WO2023144928A1 - Composition de résine de polycarbonate, produit moulé et procédé de production d'une composition de résine de polycarbonate - Google Patents
Composition de résine de polycarbonate, produit moulé et procédé de production d'une composition de résine de polycarbonate Download PDFInfo
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- WO2023144928A1 WO2023144928A1 PCT/JP2022/002888 JP2022002888W WO2023144928A1 WO 2023144928 A1 WO2023144928 A1 WO 2023144928A1 JP 2022002888 W JP2022002888 W JP 2022002888W WO 2023144928 A1 WO2023144928 A1 WO 2023144928A1
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- WIPO (PCT)
- Prior art keywords
- polycarbonate resin
- resin composition
- compound
- donor
- weight
- Prior art date
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- 239000004431 polycarbonate resin Substances 0.000 title claims abstract description 77
- 229920005668 polycarbonate resin Polymers 0.000 title claims abstract description 77
- 239000000203 mixture Substances 0.000 title claims abstract description 49
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 150000001875 compounds Chemical class 0.000 claims abstract description 72
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 35
- 239000002608 ionic liquid Substances 0.000 claims abstract description 30
- 150000004714 phosphonium salts Chemical class 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims description 26
- 239000000126 substance Substances 0.000 claims description 16
- 238000002834 transmittance Methods 0.000 claims description 14
- 238000004898 kneading Methods 0.000 claims description 10
- ZXMGHDIOOHOAAE-UHFFFAOYSA-N 1,1,1-trifluoro-n-(trifluoromethylsulfonyl)methanesulfonamide Chemical compound FC(F)(F)S(=O)(=O)NS(=O)(=O)C(F)(F)F ZXMGHDIOOHOAAE-UHFFFAOYSA-N 0.000 claims description 6
- VBVCYAZECWLFHP-UHFFFAOYSA-N dodecyl benzenesulfonate;tetrabutylphosphanium Chemical compound CCCC[P+](CCCC)(CCCC)CCCC.CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 VBVCYAZECWLFHP-UHFFFAOYSA-N 0.000 claims description 6
- SNDRYHUSDCHSDJ-UHFFFAOYSA-N tributyl(dodecyl)phosphanium Chemical compound CCCCCCCCCCCC[P+](CCCC)(CCCC)CCCC SNDRYHUSDCHSDJ-UHFFFAOYSA-N 0.000 claims description 6
- ABJGUZZWSKMTEI-UHFFFAOYSA-M tributyl(dodecyl)phosphanium;bromide Chemical compound [Br-].CCCCCCCCCCCC[P+](CCCC)(CCCC)CCCC ABJGUZZWSKMTEI-UHFFFAOYSA-M 0.000 claims description 6
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 125000003118 aryl group Chemical group 0.000 claims description 3
- 125000003545 alkoxy group Chemical group 0.000 claims description 2
- 125000004104 aryloxy group Chemical group 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 239000000428 dust Substances 0.000 description 50
- 239000002216 antistatic agent Substances 0.000 description 22
- -1 sulfonimide anions Chemical class 0.000 description 22
- 230000000052 comparative effect Effects 0.000 description 16
- 238000012360 testing method Methods 0.000 description 15
- 230000002209 hydrophobic effect Effects 0.000 description 13
- 238000011156 evaluation Methods 0.000 description 12
- 238000000465 moulding Methods 0.000 description 12
- 229920002545 silicone oil Polymers 0.000 description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 9
- 230000002265 prevention Effects 0.000 description 9
- 239000003063 flame retardant Substances 0.000 description 8
- 239000004611 light stabiliser Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- 235000014113 dietary fatty acids Nutrition 0.000 description 6
- 239000000194 fatty acid Substances 0.000 description 6
- 229930195729 fatty acid Natural products 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerol Natural products OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 5
- 239000003963 antioxidant agent Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 235000011187 glycerol Nutrition 0.000 description 5
- 229920000515 polycarbonate Polymers 0.000 description 5
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 5
- 229920002614 Polyether block amide Polymers 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000003381 stabilizer Substances 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- 239000004420 Iupilon Substances 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 239000004721 Polyphenylene oxide Chemical group 0.000 description 3
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 3
- 238000007792 addition Methods 0.000 description 3
- 230000003373 anti-fouling effect Effects 0.000 description 3
- 238000000071 blow moulding Methods 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 229920006351 engineering plastic Polymers 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 230000007062 hydrolysis Effects 0.000 description 3
- 238000006460 hydrolysis reaction Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000013508 migration Methods 0.000 description 3
- 230000005012 migration Effects 0.000 description 3
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000570 polyether Chemical group 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- ROIDZKBDWLTGBW-UHFFFAOYSA-N 1,2,2,5,6-pentamethylpiperidin-4-ol Chemical compound CN1C(CC(C(C1C)C)O)(C)C ROIDZKBDWLTGBW-UHFFFAOYSA-N 0.000 description 2
- LOMJGCFEVIUZMW-UHFFFAOYSA-N 1,3,7,9-tetratert-butyl-11-(2-ethylhexoxy)-5h-benzo[d][1,3,2]benzodioxaphosphocine Chemical compound C1C2=CC(C(C)(C)C)=CC(C(C)(C)C)=C2OP(OCC(CC)CCCC)OC2=C1C=C(C(C)(C)C)C=C2C(C)(C)C LOMJGCFEVIUZMW-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- IYAZLDLPUNDVAG-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4-(2,4,4-trimethylpentan-2-yl)phenol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 IYAZLDLPUNDVAG-UHFFFAOYSA-N 0.000 description 2
- VVBVFVRWEMORTQ-UHFFFAOYSA-N 2-[4-(4,6-diphenyl-1,3,5-triazin-2-yl)-3-hydroxyphenoxy]ethyl 2-ethylhexanoate Chemical compound OC1=CC(OCCOC(=O)C(CC)CCCC)=CC=C1C1=NC(C=2C=CC=CC=2)=NC(C=2C=CC=CC=2)=N1 VVBVFVRWEMORTQ-UHFFFAOYSA-N 0.000 description 2
- RLHGFJMGWQXPBW-UHFFFAOYSA-N 2-hydroxy-3-(1h-imidazol-5-ylmethyl)benzamide Chemical compound NC(=O)C1=CC=CC(CC=2NC=NC=2)=C1O RLHGFJMGWQXPBW-UHFFFAOYSA-N 0.000 description 2
- NZGQHKSLKRFZFL-UHFFFAOYSA-N 4-(4-hydroxyphenoxy)phenol Chemical compound C1=CC(O)=CC=C1OC1=CC=C(O)C=C1 NZGQHKSLKRFZFL-UHFFFAOYSA-N 0.000 description 2
- DFANMEUHPMJFDO-UHFFFAOYSA-N 6-[4,6-bis(4-hexoxy-2-hydroxy-3-methylphenyl)-1,3,5-triazin-2-yl]-3-hexoxy-2-methylphenol Chemical compound OC1=C(C)C(OCCCCCC)=CC=C1C1=NC(C=2C(=C(C)C(OCCCCCC)=CC=2)O)=NC(C=2C(=C(C)C(OCCCCCC)=CC=2)O)=N1 DFANMEUHPMJFDO-UHFFFAOYSA-N 0.000 description 2
- FBYQNWXFWALIKJ-UHFFFAOYSA-N C1(=CC=CC=C1)C(CCCCCCCCCP(O)(O)O)C1=CC=CC=C1 Chemical compound C1(=CC=CC=C1)C(CCCCCCCCCP(O)(O)O)C1=CC=CC=C1 FBYQNWXFWALIKJ-UHFFFAOYSA-N 0.000 description 2
- DXGXNGNCPNFUQI-UHFFFAOYSA-N CCCCC(CC)C(C1=CC=CC=C1)(C1=CC=CC=C1)P(O)(O)O Chemical compound CCCCC(CC)C(C1=CC=CC=C1)(C1=CC=CC=C1)P(O)(O)O DXGXNGNCPNFUQI-UHFFFAOYSA-N 0.000 description 2
- OAAPJLMVZWDEJE-UHFFFAOYSA-N CCCCC[P+](CC)(CC)CC.FC(F)(F)S(=O)(=O)[N-]S(=O)(=O)C(F)(F)F Chemical compound CCCCC[P+](CC)(CC)CC.FC(F)(F)S(=O)(=O)[N-]S(=O)(=O)C(F)(F)F OAAPJLMVZWDEJE-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 238000012696 Interfacial polycondensation Methods 0.000 description 2
- 239000004419 Panlite Substances 0.000 description 2
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 2
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- CGRTZESQZZGAAU-UHFFFAOYSA-N [2-[3-[1-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]-2-methylpropan-2-yl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]-2-methylpropyl] 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCC(C)(C)C2OCC3(CO2)COC(OC3)C(C)(C)COC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 CGRTZESQZZGAAU-UHFFFAOYSA-N 0.000 description 2
- VSVVZZQIUJXYQA-UHFFFAOYSA-N [3-(3-dodecylsulfanylpropanoyloxy)-2,2-bis(3-dodecylsulfanylpropanoyloxymethyl)propyl] 3-dodecylsulfanylpropanoate Chemical compound CCCCCCCCCCCCSCCC(=O)OCC(COC(=O)CCSCCCCCCCCCCCC)(COC(=O)CCSCCCCCCCCCCCC)COC(=O)CCSCCCCCCCCCCCC VSVVZZQIUJXYQA-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- VGANZAMOUWXNNY-UHFFFAOYSA-N bis(trifluoromethylsulfonyl)azanide triethyl(octyl)phosphanium Chemical compound CCCCCCCC[P+](CC)(CC)CC.FC(F)(F)S(=O)(=O)[N-]S(=O)(=O)C(F)(F)F VGANZAMOUWXNNY-UHFFFAOYSA-N 0.000 description 2
- YJPDLBMZLGTDRZ-UHFFFAOYSA-N bis(trifluoromethylsulfonyl)azanide;tributyl(methyl)phosphanium Chemical compound CCCC[P+](C)(CCCC)CCCC.FC(F)(F)S(=O)(=O)[N-]S(=O)(=O)C(F)(F)F YJPDLBMZLGTDRZ-UHFFFAOYSA-N 0.000 description 2
- HYNYWFRJHNNLJA-UHFFFAOYSA-N bis(trifluoromethylsulfonyl)azanide;trihexyl(tetradecyl)phosphanium Chemical compound FC(F)(F)S(=O)(=O)[N-]S(=O)(=O)C(F)(F)F.CCCCCCCCCCCCCC[P+](CCCCCC)(CCCCCC)CCCCCC HYNYWFRJHNNLJA-UHFFFAOYSA-N 0.000 description 2
- FQUNFJULCYSSOP-UHFFFAOYSA-N bisoctrizole Chemical compound N1=C2C=CC=CC2=NN1C1=CC(C(C)(C)CC(C)(C)C)=CC(CC=2C(=C(C=C(C=2)C(C)(C)CC(C)(C)C)N2N=C3C=CC=CC3=N2)O)=C1O FQUNFJULCYSSOP-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000012760 heat stabilizer Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 238000005453 pelletization Methods 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 159000000000 sodium salts Chemical class 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 238000005809 transesterification reaction Methods 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- 238000004383 yellowing Methods 0.000 description 2
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- DEIGXXQKDWULML-UHFFFAOYSA-N 1,2,5,6,9,10-hexabromocyclododecane Chemical compound BrC1CCC(Br)C(Br)CCC(Br)C(Br)CCC1Br DEIGXXQKDWULML-UHFFFAOYSA-N 0.000 description 1
- QNJUJUHEBJQOHY-UHFFFAOYSA-N 1,3-dibromo-5-[3,5-dibromo-4-(3,3-dibromopropoxy)phenyl]sulfonyl-2-(3,3-dibromopropoxy)benzene Chemical compound C1=C(Br)C(OCCC(Br)Br)=C(Br)C=C1S(=O)(=O)C1=CC(Br)=C(OCCC(Br)Br)C(Br)=C1 QNJUJUHEBJQOHY-UHFFFAOYSA-N 0.000 description 1
- QSRJVOOOWGXUDY-UHFFFAOYSA-N 2-[2-[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCCOCCOCCOC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QSRJVOOOWGXUDY-UHFFFAOYSA-N 0.000 description 1
- BPZIYBJCZRUDEG-UHFFFAOYSA-N 2-[3-(1-hydroxy-2-methylpropan-2-yl)-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]-2-methylpropan-1-ol Chemical compound C1OC(C(C)(CO)C)OCC21COC(C(C)(C)CO)OC2 BPZIYBJCZRUDEG-UHFFFAOYSA-N 0.000 description 1
- AIBRSVLEQRWAEG-UHFFFAOYSA-N 3,9-bis(2,4-ditert-butylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP1OCC2(COP(OC=3C(=CC(=CC=3)C(C)(C)C)C(C)(C)C)OC2)CO1 AIBRSVLEQRWAEG-UHFFFAOYSA-N 0.000 description 1
- PZRWFKGUFWPFID-UHFFFAOYSA-N 3,9-dioctadecoxy-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound C1OP(OCCCCCCCCCCCCCCCCCC)OCC21COP(OCCCCCCCCCCCCCCCCCC)OC2 PZRWFKGUFWPFID-UHFFFAOYSA-N 0.000 description 1
- RXNYJUSEXLAVNQ-UHFFFAOYSA-N 4,4'-Dihydroxybenzophenone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1 RXNYJUSEXLAVNQ-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- VWGKEVWFBOUAND-UHFFFAOYSA-N 4,4'-thiodiphenol Chemical compound C1=CC(O)=CC=C1SC1=CC=C(O)C=C1 VWGKEVWFBOUAND-UHFFFAOYSA-N 0.000 description 1
- RQCACQIALULDSK-UHFFFAOYSA-N 4-(4-hydroxyphenyl)sulfinylphenol Chemical compound C1=CC(O)=CC=C1S(=O)C1=CC=C(O)C=C1 RQCACQIALULDSK-UHFFFAOYSA-N 0.000 description 1
- ODJUOZPKKHIEOZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3,5-dimethylphenyl)propan-2-yl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=C(C)C=2)=C1 ODJUOZPKKHIEOZ-UHFFFAOYSA-N 0.000 description 1
- NMLSKYOPDGYLLU-UHFFFAOYSA-N 4-[[2,3-bis[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]phenyl]methyl]-2,6-ditert-butylphenol Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CC=2C(=C(CC=3C=C(C(O)=C(C=3)C(C)(C)C)C(C)(C)C)C=CC=2)CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 NMLSKYOPDGYLLU-UHFFFAOYSA-N 0.000 description 1
- 101710179738 6,7-dimethyl-8-ribityllumazine synthase 1 Proteins 0.000 description 1
- 101710179734 6,7-dimethyl-8-ribityllumazine synthase 2 Proteins 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- CKFNNTJWWQATDE-UHFFFAOYSA-N CC(C)(C1=CC=CC=C1)C(C(C(C)(C)C1=CC=CC=C1)=C(C1=C2N=NN1)O)=C2C1=CC=CC=C1 Chemical compound CC(C)(C1=CC=CC=C1)C(C(C(C)(C)C1=CC=CC=C1)=C(C1=C2N=NN1)O)=C2C1=CC=CC=C1 CKFNNTJWWQATDE-UHFFFAOYSA-N 0.000 description 1
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 1
- 229920004142 LEXAN™ Polymers 0.000 description 1
- 239000004418 Lexan Substances 0.000 description 1
- 101710186608 Lipoyl synthase 1 Proteins 0.000 description 1
- 101710137584 Lipoyl synthase 1, chloroplastic Proteins 0.000 description 1
- 101710090391 Lipoyl synthase 1, mitochondrial Proteins 0.000 description 1
- 101710186609 Lipoyl synthase 2 Proteins 0.000 description 1
- 101710122908 Lipoyl synthase 2, chloroplastic Proteins 0.000 description 1
- 101710101072 Lipoyl synthase 2, mitochondrial Proteins 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 241001483078 Phyto Species 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical class C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical class C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 1
- ZEFSGHVBJCEKAZ-UHFFFAOYSA-N bis(2,4-ditert-butyl-6-methylphenyl) ethyl phosphite Chemical compound CC=1C=C(C(C)(C)C)C=C(C(C)(C)C)C=1OP(OCC)OC1=C(C)C=C(C(C)(C)C)C=C1C(C)(C)C ZEFSGHVBJCEKAZ-UHFFFAOYSA-N 0.000 description 1
- NOFBAVDIGCEKOQ-UHFFFAOYSA-N bis(trifluoromethylsulfonyl)azanide;1-butyl-3-methylpyridin-1-ium Chemical compound CCCC[N+]1=CC=CC(C)=C1.FC(F)(F)S(=O)(=O)[N-]S(=O)(=O)C(F)(F)F NOFBAVDIGCEKOQ-UHFFFAOYSA-N 0.000 description 1
- XALVHDZWUBSWES-UHFFFAOYSA-N bis(trifluoromethylsulfonyl)azanide;tributyl(methyl)azanium Chemical compound CCCC[N+](C)(CCCC)CCCC.FC(F)(F)S(=O)(=O)[N-]S(=O)(=O)C(F)(F)F XALVHDZWUBSWES-UHFFFAOYSA-N 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- OCWYEMOEOGEQAN-UHFFFAOYSA-N bumetrizole Chemical compound CC(C)(C)C1=CC(C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O OCWYEMOEOGEQAN-UHFFFAOYSA-N 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 150000001924 cycloalkanes Chemical class 0.000 description 1
- 229940105990 diglycerin Drugs 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 150000002009 diols Chemical group 0.000 description 1
- KUMNEOGIHFCNQW-UHFFFAOYSA-N diphenyl phosphite Chemical compound C=1C=CC=CC=1OP([O-])OC1=CC=CC=C1 KUMNEOGIHFCNQW-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- PWWSSIYVTQUJQQ-UHFFFAOYSA-N distearyl thiodipropionate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCCCCCC PWWSSIYVTQUJQQ-UHFFFAOYSA-N 0.000 description 1
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000010101 extrusion blow moulding Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 125000003709 fluoroalkyl group Chemical group 0.000 description 1
- 238000010097 foam moulding Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 150000004693 imidazolium salts Chemical class 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- RKISUIUJZGSLEV-UHFFFAOYSA-N n-[2-(octadecanoylamino)ethyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCCNC(=O)CCCCCCCCCCCCCCCCC RKISUIUJZGSLEV-UHFFFAOYSA-N 0.000 description 1
- CSWFWSPPZMEYAY-UHFFFAOYSA-N octadecyl dihydrogen phosphite Chemical compound CCCCCCCCCCCCCCCCCCOP(O)O CSWFWSPPZMEYAY-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-O phosphonium Chemical compound [PH4+] XYFCBTPGUUZFHI-UHFFFAOYSA-O 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003216 poly(methylphenylsiloxane) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000001175 rotational moulding Methods 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- WUPCFMITFBVJMS-UHFFFAOYSA-N tetrakis(1,2,2,6,6-pentamethylpiperidin-4-yl) butane-1,2,3,4-tetracarboxylate Chemical compound C1C(C)(C)N(C)C(C)(C)CC1OC(=O)CC(C(=O)OC1CC(C)(C)N(C)C(C)(C)C1)C(C(=O)OC1CC(C)(C)N(C)C(C)(C)C1)CC(=O)OC1CC(C)(C)N(C)C(C)(C)C1 WUPCFMITFBVJMS-UHFFFAOYSA-N 0.000 description 1
- NZNAAUDJKMURFU-UHFFFAOYSA-N tetrakis(2,2,6,6-tetramethylpiperidin-4-yl) butane-1,2,3,4-tetracarboxylate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CC(C(=O)OC1CC(C)(C)NC(C)(C)C1)C(C(=O)OC1CC(C)(C)NC(C)(C)C1)CC(=O)OC1CC(C)(C)NC(C)(C)C1 NZNAAUDJKMURFU-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- MGMXGCZJYUCMGY-UHFFFAOYSA-N tris(4-nonylphenyl) phosphite Chemical compound C1=CC(CCCCCCCCC)=CC=C1OP(OC=1C=CC(CCCCCCCCC)=CC=1)OC1=CC=C(CCCCCCCCC)C=C1 MGMXGCZJYUCMGY-UHFFFAOYSA-N 0.000 description 1
- KJWHEZXBZQXVSA-UHFFFAOYSA-N tris(prop-2-enyl) phosphite Chemical compound C=CCOP(OCC=C)OCC=C KJWHEZXBZQXVSA-UHFFFAOYSA-N 0.000 description 1
- 238000001392 ultraviolet--visible--near infrared spectroscopy Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229940088594 vitamin Drugs 0.000 description 1
- 229930003231 vitamin Natural products 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/50—Phosphorus bound to carbon only
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/55—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
Definitions
- the present disclosure relates to a polycarbonate resin composition, a molded product, and a method for producing a polycarbonate resin composition.
- polycarbonate resin While polycarbonate resin is excellent in transparency, mechanical properties, heat resistance, etc., it has a high surface specific resistivity (10 14 ⁇ /sq or more), so dust such as dust and dirt easily adheres to the surface of the molded product. There is a risk of causing problems such as malfunction when used in electrical equipment parts.
- an antistatic polycarbonate resin composition to which an ionic liquid with high antistatic performance or a conductive metal oxide is added is being studied.
- an antistatic agent is added to improve antistatic performance, discoloration and deterioration of transparency occur.
- surfactants such as quaternary ammonium salts and sulfonates, conductive polymers such as polythiophene and polyaniline, and conductive metal oxides such as indium oxide and tin oxide are used. is known to be added, and antistatic properties are imparted to polycarbonate resin compositions by adding a single antistatic agent to multiple additions.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2021-70736
- Combinations of antistatic agents and silicone oils are disclosed.
- Patent Document 2 JP 2011-57757 A
- phosphonium sulfonic acid salts potassium and sodium salts of diphenylsulfone-3-sulfonic acid, and potassium and sodium salts of perfluoroalkanesulfonic acid are used as antistatic agents.
- metal salts selected from
- Patent Document 3 JP 2015-199880
- Patent Document 4 JP 2020-33561 disclose donor-acceptor compounds as antistatic agents.
- the antistatic agent described in Patent Document 1 has a high surface specific resistivity (10 12 ⁇ /sq to 10 13 ⁇ /sq) and does not have sufficient antistatic properties.
- the antistatic agent described in Patent Document 1 since there is a high correlation between antistatic properties and dust adhesion, it is sufficiently effective against both hydrophilic dust stains such as dust and dirt, and hydrophobic dust stains such as soot and oil smoke. was not accepted.
- the antistatic agent described in Patent Document 2 has a high total light transmittance, ensures transparency, and has a low surface specific resistivity (10 11 ⁇ /sq to 10 12 ⁇ /sq). was enough.
- the addition of a large amount of phosphonium sulfonate accelerates the deterioration of the mechanical properties and the hydrolysis of the polycarbonate resin, which may cause the polycarbonate resin composition to yellow.
- the surface specific resistivity is high, and there is a risk that it will not be sufficiently effective against dust stains.
- the present disclosure has been made in order to solve the above problems, and provides a polycarbonate resin composition and a molded article that are difficult to adhere to both hydrophilic dust stains and hydrophobic dust stains while ensuring transparency. intended to provide
- the present inventors have found synergy by combining a polycarbonate resin with a donor-acceptor compound and at least one of a silicone compound and a phosphonium salt-based ionic liquid. As a result, it has been found that an antifouling effect is obtained in which both hydrophilic dust stains and hydrophobic dust stains are difficult to adhere while ensuring transparency.
- the present disclosure relates to the following polycarbonate resin composition.
- a polycarbonate resin composition Containing a polycarbonate resin and a donor-acceptor compound, A polycarbonate resin composition containing at least one of a silicone-based compound and a phosphonium salt-based ionic liquid.
- the polycarbonate resin composition of the present embodiment contains a polycarbonate resin (A) and a donor-acceptor compound (B), and contains at least one of a silicone compound (C) and a phosphonium salt-based ionic liquid (D). contains.
- the polycarbonate resin composition of the present embodiment contains a polycarbonate resin (A) and a donor-acceptor compound (B), and contains at least one of a silicone compound (C) and a phosphonium salt-based ionic liquid (D).
- a silicone compound (C) and a phosphonium salt-based ionic liquid (D) By containing it, an antifouling effect is exhibited in which both hydrophilic dust stains and hydrophobic dust stains are difficult to adhere while ensuring transparency. The reason for using each of the above components will be described below.
- donor-acceptor compounds were investigated as antistatic agents.
- Donor-acceptor compounds are often used as antistatic agents for thermoplastic resins other than polycarbonate resins. No good antistatic property was obtained. Therefore, the inventors of the present invention have found that polycarbonate resin is a harder material than other resins and is less likely to migrate to the surface of a molded product. Thought.
- the silicone-based compound promotes surface migration of the donor-acceptor-based compound, that is, has a role as a dispersant that promotes dispersibility of the donor-acceptor-based compound. Therefore, when the kinematic viscosity of the silicone-based compound becomes high (exceeding 20000 mm 2 /sec), the transferability of the donor-acceptor-based compound to the surface of the molded article, that is, the dispersibility is remarkably lowered, resulting in sufficient dust adhesion prevention. No effect will be obtained.
- silicone-based compounds Compared to phosphonium salt-based ionic liquids, silicone-based compounds have a higher affinity for polycarbonate resin, which is the base material, so they are also excellent in terms of the bleeding of liquid components (blooming property) due to long-term use.
- Phosphonium salt-based ionic liquids like silicone-based compounds, also play a role as dispersants that promote the dispersibility of donor-acceptor-based compounds.
- phosphonium salt-based ionic liquids for example, even in high-viscosity liquids such as tetrabutylphosphonium dodecylbenzenesulfonate (viscosity at 30 ° C.: 13750 mPas), can obtain a sufficient dust adhesion prevention effect. It also has a role as an antistatic agent.
- Glycerin fatty acid ester known as an antistatic agent for polycarbonate resin
- polyether block amide copolymer known as a permanent antistatic agent
- the surface specific resistivity was high ( 10 14 ⁇ /sq or more)
- the dust adhesion rate was not improved. This is because the glycerin fatty acid ester is pasty (non-fluid) at room temperature (25°C), and the polyether block amide copolymer is solid at room temperature (25°C). This is because it is considered that a charged film of the donor-acceptor compound is not formed.
- the polycarbonate resin (A) contained in the polycarbonate resin composition of the present disclosure is not particularly limited, and includes various resins.
- an aromatic polycarbonate produced by a solution method (interfacial polycondensation method) or a melt method (transesterification method) using a dihydric phenol and a carbonate precursor can be used. That is, it is possible to use those produced by reacting them by an interfacial polycondensation method between dihydric phenol and phosgene, a transesterification method between dihydric phenol and diphenyl carbonate, or the like.
- dihydric phenols include various ones, particularly 2,2-bis(4-hydroxyphenyl)propane [bisphenol A], bis(4-hydroxyphenyl)methane, 1,1-bis(4-hydroxy phenyl)ethane, 2,2-bis(4-hydroxy-3,5-dimethylphenyl)propane, 4,4′-dihydroxydiphenyl, bis(4-hydroxyphenyl)cycloalkane, bis(4-hydroxyphenyl)oxide, Bis (4-hydroxyphenyl) sulfide, bis (4-hydroxyphenyl) sulfone, bis (4-hydroxyphenyl) sulfoxide, bis (4-hydroxyphenyl) ether, bis (4-hydroxyphenyl) ketone, etc., or these Examples thereof include halogen-substituted products.
- hydroquinone, resorcinol, catechol and the like are also included. These may be used alone or in combination of two or more. Among these, bis(hydroxyphenyl)
- Carbonate precursors include carbonyl halides, carbonyl esters, haloformates and the like, specifically phosgene, dihaloformates of dihydric phenols, diphenyl carbonate, dimethyl carbonate, diethyl carbonate and the like.
- Polycarbonate resin (A) includes not only new materials but also polycarbonate resins recycled from used products. Any commercially available grade may be used, but an optical grade with high transmittance is desirable. For example, Iupilon ML200, ML300, ML400, HL3003, HL3503 (Mitsubishi Engineering-Plastics Co., Ltd.), SD Polyca 303-10, 303-30 (Sumika Polycarbonate Co., Ltd.), Lexan LS-1, LS-2, LS -3 (SABIC Innovative Plastics Japan LLC), Panlite L-1225Z, L-1225ZL, LN-2250N (Teijin Ltd.), Toughlon LC1500, LC1700 (Idemitsu Kosan Co., Ltd.) and the like can be used.
- the polycarbonate resin composition of the present disclosure contains a donor-acceptor compound (B).
- the antistatic property dust adhesion prevention property
- the donor-acceptor compound (B) means a compound in which a donor unit and an acceptor unit are alternately arranged, the donor unit is an electron-donating structural unit, and the acceptor unit is Each means an electron-accepting structural unit.
- the donor-acceptor compound (B) in the present disclosure includes, for example, a compound represented by Chemical Formula 1 below.
- Biomicel BN-105 (chemical formula: C 42 H 81 O 8 B ⁇ C 23 H 48 ON 2 ) (Boron Laboratory Co., Ltd.) can be used.
- the content of the donor-acceptor compound (B) in the present disclosure is 0.5 to 5.0 parts by weight, preferably 0.5 to 4.0 parts by weight, with respect to 100 parts by weight of the polycarbonate resin. , more preferably 0.5 to 3.0 parts by weight. If the content of the donor-acceptor compound (B) exceeds 5.0 parts by weight, the transparency and mechanical properties may be greatly reduced. If the content of the donor-acceptor compound (B) is less than 0.5 parts by weight, the dust adhesion prevention property is lowered.
- the polycarbonate resin composition of the present disclosure contains at least one of silicone compounds (C) and phosphonium salt ionic liquids (D).
- silicone compounds (C) and phosphonium salt ionic liquids (D) By containing at least one of the silicone-based compound (C) and the phosphonium salt-based ionic liquid (D), the antistatic property (dust adhesion prevention property) can be improved.
- the silicone-based compound (C) in the present disclosure is a silicone oil represented by Chemical Formula 2 below.
- R 1 and R 2 are each independently a hydrogen atom, an alkyl group, an alkoxy group, an aryl group, or an aryloxy group.
- silicone oil is a linear polymer composed of siloxane bonds.
- dimethyl silicone oil whose side chain and terminal are all methyl groups
- methyl phenyl silicone oil whose side chain is partially phenyl group and methyl hydrogen silicone oil whose side chain is partially hydrogen are collectively referred to as straight Silicone oil.
- modified silicone oil is obtained by introducing an organic group into the side chain and terminal.
- organic groups to be introduced include amino groups, epoxy groups, alicyclic epoxy groups, vinyl groups, carbinol groups, methacryl groups, polyether groups, mercapto groups, carboxyl groups, phenol groups, silanol groups, methoxy groups, diol groups, A phenyl group, a fluoroalkyl group, an aralkyl group, a long-chain alkyl group, hydrogen and the like can be mentioned.
- a copolymer obtained by copolymerizing silicone oil may also be used.
- the silicone compound (C) has a kinematic viscosity of 10 to 20000 mm 2 /sec at room temperature (25° C.). If the kinematic viscosity exceeds 20,000 mm 2 /sec, the migration of the donor-acceptor compound (B) to the surface of the molded product is significantly reduced, and a sufficient dust adhesion prevention effect cannot be obtained. If the kinematic viscosity is less than 10 mm 2 /sec, only the silicone compound (C) migrates to the surface of the molded product, failing to obtain a sufficient dust adhesion prevention effect.
- the silicone compound (C) preferably has a kinematic viscosity at room temperature (25° C.) of 20 to 2000 mm 2 /sec, more preferably 37 to 200 mm 2 /sec.
- the silicone compound (C) has a refractive index at a sodium D line wavelength of 589.3 nm that is close to the refractive index value of the polycarbonate resin (A) at a sodium D line wavelength of 589.3 nm, which is 1.58.
- the refractive index of the silicone-based compound (C) is farther than 1.58, the difference between the refractive index of the polycarbonate resin (A) and the silicone-based compound (C) causes scattering and This is because a phenomenon such as refraction occurs and the transparency is lowered.
- the refractive index of the silicone compound (C) is preferably in the range of 1.50 to 1.74, more preferably in the range of 1.51 to 1.65.
- the refractive index value of the silicone compound (C) is outside the range of 1.50 to 1.74, the polycarbonate resin (A) becomes cloudy.
- a phenyl group is preferably introduced into such a silicone-based compound (C).
- silicone compound (C) examples include KR-9218 (kinematic viscosity: 40 mm 2 /sec, refractive index: 1.529) and KR-511 (kinematic viscosity: 100 mm 2 /sec, refractive index: 1.518).
- KR-9218 kinematic viscosity: 40 mm 2 /sec, refractive index: 1.529
- KR-511 kinematic viscosity: 100 mm 2 /sec, refractive index: 1.518
- HIVAC F-5 kinematic viscosity: 160 mm 2 /sec, refractive index: 1.575
- the content of the silicone compound (C) in the present disclosure is 1.0 to 5.0 parts by weight, preferably 1.0 to 4.0 parts by weight, with respect to 100 parts by weight of the polycarbonate resin. It is preferably 1.0 to 3.0 parts by weight. If the content of the silicone-based compound (C) exceeds 5.0 parts by weight, the mechanical properties may be greatly reduced. If the content of the silicone-based compound (C) is less than 1.0 part by weight, the dust adhesion prevention property is lowered.
- Phosphonium salt-based ionic liquid (D) Phosphonium salt-based ionic liquids (D) include tributyldodecylphosphonium bis(trifluoromethanesulfonyl)imide, tributyldodecylphosphonium bromide, tetrabutylphosphonium dodecylbenzenesulfonate, trihexyltetradecylphosphonium bis(trifluoromethylsulfonyl)imide, triethyl pentylphosphonium bis(trifluoromethylsulfonyl)imide, triethyloctylphosphonium bis(trifluoromethylsulfonyl)imide, tri-n-butylmethylphosphonium bis(trifluoromethylsulfonyl)imide, tetrabutylphosphonium tetraphenylborate and the like.
- tributyldodecylphosphonium bis(trifluoromethanesulfonyl)imide, tributyldodecylphosphonium bromide, and tetrabutylphosphonium dodecylbenzenesulfonate are preferably used.
- tributyldodecylphosphonium bis(trifluoromethanesulfonyl)imide examples include, for example, tributyldodecylphosphonium bis(trifluoromethanesulfonyl)imide (Fujifilm Wako Pure Chemical Industries, Ltd.), IL-AP3 (Koei Chemical Industry Co., Ltd.), and the like.
- Tributyldodecylphosphonium bromide (Fujifilm Wako Pure Chemical Industries, Ltd.) can be used as tributyldodecylphosphonium bromide, and Elekat S-418 (Takemoto Oil & Fat Co., Ltd.) can be used as tetrabutylphosphonium dodecylbenzenesulfonate.
- the content of the phosphonium salt-based ionic liquid (D) in the present disclosure is 0.5 to 5.0 parts by weight, preferably 0.5 to 4.0 parts by weight, relative to 100 parts by weight of the polycarbonate resin. , more preferably 0.5 to 3.0 parts by weight.
- the content of the phosphonium salt-based ionic liquid (D) exceeds 5.0 parts by weight, the thermal stability at high temperatures is remarkably reduced, and not only is yellowing likely to occur, but also the mechanical properties are greatly reduced.
- the content of the phosphonium salt-based ionic liquid (D) is less than 0.5 parts by weight, the dust adhesion prevention property is deteriorated.
- the polycarbonate resin composition of the present disclosure may contain additives such as heat stabilizers, ultraviolet absorbers, and light stabilizers as long as they do not impede the purpose of the present disclosure.
- the polycarbonate resin composition of the present disclosure contains the phosphonium salt-based ionic liquid (D), hydrolysis is caused, the thermal stability is lowered, and yellowing occurs. Therefore, in order to improve the thermal stability, It may contain a heat resistant stabilizer.
- antioxidants such as hindered phenol-based, phosphorus-based, and sulfur-based antioxidants, which may be used alone or in combination of two or more.
- the amount of the heat stabilizer added in the present disclosure is not particularly limited, and the composition ratio when two or more types are mixed is not particularly limited, but it can be adjusted on a case-by-case basis depending on the required physical properties. desirable.
- hindered phenol antioxidants examples include 2,6-di-tert-butyl-p-cresol, tetrakis[methylene-3-(3′,5′-di-tert-butyl-4′-hydroxy phenyl)propionate]methane, stearyl ⁇ -(3′,5′-di-tert-butyl-4-hydroxyphenyl)propionate, 3,9-bis[1,1-dimethyl-2-[ ⁇ -(3-tert -butyl-4-hydroxy-5-methylphenyl)propionyloxy]ethyl]-2,4,8,10-tetraoxaspiro(5,5)undecane, 1,3,5-trimethyl-2,4,6- known tris(3',5'-di-tert-butyl-4-hydroxybenzyl)benzene, triethylene glycol bis[3-(3-tert-butyl-5-methyl-4-hydroxyphenyl)propionate] things are mentioned.
- tetrakis[methylene-3-(3′,5′-di-tert-butyl-4′-hydroxyphenyl)propionate]methane, stearyl ⁇ -(3′,5′) are preferred from the viewpoint of heat stability.
- -di-tert-butyl-4-hydroxyphenyl)propionate, 3,9-bis[1,1-dimethyl-2-[ ⁇ -(3-tert-butyl-4-hydroxy-5-methylphenyl)propionyloxy] Ethyl]-2,4,8,10-tetraoxaspiro(5,5)undecane is preferred.
- sulfur-based antioxidants examples include pentaerythritol tetrakis(3-laurylthiopropionate), dilauryl-3,3'-thiodipropionate, dioctadecyl-3,3'-thiodipropionate, and the like. A publicly known thing is mentioned. Among these, pentaerythritol tetrakis(3-laurylthiopropionate) is preferred from the viewpoint of heat resistance stability.
- the content of the heat resistant stabilizer in the present disclosure is preferably 0.05 to 10 parts by weight, more preferably 0.05 to 3.0 parts by weight, with respect to 100 parts by weight of the polycarbonate resin (A).
- the polycarbonate resin composition of the present embodiment is often used for outdoor products and yellows due to ultraviolet rays, so it may contain an ultraviolet absorber.
- UV absorbers include, for example, hydroxybis(dimethylbenzyl)phenylbenzotriazole, 2-(2′-hydroxy-5′-tert-octylphenyl)benzotriazole, 2,2′-methylenebis[6-(2H-benzo triazol-2-yl)-4-tert-octylphenol], 2-(2′-hydroxy-5′-methylphenyl)benzotriazole, 2-(2′-hydroxy-3′-tert-butyl-5′-methyl phenyl)-5-chlorobenzotriazole, 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-[2-(2-ethylhexanoyloxy)ethoxy]phenol), 2 , 4,6-tris(2-hydroxy-4-hexyloxy-3-methylphenyl)-1,3,5-triazine).
- 2-(2'-hydroxy-5'-tert-octylphenyl)benzotriazole 2,2'-methylenebis[6-(2H-benzotriazol-2-yl)- 4-tert-octylphenol], 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-[2-(2-ethylhexanoyloxy)ethoxy]phenol), 2,4 ,6-tris(2-hydroxy-4-hexyloxy-3-methylphenyl)-1,3,5-triazine) is preferred.
- the amount of the ultraviolet absorber added in the present disclosure is not particularly limited, and the composition ratio when two or more types are mixed is not particularly limited, but it can be adjusted on a case-by-case basis depending on the required physical properties. desirable.
- the content of the ultraviolet absorber in the present disclosure is preferably 0.05 to 10 parts by weight, more preferably 0.05 to 3.0 parts by weight, relative to 100 parts by weight of the polycarbonate resin (A).
- the polycarbonate resin composition of the present disclosure is often used for outdoor products and may contain a light stabilizer because it yellows when exposed to ultraviolet rays.
- Light stabilizers include tetrakis(1,2,2,6,6-pentamethyl-4-piperidyl)butane-1,2,3,4-tetracarboxylate, tetrakis(2,2,6,6-tetramethyl -4-piperidyl)butane-1,2,3,4-tetracarboxylate, 1,2,3,4-butanetetracarboxylic acid, and 1,2,3,6,6-pentamethyl-4-piperidinol, 3,9-bis(2-hydroxy-1,1-dimethylethyl)-2,4,8,10-tetraoxaspiro[5.5]undecane mixed ester, bis(2,2,6,6 -tetramethyl-4-piperidyl) sebacate and other known compounds.
- 1,2,3,4-butanetetracarboxylic acid 1,2,3,6,6-pentamethyl-4-piperidinol, and 3,9-bis(2- Mixed esters with hydroxy-1,1-dimethylethyl)-2,4,8,10-tetraoxaspiro[5.5]undecane are preferred.
- the above light stabilizers may be used alone or in mixtures of two or more.
- the amount of the light stabilizer added in the present disclosure is not particularly limited, and the composition ratio when two or more types are mixed is not particularly limited, but it can be adjusted on a case-by-case basis depending on the required physical properties. desirable.
- the content of the light stabilizer in the present disclosure is preferably 0.05 to 10 parts by weight, more preferably 0.05 to 3.0 parts by weight, relative to 100 parts by weight of the polycarbonate resin (A).
- additives include antistatic agents, plasticizers, release agents, flame retardants, flame retardant aids, dyes, pigments, etc., as long as they do not interfere with the purpose of the present disclosure. .
- Antistatic agents include trihexyltetradecylphosphonium bis(trifluoromethylsulfonyl)imide, triethylpentylphosphonium bis(trifluoromethylsulfonyl)imide, triethyloctylphosphonium bis(trifluoromethylsulfonyl)imide, tri-n-butylmethyl Phosphonium bis(trifluoromethylsulfonyl)imide, phosphonium salt-based ionic liquid (D) such as tetrabutylphosphonium tetraphenylborate, tributylmethylammonium bis(trifluoromethylsulfonyl)imide (FC-4400, 3M Japan Ltd.) ammonium salt-based ionic liquids such as N-butyl-3-methylpyridinium bis(trifluoromethylsulfonyl)imide (CIL-312, Nihon Carlit Co., Ltd.) pyri
- the plasticizer can be arbitrarily selected from known ones such as polyethylene glycol, polyamide oligomer, ethylene bis-stearamide, phthalate ester, adipate ester, polystyrene oligomer, polyethylene wax, silicone oil and mineral oil. can.
- the mold release agent is arbitrarily selected from known substances such as polyethylene wax, silicone oil, stearyl phosphite, long-chain carboxylic acid, long-chain carboxylic acid metal salt, higher fatty acid ester of monohydric or polyhydric alcohol, and the like. be able to.
- Flame retardants include phosphorus-based flame retardants such as bisphenol A bis (diphenyl phosphite), tricresyl phosphate, triphenyl phosphate, tris-3-chloropropyl phosphate, 2,2-bis[4-(3,3- Brominated flame retardants such as dibromopropoxyl)-3,5-dibromophenyl]propane, bis(3,5-dibromo-4-dibromopropyloxyphenyl)sulfone, ethylenebispentabromobenzene, hexabromocyclododecane, silicones It can be used by arbitrarily selecting from publicly known flame retardants, hydroxide-based flame retardants such as magnesium hydroxide and aluminum hydroxide.
- the flame retardant aid can be arbitrarily selected from antimony compounds such as antimony trioxide and others.
- the method for producing the polycarbonate resin composition of the present disclosure is not particularly limited, and a wide range of known methods for producing a polycarbonate resin composition can be employed. At least one of the silicone-based compound (C) and the phosphonium salt-based ionic liquid (D), and optional additives are mixed and kneaded.
- the kneading method for example, a method using any physical blend such as melt kneading, solvent cast blend, latex blend, polymer complex, etc. can be used, but the melt kneading method is preferred.
- the melt-kneading temperature is not particularly limited, but is usually in the range of 240 to 320°C.
- Examples of equipment used for the kneading include a tumbler, a Henschel mixer, a rotary mixer, a super mixer, a ribbon tumbler, and a V blender. and pelletize.
- a single-screw or multi-screw extruder is generally used for melt-kneading pelletization, but a Banbury mixer, a roller, a co-kneader, a blast mill, a Prabender Brautograph, or the like can also be used, and these can be used batchwise or continuously. drive wisely.
- resin pellets, hydrolysis resistance improvers, and other additives are mixed without melt-kneading, and the mixed components are used as a molding resin, and melt-kneaded in a heating cylinder of a molding machine, so-called mold blending. It is also possible to implement in
- Embodiment 2 A molded article according to the present embodiment is made of the polycarbonate resin composition described above. In the molded article according to the present embodiment, since it is made of the above-described polycarbonate resin composition, it is possible to obtain an effect that both hydrophilic dust stains and hydrophobic dust stains are difficult to adhere while ensuring transparency. be.
- the molded article of the present embodiment includes at least one of the polycarbonate resin (A), the donor-acceptor compound (B), the silicone compound (C), and the phosphonium salt-based ionic liquid (D), It can be produced by pelletizing after melt-kneading a polycarbonate resin composition containing, and molding by various molding methods. It is also possible to directly mold the resin melted and kneaded by an extruder without going through pellets.
- the shape of the molded product is not particularly limited, but can be appropriately selected according to the application and purpose of the molded product.
- Examples include plate-like, plate-like, rod-like, sheet-like, film-like, cylindrical, annular, circular, elliptical, polygonal, odd-shaped, hollow, frame-like, box-like, and panel-like shapes. .
- Specific examples include those of various shapes such as automobile interior panels, automobile (motorcycle) headlamp lenses, lighting covers, display windows of devices, housings, etc., and special shapes.
- the surface of the molded product may have an uneven shape transferred thereto, or may have a three-dimensional shape having a three-dimensional curved surface.
- it may be a multilayer structure laminated with other resin sheets.
- the molding method is not particularly limited, and conventionally known molding methods can be employed, including an injection molding method, an injection compression molding method, an extrusion molding method, a profile extrusion method, a transfer molding method, a blow molding method, and a gas-assisted blow molding.
- method blow molding method, extrusion blow molding, IMC (in-mold coating) molding method, rotational molding method, multi-layer molding method, two-color molding method, insert molding method, sandwich molding method, foam molding method, pressure molding method etc.
- the molded article of the present embodiment has excellent transparency even at a thickness of about 0.5 to 6.0 mm. % or more.
- the total light transmittance refers to all transmitted light when the light equivalent to the D65 light source is incident on the measurement object
- the D65 light source refers to the light that reproduces the outdoor lighting environment. say. Taking the state without a test piece as 100%, the closer the numerical value is to 100%, the more transparent it is.
- the total light transmittance is measured, for example, according to JIS K7361-1:1997 "Plastics-Testing method for total light transmittance of transparent materials-Part 1: Single beam method", using a thickness of 2.0 mm. Measurement can be performed at a temperature of 23° C. using a molded product with an ultraviolet-visible-near-infrared (UV-Vis-NIR) spectrophotometer (Solid Spec-3700 DUV manufactured by Shimadzu Corp.).
- UV-Vis-NIR ultraviolet-visible-near-infrared
- the haze of the molded article having a thickness of 2.0 mm is 2% or less, preferably 1% or less.
- haze refers to the degree of light scattering, even in materials that do not absorb light, as light may scatter inside the material and become opaque. A lower value means more transparency.
- Haze for example, using a molded product with a thickness of 2.0 mm, using a haze meter (manufactured by Nippon Denshoku Industries Co., Ltd. NDH2000 ) can be measured at a temperature of 23° C. with a D65 light source.
- haze can be calculated by the following formula (1).
- Haze (%) diffused light component/total light transmittance ⁇ 100 Equation (1)
- Light included in the total light transmittance includes a parallel light component and a diffused light component, and the haze quantifies the proportion of the diffused light component in the total light transmittance.
- Test piece used for the following evaluation is a flat plate test piece (length 100 mm x width 100 mm x thickness 2.0 mm), which was evaluated after being left for one week in an environment of temperature 23°C and humidity 50%. .
- the obtained pellets were made into flat test pieces for evaluation (length 100 mm x width 100 mm x thickness 2 mm) (Examples 1 to 13, Molded as Comparative Examples 1-11).
- the basic conditions for injection molding were a resin temperature of 280°C and a mold temperature of 80°C.
- a component A-1: Iupilon HL3503 manufactured by Mitsubishi Engineering-Plastics Co., Ltd.
- Tables 1 and 2 show the evaluation results of (1) to (4) above and (5) overall judgment for the obtained flat test pieces for evaluation (Examples 1 to 13 and Comparative Examples 1 to 11).
- the molded articles made of the polycarbonate resin composition that satisfies the constituent requirements of the present disclosure are excellent in transparency and exhibit both hydrophilic dust stains and hydrophobic dust stains. It can be confirmed that a polycarbonate resin composition exhibiting an antifouling effect that is difficult to adhere to is obtained.
- Comparative Example 1 was inferior in antistatic property and dust adhesion property because it did not contain B component C component and D component.
- Comparative Examples 2 and 3 contained the B component but did not contain the C component and the D component, and thus, similarly to Comparative Example 1, were inferior in antistatic property and dust adhesion property.
- Comparative Example 4 contained the C component but did not contain the B component.
- Comparative Example 5 contained components C and D but did not contain component B, so the antistatic property and hydrophilic dust adhesion were improved, but the hydrophobic dust adhesion was poor.
- Comparative Example 6 contained the D component but did not contain the B component, so the antistatic property and hydrophilic dust adhesion were improved, but the hydrophobic dust adhesion was inferior. From these results, it can be confirmed that containing A to B components and containing at least one of C component and D component is a necessary constituent element in the present disclosure.
- Comparative Example 7 uses glycerin fatty acid ester (E-1), which is an antistatic agent, instead of the C and D components, and Comparative Example 8 uses a polyether block, which is a permanent antistatic agent instead of the C and D components. Since each of the amide copolymers (F-1) was contained, the antistatic properties and the adhesion of hydrophobic dust were inferior. From these results, it can be confirmed that glycerin fatty acid esters and polyether block amide copolymers, which are conventionally known antistatic agents for polycarbonate resins, are not suitable for the present disclosure.
- Comparative Examples 9 to 11 contain all of the A to D components, Comparative Example 9 has the B component content, Comparative Example 10 has the C component content, and Comparative Example 11 has the D component content. , respectively, the antistatic property and the dust adhesion property were improved, but the transparency was inferior. From these results, it can be confirmed that containing A to B components, containing at least one of C component and D component, and containing each specified amount is a necessary constituent element in the present invention.
- Example 1 Although not shown in Tables 1 and 2, evaluation of mechanical properties (tensile strength, tensile elongation at break and Charpy impact strength) was performed in Example 1 and Comparative Example 1, and equivalent evaluation results were obtained. It can be confirmed that even if components B to D are blended with component A, no deterioration in mechanical properties is observed.
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Abstract
L'invention concerne une composition de résine de polycarbonate qui comprend une résine de polycarbonate et un composé donneur-accepteur, et comprend un composé à base de silicone et/ou un liquide ionique à base de sel de phosphonium.
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