WO2023054512A1 - 気密端子 - Google Patents

気密端子 Download PDF

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Publication number
WO2023054512A1
WO2023054512A1 PCT/JP2022/036263 JP2022036263W WO2023054512A1 WO 2023054512 A1 WO2023054512 A1 WO 2023054512A1 JP 2022036263 W JP2022036263 W JP 2022036263W WO 2023054512 A1 WO2023054512 A1 WO 2023054512A1
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WO
WIPO (PCT)
Prior art keywords
annular member
airtight terminal
peripheral surface
hole
ceramic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/036263
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English (en)
French (fr)
Japanese (ja)
Inventor
遥 大村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2023551627A priority Critical patent/JP7583954B2/ja
Priority to US18/696,936 priority patent/US20240395442A1/en
Priority to CN202280064734.9A priority patent/CN118044071A/zh
Priority to EP22876378.5A priority patent/EP4411993A4/en
Publication of WO2023054512A1 publication Critical patent/WO2023054512A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/16—Fastening of connecting parts to base or case; Insulating connecting parts from base or case
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/26—Lead-in insulators; Lead-through insulators
    • H01B17/30—Sealing
    • H01B17/303—Sealing of leads to lead-through insulators
    • H01B17/305—Sealing of leads to lead-through insulators by embedding in glass or ceramic material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D19/00—Axial-flow pumps
    • F04D19/02—Multi-stage pumps
    • F04D19/04—Multi-stage pumps specially adapted to the production of a high vacuum, e.g. molecular pumps
    • F04D19/042—Turbomolecular vacuum pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D25/00—Pumping installations or systems
    • F04D25/02—Units comprising pumps and their driving means
    • F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
    • F04D25/0693—Details or arrangements of the wiring

Definitions

  • the present disclosure relates to airtight terminals.
  • vacuum pumps such as turbomolecular pumps use airtight terminals to supply electrical signals from the outside of the vacuum pump to the inside, which is the vacuum space.
  • an airtight terminal generally includes a cylindrical metal sleeve, a disk-shaped insulating substrate brazed to the inner peripheral surface of the metal sleeve and having a through hole in the axial direction, and a and a lead pin (conducting member) with a washer (annular member).
  • a metal layer (metallized layer) is formed on the inner peripheral surface of the through-hole to a depth of 200 ⁇ m to 5 mm from the peripheral edge of the through-hole of the insulating substrate and the opening of the through-hole.
  • a hermetic terminal is described.
  • a washer and a lead pin are fixed to this metal layer by brazing.
  • the airtight terminal according to the present disclosure includes a cylindrical metal sleeve, a ceramic substrate fixed to the inner peripheral surface of the metal sleeve and having a first through hole along the axial direction of the metal sleeve, and a ceramic substrate coaxial with the first through hole. and a columnar conductive member inserted into the first and second through holes and brazed to the ceramic substrate and the annular member.
  • An inner peripheral surface of the annular member facing the conducting member has a first region that curves away from the conducting member.
  • a vacuum pump according to the present disclosure includes this airtight terminal.
  • FIG. 1 is a plan view of an airtight terminal according to an embodiment of the present disclosure
  • FIG. FIG. 2 is an explanatory diagram for explaining a cross section taken along line XX shown in FIG. 1
  • FIG. 3 is an enlarged explanatory view for explaining a region Y shown in FIG. 2
  • 3 is an enlarged explanatory view for explaining another embodiment of the region Y shown in FIG. 2
  • FIG. 3 is an enlarged explanatory view for explaining another embodiment of the region Y shown in FIG. 2
  • FIG. 3 is an enlarged explanatory view for explaining another embodiment of the region Y shown in FIG. 2
  • FIG. 3 is an enlarged explanatory view for explaining another embodiment of the region Y shown in FIG. 2
  • FIG. 3 is an enlarged explanatory view for explaining another embodiment of the region Y shown in FIG. 2;
  • the lead pin when fixing a washer and a lead pin to a metal layer by brazing, if the straightness of the inner peripheral surface of the washer is small and the distance between the inner peripheral surface of the washer and the outer peripheral surface of the lead pin is large, the lead pin may It may be tilted and fixed with respect to the insulating substrate. In such a case, the wiring work for connecting to the tip of the lead pin may become difficult. On the other hand, if the distance between the inner peripheral surface of the washer and the outer peripheral surface of the lead pin is narrow, the brazing material cannot flow sufficiently between the inner peripheral surface of the washer and the outer peripheral surface of the lead pin. As a result, many gaps remain between the inner peripheral surface of the washer and the outer peripheral surface of the lead pin, and joint strength and airtightness may be poor.
  • An object of the present disclosure is to provide an airtight terminal that facilitates wiring work for connection to the tip of a lead pin and that suppresses a gap that may occur between the inner peripheral surface and the outer peripheral surface.
  • the inner peripheral surface of the annular member facing the conducting member has the first region curved toward the outer peripheral surface direction.
  • the contact area of the brazing filler metal with respect to the inner peripheral surface of the annular member can be increased. Therefore, according to the airtight terminal according to the present disclosure, the wiring work for connecting to the tip portion of the lead pin is easy, and a gap that may occur between the inner peripheral surface and the outer peripheral surface is suppressed.
  • FIG. 1 is a plan view showing an airtight terminal 1 according to one embodiment.
  • the metal sleeve 2 has a cylindrical shape, and as long as it is cylindrical, the shape is not limited, such as a cylindrical shape, a rectangular cylindrical shape (for example, a triangular cylindrical shape, a square cylindrical shape, a pentagonal cylindrical shape, a hexagonal cylindrical shape, etc.).
  • the size of the metal sleeve 2 may be appropriately set according to the device provided with the airtight terminal 1 or the like.
  • the length of the metal sleeve 2 is, for example, 15 mm or more and 30 mm or less, and the outer diameter of the outermost circumference is 20 mm or more and 30 mm or less.
  • the outer diameter in the case of a rectangular tube means the length of the longest outer edge.
  • the metal sleeve 2 is made of, for example, carbon steel, low alloy steel, tool steel, stainless steel, iron, copper, copper alloy, titanium, titanium alloy, molybdenum, molybdenum alloy, Fe—Ni alloy, Fe—Ni—Cr—Ti— Al alloy, Fe--Cr--Al alloy, Fe--Co--Cr alloy Fe--Co alloy, Fe--Co--C alloy, Fe--Ni alloy or Fe--Ni--Co alloy there is
  • Carbon steel is an alloy of Fe and 0.02 to 2.14% by mass of C, and contains Si, Mn, P and S in addition to C.
  • Examples of such carbon steel include S10C, S12C, S15C, S17C, S20C, S22C, S25C, S28C, S30C, S33C, S35C, S38C, S40C, S43C, S45C, and S48C defined in JIS G 4051:2016. , S50C, S53C, S55C, S58C, S60C, S65C, S70C, and S75C.
  • Low alloy steel contains at least one of Al, B, Co, Cr, Cu, La, Mo, Nb, Ni, Pb, Se, Te, Ti, V, W and Zr, and the content of these elements Carbon steel with a total of 5% by mass or less.
  • Tool steel refers to carbon tool steel specified in JIS G 4401:2009 and alloy tool steel specified in JIS G 4404:2006.
  • Stainless steel is an alloy of Fe and 10.5% by mass or more of Cr, with a C content of 1.2% or less. be done.
  • Examples of stainless steel include SUS304, SUS304L, SUS304ULC, SUS310ULC, and SUSXM15J1.
  • the ceramic substrate 3 is a member for fixing the conduction member 4 to be described later inside the metal sleeve 2 .
  • the ceramic substrate 3 is fixed by the outer peripheral surface of the ceramic substrate 3 and the inner wall surface of the metal sleeve 2, as shown in FIGS. That is, the ceramic substrate 3 is formed according to the inner diameter of the metal sleeve 2 .
  • the thickness of the ceramic substrate 3 may be any thickness that allows the conductive member 4 to be fixed, and is, for example, 4 mm or more and 10 mm or less.
  • FIG. 2 is an explanatory diagram for explaining a cross section taken along line XX shown in FIG.
  • the ceramic substrate 3 is not limited as long as it is made of ceramics.
  • ceramics include ceramics containing aluminum oxide, aluminum nitride, silicon carbide, or silicon nitride as a main component.
  • the term "main component” refers to a component that accounts for 80% by mass or more of the total 100% by mass of the components that make up the ceramics.
  • Each component contained in the ceramics is identified by an X-ray diffractometer using CuK ⁇ rays, and the content of each component may be determined by, for example, an ICP (Inductively Coupled Plasma) emission spectrometer or a fluorescent X-ray spectrometer.
  • ICP Inductively Coupled Plasma
  • the ceramic substrate 3 has a first through hole 3a along the axial direction of the metal sleeve 2.
  • the first through hole 3 a is a through hole for inserting the conducting member 4 , and the diameter of the first through hole 3 a is appropriately set according to the outer diameter of the conducting member 4 .
  • At least one first through-hole 3a should be formed in the ceramic substrate 3, and the number of first through-holes 3a is appropriately set according to the number of the conductive members 4 to be inserted.
  • the annular member 5 is positioned on the surface of the ceramic substrate 3.
  • the annular member 5 corresponds to a washer, and is made of, for example, carbon steel, low alloy steel, tool steel, stainless steel, iron, copper, copper alloy, titanium, titanium alloy, molybdenum, molybdenum alloy, Fe—Ni alloy, Fe—Ni. -Cr-Ti-Al alloy, Fe-Cr-Al alloy, Fe-Co-Cr alloy Fe-Co alloy, Fe-Co-C alloy, Fe-Ni alloy or Fe-Ni-Co alloy made of metal. Definitions of carbon steel, low alloy steel, tool steel and stainless steel are given above.
  • the annular member 5 is not limited as long as it is smaller than the width and thickness of the ceramic substrate 3 and has a size that allows the conductive member 4 to be inserted.
  • the outer diameter of the annular member 5 is approximately 1.2 times or more and 2 times or less the outer diameter of the conducting member 4, and particularly 1.4 times or more and 1.8 times or less. Good to have.
  • the thickness of the annular member 5 is about 0.1 mm or more and 0.5 mm or less.
  • the annular member 5 has a second through hole 5a positioned coaxially with the first through hole 3a formed in the ceramic substrate 3.
  • the second through hole 5 a is a through hole for inserting the conducting member 4 , and the diameter of the second through hole 5 a is appropriately set according to the outer diameter of the conducting member 4 .
  • the conducting member 4 corresponds to a lead pin, and the shape is not limited as long as it has a columnar shape such as a columnar shape, a prismatic shape (for example, a triangular prismatic shape, a square prismatic shape, a pentagonal prismatic shape, a hexagonal prismatic shape, etc.).
  • the length and outer diameter of the conducting member 4 are appropriately set according to the size of the metal sleeve 2, for example.
  • the conducting member 4 is made of metal such as copper or oxygen-free copper (for example, alloy number C1020 defined in JIS H 3100:2012 or alloy number C1011 defined in JIS H 3510:2012). At least one conductive member 4 may be included, and the number of conductive members 4 may be appropriately set according to the use of the airtight terminal 1 or the like.
  • the conducting member 4 is inserted into the first through hole 3 a formed in the ceramic substrate 3 and the second through hole 5 a formed in the annular member 5 and fixed to the ceramic substrate 3 .
  • the surface of the ceramic substrate 3 is brazed using a brazing material 6 so as to cover the annular member 5 .
  • the brazing material 6 include Ag--Cu--Ti solder, BAg-8, BAg-8A, BAg-8B, and BAg-9.
  • Ag--Cu--Ti braze contains, for example, 35 to 50% by mass of Cu, 1 to 8% by mass of Ti, and the balance of silver (Ag) out of 100% by mass of Ag, Cu, and Ti in total.
  • the annular member 5 has, as shown in FIG. 3, a first region 51 in which the inner peripheral surface facing the conducting member 4 curves toward the outer peripheral surface direction.
  • FIG. 3 is an enlarged explanatory diagram for explaining the region Y shown in FIG. Since the annular member 5 has such a first region 51 , the contact area of the brazing material 6 with the inner peripheral surface of the annular member 5 can be increased. As a result, airtightness and joint strength of the annular member 5 to the conducting member 4 can be improved.
  • the first region 51 may be present only at one place, or may be present at a plurality of places. Since the inner peripheral surface of the annular member 5 has the plurality of first regions 51 , the contact area of the brazing material 6 with the inner peripheral surface of the annular member 5 can be further increased. As a result, airtightness and joint strength of the annular member 5 to the conductive member 4 can be further improved.
  • the curvature of the first region 51 is not limited, and is preferably 0.6 (1/mm) or more, for example.
  • the curvature of each first region 51 is preferably 0.6 (1/mm) or more.
  • the contact area of the brazing material 6 with the inner peripheral surface of the annular member 5 can be increased.
  • the upper limit of the curvature of the first region 51 may be, for example, 1.2 (1/mm).
  • a scanning electron microscope is used to photograph the entire annular member 5 with a cross section including the axis of the conducting member 4 as a target.
  • the curvature of the first region 51 may be obtained by tracing the inner peripheral surface of the annular member 5 displayed in the captured image.
  • the magnification of the image is, for example, 35 times.
  • the brazed portion sandwiched between the inner peripheral surface of the annular member 5 and the outer peripheral surface of the conducting member 4 has as few gaps as possible.
  • the porosity of the brazed portion sandwiched between the inner peripheral surface of the annular member 5 and the outer peripheral surface of the conducting member 4 is 1% or less in a cross-sectional view including the axis of the conducting member 4. It's good.
  • the area of the brazed portion refers to only the portion sandwiched between the inner peripheral surface of the annular member 5 and the outer peripheral surface of the conducting member 4 (that is, from the upper surface of the annular member 5 This area does not include the brazing filler metal 6 positioned above and the brazing filler metal 6 positioned below the lower surface of the annular member 5).
  • the porosity is the percentage of voids inherent in the brazed portion when the area of the brazed portion is 100%.
  • the outer peripheral surface of the annular member 5 may be further formed with a second region 52 that curves toward the inner peripheral surface direction. Since the annular member 5 has such a second region 52 , the contact area of the brazing material 6 with the outer peripheral surface of the annular member 5 can be increased. As a result, even if an impact is applied from the outer peripheral side, the annular member 5 can be fixed for a long period of time.
  • the second region 52 may be present only at one place, or may be present at a plurality of places.
  • the contact area of the brazing material 6 with the outer peripheral surface of the annular member 5 can be further increased.
  • the annular member 5 can be fixed for a longer period of time.
  • the curvature of the second region 52 is not limited, and is preferably 0.6 (1/mm) or more, for example.
  • the curvature of each second region 52 is preferably 0.6 (1/mm) or more.
  • the contact area of the brazing material 6 with the outer peripheral surface of the annular member 5 can be increased. As a result, even if an impact is applied from the outer peripheral side, the annular member 5 can be fixed for a longer period of time.
  • the upper limit of the curvature of the second region 52 may be, for example, 1.2 (1/mm).
  • the curvature of the second region 52 can be obtained by the same method as the curvature of the first region 51 is obtained.
  • the first through hole 3a formed in the ceramic substrate 3 may have a first opening 3a' that opens in an inverted frustum shape on the side where the annular member 5 is installed.
  • the first opening 3a' has a shape that opens like an inverted frustum
  • the stress of the ceramic substrate 3 near the first opening 3a' is dispersed more than when it has a shape other than an inverted frustum. be.
  • the ceramic substrate 3 is less likely to crack and can be used for a long period of time.
  • the inverted truncated cone shape may be an inverted truncated cone shape, an inverted truncated pyramid shape, or the like depending on the shape of the conductive member 4 (the shape of the first through hole 3a). As shown in FIG. 1, when the conductive member 4 is cylindrical, the inverted truncated cone shape becomes an inverted truncated cone shape.
  • the first through hole 3a formed in the ceramic substrate 3 may have a second opening opening in an inverted frustum shape on the side opposite to the side on which the annular member 5 is installed.
  • the second opening has a shape that opens like an inverted frustum
  • the stress of the ceramic substrate 3 near the second opening is more dispersed than when it has a shape other than an inverted frustum.
  • the ceramic substrate 3 is less likely to crack and can be used for a long period of time.
  • the inverted truncated cone shape may be an inverted truncated cone shape, an inverted truncated pyramid shape, or the like depending on the shape of the conductive member 4 (the shape of the first through hole 3a). As shown in FIG. 1, when the conductive member 4 is cylindrical, the inverted truncated cone shape becomes an inverted truncated cone shape.
  • the first opening 3 a ′ and the second opening are a virtual plane perpendicular to the axial direction of the first through hole 3 a and passing through the center of the thickness of the ceramic substrate 3 .
  • the brazing material 6 may form a fillet from above the upper surface of the annular member 5 toward the outside of the outer peripheral surface of the annular member 5 .
  • the contact area of the brazing material 6 with respect to the ceramic substrate 3 , the conductive member 4 and the annular member 5 can be increased.
  • a metallized layer (not shown) and a plated layer (not shown) covering the metallized layer are provided on the surface of the ceramic substrate 3, the contact area of the brazing material 6 with the plated layer instead of the ceramic substrate 3 can be expanded. As a result, even if a pulling force is applied to the outside, it becomes difficult to peel off, and it can be used for a long period of time.
  • the average value of the cutting level difference R ⁇ c1 which represents the difference between the cutting level at the load length rate of 75% in the roughness curve and the cutting level at the load length rate of 75% in the roughness curve, is the roughness curve of the exposed portion of the surface of the ceramic substrate 3. may be greater than the mean value of the cut level difference R ⁇ c2 representing the difference between the cut level at 25% load length ratio in the roughness curve and the cut level at 75% load length ratio in the roughness curve.
  • the average value of the cutting level difference R ⁇ c1 is larger than the average value of the cutting level difference R ⁇ c2
  • the anchoring effect of the brazed portion is enhanced, so the bonding strength of the brazed portion to the plating layer can be increased.
  • the average value of the cutting level difference R ⁇ c2 is smaller than the average value of the cutting level difference R ⁇ c1.
  • the cutting level differences R ⁇ c1 and R ⁇ c2 can be measured using a shape analysis laser microscope (manufactured by Keyence Corporation, an ultra-depth color 3D shape measuring microscope (VK-X1100 or its successor)).
  • the illumination system is coaxial illumination
  • the magnification is 60 times
  • the cutoff value ⁇ s is absent
  • the cutoff value ⁇ c is 0.8 mm
  • the cutoff value ⁇ f is absent
  • the end effect is corrected.
  • the measurement is performed on the surface of the plated layer around the conductive member 4 and the exposed portion of the surface of the ceramic substrate 3. For example, the measurement range per location is 5657 ⁇ m ⁇ 4232 m.
  • a circumference C1 to be measured centered on the axis of the conductive member 4 is drawn on the surface of the plated layer.
  • the length per circumference is, for example, 6.2 mm or more and 6.6 mm or less.
  • a circumference C2 is drawn on the exposed portion of the surface of the ceramic substrate 3 coaxially with the circumference C1.
  • the length per circumference is, for example, 7.8 mm or more and 8.3 mm or less.
  • the measured values of the cutting level differences R ⁇ c1 and R ⁇ c2 may be obtained so as to be the same as the number of the conductive members 4, and the respective average values may be calculated.
  • the measured value of the cutting level difference R.delta.c1 and the measured value of the cutting level difference R.delta.c2 can be compared.
  • the average value of the cutting level difference R ⁇ c1 is 4 ⁇ m or more and 7 ⁇ m or less, and the average value of the cutting level difference R ⁇ c2 is 1 ⁇ m or more and 2 ⁇ m or less.
  • the difference between the average value of the cutting level differences R ⁇ c1 and the average value of the cutting level differences R ⁇ c2 is preferably 2 ⁇ m or more and 5 ⁇ m or less.
  • the metallized layer contains, for example, molybdenum as its main component and manganese.
  • the content of manganese is, for example, 10% by mass or more and 30% by mass or less in 100% by mass of the components constituting the metallized layer, and the balance is molybdenum.
  • the thickness of the metallized layer is, for example, several tens of micrometers.
  • the plated layer may contain, for example, nickel as a main component and may contain phosphorus or boron. The thickness of the plated layer is, for example, several ⁇ m.
  • the cross-sectional profile of the brazing material 6 may have concave surfaces 7a, 7b. Since the concave surfaces 7a and 7b are provided, the volume of the brazing material 6 can be reduced compared to the case where the concave surfaces 7a and 7b are not provided. Therefore, the stress applied to the ceramic substrate 3 is reduced, and the occurrence of cracks in the ceramic substrate 3 can be particularly suppressed. In particular, since it has the concave surface 7a, the stress applied to the ceramic substrate 3 is reduced.
  • a convex surface 8 is formed at the boundary between the concave surfaces 7a and 7b.
  • the top of the convex surface 8 may be close to the line of intersection between the upper surface of the annular member 5 and the outer peripheral surface.
  • the thickness of the brazing filler metal near the convex surface 8 is thin. Therefore, the stress applied to the ceramic substrate 3 is reduced, and the occurrence of cracks in the ceramic substrate 3 can be particularly suppressed.
  • the average curvature radius of the convex surface 8 may be 60 ⁇ m or more and 190 ⁇ m or less.
  • the bonding strength of the conductive member 4 to the ceramic substrate 3 is improved.
  • a plurality of conducting members 4 are arranged along the axial direction of the metal sleeve 2 , it is possible to suppress short-circuiting between adjacent conducting members 4 due to the brazing filler metal 6 .
  • the conduction member 4 is columnar, the convex surface 8 will have a ring shape surrounding the conduction member 4 .
  • the average curvature radius of the convex surface 8 can be measured using a shape analysis laser microscope (manufactured by Keyence Corporation, an ultra-depth color 3D shape measuring microscope (VK-X1100 or its successor model)).
  • profile measurement may be performed by setting the illumination method to coaxial illumination, the magnification to 120, and the measurement range including the convex surface 8 to, for example, 2792 ⁇ m ⁇ 2093 ⁇ m per point. Specifically, first, in one measurement range, four lines to be measured are drawn from the conductive member 4 side toward the ceramic substrate 3 side so as to include the convex surface 8 .
  • the length of one line is, for example, 200 ⁇ m or more and 300 ⁇ m or less. At least 3 measurement ranges should be set, and at least 12 lines should be measured. Let the average value of the measured values obtained from the 12 lines to be measured be the average radius of curvature of the convex surface 8 .
  • FIG. 5 An airtight terminal 30 according to another embodiment of the present disclosure will be described based on FIG. A configuration different from the one embodiment will be described.
  • a portion of the annular member 5 may be positioned inside the first opening 3 a ′ of the ceramic substrate 3 . That is, the lower surface of the annular member 5 may be located at a distance D from the surface of the ceramic substrate 3 to the first opening 3a' in the axial direction of the first through hole 3a.
  • the volume of the brazing material 6 in the through hole 3a is reduced by the annular member 5.
  • FIG. Therefore, the stress applied to the ceramic substrate 3 adjacent to the through-hole 3a is reduced, and the occurrence of cracks in the ceramic substrate 3 can be particularly suppressed.
  • FIG. 6 An airtight terminal 40 according to another embodiment of the present disclosure will be described based on FIG. A configuration different from the one embodiment will be described.
  • the distance between the outer peripheral surface of the conducting member 4 and the inner peripheral surface of the annular member 5 may not be uniform.
  • the distance between the outer peripheral surface of the conductive member 4 and the inner peripheral surface of the annular member 5 is W1 on the left side of the paper surface and W2 on the right side of the paper surface, where W1>W2. It is preferable to have such a structure.
  • W1 is larger than W2
  • the volume of the brazing material 6 between the first region 51 and the conductive member 4 increases in the area on the left side of the drawing.
  • W1 is larger than W2
  • the distance between the convex surface 8 and the line of intersection between the upper surface of the annular member 5 and the outer peripheral surface can be reduced in the area on the left side of the drawing.
  • the volume of the brazing material 6 between the first area 51 and the conducting member 4 increases. In the area on the right side of the page, the volume of the brazing material 6 between the first area 51 and the conducting member 4 decreases.
  • the airtight terminal 1 is manufactured, for example, by the following procedure. First, the metal sleeve 2 is prepared. Next, a ceramic substrate 3 is fixed to the inner peripheral surface of this metal sleeve 2 . The annular member 5 is placed on the ceramic substrate 3 so that the first through hole 3a formed in the ceramic substrate 3 and the second through hole 5a formed in the annular member 5 overlap each other. Next, the conducting member 4 is inserted into the first through hole 3a and the second through hole 5a, and the ceramic substrate 3, the conducting member 4 and the annular member 5 are fixed with the brazing material 6 so as to cover the annular member 5. .
  • the porosity of the brazing portion sandwiched between the inner peripheral surface of the annular member 5 and the outer peripheral surface of the conducting member 4 and the formation shape of the fillet can be adjusted. can be controlled.
  • the 25% load length in the surface roughness curve of the plated layer The average value of the cutting level difference R ⁇ c1 representing the difference between the cutting level at the load length rate of 75% in the roughness curve and the cutting level at the load length rate of 75% in the roughness curve is the roughness curve of the exposed portion of the surface of the ceramic substrate 3.
  • the ceramic substrate The surface of 3 may be ground or polished in advance.
  • the metal sleeve 2 is prepared.
  • a ceramic substrate 3 is fixed to the inner peripheral surface of this metal sleeve 2 .
  • the annular member 5 is coated with the brazing material 6 in advance.
  • a paste made of fine powder of the brazing material 6 and an organic solvent is applied to the entire periphery of the annular member 5, that is, the upper surface, the lower surface, the inner peripheral surface and the outer peripheral surface. It can be produced by heating and cooling.
  • An annular member is mounted on the ceramic substrate 3 so that the first through hole 3a formed in the ceramic substrate 3 and the second through hole 5a (previously coated with the brazing material 6) formed in the annular member 5 overlap each other. 5 is placed.
  • the conducting member 4 is inserted into the first through hole 3a and the second through hole 5a, and the ceramic substrate 3, the conducting member 4 and the annular member 5 are fixed with the brazing material 6 so as to cover the annular member 5. .
  • an airtight terminal 20 according to another embodiment is obtained.
  • the airtight terminal 30 In order to manufacture the airtight terminal 30 according to another embodiment in which a part of the annular member 5 is positioned inside the first opening 3a' of the ceramic substrate 3 shown in FIG. be done. First, the metal sleeve 2 is prepared. Next, a ceramic substrate 3 is fixed to the inner peripheral surface of this metal sleeve 2 . The annular member 5 is placed on the ceramic substrate 3 so that the first through hole 3a formed in the ceramic substrate 3 and the second through hole 5a formed in the annular member 5 overlap each other. When placing the annular member 5, the lower surface of the annular member 5 is positioned inside the first opening 3a' of the first through hole 3a, and then the annular member 5 is fixed.
  • the conducting member 4 is inserted into the first through hole 3a and the second through hole 5a, and the ceramic substrate 3, the conducting member 4 and the annular member 5 are fixed with the brazing material 6 so as to cover the annular member 5. .
  • an airtight terminal 30 according to another embodiment is obtained.
  • a first manufacturing method first, the metal sleeve 2 is prepared.
  • a ceramic substrate 3 is fixed to the inner peripheral surface of this metal sleeve 2 .
  • the annular member 5 is placed on the ceramic substrate 3 so that the first through hole 3a formed in the ceramic substrate 3 and the second through hole 5a formed in the annular member 5 overlap each other.
  • the conductive member 4 is inserted into the first through hole 3a and the second through hole 5a so that the interval between the conductive member 4 and the annular member 5 is uneven.
  • the annular member 4 and the conducting member 5 are fixed with the brazing material 6 .
  • the metal sleeve 2 is prepared.
  • a ceramic substrate 3 is fixed to the inner peripheral surface of this metal sleeve 2 .
  • the annular member 5 is placed on the ceramic substrate 3 so that the first through hole 3a formed in the ceramic substrate 3 and the second through hole 5a formed in the annular member 5 overlap each other.
  • the conducting member 4 is inserted into the first through hole 3a and the second through hole 5a.
  • the ceramic substrate 3 is tilted so that the axial direction of the annular member 5 is tilted by 10 to 30° with respect to the vertical direction.
  • the brazing material 6 is heated and cooled to fix the conductive member 4 and the annular member 5 .
  • an airtight terminal 40 according to another embodiment is obtained.
  • the ceramic substrate 3 may be fixed to the inner peripheral surface of the metal sleeve 2 after the conducting member 4 and the annular member 5 are previously fixed to the ceramic substrate 3 with the brazing material 6 .
  • An annular member 5 having a first region 51 whose inner peripheral surface facing the conducting member 4 curves in a direction away from the conducting member 4 is prepared in advance by preparing a metal plate, applying a resist, and applying a mask in order. It can be obtained by performing exposure, development, etching, and resist stripping.
  • the airtight terminal 1 is used in various devices.
  • Such devices include, for example, vacuum pumps, plasma processing devices such as plasma deposition devices, plasma etching devices, and plasma ashing devices.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Ceramic Products (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
PCT/JP2022/036263 2021-09-29 2022-09-28 気密端子 Ceased WO2023054512A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2023551627A JP7583954B2 (ja) 2021-09-29 2022-09-28 気密端子
US18/696,936 US20240395442A1 (en) 2021-09-29 2022-09-28 Hermetic terminal
CN202280064734.9A CN118044071A (zh) 2021-09-29 2022-09-28 气密端子
EP22876378.5A EP4411993A4 (en) 2021-09-29 2022-09-28 AIRTIGHT TERMINAL

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-159883 2021-09-29
JP2021159883 2021-09-29

Publications (1)

Publication Number Publication Date
WO2023054512A1 true WO2023054512A1 (ja) 2023-04-06

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PCT/JP2022/036263 Ceased WO2023054512A1 (ja) 2021-09-29 2022-09-28 気密端子

Country Status (5)

Country Link
US (1) US20240395442A1 (https=)
EP (1) EP4411993A4 (https=)
JP (1) JP7583954B2 (https=)
CN (1) CN118044071A (https=)
WO (1) WO2023054512A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025070217A1 (ja) * 2023-09-25 2025-04-03 京セラ株式会社 接合体、給電端子および気密端子

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5353580U (https=) * 1976-10-12 1978-05-09
JPH1116620A (ja) 1997-06-23 1999-01-22 Kyocera Corp 気密端子
JP2002110265A (ja) * 2000-09-29 2002-04-12 Kyocera Corp 真空気密端子および電気ポット
JP2019149304A (ja) * 2018-02-27 2019-09-05 京セラ株式会社 密封端子

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4099025B2 (ja) * 2002-04-12 2008-06-11 京セラ株式会社 セラミック端子
JP7311447B2 (ja) * 2020-03-11 2023-07-19 京セラ株式会社 気密端子

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5353580U (https=) * 1976-10-12 1978-05-09
JPH1116620A (ja) 1997-06-23 1999-01-22 Kyocera Corp 気密端子
JP2002110265A (ja) * 2000-09-29 2002-04-12 Kyocera Corp 真空気密端子および電気ポット
JP2019149304A (ja) * 2018-02-27 2019-09-05 京セラ株式会社 密封端子

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4411993A4

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025070217A1 (ja) * 2023-09-25 2025-04-03 京セラ株式会社 接合体、給電端子および気密端子

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US20240395442A1 (en) 2024-11-28
EP4411993A4 (en) 2025-09-03
JP7583954B2 (ja) 2024-11-14
EP4411993A1 (en) 2024-08-07
CN118044071A (zh) 2024-05-14
JPWO2023054512A1 (https=) 2023-04-06

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