WO2023045429A1

WO2023045429A1 - Heat dissipation device

Info

Publication number: WO2023045429A1
Application number: PCT/CN2022/099196
Authority: WO
Inventors: 孟西陵; 李婷; 周伟; 荣朝运; 邓南建; 张伟; 黄敬伟
Original assignee: 上海精智实业股份有限公司
Priority date: 2021-09-22
Filing date: 2022-06-16
Publication date: 2023-03-30
Also published as: CN113865393B; CN113865393A

Abstract

The present application discloses a heat dissipation device. The heat dissipation device comprises: a seat assembly, a liquid inlet cavity being disposed inside the seat assembly, and the liquid inlet cavity being configured to accommodate a refrigerant; a guide toothed sheet assembly, disposed in the liquid inlet cavity; and a heat dissipation toothed sheet, disposed on the seat assembly and extending in a vertical direction, a passage being provided in the heat dissipation toothed sheet, the passage having a top end and a bottom end, and the bottom end of the passage being in communication with the liquid inlet cavity. The seat assembly is configured such that when a position where the seat assembly is attached to a chip is heated, heat is transferred to the liquid inlet cavity via the seat assembly, so that the refrigerant in the liquid inlet cavity is boiled and vaporized to form a gaseous refrigerant. The passage is configured such that the gaseous refrigerant enters the top end through the passage to condense to form a liquid refrigerant, so that the liquid refrigerant can flow back to the liquid inlet cavity through the passage.

Description

heat sink

This application claims the priority of the Chinese patent application with application number 202111107800.X filed with the China Patent Office on September 22, 2021, the entire content of which is incorporated herein by reference.

technical field

The present application relates to the technical field of communications, for example, to radiators.

Background technique

With the enrichment of people's lives and the rapid development of 5G communication technology, chip technology has been extensively developed, resulting in an increase in the power of chips and the power of outdoor communication base station equipment. As the power of the chip increases and the use time is prolonged, the chip will release a large amount of heat. If the heat cannot be discharged in time at this time, the chip will be damaged due to the temperature rise.

Related heat dissipation equipment mainly adopts the following two methods. The first method is to dissipate heat through the natural convection of the substrate, and use air flow to achieve heat exchange. The heat dissipation effect is poor and it is difficult to meet the cooling needs of communication equipment; The two ends of the material are respectively provided with an inlet and an outlet, so that the refrigerant enters the base material through the inlet, and the refrigerant absorbs the heat in the base material and is discharged from the outlet. Due to the continuous supply and discharge of refrigerant during the heat dissipation process, the additional pump or related pipelines lead to a complex structure and a large space occupation, resulting in high production costs.

Contents of the invention

The application provides a radiator with good heat dissipation effect and low production cost.

The application provides a heat sink for cooling chips, including:

A base assembly, a liquid inlet chamber is arranged inside the base assembly, and the liquid inlet chamber is configured to accommodate refrigerant;

A guide gear assembly is arranged in the liquid inlet chamber;

The heat dissipation fins are arranged on the base assembly and extend in the vertical direction, a channel is arranged in the heat dissipation fins, the passage has a top end and a bottom end, and the bottom end of the passage communicates with the inlet liquid Cavity; where,

The base assembly is configured such that when the position where the base assembly and the chip are bonded is heated, the heat is transferred to the liquid inlet chamber through the base assembly, so that the refrigerant in the liquid inlet chamber boils and vaporizes A gaseous refrigerant is formed; the channel is configured such that the gaseous refrigerant passes through the channel and enters the top to condense to form a liquid refrigerant, and the liquid refrigerant can flow back into the liquid inlet cavity through the channel.

Description of drawings

Fig. 1 is the structural representation of the radiator of the present application;

Fig. 2 is the sectional view of radiator of the present application;

Fig. 3 is the explosion schematic diagram of the radiator of the present application;

Fig. 4 is the schematic structural view of the bottom plate of the radiator of the present application;

Fig. 5 is a partial enlarged view at A of Fig. 4;

Fig. 6 is a schematic structural view of the bottom board of the radiator of the present application;

Fig. 7 is a cross-sectional view of the cooling fins in the radiator of the present application.

In the picture:

1. Base assembly; 2. Guide tooth piece assembly; 3. Heat dissipation tooth piece; 4. Liquid injection pipe;

11. Liquid inlet chamber; 12. Bottom plate; 13. Bottom insert plate;

121, limit column; 122, support column; 123, accommodation groove; 131, limit hole; 132, first jack;

21. Guide tooth piece; 22. Clearance;

31. Channel; 311. Horizontal flow channel; 312. Vertical flow channel; 32. First bump; 33. Through groove; 34. Connecting flow channel.

Detailed ways

The present embodiment will be described below in conjunction with the accompanying drawings, and the described embodiment is a part of the embodiments of the present application, but not all of the embodiments.

In the description of this application, the terms "connected", "connected" and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, or a detachable connection, or integrated; it can be a mechanical connection, or a Electrical connection; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components. Those skilled in the art can understand the meanings of the above terms in this application according to the actual situation.

In this application, a first feature being "on" or "under" a second feature may include that the first and second features are in direct contact, and may also include that the first and second features are not in direct contact but pass between them. additional feature contacts. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or means that the first feature is horizontally higher than the second feature. "Below", "beneath" and "under" the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or means that the first feature has a lower level than the second feature.

The technical solution of the present application will be described below in conjunction with the accompanying drawings.

In the communication field, the chip, as the controller of the communication process, has great application prospects. Since the chip is prone to generate large amounts of heat during long-term use, if the heat cannot be discharged in time, it will cause damage to the chip to a certain extent. Related radiators used for heat dissipation of chips have the problems of poor heat dissipation effect, high production cost, and difficulties in satisfying user needs.

This embodiment provides a heat sink (for example: a heat sink used for communication settings), used for chip cooling, as shown in Figure 1, the heat sink includes a base assembly 1 and cooling fins 3, on the base assembly 1 There are cooling gears 3 arranged on it, and the base assembly 1 plays the role of overall support. The positions of the base assembly 1 and the cooling fins 3 can be arranged in various forms, and the base assembly 1 can be arranged in a horizontal direction or in a vertical direction. If the base assembly 1 is arranged in the horizontal direction, the cooling fins 3 are vertically arranged on the base assembly 1; In this embodiment, a base component 1 can be used to fix the cooling fins 3 , with a simple structure and good structural stability.

A chip is pasted on the side of the base assembly 1 far away from the cooling fins 3. In order to dissipate heat from the chip in a timely and effective manner, as shown in FIG. Set to accommodate the refrigerant, a channel 31 is provided in the cooling fin 3, the channel 31 has a top end and a bottom end, the bottom end of the channel 31 is connected to the liquid inlet chamber 11, and the top end of the channel 31 is configured to condense the gaseous refrigerant into a liquid refrigerant . The liquid refrigerant in the liquid inlet chamber 11 will quickly boil and vaporize to form a gaseous refrigerant after being heated. The gaseous refrigerant diffuses to the top of the cooling fin 3 through the channel 31, and enters the top of the channel 31 to condense to form a liquid refrigerant. After that, the liquid refrigerant is condensed under the action of gravity It flows back into the liquid inlet chamber 11 through the channel 31 to form a complete circulation loop. In one embodiment, the inner diameter of the channel 31 is very small, so the channel 31 can also be called a micro channel.

In the radiator provided in this embodiment, when the position where the base assembly 1 and the chip are bonded is heated, the heat is transferred to the liquid inlet chamber 11 through the base assembly 1, so that the liquid refrigerant in the liquid inlet chamber 11 will quickly boil and vaporize after being heated. A gaseous refrigerant is formed. The gaseous refrigerant diffuses to the top of the cooling fins 3 through the channel 31 , and realizes rapid heat dissipation under the condensation of the channel 31 , and finally enters the top of the channel 31 to condense to form a liquid refrigerant. At this time, under the action of gravity, the liquid refrigerant can flow back into the liquid inlet chamber 11 through the channel 31 to realize a complete refrigerant circulation loop, which is continuously realized in the two spaces of the liquid inlet chamber 11 of the radiator and the top of the channel 31 The two-phase flow is converted so that the base assembly 1 as the heating end and the heat dissipation fin 3 as the condensing end reach a state of rapid temperature uniformity, so that the heat from the heat-generating part of the chip is taken away by the radiator to achieve the purpose of rapid cooling.

Compared with the natural convection heat dissipation method in the related art, the radiator uses the heat exchange method of the refrigerant to be vaporized, condensed, liquefied and refluxed, which improves the heat dissipation effect, and does not require additional pumps and connecting pipelines. Heat dissipation can be realized by opening a cavity structure inside, the structure is simple, the floor space is small, and the production cost is low.

As shown in Figure 3, a guide gear assembly 2 is provided in the liquid inlet chamber 11. This arrangement has the following purposes: first, by providing the guide gear assembly 2 in the liquid inlet chamber 11, the inlet The heat dissipation area of the refrigerant in the liquid cavity 11 is equivalent to that before the heat dissipation of the heat dissipation tooth piece 3, the guide tooth piece assembly 2 performs pre-heat dissipation, and the heat dissipation effect is good; phenomenon and the phenomenon that the non-wetting liquid decreases in the thin tube, the refrigerant is the wetting liquid, and the guide tooth assembly 2 is arranged in the liquid inlet chamber 11, and the refrigerant will appear liquid along the outer surface of the guide tooth assembly 2 under capillary action. When the surface is raised, the distance between the heat dissipation fins 3 and the liquid inlet chamber 11 is reduced to ensure that the refrigerant quickly enters the passage 31 in the heat dissipation fins 3 . Thirdly, the refrigerant will flow along the outer side of the guide gear assembly 2 , and the guide gear assembly 2 plays a role of guiding the refrigerant to realize the planning of the flow path of the refrigerant.

When the base assembly 1 is arranged in the vertical direction, the refrigerant in the liquid inlet chamber 11 will gather to the lower half of the liquid inlet chamber 11 under the action of gravity, resulting in insufficient refrigerant in the upper half of the liquid inlet chamber 11, which is not conducive to The refrigerant enters the cooling fins 3 located at the top of the liquid inlet chamber 11 . As shown in FIGS. 4-5 , the guide gear assembly 2 includes a plurality of guide gears 21 arranged in parallel at intervals, and the guide gears 21 extend vertically to divide the liquid inlet chamber 11 into multiple flow channels. Each guide tooth piece 21 is provided with a gap 22 , and the gap 22 communicates with the liquid inlet chamber 11 . By setting at least one gap 22 on the guide tooth piece 21, the gap 22 divides the guide tooth piece 21 into a single structure. A certain volume of refrigerant prevents the refrigerant from directly collecting in the lower half of the liquid inlet chamber 11 to ensure uniform dispersion of the refrigerant in the liquid inlet chamber 11 .

In one embodiment, as shown in FIG. 3 , the base assembly 1 includes a bottom board 12 and a bottom board 13 , the bottom board 12 is manufactured by forging or liquid die forging, and the bottom board 13 is formed by stamping composite materials. The bottom board 13 is located above the bottom board 12 and connected thereto. The bottom board 13 and the bottom board 12 are arranged parallel to each other and form a liquid inlet chamber 11 therebetween.

If the base plate 12 and the bottom inserting plate 13 are plate-like structures, the liquid inlet chamber 11 is a gap between the base plate 12 and the bottom inserting plate 13, and the volume for accommodating the refrigerant is relatively small. In order to ensure that the liquid inlet chamber 11 has a relatively large volume, optionally, as shown in FIG. The accommodation groove 123, when the bottom surface of the bottom plate 13 and the top surface of the bottom plate 12 are fitted together, the bottom plate 13 is covered on the accommodation groove 123, in addition to ensuring that the liquid inlet chamber 11 has a certain volume, it can also prevent the refrigerant from flowing The liquid inlet chamber 11 overflows to realize the function of encapsulating the refrigerant.

When the radiator is assembled, the bottom board 13 can be installed on the bottom plate 12 . In order to ensure the installation accuracy between the bottom board 13 and the bottom board 12, as shown in FIGS. The limiting column 121 can pass through the limiting hole 131 . Through the mutual cooperation of the limiting post 121 and the limiting hole 131 , a good positioning effect between the bottom board 13 and the bottom plate 12 can be achieved to ensure precise alignment between the two. In one embodiment, a limiting column 121 is provided on the side of the base plate 12 close to the bottom board 13, and a limiting hole 131 is provided on the bottom board 13 corresponding to the limiting column 121. The limiting column 121 is a cylindrical structure, limiting The positioning hole 131 is a round hole structure, and the limiting column 121 is plugged into the limiting hole 131, which has a simple structure and is easy to use.

In one embodiment, since the receiving groove 123 is provided in the middle of the bottom plate 12, according to the inner and outer regions of the receiving groove 123, the limiting column 121 can have two types: the first limiting column and the second limiting column. , the number of the first limit posts can be multiple, and the plurality of first limit posts are arranged around the receiving groove 123 or outside the receiving groove 123, and each first stop post passes through a corresponding The corresponding limiting hole 131 is used for limiting the position of the bottom plate 12 in the outer area of the receiving groove 123 . The number of the second limiting posts can be multiple, and a plurality of second limiting posts are arranged in the interior of the receiving groove 123 in parallel and at intervals, and each second limiting post passes through a corresponding limiting hole 131 for use The bottom plate 12 is located in the inner area of the accommodating groove 123 .

In one embodiment, since there is a height difference between the bottom wall of the receiving groove 123 and the top surface of the bottom plate 12, in order to ensure that the heights of the top surfaces of the first limiting column and the second limiting column remain consistent, an optional , between the second limit post and the bottom wall of the receiving groove 123, a limit platform is set, the limit platform is equivalent to making up the height of the second limit post, and realizes the effect of padding the height of the second limit post, thereby ensuring The heights of the top surfaces of the two kinds of limiting posts 121 are kept the same, so as to avoid the protruding situation of the cooling fins 3 .

If the cooling fins 3 and the bottom plate 13 are only fixed by plugging, it is difficult to ensure the fixing effect of the overall structure. Optionally, the base assembly 1 and the cooling fins 3 are connected by high-temperature brazing. The solder can include powder texture, and it is welded by high temperature brazing process, which is easy to operate and reliable in structure.

Optionally, a support column 122 is provided on the side of the bottom board 12 close to the bottom board 13 , the support post 122 can be set in the receiving groove 123 of the bottom board 12 , and the bottom board 12 is connected to the bottom board 13 through the support post 122 . The support column 122 has two functions: first, the support column 122 plays the role of carrying the bottom board 13, preventing the bottom board 13 from collapsing in the area corresponding to the receiving groove 123; secondly, the support column 122 The top surface of the top surface provides a welding position for high-temperature brazing, that is, the supporting column 122 is the welding position between the bottom plate 12 and the bottom plate 13, which realizes the planning of the welding path, and the welding strength is high to ensure the stability of the overall structure.

In order to ensure that the liquid inlet chamber 11 between the accommodation tank 123 and the bottom board 13 can be supplied with refrigerant in time, as shown in FIG. The pipe 4 communicates with the liquid inlet chamber 11 and delivers the refrigerant thereto, so that the refrigerant can be delivered into the liquid inlet chamber 11 through the liquid injection pipe 4 to realize sufficient replenishment of the refrigerant. As shown in FIG. 6 , in an embodiment, a circular hole may be provided on the bottom plate 13 , and the liquid injection pipe 4 is passed through the circular hole to provide sufficient refrigerant for the liquid inlet chamber 11 . The liquid injection pipe 4 can adopt a curved pipe structure, which is used to avoid the bottom plate 13 and the cooling fins 3. There can be a certain distance between the bottom end of the liquid injection pipe 4 and the bottom wall of the receiving tank 123 to avoid liquid injection. The bottom of the pipe 4 is clogged and causes poor circulation.

Since the bottom board 13 carries the cooling fins 3 , it also needs to fix the cooling fins 3 . To this end, as shown in Figure 3 and Figure 6, a first insertion hole 132 is provided on the bottom board 13, and a first protrusion 32 is correspondingly provided on the bottom of the cooling fin 3, and the first protrusion 32 penetrates through the second A socket 132 . Optionally, the first insertion hole 132 is a through hole with a strip structure, and the first protrusion 32 extends along the length direction of the cooling fin 3 , so that the first protrusion 32 can be plugged into the first insertion hole 132 . In this embodiment, the number and length of each first insertion hole 132 can be matched with the corresponding first bump 32 .

After the introduction of the base assembly 1 is completed, the heat dissipation fins 3 will be introduced in detail. As shown in FIG. 3 , the cooling fins 3 are made of aluminum plate, which has excellent heat dissipation performance and good heat transfer effect. The number of cooling fins 3 can be multiple, a plurality of cooling fins 3 are arranged in parallel at intervals, a group of guide fin assemblies 2 are arranged between two adjacent cooling fins 3, and the types of the plurality of cooling fins 3 are at least A sort of. In this embodiment, the quantity and type of the cooling fins 3 can be adjusted according to actual production needs.

The difference between different types of cooling fins 3 lies in the following aspects: first, the length of the cooling fins 3, the length of the cooling fins 3 in the middle is longer, and the length of the cooling fins 3 on both sides is shorter; The second, the quantity and the structure of the first bump 32 at the bottom of the fins 3, the first bump 32 can be a continuous strip structure, the first bump 32 can also be a discontinuous block structure; the third, An escape groove is provided at a position corresponding to the limiting post 121 at the bottom of the cooling fin 3 , and the avoiding groove is used for avoiding the limiting post 121 .

As shown in FIG. 3 and FIG. 7 , for each fin 3 , a plurality of passages 31 are provided inside, and the passages 31 are connected to each other or not connected to each other.

If a plurality of passages 31 are not connected to each other, there is an interval between two adjacent passages 31, the purpose of setting the interval is, first, the interval is the partition between adjacent two passages 31, ensuring that each passage 31 The independence of each channel 31 will not affect the working status of other channels 31 due to the blockage of the respective channels 31; second, the outer wall of the interval guides the refrigerant entering the channel 31, ensuring the smooth flow of the refrigerant in the channel 31 Third, the outer wall of the interval increases the heat dissipation area and improves the heat dissipation effect.

When producing and processing the cooling fins 3 , different processing methods can be adopted. Optionally, the cooling fins 3 are extruded from a micro-channel aluminum plate, adopting an integral molding structure, which reduces parts assembly and assembling links, and lowers production costs. Or after the cavity is formed in the cooling fins 3, the two sides of the cooling fins 3 are pressed in a direction close to each other and abut against each other, forming a gap at the abutting position, and the gap divides the cavity of the cooling fins 3 into Channel 31.

In this embodiment, the interval corresponds to the setting of the avoidance groove, and the interval is greater than the diameter of the limit post 121, so that the position of the heat dissipation tooth plate 3 corresponding to the limit post 121 is not provided with a channel 31, so as to avoid the passage 31 due to the setting of the limit post 121. Blockage affects heat dissipation efficiency.

If the plurality of channels 31 are connected to each other, the refrigerant will flow among the plurality of channels 31, which increases the flow path of the refrigerant, prolongs the length of heat dissipation, and improves the heat dissipation effect.

In one embodiment, as shown in FIG. 7 , the channel 31 includes a horizontal flow channel 311 and a vertical flow channel 312 , the vertical flow channel 312 is perpendicular to the horizontal flow channel 311 to form an L-shaped structure, and one end of the horizontal flow channel 311 communicates with the liquid inlet chamber 11 , and the other end communicates with the vertical channel 312. When the base assembly 1 is in the vertical direction, this L-shaped structure plays a role of direction conversion, so that the vertical channel 312 can also be arranged in the vertical direction, so that the gaseous refrigerant formed by the boiling and gasification of the refrigerant can reach the channel smoothly 31 top.

Optionally, at least one communication flow channel 34 is provided in each cooling fin 3 , through which a plurality of channels 31 communicate with each other, and the refrigerant in one channel 31 enters other channels through the communication flow channel 34 In 31, the path of refrigerant flow is tortuous, and the flow path is diversified.

In this embodiment, the position of the communication channel 34 can be in various ways, and the communication channel 34 can be arranged parallel to the horizontal plane, or can be arranged obliquely relative to the horizontal plane. Exemplarily, the communication channel 34 in this embodiment can be divided into two types: a first communication channel and a second communication channel. Since the cooling fins 3 extend in the vertical direction, the first communication channel is arranged parallel to the horizontal plane. When the channel 31 extends in the vertical direction, the first communication channel plays a role of transverse conduction. The second communication flow channel is arranged obliquely relative to the horizontal plane. Optionally, the second communication flow channel is arranged obliquely upward relative to the horizontal plane, so as to guide the gaseous refrigerant upward while realizing the communication of the channel 31 . Optionally, the second communication flow channel is disposed near the connection of the horizontal flow channel 311 and the vertical flow channel 312 , that is, the second communication flow channel is disposed near the corner of the channel 31 .

Optionally, a through groove 33 is opened at the bottom of the cooling fin 3 , the through groove 33 communicates with the channel 31 , and the extending direction of the through groove 33 and the extending direction of the channel 31 are perpendicular to each other. If there is no passage 31 at the bottom of the heat dissipation fin 3, only the bottom port of the passage 31 can transport the refrigerant. By opening a through groove 33 at the bottom of the heat dissipation fin 3, the through groove 33 is a rectangular groove structure, and the through groove 33 communicates with the The channel 31 is equivalent to increasing the contact area between the bottom of the channel 31 and the liquid inlet chamber 11, so that the bottom port and both sides of the channel 31 can provide the entrance for the refrigerant to enter the channel 31, which facilitates the transportation of the refrigerant.

The heat sink has passed the comparative heat test, and the heat uniformity performance and heat dissipation capacity of the heat sink are better than the original aluminum heat sink made of die-casting or extruded material. Under high-temperature working conditions, the temperature difference between the liquid inlet chamber 11 and the top of the channel 31 is ≤3°C , reducing the temperature range.

The installation process of the radiator provided in this embodiment is as follows:

1. Put the limit column 121 of the base plate 12 through the limit hole 131 of the bottom insert plate 13 for pairing and combination;

2. Install the liquid injection pipe 4 in the round hole of the bottom board 13, and insert the first protrusion 32 of the cooling gear 3 into the first socket 132 of the bottom board 13;

3. Install multiple cooling fins 3 sequentially;

4. After being fixed by a special fixture, perform high-temperature brazing to ensure good welding.

In the description herein, the terms "up", "down", "right", and other orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are for the convenience of description and simplification of operations, rather than indicating or implying Refers to a device or element having a particular orientation, being constructed and operating in a particular orientation. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

Claims

A radiator for cooling chips, comprising:

A base assembly (1), a liquid inlet chamber (11) is provided inside the base assembly (1), and the liquid inlet chamber (11) is configured to accommodate refrigerant;

The guide gear assembly (2) is arranged in the liquid inlet chamber (11);

The heat dissipation fins (3) are arranged on the base assembly (1) and extend in the vertical direction, and a channel (31) is arranged in the heat dissipation fins (3), and the channel (31) has a top end and a The bottom end, the bottom end of the channel (31) communicates with the liquid inlet chamber (11); wherein,

The base component (1) is configured such that when the position where the base component (1) and the chip are bonded is heated, the heat is transferred to the liquid inlet chamber (11) through the base component (1), so that the The refrigerant in the liquid inlet chamber (11) boils and vaporizes to form a gaseous refrigerant; the channel is configured so that the gaseous refrigerant enters the top end through the channel (31) to condense to form a liquid refrigerant, and the liquid refrigerant It can flow back into the liquid inlet cavity (11) through the channel (31).
The heat sink according to claim 1, wherein the number of the heat dissipation fins (3) is multiple, a plurality of the heat dissipation fins (3) are arranged in parallel and at intervals, and two adjacent heat dissipation fins ( 3) There is a set of guide tooth plate assemblies (2) arranged between them.
The radiator according to claim 2, wherein a plurality of channels (31) are arranged in each of the cooling fins (3).
The radiator according to claim 3, wherein a plurality of communication channels (34) are arranged in each of the cooling fins (3), and the communication channels (34) are passed between the plurality of channels (31) (34) communication, the communication channel (34) includes a first communication channel and a second communication channel, the first communication channel is arranged parallel to the horizontal plane, and the second communication channel is inclined relative to the horizontal plane set up.
The radiator according to claim 3, wherein, at least one communication channel (34) is arranged in each of the heat dissipation fins (3), and a plurality of the channels (31) pass through the communication channel (34) are in communication, and the communication channel (34) is arranged parallel to the horizontal plane.
The radiator according to claim 3, wherein, at least one communication channel (34) is arranged in each of the heat dissipation fins (3), and a plurality of the channels (31) pass through the communication channel (34) are connected, and the communication channel (34) is arranged obliquely relative to the horizontal plane.
The radiator according to any one of claims 1-6, wherein the channel (31) comprises a lateral flow channel (311) and a vertical flow channel (312), and the vertical flow channel (312) is perpendicular to the lateral flow channel channel (311), forming an L-shaped structure, one end of the horizontal flow channel (311) communicates with the liquid inlet chamber (11), and the other end communicates with the vertical flow channel (312).
The radiator according to claim 2, wherein the guide tooth piece assembly (2) comprises a plurality of parallel spaced apart guide tooth pieces (21), each of the guide tooth pieces (21) is provided with a gap ( 22), the gap (22) communicates with the liquid inlet chamber (11).
The radiator according to claim 1, wherein the base assembly (1) comprises a bottom board (12) and a bottom board (13), and the bottom board (13) is located above the bottom board (12) and connected with it, the liquid inlet chamber (11) is formed between the bottom board (13) and the bottom board (12), and a first insertion hole (132) is arranged on the bottom board (13) ), the bottom of the cooling fins (3) is correspondingly provided with a first bump (32), and the first bump (32) passes through the first insertion hole (132).
The heat sink according to claim 9, wherein, one of the bottom plate (12) and the bottom board (13) is provided with a limiting column (121), and the other is provided with a limiting hole (131), so The limiting post (121) is passed through the limiting hole (131).
The heat sink according to claim 9, wherein a support column (122) is provided on the side of the bottom plate (12) close to the bottom board (13), and the bottom plate (12) passes through the support column (122) is connected to the bottom board (13).
The radiator according to claim 9, wherein at least one of the bottom plate (12) and the bottom interposer (13) is provided with a liquid injection pipe (4), and the liquid injection pipe (4) communicates with The liquid enters the cavity (11) and delivers refrigerant thereto.