WO2023053968A1 - 検査装置及び検査方法 - Google Patents

検査装置及び検査方法 Download PDF

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Publication number
WO2023053968A1
WO2023053968A1 PCT/JP2022/034418 JP2022034418W WO2023053968A1 WO 2023053968 A1 WO2023053968 A1 WO 2023053968A1 JP 2022034418 W JP2022034418 W JP 2022034418W WO 2023053968 A1 WO2023053968 A1 WO 2023053968A1
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WO
WIPO (PCT)
Prior art keywords
probe
target
targets
electrode
contact
Prior art date
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Ceased
Application number
PCT/JP2022/034418
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English (en)
French (fr)
Japanese (ja)
Inventor
顕太朗 小西
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to KR1020247012521A priority Critical patent/KR20240068698A/ko
Priority to CN202280063312.XA priority patent/CN117981064A/zh
Publication of WO2023053968A1 publication Critical patent/WO2023053968A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Definitions

  • the present disclosure relates to an inspection device and an inspection method.
  • Patent Document 1 discloses a probe card having a probe detection chamber which is formed in line with an inspection chamber for conducting an electrical characteristic inspection of a semiconductor wafer and has a supporting member which is detachably mounted while positioning the probe card at a predetermined position.
  • a detection device is disclosed. This device comprises at least two components: a probe card positioned and mounted on the predetermined position of the support via a first holder; and a probe card movably provided in the probe detection chamber. and a first imaging device that detects the tip of the probe. Further, the probe card detection device is detachably attached to the predetermined position of the support by positioning it via a second holder instead of the probe card, and corresponds to the at least two probes. a probe compensation card having at least two targets.
  • Differences between the horizontal positions of the tips of the at least two probes and the horizontal positions of the at least two targets are detected by the first imaging device in the probe detection chamber.
  • the difference is detected as a correction value for aligning at least two probes of the probe card and at least two electrode pads of the semiconductor wafer in the inspection room.
  • the technology according to the present disclosure more accurately aligns the electrodes provided on the substrate and the probes of the probe card in an inspection apparatus that inspects the substrate.
  • One aspect of the present disclosure is an inspection apparatus for inspecting a substrate, comprising: a mounting member on which the substrate is mounted; a holding unit that holds a probe card having probes that contact electrodes on the substrate; a moving mechanism for holding and moving a member in horizontal and vertical directions; a first acquisition unit fixed to the moving mechanism for acquiring the position of the probe; A second acquisition unit for acquiring the position of the electrode and a control unit, and a plurality of first targets are provided on at least one of the probe card and the holding unit, is provided with the same number of second targets as the first targets, further comprising a detection unit for simultaneously detecting the first targets and the second targets corresponding to the first targets, the control unit is a step of acquiring a representative position of the probe with respect to the probe reference position using the first acquisition unit; a step of moving the mounting member to a region below an acquisition unit and acquiring a representative position of the electrode with respect to the electrode reference position using the second acquisition unit; A step of acquiring matching positions at which a first target simultaneously has a
  • an inspection apparatus that inspects a substrate, it is possible to more accurately align the electrodes provided on the substrate and the probes of the probe card.
  • FIG. 10 is a diagram for explaining inspection processing that accompanies contact position determination processing according to the present embodiment;
  • FIG. 10 is a diagram for explaining inspection processing that accompanies contact position determination processing according to the present embodiment;
  • FIG. 10 is a diagram for explaining inspection processing that accompanies contact position determination processing according to the present embodiment;
  • FIG. 10 is a diagram for explaining inspection processing that accompanies contact position determination processing according to the present embodiment;
  • FIG. 10 is a diagram for explaining inspection processing that accompanies contact position determination processing according to the present embodiment;
  • FIG. 10 is a diagram for explaining inspection processing that accompanies contact position determination processing according to the present embodiment;
  • FIG. 10 is a diagram for explaining inspection processing that accompanies contact position determination processing according to the present embodiment;
  • FIG. 10 is a diagram for explaining inspection processing that accompanies contact position determination processing according to the present embodiment;
  • a large number of semiconductor devices with predetermined circuit patterns are formed on a semiconductor wafer (hereinafter referred to as "wafer").
  • the semiconductor devices thus formed are inspected for electrical characteristics and the like, and sorted into non-defective products and defective products.
  • Semiconductor devices are inspected, for example, by using an inspection apparatus in a state of a wafer before being divided into semiconductor devices.
  • the inspection device is provided with a probe card having a large number of probes that are needle-shaped contact terminals.
  • the wafer and the probe card are brought close to each other, and the probes of the probe card contact each electrode of the semiconductor device formed on the wafer.
  • an electrical signal is supplied to the semiconductor device through each probe from a tester provided above the probe card. Based on the electrical signal received by the tester from the semiconductor device via each probe, it is determined whether or not the semiconductor device is defective.
  • the inspection apparatus aligns the probe card and the wafer, more specifically, aligns the probes with the electrodes on the wafer.
  • the inspection apparatus aligns the probe card and the wafer, more specifically, aligns the probes with the electrodes on the wafer.
  • the technology according to the present disclosure provides a board inspection apparatus that can more accurately align the electrodes on the board and the probes of the probe card.
  • ⁇ Inspection device> 1 and 2 are a cross-sectional view and a vertical cross-sectional view, respectively, showing the outline of the configuration of the inspection apparatus according to this embodiment. Note that FIG. 2 shows only part of an aligner, which will be described later.
  • the inspection apparatus 1 shown in FIGS. 1 and 2 inspects a wafer W as a substrate, and more specifically, inspects the electrical characteristics of semiconductor devices formed on the wafer W as devices to be inspected. be.
  • the inspection apparatus 1 has a housing 10 , and the housing 10 is provided with a loading/unloading area 11 , a transport area 12 and an inspection area 13 .
  • the loading/unloading area 11 is an area where the wafer W is loaded/unloaded to/from the inspection apparatus 1 .
  • the transport area 12 is an area that connects the loading/unloading area 11 and the inspection area 13 .
  • the inspection area 13 is an area where the electrical characteristics of the semiconductor devices formed on the wafer W are inspected.
  • the loading/unloading area 11 is provided with a port 20 for receiving a cassette C housing a plurality of wafers W, a loader 21 housing a probe card described later, and a control unit 22 for controlling each component of the inspection apparatus 1.
  • the control unit 22 is configured by a computer having a CPU, a memory, etc., and has a storage unit (not shown) that stores various information.
  • the storage unit stores, for example, programs for realizing inspection processing and the like.
  • the program may be recorded in a computer-readable storage medium and installed in the control unit 22 from the storage medium.
  • the storage medium may be temporary or non-temporary. Part or all of the program may be realized by dedicated hardware (circuit board).
  • the storage unit is, for example, a storage device such as an HDD, a memory such as a RAM that temporarily stores necessary information related to program calculation, or a combination thereof.
  • a transfer device 30 that can freely move while holding a wafer W or the like is arranged.
  • the transfer device 30 transfers the wafer W between the cassette C in the port 20 of the loading/unloading area 11 and the inspection area 13 .
  • the transport device 30 transports probe cards fixed to a pogo frame, which will be described later, in the inspection area 13 and requiring maintenance to the loader 21 in the loading/unloading area 11 . Further, the transport device 30 transports new or maintained probe cards from the loader 21 into the inspection area 13 .
  • a plurality of testers 40 are provided in the inspection area 13 .
  • the inspection area 13 is divided into three in the vertical direction, and four testers arranged in the horizontal direction (the X direction in the drawing) are arranged in each divided area 13a.
  • a train of 40 testers is provided.
  • each divided area 13a is provided with an aligner 50 as one moving mechanism and one upper camera 60. As shown in FIG. The number and arrangement of the tester 40, the aligner 50, and the upper camera 60 can be arbitrarily selected.
  • the tester 40 transmits and receives electrical signals to and from the wafer W for electrical characteristic inspection.
  • the aligner 50 holds a chuck top 70, which will be described later, and moves it in the horizontal direction (the X direction and the Y direction in FIG. 1, the ⁇ direction around the Z axis in the drawing) and the vertical direction (the Z direction in the drawing). is configured to allow The aligner 50 is also used for alignment between the wafer W placed on the chuck top 70 and probes of a probe card, which will be described later.
  • the upper camera 60 is provided so as to image the downward direction.
  • the upper camera 60 is configured to be horizontally movable.
  • the upper camera 60 is positioned, for example, in an area in front of each tester 40 in the inspection where the upper camera 60 is provided, and in an area that does not overlap a probe card held by a pogo frame, which will be described later, in plan view.
  • the wafer W placed on the chuck top 70 on the aligner 50 is imaged.
  • the upper camera 60 is controlled by the control unit 22 .
  • the result of imaging by the upper camera 60 is output to the control section 22 .
  • the chuck top 70 is an example of a mounting member, on which the wafer W is mounted.
  • the chuck top 70 can hold, for example, the mounted wafer W by suction or the like.
  • the transfer apparatus 30 while the transfer apparatus 30 is transferring the wafer W toward one tester 40, the other tester 40 tests the electrical characteristics of the electronic devices formed on the other wafer W. be able to.
  • FIG. 3 is a side sectional view of the inspection area 13.
  • FIG. 4 is a cross-sectional view of the periphery of a pogo frame, which will be described later.
  • FIG. 5 is a bottom view of a probe card which will be described later. In FIG. 5, the illustration of probes, which will be described later, is omitted.
  • FIG. 6 is a top view of the chuck top 70.
  • Each divided area 13a of the inspection area 13 is provided with the aligner 50 and the upper camera 60 as described above. As shown in FIG. 3, each divided area 13a is provided with a lower camera 80, a pogo frame 90, and a probe card 100, which will be described later.
  • the aligner 50 has an X stage 51, a Y stage 52 and a Z stage 53, for example.
  • the X stage 51 moves along the guide rails 51a in the X-axis direction that constitutes the coordinate system of the movement plane (XY plane) of the aligner 50.
  • the X stage 51 is provided with a position detection mechanism (not shown) for detecting the position of the X stage 51 in the X direction, that is, the position of the chuck top 70 in the X axis direction.
  • the position detection mechanism is, for example, a linear encoder.
  • the Y stage 52 moves on the X stage 51. Specifically, it moves along the guide rails 52a in the Y-axis direction that constitutes the coordinate system of the movement plane (XY plane) of the aligner 50 .
  • the Y stage 52 is provided with a position detection mechanism (not shown) for detecting the position of the Y stage 52 in the Y axis direction, that is, the position of the chuck top 70 in the Y axis direction.
  • the position detection mechanism is, for example, a linear encoder.
  • the Z stage 53 moves in the height direction (Z direction) by means of an extensible shaft 53a that can extend and contract in the height direction (Z direction) perpendicular to the movement plane (XY plane) of the aligner 50 .
  • the Z stage 53 is provided with a position detection mechanism (not shown) for detecting the position of the Z stage 53 in the Z direction, that is, the position of the chuck top 70 in the Z direction.
  • the position detection mechanism is, for example, a linear encoder.
  • the chuck top 70 is detachably held by suction on the Z stage 53 .
  • the chuck top 70 is held by the Z stage 53 by vacuum suction or the like by a suction holding mechanism (not shown).
  • the lower camera 80 is an example of a first acquisition unit, and is used to acquire representative positions of probes provided on the probe card 100, which will be described later. Also, the lower camera 80 is an example of a first imaging unit, and captures an upward image. Note that the above-described upper camera 60 is an example of a second acquisition unit, and is for acquiring the representative position and the like of the wafer W placed on the chuck top 70 on the aligner 50 . Also, the upper camera 60 is an example of a second imaging section, and captures an image of the downward direction as described above.
  • a lower camera 80 is fixed to the aligner 50 .
  • the lower camera 80 is fixed to the Z stage 53 of the aligner 50 . Being fixed in this way, the lower camera 80 can be moved together with the chuck top 70 by the aligner 50 .
  • the lower camera 80 is positioned, for example, in an area below the probe card 100 fixed to the pogo frame 90 and images the probe card 100 .
  • the aligner 50 and the lower camera 80 are controlled by the controller 22.
  • the result of imaging by the lower camera 80 and the result of position detection by the position detection mechanisms provided on the X stage 51 , Y stage 52 and Z stage 53 are output to the control section 22 .
  • the tester 40 has a tester motherboard 41 at its bottom, as shown in FIG.
  • a plurality of inspection circuit boards (not shown) are mounted on the tester motherboard 41 in an upright state.
  • a plurality of electrodes (not shown) are provided on the bottom surface of the tester motherboard 41 .
  • a pogo frame 90 is provided below the tester 40 .
  • the pogo frame 90 is an example of a holding section and holds the probe card 100 . Also, the pogo frame 90 electrically connects the probe card 100 and the tester 40 . This pogo frame 90 has pogo pins 91 for the electrical connection described above, and more specifically, has a pogo block 92 that holds a large number of pogo pins 91 . A probe card 100 is fixed to the lower surface of the pogo frame 90 while being aligned at a predetermined position.
  • the tester motherboard 41 is vacuum-sucked to the pogo frame 90 by an exhaust mechanism (not shown), and the probe card 100 is vacuum-sucked to the pogo frame 90 .
  • the lower end of each pogo pin 91 of the pogo frame 90 is brought into contact with the corresponding electrode on the upper surface of the card body 101 of the probe card 100, and the upper end of each pogo pin 91 is It is pressed against the corresponding electrodes on the underside of the tester motherboard 41 .
  • the probe card 100 has a disk-shaped card body 101 with a plurality of electrodes provided on its upper surface.
  • a plurality of probes 102 which are needle-like contact terminals extending downward, are provided on the lower surface of the card body 101.
  • the plurality of electrodes provided on the upper surface of the card body 101 are electrically connected to corresponding probes 102, respectively.
  • the probes 102 are brought into contact with electrodes P (see FIG. 6) of semiconductor devices formed on the wafer W, respectively. Therefore, during the electrical characteristic inspection, electrical signals for inspection are transmitted and received between the tester mother board 41 and the semiconductor devices on the wafer W via the pogo pins 91, the electrodes provided on the upper surface of the card body 101, and the probes 102. be done.
  • the inspection apparatus 1 is provided with a large number of probes 102 so as to cover substantially the entire lower surface of the card body 101 in order to collectively inspect the electrical characteristics of a plurality of semiconductor devices formed on the wafer W.
  • a bellows 93 is attached to the lower surface of the pogo frame 90 .
  • the bellows 93 is a tubular extendable member that hangs down so as to surround the probe card 100 . Also, the bellows 93 attracts and holds the chuck top 70 at a position below the probe card 100 as indicated by the dotted line in FIG.
  • the bellows 93 sucks and holds the chuck top 70 to form a sealed space S surrounded by the pogo frame 90 including the probe card 100 , the bellows 93 and the chuck top 70 .
  • the contact state between the wafer W and the probes 102 can be maintained by decompressing the sealed space S with a decompression mechanism (not shown).
  • a plurality of first targets 103 are provided on the lower surface of the card body 101 of the probe card 100 as shown in FIGS. 4 and 5 in addition to the probes 102 .
  • the first target 103 is a mark for aligning the wafer W and the probe card 100 .
  • the shape of each first target 103 in plan view is, for example, circular.
  • the first targets 103 are provided at equal intervals on the same circumference around the center of the probe card 100, for example, in a region R2 surrounding the outside of the region R1 where the probes 102 are formed.
  • the number, shape and arrangement of the first targets 103 are arbitrary as long as the purpose of providing the first targets 103 can be achieved.
  • the same number of second targets 71 as the first targets 103 are provided on the upper surface of the chuck top 70 .
  • the second target 71 like the first target 103 , is a mark for aligning the wafer W and the probe card 100 .
  • the shape of each second target 71 in plan view is circular, for example.
  • the second targets 71 are provided at equal intervals on the same circumference around the center of the chuck top 70, for example, in a region R12 surrounding the outside of the region R11 on which the wafer W is placed.
  • the number, shape and arrangement of the second targets are arbitrary as long as the purpose of providing the second targets can be achieved.
  • the first target 103 and the second target 71 are provided as follows. That is, the first targets 103 and the second targets 71 are provided so that all the first targets 103 can simultaneously have a predetermined positional relationship with the second targets 71 corresponding to the first targets 103 in plan view. There is Specifically, for example, all the first targets 103 can simultaneously overlap the second targets 71 corresponding to the first targets 103 in plan view (more specifically, their centers are aligned). ), a first target 103 and a second target 71 are provided.
  • a reference matching camera 110 is provided for each second target 71, that is, each first target 103.
  • the reference matching camera 110 is an example of a detection unit, and is for detecting the corresponding first target 103 and the second target 71 corresponding to the first target 103 at the same time.
  • the reference alignment camera 110 is an example of a third imaging unit, is provided at a position below the second target 71 in the aligner 50, and images the upper side.
  • the first target 103 and the second target 71 are arranged as follows. is provided.
  • the chuck top 70 is formed with a through hole 72 penetrating vertically.
  • the through hole 72 is closed with a window member 73 made of a material transparent to the light used for imaging by the reference alignment camera 110 .
  • a second target 71 is provided on the window member 73 , and the reference alignment camera 110 images the second target 71 and the first target 103 through the through hole 72 .
  • second target 71 is made smaller than first target 103 so that fiducial camera 110 can image first target 103 through second target 71 .
  • the second target 71 may be formed in a ring shape having a hole in the center in plan view, and the reference alignment camera 110 may image the first target 103 through the hole.
  • the contact position is the position of the chuck top 70 when the electrodes P of the wafer W supported by the chuck top 70 are brought into contact with the probes 102 .
  • the lower camera 80 is used to acquire the representative position of the probe 102 with respect to the probe reference position.
  • the representative position of the probe 102 with respect to the probe reference position is, in other words, the representative position of the probe 102 in the coordinate system based on the imaging by the lower camera 80 .
  • a representative image of the electrodes P on the wafer W placed on the chuck top 70 with respect to the electrode reference position is detected.
  • a position is obtained.
  • the representative position of the electrode P with respect to the electrode reference position is, in other words, the representative position of the electrode P in the coordinate system based on the imaging by the upper camera 60 .
  • information for associating the probe reference position and the electrode reference position that is, information for associating the coordinate system based on the imaging by the lower camera 80 and the coordinate system based on the imaging by the upper camera 60 is acquired.
  • an area below the upper camera 60 (hereinafter referred to as an "alignment area") is located in an area that does not overlap the probe card 100 held by the pogo frame 90 in plan view.
  • the lower camera 80 is moved.
  • the same target 500 is imaged by the upper camera 60 and the lower camera 80, and information on the position of the Z stage 53 at that time is acquired as information for associating the probe reference position with the electrode reference position.
  • the contact position is determined based on the obtained representative position of the probe 102 with respect to the probe reference position, the representative position of the electrode P with respect to the electrode reference position, and information for associating the probe reference position with the electrode reference position. be done.
  • the housing 10 in which the aligner 50 is installed is distorted on the order of ⁇ m due to expansion or contraction due to changes in the temperature of the housing 10, changes in the center of gravity of the plurality of aligners 50 within the housing 10, and the like.
  • the information for associating the probe reference position and the electrode reference position is acquired, that is, when the lower camera 80 is positioned in the alignment area A, the chuck top 70 and the probe card 100 held by the pogo frame 90 are shown. There is a distance from the chuck top 70 . Therefore, if there is distortion as described above, it may not be possible to appropriately contact the probe 102 and the electrode P at the contact position determined by the method according to the comparative embodiment.
  • a wafer W to be inspected is carried into a desired divided area 13a.
  • the transfer device 30 and the like are controlled by the control unit 22 , and the wafer W is taken out from the cassette C in the port 20 of the loading/unloading area 11 , loaded into the middle divided area 13 a , and transferred to the aligner 50 . It is placed on the chuck top 70 which is held by suction.
  • the controller 22 uses the lower camera 80 to acquire a representative position of the probe 102 with respect to the probe reference position. Specifically, under the control of the control unit 22, the chuck top 70 is moved by the aligner 50 so that the lower camera 80 is positioned in the area below the probe card 100 as shown in FIG. Based on the result and the detection result of the position detection mechanism of the aligner 50, the representative position of the probe 102 with respect to the probe reference position is acquired.
  • the representative position of the probe 102 is, for example, the center-of-gravity position of the probe 102 at a plurality of predetermined locations.
  • the position (specifically, position coordinates) of each probe 102 is determined based on the output from the position detection mechanism of the aligner 50 when the tip of the probe 102 is positioned at the center of the image obtained by the lower camera 80. can be obtained.
  • the probe reference position may be determined in advance, and may be, for example, a designed position at the center of the probe card 100 .
  • the representative position of the first target 103 of the probe card 100 is acquired as the probe reference position by the controller 22 using the lower camera 80 .
  • the representative position of the first targets 103 is, for example, the center-of-gravity position of the plurality of first targets 103 .
  • the position of each first target 103 is obtained, for example, based on the output from the position detection mechanism of the aligner 50 when the center of the first target 103 is positioned at the center of the image obtained by the lower camera 80. be able to.
  • the representative position of the electrode P is, for example, the position of the center of gravity of the electrode P at a plurality of predetermined locations.
  • the position (specifically, position coordinates) of each electrode P is determined based on the output from the position detection mechanism of the aligner 50 when the center of the electrode P is positioned at the center of the image obtained by the upper camera 60. can be obtained.
  • the electrode reference position may be determined in advance, and may be, for example, a designed position at the center of the chuck top 70 .
  • the representative position of the second target 71 on the chuck top 70 is acquired as the electrode reference position by the controller 22 using the upper camera 60 .
  • the representative position of the second targets 71 is, for example, the center-of-gravity position of the plurality of second targets 71 .
  • the position of each second target 71 is obtained, for example, based on the output from the position detection mechanism of the aligner 50 when the center of the second target 71 is positioned at the center of the image obtained by the upper camera 60. be able to.
  • the control unit 22 uses the reference matching camera 110 to acquire the matching position.
  • the coincident position is the position of the chuck top 70 when all the first targets 103 simultaneously have a predetermined positional relationship with the second targets 71 corresponding to the first targets 103 in plan view.
  • the “predetermined positional relationship in plan view” refers to, for example, a positional relationship in which the center of the first target 103 overlaps the center of the second target 71 corresponding to the first target 103 in plan view.
  • the chuck top 70 is moved by the aligner 50 so as to be positioned below the probe card 100 as shown in FIG.
  • a matching position is acquired based on the detection result of the position detection mechanism of the aligner 50 .
  • the contact position is obtained by the control unit 22 based on the representative position of the probe 102 with respect to the probe reference position and the representative position of the electrode P with respect to the electrode reference position, and the contact position is obtained based on the matching position obtained in step S2c. is corrected. That is, the control unit 22 acquires a temporary contact position based on the representative position of the probe 102 with respect to the probe reference position and the representative position of the electrode P with respect to the electrode reference position, and the temporary contact position is obtained in step S2c. The corrected temporary contact position is determined as the contact position. Correcting the tentative contact position based on the matching position means, in other words, that the probe reference position and the electrode reference position are associated with each other.
  • the matching position information is information for associating the probe reference position with the electrode reference position.
  • the control unit 22 corrects the provisional contact position B3 based on the positional deviation D of the matching position B2 from the contact reference position B1. is determined as the contact position B4.
  • the contact reference position B1 is predetermined, for example. Further, the contact reference position B1 is set by the control unit 22 as (1) It may be obtained based on the representative position of the first target 103 of the probe card 100 as the probe reference position and the predetermined electrode reference position, (2) may be obtained based on a predetermined probe reference position and a representative position of the second target 71 on the chuck top 70 as an electrode reference position; (3) It may be obtained based on the representative position of the first target 103 of the probe card 100 as the probe reference position and the representative position of the second target 71 of the chuck top 70 as the electrode reference position.
  • the controller 22 acquires the horizontal positional change of the second target 71 with respect to the probe card 100 using the reference alignment camera 110, and based on the acquired result, the position of the chuck top 70 is determined. is corrected. Specifically, during the ascent, the position change in the horizontal direction is acquired by the control unit 22 using the reference matching camera 110, and the position of the chuck top 70 is corrected from the contact position so as to cancel this position change.
  • a pattern such as a square pattern may be provided around the first target 103 on the probe card 100 so that the change in the horizontal position of the second target 71 with respect to the probe card 100 can be easily obtained.
  • Step S4 Adsorption of chuck top 70
  • the chuck top 70 is attracted to the pogo frame 90 under the control of the controller 22 .
  • a decompression mechanism (not shown) or the like is controlled, and the Z stage 53 of the aligner 50 is lowered. It is separated from the aligner 50 and attached to the pogo frame 90 .
  • Step S5 Inspection After the chuck top 70 and the aligner 50 are separated, the electrical characteristics of the electronic devices formed on the wafer W are inspected. An electrical signal for electrical characteristic inspection is input from the tester 40 to the electronic device via the pogo pins 91, the probes 102, and the like.
  • the wafer W after inspection is unloaded. Specifically, the chuck top 70 sucked to the pogo frame 90 is delivered to and held by the aligner 50 . Also, the inspected wafer W on the chuck top 70 held by the aligner 50 is unloaded from the inspection area 13 by the transport device 30 and returned to the cassette C in the port 20 of the loading/unloading area 11 . During the inspection by one tester 40 , the aligner 50 transports the wafer W to be inspected to another tester 40 and recovers the wafer W after inspection from the other tester 40 .
  • the moving distance from the position where the information for associating the probe reference position and the electrode reference position to the contact position is shorter than in the comparison mode. Therefore, even if the housing 10 is distorted as described above, the probes 102 and the electrodes P can be brought into contact with each other more appropriately.
  • the representative position of the first target 103 may be used as the probe reference position.
  • the probes 102 and the electrodes P can be brought into contact more appropriately. For example, even when the probe card 100 expands or contracts due to a temperature change of the probe card 100, the probes 102 and the electrodes P can be properly contacted.
  • the representative position of the second target 71 may be used as the electrode reference position.
  • the probes 102 and the electrodes P can be brought into more appropriate contact regardless of the state of the chuck top 70 .
  • the probes 102 and the electrodes P can be properly brought into contact with each other.
  • the horizontal position change of the second target 71 with respect to the probe card 100 is acquired using the reference alignment camera 110, and based on the acquired result, the chuck top 70 is The position may be modified. As a result, the probes 102 and the electrodes P can be properly brought into contact with each other even when the positional change occurs while the chuck top 70 is ascending.
  • the first target 103 is provided on the probe card 100 in the above example, the first target may be provided on the pogo frame 90 . Specifically, the first target may be provided within a region surrounded by the bellows 93 on the lower surface of the pogo frame 90 .
  • the aligner 50 is provided with the reference matching camera 110 for simultaneously detecting the first target 103 and the second target 71, and the first target 103 is imaged through the second target 71.
  • the reference matching camera for the simultaneous detection may be provided on the pogo frame 90 .
  • the control unit 22 uses the reference alignment camera 110 to acquire the change in the horizontal position of the first target 103 with respect to the chuck top 70, and based on the acquisition result, , the position of the chuck top 70 may be corrected.
  • control unit 50 aligner 60 upper camera 70 chuck top 71 second target 80 lower camera 90 pogo frame 100 probe card 102 probe 103 first target 110 reference matching camera B2 match position B3 contact position B4 contact position P electrode W wafer

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
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PCT/JP2022/034418 2021-09-28 2022-09-14 検査装置及び検査方法 Ceased WO2023053968A1 (ja)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05198662A (ja) * 1991-08-01 1993-08-06 Tokyo Electron Yamanashi Kk プローブ装置及び同装置におけるアライメント方法
JP2010219110A (ja) * 2009-03-13 2010-09-30 Techno Horon:Kk プローブ方法及びプローブ装置
JP2019145742A (ja) * 2018-02-23 2019-08-29 東京エレクトロン株式会社 コンタクト精度保証方法、コンタクト精度保証機構、および検査装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012204695A (ja) 2011-03-25 2012-10-22 Tokyo Electron Ltd プローブカード検出装置、ウエハの位置合わせ装置及びウエハの位置合わせ方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05198662A (ja) * 1991-08-01 1993-08-06 Tokyo Electron Yamanashi Kk プローブ装置及び同装置におけるアライメント方法
JP2010219110A (ja) * 2009-03-13 2010-09-30 Techno Horon:Kk プローブ方法及びプローブ装置
JP2019145742A (ja) * 2018-02-23 2019-08-29 東京エレクトロン株式会社 コンタクト精度保証方法、コンタクト精度保証機構、および検査装置

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