WO2023095785A1 - 感光性樹脂組成物、硬化物、有機ｅｌ表示装置、半導体装置および硬化物の製造方法 - Google Patents

感光性樹脂組成物、硬化物、有機ｅｌ表示装置、半導体装置および硬化物の製造方法 Download PDF

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WO2023095785A1
WO2023095785A1 PCT/JP2022/043165 JP2022043165W WO2023095785A1 WO 2023095785 A1 WO2023095785 A1 WO 2023095785A1 JP 2022043165 W JP2022043165 W JP 2022043165W WO 2023095785 A1 WO2023095785 A1 WO 2023095785A1
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photosensitive resin
group
resin composition
thermal
mass
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English (en)
French (fr)
Japanese (ja)
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池田圭
亀本聡
鬼木順平
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Toray Industries Inc
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Toray Industries Inc
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Priority to KR1020247006745A priority Critical patent/KR20240110932A/ko
Priority to JP2022573199A priority patent/JPWO2023095785A1/ja
Priority to CN202280065150.3A priority patent/CN118020025A/zh
Publication of WO2023095785A1 publication Critical patent/WO2023095785A1/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
    • C08K5/23—Azo-compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

Definitions

  • the present invention relates to a photosensitive resin composition, a cured product using the same, an organic EL display device comprising the cured product, a semiconductor device comprising the cured product, and a method for producing the cured product.
  • organic electroluminescence (hereinafter referred to as "organic EL”) display devices have been developed for display devices with thin displays, such as smartphones, tablet PCs, and televisions.
  • an organic EL display device has a drive circuit, a planarizing layer, a first electrode, a pixel dividing layer, a light emitting layer and a second electrode on a substrate, and between the first electrode and the second electrode facing each other.
  • Light can be emitted by applying a voltage or by passing a current.
  • a photosensitive resin composition that can be patterned by ultraviolet irradiation is generally used as the flattening layer material and the pixel dividing layer material.
  • a photosensitive resin composition using a polyimide-based or polybenzoxazole-based resin has a high heat resistance of the resin and a small amount of gas components generated from the cured product, so that a highly reliable organic EL display device can be obtained. It is preferably used in that it can be used (see, for example, Patent Document 1).
  • pixel shrinkage refers to a phenomenon in which the luminance of light emitted from the edge of a pixel decreases or the pixel does not emit light.
  • a flexible organic EL display device has structurally bendable portions and/or portions fixed in a bent state, and bending stress is applied to the flattening layer and the pixel dividing layer at the bent portions.
  • high bending resistance is required for the material for the flattening layer and the material for the pixel dividing layer.
  • the object of the present invention is to provide a photosensitive resin composition having high sensitivity, high bending resistance of the cured product, and high reliability when the cured product is used in an organic EL display device. .
  • the object of the present invention is achieved by the following configurations. i.e. [1] (A) an alkali-soluble resin, (B) a quinonediazide compound, (C) a thermal cross-linking agent and (D) a thermal acid generator, wherein the (C) thermal cross-linking agent is (C1) A photosensitive resin composition containing a thermal cross-linking agent having a phenolic hydroxyl group in the molecule and a methylol group and/or an alkoxymethyl group, and (C2) a thermal cross-linking agent having an epoxy group.
  • the (C2) thermal crosslinking agent having an epoxy group is one or more thermal crosslinking agents selected from the group consisting of isocyanuric ring structure-containing epoxy thermal crosslinking agents, alicyclic epoxy thermal crosslinking agents, and aliphatic epoxy thermal crosslinking agents.
  • R 20 is a divalent to tetravalent group having 1 to 10 carbon atoms.
  • R 21 is each independently an optionally substituted alkyl group having 1 to 10 carbon atoms. , or an optionally substituted aryl group having 6 to 20 carbon atoms, which may be a hydroxyl group, a halogen atom, a cyano group, a vinyl group, an acetylene group, or a straight chain having 1 to 10 carbon atoms.
  • the (A) alkali-soluble resin contains one or more alkali-soluble resins selected from the group consisting of polyimides, polyimide precursors, polybenzoxazoles, polybenzoxazole precursors, and copolymers thereof.
  • the photosensitive resin composition according to any one of [4].
  • the content of the (C1) thermal cross-linking agent having a phenolic hydroxyl group in the molecule and having a methylol group and/or an alkoxymethyl group is ⁇ 1 (mass) and the content of the (C2) thermal cross-linking agent having an epoxy group
  • Composition Composition.
  • the photosensitive resin composition according to any one of [1] to [7], further comprising (E) polyhydroxystyrene and/or polyhydroxystyrene/polystyrene copolymer.
  • the content of the (C1) thermal cross-linking agent having a phenolic hydroxyl group in the molecule and having a methylol group and/or an alkoxymethyl group is ⁇ 1 (mass)
  • the content of the (C2) thermal cross-linking agent having an epoxy group When the amount is ⁇ 2 (mass) and the content of the component (E) is ⁇ 3 (mass), the mass ratio ( ⁇ 1 + ⁇ 2) / ⁇ 3 is in the range of 0.5 ⁇ ( ⁇ 1 + ⁇ 2) / ⁇ 3 ⁇ 3.0.
  • [10] A cured product obtained by curing the photosensitive resin composition according to any one of [1] to [9].
  • An organic EL display device comprising the cured product according to [10] above.
  • [12] A semiconductor device comprising the cured product according to [10] above.
  • a method for producing a cured product comprising the steps of (4) developing the exposed photosensitive resin film and (5) heat-treating the developed photosensitive resin film in this order.
  • the photosensitive resin composition of the present invention can provide a photosensitive resin composition having high sensitivity and high bending resistance of the cured product, and having high reliability when the cured product is used in an organic EL display device. .
  • FIG. 4 is a cross-sectional view of a TFT substrate on which a planarization layer and a pixel division layer are formed; 1 is a schematic diagram of a substrate of an organic EL display device; FIG.
  • the photosensitive resin composition of the present invention is a photosensitive resin composition containing (A) an alkali-soluble resin, (B) a quinone diazide compound, (C) a thermal cross-linking agent and (D) a thermal acid generator, wherein (C)
  • the thermal cross-linking agent contains (C1) a thermal cross-linking agent having a phenolic hydroxyl group in the molecule and a methylol group and/or an alkoxymethyl group, and (C2) a thermal cross-linking agent having an epoxy group. It is a flexible resin composition.
  • the photosensitive resin composition of the present invention contains (A) an alkali-soluble resin.
  • alkali-soluble as used in the present invention means that a solution obtained by dissolving a resin in ⁇ -butyrolactone is coated on a silicon wafer and dried at 120°C for 4 minutes. may be referred to as prebaking) to form a dry photosensitive resin film having a thickness of 10 ⁇ m ⁇ 0.5 ⁇ m (the dried photosensitive resin film obtained by prebaking in this way may be referred to as a prebaking film). Then, the pre-baked film is immersed in a 2.38% by mass tetramethylammonium hydroxide aqueous solution at 23 ⁇ 1° C. for 1 minute and then rinsed with pure water. It means that
  • Alkali-soluble resins include, for example, polyimides, polyimide precursors, polybenzoxazole precursors, and copolymers thereof, as well as polyamides, polymers obtained by polymerizing radically polymerizable monomers, siloxane resins, cardo resins, Phenolic resins and the like can be mentioned, but they are not particularly limited as long as they have the alkali solubility described above. Two or more of these alkali-soluble resins may be used in combination. Among the alkali-soluble resins described above, those having excellent heat resistance, less outgassing at high temperatures, and excellent film physical properties such as elongation are preferred. Specifically, it preferably contains one or more alkali-soluble resins selected from the group consisting of polyimides, polyimide precursors, polybenzoxazole precursors, and copolymers thereof.
  • At least one alkali-soluble resin selected from the group consisting of polyimides, polyimide precursors, polybenzoxazoles, polybenzoxazole precursors, and copolymers thereof that can be used as (A) an alkali-soluble resin in the present invention preferably has an acidic group in the structural unit of the resin and/or at the end of its main chain in order to impart the alkali solubility.
  • acidic groups include carboxyl groups, phenolic hydroxyl groups, sulfonic acid groups, and thiol groups.
  • the alkali-soluble resin preferably has a fluorine atom, and when developing with an alkaline aqueous solution, imparts water repellency to the interface between the film and the substrate, and suppresses the penetration of the alkaline aqueous solution into the interface.
  • the fluorine atom content in the alkali-soluble resin or copolymer thereof is preferably 5% by mass or more from the viewpoint of the effect of preventing penetration of the alkaline aqueous solution into the interface, and 20% by mass or less from the viewpoint of solubility in the alkaline aqueous solution. preferable.
  • One or more alkali-soluble resins selected from the group consisting of polyimides, polyimide precursors, polybenzoxazoles, polybenzoxazole precursors, and copolymers thereof used in the photosensitive resin composition of the present invention are known. Those synthesized by the method of can be used.
  • a polyimide precursor if it is a polyamic acid, for example, a method of reacting a tetracarboxylic dianhydride and a diamine compound at a low temperature, and if it is a polyamic acid ester, for example, a tetracarboxylic dianhydride at a low temperature and a diamine compound, a method of partially esterifying the amic acid structure with N,N-dimethylformamide dimethylacetal or the like, a method of obtaining a diester with a tetracarboxylic dianhydride and an alcohol, and then an amine and a condensing agent. a method of reacting in the presence of tetracarboxylic acid dianhydride and an alcohol to obtain a diester, followed by acid chloride of the remaining dicarboxylic acid and reaction with an amine.
  • a polyamic acid for example, a method of reacting a tetracarboxylic dianhydride
  • polyimide for example, it can be obtained by dehydrating and ring-closing the polyamic acid or polyamic acid ester obtained by the above-described method by heating in an organic solvent or chemically treating with acid or base.
  • a polybenzoxazole precursor it can be obtained by a condensation reaction between a bisaminophenol compound and a dicarboxylic acid.
  • a method of dripping a solution of dichloride There is a method of dripping a solution of dichloride.
  • polybenzoxazole for example, it can be obtained by dehydrating and ring-closing the polybenzoxazole precursor obtained by the above method by heating it in an organic solvent or chemically treating it with an acid or base.
  • Specific acid dianhydrides used as raw materials for polyimides, polyimide precursors and copolymers thereof include pyromellitic dianhydride and 3,3′,4,4′-biphenyltetracarboxylic dianhydride.
  • aliphatic tetracarboxylic dianhydrides such as butanetetracarboxylic dianhydride and 1,2,3,4-cyclopentanetetracarboxylic dianhydride. . You may use 2 or more types of these.
  • dicarboxylic acids used as raw materials for polybenzoxazole, polybenzoxazole precursors, and copolymers thereof include terephthalic acid, isophthalic acid, diphenyletherdicarboxylic acid, bis(carboxyphenyl)hexafluoropropane, biphenyldicarboxylic acid, and benzophenonedicarboxylic acid.
  • triphenyldicarboxylic acid examples of tricarboxylic acids such as trimellitic acid, trimesic acid, diphenylethertricarboxylic acid, biphenyltricarboxylic acid, examples of tetracarboxylic acids such as pyromellitic acid, 3,3′,4,4′-biphenyltetra carboxylic acid, 2,3,3′,4′-biphenyltetracarboxylic acid, 2,2′,3,3′-biphenyltetracarboxylic acid, 3,3′,4,4′-benzophenonetetracarboxylic acid, 2, 2',3,3'-benzophenonetetracarboxylic acid, 2,2-bis(3,4-dicarboxyphenyl)propane, 2,2-bis(2,3-dicarboxyphenyl)propane, 2,2-bis (3,4-dicarboxyphenyl)hexafluoropropane, 2,2-bis(2,3
  • diamines used as starting materials for polyimides, polyimide precursors and copolymers containing them include 3,4′-diaminodiphenyl ether, 4,4′-diaminodiphenyl ether, 3,4′-diaminodiphenylmethane, 4,4′-diaminodiphenylmethane, 1,4-bis(4-aminophenoxy)benzene, benzidine, m-phenylenediamine, p-phenylenediamine, 1,5-naphthalenediamine, 2,6-naphthalenediamine, bis(4 -aminophenoxy)biphenyl, bis ⁇ 4-(4-aminophenoxy)phenyl ⁇ ether, 1,4-bis(4-aminophenoxy)benzene, 2,2′-dimethyl-4,4′-diaminobiphenyl, 2, 2'-diethyl-4,4'-diaminobiphenyl, 3,3'-
  • R 1 and R 4 represent an oxygen atom, C(CF 3 ) 2 or C(CH 3 ) 2 .
  • R 2 , R 3 , R 5 to R 12 each independently represent a hydrogen atom or a hydroxyl group.
  • one or more alkalis selected from the group consisting of polyimides, polyimide precursors, polybenzoxazoles, polybenzoxazole precursors, and copolymers thereof It is preferable to block the main chain end of the soluble resin with a terminal blocker such as monoamine, acid anhydride, monocarboxylic acid, monoacid chloride compound, monoactive ester compound or the like.
  • a terminal blocker such as monoamine, acid anhydride, monocarboxylic acid, monoacid chloride compound, monoactive ester compound or the like.
  • monoamines, acid anhydrides, monocarboxylic acids, monoacid chloride compounds having at least one alkenyl group or alkynyl group are used as terminal blockers.
  • Mono-active ester compounds can also be used.
  • the content of terminal blocking agents such as monoamines, acid anhydrides, acid chlorides, and monocarboxylic acids is 1 mol% or more based on the total 100 mol% of all monomer components constituting the resin from the viewpoint of improving storage stability. is preferred, and 5 mol % or more is more preferred. Moreover, from the viewpoint of obtaining a resin having good film properties, it is preferably 40 mol % or less, more preferably 30 mol % or less, based on 100 mol % of the total sum of all monomer components constituting the resin.
  • a plurality of different terminal groups may be introduced by reacting a plurality of terminal blocking agents.
  • polyamides include polycondensates of dibasic acids and diamines, cyclic lactam ring-opening polymers, polycondensates of aminocarboxylic acids, and copolymers and blends thereof. More specifically, aliphatic polyamides such as polyamide 6, polyamide 10, polyamide 11, polyamide 12, polyamide 46, polyamide 66, polyamide 610, polyamide 612, polymetaxylene adipamide (polyamide MXD6), polyhexamethylene tele Aromatic polyamides such as phthalamide (polyamide 6T), polyhexamethylene isophthalamide (polyamide 6I), and polyamide 6/6I, polyamide 66/6I, polyamide 6/6T, polyamide 66/6T, polyamide 6/66/ Copolymers and blends such as 6T, polyamide 6/66/6I, polyamide 9T, polyamide 10T can be used.
  • aliphatic polyamides such as polyamide 6, polyamide 10, polyamide 11, polyamide 12, polyamide 46, polyamide 66
  • (Meth)acrylic acid esters include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, cyclopropyl (meth)acrylate, cyclopentyl (meth)acrylate, and (meth)acrylic acid.
  • (meth)acrylic acid is a generic term for methacrylic acid and acrylic acid, and the same applies to compounds in the present specification including the above series of compounds.
  • Aromatic vinyl compounds such as styrene, p-methylstyrene, o-methylstyrene, m-methylstyrene and ⁇ -methylstyrene may be copolymerized with the above (meth)acrylic acid and (meth)acrylic acid esters. .
  • an ethylenically unsaturated double bond group can be introduced by addition reaction of an epoxy compound having an ethylenically unsaturated double bond group to (meth)acrylic acid.
  • Cardo resins include resins having a cardo structure, that is, a skeleton structure in which two cyclic structures are bonded to a quaternary carbon atom constituting a cyclic structure.
  • a common cardo structure is a fluorene ring with two aromatic rings attached to the 9-position.
  • skeleton structures in which two cyclic structures are bonded to a quaternary carbon atom constituting a cyclic structure include a bisarylfluorene skeleton, a bisphenolfluorene skeleton, and a bisaminophenylfluorene skeleton.
  • the skeleton may have an epoxy group, an acrylic group, or a methacrylic group as a substituent.
  • the cardo resin is formed by polymerizing the skeleton having the cardo structure through reaction or the like between the functional groups bonded thereto.
  • the cardo resin has a structure (cardo structure) in which a main chain and a bulky side chain are connected by one element, and has a cyclic structure substantially perpendicular to the main chain.
  • monomers having a cardo structure include bis(glycidyloxyphenyl)fluorene type epoxy resin, 9,9-bis(4-hydroxyphenyl)fluorene, 9,9-bis(4-hydroxy-3-methyl Examples thereof include resins such as cardo structure-containing bisphenols such as phenyl)fluorene.
  • the cardo resin is a polymer obtained by polymerizing a monomer having a cardo structure, but may be a copolymer with other copolymerizable monomers.
  • Phenol resins include novolak phenol resins and resole phenol resins, which are obtained by polycondensing various phenols alone or a mixture of a plurality of them with aldehydes such as formalin.
  • Phenols constituting novolac phenol resins and resole phenol resins include, for example, phenol, p-cresol, m-cresol, o-cresol, 2,3-dimethylphenol, 2,4-dimethylphenol, and 2,5-dimethylphenol.
  • aldehydes include paraformaldehyde, acetaldehyde, benzaldehyde, hydroxybenzaldehyde, chloroacetaldehyde, and the like, and these can be used alone or as a mixture of a plurality of them.
  • siloxane resin also referred to as polysiloxane
  • siloxane resin monomers siloxane resins obtained by hydrolyzing and partially condensing by dehydration reaction. Partial condensation by dehydration reaction may be simply referred to as partial condensation.
  • organosilanes include tetrafunctional silanes such as tetramethoxysilane, tetraethoxysilane, tetraacetoxysilane, tetraphenoxysilane, methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, p-hydroxy phenyltrimethoxysilane, 1-(p-hydroxyphenyl)ethyltrimethoxysilane, 2-(p-hydroxyphenyl)ethyltrimethoxysilane,
  • Bifunctional silanes trimethylmethoxysilane, tri-n-butylethoxysilane, (3-glycidoxypropyl)dimethylmethoxysilane, (3-glycidoxypropyl)dimethylethoxysilane and other monofunctional silanes can be mentioned. Two or more of these organosilanes may be used. Further, a silicate compound such as Methyl Silicate 51 manufactured by Fuso Chemical Industry Co., Ltd. and M Silicate 51 manufactured by Tama Chemical Industry Co., Ltd. may be copolymerized.
  • Siloxane resins are synthesized by hydrolyzing and partially condensing siloxane resin monomers such as organosilanes.
  • partial condensation refers to not condensing all of the Si--OH in the hydrolyzate, but leaving a portion of the Si--OH in the resulting polysiloxane.
  • General methods can be used for hydrolysis and partial condensation. For example, an organic solvent, water, and optionally a catalyst are added to the organosilane mixture, and the mixture is heated and stirred at 50 to 150° C. for about 0.5 to 100 hours. During stirring, hydrolysis by-products (alcohol such as methanol) and condensation by-products (water) may be removed by distillation, if necessary.
  • acid catalysts include hydrochloric acid, nitric acid, sulfuric acid, hydrofluoric acid, phosphoric acid, acetic acid, trifluoroacetic acid, formic acid, polyvalent carboxylic acids or their anhydrides, and acidic cation exchange resins.
  • base catalysts include triethylamine, tripropylamine, tributylamine, tripentylamine, trihexylamine, triheptylamine, trioctylamine, diethylamine, triethanolamine, diethanolamine, sodium hydroxide, potassium hydroxide, amino alkoxysilanes having groups, basic anion exchange resins, and the like.
  • the photosensitive resin composition of the present invention contains (B) a quinonediazide compound.
  • a quinonediazide compound By including (B) the quinonediazide compound, an acid is generated in the light-irradiated area, and the solubility of the light-irradiated area in an alkaline aqueous solution increases, so that a positive relief pattern in which the light-irradiated area dissolves can be obtained.
  • the quinonediazide compound examples include those in which the sulfonic acid of quinonediazide is bonded to a polyhydroxy compound via an ester bond, the sulfonic acid of quinonediazide to a polyamino compound in a sulfonamide bond, and the sulfonic acid of quinonediazide to a polyhydroxypolyamino compound in an ester bond and/or a sulfone bond. Examples include those with an amide bond. It is preferable that 50 mol % or more of all the functional groups of these polyhydroxy compounds and polyamino compounds are substituted with quinonediazide.
  • the photosensitive resin composition may contain (B) two or more quinonediazide compounds.
  • naphthoquinonediazide sulfonic acid ester compounds are preferably used, and can be synthesized by an esterification reaction between a compound having a phenolic hydroxyl group and a naphthoquinonediazide sulfonic acid compound. It can be synthesized by the method.
  • the resolution, sensitivity and film retention rate are further improved.
  • Compounds having a phenolic hydroxyl group used here include Bis-Z, BisP-EZ, TekP-4HBPA, TrisP-HAP, TrisP-PA, TrisP-SA, TrisOCR-PA, BisOCHP-Z, BisP-MZ, BisP -PZ, BisP-IPZ, BisOCP-IPZ, BisP-CP, BisRS-2P, BisRS-3P, BisP-OCHP, methylenetris-FR-CR, BisRS-26X, DML-MBPC, DML-MBOC, DML-OCHP, DML-PCHP, DML-PC, DML-PTBP, DML-34X, DML-EP, DML-POP, Dimethylol-BisOC-P, DML-PFP, DML-PSBP, DML-MTrisPC, TriML-P, TriML-35XL, TML-BP, TML-HQ, TML-pp-BPF, TML-BPA, TMOM-BP, HML
  • naphthoquinonediazide sulfonate ester compound examples include those obtained by introducing naphthoquinonediazide-4-sulfonic acid or naphthoquinonediazide-5-sulfonic acid into these compounds through an ester bond, but compounds other than these can be used. You can also
  • Naphthoquinonediazide-4-ester compounds have absorption in the i-line region of mercury lamps and are suitable for i-line exposure. suitable for g-line exposure.
  • the photosensitive resin composition of the present invention can contain both a naphthoquinonediazide-4-sulfonate ester compound and a naphthoquinonediazide-5-sulfonate ester compound, and the same molecule contains a naphthoquinonediazide-4-sulfonyl group,
  • a naphthoquinone diazide-5-sulfonyl group may be used in combination with a naphthoquinone diazide sulfonic acid ester compound, or a mixture of a naphthoquinone diazide-4-sulfonic acid ester compound and a naphthoquinone diazide-5-sulfonic acid ester compound.
  • the content of the quinonediazide compound (B) is preferably 5 parts by mass or more, preferably 10 parts by mass or more relative to 100 parts by mass of the alkali-soluble resin (A), from the viewpoint of improving the sensitivity during exposure. is more preferred.
  • the amount is preferably 50 parts by mass or less, more preferably 30 parts by mass or less, relative to 100 parts by mass of the alkali-soluble resin (A).
  • the photosensitive resin composition of the present invention contains (C) a thermal cross-linking agent.
  • a thermal cross-linking agent refers to a compound having at least two thermally reactive functional groups such as a methylol group, an alkoxymethyl group, an epoxy group and an oxetanyl group in the molecule.
  • the thermal cross-linking agent can cross-link the (A) alkali-soluble resin or other additive components to enhance the chemical resistance and heat resistance of the cured product.
  • the thermal cross-linking agent (C1) has a phenolic hydroxyl group in the molecule and has a methylol group and/or an alkoxymethyl group (hereinafter referred to as (C1) (sometimes referred to as components).
  • Component (C1) preferably has a phenolic hydroxyl group in the molecule and at least two methylol groups and/or alkoxymethyl groups in the molecule. Examples of alkoxymethyl groups include, but are not limited to, methoxymethyl, ethoxymethyl, propoxymethyl, and butoxymethyl groups.
  • the (C1) component has a phenolic hydroxyl group in its molecule, so that it can improve the solubility in an alkaline developer and increase the sensitivity of the photosensitive resin composition.
  • the methylol group and/or the alkoxymethyl group undergo a dehydration or dealcoholization reaction in the temperature range of 150° C. or higher (A) with functional groups such as phenolic hydroxyl groups and carboxy groups in the alkali-soluble resin or other additive components. It can be crosslinked to improve the chemical resistance and heat resistance of the cured product of the photosensitive resin composition.
  • Component (C1) includes, for example, DML-PC, DML-PEP, DMOM-PC, TriML-P, TriML-35XL, TML-HQ, TML-BP, TML-pp-BPF, TML-BPE, TMOM-BP , TMOM-BPE, TMOM-BPA, TMOM-BPAF, TMOM-BPAP, HML-TPPHBA, HML-TPHAP, HMOM-TPPHBA, HMOM-TPHAP, HMOM-TPPA (product names, manufactured by Honshu Chemical Industry Co., Ltd.) , 26DMPC, 46DMOC, DM-BIPC-F, DM-BIOC-F, TM-BIP-A (all trade names, manufactured by Asahi Yukizai Co., Ltd.), and the like, which are available from each company.
  • the (C1) component is preferably a thermal cross-linking agent having 3 or more phenolic hydroxyl groups in one molecule.
  • a thermal cross-linking agent having 3 or more phenolic hydroxyl groups, the solubility in an alkaline developer is further increased, and patterning can be performed with higher sensitivity.
  • thermal cross-linking agents include, for example, HML-TPPHBA, HML-TPHAP, HMOM-TPPHBA, HMOM-TPHAP, and HMOM-TPPA (trade names, manufactured by Honshu Kagaku Kogyo Co., Ltd.).
  • the content of component (C1) is preferably 3 parts by mass or more, more preferably 5 parts by mass or more, and 10 parts by mass with respect to 100 parts by mass of the alkali-soluble resin (A). Part or more is more preferable.
  • (A) 30 parts by mass or less is preferable with respect to 100 parts by mass of the alkali-soluble resin, and 25 parts by mass The following is more preferable, and 20 parts by mass or less is even more preferable.
  • the photosensitive resin composition of the present invention contains (C) a thermal cross-linking agent (C2) having an epoxy group (hereinafter sometimes referred to as the (C2) component).
  • the (C2) component has at least two epoxy groups in its molecule.
  • the (C1) component has a phenolic hydroxyl group in its molecule
  • the (C2) component has an epoxy group in its molecule. Since the epoxy group crosslinks with the phenolic hydroxyl group, it is presumed that the crosslinking reaction also proceeds between the (C1) component and the (C2) component.
  • a compound having a phenolic hydroxyl group in the molecule, a methylol group and/or an alkoxymethyl group, and an epoxy group is classified as a (C1) component in the present application.
  • components (C2) those having two epoxy groups in one molecule are “Epikote” (registered trademark) 807, “Epikote” 828, “Epikote” 1002, “Epikote” 1750, “Epikote” 1007, YX8100- BH30, E1256, E4250, E4275 (trade names, manufactured by Japan Epoxy Co., Ltd.), “Epiclon” (registered trademark) EXA-4880, “Epiclon” EXA-4822, “Epiclon” EXA-9583, HP4032, HP4770 (above Trade names, manufactured by Dainippon Ink and Chemicals Co., Ltd.), “Epolite” (registered trademark) 40E, “Epolite” 100E, “Epolite” 200E, “Epolite” 400E, “Epolite” 70P, “Epolite” 200P, “Epolite”400P, ”E
  • VG3101L (trade name, manufactured by Printec Co., Ltd.), "TEPIC” (registered trademark)-S, "TEPIC”-L, which have three or more epoxy groups in one molecule.
  • “TEPIC”-VL, “TEPIC”-FL, “TEPIC”-UC (all trade names, manufactured by Nissan Chemical Industries, Ltd.), “Epicron” N660, “Epicron” N695, HP7200 (all trade names, Dainippon Ink Kagaku Kogyo Co., Ltd.), “Denacol” EX-321L (trade name, manufactured by Nagase ChemteX Corporation), NC6000, EPPN502H, NC3000 (trade names, manufactured by Nippon Kayaku Co., Ltd.), "Epotote” (registered trademark) YH-434L (trade name, manufactured by Tohto Kasei Co., Ltd.), EHPE-3150 (trade name, manufactured by Daice
  • Component (C2) preferably contains one or more thermal crosslinking agents selected from the group consisting of isocyanuric ring structure-containing epoxy thermal crosslinking agents, alicyclic epoxy thermal crosslinking agents, and aliphatic epoxy thermal crosslinking agents. .
  • These epoxy thermal cross-linking agents have a structure that does not have an aromatic ring in the molecule, so that the solubility in an alkaline developer increases, and patterning can be performed with high sensitivity. Furthermore, it is possible to suppress decomposition due to heat or light irradiation including ultraviolet rays, so it is also preferable in terms of exhibiting high bending resistance.
  • the isocyanuric ring structure-containing epoxy thermal cross-linking agent is an epoxy thermal cross-linking agent containing an isocyanuric ring structure in the compound structure.
  • the alicyclic epoxy thermal cross-linking agent is an epoxy thermal cross-linking agent having one or more alicyclic structures having 3 to 12 carbon atoms which may have a hetero element or a branched structure in a compound structure other than the ethylene oxide structure.
  • the aliphatic epoxy thermal cross-linking agent is an epoxy thermal cross-linking agent having a non-alicyclic structure having 3 to 24 carbon atoms which may contain a hetero element or a branched structure in a compound structure other than the ethylene oxide structure.
  • a compound having an isocyanuric ring, an alicyclic structure, and an aliphatic structure as an epoxy thermal cross-linking agent is classified as an isocyanuric ring structure-containing epoxy thermal cross-linking agent in the present application.
  • a compound having an alicyclic structure or an aliphatic structure as an epoxy thermal cross-linking agent is classified as an alicyclic epoxy thermal cross-linking agent in the present application.
  • the (C2) component particularly preferably contains an aliphatic epoxy thermal cross-linking agent.
  • an aliphatic structure By having an aliphatic structure, the fluidity of the resin can be improved, the cross-linking reaction can be particularly accelerated, and particularly high bending resistance can be expressed.
  • the isocyanuric ring structure-containing epoxy thermal cross-linking agent includes, for example, "TEPIC” (registered trademark)-S, "TEPIC”-L, “TEPIC”-VL, “TEPIC”-FL, “TEPIC”-UC (trade names of , manufactured by Nissan Chemical Industries, Ltd.), MA-DGIC (trade name, manufactured by Shikoku Kasei Co., Ltd.), and as an alicyclic epoxy thermal cross-linking agent, "Denacol” (registered trademark) EX-252 (trade name, Nagase Chemtex Co., Ltd.), “Epocalyc” (registered trademark) THI-DE, “Epocalyc” DE-102, “Epocalyc” DE-103 (trade names, manufactured by ENEOS Corporation), “Showfree” (registered Trademark) CDMDG (trade name, manufactured by Showa Denko K.K.), “Celoxide” (registered trademark) 2021P (trade name,
  • EX-614B "Denacol” EX-313, “Denacol” EX-512, “Denacol” EX-321L, “Denacol” EX-810, “Denacol” EX-861, “Denacol” EX-211 Nagase Chemtex Co., Ltd.), Epogose” (registered trademark) BD, “Epogose” NPG, “Epogose” HD (trade name, manufactured by Yokkaichi Gosei Co., Ltd.), “Showfree” (trademark) PETG (trade name , manufactured by Showa Denko K.K.) and the like, which are available from each company.
  • the content of the component (C2) is preferably 3 parts by mass or more, more preferably 5 parts by mass or more, more preferably 10 parts by mass with respect to 100 parts by mass of the alkali-soluble resin (A), from the viewpoint of improving the chemical resistance of the cured product. Part or more is more preferable. Moreover, from the viewpoint of patterning with high sensitivity, it is preferably 30 parts by mass or less, more preferably 25 parts by mass or less, and even more preferably 20 parts by mass or less with respect to 100 parts by mass of the alkali-soluble resin (A).
  • the mass ratio ⁇ 1/ ⁇ 2 is preferably 0.5 or more, and more preferably 0.6 or more. Preferably, 0.7 or more is more preferable. Also, the mass ratio ⁇ 1/ ⁇ 2 is preferably 2.0 or less, more preferably 1.8 or less, and even more preferably 1.5 or less.
  • the photosensitive resin composition of the present invention can contain a thermal cross-linking agent other than component (C1) and (C2) within a range that does not impair sensitivity.
  • a thermal cross-linking agent include a thermal cross-linking agent having a methylol group and/or an alkoxymethyl group but not having a phenolic hydroxyl group in the molecule, an oxetane compound, a bismaleimide compound, an isocyanate compound and a blocked isocyanate compound. be done.
  • Thermal cross-linking agents having methylol groups and/or alkoxymethyl groups without phenolic hydroxyl groups in the molecule include, for example, "NIKALAC” (registered trademark) MX-290 and “NIKALAC” (registered trademark) MX-280. , “NIKALAC” (registered trademark) MX-270, “NIKALAC” (registered trademark) MX-279, “NIKALAC” (registered trademark) MW-100LM, “NIKALAC” (registered trademark) MX-750LM (above, product names, (manufactured by Sanwa Chemical Co., Ltd.) and the like, which are available from each of the companies mentioned above.
  • Oxetane compounds include, for example, OXT-121, OXT-221, OX-SQ-H, OXT-191, PNOX-1009, RSOX (these are trade names, manufactured by Toagosei Co., Ltd.), and "Etanacol” (registered trademark).
  • OXBP, “Etanacol” (registered trademark) OXTP these are trade names, manufactured by Ube Industries, Ltd., etc., and are available from each company.
  • bismaleimide compounds include 1,2-bis(maleimido)ethane, 1,3-bis(maleimido)propane, 1,4-bis(maleimido)butane, 1,5-bis(maleimido)pentane, 1, 6-bis(maleimido)hexane, 2,2,4-trimethyl-1,6-bis(maleimido)hexane, N,N'-1,3-phenylenebis(maleimido), 4-methyl-N,N'- 1,3-phenylenebis(maleimide), N,N'-1,4-phenylenebis(maleimide), 3-methyl-N,N'-1,4-phenylenebis(maleimide), 4,4'-bis (maleimido)diphenylmethane, 3,3′-diethyl-5,5′-dimethyl-4,4′-bis(maleimido)diphenylmethane or 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane. .
  • isocyanate compounds include aromatic polyisocyanates such as 4,4′-methylenebis(phenylene isocyanate) (MDI) and tolylene diisocyanate (TDI); hexamethylene diisocyanate (HDI), trimethylene diisocyanate, 1,4- Aliphatic polyisocyanates such as tetramethylene diisocyanate, pentamethylene diisocyanate and lysine diisocyanate; can.
  • aromatic polyisocyanates such as 4,4′-methylenebis(phenylene isocyanate) (MDI) and tolylene diisocyanate (TDI); hexamethylene diisocyanate (HDI), trimethylene diisocyanate, 1,4- Aliphatic polyisocyanates such as tetramethylene diisocyanate, pentamethylene diisocyanate and lysine diisocyanate; can.
  • blocked isocyanate compounds include compounds obtained by blocking the aforementioned isocyanate compounds with block bodies such as oximes, lactams and pyrazoles, and the crosslinking temperature can be easily adjusted.
  • the content of the thermal cross-linking agent other than the components (C1) and (C2) is 3 parts by mass with respect to 100 parts by mass of the alkali-soluble resin (A) from the viewpoint of improving the heat resistance and chemical resistance of the cured product.
  • the above is preferable, and from the viewpoint of pattern processing with high sensitivity, 30 parts by mass or less is preferable with respect to 100 parts by mass of the (A) alkali-soluble resin.
  • the photosensitive resin composition of the present invention contains (D) a thermal acid generator.
  • the thermal acid generator is a compound that generates an acid when heated, and the thermal decomposition starting temperature of the (D) thermal acid generator is preferably 120° C. or higher, more preferably 130° C. or higher, and even more preferably 140° C. or higher.
  • the thermal decomposition temperature is preferably 250° C. or lower, more preferably 240° C. or lower, and even more preferably 230° C.
  • the thermal decomposition temperature 250° C. or lower.
  • sufficient acid can be generated in the heating step.
  • the cross-linking reaction of the component (C1) can be promoted, and as a result, the unreacted cross-linkable groups remaining in the cured product can be greatly reduced. If an unreacted crosslinkable group remains in the cured product, a gas component is generated during the reliability test, which causes undesirable phenomena such as a decrease in the brightness of the organic EL display device and pixel shrinkage.
  • the cross-linking promotion effect of the acid generated from the agent can greatly improve the reliability of the organic EL display device.
  • the (D) thermal acid generator in the photosensitive resin composition of the present invention may have a function of generating an acid upon heating.
  • (D) Included in the definition of thermal acid generators.
  • the quinonediazide compound is defined as not included in (D) the thermal acid generator even if it generates an acid by heating.
  • the acid generated from the thermal acid generator is preferably a strong acid. Acids, camphorsulfonic acid, and the like are preferred.
  • thermal acid generator examples include the following sulfonium salts, sulfonic acid esters, and the like. You may contain 2 or more types of these.
  • the sulfonium salt preferably has a structure represented by formula (1).
  • R 13 to R 15 each independently represent a monovalent organic group having 1 to 20 carbon atoms.
  • a monovalent organic group having 1 to 20 carbon atoms which can be taken by R 13 to R 15 a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms which may have a substituent or a substituted It represents an aryl group having 6 to 20 carbon atoms which may have a group.
  • Substituents include a hydroxyl group, a halogen atom, a cyano group, a vinyl group, an acetylene group, or a linear or cyclic alkyl group having 1 to 10 carbon atoms.
  • Z- represents an anion moiety selected from R 16 SO 3 -, R 16 SO 4 -, R 16 COO- and SbF 6 -.
  • R 16 represents a monovalent organic group having 1 to 20 carbon atoms. Examples of the monovalent organic group having 1 to 20 carbon atoms that R 16 can take include an alkyl group, an aryl group, a perfluoroalkyl group, and a structure represented by formula (2).
  • the sulfonium salt of formula (1) preferably contains a compound selected from the group consisting of monoarylsulfonium salts and trialkylsulfonium salts from the viewpoint of generating heat by heating.
  • sulfonic acid esters examples include structures represented by formula (3) or formula (4).
  • R 17 and R 18 are each independently an optionally substituted linear, branched or cyclic alkyl group having 1 to 10 carbon atoms or optionally having a substituent It represents an aryl group having 6 to 20 carbon atoms.
  • Substituents include a hydroxyl group, a halogen atom, a cyano group, a vinyl group, an acetylene group, and a linear or cyclic alkyl group having 1 to 10 carbon atoms.
  • R 19 represents a monovalent organic group having 1 to 20 carbon atoms.
  • monovalent organic groups having 1 to 20 carbon atoms that R 19 can take include alkyl groups, aryl groups, perfluoroalkyl groups, structures represented by formula (2), and the like.
  • thermal acid generators it is preferable to contain a thermal acid generator having a sulfonate ester structure because it has a high effect of improving the reliability of the organic EL display device.
  • compounds described in formula (3) above include methyl methanesulfonate, ethyl methanesulfonate, propyl methanesulfonate, butyl methanesulfonate, phenyl methanesulfonate, methyl ethanesulfonate, ethyl ethanesulfonate, ethane Propyl sulfonate, butyl ethanesulfonate, phenyl ethanesulfonate, methyl propanesulfonate, ethyl propanesulfonate, propyl propanesulfonate, butyl propanesulfonate, phenyl propanesulfonate, methyl butanesulfonate,
  • thermal acid generators having a sulfonate structure include PAI-01, PAI-101, PAI-106, PAI-1001, PAI-1002, PAI-1003, PAI -1004 (trade name, manufactured by Midori Chemical Co., Ltd.), SP-082, SP-601, SP-606, SP-607, SP-612 (trade name, manufactured by ADEKA Co., Ltd.), NIT, MIN, ILP- 110, ILP-110N, ILP-118, ILP-113, PA-223, PA-298 (trade name, Heraeus Co., Ltd.), NAI-105, NAI-106, NAI-109 (trade name, Midori Chemical Co., Ltd.) and the like.
  • the thermal acid generator contains the compound represented by formula (5).
  • the thermal acid generator containing the compound of formula (5) is highly effective in improving the exposure sensitivity and improving the reliability of the organic EL display device.
  • the improvement in exposure sensitivity is due to the fact that (D) the thermal acid generator contains the compound represented by the formula (5), compared to the case where the compound of the formula (5) is not contained, the alkali It is presumed that this is because the solubility in the developer is easily improved.
  • R 20 is a divalent to tetravalent group having 1 to 10 carbon atoms.
  • R 21 represents an optionally substituted C 1-10 alkyl group or an optionally substituted C 6-20 aryl group. Examples of the substituent include a hydroxyl group, a halogen atom, a cyano group, a vinyl group, an acetylene group, and a linear or cyclic alkyl group having 1 to 10 carbon atoms.
  • a represents an integer of 2 to 4;
  • R 20 is a divalent to tetravalent group having 1 to 6 carbon atoms
  • R 21 is each independently a straight chain or A branched or cyclic alkyl group or an optionally substituted aryl group having 6 to 10 carbon atoms is preferred.
  • Examples of the compound described in the above formula (5) include compounds having multiple alcoholic hydroxyl groups (sometimes referred to as polyhydric alcohol compounds), or compounds having multiple phenolic hydroxyl groups (sometimes referred to as polyhydric phenol compounds). ) are sulfonated with methanesulfonic acid, ethanesulfonic acid, propanesulfonic acid, butanesulfonic acid, octanesulfonic acid, p-toluenesulfonic acid, benzenesulfonic acid, etc. be done.
  • polyhydric alcohol compounds specific examples include methanediol, ethanediol, propanediol, butanediol, pentanediol, hexanediol, heptanediol, octanediol, nonanediol, and decanediol. .
  • specific examples of trihydric or higher alcohol compounds include propanetriol, butanetriol, pentanetriol, hexanetriol, heptanetriol, octanetriol, nonanetriol, decanetriol, and pentaerythritol.
  • polyhydric phenol compounds include dihydroxybenzene, trihydroxybenzene, tetrahydroxybenzene and the like.
  • the content of the compound represented by the formula (5) is 20% by mass or more in 100% by mass of the thermal acid generator (D) from the viewpoint of easily obtaining the effect of improving the exposure sensitivity and improving the reliability of the organic EL display device. preferably. It is more preferably 50% by mass or more, still more preferably 70% by mass or more, and particularly preferably 100% by mass.
  • the content of the thermal acid generator (D) is preferably 1 part by mass or more, preferably 2 parts by mass or more, with respect to 100 parts by mass of the alkali-soluble resin (A) from the viewpoint of further improving the reliability of the organic EL display device. is more preferable, and 3 parts by mass or more is even more preferable.
  • the content of the thermal acid generator (D) is preferably 15 parts by mass or less, and 10 parts by mass or less with respect to 100 parts by mass of the alkali-soluble resin (A) from the viewpoint of imparting high heat resistance to the cured product. is more preferable, and 8 parts by mass or less is even more preferable.
  • the photosensitive resin composition of the present invention may further contain (E) polyhydroxystyrene and/or polyhydroxystyrene/polystyrene copolymer.
  • component (E) polyhydroxystyrene and/or polyhydroxystyrene/polystyrene copolymer.
  • the component (E) can be produced by addition polymerization of a phenol derivative having an unsaturated bond.
  • phenol derivatives having an unsaturated bond include hydroxystyrene, dihydroxystyrene, allylphenol, coumaric acid, 2′-hydroxychalcone, N-hydroxyphenyl-5-norbornene-2,3-dicarboxylic imide, resveratrol. 4-Hydroxystilbene and the like can be mentioned, and two or more of these may be used. It may also be a copolymer with a monomer containing no phenolic hydroxyl group, such as styrene. This facilitates adjustment of the alkali dissolution rate of component (C).
  • the content of component (E) is 1 to 90 parts by mass per 100 parts by mass of component (A). If the content of component (E) is less than 1 part by mass per 100 parts by mass of component (A), the sensitivity will be lowered.
  • the content of component (E) is preferably 3 parts by mass or more per 100 parts by mass of component (A). On the other hand, when the content of the component (E) exceeds 90 parts by mass per 100 parts by mass of the component (A), the development adhesion is lowered.
  • the content of component (E) is preferably 70 parts by mass or less per 100 parts by mass of component (A).
  • the preferred weight-average molecular weight of the component (E) can be determined by gel permeation chromatography (GPC) in terms of polystyrene. From the viewpoint of development adhesion, it is preferably 10,000 or less, more preferably 8,000 or less, and even more preferably 7,000 or less.
  • the content of the thermal cross-linking agent having a phenolic hydroxyl group in the molecule (C1) and having a methylol group and/or an alkoxymethyl group is ⁇ 1 (mass)
  • the content of (C2) is
  • the mass ratio ( ⁇ 1 + ⁇ 2)/ ⁇ 3 is 0.5 ⁇ ( ⁇ 1 + ⁇ 2)/ ⁇ 3. It is preferably in the range of ⁇ 3.0.
  • the range is more preferably 1.0 ⁇ ( ⁇ 1+ ⁇ 2)/ ⁇ 3 ⁇ 2.5, and still more preferably 1.3 ⁇ ( ⁇ 1+ ⁇ 2)/ ⁇ 3 ⁇ 2.2.
  • the photosensitive resin composition of the present invention preferably contains an organic solvent. As a result, a varnish state can be obtained, and coatability can be improved.
  • the organic solvent includes polar aprotic organic solvents such as ⁇ -butyrolactone, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene.
  • polar aprotic organic solvents such as ⁇ -butyrolactone, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene.
  • Ethers such as glycol mono-n-propyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol mono-n-propyl ether, dipropylene glycol mono-n-butyl ether, tetrahydrofuran, dioxane, acetone, Ketones such as methyl ethyl ketone, diisobutyl ketone, cyclohexanone, 2-heptanone, 3-heptanone, diacetone alcohol, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, ethyl lactate, ethyl 2-hydroxy-2-methylpropionate, methyl 3-meth
  • the amount of the organic solvent used is not particularly limited, but is preferably 100 to 3000 parts by mass, more preferably 150 to 2000 parts by mass, based on 100 parts by mass of the total amount of the photosensitive resin composition excluding the organic solvent and water.
  • the ratio of the organic solvent having a boiling point of 180° C. or higher to the total amount of the organic solvent is preferably 20% by mass or less, more preferably 10% by mass or less.
  • the photosensitive resin composition of the present invention can contain a coloring agent.
  • Colorants refer to organic pigments, inorganic pigments or dyes. Colorants are preferably organic and/or inorganic pigments.
  • organic pigments include diketopyrrolopyrrole pigments, azo pigments such as azo, disazo and polyazo, phthalocyanine pigments such as copper phthalocyanine, halogenated copper phthalocyanine and metal-free phthalocyanine, aminoanthraquinone, diaminodianthraquinone, anthra Anthraquinone pigments such as pyrimidine, flavanthrone, anthanthrone, indanthrone, pyranthrone or violanthrone, quinacridone pigments, dioxazine pigments, perinone pigments, perylene pigments, thioindigo pigments, isoindoline pigments, isoindolinone pigments , quinophthalone-based pigments, threne-based pigments, benzofuranone-based pigments, or organic metal complex-based pigments.
  • diketopyrrolopyrrole pigments such as azo, disazo
  • inorganic pigments include titanium oxide, zinc white, zinc sulfide, lead white, calcium carbonate, precipitated barium sulfate, white carbon, alumina white, kaolin clay, talc, bentonite, black iron oxide, cadmium red, red iron oxide, molybdenum. Red, molybdate orange, chrome vermillion, yellow lead, cadmium yellow, yellow iron oxide, titanium yellow, chromium oxide, Viridian, titanium cobalt green, cobalt green, cobalt chrome green, victoria green, ultramarine blue, dark blue, cobalt blue, cerulean blue, cobalt silica blue, cobalt zinc silica blue, manganese violet or cobalt violet.
  • Dyes include, for example, azo dyes, anthraquinone dyes, condensed polycyclic aromatic carbonyl dyes, indigoid dyes, carbonium dyes, phthalocyanine dyes, methine or polymethine dyes.
  • the color of the colorant is preferably black, which can block visible light over the entire wavelength range
  • the photosensitive resin composition is selected from organic pigments, inorganic pigments, and dyes. It is preferable to contain at least one colorant that exhibits a black color when cured.
  • the above-mentioned black organic pigment and black inorganic pigment may be contained, or two or more kinds of organic pigments and dyes may be mixed to produce a pseudo-black color. Pseudo blackening can be obtained by mixing two or more of the organic pigments and dyes of red, orange, yellow, purple, blue, green, etc. described above.
  • the photosensitive resin composition itself of the present invention does not necessarily have to be black, and a coloring agent may be used that changes the color during heat curing so that the cured product exhibits a black color.
  • a coloring agent that contains an organic pigment and/or an inorganic pigment and exhibits a black color when cured.
  • a coloring agent that contains an organic pigment and/or a dye and exhibits a black color when cured it is preferable to contain an organic pigment and a coloring agent that exhibits a black color when cured.
  • the content of the colorant is preferably 5% by mass or more, more preferably 10% by mass or more, relative to the total amount of the photosensitive resin composition excluding the organic solvent and water, from the viewpoint of obtaining the necessary coloring properties for the cured product. , more preferably 15% by mass or more. Further, from the viewpoint of obtaining good storage stability, the total amount of the photosensitive resin composition excluding the organic solvent and water is preferably 50% by mass or less, more preferably 40% by mass or less, and further 30% by mass or less. preferable.
  • the photosensitive resin composition contains a pigment, it preferably contains a dispersant.
  • a dispersant By containing a dispersant, the colorant can be uniformly and stably dispersed in the resin composition.
  • the dispersant is not particularly limited, but a polymer dispersant is preferred.
  • polymer dispersants include polyester polymer dispersants, acrylic polymer dispersants, polyurethane polymer dispersants, polyallylamine polymer dispersants and carbodiimide polymer dispersants.
  • the polymer dispersant has a main chain composed of polyamino, polyether, polyester, polyurethane, polyacrylate, or the like, and has amine, carboxylic acid, phosphoric acid, amine salt, carboxylic acid at the side chain or at the end of the main chain. It refers to polymer compounds having polar groups such as acid salts and phosphates. The polar groups are adsorbed on the pigment, and the steric hindrance of the main chain polymer plays a role in stabilizing the dispersion of the pigment.
  • the dispersant is a (polymer) dispersant having only an amine value, a (polymer) dispersant having only an acid value, a (polymer) dispersant having an amine value and an acid value, or a (polymer) dispersant having both an amine value and an acid value. Although it is classified into (polymeric) dispersants that do not have an amine value, (polymeric) dispersants that have an amine value and an acid value, and (polymeric) dispersants that have only an amine Molecular) dispersants are more preferred.
  • the content of the dispersant is preferably 1 part by mass or more, more preferably 3 parts by mass or more, relative to 100 parts by mass of the pigment, from the viewpoint of obtaining good dispersion stability. From the viewpoint of maintaining the heat resistance of the cured product, it is preferably 100 parts by mass or less, more preferably 50 parts by mass or less, relative to 100 parts by mass of the pigment.
  • the photosensitive resin composition of the present invention can contain an adhesion improver.
  • Adhesion improvers include vinyltrimethoxysilane, vinyltriethoxysilane, epoxycyclohexylethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, p-styryltrimethoxysilane, Silane coupling agents such as 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, titanium chelating agents, aluminum chelating agents, aromatic amine compounds and alkoxy group-containing Examples thereof include compounds obtained by reacting silicon compounds.
  • the adhesion to an underlying substrate such as a silicon wafer, ITO, SiO 2 , or silicon nitride can be enhanced when developing a photosensitive resin film.
  • resistance to oxygen plasma and UV ozone treatment used for cleaning can be enhanced.
  • the content of the adhesion improver is preferably 0.1 to 10% by mass with respect to the total amount of the photosensitive resin composition excluding the organic solvent and water.
  • the photosensitive resin composition of the present invention may optionally contain a surfactant for the purpose of improving the wettability with the substrate.
  • a surfactant for the purpose of improving the wettability with the substrate.
  • Commercially available compounds can be used as surfactants.
  • silicone-based surfactants include SH series, SD series, and ST series from Toray Dow Corning Silicone Co., Ltd., BYK series from BYK Chemie Japan, and Shin-Etsu Silicone. KP series from Nippon Yushi Co., Ltd., Disfoam series from Toshiba Silicone Co., Ltd., and TSF series from Toshiba Silicone Co., Ltd.
  • fluorine-based surfactants include Dainippon Ink Mfg.
  • Surfactants composed of poly- and/or methacrylic polymers include, but are not limited to, Polyflow series from Kyoeisha Chemical Co., Ltd., and "Disparon (registered trademark)” series from Kusumoto Kasei Co., Ltd.
  • the content of the surfactant is preferably 0.001-1% by mass with respect to the total amount of the photosensitive resin composition excluding the organic solvent and water.
  • the photosensitive resin composition of the present invention optionally contains a compound having a phenolic hydroxyl group and different from the component (C1) for the purpose of supplementing the alkali developability of the photosensitive resin composition.
  • a compound having a phenolic hydroxyl group include Bis-Z, BisOC-Z, BisOPP-Z, BisP-CP, Bis26X-Z, BisOTBP-Z, BisOCHP-Z, BisOCR-CP, BisP-MZ, BisP-EZ, Bis26X-CP, BisP-PZ, BisP-IPZ, BisCRIPZ, BisOCP-IPZ, BisOIPP-CP, Bis26X-IPZ, BisOTBP-CP, TekP-4HBPA (Tetrakis P-DO-BPA), TrisPHAP, TrisP- PA, TrisP-PHBA, TrisP-SA, TrisOCR-PA, BisOFP-Z, BisRS-2P, BisPG-26X, BisRS-3P, BisOC-OCHP, BisPC
  • the resulting photosensitive resin composition is almost insoluble in an alkaline developer before exposure, and readily dissolves in an alkaline developer after exposure. Less film loss and easy development in a short time. Therefore, it becomes easier to improve the sensitivity.
  • the content of such a compound having a phenolic hydroxyl group is preferably 1% by mass or more and 20% by mass or less with respect to the total amount of the photosensitive resin composition excluding the organic solvent and water.
  • the photosensitive resin composition of the present invention may contain inorganic particles.
  • Preferred specific examples include silicon oxide, titanium oxide, barium titanate, alumina and talc, but are not limited to these.
  • the primary particle diameter of these inorganic particles is preferably 100 nm or less, more preferably 60 nm or less.
  • the content of the inorganic particles is preferably 5-90% by mass with respect to the total amount of the photosensitive resin composition excluding the organic solvent and water.
  • the manufacturing method for manufacturing the photosensitive resin composition of the present invention will be described.
  • (A) an alkali-soluble resin, (B) a quinone diazide compound, (C) a thermal cross-linking agent, (D) a thermal acid generator, and if necessary, an organic solvent, an adhesion improver, a surfactant, a coloring agent, inorganic particles, etc. can be dissolved to obtain a photosensitive resin composition.
  • Dissolution methods include stirring and heating.
  • the heating temperature is preferably set within a range that does not impair the performance of the photosensitive resin composition, and is usually room temperature to 80°C.
  • the order of dissolving each component is not particularly limited, and for example, a method of dissolving compounds in order of low solubility can be mentioned.
  • ingredients that tend to generate air bubbles during stirring and dissolution such as surfactants and some adhesion improvers, by adding them at the end after dissolving other ingredients, the other ingredients will not be dissolved due to air bubbles. can be prevented.
  • the obtained photosensitive resin composition is preferably filtered using a filtration filter to remove dust and particles.
  • filter pore sizes include, but are not limited to, 0.5 ⁇ m, 0.2 ⁇ m, 0.1 ⁇ m, 0.07 ⁇ m, 0.05 ⁇ m, and 0.02 ⁇ m.
  • Materials for the filtration filter include polypropylene (PP), polyethylene (PE), nylon (NY), polytetrafluoroethylene (PTFE), etc., and polyethylene and nylon are preferred.
  • the cured product of the present invention is a cured product obtained by curing a photosensitive resin composition.
  • a cured product is obtained by heat-treating a photosensitive resin composition.
  • a known method such as a method using a hot plate, an oven, or infrared rays can be used for the heat treatment. Preferable heat treatment conditions will be described later in the step of heat-treating the developed photosensitive resin film in the method for producing a cured product (5).
  • the method for producing the cured product is (1) a step of applying the photosensitive resin composition of the present invention to a substrate to form a photosensitive resin film; (2) drying the photosensitive resin film; (3) exposing the dried photosensitive resin film through a photomask; (4) developing the exposed photosensitive resin film; and (5) heating the developed photosensitive resin film in this order.
  • the photosensitive resin composition of the present invention is applied by a spin coating method, a slit coating method, a dip coating method, or a spray coating method.
  • a photosensitive resin film of the photosensitive resin composition is obtained by coating with a method, printing method, or the like.
  • the substrate to be coated with the photosensitive resin composition may be pretreated with the above-described adhesion improver.
  • a solution obtained by dissolving 0.5 to 20% by mass of an adhesion improver in a solvent such as isopropanol, ethanol, methanol, water, tetrahydrofuran, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, ethyl lactate, and diethyl adipate is used.
  • a method of treating the substrate surface include spin coating, slit die coating, bar coating, dip coating, spray coating, vapor treatment, and the like.
  • the applied photosensitive resin film is dried under reduced pressure if necessary, and then using a hot plate, oven, infrared rays, etc., in the range of 50 ° C. to 180 ° C.
  • a dry photosensitive resin film is obtained by performing heat treatment for 1 minute to several hours at .
  • the dry photosensitive resin film is irradiated with actinic rays through a photomask having a desired pattern.
  • Actinic rays used for exposure include ultraviolet rays, visible rays, electron beams, X-rays, etc.
  • post-exposure baking may be performed. By performing post-exposure baking, effects such as improvement in resolution after development and an increase in the allowable range of development conditions can be expected.
  • the post-exposure bake temperature is preferably 50 to 180°C, more preferably 60 to 150°C.
  • the post-exposure bake time is preferably 10 seconds to several hours. When the post-exposure baking time is within the above range, the reaction proceeds favorably, and the development time may be shortened.
  • the exposed photosensitive resin film is developed using a developer to remove portions other than the exposed portion.
  • Developers include tetramethylammonium hydroxide, diethanolamine, diethylaminoethanol, sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, triethylamine, diethylamine, methylamine, dimethylamine, dimethylaminoethyl acetate, dimethylaminoethanol, dimethyl
  • alkaline compounds such as aminoethyl methacrylate, cyclohexylamine, ethylenediamine and hexamethylenediamine are preferred.
  • these alkaline aqueous solutions are added with a polar solvent such as N-methyl-2-pyrrolidone, N,N-dimethylformamide, N,N-dimethylacetamide, dimethylsulfoxide, ⁇ -butyrolactone, dimethylacrylamide, methanol, ethanol, Alcohols such as isopropanol, esters such as ethyl lactate and propylene glycol monomethyl ether acetate, and ketones such as cyclopentanone, cyclohexanone, isobutyl ketone and methyl isobutyl ketone may be added alone or in combination. good.
  • a developing method methods such as spray, puddle, immersion, and ultrasonic waves are possible.
  • alcohols such as ethanol and isopropyl alcohol
  • esters such as ethyl lactate and propylene glycol monomethyl ether acetate may be added to the distilled water for rinsing.
  • the step of heat-treating the developed photosensitive resin film is performed.
  • Heat treatment can remove residual organic solvents and components with low heat resistance, so that heat resistance and chemical resistance can be improved.
  • the photosensitive resin composition of the present invention contains a polyimide precursor, a polybenzoxazole precursor and/or a copolymer thereof, it can form an imide ring or an oxazole ring by heat treatment. can improve sexuality.
  • the photosensitive resin composition of the present invention contains a thermal cross-linking agent, the thermal cross-linking reaction can be advanced by heat treatment, and heat resistance and chemical resistance can be improved.
  • the heat treatment temperature is preferably 200° C. or higher, more preferably 220° C. or higher, even more preferably 230° C.
  • the temperature is preferably 400° C. or lower, more preferably 350° C. or lower, and even more preferably 320° C. or lower. Within this temperature range, the temperature may be raised stepwise or continuously.
  • the heat treatment time is preferably 30 minutes or longer, more preferably 45 minutes or longer. From the viewpoint of productivity, it is preferably 180 minutes or less, more preferably 120 minutes or less. For example, there is a method of performing heat treatment at 150° C. and 250° C. for 60 minutes each, and a method of performing heat treatment while linearly increasing the temperature from room temperature to 250° C. over 2 hours.
  • a cured product formed from the photosensitive resin composition of the present invention is a display device comprising a first electrode formed on a substrate and a second electrode provided opposite to the first electrode, specifically For example, it can be used for a planarization layer of a liquid crystal display device, a planarization layer and/or a pixel division layer of an organic EL display device, and the like.
  • An organic EL display device will be described below as an example.
  • the organic EL display device of the present invention comprises the cured product.
  • a drive circuit, a planarization layer, a first electrode, a pixel division layer, an organic EL layer (light-emitting layer) and a second electrode are provided on a substrate, and the planarization layer and/or the pixel division layer are the It is preferably an organic EL display device containing a cured product.
  • a thin film transistor hereinafter also referred to as a TFT
  • a TFT thin film transistor located on the side of the TFT and connected to the TFT are formed on a substrate such as a glass or resin film.
  • a planarization layer is provided thereon so as to cover the unevenness, and an organic EL layer is provided on the planarization layer.
  • the organic EL layer and the wiring are connected via a contact hole and a first electrode formed in the planarization layer.
  • flexible organic EL display devices have become mainstream in recent years, and it is preferable that the organic EL display device has a substrate having the drive circuit made of a resin film.
  • the organic EL display device of the present invention it is preferable that at least a portion of the portion provided with the cured product has a bendable portion and/or a portion fixed in a bent state.
  • a cured product obtained by curing the photosensitive resin composition or the photosensitive resin sheet of the present invention an organic EL display device having excellent bending resistance can be obtained.
  • the radius of curvature of the bendable portion and/or the portion fixed in a bent state is preferably 0.1 mm or more, and preferably 5 mm or less. If the radius of curvature is 0.1 mm or more, it is possible to ensure bending resistance at the bent portion, and if it is 5 mm or less, it is possible to ensure designability such as a narrow frame.
  • the organic EL display device of the present invention can be bent at any appropriate portion.
  • the organic EL display device may be bendable at the central portion like a foldable display device, or may be bendable at the ends from the viewpoint of maximizing design and display screen. good.
  • the organic EL display device may be bendable along its longitudinal direction and may be bendable along its lateral direction. It is sufficient that a specific portion of the organic EL display device can be bent (for example, part or all of the four corners can be bent obliquely) depending on the application.
  • FIG. 1 shows a cross-sectional view of an example of a TFT substrate on which a planarization layer and a pixel division layer are formed.
  • Bottom-gate type or top-gate type TFTs 2 are provided in a matrix on a substrate 1 , and a TFT insulating layer 3 is formed to cover the TFTs 2 .
  • a wiring 4 connected to the TFT 2 is provided on the TFT insulating layer 3 .
  • a flattening layer 5 is provided on the TFT insulating layer 3 so as to bury the wiring 4 therein.
  • a contact hole 6 reaching the wiring 4 is provided in the planarization layer 5 .
  • ITO transparent electrode
  • the first electrode 7 becomes an electrode of a display element (for example, an organic EL element).
  • a pixel dividing layer 8 is formed so as to cover the periphery of the first electrode 7 .
  • the organic EL element may be of a top emission type in which light is emitted from the side opposite to the substrate 1, or may be of a bottom emission type in which light is extracted from the substrate 1 side. In this manner, an active matrix type organic EL display device is obtained in which the TFTs 2 for driving the organic EL elements are connected to the respective organic EL elements.
  • the TFT insulating layer 3, the planarizing layer 5 and/or the pixel dividing layer 8 are formed by (1) applying the photosensitive resin composition of the present invention to a substrate to form a photosensitive resin film, and (2) (3) exposing the dried photosensitive resin film through a photomask; (4) developing the exposed photosensitive resin film; and (5) developing the photosensitive resin film. It can be formed by a step of heat-treating a flexible resin film. An organic EL display device can be obtained by a manufacturing method including these steps.
  • the photosensitive resin composition of the present invention is preferably used as a semiconductor device provided with a cured product formed by curing it.
  • the cured product can be used as an insulating film or protective film that constitutes a semiconductor device (electronic component).
  • semiconductor devices include active components such as transistors, diodes, integrated circuits (hereinafter referred to as ICs) and memories, and passive components such as resistors, capacitors and inductors.
  • An electronic component using a semiconductor is also called a semiconductor device.
  • cured products possessed by electronic components include passivation films of semiconductors, semiconductor elements, surface protective films such as TFTs, interlayer insulating films in multilayer wiring for high-density mounting of 2 to 10 layers, insulating films of touch panel displays, Although it is suitably used for applications such as protective films, it is not limited to this and can take various structures.
  • the surface of the substrate on which the cured product is formed can be appropriately selected depending on the application and process.
  • an electronic device having a surface protective film, an interlayer insulating film, etc. on which the cured product of the present invention is arranged for example, an MRAM with low heat resistance can be cited. That is, the cured product of the present invention is suitable for use as a surface protective film for MRAM.
  • the cured product of the present invention is also suitable for these surface protective films. It is also suitable for use in fan-out wafer level packages (hereinafter referred to as fan-out WLP).
  • the fan-out WLP uses sealing resin such as epoxy resin to provide an extended portion around the semiconductor chip, rewires from the electrodes on the semiconductor chip to the extended portion, and mounts solder balls on the extended portion.
  • wiring is installed so as to straddle the boundary formed by the main surface of the semiconductor chip and the main surface of the sealing resin. That is, an interlayer insulating film is formed on a base material composed of two or more kinds of materials such as a semiconductor chip with metal wiring and a sealing resin, and wiring is formed on the interlayer insulating film.
  • wiring is installed so as to straddle the boundary line between the main surface of the semiconductor chip and the main surface of the printed circuit board. .
  • an interlayer insulating film is formed on a substrate made of two or more materials, and wiring is formed on the interlayer insulating film.
  • the cured product obtained by curing the photosensitive resin composition of the present invention has high adhesion to semiconductor chips with metal wiring, and has high adhesion to sealing resins such as epoxy resins. It is suitably used as an interlayer insulating film provided on a base material composed of at least one kind of material.
  • TMAH tetramethylammonium aqueous solution
  • the resulting pattern of the developed film was observed using an FDP microscope MX61 (manufactured by Olympus Co., Ltd.) at a magnification of 20 times, and the minimum required exposure dose at which the contact hole diameter reached 10 ⁇ m was determined.
  • the substrate with the developed photosensitive resin film adhered to the entire surface was heated at 250° C. for 60 minutes under a nitrogen atmosphere using an inert oven (CLH-21CD-S manufactured by Koyo Thermo Systems Co., Ltd., hereinafter referred to as the inert oven). After curing (heat treatment) for a minute, a polyimide film substrate having a cured product with a film thickness of 2.0 ⁇ m was obtained.
  • CLH-21CD-S manufactured by Koyo Thermo Systems Co., Ltd.
  • the polyimide film substrate provided with the cured product was cut into 10 pieces each having a size of 50 mm long and 10 mm wide.
  • the cut polyimide film substrate having the cured product was stored in an air atmosphere at 100° C. for 500 hours. Thereafter, the polyimide film substrate provided with the cured product was held for 30 seconds while being bent at 180° along a 25 mm long line with the side provided with the cured product facing outward. After 30 seconds have passed, the folded polyimide film substrate is opened, and an FPD inspection microscope (MX-61L; manufactured by Olympus Co., Ltd.) is used to observe the bent portion along a vertical 25 mm line on the surface of the cured product on the polyimide film substrate.
  • MX-61L manufactured by Olympus Co., Ltd.
  • the appearance change of the surface of the cured product was evaluated.
  • the bending test was performed within a radius of curvature of 0.05 to 1.0 mm, and the minimum radius of curvature that did not cause peeling of the cured product from the polyimide film substrate or appearance change such as cracks on the surface of the cured product was recorded.
  • FIG. 2 shows a schematic diagram of the substrate used.
  • an ITO transparent conductive film of 100 nm is formed on the entire surface of the substrate by a sputtering method.
  • An electrode 13 was formed at the same time.
  • the obtained substrate was subjected to ultrasonic cleaning for 10 minutes using a cleaning solution "Semico Clean 56" (trade name, manufactured by Furuuchi Chemical Co., Ltd.), and then cleaned with ultrapure water.
  • a photosensitive resin composition obtained in each of Examples and Comparative Examples described later is applied by a spin coating method at an arbitrary number of rotations to obtain a photosensitive resin film.
  • a step of drying the photosensitive resin film pre-baking was performed on a hot plate at 120° C. for 2 minutes to obtain a dried photosensitive resin film.
  • PLA parallel light mask aligner
  • PLA-501F manufactured by Canon Inc.
  • an ultra-high pressure mercury lamp was applied as a light source (g-line, h-line, After UV exposure using as a mixed line of i-line), it is developed with a 2.38% by mass tetramethylammonium hydroxide aqueous solution using an automatic developing device (AD-2000 manufactured by Takizawa Sangyo Co., Ltd.), and only the exposed portion is exposed. After dissolving, it was rinsed with pure water. The resulting patterned substrate was cured (heated) in an oven at 250° C. under a nitrogen atmosphere for 60 minutes using an inert oven.
  • AD-2000 automatic developing device manufactured by Takizawa Sangyo Co., Ltd.
  • the pixel division layer 14 having a width of 50 ⁇ m and a length of 260 ⁇ m is arranged at a pitch of 155 ⁇ m in the width direction and a pitch of 465 ⁇ m in the length direction, and each opening exposes the first electrode. It is formed only in the substrate effective area.
  • a pixel division layer having an aperture ratio of 18% was provided in a square substrate effective area of 16 mm on a side, and the thickness of the pixel division layer was approximately 2.0 ⁇ m.
  • an organic EL layer 15 was formed by a vacuum deposition method.
  • the degree of vacuum during vapor deposition was 1 ⁇ 10 ⁇ 3 Pa or less, and the substrate was rotated with respect to the vapor deposition source during vapor deposition.
  • 10 nm of compound (HT-1) was deposited as a hole injection layer, and 50 nm of compound (HT-2) was deposited as a hole transport layer.
  • a compound (GH-1) as a host material and a compound (GD-1) as a dopant material were deposited on the light-emitting layer to a thickness of 40 nm with a doping concentration of 10%.
  • the compound (ET-1) and the compound (LiQ) as electron transport materials were laminated at a volume ratio of 1:1 to a thickness of 40 nm. Structures of compounds used in the organic EL layer are shown below.
  • the film thickness referred to here is a value displayed on a crystal oscillation type film thickness monitor.
  • the produced organic EL display device was stored in an air atmosphere at 100° C. Every 100 hours, the organic EL display device was taken out and emitted by direct current driving at 10 mA/cm 2 to measure the light emitting area in the light emitting pixel. Taking the initial light emitting area before the reliability test as 100, the minimum time for the light emitting area after the UV irradiation treatment test to be 50 or less is defined as the organic EL display device reliability (unit: hours), and the reliability of 500 hours or more is considered to pass. bottom.
  • PETG Showfree (registered trademark) PETG (aliphatic epoxy thermal cross-linking agent, compound represented by the following chemical formula, manufactured by Showa Denko K.K.)
  • TEPIC-VL TEPIC-VL
  • TEPIC epoxy thermal cross-linking agent containing isocyanuric ring structure, compound represented by the following chemical formula, manufactured by Nissan Chemical Industries, Ltd.
  • VG3101L thermo cross-linking agent having an aromatic ring and an epoxy group, a compound represented by the following chemical formula, manufactured by Printec Co., Ltd.
  • ⁇ BTS butyl p-toluenesulfonate (a thermal acid generator having a sulfonate ester structure, manufactured by Fuji Film Wako Pure Chemical Industries, Ltd.)
  • ⁇ PAG-103 a thermal acid generator having a sulfonate ester structure, a compound represented by the following chemical formula, manufactured by BASF Japan Co., Ltd.
  • the reaction mixture was then poured into 3 L of methanol to purify the polymer and the precipitated polymer was dried.
  • the resulting polymer was dissolved in 1.6 L of acetone, 2 g of concentrated hydrochloric acid was added at 60° C., and the mixture was stirred for 7 hours to deprotect pt-butoxystyrene and convert it to hydroxystyrene.
  • the solution was poured into water to precipitate the polymer, and the resulting precipitate was washed with water three times and then dried in a vacuum dryer at 50°C for 24 hours to obtain the desired polyhydroxystyrene (E1). Obtained.
  • Example 1 Under a yellow light, (A) 10.0 g of (P1) obtained in Synthesis Example 2 as the alkali-soluble resin, and (B) 2.0 g of the quinonediazide compound 1 obtained in Synthesis Example 6 as the quinonediazide compound ((A) 20 parts by mass per 100 parts by mass), (C1) 1.5 g of HMOM-TPHAP as a thermal cross-linking agent having a phenolic hydroxyl group in the molecule and a methylol group and/or an alkoxymethyl group ((A) 100 (15 parts by mass based on parts by mass), (C2) 1.5 g of PETG as a thermal crosslinking agent having an epoxy group (15 parts by mass based on (A) 100 parts by mass), and (E) BTS as a thermal acid generator.
  • P1 obtained in Synthesis Example 2 as the alkali-soluble resin
  • B 2.0 g of the quinonediazide compound 1 obtained in Synthesis Example 6 as the quinonediazide compound
  • Photosensitive resin compositions B to X and photosensitive resin compositions a to f were obtained in the same manner as in Example 1 with the types and amounts of the compounds shown in Tables 1 and 2. Using the obtained photosensitive resin composition, the above evaluations (1) to (3) were carried out.
  • Substrate 2 TFT 3: TFT insulating layer 4: Wiring 5: Flattening layer 6: Contact hole 7: First electrode 8: Pixel dividing layer 9: Organic EL layer 10: Second electrode 11: Non-alkali glass substrate 12: First electrode 13: Auxiliary electrode 14: pixel dividing layer 15: organic EL layer 16: second electrode

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PCT/JP2022/043165 2021-11-26 2022-11-22 感光性樹脂組成物、硬化物、有機ｅｌ表示装置、半導体装置および硬化物の製造方法 Ceased WO2023095785A1 (ja)

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