WO2023149213A1 - 粘着テープ、粘着テープを用いて得られる物品及び物品の解体方法 - Google Patents

粘着テープ、粘着テープを用いて得られる物品及び物品の解体方法 Download PDF

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Publication number
WO2023149213A1
WO2023149213A1 PCT/JP2023/001428 JP2023001428W WO2023149213A1 WO 2023149213 A1 WO2023149213 A1 WO 2023149213A1 JP 2023001428 W JP2023001428 W JP 2023001428W WO 2023149213 A1 WO2023149213 A1 WO 2023149213A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
adhesive tape
foam
pressure
sensitive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/001428
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
健一 藤崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
DIC Corp
Dainippon Ink and Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DIC Corp, Dainippon Ink and Chemicals Co Ltd filed Critical DIC Corp
Priority to CN202380015281.5A priority Critical patent/CN118414393A/zh
Priority to JP2023561055A priority patent/JP7464203B2/ja
Priority to US18/730,545 priority patent/US20250084283A1/en
Priority to KR1020247023953A priority patent/KR20240122542A/ko
Publication of WO2023149213A1 publication Critical patent/WO2023149213A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J135/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least another carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J135/02—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/26—Porous or cellular plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/262—Alkali metal carbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
    • C08K2003/3045—Sulfates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/33—Applications of adhesives in processes or use of adhesives in the form of films or foils for batteries or fuel cells
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/24—Presence of a foam
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2425/00—Presence of styrenic polymer
    • C09J2425/005—Presence of styrenic polymer in the release coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/62—Plastics recycling; Rubber recycling

Definitions

  • thermoplastic resins include urethane-based resins; polycarbonate; vinyl chloride-based resins such as polyvinyl chloride and vinyl chloride-vinyl acetate copolymer resins; Acrylic resins such as polyethyl methacrylate; polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polytrimethylene terephthalate, polyethylene naphthalate, and polybutylene naphthalate; polyamide resins; polystyrene, imide-modified polystyrene, acrylonitrile-butadiene- Polystyrene resins such as styrene copolymer resins (ABS resins), imide-modified ABS resins, styrene/acrylonitrile copolymer resins, acrylonitrile/ethylene/propylene/diene/styrene copolymer resins, cellulose resins such as nitrocellulose and cellulose acetate; silicone-
  • the thickness of the easily dismantling layer (A) is preferably 5 ⁇ m to 80 ⁇ m, more preferably 5 ⁇ m to 60 ⁇ m, even more preferably 10 ⁇ m to 20 ⁇ m.
  • the thickness of the easy-to-dismantle layer (A) means the average value obtained by measuring the thickness at five randomly selected locations.
  • the easy-to-dismantle layer (A) may further contain the above heat-absorbing agent and other additives in addition to the thermoplastic resin.
  • the ratio of the average cell diameter in the flow direction to the average cell diameter in the thickness direction is preferably 1 or more, more preferably 3 or more. , 4 to 25 are more preferred.
  • the pressure-sensitive adhesive tape has excellent flexibility in the thickness direction, and even when a rigid body is used as the adherend, the adhesion is further improved.
  • a foam base material when producing a foam base material by chemical foaming, for example, a polyolefin resin containing 40% by weight or more of a polyethylene resin, a thermal decomposition type foaming agent, a foaming aid, a coloring agent, and, if necessary, further A step of producing a polyolefin resin sheet by supplying a polyolefin resin composition containing other components to an extruder, melt-kneading it, and extruding it into a sheet form from the extruder; and foaming a decomposable foaming agent. If necessary, as described later, the step of cross-linking the polyolefin resin sheet, or melting or softening the obtained foamed sheet and stretching it in either or both of the machine direction and the width direction. A step of stretching the foam sheet may be included.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
PCT/JP2023/001428 2022-02-04 2023-01-19 粘着テープ、粘着テープを用いて得られる物品及び物品の解体方法 Ceased WO2023149213A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN202380015281.5A CN118414393A (zh) 2022-02-04 2023-01-19 粘着带、使用粘着带得到的物品及物品解体方法
JP2023561055A JP7464203B2 (ja) 2022-02-04 2023-01-19 粘着テープ、粘着テープを用いて得られる物品及び物品の解体方法
US18/730,545 US20250084283A1 (en) 2022-02-04 2023-01-19 Adhesive tape, article obtained using adhesive tape, and method for dismantling articles
KR1020247023953A KR20240122542A (ko) 2022-02-04 2023-01-19 점착 테이프, 점착 테이프를 이용하여 얻어지는 물품 및 물품의 해체 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022016443 2022-02-04
JP2022-016443 2022-02-04

Publications (1)

Publication Number Publication Date
WO2023149213A1 true WO2023149213A1 (ja) 2023-08-10

Family

ID=87552044

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2023/001428 Ceased WO2023149213A1 (ja) 2022-02-04 2023-01-19 粘着テープ、粘着テープを用いて得られる物品及び物品の解体方法

Country Status (5)

Country Link
US (1) US20250084283A1 (https=)
JP (1) JP7464203B2 (https=)
KR (1) KR20240122542A (https=)
CN (1) CN118414393A (https=)
WO (1) WO2023149213A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026009265A1 (ja) * 2024-07-01 2026-01-08 三菱電機株式会社 接着構造体およびそれを用いた接着方法
WO2026042615A1 (ja) * 2024-08-23 2026-02-26 日東電工株式会社 シール材、シール構造、及び粘着シート

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004123943A (ja) * 2002-10-03 2004-04-22 Aica Kogyo Co Ltd 易解体性接着パネル用水性接着剤組成物
JP2012126879A (ja) * 2010-06-10 2012-07-05 Osaka City Univ 易解体性粘着剤組成物及び易解体性粘着テープ
JP2016074813A (ja) * 2014-10-06 2016-05-12 Dic株式会社 両面粘着テープ、両面粘着テープの製造方法、接着方法及び分離方法
JP2016079361A (ja) * 2014-10-22 2016-05-16 Dic株式会社 粘着テープ、粘着テープを用いて得られる物品及び物品の解体方法
JP2017119438A (ja) * 2014-11-13 2017-07-06 Dic株式会社 両面粘着テープ、物品及び分離方法
JP7005089B1 (ja) * 2020-07-08 2022-01-21 国立大学法人九州大学 易解体性接着材料、硬化体、物品および解体方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI302561B (en) 2004-01-28 2008-11-01 Lg Chemical Ltd Releasable adhesive composition
DE102006043259A1 (de) * 2006-09-11 2008-06-19 Tesa Ag Verfahren zur Herstellung eines doppelseitigen Haftklebebandes und seine Verwendung
JP5556987B2 (ja) 2009-04-09 2014-07-23 Ｄｉｃ株式会社 両面粘着テープ
JP2013079322A (ja) 2011-10-04 2013-05-02 Nitto Denko Corp 加熱発泡型再剥離性粘着テープ又はシート、及び剥離方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004123943A (ja) * 2002-10-03 2004-04-22 Aica Kogyo Co Ltd 易解体性接着パネル用水性接着剤組成物
JP2012126879A (ja) * 2010-06-10 2012-07-05 Osaka City Univ 易解体性粘着剤組成物及び易解体性粘着テープ
JP2016074813A (ja) * 2014-10-06 2016-05-12 Dic株式会社 両面粘着テープ、両面粘着テープの製造方法、接着方法及び分離方法
JP2016079361A (ja) * 2014-10-22 2016-05-16 Dic株式会社 粘着テープ、粘着テープを用いて得られる物品及び物品の解体方法
JP2017119438A (ja) * 2014-11-13 2017-07-06 Dic株式会社 両面粘着テープ、物品及び分離方法
JP7005089B1 (ja) * 2020-07-08 2022-01-21 国立大学法人九州大学 易解体性接着材料、硬化体、物品および解体方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026009265A1 (ja) * 2024-07-01 2026-01-08 三菱電機株式会社 接着構造体およびそれを用いた接着方法
JP7825787B1 (ja) * 2024-07-01 2026-03-06 三菱電機株式会社 接着構造体およびそれを用いた接着方法
WO2026042615A1 (ja) * 2024-08-23 2026-02-26 日東電工株式会社 シール材、シール構造、及び粘着シート

Also Published As

Publication number Publication date
KR20240122542A (ko) 2024-08-12
JP7464203B2 (ja) 2024-04-09
US20250084283A1 (en) 2025-03-13
CN118414393A (zh) 2024-07-30
JPWO2023149213A1 (https=) 2023-08-10

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