WO2023079843A1 - ポリカーボネート樹脂組成物 - Google Patents
ポリカーボネート樹脂組成物 Download PDFInfo
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- WO2023079843A1 WO2023079843A1 PCT/JP2022/034682 JP2022034682W WO2023079843A1 WO 2023079843 A1 WO2023079843 A1 WO 2023079843A1 JP 2022034682 W JP2022034682 W JP 2022034682W WO 2023079843 A1 WO2023079843 A1 WO 2023079843A1
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- polycarbonate resin
- resin composition
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- 229920005668 polycarbonate resin Polymers 0.000 title claims abstract description 98
- 239000004431 polycarbonate resin Substances 0.000 title claims abstract description 98
- 239000000203 mixture Substances 0.000 title claims abstract description 52
- 150000001875 compounds Chemical class 0.000 claims abstract description 41
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 40
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 35
- CJWNFAKWHDOUKL-UHFFFAOYSA-N 2-(2-phenylpropan-2-yl)phenol Chemical compound C=1C=CC=C(O)C=1C(C)(C)C1=CC=CC=C1 CJWNFAKWHDOUKL-UHFFFAOYSA-N 0.000 claims abstract description 16
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 claims abstract description 16
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 claims description 10
- 239000004593 Epoxy Substances 0.000 claims description 9
- 239000008188 pellet Substances 0.000 claims description 7
- FIQMHBFVRAXMOP-UHFFFAOYSA-N triphenylphosphane oxide Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)(=O)C1=CC=CC=C1 FIQMHBFVRAXMOP-UHFFFAOYSA-N 0.000 claims description 5
- ZYUVGYBAPZYKSA-UHFFFAOYSA-N 5-(3-hydroxybutan-2-yl)-4-methylbenzene-1,3-diol Chemical compound CC(O)C(C)C1=CC(O)=CC(O)=C1C ZYUVGYBAPZYKSA-UHFFFAOYSA-N 0.000 claims description 2
- NHADDZMCASKINP-HTRCEHHLSA-N decarboxydihydrocitrinin Natural products C1=C(O)C(C)=C2[C@H](C)[C@@H](C)OCC2=C1O NHADDZMCASKINP-HTRCEHHLSA-N 0.000 claims description 2
- -1 aryl phosphine oxide Chemical compound 0.000 abstract description 35
- 238000002845 discoloration Methods 0.000 description 16
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 12
- 229940106691 bisphenol a Drugs 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 239000011574 phosphorus Substances 0.000 description 10
- 229910052698 phosphorus Inorganic materials 0.000 description 10
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 125000003118 aryl group Chemical group 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 8
- 150000001298 alcohols Chemical class 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 8
- 239000003381 stabilizer Substances 0.000 description 8
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 8
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 7
- 125000001931 aliphatic group Chemical group 0.000 description 7
- 125000004432 carbon atom Chemical group C* 0.000 description 7
- 150000007942 carboxylates Chemical class 0.000 description 7
- 150000002148 esters Chemical class 0.000 description 7
- 239000011342 resin composition Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 5
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 229920006395 saturated elastomer Polymers 0.000 description 5
- 239000001993 wax Substances 0.000 description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- 239000012321 sodium triacetoxyborohydride Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 4
- IYAZLDLPUNDVAG-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4-(2,4,4-trimethylpentan-2-yl)phenol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 IYAZLDLPUNDVAG-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 238000012695 Interfacial polymerization Methods 0.000 description 3
- 239000006096 absorbing agent Substances 0.000 description 3
- 150000001335 aliphatic alkanes Chemical class 0.000 description 3
- 150000001735 carboxylic acids Chemical class 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000005187 foaming Methods 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 239000012188 paraffin wax Substances 0.000 description 3
- 238000005809 transesterification reaction Methods 0.000 description 3
- OWEYKIWAZBBXJK-UHFFFAOYSA-N 1,1-Dichloro-2,2-bis(4-hydroxyphenyl)ethylene Chemical compound C1=CC(O)=CC=C1C(=C(Cl)Cl)C1=CC=C(O)C=C1 OWEYKIWAZBBXJK-UHFFFAOYSA-N 0.000 description 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- GXURZKWLMYOCDX-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;dihydroxyphosphanyl dihydrogen phosphite Chemical group OP(O)OP(O)O.OCC(CO)(CO)CO GXURZKWLMYOCDX-UHFFFAOYSA-N 0.000 description 2
- YMTYZTXUZLQUSF-UHFFFAOYSA-N 3,3'-Dimethylbisphenol A Chemical compound C1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=CC=2)=C1 YMTYZTXUZLQUSF-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 150000001565 benzotriazoles Chemical class 0.000 description 2
- IMHDGJOMLMDPJN-UHFFFAOYSA-N biphenyl-2,2'-diol Chemical group OC1=CC=CC=C1C1=CC=CC=C1O IMHDGJOMLMDPJN-UHFFFAOYSA-N 0.000 description 2
- FQUNFJULCYSSOP-UHFFFAOYSA-N bisoctrizole Chemical compound N1=C2C=CC=CC2=NN1C1=CC(C(C)(C)CC(C)(C)C)=CC(CC=2C(=C(C=C(C=2)C(C)(C)CC(C)(C)C)N2N=C3C=CC=CC3=N2)O)=C1O FQUNFJULCYSSOP-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- NOPFSRXAKWQILS-UHFFFAOYSA-N docosan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCCCCCO NOPFSRXAKWQILS-UHFFFAOYSA-N 0.000 description 2
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- XMHIUKTWLZUKEX-UHFFFAOYSA-N hexacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O XMHIUKTWLZUKEX-UHFFFAOYSA-N 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- VKOBVWXKNCXXDE-UHFFFAOYSA-N icosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCC(O)=O VKOBVWXKNCXXDE-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 description 2
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 2
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 235000019198 oils Nutrition 0.000 description 2
- ZQBAKBUEJOMQEX-UHFFFAOYSA-N phenyl salicylate Chemical compound OC1=CC=CC=C1C(=O)OC1=CC=CC=C1 ZQBAKBUEJOMQEX-UHFFFAOYSA-N 0.000 description 2
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- VHOCUJPBKOZGJD-UHFFFAOYSA-N triacontanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O VHOCUJPBKOZGJD-UHFFFAOYSA-N 0.000 description 2
- KMEHEQFDWWYZIO-UHFFFAOYSA-N triacontyl hexadecanoate Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCOC(=O)CCCCCCCCCCCCCCC KMEHEQFDWWYZIO-UHFFFAOYSA-N 0.000 description 2
- COIOYMYWGDAQPM-UHFFFAOYSA-N tris(2-methylphenyl)phosphane Chemical compound CC1=CC=CC=C1P(C=1C(=CC=CC=1)C)C1=CC=CC=C1C COIOYMYWGDAQPM-UHFFFAOYSA-N 0.000 description 2
- WGKLOLBTFWFKOD-UHFFFAOYSA-N tris(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC WGKLOLBTFWFKOD-UHFFFAOYSA-N 0.000 description 2
- PPTXVXKCQZKFBN-UHFFFAOYSA-N (S)-(-)-1,1'-Bi-2-naphthol Chemical group C1=CC=C2C(C3=C4C=CC=CC4=CC=C3O)=C(O)C=CC2=C1 PPTXVXKCQZKFBN-UHFFFAOYSA-N 0.000 description 1
- QIKKFTUQKYGBLZ-UHFFFAOYSA-N 1,1,3,3,3-pentafluoropropane-1,2,2-triol Chemical compound OC(F)(F)C(O)(O)C(F)(F)F QIKKFTUQKYGBLZ-UHFFFAOYSA-N 0.000 description 1
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- YKPAABNCNAGAAJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)propane Chemical compound C=1C=C(O)C=CC=1C(CC)C1=CC=C(O)C=C1 YKPAABNCNAGAAJ-UHFFFAOYSA-N 0.000 description 1
- ZOVXDXVZHWAYBV-UHFFFAOYSA-N 1-[benzyl(phenyl)phosphoryl]naphthalene Chemical compound C=1C=CC=CC=1P(C=1C2=CC=CC=C2C=CC=1)(=O)CC1=CC=CC=C1 ZOVXDXVZHWAYBV-UHFFFAOYSA-N 0.000 description 1
- GJBIMMKVOGMMLP-UHFFFAOYSA-N 1-bis(4-chlorophenyl)phosphoryl-4-chlorobenzene Chemical compound C1=CC(Cl)=CC=C1P(=O)(C=1C=CC(Cl)=CC=1)C1=CC=C(Cl)C=C1 GJBIMMKVOGMMLP-UHFFFAOYSA-N 0.000 description 1
- VSJZSGXKNZYQPR-UHFFFAOYSA-N 1-bis(4-fluorophenyl)phosphoryl-4-fluorobenzene Chemical compound C1=CC(F)=CC=C1P(=O)(C=1C=CC(F)=CC=1)C1=CC=C(F)C=C1 VSJZSGXKNZYQPR-UHFFFAOYSA-N 0.000 description 1
- SPKBYIYIZQARNX-UHFFFAOYSA-N 1-bis(4-methylphenyl)phosphoryl-4-methylbenzene Chemical compound C1=CC(C)=CC=C1P(=O)(C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 SPKBYIYIZQARNX-UHFFFAOYSA-N 0.000 description 1
- CUEBOLMMFMGZOR-UHFFFAOYSA-N 1-bis(4-nonylphenyl)phosphoryl-4-nonylbenzene Chemical compound C(CCCCCCCC)C1=CC=C(C=C1)P(C1=CC=C(C=C1)CCCCCCCCC)(C1=CC=C(C=C1)CCCCCCCCC)=O CUEBOLMMFMGZOR-UHFFFAOYSA-N 0.000 description 1
- DFGYDPMXPAQIOD-UHFFFAOYSA-N 1-dinaphthalen-1-ylphosphorylnaphthalene Chemical compound C1=CC=C2C(P(C=3C4=CC=CC=C4C=CC=3)(C=3C4=CC=CC=C4C=CC=3)=O)=CC=CC2=C1 DFGYDPMXPAQIOD-UHFFFAOYSA-N 0.000 description 1
- ZEDILIZPCWFFRY-UHFFFAOYSA-N 18,18-diphenyloctadecylphosphane Chemical compound C=1C=CC=CC=1C(CCCCCCCCCCCCCCCCCP)C1=CC=CC=C1 ZEDILIZPCWFFRY-UHFFFAOYSA-N 0.000 description 1
- MEZZCSHVIGVWFI-UHFFFAOYSA-N 2,2'-Dihydroxy-4-methoxybenzophenone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1O MEZZCSHVIGVWFI-UHFFFAOYSA-N 0.000 description 1
- WZUNUACWCJJERC-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)butyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(CC)(CO)CO WZUNUACWCJJERC-UHFFFAOYSA-N 0.000 description 1
- HCKKBDSXUFUYCD-UHFFFAOYSA-N 2,2-dimethyl-3-octadecyl-7-oxabicyclo[4.1.0]heptane-3-carboxylic acid Chemical compound CC1(C)C(CCCCCCCCCCCCCCCCCC)(C(O)=O)CCC2OC21 HCKKBDSXUFUYCD-UHFFFAOYSA-N 0.000 description 1
- ZXDDPOHVAMWLBH-UHFFFAOYSA-N 2,4-Dihydroxybenzophenone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=CC=C1 ZXDDPOHVAMWLBH-UHFFFAOYSA-N 0.000 description 1
- NAKNWEYGAKQQBY-UHFFFAOYSA-N 2,4-dioxabicyclo[1.1.0]butane-1,3-diol Chemical compound O1C2(O)OC21O NAKNWEYGAKQQBY-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- VXHYVVAUHMGCEX-UHFFFAOYSA-N 2-(2-hydroxyphenoxy)phenol Chemical compound OC1=CC=CC=C1OC1=CC=CC=C1O VXHYVVAUHMGCEX-UHFFFAOYSA-N 0.000 description 1
- LHPPDQUVECZQSW-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-ditert-butylphenol Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=CC=CC3=N2)=C1O LHPPDQUVECZQSW-UHFFFAOYSA-N 0.000 description 1
- IZWGOJSWVITMGN-UHFFFAOYSA-N 2-(diphenylphosphanylmethyl)butanoic acid Chemical compound C=1C=CC=CC=1P(CC(CC)C(O)=O)C1=CC=CC=C1 IZWGOJSWVITMGN-UHFFFAOYSA-N 0.000 description 1
- HHRACYLRBOUBKM-UHFFFAOYSA-N 2-[(4-tert-butylphenoxy)methyl]oxirane Chemical compound C1=CC(C(C)(C)C)=CC=C1OCC1OC1 HHRACYLRBOUBKM-UHFFFAOYSA-N 0.000 description 1
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 1
- KLIZOTJVECGYSJ-UHFFFAOYSA-N 2-[2-[3-(benzotriazol-2-yl)-5-(2-phenylpropan-2-yl)phenyl]propan-2-yl]phenol Chemical compound C=1C(N2N=C3C=CC=CC3=N2)=CC(C(C)(C)C=2C(=CC=CC=2)O)=CC=1C(C)(C)C1=CC=CC=C1 KLIZOTJVECGYSJ-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- WKVWOPDUENJKAR-UHFFFAOYSA-N 2-cyclohexyl-4-[2-(3-cyclohexyl-4-hydroxyphenyl)propan-2-yl]phenol Chemical compound C=1C=C(O)C(C2CCCCC2)=CC=1C(C)(C)C(C=1)=CC=C(O)C=1C1CCCCC1 WKVWOPDUENJKAR-UHFFFAOYSA-N 0.000 description 1
- ZJUBMERVMHAVPN-UHFFFAOYSA-N 2-cyclohexyl-4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound C=1C=C(O)C(C2CCCCC2)=CC=1C(C)(C)C1=CC=C(O)C=C1 ZJUBMERVMHAVPN-UHFFFAOYSA-N 0.000 description 1
- XCZKKZXWDBOGPA-UHFFFAOYSA-N 2-phenylbenzene-1,4-diol Chemical group OC1=CC=C(O)C(C=2C=CC=CC=2)=C1 XCZKKZXWDBOGPA-UHFFFAOYSA-N 0.000 description 1
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- CNUJLMSKURPSHE-UHFFFAOYSA-N trioctadecyl phosphite Chemical compound CCCCCCCCCCCCCCCCCCOP(OCCCCCCCCCCCCCCCCCC)OCCCCCCCCCCCCCCCCCC CNUJLMSKURPSHE-UHFFFAOYSA-N 0.000 description 1
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- GEPJPYNDFSOARB-UHFFFAOYSA-N tris(4-fluorophenyl)phosphane Chemical compound C1=CC(F)=CC=C1P(C=1C=CC(F)=CC=1)C1=CC=C(F)C=C1 GEPJPYNDFSOARB-UHFFFAOYSA-N 0.000 description 1
- WXAZIUYTQHYBFW-UHFFFAOYSA-N tris(4-methylphenyl)phosphane Chemical compound C1=CC(C)=CC=C1P(C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 WXAZIUYTQHYBFW-UHFFFAOYSA-N 0.000 description 1
- MGMXGCZJYUCMGY-UHFFFAOYSA-N tris(4-nonylphenyl) phosphite Chemical compound C1=CC(CCCCCCCCC)=CC=C1OP(OC=1C=CC(CCCCCCCCC)=CC=1)OC1=CC=C(CCCCCCCCC)C=C1 MGMXGCZJYUCMGY-UHFFFAOYSA-N 0.000 description 1
- JNJGSDYMEKOBPD-UHFFFAOYSA-N tris(4-nonylphenyl)phosphane Chemical compound C1=CC(CCCCCCCCC)=CC=C1P(C=1C=CC(CCCCCCCCC)=CC=1)C1=CC=C(CCCCCCCCC)C=C1 JNJGSDYMEKOBPD-UHFFFAOYSA-N 0.000 description 1
- QQBLOZGVRHAYGT-UHFFFAOYSA-N tris-decyl phosphite Chemical compound CCCCCCCCCCOP(OCCCCCCCCCC)OCCCCCCCCCC QQBLOZGVRHAYGT-UHFFFAOYSA-N 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- DCXXMTOCNZCJGO-UHFFFAOYSA-N tristearoylglycerol Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(OC(=O)CCCCCCCCCCCCCCCCC)COC(=O)CCCCCCCCCCCCCCCCC DCXXMTOCNZCJGO-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1515—Three-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/50—Phosphorus bound to carbon only
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
Definitions
- the present invention relates to a polycarbonate resin composition, and more particularly, to a polycarbonate resin composition having a good hue and excellent resistance to heat and humidity discoloration, and a molded product thereof.
- Polycarbonate resin is excellent in mechanical properties such as impact resistance, heat resistance, transparency, etc., so it is used in various optical parts, electrical and electronic equipment parts, automobile interior and exterior parts, OA equipment parts, sheets, machine parts. , and is widely used in many applications such as building materials.
- polycarbonate resin compositions are used in many applications.
- distearylhydroxylamine, triphenylamine, tri-n-octylphosphine oxide, triphenylphosphine oxide, pyridine N-oxide, ethoxylated sorbitan monolaurate, or a specific siloxane is used as an antistatic agent.
- An antistatic polycarbonate resin containing is described.
- polycarbonate resins are particularly required to have improved hue and resistance to discoloration due to heat and humidity.
- the present invention has been made in view of the above circumstances, and its object (object) is to provide a polycarbonate resin composition that has a good hue and is excellent in resistance to discoloration by heat and humidity.
- the present inventors have made intensive studies and found that a polycarbonate resin containing a specific amount of an arylphosphine oxide, a compound having a phenol structure, an arylphosphine, or an epoxy compound has a good hue. and found that it has excellent wet heat discoloration resistance, and completed the present invention.
- the present invention relates to the following polycarbonate resin composition and molded article.
- 8. Pellets of the polycarbonate resin composition according to any one of 1 to 7 above.
- 9. A molded article made of the polycarbonate resin composition according to any one of 1 to 7 above. 10.
- a molded article comprising pellets of the polycarbonate resin composition as described in 8 above.
- the polycarbonate resin composition of the present invention has a good hue and is excellent in resistance to heat and humidity discoloration.
- the polycarbonate resin composition of the present invention comprises 100 parts by mass of polycarbonate resin (A), 0.001 to 0.3 parts by mass of arylphosphine oxide (B), and 0.0012 to 0.0012 parts by mass of compound (C1) having a phenol structure.
- the compound (C1) having a phenol structure is at least one selected from bisphenol A, 4-tert-butylphenol, cumylphenol, and phenol, and in the case of containing bisphenol A
- the content is 0.002 to 0.03 parts by mass, the content is 0.0012 to 0.01 parts by mass when 4-tert-butylphenol is contained, and the content is 0.0012 when cumylphenol is contained. 0.01 part by mass, and when phenol is included, the content is 0.0012 to 0.01 part by mass.
- Polycarbonate resin (A) The polycarbonate resin (A) used in the present invention is not particularly limited, and various resins can be used. Polycarbonate resins can be classified into aromatic polycarbonate resins in which the carbons directly bonded to the carbonic acid bonds are aromatic carbons, and aliphatic polycarbonate resins in which the carbons directly bonded to the carbonic acid bonds are aliphatic carbons, and either can be used. Among them, as the polycarbonate resin (A), an aromatic polycarbonate resin is preferable from the viewpoint of heat resistance, mechanical properties, electrical properties, and the like.
- aromatic dihydroxy compounds among monomers that are raw materials for aromatic polycarbonate resins include: Dihydroxybenzenes such as 1,2-dihydroxybenzene, 1,3-dihydroxybenzene (ie, resorcinol), 1,4-dihydroxybenzene; Dihydroxybiphenyls such as 2,5-dihydroxybiphenyl, 2,2'-dihydroxybiphenyl, 4,4'-dihydroxybiphenyl;
- 2,2'-dihydroxy-1,1'-binaphthyl 1,2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 1 ,7-dihydroxynaphthalene, dihydroxynaphthalenes such as 2,7-dihydroxynaphthalene;
- 1,1-bis(4-hydroxyphenyl)cyclopentane 1,1-bis(4-hydroxyphenyl)cyclohexane, 1,1-bis(4-hydroxyphenyl)-3,3-dimethylcyclohexane, 1,1-bis(4-hydroxyphenyl)-3,4-dimethylcyclohexane, 1,1-bis(4-hydroxyphenyl)-3,5-dimethylcyclohexane, 1,1-bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane, 1,1-bis(4-hydroxy-3,5-dimethylphenyl)-3,3,5-trimethylcyclohexane, 1,1-bis(4-hydroxyphenyl)-3-propyl-5-methylcyclohexane, 1,1-bis(4-hydroxyphenyl)-3-tert-butyl-cyclohexane, 1,1-bis(4-hydroxyphenyl)-4-tert-butyl-cyclohexan
- 4,4'-dihydroxydiphenyl sulfide Dihydroxydiarylsulfides such as 4,4'-dihydroxy-3,3'-dimethyldiphenylsulfide; dihydroxydiarylsulfoxides such as 4,4'-dihydroxydiphenylsulfoxide and 4,4'-dihydroxy-3,3'-dimethyldiphenylsulfoxide; 4,4'-dihydroxydiphenyl sulfone, Dihydroxydiarylsulfones such as 4,4'-dihydroxy-3,3'-dimethyldiphenylsulfone; etc.
- bis(hydroxyaryl)alkanes are preferred, and bis(4-hydroxyphenyl)alkanes are particularly preferred, and 2,2-bis(4-hydroxyphenyl)propane (That is, bisphenol A) and 2,2-bis(3-methyl-4-hydroxyphenyl)propane (ie, bisphenol C) are preferred.
- 1 type may be used for an aromatic dihydroxy compound, and it may use 2 or more types together by arbitrary combinations and ratios.
- carbonate precursors include carbonyl halides and carbonate esters.
- one type of carbonate precursor may be used, or two or more types may be used together in an arbitrary combination and ratio.
- carbonyl halides include phosgene; haloformates such as bischloroformates of dihydroxy compounds and monochloroformates of dihydroxy compounds.
- carbonate esters include diaryl carbonates such as diphenyl carbonate and ditolyl carbonate; dialkyl carbonates such as dimethyl carbonate and diethyl carbonate; biscarbonates of dihydroxy compounds, monocarbonates of dihydroxy compounds, and cyclic carbonates. and carbonates of dihydroxy compounds such as
- the method for producing the polycarbonate resin (A) is not particularly limited, and any method can be adopted. Examples thereof include an interfacial polymerization method, a melt transesterification method, a pyridine method, a ring-opening polymerization method of a cyclic carbonate compound, a solid-phase transesterification method of a prepolymer, and the like. Among these, the interfacial polymerization method and the melt transesterification method are preferable because the effect of improving the resistance to moist heat is higher, and the interfacial polymerization method is particularly preferable.
- the molecular weight of the polycarbonate resin (A) is preferably 10,000 to 50,000, more preferably 10,000 to 50,000 as a viscosity average molecular weight (Mv) converted from the solution viscosity measured at a temperature of 25° C. using methylene chloride as a solvent.
- Mv viscosity average molecular weight
- the molecular weight of the polycarbonate resin (A) is preferably 10,000 to 50,000, more preferably 10,000 to 50,000 as a viscosity average molecular weight (Mv) converted from the solution viscosity measured at a temperature of 25° C. using methylene chloride as a solvent.
- Mv viscosity average molecular weight converted from the solution viscosity measured at a temperature of 25° C. using methylene chloride as a solvent.
- Mv viscosity average molecular weight
- the decrease in fluidity of the polycarbonate resin composition of the invention can be suppressed and improved, and the moldability can be enhanced to facilitate molding.
- Two or more kinds of polycarbonate resins having different viscosity-average molecular weights may be mixed and used, and in this case, polycarbonate resins having viscosity-average molecular weights outside the preferred range may be mixed.
- the intrinsic viscosity [ ⁇ ] is a value calculated from the following formula by measuring the specific viscosity [ ⁇ sp ] at each solution concentration [C] (g/dl).
- the polycarbonate resin (A) may contain a polycarbonate oligomer in order to improve the appearance and fluidity of the molded product.
- the viscosity-average molecular weight [Mv] of this polycarbonate oligomer is usually 1,500 or more, preferably 2,000 or more, and usually 9,500 or less, preferably 9,000 or less.
- the polycarbonate oligomer contained is preferably 30% by mass or less of the polycarbonate resin (including the polycarbonate oligomer).
- the polycarbonate resin (A) may be not only a virgin raw material but also a polycarbonate resin recycled from a used product (so-called material-recycled polycarbonate resin), and contains both a virgin raw material and a recycled resin. Also preferably, it may consist of a recycled polycarbonate resin.
- the ratio of the recycled polycarbonate resin in the polycarbonate resin (A) is preferably 40% or more, 50% or more, 60% or more, 80% or more, and particularly preferably 100%.
- Arylphosphine oxide (B) The polycarbonate resin composition of the present invention contains an arylphosphine oxide (B).
- Arylphosphine oxide (B) includes triphenylphosphine oxide, diphenylbutylphosphine oxide, diphenyloctadecylphosphine oxide, tris(p-tolyl)phosphine oxide, tris(p-nonylphenyl)phosphine oxide, tris(naphthyl)phosphine oxide, Diphenyl(hydroxymethyl)phosphine oxide, diphenyl(acetoxymethyl)phosphine oxide, diphenyl( ⁇ -ethylcarboxyethyl)phosphine oxide, tris(p-chlorophenyl)phosphine oxide, tris(p-fluorophenyl)phosphine oxide, diphenylbenzylphosphine oxide , diphenyl- ⁇ -cyanoethyl
- the content of the arylphosphine oxide (B) is 0.001 to 0.3 parts by mass with respect to 100 parts by mass of the polycarbonate resin (A).
- a resin composition containing such an amount in combination with the compound (C1) having a phenol structure has a good hue and is excellent in wet heat discoloration resistance.
- the content of the arylphosphine oxide (B) is preferably 0.002 parts by mass or more, especially 0.003 parts by mass or more, 0.004 parts by mass or more, particularly preferably 0.005 parts by mass or more, and , preferably 0.25 parts by mass or less, more preferably 0.2 parts by mass or less, 0.15 parts by mass or less, 0.13 parts by mass or less, and particularly preferably 0.1 parts by mass or less.
- the polycarbonate resin composition of the present invention contains a compound (C1) having a phenol structure.
- the compound (C1) having a phenol structure is a compound in which a hydroxy group is directly bonded to a benzene ring. It is at least one selected from cumylphenol and phenol. Among these, 2,2-bis(4-hydroxyphenyl)propane, 4-tert-butylphenol and cumylphenol are more preferred, and 2,2-bis(4-hydroxyphenyl)propane and 4-tert-butylphenol are particularly preferred. preferable.
- the compound (C1) having a phenol structure may contain one type alone, or may contain two or more types.
- the content of the compound (C1) having a phenol structure is 0.0012 to 0.03 parts by mass with respect to 100 parts by mass of the polycarbonate resin (A). When two or more compounds (C1) having a phenol structure are contained, it is the total amount thereof. A resin composition containing such an amount together with the arylphosphine oxide (B) has a good hue and is excellent in wet heat discoloration resistance.
- the content of the compound (C1) having a phenol structure is preferably 0.0015 parts by mass or more, especially 0.002 parts by mass or more, 0.003 parts by mass or more, relative to 100 parts by mass of the polycarbonate resin (A).
- the content is 0.002 to 0.03 parts by mass, preferably 0.004 to 0.03 parts by mass, per 100 parts by mass of the polycarbonate resin (A). 01 parts by mass.
- 4-tert-butylphenol is contained, the content is 0.0012 to 0.01 parts by mass, preferably 0.002 to 0.003 parts by mass, based on 100 parts by mass of the polycarbonate resin (A).
- the content When cumylphenol is contained, the content is 0.0012 to 0.01 parts by weight, preferably 0.002 to 0.003 parts by weight, per 100 parts by weight of the polycarbonate resin (A). When phenol is contained, the content is 0.0012 to 0.01 parts by mass, preferably 0.002 to 0.003 parts by mass, per 100 parts by mass of the polycarbonate resin (A).
- Bisphenol A, 4-tert-butylphenol, cumylphenol, and phenol may be present in a free state as used or by-produced during the production of the polycarbonate resin (A), and these amounts are also phenolic structures. is included as the amount of compound (C1) having
- the polycarbonate resin composition of the present invention also preferably contains an arylphosphine (C2).
- Arylphosphine (C2) includes, for example, triphenylphosphine, diphenylbutylphosphine, diphenyloctadecylphosphine, tris(p-tolyl)phosphine, tris(p-nonylphenyl)phosphine, tris(naphthyl)phosphine, and diphenyl(hydroxymethyl)phosphine.
- the content is preferably 0.001 to 0.3 parts by mass with respect to 100 parts by mass of the polycarbonate resin (A).
- a resin composition containing both the arylphosphine oxide (B) and the compound (C1) having a phenol structure in such an amount has a more favorable hue and is excellent in wet heat discoloration resistance.
- the content of the arylphosphine (C2) is more preferably 0.005 parts by mass or more, particularly preferably 0.008 parts by mass or more, particularly preferably 0.01 parts by mass or more, and more preferably 0.25 parts by mass.
- the mass ratio C2/B of the contents of the arylphosphine (C2) and the arylphosphine oxide (B) is preferably 0 or more and 6 or less, more preferably 0 or more and 6 or less, and further preferably 0.1 or more and 2.0 or less. It is preferably 0.2 or more and 0.4 or less is particularly preferable.
- the polycarbonate resin composition of the present invention also preferably contains an epoxy compound (C3).
- a compound having one or more epoxy groups in one molecule is used as the epoxy compound (C3).
- alicyclic epoxy compounds are preferably used, and 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexyl carboxylate is particularly preferred.
- the content is preferably 0.001 to 0.3 parts by mass with respect to 100 parts by mass of the polycarbonate resin (A).
- a resin composition containing both the arylphosphine oxide (B) and the compound (C1) having a phenol structure in such amounts has a better hue and is excellent in resistance to heat and humidity discoloration.
- the content of the epoxy compound (C3) is more preferably 0.005 parts by mass or more, more preferably 0.008 parts by mass or more, particularly preferably 0.01 parts by mass or more, and more preferably 0.25 parts by mass. not more than 0.2 parts by mass, not more than 0.15 parts by mass, not more than 0.1 parts by mass, not more than 0.07 parts by mass, not more than 0.05 parts by mass, and particularly not more than 0.04 parts by mass. preferable.
- the polycarbonate resin composition of the present invention also preferably contains a phosphorus stabilizer.
- a phosphorus stabilizer By containing the phosphorus stabilizer, the polycarbonate resin composition of the present invention has a better hue and further improves the resistance to heat and humidity discoloration. Any known phosphorus stabilizer can be used.
- phosphorus oxo acids such as phosphoric acid, phosphonic acid, phosphorous acid, phosphinic acid, and polyphosphoric acid
- acid pyrophosphate metal salts such as sodium acid pyrophosphate, potassium acid pyrophosphate, and calcium acid pyrophosphate
- phosphoric acid phosphates of group 1 or group 2B metals such as potassium, sodium phosphate, cesium phosphate, zinc phosphate; phosphate compounds, phosphite compounds, phosphonite compounds, etc.; preferable.
- a phosphite compound By selecting a phosphite compound, a polycarbonate resin composition having higher discoloration resistance and continuous productivity can be obtained.
- the phosphite compound is a trivalent phosphorus compound having a structure represented by the general formula: P(OR) 3 , and R represents a monovalent or divalent organic group.
- phosphite compounds include triphenylphosphite, tris(monononylphenyl)phosphite, tris(monononyl/dinonylphenyl)phosphite, tris(2,4-di-tert-butylphenyl)phosphite, Phyto, monooctyldiphenylphosphite, dioctylmonophenylphosphite, monodecyldiphenylphosphite, didecylmonophenylphosphite, tridecylphosphite, trilaurylphosphite, tristearylphosphite, distearylpentaerythritol diphosphite, Bis(
- an aromatic phosphite compound represented by the following formula (1) or (2) is more preferable because it effectively increases the resistance to heat and humidity discoloration of the polycarbonate resin composition of the present invention. .
- R 1 , R 2 and R 3 may be the same or different and represent an aryl group having 6 or more and 30 or less carbon atoms. ]
- R 4 and R 5 may be the same or different and represent an aryl group having 6 or more and 30 or less carbon atoms. ]
- phosphite compound represented by the above formula (1) triphenylphosphite, tris(monononylphenyl)phosphite, tris(2,4-di-tert-butylphenyl)phosphite and the like are preferred among others. More preferred is tris(2,4-di-tert-butylphenyl)phosphite.
- organic phosphite compounds include "ADEKA STAB 1178" manufactured by ADEKA, "SUMILIZER TNP” manufactured by Sumitomo Chemical Co., Ltd., "JP-351” manufactured by Johoku Chemical Industry Co., Ltd., and "ADEKA STAB” manufactured by ADEKA. 2112”, “Irgafos 168” manufactured by BASF, “JP-650” manufactured by Johoku Chemical Industry Co., Ltd., and the like.
- Examples of the phosphite compound represented by the above formula (2) include, among others, bis(2,4-di-tert-butyl-4-methylphenyl)pentaerythritol diphosphite, bis(2,6-di-tert-butyl Especially preferred are those having a pentaerythritol diphosphite structure such as 4-methylphenyl)pentaerythritol diphosphite and bis(2,4-dicumylphenyl)pentaerythritol diphosphite.
- Specific examples of such organic phosphite compounds preferably include "ADEKA STAB PEP-36", “ADEKA STAB PEP-24G", and "Doverphos S-9228" manufactured by Doverchemical.
- one type of phosphorus-based stabilizer may be contained, or two or more types may be contained in any combination and ratio.
- the content of the phosphorus-based stabilizer is preferably 0.005 to 0.5 parts by mass, more preferably 0.007 parts by mass or more, and still more preferably 0.007 part by mass, based on 100 parts by mass of the polycarbonate resin (A).
- 008 parts by mass or more particularly preferably 0.01 parts by mass or more, more preferably 0.4 parts by mass or less, still more preferably 0.3 parts by mass or less, even more preferably 0.2 parts by mass or less, especially is 0.1 parts by mass or less.
- the content of the phosphorus stabilizer is less than 0.005 parts by mass in the above range, the effect of further improving the hue and the resistance to wet heat discoloration tends to be insufficient, and the content of the phosphorus stabilizer is 0.5 parts by mass. If it exceeds the part, the wet heat discoloration resistance may rather deteriorate, and the wet heat stability may also decrease.
- the resin composition of the present invention contains a release agent.
- release agents include aliphatic carboxylic acids, esters of aliphatic carboxylic acids and alcohols, aliphatic hydrocarbon compounds having a number average molecular weight of 200 to 15,000, and polysiloxane silicone oils.
- aliphatic carboxylic acids examples include saturated or unsaturated aliphatic monovalent, divalent or trivalent carboxylic acids.
- the aliphatic carboxylic acid also includes alicyclic carboxylic acid.
- preferred aliphatic carboxylic acids are monovalent or divalent carboxylic acids having 6 to 36 carbon atoms, more preferably aliphatic saturated monovalent carboxylic acids having 6 to 36 carbon atoms.
- aliphatic carboxylic acids include palmitic acid, stearic acid, caproic acid, capric acid, lauric acid, arachidic acid, behenic acid, lignoceric acid, cerotic acid, melissic acid, tetralyacontanoic acid, montanic acid, and adipine. acid, azelaic acid, and the like.
- Alcohols include, for example, saturated or unsaturated monohydric or polyhydric alcohols. These alcohols may have substituents such as fluorine atoms and aryl groups. Among these, monohydric or polyhydric saturated alcohols having 30 or less carbon atoms are preferable, and aliphatic saturated monohydric alcohols or saturated aliphatic polyhydric alcohols having 30 or less carbon atoms are more preferable.
- aliphatic is used as a term that also includes alicyclic compounds.
- alcohols include octanol, decanol, dodecanol, stearyl alcohol, behenyl alcohol, ethylene glycol, diethylene glycol, glycerin, pentaerythritol, 2,2-dihydroxyperfluoropropanol, neopentylene glycol, ditrimethylolpropane, dipentaerythritol, and the like. are mentioned.
- the above ester may contain aliphatic carboxylic acid and/or alcohol as impurities. Further, the above ester may be a pure substance, or may be a mixture of multiple compounds. Furthermore, the aliphatic carboxylic acids and alcohols that form one ester by combining may be used alone, or two or more of them may be used in any combination and ratio.
- esters of aliphatic carboxylic acids and alcohols include beeswax (a mixture containing myricyl palmitate as a main component), stearyl stearate, behenyl behenate, stearyl behenate, glycerin monopalmitate, glycerin monostea glycerin distearate, glycerin tristearate, pentaerythritol monopalmitate, pentaerythritol monostearate, pentaerythritol distearate, pentaerythritol tristearate, pentaerythritol tetrastearate and the like.
- Aliphatic hydrocarbons having a number average molecular weight of 200 to 15,000 include, for example, liquid paraffin, paraffin wax, microwax, polyethylene wax, Fischer-Tropsch wax, and ⁇ -olefin oligomers having 3 to 12 carbon atoms.
- an alicyclic hydrocarbon is also contained as an aliphatic hydrocarbon here.
- these hydrocarbons may be partially oxidized.
- paraffin wax, polyethylene wax, or partial oxides of polyethylene wax are preferable, and paraffin wax and polyethylene wax are more preferable.
- the number average molecular weight of the aliphatic hydrocarbon is preferably 5,000 or less.
- the aliphatic hydrocarbon may be a single substance, or a mixture of substances having various constituents and molecular weights can be used as long as the main component is within the above range.
- polysiloxane-based silicone oils examples include dimethylsilicone oil, methylphenylsilicone oil, diphenylsilicone oil, and fluorinated alkylsilicone.
- release agents described above may be contained, or two or more thereof may be contained in any combination and ratio.
- the content of the release agent is usually 0.001 parts by mass or more, preferably 0.01 parts by mass or more, and usually 2 parts by mass or less, preferably 1 part by mass, relative to 100 parts by mass of the polycarbonate resin (A). It is not more than 0.5 part by mass, more preferably not more than 0.5 part by mass. If the content of the release agent is less than the lower limit of the above range, the releasability effect may not be sufficient, and if the content of the release agent exceeds the upper limit of the above range, hydrolysis resistance may cause a decrease in the product, mold contamination during injection molding, and the like.
- the polycarbonate resin composition of the present invention preferably also contains an ultraviolet absorber.
- UV absorbers include, for example, inorganic UV absorbers such as cerium oxide and zinc oxide; An ultraviolet absorber etc. are mentioned. Among these, organic ultraviolet absorbers are preferred, and benzotriazole compounds are more preferred. By selecting the organic ultraviolet absorber, the resin composition of the present invention has good transparency and mechanical properties.
- benzotriazole compounds include 2-(2'-hydroxy-5'-methylphenyl)benzotriazole, 2-[2'-hydroxy-3',5'-bis( ⁇ , ⁇ -dimethylbenzyl ) phenyl]-benzotriazole, 2-(2′-hydroxy-3′,5′-di-tert-butyl-phenyl)-benzotriazole, 2-(2′-hydroxy-3′-tert-butyl-5′ -methylphenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-3',5'-di-tert-butyl-phenyl)-5-chlorobenzotriazole), 2-(2'-hydroxy-3 ',5'-di-tert-amyl)-benzotriazole, 2-(2'-hydroxy-5'-tert-octylphenyl)benzotriazole, 2,2'-methylenebis[4-(1,1,3, 3-tetramethylbutyl)-6-
- benzophenone compounds include 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-methoxybenzophenone-5-sulfonic acid, 2-hydroxy-4-n-octoxy Benzophenone, 2-hydroxy-n-dodecyloxybenzophenone, bis(5-benzoyl-4-hydroxy-2-methoxyphenyl)methane, 2,2'-dihydroxy-4-methoxybenzophenone, 2,2'-dihydroxy-4 , 4′-dimethoxybenzophenone and the like.
- salicylate compounds include phenyl salicylate and 4-tert-butylphenyl salicylate.
- cyanoacrylate compounds include ethyl-2-cyano-3,3-diphenyl acrylate and 2-ethylhexyl-2-cyano-3,3-diphenyl acrylate.
- oxalinide compound include 2-ethoxy-2′-ethyloxalinic acid bisallinide and the like.
- the malonic ester compound 2-(alkylidene)malonic esters are preferable, and 2-(1-arylalkylidene)malonic esters are more preferable.
- the content is usually 0.05 parts by mass or more, preferably 0.1 parts by mass or more, and usually 1 part by mass or less, relative to 100 parts by mass of the polycarbonate resin (A). , preferably 0.5 parts by mass or less. If the content of the ultraviolet absorber is less than the lower limit of the range, the effect of improving weather resistance and light resistance may be insufficient, and if the content of the ultraviolet absorber exceeds the upper limit of the range. may cause mold deposits and the like to cause mold contamination.
- One type of ultraviolet absorber may be contained, or two or more types may be contained in any combination and ratio.
- the polycarbonate resin composition of the present invention contains other additives other than those described above, such as antioxidants, fluorescent brighteners, pigments, dyes, flame retardants, impact modifiers, plasticizers, compatibilizers, etc. agent. These additives may contain 1 type, or 2 or more types. Moreover, other resins than the polycarbonate resin (A) may be contained.
- resins include, for example, thermoplastic polyester resins such as polyethylene terephthalate, polytrimethylene terephthalate, and polybutylene terephthalate; polyolefin resins such as polyethylene resins and polypropylene resins; polyamide resins; polyimide resins; polyetherimide resins; polyurethane resins; As other resins, ABS resin and polybutylene terephthalate resin are particularly preferable.
- polycarbonate resin composition Since the polycarbonate resin composition of the present invention has excellent wet heat discoloration resistance, a test piece with a thickness of 3 mm is tested in a pressure cooker tester (PCT) for 100 hours, and then YI in the thickness direction (3 mmt) (after PCT YI) and the difference ⁇ YI between the YI before the test (initial YI), that is, (YI after PCT) - (initial YI) is preferably 3.5 or less, more preferably 3 or less, especially 2.5 or less, 2 or less, 1.8 or less, 1.6 or less, particularly 1. 5 or less is possible.
- the details of the method for measuring ⁇ YI are as described in Examples.
- the polycarbonate resin composition was prepared by adjusting as follows, but the present invention should not be construed as being limited to the following examples.
- the ingredients used are shown in Table 1 below.
- the amounts of bisphenol A, 4-tert-butylphenol, cumylphenol and phenol in the polycarbonate resins (A1) and (A2) were measured as follows. A polycarbonate resin was dissolved in a dichloromethane solution, and methanol was added dropwise to reprecipitate the polymer component. After filtration, the filtrate was dried and dissolved in 5 ml of methanol. The contents of bisphenol A, 4-tert-butylphenol, cumylphenol and phenol were determined by analyzing this methanol solution by high performance liquid chromatography ("LC-20AD Prominence" manufactured by Shimadzu Corporation). To calculate the content, a calibration curve prepared from separately prepared standard substances was used. The amounts of bisphenol A, 4-tert-butylphenol, cumylphenol and phenol in the polycarbonate resin compositions obtained in the following examples and comparative examples were also measured in the same manner as above.
- Examples 1 to 20, Comparative Examples 1 to 19 Each of the above components was blended in the ratio (parts by mass) shown in Table 2 below, mixed in a tumbler for 20 minutes, and then a vented single screw extruder with a screw diameter of 40 mm (Tanabe Plastic Machinery Co., Ltd. "VS- 40”), the mixture was melt-kneaded at a cylinder temperature of 240° C., and pellets were obtained by strand cutting.
- the amounts of bisphenol A, 4-tert-butylphenol, cumylphenol, and phenol in the polycarbonate resin composition pellets obtained above were measured by the method described above, and the results were expressed as parts by mass based on 100 parts by mass of the polycarbonate resin. It described below in Table 2.
- the thickness is reduced by an injection molding machine (“J55AD” manufactured by Japan Steel Works, Ltd.) at a resin temperature of 280 ° C.
- J55AD Japan Steel Works, Ltd.
- a three-tiered plate was molded having sections of 1.0 mm, 2.0 mm and 3.0 mm respectively. Injection molding was performed under the following conditions. Screw rotation speed: 100 rpm Back pressure (gauge pressure): 10 MPa Injection holding pressure time: 10 sec Cooling time: 20 sec YI in the thickness direction (initial YI) was measured for the 3.0 mm thick portion of the three-stage plate.
- the polycarbonate resin composition of the present invention has a good hue and excellent resistance to discoloration under heat and humidity, so it can be suitably used for various molded products.
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Abstract
Description
本発明は、以下のポリカーボネート樹脂組成物及び成形体に関する。
2.アリールホスフィンオキシド(B)が、トリフェニルホスフィンオキシドである上記1に記載のポリカーボネート樹脂組成物。
3.さらに、アリールホスフィン(C2)を0.001~0.3質量部を含む上記1または2に記載のポリカーボネート樹脂組成物。
4.アリールホスフィン(C2)が、トリフェニルホスフィンである上記3に記載のポリカーボネート樹脂組成物。
5.アリールホスフィン(C2)とアリールホスフィンオキシド(B)の含有量の質量比C2/Bが、0以上6以下である上記3または4に記載のポリカーボネート樹脂組成物。
6.さらに、エポキシ化合物(C3)0.001~0.3質量部を含む上記1~5のいずれかに記載のポリカーボネート樹脂組成物。
7.ポリカーボネート樹脂(A)が、リサイクルポリカーボネート樹脂を含む上記1~6のいずれかに記載のポリカーボネート樹脂組成物。
8.上記1~7のいずれかに記載のポリカーボネート樹脂組成物のペレット。
9.上記1~7のいずれかに記載のポリカーボネート樹脂組成物からなる成形体。
10.上記8に記載のポリカーボネート樹脂組成物のペレットからなる成形体。
なお、本明細書において、「~」とは、特に断りがない場合、その前後に記載される数値を下限値及び上限値として含む意味で使用される。
本発明において使用するポリカーボネート樹脂(A)は、特に限定されず、種々のものが用いられる。ポリカーボネート樹脂は、炭酸結合に直接結合する炭素がそれぞれ芳香族炭素である芳香族ポリカーボネート樹脂、及び脂肪族炭素である脂肪族ポリカーボネート樹脂に分類できるが、いずれを用いることもできる。中でも、ポリカーボネート樹脂(A)としては、耐熱性、機械的物性、電気的特性等の観点から、芳香族ポリカーボネート樹脂が好ましい。
1,2-ジヒドロキシベンゼン、1,3-ジヒドロキシベンゼン(即ち、レゾルシノール)、1,4-ジヒドロキシベンゼン等のジヒドロキシベンゼン類;
2,5-ジヒドロキシビフェニル、2,2’-ジヒドロキシビフェニル、4,4’-ジヒドロキシビフェニル等のジヒドロキシビフェニル類;
1,1-ビス(4-ヒドロキシフェニル)プロパン、
2,2-ビス(3-メチル-4-ヒドロキシフェニル)プロパン(即ち、ビスフェノールC)、
2,2-ビス(3-メトキシ-4-ヒドロキシフェニル)プロパン、
2-(4-ヒドロキシフェニル)-2-(3-メトキシ-4-ヒドロキシフェニル)プロパン、
1,1-ビス(3-tert-ブチル-4-ヒドロキシフェニル)プロパン、
2,2-ビス(3,5-ジメチル-4-ヒドロキシフェニル)プロパン、
2,2-ビス(3-シクロヘキシル-4-ヒドロキシフェニル)プロパン、
2-(4-ヒドロキシフェニル)-2-(3-シクロヘキシル-4-ヒドロキシフェニル)プロパン、
α,α’-ビス(4-ヒドロキシフェニル)-1,4-ジイソプロピルベンゼン、
1,3-ビス[2-(4-ヒドロキシフェニル)-2-プロピル]ベンゼン、
ビス(4-ヒドロキシフェニル)メタン、
ビス(4-ヒドロキシフェニル)シクロヘキシルメタン、
ビス(4-ヒドロキシフェニル)フェニルメタン、
ビス(4-ヒドロキシフェニル)(4-プロペニルフェニル)メタン、
ビス(4-ヒドロキシフェニル)ジフェニルメタン、
ビス(4-ヒドロキシフェニル)ナフチルメタン、
1,1-ビス(4-ヒドロキシフェニル)エタン、
1,1-ビス(4-ヒドロキシフェニル)-1-フェニルエタン、
1,1-ビス(4-ヒドロキシフェニル)-1-ナフチルエタン、
1,1-ビス(4-ヒドロキシフェニル)ブタン、
2,2-ビス(4-ヒドロキシフェニル)ブタン、
2,2-ビス(4-ヒドロキシフェニル)ペンタン、
1,1-ビス(4-ヒドロキシフェニル)ヘキサン、
2,2-ビス(4-ヒドロキシフェニル)ヘキサン、
1,1-ビス(4-ヒドロキシフェニル)オクタン、
2,2-ビス(4-ヒドロキシフェニル)オクタン、
4,4-ビス(4-ヒドロキシフェニル)ヘプタン、
2,2-ビス(4-ヒドロキシフェニル)ノナン、
1,1-ビス(4-ヒドロキシフェニル)デカン、
1,1-ビス(4-ヒドロキシフェニル)ドデカン、
等のビス(ヒドロキシアリール)アルカン類;
1,1-ビス(4-ヒドロキシフェニル)シクロヘキサン、
1,1-ビス(4-ヒドロキシフェニル)-3,3-ジメチルシクロヘキサン、
1,1-ビス(4-ヒドロキシフェニル)-3,4-ジメチルシクロヘキサン、
1,1-ビス(4-ヒドロキシフェニル)-3,5-ジメチルシクロヘキサン、
1,1-ビス(4-ヒドロキシフェニル)-3,3,5-トリメチルシクロヘキサン、
1,1-ビス(4-ヒドロキシ-3,5-ジメチルフェニル)-3,3,5-トリメチルシクロヘキサン、
1,1-ビス(4-ヒドロキシフェニル)-3-プロピル-5-メチルシクロヘキサン、1,1-ビス(4-ヒドロキシフェニル)-3-tert-ブチル-シクロヘキサン、
1,1-ビス(4-ヒドロキシフェニル)-4-tert-ブチル-シクロヘキサン、
1,1-ビス(4-ヒドロキシフェニル)-3-フェニルシクロヘキサン、
1,1-ビス(4-ヒドロキシフェニル)-4-フェニルシクロヘキサン、
等のビス(ヒドロキシアリール)シクロアルカン類;
9,9-ビス(4-ヒドロキシ-3-メチルフェニル)フルオレン等のカルド構造含有ビスフェノール類;
4,4’-ジヒドロキシ-3,3’-ジメチルジフェニルスルフィド等のジヒドロキシジアリールスルフィド類;
4,4’-ジヒドロキシジフェニルスルホキシド、4,4’-ジヒドロキシ-3,3’-ジメチルジフェニルスルホキシド等のジヒドロキシジアリールスルホキシド類;
4,4’-ジヒドロキシジフェニルスルホン、
4,4’-ジヒドロキシ-3,3’-ジメチルジフェニルスルホン等のジヒドロキシジアリールスルホン類;
等が挙げられる。
なお、芳香族ジヒドロキシ化合物は、1種を用いてもよく、2種以上を任意の組み合わせ及び比率で併用してもよい。
なお、粘度平均分子量の異なる2種類以上のポリカーボネート樹脂を混合して用いてもよく、この場合には、粘度平均分子量が上記の好適な範囲外であるポリカーボネート樹脂を混合してもよい。
本発明のポリカーボネート樹脂組成物は、アリールホスフィンオキシド(B)を含有する。アリールホスフィンオキシド(B)としては、トリフェニルホスフィンオキシド、ジフェニルブチルホスフィンオキシド、ジフェニルオクタデシルホスフィンオキシド、トリス(p-トリル)ホスフィンオキシド、トリス(p-ノニルフェニル)ホスフィンオキシド、トリス(ナフチル)ホスフィンオキシド、ジフェニル(ヒドロキシメチル)ホスフィンオキシド、ジフェニル(アセトキシメチル)ホスフィンオキシド、ジフェニル(β-エチルカルボキシエチル)ホスフィンオキシド、トリス(p-クロロフェニル)ホスフィンオキシド、トリス(p-フルオロフェニル)ホスフィンオキシド、ジフェニルベンジルホスフィンオキシド、ジフェニル-β-シアノエチルホスフィンオキシド、ジフェニル(p-ヒドロキシフェニル)ホスフィンオキシド、ジフェニル-1,4-ジヒドロキシフェニル-2-ホスフィンオキシド、フェニルナフチルベンジルホスフィンオキシド等が好ましく挙げられ、トリアリールホスフィンオキシドが好ましく、特に好ましくはトリフェニルホスフィンオキシドである。
本発明のポリカーボネート樹脂組成物は、フェノール構造を有する化合物(C1)を含有する。
フェノール構造を有する化合物(C1)はベンゼン環に直接ヒドロキシ基が結合した化合物であり、本発明では、2,2-ビス(4-ヒドロキシフェニル)プロパン(即ちビスフェノールA)、4-tert-ブチルフェノール、クミルフェノール、フェノールから選ばれる少なくとも1種である。これらの中でも、2,2-ビス(4-ヒドロキシフェニル)プロパン、4-tert-ブチルフェノール、クミルフェノールがより好ましく、特に2,2-ビス(4-ヒドロキシフェニル)プロパン、4-tert-ブチルフェノールが好ましい。
フェノール構造を有する化合物(C1)は、1種を単独で含有してもよく、2種以上を含有していてもよい。
フェノール構造を有する化合物(C1)の含有量は、ポリカーボネート樹脂(A)100質量部に対し、好ましくは0.0015質量部以上であり、中でも0.002質量部以上、0.003質量部以上、特に好ましくは0.004質量部以上であり、また、好ましくは0.025質量部以下であり、中でも0.02質量部以下、0.015質量部以下、特に好ましくは0.013質量部以下である。
フェノール構造を有する化合物(C1)として、ビスフェノールAを含有する場合の含有量は、ポリカーボネート樹脂(A)100質量部に対し、0.002~0.03質量部、好ましくは0.004~0.01質量部である。
4-tert-ブチルフェノールを含有する場合の含有量は、ポリカーボネート樹脂(A)100質量部に対し、0.0012~0.01質量部、好ましくは0.002~0.003質量部である。
クミルフェノールを含有する場合の含有量は、ポリカーボネート樹脂(A)100質量部に対し、0.0012~0.01質量部、好ましくは0.002~0.003質量部である。
フェノールを含有する場合の含有量は、ポリカーボネート樹脂(A)100質量部に対し、0.0012~0.01質量部、好ましくは0.002~0.003質量部である。
アリールホスフィン(C2)としては、例えばトリフェニルホスフィン、ジフェニルブチルホスフィン、ジフェニルオクタデシルホスフィン、トリス(p-トリル)ホスフィン、トリス(p-ノニルフェニル)ホスフィン、トリス(ナフチル)ホスフィン、ジフェニル(ヒドロキシメチル)ホスフィン、ジフェニル(アセトキシメチル)、ジフェニル(β-エチルカルボキシエチル)ホスフィン、トリス(p-クロロフェニル)ホスフィン、トリス(p-フルオロフェニル)ホスフィン、ジフェニルベンジルホスフィン、ジフェニル-β-シアノエチルホスフィン、ジフェニル(p-ヒドロキシフェニル)ホスフィン、ジフェニル-1,4-ジヒドロキシフェニル-2-ホスフィン、フェニルナフチルベンジルホスフィン等が好ましく挙げられ、トリアリールホスフィンが好ましく、トリフェニルホスフィン、トリトリルホスフィン等が好ましく挙げられ、特に好ましくはトリフェニルホスフィンである。
アリールホスフィン(C2)とアリールホスフィンオキシド(B)の含有量の質量比C2/Bは0以上6以下であることが好ましく、0超6以下がより好ましく、0.1以上2.0以下がさらに好ましく、0.2以上0.4以下が特に好ましい。
エポキシ化合物(C3)としては、1分子中にエポキシ基を1個以上有する化合物が用いられる。具体的には、フェニルグリシジルエーテル、アリルグリシジルエーテル、t-ブチルフェニルグリシジルエーテル、3,4-エポキシシクロヘキシルメチル-3’,4’-エポキシシクロヘキシルカルボキシレート、3,4-エポキシ-6-メチルシクロヘキシルメチル-3’,4’-エポキシ-6’-メチルシクロヘキシルカルボキシレート、2,3-エポキシシクロヘキシルメチル-3’,4’-エポキシシクロヘキシルカルボキシレート、4-(3,4-エポキシ-5-メチルシクロヘキシル)ブチル-3’,4’-エポキシシクロヘキシルカルボキシレート、3,4-エポキシシクロヘキシルエチレンオキシド、シクロヘキシルメチル3,4-エポキシシクロヘキシルカルボキシレート、3,4-エポキシ-6-メチルシクロヘキシルメチル-6’-メチルシロヘキシルカルボキシレート、ビスフェノール-Aジグリシジルエーテル、テトラブロモビスフェノール-Aグリシジルエーテル、フタル酸のジグリシジルエステル、ヘキサヒドロフタル酸のジグリシジルエステル、ビス-エポキシジシクロペンタジエニルエーテル、ビス-エポキシエチレングリコール、ビス-エポキシシクロヘキシルアジペート、ブタジエンジエポキシド、テトラフェニルエチレンエポキシド、オクチルエポキシタレート、エポキシ化ポリブタジエン、3,4-ジメチル-1,2-エポキシシクロヘキサン、3,5-ジメチル-1,2-エポキシシクロヘキサン、3-メチル-5-t-ブチル-1,2-エポキシシクロヘキサン、オクタデシル-2,2-ジメチル-3,4-エポキシシクロヘキシルカルボキシレート、N-ブチル-2,2-ジメチル-3,4-エポキシシクロヘキシルカルボキシレート、シクロヘキシル-2-メチル-3,4-エポキシシクロヘキシルカルボキシレート、N-ブチル-2-イソプロピル-3,4-エポキシ-5-メチルシクロヘキシルカルボキシレート、オクタデシル-3,4-エポキシシクロヘキシルカルボキシレート、2-エチルヘキシル-3’,4’-エポキシシクロヘキシルカルボキシレート、4,6-ジメチル-2,3-エポキシシクロヘキシル-3’,4’-エポキシシクロヘキシルカルボキシレート、4,5-エポキシ無水テトラヒドロフタル酸、3-t-ブチル-4,5-エポキシ無水テトラヒドロフタル酸、ジエチル4,5-エポキシ-シス-1,2-シクロヘキシルジカルボキシレート、ジ-n-ブチル-3-t-ブチル-4,5-エポキシ-シス-1,2-シクロヘキシルジカルボキシレート、エポキシ化大豆油、エポキシ化アマニ油などを好ましく例示することができる。
本発明のポリカーボネート樹脂組成物は、リン系安定剤を含有することも好ましい。リン系安定剤を含有することで、本発明のポリカーボネート樹脂組成物の色相がより良好なものとなり、さらに耐湿熱変色性がより向上する。
リン系安定剤としては、公知の任意のものを使用できる。具体例を挙げると、リン酸、ホスホン酸、亜燐酸、ホスフィン酸、ポリリン酸などのリンのオキソ酸;酸性ピロリン酸ナトリウム、酸性ピロリン酸カリウム、酸性ピロリン酸カルシウムなどの酸性ピロリン酸金属塩;リン酸カリウム、リン酸ナトリウム、リン酸セシウム、リン酸亜鉛など第1族又は第2B族金属のリン酸塩;ホスフェート化合物、ホスファイト化合物、ホスホナイト化合物などが挙げられるが、ホスファイト構造を有する化合物が特に好ましい。ホスファイト化合物を選択することで、より高い耐変色性と連続生産性を有するポリカーボネート樹脂組成物が得られる。
このようなホスファイト化合物としては、例えば、トリフェニルホスファイト、トリス(モノノニルフェニル)ホスファイト、トリス(モノノニル/ジノニル・フェニル)ホスファイト、トリス(2,4-ジ-tert-ブチルフェニル)ホスファイト、モノオクチルジフェニルホスファイト、ジオクチルモノフェニルホスファイト、モノデシルジフェニルホスファイト、ジデシルモノフェニルホスファイト、トリデシルホスファイト、トリラウリルホスファイト、トリステアリルホスファイト、ジステアリルペンタエリスリトールジホスファイト、ビス(2,4-ジ-tert-ブチル-4-メチルフェニル)ペンタエリスリトールホスファイト、ビス(2,6-ジ-tert-ブチルフェニル)オクチルホスファイト、2,2-メチレンビス(4,6-ジ-tert-ブチルフェニル)オクチルホスファイト、テトラキス(2,4-ジ-tert-ブチルフェニル)-4,4’-ビフェニレン-ジホスファイト、6-[3-(3-tert-ブチル-ヒドロキシ-5-メチルフェニル)プロポキシ]-2,4,8,10-テトラ-tert-ブチルジベンゾ[d,f][1,3,2]-ジオキサホスフェピン等が挙げられる。
本発明の樹脂組成物は離型剤を含有することも好ましい。
離型剤としては、例えば、脂肪族カルボン酸、脂肪族カルボン酸とアルコールとのエステル、数平均分子量200~15000の脂肪族炭化水素化合物、ポリシロキサン系シリコーンオイルなどが挙げられる。
これらの中では、パラフィンワックス、ポリエチレンワックスまたはポリエチレンワックスの部分酸化物が好ましく、パラフィンワックス、ポリエチレンワックスがさらに好ましい。
また、前記の脂肪族炭化水素の数平均分子量は、好ましくは5000以下である。
なお、脂肪族炭化水素は、単一物質であってもよいが、構成成分や分子量が様々なものの混合物であっても、主成分が上記の範囲内であれば使用できる。
本発明のポリカーボネート樹脂組成物は、紫外線吸収剤を含有することも好ましい。
紫外線吸収剤としては、例えば、酸化セリウム、酸化亜鉛などの無機紫外線吸収剤;ベンゾトリアゾール化合物、ベンゾフェノン化合物、サリシレート化合物、シアノアクリレート化合物、トリアジン化合物、オギサニリド化合物、マロン酸エステル化合物、ヒンダードアミン化合物などの有機紫外線吸収剤などが挙げられる。これらの中では有機紫外線吸収剤が好ましく、ベンゾトリアゾール化合物がより好ましい。有機紫外線吸収剤を選択することで、本発明の樹脂組成物の透明性や機械物性が良好なものになる。
シアノアクリレート化合物の具体例としては、例えば、エチル-2-シアノ-3,3-ジフェニルアクリレート、2-エチルヘキシル-2-シアノ-3,3-ジフェニルアクリレート等が挙げられる。
オギサニリド化合物の具体例としては、例えば、2-エトキシ-2’-エチルオキサリニックアシッドビスアリニド等が挙げられる。
マロン酸エステル化合物としては、2-(アルキリデン)マロン酸エステル類が好ましく、2-(1-アリールアルキリデン)マロン酸エステル類がより好ましい。
紫外線吸収剤は、1種が含有されていてもよく、2種以上が任意の組み合わせ及び比率で含有されていてもよい。
本発明のポリカーボネート樹脂組成物は、上記した以外のその他の添加剤、例えば、酸化防止剤、蛍光増白剤、顔料、染料、難燃剤、耐衝撃改良剤、可塑剤、相溶化剤などの添加剤を含有することができる。これらの添加剤は一種又は二種以上を含有してもよい。
また、ポリカーボネート樹脂(A)以外の他の樹脂を含有してもよい。その他の樹脂としては、例えば、ポリエチレンテレフタレート、ポリトリメチレンテレフタレート、ポリブチレンテレフタレートなどの熱可塑性ポリエステル樹脂;ポリスチレン樹脂、高衝撃ポリスチレン樹脂(HIPS)、アクリロニトリル-スチレン共重合体(AS樹脂)などのスチレン系樹脂;ポリエチレン樹脂、ポリプロピレン樹脂等のポリオレフィン樹脂;ポリアミド樹脂;ポリイミド樹脂;ポリエーテルイミド樹脂;ポリウレタン樹脂;ポリフェニレンエーテル樹脂;ポリフェニレンサルファイド樹脂;ポリスルホン樹脂;ポリメタクリレート樹脂等が挙げられる。その他の樹脂としては、特にABS樹脂、ポリブチレンテレフタレート樹脂が好ましい。
本発明のポリカーボネート樹脂組成物は、耐湿熱変色性に優れるので、厚さ3mmの試験片をプレッシャークッカー試験機(PCT)中に100時間、試験した後の厚み方向(3mmt)のYI(PCT後YI)と、試験前のYI(初期YI)の差ΔYI、即ち、
(PCT後YI)-(初期YI)が、好ましくは3.5以下であり、より好ましくは3以下、中でも2.5以下、2以下、1.8以下、1.6以下、特には1.5以下とすることが可能である。
なお、ΔYIの測定方法の詳細は、実施例に記載する通りである。
使用した成分は、以下の表1の通りである。
ポリカーボネート樹脂をジクロロメタン溶液に溶解し、ここへメタノールを滴下してポリマー成分を再沈させて濾過し、濾液を乾固したものをメタノール5mlに溶解させた。このメタノール溶液を高速液体クロマトグラフィー(島津製作所社製「LC-20AD Prominence」)で分析することにより、ビスフェノールA、4-tert-ブチルフェノール、クミルフェノール、フェノールの含有量を求めた。なお、含有量を算出するには、別途調整した標準物質から作成した検量線を用いた。
また、以下の実施例及び比較例で得られたポリカーボネート樹脂組成物中のビスフェノールA、4-tert-ブチルフェノール、クミルフェノール、フェノールの量の測定も上記と同様にして行った。
上記した各成分を、後記表2以下に記した割合(質量部)で配合し、タンブラーにて20分混合した後、スクリュー径40mmのベント付単軸押出機(田辺プラスチック機械社製「VS-40」)により、シリンダー温度を240℃で溶融混練し、ストランドカットによりペレットを得た。
上記で得られたポリカーボネート樹脂組成物ペレット中のビスフェノールA、4-tert-ブチルフェノール、クミルフェノール、フェノールの量を、前記した方法により測定し、結果をポリカーボネート樹脂100質量部に対する質量部として、下記表2以下に記載した。
スクリュー回転数:100rpm
背圧(ゲージ圧力):10MPa
射出保圧時間:10sec
冷却時間:20sec
上記3段プレートの厚さ3.0mmの部分について、厚み方向のYI(初期YI)を測定した。測定は、JIS K7105に基づき、日本電色工業社製色差計「SE-6000」を使用して行った。なお、光源はC、視野は2度に設定した。
次いで、この3段プレートを、温度121℃、湿度100%、ゲージ圧力0.1MPaで、プレッシャークッカー試験機(PCT)中に100時間保持した後、同様にしてYIを測定(PCT後YI)し、以下の式からΔYIを求めた。なお、PCTはエスペック社製「EHS-212MD」を使用して行った。
ΔYI=(PCT後YI)-(初期YI)
以上の評価結果を、下記表2以下に示す。
Claims (10)
- ポリカーボネート樹脂(A)100質量部に対し、アリールホスフィンオキシド(B)0.001~0.3質量部、さらに、フェノール構造を有する化合物(C1)0.0012~0.03質量部を含有し、フェノール構造を有する化合物(C1)が、ビスフェノールA、4-tert-ブチルフェノール、クミルフェノール、フェノールから選ばれる少なくとも1種であって、ビスフェノールAを含有する場合の含有量は0.002~0.03質量部、4-tert-ブチルフェノールを含有する場合の含有量は0.0012~0.01質量部、クミルフェノールを含有する場合の含有量は0.0012~0.01質量部、フェノールを含有する場合の含有量は0.0012~0.01質量部であることを特徴とするポリカーボネート樹脂組成物。
- アリールホスフィンオキシド(B)が、トリフェニルホスフィンオキシドである請求項1に記載のポリカーボネート樹脂組成物。
- さらに、アリールホスフィン(C2)を0.001~0.3質量部を含む請求項1に記載のポリカーボネート樹脂組成物。
- アリールホスフィン(C2)が、トリフェニルホスフィンである請求項3に記載のポリカーボネート樹脂組成物。
- アリールホスフィン(C2)とアリールホスフィンオキシド(B)の含有量の質量比C2/Bが、0以上6以下である請求項3に記載のポリカーボネート樹脂組成物。
- さらに、エポキシ化合物(C3)0.001~0.3質量部を含む請求項1に記載のポリカーボネート樹脂組成物。
- ポリカーボネート樹脂(A)が、リサイクルポリカーボネート樹脂を含む請求項1に記載のポリカーボネート樹脂組成物。
- 請求項1~7のいずれかに記載のポリカーボネート樹脂組成物のペレット。
- 請求項1~7のいずれかに記載のポリカーボネート樹脂組成物からなる成形体。
- 請求項8に記載のポリカーボネート樹脂組成物のペレットからなる成形体。
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Citations (3)
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JPH07207018A (ja) * | 1994-01-25 | 1995-08-08 | Mitsubishi Gas Chem Co Inc | ポリカーボネートの製造法 |
JP2004526843A (ja) * | 2001-03-26 | 2004-09-02 | バイエル アクチェンゲゼルシャフト | 改良された加水分解耐性を有する溶融ポリカーボネートを含有する組成物、それを含有する成形品およびその使用 |
JP2014062203A (ja) * | 2012-09-21 | 2014-04-10 | Idemitsu Kosan Co Ltd | 芳香族ポリカーボネート樹脂組成物及び該樹脂組成物を用いた成形品 |
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JPH07207018A (ja) * | 1994-01-25 | 1995-08-08 | Mitsubishi Gas Chem Co Inc | ポリカーボネートの製造法 |
JP2004526843A (ja) * | 2001-03-26 | 2004-09-02 | バイエル アクチェンゲゼルシャフト | 改良された加水分解耐性を有する溶融ポリカーボネートを含有する組成物、それを含有する成形品およびその使用 |
JP2014062203A (ja) * | 2012-09-21 | 2014-04-10 | Idemitsu Kosan Co Ltd | 芳香族ポリカーボネート樹脂組成物及び該樹脂組成物を用いた成形品 |
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