WO2023067700A1 - Procédé de serrage de substrat, appareil de travail et système de travail - Google Patents

Procédé de serrage de substrat, appareil de travail et système de travail Download PDF

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Publication number
WO2023067700A1
WO2023067700A1 PCT/JP2021/038637 JP2021038637W WO2023067700A1 WO 2023067700 A1 WO2023067700 A1 WO 2023067700A1 JP 2021038637 W JP2021038637 W JP 2021038637W WO 2023067700 A1 WO2023067700 A1 WO 2023067700A1
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Prior art keywords
substrate
detection sensor
detection state
state
board
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PCT/JP2021/038637
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English (en)
Japanese (ja)
Inventor
太郎 伊藤
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株式会社Fuji
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Application filed by 株式会社Fuji filed Critical 株式会社Fuji
Priority to PCT/JP2021/038637 priority Critical patent/WO2023067700A1/fr
Publication of WO2023067700A1 publication Critical patent/WO2023067700A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • This specification discloses a substrate clamping method, a working device, and a working system.
  • a substrate clamping method in which a substrate is sandwiched and clamped between a movable member used in a working device and a substrate holding member positioned at a predetermined position, and a waiting time occurs along with the movement of the movable member.
  • a movable member used in a working device and a substrate holding member positioned at a predetermined position, and a waiting time occurs along with the movement of the movable member.
  • the movable member is made to stand by in advance at an interference avoidance position near the substrate, which is a position where the movable member and components mounted on the back surface of the substrate do not interfere, and the substrate is positioned at the substrate fixing position.
  • a substrate clamping method is disclosed in which a movable member is moved when the substrate is transported, and the substrate is clamped and fixed between the movable member and the substrate holding member.
  • Patent Document 1 does not consider the case where an abnormality or the like occurs in the working device and the operation is stopped.
  • the board support member may be retracted to a position that does not interfere with the work so that the operator can check the state inside the working device.
  • the main purpose of the present disclosure is to shorten the waiting time caused by the movement of the movable member when the working device resumes its operation after stopping its operation.
  • a first substrate clamping method of the present disclosure comprises: A substrate detection sensor for detecting a substrate is provided at least one of an entrance portion, an exit portion, and between the entrance portion and the exit portion of a substrate transport path of the work device, and the work device returns from a state in which operation is stopped. case, if the substrate detection sensor is in a detection state in which the substrate is detected at the time of return, the substrate is conveyed in the first direction until the substrate detection sensor enters a non-detection state in which the substrate is not detected, and the substrate detection is performed.
  • a substrate clamping method for clamping by pressing the substrate against a fixed member with a movable member If the substrate detection sensor is in the detection state at the time of the return, the movable member is moved from a predetermined position to a standby position before coming into contact with the substrate and stands by; The gist is that when the substrate is conveyed to the clamping position by the substrate conveying device, the movable member is brought into contact with the substrate and pressed against the fixed member.
  • the waiting time can be shortened compared to the case where the substrate is clamped after it has been conveyed to the clamping position.
  • a second substrate clamping method of the present disclosure comprises: A board detection sensor for detecting a board is provided at an entrance or an exit of a board transport path of the working device, and when the working device returns from a state in which its operation is stopped, the board detection sensor detects the board at the time of returning. If the non-detection state is not detected, the substrate is conveyed in the first direction until the substrate detection sensor changes to the detection state for detecting the substrate, and the substrate detection sensor changes from the non-detection state to the detection state. is used in a substrate transport apparatus for transporting the substrate to a clamping position in a second direction opposite to the first direction, and the substrate transported to the clamping position is pressed against a fixed member by a movable member.
  • a method of clamping a substrate to be clamped comprising: When the substrate detection sensor is in the non-detection state at the time of the return and then changes to the detection state, the movable member is moved from a predetermined position to a standby position before coming into contact with the substrate. and wait The gist is that when the substrate is conveyed to the clamping position by the substrate conveying device, the movable member is brought into contact with the substrate and pressed against the fixed member.
  • the movable member when the substrate detection sensor is in the non-detection state at the time of return and then changes to the detection state, the movable member is moved from the predetermined position to the standby position before coming into contact with the substrate. and wait. Therefore, the waiting time can be shortened compared to the case where the substrate is clamped after it has been conveyed to the clamping position.
  • a third substrate clamping method of the present disclosure comprises: A first substrate detection sensor for detecting a substrate is provided at an entrance or an exit of a substrate carrying-in path of the working device, and a second substrate detection sensor is provided between the entrance and the exit for detecting the substrate, When the device recovers from a state in which the operation is stopped, if the first substrate detection sensor and the second substrate detection sensor are in a non-detection state in which the substrate is not detected at the time of recovery, the first substrate detection sensor is in the non-detection state.
  • the substrate is conveyed in the first direction until the detection state changes to the detection state for detecting the substrate, and the substrate is moved to the clamp position based on the change of the first substrate detection sensor from the non-detection state to the detection state. If the second substrate detection sensor detects the substrate at the time of returning, the second substrate detection sensor does not detect the substrate.
  • the substrate is transported in the first direction until it reaches a non-detection state, and the substrate is transported to the clamp position in the second direction based on the change of the second substrate detection sensor from the detection state to the non-detection state.
  • a substrate clamping method for use in a substrate transport apparatus that transports a substrate to a substrate, wherein the substrate transported to the clamping position is clamped by pressing the substrate against a fixed member using a movable member,
  • the first substrate detection sensor and the second substrate detection sensor are in the non-detection state at the time of the return, and then the first substrate detection sensor changes from the non-detection state to the detection state, or at the time of the return.
  • the movable member when the second substrate detection sensor is in the detection state, the movable member is moved from a predetermined position to a standby position before coming into contact with the substrate and stands by;
  • the gist is that when the substrate is conveyed to the clamping position by the substrate conveying device, the movable member is brought into contact with the substrate and pressed against the fixed member.
  • this third substrate clamping method when the first substrate detection sensor and the second substrate detection sensor are in the non-detection state at the time of recovery, and then the first substrate detection sensor changes from the non-detection state to the detection state, or at the time of recovery
  • the second substrate detection sensor is in the detection state, the movable member is moved from a predetermined position to a standby position before coming into contact with the substrate and stands by. Therefore, the waiting time can be shortened compared to the case where the substrate is clamped after it has been moved to the clamping position.
  • the working device and working system of the present disclosure also have the same effect as the first substrate clamping method of the present disclosure.
  • FIG. 1 is a schematic configuration diagram of a component mounter 10 of this embodiment
  • FIG. 2 is a schematic configuration diagram of a substrate transfer device 20 and a clamp device 30
  • FIG. 8 is an explanatory diagram of a first substrate detection sensor 81
  • FIG. 8 is an explanatory diagram of a second substrate detection sensor 82
  • FIG. 3 is a block diagram showing electrical connections of the control device 70.
  • FIG. 4 is a flow chart showing an example of a return processing routine
  • 4 is a flow chart showing an example of a return processing routine
  • FIG. 5 is an explanatory diagram showing the operation of each member at the time of return
  • FIG. 5 is an explanatory diagram showing the operation of each member at the time of return;
  • FIG. 5 is an explanatory diagram showing the operation of each member at the time of return;
  • FIG. 5 is an explanatory diagram showing the operation of each member at the time of return;
  • FIG. 5 is an explanatory diagram showing the operation of each member at the time of return;
  • FIG. 5 is an explanatory diagram showing the operation of each member at the time of return;
  • FIG. 5 is an explanatory diagram showing the operation of each member at the time of return;
  • FIG. 5 is an explanatory diagram showing the operation of each member at the time of return;
  • FIG. 5 is an explanatory diagram showing the operation of each member at the time of return;
  • FIG. 5 is an explanatory diagram showing the operation of each member at the time of return;
  • FIG. 5 is an explanatory diagram showing the operation of each member at the time of return;
  • FIG. 5 is an explanatory diagram showing the operation of each member at the time of return;
  • FIG. 5 is an explanatory diagram showing the operation of each member at the time of return;
  • FIG. 5 is an explanatory diagram showing the operation of each member at the time of return;
  • FIG. 5 is an explanatory diagram showing the operation of each member at the time of return;
  • FIG. 5 is an explanatory diagram showing the operation of each member at the time of return;
  • FIG. 5 is an explanatory diagram showing the operation of each member at the time of return;
  • FIG. 5 is an explanatory diagram showing the operation of each member at the time of return;
  • FIG. 5 is an explanatory diagram showing the operation of each member at the time of return;
  • 4 is a time chart showing the operation state of each member at the time of return;
  • 4 is a time chart showing the operation state of each member at the time of return;
  • 4 is a time chart showing the operation state of each member at the time of return;
  • 4 is a time chart showing the operation state of each member at the time of return;
  • 4 is a time chart showing the operation state of each member at the time of return;
  • 4 is a time chart showing the operation state of each member at the time of return;
  • 4 is a time chart showing the operation state of each member at the time of return;
  • FIG. 1 is a schematic configuration diagram of a component mounter 10 of this embodiment.
  • FIG. 2 is a schematic configuration diagram of the substrate transfer device 20 and the clamping device 30.
  • FIG. 3A and 3B are explanatory diagrams of the first substrate detection sensor 81 and the second substrate detection sensor 82.
  • FIG. FIG. 4 is a block diagram showing electrical connections of the control device 70.
  • FIG. 1 and 2 is the X-axis direction (in FIG. 3, the direction perpendicular to the paper surface is the X-axis direction), and the front (front) and rear (back) directions in FIGS. 3, the horizontal direction is the Y-axis direction), and the vertical direction in FIGS. 1 to 3 is the Z-axis direction. Note that FIG.
  • FIG. 3A is a view showing a cross section taken along a plane parallel to the YZ plane passing through the first substrate detection sensor 81 .
  • FIG. 3B is a diagram showing a cross section taken along a plane parallel to the YZ plane passing through the second substrate detection sensor 82 .
  • the component mounter 10 includes a component supply device 16 that supplies components, a substrate transfer device 20 that transfers a substrate S, a clamp device 30 that clamps the substrate S, and a suction nozzle 51 that picks up components.
  • a head 50 that is sucked and mounted on the substrate S, an XY robot 40 that moves the head 50 in the XY directions, a first substrate detection sensor 81 (see FIG. 3), and a second substrate detection sensor 82 (see FIG. 3). and a control device 70 (see FIG. 4) that controls the entire mounter.
  • the component supply device 16 , substrate transfer device 20 and clamping device 30 are installed on a support base 14 provided in the middle portion of the housing 12 .
  • the component mounter 10 also has a mark camera 56 for capturing an image of a reference mark attached to the board S, and a parts camera 58 for capturing an image of the suction posture of the component that is sucked by the suction nozzle 51. etc. are also provided.
  • the mark camera 56 is installed on the head 50 and the X-axis slider 42 of the XY robot 40 to be described later so as to be movable in the XY directions by the XY robot 40 .
  • the component supply device 16 is, for example, a tape feeder that supplies components by pulling out a carrier tape in which components are stored at predetermined intervals from a reel and sending it out to a component supply position.
  • the substrate conveying device 20 has a substrate conveying path extending in the left-right direction (X-axis direction), and is a conveying device for conveying the substrate S.
  • a conveying device for conveying the substrate S.
  • the substrate transfer device 20 includes a pair of side frames 22 arranged at a predetermined interval in the Y-axis direction, conveyor belts 24 provided on each of the pair of side frames 22, and the conveyor belts 24 driven to circulate. and a belt drive device 26 (see FIG. 4).
  • Each of the pair of side frames 22 is supported by two support columns 21 arranged in the X-axis direction.
  • the lower ends of the two support columns 21 that support one of the pair of side frames 22 are connected to guide rails 27 provided on the support base 14 along the Y-axis direction.
  • a slider 28 is mounted which is movable thereon.
  • the substrate transfer device 20 can transfer substrates S of different sizes by moving two support columns 21 to adjust the distance between the pair of side frames 22 .
  • the belt driving device 26 has, for example, a stepping motor that can be driven in both forward and reverse directions.
  • the substrate conveying device 20 moves the substrate S from the downstream side of the substrate conveying path to the upstream side (reverse direction, first direction) by rotating the conveyor belt 24 in the reverse rotation direction by driving the belt driving device 26 in the reverse rotation direction.
  • the substrate conveying device 20 moves the substrate S from the upstream side of the substrate conveying path to the downstream side (forward direction, second direction).
  • the belt driving device 26 includes a stepping motor and may be out of step when a large load is applied, a certain waiting time is set when switching the rotation direction. Therefore, in the substrate transfer device 20, a waiting time occurs when switching the transfer direction of the substrate S between the forward direction and the reverse direction.
  • the clamping device 30 is a substrate holding device that sandwiches and holds the edge of the substrate S between two members (substrate holding plate 32 and clamper 34).
  • the clamping device 30 includes a pair of substrate holding plates 32 (fixed members) provided on the upper ends of a pair of side frames 22, a pair of clampers 34 (movable members), and a motor 38 (see FIG. 4).
  • a lifting device 36 for lifting and lowering the pair of clampers 34 via the support plate 35 is provided.
  • the support plate 35 is provided with a plurality of support pins for supporting the back surface of the substrate S when the substrate S is clamped. Therefore, the substrate S is clamped by the clamping device 30 and simultaneously supported by the support pins.
  • the clamper 34 has a projecting portion 34a projecting downward from the lower end surface thereof.
  • the upper surface of the support plate 35 comes into contact with the projecting portion 34a and is pushed up. ing.
  • the substrate S is transported by rotating the conveyor belt 24 while being placed on the conveyor belt 24 (see FIG. 2). Further, when the clamper 34 is lifted while the substrate S transported to the predetermined clamping position by the substrate transporting device 20 is placed on the conveyor belt 24 , the clamper 34 pushes the substrate S up to the substrate holding plate 32 . be pushed. As a result, the substrate S is sandwiched and clamped between the clamper 34 and the substrate holding plate 32 .
  • the head 50 includes a Z-axis actuator 52 that moves the suction nozzle 51 vertically (Z-axis), and a ⁇ -axis actuator 54 that rotates the suction nozzle 51 around the Z-axis.
  • the suction port of the suction nozzle 51 selectively communicates with either one of the vacuum pump 62 and the air pipe 64 via the electromagnetic valve 60 .
  • the solenoid valve 60 By driving the solenoid valve 60 so that the suction port communicates with the vacuum pump 62 , the suction nozzle 51 can apply negative pressure to the suction port to suck the component, and the suction port communicates with the air pipe 64 .
  • the electromagnetic valve 60 positive pressure can be applied to the suction port to release the suction of the component.
  • the XY robot 40 as shown in FIG. an X-axis guide rail 41 provided along the left-right (X-axis) direction on the lower surface of the Y-axis slider 44; and an X-axis slider 42 movable along the X-axis guide rail 41.
  • the head 50 is attached to the X-axis slider 42 and can be moved to any position on the XY plane by the XY robot 40 .
  • the X-axis slider 42 is driven by an X-axis actuator 46 (see FIG. 4), and the Y-axis slider 44 is driven by a Y-axis actuator 48 (see FIG. 4).
  • the first board detection sensor 81 is provided at the entrance of the board transport path (board transport device 20) of the component mounter 10, as shown in FIG. 3A.
  • the first substrate detection sensor 81 is, for example, a transmissive optical sensor that includes a light projecting portion 81a and a light receiving portion 81b that are provided at opposing positions across the substrate transport path.
  • the light projecting portion 81a is provided on one inner surface of the side frame 22 facing each other.
  • the light receiving portion 81 b is provided on the other inner surface of the pair of side frames 22 .
  • the first substrate detection sensor 81 may be a reflective optical sensor.
  • the first substrate detection sensor 81 If there is something (for example, a substrate S) between the light projecting part 81a and the light receiving part 81b that blocks the light from the light projecting part 81a and the light receiving part 81b does not receive the light from the light projecting part 81a , the first substrate detection sensor 81 outputs a signal indicating that the substrate S is detected to the control device 70 (see FIG. 4).
  • the first substrate The detection sensor 81 outputs to the control device 70 a signal indicating a non-detection state in which the substrate S is not detected.
  • the second board detection sensor 82 is provided between the entrance part and the exit part (central part) of the board transport path (board transport device 20) of the component mounter 10.
  • the second substrate detection sensor 82 is, for example, a transmissive optical sensor that includes a light projecting portion 82a and a light receiving portion 82b that are opposed to each other with the substrate transport path interposed therebetween.
  • the light projecting portion 82a is provided on one inner surface of the pair of side frames 22 facing each other.
  • the light receiving portion 82b is provided on the other inner surface of the pair of side frames 22.
  • the second substrate detection sensor 82 may be a reflective optical sensor.
  • the two-board detection sensor 82 outputs a signal indicating that the board S has been detected to the control device 70 (see FIG. 4).
  • the second substrate The detection sensor 82 outputs a signal to the controller 70 indicating that it is in a non-detection state in which the substrate S is not detected.
  • the control device 70 includes a CPU 71, a ROM 72, a storage 73 (eg, HDD or SSD), a RAM 74, and an input/output interface 75, as shown in FIG. These are electrically connected via a bus 76 .
  • the control device 70 includes an elevation position sensor 37 that detects the elevation position of the clamper 34 (clamper position), an X-axis position sensor 47 that detects the position of the X-axis slider 42, and a Y-axis sensor that detects the position of the Y-axis slider 44.
  • various signals from the detection sensor 82 and the like are input via the input/output interface 75 .
  • the component supply device 16 the belt drive device 26, the lifting device 36 (driving circuit for driving the motor 38), the X-axis actuator 46, the Y-axis actuator 48, the Z-axis actuator 52, the ⁇ -axis actuator 54, various control signals to the electromagnetic valve 60 and the like are output via the input/output interface 75.
  • the mounting operation routine is stored in the storage 73 and is started after the worker inputs a mounting start instruction.
  • the CPU 71 controls the board transfer device 20 to load the board S.
  • the CPU 71 controls the clamp device 30 to clamp the substrate S.
  • the CPU 71 causes the suction nozzle 51 of the head 50 to pick up the component supplied from the component supply device 16 .
  • the CPU 71 controls the X-axis actuator 46 and the Y-axis actuator 48 to move the suction nozzle 51 directly above the component pickup position of the desired component.
  • the CPU 71 controls the Z-axis actuator 52 and the electromagnetic valve 60 to lower the suction nozzle 51 and apply negative pressure to the suction port of the suction nozzle 51 .
  • the desired component is sucked by the suction nozzle 51 .
  • the CPU 71 raises the suction nozzle 51 and controls the X-axis actuator 46 and the Y-axis actuator 48 to move the suction nozzle 51 , which has picked up the component at its tip, above the target mounting position of the board S.
  • the CPU 71 controls the Z-axis actuator 52 and the electromagnetic valve 60 to lower the suction nozzle 51 and apply positive pressure to the suction port of the suction nozzle 51 to release the suction of the component. .
  • the component sucked by the suction nozzle 51 is separated and mounted on the substrate S at a predetermined position.
  • Other components to be mounted on the board S are also mounted on the board S in the same manner, and when all the components have been mounted, the CPU 71 performs a component presence/absence inspection. Then, the CPU 71 controls the substrate transfer device 20 to send out the substrate S to the downstream side.
  • the mounter 10 when the mounter 10 is performing the above-described component mounting process, if an abnormality occurs such as the component sucked by the suction nozzle 51 dropping, the operator asks the mounter 10 to Describe the work to be done.
  • the CPU 71 controls various members to stop the operation of the mounter 10 and controls an alarm device (not shown) to inform the operator that an abnormality has occurred in the mounter 10. I will notify you.
  • the operator who notices the notification inputs a clamp release instruction to the control device 70 .
  • the CPU 71 controls the clamping device 30 to release the clamping of the substrate S and retract the clamper 34 and the support plate 35 to a position where they do not interfere with the work performed by the operator.
  • the operator checks the internal state of the substrate transfer apparatus 20, performs necessary work (work to remove the dropped parts, maintenance work, etc.), and then performs predetermined restoration work to restore the operation. , inputs a return request to the control device 70 .
  • FIG. 5 and 6 are flowcharts showing an example of a return processing routine.
  • 7 and 10 are explanatory views showing the operation of each member when the second board detection sensor 82 is in the detection state at the time of return, respectively, and the operation of each member when the second board detection sensor 82 is in the detection state at the time of return.
  • FIGS. 9 and 12 are explanatory diagrams showing the operation of each member when the second substrate detection sensor 82 is in the non-detection state at the time of return and the first substrate detection sensor 81 is changed to the detection state after that.
  • 4 is a time chart showing the operation state of each member when the second board detection sensor 82 is in the non-detection state at the time and then the first board detection sensor 81 changes to the detection state;
  • the return processing routine is stored in the storage 73 and executed when the component mounter 10 returns from a stopped state. Note that the return time is the timing at which the worker inputs a return request.
  • the CPU 71 determines whether or not a signal indicating the detection state is input from the second board detection sensor 82 (S100). If the substrate S blocks the light from the light projecting part 82a of the second substrate detection sensor 82 as shown in FIG. A signal is input and an affirmative judgment is made. As shown in FIGS. 8A and 9A, if the substrate S does not block the light from the light projecting part 82a of the second substrate detection sensor 82, the CPU 71 is in a non-detection state in which the second substrate detection sensor 82 does not detect the substrate S. A signal to the effect that it is is input, and a negative determination is made.
  • the CPU 71 starts moving the clamper 34 as shown in FIG. 7B (S110).
  • the movement processing of the clamper 34 is executed, for example, as follows. That is, first, the CPU 71 detects the current position of the clamper 34 using the elevation position sensor 37 . Then, the CPU 71 drives and controls the motor 38 of the lifting device 36 by position control so that the clamper 34 is lifted. Position control is performed by driving and controlling the motor 38 by feedback control (PI control or the like) based on the deviation between the clamper 34 detected by the elevation position sensor 37 and the standby position so that the position of the clamper 34 matches the standby position.
  • the standby position is set at a position before the clamper 34 comes into contact with the substrate S. As shown in FIG. Therefore, it takes a certain amount of time for the clamper 34 to reach the standby position after it starts to rise.
  • the CPU 71 executes a backward transport process (S120). Specifically, the CPU 71 drives and controls the belt driving device 26 so that the belt driving device 26 is driven in the reverse rotation direction, and rotates the conveyor belt 24 in the reverse rotation direction to transport the substrate S in the reverse direction.
  • the CPU 71 waits until a signal indicating that the substrate S has been transported in the reverse direction and the second substrate detection sensor 82 has entered a non-detection state (S130). Subsequently, the CPU 71 detects the position of the substrate S with respect to the substrate transfer device 20 based on the signal indicating that the second substrate detection sensor 82 has entered the non-detection state (S135). After S135, the CPU 71 proceeds to S230.
  • the CPU 71 determines whether or not a signal indicating the detection state has been input from the first board detection sensor 81 (S140). If the substrate S blocks the light from the light projecting part 81a of the first substrate detection sensor 81 as shown in FIG. A signal is input and an affirmative judgment is made. On the other hand, if the substrate S does not block the light from the light projecting part 81a of the first substrate detection sensor 81 as shown in FIG. A signal to the effect that it is is input, and a negative determination is made.
  • the CPU 71 If an affirmative determination is made in S140, the CPU 71 starts moving the clamper 34 as shown in FIG. 8B (S150). Next, the CPU 71 executes a backward transport process for the substrate S (S160). The clamper 34 moving process and reverse conveying process have already been described. Next, as shown in FIG. 8C, the CPU 71 waits until a signal indicating that the substrate S has been transported in the reverse direction and the first substrate detection sensor 81 has entered the non-detection state (S170). Subsequently, the CPU 71 detects the position of the substrate S with respect to the substrate transfer device 20 based on the signal indicating that the first substrate detection sensor 81 has entered the non-detection state (S175). After S175, the CPU 71 proceeds to S230.
  • the CPU 71 executes reverse transport processing as shown in FIG. 9B (S180). The backward conveying process has already been explained.
  • the CPU 71 determines whether or not a signal indicating that the first board detection sensor 81 is in the detection state is input from the first board detection sensor 81 (S190).
  • the CPU 71 executes processing similar to that of S140.
  • the CPU 71 determines whether or not a predetermined time has passed since the process of S180 was started (S200). If a negative determination is made in S200, the CPU 71 returns to S190 again. On the other hand, if an affirmative determination is made in S200, the CPU 71 determines that there is no substrate S in the substrate conveying device 20 (S205), and stops driving the belt driving device 26 (S210).
  • FIG. 9B when the substrate S is transported in the reverse direction and a signal is input from the first substrate detection sensor 81 to the effect that it is in the detection state, an affirmative determination is made in S190, and the process proceeds to FIG. 9C.
  • the CPU 71 starts moving the clamper 34 (S220). The movement processing of the clamper 34 is as already explained. Subsequently, the CPU 71 detects the position of the substrate S with respect to the substrate transfer device 20 based on the signal indicating that the detection state has been entered from the first substrate detection sensor 81 (S225). After S135, after S175, or after S225, the CPU 71 executes processing for switching the conveying direction of the belt driving device 26 (S230).
  • the CPU 71 drives and controls the belt driving device 26 so that the driving direction of the belt driving device 26 is switched from the reverse rotation direction to the forward rotation direction, thereby changing the transport direction of the substrate transport device 20 from the reverse direction to the forward direction. switch. As described above, a certain waiting time is required to switch the transport direction.
  • the CPU 71 executes forward transport processing as shown in FIGS. 7D, 8D, and 9C (S240). Specifically, the CPU 71 drives and controls the belt driving device 26 so that the belt driving device 26 drives in the forward rotation direction, and rotates the conveyor belt 24 in the forward rotation direction to convey the substrate S in the forward direction. Subsequently, the CPU 71 waits until the substrate S reaches the clamp position (S250). Specifically, the CPU 71 waits for the substrate S to be transported in the forward direction by a predetermined transport amount. Here, the transport amount is determined based on the size information of the substrate S. As shown in FIG.
  • the movement time from the start of movement processing of the clamper 34 to the arrival of the clamper 34 at the standby position is determined by the CPU 71 in S230 to change the transport direction of the substrate transport device 20. This time is longer than the transport time from when the reverse direction is switched to the forward direction until the substrate S is transported to the clamp position. Further, the movement time of the clamper 34 is shorter than the sum of the waiting time required for switching the transfer direction from the reverse direction to the forward direction in the substrate transfer device 20 and the transfer time of the substrate S. 10A, 11A, and 12A (timing of S110, S150 or S220), the clamper 34 reaches the standby position before the substrate S reaches the clamp position. do.
  • the CPU 71 moves up and down so that the clamper 34 waits at the standby position as shown in FIGS. 7D, 8D, and 9C. It drives and controls the motor 38 of the device 36 .
  • the clamper reaches the standby position before the substrate S reaches the clamp position. Therefore, in the mounter 10, waiting time due to movement of the clamper 34 as shown in FIGS. 10B, 11B, and 12B does not occur.
  • the CPU 71 executes the clamping process of the substrate S as shown in FIGS. 7E, 8E, and 9D. Specifically, the CPU 71 drives and controls the motor 38 of the lifting device 36 by torque control so that the clamper 34 presses and clamps the substrate S against the substrate pressing plate 32 . Torque control is performed by feedback control based on current from a current sensor (not shown) provided in the drive circuit so that a predetermined target current is applied to the motor 38 . After confirming that the clamping position of the clamper 34 detected by the elevation position sensor 37 has not changed for a certain period of time, the CPU 71 completes the clamping process. After S210 or after S260, the CPU 71 terminates this routine.
  • the component mounter 10 of the present embodiment corresponds to the working device of the present disclosure
  • the substrate transfer device 20 corresponds to the substrate transfer device of the present disclosure
  • the clamp device 30 corresponds to the clamp device
  • the substrate pressing plate 32 corresponds to the
  • the clamper 34 corresponds to the movable member
  • the first board detection sensor 81 corresponds to the first board detection sensor
  • the second board detection sensor 82 corresponds to the second board detection sensor
  • the controller 70 corresponds to the transport control section and the clamp control section.
  • the first board detection sensor 81 and the second board detection sensor 82 are in the non-detection state at the time of recovery, the first board detection sensor 81 changes from the non-detection state to the detection state or returns.
  • the clamp device 30 is controlled to move the clamper 34 to the standby position before contacting the substrate S and wait. Therefore, compared with the case where the substrate S is clamped after the substrate S is moved to the clamping position, the waiting time for movement of the clamper 34 can be shortened.
  • the substrate conveying device 20 can convey the substrate in the forward and reverse directions by means of the belt driving device 26 which can be driven in both forward and reverse directions.
  • a waiting time occurs in switching between the The movement time required for the clamper 34 to move from the predetermined position to the standby position is longer than the transport time required for the substrate S to be transported to the clamping position after the transport direction of the substrate S is switched from the reverse direction to the forward direction. is shorter than the sum of the waiting time until switching from the reverse direction to the forward direction and the transport time. Therefore, no waiting time occurs due to movement of the clamper 34 .
  • the first board detection sensor is provided at the entrance of the board transport path in the component mounter 10 .
  • the first board detection sensor 81 may be provided at the exit of the board transport path in the component mounter 10 .
  • forward transport processing may be executed instead of reverse transport processing.
  • a negative determination is made in S100 and an affirmative determination is made in S140, and when the process proceeds to S230 through S150 to S175, or a negative determination is made in S100 and S140, the process proceeds to S230 through S180, S190, S220 and S225.
  • the conveying direction may be switched from the forward direction to the reverse direction in S230.
  • the component mounter 10 has two board detection sensors, the first board detection sensor 81 and the second board detection sensor 82 .
  • the component mounter 10 may have one substrate detection sensor at the entrance, exit, and therebetween (central portion) of the substrate conveying path.
  • the CPU 71 determines whether or not the board detection sensor is in the detection state at the time of recovery. Therefore, if the substrate detection sensor is in the detection state, the CPU 71 starts moving processing of the clamper 34, executes the reverse conveying processing until the substrate detection sensor is in the non-detection state, and then returns in the above-described embodiment.
  • Processing similar to S230 to S260 of the processing routine is executed.
  • the CPU 71 terminates the return processing.
  • the CPU 71 determines whether the board detection sensor is in the detection state at the time of return. Therefore, if the substrate detection sensor is in the detection state, the CPU 71 starts moving processing of the clamper 34, executes the reverse conveying processing until the substrate detection sensor is in the non-detection state, and then returns in the above-described embodiment. Processing similar to S230 to S260 of the processing routine is executed.
  • the CPU 71 executes the reverse transport processing to detect the substrate, then starts the movement processing of the clamper 34, and performs the return processing routine in the above-described embodiment. The same processing as S230 to S260 of is executed. Furthermore, in the modified example of the mounter 10 in which the board detection sensor is provided at the exit of the board transport path, in the return process, the CPU 71 determines whether or not the board detection sensor is in the detection state at the time of return.
  • the CPU 71 starts moving the clamper 34, executes the forward transport processing until the substrate detection sensor is in the non-detection state, detects the substrate, and then moves the substrate.
  • the transport direction of the transport device 20 is switched from the forward direction to the reverse direction, the backward transport processing of the substrate S is executed, and the same processing as S250 and S260 of the return processing routine in the above-described embodiment is executed.
  • the CPU 71 executes the forward transfer process, and when detecting the substrate, starts the movement process of the clamper 34 and moves the transfer direction of the substrate transfer device 20 forward.
  • the substrate S is reversely conveyed, and the same processing as S250 and S260 of the return processing routine in the above-described embodiment is executed.
  • the clamper 34 is moved to a predetermined position when the board detection sensor is in the detection state at the time of recovery or when the board detection sensor is in the non-detection state at the time of recovery and then changes to the detection state. to the target position and wait. Therefore, the waiting time can be shortened compared to the case where the substrate is clamped after it has been conveyed to the clamping position.
  • a substrate detection sensor is provided at the entrance or the exit of the substrate transporting path. If the substrate S is relatively small, it is preferable that the substrate detection sensor be provided in the central portion.
  • the component mounter 10 has been described, but a clamping method for the board S may be used, for example.
  • the board transfer device 20 is incorporated in the component mounter 10, but the board transfer device 20 may be provided separately from the component mounter.
  • the component mounter 10 described in the above embodiment may be used as a component mounting system including the component mounter and the board transfer device 20 .
  • the working apparatus of the present disclosure is described as the component mounter 10, but it may be a printing apparatus that prints solder on the board S. FIG. It should be noted that these points are the same for the modified examples described above.
  • the CPU 71 executed the backward transport processing of the substrate S in S120, S160 or S180.
  • the CPU 71 may execute the forward transport process instead of the reverse transport process.
  • it may be determined whether or not the second board detection sensor 82 is in the detection state, and if a negative determination is made, the process proceeds to S200, and if an affirmative determination is made, the process proceeds to S220.
  • the CPU 71 switches the transport direction of the substrate S from the forward direction to the reverse direction in the transport direction switching process executed in S230, and instead of the forward transport process of the substrate S executed in S240, The reverse conveying process of S may be executed.
  • the present disclosure can be used in the manufacturing industry of component mounters.

Abstract

Un procédé de serrage de substrat selon la présente divulgation est utilisé pour un appareil de transport de substrat comprenant un capteur de détection de substrat pour détecter un substrat, dans lequel, lorsqu'un appareil de travail revient d'un état d'arrêt d'opération : si le capteur de détection de substrat est dans un état de détection au moment du retour, le substrat est transporté dans une première direction jusqu'à ce qu'un état de non-détection soit atteint, et le substrat est transporté dans une seconde direction vers une position de serrage sur la base du capteur de détection de substrat ayant changé de l'état de détection à l'état de non-détection ; si le capteur de détection de substrat est dans l'état de non-détection au moment du retour, le substrat est transporté dans la première direction jusqu'à ce que l'état change à l'état de détection, et le substrat est transporté dans la seconde direction vers la position de serrage sur la base du capteur de détection de substrat ayant changé de l'état de non-détection à l'état de détection. Lorsque le capteur de détection de substrat est dans l'état de détection au moment du retour, ou lorsque le capteur de détection de substrat est dans l'état de non-détection au moment du retour et lorsque le capteur de détection de substrat a ensuite changé à l'état de détection, un élément mobile est déplacé vers une position d'attente et attend. Une fois que le substrat est transporté vers la position de serrage, l'élément mobile est mis en contact avec le substrat et pressé contre un élément fixe.
PCT/JP2021/038637 2021-10-19 2021-10-19 Procédé de serrage de substrat, appareil de travail et système de travail WO2023067700A1 (fr)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4835573B2 (ja) * 2007-10-26 2011-12-14 パナソニック株式会社 基板搬送装置および基板搬送方法
JP2017028167A (ja) * 2015-07-24 2017-02-02 富士機械製造株式会社 部品実装機
WO2018109891A1 (fr) * 2016-12-15 2018-06-21 株式会社Ｆｕｊｉ Dispositif de transfert de substrat
JP2020064885A (ja) * 2018-10-15 2020-04-23 パナソニックＩｐマネジメント株式会社 部品装着装置および実装基板の製造方法
WO2021152840A1 (fr) * 2020-01-31 2021-08-05 株式会社Ｆｕｊｉ Machine de traitement de carte

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4835573B2 (ja) * 2007-10-26 2011-12-14 パナソニック株式会社 基板搬送装置および基板搬送方法
JP2017028167A (ja) * 2015-07-24 2017-02-02 富士機械製造株式会社 部品実装機
WO2018109891A1 (fr) * 2016-12-15 2018-06-21 株式会社Ｆｕｊｉ Dispositif de transfert de substrat
JP2020064885A (ja) * 2018-10-15 2020-04-23 パナソニックＩｐマネジメント株式会社 部品装着装置および実装基板の製造方法
WO2021152840A1 (fr) * 2020-01-31 2021-08-05 株式会社Ｆｕｊｉ Machine de traitement de carte

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