WO2023067894A1 - Dispositif de refroidissement et son procédé de fabrication - Google Patents

Dispositif de refroidissement et son procédé de fabrication Download PDF

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Publication number
WO2023067894A1
WO2023067894A1 PCT/JP2022/032071 JP2022032071W WO2023067894A1 WO 2023067894 A1 WO2023067894 A1 WO 2023067894A1 JP 2022032071 W JP2022032071 W JP 2022032071W WO 2023067894 A1 WO2023067894 A1 WO 2023067894A1
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WIPO (PCT)
Prior art keywords
heat radiation
heat
radiation fin
fin row
row
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PCT/JP2022/032071
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English (en)
Japanese (ja)
Inventor
亨太 浅井
健 徳山
明博 難波
ティ チェン
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株式会社日立製作所
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Publication of WO2023067894A1 publication Critical patent/WO2023067894A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a cooling device and a method for manufacturing a cooling device.
  • Patent Document 1 copper or nickel is plated at predetermined locations on the heat dissipation surface of the substrate portion made of aluminum metal or aluminum metal alloy. Then, there is a technology in which a radiation fin row, which is a row of wire fins made of copper metal or a copper alloy formed by bending multiple rows via a plated portion, is soldered to the heat radiation surface and integrated. disclosed.
  • the heat dissipation area is increased by using the heat dissipation fin row that is continuously bent in an uneven shape.
  • the wires forming the radiation fin rows are continuously bent to form the radiation fins, the number of steps in the manufacturing process is reduced, resulting in high productivity.
  • the radiation area is made large by arranging the rows of radiation fins that are bent in an uneven shape.
  • An object of the present invention is to provide a cooling device and a method of manufacturing the cooling device that sufficiently increases the mounting density of a plurality of radiating fin rows on a heat radiating surface.
  • a cooling device is a cooling device including a plurality of rows of radiation fins, which are rows of the radiation fins, arranged on a heat radiation surface and arranged on a radiation surface are radiation fins that are linear radiation portions, wherein the radiation fin rows and the second heat radiation fin row, which is the heat radiation fin row adjacent to the first heat radiation fin row, are alternately arranged, and the heat radiation of the first heat radiation fin row is arranged alternately.
  • the first heat radiation fin height which is the height from the surface, is different from the second heat radiation fin height, which is the height of the second heat radiation fin row from the heat radiation surface.
  • a downwardly tapered tool contacts the heat dissipation surface to form the second heat dissipation fin row, and an upper portion of the tool having a horizontal width larger than a lower portion contacts the first heat dissipation fin row. Not tall.
  • the present invention it is possible to provide a cooling device and a method of manufacturing the cooling device that sufficiently increase the mounting density of a plurality of fin rows on the heat dissipation surface.
  • FIG. 1 is an exploded perspective view showing the cooling device according to the first embodiment.
  • FIG. 2 is a vertical cross-sectional view showing the cooling device according to the first embodiment as seen from the X direction in FIG.
  • FIG. 3 is a longitudinal sectional view showing the cooling device according to the first embodiment as seen from the Y direction in FIG.
  • FIG. 4 is a perspective view showing the cooling device with the heat dissipation cover removed according to the first embodiment.
  • FIG. 5 is a front view showing the cooling device according to the first embodiment from which the heat dissipation cover is removed, as seen from the X direction in FIG.
  • FIG. 6 is a side view showing the cooling device according to the first embodiment from which the heat radiation cover is removed, viewed from the Y direction in FIG.
  • FIG. 1 is an exploded perspective view showing the cooling device according to the first embodiment.
  • FIG. 2 is a vertical cross-sectional view showing the cooling device according to the first embodiment as seen from the X direction in FIG.
  • FIG. 3 is
  • FIG. 7 is an explanatory diagram showing the tool according to the first embodiment.
  • FIG. 8 is a flow chart showing the method for manufacturing the cooling device according to the first embodiment.
  • FIG. 9 is an explanatory diagram showing the first manufacturing process of the cooling device manufacturing method according to the first embodiment.
  • FIG. 10 is an explanatory diagram showing the second manufacturing process of the cooling device manufacturing method according to the first embodiment.
  • FIG. 11 is an explanatory diagram showing the dimensional relationship between the first heat radiation fin row and the second heat radiation fin row and the tool according to the first embodiment.
  • FIG. 12 is a perspective view showing the cooling device from which the heat dissipation cover is removed according to Modification 1 of the first embodiment.
  • FIG. 13 is a front view showing the cooling device from which the heat radiation cover is removed according to Modification 1 of the first embodiment, viewed from the X direction in FIG. 12 .
  • 14 is a side view showing the cooling device from which the heat radiation cover is removed according to Modification 1 of the first embodiment, viewed from the Y direction of FIG. 12.
  • FIG. FIG. 15 is a vertical cross-sectional view showing the cooling device according to Modification 2 of the first embodiment as seen from the Y direction in FIG.
  • FIG. 16 is an explanatory diagram showing a first manufacturing process of a method for manufacturing a cooling device according to Modification 3 of the first embodiment.
  • 17A and 17B are explanatory diagrams showing a second manufacturing process of the cooling device manufacturing method according to Modification 3 of the first embodiment.
  • FIG. 18 is an explanatory diagram showing the dimensional relationship between the first heat radiation fin row, the second heat radiation fin row, and the tool according to Modification 3 of the first embodiment.
  • FIG. 1 is an exploded perspective view showing a cooling device 100 according to the first embodiment.
  • FIG. 2 is a longitudinal sectional view showing the cooling device 100 according to the first embodiment as seen from the X direction in FIG.
  • FIG. 3 is a longitudinal sectional view showing the cooling device 100 according to the first embodiment as seen from the Y direction in FIG.
  • the cooling device 100 dissipates heat from a heat radiating member (cooling member) 1 by circulating a coolant inside.
  • the cooling device 100 is a box.
  • the cooling device 100 includes a heat radiating member 1 , a first heat radiating fin row 21 , a second heat radiating fin row 22 , a heat radiating cover (cooling cover) 3 , and a sealing member 4 .
  • the heat radiating member 1 is used in an in-vehicle power converter, and is used in an environment with large temperature changes.
  • the heat dissipating member 1 is a rectangular plate member and is composed of a substrate portion made of aluminum metal or an aluminum metal alloy, and has a heat dissipating surface 11 formed on the upper surface thereof in a state in which copper or nickel is plated.
  • the first radiating fin row 21 and the second radiating fin row 22 are continuously formed by bending a wire 23 made of metal such as copper metal or copper alloy, which is a linear heat radiating part, into an uneven shape. It is a configuration in which the heat radiation fins 2, which are wire fins, are connected to each other.
  • the first heat radiation fin row 21 and the second heat radiation fin row 22 are arranged on the heat radiation surface 11 of the heat radiation member 1 and integrated.
  • the first radiating fin row 21 and the second radiating fin row 22 extend in the X direction in the cooling device 100 and are arranged in a plurality of rows in the Y direction.
  • the heat dissipation cover 3 is made of an insulating resin material and covers the heat dissipation surface 11 from above.
  • the heat radiation cover 3 is a lid member and is fixed to the top of the heat radiation member 1 with screws (not shown).
  • the heat dissipating cover 3 has a rectangular shape, is formed with a hollow portion that opens downward, and has a top surface portion 31 and four lateral side portions 32 that are connected to the top surface portion 31 .
  • the heat radiation cover 3 is in contact with the second heat radiation fin row 22 entering the hollow portion at the lower surface of the top surface portion 31 .
  • An inflow portion 33 and an outflow portion 34 for the coolant that flows through the cooling device 100 are provided on the pair of side surface portions 32 of the heat radiation cover 3 facing each other.
  • the X direction is the direction orthogonal to the coolant flow direction
  • the Y direction is the coolant flow direction.
  • the sealing member 4 seals the heat radiating member 1 and the heat radiating cover 3 .
  • the seal member 4 is a rectangular ring member that extends along the edge of the heat dissipation surface 11 and surrounds the heat dissipation surface 11 .
  • the seal member 4 is fitted into recesses 321 formed in the lower surfaces of the four side portions 32 of the heat dissipation cover 3 . As a result, the heat radiation surface 11 is sealed by the heat radiation cover 3 and the seal member 4 and cooled by an insulating coolant (not shown) flowing through the cooling device 100 .
  • FIG. 4 is a perspective view showing the cooling device 100 with the heat dissipation cover 3 removed according to the first embodiment.
  • FIG. 5 is a front view showing the cooling device 100 with the heat radiation cover 3 removed according to the first embodiment, viewed from the X direction in FIG.
  • FIG. 6 is a side view showing the cooling device 100 from which the heat dissipation cover 3 according to the first embodiment is removed, viewed from the Y direction in FIG.
  • the first radiating fin row 21 and the second radiating fin row 22 are formed by crimping the linear wires 23 forming the radiating fins 2 to the radiating surface 11. Configuration.
  • the first radiating fin rows 21 and the second radiating fin rows 22 adjacent to the first radiating fin rows 21 are alternately arranged.
  • the first radiating fin row 21 and the second radiating fin row 22 have a first radiating fin connecting portion 211 and a second radiating fin connecting portion 221 that are joints with the heat radiating surface 11 .
  • the contact area of the second heat radiation fin connection portion 221 is larger than that of the first heat radiation fin connection portion 211 .
  • Wires 23 are bent from the heat radiating surface 11 to bridge between the first heat radiating fin connecting portions 211 and the second heat radiating fin connecting portions 221 adjacent to each other in one heat radiating fin row. It has a convex loop that contacts the coolant flowing through it.
  • the first radiating fin row 21 and the second radiating fin row 22 are arranged so that the facing area with respect to the flow of the coolant flowing through the cooling device 100 is larger than the facing area intersecting with the flow of the coolant.
  • the facing area facing the Y direction of the first heat radiation fin row 21 and the second heat radiation fin row 22 is larger than the facing area facing the X direction.
  • FIG. 7 is an explanatory diagram showing the tool 5 according to the first embodiment.
  • the tool 5 has an upper width that is wider than the lower width and is tapered downward, with the upper portion having a horizontal width greater than the lower portion.
  • the tool 5 has a wire feeding section 51 , a high frequency vibration pressing section 52 and a cutting section 53 .
  • the wire feeding portion 51, the high-frequency vibration pressing portion 52, and the cutting portion 53 are arranged in three rows.
  • the wire delivery unit 51 has a delivery port for the metal wire 23, bends the metal wire 23 in an uneven shape, and delivers it continuously.
  • the high-frequency vibration pressing part 52 has a columnar pressing part, and the wire 23 is brought into contact with the heat dissipation surface 11 by high-frequency vibration by the pressing part.
  • the high-frequency vibration pressing part 52 crimps the linear wire 23 forming the heat radiation fins 2 fed from the tool 5 to the heat radiation surface 11 to form the first heat radiation fin row 21 and the second heat radiation fin row 22 .
  • the tool 5 does not have to employ a technique in which the linear wire 23 forming the heat radiating fins 2 sent out from the tool 5 by the high frequency vibration pressing portion 52 is crimped to the heat radiating surface 11 .
  • the tool 5 may be a method of soldering pre-bent fins.
  • the cutting part 53 cuts the metal wire 23 after forming one row of the first radiation fin row 21 or the second radiation fin row 22 .
  • FIG. 8 is a flow chart showing a method for manufacturing the cooling device 100 according to the first embodiment.
  • FIG. 9 is an explanatory diagram showing the first manufacturing process of the method for manufacturing the cooling device 100 according to the first embodiment.
  • FIG. 10 is an explanatory diagram showing the second manufacturing process of the method for manufacturing the cooling device 100 according to the first embodiment.
  • the manufacturing method of the cooling device 100 has a first manufacturing step S1 and a second manufacturing step S2.
  • the first heat radiation fin row 21 among the heat radiation fin rows is arranged at the first heat radiation fin height, which is the height from the heat radiation surface 11. 2111 is formed to be different from the second heat radiation fin height 2211 which is the height of the second heat radiation fin row 22 from the heat radiation surface 11 .
  • the first manufacturing step S1 is performed prior to the second manufacturing step S2. Thus, the first heat radiation fin row 21 is formed before the second heat radiation fin row 22 is formed.
  • the dimension of the first heat radiation fin height 2111 of the first heat radiation fin row 21 to be formed is adjusted so that the upper width is wider than the lower width and the tool 5 tapered downward is brought into contact with the heat radiation surface 11. Then, the upper portion of the tool 5, which is wider than the lower portion in the horizontal direction, does not come into contact with the first heat dissipating fin row 21. As shown in FIG.
  • a second heat radiation fin row 22 which is a heat radiation fin row alternately arranged adjacent to the first heat radiation fin row, is formed.
  • the vibration amount of the high-frequency vibration with respect to the heat radiation surface 11 of the tool 5 is increased compared to the vibration amount of the high-frequency vibration in the case of the first heat radiation fin row 21 .
  • the second heat radiation fin row 22 is formed such that the amount of high-frequency vibration with respect to the heat radiation surface 11 of the tool 5 is higher than that of the first heat radiation fin row 21 . configuration.
  • FIG. 11 is an explanatory diagram showing the dimensional relationship between the first heat radiation fin row 21 and the second heat radiation fin row 22 and the tool 5 according to the first embodiment.
  • the first heat radiation fin row 21 has a first heat radiation fin height 2111, which is the height from the heat radiation surface 11, by the height of the second radiation fin row 22 from the heat radiation surface 11. It is made different from a certain second radiation fin height 2211 .
  • the first heat radiating fin height 2111 is defined by the lower part of the tool 5 in a state where the tool 5 having a downwardly tapered shape whose upper width is wider than the lower width is in contact with the heat radiating surface 11 to form the second heat radiating fin row 22 .
  • the height is such that the upper portion, which has a horizontal width greater than that, does not come into contact with the first radiation fin row 21 .
  • the first heat radiation fin height 2111 is such that the horizontal width of the tool 5 whose tip is in contact with the heat radiation surface 11 of the heat radiation member 1 is equal to the adjacent first radiation fin row 21 sandwiching the second radiation fin row 22 .
  • the height is such that the second radiating fin row 22 can be formed between them without contacting any of the first radiating fin rows 21 .
  • the tool 5 is narrower at the bottom than at the top, which has a horizontal width. Therefore, the adjacent space between the first heat radiation fin row 21 and the second heat radiation fin row 22 is narrowed.
  • the first heat radiation fin row 21 and the second heat radiation fin row 22 are densely arranged on the heat radiation surface 11 of the heat radiation member 1 .
  • FIG. 12 is a perspective view showing the cooling device 100 with the heat dissipation cover 3 removed according to Modification 1 of the first embodiment.
  • FIG. 13 is a front view showing the cooling device 100 from which the heat dissipation cover 3 according to Modification 1 of the first embodiment is removed, as seen from the X direction in FIG. 12 .
  • FIG. 14 is a side view showing the cooling device 100 from which the heat dissipation cover 3 according to Modification 1 of the first embodiment is removed, viewed from the Y direction of FIG. 12 .
  • the first heat radiation fin row 21 and the second heat radiation fin row 22 are staggered and arranged.
  • a convex portion of the second radiation fin row 22 is formed so as to overlap the upper portion of the first radiation fin connecting portion 211 which is a concave portion of the first radiation fin row 21 .
  • the first radiation fin row 21 extends unevenly in the Y direction and is arranged in multiple rows in the X direction.
  • the second radiation fin row 22 extends in the X direction in an irregular shape and is arranged in a plurality of rows in the Y direction.
  • the coolant flows in from the inflow part 33 in the Y direction and flows out from the outflow part 34 on the opposite side.
  • the second radiation fin row 22 which is taller than the first radiation fin row 21, with the facing area expanded in the Y direction, the effective contact area of all the fin rows with respect to the coolant increases, The heat transfer coefficient of the radiation fins 2 is improved. Thereby, the cooling performance of the cooling device 100 can be improved.
  • the first radiating fin height 2111 is such that the upper width is wider than the lower width and the tool 5 tapered downward to form a second radiating fin height 2111 in contact with the radiating surface 11 .
  • the upper portion of the tool 5 having a horizontal width larger than the lower portion has a height such that it does not come into contact with the first heat dissipating fin row 21 when the heat dissipating fin row 22 is formed.
  • the first heat radiation fin height 2111 is the horizontal width of the tool 5 whose tip is in contact with the heat radiation surface 11 of the heat radiation member 1, and is equal to the width of the adjacent first heat radiation fins sandwiching the second heat radiation fin row 22. The height is such that the second radiating fin row 22 can be formed between the rows 21 without contacting any of the first radiating fin rows 21 .
  • the cooling device 100 prevents the first heat radiation fin row 21 and the second heat radiation fin row 22 from interfering with the tool 5.
  • the mounting density of the two radiation fin rows 22 can be increased, and the heat transfer coefficient of the radiation fins 2 can be improved. As a result, the cooling performance of the cooling device 100 can be improved.
  • FIG. 15 is a longitudinal sectional view showing the cooling device 100 according to Modification 2 of the first embodiment as seen from the Y direction in FIG.
  • a protrusion 35 is provided that protrudes downward to match the height of the first heat radiation fins 2111 with the height of the second heat radiation fins 2211 as a reference. ing.
  • the flow velocity of the coolant (not shown) is uniform within the coolant channel in the cooling device 100 .
  • the heat transfer coefficient of the radiation fins 2 is improved, and the cooling performance of the cooling device 100 is improved.
  • FIG. 16 is an explanatory diagram showing the first manufacturing process of the method for manufacturing the cooling device 100 according to Modification 3 of the first embodiment.
  • FIG. 17 is an explanatory diagram showing the second manufacturing process of the method for manufacturing the cooling device 100 according to Modification 3 of the first embodiment.
  • FIG. 18 is an explanatory diagram showing the dimensional relationship between the first heat radiation fin row 21 and the second heat radiation fin row 22 and the tool 5 according to Modification 3 of the first embodiment.
  • the width H2 is sharper and narrower than the width H1 of the first embodiment.
  • the first heat radiation fin row 21 and the second heat radiation fin row 22 are densely arranged by narrowing the adjacent interval K1 to the interval K2 as the upper portion having the horizontal width of the tool 5 is narrower than the lower portion. ing. Therefore, when forming the second radiation fin row 22, the first radiation fin row 21 and the tool 5 do not interfere with each other, and the distance between the first radiation fin row 21 and the second radiation fin row 22 is becomes smaller. As a result, the mounting density of the radiating fins 2 is increased, and the heat transfer coefficient of the radiating fins 2 is improved. As a result, the cooling performance of the cooling device 100 can be improved.
  • the cooling device 100 has heat radiation fins 2 , which are linear heat radiation portions, arranged on a heat radiation surface 11 and has a plurality of radiation fin rows, which are rows of the radiation fins 2 .
  • the first radiating fin row 21 and the second radiating fin row 22 adjacent to the first radiating fin row 21 are alternately arranged.
  • the first heat radiating fin height 2111 is defined by the lower part of the tool 5 in a state where the tool 5 having a downwardly tapered shape whose upper width is wider than the lower width is in contact with the heat radiating surface 11 to form the second heat radiating fin row 22 .
  • the height is such that the upper portion, which has a horizontal width greater than that, does not come into contact with the first radiation fin row 21 .
  • the dimension of the first heat radiation fin height 2111 is such that the upper width is wider than the lower width and the tool 5 tapers downward, and the second heat radiation fin row 22 is formed by contacting the heat radiation surface 11 .
  • the height is set so that the upper portion of the tool 5 having a horizontal width larger than the lower portion does not come into contact with the first radiation fin row 21 .
  • the tool 5 does not come into contact with the first radiation fin row 21 when forming the second radiation fin row 22 . Therefore, the interval between the first heat radiation fin row 21 and the second heat radiation fin row 22 adjacent to each other can be reduced. Therefore, the mounting density of the plurality of heat dissipating fin rows on the heat dissipating surface 11 is sufficiently increased.
  • the first radiating fin row 21 and the second radiating fin row 22 are densely arranged with a narrower spacing between them as the upper part of the tool 5 having a horizontal width is narrower than the lower part.
  • the first heat radiation fin row 21 is formed before the second heat radiation fin row 22 is formed.
  • the tool 5 does not come into contact with the first heat radiation fin row 21 when forming the second heat radiation fin row 22 after forming the first heat radiation fin row 21 . Therefore, the interval between the first heat radiation fin row 21 and the second heat radiation fin row 22 adjacent to each other can be reduced. Therefore, the mounting density of the plurality of heat dissipating fin rows on the heat dissipating surface 11 is sufficiently increased.
  • the first radiating fin row 21 and the second radiating fin row 22 are formed continuously by bending a metal wire 23 in an uneven shape.
  • the first heat radiation fin row 21 and the second heat radiation fin row 22 can be easily formed, and productivity can be improved.
  • the first radiating fin row 21 and the second radiating fin row 22 are formed by pressing against the radiating surface 11 .
  • the first heat radiation fin row 21 and the second heat radiation fin row 22 are brought into contact with the heat radiation surface 11 by vibrating the tool 5 at a high frequency, and a linear wire 23 that forms the heat radiation fins 2 sent out from the tool 5 is attached. It is a structure formed by pressure bonding to the heat dissipation surface 11 .
  • the second heat radiation fin row 22 is formed by increasing the amount of high-frequency vibration with respect to the heat radiation surface 11 of the tool 5 compared to the vibration amount of the high-frequency vibration in the case of the first heat radiation fin row 21. configuration.
  • the compression of the second radiation fin row 22 to the heat radiation surface 11 is stronger than the compression of the first radiation fin row 21 to the radiation surface 11 .
  • the second radiation fin array 22, which is higher than the first radiation fin height 2111 and applies a load to the refrigerant, can be prevented from collapsing.
  • the first heat radiation fin row 21 has a first heat radiation fin connection portion 211 that is a joint portion with the heat radiation surface 11 .
  • the second radiation fin row 22 has a second radiation fin connection portion 221 that is a joint portion with the radiation surface 11 .
  • the contact area of the second heat radiation fin connection portion 221 is larger than that of the first heat radiation fin connection portion 211 .
  • the compression of the second radiation fin row 22 to the heat radiation surface 11 is stronger than the compression of the first radiation fin row 21 to the radiation surface 11 .
  • the second radiation fin array 22, which is higher than the first radiation fin height 2111 and applies a load to the refrigerant, can be prevented from collapsing.
  • the first radiating fin row 21 and the second radiating fin row 22 are staggered and arranged.
  • the heat radiation fin row has an increased effective contact area with respect to the coolant, and the heat transfer coefficient of the heat radiation fins 2 is improved. Thereby, the cooling performance of the cooling device 100 can be improved.
  • the first radiating fin row 21 and the second radiating fin row 22 are arranged such that the facing area with respect to the flow of the coolant flowing through the cooling device 100 is larger than the facing area intersecting with the flow of the coolant.
  • the heat radiation fin row has an increased effective contact area with respect to the coolant, and the heat transfer coefficient of the heat radiation fins 2 is improved. Thereby, the cooling performance of the cooling device 100 can be improved.
  • the cooling device 100 has a heat radiation cover 3 that covers the heat radiation surface 11 from above.
  • the heat radiation cover 3 is in contact with the second heat radiation fin row 22 .
  • the heat transfer rate from the second heat radiation fin row 22 to the heat radiation cover 3 via the contact portion between the second heat radiation fin row 22 and the heat radiation cover 3 is improved.
  • the cooling performance of the cooling device 100 can be improved.
  • the heat radiation fins 2 of the uneven second heat radiation fin array 22 have a tolerance in the height direction
  • the convex loops of the heat radiation fins 2 come into contact with the heat radiation cover 3 and bend, thereby increasing the height. Tolerance in the vertical direction can be absorbed, all the second radiation fin rows 22 can contact the radiation cover 3, and the second radiation fin rows 22 can be dissipated via the contact portion between the second radiation fin rows 22 and the radiation cover 3. to the heat radiation cover 3 can be improved.
  • a protrusion 35 is provided that protrudes downward to match the height of the first heat radiation fins 2111 with the height of the second heat radiation fins 2211 as a reference.
  • the clearance between the first heat radiation fin row 21 and the heat radiation cover 3 can match the clearance between the second heat radiation fin row 22 and the heat radiation cover 3, and the flow velocity of the coolant flowing through the cooling device 100 can be increased. uniformly equal.
  • the amount of heat carried away by the coolant from the first heat radiation fin row 21 and the second heat radiation fin row 22 can be made uniform, and the cooling performance of the cooling device 100 can be improved.
  • the cooling device 100 arranges the heat radiation fins 2 as linear heat radiation portions on the heat radiation surface 11 and includes a plurality of heat radiation fin rows, which are the rows of the heat radiation fins 2 .
  • the first radiating fin row 21 and the second radiating fin row 22 adjacent to the first radiating fin row 21 are alternately arranged.
  • the first radiating fin row 21 and the second radiating fin row 22 are formed by pressure bonding to the radiating surface 11 using high-frequency vibration.
  • the first heat radiation fin row 21 and the second heat radiation fin row 22 are formed by pressing against the heat radiation surface 11 using high-frequency vibration. This eliminates the need for a soldering process when forming the first heat radiation fin row 21 and the second heat radiation fin row 22 . As a result, when forming the second radiation fin row 22 , there is no need for a soldering jig to enter the space between the adjacent first radiation fin rows 21 formed on the heat radiation surface 11 . Therefore, the interval between the first heat radiation fin row 21 and the second heat radiation fin row 22 adjacent to each other can be reduced. Therefore, the mounting density of the plurality of heat dissipating fin rows on the heat dissipating surface 11 is sufficiently increased.
  • the manufacturing method of the cooling device 100 is to arrange the heat radiating fins 2 as linear heat radiating portions on the heat radiating surface 11 and form a plurality of heat radiating fin rows, which are rows of the heat radiating fins 2 .
  • the manufacturing method of the cooling device 100 is such that the first heat radiation fin row 21 of the heat radiation fin rows is placed on the heat radiation surface 11 of the second heat radiation fin row 22 by setting the first heat radiation fin height 2111 which is the height from the heat radiation surface 11 to the heat radiation surface 11 of the second radiation fin row 22 .
  • the manufacturing method of the cooling device 100 includes a second manufacturing step of forming the second heat radiation fin row 22 , which is a heat radiation fin row arranged alternately adjacent to the first heat radiation fin row 21 .
  • the dimension of the first heat radiating fin height 2111 of the first heat radiating fin row 21 to be formed is adjusted so that the upper width is wider than the lower width and the downwardly tapering shape of the tool 5 is in contact with the heat radiating surface 11 .
  • the upper part of the tool 5, which has a horizontal width larger than the lower part, does not come into contact with the first radiating fin row 21 in the state where the second radiating fin row 22 is formed.
  • the dimension of the first radiation fin height 2111 is such that the upper width is wider than the lower width and the tool 5 is tapered downward, and the second radiation fin array 22 is formed by contacting the heat radiation surface 11 .
  • the height is set so that the upper portion of the tool 5 having a horizontal width larger than the lower portion does not come into contact with the first radiation fin row 21 .
  • the tool 5 does not come into contact with the first radiation fin row 21 on the heat radiation surface 11 when forming the second radiation fin row 22 . Therefore, the interval between the first heat radiation fin row 21 and the second heat radiation fin row 22 adjacent to each other can be reduced. Therefore, the mounting density of the plurality of heat dissipating fin rows on the heat dissipating surface 11 is sufficiently increased.
  • the first manufacturing step is performed before the second manufacturing step.
  • the tool 5 does not come into contact with the first heat radiation fin row 21 when forming the second heat radiation fin row 22 after forming the first heat radiation fin row 21 . Therefore, the interval between the first heat radiation fin row 21 and the second heat radiation fin row 22 adjacent to each other can be reduced. Therefore, the mounting density of the plurality of heat dissipating fin rows on the heat dissipating surface 11 is sufficiently increased.

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  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention concerne un dispositif de refroidissement dans lequel une première rangée d'ailettes de dissipation de chaleur (21) et une seconde rangée d'ailettes de dissipation de chaleur (22) sont disposées en alternance. Une première hauteur d'ailette de dissipation de chaleur (2111) est différente d'une seconde hauteur d'ailette de dissipation de chaleur (2211). La première hauteur d'ailette de dissipation de chaleur (2111) est une hauteur telle que, dans un état où un outil (5) ayant une forme effilée vers le bas est en contact avec une surface de dissipation de chaleur (11) pour former la seconde rangée d'ailettes de dissipation de chaleur (22), une partie supérieure de l'outil (5) dont la largeur horizontale est supérieure à celle de sa partie inférieure n'entre pas en contact avec la première rangée d'ailettes de dissipation de chaleur (21).
PCT/JP2022/032071 2021-10-20 2022-08-25 Dispositif de refroidissement et son procédé de fabrication WO2023067894A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-171495 2021-10-20
JP2021171495A JP2023061539A (ja) 2021-10-20 2021-10-20 冷却装置及び冷却装置の製造方法

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JP2008098432A (ja) * 2006-10-12 2008-04-24 Fujitsu Ltd 電子部品の放熱装置
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