JP7737852B2 - 検査装置及び検査方法 - Google Patents

検査装置及び検査方法

Info

Publication number
JP7737852B2
JP7737852B2 JP2021158082A JP2021158082A JP7737852B2 JP 7737852 B2 JP7737852 B2 JP 7737852B2 JP 2021158082 A JP2021158082 A JP 2021158082A JP 2021158082 A JP2021158082 A JP 2021158082A JP 7737852 B2 JP7737852 B2 JP 7737852B2
Authority
JP
Japan
Prior art keywords
probe
target
targets
acquiring
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021158082A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023048650A (ja
JP2023048650A5 (enExample
Inventor
顕太朗 小西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2021158082A priority Critical patent/JP7737852B2/ja
Priority to KR1020247012521A priority patent/KR20240068698A/ko
Priority to PCT/JP2022/034418 priority patent/WO2023053968A1/ja
Priority to CN202280063312.XA priority patent/CN117981064A/zh
Publication of JP2023048650A publication Critical patent/JP2023048650A/ja
Publication of JP2023048650A5 publication Critical patent/JP2023048650A5/ja
Application granted granted Critical
Publication of JP7737852B2 publication Critical patent/JP7737852B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2021158082A 2021-09-28 2021-09-28 検査装置及び検査方法 Active JP7737852B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2021158082A JP7737852B2 (ja) 2021-09-28 2021-09-28 検査装置及び検査方法
KR1020247012521A KR20240068698A (ko) 2021-09-28 2022-09-14 검사 장치 및 검사 방법
PCT/JP2022/034418 WO2023053968A1 (ja) 2021-09-28 2022-09-14 検査装置及び検査方法
CN202280063312.XA CN117981064A (zh) 2021-09-28 2022-09-14 检查装置和检查方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021158082A JP7737852B2 (ja) 2021-09-28 2021-09-28 検査装置及び検査方法

Publications (3)

Publication Number Publication Date
JP2023048650A JP2023048650A (ja) 2023-04-07
JP2023048650A5 JP2023048650A5 (enExample) 2024-08-07
JP7737852B2 true JP7737852B2 (ja) 2025-09-11

Family

ID=85779983

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021158082A Active JP7737852B2 (ja) 2021-09-28 2021-09-28 検査装置及び検査方法

Country Status (4)

Country Link
JP (1) JP7737852B2 (enExample)
KR (1) KR20240068698A (enExample)
CN (1) CN117981064A (enExample)
WO (1) WO2023053968A1 (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010219110A (ja) 2009-03-13 2010-09-30 Techno Horon:Kk プローブ方法及びプローブ装置
JP2019145742A (ja) 2018-02-23 2019-08-29 東京エレクトロン株式会社 コンタクト精度保証方法、コンタクト精度保証機構、および検査装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05198662A (ja) * 1991-08-01 1993-08-06 Tokyo Electron Yamanashi Kk プローブ装置及び同装置におけるアライメント方法
JP2012204695A (ja) 2011-03-25 2012-10-22 Tokyo Electron Ltd プローブカード検出装置、ウエハの位置合わせ装置及びウエハの位置合わせ方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010219110A (ja) 2009-03-13 2010-09-30 Techno Horon:Kk プローブ方法及びプローブ装置
JP2019145742A (ja) 2018-02-23 2019-08-29 東京エレクトロン株式会社 コンタクト精度保証方法、コンタクト精度保証機構、および検査装置

Also Published As

Publication number Publication date
KR20240068698A (ko) 2024-05-17
JP2023048650A (ja) 2023-04-07
CN117981064A (zh) 2024-05-03
WO2023053968A1 (ja) 2023-04-06

Similar Documents

Publication Publication Date Title
US11346861B2 (en) Contact accuracy assurance method, contact accuracy assurance mechanism, and inspection apparatus
JP7153556B2 (ja) 温度測定部材、検査装置及び温度測定方法
CN113874693A (zh) 载置台、检查装置和温度校正方法
US11933839B2 (en) Inspection apparatus and inspection method
US20080059095A1 (en) Electronic Device Handling Apparatus and Defective Terminal Determination Method
CN111446183A (zh) 卡盘顶、检查装置以及卡盘顶的回收方法
US11408926B2 (en) Electrical connecting device, inspection apparatus, and method for electrical connection between contact target and contact member
JP7737852B2 (ja) 検査装置及び検査方法
JP7784890B2 (ja) 検査装置及び検査方法
US11467208B2 (en) Contact release method in inspection apparatus and inspection apparatus
JP7558038B2 (ja) 検査装置における接触解除方法及び検査装置
KR101218507B1 (ko) 프로브 장치
US20250208169A1 (en) Inspection method and inspection device
WO2023127490A1 (ja) 検査装置及び検査方法
JP2023152601A (ja) 検査方法及び検査装置
CN118974901A (zh) 检查方法和检查装置
KR20180010480A (ko) 반도체 소자 테스트 방법
JPWO2007148422A1 (ja) 電子部品試験装置のキャリブレーション方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240730

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240730

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250805

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250901

R150 Certificate of patent or registration of utility model

Ref document number: 7737852

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150