WO2023087207A9 - 显示模组和显示装置 - Google Patents

显示模组和显示装置 Download PDF

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Publication number
WO2023087207A9
WO2023087207A9 PCT/CN2021/131458 CN2021131458W WO2023087207A9 WO 2023087207 A9 WO2023087207 A9 WO 2023087207A9 CN 2021131458 W CN2021131458 W CN 2021131458W WO 2023087207 A9 WO2023087207 A9 WO 2023087207A9
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WO
WIPO (PCT)
Prior art keywords
circuit board
backlight module
peripheral circuit
edge
display
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Application number
PCT/CN2021/131458
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English (en)
French (fr)
Other versions
WO2023087207A1 (zh
Inventor
赵彦礼
李晓吉
吴海龙
陈刚
李伟
李佳钦
杨娟
Original Assignee
京东方科技集团股份有限公司
重庆京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 重庆京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to CN202180003438.3A priority Critical patent/CN116710836A/zh
Priority to PCT/CN2021/131458 priority patent/WO2023087207A1/zh
Publication of WO2023087207A1 publication Critical patent/WO2023087207A1/zh
Publication of WO2023087207A9 publication Critical patent/WO2023087207A9/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices

Definitions

  • Embodiments of the present disclosure belong to the field of display technologies, and in particular relate to a display module and a display device.
  • Embodiments of the present disclosure provide a display module and a display device.
  • an embodiment of the present disclosure provides a display module, including a backlight module, a display substrate, a flexible circuit board, and a peripheral circuit board;
  • the display substrate is located on the light emitting side of the backlight module;
  • the peripheral circuit board is located on the back side of the backlight module away from the light emitting side;
  • the display substrate has a binding area located on one side of the display substrate, and the binding area is bound and connected to the peripheral circuit board through the flexible circuit board;
  • the display module further includes a reinforced protective strip, which is located on the back side of the backlight module and on the side of the peripheral circuit board close to the backlight module; the reinforced protective strip extends through the binding The edge of the backlight module on the side where the fixed area is located;
  • the peripheral circuit board partially overlaps the reinforcing protection strip.
  • the flexible circuit board includes a flexible base film and a circuit device, and the circuit device is arranged on the flexible base film and protrudes from the surface of the flexible base film;
  • An opening is provided in the peripheral circuit board, and the opening is located in a region of the peripheral circuit board overlapping with the reinforced protection strip;
  • the circuit device is embedded in the opening.
  • the reinforcing protection strip includes a first structure and a second structure, the first structure is along the first edge of the backlight module on the side where the binding area is located and is connected to the first edge.
  • the adjacent second edge and third edge are distributed; the second structure is located in the area surrounded by the first structure; the first structure is connected to the second structure, and the edge of the first structure is far away from The thickness in the direction of the backlight module is greater than the thickness of the second structure along the direction away from the backlight module;
  • a first side edge region of the peripheral circuit board overlaps the second structure.
  • a surface of the first side edge region of the peripheral circuit board facing away from the backlight module is flush with a surface of the first structure facing away from the backlight module.
  • the range of the gap between the circuit device and the reinforced protection strip is 0.2-0.5 mm;
  • the gap between the circuit device and the side wall of the opening ranges from 0.5 to 1 mm.
  • the first structure includes a main structure, a first substructure and a second substructure; the main structure is distributed along the first edge of the backlight module; the first substructure is distributed along the The second edge distribution of the backlight module; the second substructure is distributed along the third edge of the backlight module;
  • the gap between the peripheral circuit board and the main structure ranges from 1 to 1.5mm;
  • the gap between the peripheral circuit board and the first substructure ranges from 1 to 1.5mm;
  • the gap between the peripheral circuit board and the second substructure ranges from 1 to 1.5mm.
  • the edges and corners of the reinforcing protection strip respectively form arc chamfers, and the radial dimension of the arc chamfers is greater than or equal to 2mm.
  • the reinforced protection strip is made of PC, PET or metal alloy.
  • the backlight module includes a light bar, the light bar is located on the end face of the first edge of the backlight module, and the light bars are distributed along the extending direction of the first edge of the backlight module ;
  • the light bar overlaps the reinforced protection bar.
  • the light bar includes a circuit base film and a plurality of lamp beads, and the plurality of lamp beads are equally spaced on the circuit base film;
  • the circuit base film is bent from one end of the first edge of the backlight module to the backside of the backlight module, and bound to the peripheral circuit board;
  • peripheral circuit board and the portion of the circuit base film bent to the backside of the backlight module do not overlap each other.
  • a first notch or hollow is formed on the peripheral circuit board in a region corresponding to the bending of the circuit base film to the backside portion of the backlight module.
  • the thickness of the first structure ranges from 0.5 to 0.6 mm;
  • the thickness range of the second structure is 0.1-0.2mm.
  • the shape of the peripheral circuit board includes a strip shape, and the length direction of the peripheral circuit board extends along the extending direction of the first edge of the backlight module;
  • the backside of the backlight module is provided with a first alignment mark, and the first alignment mark is correspondingly located on the periphery of the second side edge area of the peripheral circuit board, and is used to check the position of the peripheral circuit board. limited;
  • the second side edge region of the peripheral circuit board is opposite the first side edge region of the peripheral circuit board
  • the range of the gap between the first alignment mark and the peripheral circuit board is 0.5-0.8mm.
  • the backside of the backlight module is provided with a second alignment mark, and the second alignment mark is correspondingly located on the first substructure, the second substructure and the second structure.
  • the periphery of is used to limit the position of the reinforced protective strip
  • the ranges of gaps between the second alignment mark and the first substructure, the second substructure and the second structure are respectively 0.3-0.5mm.
  • the width of the peripheral circuit board extending away from the first edge of the backlight module is greater than the width of the reinforcing protection strip extending away from the first edge of the backlight module;
  • the width of the peripheral circuit board extending away from the first edge of the backlight module is smaller than the width of the backlight module along the same direction.
  • the width of the peripheral circuit board extending away from the first edge of the backlight module is twice the width of the reinforcing protection strip extending away from the first edge of the backlight module;
  • the width of the peripheral circuit board extending away from the first edge of the backlight module is 1/15-1/10 of the width of the backlight module along the same direction.
  • the number of the flexible circuit boards is multiple, and each of the flexible circuit boards includes one circuit device; the plurality of flexible circuit boards are along the extending direction of the first edge of the backlight module Arranged at equal intervals in sequence;
  • the number of the openings in the peripheral circuit board is multiple, and the multiple openings are arranged at equal intervals in sequence along the extending direction of the first edge of the backlight module;
  • a plurality of the circuit devices are respectively embedded in the plurality of openings in a one-to-one correspondence.
  • the opening includes a second notch opened on a side edge of the peripheral circuit board close to the first edge of the backlight module.
  • the opening includes a through hole opened in an edge region of the peripheral circuit board near the first edge of the backlight module.
  • an embodiment of the present disclosure further provides a display device, which includes the above-mentioned display module.
  • Figure 1 is a schematic diagram of cracking of the driver chip and abnormal display of the NB product in the disclosed technology
  • FIG. 2 is a schematic front view of the display surface of the display module in an embodiment of the present disclosure
  • Fig. 3 is a schematic cross-sectional view of the structure of the module shown in Fig. 2 along the section line EE;
  • FIG. 4 is a schematic diagram of the back side of the display module opposite to the display surface in an embodiment of the disclosure
  • Fig. 5 is a partially enlarged schematic diagram of part A in Fig. 4;
  • Fig. 6 is a schematic cross-sectional view of the structure along the section line BB in Fig. 4;
  • FIG. 7 is a schematic top view of the structure of the reinforced protection strip in the embodiment of the present disclosure.
  • Fig. 8 is a schematic diagram of the gap setting structure between the first substructure and the second substructure and the peripheral circuit board along the section line FF in Fig. 7;
  • Fig. 9 is a schematic diagram of a gap setting structure between the circuit device and the side wall of the opening along the section line CC in Fig. 4;
  • FIG. 10 is a schematic diagram of a partially enlarged structure of part D in FIG. 4 .
  • Embodiments of the present disclosure are not limited to the embodiments shown in the drawings, but include modifications of configurations formed based on manufacturing processes. Accordingly, the regions illustrated in the figures have schematic properties, and the shapes of the regions shown in the figures illustrate the specific shapes of the regions and are not intended to be limiting.
  • the ultra-thin and ultra-narrow NB model that uses COF to bend to the back of the display module and binds to the peripheral circuit board is likely to cause crush damage to the display driver chip (IC) during initial installation and testing, resulting in the display driver IC Crack (IC Crack), refer to Figure 1.
  • ultra-thin NB fragments are prone to occur, resulting in abnormal display of NB products. Facing the strict production, verification and use conditions of ultra-thin and ultra-narrow NB models, how to protect the display driver chip (IC) and improve the overall strength of the LCD module under the condition of realizing ultra-thin and ultra-narrow NB models become a technical problem to be solved urgently.
  • the embodiment of the present disclosure provides a display module, refer to 2- Fig.
  • the display substrate 2 is located on the light-emitting side 101 of the backlight module 1; the peripheral circuit board 4 is located on the backlight module 1 away from the light-emitting side 101
  • the back side 102 of the display substrate 2 has a binding area 100 located on one side edge thereof, and the binding area 100 is bound and connected to the peripheral circuit board 4 through the flexible circuit board 3; wherein, the display module also includes a reinforcing protection strip 5, It is located at the backside 102 of the backlight module 1, and is located on the side of the peripheral circuit board 4 close to the backlight module 1; the reinforcement protection strip 5 extends through the edge of the backlight module 1 on the side where the binding area 100 is located; the peripheral circuit board 4 and the reinforcement The protection strips 5 partially overlap.
  • the display substrate 2 may be an array substrate of a liquid crystal display module, or a liquid crystal display panel of a liquid crystal display module.
  • the flexible circuit board 3 has a certain degree of flexibility, and the flexible circuit board 3 can be flexibly bent to the back side 102 of the backlight module 1 after being bound and connected to the binding area 100 of the display substrate 2 located on the light-emitting side 101 of the backlight module 1 , And bind and connect with the peripheral circuit board 4 located at the backside 102 of the backlight module 1 .
  • the peripheral circuit board 4 provides the display substrate 2 with data driving signals for display through the flexible circuit board 3 .
  • the reinforced protective strip 5 is made of PC, PET or metal alloy.
  • the reinforced protective strip 5 made of hard PC, PET or metal alloy has a certain supporting strength, and the reinforced protective strip 5 can be used to protect the backlight by extending the reinforced protective strip 5 past the edge of the backlight module 1 on the side where the binding area 100 is located.
  • the edge of the side of the module 1 corresponding to the binding area 100 forms a continuous support, so that the strength of the backlight module 1 and even the display module increases in the direction along the edge of the side where the binding area 100 is located, effectively reducing the backlight module 1 and even the display.
  • the amount of deformation of the substrate 2 after being stressed reduces the fragmentation rate of the production line, thereby avoiding that the display module is not prone to fragmentation during production, verification, and use when the thickness of the display module is thin (such as 1.9mm thickness). , improving the overall strength of the display module, thereby improving the quality of the display module.
  • the peripheral circuit board 4 is arranged on the backside 102 of the backlight module 1. Compared with the scheme in which the peripheral circuit board is arranged on the light-emitting side 101 of the backlight module 1, the arrangement of the peripheral circuit board 4 will not occupy the display module.
  • the side frame area where the binding area 100 is located can reduce the width of the side frame area where the binding area 100 of the display module is located, which is beneficial to realize the ultra-narrow frame of the display module.
  • the peripheral circuit board 4 partially overlaps with the reinforcing protection strip 5.
  • the peripheral circuit board 4 is arranged closer to the binding area 100 of the display substrate 2, so as to shorten the length of the bonding connection line; on the other hand, It is beneficial to strengthen the protective strip 5 and the peripheral circuit board 4 to jointly form a good protection for the circuit devices 32 on the flexible circuit board 3 .
  • the flexible circuit board 3 includes a flexible base film 31 and a circuit device 32, the circuit device 32 is disposed on the flexible base film 31, and protrudes from the surface of the flexible base film 31; the peripheral circuit board 4 is provided with an opening 40 , the opening 40 is located in the area where the peripheral circuit board 4 overlaps the reinforcing protection strip 5 ; the circuit device 32 is embedded in the opening 40 . That is, the flexible circuit board 3 adopts a COF (that is, the circuit device 32 is integrated on the flexible circuit board 3 ) scheme. In this way, the opening 40 in the peripheral circuit board 4 and the reinforcing protection strip 5 can surround and form a space for accommodating the circuit device 32, and the circuit device 32 is embedded in the space.
  • COF that is, the circuit device 32 is integrated on the flexible circuit board 3
  • the impact of the circuit device 32 on the display module can be reduced.
  • the contribution of the thickness makes the overall thickness of the display module thinner; on the other hand, the circuit device 32 is not easy to be crushed and ruptured during the initial assembly and testing of the display module in this space, thereby forming a negative impact on the circuit device 32.
  • the enhanced protective strip 5 can be made of a metal alloy material with good heat dissipation performance, the enhanced protective strip 5 can also play a good role in dissipating the heat generated by the circuit device 32 when it is working, thereby improving The quality protection of the circuit device 32 is well formed.
  • circuit device 32 may be a data driver chip.
  • the data driving chip provides data driving signals for the display substrate 2 when the display module displays.
  • the circuit device 32 is arranged on the flexible base film 31 to form the flexible circuit board 3.
  • the flexible base film 31 is bent to the backlight module. 1 backside 102 so that the circuit device 32 is embedded in the opening 40 of the peripheral circuit board 4, which can greatly reduce the frame width of the display module, which is conducive to the realization of an ultra-narrow frame of the display module;
  • the width of the side frame area where the 100 is located is reduced from 7.0mm to 5.0mm.
  • the reinforced protective strip 5 includes a first structure 51 and a second structure 52 , and the first structure 51 is along the side of the backlight module 1 where the bonding region 100 is located.
  • the first edge 11 of the first edge 11 and the second edge 12 and the third edge 13 adjacent to the first edge 11 are distributed; the second structure 52 is located in the area formed by the first structure 51; the first structure 51 and the second structure 52 are connected , the thickness h1 of the first structure 51 along the direction away from the backlight module 1 is greater than the thickness h2 of the second structure 52 along the direction away from the backlight module 1; the first side edge region 41 of the peripheral circuit board 4 intersects with the second structure 52 stack.
  • the opening 40 and the second structure 52 in the peripheral circuit board 4 can enclose a space for accommodating the circuit device 32 .
  • the surface of the first side edge region 41 of the peripheral circuit board 4 facing away from the backlight module 1 is flush with the surface of the first structure 51 facing away from the backlight module 1 . That is, the first side edge region 41 of the peripheral circuit board 4 is embedded in the space formed by the first structure 51 and the second structure 52; such an arrangement, on the one hand, can ensure that the protective strip 5 is strengthened against the backlight module 1, display
  • the sufficient supporting strength of the substrate 2 ensures the strength of the entire ultra-thin display module; on the other hand, the nested setting between the peripheral circuit board 4 and the reinforcing protection strip 5 can reduce the overall thickness of the display module to a certain extent. The thickness is conducive to realizing an ultra-thin display module.
  • the thickness h1 of the first structure 51 ranges from 0.5 to 0.6 mm; the thickness h2 of the second structure 52 ranges from 0.1 to 0.2 mm. In this way, the thickness of the reinforced protective strip 5 is relatively thin, which is beneficial to realize an ultra-thin display module.
  • the gap a between the circuit device 32 and the reinforcing protection strip 5 ranges from 0.2 to 0.5 mm; the gap b between the circuit device 32 and the side wall of the opening 40 ranges from 0.5 to 0.5 mm. 1mm.
  • the gap a and the gap b are the reserved tolerances when the circuit device 32 is assembled, which can ensure that the circuit device 32 can be smoothly assembled into the space formed by the opening 40 and the reinforcement protection strip 5, and it is not easy to be bumped or squeezed.
  • Deviations occur when the peripheral circuit board 4 is assembled and interference between the circuit device 32 and the peripheral circuit board 4 caused by the length tolerance of the flexible circuit board 3 is avoided, and the gap between the flexible circuit board 3 and the external system (such as the backside shell of the display module) is avoided. Interference occurs between them, which ensures the operational yield of the assembly of the circuit device 32; on the other hand, the gap a and the gap b can also ensure that when the display module is squeezed or bumped, the side wall of the opening 40 and the reinforcing protection strip 5 will not collide to the circuit device 32, thereby protecting the circuit device 32 from bump damage.
  • the first structure 51 includes a main structure 511, a first substructure 512 and a second substructure 513; the main structure 511 is distributed along the first edge 11 of the backlight module 1; A substructure 512 is distributed along the second edge 12 of the backlight module 1; a second substructure 513 is distributed along the third edge 13 of the backlight module 1; the gap c1 between the peripheral circuit board 4 and the main structure 511 ranges from 1 to 1.5 mm; the gap c2 between the peripheral circuit board 4 and the first substructure 512 ranges from 1 to 1.5 mm; the gap c3 between the peripheral circuit board 4 and the second substructure 513 ranges from 1 to 1.5 mm.
  • the above-mentioned gap setting enables the reinforced protective strip 5 to accurately limit the peripheral circuit board 4 , and at the same time ensures that the material of the reinforced protective strip 5 is fully and effectively utilized.
  • the edges and corners of the reinforcing protection strip 5 respectively form arc chamfers, and the radial dimension of the arc chamfers is greater than or equal to 2 mm.
  • Such an arrangement can prevent the flexible base film 31 in the flexible circuit board 3 and the circuit devices 32 on it from being damaged when they come into contact with the edges or corners of the reinforcing protection strip 5 during the assembly process, thereby protecting the flexible circuit board well. 3 and the circuit device 32 thereon.
  • the backlight module 1 includes a light bar 14, the light bar 14 is located on the end face of the first edge 11 of the backlight module 1, and the light bar 14 is along the first edge of the backlight module 1. 11 in the direction of extension; the light bar 14 overlaps with the reinforcing protection bar 5 .
  • the reinforced protection strip 5 can be made of a metal alloy material with good thermal conductivity, the reinforced protection strip 5 can well dissipate the heat emitted by the light strip 14 in the area where the light strip 14 overlaps with the reinforced protection strip 5 . Avoid damage to the light bar 14 caused by excessive heat accumulation.
  • the backlight module 1 further includes a backplane 15, a light guide plate 16, an optical film layer 17 and a reflective layer 18, and the reflective layer 18, the light guide plate 16 and the optical film layer 17 are sequentially stacked on the bottom wall of the backplane 15.
  • the back plate 15 extends to the edge end surface of the cladding reflective layer 18, the light guide plate 16 and the optical film layer 17;
  • the light bar 14 is arranged on the cladding reflective layer 18, the light guide plate 16 and the optical On the side wall of the edge end face of the film layer 17.
  • the light bar 14 includes a circuit base film 141 and a plurality of lamp beads 142, and the plurality of lamp beads 142 are equally spaced on the circuit base film 141;
  • the light emitted by the lamp beads 142 is incident into the light guide plate 16 from the edge surface of the light guide plate 16 , that is, the backlight module 1 adopts a side-type backlight source.
  • the side-type backlight can reduce the thickness of the backlight module 1 , thereby reducing the thickness of the entire display module.
  • the circuit base film 141 is bent from one end of the first edge 11 of the backlight module 1 to the backside 102 of the backlight module 1, and is bonded to the peripheral circuit board 4. , the peripheral circuit board 4 and the portion of the circuit base film 141 that is bent to the backside 102 of the backlight module 1 do not overlap each other. Wherein, the circuit base film 141 and the peripheral circuit board 4 are bound and connected through the connector 6 provided on the peripheral circuit board 4 .
  • the parts of the peripheral circuit board 4 and the circuit base film 141 that are bent to the backside 102 of the backlight module 1 not overlap each other, on the one hand, it is beneficial to avoid an increase in the thickness of the peripheral circuit board 4 and the circuit base film 141 after being stacked. On the other hand, it can effectively prevent the heat released by the peripheral circuit board 4 from causing signal interference to the circuit base film 141 , thereby ensuring the normal operation of the light bar 14 .
  • the peripheral circuit board 4 forms a first gap 42 or a hollow (not shown in the figure) in the area corresponding to the portion of the circuit base film 141 that is bent to the backside 102 of the backlight module 1 .
  • Such setting is beneficial to avoid the increase in the thickness of the peripheral circuit board 4 and the circuit base film 141 after overlapping; on the other hand, it can effectively prevent the heat released by the peripheral circuit board 4 from causing signal interference to the circuit base film 141, Therefore, the normal operation of the light bar 14 is ensured.
  • the backside 102 of the backlight module 1 is provided with a second alignment mark 8, and the second alignment mark 8 is correspondingly located on the first substructure 512, the second substructure 513, and the second structure. 52, used to limit the position of the reinforcing protection strip 5; the gap d2 between the second alignment mark 8 and the first substructure 512, the second substructure 513 and the second structure 52 ranges from 0.3 to 0.5 mm.
  • the setting of the second alignment mark 8 and the gap d2 between it and the first substructure 512, the second substructure 513, and the second structure 52 can not only ensure the accuracy of the setting position of the reinforcing protection strip 5, but also ensure that Enhance the effectiveness and yield of protection strip 5 assembly (such as attaching).
  • the width e1 of the peripheral circuit board 4 extending away from the first edge 11 of the backlight module 1 is equal to the width e2 of the reinforcing protection strip 5 extending away from the first edge 11 of the backlight module 1. Twice; the width e1 of the peripheral circuit board 4 extending away from the first edge 11 of the backlight module 1 is 1/15-1/10 of the width e3 of the backlight module 1 along the same direction. That is to say, in this embodiment, the reinforcing protection strip 5 and the peripheral circuit board 4 are only correspondingly distributed in a relatively narrow local area near the first edge 11 of the backlight module 1, which can further ensure that the overall thickness of the display module will not be too large. It is beneficial to realize the ultra-thin display module; it is also beneficial to save the material cost of the reinforced protective strip 5 .
  • each flexible circuit board 3 includes a circuit device 32 ; multiple flexible circuit boards 3 are arranged along the first edge 11 of the backlight module 1 The extension direction of the backlight module 1 is arranged at equal intervals in sequence; the number of openings 40 in the peripheral circuit board 4 is multiple, and the plurality of openings 40 are arranged at equal intervals in sequence along the extension direction of the first edge 11 of the backlight module 1; the plurality of circuit devices 32 are respectively are embedded in the plurality of openings 40 in a one-to-one correspondence.
  • the number of flexible circuit boards 3 is five, and correspondingly, there are five circuit devices 32 .
  • the opening 40 includes a second notch opened on a side edge of the peripheral circuit board 4 close to the first edge 11 of the backlight module 1 .
  • the opening includes a through hole (not shown in the figure) opened in an edge region of the peripheral circuit board near the first edge of the backlight module.
  • the reinforced protective strip 5 can be aligned with the corresponding binding region 100 of the backlight module 1.
  • the edge of the side forms a continuous support, so that the strength of the backlight module 1 and even the display module increases in the direction along the side edge of the binding area 100, effectively reducing the deformation of the backlight module 1 and even the display substrate 2 after being stressed, reducing The fragmentation rate of the production line, so as to avoid the display module is not easy to be broken in the process of production, verification and use when the thickness of the display module is thin (such as 1.9mm), and the overall strength of the display module is improved.
  • Embodiments of the present disclosure also provide a display device, which includes the display module in the above embodiments.
  • the ultra-thin and ultra-narrow frame of the display device can be realized; on the other hand, the ultra-thin display device is prevented from being broken, and the overall strength of the display device is improved. Therefore, the quality of the display device is improved.
  • the display device can be any product or component with a display function such as an LCD panel, an LCD TV, a mobile phone, a tablet computer, a notebook computer, a monitor, a notebook computer, a digital photo frame, a navigator, and the like.
  • a display function such as an LCD panel, an LCD TV, a mobile phone, a tablet computer, a notebook computer, a monitor, a notebook computer, a digital photo frame, a navigator, and the like.

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Abstract

一种显示模组和包括该显示模组的显示装置，该显示模组包括背光模组（1）、显示基板（2）、柔性线路板（3）和外围电路板（4）；显示基板（2）位于背光模组（1）的出光侧（101）；外围电路板（4）位于背光模组（1）的背离出光侧（101）的背侧（102）；显示基板（2）具有位于其一侧边缘的绑定区（100），绑定区（100）与外围电路板（4）通过柔性线路板（3）绑定连接；其中，显示模组还包括增强保护条（5），位于背光模组（1）的背侧（102），且位于外围电路板（4）靠近背光模组（1）的一侧；增强保护条（5）延伸经过绑定区（100）所在侧的背光模组（1）边缘；外围电路板（4）与增强保护条（5）局部交叠。

Description

显示模组和显示装置 技术领域
本公开实施例属于显示技术领域，具体涉及一种显示模组和显示装置。
背景技术
现阶段采用液晶显示模组(LCD Module，LCM)的NB(Note Book，笔记本)产品发展趋势向超薄超窄进行到了极致的阶段，这使得该产品应用普通的COG(即显示驱动芯片未集成在柔性线路板上，显示驱动芯片直接设置在背光模组的边框区)技术已经不能满足客户需求，应用COF(即显示驱动芯片集成在柔性线路板上)设计成为这种超薄超窄边框产品的重要解决方案。
发明内容
本公开实施例提供一种显示模组和显示装置。
第一方面，本公开实施例提供一种显示模组，包括背光模组、显示基板、柔性线路板和外围电路板；
所述显示基板位于所述背光模组的出光侧；所述外围电路板位于所述背光模组的背离出光侧的背侧；
所述显示基板具有位于其一侧边缘的绑定区，所述绑定区与所述外围电路板通过所述柔性线路板绑定连接；
其中，所述显示模组还包括增强保护条，位于所述背光模组的背侧，且位于所述外围电路板靠近所述背光模组的一侧；所述增强保护条延伸经过所述绑定区所在侧的所述背光模组边缘；
所述外围电路板与所述增强保护条局部交叠。
在一些实施例中，所述柔性线路板包括柔性基膜和电路器件，所述电路器件设置于所述柔性基膜上，且凸出于所述柔性基膜表面；
所述外围电路板中开设有开口，所述开口位于所述外围电路板的与所 述增强保护条交叠的区域；
所述电路器件内嵌于所述开口中。
在一些实施例中，所述增强保护条包括第一结构和第二结构，所述第一结构沿所述绑定区所在侧的所述背光模组的第一边缘以及与所述第一边缘邻接的第二边缘和第三边缘分布；所述第二结构位于所述第一结构围设形成的区域内；所述第一结构和所述第二结构连接，所述第一结构的沿远离所述背光模组方向的厚度大于所述第二结构的沿远离所述背光模组方向的厚度；
所述外围电路板的第一侧边缘区域与所述第二结构交叠。
在一些实施例中，所述外围电路板的第一侧边缘区域的背离所述背光模组的表面与所述第一结构的背离所述背光模组的表面平齐。
在一些实施例中，所述电路器件与所述增强保护条之间的间隙范围为0.2～0.5mm；
所述电路器件与所述开口侧壁之间的间隙范围为0.5～1mm。
在一些实施例中，所述第一结构包括主结构、第一子结构和第二子结构；所述主结构沿所述背光模组的第一边缘分布；所述第一子结构沿所述背光模组的第二边缘分布；所述第二子结构沿所述背光模组的第三边缘分布；
所述外围电路板与所述主结构之间的间隙范围为1～1.5mm；
所述外围电路板与所述第一子结构之间的间隙范围为1～1.5mm；
所述外围电路板与所述第二子结构之间的间隙范围为1～1.5mm。
在一些实施例中，所述增强保护条的棱边和拐角位置分别形成弧面倒角，所述弧面倒角的径向尺寸大于或等于2mm。
在一些实施例中，所述增强保护条采用PC、PET或者金属合金材质。
在一些实施例中，所述背光模组包括灯条，所述灯条位于所述背光模组的第一边缘端面，且所述灯条沿所述背光模组的第一边缘的延伸方向分 布；
所述灯条与所述增强保护条交叠。
在一些实施例中，所述灯条包括电路基膜和多个灯珠，所述多个灯珠等间隔分布于所述电路基膜上；
所述电路基膜由所述背光模组的第一边缘的一端弯折至所述背光模组的背侧，并与所述外围电路板绑定连接；
所述外围电路板与所述电路基膜的弯折至所述背光模组背侧的部分互不交叠。
在一些实施例中，所述外围电路板在对应所述电路基膜的弯折至所述背光模组背侧部分的区域形成第一缺口或者镂空。
在一些实施例中，所述第一结构的厚度范围为0.5～0.6mm；
所述第二结构的厚度范围为0.1～0.2mm。
在一些实施例中，所述外围电路板的形状包括长条形，所述外围电路板的长度方向沿所述背光模组的第一边缘的延伸方向延伸；
所述背光模组的背侧设置有第一对位标记，所述第一对位标记对应位于所述外围电路板的第二侧边缘区域的外围，用于对所述外围电路板的位置进行限定；
所述外围电路板的第二侧边缘区域与所述外围电路板的第一侧边缘区域相对；
所述第一对位标记与所述外围电路板之间的间隙范围为0.5～0.8mm。
在一些实施例中，所述背光模组的背侧设置有第二对位标记，所述第二对位标记对应位于所述第一子结构、所述第二子结构和所述第二结构的外围，用于对所述增强保护条的位置进行限定；
所述第二对位标记与所述第一子结构、所述第二子结构和所述第二结构之间的间隙范围分别为0.3～0.5mm。
在一些实施例中，所述外围电路板沿远离所述背光模组第一边缘方向 延伸的宽度大于所述增强保护条沿远离所述背光模组第一边缘方向延伸的宽度；
所述外围电路板沿远离所述背光模组第一边缘方向延伸的宽度小于所述背光模组沿同一方向的宽度。
在一些实施例中，所述外围电路板沿远离所述背光模组第一边缘方向延伸的宽度是所述增强保护条沿远离所述背光模组第一边缘方向延伸的宽度的两倍；
所述外围电路板沿远离所述背光模组第一边缘方向延伸的宽度是所述背光模组沿同一方向的宽度的1/15～1/10。
在一些实施例中，所述柔性线路板的数量为多个，每个所述柔性线路板包括一个所述电路器件；多个所述柔性线路板沿所述背光模组第一边缘的延伸方向依次等间隔排布；
所述外围电路板中所述开口的数量为多个，多个所述开口沿所述背光模组第一边缘的延伸方向依次等间隔排布；
多个所述电路器件分别一一对应地内嵌于多个所述开口中。
在一些实施例中，所述开口包括开设于所述外围电路板的靠近所述背光模组第一边缘侧边缘上的第二缺口。
在一些实施例中，所述开口包括开设于所述外围电路板的靠近所述背光模组第一边缘侧边缘区域内的通孔。
第二方面，本公开实施例还提供一种显示装置，其中，包括上述显示模组。
附图说明
附图用来提供对本公开实施例的进一步理解，并且构成说明书的一部分，与本公开实施例一起用于解释本公开，并不构成对本公开的限制。通过参考附图对详细示例实施例进行描述，以上和其它特征和优点对本领域技术人员将变得更加显而易见，在附图中：
图1为公开技术中NB产品发生驱动芯片破裂和不正常显示的示意图；
图2为本公开实施例中显示模组的显示面的正面示意图；
图3为图2中显示模组沿EE剖切线的结构剖视示意图；
图4为本公开实施例中显示模组的与显示面相对的背面示意图；
图5为图4中A部分的局部放大示意图；
图6为沿图4中BB剖切线的结构剖视示意图；
图7为本公开实施例中增强保护条的结构俯视示意图；
图8为沿图7中FF剖切线的第一子结构和第二子结构与外围电路板之间的间隙设置结构示意图；
图9为沿图4中CC剖切线的电路器件与开口侧壁之间的间隙设置结构示意图；
图10为图4中D部分的局部放大结构示意图。
其中附图标记为：
1、背光模组；11、第一边缘；12、第二边缘；13、第三边缘；14、灯条；141、电路基膜；142、灯珠；15、背板；16、导光板；17、光学膜层；18、反射层；2、显示基板；3、柔性线路板；31、柔性基膜；32、电路器件；4、外围电路板；40、开口；41、第一侧边缘区域；42、第一缺口；43、第二侧边缘区域；100、绑定区；101、出光侧；102、背侧；5、增强保护条；51、第一结构；511、主结构；512、第一子结构；513、第二子结构；52、第二结构；6、连接器；7、第一对位标记；8、第二对位标记。
具体实施方式
为使本领域技术人员更好地理解本公开实施例的技术方案，下面结合附图和具体实施方式对本公开实施例提供的一种显示模组和显示装置作进一步详细描述。
在下文中将参考附图更充分地描述本公开实施例，但是所示的实施例可以以不同形式来体现，且不应当被解释为限于本公开阐述的实施例。反 之，提供这些实施例的目的在于使本公开透彻和完整，并将使本领域技术人员充分理解本公开的范围。
本公开实施例不限于附图中所示的实施例，而是包括基于制造工艺而形成的配置的修改。因此，附图中例示的区具有示意性属性，并且图中所示区的形状例示了区的具体形状，但并不是旨在限制性的。
随着NB(Note Book，笔记本)产品超窄超薄化发展趋势，液晶显示模组(LCM)的厚度已经由原来的2.6T(毫米)减小到了1.9T，同时绑定侧边框区的宽度也由7mm减小到了5mm，这对于产品的生产和验证提出非常苛刻的条件，普通的COG(即显示驱动芯片未集成在柔性线路板上，显示驱动芯片直接设置在背光模组的边框区)技术已经不能满足客户需求，所以应用COF(即显示驱动芯片集成在柔性线路板上)技术在NB机种上成为一种可能。
但应用COF弯折到显示模组背侧并与外围电路板绑定连接的超薄超窄NB机种在初装和测试时容易对显示驱动芯片(IC)造成挤压伤害，导致显示驱动芯片破裂(IC Crack)，参照图1，同时很容易发生超薄NB破片，导致NB产品不正常显示。面对超薄超窄NB机种严苛的生产，验证和使用条件，如何在实现NB机种超薄超窄的情况下对显示驱动芯片(IC)进行保护并提升液晶显示模组的整体强度成为目前亟待解决的技术问题。
针对上述如何在实现NB机种超薄超窄的情况下对显示驱动芯片(IC)进行保护并提升液晶显示模组的整体强度的问题，本公开实施例提供一种显示模组，参照2-图6，包括背光模组1、显示基板2、柔性线路板3和外围电路板4；显示基板2位于背光模组1的出光侧101；外围电路板4位于背光模组1的背离出光侧101的背侧102；显示基板2具有位于其一侧边缘的绑定区100，绑定区100与外围电路板4通过柔性线路板3绑定连接；其中，显示模组还包括增强保护条5，位于背光模组1的背侧102，且位于外 围电路板4靠近背光模组1的一侧；增强保护条5延伸经过绑定区100所在侧的背光模组1边缘；外围电路板4与增强保护条5局部交叠。
其中，显示基板2可以是液晶显示模组的阵列基板，也可以是液晶显示模组的液晶显示面板。柔性线路板3具有一定的柔性性能，柔性线路板3能在与位于背光模组1出光侧101的显示基板2的绑定区100绑定连接后柔性弯折至背光模组1背侧102，并与位于背光模组1背侧102的外围电路板4绑定连接。
在一些实施例中，外围电路板4通过柔性线路板3为显示基板2提供显示时的数据驱动信号。
在一些实施例中，增强保护条5采用PC、PET或者金属合金材质。采用硬质PC、PET或者金属合金材料的增强保护条5具有一定的支撑强度，通过使增强保护条5延伸经过绑定区100所在侧的背光模组1边缘，使增强保护条5能够对背光模组1的对应绑定区100所在侧的边缘形成连续支撑，使背光模组1乃至显示模组在沿绑定区100所在侧边缘的方向上强度增大，有效降低背光模组1乃至显示基板2受力后的变形量，减少产线作业破片率，从而避免在显示模组厚度较薄(如1.9mm厚度)的情况下，显示模组在生产、验证以及使用过程中不容易发生破片，提升了显示模组的整体强度，进而提升了显示模组的品质。
本实施例中，将外围电路板4设置于背光模组1背侧102，相对于外围电路板设置于背光模组1出光侧101的方案，外围电路板4的设置不会再占用显示模组的绑定区100所在侧边框区，从而能够减小显示模组绑定区100所在侧边框区的宽度，有利于实现显示模组的超窄边框。
本实施例中，外围电路板4与增强保护条5局部交叠，一方面，使外围电路板4更靠近显示基板2的绑定区100设置，便于缩短绑定连接线长度；另一方面，有利于增强保护条5和外围电路板4共同对柔性线路板3上的电路器件32形成良好保护。
在一些实施例中，柔性线路板3包括柔性基膜31和电路器件32，电路器件32设置于柔性基膜31上，且凸出于柔性基膜31表面；外围电路板4中开设有开口40，开口40位于外围电路板4的与增强保护条5交叠的区域；电路器件32内嵌于开口40中。即柔性线路板3采用COF(即电路器件32集成在柔性线路板3上)方案。如此设置，外围电路板4中的开口40和增强保护条5能够围设形成容置电路器件32的空间，电路器件32内嵌于该空间中，一方面，能够减少电路器件32对显示模组厚度的贡献，使显示模组的整体厚度减薄；另一方面，电路器件32在该空间内不容易在显示模组初装和测试时受到挤压伤害而致破裂，从而对电路器件32形成了良好保护；再一方面，由于增强保护条5可以采用具有良好散热性能的金属合金材质，所以增强保护条5还能起到对电路器件32工作时产生的热量进行良好散发的作用，从而更好地对电路器件32形成品质保护。
在一些实施例中，电路器件32可以是数据驱动芯片。数据驱动芯片在显示模组显示时为显示基板2提供数据驱动信号。电路器件32设置于柔性基膜31上构成柔性线路板3，相对于目前将电路器件直接设置在显示基板绑定区的设置方案(即COG方案)，通过柔性基膜31弯折到背光模组1背侧102从而使电路器件32内嵌于外围电路板4的开口40中，能够大大缩减显示模组的边框宽度，有利于显示模组实现超窄边框；如能够将显示基板2绑定区100所在侧边框区的宽度由7.0mm缩减至5.0mm。
在一些实施例中，参照图5、图6、图7和图8，增强保护条5包括第一结构51和第二结构52，第一结构51沿绑定区100所在侧的背光模组1的第一边缘11以及与第一边缘11邻接的第二边缘12和第三边缘13分布；第二结构52位于第一结构51围设形成的区域内；第一结构51和第二结构52连接，第一结构51的沿远离背光模组1方向的厚度h1大于第二结构52的沿远离背光模组1方向的厚度h2；外围电路板4的第一侧边缘区域41与第二结构52交叠。如此通过在外围电路板4的第一侧边缘区域41开设开 口40，能够实现外围电路板4中开口40与第二结构52围设形成容置电路器件32的空间。
在一些实施例中，参照图6和图7，外围电路板4的第一侧边缘区域41的背离背光模组1的表面与第一结构51的背离背光模组1的表面平齐。即外围电路板4的第一侧边缘区域41内嵌于第一结构51和第二结构52围设形成的空间内；如此设置，一方面，能够确保增强保护条5对背光模组1、显示基板2的足够的支撑强度，从而确保整个超薄显示模组的强度；另一方面，外围电路板4局部与增强保护条5之间的嵌套设置能够在一定程度上减少显示模组的整体厚度，有利于实现超薄显示模组。
在一些实施例中，第一结构51的厚度h1范围为0.5～0.6mm；第二结构52的厚度h2范围为0.1～0.2mm。如此增强保护条5的厚度较薄，有利于实现超薄显示模组。
在一些实施例中，参照图6和图9，电路器件32与增强保护条5之间的间隙a范围为0.2～0.5mm；电路器件32与开口40侧壁之间的间隙b范围为0.5～1mm。间隙a和间隙b为电路器件32组装时的预留公差，能确保电路器件32顺利组装至开口40和增强保护条5围设形成的空间内，不容易被磕碰或者挤压损坏，同时还避免外围电路板4组装时出现偏差和避免柔性线路板3长度公差引起的电路器件32与外围电路板4之间发生干涉，以及避免柔性线路板3与外部系统(如显示模组背侧外壳)之间发生干涉，确保了电路器件32组装的作业良率；另一方面，间隙a和间隙b还能确保在显示模组受到挤压或者碰撞时，开口40侧壁和增强保护条5不会磕碰到电路器件32，从而保护电路器件32免受磕碰损坏。
在一些实施例中，参照图7和图8，第一结构51包括主结构511、第一子结构512和第二子结构513；主结构511沿背光模组1的第一边缘11分布；第一子结构512沿背光模组1的第二边缘12分布；第二子结构513沿背光模组1的第三边缘13分布；外围电路板4与主结构511之间的间隙 c1范围为1～1.5mm；外围电路板4与第一子结构512之间的间隙c2范围为1～1.5mm；外围电路板4与第二子结构513之间的间隙c3范围为1～1.5mm。上述间隙设置，使增强保护条5能够对外围电路板4进行精确限位，同时确保增强保护条5材料的成型充分和有效利用。
在一些实施例中，参照图8，增强保护条5的棱边和拐角位置分别形成弧面倒角，弧面倒角的径向尺寸大于或等于2mm。如此设置，能够避免柔性线路板3中的柔性基膜31及其上的电路器件32在组装过程中与增强保护条5的棱边或拐角相接触时被损伤，从而很好地保护柔性线路板3及其上的电路器件32。
在一些实施例中，参照图2和图6，背光模组1包括灯条14，灯条14位于背光模组1的第一边缘11端面，且灯条14沿背光模组1的第一边缘11的延伸方向分布；灯条14与增强保护条5交叠。其中，由于增强保护条5可以采用导热性能良好的金属合金材质，所以在灯条14与增强保护条5相交叠的区域，增强保护条5能很好地对灯条14发出的热量进行散发，避免热量累积太高对灯条14造成的损坏。
在一些实施例中，背光模组1还包括背板15、导光板16、光学膜层17和反射层18，反射层18、导光板16和光学膜层17依次叠置于背板15底壁上方；背板15延伸至包覆反射层18、导光板16和光学膜层17的边缘端面；灯条14设置于背板15对应第一边缘11的包覆反射层18、导光板16和光学膜层17边缘端面的侧壁上。在一些实施例中，灯条14包括电路基膜141和多个灯珠142，多个灯珠142等间隔分布于电路基膜141上；灯珠142的出光面朝向导光板16的边缘端面，灯珠142发出的光线从导光板16的边缘端面入射至导光板16中，即背光模组1采用侧入式背光源。侧入式背光源相对于直下式背光源(即灯珠位于导光板与背板底壁之间)能够减小背光模组1的厚度，从而有利于减小整个显示模组的厚度。
在一些实施例中，参照图6和图10，电路基膜141由背光模组1的第 一边缘11的一端弯折至背光模组1的背侧102，并与外围电路板4绑定连接,外围电路板4与电路基膜141的弯折至背光模组1背侧102的部分互不交叠。其中，电路基膜141与外围电路板4通过设置于外围电路板4上的连接器6实现绑定连接。通过使外围电路板4与电路基膜141的弯折至背光模组1背侧102的部分互不交叠，一方面，有利于避免外围电路板4与电路基膜141叠置后的厚度增大；另一方面，能有效地防止外围电路板4释放的热量对电路基膜141造成信号干扰，从而确保灯条14的正常工作。
在一些实施例中，参照图10，外围电路板4在对应电路基膜141的弯折至背光模组1背侧102部分的区域形成第一缺口42或者镂空(图中未示意)。如此设置，一方面，有利于避免外围电路板4与电路基膜141叠置后的厚度增大；另一方面，能有效地防止外围电路板4释放的热量对电路基膜141造成信号干扰，从而确保灯条14的正常工作。
在一些实施例中，参照图4和图5，外围电路板4的形状包括长条形，外围电路板4的长度方向沿背光模组1的第一边缘11的延伸方向延伸；背光模组1的背侧102设置有第一对位标记7，第一对位标记7对应位于外围电路板4的第二侧边缘区域43的外围，用于对外围电路板4的位置进行限定；外围电路板4的第二侧边缘区域43与外围电路板4的第一侧边缘区域41相对；第一对位标记7与外围电路板4之间的间隙d1范围为0.5～0.8mm。第一对位标记7以及其与外围电路板4之间间隙d1的设置，既能够保证外围电路板4设置位置的精确性，又能确保外围电路板4组装(如进行贴附)的实效性和良率。
在一些实施例中，参照图7，背光模组1的背侧102设置有第二对位标记8，第二对位标记8对应位于第一子结构512、第二子结构513和第二结构52的外围，用于对增强保护条5的位置进行限定；第二对位标记8与第一子结构512、第二子结构513和第二结构52之间的间隙d2范围分别为0.3～0.5mm。第二对位标记8以及其与第一子结构512、第二子结构513和 第二结构52之间之间间隙d2的设置，既能够保证增强保护条5设置位置的精确性，又能确保增强保护条5组装(如进行贴附)的实效性和良率。
在一些实施例中，参照图4，外围电路板4沿远离背光模组1第一边缘11方向延伸的宽度e1大于增强保护条5沿远离背光模组1第一边缘11方向延伸的宽度e2；外围电路板4沿远离背光模组1第一边缘11方向延伸的宽度e1小于背光模组1沿同一方向的宽度e3。本实施例中，增强保护条5和外围电路板4只对应设置于背光模组1第一边缘11所在的局部区域，即增强保护条5和外围电路板4并不分布于背光模组1的整个背侧102，如此能够确保显示模组的整体厚度不会过大，有利于实现超薄显示模组。
在一些实施例中，参照图4，外围电路板4沿远离背光模组1第一边缘11方向延伸的宽度e1是增强保护条5沿远离背光模组1第一边缘11方向延伸的宽度e2的两倍；外围电路板4沿远离背光模组1第一边缘11方向延伸的宽度e1是背光模组1沿同一方向的宽度e3的1/15～1/10。即本实施例中，增强保护条5和外围电路板4只对应分布于背光模组1第一边缘11附近较窄的局部区域，如此能够进一步确保显示模组的整体厚度不会过大，有利于实现超薄显示模组；还有利于节约增强保护条5的材料成本。
在一些实施例中，参照图4和图5，柔性线路板3的数量为多个，每个柔性线路板3包括一个电路器件32；多个柔性线路板3沿背光模组1第一边缘11的延伸方向依次等间隔排布；外围电路板4中开口40的数量为多个，多个开口40沿背光模组1第一边缘11的延伸方向依次等间隔排布；多个电路器件32分别一一对应地内嵌于多个开口40中。如柔性线路板3的数量为五个，相应地，电路器件32有五个。
在一些实施例中，多个电路器件32为多个数据驱动芯片，多个数据驱动芯片分别与外围电路板4上相应接口绑定连接，以便外围电路板4上的相应接口一一对应地为各个数据驱动芯片提供数据驱动信号，从而便于各数据驱动芯片为显示基板2上相应的数据线提供相应的数据信号。多个数 据驱动芯片如上述依次等间隔排布，有利于为显示基板2上沿背光模组1第一边缘11的延伸方向依次排布的数据线更快速更低损耗地提供数据驱动信号。
在一些实施例中，参照图4，开口40包括开设于外围电路板4的靠近背光模组1第一边缘11侧边缘上的第二缺口。
在一些实施例中，开口包括开设于外围电路板的靠近背光模组第一边缘侧边缘区域内的通孔(图中未示出)。
本实施例中所提供的显示模组，通过使增强保护条5延伸经过绑定区100所在侧的背光模组1边缘，使增强保护条5能够对背光模组1的对应绑定区100所在侧的边缘形成连续支撑，使背光模组1乃至显示模组在沿绑定区100所在侧边缘的方向上强度增大，有效降低背光模组1乃至显示基板2受力后的变形量，减少产线作业破片率，从而避免在显示模组厚度较薄(如1.9mm厚度)的情况下，显示模组在生产、验证以及使用过程中不容易发生破片，提升了显示模组的整体强度，进而提升了显示模组的品质。通过使电路器件32内嵌于外围电路板4中的开口40和增强保护条5围设形成的空间中，一方面，能够减少电路器件32对显示模组厚度的贡献，使显示模组的整体厚度减薄；另一方面，电路器件32在该空间内不容易在显示模组初装和测试时受到挤压伤害而致破裂，从而对电路器件32形成了良好保护；再一方面，由于增强保护条5可以采用具有良好散热性能的金属合金材质，所以增强保护条5还能起到对电路器件32工作时产生的热量进行良好散发的作用，从而更好地对电路器件32形成品质保护。
本公开实施例还提供一种显示装置，其中，包括上述实施例中的显示模组。
通过采用上述实施例中的显示模组，一方面，能够实现该显示装置的超薄和超窄边框；另一方面，防止超薄的该显示装置发生破片，提升了该显示装置的整体强度，从而提升了该显示装置的品质。
该显示装置可以为：LCD面板、LCD电视、手机、平板电脑、笔记本电脑、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
可以理解的是，以上实施方式仅仅是为了说明本公开的原理而采用的示例性实施方式，然而本公开并不局限于此。对于本领域内的普通技术人员而言，在不脱离本公开的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本公开的保护范围。

Claims (20)

  1. 一种显示模组，包括背光模组、显示基板、柔性线路板和外围电路板；
    所述显示基板位于所述背光模组的出光侧；所述外围电路板位于所述背光模组的背离出光侧的背侧；
    所述显示基板具有位于其一侧边缘的绑定区，所述绑定区与所述外围电路板通过所述柔性线路板绑定连接；
    其中，所述显示模组还包括增强保护条，位于所述背光模组的背侧，且位于所述外围电路板靠近所述背光模组的一侧；所述增强保护条延伸经过所述绑定区所在侧的所述背光模组边缘；
    所述外围电路板与所述增强保护条局部交叠。
  2. 根据权利要求1所述的显示模组，其中，所述柔性线路板包括柔性基膜和电路器件，所述电路器件设置于所述柔性基膜上，且凸出于所述柔性基膜表面；
    所述外围电路板中开设有开口，所述开口位于所述外围电路板的与所述增强保护条交叠的区域；
    所述电路器件内嵌于所述开口中。
  3. 根据权利要求2所述的显示模组，其中，所述增强保护条包括第一结构和第二结构，所述第一结构沿所述绑定区所在侧的所述背光模组的第一边缘以及与所述第一边缘邻接的第二边缘和第三边缘分布；所述第二结构位于所述第一结构围设形成的区域内；所述第一结构和所述第二结构连接，所述第一结构的沿远离所述背光模组方向的厚度大于所述第二结构的沿远离所述背光模组方向的厚度；
    所述外围电路板的第一侧边缘区域与所述第二结构交叠。
  4. 根据权利要求3所述的显示模组，其中，所述外围电路板的第一侧边缘区域的背离所述背光模组的表面与所述第一结构的背离所述背光模组的表面平齐。
  5. 根据权利要求4所述的显示模组，其中，所述电路器件与所述增强保护条之间的间隙范围为0.2～0.5mm；
    所述电路器件与所述开口侧壁之间的间隙范围为0.5～1mm。
  6. 根据权利要求5所述的显示模组，其中，所述第一结构包括主结构、第一子结构和第二子结构；所述主结构沿所述背光模组的第一边缘分布；所述第一子结构沿所述背光模组的第二边缘分布；所述第二子结构沿所述背光模组的第三边缘分布；
    所述外围电路板与所述主结构之间的间隙范围为1～1.5mm；
    所述外围电路板与所述第一子结构之间的间隙范围为1～1.5mm；
    所述外围电路板与所述第二子结构之间的间隙范围为1～1.5mm。
  7. 根据权利要求6所述的显示模组，其中，所述增强保护条的棱边和拐角位置分别形成弧面倒角，所述弧面倒角的径向尺寸大于或等于2mm。
  8. 根据权利要求7所述的显示模组，其中，所述增强保护条采用PC、PET或者金属合金材质。
  9. 根据权利要求8所述的显示模组，其中，所述背光模组包括灯条，所述灯条位于所述背光模组的第一边缘端面，且所述灯条沿所述背光模组 的第一边缘的延伸方向分布；
    所述灯条与所述增强保护条交叠。
  10. 根据权利要求9所述的显示模组，其中，所述灯条包括电路基膜和多个灯珠，所述多个灯珠等间隔分布于所述电路基膜上；
    所述电路基膜由所述背光模组的第一边缘的一端弯折至所述背光模组的背侧，并与所述外围电路板绑定连接；
    所述外围电路板与所述电路基膜的弯折至所述背光模组背侧的部分互不交叠。
  11. 根据权利要求10所述的显示模组，其中，所述外围电路板在对应所述电路基膜的弯折至所述背光模组背侧部分的区域形成第一缺口或者镂空。
  12. 根据权利要求3所述的显示模组，其中，所述第一结构的厚度范围为0.5～0.6mm；
    所述第二结构的厚度范围为0.1～0.2mm。
  13. 根据权利要求6所述的显示模组，其中，所述外围电路板的形状包括长条形，所述外围电路板的长度方向沿所述背光模组的第一边缘的延伸方向延伸；
    所述背光模组的背侧设置有第一对位标记，所述第一对位标记对应位于所述外围电路板的第二侧边缘区域的外围，用于对所述外围电路板的位置进行限定；
    所述外围电路板的第二侧边缘区域与所述外围电路板的第一侧边缘区域相对；
    所述第一对位标记与所述外围电路板之间的间隙范围为0.5～0.8mm。
  14. 根据权利要求6所述的显示模组，其中，所述背光模组的背侧设置有第二对位标记，所述第二对位标记对应位于所述第一子结构、所述第二子结构和所述第二结构的外围，用于对所述增强保护条的位置进行限定；
    所述第二对位标记与所述第一子结构、所述第二子结构和所述第二结构之间的间隙范围分别为0.3～0.5mm。
  15. 根据权利要求13所述的显示模组，其中，所述外围电路板沿远离所述背光模组第一边缘方向延伸的宽度大于所述增强保护条沿远离所述背光模组第一边缘方向延伸的宽度；
    所述外围电路板沿远离所述背光模组第一边缘方向延伸的宽度小于所述背光模组沿同一方向的宽度。
  16. 根据权利要求15所述的显示模组，其中，所述外围电路板沿远离所述背光模组第一边缘方向延伸的宽度是所述增强保护条沿远离所述背光模组第一边缘方向延伸的宽度的两倍；
    所述外围电路板沿远离所述背光模组第一边缘方向延伸的宽度是所述背光模组沿同一方向的宽度的1/15～1/10。
  17. 根据权利要求3所述的显示模组，其中，所述柔性线路板的数量为多个，每个所述柔性线路板包括一个所述电路器件；多个所述柔性线路板沿所述背光模组第一边缘的延伸方向依次等间隔排布；
    所述外围电路板中所述开口的数量为多个，多个所述开口沿所述背光模组第一边缘的延伸方向依次等间隔排布；
    多个所述电路器件分别一一对应地内嵌于多个所述开口中。
  18. 根据权利要求17所述的显示模组，其中，所述开口包括开设于所述外围电路板的靠近所述背光模组第一边缘侧边缘上的第二缺口。
  19. 根据权利要求17所述的显示模组，其中，所述开口包括开设于所述外围电路板的靠近所述背光模组第一边缘侧边缘区域内的通孔。
  20. 一种显示装置，其中，包括权利要求1-19任意一项所述的显示模组。
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