CN215819215U - Aluminum extrusion radiator - Google Patents

Abstract

The utility model discloses an aluminum extruded radiator which comprises a substrate, wherein a first radiating frame and a second radiating frame are respectively arranged on two sides of the top of the substrate, notches are respectively formed in the bottom ends of the first radiating frame and the second radiating frame, fins are inserted into the inner sides of the notches, and heat conducting cavities are formed among the fins. This crowded radiator of aluminium, when the source that generates heat is in this radiator below, the radiator bottom is heated, and inside working medium is heated the vaporization, up flows to the fin end, and fin end heat dissipation back, working medium condensation down flow to crowded base plate of aluminium, so circulation is reciprocal, with on the crowded heat transfer of base plate of aluminium to the fin, takes away from the system through the forced air cooling, this mode can promote the heat conductivity to equivalent 15000W/mK. Compared with the traditional aluminum extrusion (220W/mK), the aluminum extrusion heat dissipation device has the advantages that the heat transfer is accelerated, the self thermal resistance of the radiator is reduced, the temperature difference of the radiator is reduced, a lower cold source is provided for a chip, and the heat dissipation efficiency is improved.

Description

Aluminum extrusion radiator

Technical Field

The utility model relates to the technical field of radiators for electronic information industry, in particular to an aluminum extruded radiator.

Background

In the electronic information trade, use crowded radiator of aluminium in a large number, along with the miniaturization of product, the chip on the PCB board is also more miniaturized, and the consequence is the density of generating heat and increases thereupon, and the overheated problem that has become to solve among this type of product of PCB board, current heat dissipation scheme is paste heat conduction pad, aluminium crowded on the chip, through crowded radiating fin of aluminium and air convection, outwards transmits the heat, for the PCB board cooling, this scheme has following problem:

usually can dispel the heat with a plurality of chips with same aluminium is crowded, lead to the crowded size of aluminium great, self also can form a great difference in temperature, lead to the chip formation temperature accumulation of PCB board, the temperature is higher, traditional aluminium is crowded can't be too densely too high with the tooth design, is the crowded technology restriction of aluminium on the one hand, and on the other hand is that the crowded fin of aluminium is too thin, leads to the unable upload of root heat, and the top fin can't play a role.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide an aluminum extrusion radiator to solve the problems that the conventional radiator in the background art usually uses the same aluminum extrusion for radiating a plurality of chips, so that the aluminum extrusion size is large, a large temperature difference is formed, the temperature of the chips of a PCB is accumulated, the temperature is high, the teeth cannot be designed to be too dense and too high by the traditional aluminum extrusion, on one hand, the process limitation of the aluminum extrusion is caused, and on the other hand, the heat of the root cannot be uploaded and the top fin cannot play a role because the aluminum extrusion fins are too thin.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides an crowded radiator of aluminium, includes the base plate, the top both sides of base plate are provided with first heat dissipation frame and second heat dissipation frame respectively, the notch has all been seted up to the inside bottom of first heat dissipation frame and second heat dissipation frame, the fin is all installed in pegging graft in the inboard of notch, all be formed with the heat conduction cavity between the fin, the one end of first heat dissipation frame and second heat dissipation frame and the mutual joint of notch on the base plate.

Preferably, the tops of the first heat dissipation frame and the second heat dissipation frame are transversely arranged to form clamping plates, and the notches are transversely arranged along the bottom end of the inner portion of the substrate.

Preferably, through holes are formed in the surfaces of one sides of the first heat dissipation frame and the second heat dissipation frame, and the tops of the fins are arc-shaped.

Preferably, the first heat dissipation frame and the second heat dissipation frame are formed by integrally bending the base plate, and the fins are formed by integrally bending.

Preferably, the heights of the first heat dissipation frame and the second heat dissipation frame are both greater than the heights of the fins.

Compared with the prior art, the utility model has the beneficial effects that:

this crowded radiator of aluminium carries out daily use in-process, when the source that generates heat is in this radiator below, the radiator bottom is heated, and inside working medium is heated the vaporization, up flows to the fin end, and fin end heat dissipation back, working medium condensation down flow to crowded base plate of aluminium, and the circulation is reciprocal like this, with on crowded heat transfer to the fin on the base plate of aluminium, through the forced air cooling area from the system, this mode can promote the heat conductivity to equivalent 15000W/mK. Compared with the traditional aluminum extrusion (220W/mK), the aluminum extrusion heat dissipation device has the advantages that the heat transfer is accelerated, the self thermal resistance of the radiator is reduced, the temperature difference of the radiator is reduced, a lower cold source is provided for a chip, and the heat dissipation efficiency is improved.

According to the aluminum extruded radiator, in the daily use process, due to the high heat conductivity of the radiator, the temperature uniformity is improved, the temperature of a chip with high heat productivity can be obviously reduced, and meanwhile, the temperature of a chip with low heat productivity can be increased.

This crowded radiator of aluminium, in the in-process of carrying out daily use, because the radiator is inside to link up, if there is local high temperature, the working medium of other positions can be supplied, increases the heat transfer capacity in this region, maintains the temperature at comparatively homogeneous level, except the beneficial effect in the aspect of the heat dissipation, owing to structural improvement, makes the crowded head of aluminium need not the end cap sealed. On one hand, the cost of the plug and the cost of the assembly plug are reduced, on the other hand, the number of welding lines is reduced, and the probability of failure of the radiator due to leakage is reduced

Drawings

FIG. 1 is an exploded view of the present invention;

FIG. 2 is a perspective view of the present invention;

fig. 3 is a front view of the present invention.

In the figure: 1. a fin; 2. a first heat dissipation frame; 3. a second heat dissipation frame; 4. a through hole; 5. clamping a plate; 6. a notch; 7. a substrate; 8. a thermally conductive chamber.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: an aluminum extruded radiator comprises a substrate 7, a first radiating frame 2 and a second radiating frame 3 are respectively arranged on two sides of the top of the substrate 7, notches 6 are respectively arranged at the bottom ends of the first radiating frame 2 and the second radiating frame 3, fins 1 are respectively inserted and installed on the inner sides of the notches 6, heat conducting chambers 8 are respectively formed among the fins 1, when the lower part is heated, working media in the radiator are heated and evaporated into gas state and flow upwards, the upper fins 1 are contacted with the outside air to radiate heat to the air, the temperature is reduced, the gas state hot working media are liquefied when meeting cold, liquid drops downwards under the influence of gravity, the heat at the bottom can be transmitted to the upper fins 1, the heat is radiated to the outside through the fins 1, one ends of the first radiating frame 2 and the second radiating frame 3 are mutually clamped with the notches 6 on the substrate 7, clamping plates 5 are transversely arranged on the tops of the first radiating frame 2 and the second radiating frame 3, and notch 6 transversely arranges along the inside bottom of base plate 7, can carry out the spacing fixed of pegging graft in real time with fin 1, make the installation location more reliable and more stable, also make things convenient for the later stage to dismantle in real time and change simultaneously, through-hole 4 has all been seted up to one side surface of first heat dissipation frame 2 and second heat dissipation frame 3, can conveniently connect inside cavity through-hole 4 and carry out real-time evacuation and water injection, and the top of fin 1 is circular-arc, first heat dissipation frame 2 and second heat dissipation frame 3 all have base plate 7 integrated into one piece to bend and form, and fin 1 is through the integrated into one piece shaping of bending, the height of first heat dissipation frame 2 and second heat dissipation frame 3 all is greater than the height of fin 1, can make in the installation more smoothly without hindrance, avoid the top to appear the card because of high improper and hinder the problem, lead to fin 1 can's unable installation inside the heat dissipation frame.

The working principle is as follows: when this radiator is used in the heat dissipation as required, at first accessible process equipment carries out the shaping of buckling in real time with base plate 7 and fin 1, and carry out real-time grafting combination with fin 1 and notch 6 through the manual work and assemble together, then carry out the welding process of relevant position, then through-hole 4 evacuation and water injection in inside cavity, form a radiator promptly, the heat source of this radiator should arrange in the below, when the below is heated, the inside working medium of radiator is heated and evaporates into the gaseous state, up flow, top fin 1 and external air contact, to the air heat dissipation, the temperature drops, gaseous state hot working medium meets cold liquefaction, liquid is influenced by gravity and is dropped down, so circulate, on can transmitting the fin 1 on the upper portion with the heat of bottom, dispel the heat to the external world through fin 1.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. An aluminium extruded radiator, includes base plate (7), its characterized in that: the heat dissipation structure is characterized in that a first heat dissipation frame (2) and a second heat dissipation frame (3) are arranged on two sides of the top of the base plate (7) respectively, notches (6) are formed in the bottom ends of the first heat dissipation frame (2) and the second heat dissipation frame (3), fins (1) are installed on the inner sides of the notches (6) in an inserted mode, heat conduction cavities (8) are formed between the fins (1), and one ends of the first heat dissipation frame (2) and the second heat dissipation frame (3) are connected with the notches (6) in the base plate (7) in a clamped mode.

2. An aluminum extruded heat sink as recited in claim 1 wherein: the top of first heat dissipation frame (2) and second heat dissipation frame (3) transversely arranges and is provided with cardboard (5), and notch (6) transversely arranges along the inside bottom of base plate (7).

3. An aluminum extruded heat sink as recited in claim 1 wherein: through holes (4) are formed in the surfaces of one sides of the first heat dissipation frame (2) and the second heat dissipation frame (3), and the tops of the fins (1) are arc-shaped.

4. An aluminum extruded heat sink as recited in claim 1 wherein: the first heat dissipation frame (2) and the second heat dissipation frame (3) are formed by integrally bending a base plate (7), and the fins (1) are integrally bent.

5. An aluminum extruded heat sink as recited in claim 1 wherein: the heights of the first heat dissipation frame (2) and the second heat dissipation frame (3) are both larger than the heights of the fins (1).

Images