WO2023108697A1 - 一种显示装置 - Google Patents

一种显示装置 Download PDF

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Publication number
WO2023108697A1
WO2023108697A1 PCT/CN2021/139818 CN2021139818W WO2023108697A1 WO 2023108697 A1 WO2023108697 A1 WO 2023108697A1 CN 2021139818 W CN2021139818 W CN 2021139818W WO 2023108697 A1 WO2023108697 A1 WO 2023108697A1
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WO
WIPO (PCT)
Prior art keywords
display device
edge
microstructure
layer
composite functional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/139818
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English (en)
French (fr)
Inventor
占栋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to US17/622,882 priority Critical patent/US12382816B2/en
Publication of WO2023108697A1 publication Critical patent/WO2023108697A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/065—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/05—5 or more layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/402—Coloured
    • B32B2307/4023—Coloured on the layer surface, e.g. ink
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/42—Polarizing, birefringent, filtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants

Definitions

  • the present application relates to the field of display technology, in particular to a display device.
  • OLED Organic Light Emitting Diode
  • a high-viscosity middle frame glue is usually used to bond and fix the display panel and the middle frame in the display device.
  • the frame adhesive is strong, and the fixing effect is good, but the side of the display panel close to the middle frame is also provided with a backplane and a composite functional layer, which makes the display device in the process of dismantling and repairing, between the display panel and the backplane, the backplane
  • film layer delamination, edge bulging and wrinkling are prone to occur, resulting in the display device being disassembled and repaired after being unable to be reused, the yield rate is reduced, and the cost is greatly increased. The problem needs to be solved urgently.
  • the present application provides a display device, which can effectively solve the problems of delamination of film layers and bulging and wrinkling of edges that occur in the dismantling and repairing process of the current display device.
  • the present application provides a display device, the display device comprising:
  • a backplane located on one side of the display panel
  • a microstructure is provided on an edge of at least one of the display panel, the backplane and the composite functional layer.
  • the display device further includes a light-shielding ink layer, and the light-shielding ink layer is located on the side of the back plate away from the composite functional layer, wherein the light-shielding ink layer includes a light-shielding pattern, and the light-shielding pattern and The microstructure is set accordingly.
  • a first microstructure is provided on the edge of the side of the back plate close to the composite functional layer.
  • the composite functional layer includes a support layer and a buffer layer, the buffer layer is located between the support layer and the backboard, wherein the buffer layer is on the edge of the side close to the support layer A second microstructure is provided.
  • the back plate and the composite functional layer form a laminated structure, and at least one side edge of the laminated structure is covered with colloid.
  • the display panel includes a base substrate adjacent to the backplane, at least one edge of the base substrate protrudes from the stacked structure, and the base substrate protrudes from the The colloid is covered on the edge of the laminated structure.
  • a third microstructure is provided on the edge of the base substrate protruding from the stacked structure, and the third microstructure is covered with the colloid.
  • the microstructure includes a plurality of grooves arranged at intervals, and the grooves extend along the length direction of the edge.
  • the edges include two first edges extending along a first direction and two second edges extending along a second direction perpendicular to the first direction, and the microstructures are arranged on two of the on the first edge and at least one of said second edges.
  • the first edge has a curved shape, and the distribution density of the microstructures on the first edge is greater than the distribution density of the microstructures on the second edge.
  • the relationship between the display panel, the backplane and the composite functional layer can be effectively strengthened.
  • the pinning effect and adhesion effect between the display devices can effectively avoid the peeling phenomenon between the display panel, the back plate and the composite functional layer during the dismantling and repairing process of the display device, and improve the reliability of the display device. Disassemble repair yield rate, reduce costs.
  • FIG. 1 is a schematic structural diagram of a display device provided in Embodiment 1 of the present application.
  • FIG. 2 is a schematic cross-sectional view of some film layers in the display device provided in Embodiment 1 of the present application.
  • FIG. 3 is a schematic diagram of the distribution of the first microstructure on the backplane provided by Embodiment 1 of the present application.
  • FIG. 4 is a schematic diagram of the distribution of the first microstructure on the backplane provided by Embodiment 2 of the present application.
  • FIG. 5 is a schematic diagram of the distribution of the first microstructure on the backplane provided by Embodiment 3 of the present application.
  • FIG. 6 is a schematic diagram of the distribution of the first microstructure on the backplane provided by Embodiment 4 of the present application.
  • FIG. 7 is a schematic structural diagram of a display device provided in Embodiment 5 of the present application.
  • FIG. 8 is a schematic cross-sectional view of some film layers in the display device provided in Embodiment 5 of the present application.
  • the present application provides a display device, which includes: a display panel; a backplane located on one side of the display panel; a composite functional layer located on the side of the backplane away from the display panel; wherein, the A microstructure is arranged on the edge of at least one of the display panel, the backplane and the composite functional layer.
  • the pinning effect and adhesion effect between the display devices can effectively avoid the peeling phenomenon between the display panel, the back plate and the composite functional layer during the dismantling and repairing process of the display device, and improve the reliability of the display device. Disassemble repair yield rate, reduce costs.
  • FIG. 1 is a schematic structural view of a display device provided in Embodiment 1 of the present application
  • FIG. 2 is a schematic cross-sectional view of some film layers in the display device provided in Embodiment 1 of the present application.
  • the present application provides a display device 10 , and the display device 10 may be a flat display device.
  • the display device 10 includes a display panel 100, and the display panel 100 is configured to perform a display function.
  • the display panel 100 is, for example, an OLED display panel.
  • the present application does not limit the type of the display panel 100 , and in other embodiments of the present application, the display panel 100 may also be a liquid crystal display panel or an inorganic light emitting diode display panel.
  • the display panel 100 includes a base substrate 101 and a display panel body 102 fixed on the base substrate 101 .
  • the material forming the base substrate 101 includes, for example, polyimide material or polyethylene terephthalate material;
  • the display panel body 102 includes a driving circuit layer and a pixel definition layer disposed on the driving circuit layer, A plurality of pixel-defining openings arranged in an array are formed on the pixel-defining layer, and an OLED light-emitting device is arranged in each of the pixel-defining openings, and the OLED light-emitting device includes a cathode, an anode, and an electrode located between the cathode and the anode.
  • the OLED light-emitting device is also provided with an encapsulation layer for preventing water and oxygen intrusion, and the encapsulation layer may include an inorganic film layer and an organic film layer that are stacked.
  • the display device 10 further includes a middle frame (not shown in the figure) for carrying and protecting the display device 10, and a middle frame is provided on the side facing the display panel 100 of the middle frame Glue (not shown in the figure), the middle frame glue can well fix the display panel 100 and the middle frame together, and has the functions of sealing, waterproof and dustproof, etc., the setting of the middle frame glue
  • the area corresponds to the edge of the middle frame and the position of the earpiece.
  • the display device 10 further includes a backplane 110 fixedly disposed on one side of the display panel 100 .
  • the display panel 100 includes a light output side and a backlight side
  • the backplane 110 is disposed on the backlight side of the display panel 100 and between the display panel 100 and the middle frame.
  • the display device 10 further includes a composite functional layer, and the composite functional layer is disposed on a side of the backplane 110 away from the display panel 100 .
  • the composite functional layer is located between the backplane 110 and the middle frame, and is fixedly connected to the middle frame through the middle frame glue.
  • the edge of the backplane 110 is provided with a microstructure 1000, so
  • the microstructure 1000 includes a plurality of grooves arranged at intervals.
  • the microstructure 1000 disposed on the edge of the back plate 110 is a first microstructure 1101, and the first microstructure 1101 includes a plurality of grooves arranged at intervals, and the grooves are arranged along the length of the edge. direction extension.
  • the first microstructure 1101 is arranged on the edge of the side of the backboard 110 close to the composite functional layer, and the composite functional layer includes a first adhesive layer adjacent to the backboard 110.
  • the junction layer 121 , the first adhesive layer 121 can be filled in the groove in the first microstructure 1101 . Therefore, the setting of the first microstructure 1101 can effectively increase the surface roughness of the edge of the back plate 110 near the composite functional layer, expand the bonding area between the back plate 110 and the composite functional layer, and enhance
  • the pinning effect between the backplane 110 and the composite functional layer improves the adhesion effect between the backplane 110 and the composite functional layer, avoiding the damage caused by the display device 10 during dismantling and repairing.
  • the phenomenon of peeling between the backplane 110 and the composite functional layer reduces the probability of edge bulging and wrinkling of the display device 10 , improves the disassembly and repair yield of the display device 10 , and reduces costs.
  • the depth of the grooves in the first microstructure 1101 is greater than 0 micrometers and less than or equal to 10 micrometers.
  • the edges of the backplane 110 include two first edges extending along a first direction and two second edges extending along a second direction perpendicular to the first direction, and the first micro The structure 1101 is disposed on two of the first edges and at least one of the second edges.
  • the length of the first edge is greater than the length of the second edge.
  • the display device 10 further includes an integrated circuit (IC) disposed between the middle frame and the composite functional layer, and the middle frame glue is not provided between the integrated circuit and the middle frame, wherein, The integrated circuit is arranged corresponding to one of the second edges of the backplane 110, and the first microstructure 1101 is not arranged on the second edge of the backplane 110 corresponding to the integrated circuit .
  • IC integrated circuit
  • the composite functional layer includes a plurality of laminated film layers.
  • a microstructure 1000 is arranged on the edge of the composite function.
  • the microstructure 1000 includes a plurality of grooves arranged at intervals.
  • the microstructure 1000 disposed on the edge of the composite functional layer is a second microstructure 1221, and the second microstructure 1221 includes a plurality of grooves arranged at intervals, and the grooves are arranged along the edge. extending in the length direction.
  • the composite functional layer includes a buffer layer 120 and a support layer 130, and the buffer layer 120 is located between the support layer 130 and the back plate 110, wherein the buffer layer 120 can support the
  • the display panel 100 acts as a buffer to improve the stability of the display device 10.
  • the buffer layer 120 includes the first adhesive layer 121 and is located between the first adhesive layer 121 and the supporting layer.
  • the foam material layer 122 between 130, the first adhesive layer 121 stably connects the foam material layer 122 and the back plate 110 together;
  • the support layer 130 is used to support the display panel 100, improving the rigidity of the display device 10,
  • the support layer 130 includes a second adhesive layer 131, a polyimide layer 132 and a metal layer 133, the second adhesive layer 131 is adjacent to the buffer layer 120
  • the metal layer 133 is set adjacent to the middle frame glue, the metal layer 133 is, for example, metal copper foil or tile alloy, and the polyimide layer 132 is located between the second bonding layer 131 and the between metal layers 133 .
  • the second microstructure 1221 is disposed on the edge of the cushioning layer 120 close to the support layer 130 , specifically on a side of the foam material layer 122 close to the support layer 130 On the edge of the side, since the second adhesive layer 131 in the support layer 130 is adjacent to the foam material layer 122, the second adhesive layer 131 can be filled in the second microstructure 1221 in the groove. Therefore, the setting of the second microstructure 1221 can effectively increase the surface roughness of the edge of the buffer layer 120 facing the support layer 130, and expand the adhesion between the buffer layer 120 and the support layer 130.
  • junction area enhance the pinning effect between the buffer layer 120 and the support layer 130, improve the adhesion effect between the buffer layer 120 and the support layer 130, and prevent the display device 10 from being disassembled During the rework process, peeling occurs between the buffer layer 120 and the support layer 130 , which reduces the probability of edge swelling and wrinkling of the display device 10 , improves the disassembly and repair yield of the display device 10 , and reduces costs.
  • the depth of the grooves in the second microstructure 1221 is greater than 0 micrometers and less than or equal to 10 micrometers.
  • the edges of the composite functional layer include two first edges extending along a first direction and two second edges extending along a second direction perpendicular to the first direction, and the second micro The structure 1221 is disposed on two of the first edges and at least one of the second edges.
  • the length of the first edge is greater than the length of the second edge.
  • the display device 10 further includes an integrated circuit (IC) disposed between the middle frame and the composite functional layer, and the middle frame glue is not provided between the integrated circuit and the middle frame, wherein, The integrated circuit is arranged corresponding to one of the second edges of the composite functional layer, and the second microstructure 1221 is not arranged on the second edge of the composite functional layer corresponding to the integrated circuit .
  • IC integrated circuit
  • the back plate 110 and the composite functional layer form a laminated structure, at least one edge of the laminated structure is covered with glue 140 , and the width of the glue 140 is, for example, less than or equal to 20 mm.
  • the colloid 140 can stably combine the laminated structure formed by the back plate 110 and the composite functional layer, so as to further reduce the possibility of film peeling between the back plate 110 and the composite functional layer. probability, improve the disassembly and repair yield rate of the display device 10, and reduce the cost.
  • the base substrate 101 in the display panel 100 protrudes from the stacked structure, and the base substrate 101 protrudes from the edge of the stacked structure It is covered with the colloid 140 .
  • the colloid 140 can make the laminated structure and the display panel 100 together stably, so as to further reduce the probability of film peeling between the display panel 100 and the laminated structure, and improve the The dismantling repair yield rate of the display device 10 is reduced to reduce costs.
  • the edge of the display panel 100 is provided with a microstructure 1000 , the microstructure 1000 includes a plurality of grooves arranged at intervals.
  • the microstructure 1000 disposed on the edge of the display panel 100 is a third microstructure 1011, and the third microstructure 1011 is specifically disposed on the side of the base substrate 101 close to the backplane 110.
  • the third microstructure 1011 includes a plurality of grooves arranged at intervals, and the grooves extend along the length direction of the edge.
  • the colloid 140 fills the recesses in the third microstructure 1011 in the slot. Therefore, the arrangement of the third microstructure 1011 can effectively increase the surface roughness of the edge of the display panel 100 near the back plate 110, and expand the adhesion between the display panel 100 and the laminated structure.
  • junction area enhance the pinning effect between the display panel 100 and the laminated structure, improve the adhesion effect between the display panel 100 and the laminated structure, and prevent the display device 10 from being disassembled During the rework process, peeling occurs between the display panel 100 and the back plate 110 , which reduces the probability of edge swelling and wrinkling of the display device 10 , improves the disassembly and repair yield of the display device 10 , and reduces costs.
  • the depth of the grooves in the third microstructure 1011 is greater than 0 micrometers and less than or equal to 10 micrometers.
  • the edges of the display panel 100 include two first edges extending along a first direction and two second edges extending along a second direction perpendicular to the first direction, and the third micro The structure 1011 is disposed on two of the first edges and at least one of the second edges.
  • the length of the first edge is greater than the length of the second edge.
  • the display device 10 further includes an integrated circuit (IC) disposed between the middle frame and the composite functional layer, and the middle frame glue is not provided between the integrated circuit and the middle frame, wherein, The integrated circuit is disposed corresponding to one of the second edges of the display panel, and the third microstructure 1011 is not disposed on the second edge of the display panel 100 disposed corresponding to the integrated circuit.
  • IC integrated circuit
  • the display device 10 further includes a light-shielding ink layer 160, the light-shielding ink layer 160 is located on the side of the back plate 110 away from the composite functional layer, wherein the light-shielding ink layer 160 includes a light-shielding pattern , the light-shielding pattern is set corresponding to the microstructure 1000 . Since the light-shielding pattern is set corresponding to the microstructure 1000 , it can effectively avoid the degradation of display quality caused by optical phenomena such as scattering and refraction when the light irradiates the microstructure 1000 .
  • the side of the display panel 100 away from the back plate 110 is further provided with a polarizer 150 and a cover plate 170 stacked in sequence.
  • the polarizer 150 is used to reduce the reflected light formed by the external ambient light on the display device 10 and improve the display effect of the display device 10.
  • the optical film type for reducing the reflected light is not limited to the polarizer 150.
  • the polarizer 150 can be replaced with a color filter; the cover 170 is used to protect the display panel 100 , and its material can be a flexible cover formed of ultra-thin glass or organic material.
  • the light-shielding ink layer 160 may be disposed between the cover plate 170 and the polarizer 150 .
  • the microstructure 1000 includes the first microstructure 1101 disposed on the edge of the backplane 110, the second microstructure 1221 disposed on the edge of the composite functional layer, and the The third microstructure 1011 on the edge of the display panel 100 .
  • the first microstructure 1101, the second microstructure 1221 and the third microstructure 1011 all include a plurality of grooves arranged at intervals, and the grooves extend along the length direction of the edge, wherein the The arrangement of grooves in the first microstructure 1101 , the second microstructure 1221 and the third microstructure 1011 may be the same or different.
  • the grooves in the first microstructure 1101, the second microstructure 1221 and the third microstructure 1011 are set in the same or similar form, and the first microstructure 1101 is taken as an example below to describe the The configuration of the grooves in the microstructure 1000 will be described.
  • FIG. 3 is a schematic diagram of the distribution of the first microstructure on the backplane provided by Embodiment 1 of the present application.
  • the first microstructure 1101 on the edge of the backplane 110 includes a plurality of grooves arranged at intervals 1001, the groove 1001 extends along the length direction of the edge, and the cross-sectional shape of the groove 1001 is, for example, a rectangle.
  • the cross-sectional shape of the groove 1001 can also be circle or triangle etc.
  • the shape of the back plate 110 is rectangular, and the edges of the back plate 110 include two opposite first edges 111 and two opposite second edges 112, the length of the first edges 111 is longer than the The length of the second edge 112, the first edge 111 extends along the first direction, the second edge 112 extends along the second direction, and the first direction is perpendicular to the second direction.
  • the first microstructure 1101 includes multiple rows of groove groups arranged on each of the first edges 111, and each row of groove groups includes at least one groove 1001; the first microstructure 1101 also includes a set At least one row of groove groups on one of the second edges 112, each row of groove groups includes at least one groove 1001, the other second edge 112 is not provided with the groove group, and the groove group is not provided with the
  • the second edge 112 of the groove group corresponds to a binding area of the display device, and the binding area is provided with the integrated circuit.
  • each first edge 111 of the back plate 110 is provided with two rows of groove groups, and each row of groove groups includes one groove 1001; one of the second edges 112 is provided with a row of grooves.
  • the distribution manner of the grooves 1001 in the second microstructure 1221 and the third microstructure 1011 is the same as the distribution manner of the grooves 1001 in the first microstructure 1101, so as to avoid
  • the microstructures 1000 distributed in different ways are arranged on the display panel 100 , the backplane 110 and the composite functional layer respectively, resulting in increased process complexity.
  • FIG. 4 is a schematic diagram of the distribution of the first microstructure on the backplane provided by Embodiment 2 of the present application.
  • the structure of the display device 10 provided in Embodiment 1 of the application is similar, and this embodiment will not repeat the same parts.
  • the grooves 1001 are distributed in different ways.
  • the microstructure 1000 includes the first microstructure 1101 disposed on the edge of the backplane 110, the second microstructure 1221 disposed on the edge of the composite functional layer, and the The third microstructure 1011 on the edge of the display panel 100 is described above.
  • the structures of the grooves 1001 in the first microstructure 1101 , the second microstructure 1221 and the third microstructure 1011 are the same.
  • the arrangement form of the groove 1001 in the microstructure 1000 will be described.
  • the first microstructure 1101 includes multiple rows of groove groups arranged on each of the first edges 111, each row of groove groups includes a plurality of grooves 1001 arranged at intervals, two of the groove groups
  • the grooves 1001 on the first edge 111 are arranged axially symmetrically, and the grooves 1001 in each row of groove groups and the grooves 1001 in the adjacent row of groove groups are arranged in a misalignment, and the size of each groove 1001 is the same
  • the first microstructure 1101 also includes a plurality of rows of groove groups arranged on one of the second edges 112, each row of groove groups includes at least one of the grooves 1001, and each row of groove groups
  • the grooves 1001 and the grooves 1001 in the groove groups in the adjacent row are arranged in offsets, and the groove group is not provided on the other second edge 112 .
  • the first microstructure 1101 on the edge of the back plate 110 includes more grooves 1001 arranged at intervals, and the distribution of the grooves 1001 is more complex. It is possible to further increase the bonding area between the backplane 110 and the composite functional layer, enhance the pinning effect between the backplane 110 and the composite functional layer, and prevent the The phenomenon of peeling between the backplane 110 and the composite functional layer reduces the probability of edge bulging and wrinkling of the display device 10 , improves the disassembly and repair yield of the display device, and reduces costs.
  • the distribution method of the grooves 1001 in the second microstructure 1221 and the third microstructure 1011 is the same as the distribution method of the grooves 1001 in the first microstructure 1101, and this embodiment is here I won't repeat them one by one.
  • Fig. 5 is a schematic diagram of the distribution of the first microstructure on the backplane provided by Embodiment 3 of the present application.
  • Embodiment 3 of the present application provides a display device 10, which is compatible with the The structure of the display device 10 provided in Embodiment 1 of the application is similar, and this embodiment will not repeat the same parts.
  • the grooves 1001 are distributed in different ways.
  • the microstructure 1000 includes the first microstructure 1101 disposed on the edge of the backplane 110, the second microstructure 1221 disposed on the edge of the composite functional layer, and the The third microstructure 1011 on the edge of the display panel 100 is described above.
  • the structures of the grooves 1001 in the first microstructure 1101 , the second microstructure 1221 and the third microstructure 1011 are the same.
  • the arrangement form of the groove 1001 in the microstructure 1000 will be described.
  • the first microstructure 1101 includes multiple rows of groove groups arranged on each of the first edges 111, each row of groove groups includes a plurality of grooves 1001 arranged at intervals, two of the groove groups The grooves 1001 on the first edge 111 are arranged in an array, and the distances between the grooves 1001 in each row of groove groups are different, and each groove 1001 in each row of groove groups and the groove groups in the adjacent row Part of the grooves 1001 are set in dislocation, and the size of each groove 1001 is the same; the first microstructure 1101 also includes a plurality of rows of groove groups arranged on one of the second edges 112, and each row of groove groups includes At least one groove 1001 is arranged at intervals, and each groove 1001 in each row of groove groups is offset from each groove 1001 in the adjacent row of groove groups, and the other second edge 112 is not provided with the groove group.
  • the first microstructure 1101 on the edge of the back plate 110 includes more grooves 1001 arranged at intervals, and the distribution of the grooves 1001 is more complex. It is possible to further increase the bonding area between the backplane 110 and the composite functional layer, enhance the pinning effect between the backplane 110 and the composite functional layer, and prevent the The phenomenon of peeling between the backplane 110 and the composite functional layer reduces the probability of edge bulging and wrinkling of the display device 10 , improves the disassembly and repair yield of the display device, and reduces costs.
  • the distribution method of the grooves 1001 in the second microstructure 1221 and the third microstructure 1011 is the same as the distribution method of the grooves 1001 in the first microstructure 1101, and this embodiment is here I won't repeat them one by one.
  • FIG. 6 is a schematic diagram of the distribution of the first microstructure on the backplane provided by Embodiment 4 of the present application.
  • the structure of the display device 10 provided in Embodiment 2 of the application is similar, and this embodiment will not repeat the same parts.
  • the grooves 1001 are distributed in different ways.
  • the microstructure 1000 includes the first microstructure 1101 disposed on the edge of the backplane 110, the second microstructure 1221 disposed on the edge of the composite functional layer, and the The third microstructure 1011 on the edge of the display panel 100 is described above.
  • the structures of the grooves 1001 in the first microstructure 1101 , the second microstructure 1221 and the third microstructure 1011 are the same.
  • the arrangement form of the groove 1001 in the microstructure 1000 will be described.
  • the first microstructure 1101 includes multiple rows of groove groups arranged on each of the first edges 111, each row of groove groups includes a plurality of grooves 1001 arranged at intervals, two of the groove groups
  • the grooves 1001 on the first edge 111 are arranged axially symmetrically, the sizes of the two adjacent grooves 1001 in each row of groove groups are different, and each groove 1001 in each row of groove groups and the grooves in the adjacent rows
  • the grooves 1001 in the groove group are arranged in dislocation;
  • the first microstructure 1101 also includes a plurality of rows of groove groups arranged on one of the second edges 112, and each row of groove groups includes at least one of the grooves 1001, and the grooves 1001 in each row of groove groups are offset with the grooves 1001 in the adjacent row of groove groups, and the other second edge 112 is not provided with the groove group.
  • the first microstructure 1101 on the edge of the back plate 110 includes more grooves 1001 arranged at intervals, and the distribution of the grooves 1001 is more complex. It is possible to further increase the bonding area between the backplane 110 and the composite functional layer, enhance the pinning effect between the backplane 110 and the composite functional layer, and prevent the The phenomenon of peeling between the backplane 110 and the composite functional layer reduces the probability of edge bulging and wrinkling of the display device 10 , improves the disassembly and repair yield of the display device, and reduces costs.
  • the distribution method of the grooves 1001 in the second microstructure 1221 and the third microstructure 1011 is the same as the distribution method of the grooves 1001 in the first microstructure 1101, and this embodiment is here I won't repeat them one by one.
  • FIG. 7 is a schematic structural view of the display device provided in Embodiment 5 of the present application
  • FIG. 8 is a schematic cross-sectional view of some film layers in the display device provided in Embodiment 5 of the present application.
  • the present application provides a display device 10 .
  • the display device 10 may be a curved display device, and the curved display device includes a four-curved display device or a hyperbolic display device.
  • the display device 10 provided in Embodiment 5 of the present application is similar to the display devices 10 in Embodiment 1 to Embodiment 4, and includes the same film structure, and the distribution of grooves in the microstructure 1000 can be It is any one of the four groove distribution modes in Embodiment 1 to Embodiment 4, and this embodiment will not repeat them one by one here.
  • the two first edges 111 and the two second edges 112 of the back plate 110 have curved shapes; the two first edges of the composite functional layer Both the edge 111 and the two second edges 112 have a curved shape; the two first edges 111 and the two second edges 112 of the display panel 100 both have a curved shape.
  • the display device 10 is a hyperboloid display device
  • the two first edges 111 of the backplane 110 both have a curved shape;
  • the two first edges 111 of the composite functional layer both have a curved shape;
  • the display panel The two first edges 111 of the 100 both have curved shapes.
  • the display device 10 is a hyperboloid display device, and continue to take the first microstructure 1101 as an example to describe the arrangement of the grooves 1001 in the microstructure 1000 .
  • the first edge 111 has a curved shape
  • the second edge 112 has a planar shape
  • the layout density of the first microstructure 1101 on the first edge 111 is greater than that of the first microstructure 1101 on the second edge 1101.
  • the layout density on the two edges 112 that is, the area ratio of the grooves on each of the first edges 111 is greater than the area ratio of the grooves on each of the second edges 112 .
  • the backplane 110 and the composite functional layer can effectively reduce the probability of bulging and wrinkling on the edge of the curved surface of the hyperboloid display device, improve the disassembly and repair yield of the display device 10 , and reduce costs.
  • the present application provides a display device, which includes: a display panel; a backplane located on one side of the display panel; a composite functional layer located on a side of the backplane away from the display panel side; wherein, the edge of at least one of the display panel, the backplane and the composite functional layer is provided with a microstructure.
  • a display device which includes: a display panel; a backplane located on one side of the display panel; a composite functional layer located on a side of the backplane away from the display panel side; wherein, the edge of at least one of the display panel, the backplane and the composite functional layer is provided with a microstructure.
  • the pinning effect and adhesion effect between the display device thereby effectively avoiding the peeling phenomenon between the display panel, the back plate and the composite functional layer during the dismantling and repairing process of the display device, and improving the performance of the display device Disassemble repair yield rate, reduce costs.

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Abstract

一种显示装置（10），包括：显示面板（100）；背板（110），位于显示面板（100）的一侧；复合功能层，位于背板（110）远离显示面板（100）的一侧；其中，显示面板（100）、背板（110）和复合功能层中的至少一个的边缘上设置有微结构（1000），微结构（1000）能够有效避免显示装置在拆机返修过程中显示面板（100）、背板（110）和复合功能层之间出现剥离现象，提高显示装置的拆机返修良率，降低成本。

Description

一种显示装置 技术领域
本申请涉及显示技术领域，具体涉及一种显示装置。
 背景技术
有机发光二极管（Organic Light Emitting Diode，OLED）显示装置具有驱动电压低、发光效率高、响应时间短、清晰度与对比度高、近180°视角、使用温度范围宽，可实现柔性显示与大面积全色显示等诸多优点，被业界公认为是最有发展潜力的显示装置。
为了保证OLED显示装置的整机组装的稳定性和防水需求，在现有技术的显示装置中，通常会采用高粘性的中框胶将显示装置中的显示面板与中框进行粘结固定，中框胶粘性较强，固定效果良好，但显示面板靠近中框的一侧还设置有背板和复合功能层，这使得显示装置在拆机返修过程中，显示面板与背板之间、背板与复合功能层之间或复合功能层中的膜层之间容易发生膜层分层、边缘鼓包褶皱等现象，导致显示装置拆机返修后无法重复利用，良率下降，成本大大升高，此问题亟待解决。
 技术问题
本申请提供一种显示装置，能够有效解决目前显示装置在拆机返修过程中出现的膜层分层、边缘鼓包褶皱的问题。
 技术解决方案
本申请提供一种显示装置，所述显示装置包括：
显示面板；
背板，位于所述显示面板的一侧；
复合功能层，位于所述背板远离所述显示面板的一侧；
其中，所述显示面板、所述背板和所述复合功能层中的至少一个的边缘上设置有微结构。
可选的，所述显示装置还包括遮光油墨层，所述遮光油墨层位于所述背板远离所述复合功能层的一侧，其中，所述遮光油墨层包括遮光图案，所述遮光图案与所述微结构对应设置。
可选的，所述背板靠近所述复合功能层的一侧的边缘上设置有第一微结构。
可选的，所述复合功能层包括支撑层和缓冲层，所述缓冲层位于所述支撑层和所述背板之间，其中，所述缓冲层靠近所述支撑层的一侧的边缘上设置有第二微结构。
可选的，所述背板和所述复合功能层形成一叠层结构，所述叠层结构的至少一个侧缘上覆盖有胶体。
可选的，所述显示面板包括与所述背板邻接设置的衬底基板，所述衬底基板的至少一个边缘凸出于所述叠层结构，且所述衬底基板凸出于所述叠层结构的所述边缘上覆盖有所述胶体。
可选的，所述衬底基板凸出于所述叠层结构的所述边缘上设置有第三微结构，且所述第三微结构上覆盖有所述胶体。
可选的，所述微结构包括间隔设置的多个凹槽，所述凹槽沿所述边缘的长度方向延伸。
可选的，所述边缘包括沿第一方向延伸的两个第一边缘和沿垂直于所述第一方向的第二方向延伸的两个第二边缘，所述微结构设置于两个所述第一边缘及至少一个所述第二边缘上。
可选的，所述第一边缘具有曲面形态，且所述第一边缘上的所述微结构的分布密度大于所述第二边缘上的所述微结构的分布密度。
 有益效果
本申请通过在所述显示面板、所述背板和所述复合功能层中的至少一个的边缘上设置有微结构，能够有效增强所述显示面板、所述背板和所述复合功能层之间的钉扎效果与粘附效果，从而有效避免所述显示装置在拆机返修过程中所述显示面板、所述背板和所述复合功能层之间出现剥离现象，提高所述显示装置的拆机返修良率，降低成本。
 附图说明
下面结合附图，通过对本申请的具体实施方式详细描述，将使本申请的技术方案及其它有益效果显而易见。
图1为本申请实施例一提供的显示装置的结构示意图。
图2为本申请实施例一提供的显示装置中的部分膜层的剖面示意图。
图3为本申请实施例一提供的第一微结构在背板上的分布示意图。
图4为本申请实施例二提供的第一微结构在背板上的分布示意图。
图5为本申请实施例三提供的第一微结构在背板上的分布示意图。
图6为本申请实施例四提供的第一微结构在背板上的分布示意图。
图7为本申请实施例五提供的显示装置的结构示意图。
图8为本申请实施例五提供的显示装置中的部分膜层的剖面示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。此外，应当理解的是，此处所描述的具体实施方式仅用于说明和解释本申请，并不用于限制本申请。在本申请中，在未作相反说明的情况下，使用的方位词如“上”和“下”通常是指装置实际使用或工作状态下的上和下，具体为附图中的图面方向；而“内”和“外”则是针对装置的轮廓而言的。
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本申请提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。以下分别进行详细说明，需说明的是，以下实施例的描述顺序不作为对实施例优选顺序的限定。
本申请提供一种显示装置，所述显示装置包括：显示面板；背板，位于所述显示面板的一侧；复合功能层，位于所述背板远离所述显示面板的一侧；其中，所述显示面板、所述背板和所述复合功能层中的至少一个的边缘上设置有微结构。本申请通过在所述显示面板、所述背板和所述复合功能层中的至少一个的边缘上设置有微结构，能够有效增强所述显示面板、所述背板和所述复合功能层之间的钉扎效果与粘附效果，从而有效避免所述显示装置在拆机返修过程中所述显示面板、所述背板和所述复合功能层之间出现剥离现象，提高所述显示装置的拆机返修良率，降低成本。
实施例一
图1为本申请实施例一提供的显示装置的结构示意图；图2为本申请实施例一提供的显示装置中的部分膜层的剖面示意图。结合图1和图2所示，本申请提供一种显示装置10，所述显示装置10可以为平面显示装置。
本实施例中，所述显示装置10包括显示面板100，所述显示面板100用于执行显示功能。本实施例中，所述显示面板100例如为OLED显示面板。当然，本申请对所述显示面板100的类型不作限制，在本申请的其他实施例中，所述显示面板100还可以是液晶显示面板或无机发光二极管显示面板。
本实施例中，所述显示面板100包括衬底基板101和固定设置于所述衬底基板101上的显示面板本体102。形成所述衬底基板101的材料例如包括聚酰亚胺材料或聚对苯二甲酸乙二醇酯材料；所述显示面板本体102包括驱动电路层和设置于驱动电路层上的像素定义层，所述像素定义层上形成有阵列排布的多个像素定义开口，每个所述像素定义开口内设置有OLED发光器件，所述OLED发光器件包括阴极、阳极和位于所述阴极和所述阳极之间的发光单元，所述OLED发光器件上例如还设置有用于防止水氧入侵的封装层，所述封装层可以包括层叠设置的无机膜层和有机膜层。
本实施例中，所述显示装置10还包括中框（图中未示出），用于承载和保护所述显示装置10，所述中框朝向所述显示面板100的一侧设置有中框胶（图中未示出），所述中框胶能够将所述显示面板100与所述中框很好的固定到一起，并具有密封、防水防尘等作用，所述中框胶的设置区域与所述中框的边缘及听筒位置相对应。
本实施例中，所述显示装置10还包括固定设置于所述显示面板100的一侧的背板110。具体的，所述显示面板100包括出光侧和背光侧，所述背板110设置于所述显示面板100的背光侧，并位于所述显示面板100和所述中框之间。
本实施例中，所述显示装置10还包括复合功能层，所述复合功能层设置于所述背板110远离所述显示面板100的一侧。具体的，所述复合功能层位于所述背板110和所述中框之间，并通过所述中框胶与所述中框固定连接。
本实施例中，为了有效避免拆机过程所述显示装置10中的所述背板110和所述复合功能层之间出现剥离现象，所述背板110的边缘上设置有微结构1000，所述微结构1000包括间隔设置的多个凹槽。具体的，设置于所述背板110的边缘上的微结构1000为第一微结构1101，所述第一微结构1101包括间隔设置的多个凹槽，所述凹槽沿所述边缘的长度方向延伸。
本实施例中，所述第一微结构1101设置在所述背板110靠近所述复合功能层的一侧的边缘上，所述复合功能层包括与所述背板110邻接设置的第一粘结层121，所述第一粘结层121能够填充于所述第一微结构1101中的所述凹槽中。因此，所述第一微结构1101的设置能够有效增加所述背板110靠近所述复合功能层一侧的边缘的表面粗糙度，扩大背板110和复合功能层之间的粘结面积，增强所述背板110和所述复合功能层之间的钉扎效应，提升所述背板110和所述复合功能层之间的粘附效果，避免所述显示装置10在拆机返修过程中所述背板110和所述复合功能层之间出现剥离现象，降低显示装置10出现边缘鼓包褶皱问题的概率，提高所述显示装置10的拆机返修良率，降低成本。
本实施例中，所述第一微结构1101中的凹槽的深度大于0微米，且小于或等于10微米。
本实施例中，所述背板110的边缘包括沿第一方向延伸的两个第一边缘和沿垂直于所述第一方向的第二方向延伸的两个第二边缘，所述第一微结构1101设置于两个所述第一边缘及至少一个所述第二边缘上。优选的，所述第一边缘的长度大于所述第二边缘的长度。所述显示装置10还包括设置于所述中框和所述复合功能层之间的集成电路（IC），且所述集成电路与所述中框之间未设置所述中框胶，其中，所述集成电路与所述背板110的一个所述第二边缘对应设置，且与所述集成电路对应设置的所述背板110的所述第二边缘上未设置所述第一微结构1101。
本实施例中，所述复合功能层包括层叠设置的多个膜层，为了有效避免拆机过程中所述多个膜层之间出现剥离现象，所述复合功能的边缘上设置有微结构1000，所述微结构1000包括间隔设置的多个凹槽。具体的，设置于所述复合功能层的边缘上的所述微结构1000为第二微结构1221，所述第二微结构1221包括间隔设置的多个凹槽，所述凹槽沿所述边缘的长度方向延伸。
本实施例中，所述复合功能层包括缓冲层120和支撑层130，所述缓冲层120位于所述支撑层130和所述背板110之间，其中，所述缓冲层120能够对所述显示面板100起到一定的缓冲作用，以提升所述显示装置10的稳定性，所述缓冲层120包括所述第一粘结层121和位于所述第一粘结层121和所述支撑层130之间的泡棉材料层122，所述第一粘结层121将所述泡棉材料层122和所述背板110稳定的连接到一起；所述支撑层130用于支撑所述显示面板100，提升所述显示装置10的刚性，所述支撑层130包括第二粘结层131、聚酰亚胺层132和金属层133，所述第二粘结层131与所述缓冲层120邻接设置，所述金属层133与所述中框胶邻接设置，所述金属层133例如为金属铜箔或瓦合金，所述聚酰亚胺层132位于所述第二粘结层131和所述金属层133之间。
本实施例中，所述第二微结构1221设置于所述缓冲层120靠近所述支撑层130的一侧的边缘上，具体设置于所述泡棉材料层122靠近所述支撑层130的一侧的边缘上，由于所述支撑层130中的所述第二粘结层131与所述泡棉材料层122邻接设置，使得所述第二粘结层131能够填充于所述第二微结构1221中的所述凹槽中。因此，所述第二微结构1221的设置能够有效增加所述缓冲层120朝向所述支撑层130一侧的边缘的表面粗糙度，扩大所述缓冲层120和所述支撑层130之间的粘结面积，增强所述缓冲层120和所述支撑层130之间的钉扎效应，提升所述缓冲层120和所述支撑层130之间的粘附效果，避免所述显示装置10在拆机返修过程中所述缓冲层120和所述支撑层130之间出现剥离现象，降低显示装置10出现边缘鼓包褶皱问题的概率，提高所述显示装置10的拆机返修良率，降低成本。
本实施例中，所述第二微结构1221中的凹槽的深度大于0微米，且小于或等于10微米。
本实施例中，所述复合功能层的边缘包括沿第一方向延伸的两个第一边缘和沿垂直于所述第一方向的第二方向延伸的两个第二边缘，所述第二微结构1221设置于两个所述第一边缘及至少一个所述第二边缘上。优选的，所述第一边缘的长度大于所述第二边缘的长度。所述显示装置10还包括设置于所述中框和所述复合功能层之间的集成电路（IC），且所述集成电路与所述中框之间未设置所述中框胶，其中，所述集成电路与所述复合功能层的一个所述第二边缘对应设置，且与所述集成电路对应设置的所述复合功能层的所述第二边缘上未设置所述第二微结构1221。
本实施例中，所述背板110和所述复合功能层形成一叠层结构，所述叠层结构的至少一侧缘上覆盖有胶体140，所述胶体140的宽度例如小于或等于20mm。所述胶体140能够使所述背板110和所述复合功能层形成的叠层结构稳定的结合到一起，以进一步降低所述背板110和所述复合功能层之间发生膜层剥离问题的几率，提高所述显示装置10的拆机返修良率，降低成本。
本实施例中，所述显示面板100中的所述衬底基板101的至少一个边缘凸出于所述叠层结构，且所述衬底基板101凸出于所述叠层结构的所述边缘上覆盖有所述胶体140。所述胶体140能够使所述叠层结构与所述显示面板100稳定的结合到一起，以进一步降低所述显示面板100和所述叠层结构之间发生膜层剥离问题的几率，提高所述显示装置10的拆机返修良率，降低成本。
本实施例中，为了进一步降低拆机过程所述显示装置10中的所述显示面板100和所述叠层结构之间出现剥离问题的几率，所述显示面板100的边缘上设置有微结构1000，所述微结构1000包括间隔设置的多个凹槽。具体的，设置于所述显示面板100的边缘上的微结构1000为第三微结构1011，所述第三微结构1011具体设置在所述衬底基板101靠近所述背板110的一侧的边缘上，所述第三微结构1011包括间隔设置的多个凹槽，所述凹槽沿所述边缘的长度方向延伸。
本实施例中，由于所述衬底基板101凸出于所述叠层结构的所述边缘上覆盖有所述胶体140，所述胶体140填充于所述第三微结构1011中的所述凹槽中。因此，所述第三微结构1011的设置能够有效增加所述显示面板100靠近所述背板110一侧的边缘的表面粗糙度，扩大所述显示面板100和所述叠层结构之间的粘结面积，增强所述显示面板100和所述叠层结构之间的钉扎效应，提升所述显示面板100和所述叠层结构之间的粘附效果，避免所述显示装置10在拆机返修过程中所述显示面板100和所述背板110之间出现剥离现象，降低显示装置10出现边缘鼓包褶皱问题的概率，提高所述显示装置10的拆机返修良率，降低成本。
本实施例中，所述第三微结构1011中的凹槽的深度大于0微米，且小于或等于10微米。
本实施例中，所述显示面板100的边缘包括沿第一方向延伸的两个第一边缘和沿垂直于所述第一方向的第二方向延伸的两个第二边缘，所述第三微结构1011设置于两个所述第一边缘及至少一个所述第二边缘上。优选的，所述第一边缘的长度大于所述第二边缘的长度。所述显示装置10还包括设置于所述中框和所述复合功能层之间的集成电路（IC），且所述集成电路与所述中框之间未设置所述中框胶，其中，所述集成电路与所述显示面板的一个所述第二边缘对应设置，且与所述集成电路对应设置的所述显示面板100的所述第二边缘上未设置所述第三微结构1011。
本实施例中，所述显示装置10还包括遮光油墨层160，所述遮光油墨层160位于所述背板110远离所述复合功能层的一侧，其中，所述遮光油墨层160包括遮光图案，所述遮光图案与所述微结构1000对应设置。由于所述遮光图案与所述微结构1000对应设置，从而能够有效避免光线照射到所述微结构1000时产生散射、折射等光学现象而导致的显示质量下降的问题。
本实施例中，所述显示面板100远离所述背板110的一侧还依次层叠设置有偏光片150和盖板170。所述偏光片150用于降低外界环境光在所述显示装置10上形成的反射光，提升显示装置10的显示效果，当然，降低所述反射光的光学膜类型并不限于偏光片150，在其他实施例中，所述偏光片150还可替换为彩色滤光片；所述盖板170用于保护所述显示面板100，其材质可以为超薄玻璃或有机材料形成的柔性盖板。所述遮光油墨层160可以设置在所述盖板170和所述偏光片150之间。
本实施例中，所述微结构1000包括设置于所述背板110的边缘上的所述第一微结构1101、设置于所述复合功能层的边缘上的所述第二微结构1221和设置于所述显示面板100的边缘上的第三微结构1011。所述第一微结构1101、所述第二微结构1221和所述第三微结构1011均包括间隔设置的多个凹槽，且所述凹槽沿所述边缘的长度方向延伸，其中，所述第一微结构1101、所述第二微结构1221和所述第三微结构1011中的凹槽设置形式可以相同或不同。优选的，所述第一微结构1101、所述第二微结构1221和所述第三微结构1011中的凹槽设置形式相同或相似，下面以所述第一微结构1101作为示例，对所述微结构1000中的凹槽的设置形式进行说明。
图3为本申请实施例一提供的第一微结构在背板上的分布示意图，如图3所示，所述背板110的边缘上的第一微结构1101包括间隔设置的多个凹槽1001，所述凹槽1001沿所述边缘的长度方向延伸，所述凹槽1001的截面形状例如为矩形，当然，在本申请的其他实施例中，所述凹槽1001的截面形状还可以为圆形或三角形等。
具体的，所述背板110的形状为矩形，所述背板110的边缘包括两个相对设置的第一边缘111和两个相对设置的第二边缘112，第一边缘111的长度大于所述第二边缘112的长度，所述第一边缘111沿所述第一方向延伸，所述第二边缘112沿所述第二方向延伸，所述第一方向与所述第二方向垂直。所述第一微结构1101包括设置在每个所述第一边缘111上的多列凹槽组，每列凹槽组包括至少一个所述凹槽1001；所述第一微结构1101还包括设置在其中一个所述第二边缘112上的至少一列凹槽组，每列凹槽组包括至少一个凹槽1001，另外一个所述第二边缘112上未设置所述凹槽组，未设置所述凹槽组的所述第二边缘112对应的所述显示装置的绑定区，所述绑定区设置有所述集成电路。
进一步的，所述背板110的每个第一边缘111上设置有两列凹槽组，每列凹槽组包括一个所述凹槽1001；其中一个所述第二边缘112上设置有一列凹槽组，所述凹槽组包括一个所述凹槽1001，另外一个所述第二边缘上未设置所述凹槽组。
相应的，所述第二微结构1221和所述第三微结构1011中的凹槽1001的分布方式，与所述第一微结构1101中的凹槽1001的分布方式相同，以避免由于分别需要在所述显示面板100、所述背板110和所述复合功能层上分别设置不同分布方式的微结构1000，而导致的工艺复杂度增加。
实施例二
图4为本申请实施例二提供的第一微结构在背板上的分布示意图，结合图2和图4所示，本申请实施例二提供一种显示装置10，所述显示装置10与本申请实施例一提供的显示装置10结构相类似，本实施例对于相同部分不再赘述，不同的是，所述显示装置的显示面板100、背板110和复合功能层上的微结构1000中的凹槽1001的分布方式不同。
具体的，所述微结构1000包括设置于所述背板110的边缘上的所述第一微结构1101、设置于所述复合功能层的边缘上的所述第二微结构1221和设置于所述显示面板100的边缘上的第三微结构1011。所述第一微结构1101、所述第二微结构1221和第三微结构1011中的凹槽1001的结构相同。
继续以所述第一微结构1101作为示例，对所述微结构1000中的凹槽1001的设置形式进行说明。
本实施例中，所述第一微结构1101包括设置在每个所述第一边缘111上的多列凹槽组，每列凹槽组包括间隔设置的多个凹槽1001，两个所述第一边缘111上的所述凹槽1001轴对称设置，且每列凹槽组中各凹槽1001与其相邻列的凹槽组中的各凹槽1001错位设置，各凹槽1001的大小相同；所述第一微结构1101还包括设置在其中一个所述第二边缘112上的多列凹槽组，每列凹槽组包括至少一个所述凹槽1001，且每列凹槽组中各凹槽1001与其相邻列的凹槽组中的各凹槽1001错位设置，另外一个所述第二边缘112上未设置所述凹槽组。
本申请实施例二提供的显示装置10中，由于所述背板110的边缘上的所述第一微结构1101包括更多的间隔设置的凹槽1001，且凹槽1001的分布形式更加复杂，能够进一步增加所述背板110和复合功能层之间的粘结面积，增强所述背板110和复合功能层之间的钉扎效应，避免所述显示装置10在拆机返修过程中所述背板110和所述复合功能层之间出现剥离现象，降低显示装置10出现边缘鼓包褶皱问题的概率，提高所述显示装置的拆机返修良率，降低成本。
相应的，所述第二微结构1221和所述第三微结构1011中的凹槽1001的分布方式，与所述第一微结构1101中的凹槽1001的分布方式相同，本实施例在此不再一一赘述。
实施例三
图5为本申请实施例三提供的第一微结构在背板上的分布示意图，结合图2和图5所示，本申请实施例三提供一种显示装置10，所述显示装置10与本申请实施例一提供的显示装置10结构相类似，本实施例对于相同部分不再赘述，不同的是，所述显示装置的显示面板100、背板110和复合功能层上的微结构1000中的凹槽1001的分布方式不同。
具体的，所述微结构1000包括设置于所述背板110的边缘上的所述第一微结构1101、设置于所述复合功能层的边缘上的所述第二微结构1221和设置于所述显示面板100的边缘上的第三微结构1011。所述第一微结构1101、所述第二微结构1221和第三微结构1011中的凹槽1001的结构相同。
继续以所述第一微结构1101作为示例，对所述微结构1000中的凹槽1001的设置形式进行说明。
本实施例中，所述第一微结构1101包括设置在每个所述第一边缘111上的多列凹槽组，每列凹槽组包括间隔设置的多个凹槽1001，两个所述第一边缘111上的所述凹槽1001阵列设置，每列凹槽组中各凹槽1001之间的间隔距离不同，且每列凹槽组中各凹槽1001与其相邻列的凹槽组中的部分凹槽1001错位设置，各凹槽1001的大小相同；所述第一微结构1101还包括设置在其中一个所述第二边缘112上的多列凹槽组，每列凹槽组包括间隔设置的至少一个凹槽1001，且每列凹槽组中各凹槽1001与其相邻列的凹槽组中的各凹槽1001错位设置，另外一个所述第二边缘112上未设置所述凹槽组。
本申请实施例三提供的显示装置10中，由于所述背板110的边缘上的所述第一微结构1101包括更多的间隔设置的凹槽1001，且凹槽1001的分布形式更加复杂，能够进一步增加所述背板110和复合功能层之间的粘结面积，增强所述背板110和复合功能层之间的钉扎效应，避免所述显示装置10在拆机返修过程中所述背板110和所述复合功能层之间出现剥离现象，降低显示装置10出现边缘鼓包褶皱问题的概率，提高所述显示装置的拆机返修良率，降低成本。
相应的，所述第二微结构1221和所述第三微结构1011中的凹槽1001的分布方式，与所述第一微结构1101中的凹槽1001的分布方式相同，本实施例在此不再一一赘述。
实施例四
图6为本申请实施例四提供的第一微结构在背板上的分布示意图，结合图2和图6所示，本申请实施例四提供一种显示装置10，所述显示装置10与本申请实施例二提供的显示装置10结构相类似，本实施例对于相同部分不再赘述，不同的是，所述显示装置的显示面板100、背板110和复合功能层上的微结构1000中的凹槽1001的分布方式不同。
具体的，所述微结构1000包括设置于所述背板110的边缘上的所述第一微结构1101、设置于所述复合功能层的边缘上的所述第二微结构1221和设置于所述显示面板100的边缘上的第三微结构1011。所述第一微结构1101、所述第二微结构1221和第三微结构1011中的凹槽1001的结构相同。
继续以所述第一微结构1101作为示例，对所述微结构1000中的凹槽1001的设置形式进行说明。
本实施例中，所述第一微结构1101包括设置在每个所述第一边缘111上的多列凹槽组，每列凹槽组包括间隔设置的多个凹槽1001，两个所述第一边缘111上的所述凹槽1001轴对称设置，每列凹槽组中相邻的两个凹槽1001的大小不同，且每列凹槽组中各凹槽1001与其相邻列的凹槽组中的各凹槽1001错位设置；所述第一微结构1101还包括设置在其中一个所述第二边缘112上的多列凹槽组，每列凹槽组包括至少一个所述凹槽1001，且每列凹槽组中各凹槽1001与其相邻列的凹槽组中的各凹槽1001错位设置，另外一个所述第二边缘112上未设置所述凹槽组。
本申请实施例四提供的显示装置10中，由于所述背板110的边缘上的所述第一微结构1101包括更多的间隔设置的凹槽1001，且凹槽1001的分布形式更加复杂，能够进一步增加所述背板110和复合功能层之间的粘结面积，增强所述背板110和复合功能层之间的钉扎效应，避免所述显示装置10在拆机返修过程中所述背板110和所述复合功能层之间出现剥离现象，降低显示装置10出现边缘鼓包褶皱问题的概率，提高所述显示装置的拆机返修良率，降低成本。
相应的，所述第二微结构1221和所述第三微结构1011中的凹槽1001的分布方式，与所述第一微结构1101中的凹槽1001的分布方式相同，本实施例在此不再一一赘述。
实施例五
图7为本申请实施例五提供的显示装置的结构示意图；图8为本申请实施例五提供的显示装置中的部分膜层的剖面示意图。结合图3至图8所示，本申请提供一种显示装置10，所述显示装置10可以为曲面显示装置，所述曲面显示装置包括四曲面显示装置或双曲面显示装置。
需要说明的是，本申请实施例五提供的显示装置10与实施例一到实施例四中的显示装置10相类似，并包括同样的膜层结构，其微结构1000中的凹槽分布方式可以是实施例一到实施例四中的四种凹槽分布方式中的任意一种，本实施例在此不再一一赘述。
不同的是，当所述显示装置10为四曲面显示装置，所述背板110的两个第一边缘111和两个第二边缘112均具有曲面形态；所述复合功能层的两个第一边缘111和两个第二边缘112均具有曲面形态；所述显示面板100的两个第一边缘111和两个第二边缘112均具有曲面形态。当所述显示装置10为双曲面显示装置，所述背板110的两个第一边缘111均具有曲面形态；所述复合功能层的两个第一边缘111均具有曲面形态；所述显示面板100的两个第一边缘111均具有曲面形态。
优选的，所述显示装置10为双曲面显示装置，并继续以所述第一微结构1101作为示例，对所述微结构1000中的凹槽1001的设置形式进行说明。
所述第一边缘111具有曲面形态，所述第二边缘112具有平面形态，所述第一微结构1101在所述第一边缘111上的布局密度大于所述第一微结构1101在所述第二边缘112上的布局密度，也即每个所述第一边缘111上的凹槽面积占比大于每个所述第二边缘112上的凹槽面积占比。由于具有曲面形态的所述第一边缘111上的凹槽面积占比更大，使得所述背板110与所述复合功能层在所述背板110的第一边缘111处更难发生剥离现象，能够有效降低双曲面显示装置在曲面边缘出现鼓包褶皱问题的概率，提高所述显示装置10的拆机返修良率，降低成本。
相应的，所述第二微结构1221和所述第三微结构1011中的凹槽分布方式，与所述第一微结构1101中的凹槽分布方式，本实施例在此不再一一赘述。
综上所述，本申请提供一种显示装置，所述显示装置包括：显示面板；背板，位于所述显示面板的一侧；复合功能层，位于所述背板远离所述显示面板的一侧；其中，所述显示面板、所述背板和所述复合功能层中的至少一个的边缘上设置有微结构。本申请通过在所述显示面板、所述背板和所述复合功能层中的至少一个的边缘上设置有微结构，能够有效增强所述显示面板、所述背板和所述复合功能层之间的钉扎效果与粘附效果，从而有效避免所述显示装置在拆机返修过程中所述显示面板、所述背板和所述复合功能层之间出现剥离现象，提高所述显示装置的拆机返修良率，降低成本。
以上对本申请实施例所提供的一种显示装置进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种显示装置，其中，包括：
    显示面板；
    背板，位于所述显示面板的一侧；
    复合功能层，位于所述背板远离所述显示面板的一侧；
    其中，所述显示面板、所述背板和所述复合功能层中的至少一个的边缘上设置有微结构。
  2. 根据权利要求1所述的显示装置，其中，所述显示装置还包括遮光油墨层，所述遮光油墨层位于所述背板远离所述复合功能层的一侧，其中，所述遮光油墨层包括遮光图案，所述遮光图案与所述微结构对应设置。
  3. 根据权利要求1所述的显示装置，其中，所述背板靠近所述复合功能层的一侧的边缘上设置有第一微结构。
  4. 根据权利要求3所述的显示装置，其中，所述复合功能层包括支撑层和缓冲层，所述缓冲层位于所述支撑层和所述背板之间，其中，所述缓冲层靠近所述支撑层的一侧的边缘上设置有第二微结构。
  5. 根据权利要求4所述的显示装置，其中，所述背板和所述复合功能层形成一叠层结构，所述叠层结构的至少一个侧缘上覆盖有胶体。
  6. 根据权利要求5所述的显示装置，其中，所述显示面板包括与所述背板邻接设置的衬底基板，所述衬底基板的至少一个边缘凸出于所述叠层结构，且所述衬底基板凸出于所述叠层结构的所述边缘上覆盖有所述胶体。
  7. 根据权利要求6所述的显示装置，其中，所述衬底基板凸出于所述叠层结构的所述边缘上设置有第三微结构，且所述第三微结构上覆盖有所述胶体。
  8. 根据权利要求1所述的显示装置，其中，所述微结构包括间隔设置的多个凹槽，所述凹槽沿所述边缘的长度方向延伸。
  9. 根据权利要求1所述的显示装置，其中，所述边缘包括沿第一方向延伸的两个第一边缘和沿垂直于所述第一方向的第二方向延伸的两个第二边缘，所述微结构设置于两个所述第一边缘及至少一个所述第二边缘上。
  10. 根据权利要求9所述的显示装置，其中，所述第一边缘具有曲面形态，所述微结构在所述第一边缘上的分布密度大于所述微结构在所述第二边缘上的分布密度。
  11. 根据权利要求1所述的显示装置，其中，所述显示装置还包括中框，所述中框设置于所述复合功能层远离所述背板的一侧，且所述中框与所述复合功能层之间设置有中框胶，所述中框通过所述中框胶与所述复合功能层固定连接。
  12. 根据权利要求11所述的显示装置，其中，所述显示装置还包括遮光油墨层，所述遮光油墨层位于所述背板远离所述复合功能层的一侧，其中，所述遮光油墨层包括遮光图案，所述遮光图案与所述微结构对应设置。
  13. 根据权利要求11所述的显示装置，其中，所述背板靠近所述复合功能层的一侧的边缘上设置有第一微结构。
  14. 根据权利要求13所述的显示装置，其中，所述复合功能层包括支撑层和缓冲层，所述缓冲层位于所述支撑层和所述背板之间，其中，所述缓冲层靠近所述支撑层的一侧的边缘上设置有第二微结构。
  15. 根据权利要求14所述的显示装置，其中，所述背板和所述复合功能层形成一叠层结构，所述叠层结构的至少一个侧缘上覆盖有胶体。
  16. 根据权利要求15所述的显示装置，其中，所述显示面板包括与所述背板邻接设置的衬底基板，所述衬底基板的至少一个边缘凸出于所述叠层结构，且所述衬底基板凸出于所述叠层结构的所述边缘上覆盖有所述胶体。
  17. 根据权利要求16所述的显示装置，其中，所述衬底基板凸出于所述叠层结构的所述边缘上设置有第三微结构，且所述第三微结构上覆盖有所述胶体。
  18. 根据权利要求11所述的显示装置，其中，所述微结构包括间隔设置的多个凹槽，所述凹槽沿所述边缘的长度方向延伸。
  19. 根据权利要求11所述的显示装置，其中，所述边缘包括沿第一方向延伸的两个第一边缘和沿垂直于所述第一方向的第二方向延伸的两个第二边缘，所述微结构设置于两个所述第一边缘及至少一个所述第二边缘上。
  20. 根据权利要求19所述的显示装置，其中，所述第一边缘具有曲面形态，所述微结构在所述第一边缘上的分布密度大于所述微结构在所述第二边缘上的分布密度。
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