WO2023155232A1 - 显示面板及其制备方法和显示装置 - Google Patents

显示面板及其制备方法和显示装置 Download PDF

Info

Publication number
WO2023155232A1
WO2023155232A1 PCT/CN2022/077966 CN2022077966W WO2023155232A1 WO 2023155232 A1 WO2023155232 A1 WO 2023155232A1 CN 2022077966 W CN2022077966 W CN 2022077966W WO 2023155232 A1 WO2023155232 A1 WO 2023155232A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
cathode
conductive
conductive layer
display panel
Prior art date
Application number
PCT/CN2022/077966
Other languages
English (en)
French (fr)
Inventor
冯华均
Original Assignee
深圳市华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Priority to US17/762,035 priority Critical patent/US20240147784A1/en
Publication of WO2023155232A1 publication Critical patent/WO2023155232A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/82—Cathodes
    • H10K50/822—Cathodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/82—Cathodes
    • H10K50/824—Cathodes combined with auxiliary electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H10K59/1315—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/302—Details of OLEDs of OLED structures
    • H10K2102/3023—Direction of light emission
    • H10K2102/3026—Top emission

Definitions

  • the present application belongs to the field of display technology, and in particular relates to a display panel, a manufacturing method thereof, and a display device.
  • OLED Organic Light-Emitting Diode
  • Organic Light-Emitting Diode OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) display device is a research hotspot in recent years. It has the advantages of self-illumination, all-solid-state, high contrast, and can realize soft screen design.
  • the thickness of the cathode in the existing top emission display device is generally thin, which results in a large cathode impedance and a relatively high voltage drop (IR drop), which easily causes uneven light emission of the display device.
  • the thickness of the cathode in the existing top emission display device is generally thin, which results in a relatively large cathode impedance and a relatively high voltage drop, which easily causes uneven light emission of the display device.
  • Embodiments of the present application provide a display panel, a manufacturing method thereof, and a display device to solve the problem that the thickness of the cathode in the existing top-emission display device is generally thin, which leads to a large cathode impedance and a relatively high voltage drop. It is easy to cause the problem of non-uniform light emission of the display device.
  • the embodiment of the present application provides a display panel, including:
  • the driving layer comprising a plurality of driving units arranged at intervals;
  • a light emitting part arranged on a side of the anode away from the driving unit
  • a cathode disposed on a side of the light-emitting part away from the driving unit
  • An encapsulation layer disposed on a side of the cathode away from the drive unit, the encapsulation layer is provided with a plurality of via holes to expose the cathode corresponding to each of the drive units;
  • a plurality of conductive parts are correspondingly arranged in the plurality of via holes
  • the conductive layer is arranged on the side of the packaging layer away from the drive unit, and the conductive layer is connected to each of the cathodes through the conductive part in the corresponding via hole, so that each of the cathodes is connected to the
  • the conductive layers are connected in parallel.
  • the embodiment of the present application also provides a method for manufacturing a display panel, including:
  • An encapsulation layer is provided on the cathode, and the encapsulation layer is provided with a plurality of via holes to expose the cathode corresponding to each of the driving units;
  • a plurality of conductive parts are correspondingly arranged in the plurality of via holes
  • a conductive layer is disposed on the packaging layer, and the conductive layer is connected to each of the cathodes through a conductive portion in the corresponding via hole, so that each of the cathodes is connected in parallel with the conductive layer.
  • the embodiment of the present application further provides a display device, including:
  • display panel including:
  • the driving layer comprising a plurality of driving units arranged at intervals;
  • a light emitting part arranged on a side of the anode away from the driving unit
  • a cathode disposed on a side of the light-emitting part away from the driving unit
  • An encapsulation layer disposed on a side of the cathode away from the drive unit, the encapsulation layer is provided with a plurality of via holes to expose the cathode corresponding to each of the drive units;
  • a plurality of conductive parts are correspondingly arranged in the plurality of via holes
  • the conductive layer is arranged on the side of the packaging layer away from the drive unit, and the conductive layer is connected to each of the cathodes through the conductive part in the corresponding via hole, so that each of the cathodes is connected to the
  • the conductive layers are connected in parallel;
  • a casing the casing is used to carry the display panel.
  • the display panel and its manufacturing method and display device by providing a conductive layer on the side of the encapsulation layer away from the cathode, and the conductive layer is connected in parallel with the cathode corresponding to each driving unit, it is possible to reduce the size of the two ends of the cathode, etc.
  • Effective resistance compared with the existing scheme of only setting a thinner cathode, the impedance that the cathode and the conductive layer of the present application can transmit is smaller, thereby reducing the voltage drop existing at both ends of the cathode and improving the display uniformity of the display device .
  • FIG. 1 is a schematic structural diagram of a display device provided by an embodiment of the present application.
  • FIG. 2 is a schematic diagram of a first structure of a display panel in the display device shown in FIG. 1 .
  • FIG. 3 is a schematic diagram of a second structure of a display panel in the display device shown in FIG. 1 .
  • FIG. 4 is a schematic diagram of an equivalent circuit structure of a cathode and a conductive layer provided in an embodiment of the present application.
  • FIG. 5 is a schematic flow diagram of a first process of a manufacturing method of a display panel provided in an embodiment of the present application.
  • FIG. 6 is a schematic diagram of the first manufacturing process of the manufacturing method of the display panel provided in the embodiment of the present application.
  • FIG. 7 is a second schematic flowchart of the method for manufacturing a display panel provided by the embodiment of the present application.
  • FIG. 8 is a schematic diagram of the second manufacturing process of the manufacturing method of the display panel provided in the embodiment of the present application.
  • the embodiment of the present application provides A display panel, its manufacturing method and display device will be described below with reference to the accompanying drawings.
  • FIG. 1 is a schematic structural diagram of a display device provided by an embodiment of the present application.
  • the embodiment of the present application provides a display device 1.
  • the display device 1 may include a display panel 10 and a housing 20.
  • the display panel 10 is installed in the housing 20.
  • the housing 20 may be used to carry the display panel 10, and the housing 20 may be Set the control display panel 10 main control circuit board and the like.
  • the display device 1 may be a mobile electronic device such as a mobile phone or a tablet, and the display device 1 may also be a device having a display function such as a computer device, a television, or a vehicle-mounted computer.
  • the display panel 10 may be a device including an OLED (Organic Light-Emitting Diode, organic light-emitting semiconductor), or the light-emitting form of the components in the display panel 1 is an OLED light-emitting form, and the OLED belongs to a current-type organic light-emitting device.
  • OLED Organic Light-Emitting Diode, organic light-emitting semiconductor
  • the OLED belongs to a current-type organic light-emitting device.
  • the OLED is a phenomenon of luminescence caused by the injection and recombination of carriers, and the luminous intensity is proportional to the injected current.
  • the holes generated by the anode and the electrons generated by the cathode will move, inject into the hole transport layer and the electron transport layer respectively, and migrate to the light emitting layer.
  • energy excitons are generated, which excite light-emitting molecules and finally produce visible light.
  • a top emission display panel has been developed. Due to the need to increase the light transmittance, the thickness of the cathode is generally thinner, which results in a larger impedance of the cathode and a relatively high voltage drop, which easily causes uneven light emission of the display device.
  • FIG. 2 is a first structural schematic diagram of the display panel in the display device shown in FIG. 1
  • FIG. 3 is a schematic diagram of the display panel in the display device shown in FIG. Schematic diagram of the second structure.
  • the display panel 10 may include a driving layer 101 , an anode 102 , a light emitting part 103 , a cathode 104 , an encapsulation layer 105 , a conductive layer 106 and a plurality of conductive parts 100 .
  • the driving layer 101 may include a plurality of driving units 1012 arranged at intervals.
  • the anode 102 is disposed on one side of the driving unit 1012 .
  • the light emitting part 103 is disposed on a side of the anode 102 away from the driving unit 1012 .
  • the cathode 104 is disposed on a side of the light emitting portion 103 away from the driving unit 1012 .
  • the packaging layer 105 is disposed on the side of the cathode 104 facing away from the driving unit 1012 , and the packaging layer 105 is provided with a plurality of via holes 1052 to expose the cathode 104 corresponding to each driving unit 1012 .
  • the plurality of conductive portions 100 are correspondingly disposed in the plurality of via holes 1052 .
  • the conductive layer 106 is disposed on the side of the packaging layer 105 facing away from the driving unit 1012 , and the conductive layer 106 is connected to each cathode 104 through the conductive portion 100 in the corresponding via hole 1052 so that each cathode 104 is connected to the conductive layer 106 in parallel.
  • the impedance transmitted by the cathode 104 and the conductive layer 106 of the present application is smaller, thereby reducing the voltage drop across the cathode 104 and improving the display uniformity of the display device 1 .
  • the driving unit 1012 , the anode 102 , the light emitting part 103 , the cathode 104 , the encapsulation layer 105 and the conductive layer 106 are stacked in sequence.
  • the anode 102, the light emitting part 103 and the cathode 104 can be regarded as a light emitting unit, and the encapsulation layer 105 and the conductive layer 106 can be understood as an encapsulation unit.
  • the display panel 10 may include a driving layer 101, a light-emitting layer, and an encapsulation layer 105.
  • the driving layer 101 includes a plurality of driving units 1012 arranged at intervals, and each driving unit 1012 is also a thin film transistor (Thin Film Transistor, TFT) structure, each driving unit 1012 may include a gate, a source, a drain, an interlayer insulating layer, an interlayer dielectric layer, etc. that are stacked.
  • the light-emitting layer includes light-emitting units corresponding to the driving units 1012 one-to-one, and each light-emitting unit may include an anode 102 , a light-emitting portion 103 and a cathode 104 .
  • the light-emitting layer is interposed between the driving layer 101 and the encapsulation layer 105, and the encapsulation layer 105 is used to encapsulate the light-emitting layer to block the influence of external water vapor on the light-emitting layer.
  • the light emitting part 103 can also be referred to as a pixel unit, and the light emitting part 103 is interposed between the anode 102 and the cathode 104 .
  • the light-emitting part 103 can be made of an organic semiconductor material.
  • the light-emitting part 103 emits light through the injection and recombination of carriers in the anode 102 and cathode 104, and the light-emitting intensity is proportional to the injected current.
  • the light emitting part 103 may also include multiple layer structures, such as a hole injection layer, a hole transport layer, and the like.
  • the embodiment of the present application adds a layer of conductive layer 106, by connecting the conductive layer 106 to the cathode 104 corresponding to each driving unit 1012 in parallel, it can make the conduction
  • the impedance of transmission between the layer 106 and the cathode 104 is small, thereby reducing the voltage drop of the cathode 104 to improve the display uniformity of the display device 1 .
  • the conductive layer 106 may be made of a transparent conductive material, such as a transparent oxide material.
  • the conductive layer 106 can be made of ITO (Indium Tin Oxide, Indium Tin Oxide) material, ITO is a mixture, transparent brown film or yellowish gray block, made of 90% In2O3 and 10% SnO2.
  • the conductive layer 106 may also be made of IZO (Indium Zinc Oxide, indium zinc oxide) material.
  • the material of the conductive layer 106 can also be other materials, and no more examples will be given here.
  • the light transmittance of the conductive layer 106 is greater than the light transmittance of the cathode 104, so that the addition of the conductive layer 106 basically does not affect the light transmittance of the display panel 10, and compared with the existing scheme of only setting a thinner cathode,
  • the parallel connection of the cathode 104 and the conductive layer 106 of the present application can reduce the equivalent resistance at both ends of the cathode 104 , thereby reducing the voltage drop at both ends of the cathode 104 and improving the display uniformity of the display device 1 .
  • the display panel 10 may further include a barrier layer 107 disposed between the anode 102 and the cathode 104 and adjacent to the light emitting part 103 .
  • the barrier layer 107 can also be called a black matrix or a light-shielding layer.
  • the barrier layer 107 is used to separate the anode 102 from the cathode 104, and can separate the light-emitting parts 103 between different light-emitting units to prevent the gap between the light-emitting parts 103. interference.
  • the display panel 10 may further include a plurality of protrusions 108 , each protrusion 108 is disposed between the cathode 104 and the barrier layer 107 , and the plurality of protrusions 108 are correspondingly disposed in the plurality of via holes 1052 .
  • a part of the cathode 104 is disposed in the via hole 1052 , and the protrusion 108 can raise the portion of the cathode 104 corresponding to the via hole 1052 to facilitate the connection between the cathode 104 and the conductive layer 106 .
  • the upper surface of the cathode 104 connected to the conductive layer 106 is flush with the upper surface of the packaging layer 105 facing the conductive layer 106 .
  • the negative electrode 104 that is arranged in this way can facilitate the connection with the conductive layer 106.
  • the negative electrode 104 and the conductive layer 106 can be made respectively at the same time, and then the conductive layer 106 that has been made is buckled to the packaging layer 105, so that the conductive layer 106 and the conductive layer 106 are connected to the packaging layer 105.
  • the cathodes 104 are connected in parallel.
  • a part of the conductive layer 106 can be disposed in the via hole 1052 and connected to the cathode 104 .
  • the conductive part 100 and the conductive layer 106 can be integrally formed. That is to say, the thickness of the portion of the conductive layer 106 corresponding to the via hole 1052 is greater than the thickness of the conductive layer 106 corresponding to the non-via hole 1052 region of the encapsulation layer 105 .
  • the protruding portion 108 may not be provided, that is, a part of the conductive layer 106 is completely filled in the via hole 1052 .
  • the raised portion 108 can also be selected.
  • the height of the raised portion 108 can be smaller than the height of the raised portion 108 in the first case, that is, the thickness of the conductive layer 106 in the via hole 1052 is the same as that of the cathode 104 and The thickness of the protruding portion 108 inside the via hole 1052 is equal to the height of the via hole 1052 .
  • FIG. 4 is a schematic diagram of an equivalent circuit structure of a cathode and a conductive layer provided by an embodiment of the present application.
  • the parallel connection between the conductive layer 106 and the cathode 104 can reduce the equivalent resistance at both ends of the cathode 104 , thereby reducing the voltage drop of the cathode 104 and improving the display uniformity of the display device 1 .
  • the orthographic projection of the conductive part 100 in each via hole 1052 on the conductive layer 106 is spaced from the orthographic projection of the corresponding light emitting part 103 on the conductive layer 106, so as to prevent the connection between the cathode 104 and the conductive layer 106
  • the influence of the thickness of the light-emitting part 103 on the light-emitting part 103 affects the light transmittance of the light-emitting part 103.
  • the display panel 10 may further include a first metal part 109 , a second metal part 110 and conductive gold balls 111 .
  • the first metal part 109 can be disposed on the side of the driving unit 1012 away from the light emitting part 103 , and the first metal part 109 can be connected to the driving unit 1012 to transmit scanning signals or electrical signals to the driving unit 1012 .
  • the second metal portion 110 is on the same layer as the first metal portion 109 and arranged at intervals, that is, the second metal portion 110 does not correspond to the driving unit 1012 , and the second metal portion 110 and the driving unit 1012 are arranged in a dislocation.
  • the conductive gold ball 111 connects the second metal part 110 and the conductive layer 106 .
  • the current can flow to the conductive layer 106 through the peripheral conductive gold balls 111 , and then be transmitted to the cathode 104 , thereby increasing the conductivity of the conductive layer 106 and the cathode 104 .
  • both the first metal part 109 and the second metal part 110 are the first metal layer produced when the display panel 10 is produced, and then the driving unit 1012 and the light emitting unit are sequentially produced on the first metal part 109 .
  • the conductive gold ball 111 straddles the driving unit and the light emitting unit, and connects the second metal part 110 with the conductive layer 106, so that the current can be introduced from the second metal part 110, and flow through the conductive gold ball 111 and the conductive layer 106 to the cathode 104 in sequence .
  • the conductive gold balls 111 may only be disposed on the edge of the display panel 10 .
  • the light-emitting layer and the conductive gold balls 111 can be separated by a getter and a barrier to prevent mutual interference between the metal in the light-emitting layer and the conductive gold balls 111 .
  • FIG. 5 is a schematic flow chart of a first manufacturing method of a display panel provided by an embodiment of the present application.
  • the structural composition of the display panel 10 can refer to FIG. 1 to FIG. 4 and the above description, and will not be repeated here.
  • the preparation method of the display panel includes:
  • a layer of substrate 112 is provided first to provide support and a flatness basis for the layer structure of the display panel 10 .
  • the substrate 112 can generally be a glass substrate.
  • the substrate 112 is cut out to a predetermined size, and forms a display screen structure together with other layer structures.
  • the driving unit 1012 can be fabricated on the substrate 112 first, that is, the TFT structure can be fabricated, and the TFT can usually be a layer structure composed of a gate, a source, a drain, an insulating layer and an interlayer dielectric layer.
  • a plurality of driving units 1012 are arranged at intervals on the substrate 112 , and the plurality of driving units 1012 may be arranged in an array on the substrate 112 .
  • a layer structure composed of a plurality of driving units 1012 arranged at intervals may be called a driving layer 101 .
  • the driving unit 1012 is used to drive the light emitting unit to emit light, that is, the driving unit 1012 can provide the light emitting unit with an electrical signal or a scanning signal, so as to control the light emitting unit to emit light according to a preset program.
  • the anode 102 , the light emitting part 103 and the cathode 104 form a "sandwich" structure, the light emitting part 103 is sandwiched between the anode 102 and the cathode 104, and the light emitting part 103 can also be called a pixel unit.
  • the light-emitting part 103 can be made of an organic semiconductor material.
  • the light-emitting part 103 emits light through the injection and recombination of carriers in the anode 102 and cathode 104, and the light-emitting intensity is proportional to the injected current.
  • the light emitting part 103 may also include multiple layer structures, such as a hole injection layer, a hole transport layer, and the like.
  • the widths of the anode 102, the light emitting part 103 and the cathode 104 are different, and the width of the light emitting part 103 may be smaller than the width of the anode 102 and the cathode 104, which is due to the anode 102 and the cathode 104.
  • the cathode 104 not only needs to be connected to the light emitting part 103, but also needs to be electrically connected to other layer structures.
  • the anode 102 also needs to be connected to the source of the driving unit 1012, so that the electrical signal of the driving unit 1012 can be transmitted to the light emitting unit.
  • the transmission impedance is relatively large, resulting in a large voltage drop at the cathode, resulting in uneven display of the display panel 10 or the display device 1 . Therefore, in the embodiment of the present application, the equivalent resistance at both ends of the cathode 104 is reduced by connecting the conductive layer to the cathode 104 in parallel, thereby reducing the transmission impedance of the cathode 104 and reducing the voltage drop existing at the cathode 104, so that the display panel 10 or the display device 1 shows improved uniformity.
  • an encapsulation layer 105 can be provided on the side of the cathode 104 away from the light emitting part 103, and the encapsulation layer 105 covers the cathode 104.
  • a part of the cathode 104 needs to be exposed, and this part of the cathode 104 can be connected to the conductive layer.
  • a plurality of via holes 1052 may be provided in the encapsulation layer 105 to expose the cathode 104 corresponding to each driving unit 1012 .
  • the encapsulation layer 105 above the cathode 104 corresponding to each driving unit 1012 may be provided with one via hole 1052 , and the number of the via holes 1052 may be the same as the number of the driving units 1012 .
  • the via hole 1052 and the light emitting portion 103 may be dislocated.
  • a plurality of via holes 1052 are disposed between the cathode 104 and the conductive layer 106 , in order to connect the cathode 104 to the conductive layer 106 , a conductive portion 100 may be disposed in each via hole 1052 .
  • the conductive part 100 is used as the connection carrier of the cathode 104 and the conductive layer 106.
  • the conductive part 100 and the cathode 104 can be integrally formed, or the conductive part 100 and the conductive layer 106 can be integrally formed to simplify the manufacturing process.
  • the conductive layer 106 can be understood as an auxiliary electrode of the cathode 104 , that is, an additional layer of conductive structure to reduce the transmission impedance of the cathode 104 .
  • the conductive layer 106 can be made of transparent oxide material to prevent the conductive layer 106 from affecting the light transmittance.
  • the material of the conductive layer 106 may be ITO, IZO, or a mixed material of ITO and IZO materials.
  • the conductive layer 106 is arranged on the side of the packaging layer 105 facing away from the cathode 104, and the conductive layer 106 is bonded to the packaging layer 105, so that the conductive layer 106 and the cathode 104 corresponding to each driving unit 1012 can conduct electricity through the corresponding via hole 1052.
  • the portion 100 is connected, so that each cathode 104 is connected in parallel with the conductive layer 106, so as to reduce the equivalent resistance across the cathode 104, thereby reducing the voltage drop existing at the cathode 104.
  • a cover plate 113 may also be provided on the side of the conductive layer 106 away from the cathode 104, and the cover plate 113 may be a glass cover plate.
  • connection between the conductive layer 106 and the cover plate 113 and the encapsulation layer 105 can be performed in the following two ways.
  • FIG. 1 to FIG. 5 and refer to FIG. 6 is a schematic diagram of the first manufacturing process of the manufacturing method of the display panel provided by the embodiment of the present application.
  • the encapsulation layer 105 , the conductive layer 106 and the cover plate 113 can be manufactured in a layer-by-layer manner. That is, after step 308 , the cover plate 113 is directly disposed on the conductive layer 106 .
  • the conductive layer 106 is provided on the encapsulation layer 105, the conductive part 100 can be integrally formed with the conductive layer 106, and the conductive layer 106 can be partially filled in each via hole 1052, so that the conductive layer 106 and each cathode 104 pass through The conductive portion 100 corresponding to the via hole 1052 is connected.
  • the cover plate 113 can be directly covered on the conductive layer 106 , that is, the cover plate 113 is disposed on the conductive layer 106 .
  • the conductive part 100 and the light emitting part 103 in the via hole 1052 are dislocated so as to prevent the thickness of the junction of the conductive layer 106 and the cathode 104 from affecting the light transmittance of the light emitting part 103 .
  • FIG. 7 is a second schematic flow chart of the method for manufacturing a display panel provided in the embodiment of the present application
  • the cathode 104 and the encapsulation layer 105 as well as the conductive layer 106 and the cover plate 113 are fabricated respectively, and then the cover plate 113 with the conductive layer 106 is bonded to the encapsulation layer 105 and the conductive layer 106 is connected to the cathode 104 .
  • the preparation method of the display panel may further include:
  • step 301 Reference may be made to the description of step 301, which will not be repeated here.
  • Both the first metal part 109 and the second metal part 110 can be understood as the first metal layer produced when the display panel 10 is produced, and then the driving unit and the light emitting unit are sequentially produced on the first metal part 109 .
  • the first metal part 109 is disposed on the side of the driving unit 1012 facing away from the light emitting part 103 , and the first metal part 109 can be connected to the driving unit 1012 to transmit scanning signals or electrical signals to the driving unit 1012 .
  • a plurality of driving units 1012 form the driving layer 101 .
  • steps 404 to 408 reference may be made to the description of steps 303 to 307, which will not be repeated here.
  • conductive gold balls 111 can be added.
  • a through hole may be opened from the encapsulation layer 105 to a region of the driving layer 101 different from the driving unit 1012 to expose the second metal portion 110 .
  • the second metal portion 110 is on the same layer as the first metal portion 109 and arranged at intervals, that is, the second metal portion 110 does not correspond to the driving unit 1012 , and the second metal portion 110 and the driving unit 1012 are arranged in a dislocation.
  • conductive gold balls 111 are disposed on the second metal part 110 .
  • An end of the conductive gold ball 111 facing away from the substrate 112 may be flush with an upper surface of the packaging layer 105 facing away from the driving unit 1012 .
  • the conductive layer 106 can be provided on the cover plate 113 , and then the cover plate 113 with the conductive layer 106 is turned over and connected with the encapsulation layer 105 in pairs.
  • the group connection can be understood as: after the conductive layer 106 and the encapsulation layer 105 are positioned, they are bonded and connected, so that the conductive layer 106 is connected to the exposed cathode 104 corresponding to each driving unit 1012 .
  • the conductive part 100 can be integrally formed with the cathode 104 , thereby simplifying the manufacturing process of the display panel 10 .
  • the conductive layer 106 can be connected to the conductive gold ball 111 at the same time, and the conductive gold ball 111 is connected to the second metal part 110 and the conductive layer 106 .
  • the conductive gold ball 111 in an electrified state, current can flow to the conductive layer 106 through the peripheral conductive gold ball 111 , and then be transmitted to the cathode 104 .
  • the conductive gold ball 111 straddles the driving unit and the light emitting unit, and connects the second metal part 110 with the conductive layer 106, so that the current can be introduced from the second metal part 110, and flow through the conductive gold ball 111 and the conductive layer 106 to the cathode 104 in sequence .
  • the conductive gold balls 111 may only be disposed on the edge of the display panel 10 .
  • the cathode 104 can be raised so that the cathode 104 can be connected to the conductive layer 106 .
  • the method for manufacturing the display panel may further include:
  • a barrier layer is provided on the anode, and the barrier layer is adjacent to the light emitting part.
  • the barrier layer 107 is disposed between the anode 102 and the cathode 104 and adjacent to the light emitting part 103 .
  • the barrier layer 107 can also be called a black matrix or a light-shielding layer.
  • the barrier layer 107 is used to separate the anode 102 from the cathode 104, and can separate the light-emitting parts 103 between different light-emitting units to prevent the gap between the light-emitting parts 103. interference.
  • a plurality of protrusions are provided on the barrier layer.
  • Each protrusion 108 is disposed between the cathode 104 and the barrier layer 107 , and the plurality of protrusions 108 are correspondingly disposed in the plurality of via holes 1052 .
  • the conductive part 100 and the cathode 104 are integrally formed, that is, a part of the cathode 104 is disposed in the via hole 1052, and the setting of the protrusion 108 can raise the part of the cathode 104 corresponding to the via hole 1052, so that the cathode 104 Connection to conductive layer 106 .
  • the upper surface of the cathode 104 connected to the conductive layer 106 is flush with the upper surface of the packaging layer 105 facing the conductive layer 106 .
  • the negative electrode 104 that is arranged in this way can facilitate the connection with the conductive layer 106.
  • the negative electrode 104 and the conductive layer 106 can be made respectively at the same time, and then the conductive layer 106 that has been made is buckled to the packaging layer 105, so that the conductive layer 106 and the conductive layer 106 are connected to the packaging layer 105.
  • the cathode 104 is connected.
  • a cathode is provided on the blocking layer, the light emitting part and the raised part.
  • An encapsulation layer is arranged on the cathode, and a plurality of via holes are respectively opened in the positions of the encapsulation layer corresponding to the plurality of protrusions.
  • the cathode 104 covers part of the barrier layer 107 , covers the light emitting part 103 , and covers the raised part 108 . Since the thickness of the cathode 104 is consistent in different regions, the part of the cathode 104 corresponding to the light-emitting part 103 can follow the light-emitting part 103 and sink a part, which is due to the upper surface of the light-emitting part 103 connected to the cathode 104 and the barrier layer 107 and The upper surface connected to the cathode 104 is not flush. The portion of the cathode 104 corresponding to the protruding portion 108 is raised by the protruding portion 108 and is in the via hole 1052 . When the upper surface of the cathode 104 is flush with the conductive layer 106, the cathode 104 can be connected to the conductive layer 106.
  • the position of the via hole 1052 is set according to the protruding part 108. Therefore, during fabrication, the protruding part 108 is usually fabricated first, then the cathode 104 is fabricated, and then the encapsulation layer 105 is fabricated. The position of the hole 1052 can be opened according to the raised cathode 104 .
  • the conductive layer 106 is directly stacked on the packaging layer 105, or in the second way, the cover plate 113 with the conductive layer 106 is connected to the packaging layer 105 in pairs.
  • Other conductive structures are provided to further increase the conductivity of the cathode 104 . That is to say, for the arrangement of the conductive gold balls 111 , in the first manner, reference may be made to the description of the second manner.
  • the method for preparing the display panel may also include:
  • the first metal part and the second metal part are arranged on the substrate, and the first metal part and the second metal part are arranged on the same layer.
  • Both the first metal part 109 and the second metal part 110 can be understood as the first metal layer produced when the display panel 10 is produced, and then the driving unit and the light emitting unit are sequentially produced on the first metal part 109 .
  • the driving unit is arranged on the first metal part, and the first metal part is connected with the driving unit.
  • the first metal part 109 is disposed on the side of the driving unit 1012 facing away from the light emitting part 103 , and the first metal part 109 can be connected to the driving unit 1012 to transmit scanning signals or electrical signals to the driving unit 1012 .
  • Conductive gold balls are arranged on the second metal part, and the conductive gold balls are connected with the conductive layer.
  • the second metal portion 110 is on the same layer as the first metal portion 109 and arranged at intervals, that is, the second metal portion 110 does not correspond to the driving unit 1012 , and the second metal portion 110 and the driving unit 1012 are arranged in a dislocation.
  • the conductive gold ball 111 connects the second metal part 110 and the conductive layer 106 . For example, in an electrified state, current can flow to the conductive layer 106 through the peripheral conductive gold ball 111 , and then be transmitted to the cathode 104 .
  • the conductive gold ball 111 straddles the driving unit and the light emitting unit, and connects the second metal part 110 with the conductive layer 106, so that the current can be introduced from the second metal part 110, and flow through the conductive gold ball 111 and the conductive layer 106 to the cathode 104 in sequence .
  • the conductive gold balls 111 may only be disposed on the edge of the display panel 10 .
  • the conductive layer 106 is provided on the side of the encapsulation layer 105 away from the cathode 104, and the conductive layer 106 is connected in parallel with the cathode 104 corresponding to each driving unit 1012
  • the connection can reduce the equivalent resistance at both ends of the cathode 104.
  • the impedance transmitted by the cathode 104 and the conductive layer 106 of the present application is smaller, thereby reducing the two ends of the cathode 104.
  • the voltage drop existing at the terminals improves the display uniformity of the display device 1 .
  • first and second are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features.
  • features defined as “first” and “second” may explicitly or implicitly include one or more features.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种显示面板（10）及制备方法和显示装置（1），显示面板（10）包括：驱动层（101），包括驱动单元（1012）；阳极（102）；发光部（103）；阴极（104）；封装层（105），设置有多个过孔（1052），以露出对应每一驱动单元（1012）的阴极（104）；多个导电部（100），对应设置于多个过孔（1052）内；导电层（106），与每一阴极（104）连接，以使每一阴极（104）与导电层（106）并联。减小了阴极（104）两端等效电阻，进而减小阴极（104）两端存在的电压降。

Description

显示面板及其制备方法和显示装置 技术领域
本申请属于显示技术领域，尤其涉及一种显示面板及其制备方法和显示装置。
 背景技术
OLED（Organic Light-Emitting Diode，有机发光二极管）显示器件是近年来的研究热点，其具有自发光、全固态、高对比度等优点，并且能够实现软屏设计。
其中，为了增大OLED显示器件的分辨率，越来越多的顶发射型显示器件被研发出来。然而，现有的顶发射显示器件中阴极的厚度一般较薄，由此导致阴极阻抗较大，出现相对较高的电压降（IR drop），容易引起显示装置发光不均匀的现象。
 技术问题
现有的顶发射显示器件中阴极的厚度一般较薄，由此导致阴极阻抗较大，出现相对较高的电压降，容易引起显示装置发光不均匀的现象。
 技术解决方案
本申请实施例提供一种显示面板及其制备方法和显示装置，以解决现有的顶发射显示器件中阴极的厚度一般较薄，由此导致阴极阻抗较大，出现相对较高的电压降，容易引起显示装置的发光不均匀现象的问题。
第一方面，本申请实施例提供一种显示面板，包括：
驱动层，所述驱动层包括多个间隔设置的驱动单元；
阳极，设置于所述驱动单元的一侧；
发光部，设置于所述阳极背离所述驱动单元的一侧；
阴极，设置于所述发光部背离所述驱动单元的一侧；
封装层，设置于所述阴极背离所述驱动单元的一侧，所述封装层设置有多个过孔，以露出对应每一所述驱动单元的所述阴极；
多个导电部，对应设置于多个所述过孔内；
导电层，设置于所述封装层背离所述驱动单元的一侧，且所述导电层与每一所述阴极通过对应的所述过孔内的导电部连接，以使每一所述阴极与所述导电层并联。
第二方面，本申请实施例还提供一种显示面板的制备方法，包括：
提供一基板；
在所述基板上设置多个间隔的驱动单元，以形成驱动层；
在所述驱动单元上设置阳极；
在所述阳极上设置发光部；
在所述发光部上设置阴极；
在所述阴极上设置封装层，所述封装层设置有多个过孔，以露出所述对应每一所述驱动单元的所述阴极；
在多个所述过孔内对应设置多个导电部；
在所述封装层上设置导电层，所述导电层与每一所述阴极通过对应的所述过孔内的导电部连接，以使每一所述阴极与所述导电层并联。
第三方面，本申请实施例还提供一种显示装置，包括：
显示面板，包括：
驱动层，所述驱动层包括多个间隔设置的驱动单元；
阳极，设置于所述驱动单元的一侧；
发光部，设置于所述阳极背离所述驱动单元的一侧；
阴极，设置于所述发光部背离所述驱动单元的一侧；
封装层，设置于所述阴极背离所述驱动单元的一侧，所述封装层设置有多个过孔，以露出对应每一所述驱动单元的所述阴极；
多个导电部，对应设置于多个所述过孔内；
导电层，设置于所述封装层背离所述驱动单元的一侧，且所述导电层与每一所述阴极通过对应的所述过孔内的导电部连接，以使每一所述阴极与所述导电层并联；
壳体，所述壳体用于承载所述显示面板。
 有益效果
本申请实施例的显示面板及其制备方法和显示装置中，通过在封装层远离阴极的一侧设置导电层，且导电层与每一驱动单元对应的阴极并联连接，可以减小阴极两端等效电阻，相较于现有的仅设置较薄阴极的方案，本申请的阴极和导电层可以传输的阻抗更小，进而可以减小阴极两端存在的电压降，提高显示装置显示的均匀性。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单的介绍。显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对本领域技术人员来说，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
为了更完整地理解本申请及其有益效果，下面将结合附图来进行说明。其中，在下面的描述中相同的附图标号表示相同部分。
图1为本申请实施例提供的显示装置的结构示意图。
图2为图1所示的显示装置中显示面板的第一种结构示意图。
图3为图1所示的显示装置中显示面板的第二种结构示意图。
图4为本申请实施例提供的阴极和导电层的等效电路结构示意图。
图5为本申请实施例提供的显示面板的制备方法的第一流程示意图。
图6为本申请实施例提供的显示面板的制备方法的第一种制备过程示意图。
图7为本申请实施例提供的显示面板的制备方法的第二流程示意图。
图8为本申请实施例提供的显示面板的制备方法的第二种制备过程示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
为了解决现有的顶发射显示器件中阴极的厚度一般较薄，由此导致阴极阻抗较大，出现相对较高的电压降，容易引起显示装置的发光不均匀现象的问题，本申请实施例提供一种显示面板及其制备方法和显示装置，以下将结合附图进行说明。
示例性的，请参阅图1，图1为本申请实施例提供的显示装置的结构示意图。本申请实施例提供一种显示装置1，显示装置1可以包括显示面板10和壳体20，显示面板10安装于壳体20，壳体20可以用于承载显示面板10，且壳体20内可以设置控制显示面板10主控电路板等。示例性的，显示装置1可以是手机、平板等可移动电子设备，显示装置1也可以是计算机设备、电视机、车载电脑等具有显示功能的设备。
其中，显示面板10可以是包括OLED（Organic Light-Emitting Diode，有机发光半导体）的器件，或者说显示面板1中的元器件的发光形式是OLED发光形式，OLED属于一种电流型的有机发光器件，是通过载流子的注入和复合而致发光的现象，发光强度与注入的电流成正比。OLED在电场的作用下，阳极产生的空穴和阴极产生的电子就会发生移动，分别向空穴传输层和电子传输层注入，迁移到发光层。当二者在发光层相遇时，产生能量激子，从而激发发光分子最终产生可见光。
其中，为了增大OLED器件的分辨率，顶发射型显示面板被研发出来。由于需要增加光的透过率，阴极的厚度一般较薄，由此导致阴极阻抗较大，出现相对较高的电压降，容易引起显示装置发光不均匀的现象。
为了解决上述问题，本申请实施例对显示面板10的结构进行了改进。示例性的，请结合图1并参阅图2和图3，图2为图1所示的显示装置中显示面板的第一种结构示意图，图3为图1所示的显示装置中显示面板的第二种结构示意图。显示面板10可以包括驱动层101、阳极102、发光部103、阴极104、封装层105、导电层106和多个导电部100。驱动层101可以包括多个间隔设置的驱动单元1012。阳极102设置于驱动单元1012的一侧。发光部103设置于阳极102背离驱动单元1012的一侧。阴极104设置于发光部103背离驱动单元1012的一侧。封装层105设置于阴极104背离驱动单元1012的一侧，封装层105设置有多个过孔1052，以露出对应每一驱动单元1012的阴极104。多个导电部100对应设置于多个过孔1052内。导电层106设置于封装层105背离驱动单元1012的一侧，且导电层106与每一阴极104通过对应的过孔1052内的导电部100连接，以使每一阴极104与导电层106并联。通过在封装层105远离阴极104的一侧设置导电层106，且导电层106与每一驱动单元1012对应的阴极104并联连接，可以减小阴极104两端等效电阻，相较于现有的仅设置较薄阴极的方案，本申请的阴极104和导电层106可以传输的阻抗更小，进而可以减小阴极104两端存在的电压降，提高显示装置1显示的均匀性。
可以理解的是，驱动单元1012、阳极102、发光部103、阴极104、封装层105和导电层106依次层叠设置。阳极102、发光部103和阴极104可以当作发光单元，封装层105和导电层106可以理解为封装单元。也即是说，显示面板10可以包括驱动层101、发光层和封装层105，驱动层101中包括间隔设置的多个驱动单元1012，每一驱动单元1012也即是薄膜晶体管（Thin Film Transistor，TFT）结构，每一驱动单元1012可以包括层叠设置的栅极、源极、漏极以及层间绝缘层和层间电介质层等。发光层中包括与驱动单元1012一一对应设置的发光单元，每一发光单元又可以包括阳极102、发光部103和阴极104。发光层夹设于驱动层101和封装层105之间，封装层105用于封装发光层，以阻隔外界水汽等对发光层的影响。
其中，发光部103也可以称为像素单元，发光部103夹设于阳极102和阴极104之间。发光部103可以采用有机半导体材料，发光部103的发光是通过阳极102和阴极104的载流子的注入和复合而致发光的现象，发光强度与注入的电流成正比。发光部103也可以包括多个层结构，如空穴注入层、空穴传输层等。
为了减小阴极104传输的阻抗，进而降低阴极104的电压降，本申请实施例增加了一层导电层106，通过将导电层106与每一驱动单元1012对应的阴极104并联连接，可以使得导电层106和阴极104的传输的阻抗较小，进而降低阴极104的电压降，以提高显示装置1显示的均匀性。
示例性的，导电层106可以由透明导电材料制成，可以采用透明氧化物材料。比如，导电层106可以由ITO（Indium Tin Oxide，氧化铟锡）材料制成，ITO是一种混合物，透明茶色薄膜或黄偏灰色块状，由90%In2O3和10%SnO2混合而成。再比如，导电层106还可以由IZO（Indium Zinc Oxide，氧化铟锌）材料制成。当然，导电层106的材料还可以为其他材料，这里不再一一举例。
其中，导电层106的透光率大于阴极104的透光率，使得增加导电层106基本不会影响显示面板10的光透过率，并且相较于现有的仅设置较薄阴极的方案，本申请的阴极104和导电层106并联可以使阴极104两端的等效电阻减小，进而减小阴极104两端存在的电压降，提高显示装置1显示的均匀性。
需要说明的是，导电层106与每一阴极104的并联连接可以通过下列两种方式进行。
第一种情况下，也即对应图2中的情况，可以设置将阴极104抬高而与导电层106连接的方式，此时，导电部100可以与阴极104一体成型。示例性的，显示面板10还可以包括阻挡层107，阻挡层107设置于阳极102与阴极104之间，且与发光部103邻接。阻挡层107也可以称为黑矩阵或者遮光层，阻挡层107用于将阳极102与阴极104间隔开，且可以将不同发光单元之间的发光部103间隔开来，以防止发光部103之间的干扰。
显示面板10还可以包括多个凸起部108，每一凸起部108设置于阴极104和阻挡层107之间，且多个凸起部108分别对应设置于多个过孔1052内。需要说明的是，阴极104的一部分设置于过孔1052内，凸起部108的设置可以将对应过孔1052的阴极104部分抬高，以便于阴极104与导电层106的连接。示例性的，阴极104与导电层106连接的上表面与封装层105朝向导电层106的上表面齐平。这样设置的阴极104，可以方便与导电层106的连接，在制作时，可以同时分别制作阴极104和导电层106，再将制作完成的导电层106扣向封装层105，以使得导电层106与阴极104并联连接。
第二种情况下，也即对应图3中的情况，可以将导电层106的一部分设置于过孔1052内，并与阴极104连接，此时，导电部100可以与导电层106一体成型。也即是说，导电层106对应过孔1052的部分的厚度大于导电层106对应封装层105的非过孔1052区域的厚度。此时，可以不设置凸起部108，也即导电层106的一部分完全填充于过孔1052内。当然，也可以选择设置凸起部108，此时凸起部108的高度可以小于第一种情况下凸起部108的高度，也即是导电层106位于过孔1052内的厚度与阴极104和凸起部108的位于过孔1052内的厚度和与过孔1052的高度相等。
当然，导电层106和阴极104的并联连接还可以有其他情况，这里不再赘述。
示例性的，请结合图1至图3并参阅图4，图4为本申请实施例提供的阴极和导电层的等效电路结构示意图。导电层106与阴极104并联连接可以减小阴极104两端的等效电阻，进而减小阴极104的电压降，提高显示装置1显示的均匀性。
需要说明的是，每一过孔1052内的导电部100在导电层106的正投影均与其相对应的发光部103在导电层106的正投影间隔，以防止阴极104和导电层106的连接处的厚度对发光部103的影响，比如，影响发光部103的光透过率。
需要说明的是，还可以设置导电金属以增加阴极104和导电层106的导电性。示例性的，请继续参阅图2和图3，显示面板10还可以包括第一金属部109、第二金属部110和导电金球111。第一金属部109可以设置于驱动单元1012远离发光部103的一侧，且第一金属部109可以与驱动单元1012连接，以将扫描信号或者电信号传输至驱动单元1012。第二金属部110与第一金属部109同层且间隔设置，也即第二金属部110不与驱动单元1012对应，第二金属部110与驱动单元1012错位设置。导电金球111连接第二金属部110和导电层106。比如，在通电状态下，电流可以通过外围导电金球111流向导电层106，再传输至阴极104，进而可以增加导电层106和阴极104的导电性。
其中，第一金属部109和第二金属部110均为在制作显示面板10时制作的第一层金属层，然后在第一金属部109上依次制作驱动单元1012和发光单元。
导电金球111横跨驱动单元和发光单元，将第二金属部110与导电层106连接起来，从而可以由第二金属部110导入电流，并依次通过导电金球111和导电层106流向阴极104。示例性的，导电金球111可以仅设置于显示面板10的边缘位置。其中，发光层与导电金球111可以通过吸气剂和阻挡部间隔开来，以防止发光层中的金属与导电金球111之间的相互干扰。
为了更清楚的说明本申请实施例显示面板10的结构组成，以下将从显示面板的制备方法的角度进行说明。
示例性的，请接合图1至图4并参阅图5，图5为本申请实施例提供的显示面板的制备方法的第一流程示意图。显示面板10的结构组成可以参照图1至图4以及上述说明，这里不再赘述。显示面板的制备方法包括：
301、提供一基板。
需要说明的是，在制作显示面板10的过程中，通常会先设置一层基板112，以为显示面板10的层结构提供支撑和平整度的基础。基板112通常可以为玻璃基板，在制作显示面板10完成时，基板112被切割出预设尺寸，与其他层结构一起构成显示屏结构。
302、在基板上设置多个间隔的驱动单元，以形成驱动层。
在基板112上可以先制作驱动单元1012，也即制作TFT结构，TFT通常可以为栅极、源极、漏极、绝缘层以及层间电介质层组成的层结构。多个驱动单元1012间隔设置于基板112上，多个驱动单元1012可以呈阵列排布于基板112上。可以将间隔设置的多个驱动单元1012组成的层结构称为驱动层101。驱动单元1012用于驱动发光单元的发光，也即驱动单元1012可以为发光单元提供电信号或者扫描信号，以按预设程序控制发光单元的发光。
303、在驱动单元上设置阳极。
304、在阳极上设置发光部。
305、在发光部上设置阴极。
关于步骤303至305：
阳极102、发光部103和阴极104构成“三明治”结构，发光部103夹设于阳极102和阴极104之间，发光部103也可以称为像素单元。发光部103可以采用有机半导体材料，发光部103的发光是通过阳极102和阴极104的载流子的注入和复合而致发光的现象，发光强度与注入的电流成正比。发光部103也可以包括多个层结构，如空穴注入层、空穴传输层等。
需要说明的是，在显示面板10的截面上可以看出，阳极102、发光部103和阴极104的宽度不同，发光部103的宽度可以小于阳极102和阴极104的宽度，这是由于阳极102和阴极104不仅需要与发光部103连接，还需要与其他层结构电连接。比如，对于阳极102来说，阳极102还需要与驱动单元1012的源极连接，以使得驱动单元1012的电信号能够传输至发光单元。
需要说明的是，由于顶发射型OLED显示器件的阴极通常较薄，传输的阻抗较大，由此造成阴极的电压降较大，导致显示面板10或者显示装置1显示不均匀的现象。因此，本申请实施例通过对阴极104并联导电层来使阴极104两端的等效电阻减小，进而来减小阴极104传输的阻抗，降低阴极104存在的电压降，使得显示面板10或者显示装置1显示均匀性提高。
306、在阴极上设置封装层，封装层设置有多个过孔，以露出对应每一驱动单元的阴极。
由于阴极104为金属制成，为了防止阴极104暴露于外界被外界的水汽或者氧气干扰而丧失功能，可以在阴极104背离发光部103的一侧设置封装层105，封装层105覆盖阴极104。
需要说明的是，由于要将阴极104与导电层连接，以减小阴极104与导电层传输的阻抗，因此，需要露出一部分阴极104，这部分阴极104可以与导电层进行连接。示例的，可以在封装层105设置多个过孔1052，以露出对应每一驱动单元1012的阴极104。可以理解的是，每一驱动单元1012对应的阴极104上方的封装层105均可以设置一个过孔1052，过孔1052的数量可以与驱动单元1012的数量相同。并且，为了使阴极104与导电层的连接处厚度不影响发光部103的透过率，可以将过孔1052与发光部103错位设置。
307、在多个过孔内对应设置多个导电部。
多个过孔1052均设置于阴极104和导电层106之间，为了将阴极104与导电层106连接，可以在每个过孔1052内均设置导电部100。导电部100作为阴极104和导电层106的连接载体，在制备时，可以选择将导电部100与阴极104一体成型，或者选择将导电部100与导电层106一体成型，以便于简化制作工艺。
308、在封装层上设置导电层，导电层与每一阴极通过对应的过孔内的导电部连接，以使每一阴极与导电层并联。
导电层106可以理解为阴极104的辅助电极，也即为了减小阴极104传输的阻抗而额外增加的一层导电结构。导电层106可以由透明的氧化物材料制成，以防止导电层106对光透过率的影响。示例性的，导电层106的材料可以为ITO、IZO或者ITO与IZO材料的混合材料等。
导电层106设置于封装层105背离阴极104的一侧，导电层106与封装层105贴合，进而可以使导电层106与每一驱动单元1012对应的阴极104通过对应的过孔1052内的导电部100连接，从而将每一阴极104与导电层106并联连接，以减小阴极104两端的等效电阻，进而减小阴极104存在的电压降。
其中，导电层106的背离阴极104的一侧还可以设置盖板113，盖板113可以为玻璃盖板。盖板113与基板112以及盖板113与基板112之间的发光层和驱动层共同组成了显示面板10的屏结构。
需要说明的是，对于导电层106和盖板113与封装层105的连接可以通过下列两种方式进行。
第一种方式中，请接合图1至图5并参阅图6，图6为本申请实施例提供的显示面板的制备方法的第一种制备过程示意图。可以按照层层叠设的方式制作封装层105、导电层106和盖板113。也即是在步骤308之后，直接设置盖板113在导电层106上。示例性的，在封装层105上设置导电层106，导电部100可以与导电层106一体成型，导电层106可以部分填充于每一过孔1052内，以使得导电层106与每一阴极104通过对应的过孔1052的导电部100连接。在制备完成导电层106后，可以直接将盖板113盖设于导电层106，也即在导电层106上设置盖板113。
其中，在这种情况下，过孔1052内的导电部100与发光部103错位设置，以防止导电层106与阴极104连接处的厚度对发光部103的光透过率的影响。
第二种方式中，请结合图1至图6并参阅图7和图8，图7为本申请实施例提供的显示面板的制备方法的第二流程示意图，图8为本申请实施例提供的显示面板的制备方法的第二种制备过程示意图。分别制作阴极104和封装层105以及导电层106和盖板113，然后将带有导电层106的盖板113向封装层105贴合，并使导电层106与阴极104连接。示例性的，显示面板的制备方法还可以包括：
401、提供一基板。
可参照步骤301的说明，这里不再赘述。
402、在基板上设置第一金属部和第二金属部，第一金属部和第二金属部同层设置。
第一金属部109和第二金属部110均可以理解为在制作显示面板10时制作的第一层金属层，然后在第一金属部109上依次制作驱动单元和发光单元。
403、在第一金属部上设置驱动单元，并使第一金属部与驱动单元连接，多个驱动单元间隔设置，以形成驱动层。
第一金属部109设置于驱动单元1012背向发光部103的一侧，第一金属部109可以与驱动单元1012连接，以将扫描信号或者电信号传输至驱动单元1012。多个驱动单元1012形成驱动层101。
404、在驱动单元上设置阳极。
405、在阳极上设置发光部。
406、在发光部上设置阴极。
407、在阴极上设置封装层，封装层设置有多个过孔，以露出对应每一驱动单元的阴极。
408、在多个过孔内对应设置多个导电部。
步骤404至408可以参照步骤303至307的说明，这里不再赘述。
409、自封装层至驱动层开设通孔，且通孔与驱动单元错位设置，以露出第二金属部。
410、在第二金属部上设置导电金球。
关于步骤409和410：
为了增加阴极104和导电层的导电性，可以增加导电金球111。比如，可以自封装层105至驱动层101异于驱动单元1012的区域开设通孔，以露出第二金属部110。第二金属部110与第一金属部109同层且间隔设置，也即第二金属部110不与驱动单元1012对应，第二金属部110与驱动单元1012错位设置。然后在第二金属部110上设置导电金球111。导电金球111背离基板112的一端可以与封装层105背离驱动单元1012的上表面齐平。
411、提供一盖板。
412、在盖板上设置导电层。
413、将设置有导电层的盖板与封装层对组连接，使导电层与每一阴极通过对应的过孔内的导电部连接，并使导电层与导电金球连接。
关于步骤410至412：
需要说明的是，在阴极104和封装层105制作完成后，此时可以在盖板113上设置导电层106，然后将带有导电层106的盖板113翻转并与封装层105对组连接。对组连接可以理解为：导电层106与封装层105定位后进行贴合连接，以使得导电层106与露出的对应每一驱动单元1012的阴极104连接。此时导电部100可以与阴极104一体成型，进而可以简化显示面板10的制作工艺。
并且，此时可以同时将导电层106与导电金球111连接，导电金球111连接第二金属部110和导电层106。比如，在通电状态下，电流可以通过外围导电金球111流向导电层106，再传输至阴极104。导电金球111横跨驱动单元和发光单元，将第二金属部110与导电层106连接起来，从而可以由第二金属部110导入电流，并依次通过导电金球111和导电层106流向阴极104。示例性的，导电金球111可以仅设置于显示面板10的边缘位置。
其中，在这种情况下，可以将阴极104抬高，以使得阴极104可以与导电层106连接。在阳极102上设置发光部103之后，显示面板的制备方法还可以包括：
在阳极上设置阻挡层，阻挡层与发光部邻接。
阻挡层107设置于阳极102与阴极104之间，且与发光部103邻接。阻挡层107也可以称为黑矩阵或者遮光层，阻挡层107用于将阳极102与阴极104间隔开，且可以将不同发光单元之间的发光部103间隔开来，以防止发光部103之间的干扰。
在阻挡层上设置多个凸起部。
每一凸起部108设置于阴极104和阻挡层107之间，且多个凸起部108分别对应设置于多个过孔1052内。需要说明的是，导电部100与阴极104一体成型，也即阴极104的一部分设置于过孔1052内，凸起部108的设置可以将对应过孔1052的阴极104部分抬高，以便于阴极104与导电层106的连接。示例性的，阴极104与导电层106连接的上表面与封装层105朝向导电层106的上表面齐平。这样设置的阴极104，可以方便与导电层106的连接，在制作时，可以同时分别制作阴极104和导电层106，再将制作完成的导电层106扣向封装层105，以使得导电层106与阴极104连接。
在阻挡层、发光部和凸起部上设置阴极。在阴极上设置封装层，并对封装层对应多个凸起部的位置分别开设多个过孔。
阴极104覆盖阻挡层107的部分、覆盖发光部103且覆盖凸起部108。由于阴极104在不同区域的厚度是一致的，因此，阴极104对应发光部103的部分可以跟随发光部103而下凹一部分，这是由于发光部103与阴极104连接的上表面和阻挡层107与阴极104连接的上表面不齐平而造成的。阴极104对应凸起部108的部分被凸起部108抬高，且处于过孔1052内，当对应凸起部108的阴极104与导电层106连接的上表面和封装层105与导电层106连接的上表面齐平时，便可以将阴极104与导电层106进行连接。
需要说明的是，过孔1052的位置是根据凸起部108而设置的，因此，在制作时，通常是先制作凸起部108，再制作阴极104，然后再制作封装层105，此时过孔1052的位置就可以根据凸起的阴极104来开设。
需要说明的是，无论是第一种方式中直接将导电层106层叠设置于封装层105，还是第二种方式中将带有导电层106的盖板113与封装层105对组连接，均可以再设置其他导电结构来进一步增加阴极104的导电性。也即是说，对于导电金球111的设置，第一种方式中可以参照第二种方式的说明。换一种角度来说，显示面板的制备方法还可以包括：
在基板上设置第一金属部和第二金属部，第一金属部和第二金属部同层设置。第一金属部109和第二金属部110均可以理解为在制作显示面板10时制作的第一层金属层，然后在第一金属部109上依次制作驱动单元和发光单元。
在第一金属部上设置驱动单元，并使第一金属部与驱动单元连接。第一金属部109设置于驱动单元1012背向发光部103的一侧，第一金属部109可以与驱动单元1012连接，以将扫描信号或者电信号传输至驱动单元1012。
在第二金属部上设置导电金球，并使导电金球与导电层连接。第二金属部110与第一金属部109同层且间隔设置，也即第二金属部110不与驱动单元1012对应，第二金属部110与驱动单元1012错位设置。导电金球111连接第二金属部110和导电层106。比如，在通电状态下，电流可以通过外围导电金球111流向导电层106，再传输至阴极104。导电金球111横跨驱动单元和发光单元，将第二金属部110与导电层106连接起来，从而可以由第二金属部110导入电流，并依次通过导电金球111和导电层106流向阴极104。示例性的，导电金球111可以仅设置于显示面板10的边缘位置。
本申请实施例提供的显示面板10及其制备方法和显示装置1中，通过在封装层105远离阴极104的一侧设置导电层106，且导电层106与每一驱动单元1012对应的阴极104并联连接，可以减小阴极104两端等效电阻，相较于现有的仅设置较薄阴极的方案，本申请的阴极104和导电层106可以传输的阻抗更小，进而可以减小阴极104两端存在的电压降，提高显示装置1显示的均匀性。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见其他实施例的相关描述。
在本申请的描述中，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个特征。
以上对本申请实施例所提供的显示面板及其制备方法和显示装置进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种显示面板，其中，包括：
    驱动层，所述驱动层包括多个间隔设置的驱动单元；
    阳极，设置于所述驱动单元的一侧；
    发光部，设置于所述阳极背离所述驱动单元的一侧；
    阴极，设置于所述发光部背离所述驱动单元的一侧；
    封装层，设置于所述阴极背离所述驱动单元的一侧，所述封装层设置有多个过孔，以露出对应每一所述驱动单元的所述阴极；
    多个导电部，对应设置于多个所述过孔内；
    导电层，设置于所述封装层背离所述驱动单元的一侧，且所述导电层与每一所述阴极通过对应的所述过孔内的导电部连接，以使每一所述阴极与所述导电层并联。
  2. 根据权利要求1所述的显示面板，其中，所述显示面板还包括：
    阻挡层，设置于所述阳极和所述阴极之间，且与所述发光部邻接；
    多个凸起部，每一所述凸起部均设置于所述阴极和所述阻挡层之间，且多个所述凸起部分别对应设置于多个所述过孔内。
  3. 根据权利要求2所述的显示面板，其中，所述导电部与所述阴极一体成型，所述阴极与所述导电层连接的上表面与所述封装层朝向所述导电层的上表面齐平。
  4. 根据权利要求1所述的显示面板，其中，所述导电部与所述导电层一体成型，所述导电层的一部分设置在所述过孔内，并与所述阴极连接。
  5. 根据权利要求1所述的显示面板，其中，每一所述过孔内的导电部在所述导电层的正投影均与其相对应的所述发光部在所述导电层的正投影间隔。
  6. 根据权利要求5所述的显示面板，其中，所述导电层的透光率大于所述阴极的透光率。
  7. 根据权利要求6所述的显示面板，其中，所述导电层的材料为氧化铟锡或氧化铟锌。
  8. 根据权利要求7所述的显示面板，其中，所述显示面板还包括：
    第一金属部，设置于所述驱动单元远离所述发光部的一侧，且所述第一金属部与所述驱动单元连接；
    第二金属部，与所述第一金属部同层且间隔设置；
    导电金球，连接所述第二金属部和所述导电层。
  9. 根据权利要求8所述的显示面板，其中，所述导电金球设置于所述显示面板的边缘位置。
  10. 根据权利要求8所述的显示面板，其中，所述导电金球与所述发光部之间设置有吸气剂和阻挡部，以将所述导电金球与所述发光部间隔开。
  11. 一种显示面板的制备方法，其中，包括：
    提供一基板；
    在所述基板上设置多个间隔的驱动单元，以形成驱动层；
    在所述驱动单元上设置阳极；
    在所述阳极上设置发光部；
    在所述发光部上设置阴极；
    在所述阴极上设置封装层，所述封装层设置有多个过孔，以露出所述对应每一所述驱动单元的所述阴极；
    在多个所述过孔内对应设置多个导电部；
    在所述封装层上设置导电层，所述导电层与每一所述阴极通过对应的所述过孔内的导电部连接，以使每一所述阴极与所述导电层并联。
  12. 根据权利要求11所述的制备方法，其中，所述在所述封装层上设置导电层，所述导电层与每一所述阴极通过对应的所述过孔内的导电部连接，以使每一所述阴极与所述导电层并联，包括：
    提供一盖板；
    在所述盖板上设置导电层；
    将设置有所述导电层的盖板与所述封装层对组连接，并使所述导电层与每一所述阴极通过对应的所述过孔内的导电部连接。
  13. 根据权利要求12所述的制备方法，其中，所述在所述阳极上设置发光部之后，所述制备方法还包括：
    在所述阳极上设置阻挡层，所述阻挡层与所述发光部邻接；
    在所述阻挡层上设置多个凸起部；
    在所述阻挡层、所述发光部和所述凸起部上设置阴极，所述导电部与所述阴极一体成型；
    在所述阴极上设置封装层，并对所述封装层对应多个所述凸起部的位置分别开设多个过孔，以露出所述阴极。
  14. 根据权利要求11所述的制备方法，其中，所述在所述封装层上设置导电层，所述导电层与每一所述阴极通过所述过孔内的导电部连接，以使每一所述阴极与所述导电层并联，所述制备方法还包括：
    所述导电部与所述导电层一体成型，所述导电层的一部分设置在所述过孔内，并与所述阴极连接；
    在所述导电层背离所述封装层的一侧设置盖板。
  15. 根据权利要求11所述的制备方法，其中，所述制备方法还包括：
    在所述基板上设置第一金属部和第二金属部，所述第一金属部和所述第二金属部同层设置；
    在所述第一金属部上设置所述驱动单元，并使所述第一金属部与所述驱动单元连接；
    在所述第二金属部上设置导电金球，并使所述导电金球与所述导电层连接。
  16. 一种显示装置，其中，包括：
    显示面板，包括：
    驱动层，所述驱动层包括多个间隔设置的驱动单元；
    阳极，设置于所述驱动单元的一侧；
    发光部，设置于所述阳极背离所述驱动单元的一侧；
    阴极，设置于所述发光部背离所述驱动单元的一侧；
    封装层，设置于所述阴极背离所述驱动单元的一侧，所述封装层设置有多个过孔，以露出对应每一所述驱动单元的所述阴极；
    多个导电部，对应设置于多个所述过孔内；
    导电层，设置于所述封装层背离所述驱动单元的一侧，且所述导电层与每一所述阴极通过对应的所述过孔内的导电部连接，以使每一所述阴极与所述导电层并联；
    壳体，所述壳体用于承载所述显示面板。
  17. 根据权利要求16所述的显示装置，其中，所述显示面板还包括：
    阻挡层，设置于所述阳极和所述阴极之间，且与所述发光部邻接；
    多个凸起部，每一所述凸起部均设置于所述阴极和所述阻挡层之间，且多个所述凸起部分别对应设置于多个所述过孔内。
  18. 根据权利要求17所述的显示装置，其中，所述导电部与所述阴极一体成型，所述阴极与所述导电层连接的上表面与所述封装层朝向所述导电层的上表面齐平。
  19. 根据权利要求16所述的显示装置，其中，所述导电部与所述导电层一体成型，所述导电层的一部分设置在所述过孔内，并与所述阴极连接。
  20. 根据权利要求16所述的显示装置，其中，每一所述过孔内的导电部在所述导电层的正投影均与其相对应的所述发光部在所述导电层的正投影间隔。
PCT/CN2022/077966 2022-02-17 2022-02-25 显示面板及其制备方法和显示装置 WO2023155232A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US17/762,035 US20240147784A1 (en) 2022-02-17 2022-02-25 Display panel, method of manufacturing the same, and display device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202210146994.2 2022-02-17
CN202210146994.2A CN114628472B (zh) 2022-02-17 2022-02-17 显示面板及其制备方法和显示装置

Publications (1)

Publication Number Publication Date
WO2023155232A1 true WO2023155232A1 (zh) 2023-08-24

Family

ID=81899887

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/077966 WO2023155232A1 (zh) 2022-02-17 2022-02-25 显示面板及其制备方法和显示装置

Country Status (3)

Country Link
US (1) US20240147784A1 (zh)
CN (1) CN114628472B (zh)
WO (1) WO2023155232A1 (zh)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060273712A1 (en) * 2005-05-13 2006-12-07 Fuji Photo Film Co., Ltd. Organic electroluminescence display apparatus
JP2007095518A (ja) * 2005-09-29 2007-04-12 Toppan Printing Co Ltd 有機エレクトロルミネッセンス表示装置
US20070108899A1 (en) * 2005-11-15 2007-05-17 Samsung Electronics Co., Ltd Display device and fabricating method thereof
CN101728419A (zh) * 2008-10-17 2010-06-09 三星移动显示器株式会社 有机发光显示器
CN109742260A (zh) * 2019-01-09 2019-05-10 京东方科技集团股份有限公司 显示基板及其制备方法、显示装置
CN110061151A (zh) * 2019-05-17 2019-07-26 京东方科技集团股份有限公司 一种有机发光二极管面板及其制作方法和显示设备
CN112786805A (zh) * 2021-01-08 2021-05-11 深圳市华星光电半导体显示技术有限公司 Oled显示装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102119453B1 (ko) * 2013-12-18 2020-06-05 엘지디스플레이 주식회사 유기발광표시장치

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060273712A1 (en) * 2005-05-13 2006-12-07 Fuji Photo Film Co., Ltd. Organic electroluminescence display apparatus
JP2007095518A (ja) * 2005-09-29 2007-04-12 Toppan Printing Co Ltd 有機エレクトロルミネッセンス表示装置
US20070108899A1 (en) * 2005-11-15 2007-05-17 Samsung Electronics Co., Ltd Display device and fabricating method thereof
CN101728419A (zh) * 2008-10-17 2010-06-09 三星移动显示器株式会社 有机发光显示器
CN109742260A (zh) * 2019-01-09 2019-05-10 京东方科技集团股份有限公司 显示基板及其制备方法、显示装置
CN110061151A (zh) * 2019-05-17 2019-07-26 京东方科技集团股份有限公司 一种有机发光二极管面板及其制作方法和显示设备
CN112786805A (zh) * 2021-01-08 2021-05-11 深圳市华星光电半导体显示技术有限公司 Oled显示装置

Also Published As

Publication number Publication date
CN114628472B (zh) 2024-02-09
CN114628472A (zh) 2022-06-14
US20240147784A1 (en) 2024-05-02

Similar Documents

Publication Publication Date Title
CN109698224B (zh) 显示基板及其制造方法和显示面板
WO2021078175A1 (zh) 显示基板及其制备方法、显示面板
US11165038B2 (en) Display module and electronic device with auxiliary electrode layer on cathode layer
CN111863903B (zh) 显示面板及其制作方法、显示装置
CN110098235B (zh) 显示面板及其制作方法
US11404488B2 (en) Transparent display panel and display device
KR20120066353A (ko) 유기 발광 표시 장치
CN114171563B (zh) 显示面板和显示装置
US11296181B2 (en) Display panel packaging method
CN111540771A (zh) Oled阵列基板、显示面板及显示装置
WO2021121095A1 (zh) 阵列基板、显示面板及显示装置
CN111863892B (zh) 显示装置及其制备方法
CN107978691A (zh) 有机发光显示面板、显示装置及显示面板的制作方法
KR20120066350A (ko) 유기 발광 표시 장치
WO2023065433A1 (zh) 显示面板及显示装置
CN114220821B (zh) 显示面板
CN116600612B (zh) 显示面板、显示装置及显示面板的制备方法
CN111081721A (zh) 显示面板及显示装置
WO2023155232A1 (zh) 显示面板及其制备方法和显示装置
CN115835677A (zh) 显示基板及显示装置
CN113964139A (zh) 显示模组及其制备方法
CN113629121A (zh) 显示面板、显示装置及显示面板的制备方法
CN219499935U (zh) 显示面板及电子设备
CN213958991U (zh) 封装基板和显示面板
WO2023159456A1 (zh) 显示装置及显示面板

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 17762035

Country of ref document: US