WO2023116597A1 - Substrat, module de caméra et appareil électronique - Google Patents

Substrat, module de caméra et appareil électronique Download PDF

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Publication number
WO2023116597A1
WO2023116597A1 PCT/CN2022/139883 CN2022139883W WO2023116597A1 WO 2023116597 A1 WO2023116597 A1 WO 2023116597A1 CN 2022139883 W CN2022139883 W CN 2022139883W WO 2023116597 A1 WO2023116597 A1 WO 2023116597A1
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WO
WIPO (PCT)
Prior art keywords
groove
area
metal layer
heat dissipation
substrate
Prior art date
Application number
PCT/CN2022/139883
Other languages
English (en)
Chinese (zh)
Inventor
王鹏
徐波
Original Assignee
维沃移动通信有限公司
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Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2023116597A1 publication Critical patent/WO2023116597A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127—Natural convection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers

Definitions

  • the present application relates to the technical field of electronic equipment, in particular to a substrate, a camera module and electronic equipment.
  • the anti-shake methods include optical anti-shake, electronic anti-shake, and pan-tilt anti-shake. Among them, pan-tilt anti-shake is widely used.
  • the circuit substrate of the camera module includes a hard part and a flexible part.
  • the hard part is connected to the camera, and one end of the flexible part is connected to the hard part.
  • the flexible part usually has a "Z"-shaped folding structure. When the camera moves relative to the pan-tilt support and the entire camera module vibrates, the flexible part can produce a certain shock-absorbing effect, and the "Z"-shaped folding structure can ensure the reliability of the connection between the hard part and the flexible part.
  • the inventors found that there are at least the following problems in the related art: the heat dissipation effect of the circuit substrate is poor, and the heat generated by the image sensor in the camera module is difficult to dissipate, which affects the working performance of the image sensor, thus causing the image The working performance of the camera module.
  • Embodiments of the present application provide a substrate, a camera module, and electronic equipment to solve the technical problem in the related art that the heat dissipation effect of the circuit substrate in the camera module is poor, making it difficult to dissipate the heat generated by the image sensor.
  • an embodiment of the present application provides a substrate, including a heat sink, a support plate, and a stacked first metal layer, a first base film, and a second metal layer;
  • the surface of the first metal layer facing away from the first substrate film is provided with a heat dissipation area for placing functional devices, and the heat dissipation area is provided with a plurality of heat dissipation holes at intervals, and the heat dissipation holes face the first substrate film extend;
  • the surface of the second metal layer facing away from the first substrate film is provided with a first groove at a position opposite to the heat dissipation area, and the support plate covers the surface of the second metal layer facing away from the first substrate film. on the surface of the substrate film, and form an accommodating cavity with the first groove;
  • the heat sink is placed in the accommodating chamber.
  • an embodiment of the present application provides a camera module, including an image sensor and the above-mentioned substrate;
  • the image sensor is placed on the heat dissipation area of the substrate.
  • the embodiment of the present application provides an electronic device, including a camera module.
  • the substrate includes a stacked first metal layer, a first substrate film and a second metal layer, and the surface of the first metal layer away from the first substrate film is provided with a heat dissipation area for placing functional devices , the cooling area is provided with a plurality of cooling holes at intervals, the cooling holes extend toward the first substrate film, and are blind holes; the surface of the second metal layer away from the first substrate film is provided with a first concave hole at a position opposite to the cooling area
  • the groove, the support plate is covered on the surface of the second metal layer away from the first substrate film, and forms an accommodating cavity with the first groove, and the heat sink is placed in the accommodating cavity.
  • the heat generated by functional devices can be transferred to the heat sink through the heat dissipation hole, and the heat dissipation element dissipates the heat. It can be seen that the substrate has a good heat dissipation effect.
  • Figure 1 shows one of the schematic diagrams of a substrate provided in the embodiment of the present application
  • Figure 2 shows the second schematic diagram of a substrate provided in the embodiment of the present application
  • Fig. 3 shows the partial schematic view of the second metal layer of the substrate in Fig. 1;
  • FIG. 4 is a schematic diagram of a second metal layer of a substrate provided by an embodiment of the present application.
  • 10 first metal layer; 11: heat dissipation area; 12: heat dissipation hole; 20: first substrate film; 30: second metal layer; 31: first groove; 32: second groove; 33: connection area ; 34: second circuit area; 40: support plate; 41: third metal layer; 411: coverage area; 412: first line area; 42: second substrate film; 43: fourth metal layer; 50: capillary Structural part; 60: insulating layer; 70: functional device; 80: thermal conductive adhesive; 90: wire.
  • a substrate is proposed. Referring to FIG. 1 to FIG. Metal layer 30; the surface of the first metal layer 10 facing away from the first substrate film 20 is provided with a heat dissipation area 11 for placing the functional device 70, and the heat dissipation area 11 is provided with a plurality of heat dissipation holes 12 at intervals, and the heat dissipation holes 12 face the first substrate
  • the film 20 is extended; the surface of the second metal layer 30 away from the first substrate film 20 is provided with a first groove 31 at a position opposite to the heat dissipation area 11, and the support plate 40 covers the second metal layer 30 away from the first substrate on the surface of the film 20 , and forms an accommodating cavity with the first groove 31 ; the heat sink is placed in the accommodating cavity.
  • the heat generated by the functional device 70 (such as the image sensor in the camera module) is transferred to the heat dissipation element through the heat dissipation hole 12, and the heat dissipation element dissipates the heat. It can be seen that the substrate has a good heat dissipation effect.
  • the material of the second metal layer 30 can be copper foil, aluminum foil, gold foil or other conductive materials. Copper foil is preferred in this embodiment, and the following description will be made by taking the first metal layer 10 as the first copper foil and the second metal layer 30 as the second copper foil as an example.
  • the first substrate film 20 can be polyimide film (referred to as PI film), polyester film (abbreviated as PET film), fluorocarbon ethylene film, imide fiber paper, polybutylene terephthalate film and other insulating substrates. membrane material.
  • the first copper foil, the first base film 20 and the second copper foil constitute a flexible copper clad laminate (referred to as the first flexible copper clad laminate).
  • PI films are preferred.
  • the surface of the first copper foil facing away from the first substrate film 20 (that is, the upper surface of the first copper foil) is provided with a heat dissipation area 11 for placing a functional device 70.
  • the functional device generates heat when it is working.
  • the functional device can be a resistor, a transformer, a photoelectric sensor, an image sensor, etc.
  • the following description takes the functional device as an image sensor as an example.
  • the heat dissipation area 11 is provided with a plurality of heat dissipation holes 12 at intervals, and the heat dissipation holes 12 extend toward the first base film 20, that is, the heat dissipation holes 12 extend from the first copper foil
  • the upper surface extends downwards, and the heat dissipation holes 12 can be blind holes or through holes, which need to be set according to the actual type of heat dissipation element.
  • the surface of the second copper foil facing away from the first substrate film 20 (that is, the lower surface of the second copper foil) is provided with a first recess at a position opposite to the heat dissipation area 11 .
  • the support plate 40 covers the lower surface of the second copper foil to form an accommodation cavity with the first groove 31, and the heat dissipation element is placed in the accommodation cavity, so that the heat generated by the image sensor can be transferred to the heat dissipation element through the heat dissipation hole 12 , so that the heat dissipation element dissipates heat, it can be seen that the substrate has a good heat dissipation effect.
  • the image sensor can be a sensor in the camera module, and the image sensor is mainly used to receive the light passing through the lens of the camera module to convert these light signals into electrical signals. Therefore, the camera module takes pictures Or when shooting video, the image sensor heats up and generates heat.
  • the image sensor can be placed on the heat dissipation area 11, so that the heat generated by the image sensor can be transferred to the heat dissipation element through the heat dissipation hole 12, and the heat dissipation element will dissipate the heat.
  • the camera module is avoided. The heat generated by the image sensor in the circuit board is difficult to dissipate and affect the working performance of the image sensor, thus the working performance of the image camera module.
  • the thickness of the second copper foil is greater than that of the first copper foil, and the thinner first copper foil is also conducive to the rapid transfer of heat, which can make the image sensor generate
  • the heat is quickly transferred to the heat dissipation element through the heat dissipation holes 12 for dissipation, which further improves the heat dissipation effect of the substrate.
  • the heat sink is a capillary structure 50 filled with a heat dissipation medium;
  • the second metal layer 30 is away from the first substrate film 20
  • the surface of the surface is also provided with a plurality of second grooves 32, a plurality of second grooves 32 are arranged around the first groove 31, and communicate with the first groove 31 respectively;
  • the cooling hole 12 is a blind hole, and the supporting plate 40 is connected with the first groove 31
  • the first groove 31 and the second groove 32 form an accommodating cavity, and the accommodating cavity is a vacuum cavity.
  • a plurality of second grooves 32 are also provided on the lower surface of the second copper foil, and the plurality of second grooves 32 are arranged around the first groove 31, and are connected to the first groove respectively. 31 communicates with each other, so that the supporting plate 40 and the first groove 31 and the second groove 32 form a receiving cavity.
  • the cooling hole 12 is a blind hole, so that the containing cavity is a vacuum cavity.
  • the capillary structure is arranged in the vacuum cavity. Since the heat dissipation medium is filled in the capillary structure member 50, after the heat is transferred to the capillary structure member 50, the heat dissipation medium will start to produce liquid phase gasification in the vacuum environment.
  • the heat dissipation medium absorbs heat energy and expands rapidly in volume, and the heat dissipation medium in the gaseous phase quickly fills the entire vacuum chamber.
  • the heat dissipation medium in the gaseous phase touches a region with a lower temperature (the second groove 32)
  • condensation will occur, thereby releasing The heat accumulated during evaporation, the condensed liquid-phase heat dissipation medium is sucked back to the high-temperature area of the vacuum chamber due to the adsorption of the capillary structure 50, and then enters the next cycle of liquid-phase gasification.
  • the internal cycle is repeated, so that the heat generated by the image sensor can be taken away by such a cycle, so that the substrate can achieve a good circulation heat dissipation effect.
  • the heat dissipation medium may be pure water or other medium that can absorb heat and undergo phase change.
  • the cooling hole 12 runs through the first copper foil and the first base film 20, of course, the cooling hole 12 can also run through the first copper foil, the first base film 20 and the second copper foil, specifically according to actual needs are set.
  • the etched pattern is as shown in FIG. 4; then, Put the capillary structure 50 into the second groove 32, inject heat dissipation medium (preferably pure water) into the capillary structure 50; cover the support plate 40 on the lower surface of the second copper foil, and perform sealing treatment, so that The support plate 40 and the first groove 31 and the second groove 32 form an accommodation chamber; then the air in the accommodation chamber is drawn out by a vacuum pump, so that the accommodation chamber is a vacuum chamber, and it is pumped into a negative pressure state, so that the capillary structure 50 can Adsorbed in the first groove 31.
  • heat dissipation medium preferably pure water
  • the capillary structure 50 may be a metal mesh, or a porous structure formed by sintering metal powder, or partly sintered with metal powder and partly made of metal mesh.
  • Metal powder or metal mesh are made of high thermal conductivity materials, such as copper, iron, aluminum and other metals.
  • the capillary structure 50 made of copper mesh or copper powder is preferred.
  • the capillary structure 50 can adopt a groove structure, or a pipe structure, or a part adopts a groove structure, and the other part adopts a pipe structure, and so on.
  • the heat sink can also be a thermoelectric cooler (Thermo Electric Cooler, TEC).
  • the heat dissipation hole 12 can be a through hole or a blind hole.
  • TECs are made using the Peltier effect of semiconductor materials.
  • the so-called Peltier effect refers to the phenomenon that when a direct current passes through a galvanic couple composed of two semiconductor materials, one end absorbs heat and the other end releases heat.
  • the heavily doped N-type and P-type bismuth telluride are mainly used as the semiconductor material of TEC, and the bismuth telluride elements are electrically connected in series and generate heat in parallel.
  • TEC includes some P-type and N-type pairs (groups), which are connected together by electrodes and sandwiched between two ceramic electrodes; when a current flows through the TEC, the heat generated by the current will be transferred from one side of the TEC to the TEC. On the other hand, this is the cooling principle of TEC.
  • the specific structure of the semiconductor refrigerator 4 is well known to those skilled in the art, for details, reference may be made to the structure of the prior art, which will not be repeated here.
  • the cold end of the TEC faces the functional device 70, and the hot end faces away from the functional device 70.
  • the heat generated by the functional device 70 during operation can be absorbed by the cold end and transferred from the hot end to the support plate 40, wherein the support The area of the plate 40 is larger than that of the functional device 70 , therefore, the heat generated by the functional device 70 in a small area can be diffused through the large-area support plate 40 .
  • the area of the support plate 40 can be more than twice the area of the functional device 70, and the area of the support plate 40 is specifically several times the area of the functional device 70, which is not limited in this embodiment, and can be determined according to the actual situation. set up.
  • the support plate 40 can be a metal plate, which is also conducive to the diffusion of heat due to the good thermal conductivity of the metal, and the metal plate can also play a supporting role for the flexible copper-clad laminate.
  • a substrate is thinner and can save space. , conducive to thinning.
  • the first groove 31 is rectangular, and the area of the orthographic projection of the first groove 31 is greater than or equal to the area of the orthographic projection of the second groove 32.
  • the shape of the capillary structure 50 is similar to that of the first groove. 31; the second groove 32 is rectangular, the second groove 32 extends away from the side edge of the first groove 31, and the depth of the second groove 32 is less than or equal to the first groove 31 in depth.
  • the first groove 31 in this embodiment is also rectangular.
  • the area of the orthographic projection of the first groove 31 is greater than or equal to the area of the orthographic projection of the second groove 32, and the shape of the capillary structure 50 is adapted to the shape of the first groove 31, that is, the orthographic projection of the capillary structure 50
  • the area of the projection is greater than or equal to the area of the orthographic projection of the second groove 32, so that the heat generated by the image sensor can be transferred to the capillary structure 50 through the cooling holes 12 as much as possible, so that more heat can pass through the capillary structure 50 out to further improve the heat dissipation effect of the substrate.
  • the area of the orthographic projection of the first groove 31 is equal to the area of the orthographic projection of the second groove 32 , which is beneficial to reduce the occupied space of the substrate.
  • the second groove 32 can be rectangular, and the second groove 32 extends away from the side edge of the first groove 31, as can be seen in Figure 4, the second There is a preset distance between the side edge of the groove 32 away from the first groove 31 and the side edge of the second copper foil, that is, the second groove 32 does not extend to the side edge of the second copper foil, so that the support
  • the plate 40 may form a receiving cavity with the first groove 31 and the second groove 32 .
  • the depth of the second groove 32 is less than or equal to the depth of the first groove 31, the depth of the second groove 32 in the figure is less than the depth of the first groove 31, like this, is conducive to the heat dissipation of the liquid phase after condensation
  • the medium is reflowed to the high temperature area of the vacuum chamber to achieve a faster heat transfer cycle, so that the heat generated by the image sensor can be dissipated faster.
  • the number of second grooves 32 is at least four, and at least four second grooves 32 are evenly arranged around the first groove 31.
  • two second grooves 32 are provided on each side of the first groove 31, and three second grooves 32 or other numbers of second grooves 32 may also be provided, depending on actual needs. Make settings.
  • a plurality of second grooves 32 are evenly arranged around the first groove 31, so that after the heat dissipation medium absorbs heat energy and expands rapidly, the gaseous heat dissipation medium will expand outward from all directions to fill the entire vacuum chamber more quickly.
  • the heat dissipation medium in the gaseous phase comes into contact with the lower temperature area (the second groove 32), it will condense, thereby releasing the heat accumulated during evaporation faster, and the condensed heat dissipation medium in the liquid phase will be dissipated faster. It is sucked back to the high temperature area of the vacuum chamber, and then enters the next cycle of liquid phase vaporization. This process is repeated in the vacuum chamber, so that the cycle can take away the heat generated by the image sensor faster.
  • the shape of the second groove 32 is not limited to a rectangle, and can also be other shapes, such as trapezoidal, etc., and the arrangement of the second groove 32 is not limited to the arrangement shown in the figure.
  • the grooves 32 are evenly arranged, and the angles between two adjacent second grooves 32 are equal.
  • the specific shape and arrangement structure of the second grooves 32 may not be limited, and may be determined according to actual needs. Make settings.
  • the surface of the second metal layer 30 facing away from the first substrate film 20 is provided with a connection area 33 in the area except the first groove 31 and the second groove 32, and the connection area 33 is used for connecting with the support plate. 40 sealed connection.
  • connection area 33 is arranged around the first groove 31, and is arranged in an area where the second groove 32 is not provided and the second groove 32 is far away from the first groove 31. side area.
  • the first connection area 33 can be sealed and connected to the first support plate 40 by welding or bonding with a sealing medium, so that the support plate 40 forms a sealed accommodation cavity with the first groove 31 and the second groove 32, so that the accommodation The cavity can be a vacuum cavity.
  • the support plate 40 includes a third metal layer 41, a second substrate film 42 and a fourth metal layer 43 that are laminated.
  • the third metal layer 41 covers the second metal layer.
  • the third metal layer 41 also includes a coverage area 411 and a first circuit area 412, the coverage area 411 covers the first groove 31 and the second groove 32, and the connection area 33 Located in the area of the coverage area 411 except the first groove 31 and the second groove 32, the first line area 412 is located in the part of the third metal layer 41 except the area of the coverage area 411, and is insulated from the coverage area 411, the first line area A first pad is provided on the area 412, and the first pad is used to electrically connect with the functional device 70 through a wire; All regions are provided with an insulating layer 60 .
  • the support plate 40 is the third metal layer 41, the second base film 42 and the fourth metal layer 43
  • the substrate is the first metal layer 10, the first base film 20 and the fourth metal layer.
  • Two metal layers 30 a third metal layer 41 , a second base film 42 and a fourth metal layer 43 .
  • the materials of the third metal layer 41 and the fourth metal layer 43 may be copper foil, aluminum foil, gold foil or other conductive materials. Copper foil is preferred in this embodiment, and the following description will be made by taking the third metal layer 41 as the third copper foil and the fourth metal layer 43 as the fourth copper foil as an example.
  • the second substrate film 42 can be polyimide film (referred to as PI film), polyester film (referred to as PET film), fluorocarbon ethylene film, imide fiber paper, polybutylene terephthalate film and other insulating substrates. membrane material.
  • the third copper foil, the second base film 42 and the fourth copper foil constitute a flexible copper clad laminate (referred to as the second flexible copper clad laminate). That is to say, this embodiment is basically composed of the first flexible copper clad laminate and the second flexible copper clad laminate arranged in layers. Since the flexible copper clad laminate is relatively thin, it can be seen that the thickness of the substrate in this embodiment is relatively thin, which is conducive to thinning.
  • the substrate can be applied to the camera module with the anti-shake function of the pan/tilt, so as to save space, and has a good circulation heat dissipation effect, so as to avoid affecting the working performance of the camera module due to the poor heat dissipation effect of the existing circuit substrate.
  • the second base film 42 of this embodiment is preferably a PI film.
  • the connection zone 33 is located in the area of the coverage area 411 except the first groove 31 and the second groove 32 .
  • the connection zone 33 is located on the side of the second groove 32 away from the first groove 31 , and located at the side edge of the second groove 32 .
  • the first circuit area 412 is located in a part of the third copper foil except the coverage area 411. As shown in FIG. 1, the first circuit area 412 is located on both sides of the coverage area 411.
  • the area 412 can be a patterned circuit area, and the first line area 412 avoids the coverage area 411 for etching lines.
  • An insulating layer 60 is provided to make the coverage area 411 and the first line area 412 non-conductive, that is, to insulate between the coverage area 411 and the first line area 412, so that the copper around the capillary structure 50 is non-conductive. pass.
  • the first wiring area 412 is provided with a first pad, one end of the wire is welded on the first pad, and the other end is electrically connected to the image sensor, so that the first wiring area 412 supplies power to the image sensor.
  • the surface of the fourth copper foil away from the second substrate film 42 (the lower surface of the fourth copper foil), and the area of the first copper foil in addition to the heat dissipation zone 11 are all provided with an insulating layer 60, and the fourth copper foil
  • the insulation layer 60 on the lower surface can be completed by pressing, and the insulation layer 60 on the first copper foil can be completed by sticking.
  • the fourth copper foil is also a patterned circuit layer.
  • regions can be divided according to actual needs, and different regions can be treated accordingly.
  • the first circuit region 412 and the fourth copper foil for patterning circuit, and the connection area 33 of the third copper foil is subjected to surface treatment for welding or bonding with the support plate 40 .
  • the support plate 40 is a metal plate;
  • the first metal layer 10 also includes a second circuit area 34, and the second circuit area 34 is located in a part of the first metal layer 10 except the heat dissipation area 11, and is connected to the heat dissipation area. 11 are insulated, and a second pad is provided on the second line area 34, and the second pad is used to electrically connect with the functional device 70 through a wire; the second metal layer 30 except the first groove 31 and the second groove 32
  • An insulating layer 60 is provided in the region of the connecting region 33 .
  • the support plate 40 in this embodiment can be a metal plate, and the material of the metal plate can be alloy, steel, etc., which can be selected according to actual needs. This may not be limited.
  • the connection area 33 of the second copper foil can be sealed and connected to the support plate 40 by welding.
  • the support plate 40 can also be a non-metal plate with a certain hardness, and the non-metal plate can be sealed and connected with the support plate 40 through a sealant, wherein the sealant is preferably a bonding medium that is not affected by thermal viscosity, so as to Avoid air leaks in the vacuum chamber.
  • the first metal layer 10 also includes a second circuit area 34, and the second circuit area 34 is located in a partial area of the first copper foil except the heat dissipation area 11.
  • the second circuit area Area 34 is positioned at both sides of heat dissipation area 11, and second line area 34 can be patterned circuit area, and second line area 34 avoids heat dissipation area 11 etching circuit, and there is a section of unetched between second line area 34 and heat dissipation area 11
  • an insulating layer 60 is provided to make the heat dissipation region 11 and the second circuit region 34 non-conductive, that is, the heat dissipation region 11 and the second circuit region 34 are insulated.
  • the side of the second circuit layer away from the heat dissipation area 11 is also provided with an insulating layer 60
  • the second metal layer 30 is provided with an insulating layer 60 except for the first groove 31, the second groove 32 and the connection area 33.
  • Layer 60 It should be noted that, for the specific structure of each layer of the first flexible copper-clad laminate, regions can be divided according to actual needs, and different regions can be processed accordingly. holes to form heat dissipation holes 12.
  • the material of the insulating layer 60 can be resin glass fiber cloth, thermosetting pure glue or other insulating materials.
  • the specific material of the insulating layer 60 is not limited, and can be set according to actual needs. .
  • the substrate includes a first metal layer 10, a first base film 20, and a second metal layer 30 stacked in layers, and the surface of the first metal layer 10 away from the first base film 20 is provided with a The heat dissipation area 11 of the functional device, the heat dissipation area 11 is provided with a plurality of heat dissipation holes 12 at intervals, the heat dissipation holes 12 extend toward the first substrate film 20, and are blind holes; the second metal layer 30 is away from the surface of the first substrate film 20 A first groove 31 is provided at a position opposite to the heat dissipation area 11, and the support plate 40 is covered on the surface of the second metal layer 30 away from the first substrate film 20, and forms a receiving cavity with the first groove 31 to dissipate heat.
  • the parts are placed in the holding chamber.
  • the heat generated by the functional device 70 (the image sensor of the camera module) of this embodiment can be transferred to the heat sink through the heat dissipation hole 12, and the heat sink will dissipate the heat.
  • the substrate has a good heat dissipation effect and can avoid the heat dissipation of the camera module. Due to the poor heat dissipation of the circuit substrate, it is difficult to dissipate the heat generated by the image sensor, which affects the working performance of the image sensor, thereby affecting the working performance of the image camera module.
  • a camera module is also provided, and the camera module includes an image sensor and the above-mentioned substrate.
  • the camera module may be a pan-tilt anti-shake camera module, the camera module includes an image sensor and the above-mentioned substrate, and the image sensor may be fixed to the heat dissipation area 11 of the first metal layer 10 through a thermally conductive adhesive 80 .
  • the image sensor is mainly used to receive the light passing through the lens of the camera module to convert these light signals into electrical signals. Therefore, when the camera module takes pictures or takes videos, the image sensor will generate heat and produce heat.
  • the heat generated by the image sensor is transmitted to the heat sink through the heat dissipation hole 12, so that the heat is dissipated through the heat sink.
  • the heat dissipation effect of the substrate is better, which can avoid affecting the work of the camera module due to the poor heat dissipation effect of the substrate. performance, and the substrate can be composed of a first flexible copper clad laminate and a metal plate, or composed of a first flexible copper clad laminate and a second flexible copper clad laminate.
  • the thickness of the substrate is relatively thin, which saves space and facilitates the development of thinning.
  • an electronic device is also provided, and the electronic device may include a camera module.
  • electronic devices include but are not limited to mobile phones, tablet computers, notebook computers, palmtop computers, vehicle-mounted terminals, wearable devices, and pedometers.
  • the electronic device may include a camera module.
  • the camera module may be a camera module with a pan/tilt anti-shake function.
  • the camera module includes the above-mentioned substrate. The specific structure of the substrate has been described in detail above and will not be repeated here. repeat.
  • the camera module also includes a digital signal processing chip.
  • the optical image generated by the shooting scene is projected onto the image sensor through the lens, and then the optical image is converted into an electrical signal, and the electrical signal is converted into a digital signal through analog-to-digital conversion.
  • the digital signal is processed by the digital signal processing chip, and then sent to the processor in the electronic device for processing, and finally converted into an image that can be seen on the screen of the electronic device.
  • the substrate of this embodiment can be composed of a first flexible copper clad laminate and a metal plate, or a first flexible copper clad laminate and a second flexible copper clad laminate. Composed of copper plates, the thickness of the substrate is relatively thin, which can save space for electronic equipment and is conducive to the development of thinner electronic equipment.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Des modes de réalisation de la présente invention concernent un substrat, un module de caméra et un appareil électronique. Le substrat comprend : un élément de dissipation de chaleur ; une plaque de support ; et une première couche métallique, un premier film de matériau de substrat et une seconde couche métallique, qui sont agencés de manière empilée. La surface de la première couche métallique opposée au premier film de matériau de substrat est pourvue d'une zone de dissipation de chaleur pour placer un dispositif fonctionnel, la zone de dissipation de chaleur est pourvue d'une pluralité de trous de dissipation de chaleur à des intervalles, et les trous de dissipation de chaleur s'étendent vers le premier film de matériau de substrat ; une première rainure est formée dans la surface de la seconde couche métallique opposée au premier film de matériau de substrat et dans une position opposée à la zone de dissipation de chaleur, la plaque de support recouvre la surface de la seconde couche métallique opposée au premier film de substrat, et la première rainure forme ensemble une cavité de réception ; et l'élément de dissipation de chaleur est placé dans la cavité de réception.
PCT/CN2022/139883 2021-12-22 2022-12-19 Substrat, module de caméra et appareil électronique WO2023116597A1 (fr)

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CN114245566A (zh) * 2021-12-22 2022-03-25 维沃移动通信有限公司 基板、摄像头模组及电子设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6365260B1 (en) * 1996-06-29 2002-04-02 Robert Bosch Gmbh Arrangement for heat dissipation in chip modules on multilayered ceramic carriers, in particular multichip modules
US20040196633A1 (en) * 2003-02-27 2004-10-07 Shwin-Chung Wong Microchannel heat pipe with parallel grooves for recycling coolant
US20190181314A1 (en) * 2005-10-19 2019-06-13 Lg Innotek Co., Ltd. Light emitting diode package having frame with bottom surface having two surfaces different in height
CN113163588A (zh) * 2021-05-07 2021-07-23 常州欣盛半导体技术股份有限公司 基于fpc的金属线路结构及其加工方法
CN114245566A (zh) * 2021-12-22 2022-03-25 维沃移动通信有限公司 基板、摄像头模组及电子设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6365260B1 (en) * 1996-06-29 2002-04-02 Robert Bosch Gmbh Arrangement for heat dissipation in chip modules on multilayered ceramic carriers, in particular multichip modules
US20040196633A1 (en) * 2003-02-27 2004-10-07 Shwin-Chung Wong Microchannel heat pipe with parallel grooves for recycling coolant
US20190181314A1 (en) * 2005-10-19 2019-06-13 Lg Innotek Co., Ltd. Light emitting diode package having frame with bottom surface having two surfaces different in height
CN113163588A (zh) * 2021-05-07 2021-07-23 常州欣盛半导体技术股份有限公司 基于fpc的金属线路结构及其加工方法
CN114245566A (zh) * 2021-12-22 2022-03-25 维沃移动通信有限公司 基板、摄像头模组及电子设备

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