WO2023045429A1 - Dispositif de dissipation de chaleur - Google Patents

Dispositif de dissipation de chaleur Download PDF

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Publication number
WO2023045429A1
WO2023045429A1 PCT/CN2022/099196 CN2022099196W WO2023045429A1 WO 2023045429 A1 WO2023045429 A1 WO 2023045429A1 CN 2022099196 W CN2022099196 W CN 2022099196W WO 2023045429 A1 WO2023045429 A1 WO 2023045429A1
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WO
WIPO (PCT)
Prior art keywords
channel
liquid inlet
refrigerant
heat dissipation
inlet chamber
Prior art date
Application number
PCT/CN2022/099196
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English (en)
Chinese (zh)
Inventor
孟西陵
李婷
周伟
荣朝运
邓南建
张伟
黄敬伟
Original Assignee
上海精智实业股份有限公司
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Publication of WO2023045429A1 publication Critical patent/WO2023045429A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes

Definitions

  • the present application relates to the technical field of communications, for example, to radiators.
  • chip technology has been extensively developed, resulting in an increase in the power of chips and the power of outdoor communication base station equipment.
  • the chip will release a large amount of heat. If the heat cannot be discharged in time at this time, the chip will be damaged due to the temperature rise.
  • the first method is to dissipate heat through the natural convection of the substrate, and use air flow to achieve heat exchange.
  • the heat dissipation effect is poor and it is difficult to meet the cooling needs of communication equipment;
  • the two ends of the material are respectively provided with an inlet and an outlet, so that the refrigerant enters the base material through the inlet, and the refrigerant absorbs the heat in the base material and is discharged from the outlet. Due to the continuous supply and discharge of refrigerant during the heat dissipation process, the additional pump or related pipelines lead to a complex structure and a large space occupation, resulting in high production costs.
  • the application provides a radiator with good heat dissipation effect and low production cost.
  • the application provides a heat sink for cooling chips, including:
  • a base assembly, a liquid inlet chamber is arranged inside the base assembly, and the liquid inlet chamber is configured to accommodate refrigerant;
  • a guide gear assembly is arranged in the liquid inlet chamber
  • the heat dissipation fins are arranged on the base assembly and extend in the vertical direction, a channel is arranged in the heat dissipation fins, the passage has a top end and a bottom end, and the bottom end of the passage communicates with the inlet liquid Cavity;
  • the base assembly is configured such that when the position where the base assembly and the chip are bonded is heated, the heat is transferred to the liquid inlet chamber through the base assembly, so that the refrigerant in the liquid inlet chamber boils and vaporizes A gaseous refrigerant is formed;
  • the channel is configured such that the gaseous refrigerant passes through the channel and enters the top to condense to form a liquid refrigerant, and the liquid refrigerant can flow back into the liquid inlet cavity through the channel.
  • Fig. 1 is the structural representation of the radiator of the present application
  • Fig. 2 is the sectional view of radiator of the present application
  • Fig. 3 is the explosion schematic diagram of the radiator of the present application.
  • Fig. 4 is the schematic structural view of the bottom plate of the radiator of the present application.
  • Fig. 5 is a partial enlarged view at A of Fig. 4;
  • Fig. 6 is a schematic structural view of the bottom board of the radiator of the present application.
  • Fig. 7 is a cross-sectional view of the cooling fins in the radiator of the present application.
  • connection should be understood in a broad sense, for example, it can be a fixed connection, or a detachable connection, or integrated; it can be a mechanical connection, or a Electrical connection; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components.
  • connection can be a fixed connection, or a detachable connection, or integrated; it can be a mechanical connection, or a Electrical connection; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components.
  • a first feature being "on” or “under” a second feature may include that the first and second features are in direct contact, and may also include that the first and second features are not in direct contact but pass between them. additional feature contacts.
  • “above”, “above” and “above” the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or means that the first feature is horizontally higher than the second feature.
  • “Below”, “beneath” and “under” the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or means that the first feature has a lower level than the second feature.
  • the chip As the controller of the communication process, the chip, as the controller of the communication process, has great application prospects. Since the chip is prone to generate large amounts of heat during long-term use, if the heat cannot be discharged in time, it will cause damage to the chip to a certain extent.
  • Related radiators used for heat dissipation of chips have the problems of poor heat dissipation effect, high production cost, and difficulties in satisfying user needs.
  • the heat sink for example: a heat sink used for communication settings
  • the heat sink includes a base assembly 1 and cooling fins 3, on the base assembly 1
  • the positions of the base assembly 1 and the cooling fins 3 can be arranged in various forms, and the base assembly 1 can be arranged in a horizontal direction or in a vertical direction. If the base assembly 1 is arranged in the horizontal direction, the cooling fins 3 are vertically arranged on the base assembly 1;
  • a base component 1 can be used to fix the cooling fins 3 , with a simple structure and good structural stability.
  • a chip is pasted on the side of the base assembly 1 far away from the cooling fins 3.
  • a channel 31 is provided in the cooling fin 3, the channel 31 has a top end and a bottom end, the bottom end of the channel 31 is connected to the liquid inlet chamber 11, and the top end of the channel 31 is configured to condense the gaseous refrigerant into a liquid refrigerant .
  • the liquid refrigerant in the liquid inlet chamber 11 will quickly boil and vaporize to form a gaseous refrigerant after being heated.
  • the gaseous refrigerant diffuses to the top of the cooling fin 3 through the channel 31, and enters the top of the channel 31 to condense to form a liquid refrigerant. After that, the liquid refrigerant is condensed under the action of gravity It flows back into the liquid inlet chamber 11 through the channel 31 to form a complete circulation loop.
  • the inner diameter of the channel 31 is very small, so the channel 31 can also be called a micro channel.
  • the radiator when the position where the base assembly 1 and the chip are bonded is heated, the heat is transferred to the liquid inlet chamber 11 through the base assembly 1, so that the liquid refrigerant in the liquid inlet chamber 11 will quickly boil and vaporize after being heated.
  • a gaseous refrigerant is formed.
  • the gaseous refrigerant diffuses to the top of the cooling fins 3 through the channel 31 , and realizes rapid heat dissipation under the condensation of the channel 31 , and finally enters the top of the channel 31 to condense to form a liquid refrigerant.
  • the liquid refrigerant can flow back into the liquid inlet chamber 11 through the channel 31 to realize a complete refrigerant circulation loop, which is continuously realized in the two spaces of the liquid inlet chamber 11 of the radiator and the top of the channel 31
  • the two-phase flow is converted so that the base assembly 1 as the heating end and the heat dissipation fin 3 as the condensing end reach a state of rapid temperature uniformity, so that the heat from the heat-generating part of the chip is taken away by the radiator to achieve the purpose of rapid cooling.
  • the radiator uses the heat exchange method of the refrigerant to be vaporized, condensed, liquefied and refluxed, which improves the heat dissipation effect, and does not require additional pumps and connecting pipelines.
  • Heat dissipation can be realized by opening a cavity structure inside, the structure is simple, the floor space is small, and the production cost is low.
  • a guide gear assembly 2 is provided in the liquid inlet chamber 11.
  • This arrangement has the following purposes: first, by providing the guide gear assembly 2 in the liquid inlet chamber 11, the inlet The heat dissipation area of the refrigerant in the liquid cavity 11 is equivalent to that before the heat dissipation of the heat dissipation tooth piece 3, the guide tooth piece assembly 2 performs pre-heat dissipation, and the heat dissipation effect is good; phenomenon and the phenomenon that the non-wetting liquid decreases in the thin tube, the refrigerant is the wetting liquid, and the guide tooth assembly 2 is arranged in the liquid inlet chamber 11, and the refrigerant will appear liquid along the outer surface of the guide tooth assembly 2 under capillary action.
  • the distance between the heat dissipation fins 3 and the liquid inlet chamber 11 is reduced to ensure that the refrigerant quickly enters the passage 31 in the heat dissipation fins 3 .
  • the refrigerant will flow along the outer side of the guide gear assembly 2 , and the guide gear assembly 2 plays a role of guiding the refrigerant to realize the planning of the flow path of the refrigerant.
  • the guide gear assembly 2 includes a plurality of guide gears 21 arranged in parallel at intervals, and the guide gears 21 extend vertically to divide the liquid inlet chamber 11 into multiple flow channels.
  • Each guide tooth piece 21 is provided with a gap 22 , and the gap 22 communicates with the liquid inlet chamber 11 .
  • the gap 22 divides the guide tooth piece 21 into a single structure.
  • a certain volume of refrigerant prevents the refrigerant from directly collecting in the lower half of the liquid inlet chamber 11 to ensure uniform dispersion of the refrigerant in the liquid inlet chamber 11 .
  • the base assembly 1 includes a bottom board 12 and a bottom board 13 , the bottom board 12 is manufactured by forging or liquid die forging, and the bottom board 13 is formed by stamping composite materials.
  • the bottom board 13 is located above the bottom board 12 and connected thereto.
  • the bottom board 13 and the bottom board 12 are arranged parallel to each other and form a liquid inlet chamber 11 therebetween.
  • the liquid inlet chamber 11 is a gap between the base plate 12 and the bottom inserting plate 13, and the volume for accommodating the refrigerant is relatively small.
  • the accommodation groove 123 when the bottom surface of the bottom plate 13 and the top surface of the bottom plate 12 are fitted together, the bottom plate 13 is covered on the accommodation groove 123, in addition to ensuring that the liquid inlet chamber 11 has a certain volume, it can also prevent the refrigerant from flowing The liquid inlet chamber 11 overflows to realize the function of encapsulating the refrigerant.
  • the bottom board 13 When the radiator is assembled, the bottom board 13 can be installed on the bottom plate 12 . In order to ensure the installation accuracy between the bottom board 13 and the bottom board 12, as shown in FIGS.
  • the limiting column 121 can pass through the limiting hole 131 . Through the mutual cooperation of the limiting post 121 and the limiting hole 131 , a good positioning effect between the bottom board 13 and the bottom plate 12 can be achieved to ensure precise alignment between the two.
  • a limiting column 121 is provided on the side of the base plate 12 close to the bottom board 13, and a limiting hole 131 is provided on the bottom board 13 corresponding to the limiting column 121.
  • the limiting column 121 is a cylindrical structure, limiting The positioning hole 131 is a round hole structure, and the limiting column 121 is plugged into the limiting hole 131, which has a simple structure and is easy to use.
  • the limiting column 121 can have two types: the first limiting column and the second limiting column.
  • the number of the first limit posts can be multiple, and the plurality of first limit posts are arranged around the receiving groove 123 or outside the receiving groove 123, and each first stop post passes through a corresponding The corresponding limiting hole 131 is used for limiting the position of the bottom plate 12 in the outer area of the receiving groove 123 .
  • the number of the second limiting posts can be multiple, and a plurality of second limiting posts are arranged in the interior of the receiving groove 123 in parallel and at intervals, and each second limiting post passes through a corresponding limiting hole 131 for use
  • the bottom plate 12 is located in the inner area of the accommodating groove 123 .
  • a limit platform is set, the limit platform is equivalent to making up the height of the second limit post, and realizes the effect of padding the height of the second limit post, thereby ensuring
  • the heights of the top surfaces of the two kinds of limiting posts 121 are kept the same, so as to avoid the protruding situation of the cooling fins 3 .
  • the base assembly 1 and the cooling fins 3 are connected by high-temperature brazing.
  • the solder can include powder texture, and it is welded by high temperature brazing process, which is easy to operate and reliable in structure.
  • a support column 122 is provided on the side of the bottom board 12 close to the bottom board 13 , the support post 122 can be set in the receiving groove 123 of the bottom board 12 , and the bottom board 12 is connected to the bottom board 13 through the support post 122 .
  • the support column 122 has two functions: first, the support column 122 plays the role of carrying the bottom board 13, preventing the bottom board 13 from collapsing in the area corresponding to the receiving groove 123; secondly, the support column 122
  • the top surface of the top surface provides a welding position for high-temperature brazing, that is, the supporting column 122 is the welding position between the bottom plate 12 and the bottom plate 13, which realizes the planning of the welding path, and the welding strength is high to ensure the stability of the overall structure.
  • the pipe 4 communicates with the liquid inlet chamber 11 and delivers the refrigerant thereto, so that the refrigerant can be delivered into the liquid inlet chamber 11 through the liquid injection pipe 4 to realize sufficient replenishment of the refrigerant.
  • a circular hole may be provided on the bottom plate 13 , and the liquid injection pipe 4 is passed through the circular hole to provide sufficient refrigerant for the liquid inlet chamber 11 .
  • the liquid injection pipe 4 can adopt a curved pipe structure, which is used to avoid the bottom plate 13 and the cooling fins 3. There can be a certain distance between the bottom end of the liquid injection pipe 4 and the bottom wall of the receiving tank 123 to avoid liquid injection. The bottom of the pipe 4 is clogged and causes poor circulation.
  • a first insertion hole 132 is provided on the bottom board 13, and a first protrusion 32 is correspondingly provided on the bottom of the cooling fin 3, and the first protrusion 32 penetrates through the second A socket 132 .
  • the first insertion hole 132 is a through hole with a strip structure, and the first protrusion 32 extends along the length direction of the cooling fin 3 , so that the first protrusion 32 can be plugged into the first insertion hole 132 .
  • the number and length of each first insertion hole 132 can be matched with the corresponding first bump 32 .
  • the cooling fins 3 are made of aluminum plate, which has excellent heat dissipation performance and good heat transfer effect.
  • the number of cooling fins 3 can be multiple, a plurality of cooling fins 3 are arranged in parallel at intervals, a group of guide fin assemblies 2 are arranged between two adjacent cooling fins 3, and the types of the plurality of cooling fins 3 are at least A sort of. In this embodiment, the quantity and type of the cooling fins 3 can be adjusted according to actual production needs.
  • the difference between different types of cooling fins 3 lies in the following aspects: first, the length of the cooling fins 3, the length of the cooling fins 3 in the middle is longer, and the length of the cooling fins 3 on both sides is shorter;
  • a plurality of passages 31 are provided inside, and the passages 31 are connected to each other or not connected to each other.
  • the purpose of setting the interval is, first, the interval is the partition between adjacent two passages 31, ensuring that each passage 31 The independence of each channel 31 will not affect the working status of other channels 31 due to the blockage of the respective channels 31; second, the outer wall of the interval guides the refrigerant entering the channel 31, ensuring the smooth flow of the refrigerant in the channel 31 Third, the outer wall of the interval increases the heat dissipation area and improves the heat dissipation effect.
  • the cooling fins 3 are extruded from a micro-channel aluminum plate, adopting an integral molding structure, which reduces parts assembly and assembling links, and lowers production costs.
  • the two sides of the cooling fins 3 are pressed in a direction close to each other and abut against each other, forming a gap at the abutting position, and the gap divides the cavity of the cooling fins 3 into Channel 31.
  • the interval corresponds to the setting of the avoidance groove, and the interval is greater than the diameter of the limit post 121, so that the position of the heat dissipation tooth plate 3 corresponding to the limit post 121 is not provided with a channel 31, so as to avoid the passage 31 due to the setting of the limit post 121. Blockage affects heat dissipation efficiency.
  • the refrigerant will flow among the plurality of channels 31, which increases the flow path of the refrigerant, prolongs the length of heat dissipation, and improves the heat dissipation effect.
  • the channel 31 includes a horizontal flow channel 311 and a vertical flow channel 312
  • the vertical flow channel 312 is perpendicular to the horizontal flow channel 311 to form an L-shaped structure
  • one end of the horizontal flow channel 311 communicates with the liquid inlet chamber 11
  • the other end communicates with the vertical channel 312.
  • this L-shaped structure plays a role of direction conversion, so that the vertical channel 312 can also be arranged in the vertical direction, so that the gaseous refrigerant formed by the boiling and gasification of the refrigerant can reach the channel smoothly 31 top.
  • At least one communication flow channel 34 is provided in each cooling fin 3 , through which a plurality of channels 31 communicate with each other, and the refrigerant in one channel 31 enters other channels through the communication flow channel 34 In 31, the path of refrigerant flow is tortuous, and the flow path is diversified.
  • the position of the communication channel 34 can be in various ways, and the communication channel 34 can be arranged parallel to the horizontal plane, or can be arranged obliquely relative to the horizontal plane.
  • the communication channel 34 in this embodiment can be divided into two types: a first communication channel and a second communication channel. Since the cooling fins 3 extend in the vertical direction, the first communication channel is arranged parallel to the horizontal plane. When the channel 31 extends in the vertical direction, the first communication channel plays a role of transverse conduction. The second communication flow channel is arranged obliquely relative to the horizontal plane.
  • the second communication flow channel is arranged obliquely upward relative to the horizontal plane, so as to guide the gaseous refrigerant upward while realizing the communication of the channel 31 .
  • the second communication flow channel is disposed near the connection of the horizontal flow channel 311 and the vertical flow channel 312 , that is, the second communication flow channel is disposed near the corner of the channel 31 .
  • a through groove 33 is opened at the bottom of the cooling fin 3 , the through groove 33 communicates with the channel 31 , and the extending direction of the through groove 33 and the extending direction of the channel 31 are perpendicular to each other. If there is no passage 31 at the bottom of the heat dissipation fin 3, only the bottom port of the passage 31 can transport the refrigerant.
  • the through groove 33 is a rectangular groove structure, and the through groove 33 communicates with the
  • the channel 31 is equivalent to increasing the contact area between the bottom of the channel 31 and the liquid inlet chamber 11, so that the bottom port and both sides of the channel 31 can provide the entrance for the refrigerant to enter the channel 31, which facilitates the transportation of the refrigerant.
  • the heat sink has passed the comparative heat test, and the heat uniformity performance and heat dissipation capacity of the heat sink are better than the original aluminum heat sink made of die-casting or extruded material.
  • the temperature difference between the liquid inlet chamber 11 and the top of the channel 31 is ⁇ 3°C , reducing the temperature range.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention divulgue un dispositif de dissipation de chaleur. Le dispositif de dissipation de chaleur comprend : un ensemble siège, une cavité d'entrée de liquide étant disposée à l'intérieur de l'ensemble siège, et la cavité d'entrée de liquide étant configurée pour recevoir un réfrigérant ; un ensemble feuille dentée de guidage, disposé dans la cavité d'entrée de liquide ; et une feuille dentée de dissipation de chaleur, disposée sur l'ensemble siège et s'étendant dans une direction verticale, un passage étant ménagé dans la feuille dentée de dissipation de chaleur, le passage présentant une extrémité supérieure et une extrémité inférieure, et l'extrémité inférieure du passage étant en communication avec la cavité d'entrée de liquide. L'ensemble siège est configuré de sorte que lorsqu'une position dans laquelle l'ensemble siège est fixé à une puce est chauffée, de la chaleur est transférée à la cavité d'entrée de liquide par l'intermédiaire de l'ensemble siège, de sorte que le réfrigérant dans la cavité d'entrée de liquide est porté à ébullition et vaporisé pour former un réfrigérant gazeux. Le passage est configuré de sorte que le réfrigérant gazeux entre dans l'extrémité supérieure à travers le passage pour se condenser pour former un réfrigérant liquide, de sorte que le réfrigérant liquide peut refluer vers la cavité d'entrée de liquide à travers le passage.
PCT/CN2022/099196 2021-09-22 2022-06-16 Dispositif de dissipation de chaleur WO2023045429A1 (fr)

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CN202111107800.XA CN113865393B (zh) 2021-09-22 2021-09-22 一种用于通讯设置的散热器
CN202111107800.X 2021-09-22

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Cited By (1)

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CN116568008A (zh) * 2023-05-31 2023-08-08 小米汽车科技有限公司 液冷散热器、电机控制器及车辆

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CN113865393B (zh) * 2021-09-22 2023-02-03 上海精智实业股份有限公司 一种用于通讯设置的散热器
CN116709718A (zh) * 2022-02-25 2023-09-05 中兴智能科技南京有限公司 散热模块和散热器
CN115756120A (zh) * 2022-11-08 2023-03-07 广东英维克技术有限公司 散热器

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CN213208737U (zh) * 2020-09-25 2021-05-14 秦力峰 一种换热器组件
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CN208063649U (zh) * 2017-12-26 2018-11-06 讯凯国际股份有限公司 散热结构
JP3218376U (ja) * 2018-06-28 2018-10-11 泰碩電子股▲分▼有限公司 気液流路が毛細管構造および凸状部からなるベイパーチャンバー
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CN116568008A (zh) * 2023-05-31 2023-08-08 小米汽车科技有限公司 液冷散热器、电机控制器及车辆
CN116568008B (zh) * 2023-05-31 2024-02-23 小米汽车科技有限公司 液冷散热器、电机控制器及车辆

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