WO2023074376A1 - 固体電解コンデンサ - Google Patents

固体電解コンデンサ Download PDF

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Publication number
WO2023074376A1
WO2023074376A1 PCT/JP2022/038077 JP2022038077W WO2023074376A1 WO 2023074376 A1 WO2023074376 A1 WO 2023074376A1 JP 2022038077 W JP2022038077 W JP 2022038077W WO 2023074376 A1 WO2023074376 A1 WO 2023074376A1
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WIPO (PCT)
Prior art keywords
anode
terminal
solid electrolytic
cathode
electrolytic capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/038077
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English (en)
French (fr)
Japanese (ja)
Inventor
剛士 古川
貴行 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Priority to CN202280071456.XA priority Critical patent/CN118160056A/zh
Priority to JP2023556303A priority patent/JPWO2023074376A1/ja
Priority to US18/700,943 priority patent/US20240412927A1/en
Publication of WO2023074376A1 publication Critical patent/WO2023074376A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
    • H01G9/052—Sintered electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H01G9/10—Sealing, e.g. of lead-in wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/15—Solid electrolytic capacitors

Definitions

  • the present disclosure relates to solid electrolytic capacitors.
  • a solid body comprising a capacitor element having an anode part and a cathode part, an anode terminal electrically connected to the anode part, a cathode terminal electrically connected to the cathode part, and an exterior resin covering these An electrolytic capacitor is known (for example, Patent Document 1).
  • Patent Document 1 In the solid electrolytic capacitor of Patent Document 1, as shown in FIG. 2 of the same document, notch holes are provided in each of the anode terminal and the cathode terminal, and the exterior resin has protrusions that fit into the notch holes. have.
  • the solid electrolytic capacitor includes at least one capacitor element having an anode portion and a cathode portion, an anode terminal electrically connected to the anode portion, a cathode terminal electrically connected to the cathode portion, and the capacitor an exterior resin that covers the element, the anode terminal, and the cathode terminal in such a manner that a part of each of the anode terminal and the cathode terminal is exposed, and the exterior resin includes a mounting surface and the mounting surface. and a hollow portion opening toward the side opposite to the exterior resin is formed in a portion of the anode terminal and the cathode terminal exposed along the mounting surface of the anode terminal and the cathode terminal. .
  • FIG. 1A and 1B are diagrams schematically showing a solid electrolytic capacitor according to Embodiment 1 of the present disclosure, where (a) is a cross-sectional view and (b) is a bottom view.
  • FIG. 2 is a diagram schematically showing a solid electrolytic capacitor according to Embodiment 2 of the present disclosure, where (a) is a cross-sectional view and (b) is a bottom view.
  • a solid electrolytic capacitor is usually mounted on a board by soldering.
  • the amount of solder is large, melted solder flows out around the anode terminal and the cathode terminal, and the solid electrolytic capacitor may tilt or float due to the outflowing solder.
  • the mounting quality may be impaired.
  • one object of the present disclosure is to improve the quality of substrate mounting by soldering.
  • a solid electrolytic capacitor according to the present disclosure includes at least one capacitor element, an anode terminal, a cathode terminal, and an exterior resin.
  • At least one capacitor element has an anode portion and a cathode portion.
  • the anode section may include an anode body and an anode wire.
  • the anode body may be a porous sintered body obtained by sintering particles such as a valve metal.
  • the anode wire may consist of a wire having electrical conductivity.
  • the cathode part may include a solid electrolyte layer covering at least part of the dielectric layer formed on the surface of the anode body, and a cathode layer covering at least part of the solid electrolyte layer.
  • the anode terminal is electrically connected to the anode part.
  • the anode terminal may be composed of a conductive material (eg, metal).
  • the anode terminal may be joined to an anode wire of the anode section.
  • the cathode terminal is electrically connected to the cathode section.
  • the cathode terminal may be composed of a conductive material (eg, metal).
  • the cathode terminal may be bonded to the cathode layer of the cathode section via, for example, a conductive adhesive.
  • the exterior resin covers the capacitor element, the anode terminal, and the cathode terminal in a state in which a part of each of the anode terminal and the cathode terminal is exposed.
  • the exterior resin may be composed of an insulating resin containing a filler.
  • the exterior resin has a mounting surface and four side surfaces intersecting the mounting surface.
  • the mounting surface is a surface of the exterior resin that faces a member (such as a circuit board) on which the solid electrolytic capacitor is mounted.
  • the exposed portion of the anode terminal functions as an anode external terminal of the solid electrolytic capacitor.
  • the exposed portion of the cathode terminal functions as the cathode external terminal of the solid electrolytic capacitor.
  • a portion of the anode terminal and the cathode terminal exposed along the mounting surface (hereinafter also referred to as a first portion) is opened toward the side opposite to the exterior resin (that is, the side of the circuit board or the like) (in other words, As a result, a hollow portion that opens toward the outside of the solid electrolytic capacitor is formed.
  • the hollow portion defines a space between the first portion and a member (such as a circuit board) to which the first portion is connected.
  • the hollow portion may be closed at its periphery within the first portion. Alternatively, the hollow portion may straddle the outer edge of the first portion.
  • the hollow part When the hollow part straddles the outer edge of the first part, it can be said that the hollow part opens in another direction in addition to the side opposite to the exterior resin (that is, the side of the circuit board or the like). Another direction may be the center side (or inside) of the solid electrolytic capacitor, or the opposite side (or outside). At least one hollow portion should be formed in each terminal.
  • the hollow portion functions as a space for containing melted solder when soldering the solid electrolytic capacitor to the substrate. Such a hollow portion functions to prevent solder from flowing out around the anode terminal and the cathode terminal, thereby improving the quality of board mounting by soldering.
  • the distance between the outer edge of the hollow portion and the outer edge of the first portion may be 0.2 mm or more, except where the hollow portion is located. According to this configuration, when the solid electrolytic capacitor is soldered to the substrate, sufficient bonding strength can be ensured through the bonding portion having a width of 0.2 mm or more.
  • the hollow part may consist of a hollow hole.
  • the hollow portion may be closed at its periphery within the first portion.
  • the hollow part opens only toward the side opposite to the exterior resin (that is, toward the side of the circuit board or the like). According to this configuration, since soldering is performed along the entire circumference of the hollow portion (hollow hole), the bonding strength of the solid electrolytic capacitor to the substrate can be increased.
  • the hollow portion may pass through the anode terminal and the cathode terminal in the thickness direction.
  • a hollow portion having the same depth as the thickness of the anode terminal and the cathode terminal is formed. It is easy to secure a sufficient volume of the hollow portion, and thus a sufficient space for accommodating the melted solder can be easily secured.
  • the hollow part does not have to pass through the anode terminal and the cathode terminal in the thickness direction.
  • the hollow is configured as a recess with a bottom. Therefore, when the capacitor element and each terminal are molded with the exterior resin, there is no possibility that molten resin will flow into the hollow portion from the exterior resin side, regardless of the type of the solid electrolytic capacitor.
  • the depth of the recess having a bottom (that is, the distance between the surface of the terminal having the recess and the bottom farthest from the exterior resin and the bottom) may be, for example, 30% or more, or 50% or more of the thickness of the terminal. good.
  • the bottom part can also be said to be the ceiling part when viewed from the circuit board or the like.
  • the exposed portion of the anode terminal may extend from the side surface of the exterior resin over the mounting surface and may not be adhered to the exterior resin.
  • the exposed portion of the cathode terminal may extend from the side surface of the exterior resin to the mounting surface and may not be adhered to the exterior resin.
  • the solid electrolytic capacitor is configured as a so-called gull-wing solid electrolytic capacitor.
  • the exposed portions of the anode terminal and the cathode terminal are bent toward the mounting surface at the boundary between the side surface of the exterior resin and further bent at the boundary between the side surface and the mounting surface to extend along the mounting surface. distributed.
  • the first portion of each terminal does not come into contact with the exterior resin in the process of molding each component with the exterior resin. Therefore, regardless of the shape of the hollow portion, there is no possibility that the molten resin will flow into the hollow portion, which is particularly suitable for applying the technology of the present disclosure.
  • the technology of the present disclosure is also applicable to other types of solid electrolytic capacitors.
  • the ratio of the area of the hollow portion to the area of the portion (first portion) exposed along the mounting surface of the anode terminal and the cathode terminal may be 10% or more and 50% or less.
  • the ratio of the area of the hollow portion formed in the anode terminal to the area of the first portion of the anode terminal may be 10% or more and 50% or less.
  • the anode part may have a porous anode body and an anode wire partially embedded in the anode body.
  • the anode terminal may be connected to the anode wire.
  • the cathode part may have a solid electrolyte layer disposed on the anode body with a dielectric layer interposed therebetween.
  • a solid electrolytic capacitor 10 of the present embodiment includes a capacitor element 11, an anode terminal 17, a cathode terminal 18, and an exterior resin 21, as shown in FIGS. 1(a) and 1(b).
  • the solid electrolytic capacitor 10 has a substantially hexahedral outer shape.
  • the capacitor element 11 has an anode portion 12 and a cathode portion 13 .
  • the anode section 12 has, for example, an anode body 12a, which is a hexahedral porous sintered body, and an anode wire 12b partially embedded in the anode body 12a.
  • Cathode portion 13 has solid electrolyte layer 14 formed on dielectric layer 16 formed on the surface of anode body 12 a , and cathode layer 15 covering a portion of the surface of solid electrolyte layer 14 .
  • the anode body 12a is a porous sintered body obtained by sintering particles such as valve metal (hereinafter simply referred to as metal particles).
  • metal particles particles of valve action metals such as titanium, tantalum and niobium are used.
  • One or more metal particles are used for anode body 12a.
  • the metal particles may be an alloy of two or more metals.
  • an alloy containing a valve metal and silicon, vanadium, boron, or the like can be used.
  • a compound containing a valve action metal and a typical element such as nitrogen may also be used. It is preferable that the alloy of the valve action metal contains the valve action metal as a main component and contains 50 atomic % or more of the valve action metal.
  • the anode wire 12b is composed of, for example, a conductive wire.
  • the material of the anode wire 12b is not particularly limited, and examples thereof include the valve action metals described above, copper, aluminum, aluminum alloys, and the like.
  • the materials forming anode body 12a and anode wire 12b may be the same or different.
  • the cross-sectional shape of the anode wire 12b is not particularly limited. ), elliptical, rectangular, polygonal, and the like. Of these, the track shape is preferable in that rolling is suppressed during welding with the anode terminal 17 and positioning is easy.
  • the diameter of the anode wire 12b (major diameter in the case of track-shaped and elliptical) is also not particularly limited, but is, for example, 0.1 mm or more and 1.0 mm or less.
  • the anode part 12 is produced, for example, by embedding a portion of the anode wire 12b in metal particles, pressing the metal particles into a hexahedron (rectangular parallelepiped in this example), and sintering the metal particles. As a result, the rest of anode wire 12b is pulled out from the erected surface (left side surface in FIG. 1(a)) of anode body 12a so as to be erected.
  • a dielectric layer 16 is formed on the surface of the anode body 12a.
  • the dielectric layer 16 is made of metal oxide, for example.
  • Examples of a method for forming a layer containing a metal oxide on the surface of anode body 12a include a method of immersing anode body 12a in a chemical conversion solution to anodize the surface of anode body 12a, and a method of anodizing anode body 12a by immersing anode body 12a in oxygen.
  • a method of heating in an atmosphere containing The dielectric layer 16 is not limited to the layer containing the above-mentioned metal oxide, and may have insulating properties.
  • the solid electrolyte layer 14 is formed so as to cover at least part of the dielectric layer 16, and covers at least part, preferably all of the planting surface. As a result, an increase in the capacity of the solid electrolytic capacitor 10 can be expected.
  • a manganese compound or a conductive polymer is used for the solid electrolyte layer 14 .
  • conductive polymers include polypyrrole, polythiophene, polyfuran, polyaniline, polyacetylene, polyphenylene, polyparaphenylenevinylene, polyacene, polythiophenevinylene, polyfluorene, polyvinylcarbazole, polyvinylphenol, polypyridine, derivatives of these polymers, and the like. mentioned. These may be used alone, or may be used in combination.
  • the conductive polymer may be a copolymer of two or more monomers.
  • polythiophene, polyaniline, polypyrrole and the like are preferable from the viewpoint of excellent conductivity.
  • polypyrrole is preferable because of its excellent water repellency.
  • the solid electrolyte layer 14 containing the conductive polymer is formed, for example, by polymerizing a raw material monomer on the dielectric layer 16 or by applying a liquid containing the conductive polymer to the dielectric layer 16. be done.
  • Solid electrolyte layer 14 is composed of one or more solid electrolyte layers. When the solid electrolyte layer 14 is composed of two or more layers of solid charge layers, the composition and formation method (polymerization method) of the conductive polymer used for each layer may be different.
  • polypyrrole, polythiophene, polyfuran, polyaniline, etc. mean polymers having polypyrrole, polythiophene, polyfuran, polyaniline, etc. as a basic skeleton, respectively. Therefore, polypyrrole, polythiophene, polyfuran, polyaniline, etc. may also include their respective derivatives.
  • polythiophenes include poly(3,4-ethylenedioxythiophene) and the like.
  • Various dopants may be added to the polymerization liquid, solution or dispersion of the conductive polymer for forming the conductive polymer, in order to improve the conductivity of the conductive polymer.
  • the dopant is not particularly limited, but 1,5-naphthalenedisulfonic acid, 1,6-naphthalenedisulfonic acid, 1-octanesulfonic acid, 1-naphthalenesulfonic acid, 2-naphthalenesulfonic acid, 2,6-naphthalenedisulfonic acid, 2,7-naphthalenedisulfonic acid, 2-methyl-5-isopropylbenzenesulfonic acid, 4-octylbenzenesulfonic acid, 4-nitrotoluene-2-sulfonic acid, m-nitrobenzenesulfonic acid, n-octylsulfonic acid, n-butane Sulfonic acid, n-hexanesulfonic acid, o-nitrobenzenes
  • the average particle size D50 of the particles is preferably 0.01 ⁇ m or more and 0.5 ⁇ m or less, for example. If the average particle diameter D50 of the particles is within this range, the particles are likely to penetrate into the anode body 12a.
  • the cathode layer 15 has a carbon layer 15a and a metal (for example, silver) paste layer 15b formed on the surface of the carbon layer 15a.
  • Carbon layer 15 a is formed to cover a portion of solid electrolyte layer 14 .
  • the carbon layer 15a is made of a composition containing a conductive carbon material such as graphite.
  • the metal paste layer 15b is made of, for example, a composition containing silver particles and resin. Note that the configuration of the cathode layer 15 is not limited to this, and may be any configuration having a current collecting function.
  • the anode terminal 17 is electrically connected to the anode section 12 .
  • Anode terminal 17 is electrically connected to anode body 12a through a portion of anode wire 12b protruding from anode body 12a.
  • the material of the anode terminal 17 is not particularly limited as long as it is electrochemically and chemically stable and has conductivity, and may be metal or non-metal.
  • the shape is not particularly limited, either, and for example, it is long and flat with a first main surface and a second main surface.
  • the thickness of the anode terminal 17 (the distance between the main surfaces of the anode terminal 17) is preferably 25 ⁇ m or more and 200 ⁇ m or less, more preferably 25 ⁇ m or more and 100 ⁇ m or less, from the viewpoint of reducing the height.
  • the anode terminal 17 may be joined to the anode wire 12b with a conductive adhesive or solder, or may be joined to the anode wire 12b by resistance welding or laser welding.
  • the conductive adhesive is, for example, a mixture of thermosetting resin and carbon particles or metal particles.
  • the cathode terminal 18 is electrically connected to the cathode section 13 .
  • Cathode terminal 18 is electrically connected to cathode layer 15 .
  • the material of the cathode terminal 18 is also not particularly limited as long as it is electrochemically and chemically stable and has conductivity, and may be metal or non-metal.
  • the shape is not particularly limited, either, and for example, it is long and flat with a first main surface and a second main surface.
  • the thickness of the cathode terminal 18 is preferably 25 ⁇ m or more and 200 ⁇ m or less, more preferably 25 ⁇ m or more and 100 ⁇ m or less, from the viewpoint of height reduction.
  • the cathode terminal 18 For example, it is joined to the cathode layer 15 via a conductive adhesive 19 .
  • the exterior resin 21 covers the capacitor element 11, the anode terminal 17, and the cathode terminal 18 in a state in which a part of each of the anode terminal 17 and the cathode terminal 18 is exposed.
  • the exterior resin 21 has a mounting surface 21a (lower surface in FIG. 1A) and four side surfaces intersecting with the mounting surface 21a.
  • the exterior resin 21 is provided to electrically insulate the anode terminal 17 and the cathode terminal 18, and is made of an insulating material.
  • the exterior resin 21 includes, for example, a cured thermosetting resin. Examples of thermosetting resins include epoxy resins, phenol resins, silicone resins, melamine resins, urea resins, alkyd resins, polyurethanes, polyimides, unsaturated polyesters, and the like.
  • the exterior resin 21 is formed, for example, by housing the thermosetting resin and the capacitor element 11 to which the anode terminal 17 and the cathode terminal 18 are connected in a mold, and performing transfer molding or compression molding. At this time, capacitor element 11 is covered with exterior resin 21 so that at least a portion of anode terminal 17 and cathode terminal 18 are led out of exterior resin 21 .
  • the exterior shape of the exterior resin 21 is, for example, a rectangular parallelepiped.
  • the portions (hereinafter also referred to as exposed portions) of anode terminal 17 and cathode terminal 18 are bent along the outer shape of exterior resin 21 and arranged on mounting surface 21 a side of exterior resin 21 .
  • the exposed portions of anode terminal 17 and cathode terminal 18 each extend from the side surface of exterior resin 21 over mounting surface 21 a and are not adhered to exterior resin 21 .
  • the portions (first portions 17a and 18a) of the anode terminal 17 and the cathode terminal 18 exposed along the mounting surface 21a of the exterior resin 21 are provided with a slanting direction toward the opposite side of the exterior resin 21 (lower side in FIG. 1(a)). ), a hollow portion 20 is formed.
  • the hollow portion 20 has a square shape, but is not limited to this, and may have any other shape such as a circle, rectangle, or ellipse.
  • the shape and size of the hollow portion 20 of the anode terminal 17 and the shape and size of the hollow portion 20 of the cathode terminal 18 may be the same or different.
  • the hollow portion 20 is composed of a hollow hole penetrating through the anode terminal 17 and the cathode terminal 18 in the thickness direction. That is, the depth of the hollow portion 20 of this embodiment is equal to the thickness of the anode terminal 17 and the cathode terminal 18 . Also, the regions of the first portions 17a and 18a that are used for soldering are angular and have an O shape. The ratio of the area of hollow portion 20 to the areas of first portions 17a and 18a of anode terminal 17 and cathode terminal 18 is preferably 10% or more and 50% or less, but is not limited to this range. Such a hollow portion 20 may be formed by punching the anode terminal 17 and the cathode terminal 18, for example.
  • the distance between the outer edge of the hollow portion 20 and the outer edges of the first portions 17a, 18a is 0.2 mm or more.
  • the distance between the right end of the first portion 17a of the anode terminal 17 and the right end of the hollow portion 20 of the anode terminal 17 may be 0.2 mm or more.
  • the distance between the left end of the first portion 18a of the cathode terminal 18 and the left end of the hollow portion 20 of the cathode terminal 18 should be 0.2 mm or more. This is because, in the illustrated example, the distance between the outer edge of the hollow portion 20 and the outer edges of the first portions 17a and 18a is the smallest at these locations.
  • the hollow portion 20 functions as a space for containing melted solder when soldering the solid electrolytic capacitor 10 to a substrate (not shown). Such a function of the hollow portion 20 prevents the solder from flowing out around the anode terminal 17 and the cathode terminal 18, thereby improving the quality of board mounting by soldering.
  • a second embodiment of the present disclosure will be described.
  • a solid electrolytic capacitor 10 of this embodiment differs from that of the first embodiment in the configuration of a hollow portion 20 . Differences from the first embodiment will be mainly described below.
  • the hollow portion 20 of the present embodiment is composed of recesses formed in the first portions 17a and 18a of the anode terminal 17 and the cathode terminal 18. As shown in FIGS. That is, the hollow portion 20 does not pass through the anode terminal 17 and the cathode terminal 18 in the thickness direction.
  • the depth of hollow portion 20 may be, for example, 20% or more and 80% or less of the thickness of anode terminal 17 and cathode terminal 18 .
  • the hollow portion 20 extends over the outer edges of the first portions 17a and 18a. Specifically, in the example shown in FIG. 2( b ), the hollow portion 20 of the anode terminal 17 straddles the left edge of the first portion 17 a of the anode terminal 17 . In addition, in the example shown in the figure, the hollow portion 20 of the cathode terminal 18 straddles the right edge of the first portion 18a of the cathode terminal 18 . Each first portion 17a .
  • the area used for soldering at 18a has an angular U shape.
  • the present disclosure can be used for solid electrolytic capacitors.
  • Solid electrolytic capacitor 11 Capacitor element 12: Anode part 12a: Anode body 12b: Anode wire 13: Cathode part 14: Solid electrolyte layer 15: Cathode layer 15a: Carbon layer 15b: Metal paste layer 16: Dielectric layer 17: Anode terminal 17a: first portion 18: cathode terminal 18a: first portion 19: conductive adhesive 20: hollow portion 21: exterior resin 21a: mounting surface

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
PCT/JP2022/038077 2021-10-28 2022-10-12 固体電解コンデンサ Ceased WO2023074376A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202280071456.XA CN118160056A (zh) 2021-10-28 2022-10-12 固体电解电容器
JP2023556303A JPWO2023074376A1 (https=) 2021-10-28 2022-10-12
US18/700,943 US20240412927A1 (en) 2021-10-28 2022-10-12 Solid electrolytic capacitor

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JP2021-176281 2021-10-28
JP2021176281 2021-10-28

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WO2023074376A1 true WO2023074376A1 (ja) 2023-05-04

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