
进一步地,该奔应架的横向通风道下方设有至少一孔状导风板,以连通该奔应架的横向通风道,以使该奔应板及各反馈式预烧单元上的测试IC的散热热气透过该孔状导风板排出至该横向通风道中。Further, at least one hole-shaped air deflector is arranged below the transverse ventilation channel of the response frame to communicate with the transverse ventilation channel of the response frame, so that the response board and the test IC on each feedback burn-in unit are The heat dissipation hot air is discharged into the lateral ventilation channel through the hole-shaped air deflector.
进一步地,该奔应架的孔状导风板设有数个导风孔,以连通该横向通风道。Further, the hole-shaped air guide plate of the responsive frame is provided with several air guide holes to communicate with the transverse air passage.
进一步地,该奔应架的横向通风道一端设有至少一热风出口,以连通至该奔应炉的负压区及排风扇。Further, at least one hot air outlet is provided at one end of the transverse ventilation channel of the response frame to communicate with the negative pressure area of the response furnace and the exhaust fan.
进一步地,该反馈式预烧单元包括:Further, the feedback burn-in unit includes:
至少一底座,供连结承载该奔应板的测试IC的连接器,该底座底面并与该奔应板连结,该底座四周分别设有至少一进气道,可供引入该奔应板表面的空气;At least one base is used to connect the connector of the test IC carrying the response board, the bottom surface of the base is connected with the response board, and at least one air inlet is respectively provided around the base, which can be introduced into the surface of the response board. Air;
至少一上盖,结合于该底座的上方,该上盖设有一框口,该框口对应该测试IC链接器上的测试IC顶面,该上盖的框口四周缘分别设有至少一通气道,该通气道连通该底座的进气道,以引入该奔应板表面的空气;At least one upper cover is combined with the top of the base, the upper cover is provided with a frame opening, the frame opening corresponds to the top surface of the test IC on the test IC connector, and the peripheral edges of the frame opening of the upper cover are respectively provided with at least one vent a channel, the air channel is communicated with the air intake channel of the base to introduce the air on the surface of the response plate;
至少一散热鳍片组,结合于该上盖的上方,该散热鳍片组底面设有一连结部,该连结部透过该上盖的框口连结于该测试IC顶面;at least one heat dissipation fin set is combined on the upper part of the upper cover, a connecting part is provided on the bottom surface of the heat dissipation fin set, and the connecting part is connected to the top surface of the test IC through the frame opening of the upper cover;
至少一加热器,结合于该散热鳍片组内部,以提供该散热鳍片组仿真测试温升温度的功能;At least one heater is combined inside the heat dissipation fin group to provide the function of the heat dissipation fin group to simulate and test the temperature rise;
至少一风扇,结合于该散热鳍片组上方,以提供该散热鳍片组散热热气排出的散热功能,并将经由该底座的进气道与上盖的通气道引入的奔应板表面的空气一并排出;At least one fan is combined above the heat dissipation fin set to provide the heat dissipation function of the heat dissipation fin set to discharge the heat dissipation heat, and to respond to the air on the surface of the plate introduced through the air inlet channel of the base and the air channel of the upper cover discharged together;
至少一传感器,该传感器设于该测试IC顶面及散热鳍片组之间,以借该传感器感测该测试IC测试温升温度;以及,at least one sensor, the sensor is arranged between the top surface of the test IC and the heat dissipation fin group, so as to sense the test temperature rise temperature of the test IC by the sensor; and,
至少一外部控制器,分别连结该传感器、加热器及风扇,以根据该传感器所感测反馈的测试IC测试温升温度,并分别控制该加热器的加热温度及风扇的散热风速。At least one external controller is connected to the sensor, the heater and the fan respectively, to test the temperature rise according to the test IC sensed and fed back by the sensor, and to control the heating temperature of the heater and the cooling wind speed of the fan respectively.
进一步地,该反馈式预烧单元的散热鳍片组中设有至少一容置孔,以供该加热器纳置固定。Further, at least one accommodating hole is provided in the heat dissipation fin group of the feedback type burn-in unit for accommodating and fixing the heater.
进一步地,该反馈式预烧单元的风扇底部结合至少一风扇座,该风扇座中设有至少一开口,借该开口提供风扇底面与该散热鳍片组顶面连通,该风扇座周缘设有数个嵌合片,以借该嵌合片向下嵌接于该上盖外部。Further, the bottom of the fan of the feedback burn-in unit is combined with at least one fan seat, the fan seat is provided with at least one opening, and the bottom surface of the fan is provided in communication with the top surface of the heat dissipation fin group through the opening, and the periphery of the fan seat is provided with several numbers. an inserting piece, so that the inserting piece is downwardly fitted to the outside of the upper cover.
进一步地,该反馈式预烧单元的风扇座四周缘各形成有至少一开孔,可分别提供外部冷空气由四周缘经该风扇吸气运转吸入冷却该散热鳍片。Further, at least one opening is formed on the peripheral edge of the fan base of the feedback type burn-in unit, respectively, which can respectively provide external cold air from the peripheral edge to inhale and cool the heat dissipation fins through the fan inhalation operation.
进一步地,该反馈式预烧单元的传感器为一温度传感器。Further, the sensor of the feedback burn-in unit is a temperature sensor.
进一步地,该反馈式预烧单元的外部控制器设置于该奔应板上。Further, the external controller of the feedback burn-in unit is arranged on the response board.
进一步地,该反馈式预烧单元的外部控制器链接至少一外部传感器,以感测外部环境温度、反馈气流温度、流经该测试IC顶面的风速、风量状态,反馈给该外部控制器。Further, the external controller of the feedback burn-in unit is linked with at least one external sensor to sense external ambient temperature, feedback airflow temperature, wind speed and air volume state flowing through the top surface of the test IC, and feed back to the external controller.
本实用新型的功效是,借由该反馈式预烧单元中纳置于该散热鳍片组中的加热器直接对该散热鳍片组进行仿真预烧温度加热,而得以使测试IC快速到达预烧测试温度,借由该传感器感测IC顶面温度反馈给该外部控制器,控制该加热器升、降温度及其加热时间、风扇风速及其运转时间,并可由该如外部控制所连结的外部传感器感测环境温度、反馈风流温度、流经测试IC顶面的风速、风量状态反馈给该外部控制器,而更加进一步精确控制该加热器升、降温度及其加热时间、风扇风速及其运转时间,同时亦借由该设置于该奔应板所属的奔应架上方的横向通风道底面的孔状导风板的各导风孔将各测试IC上方的散热风扇的散热热气排(吸)出,进而降低各测试IC间热源互相交互干扰,进而形成一可单独个体自动反馈式控制测试IC预烧温度均温及节省预烧能源的反馈式预烧装置,并可以快速及稳定达到各测试IC均温的功效,并且,该纳置奔应板的奔应架可以用模块化方式安装纳置于该奔应炉内部,该奔应架的横向通风道一端的热风出口,也可以便于系统化连通至该奔应炉的负压区及排风扇,使该散热热气可以系统化排入该奔应炉中,再经由奔应炉集中排出,另外,值得一提之处,即为借由本实用新型的反馈式预烧装置中的各反馈式预烧单元的底座、上盖、散热鳍片组、加热器、风扇、传感器均可独立整合及装置于各测试IC的上,独立及分别针对各该测试IC的预烧耗能及温度控制需求做有效率的能源分配与个别反馈预烧温度控制,装置精简及制造维护简易,故相对于上述现有或各专利前案的IC预烧装置,本实用新型的预烧测试成本可大幅降低,并进一步提升本实用新型的产业利用的价值及经济效益。The effect of the present invention is that the heat dissipation fin group is directly heated by the heater placed in the heat dissipation fin group in the feedback type burn-in unit, so that the test IC can quickly reach the pre-heating temperature. The temperature of the burn-in test is fed back to the external controller through the sensor sensing IC top surface temperature to control the heating and cooling temperature of the heater, its heating time, the fan speed and its running time. The external sensor senses the ambient temperature, feeds back the air flow temperature, and feeds back the air speed and air volume status through the top surface of the test IC to the external controller, which further precisely controls the heater's rising and falling temperature and its heating time, fan speed and its temperature. At the same time, through the air guide holes of the perforated air guide plate on the bottom surface of the lateral air channel above the response frame to which the response board belongs, the heat dissipation heat of the cooling fan above each test IC is exhausted (suction). ) out, thereby reducing the mutual interference of heat sources among the test ICs, and forming a feedback burn-in device that can automatically control the test IC burn-in temperature and average temperature and save burn-in energy, and can quickly and stably achieve each Test the effect of IC temperature uniformity, and the cooling rack containing the cooling board can be installed in the cooling furnace in a modular way. It is systematically connected to the negative pressure area and exhaust fan of the furnace, so that the heat dissipation heat can be systematically discharged into the furnace, and then discharged centrally through the furnace. The base, upper cover, heat dissipation fin group, heater, fan and sensor of each feedback burn-in unit in the feedback burn-in device of the utility model can be independently integrated and installed on each test IC, independently and separately for The burn-in energy consumption and temperature control requirements of the test ICs are efficiently distributed and individually feedback burn-in temperature control. The device is simplified and the manufacturing and maintenance are simple. Therefore, compared with the IC burn-in devices of the above-mentioned existing or previous patents Therefore, the cost of the burn-in test of the present invention can be greatly reduced, and the value and economic benefit of the industrial utilization of the present invention can be further improved.
本实用新型的有益效果是,以消除上述现有或各专利前案所示的现有奔应炉的IC测试预烧系统所存在的于IC测试预烧时其高耗能问题益形剧烈,严重影响预烧测试时的温度控制,进而导致预烧测试系统的过电压或过电流,轻则启动保护,让预烧测试系统关闭,并严重影响IC测试效益及产能;重则因IC测试温度瞬间骤升,让保护系统来不及启动,而导致测试IC熔毁,并且以大型密闭空间内循环均温,导致各测试IC温度较难控制,温度趋于稳定的时间也较久,以及,该奔应炉中的各层每个测试IC亦必需是相同性质及同样的测试温度环境,使该测试IC的测试范畴及应用受到极大限制,并使每个测试IC也因处于不均温的散热气流下,而无法达到予以控制良好及精准的测试温度条件,而使该IC预烧测试的成本因而大幅增加,以及IC预烧测试的效能及精准度因而大幅针降低的问题。The beneficial effect of the present invention is to eliminate the problem of high energy consumption during the IC test pre-burn that exists in the existing IC test burn-in system of the above-mentioned existing or the previous patent cases. Seriously affects the temperature control during burn-in test, which in turn leads to over-voltage or over-current of the burn-in test system. In light cases, protection is activated, which shuts down the burn-in test system and seriously affects IC test efficiency and productivity. The sudden rise makes the protection system too late to start, which leads to the meltdown of the test IC, and the temperature is circulated in a large confined space, making it difficult to control the temperature of each test IC, and the time for the temperature to stabilize is longer. Each layer of the test IC in the furnace must also be of the same nature and the same test temperature environment, which greatly limits the test scope and application of the test IC, and causes each test IC to dissipate heat due to uneven temperature. Under the air flow, well-controlled and accurate test temperature conditions cannot be achieved, so the cost of the IC burn-in test is greatly increased, and the performance and accuracy of the IC burn-in test are greatly reduced.
附图说明Description of drawings
下面结合附图和实施例对本实用新型进一步说明。The present utility model will be further described below in conjunction with the accompanying drawings and embodiments.
图1为本实用新型的第一实施例的奔应炉的反馈式预烧装置的立体外观结构图;Fig. 1 is the three-dimensional appearance structure diagram of the feedback type pre-burning device of the reaction furnace according to the first embodiment of the present utility model;
图2为本实用新型的第一实施例的奔应炉的反馈式预烧装置的剖面图;2 is a cross-sectional view of the feedback pre-burning device of the furnace according to the first embodiment of the present utility model;
图3为本实用新型的第一实施例的奔应炉的反馈式预烧装置的反馈式预烧单元的立体外观结构图;3 is a three-dimensional appearance structural diagram of a feedback type pre-burning unit of the feedback type pre-burning device of the reaction furnace according to the first embodiment of the present invention;
图4为本实用新型的第一实施例的奔应炉的反馈式预烧装置的反馈式预烧单元的立体分解结构图;4 is a three-dimensional exploded structural diagram of a feedback type pre-burning unit of the feedback type pre-burning device of the reaction furnace according to the first embodiment of the present utility model;
图5为本实用新型的第一实施例的奔应炉的反馈式预烧装置的反馈式预烧单元的前视图;Fig. 5 is the front view of the feedback type pre-burning unit of the feedback type pre-burning device of the reaction furnace according to the first embodiment of the present utility model;
图6为本实用新型的第一实施例的奔应炉的反馈式预烧装置的反馈式预烧单元的俯视图;6 is a top view of a feedback type pre-burning unit of the feedback type pre-burning device of the reaction furnace according to the first embodiment of the present utility model;
图7为图6的A-A’的剖视图;Fig. 7 is the sectional view of A-A' of Fig. 6;
图8为本实用新型的第一实施例的奔应炉的反馈式预烧装置的奔应板与该反馈式预烧单元的传感器、加热器、风扇及外加控制器之间的控制方块电路图;8 is a control block circuit diagram between the response board of the feedback type burn-in device of the response furnace and the sensor, heater, fan and external controller of the feedback type burn-in unit according to the first embodiment of the present invention;
图9为本实用新型的第二实施例图;Fig. 9 is the second embodiment diagram of the present utility model;
图10为本实用新型的第三实施例图;Fig. 10 is the third embodiment diagram of the present utility model;
图11为本实用新型的奔应炉的反馈式预烧装置的较佳应用例。FIG. 11 is a preferred application example of the feedback type pre-burning device of the blast furnace of the present invention.
图中标号说明:Description of the labels in the figure:
100 反馈式预烧装置 10 奔应架100 Feedback burn-in
11 容纳空间 12 横向通风道11 Accommodating space 12 Lateral ventilation ducts
121 孔状导风板 121A 导风孔121
122 热风出口 20 奔应板122
30 反馈式预烧单元 31 底座30 Feedback burn-in
311 进气道 32 上盖
321 框口 322 通气道321
33 散热鳍片组 331 连结部33 Heat dissipation fin set 331 Connection part
34 加热器 35 风扇34
351 风扇座 352 嵌合片351
353 开孔 36 传感器353
37 外部控制器 371 外部传感器37
200 奔应炉 210 负压区200
220 排风扇 300 测试IC220
310 链接器 400 散热热气310
500 环境温度气流 600 外部冷空气500
700 反馈热流 351A 开口700
332 容置孔332 accommodating hole
具体实施方式Detailed ways
请参阅如图1、图2、图3、图4、图5、图6、图7及图8所示,本实用新型的奔应炉的反馈式预烧装置100第一实施例,该反馈式预烧装置100包括至少一奔应架10,该奔应架10纳置于一奔应炉200内部(如图11中虚线部分所示),该奔应架10内部设有一容纳空间11,并且,该奔应架10内部的上方形成至少一与该容纳空间11连通的横向通风道12,该横向通风道12下方设有至少一孔状导风板121,该孔状导风板121设有数个导风孔121A,以连通该横向通风道12,并且,该横向通风道12一端设有一热风出口122。Please refer to FIG. 1 , FIG. 2 , FIG. 3 , FIG. 4 , FIG. 5 , FIG. 6 , FIG. 7 and FIG. 8 . The
至少一奔应板20,该奔应板20纳置于该奔应架10内部的容纳空间11,且该奔应板20供至少一测试IC 300所连结的链接器310连结,该奔应板20具有对该测试IC 300进行预烧测试的功能,上述的测试IC 300的型式不限,可以为如微处理单元、图形处理单元、芯片组与网通应用等IC。At least one
至少一反馈式预烧单元30,其型式不限,在本实用新型中以包含至少一底座31、上盖32、散热鳍片组33、加热器34、风扇35、传感器36及外部控制器37(如图8所示)为例,其中,该底座31底面结合于该奔应板20与该链接器310上,该底座31底面四周缘分别设有至少一进气道311,可供引入该奔应板20表面的空气。At least one feedback burn-in
该上盖32设有一框口321,该框口321对应该底座31上的测试IC链接器310的测试IC 300顶面,并且,该上盖32的框口321四周缘分别设有至少一通气道322,该通气道322连通该底座31的进气道311(如图5所示),以引入该奔应板20表面的空气。The
该散热鳍片组33结合于该上盖32的上方,该散热鳍片组33底面设有一连结部331,该连结部331透过该上盖32的框口321连结于该测试IC 300的顶面,并且,于该散热鳍片组33内部设有至少一容置孔332。The heat dissipation fin set 33 is combined on the top of the
该加热器34结合纳置于该散热鳍片组33内部的容置孔332中,以提供该散热鳍片组33仿真测试温升温度的功能。The
该风扇35底部结合至少一风扇座351,该风扇座351中设有至少一开口351A,借该开口351A提供风扇35底面与该散热鳍片组33顶面连通,该风扇座351周缘设有数个嵌合片352,以借该嵌合片352向下嵌接于该上盖32外部,使该风扇35结合于该散热鳍片组33上方,并借该嵌合片352提供该风扇35底面与该散热鳍片组33顶面连通,以提供该散热鳍片组30散热热气排出的散热系统功能,该风扇座351四周缘各形成有至少一开孔353,可分别提供外部冷空气由四周缘经该风扇35吸气运转吸入冷却该散热鳍片30。The bottom of the
该传感器36设于该测试IC 300顶面及散热鳍片组33之间,以借该传感器36感测该测试IC 300测试温升温度。The
该外部控制器37,其设置位置不限,在本实用新型的第一实施例中,以该外部控制器37设置于该奔应板20外为例,并且,该外部控制器37分别连结该传感器36、加热器34及风扇35,以根据该传感器36所感测反馈的测试IC 300测试温升温度,并分别控制该加热器34的加热温度及风扇35的散热风速。The location of the
请再参阅图9所示,为本实用新型奔应炉的反馈式预烧装置100的第二实施例,其中,显示该反馈式预烧单元30的外部控制器37,设置于该奔应板20上,并且,该外部控制器37分别连结该传感器36、加热器34及风扇35,以根据该传感器36所感测反馈的测试IC测试温升温度,并分别控制该加热器34的加热温度及风扇35的散热风速。Please refer to FIG. 9 again, which is the second embodiment of the feedback
请再参阅图10所示,为本实用新型奔应炉的反馈式预烧装置100的第三实施例,显示如图8中所示的反馈式预烧单元30的外部控制器37连结至少一外部传感器371,以借由该外部传感器371感测该奔应炉的反馈式预烧装置100外部环境温度、反馈气流温度、流经该测试IC300顶面的风速、风量状态,并由该外部传感器371反馈提供给该外部控制器37,使该外部控制器37可更精确控制该加热器34的加热温度及风扇35的散热风速。Please refer to FIG. 10 again, which is the third embodiment of the feedback
请再参阅图11所示,为本实用新型的奔应炉的反馈式预烧装置100的较佳应用例,其中,显示该奔应架10设置于一奔应炉200内部,测试IC 300的链接器310底面连结于该奔应板20上,当本实用新型的奔应炉的反馈式预烧装置100中的各反馈式预烧单元30的风扇35经由上述的外部控制器37控制启动而进行向上吸排出该测试IC 300及该反馈式预烧单元30的散热鳍片组33的散热热气400时,该奔应架10的容纳空间11前方将引入外界温度较低的环境温度气流500分别经由该奔应板20表面、底座31的进气道311、上盖32的通气道322,以及该外部冷空气600经风扇座351的开孔353不断供给该测试IC 300及散热鳍片组33进行降温控制,而该大部分的散热热气400向上经由该奔应架10的孔状导风板121的导风孔121A排入该横向通风道12中(如图11中箭头方向所示),并经由横向通风道121A的一侧面的一热风出口122排出至该奔应炉200的一负压区210或排风扇220排出,而一小部分的散热热气400在碰触该孔状导风板121未设导风孔121A部位时,向下形成至少一反馈热流700,以反馈提供给该测试IC 300作为加速达到预烧温度用。Please refer to FIG. 11 again, which is a preferred application example of the feedback
除此之外,值得一提的是,上述本实用新型的奔应炉的反馈式预烧装置100中的反馈式预烧单元30的各底座31、上盖32、散热鳍片组33、加热器34、风扇35、传感器36及外部控制器37均可独立整合及装置于该奔应板20的各测试IC 300上,独立及分别针对各该测试IC300的预烧耗能及温度控制需求做有效率的能源分配与个别反馈预烧温度控制,除可大幅提升该测试IC 300预烧测试的效能外,更可使该奔应板20的各测试IC 300的型式、种类可以不一定相同,也就是可以在同一奔应板20上的各个测试IC 300,予以作各别不同温升温度环境的仿真测试,并可借由各测试IC 300结合本实用新型的奔应炉的反馈式预烧装置100,由该奔应炉的反馈式预烧装置100的自动反馈预烧温度的精准控制功效,使各测试IC300的预烧温度均可精准达到环境均温的预烧温度控制,可以大幅降低该测试IC 300预烧测试的成本,并大幅提升其测试效能与产业利用价值及经济效益。In addition, it is worth mentioning that the
以上所述,仅是本实用新型的较佳实施例而已,并非对本实用新型作任何形式上的限制,凡是依据本实用新型的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均仍属于本实用新型技术方案的范围内。The above are only preferred embodiments of the present invention, and are not intended to limit the present invention in any form. Any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical essence of the present invention, All still belong to the scope of the technical solution of the present invention.
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